Earphone and earphone playing system

Abstract

The embodiment of the invention belongs to the field of earphones, and relates to an earphone and an earphone playing system, the earphone comprises a first shell, a second shell, and a first loudspeaker and a plurality of second loudspeakers arranged on the first shell; the first shell and the second shell are connected to form an accommodating cavity; the first shell is in a circular truncated cone shape or an approximate circular truncated cone shape and is provided with a bottom face and a side face, the first loudspeaker is arranged on the bottom face of the first shell, the second loudspeakers are arranged on the side face of the first shell at intervals, and the first loudspeaker and the second loudspeakers are all located in the containing cavity. The earphone playing system comprises the decoding earphone playing box and the earphone. According to the scheme provided by the invention, the first loudspeaker and the plurality of second loudspeakers are respectively arranged on the bottom surface and the side surface of the first shell, so that a plurality of sound channels can be played in different directions, sound impact effects of different angles and different directions can be truly restored structurally, and sound details are truly restored.

Description

Technical Field

[0001] The present application relates to the field of earphone technology, and more specifically, to an earphone and an earphone playing system. Background Art

[0002] 3D sound is a general term for a type of sound effect. It generally refers to the sound technology that can use speakers (headphones or speakers) to create the effect of sounds coming from different directions and distances in 3D space based on the auditory characteristics of the human ear, thereby immersing the listener in a virtual sound space. Different from stereo and surround sound, it can provide 360° sound positioning in the horizontal plane and sound positioning in height.

[0003] Dolby Atmos is a 3D sound technology that can combine video content to present dynamic sound effects and more realistically create sound effects from far to near. Especially in venues such as theaters, it can be used with ceiling speakers to achieve sound field surround, show more sound details, and enhance the audience's viewing experience.

[0004] For headphones, in order to achieve Dolby Atmos, the current method is to create a specific sound source for the headphones. The specific sound source is processed through a virtual 3D sound algorithm, such as a virtual 3D sound algorithm based on the HRTF (Head Related Transfer Function) principle, and then input into the stereo headphones to achieve a certain surround / stereo effect. However, this is not a standard 3D sound effect. The sound effects involved are completed through software processing. Due to the uniqueness of the auditory characteristics of different people's ears, the sound positioning effect is subject to great uncertainty, which affects the sound quality with a certain probability and loses sound details, resulting in poor sound effects of the headphones. Summary of the invention

[0005] In view of this, an embodiment of the present application provides a headset to solve the technical problem that stereo headsets in the prior art must process special sound sources by software to achieve Dolby Atmos, resulting in poor sound effects. On this basis, a headset playback system is also provided.

[0006] In order to solve the above technical problems, the embodiment of the present application provides an audio headset, which adopts the following technical solution:

[0007] An earphone, comprising: a first shell, a second shell, and a first speaker and a plurality of second speakers arranged on the first shell;

[0008] The first shell and the second shell are connected to form a containing cavity;

[0009] The first shell is in a truncated cone shape or an approximately truncated cone shape, having a bottom surface and a side surface. The first speaker is arranged on the bottom surface of the first shell, and the plurality of second speakers are arranged at intervals on the side surface of the first shell. The first speaker and the plurality of second speakers are both located in the accommodating cavity.

[0010] Furthermore, the earphone further comprises a third shell located in the accommodating cavity;

[0011] A plurality of mounting holes are arranged on the side of the first shell, and each of the second speakers is fixedly mounted in one of the mounting holes through a third shell, and the third shell forms a vibration cavity corresponding to the second speaker.

[0012] Furthermore, the multiple mounting holes are located in the upper middle part of the first shell when the earphone is worn, and one of the mounting holes is located at the top of the first shell in the vertical direction.

[0013] Furthermore, the number of the mounting holes is three, and the three mounting holes are equidistantly distributed in the middle and upper part of the first shell.

[0014] Furthermore, the side surface of the first shell is provided with a plurality of first through holes distributed in an array;

[0015] A first tuning net is arranged between any two adjacent mounting holes, and the first tuning net is attached to the side surface of the first shell to cover a certain number of the first through holes.

[0016] Furthermore, the earphone also includes a second tuning net having the same number as the mounting holes;

[0017] The second tuning net is arranged in the corresponding installation hole adjacent to the second speaker.

[0018] Further, the first shell has an inner cavity on a side away from the second shell;

[0019] A portion of the second housing facing the first speaker is provided with a plurality of third through holes distributed in an array, and a shock absorbing member is provided between the first speaker and the plurality of third through holes.

[0020] Further, the mounting hole has a first step, a second step and a third step, and a first positioning portion is provided on the third step;

[0021] The third housing is provided with a second positioning portion;

[0022] The second speaker arranged in the mounting hole abuts against the first step, the corresponding third housing abuts against the second step and the third step, and the second positioning portion is butted against the first positioning portion.

[0023] Furthermore, the bottom surface of the first shell has a plurality of second through holes and a convex ring arranged around the plurality of second through holes;

[0024] The convex ring is arranged toward the second shell to form a mounting cavity, and the first speaker is arranged in the mounting cavity.

[0025] In order to solve the above technical problems, the embodiment of the present application further provides an earphone playback system, which adopts the following technical solution:

[0026] A headphone playing system, comprising a decoding headphone amplifier box and the headphone as described above;

[0027] The decoding ear amplifier box has a built-in DSP processor, an audio input interface and a multi-channel headphone interface. The audio input interface and the multi-channel headphone interface are both connected to the DSP processor. The decoding ear amplifier box is connected to an audio and video playback device via the audio input interface, and is connected to the headphones via the multi-channel headphone interface. The audio signal output by the audio and video playback device is decoded and processed by the DSP processor into a multi-channel signal, and the multi-channel signal is transmitted to the first speaker and the multiple second speakers via the multi-channel headphone interface.

[0028] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0029] The earphones provided in the present application are respectively provided with a first speaker and multiple second speakers on the bottom and side surfaces of the first shell, thereby being able to play multiple channels in different directions, and being able to structurally truly restore the sound impact effects at different angles and directions, and truly restore the sound details.

[0030] The headphone playback system is further combined with a decoding headphone amplifier box to process the sound signals of the audio and video playback equipment through a DSP processor, and can orderly integrate information such as sound delay, sound pressure, and filtering into multiple encoded channels, and form a multi-channel output through the first speaker and the second speaker, effectively improving the limitations of the headphone structure on the sound and producing realistic 3D sound effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 is an exploded schematic diagram of the structure of the earphone provided in an embodiment of the present application;

[0033] Figure 2 is a schematic diagram of a structure after a first speaker and a second speaker are installed on a first housing provided in an embodiment of the present application;

[0034] Figure 3 is a partial structural diagram of a headset provided in an embodiment of the present application;

[0035] Figure 4 yes Figure 3 An exploded schematic diagram of the structure of the headset shown;

[0036] Figure 5 is a front view of a first housing provided in an embodiment of the present application;

[0037] Figure 6 yes Figure 2 A schematic diagram of the structure after the third housing and the second tuning net are installed in the structure shown;

[0038] Figure 7 yes Figure 5 An enlarged schematic diagram of A is shown;

[0039] Figure 8 is a schematic structural diagram of a third housing provided in an embodiment of the present application;

[0040] Fig. 9 is a schematic structural diagram of a first shell provided in an embodiment of the present application;

[0041] Fig.10 is a stereoscopic diagram of a decoding and headphone amplifier box provided in an embodiment of the present application;

[0042] Fig.11 yes Fig.10 An exploded schematic diagram of the decoder and headphone amplifier box shown;

[0043] Fig.12 4 is a flowchart of the headphone playback system provided in this embodiment.

[0044] Reference numerals:

[0045] 1-first shell; 101-mounting hole; 101a-first step; 101b-second step; 101c-third step; 101d-first positioning portion; 102-first through hole; 103-second through hole; 104-convex ring; 2-second shell; 3-first speaker; 4-second speaker; 5-third shell; 501-second positioning portion; 502-avoidance portion; 6-first tuning net; 7-second tuning net; 8-shock absorber; 9-earmuff; 10-headband assembly; 11-upper shell; 12-volume control knob; 13-lower shell; 14-PCB board; 15-audio input interface; 16-multi-channel headphone interface; 17-display assembly. DETAILED DESCRIPTION

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0047] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0048] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0049] The present application embodiment provides a headset, such as Figure 1 and Figure 2 As shown, the earphone includes: a first shell 1, a second shell 2, and a first speaker 3 and a plurality of second speakers 4 arranged on the first shell 1; the first shell 1 is connected to the second shell 2 to form a receiving cavity; the first shell 1 is in a truncated cone shape or approximately truncated cone shape, and has a bottom surface and a side surface, the first speaker 3 is arranged on the bottom surface of the first shell 1, and the plurality of second speakers 4 are arranged at intervals on the side surface of the first shell 1, and the first speaker 3 and the plurality of second speakers 4 are both located in the receiving cavity. The earphone provided in the present application is provided with a first speaker 3 and a plurality of second speakers 4 on the bottom surface and the side surface of the first shell 1, respectively, so that multiple channels can be played in different directions, and the sound impact effects at different angles and directions can be truly restored in structure, the sound details can be truly restored, and standard 3D surround sound can be displayed.

[0050] The structure of the earphone can be applied to earbud-type, ear-hanging-type, in-ear-type and head-mounted earphones. The embodiment of the present application takes the application of the structure of the earphone to a head-mounted earphone as an example for detailed description. Figure 3 and Figure 4 As shown, when used as a headset, the headset further includes an earmuff 9 and a headband assembly 10, wherein the earmuff 9 is connected to the first shell 1, and the headband assembly 10 is connected to the two headsets, specifically to the second shell 2.

[0051] Re-read Figure 1 In this embodiment, the earphone further includes a third shell 5 located in the accommodating cavity; Figure 2 , Figure 5 and Figure 6 A plurality of mounting holes 101 are arranged on the side of the first shell 1, and each of the second speakers 4 is fixedly mounted in one of the mounting holes 101 through a third shell 5. The third shell 5 forms a corresponding vibration cavity of the second speaker 4, and the mounting hole 101 is a sound output channel of the corresponding second speaker 4. The plurality of mounting holes 101 form a plurality of sound output channels in different directions, which is conducive to restoring the sound field in different directions and angles.

[0052] In this embodiment, if Figure 7 As shown, the mounting hole 101 has a first step 101a, a second step 101b and a third step 101c, and the third step 101c is provided with a first positioning portion 101d; Figure 8 The third shell 5 is provided with a second positioning portion 501; the second speaker 4 arranged in the mounting hole 101 abuts against the first step 101a, and the corresponding third shell 5 abuts against the second step 101b and the third step 101c, and the second positioning portion 501 is docked with the first positioning portion 101d. Specifically, the first positioning portion 101d is a protrusion, and the second positioning portion 501 is a groove engaged with the protrusion. The cooperation of the multiple steps and the positioning portion can realize the fixation of the second speaker 4, and can prevent the second speaker 4 from falling off due to collision or other reasons and affecting the sound angle and orientation, thereby effectively ensuring the sound effect.

[0053] Furthermore, if Figure 8 As shown, the third shell is also provided with an avoidance portion 502, which can make the structure of the earphone more compact and help reduce the overall volume of the earphone.

[0054] In this embodiment, the plurality of mounting holes 101 are located in the middle and upper part of the first housing 1 when the earphone is worn, and one of the mounting holes 101 is arranged along the vertical direction ( Figure 5 The number of the mounting holes 101 is described as three. In this example, the three second speakers 4 correspond to the front channel, the front sky channel and the rear channel. Figure 4 and Figure 5 , the three mounting holes 101 are located in the middle and upper part of the first shell 1 when the earphone is worn, and one of the mounting holes 101 is along the vertical direction ( Figure 5B direction) is located at the top of the first housing 1 (where the second speaker 4 corresponding to the front sky channel is installed), and the other two mounting holes 101 are along the horizontal direction ( Figure 5 The C direction as shown is located in the middle of the first shell 1 (where the second speakers 4 corresponding to the front and rear channels are installed), and the three installation holes 101 are evenly distributed in the middle and upper part of the first shell 1. In this way, sound positioning can be achieved above and in front of and behind the human ear.

[0055] In this embodiment, if Figure 7 and Fig. 9 As shown, the side of the first shell 1 is provided with a plurality of first through holes 102 distributed in an array; a first tuning net 6 is provided between any two adjacent mounting holes 101, and the first tuning net 6 is attached to the side of the first shell 1 to cover a certain number of the first through holes 102. At the same time, the bottom surface of the first shell 1 also has a plurality of second through holes 103. The first through holes 102 and the second through holes 103 are sound holes, which are conducive to the propagation of sound inside the earphone and play a tuning role to a certain extent.

[0056] Further integration Figure 2 and Figure 5 , Fig. 9 In this embodiment, the bottom surface of the first shell 1 has a convex ring 104, and the convex ring 104 is arranged around the plurality of second through holes 103. The convex ring 104 is arranged toward the second shell 2 to form an installation cavity. The first speaker 3 is arranged in the installation cavity. The first speaker 3 corresponds to the bass channel. Combined with the front channel, the front sky channel and the rear channel of the three second speakers 4, a single earphone has four-channel output. The two earphones on both sides of the headband assembly 10 have a total of eight speakers that can provide eight-channel output, wherein the channel outlet pipes of the front channel and the rear channel formed by the first shell 1, the second speaker 4 and the third shell 5 are respectively located in front and rear of the ERP (Ear Reference Point, a virtual geometric reference point located at the entrance of the listener's ear, designed based on the ITU-T P.58 and ITU-T P.57 standards of the International Telecommunication Union Telecommunication Standardization Bureau) on a horizontal plane of 0 degrees (reference Figure 5 The sound outlet pipe of the front sky channel formed by the first shell 1, the second speaker 4 and the third shell 5 is located 90 degrees above the ERP human ear reference point (reference Figure 5B direction), providing sound positioning in height; the channel sound outlet pipe of the bass channel formed by the first shell 1, the first speaker 3 and the second shell 2 fixedly assembled in sequence is perpendicular to the ERP human ear reference point, and the distances from the four channels to the ERP human ear reference point are the same, thereby achieving 360-degree horizontal and height sound positioning, and effectively restoring the angle and orientation of the sound in the physical structure. In other embodiments, by increasing or decreasing the number of second speakers 4 on the side of the first shell 1, a sound structure such as four channels, six channels, ten channels, twelve channels or more channels can be formed.

[0057] In this embodiment, if Figure 1 and Figure 7 As shown, the earphone further includes second tuning nets 7 having the same number as the mounting holes 101 ; the second tuning nets 7 are arranged in the corresponding mounting holes 101 adjacent to the second speakers 4 .

[0058] In this embodiment, if Figure 1 and Fig.10 As shown, the first shell 1 has an inner cavity (front cavity) on the side away from the second shell 2, and the sound channel outlet tubes of the first speaker 3 and the second speaker 4 are both facing the inner cavity; the second shell 2 is provided with a plurality of third through holes (not marked) distributed in an array at the position facing the first speaker 3, and a shock absorber 8 is provided between the first speaker 3 and the plurality of third through holes. Specifically, the shock absorber 8 is a sponge, and the shock absorber 8 is provided in the accommodating cavity (rear cavity) between the first shell 1 and the second shell 2, which can reduce the resonance of the rear cavity and effectively improve the multi-channel sound effect in the physical structure. At the same time, the third through hole is an air vent, so that the second shell 2 is semi-open, the sound field is wider than that of closed headphones, the sound reproduction is more natural, and the characteristics are better.

[0059] This application uses multiple physical channel speakers, and is designed based on the physical structure channels of multi-channel speakers, targeting the structure of the human ear, the principle of sound localization, and the requirements of acoustic tuning. It already has a basic sound localization effect in terms of physical structure, and is less affected by the auditory characteristics of different human ears. It can achieve stable listening positioning performance and ensure the effect of 3D sound.

[0060] In order to solve the above technical problems, an embodiment of the present application also provides a headphone playback system, which includes a decoding headphone amplifier box and the headphone as described above; the decoding headphone amplifier box has a built-in DSP processor, an audio input interface and a multi-channel headphone interface, the audio input interface and the multi-channel headphone interface are both connected to the DSP processor, the decoding headphone amplifier box is connected to the audio and video playback device through the audio input interface, and is connected to the headphone through the multi-channel headphone interface, the audio signal output by the audio and video playback device is decoded and processed by the DSP processor into a multi-channel signal, and the multi-channel signal is transmitted to the first speaker 3 and the multiple second speakers 4 through the multi-channel headphone interface.

[0061] Specifically, Fig.11 and Fig.12 As shown, the decoding headphone amplifier box includes an upper shell 11, a volume control knob 12, a lower shell 13, a PCB board 14, an audio input interface 15, a multi-channel headphone interface 16 and a display component 17. The upper shell 11 and the lower shell 13 are connected to form a mounting cavity for the PCB board 14, the audio input interface 15, and the multi-channel headphone interface 16. The volume control knob 12, the audio input interface 15, the multi-channel headphone interface 16 and the display component 17 are all connected to the PCB board 14. A plurality of through holes are provided on the upper shell 11 for the volume control knob 12 and the audio input interface 15, the multi-channel headphone interface 16 and the display component 17 to pass through.

[0062] The PCB board 14 is provided with a DSP processor, and the audio input interface 15 includes a USB Type-C interface and / or an HDMI interface. The USB Type-C interface is used to connect to a computer, and the HDMI interface is used to connect to various audio and video playback devices (such as a computer, a TV, a set-top box, a Blu-ray player, etc.).

[0063] When playing audio and video, for a 3D sound source containing spatial information (such as Dolby Atmos format audio), connect the audio output (such as HDMI) of the audio and video playback device to the audio input interface 15 of the decoding headphone amplifier box, and connect the headphones to the multi-channel headphone interface 16 of the decoding headphone amplifier box through a multi-channel connector (for example, for a headset with four speakers on each ear, the multi-channel connector is an 8-channel 16-pin connector), so that 3D sound effect playback can be achieved. Taking 8-channel headphones as an example, combined with Fig.12As shown in the work flow chart of the headphone playback system, for USB audio, it is directly input to the DSP processor, and for Dolby Atmos format audio, the PCB board is also provided with an audio decoder, which decodes the Dolby Atmos format audio into Dolby Atmos multi-channel audio and then inputs it into the DSP processor. The DSP processor performs channel mixing, sound pressure, delay, room simulation, filtering effect and other processing on the USB audio or the decoded Dolby Atmos multi-channel audio, and then integrates all the sound information of the USB audio or Dolby Atmos multi-channel audio into 8 channels, which are output through the eight speakers (2 first speakers 3, 6 second speakers 4) of the left and right headphones after digital-to-analog conversion and amplification, wherein Fig.12 The subwoofer is the first speaker 3, and the front speaker, the sky speaker and the rear speaker are the aforementioned second speaker 4, which can realize the accurate simulation and sound field restoration of the original audio on the headphones, realize the complete 3D sound effects and 3D spatial positioning on the headphones, and enhance the overall experience of sound field positioning.

[0064] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A headset, characterized in that: The earphone comprises: a first shell, a second shell, and a first speaker and a plurality of second speakers arranged on the first shell; The first shell and the second shell are connected to form a containing cavity; The first shell is in a truncated cone shape or an approximately truncated cone shape, having a bottom surface and a side surface. The first speaker is arranged on the bottom surface of the first shell, and the plurality of second speakers are arranged at intervals on the side surface of the first shell. The first speaker and the plurality of second speakers are both located in the accommodating cavity.

2. The earphone according to claim 1, characterized in that The earphone further comprises a third shell located in the accommodating cavity; A plurality of mounting holes are arranged on the side of the first shell, and each of the second speakers is fixedly mounted in one of the mounting holes through a third shell, and the third shell forms a vibration cavity corresponding to the second speaker.

3. The earphone according to claim 2, characterized in that The multiple mounting holes are located in the upper middle part of the first shell when the earphone is worn, and one of the mounting holes is located at the top of the first shell in the vertical direction.

4. The earphone according to claim 3, characterized in that: The number of the mounting holes is three, and the three mounting holes are equidistantly distributed in the middle and upper part of the first shell.

5. The earphone according to any one of claims 2 to 4, characterized in that: The side surface of the first shell is provided with a plurality of first through holes distributed in an array; A first tuning net is arranged between any two adjacent mounting holes, and the first tuning net is attached to the side surface of the first shell to cover a certain number of the first through holes.

6. The earphone according to claim 5, characterized in that The earphone also includes a second tuning net having the same number as the mounting holes; The second tuning net is arranged in the corresponding installation hole adjacent to the second speaker.

7. The earphone according to claim 6, characterized in that The first shell has an inner cavity on a side away from the second shell; A portion of the second housing facing the first speaker is provided with a plurality of third through holes distributed in an array, and a shock absorbing member is provided between the first speaker and the plurality of third through holes.

8. The earphone according to any one of claims 2 to 4, characterized in that: The mounting hole has a first step, a second step and a third step, and the third step is provided with a first positioning portion; The third housing is provided with a second positioning portion; The second speaker arranged in the mounting hole abuts against the first step, the corresponding third housing abuts against the second step and the third step, and the second positioning portion is butted against the first positioning portion.

9. The earphone according to any one of claims 2 to 4, characterized in that: The bottom surface of the first shell has a plurality of second through holes and a convex ring arranged around the plurality of second through holes; The convex ring is arranged toward the second shell to form a mounting cavity, and the first speaker is arranged in the mounting cavity.

10. An earphone playback system, characterized in that: The earphone playback system comprises a decoding earphone amplifier box and the earphone according to any one of claims 1 to 9; The decoding ear amplifier box has a built-in DSP processor, an audio input interface and a multi-channel headphone interface. The audio input interface and the multi-channel headphone interface are both connected to the DSP processor. The decoding ear amplifier box is connected to an audio and video playback device via the audio input interface, and is connected to the headphones via the multi-channel headphone interface. The audio signal output by the audio and video playback device is decoded and processed by the DSP processor into a multi-channel signal, and the multi-channel signal is transmitted to the first speaker and the multiple second speakers via the multi-channel headphone interface.

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