Micro light emitting diode device packaging structure, packaging method and display device

Abstract

The present application provides a micro-LED device packaging structure, packaging method, and display device. The micro-LED device in the packaging structure includes a bonded micro-LED chip and a driver chip. A blocking structure is disposed on a side of the micro-LED chip facing away from the driver chip and protrudes from the micro-LED chip. A packaging substrate is stacked on a side of the driver chip facing away from the micro-LED chip, and a blocking step is provided around the periphery of the packaging substrate. Packaging glue wraps around the periphery of the micro-LED chip and driver chip, covering the blocking structure and at least a portion of the blocking step. As a result, the micro-LED device packaging structure and display device of the present application have excellent packaging airtightness and reliability.

Description

Technical Field

[0001] The present application relates to the field of semiconductor light emitting technology, and in particular to a micro light emitting diode device packaging structure, a packaging method and a display device. Background Art

[0002] Micro-LED (Micro-Light Emitting Diode) display technology is a display technology that miniaturizes and arrays the traditional LED (Light Emitting Diode) structure and uses CMOS (Complementary Metal Oxide Semiconductor) or TFT (Thin Film Transistor) to make driving circuits to achieve addressing control and individual drive of each pixel.

[0003] The smaller solder joints of Micro-LEDs, which are only 1 / 10 to 1 / 100 of those in traditional LEDs, significantly weaken their resistance to water and oxygen corrosion, significantly reducing their reliability. Furthermore, the driver circuits are also unsuitable for prolonged exposure to water and oxygen. Therefore, improving the airtightness and reliability of Micro-LED packaging has become a pressing issue. Summary of the Invention

[0004] The purpose of this application is to provide a micro light emitting diode device packaging structure, packaging method and display device.

[0005] In order to solve the above problems, in a first aspect, the present application provides a micro light emitting diode device packaging structure, comprising:

[0006] A micro light emitting diode device, comprising a micro light emitting diode chip and a driver chip bonded together;

[0007] a blocking structure, disposed on a side of the micro-LED chip facing away from the driver chip and protruding from the micro-LED chip;

[0008] a packaging substrate, stacked on a side of the driver chip facing away from the micro-LED chip, with a blocking step provided on the periphery of the packaging substrate; and

[0009] The packaging glue wraps the outer periphery of the micro-LED chip and the driver chip, and covers the blocking structure and at least a portion of the blocking step.

[0010] Optionally, the micro light emitting diode chip includes a display area and a non-display area, the blocking structure is arranged and protrudes from the non-display area, and the outer periphery of the blocking structure is aligned with the outer periphery of the non-display area.

[0011] Optionally, the blocking structure is a ring-shaped structure, and the display area is located inside the blocking structure.

[0012] Optionally, the micro light emitting diode device packaging structure further includes:

[0013] a circuit board electrically connected to the driving chip via an electrical connector, wherein a first end of the circuit board is disposed on the blocking step, and a second end of the circuit board is disposed outside the packaging substrate;

[0014] Wherein, the packaging glue also wraps a portion of the circuit board and the electrical connector.

[0015] Optionally, the blocking step includes a first step surface, a connecting surface, and a second step surface connected in sequence, the second step surface is located between the driving chip and the first step surface, and the circuit board is arranged on the first step surface; wherein,

[0016] The thickness of the circuit board is smaller than the height of the connection surface, and the spacing distance between the first end of the circuit board and the connection surface is between 50 micrometers and 150 micrometers.

[0017] Optionally, the packaging substrate is a heat dissipation substrate.

[0018] In a second aspect, the present application further provides a packaging method, comprising:

[0019] A micro light emitting diode device is provided, wherein the micro light emitting diode device comprises a micro light emitting diode chip and a driver chip bonded together;

[0020] A blocking structure protruding from the micro-LED chip is provided on a side of the micro-LED chip facing away from the driver chip;

[0021] A packaging substrate is provided on a side of the driver chip facing away from the micro-LED chip and is stacked and connected with the driver chip, and a blocking step is provided on the periphery of the packaging substrate;

[0022] Packaging glue is provided, and the packaging glue is made to wrap the outer periphery of the micro-LED chip and the driver chip, and cover the blocking structure and at least part of the blocking step, so as to obtain a micro-LED device packaging structure.

[0023] Optionally, the micro-LED chip includes a display area and a non-display area; and the step of providing a blocking structure protruding from the micro-LED chip on a side of the micro-LED chip facing away from the driver chip includes:

[0024] A blocking structure protruding from the non-display area is provided in the non-display area, and an outer periphery of the blocking structure is aligned with an outer periphery of the non-display area.

[0025] Optionally, the step of providing a packaging substrate stacked and connected to the driver chip on a side of the driver chip facing away from the micro-LED chip, and forming a blocking step on a periphery of the packaging substrate, comprises:

[0026] Provide packaging substrates and circuit boards;

[0027] A blocking step is provided on the periphery of the packaging substrate, so that the first end of the circuit board is disposed on the blocking step and the second end of the circuit board extends outside the packaging substrate;

[0028] The micro-LED device is stacked and connected with the packaging substrate, and the driving chip is located between the packaging substrate and the micro-LED chip;

[0029] electrically connecting the circuit board to the driver chip via an electrical connector;

[0030] The step of providing packaging glue and wrapping the outer periphery of the micro-LED chip and the driver chip with the packaging glue and covering the blocking structure and at least a portion of the blocking step includes:

[0031] Packaging glue is provided, and the packaging glue is made to wrap the outer periphery of the micro-LED chip and the driver chip, and cover the blocking structure, at least a part of the blocking step, a part of the circuit board and the electrical connector.

[0032] In a third aspect, the present application further provides a display device comprising the micro-light emitting diode device packaging structure as described above; or, comprising the micro-light emitting diode device packaging structure prepared by the packaging method as described above.

[0033] Based on the above technical solution, the blocking structure of the micro-LED device packaging structure of the present application is arranged on the side of the micro-LED chip away from the driver chip and protrudes from the micro-LED chip. The protruding blocking structure can block the flow of moisture and other liquids entering the packaging glue from the bonding interface between the micro-LED chip and the packaging glue; at the same time, a blocking step is provided on the periphery of the packaging substrate, which can block the flow of moisture and other liquids entering the packaging glue from the bonding interface between the packaging substrate and the packaging glue; thus, the blocking structure and the blocking step can both change the flow path of moisture and other liquids. Moisture and other liquids need to bypass the blocking structure and the blocking step to enter deep into the packaging glue. The blocking structure and the blocking step increase the difficulty of moisture and other liquids flowing deep into the packaging glue, making it difficult for moisture and other liquids to enter the packaging glue, especially difficult to enter the bonding area between the micro-LED chip and the driver chip, thereby greatly improving the packaging airtightness of the micro-LED device packaging structure, and the reliability of the micro-LED device packaging structure is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] To more clearly illustrate the technical solutions of this application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of this application, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0035] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0036] Figure 1 A schematic top view of a micro light emitting diode device packaging structure provided in an embodiment of the present application;

[0037] Figure 2 A cross-sectional view of a micro-LED device package structure along one direction according to an embodiment of the present application;

[0038] Figure 3 A cross-sectional view of the micro light emitting diode device package structure according to an embodiment of the present application taken along another direction;

[0039] Figure 4 For moisture to enter Figure 2 A schematic diagram of the path of the micro light emitting diode device packaging structure shown;

[0040] Figure 5 For moisture to enter Figure 3 A schematic diagram of the path of the micro light emitting diode device packaging structure shown;

[0041] Figure 6This is a schematic top view of the micro-LED device packaging structure according to an embodiment of the present application when no blocking member is provided;

[0042] Figure 7 for Figure 6 A cross-sectional view of the micro light emitting diode device package structure along one direction;

[0043] Figure 8 for Figure 6 A cross-sectional view of the micro light emitting diode device package structure shown along another direction;

[0044] Figure 9 A schematic top view of the micro-LED chip, driver chip, and barrier structure according to an embodiment of the present application;

[0045] Figure 10 for Figure 9 A schematic cross-sectional view of the structure shown;

[0046] Figure 11 A schematic diagram of a top view of the packaging substrate provided in an embodiment of the present application;

[0047] Figure 12 for Figure 11 A cross-sectional view of the structure shown along one direction;

[0048] Figure 13 for Figure 11 A cross-sectional view of the structure shown along another direction;

[0049] Figure 14 A schematic structural diagram of a micro light-emitting diode chip provided in an embodiment of the present application;

[0050] Figure 15 A schematic diagram of the structure of a driver chip provided in an embodiment of the present application;

[0051] Figure 16 A schematic diagram of a first process flow of the packaging method provided in an embodiment of the present application;

[0052] Figure 17 A second flow chart of the packaging method provided in an embodiment of the present application;

[0053] Figure 18 A schematic structural diagram of a display device provided in an embodiment of the present application.

[0054] The reference numerals indicate:

[0055] 10. Micro-LED device packaging structure; 20. Display device; 101. Micro-LED device; 100. Micro-LED chip; 200. Driver chip; 300. Package substrate; 400. Package glue; 600. Circuit board; 700. Electrical connector; 110. Display area; 120. Non-display area; 210. Second substrate; 220. Driver circuit; 230. Driver pad; 240. Electrical connection portion; 250. Second passivation layer; 260. Second bonding surface; 310. Support area; 51 0. Blocking structure; 520. Blocking step; 530. Groove structure; 610. First end; 620. Second end; 131. First substrate; 132. Buffer layer; 133. First semiconductor layer; 134. Light-emitting layer; 135. Second semiconductor layer; 136. Current diffusion layer; 137. First electrode layer; 138. Second electrode layer; 139. Solder joint structure; 141. First passivation layer; 142. Light-emitting table; 143. First bonding surface; 521. First step surface; 522. Connection surface; 523. Second step surface. DETAILED DESCRIPTION

[0056] The following will be combined with the appendix of this application Figure 1 To the attached Figure 18 The present invention clearly and completely describes the technical solutions in this application through the following examples. Obviously, the examples described are only some of the examples in this application, not all of them. All other examples obtained by those skilled in the art based on the examples in this application without creative effort are within the scope of protection of this application.

[0057] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0058] The following is a detailed description with reference to specific embodiments. It should be noted that the embodiments of the present application can be presented in various forms, some of which will be described below.

[0059] Please refer to Figures 1 to 3 , Figure 1 This is a schematic top view of the micro light emitting diode device packaging structure 10 provided in an embodiment of the present application. Figure 2 1 is a cross-sectional view of the micro light emitting diode device package structure 10 along one direction according to an embodiment of the present application. Figure 3FIG2 is a cross-sectional view of the micro-LED device package structure 10 according to an embodiment of the present application taken along another direction. The micro-LED device package structure 10 includes a micro-LED device 101 , a package substrate 300 , packaging glue 400 and a barrier structure 510 .

[0060] The micro-LED device 101 includes a micro-LED chip 100 and a driver chip 200 bonded together. A blocking structure 510 is provided on the side of the micro-LED chip 100 facing away from the driver chip 200, protruding from the micro-LED chip 100. A packaging substrate 300 is provided on the side of the driver chip 200 facing away from the micro-LED chip 100. The packaging substrate 300 and the driver chip 200 are stacked and connected, with a blocking step 520 provided around the periphery of the packaging substrate 300. Encapsulation glue 400 wraps around the outer peripheries of the micro-LED chip 100 and the driver chip 200, also covering the blocking structure 510 and blocking step 520.

[0061] It can be understood that the micro-LED chip 100 includes a display area 110 and a non-display area 120. The non-display area 120 can be arranged around the outer periphery of the display area 110, and the display area 110 is located inside the non-display area 120. Among them, the non-display area 120 can be the electrode and wiring area of the micro-LED chip 100, and the display area 110 can be the light-emitting area of the micro-LED chip 100. The display area 110 includes a plurality of pixel units so that the display area 110 can emit light. It should be noted that in the present application, the display area 110 includes the light-emitting surface of the micro-LED chip 100 and the layered structure below the light-emitting surface, and the non-display area 120 includes the non-light-emitting surface of the micro-LED chip 100 and the layered structure below the light-emitting surface.

[0062] It is understood that the driver chip 200 is located between the micro-LED chip 100 and the package substrate 300. The driver chip 200 is bonded to the micro-LED chip 100 and can control the pixel unit of the micro-LED chip 100 to emit light. Figures 1 to 3 As shown, the size of the driver chip 200 can be larger than that of the micro LED chip 100, and the orthographic projection of the micro LED chip 100 on the driver chip 200 can be located inside the driver chip 200. The driver chip 200 and the micro LED chip 100 are stacked to form a step structure.

[0063] It is understood that the packaging substrate 300 is used to carry the driver chip 200, the micro-LED chip 100 and the packaging glue 400 thereon. Figures 1 to 3As shown, the size of the package substrate 300 is larger than that of the driver chip 200. There is a supporting area 310 on the package substrate 300 that is not covered by the driver chip 200, and an overlapping area that overlaps with the driver chip 200. The package substrate 300 and the driver chip 200 can form a step structure.

[0064] It is understandable that the packaging glue 400 can bond the micro-LED chip 100, the driver chip 200 and the packaging substrate 300 together, and the packaging glue 400 serves as a protective glue for the micro-LED device packaging structure 10. Figures 1 to 3 As shown, encapsulation glue 400 is located in at least a portion of the supporting area 310 of the packaging substrate 300 and the space above it. Part of the encapsulation glue 400 can cover the sidewall edges of the micro-LED chip 100 and the driver chip 200, and part of the encapsulation glue 400 can be located above and cover at least a portion of the non-display area 120 of the micro-LED chip 100. The encapsulation glue 400 can wrap around the outer periphery of the micro-LED chip 100 and the driver chip 200, covering at least a portion (including all or part) of the non-display area 120 and at least a portion of the supporting area 310. The encapsulation glue 400 can reduce the amount of moisture and other liquids that enter the bonding area between the micro-LED chip 100 and the driver chip 200. The encapsulation glue 400 can be applied using a molding process or a dispensing process.

[0065] It is understood that both the blocking structure 510 and the blocking step 520 are located within and encapsulated by the encapsulation glue 400. In some examples, the blocking structure 510 can be disposed within the non-display region 120 of the micro-LED chip 100 and protrude therefrom. In some examples, the blocking step 520 can be disposed within the support region 310 of the package substrate 300 and protrude therefrom. The blocking structure 510 and the blocking step 520 together form a barrier for the micro-LED device package structure 10. The blocking structure 510 and the blocking step 520 can prevent external moisture from entering the encapsulation glue 400 and affecting the performance of the micro-LED device 101.

[0066] Please combine Figures 1 to 3 Please also refer to Figure 4 and Figure 5 , Figure 4 For moisture to enter Figure 2 The schematic diagram of the path of the micro light emitting diode device packaging structure 10 is shown. Figure 5 For moisture to enter Figure 3The schematic diagram of the path of the micro-LED device package structure 10 is shown. Because the blocking structure 510 protrudes from the non-display area 120, when moisture or liquid S1 enters the packaging glue 400 from the non-display area 120, the protruding blocking structure 510 can block the flow of moisture or liquid. Similarly, due to the blocking effect of the blocking step 520, when moisture or liquid S2 enters the packaging glue 400 from the support area 310, the blocking step 520 can also block the flow of moisture or liquid. Moisture or liquid must bypass the blocking structure 510 and blocking step 520 to enter deep into the packaging glue 400. The blocking structure 510 and blocking step 520 change the flow path of moisture or liquid, making it difficult for moisture or liquid to enter the packaging glue 400, especially the bonding area between the micro-LED chip 100 and the driver chip 200.

[0067] In contrast, Figures 6 to 8 As shown, Figure 6 FIG. 1 is a schematic top view of the micro-LED device package structure 10 according to an embodiment of the present application when the blocking member 500 is not provided. Figure 7 for Figure 6 The cross-sectional view of the micro light emitting diode device package structure 10 along one direction is shown. Figure 8 for Figure 6 The cross-sectional view of the micro-LED device package structure 10 shown in FIG. 1 is taken from another direction. Since the material of the packaging glue 400 is different from that of the micro-LED chip 100, the driver chip 200, and the packaging substrate 300, the bonding interface between the packaging glue 400 and the micro-LED chip 100, and the bonding interface between the packaging glue 400 and the packaging substrate 300 are easily infiltrated by moisture and other liquids. Figure 7 and Figure 8 As shown, when the blocking structure 510 and the blocking step 520 are not provided, moisture or other liquid S1 can directly enter the packaging glue 400 from the bonding interface between the packaging glue 400 and the micro-LED chip 100, and moisture or other liquid S2 can directly enter the packaging glue 400 from the bonding interface between the packaging glue 400 and the packaging substrate 300. Moisture or other liquid can easily enter the bonding area between the micro-LED chip 100 and the driver chip 200, thereby seriously affecting the performance and service life of the micro-LED device packaging structure 10, and greatly reducing the reliability of the micro-LED device packaging structure 10.

[0068] Based on this, the blocking structure 510 of the micro-LED device package structure 10 of the embodiment of the present application is provided on a side of the micro-LED chip 100 facing away from the driver chip 200 and protrudes from the micro-LED chip 100. The protruding blocking structure 510 can block the flow of liquid S1, such as moisture, from entering the packaging glue 400 through the bonding interface between the micro-LED chip 100 and the packaging glue 400. At the same time, a blocking step 520 is provided on the periphery of the packaging substrate 300. The blocking step 520 can block the flow of liquid S2, such as moisture, from entering the packaging glue 400 through the bonding interface between the packaging substrate 300 and the packaging glue 400. Thus, the blocking structure 510 and the blocking step 520 can change the flow path of liquids such as moisture. Liquids such as moisture need to bypass the blocking structure 510 and the blocking step 520 to enter deep inside the packaging glue 400. The blocking structure 510 and the blocking step 520 increase the difficulty of liquids such as moisture flowing deep inside the packaging glue 400, making it difficult for liquids such as moisture to enter the packaging glue 400, especially difficult to enter the bonding area of the micro light-emitting diode chip 100 and the driver chip 200, thereby greatly improving the packaging airtightness of the micro light-emitting diode device packaging structure 10, and the reliability of the micro light-emitting diode device packaging structure 10 is better.

[0069] Please refer again to Figures 1 to 5 Please also refer to Figure 9 and Figure 10 , Figure 9 Schematic diagram of a top view of the micro-LED chip 100, the driver chip 200 and the blocking structure 510 according to an embodiment of the present application. Figure 10 for Figure 9 A cross-sectional schematic diagram of the structure shown. In some examples, the outer perimeter of the blocking structure 510 is aligned with the outer perimeter of the micro-LED chip 100. Furthermore, the outer perimeter of the blocking structure 510 can be aligned with the outer perimeter of the non-display area 120 of the micro-LED chip 100. In this case, the non-display area 120 of the micro-LED chip 100 can support the blocking structure 510. On the one hand, the connection between the blocking structure 510 and the micro-LED chip 100 is more secure. On the other hand, the blocking structure 510, which is fully supported by the micro-LED chip 100, is also easier to produce in terms of production process.

[0070] It is understood that in some examples, the barrier structure 510 of the present application is an annular structure. In a top view, the annular structure is located outside the display area 110, and the display area 110 is located inside the barrier structure 510. The annular structure and the display area 110 can form a concentric ring structure. The barrier structure 510 can be a rectangular ring structure, a circular ring structure, etc. The annular barrier structure 510 of the present application can enclose the entire display area 110, and the barrier structure 510 can block the flow of liquids such as moisture over a larger area. Therefore, the annular barrier structure 510 can further improve the package airtightness and reliability of the micro-LED device package structure 10.

[0071] It will be appreciated that, in some examples, the barrier structure 510 of the present application is a metal structure. The metal barrier structure 510 can be formed in the non-display area 120 through evaporation and photolithography processes. The metal barrier structure 510 of the present embodiment has excellent corrosion resistance, further improving the hermetic sealing and reliability of the micro-LED device package 10.

[0072] In some examples, please refer to Figures 1 to 5 Please also refer to Figures 11 to 13 , Figure 11 A schematic top view of the packaging substrate 300 provided in an embodiment of the present application is shown. Figure 12 for Figure 11 The structure shown is a cross-sectional view along one direction, Figure 13 for Figure 11 The structure shown is a cross-sectional view taken along another direction. The blocking step 520 includes a first step surface 521, a connecting surface 522, and a second step surface 523 connected in sequence. The second step surface 523 is located between the driver chip 200 and the first step surface 521. The second step surface 523 is located above the first step surface 521, and there is a height difference between the second step surface 523 and the first step surface 521.

[0073] When liquid S2, such as moisture, enters the encapsulating glue 400 from the interface between the encapsulating glue 400 and the encapsulating substrate 300, it encounters the vertically upward connecting surface 522 after entering the first step surface 521. This connecting surface 522 blocks the flow of liquid S2, making it difficult for liquid S2 to flow to the second step surface 523. Consequently, liquid S2 is unlikely to enter the bonding area between the micro-LED chip 100 and the driver chip 200 from the interface between the encapsulating glue 400 and the encapsulating substrate 300, thereby significantly improving the hermetic seal of the micro-LED device package structure 10 and enhancing the reliability of the micro-LED device package structure 10. Furthermore, the blocking step 520 of the present application is part of the encapsulating substrate 300, eliminating the need for additional structures in the micro-LED device package structure 10, thus simplifying the structure of the blocking member 500.

[0074] It is understood that, in some examples, the outer edge of the first step surface 521 of the blocking step 520 can be aligned with the outer edge of the packaging substrate 300, and the blocking step 520 can be formed on the outer periphery of the packaging substrate 300. In this way, during the production process, the blocking step 520 can be formed on the packaging substrate 300 by cutting the step at the edge, so that the blocking step 520 of the present application is easier to process and form.

[0075] It is understood that in some examples, the blocking step 520 is annular, with the projection of the driver chip 200 on the package substrate 300 located inside the blocking step 520. The blocking step 520 can be a rectangular ring structure, a circular ring structure, or the like. The blocking step 520 of the present invention, with its annular structure, can enclose the entire driver chip 200 and block the flow of liquids such as moisture over a wider range. Thus, the blocking step 520 of the annular structure can further improve the package airtightness and reliability of the micro-LED device package 10.

[0076] In some examples, please refer to Figures 1 to 13 The micro-light emitting diode device packaging structure 10 also includes a circuit board 600. The packaging substrate 300 is used to carry the circuit board 600, and the packaging substrate 300 and the circuit board 600 can be connected as a whole. The circuit board 600 includes a first end 610 and a second end 620 that are arranged opposite to each other. The first end 610 is arranged on the blocking step 520. The first end 610 is arranged on the first step surface 521 and is spaced apart from the driver chip 200. The second end 620 is arranged outside the packaging substrate 300, and the second end 620 can be electrically connected to an external circuit. The circuit board 600 is electrically connected to the driver chip 200 through an electrical connector 700, and the external circuit provides electrical signals and control signals to the driver chip 200 through the circuit board 600.

[0077] It is understood that the encapsulation glue 400 also partially encapsulates the circuit board 600 and the electrical connector 700. In the present application, the first end 610 of the circuit board 600 and the electrical connector 700 are disposed within the encapsulation glue 400, thereby minimizing corrosion of the electrical connection between the first end 610 and the driver chip 200 by liquids such as moisture, thereby improving the airtightness and reliability of the micro-LED device package structure 10.

[0078] It will be appreciated that in some embodiments, the maximum distance between the circuit board 600 and the first stepped surface 521 is less than the maximum distance between the connection surface 522 and the first stepped surface 521, and the thickness of the circuit board 600 is less than the height of the connection surface 522, thereby creating a height difference between the circuit board 600 and the driver chip 200. The spacing distance L0 between the first end 610 of the circuit board 600 and the connection surface 522 is between 50 microns and 150 microns, for example, 50 microns, 80 microns, 100 microns, 120 microns, or 150 microns. Furthermore, the spacing distance L0 is between 80 microns and 120 microns. Furthermore, the spacing distance L0 is approximately 100 microns.

[0079] In the embodiment of the present application, the thickness of the circuit board 600 and the spacing distance L0 between the circuit board 600 and the connection surface 522 are designed as described above. A sunken groove structure 530 (the groove structure 530 can also be considered as a part of the blocking step 520) can be formed between the first end 610 of the circuit board 600 and the connection surface 522. Moisture and other liquids entering from the connection interface between the circuit board 600 and the packaging glue 400 will change their flow path and flow toward the bottom of the groove after encountering the groove. Moisture and other liquids flowing to the bottom of the groove will find it difficult to flow upward along the sidewalls of the groove to the surface of the driver chip 200 again. Therefore, the groove structure 530 can further improve the packaging airtightness and reliability of the micro-light-emitting diode device packaging structure 10. Furthermore, the spacing distance L0 between the first end 610 of the circuit board 600 and the connection surface 522 is between 50 μm and 150 μm, and the width of the groove structure 530 is in a moderate range. The groove structure 530 is neither too wide nor too narrow to allow liquids such as moisture to flow directly to the connection surface 522 of the blocking step 520, thereby rendering the groove structure 530 ineffective.

[0080] It is understood that in some embodiments, the packaging substrate 300 can be a heat dissipation substrate. Furthermore, the packaging substrate 300 can be a heat dissipation substrate with a stepped design. The packaging substrate 300 can be made of a metal or non-metallic thermally conductive material. The packaging substrate 300 of the embodiment of the present application is a heat dissipation substrate. The packaging substrate 300 can better transfer the heat generated by the driver chip 200 to the outside world, thereby improving the heating phenomenon of the micro-LED device packaging structure 10.

[0081] Based on the above description of the micro-LED device packaging structure 10, please refer to Figure 14 , Figure 14 This is a schematic structural diagram of a micro-LED chip 100 provided in an embodiment of the present application. The micro-LED chip 100 includes a first substrate 131, and a buffer layer 132, a first semiconductor layer 133, a light-emitting layer 134, a second semiconductor layer 135, a current diffusion layer 136, a first electrode layer 137, a second electrode layer 138, a solder joint structure 139, a first passivation layer 141, and the like formed on the first substrate 131.

[0082] It is understood that the first substrate 131 is used to support the film structure thereon. The first substrate 131 can be a sapphire substrate, a silicon substrate, or a silicon carbide substrate. The buffer layer 132 can relieve stress generated by lattice mismatch and thermal expansion coefficient mismatch between the film layer and the first substrate 131. The buffer layer 132 can be, but is not limited to, a silicon nitride, a silicon oxide layer, a gallium nitride layer, or an aluminum nitride layer. The light-emitting layer 134 is a quantum well layer, for example, an indium gallium nitride quantum well layer, or an indium gallium nitride / gallium nitride multi-quantum well layer. The first semiconductor layer 133 is one of an N-type semiconductor layer and a P-type semiconductor layer, and the second semiconductor layer 135 is the other of an N-type semiconductor layer and a P-type semiconductor layer. The N-type semiconductor layer is an N-type gallium nitride layer or an N-type gallium arsenide layer, and the P-type semiconductor layer is a P-type gallium nitride layer or a P-type aluminum gallium nitride layer. The first electrode layer 137 is disposed on a side of the second semiconductor layer 135 facing away from the light-emitting layer 134 and is electrically connected to the second semiconductor layer 135. The second electrode layer 138 is disposed on an exposed area of the first semiconductor layer 133 and is electrically connected to the first semiconductor layer 133. The first electrode layer 137 and the second electrode layer 138 are used to electrically connect to the driver chip 200. The current diffusion layer 136 can distribute the current very evenly throughout the first semiconductor layer 133, thereby effectively improving the luminous efficiency of the micro-LED chip 100. The solder joint structure 139 is connected to the first electrode layer 137 and the second electrode layer 138. The solder joint structure 139 can be made of, but is not limited to, a metal such as indium (In), aluminum (Al), tin (Sn), silver (Ag), gold (Au), gold-tin alloy, or nickel-gold alloy. The solder joint structure 139 is used to bond to the driver chip 200. The first passivation layer 141 is used to wrap the buffer layer 132 and the layered structure thereon and expose the solder joint structure 139 . The first passivation layer 141 is used to protect the micro light emitting diode chip 100 .

[0083] It is understandable that if Figure 14As shown, the first semiconductor layer 133, the light-emitting layer 134, the second semiconductor layer 135, the current diffusion layer 136, the first electrode layer 137, and the solder joint structure 139 connected thereto can form a plurality of spaced light-emitting mesas 142. Each light-emitting mesa 142 is a pixel unit. The region formed by the plurality of light-emitting mesas 142 is the display region 110 in the aforementioned embodiment. The region where the second electrode layer 138 and the solder joint structure 139 connected thereto, located outside the first substrate 131, are located is the non-display region 120 in the aforementioned embodiment. Specifically, when the first electrode layer 137 is a P-electrode or a positive electrode and the second electrode layer 138 is an N-electrode or a negative electrode, the display region 110 is a positive region and the non-display region 120 is a negative region. When the first electrode layer 137 is an N-electrode or a negative electrode and the second electrode layer 138 is a P-electrode or a positive electrode, the display region 110 is a negative region and the non-display region 120 is a positive region.

[0084] It is understandable that if Figure 14 As shown, the micro-LED chip 100 of the present application can be a common electrode chip structure; in other examples, the micro-LED chip 100 of the present application can also be a single micro-LED chip 100 structure.

[0085] Based on the above description, please refer to Figure 15 , Figure 15 A schematic structural diagram of a driver chip 200 provided in an embodiment of the present application. The driver chip 200 includes a second substrate 210 and a driver circuit 220 and one or more driver pads 230 formed on the second substrate 210. The driver circuit 220 may be, but is not limited to, a CMOS circuit structure or a TFT circuit structure. The driver pad 230 may be, but is not limited to, made of metals such as In, Al, Sn, Ag, Au, gold-tin alloy, and nickel-gold alloy. The one or more driver pads 230 are used to be arranged in a one-to-one correspondence with one or more solder joint structures 139 of the micro-light-emitting diode chip 100 and bonded in a one-to-one correspondence. The driver chip 200 also includes an electrical connection portion 240 electrically connected to the circuit board 600, and a second passivation layer 250 covering and exposing the driver pad 230.

[0086] Understandably, please refer to Figure 14 and Figure 15The micro-LED chip 100 further includes a first bonding surface 143. The solder joint structure 139 of the micro-LED chip 100 is exposed on the first bonding surface 143. The first bonding surface 143 is also the side of the micro-LED chip 100 facing the driver chip 200. The driver chip 200 includes a second bonding surface 260. The driver pad 230 of the driver chip 200 is exposed on the second bonding surface 260. The second bonding surface 260 is also the side of the driver chip 200 facing the micro-LED chip 100. The solder joint structure 139 of the micro-LED chip 100 is bonded to the driver pad 230 of the driver chip 200. The area between the first bonding surface 143 and the second bonding surface 260 is the bonding area between the micro-LED chip 100 and the driver chip 200.

[0087] The micro-LED device packaging structure 10 of the embodiment of the present application forms an additional barrier structure 510 with an annular metal step structure in the non-display area 120 of the micro-LED chip 100 through processes such as photolithography and evaporation. The barrier structure 510 is easier to implement in process production. At the same time, the packaging substrate 300 is designed with steps on all sides to form barrier steps 520. In this way, the path of moisture and other liquids entering the bonding area between the micro-LED chip 100 and the driver chip 200 is changed. Moisture and other liquids need to bypass the barrier structure 510 and the barrier step 520 to enter the bonding area. The path difficulty of moisture and other liquids is increased, and moisture and other liquids are not easy to enter the bonding area, thereby greatly improving the packaging airtightness and reliability of the micro-LED chip 100.

[0088] Based on the above description, the embodiment of the present application further provides a packaging method. Figure 16 This is a schematic diagram of a first process of the packaging method provided in an embodiment of the present application, the packaging method comprising:

[0089] S110 , providing a micro light emitting diode device 101 , wherein the micro light emitting diode device 101 includes a micro light emitting diode chip 100 and a driving chip 200 that are bonded together.

[0090] The micro-LED chip 100 includes a display area 110 and a non-display area 120. The non-display area 120 can be arranged around the outer periphery of the display area 110. The non-display area 120 serves as the electrode and wiring area for the micro-LED chip 100, while the display area 110 serves as the light-emitting area for the micro-LED chip 100. A driver chip 200 is bonded to the micro-LED chip 100 and controls the light emission of the pixel units in the micro-LED chip 100.

[0091] S120 , disposing a blocking structure 510 protruding from the micro-LED chip 100 on a surface of the micro-LED chip 100 facing away from the driver chip 200 .

[0092] The blocking structure 510 is disposed in the non-display area 120 of the micro-LED chip 100 and protrudes from the non-display area 120. In some examples, the outer periphery of the blocking structure 510 is aligned with the outer periphery of the micro-LED chip 100. Furthermore, the outer periphery of the blocking structure 510 is aligned with the outer periphery of the non-display area 120 of the micro-LED chip 100. In some examples, the blocking structure 510 is an annular structure, the annular structure being located outside the display area 110, and the display area 110 being located inside the blocking structure 510, so that the annular structure and the display area 110 can form a concentric ring structure. In some examples, the blocking structure 510 is a metal structure.

[0093] S130 , disposing a packaging substrate 300 stacked and connected with the driver chip 200 on a side of the driver chip 200 facing away from the micro LED chip 100 , and providing a blocking step 520 around the periphery of the packaging substrate 300 .

[0094] The package substrate 300 is used to carry the driver chip 200 and the micro LED chip 100 thereon. The driver chip 200 is located between the micro LED chip 100 and the package substrate 300. The package substrate 300 and the driver chip 200 can form a step structure.

[0095] It is understandable that the blocking step 520 can be formed on the packaging substrate 300 by edge cutting steps, the outer edge of the blocking step 520 can be aligned with the outer edge of the packaging substrate 300, and the blocking step 520 can be formed on the outer periphery of the packaging substrate 300.

[0096] S140 , providing packaging glue 400 , and wrapping the outer periphery of the micro-LED chip 100 and the driver chip 200 with the packaging glue 400 , and covering the blocking structure 510 and at least a portion of the blocking step 520 , thereby obtaining a micro-LED device packaging structure 10 .

[0097] The encapsulation glue 400 can bond the micro-LED chip 100, the driver chip 200, and the encapsulation substrate 300 together. The barrier structure 510 and the barrier step 520 are both located within and encapsulated by the encapsulation glue 400. The barrier structure 510 and the barrier step 520 can prevent external moisture from entering the encapsulation glue 400 and affecting the performance of the micro-LED device 101.

[0098] In the packaging method of the embodiment of the present application, a blocking structure 510 is provided on the side of the micro-LED chip 100 facing away from the driver chip 200 and protruding from the micro-LED chip 100. The protruding blocking structure 510 can block the flow of liquid S1 such as moisture entering the packaging glue 400 from the bonding interface between the micro-LED chip 100 and the packaging glue 400; at the same time, a blocking step 520 is provided on the periphery of the packaging substrate 300. The blocking step 520 can block the flow of liquid S2 such as moisture entering the packaging glue 400 from the bonding interface between the packaging substrate 300 and the packaging glue 400; thereby, the blocking structure 510 is provided on the periphery of the packaging substrate 300. The structure 510 and the blocking step 520 can change the flow path of liquids such as moisture. Liquids such as moisture need to bypass the blocking structure 510 and the blocking step 520 to enter deep inside the packaging glue 400. The blocking structure 510 and the blocking step 520 increase the difficulty of liquids such as moisture flowing deep inside the packaging glue 400, making it difficult for liquids such as moisture to enter the packaging glue 400, especially difficult to enter the bonding area of the micro light-emitting diode chip 100 and the driver chip 200, thereby greatly improving the packaging airtightness of the micro light-emitting diode device packaging structure 10, and the reliability of the micro light-emitting diode device packaging structure 10 is better.

[0099] In some examples, the step of disposing a blocking structure 510 protruding from the micro-LED chip 100 on a surface of the micro-LED chip 100 facing away from the driver chip 200 includes: disposing the blocking structure 510 protruding from the micro-LED chip 100 on the surface of the micro-LED chip 100 facing away from the driver chip 200, and aligning the outer periphery of the blocking structure 510 with the outer periphery of the micro-LED chip 100. Furthermore, if the micro-LED chip 100 includes a display area 110 and a non-display area 120, the step further includes: disposing the blocking structure 510 protruding from the non-display area 120, and aligning the outer periphery of the blocking structure 510 with the outer periphery of the non-display area 120. In this case, the blocking structure 510 can be fully supported by the micro-LED chip 100, the connection between the blocking structure 510 and the micro-LED chip 100 is more secure, and the blocking structure 510 is easier to manufacture.

[0100] In some examples, the step of providing a blocking structure 510 protruding from the micro-LED chip 100 on a side of the micro-LED chip 100 facing away from the driver chip 200 includes: forming a ring-shaped blocking structure 510 protruding from the micro-LED chip 100 on the outer periphery of the side of the micro-LED chip 100 facing away from the driver chip 200 through photolithography and evaporation processes, and aligning the outer periphery of the blocking structure 510 with the outer periphery of the micro-LED chip 100. In this case, a blocking structure 510 having an annular metal step structure can be additionally formed through photolithography, evaporation, and other processes, making the blocking structure 510 easier to manufacture; and the ring-shaped blocking structure 510 can enclose the entire display area 110, further improving the package airtightness and reliability of the micro-LED device package structure 10.

[0101] In some examples, a packaging substrate 300 stacked and connected to the driver chip 200 is provided on a side of the driver chip 200 away from the micro-LED chip 100, and the step of opening a blocking step 520 on the periphery of the packaging substrate 300 includes: providing a packaging substrate 300 and a circuit board 600; opening a blocking step 520 on the periphery of the packaging substrate 300, so that the first end 610 of the circuit board 600 is set on the blocking step 520, and the second end 620 of the circuit board 600 extends outside the packaging substrate 300; stacking and connecting the micro-LED device 101 and the packaging substrate 300, and positioning the driver chip 200 between the packaging substrate 300 and the micro-LED chip 100; and electrically connecting the circuit board 600 to the driver chip 200 through an electrical connector 700. The step of providing encapsulation glue 400 and wrapping the outer periphery of the micro-LED chip 100 and the driver chip 200 with the encapsulation glue 400, and covering the blocking structure 510 and at least a portion of the blocking step 520 includes: providing encapsulation glue 400 and wrapping the outer periphery of the micro-LED chip 100 and the driver chip 200 with the encapsulation glue 400, and covering the blocking structure 510, at least a portion of the blocking step 520, a portion of the circuit board 600, and the electrical connector 700.

[0102] Based on the above description, please refer to Figure 17 , Figure 17 A second flow chart of the packaging method provided in an embodiment of the present application. The packaging method of the present application includes:

[0103] In S210 , a packaging substrate 300 is provided.

[0104] In S220 , a ring-shaped blocking step 520 is formed on the periphery of the package substrate 300 by a cutting process. The blocking step 520 includes a first step surface 521 , a connecting surface 522 , and a second step surface 523 that are sequentially connected.

[0105] The packaging substrate 300 is used to support the driver chip 200, the micro-LED chip 100, and the encapsulation glue 400. The packaging substrate 300 can also serve as a heat sink. A blocking step 520 is formed on the outer periphery of the packaging substrate 300. The outer edge of the first step surface 521 of the blocking step 520 can be aligned with the outer edge of the packaging substrate 300. This invention forms the blocking step 520 on the packaging substrate 300 by using an edge-cutting step method, making it easier to process and form.

[0106] In S230 , a circuit board 600 is provided.

[0107] In S240 , the first end 610 of the circuit board 600 is disposed on the blocking step 520 , and the second end 620 of the circuit board 600 is disposed outside the package substrate 300 , and the spacing distance L0 between the first end 610 and the connecting surface 522 of the blocking step 520 is between 50 μm and 150 μm.

[0108] The maximum distance between the circuit board 600 and the first stepped surface 521 is smaller than the maximum distance between the connecting surface 522 and the first stepped surface 521. The thickness of the circuit board 600 is smaller than the height of the connecting surface 522, thereby creating a height difference between the circuit board 600 and the driver chip 200. When the spacing L0 between the first end 610 of the circuit board 600 and the connecting surface 522 of the blocking step 520 is between 50 microns and 150 microns, a sunken groove structure 530 is formed between the first end 610 and the connecting surface 522. Liquids such as moisture entering through the interface between the circuit board 600 and the encapsulating adhesive 400 will change their flow path upon encountering the groove structure 530, flowing toward the bottom of the groove structure 530. Consequently, the groove structure 530 can further improve the airtightness and reliability of the micro-LED device package 10.

[0109] In S250 , a micro light emitting diode device 101 is provided. The micro light emitting diode device 101 includes a micro light emitting diode chip 100 and a driving chip 200 that are bonded together.

[0110] In S260 , the driving chip 200 is connected to the second stepped surface 523 of the package substrate 300 , and the driving chip 200 is electrically connected to the circuit board 600 through the electrical connector 700 .

[0111] The external circuit provides electrical signals and control signals to the driver chip 200 through the circuit board 600 , and the driver chip 200 can control the pixel units of the micro light emitting diode chip 100 to emit light.

[0112] In S270 , a ring-shaped blocking structure 510 protruding from the micro-LED chip 100 is formed on the outer periphery of the micro-LED chip 100 facing away from the driver chip 200 through photolithography and evaporation processes.

[0113] In this step, an additional ring-shaped metal step-structured blocking structure 510 can be formed in the non-display area 120 of the micro-LED chip 100 through processes such as photolithography and evaporation. The blocking structure 510 is easier to realize in process production.

[0114] In S280, packaging glue 400 is provided, and the packaging glue 400 is wrapped around the outer periphery of the micro-LED chip 100 and the driver chip 200, and covers the blocking structure 510, at least part of the blocking step 520, part of the circuit board 600 and the electrical connector 700, and obtains the micro-LED device packaging structure 10.

[0115] The encapsulation glue 400 can bond the micro-LED chip 100, the driver chip 200, and the package substrate 300 together, and cover the barrier structure 510, all or part of the barrier step 520, part of the circuit board 600, and the electrical connector 700. The encapsulation glue 400 serves as a protective adhesive for the micro-LED device package structure 10. The encapsulation glue 400 can reduce the entry of moisture and other liquids into the bonding area between the micro-LED chip 100 and the driver chip 200.

[0116] In the packaging method of the embodiment of the present application, a blocking structure 510 with an annular metal step structure is additionally formed in the non-display area 120 of the micro-LED chip 100 through processes such as photolithography and evaporation. The blocking structure 510 is easier to implement in process production; at the same time, a step design is performed on the four sides of the packaging substrate 300 to form a blocking step 520. The path for liquids such as moisture to enter the bonding area between the micro-LED chip 100 and the driver chip 200 will change. Liquids such as moisture need to bypass the blocking structure 510 and the blocking step 520 to enter the bonding area. The path difficulty of liquids such as moisture increases, and liquids such as moisture are not easy to enter the bonding area, thereby greatly improving the packaging airtightness and reliability of the micro-LED device packaging structure 10.

[0117] Based on the above description, the present embodiment further provides a display device 20, please refer to Figure 18 , Figure 18A structural schematic diagram of a display device 20 provided in an embodiment of the present application. The display device 20 can be applied to electronic devices to realize extended reality (XR) technologies such as augmented reality (AR), virtual reality (VR), and mixed reality (MR). During implementation, the display device 20 can be the projection part of an electronic device, such as a projector, a head-up display (HUD), etc.; for another example, the display device 20 can also be the display part of an electronic device, such as a smart phone, a smart watch, a laptop computer, a tablet computer, a driving recorder, a navigator, a head-mounted device, or any other device with a display screen; for another example, the display device 20 can also be the lighting part of an electronic device, such as a vehicle, a street lamp, or any other device with a lighting component.

[0118] It can be understood that the display device 20 of the embodiment of the present application includes the micro-light emitting diode device packaging structure 10 of any of the aforementioned embodiments. Therefore, the micro-light emitting diode device packaging structure 10 of the display device 20 of the present application has better packaging airtightness and better reliability.

[0119] It should be noted that the micro-LED device packaging structure 10, packaging method, and display device 20 of the embodiments of the present application are different subjects under the same inventive concept. Features not described in detail in each embodiment can be found in the description of other embodiments.

[0120] It should be noted that the "multiple" mentioned in this application generally refers to two or more. Moreover, the directional terms mentioned in the embodiments of the present application, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the embodiments of the present application, rather than to limit the embodiments of the present application. In the various drawings, units with similar structures are represented by the same figure marks. For the sake of clarity, the various parts in the drawings are not drawn to scale. In addition, certain related parts may not be shown in the drawings.

[0121] It should be understood that, in the description of this application, terms such as "first" and "second" are only used to distinguish similar objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0122] It is understood that those skilled in the art can, under the guidance of the above embodiments, combine the various implementations in the above embodiments to obtain technical solutions of multiple implementations. The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

[0123] The above describes in detail the micro-LED device packaging structure, packaging method, and display device provided by this application. Specific examples are used herein to illustrate the principles and implementation methods of this application. The description of the above embodiments is intended only to facilitate understanding of this application. Furthermore, those skilled in the art will appreciate that variations in the specific implementation methods and scope of application may occur based on the principles of this application. In summary, this specification should not be construed as limiting this application.

Claims

1. A micro light emitting diode device packaging structure, characterized in that: include: A micro light emitting diode device, comprising a micro light emitting diode chip and a driver chip bonded together; a blocking structure, disposed on a side of the micro-LED chip facing away from the driver chip and protruding from the micro-LED chip; a packaging substrate, stacked on a side of the driver chip facing away from the micro-LED chip, with a blocking step provided on the periphery of the packaging substrate; and The packaging glue wraps the outer periphery of the micro-LED chip and the driver chip, and covers the blocking structure and at least a portion of the blocking step.

2. The micro light emitting diode device packaging structure according to claim 1, characterized in that: The micro light emitting diode chip includes a display area and a non-display area. The blocking structure is arranged and protrudes from the non-display area. The outer periphery of the blocking structure is aligned with the outer periphery of the non-display area.

3. The micro light emitting diode device packaging structure according to claim 2, characterized in that: The blocking structure is a ring structure, and the display area is located inside the blocking structure.

4. The micro light emitting diode device packaging structure according to any one of claims 1 to 3, characterized in that: The micro light emitting diode device packaging structure further includes: a circuit board electrically connected to the driving chip via an electrical connector, wherein a first end of the circuit board is disposed on the blocking step, and a second end of the circuit board is disposed outside the packaging substrate; Wherein, the packaging glue also wraps a portion of the circuit board and the electrical connector.

5. The micro light emitting diode device packaging structure according to claim 4, characterized in that: The blocking step includes a first step surface, a connecting surface, and a second step surface connected in sequence, the second step surface is located between the driving chip and the first step surface, and the circuit board is arranged on the first step surface; wherein, The thickness of the circuit board is smaller than the height of the connection surface, and the spacing distance between the first end of the circuit board and the connection surface is between 50 micrometers and 150 micrometers.

6. The micro light emitting diode device packaging structure according to any one of claims 1 to 3, characterized in that: The packaging substrate is a heat dissipation substrate.

7. A packaging method, characterized in that: include: A micro light emitting diode device is provided, wherein the micro light emitting diode device comprises a micro light emitting diode chip and a driver chip bonded together; A blocking structure protruding from the micro-LED chip is provided on a side of the micro-LED chip facing away from the driver chip; A packaging substrate is provided on a side of the driver chip facing away from the micro-LED chip and is stacked and connected with the driver chip, and a blocking step is provided on the periphery of the packaging substrate; Packaging glue is provided, and the packaging glue is made to wrap the outer periphery of the micro-LED chip and the driver chip, and cover the blocking structure and at least part of the blocking step, so as to obtain a micro-LED device packaging structure.

8. The packaging method according to claim 7, wherein: The micro-LED chip includes a display area and a non-display area; the step of providing a blocking structure protruding from the micro-LED chip on a side of the micro-LED chip facing away from the driver chip includes: A blocking structure protruding from the non-display area is provided in the non-display area, and an outer periphery of the blocking structure is aligned with an outer periphery of the non-display area.

9. The packaging method according to claim 7, wherein: The step of providing a packaging substrate stacked and connected to the driver chip on a side of the driver chip facing away from the micro-LED chip, and providing a blocking step on the periphery of the packaging substrate, comprises: Provide packaging substrates and circuit boards; A blocking step is provided on the periphery of the packaging substrate, so that the first end of the circuit board is disposed on the blocking step and the second end of the circuit board extends outside the packaging substrate; The micro-LED device is stacked and connected with the packaging substrate, and the driving chip is located between the packaging substrate and the micro-LED chip; electrically connecting the circuit board to the driver chip via an electrical connector; The step of providing packaging glue and wrapping the outer periphery of the micro-LED chip and the driver chip with the packaging glue and covering the blocking structure and at least a portion of the blocking step includes: Packaging glue is provided, and the packaging glue is made to wrap the outer periphery of the micro-LED chip and the driver chip, and cover the blocking structure, at least a part of the blocking step, a part of the circuit board and the electrical connector.

10. A display device, characterized in that: The micro-light emitting diode device packaging structure comprises the micro-light emitting diode device packaging structure according to any one of claims 1 to 6; or, the micro-light emitting diode device packaging structure prepared by the packaging method according to any one of claims 7 to 9.

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