Single-layer air waveguide antenna integrated on circuit board

Abstract

This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide directs electromagnetic energy through the air-filled channel. It is formed from a single layer of material, such as a metal sheet, metal coated plastic, or other material having a conductive surface attached to the circuit board. A portion of the circuit board surface is configured as a bottom of the air-filled channel. The bottom is an electrical interface between the circuit board and the air-filled channel. A single layer of material is located on top of this electrical interface for defining walls and top of an air-filled channel. The single layer of material may be secured to the circuit board in various ways. In this way, the cost of integrating the air waveguide antenna to the circuit board can be lower than that of other waveguide manufacturing technologies.

Description

[0001] This application is a divisional application of the invention patent application with the application date of March 22, 2022, application number 202210282861.8, and invention name “Single-layer air waveguide antenna integrated on a circuit board”. Background Art

[0002] Air waveguides are used in many applications, for example, as antennas to shape or filter electromagnetic energy beams based on frequency. Channels filled with air are some of the internal features of air waveguides. These channels may include openings called radiators or slots that allow electromagnetic energy to be filtered in or out. Some waveguide channels may be formed by multiple layers of substrate materials that are stacked and welded together to form channel walls. Other air waveguides are formed using Teflon and FR4 printed circuit board (PCB) materials. Yet other air waveguides are manufactured using injection molded plastics (e.g., filled polyetherimide (PEI)), which are provided with metal coatings (e.g., silver). Using existing manufacturing techniques to form air waveguides may be too expensive for some applications (including automotive scenarios that require eventual mass production). Summary of the invention

[0003] This document describes a single-layer air waveguide antenna integrated on a circuit board. In one example, a device includes an air waveguide antenna configured to guide electromagnetic energy through an air-filled channel. The air waveguide includes an electrical interface to the circuit board and a single layer of material having a conductive surface and located on top of the electrical interface. The electrical interface configures a portion of the circuit board surface to serve as a bottom of the air-filled channel. The single layer of material defines the walls and top of the air-filled channel.

[0004] In another example, a method is described. The method includes identifying a portion of a circuit board surface to serve as an electrical interface with an air-filled waveguide channel. The method further includes: obtaining a single layer of material having a conductive surface that defines a wall and a top of the air-filled waveguide channel; and placing the single layer of material on top of the portion of the circuit board surface. The method further includes: attaching the single layer of material to the portion of the circuit board surface to form an air waveguide antenna configured to guide electromagnetic energy through the air-filled waveguide channel.

[0005] This Summary introduces a simplified concept of a single layer air waveguide integrated on a circuit board, as further described in the Detailed Description and Figures. This Summary is not intended to identify essential features of the claimed subject matter, nor is it intended to be used to determine the scope of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Details of one or more aspects of a single-layer air waveguide integrated on a circuit board are described in this document with reference to the following drawings. Numbers are generally used throughout the drawings to refer to similar features and components:

[0007] Figure 1 An example environment is shown in which a radar system having a single-layer air waveguide antenna is integrated on a circuit board configured for use on a vehicle;

[0008] Figure 2 An example of a single-layer air waveguide antenna integrated on a circuit board is shown;

[0009] Figure 3 An example single layer of material is shown which, when integrated on a circuit board, is configured to function as a single layer waveguide antenna having a channel at least partially defined by the circuit board and filled with air;

[0010] Figure 4 An example surface of a circuit board is shown, the surface of the circuit board being configured to serve as the floor of an air-filled channel of a single-layer air waveguide antenna integrated on the circuit board;

[0011] Figure 5 Another example of a single-layer air waveguide antenna integrated on a circuit board is shown;

[0012] Figure 6 An example process for manufacturing a single-layer air waveguide antenna integrated on a circuit board is shown; and

[0013] Figure 7-Figure 13 Different techniques are shown for attaching a single layer of material to a circuit board surface to form a single layer air waveguide antenna integrated on the circuit board. DETAILED DESCRIPTION

[0014] Overview

[0015] Radar systems are a sensing technology that some automotive systems rely on to gain information about the surrounding environment. Radar systems typically use antennas or waveguides to direct the electromagnetic energy or signal being transmitted or received. Such radar systems may use any combination of antennas and waveguides to provide increased gain and directivity. As the automotive industry increasingly uses radar systems in more vehicles, the challenge of reducing the costs associated with the waveguides of these radar systems becomes a higher priority for manufacturers.

[0016] Air waveguides are used in many applications, for example, as antennas to shape or filter electromagnetic energy beams based on frequency. Channels filled with air are some of the internal features of air waveguides. These channels may include openings called radiators or slots that allow electromagnetic energy to be filtered in or out. Some waveguide channels may be formed by multiple layers of substrate materials that are stacked and welded together to form channel walls. Other air waveguides are formed using Teflon and FR4 printed circuit board (PCB) materials. Still other air waveguides are manufactured using injection molded plastics (e.g., filled polyetherimide (PEI)), which are given a metal coating (e.g., silver) under precisely controlled conditions to avoid thermal wear. Using existing manufacturing technology to form air waveguides may be too expensive for some applications (including automotive scenarios that require eventual mass production). A lower cost but still high-performance air waveguide antenna technology is needed to make radar and other sensing technologies affordable, which can improve driving safety.

[0017] This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through a channel filled with air. It is formed by a single layer of material, such as a metal sheet, a metal-coated plastic, or other material having a conductive surface attached to a circuit board. A portion of the circuit board surface is configured to serve as the bottom of the channel filled with air. The bottom forms an electrical interface between the circuit board and the channel filled with air. The single layer of material is located on top of this electrical interface to define the walls and ceiling of the channel filled with air. The single layer of material can be fixed to the circuit board in various ways. The cost of integrating the air waveguide antenna onto the circuit board in this way can be cheaper than other waveguide manufacturing technologies. Since the example air waveguide antenna can be manufactured by stacking a single layer of material on top of the circuit board, the two materials can be held together by a mechanical interface arranged between two adjacent surfaces. The mechanical interface can further include an electrical interface between the upper portion of the air waveguide antenna (formed by the single layer of material) and the lower portion of the air waveguide antenna (formed by the circuit board). The circuit board may include one or more electrical contacts that align with the channels of the air waveguide antenna so that the mechanical interface also electrically couples the two layers. This interface may eliminate the need for solder between the connections, which may be made directly through the interface formed between the two materials.

[0018] Since solder may no longer be required to attach the air waveguide antenna to the circuit board, there may be less risk of thermal damage to the circuit board or single layer material (e.g., metal-coated plastic). These less stringent manufacturing requirements may be more easily achieved, resulting in fewer manufacturing steps being performed and fewer defects, which may reduce costs, especially when manufactured in large quantities. Thus, the example air waveguide manufacturing may be much simpler and cheaper than existing waveguide technology.

[0019] Example Environment

[0020] Figure 1 An example environment 100 is shown in which a radar system 102 having a single layer 104 of air waveguide antennas 106 is integrated on a circuit board 108 and configured for use on a vehicle 110. The vehicle 110 may use one or more air waveguide antennas 106 to implement operation of the radar system 112. For example, in response to radar data received from the radar system 102 indicating a position of an object 112 relative to the vehicle 110, the vehicle 110 performs a driving maneuver to avoid a collision with the object 112.

[0021] Although shown as an automobile, the vehicle 110 may represent other types of motorized vehicles (e.g., motorcycles, buses, tractors, semi-trailers, or construction equipment), non-motorized vehicles (e.g., bicycles), rail vehicles (e.g., trains or trams), watercraft (e.g., ships or boats), aircraft (e.g., airplanes or helicopters), or spacecraft (e.g., satellites). In general, manufacturers may mount the radar system 102 to any mobile platform, including mobile machinery or robotic devices. In other implementations, other devices (e.g., desktop computers, tablet computers, laptop computers, televisions, computing watches, smart phones, gaming systems, etc.) may combine the radar system 102 with the air waveguide antenna 106 and the supporting technologies described herein.

[0022] The radar system 102 may be part of a vehicle 110. In the depicted environment 100, the radar system 102 is mounted near the front of the vehicle 110 or integrated into the front of the vehicle 108 to detect an object 112 and avoid a collision. The radar system 102 provides a field of view 118 toward the object 112. The radar system 102 may project the field of view 118 from any exterior surface of the vehicle 110. For example, a vehicle manufacturer may integrate the radar system 102 into a bumper, side mirror, headlight, taillight, or any other interior or exterior location where the object 112 needs to be detected. In some cases, the vehicle 110 includes multiple radar systems 102, such as a first radar system 102 and a second radar system 102 that provide a larger field of view 118. Typically, a vehicle manufacturer may design the location of one or more radar systems 102 to provide a specific field of view 118 that encompasses an area of ​​interest, including, for example, in or around a lane of travel that is aligned with the vehicle path.

[0023] The vehicle 110 may also include at least one automotive system that relies on data from the radar system 102, including a driver assistance system, an autonomous driving system, or a semi-autonomous driving system. The radar system 102 may include an interface to such an automotive system. A signal may be output via the interface based on electromagnetic energy received by the radar system 102. Typically, the automotive system uses radar data provided by the radar system 102 to perform functions. For example, a driver assistance system may provide blind spot monitoring and generate an alarm indicating a potential collision with an object 112 detected by the radar system 102. In this case, the radar data from the radar system 102 indicates when it is safe or unsafe to change lanes. The autonomous driving system may move the vehicle 110 to a specific position on the road while avoiding collisions with the object 112 detected by the radar system 102. The radar data provided by the radar system 102 may provide information about the distance to the object 112 and the position of the object 110, so that the autonomous driving system can perform emergency braking, perform lane changes, or adjust the speed of the vehicle 110.

[0024] The radar system 102 typically includes a transmitter (not shown) and at least one antenna, including an air waveguide antenna 106, to transmit electromagnetic signals. The radar system 102 typically includes a receiver (not shown) and at least one antenna, including an air waveguide antenna 106, to receive reflected versions of these electromagnetic signals. The transmitter includes components for transmitting electromagnetic signals. The receiver includes components for detecting reflected electromagnetic signals. The transmitter and the receiver may be incorporated together on the same integrated circuit (e.g., a transceiver integrated circuit) or separately incorporated on different integrated circuits. The radar system 102 also includes one or more processors (not shown) and a computer readable storage medium (CRM) (not shown). The processor may be a microprocessor or a system on a chip. The processor executes instructions stored in the CRM. For example, the processor may control the operation of the transmitter. The processor may also process the electromagnetic energy received by the air waveguide antenna 106 and determine the position of the object 112 relative to the radar system 102. The processor may also generate radar data for the automotive system. For example, the processor may control the autonomous driving system or semi-autonomous driving system of the vehicle 110 based on the processed electromagnetic energy from the air waveguide antenna 106.

[0025] Since forming an air waveguide antenna from multiple layers of substrate material and from stacking substrate materials and welding injection molded plastic may be too expensive for some applications, including automotive scenarios requiring eventual mass production, the air waveguide antenna 106 consists of only two main parts.

[0026] The first major portion consists of a metal or metallized plastic layer 104 that defines an opening 116 (e.g., port and radiator) into a dielectric-filled channel 114, which in this example is air. The channel 114 is partially surrounded by vertical walls 120 and a top 122. The purpose of the channel 114 is to direct the desired electromagnetic energy captured by the air waveguide antenna 106 to or from other components of the radar system 102 (e.g., transceiver).

[0027] The second main part of the air waveguide antenna 106 is composed of a portion of the circuit board 108 (e.g., a substrate or other circuit board). The single layer 104 is integrated onto and attached to the circuit board 108 to define a channel 114 containing a dielectric (e.g., air). The vertical walls 120 forming the channel 114 in the first main part of the air waveguide antenna 106 cooperate with the surface of the circuit board 108, which is configured to define the bottom of the channel 114. The bottom 124 is arranged opposite to the top 12 (e.g., substantially parallel). When the two main parts are put together, they create an electrical connection between the air waveguide antenna 106 and other components of the radar system 102.

[0028] The single layer 104 can be formed from a single metal sheet that is stamped or bent into a specific shape. The single layer 104 can be composed of metallized plastic; a surface coating of a metallic material can be applied to an injection molded or printed plastic part in a desired shape. The single layer 104 material can include a non-conductive core and an outer conductive surface. For example, the non-conductive core of the single layer 104 material can include plastic and the outer conductive surface can include metal.

[0029] like Figure 1 As shown, the air waveguide antenna 106 includes two channels 114. Generally, the channels 114 define a rectangular cavity surrounded by three vertical walls 120, with an opening at one end. The channels 114 and the openings 116 manipulate electromagnetic energy in a manner that is beneficial to a particular application of the air waveguide antenna 106. The vertical walls 120 of the channels 114 (e.g., surfaces of the channels 114 that are perpendicular to the flow of electromagnetic energy through the channels 114) laterally direct electromagnetic energy across the surface of the circuit board 108. The top 122 and bottom 124 of the channels 114 (e.g., surfaces parallel to the flow of electromagnetic energy through the channels) regulate the inflow and outflow of electromagnetic energy through the openings 116 in a vertical direction.

[0030] For example, the single layer 104 includes an opening 116 through the top 122 and into the channel 114, which allows undesirable electromagnetic energy (e.g., energy outside the operating frequency) to escape the air waveguide 106, and the opening 116 allows desirable electromagnetic energy (e.g., energy within the operating frequency) to flow within the air waveguide 106. The opening 116 allows electromagnetic energy to enter the channel 114 (e.g., act as a port) and exit the channel 114 (e.g., act as a radiator or slot).

[0031] The bottom 124 of the channel 114 provided by the circuit board 108 prevents electromagnetic energy passing through the channel 114 from escaping the air waveguide 106 through the circuit board 108. The bottom 124 of the channel 114 is formed by the outer surface of the circuit board 108 that is in contact with the vertical wall 120 of the single layer 104. Although there is no Figure 1 1, but the bottom 124 of the channel 114 may include connections to wires, pads, or traces that electrically couple the air waveguide antenna 106 to other components of the radar system 102, such as other components (not shown) integrated on or otherwise attached to the circuit board 108. The top 122 of the channel 144, which is positioned relative to the circuit board 108 (e.g., a surface parallel to the flow of electromagnetic energy through the channel), regulates the flow of electromagnetic energy in and out of the circuit board 108 and through the opening 116.

[0032] Layer 104 can be any solid material, including wood, carbon fiber, fiberglass, metal, plastic, or a combination thereof. A common material for layer 104 is injection molded plastic (e.g., filled PEI). Layer 104 can be metallized (e.g., coated by electroplating, physical vapor deposition, painting, or other forms of metallization). The metal used to metallize layer 104 can be silver, silver alloy, copper, aluminum, cold rolled steel, stainless steel, or other conductive metal.

[0033] Layer 104 shares interface 126 with circuit board 108. Interface 126 provides a mechanical joint between the two materials. In addition, interface 126 may provide electrical functionality. Interface 126 may be referred to as an electrical connection layer.

[0034] The air waveguide antenna 106 may be fabricated by stacking the monolayer 104 on top of the circuit board 108. The two materials may be held together by an interface 126 configured as a mechanical interface disposed between two adjacent surfaces and also configured as an electrical interface between the two pieces.

[0035] With respect to the mechanical interface provided by the interface 126, in some examples, the interface 126 includes a frictional joint formed by external pressure placed around two adjacent surfaces (e.g., using a clip, screw, or other fastener). The interface 126 can include a pattern of mechanical features (e.g., protrusions, depressions, bumps, teeth, blocks, snaps, sockets, mutually roughened surfaces) on one or both of the adjacent surfaces such that when held together under pressure, the features result in a joint that limits lateral movement and, therefore, maintains vertical alignment between the two materials. In some cases, the interface 126 between the two air waveguides includes an adhesive joint, a taped-joint, a solder joint, a weld, a reflow solder joint with a low temperature solder, a dispensed conductive or non-conductive adhesive joint, a pressure sensitive adhesive, a low pressure sintered joint, a hot-bar solder joint, or other types of connections.

[0036] The interface 126 may further include an electrical coupling or electrical interface between an upper portion of the air guide antenna 106 (formed by the single layer 104 material) and a lower portion of the air guide antenna 106 (formed by the circuit board).

[0037] Although not in Figure 11 , but the circuit board 108 may include one or more electrical contacts that are aligned with the channel 114 of the air guide antenna 106 so that the interface 126 can also electrically couple the two materials. For example, the input or output of the transceiver or other components of the radar system 102 can be electrically coupled to the air guide antenna 106 through the interface 126 using the circuit board 108. As another example, the interface 126 can electrically couple the air guide antenna 106 to the common potential of the radar system 102. This interface 126 can eliminate the need for solder joints between the connections, instead, the connection can be made directly through the interface 126.

[0038] The single layer 104 material can be structurally secured to and electrically coupled to the circuit board 108 in a variety of ways, as described in more detail below. In general, the interface 126 enables an inexpensive manufacturing process for the air waveguide antenna 106 without requiring solder to physically connect and electrically couple the layer 104 to the circuit board 108. Using relatively inexpensive air waveguide antennas 106 for radar applications in vehicles 110 can ultimately contribute to greater adoption of advanced safety technologies in vehicles, which can improve driving safety.

[0039] Example Air Waveguide Antenna

[0040] Figure 2 An example of a single layer 104 - 1 of an air waveguide antenna 106 - 1 integrated on a circuit board 108 - 1 is shown. The air waveguide antenna 106 - 1 is an example of an air waveguide antenna 106 .

[0041] exist Figure 2 In the upper right corner of FIG. 1 , the air waveguide antenna 106 - 1 is shown in assembled form. Figure 2 The remainder of FIG. 1 shows the air waveguide antenna 106 - 1 with a partial cutout A to aid in explanation.

[0042] Layer 104-1 is aligned with the top of surface 200 of circuit board 108-1 so that portions 202 of surface 200 are configured as the bottom of one or more channels 114-1. Walls 120-1 and top 122-1 of channel 114-1 are defined by the material of layer 104-1. Top 122-1 includes opening 116-1 for radiating or absorbing energy.

[0043] Figure 2Also shown in FIG. 1 are example electrical connections 204 (e.g., traces, pads, terminals, pins, wires) to the circuit board 108-1. The channels 114-1 defined by the layer 104-1 may be aligned with the electrical connections 204. Other portions of the air guide antenna 106-1, such as the material of the layer 104-1 between the channels 114-1, may include electrical interfaces through the electrical connections 204, such as to set the air guide 106 to a common potential.

[0044] Figure 3 An example single layer 104 - 2 of material is shown which, when integrated on a circuit board, is configured as a single layer waveguide antenna having a channel at least partially defined by the circuit board and filled with air. Figure 4 An example surface of a circuit board 108-2 is shown, which is configured as the bottom of an air-filled channel to a single-layer air waveguide antenna integrated on the circuit board. As shown by the dashed line B, a single channel with three openings to the air dielectric is highlighted. When referring to Figure 4 When viewing, Figure 3 The single channel highlighted in FIG. 1 is aligned with a similarly sized portion of circuit board 108 - 2 , as indicated by dashed line B.

[0045] Example Mechanical Interface

[0046] Figure 5 Another example of a single layer air waveguide antenna 106-3 integrated on a circuit board 108-3 is shown. The single layer 104-3 material is aligned with a portion of the circuit board 108-3 to create an interface 500. When the two main parts of the air waveguide antenna 106-3 are combined as shown, the interface 500 includes mechanical as well as electrical features. An electrical connection 204-1 is formed between the two surfaces.

[0047] The surface of the first layer 104-3 can share an interface 500 with a complementary surface of the circuit board 108-3. For example, if the interface 500 includes a ball-and-socket type interface, the first interface surface can include a ball and the second interface surface can include a socket. Alternatively, the first and second interface surfaces can include a combination of a "ball" and a "socket" as long as they are complementary between adjacent surfaces. This is the case regardless of which interface is used, unless in this implementation, the mechanical interface on the two interface surfaces is an irregular rough area. In this implementation, the irregular nature of the rough surface, as well as the nature of the layers being compressed together, causes a complementary relationship between the two adjacent interface surfaces. The mechanical interface on the interface surface can be a complementary interface of one type of mechanical interface, a combination of complementary interfaces of one type of mechanical interface, or any combination of the above, as well as including other types of mechanical interfaces. The interface 500 provides a mechanical connection between the two parts of the air waveguide antenna 106-3; lateral movement between the two parts is reduced.

[0048] The interface 500 created between the air waveguide antenna 106 and the circuit board 108 can reduce (if not eliminate) the need for solder at their joints. Eliminating the use of soldering techniques to make electrical connections and thereby integrating the air waveguide into the circuit board reduces the costs associated with manufacturing. Attaching the air waveguide antenna 106 to the circuit board 108 without the use of solder presents less risk of thermal damage to the circuit board 108 or the single layer 104 material (e.g., metal-coated plastic). These less stringent manufacturing techniques can be more easily implemented, resulting in fewer manufacturing steps to perform and fewer defects, which can reduce costs, especially when manufactured in large quantities. Therefore, compared to existing waveguide technology, the example air waveguide manufacturing can be much simpler and cheaper.

[0049] Example Method

[0050] Figure 6 An example process 600 for manufacturing a single-layer air waveguide antenna integrated on a circuit board is shown. Figure 1 Described in the context of Figure 6 ; However, process 600 may be applied to form any of the example air waveguide antennas discussed with respect to any of the other figures.

[0051] In other words, while the waveguide 106 is one example of a waveguide antenna that may be formed by the process 600, other variations of the waveguide 106 are possible. At 602, a portion of a circuit board surface is identified to serve as an electrical interface with a waveguide channel filled with air. For example, a portion of a circuit board 108 surface (e.g., an area proximate to an electrical connection with the radar system 102) is configured to operate as a bottom 124 of a channel 114 of the waveguide antenna 106 that is formed by the process 600 and is filled with air.

[0052] At 604, a single layer of material having a conductive surface defining the walls and top of a waveguide channel filled with air is obtained. For example, the single layer 104 of material (e.g., metal, metal-coated plastic) can be created by injection molding techniques or by other manufacturing processes, including bending and forming of metal sheets alone or in combination with precision cutting techniques. The single layer 104 includes surfaces defining the walls 120 and top 122 of the channel 114 formed by the process 600 and filled with air.

[0053] At 606, the single layer of material (i.e., obtained at 604) is placed on top of a portion of the surface identified by the circuit board 108 (i.e., identified at 602). For example, the single layer 104 material is aligned with the circuit board 108 so that when they meet as a result of being joined together, the resulting waveguide antenna 106 includes a cavity defining a channel 114, wherein the surface of the channel 114 is formed by the combination of the surface of the single layer 104 material and the surface of the circuit board 108.

[0054] At 608, a single layer of material is attached to the portion of the circuit board surface to form an air waveguide antenna configured to guide electromagnetic energy through an air-filled waveguide channel. Figure 7-Figure 13 The bond between the circuit board 108 and the single layer 104 material is configured to act as a mechanical interface that prevents separation and further prevents lateral movement, using one or more of the techniques depicted in 608. The mechanical interface formed at 608 configures the two pieces into a waveguide antenna device. Integrating waveguide technology on a circuit board using process 600 can achieve cost and material savings compared to traditional waveguide manufacturing techniques. Figure 7-Figure 12 Different techniques 700 are shown for attaching a single layer of material to a surface of a circuit board to form a single layer air waveguide antenna integrated on the circuit board.

[0055] In many cases, the mechanical interface formed at 602 includes an electrical interface formed by performing process 600. For example, the mechanical connection between the single layer 104 material and the circuit board 108 may also provide an electrical function, such as enabling an electrical connection (e.g., electrical connection 204) between the single layer 104 material and the circuit board 108. The electrical connection may include a common potential of the circuit board 108, a connection to an antenna array, or a port of a radar chip (e.g., an MMIC).

[0056] exist Figure 7 In the embodiment of the present invention, the attachment performed at 608 of process 600 includes attaching a single layer of material to a portion of a surface of a circuit board, including reflow soldering the single layer of material to the circuit board using a low temperature solder. Figure 7 As shown in , the electrical interface between the single layer 104 material and the circuit board 108 can be formed using reflow soldering, including low temperature solder (e.g., a compound based on one or more of other elements with low temperature melting points in the range of 30 to 200 degrees Celsius, such as argon (Ag), benzyl (Bn), cadmium (Cd), indium (In), lead (Pb), or silicon (Si). Even if precautions are taken, the use of high temperature solder may cause thermal damage to the single layer 104 material or the circuit board 108. When performing low temperature soldering, when the fixture (fixturing) and pins are added to the circuit board 108, the machine controls the movement of the two materials during reflow. In order to prevent the portion of the low temperature solder that is the solder intermediate (in-solder), a solder resist can be used to prevent the solder intermediate from leaking into the channel 114. The metal removed from the metallized plastic surface can be used to produce the solder resist.

[0057] exist Figure 8 and Fig. 9 , a pressure sensitive adhesive 800 is shown that can form an interface between the circuit board 108 and the single layer 104 material. The adhesive 800 can include double-sided tape. Figure 8 Adhesive 800 is depicted having an in-solder 802 and a carrier layer 804 sandwiched between two adhesive layers 806 . Fig. 9 Adhesive 800 is shown from different angles.

[0058] Adhesive 800 can be applied to the single layer 104 material or the circuit board 108. The adhesive can be a conductive adhesive or a mixture of conductive and non-conductive materials. The conductivity of adhesive 800 is considered when preparing the single layer 104 material and the circuit board 108 to ensure that conductive materials are used where electrical interfaces are required, and to allow non-conductive materials to be used in areas where a separate mechanical interface is sufficient for cost or other considerations. Adhesive 800 can be a pressure sensitive adhesive cut into a shape and used to adhere the single layer 104 material to the circuit board 108. Because the adhesive is at least partially filled with conductive particles, it electrically connects the waveguide antenna 106 to the circuit board 108 around the periphery of the channel 114. In addition, or in lieu of using adhesive 800, other adhesives can be dispensed on the circuit board 108 or on the single layer 104 material to join the two pieces of the waveguide antenna 106.

[0059] Fig.10 A conductive adhesive 1000 is depicted that may be dispensed or printed around the perimeter of the channel 114 to ensure adequate electrical connection from the waveguide antenna 106 to the circuit board 108. Non-conductive adhesive may be used in other areas to possibly reduce cost.

[0060] Fig.11 An example air waveguide antenna 106 - 4 is shown. Fig.11 It is shown that a portion of attaching the single layer 104 material to the circuit board 108 surface at 608 of the process 600 may include: using a mechanical fastener 1002 to fix the single layer 104 material to the circuit board 108. The mechanical fastener 1002 may be a screw, pin, bolt or other component that can maintain pressure between the single layer 104 material and the circuit board 109.

[0061] Fig.11 It is shown that attaching a portion of the single layer 104 material to the circuit board 108 surface at 608 of process 600 may include: fixing the single layer 104 material to the circuit board 108 by low pressure sintering the single layer 104 material to the circuit board 108. The single layer 104 material to a portion of the circuit board 108 surface at 608 of process 600 may include: forming a piercing depression (piercing dimple) during the molding operation of the single layer 104 material to form an interface 500-1 located between the channels 114. Similarly, a depression can be formed in an all-metal version of the single layer 104 material. The depression of the interface 500-1 is then metalized by PVD or electroplating. The depression can then be pressed into the solder that has been previously printed and reflowed on the circuit board.

[0062] Fig.11It is shown that attaching a portion of the single layer 104 material to the circuit board 108 surface at 608 of process 600 may include: fixing the single layer 104 material to the circuit board 108 by performing reflow soldering of the single layer 104 material to the circuit board 108. The single layer 104 material to a portion of the circuit board 108 surface at 608 of process 600 may include: forming a perforated depression during the molding operation of the single layer 104 material to form an interface 500-1 located between the channels 114. Similarly, the depression can be formed in an all-metal version of the single layer 104 material. The depression of the interface 500-1 is then metalized by PVD or electroplating. The depression can then be pressed into the solder that has been previously printed and reflowed on the circuit board. This technology results in the electrical and mechanical functions of the interface 500-1.

[0063] Although not shown, interface 500 or 500-1 may include other features or structures to achieve a secure connection between layer 104 material and circuit board 108. For example, the pattern of depressions may be replaced with teeth, ridges, protrusions, or other features that match a corresponding component pattern in circuit board 108.

[0064] Fig.12 It is shown that a portion of attaching the single layer 104 material to the circuit board 108 surface at 608 of the process 600 may include fixing the single layer 104 material to the circuit board 108 by performing low pressure sintering of the single layer 104 material to the circuit board 108. The single layer 104 material may be electrically attached to the circuit board 108 using low pressure or pressureless sintering (e.g., using Cu, using Ag). The temperature of the sintering process is approximately two hundred to two hundred and forty degrees Celsius, which requires the use of a silver mesh or copper mesh printable sintering material for the single layer 104. Once sintered, the joint can withstand temperatures in excess of nine hundred degrees Celsius and is not affected by subsequent soldering operations.

[0065] Fig.13 It is shown that a portion of attaching the single layer 104 material to the surface of the circuit board 108 at 608 of the process 600 may include: fixing the single layer 104 material to the circuit board 108 by performing thermocompression welding of the single layer 104 material to the circuit board 108. The thermocompression welding tool 1306 is made to fit the topography of the single layer 104 material. Solder 1308 is printed on the circuit board 108. The single layer 104 material is placed on the circuit board 108, and the thermocompression welding tool 1306 contacts the surface of the single layer 104 material in response to pressure 1302 being applied to the thermocompression welding tool 1306, and the thermocompression welding tool 1306 applies heat through the current 1304 to reflow the solder 1308 and create a metal joint between the circuit board 108 and the resulting waveguide antenna 106.

[0066] Additional Examples

[0067] The following are some additional examples that may be considered alone or in conjunction with any of the above examples to form a single layer air waveguide antenna integrated on a circuit board.

[0068] Example 1. A device comprising: an air waveguide antenna configured to guide electromagnetic energy through an air-filled channel, the air waveguide comprising: an electrical interface to a circuit board, the electrical interface configuring a portion of the circuit board surface to serve as the bottom of the air-filled channel; and a single layer of material having a conductive surface and placed on top of the electrical interface to define the walls and top of the air-filled channel.

[0069] Example 2. The apparatus of any of the above or below examples, wherein the electrical interface to the circuit board comprises reflow soldering to the circuit board comprising a low temperature solder.

[0070] Example 3. The apparatus of any of the above or below examples, wherein the electrical interface to the circuit board comprises a conductive adhesive to the circuit board.

[0071] Example 4. The apparatus of any of the above or below examples, wherein the electrical interface to the circuit board comprises a non-conductive adhesive to the circuit board.

[0072] Example 5. The apparatus of any of the above or below examples, wherein the electrical interface to the circuit board comprises a pressure sensitive adhesive to the circuit board.

[0073] Example 6. The apparatus of any of the above or below examples, wherein the electrical interface to the circuit board further comprises a mechanical interface to the circuit board.

[0074] Example 7. The apparatus of any of the above or below examples, wherein the mechanical interface to the circuit board includes a tooth pattern that matches a corresponding tooth pattern in the circuit board.

[0075] Example 8. The apparatus of any of the above or below examples, wherein the mechanical interface to the circuit board comprises low pressure sintering to the circuit board.

[0076] Example 9. The apparatus of any of the above or below examples, wherein the mechanical interface to the circuit board comprises thermocompression welding to the circuit board.

[0077] Example 10. The device of any of the above or below examples, wherein the bottom of the air-filled channels is parallel to the top of the air-filled channels.

[0078] Example 11. The device of any of the above or below examples, wherein the walls of the air-filled channels are orthogonal to the bottom of the air-filled channels.

[0079] Example 12. An apparatus of any of the above or below examples, wherein the single layer of material is placed on top of the electrical interface to further define an opening to the air-filled channel, the opening to the air-filled channel comprising a rectangular opening, two sides of the rectangular opening comprising walls of the air-filled channel, and the other two sides of the rectangular opening comprising a top and a bottom of the air-filled channel.

[0080] Example 13. The device of any of the above or below examples, wherein the single layer of material includes a non-conductive core and an outer conductive surface.

[0081] Example 14. The device of any of the above or below examples, wherein the non-conductive core comprises plastic and the outer conductive surface comprises metal.

[0082] Example 15. The device of any of the above or below examples, wherein the single layer of material comprises a metal.

[0083] Example 16. The apparatus of any of the above or below examples, wherein the top of the air-filled channel includes one or more slots configured to radiate electromagnetic energy.

[0084] Example 17. A method comprising: identifying a portion of a circuit board surface to serve as an electrical interface to an air-filled waveguide channel; obtaining a single layer of material having a conductive surface that defines walls and a top of the air-filled waveguide channel; placing the single layer of material on top of the portion of the circuit board surface; and attaching the single layer of material to the portion of the circuit board surface to form an air waveguide antenna configured to guide electromagnetic energy through the air-filled waveguide channel.

[0085] Example 18. The method of any of the above or below examples, wherein attaching the single layer of material to the portion of the circuit board surface comprises: reflow soldering the single layer of material to the circuit board using a low temperature solder.

[0086] Example 19. The method of any of the above or below examples, wherein attaching the single layer of material to the portion of the circuit board surface comprises: applying an adhesive to the single layer of material or the circuit board.

[0087] Example 20. The method of any of the above or below examples, wherein attaching the single layer of material to the portion of the circuit board surface includes: securing the single layer of material to the circuit board using a mechanical fastener.

[0088] Example 21. The method of any of the above or below examples, wherein attaching the single layer of material to the portion of the circuit board surface includes: performing low temperature sintering of the single layer of material to the circuit board.

[0089] Example 22. The method of any of the above or below examples, wherein attaching the single layer of material to the portion of the circuit board surface includes performing thermocompression welding of the single layer of material to the circuit board.

[0090] Example 23. The method of any of the above or below examples, wherein attaching the single layer of material to the surface of the circuit board includes: forming a mechanical interface between the single layer of material and the circuit board.

[0091] Example 24. The method of any of the above or below examples, wherein the mechanical interface comprises an electrical interface.

[0092] Example 25. The method of any of the above or below examples, wherein forming a mechanical interface between the single layer of material and the circuit board includes: achieving an electrical connection between the single layer of material and the circuit board.

[0093] Example 26. The method of any of the above examples, wherein the electrical connection comprises a common potential of a circuit board.

[0094] Example 27. A system comprising means for performing the method of any of the above examples.

[0095] Example 28. A system comprising at least one processor configured to control a manufacturing device to perform the method of any of the above examples.

[0096] Example 29. A computer-readable storage medium comprising instructions that, when executed, cause at least one processor of a system to control a manufacturing device to perform the method of any of the above examples.

[0097] Conclusion

[0098] Although various embodiments of the present disclosure are described in the foregoing description and shown in the accompanying drawings, it will be understood that the present disclosure is not limited thereto, but may be implemented into practice in various ways within the scope of the claims that follow. From the foregoing description, it will be apparent that various changes may be made without departing from the scope of the present disclosure as defined by the appended claims. In addition to radar systems, problems associated with signal attenuation may also occur in other radio frequency (RF) systems. Therefore, although described as a way to improve radar antennas and air waveguide antennas for vehicle systems, the techniques described above may also be applied outside of alternate vehicle scenarios.

[0099] Unless the context clearly dictates otherwise, the use of "or" and grammatically related terms represents unlimited, non-exclusive alternatives. As used herein, a phrase referring to "at least one of" a list of items refers to any combination of those items, including individual members. As an example, "at least one of a, b, or c" is intended to cover: a, b, c, ab, ac, bc, and abc, as well as any combination with multiple identical elements (e.g., aa, aaa, aab, aac, abb, acc, bb, bbb, bbc, cc, and ccc, or any other ordering of a, b, and c).

Claims

1. An antenna system, comprising: A circuit board comprising an exposed area of ​​a conductive layer, wherein the exposed area is configured as: an electrical interface configured to transmit or receive an electromagnetic signal based on energy guided through a waveguide channel formed at a top portion of the exposed area to configure the exposed area as a channel bottom; as well as a mechanical interface configured to prevent separation or lateral movement at the electrical interface between the bottom of the channel and a channel top and channel wall formed at the top of the channel, wherein the mechanical interface comprises solder or sintering attaching the channel wall to the exposed area of ​​the conductive layer; and A single piece of conductive material shaped to form the channel top and the channel walls coupled to the electrical interface to complete the waveguide channel and the mechanical interface by being disposed on top of the exposed area of ​​the circuit board.

2. The antenna system according to claim 1, characterized in that The electrical interface and the mechanical interface are integrated in a joint formed by the contour of the channel bottom in the circuit board, the joint extending to the channel wall in the single piece of conductive material on top of the channel bottom.

3. The antenna system according to claim 1, characterized in that The mechanical interface further includes metal teeth formed in the exposed areas of the conductive layer, the metal teeth being configured in a pattern that matches corresponding teeth formed in portions of the channel walls adjacent to the channel bottom.

4. The antenna system according to claim 1, characterized in that The soldering or the sintering includes at least one of reflow low temperature soldering, hot press soldering or low pressure sintering.

5. The antenna system according to claim 1, wherein: The single piece of conductive material is shaped to define a rectangular opening at the mechanical interface between the electrical interface and the waveguide channel.

6. The antenna system according to claim 1, characterized in that The single piece of conductive material includes a non-conductive core and an outer conductive surface.

7. The antenna system according to claim 6, characterized in that The non-conductive core comprises plastic and the outer conductive surface comprises metal.

8. The antenna system according to claim 1, characterized in that The electrical interface is configured to enable a component coupled to the conductive layer of the circuit board to transmit or receive the electromagnetic signal based on energy captured in the waveguide channel and allowed to propagate along a bottom of the channel.

9. The antenna system according to claim 1, characterized in that The waveguide channel is filled with air.

10. The antenna system according to claim 1, wherein: The channel top includes one or more slots configured to radiate the energy from the waveguide channel.

11. The antenna system according to claim 1, characterized in that The waveguide channel includes one of a plurality of waveguide channels formed between a plurality of electrical interfaces formed in other exposed areas on the circuit board, and the single piece of conductive material includes one of a plurality of single pieces of conductive material, each of the plurality of single pieces of conductive material being shaped to form an additional channel wall on top of an additional channel bottom in at least one of the other exposed areas.

12. The antenna system according to claim 1, wherein: The channel bottom is parallel to the channel top, and the channel walls are orthogonal to both the channel bottom and the channel top.

13. The antenna system according to claim 1, wherein: The system includes a radar system including the circuit board.

14. The antenna system according to claim 13, characterized in that The radar system is configured to transmit or detect the electromagnetic energy from the waveguide channel.

15. The antenna system according to claim 14, characterized in that The radar system includes a processor configured to determine an object relative to the radar system in response to receiving a signal based on the electromagnetic energy.

16. An antenna system, comprising: A circuit board comprising an exposed area of ​​a conductive layer, wherein the exposed area is configured as: an electrical interface configured to transmit or receive electromagnetic signals through energy guided by a waveguide channel formed at the top of the exposed area to configure the exposed area as a channel bottom; as well as a mechanical interface configured to prevent separation or lateral movement at the electrical interface between the channel bottom and a channel top and a channel wall formed on top of the bottom; as well as a single piece of conductive material shaped to form the channel top and the channel walls coupled to the electrical interface to complete the waveguide channel and the mechanical interface by being disposed on top of the exposed area of ​​the circuit board, wherein the single piece of conductive material includes a non-conductive core and an outer conductive surface.

17. A radar system comprising an antenna system, the antenna system having: A circuit board comprising an exposed area of ​​a conductive layer, wherein the exposed area is configured as: an electrical interface configured to transmit or receive electromagnetic signals through energy guided by a waveguide channel formed at the top of the exposed area to configure the exposed area as a channel bottom; as well as a mechanical interface configured to prevent separation or lateral movement at the electrical interface between the channel bottom and a channel top and a channel wall formed on top of the bottom; as well as A single piece of conductive material shaped to form the channel top and the channel walls coupled to the electrical interface to complete the waveguide channel and the mechanical interface by being disposed on top of the exposed area of ​​the circuit board.

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