Display module, control method thereof and display device

Abstract

The invention discloses a display module, a control method thereof and a display device. The display module comprises a back plate, a display panel, a sealing glue layer, a temperature control module and a driving chip, and the display panel is located on one side of the back plate; the sealing glue layer is located between the back plate and the display panel, and the sealing glue layer is connected with the back plate and the display panel; the temperature control module comprises a temperature detection assembly and a temperature control structure. The temperature detection assembly and the temperature control structure are located on the side, close to the sealing glue layer, of the back plate. The driving chip is connected with the temperature control module, and the driving chip controls the temperature control structure to control the temperature of the sealing glue layer based on a temperature signal of the sealing glue layer obtained by the temperature detection assembly. The temperature control module is additionally arranged, the temperature of the packaging adhesive is automatically adjusted, the packaging adhesive is not affected by external environment temperature changes, and the adhesion characteristic of normal-temperature attachment is always kept, so that the attachment risk of the display module during low-temperature falling is reduced, and the mechanical reliability of the display module in a low-temperature environment is further improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of display technology, and in particular to a display module and a control method thereof, and a display device. Background Art

[0002] At present, through continuous exploration and innovation, display panel products have found that four-sided curved screens can more perfectly enhance the user's visual experience and operating feel than double-sided screens. Among them, four-sided curved screens refer to the display screen body being curved to a certain extent in the four directions of up, down, left, and right.

[0003] However, when the four-curved screen is in a sub-zero low temperature environment and there is an external drop impact force, it is very easy to produce fitting bubbles at its R corner position, which greatly reduces the mechanical reliability of the four-curved screen and increases the cost of replacing the screen, thus becoming a technical bottleneck for the development of micro-quadruple curvature to deep quadruple curvature, and ultimately affecting the display effect and application of the display. Summary of the invention

[0004] The present invention provides a display module and a control method thereof, and a display device. By adding a temperature control module, the temperature of the packaging glue is automatically adjusted so that the adhesive property of the bonding at room temperature is always maintained, thereby improving the mechanical reliability of the display module in a low-temperature environment.

[0005] In a first aspect, an embodiment of the present invention provides a display panel, including:

[0006] Back panel;

[0007] A display panel, located on one side of the back panel;

[0008] A sealing layer, located between the back plate and the display panel, and the sealing layer is connected to the back plate and the display panel respectively;

[0009] A temperature control module, comprising a temperature detection component and a temperature control structure, wherein the temperature detection component and the temperature control structure are both located on a side of the back plate close to the sealing layer;

[0010] A driving chip is connected to the temperature control module, and the driving chip controls the temperature control structure to control the temperature of the sealing layer based on the temperature signal of the sealing layer obtained by the temperature detection component.

[0011] Based on the same inventive concept, in a second aspect, an embodiment of the present invention further provides a method for controlling a display module, which is used to control the display module provided in the first aspect. The control method includes:

[0012] Acquiring a temperature signal of the packaging glue based on a temperature detection component;

[0013] Determining whether the temperature signal of the packaging glue is within the bonding temperature range;

[0014] When the temperature signal of the packaging glue exceeds the bonding temperature range, the temperature control structure is controlled to adjust the temperature signal of the packaging glue to be within the bonding temperature range.

[0015] Based on the same inventive concept, in a third aspect, an embodiment of the present invention further provides a display device, which includes the display panel provided in the first aspect.

[0016] The display module provided by the embodiment of the present invention includes a back plate, a display panel, a sealing layer, a temperature control module and a driving chip. The temperature detection component and the temperature control structure of the temperature control module are both arranged on the side of the back plate close to the sealing layer. The driving chip uses the temperature signal of the sealing layer obtained by the temperature detection component to control the temperature control structure to automatically adjust the temperature of the sealing layer. The packaging glue is not affected by changes in external environmental temperature and always maintains the adhesive properties of normal temperature bonding, thereby reducing the bonding risk of the display module when it falls at low temperature, and further improving the mechanical reliability of the display module in a low temperature environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a top view of a display module provided by an embodiment of the present invention;

[0018] Figure 2 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction;

[0019] Figure 3 is a schematic diagram of a control method of a display module provided by an embodiment of the present invention;

[0020] Figure 4 is a top view of another display module provided by an embodiment of the present invention;

[0021] Figure 5 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction;

[0022] Figure 6 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction;

[0023] Figure 7 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction;

[0024] Figure 8 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction;

[0025] Fig. 9 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction;

[0026] Fig.10 yes Figure 1 Enlarged schematic diagram of the middle M region;

[0027] Fig.11 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction;

[0028] Fig.12 It is a top view of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0029] The present application will be further described in detail below in conjunction with the accompanying drawings and examples. It will be appreciated that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only the parts related to the present application, rather than all structures, are shown in the accompanying drawings. Various modifications and changes can be made in the present application without departing from the spirit or scope of the present application, which is obvious to those skilled in the art. Therefore, the present application is intended to cover the modifications and changes of the present application that fall within the scope of the corresponding claims (technical solutions for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present application can be combined with each other without contradiction.

[0030] The present application proposes a display module in view of one or more of the above-mentioned problems existing in the prior art. Figure 1 is a top view of a display module provided by an embodiment of the present invention, Figure 2 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction. Figure 1 and Figure 2 The display module 300 provided in the embodiment of the present invention includes a backplane 20, a display panel 200, a sealing layer 30, a temperature control module 40 and a driving chip 50, wherein the display panel 200 is located on one side of the backplane 20. The sealing layer 30 is located between the backplane 20 and the display panel 200, and the sealing layer 30 is connected to the backplane 20 and the display panel 200 respectively. The temperature control module 40 includes a temperature detection component 41 and a temperature control structure 42, and the temperature detection component 41 and the temperature control structure 42 are both located on one side of the backplane 20 close to the sealing layer 30. The driving chip 50 is connected to the temperature control module 40, and the driving chip 50 controls the temperature control structure 42 to control the temperature of the sealing layer 30 based on the temperature signal of the sealing layer 30 obtained by the temperature detection component 41.

[0031] Specifically, refer to Figure 1 and Figure 2The display panel 200 includes an OLED (Organic Light Emitting Diode) display panel, an AMOLED (Active-Matrix Organic Light Emitting Diode) display panel, a QLED (Quantum Dot Light Emitting Diodes) display panel, an LED (Light Emitting Diode) display panel, a Micro LED (Micro Light Emitting Diode) display panel, a Mini LED (Mini Light Emitting Diode) display panel, etc. The embodiment of the present invention does not impose any specific restrictions on the type of the display panel 200.

[0032] The backlight side of the display panel 200 is bonded and fixed to one side of the back plate 20 by using a sealing layer 30, and the back plate 20 is used to encapsulate and protect the display panel 200. The sealing layer 30 may include, but is not limited to, UV curing glue. A storage space may be formed between the back plate 20 and the display panel 200, and the storage space may be used to set control components, functional modules and other devices, such as circuit boards, batteries, camera modules, speakers, etc., and the back plate 20 can protect these devices. Generally, the Tg temperature of the existing sealing layer 30 material is about 0°C, and the Tg temperature refers to the temperature at which an amorphous polymer (including the non-crystalline part of a crystalline polymer) changes from a glassy state to a highly elastic state, or from a highly elastic state to a glassy state. In a sub-zero environment, when the temperature of the sealing layer 30 is lower than the Tg temperature, the colloid elastic modulus increases sharply, which easily causes the sealing layer 30 to change from adhesiveness to plasticity, thereby causing the bonding stress between the back plate 20 and the display panel 200 to increase and be unable to be released. When there is an external force F, the sealing layer 30 is very likely to generate stress bubbles under the action of the external force, causing the screen to rupture. Therefore, the reliability of the display module 300 when used in a low-temperature environment is reduced, affecting the overall stability of the display module 300.

[0033] Based on this, the embodiment of the present application sets a temperature control module 40 in at least part of the sealing layer 30, and the module is composed of a temperature detection component 41 and a temperature control structure 42. The temperature detection component 41 can be set on the side of the back plate 20 close to the sealing layer 30, for example, Figure 2In the embodiment, the temperature detection component 41 is arranged in the above-mentioned accommodation space, and the temperature control structure 42 is arranged in the sealing layer 30. The temperature control module 40 is connected to the driving chip 50, and the temperature detection component 41 can detect the temperature of the sealing layer 30 or the temperature of its surrounding environment, and convert the temperature value into an output electrical signal and transmit it to the driving chip 50. For example, the temperature detection component 41 can adopt a temperature sensor. The driving chip 50 controls the temperature control structure 4 to heat or cool the temperature of the sealing layer 30 or its surrounding environment, so as to stabilize the colloidal elastic modulus of the sealing layer 30 so that it maintains its adhesive properties. When external forces act, such as falling from a high altitude, being squeezed by foreign objects, colliding, etc., the sealing layer 30 is prevented from generating stress bubbles, thereby improving the mechanical reliability of the display module 300 when used in a low temperature environment and ensuring the normal display of the display panel.

[0034] refer to Figure 1 The driver chip 50 refers to an integrated driver chip (IC), which can be disposed between the backplane 20 and the display panel 200. The driver chip can control and drive the display panel 200. The driver chip can be bound to the flexible circuit board ( Figure 1 (not shown) so that the signal of the driving chip can be transmitted to the display panel 200 through the flexible circuit board, controlling the display panel 200 to display light and present corresponding image information.

[0035] It should be noted that the display module 200 provided in the embodiment of the present invention also includes other structures, such as a cover plate ( Figure 1 and Figure 2 ), etc., work together to realize the normal display of the display module 200, which will not be shown one by one here.

[0036] Figure 3 is a schematic diagram of a control method of a display module provided by an embodiment of the present invention. Figure 1-Figure 3 , a control method of a display module provided in an embodiment of the present application includes:

[0037] S101 , obtaining a temperature signal of packaging glue based on a temperature detection component.

[0038] S102: Determine whether the temperature signal of the packaging glue is within the bonding temperature range.

[0039] S103 , when the temperature signal of the packaging glue exceeds the bonding temperature range, controlling the temperature control structure to adjust the temperature signal of the packaging glue to be within the bonding temperature range.

[0040] The temperature signal refers to an electrical signal converted from a temperature value, such as a voltage value, a current value, etc.

[0041] The bonding temperature range refers to the temperature of the sealing layer 30 being greater than the Tg temperature, and at this temperature, the colloid elastic modulus of the sealing layer 30 is stable, and the display panel 200 and the back plate 20 can be kept bonded and fixed, and when there is an external force F, the sealing layer 30 is not prone to generate stress bubbles under the action of the external force. Exemplarily, 0° to 35°.

[0042] For example, when the display module 300 is in use, the driver chip 50 compares the detected temperature value with the Tg temperature of the sealing layer 30 stored inside it. When the detected temperature is lower than the Tg temperature of the sealing layer 30, the driver chip 50 controls the temperature control structure 42 to start heating, thereby increasing the temperature of the sealing layer 30 and its surrounding environment, and raising the temperature of the sealing layer 30 to the Tg temperature. Alternatively, when the detected temperature exceeds the safe temperature, the driver chip 50 controls the temperature control structure 42 to start cooling, thereby lowering the temperature of the sealing layer 30 and its surrounding environment, and lowering the temperature of the sealing layer 30 to within the bonding temperature range.

[0043] In this way, the temperature of the sealing layer 30 can be automatically adjusted, so that it is not affected by the external temperature, the elastic modulus of the colloid is kept stable, and the adhesive properties of normal temperature bonding are presented. When the display module 300 is subjected to external force, the bonding stress between the display panel 200 and the back plate 20 increases sharply and is released at the sealing layer 30, and stress bubbles are not easily generated at the sealing layer 30, thereby reducing the risk of stress bubbles and even screen rupture in the display module 300 in an abnormal temperature environment, thereby improving its mechanical reliability and overall stability in an abnormal temperature environment.

[0044] Figure 4 4 is a top view of another display module provided by an embodiment of the present invention.

[0045] Based on the above embodiments, Figure 1 and Figure 4 The display module 300 includes a special-shaped area M, and the temperature control module 40 is located in at least a portion of the special-shaped area M.

[0046] The irregular area M refers to the area where the outer shape of the back plate 20 of the display module 300 is curved, concave, etc., which is very likely to cause stress concentration when falling from a high altitude, being squeezed by foreign objects, colliding, etc. In the embodiment of the present application, the temperature control module 40 is arranged in at least part of the irregular area M to control the temperature of the sealing layer 30 in the irregular area M to maintain its adhesive properties, facilitate the release of the bonding stress, and avoid the generation of stress bubbles in the sealing layer 30.

[0047] Based on the above embodiments, Figure 1 The irregular area M includes an R-angle area, the center of curvature of the R-angle area faces the display panel 200, and the temperature control module 40 is located in the R-angle area.

[0048] Specifically, the R corner area is a protruding area of ​​the display module 300. In the case of a low-temperature drop, the protrusion in this area is very likely to come into contact with the collision surface, resulting in concentrated bonding stress. The temperature control module 40 is disposed in the R corner area to adjust the temperature of the sealing layer 30 in the R corner area so that it is not affected by changes in the external low-temperature environment on the elastic modulus, thereby maintaining the bonding ability of the sealing layer 30 in the R corner area under external low temperatures and reducing the risk of bonding bubbles and even screen rupture due to a low-temperature drop.

[0049] Further, refer to Figure 2 In order to strengthen the control of the temperature range of the sealing layer 30 in the R corner area, the temperature control structure 42 at least partially overlaps the sealing layer 30 in the R corner area along the direction perpendicular to the plane where the back plate 20 is located. In this way, the temperature control structure 42 can improve the accuracy of controlling the temperature of the sealing layer 30, and further improve the mechanical stability of the R corner area.

[0050] Based on the above embodiments, Figure 1 and Figure 2 The display panel 200 further includes a display area and a non-display area ( Figure 1 The temperature control module 40 is located in at least part of the non-display area where the sealing layer 30 is located.

[0051] Specifically, the display panel 200 includes a display area (Active Area, AA) and a non-display area (Non-ActiveArea, NA), the display area is used for normal display of images, and the non-display area at least partially surrounds the display area and is used for arranging signal lines and encapsulating the display panel 200, etc. Considering that when the display module 300 falls from a high altitude, it is possible that the side of the display module 300 falls on a convex, flat, or concave surface, a temperature control module 40 can be set in at least part of the area where the encapsulation glue 30 exists in the non-display area. For example, a temperature control module 40 is set in the encapsulation glue 30 to automatically adjust the temperature of the encapsulation glue 30 in the non-display area, thereby protecting the display area and reducing the risk of the screen body in the display area being broken due to stress concentration in the collision area.

[0052] Figure 5 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction is shown in FIG. Figure 6 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction is shown in FIG. Figure 7 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction is shown in FIG. Figure 8 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction is shown in FIG.

[0053] Another embodiment of the present application, refer to Figure 5 and Figure 6, the temperature control structure 42 is located between the back plate 20 and the sealing layer 30 ; along the direction perpendicular to the plane of the back plate 20 , the orthographic projection of the temperature control structure 42 on the back plate 20 and the orthographic projection of the sealing layer 30 on the back plate 20 at least partially overlap.

[0054] Another embodiment of the present application, refer to Figure 7 and Figure 8 , the temperature control structure 42 is located between the display panel 200 and the sealing layer 30 ; along the direction perpendicular to the plane of the back plate 20 , the orthographic projection of the temperature control structure 42 on the back plate 20 at least partially overlaps with the orthographic projection of the sealing layer 30 on the back plate 20 .

[0055] Specifically, refer to Figure 5 The temperature control structure 42 may be a whole surface structure, disposed between the back plate 20 and the sealing layer 30; or, referring to Figure 7 , which is disposed between the display panel 200 and the sealing layer 30, and automatically adjusts the temperature of the entire sealing layer 30. Figure 6 The temperature control structure 42 may also be composed of a plurality of dispersed substructures, and is disposed between the back plate 20 and the sealing layer 30; or, referring to Figure 8 , arranged between the display panel 200 and the sealing layer 30, and automatically adjusts the temperature of the local area of ​​the sealing layer 30 through each substructure, so as to realize automatic temperature adjustment of the entire sealing layer 30. With this substructure arrangement, the sealing layer 30 and the back plate 20 can still be in direct contact with each other, so as to ensure the adhesion between the back plate 20 and the sealing layer 30.

[0056] Further, refer to Figure 5-Figure 8 The film thickness of the sealing layer 30 can also be set to be smaller than the film thickness of the sealing layer 30. By limiting the thickness of the temperature control structure 42, it is beneficial to maintain the original film structure of the display module 300 unchanged, and ensure the adhesion between the sealing layer 30 and the back plate 20, and between the sealing layer 30 and the display panel 200.

[0057] Fig. 9 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction is shown in FIG.

[0058] Another embodiment of the present application, refer to Fig. 9 , the temperature control structure 42 is located on the side of the back plate 20 facing the display panel 200 ; along the direction perpendicular to the plane of the back plate 20 , the orthographic projection of the temperature control structure 42 on the back plate 20 does not overlap with the orthographic projection of the sealing layer 30 on the back plate 20 .

[0059] Specifically, in order to improve the adhesion between the sealing layer 30 and the back plate 20, and between the sealing layer 30 and the display panel 200, the temperature control structure 42 can also be arranged on the side of the back plate 20 without the sealing layer 30, and the temperature detection component 41 is arranged near the sealing layer 30, or arranged inside the sealing layer 30. The temperature control structure 42 adjusts the temperature of the sealing layer 30 from one end surface of the sealing layer 30 to the inside of the sealing layer 30, so as to achieve temperature adjustment of the entire sealing layer 30.

[0060] The temperature control structure 42 can be realized in the following ways:

[0061] In some embodiments, reference Figure 2 , Figure 5-Figure 8 As shown, the material of the temperature control structure 42 includes an electronic module, and the electronic module includes at least one of an electric heating wire, an electric heating tube, and an electromagnetic heating material.

[0062] For example, refer to Figure 5 The temperature control structure 42 uses electric heating wires. A plurality of electric heating wires are arranged on one side of the back plate 20 close to the sealing layer 30. Figure 5 Extending in the X direction, multiple heating wires are along Figure 5 Arranged in the Y direction. Figure 5 Only a cross section of a heating wire is shown.

[0063] When the temperature of the sealing glue layer 30 is lower than the Tg temperature, the heating wire is energized to generate heat, thereby increasing the temperature of the sealing glue layer 30 .

[0064] For example, refer to Figure 6 The temperature control structure 42 uses electric heating tubes. A plurality of electric heating tubes are arranged on one side of the back plate 20 close to the sealing layer 30. Figure 6 Extending in the Y direction, multiple electric heating tubes along Figure 6 Arranged in the X direction. Figure 6 Only the cross-section of multiple electric heating tubes is shown.

[0065] When the temperature of the sealing glue layer 30 is lower than the Tg temperature, the electric heating tube is energized to generate heat, thereby increasing the temperature of the sealing glue layer 30 .

[0066] In some embodiments, the material of the temperature control structure 42 includes an electric heating film, and the electric heating film includes a translucent polyester film.

[0067] Among them, the translucent polyester film can be a material that can generate heat after being energized, and it has the characteristics of high efficiency, speed, uniformity, safety, and stability.

[0068] For example, refer to Figure 7 and Figure 8The temperature control structure 42 uses a translucent polyester film. A translucent polyester film is set in a partial area of ​​the display panel 200 on the side close to the sealing layer 30. When the temperature of the sealing layer 30 or the ambient temperature is lower than the Tg temperature, the driving chip 50 controls the temperature control structure 42 to be powered on, and the temperature control structure 42 generates heat, thereby heating the temperature of the sealing layer 30 to keep it at the adhesive property.

[0069] In other embodiments, the temperature control structure 42 may also use particles that undergo phase change cooling after being powered on, such as a semiconductor refrigerator. When two different metals are connected by a conductor and a direct current is turned on, the temperature at one connection point decreases and the temperature at the other connection point increases. If the power supply is reversed, the temperature at the connection point changes in the opposite direction. The semiconductor refrigerator device is used to heat or cool the sealing layer 30.

[0070] In other embodiments, the materials for electric cooling also include but are not limited to silicone, polyurethane (PU), polyvinyl chloride (PVC), polyester (PET), polyurethane silicon (PU-Si), polyvinyl chloride silicon (PVC-Si), polyvinyl chloride fluorine (PVDF), polyurethane fluorine (PUF), polyurethane silicone fluorine (PU-Si-F), polyvinyl chloride silicone fluorine (PVC-Si-F), etc.

[0071] In some embodiments, reference Figure 2 , Figure 5-Figure 8 The material of the temperature control structure 42 includes an automatic constant temperature film, and the automatic constant temperature film includes at least one of a polytetrafluoroethylene film, a polyetheretherketone film, and a polyimide film.

[0072] For example, in a low temperature environment, the temperature control structure 42 uses a tetrafluoroethylene film, which can be continuously maintained at about 20% to 25%, so that the sealing layer 30 can continue to maintain the adhesive property.

[0073] Fig.10 yes Figure 1 A magnified schematic diagram of the middle M region. Fig.11 yes Figure 1 A schematic cross-sectional view of a display module along the aa' direction is shown in FIG.

[0074] Another embodiment of the present application, refer to Fig.10 and Fig.11 The display module 300 further includes a flexible adhesive layer 60 , and the flexible adhesive layer 60 at least partially covers a side of the back plate 20 close to the temperature detection component 41 .

[0075] Specifically, the flexible adhesive layer 60 has excellent heat resistance, adhesion and flexibility, shock resistance and sealing performance. The flexible adhesive layer 60 is arranged between the temperature detection component 41 and the back plate 20. When an external force F is generated, it can not only protect the temperature detection component 41, but also improve the lamination quality of the four-sided curved screen.

[0076] Based on the same inventive concept, an embodiment of the present invention further provides a display device. Fig.12 A top view of a display device provided in an embodiment of the present invention, referring to Fig.12 , the display device includes any one of the display modules provided in the above embodiments. Fig.12 , the display device 400 includes a display module 300. Therefore, the display device also has the beneficial effects of the display module in the above embodiment, and the similarities can be understood by referring to the above explanation of the display panel, which will not be repeated below.

[0077] The display device 300 provided in the embodiment of the present invention can be Fig.12 The four-sided curved screen mobile phone shown is a new design concept. Compared with the dual-curved screen mobile phone, it is more beautiful visually, can achieve holographic design such as no border, no opening, no button, etc., and is more practical. The display device 300 provided in the embodiment of the invention can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, industrial control equipment, medical display screens, touch interactive terminals, etc., and the embodiment of the present invention does not make special restrictions on this.

[0078] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display module, characterized in that: include: Back panel; A display panel, located on one side of the back panel; A sealing layer, located between the back plate and the display panel, and the sealing layer is connected to the back plate and the display panel respectively; A temperature control module, comprising a temperature detection component and a temperature control structure, wherein the temperature detection component and the temperature control structure are both located on a side of the back plate close to the sealing layer; A driving chip is connected to the temperature control module, and the driving chip controls the temperature control structure to control the temperature of the sealing layer based on the temperature signal of the sealing layer obtained by the temperature detection component.

2. The display module according to claim 1, characterized in that: The display module includes a special-shaped area; the temperature control module is located at least in part of the special-shaped area.

3. The display module according to claim 2, characterized in that: The irregularly shaped area includes an R-angle area, and the center of curvature of the R-angle area faces the display panel; The temperature control module is located in the R corner area.

4. The display module according to claim 3, characterized in that: Along a direction perpendicular to the plane where the back plate is located, the temperature control structure at least partially overlaps with the sealing glue layer in the R angle area.

5. The display module according to claim 1, characterized in that: The display panel further includes a display area and a non-display area at least partially disposed around the display area; The temperature control module is located in at least a portion of the non-display area where the sealing glue layer is located.

6. The display module according to claim 1, characterized in that: It also includes a flexible adhesive layer, which at least partially covers a side of the back plate close to the temperature detection component.

7. The display module according to claim 1, characterized in that: The temperature control structure is located between the back plate and the sealing glue layer; Along a direction perpendicular to the plane where the back plate is located, an orthographic projection of the temperature control structure on the back plate and an orthographic projection of the sealing glue layer on the back plate at least partially overlap.

8. The display module according to claim 1, characterized in that: The temperature control structure is located between the display panel and the sealing layer; Along a direction perpendicular to the plane where the back plate is located, an orthographic projection of the temperature control structure on the back plate and an orthographic projection of the sealing glue layer on the back plate at least partially overlap.

9. The display module according to claim 1, characterized in that: The temperature control structure is located on a side of the back plate facing the display panel; Along a direction perpendicular to the plane where the back plate is located, the orthographic projection of the temperature control structure on the back plate does not overlap with the orthographic projection of the sealing layer on the back plate.

10. The display module according to claim 1, characterized in that: The material of the temperature control structure includes an electronic module, and the electronic module includes at least one of an electric heating wire, an electric heating tube, and an electromagnetic heating material.

11. The display module according to claim 1, characterized in that: The material of the temperature control structure includes an electric heating film, and the electric heating film includes a translucent polyester film.

12. The display module according to claim 1, characterized in that: The material of the temperature control structure includes an automatic constant temperature film, and the automatic constant temperature film includes at least one of a polytetrafluoroethylene film, a polyetheretherketone film, and a polyimide film.

13. A method for controlling a display module, for controlling the display module according to any one of claims 1 to 12, the control method comprising: Acquiring a temperature signal of the packaging glue based on a temperature detection component; Determining whether the temperature signal of the packaging glue is within the bonding temperature range; When the temperature signal of the packaging glue exceeds the bonding temperature range, the temperature control structure is controlled to adjust the temperature signal of the packaging glue to be within the bonding temperature range.

14. A display device, characterized in that: A display module comprising any one of claims 1-12.

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