Thermal device

Abstract

A thermal device of the present disclosure has a ceramic container, a fluid, and a metal tube. The container has an internal space, an opening connected to the internal space, and a communication path connecting the internal space and the opening. The fluid is located in the interior space. A part of the metal pipe is inserted into the communication path, and the other part is closed.

Description

Technical Field

[0001] The present disclosure relates to a thermal device. Background Art

[0002] Conventionally, there are known thermal devices that utilize latent heat of a phase change material. Patent Document 1 discloses a heat pipe including a sealed container and a pipe for injecting a working fluid into the sealed container.

[0003] In addition, Patent Document 1 discloses that a closed container and a pipe are formed of a metal having excellent heat conductivity.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2000-213881 Summary of the invention

[0007] A thermal device of one embodiment of the present disclosure comprises a ceramic container, a fluid and a metal pipe. The container comprises an internal space, an opening connected to the internal space and a connecting passage connecting the internal space and the opening. The fluid is located in the internal space. A portion of the metal pipe is inserted into the connecting passage and the other portion is sealed. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a perspective view of a heat dissipation device according to an embodiment.

[0009] Figure 2 This is a diagram of the first member of the embodiment as viewed from the negative Z-axis direction side toward the positive Z-axis direction.

[0010] Figure 3 This is a diagram of the second member of the embodiment as viewed from the positive Z-axis direction side toward the negative Z-axis direction.

[0011] Figure 4 This is a diagram of the intermediate member according to the embodiment as viewed from the Z-axis positive direction side toward the Z-axis negative direction.

[0012] Figure 5 This is a diagram in which the first groove forming region and the second groove forming region are overlapped with the intermediate member.

[0013] Figure 6 It is a diagram for explaining the flow of fluid in the heat dissipation device according to the embodiment.

[0014] Figure 7 It is a diagram for explaining the flow of fluid in the heat dissipation device according to the embodiment.

[0015] Figure 8 yes Figure 5 Sectional view in the VIII-VIII direction.

[0016] Fig. 9 yes Figure 8 Sectional view in the IX-IX direction.

[0017] Fig.10 It is a schematic diagram showing an example of crimping of a metal pipe.

[0018] Fig.11 2 is a schematic diagram showing a first modification example. DETAILED DESCRIPTION

[0019] Hereinafter, a method for implementing the thermal device of the present disclosure (hereinafter referred to as an "implementation method") will be described in detail with reference to the accompanying drawings. It should be noted that the present disclosure is not limited to the implementation method. In addition, the various implementation methods can be appropriately combined within the scope that does not cause inconsistency in the processing content. In addition, in the following embodiments, the same reference numerals are marked on the same parts, and repeated descriptions are omitted.

[0020] In the embodiments shown below, expressions such as "certain", "orthogonal", "perpendicular" or "parallel" are sometimes used, but these expressions do not need to be strictly "certain", "orthogonal", "perpendicular" or "parallel". That is, the above expressions allow for deviations such as manufacturing accuracy or setting accuracy.

[0021] In order to facilitate understanding of the description, in the drawings referred to below, an orthogonal coordinate system is sometimes shown which defines an X-axis direction, a Y-axis direction, and a Z-axis direction that are orthogonal to each other and sets the positive direction of the Z-axis as the vertical upward direction.

[0022] The technology described in Patent Document 1 has room for further improvement in terms of improving durability.

[0023] The present disclosure has been made in view of the above circumstances, and provides a thermal device having excellent durability.

[0024] Hereinafter, as an example of the thermal device of the present disclosure, a heat dissipation device, specifically a vapor chamber, which efficiently transfers heat from a high temperature portion to a low temperature portion using latent heat associated with evaporation and condensation of a fluid (an example of a working fluid or a phase change material) is described. Hereinafter, the thermal device may be described as a heat dissipation device.

[0025] First, refer to Figure 1 The overall structure of the heat dissipation device according to the embodiment will be described. Figure 1 It is a perspective view of a heat dissipation device according to an embodiment.

[0026] like Figure 1As shown, the heat dissipation device 1 may include a container 2. The container 2 may be made of ceramic. The container 2 may include a first member 10, a second member 20, and an intermediate member 30. The first member 10, the second member 20, and the intermediate member 30 may all be plate-shaped, and the intermediate member 30 may be sandwiched between the first member 10 and the second member 20.

[0027] Furthermore, the container 2 may also include a first reinforcing member 40 and a second reinforcing member 50. The first reinforcing member 40 may be located on the upper surface (fifth surface) of the first member 10. The first reinforcing member 40 may be, for example, a stack of two reinforcing plates 40a and 40b. Not limited to this, the first reinforcing member 40 may also be composed of a single reinforcing plate. The second reinforcing member 50 may be located on the lower surface (sixth surface) of the second member 20. The second reinforcing member 50 may be, for example, a stack of two reinforcing plates 50a and 50b. Not limited to this, the second reinforcing member 50 may also be composed of a single reinforcing plate.

[0028] It should be noted that the container 2 does not necessarily need to include the first reinforcing member 40 and the second reinforcing member 50 .

[0029] The container 2 may include a working area 100 and a frame area 200. The working area 100 may be an internal space formed in the container 2, and a fluid serving as a phase change material may be enclosed in the internal space. As the fluid, for example, liquids such as water, hydrocarbon compounds, organic liquids (such as ethanol and methanol), and ammonia may be used.

[0030] The shape of the working area 100 when the container 2 is viewed from a direction perpendicular to the upper surface of the container 2 (i.e., when the container 2 is viewed from above) can be circular. Specifically, the working area 100 can have a cylindrical shape. By setting this structure, stress concentration at the corners is less likely to occur compared to the case where the shape of the working area 100 is set to a quadrilateral shape when viewed from above. Therefore, according to the heat dissipation device 1 of the embodiment, for example, the durability of the container 2 against stress generated by the phase change of the fluid can be improved.

[0031] In addition, by setting this structure, compared with the case where the shape of the working area 100 is set to a rectangular shape in plan view, the cross-sectional area of ​​the part connecting the later-described connecting passage 60 and the working area 100 becomes larger, so that the fluid can be injected and the gas in the working area 100 can be discharged more efficiently.

[0032] The frame region 200 may be a region surrounding the working region 100. In other words, the frame region 200 may be a region outside the working region 100 in the heat dissipation device 1. The working region 100 is substantially hollow, whereas the frame region 200 may be substantially solid.

[0033] The frame area 200 is a wide area that is intentionally formed, for example, to reduce leakage of fluid or fluid vapor from the interface between the first component 10 and the intermediate component 30 or the interface between the second component 20 and the intermediate component 30, or entry of external atmosphere into the internal space of the working area 100 from the above interface (i.e., to ensure airtightness).

[0034] The fluid can be filled, for example, at a ratio of 10% by volume or more and 95% by volume or less relative to the total volume of the internal space of the working area 100. Preferably, the above ratio can be 30% by volume or more and 75% by volume or less. Further preferably, the above ratio can also be 40% by volume or more and 65% by volume or less. In addition, other parts other than the fluid in the internal space of the working area 100 can be a vacuum state or a low-pressure state containing a portion of the vaporized fluid. Thus, gas-liquid equilibrium can be maintained even in a high-temperature environment, so it is difficult to evaporate (dry out). In addition, heat diffusion is efficiently performed even in a low-temperature environment, so thermal diffusivity can be improved in various temperature regions.

[0035] The first member 10, the second member 20, the intermediate member 30, the first reinforcing member 40, and the second reinforcing member 50 may be made of ceramic. As the ceramic constituting the first member 10, the second member 20, the intermediate member 30, the first reinforcing member 40, and the second reinforcing member 50, for example, alumina (Al2O3), zirconium oxide (ZrO2), silicon carbide (SiC), silicon nitride (Si3N4), aluminum nitride (AlN), cordierite (Mg2Al3 (AlSi5O 18 )), silicon-infiltrated silicon carbide (SiSiC), etc. In addition, the ceramics constituting the first member 10, the second member 20, the intermediate member 30, the first reinforcing member 40, and the second reinforcing member 50 may be single crystal.

[0036] Metal heat sinks are difficult to obtain rigidity and thin due to material and process reasons. In addition, the part of the metal heat sink that contacts the fluid is made of metal, so there is room for improvement in corrosion resistance. In contrast, in the heat sink 1 of the embodiment, the first member 10, the second member 20, the intermediate member 30, the first reinforcing member 40 and the second reinforcing member 50 are all made of ceramics, so it is easy to be thinned compared to metal heat sinks and has excellent corrosion resistance.

[0037] exist Figure 1 In the example shown, the heat sink 1 is disposed in a posture in which the first member 10 faces upward, but the posture of the heat sink 1 is not limited to this. Figure 1 For example, the heat dissipation device 1 can be arranged in a posture where the first member 10 faces downward. In addition, the heat dissipation device 1 is not limited to Figure 1 The horizontal arrangement shown can also be placed vertically.

[0038] The container 2 may also have a plurality of (here, two) communication passages 60 that connect the internal space of the working area 100 to the outside. One of the two communication passages 60 may be used, for example, as an injection hole for injecting a fluid. In addition, the other of the two communication passages 60 may be used, for example, as a discharge hole for discharging gas in the working area 100. In this case, during the manufacturing process of the heat dissipation device 1, a fluid may be injected into the internal space of the working area 100 from one of the communication passages 60, and then the gas existing in the internal space of the working area 100 may be discharged to the outside from the other of the communication passages 60.

[0039] The two communication paths 60 may open at the side of the container 2. The two communication paths 60 may also extend linearly from the side of the container 2 toward the working area 100.

[0040] The two communication passages 60 may also open on the same side of the container 2. In this case, by making the sides of the two communication passages 60 open upward, the fluid can be efficiently injected into the working area 100, and the gas existing in the internal space of the working area 100 can be efficiently discharged.

[0041] The heat source may be disposed on the upper surface of the container 2. Therefore, by locating the communication passage 60 on the side of the container 2, a larger installation space for the heat source can be secured compared to the case where the communication passage 60 is located on the upper surface of the container 2.

[0042] It should be noted that the two communication paths 60 may open at different sides of the container 2. In addition, the heat sink 1 does not necessarily need to have a plurality of communication paths 60. For example, the heat sink 1 may have only one of the two communication paths 60 described above.

[0043] Alternatively, a metal tube 70 may be inserted into the communication passage 60, and the communication passage 60 may be sealed by the metal tube 70. By blocking the communication passage 60 with the metal tube 70, the internal space of the heat sink 1 is sealed, and the fluid is sealed in the working area 100. In this way, the heat sink 1 may also be a sealed container with its interior sealed. The specific structure of the communication passage 60 and the metal tube 70 will be described later.

[0044] Next, refer to Figure 2 The structure of the first member 10 will be described. Figure 2 This is a diagram of the first member 10 according to the embodiment as viewed from the negative Z-axis direction side toward the positive Z-axis direction.

[0045] exist Figure 2 , the lower surface of the first member 10, specifically, the surface (third surface) facing the upper surface (first surface) of the intermediate member 30 is shown. Figure 2As shown, the first member 10 may have a lattice-shaped first groove portion 11 on the third surface.

[0046] The first groove portion 11 may include a first concave portion 11a that is recessed relative to the third surface and a plurality of first convex portions 11b located in the first concave portion 11a. The first concave portion 11a is located in the center of the third surface, and its outline when viewed from above may be, for example, circular. The plurality of first convex portions 11b may be arranged longitudinally and transversely at intervals in the first concave portion 11a. The first groove portion 11 may have a lattice shape through the first concave portions 11a and the plurality of first convex portions 11b.

[0047] Hereinafter, the area where the first groove portion 11 is located in the third surface of the first member 10 is described as a “first groove forming area 110”. The first groove forming area 110 may constitute a part of the working area 100. In addition, the first member 10 may have a first frame area 210 in a rectangular frame shape surrounding the first groove forming area 110. The first frame area 210 may constitute a part of the frame area 200.

[0048] A plurality of (here, two) communication grooves 12 may be located in the first frame region 210. The communication groove 12 may constitute a portion of the communication path 60. One end of the communication groove 12 may be located at the outer edge of the first member 10, and the other end of the communication groove 12 may be located at the outer edge of the first recess 11a. The depth of the communication groove 12 in the thickness direction of the first member 10 (here, the Z-axis direction) may be deeper than the depth of the first recess 11a in the thickness direction of the first member 10.

[0049] The reinforcing plate 40 b of the first reinforcing member 40 may be located at a center portion of the upper surface (fifth surface) of the first member 10 that is located on the opposite side of the lower surface (third surface).

[0050] Next, refer to Figure 3 The structure of the second member 20 will be described. Figure 3 This is a diagram of the second member 20 according to the embodiment as viewed from the Z-axis positive direction side toward the Z-axis negative direction.

[0051] exist Figure 3 , the upper surface of the second member 20, specifically, the surface (fourth surface) facing the lower surface (second surface) of the intermediate member 30 is shown. Figure 3 As shown, the second member 20 has a lattice-shaped second groove portion 21 on the fourth surface.

[0052] The second groove portion 21 may include a second concave portion 21a that is recessed relative to the fourth surface and a plurality of second convex portions 21b located in the second concave portion 21a. The second concave portion 21a may be located in the center of the fourth surface, and the outline when viewed from above may be, for example, circular. The plurality of second convex portions 21b may be arranged longitudinally and transversely at intervals in the second concave portion 21a. The second groove portion 21 may have a lattice shape through the second concave portions 21a and the plurality of second convex portions 21b.

[0053] Hereinafter, the area of ​​the fourth surface of the second member 20 where the second groove portion 21 is located is described as a “second groove forming area 120”. The second groove forming area 120 may constitute a part of the working area 100. In addition, the second member 20 may have a second frame area 220 in a rectangular frame shape surrounding the second groove forming area 120. The second frame area 220 may constitute a part of the frame area 200.

[0054] The size of the second groove forming region 120 in the second member 20 may be the same as the size of the first groove forming region 110 in the first member 10. In addition, the position of the second groove forming region 120 in the fourth surface of the second member 20 may be the same as the position of the first groove forming region 110 in the third surface of the first member 10.

[0055] Thus, by making the first grooves 11 and the second grooves 21 shaped like a grid, the fluid can be efficiently circulated in the internal space of the heat sink 1. It should be noted that the first grooves 11 and the second grooves 21 do not necessarily need to be shaped like a grid.

[0056] A plurality of (here, two) communication grooves 22 may be located in the second frame region 220. The communication groove 22 may constitute a portion of the communication path 60. One end of the communication groove 22 may be located at the outer edge of the second member 20, and the other end of the communication groove 22 may be located at the outer edge of the second recess 21a. The depth of the communication groove 22 in the thickness direction of the second member 20 may be deeper than the depth of the second recess 21a in the thickness direction of the second member 20.

[0057] Next, refer to Figure 4 The structure of the intermediate member 30 will be described. Figure 4 This is a diagram of the intermediate member 30 according to the embodiment as viewed from the Z-axis positive direction side toward the Z-axis negative direction.

[0058] like Figure 4As shown, the intermediate member 30 may have a third frame area 230 in a rectangular frame shape. The third frame area 230 may constitute a part of the frame area 200. In addition, the intermediate member 30 may have a central portion 32 in a circular shape when viewed from above and a plurality of connecting portions 33, wherein the central portion 32 in a circular shape when viewed from above is located inside the third frame area 230, and the plurality of connecting portions 33 may be located between the central portion 32 and the third frame area 230 and connect the central portion 32 to the third frame area 230. Figure 4 In the example shown, the central portion 32 may be located at the center of the intermediate member 30. In addition, the plurality of connection portions 33 may be spaced apart from each other and may be radially extended from the central portion 32 toward the third frame region 230.

[0059] The intermediate member 30 may further include a plurality of steam holes 36 and a plurality of reflow holes 37. The plurality of steam holes 36 and the plurality of reflow holes 37 may penetrate the upper surface (first surface) and the lower surface (second surface) of the intermediate member 30.

[0060] The plurality of steam holes 36 can function as a part of the flow path of the steam of the fluid. The plurality of steam holes 36 can be located between two adjacent connecting portions 33. That is, the plurality of steam holes 36 and the plurality of connecting portions 33 can be alternately arranged in the circumferential direction. The plurality of steam holes 36, like the plurality of connecting portions 33, can be spaced apart from each other and widen and extend radially from the central portion 32 toward the third frame area 230.

[0061] The plurality of reflux holes 37 can function as a part of the flow path of the fluid. The reflux holes 37 can be fine holes with a smaller opening area than the above-mentioned steam holes 36. Specifically, the reflux holes 37 can also be small enough to cause the fluid passing through the reflux holes 37 to generate a capillary phenomenon.

[0062] A plurality of (here, two) communication holes 38 may be located in the third frame region 230. The communication holes 38 may constitute a portion of the communication path 60. One end of the communication hole 38 may be located at the outer edge of the intermediate member 30, and the other end of the communication hole 38 may be located at the outer edge of the steam hole 36. The communication hole 38 may penetrate the intermediate member 30 in the thickness direction.

[0063] Figure 5 Yes Figure 2 The first groove forming area 110 and Figure 3 The second groove forming area 120 is shown with Figure 4 The intermediate member 30 shown in FIG. Figure 5 As shown, the first groove forming region 110 and the second groove forming region 120 may overlap with the third frame region 230 of the intermediate member 30 .

[0064] The working area 100 of the heat sink 1 may have an internal space sandwiched by the first groove forming area 110 and the second groove forming area 120, and a fluid may be sealed in the internal space. In addition, an intermediate member 30 may be sandwiched between the first groove forming area 110 and the second groove forming area 120 in the internal space, thereby the working area 100 may be divided into a first space sandwiched by the first groove forming area 110 and the intermediate member 30, and a second space sandwiched by the second groove forming area 120 and the intermediate member 30. These first space and second space may be connected through the steam hole 36 and the reflux hole 37 formed in the intermediate member 30.

[0065] Next, refer to Figure 6 and Figure 7 The flow of the fluid in the heat dissipation device 1 according to the embodiment will be described. Figure 6 and Figure 7 1 is a diagram for explaining the flow of fluid in the heat sink 1 according to the embodiment. Figure 6 is from Figure 5 The third frame area 230 is omitted in the figure shown. Figure 7 yes Figure 6 In the VII-VII section view. Figure 6 and Figure 7 In the diagram, the hollow arrows represent the flow of vapor, and the black arrows represent the flow of liquid. Figure 7 In the figure, the first reinforcing member 40 and the second reinforcing member 50 are omitted.

[0066] The fluid is heated by the heat source and vaporized into steam. As described above, the heat source can be arranged on the first member 10 (refer to Figure 1 , Figure 2 ) at the center of the upper surface (fifth surface) of the first member 10. Therefore, the vapor of the fluid is generated at the center of the first space (the space sandwiched by the first member 10 and the intermediate member 30).

[0067] The vapor of the fluid passes through the first groove portion 11 of the first groove forming region 110 and diffuses in the in-plane direction (XY plane direction) of the heat sink 1 (see Figure 6 ), and moves toward the second space (the space sandwiched by the second member 20 and the intermediate member 30) through the plurality of steam holes 36 (refer to Figure 7 white arrows as shown).

[0068] The vapor moved to the second space is condensed into liquid due to the decrease in temperature. The liquefied fluid moves toward the central part of the heat sink 1 in the second groove forming area 120 by the capillary force of the second groove portion 21 (see Figure 6In this process, the fluid enters the reflux hole 37 and returns to the first space due to the capillary force of the reflux hole 37 (refer to Figure 7 By repeating the above cycle, the heat dissipation device 1 can move heat from the heat source.

[0069] Next, refer to Figure 8 The structure of the metal pipe 70 will be described. Figure 8 yes Figure 5 Sectional view viewed along the VIII-VIII direction.

[0070] like Figure 8 As shown, the communication passage 60 may include communication grooves 12, 22 and a communication hole 38. As described above, the depth of the communication groove 12 in the thickness direction (Z-axis direction) of the first member 10 may be deeper than the depth of the first recess 11a of the working area 100 in the thickness direction of the first member 10. In addition, the depth of the communication groove 22 in the thickness direction of the second member 20 may be deeper than the depth of the second recess 21a of the working area 100 in the thickness direction of the second member 20. Therefore, the thickness T1 of the working area 100 may be configured to be thinner than the thickness T2 of the communication passage 60. According to this structure, the cycle of evaporation and condensation of the fluid in the working area 100 (internal space) can be repeated more quickly, and the circulation of the fluid can be performed efficiently.

[0071] The metal pipe 70 can seal the communication passage 60 by inserting a portion of the metal pipe 70 into the communication passage 60 and closing the other portion. One end 701 of the metal pipe 70 can be located in the communication passage 60. In other words, the metal pipe 70 may not be located in the working area 100. According to this structure, it is possible to reduce the reduction in the effective volume of the working area 100 (internal space).

[0072] One end 701 of the metal tube 70 may also be located at a position closer to the working area 100 (internal space) than the center in the longitudinal direction of the communication passage 60. With this structure, the metal tube 70 is not easily displaced when inserted, and the position accuracy of the metal tube 70 is improved. In addition, the other end 702 of the metal tube 70 may be located outside the communication passage 60.

[0073] like Figure 8 As shown, the metal pipe 70 may have an insertion portion 71 , a protrusion 72 , and a flange portion 73 .

[0074] The insertion portion 71 is a portion of the metal tube 70 located inside the communication passage 60. The protrusion 72 is a portion of the metal tube 70 located outside the communication passage 60. The length L1 of the insertion portion 71 may be shorter than the length L2 of the protrusion 72. With this structure, compared with a case where the length L1 of the insertion portion 71 is longer than the length L2 of the protrusion 72, the heat of the metal tube 70 can be further dissipated to the protrusion 72, and the stress applied to the container 2 can be relieved. It should be noted that in Figure 8 In the figure, as an example, the length L1 of the insertion portion 71 and the length L2 of the protrusion 72 are shown with the lower surface of the flange portion 73 as a reference, but the position used as a reference is not limited to this. For example, the position of the opening 201 may be used as a reference.

[0075] The flange 73 may be located at the protruding portion 72. The flange 73 may be bonded to the surface where the opening 201 of the communication passage 60 in the container 2 is located via a brazing material 74 such as silver brazing material. If the flange 73 is bonded to the container 2 via the brazing material 74, the connection durability between the container 2 and the metal pipe 70 is high.

[0076] The brazing material 74 may be located not only between the flange portion 73 and the container 2, but also between the insertion portion 71 and the communication path 60, for example. According to this structure, the connection durability between the container 2 and the metal pipe 70 is high. In addition, the brazing material 74 may be provided so as to straddle the surface of the flange portion 73 on the opposite side of the bonding surface with the container 2 and the opening surface of the communication path 60 in the container 2. That is, the brazing material 74 may be provided so as to cover the flange portion 73 as a whole. According to this structure, the connection durability between the container 2 and the metal pipe 70 is high.

[0077] It should be noted that the method of joining the metal pipe 70 to the container 2 is not limited to the above method. As long as the metal pipe 70 and the container 2 can be joined, the flange portion 73 is not an essential structure.

[0078] Next, the structures of the communication passage 60 and the metal pipe 70 in a cross-sectional view (hereinafter, also simply referred to as a cross-sectional view) of the communication passage 60 cut along a plane perpendicular to the longitudinal direction of the communication passage 60 will be described. Fig. 9 yes Figure 8 In the IX-IX section view. Fig. 9 In the figure, the first reinforcing member 40 and the second reinforcing member 50 are omitted.

[0079] like Fig. 9As shown, in cross-sectional view, the shape of the connecting passage 60 may be a polygonal shape having a plurality of corners. As described later, the first member 10, the second member 20, and the intermediate member 30 constituting the container 2 are obtained by processing a laminate composed of a plurality of layers. Specifically, the first member 10 having the connecting groove 12 is obtained by processing a laminate composed of layers 10a and 10b. Similarly, the second member 20 having the connecting groove 22 is obtained by processing a laminate composed of layers 20a and 20b. Similarly, the intermediate member 30 having the connecting hole 38 is obtained by processing a laminate composed of layers 30a and 30b. That is, the connecting passage 60 is composed of a plurality of layers, and therefore becomes a polygonal shape having a plurality of corners.

[0080] In addition, if Fig. 9 As shown, in cross-sectional view, the metal tube 70 may be circular in shape. Therefore, the shapes of the metal tube 70 and the connecting passage 60 may be different. In addition, the heat dissipation device 1 may also have a space between the outer peripheral surface of the metal tube 70 and the inner peripheral surface of the connecting passage 60.

[0081] The first member 10, the second member 20 and the intermediate member 30 constituting the connecting passage 60 are made of ceramics. Compared with metals, ceramics generally have a larger Young's modulus, in other words, have a higher rigidity. The metal tube 70 made of metal deforms (expands) in the direction of expanding the connecting passage 60 due to heat. And, stress is generated in the connecting passage 60 along with this deformation. In the case where there is a space between the outer peripheral surface of the metal tube 70 and the inner peripheral surface of the connecting passage 60, even if the metal tube 70 expands, the expansion of the metal tube 70 can be released into the space, compared with the case where there is no such space. Therefore, by making the shapes of the metal tube 70 and the connecting passage 60 in cross-section dissimilar, the stress applied to the container 2 due to the deformation of the metal tube 70 caused by temperature changes (especially, temperature rise) can be alleviated.

[0082] In addition, if Fig. 9 As shown, in the cross-sectional view, one internal angle of the shape of the communication passage 60 may be 90° or more, and the sum of all internal angles may be 360° or more. This can further alleviate the stress on the corners of the communication passage 60 when the metal pipe 70 expands due to heat, and can also reduce the occurrence of cracks in the container 2.

[0083] In addition, if Fig. 9 As shown, the shape of the connecting passage 60 may be such that the longitudinal width W1 and the lateral width W2 are different. With this structure, when the metal pipe 70 expands due to heat, the short width direction ( Fig. 9 In the example shown, the expansion force in the Z-axis direction is released to the longitudinal direction (in the Fig. 9 In the example shown, it is the space in the Y-axis direction).

[0084] In addition, if Fig. 9 As shown, the metal pipe 70 may contact the communication passage 60 at multiple points in cross-section. Fig. 9 In the figure, an example is shown in which the metal pipe 70 is in contact with the communication passage 60 at two points, but the metal pipe 70 may be in contact with the communication passage 60 at three or more points in cross-sectional view. With this structure, the metal pipe 70 can be supported with high accuracy.

[0085] The cross-sectional shape of the communication path 60 is not limited to Fig. 9 For example, the communication passage 60 may be square or rectangular in cross-sectional view. In addition, the communication passage 60 may be circular, for example, elliptical, which is not similar to the cross-sectional shape of the metal pipe 70 in cross-sectional view.

[0086] In addition, as described above, the heat sink 1 of the embodiment may be a sealed container made of ceramics. That is, the first member 10, the second member 20, and the intermediate member 30 may also be made of ceramics.

[0087] Compared with metals, ceramics generally have a larger Young's modulus, in other words, have higher rigidity. The metal tube 70 made of metal is deformed in the direction of expanding the connecting path 60 due to heat. Assuming that the heat sink is made of metal, if the metal tube 70 is deformed in the direction of expanding the connecting path 60, the connecting path 60 is also easily deformed along with the deformation. In contrast, even if the metal tube 70 of the heat sink 1 made of ceramic is deformed in the direction of expanding the connecting path 60, the connecting path 60 is less likely to be deformed than the heat sink made of metal. Therefore, compared with the heat sink made of metal, the heat sink 1 made of ceramic is easier to ensure airtightness against temperature changes (especially temperature rise).

[0088] In addition, from another point of view, ceramics have a smaller thermal expansion coefficient than most metals except for some metals such as W (tungsten), Mo (molybdenum), Ti (titanium), Nb (niobium), and Zr (zirconium). That is, the heat sink 1 made of ceramics is less likely to be thermally deformed than the heat sink made of metals. Therefore, the heat sink 1 made of ceramics is easier to maintain the state in which the metal pipe 70 presses the connecting path 60 than the heat sink made of metals. Therefore, according to the heat sink 1 made of ceramics, it is easier to ensure the airtightness against the thermal cycle than the heat sink made of metals. In addition, according to the heat sink 1 made of ceramics, it is less likely to be corroded even when exposed to acid or high-temperature water vapor than the heat sink made of metals, and it is also less likely to be oxidized even at high temperatures.

[0089] It should be noted that, as mentioned above, examples of ceramics constituting the first member 10, the second member 20 and the intermediate member 30 include alumina, zirconia and silicon carbide. Among these ceramics, alumina is preferably used as the ceramic constituting the first member 10, the second member 20 and the intermediate member 30 from the aspects of low cost, less damage to the environment and excellent processability.

[0090] The interior of the heat sink 1 of the embodiment is in a reduced pressure state (including vacuum) when no heat source is arranged on the upper surface (fifth surface) of the first member 10. On the other hand, when a heat source is arranged on the upper surface of the first member 10, the fluid vaporizes and expands in volume, so that the interior of the heat sink 1 becomes a pressurized state. In this way, the pressure state inside the heat sink 1 alternately changes between the reduced pressure state and the pressurized state depending on the presence or absence of a heat source.

[0091] On the other hand, since the metal pipe 70 of the embodiment is pressed toward the communication path 60 , it is easy to ensure both the airtightness in the decompressed state and the airtightness in the pressurized state.

[0092] Next, an example of a method for manufacturing the heat sink device 1 of the embodiment is described. First, raw materials of the first member 10, the second member 20, and the intermediate member 30 are used to form green sheets by a doctor blade method or a roll press method, and a plurality of green sheets are stacked to obtain a laminate.

[0093] Next, by subjecting the obtained laminated body to laser processing and punching using a die, each molded body of the first member 10, the second member 20, and the intermediate member 30 is obtained. For example, by subjecting the laminated body to laser processing, a molded body of the intermediate member 30 having a plurality of steam holes 36, a plurality of reflow holes 37, and a plurality of connecting holes 38 can be obtained. In addition, by subjecting the obtained laminated body to laser processing, a molded body of the first member 10 having a plurality of connecting grooves 12 and a first groove forming region 110 is obtained. In addition, by subjecting the obtained laminated body to laser processing, a molded body of the second member 20 having a plurality of connecting grooves 22 and a second groove forming region 120 is obtained.

[0094] Next, the molded bodies of the first member 10, the second member 20, and the intermediate member 30 are stacked and fired in the order of the second member 20, the intermediate member 30, and the first member 10, thereby obtaining a sintered body of the container 2 in which the first member 10, the second member 20, and the intermediate member 30 are integrated. In this way, the first member 10, the second member 20, and the intermediate member 30 are integrally formed. Therefore, since an adhesive or the like is not required, a heat dissipation device 1 with high reliability can be obtained.

[0095] It should be noted that the method for obtaining each molded body of the first member 10, the second member 20, and the intermediate member 30 is not limited to the above method, and each molded body may be obtained by, for example, laminating the green sheets after processing the green sheets. In addition, in the above example, after the molded bodies of the first member 10, the second member 20, and the intermediate member 30 are respectively produced, they are laminated to obtain the molded body of the container 2, but, for example, the molded body of the container 2 may also be obtained by sequentially laminating the processed green sheets.

[0096] Next, the insertion portion 71 of the metal pipe 70 is inserted into each of the plurality of communication paths 60 . Then, the flange portion 73 of the metal pipe 70 is joined to the container 2 via the brazing material 74 .

[0097] Next, for example, a fluid is injected into the interior of the sintered body from one of the two metal pipes 70. The gas existing in the interior of the sintered body is discharged to the outside from the other metal pipe 70 along with the injection of the fluid.

[0098] Next, a vacuum pump or other decompression device is used to evacuate the interior of the sintered body through the communication path 60. The interior of the sintered body is preferably in a vacuum state, but does not need to be strictly in a vacuum state, and may be in a decompression state close to a vacuum state, for example.

[0099] Next, the communication path 60 is sealed while the interior of the sintered body is evacuated. Fig.10 As shown, the protruding portion 72 of the crimped metal tube 70 (see Figure 8 ) to seal the container 2. It should be noted that the method of sealing the communication path 60 is not limited to the above example. For example, the other end 702 of the metal pipe 70 may be welded (see Figure 8 ) to seal the communication path 60. In addition, the communication path 60 may be sealed by both crimping and welding.

[0100] (First Modification)

[0101] In the above-mentioned implementation mode, if Figure 8 As shown in FIG. 1 , the length L1 of the insertion portion 71 of the metal pipe 70 is shorter than the length L2 of the protruding portion 72, but the present invention is not limited to this structure. Fig.11 As shown, the length L1 of the insertion portion 71 may be longer than the length L2 of the protruding portion 72. With this structure, the metal pipe 70 is unlikely to fall out of the container 2.

[0102] As described above, the heat device (as an example, the heat dissipation device 1) of the embodiment includes a ceramic container (as an example, the container 2), a fluid (as an example, the fluid), and a metal pipe (as an example, the metal pipe 70). The container has an internal space (as an example, the working area 100), an opening connected to the internal space (as an example, the opening 201), and a connecting path (as an example, the connecting path 60) connecting the internal space and the opening. The fluid is located in the internal space. A portion of the metal pipe is inserted into the connecting path, and the other portion is closed.

[0103] The container of the thermal device of the embodiment is made of ceramics, and therefore has excellent durability against temperature changes compared to the metal container described in Patent Document 1. In addition, in the thermal device of the embodiment, a portion of the metal pipe is located in the communication path of the thermal device, so even if the metal pipe is deformed due to temperature changes, the stress can be borne by the entire container and can be alleviated.

[0104] In addition, in the thermal device of the embodiment, since the communication path and the metal pipe are not similar, a gap is formed between the communication path and the metal pipe, and when the metal pipe is deformed, stress can be further relaxed.

[0105] Therefore, according to the thermal device of the embodiment, durability can be improved.

[0106] The thermal device disclosed in the present invention is not limited to a heat dissipation device. For example, the thermal device disclosed in the present invention may also be a thermal storage device that stores latent heat accompanying the phase change of a thermal storage material (an example of a phase change material) as thermal energy. In this case, the thermal storage material uses a material that undergoes a solid-liquid phase change or a material that undergoes a solid-solid phase change. In this way, the phase change material does not necessarily need to undergo a gas-liquid phase change. In other words, the phase change material does not necessarily need to be a liquid, but may also be a solid.

[0107] It should be considered that the embodiments disclosed this time are illustrative in all aspects and are not restrictive. In fact, the above-mentioned embodiments can be implemented in many ways. In addition, the above-mentioned embodiments can also be omitted, replaced, and changed in various ways without departing from the attached technical solutions and their main purpose.

[0108] Description of reference numerals:

[0109] 1. Heat dissipation device

[0110] 2 Container

[0111] 10 First Component

[0112] Layer 10a, 10b

[0113] 11 First groove

[0114] 11a first recess

[0115] 11b first convex part

[0116] 12 Connecting groove

[0117] 20 Second component

[0118] 20a, 20b floors

[0119] 21 Second groove

[0120] 21a Second recess

[0121] 21b second convex part

[0122] 22 connecting groove

[0123] 30 Intermediate Components

[0124] 30a, 30b layers

[0125] 32 Central

[0126] 33 Connection

[0127] 36 Steam holes

[0128] 37 Reflux Hole

[0129] 38 connecting hole

[0130] 40 first reinforcement member

[0131] 40a, 40b reinforcement plate

[0132] 50 Second reinforcement member

[0133] 50a, 50b reinforcement plate

[0134] 60 Connecting Road

[0135] 70 Metal pipe

[0136] 71 Insertion

[0137] 72 Protrusion

[0138] 73 Flange

[0139] 74 solder

[0140] 100 working areas

[0141] 110 First groove forming region

[0142] 120 Second groove forming area

[0143] 200 frame area

[0144] 201 Opening

[0145] 210 First frame area

[0146] 220 Second frame area

[0147] 230 Third frame area

[0148] 701 One end

[0149] 702 The Other End

[0150] L1 Insertion length

[0151] L2 Length of the protrusion

[0152] T1 Thickness of the working area

[0153] T2 Thickness of connecting path

[0154] W1 Vertical Width

[0155] W2 Horizontal width.

Claims

1. A thermal device, wherein: The thermal device has: A ceramic container having an internal space, an opening connected to the internal space, and a communication path connecting the internal space and the opening; a fluid located in the interior space; and A portion of the metal pipe is inserted into the communication path, and another portion of the metal pipe is closed.

2. The thermal device according to claim 1, wherein: The opening is located on a side surface of the container.

3. The thermal device according to claim 2, wherein: The thermal device has a plurality of openings and a plurality of communication paths. The plurality of openings are located on the same side surface.

4. The thermal device according to claim 1, wherein: One end of the metal pipe is located in the communication path.

5. The thermal device according to claim 4, wherein: One end of the metal pipe is located closer to the internal space than the center of the communication path in the longitudinal direction.

6. The thermal device according to claim 1, wherein: The metal pipe is in contact with the communication passage at two or more points in a cross-sectional view taken along a plane perpendicular to the longitudinal direction of the communication passage.

7. The thermal device according to claim 1, wherein: The thickness of the internal space is thinner than the thickness of the communication path.

8. The thermal device according to claim 1, wherein: When viewing the container from above, the inner space is circular.

9. The thermal device according to claim 1, wherein: In a cross-sectional view of the communication passage cut along a plane perpendicular to the longitudinal direction of the communication passage, the shape of the metal pipe is not similar to the shape of the communication passage.

10. The thermal device according to claim 9, wherein: The shape of the communication path in the cross-sectional view is a polygonal shape having a plurality of corners.

11. The thermal device according to claim 9, wherein: The shape of the metal pipe in the cross-sectional view is circular.

12. The thermal device according to claim 11, wherein The communicating path in the cross-sectional view has a shape in which a longitudinal width and a lateral width are different from each other.

13. The thermal device according to claim 10, wherein: In the cross-sectional view, one internal angle of the shape of the communication path is greater than or equal to 90°, and the sum of all internal angles is greater than or equal to 360°.

14. The thermal device according to claim 1, wherein: The metal pipe has an insertion portion located in the communication passage, a protrusion portion located outside the communication passage, and a flange portion located in the protrusion portion. The flange portion is joined to a surface of the container where the opening portion is located.

15. The thermal device according to claim 14, wherein: The length of the insertion portion is shorter than the length of the protrusion portion.

16. The thermal device according to claim 1, wherein A space is provided between the inner peripheral surface of the communication passage and the outer peripheral surface of the metal pipe.

Images