Magnetic chamber and modular coil

Abstract

The present disclosure relates to an assembly comprising a plurality of modular coils (100a, 100b; the invention relates to a modular coil assembly (100) comprising a plurality of modular coils (102, 401) mechanically and electrically joined together, where each modular coil comprises a groove (110a, 110b) that divides the modular coil into at least two different electrically conductive regions.

Description

[0001] This application is based on the European patent application with the invention name “MAGNETIC CHAMBER AND MODULARCOILS” and application number 22305444 filed on April 4, 2022 and the European patent application with the invention name “METHODFOR MANUFACTURING SUPERCONDUCTING COILS AND DEVICE” and application number 22305437 filed on April 4, 2022, and claims the priority of the above-mentioned European patent applications, which are hereby incorporated by reference to the maximum extent permitted by law. Technical Field

[0002] The present disclosure relates to magnetic chambers, and in particular to magnetic chambers having coils constructed in a modular manner. Background Art

[0003] The wonders of the modern world are largely due to the development of devices that utilize magnetic fields in various ways. However, there are applications of magnetic fields that remain difficult to reach due to limitations in the construction methods of magnetic devices and magnetic confinement chambers.

[0004] A magnetic chamber is an enclosed volume that maintains a magnetic field. Magnetic fields can be created by electric currents and exist in nature in permanent magnets. Magnetic fields affect many objects in nature, depending on the material the object is made of. Materials affected by magnetic fields are called magnetic materials. In order for a magnetic field to be useful in a particular application, it is usually required that the field have a specific configuration, usually represented by field lines. Field lines represent the way other magnets will align themselves under the influence of a magnetic field. Field lines extend throughout space. The magnetic field also describes other properties, such as the strength of the field.

[0005] Magnetic chambers with specific magnetic field configurations inside are useful in many applications. In magnetic resonance imaging MRI applications, a highly uniform magnetic field is required. In contrast, in fusion energy applications (for example, applications involving stellarators), twisted and complex magnetic fields are required. In many applications, the magnetic field also needs to be changed in a timely manner in the sense that some of its characteristics need to be modified. Magnetic field applications for transportation (for example, maglev trains or hyperloops) generally require the magnetic field to move in order to move the train. Magnetic fields and therefore magnetic chambers containing magnetic fields also have applications in the food industry, where magnetic fields and magnetic chambers are used to perform mixing or separation. Other applications include the power industry, especially power transmission, where magnetic fields are used to measure current intensity.

[0006] Some applications of magnetic chambers further benefit if the magnetic field can be confined to the interior of a container called a vessel. A natural phenomenon called the Meissner effect describes the repulsion of magnetic fields from superconductors. Superconductors are materials in which electric current can flow without any resistance; thus, superconductors are ideal conductors because electric current flows without energy loss. These two properties of superconductors are very attractive to manufacturers and designers of magnetic devices, they can be used as conductors for electric current, and the magnetic chamber can be lined with superconductors to confine the magnetic field inside.

[0007] Currently, magnetic chambers are constructed with large magnets shaped into coils; depending on cost or application, the magnets can be permanent or electrical. In applications where the magnetic field requires a special configuration (e.g., in stellarators), the coils must be twisted into complex shapes during construction. This greatly increases costs during the design and manufacturing stages; stellarator designs are very complex and require a lot of testing, so building many magnet coils requires a lot of time and money.

[0008] A magnetic module for an MRI machine is described in U.S. Patent No. 8,838,193 to Maher et al. The module described by Maher is constructed by adding a conductive surface path of superconducting material to a support structure. The path is described as being conical or preferably spiral. Each is approximately 1 m 2 Several modules of different sizes are aligned to produce the magnetic field required for MRI. As described by Maher, the modules only work in conjunction with each other, so a magnetic field is created from the combination of the effects of the modules. In addition, according to Maher, each module produces a specific magnetic field configuration. Maher describes the way in which the modules can be arranged together to produce a magnetic field, but he does not describe or disclose the method by which the modules can be used to contain or constrain the magnetic field. A careful reading of the description of Maher's modules reveals that it is impossible to constrain the magnetic field using the described module arrangement, because each module must generate a magnetic field in a specific direction in order to work in conjunction with each other. In addition, many modules may be required to generate a specific magnetic field configuration, and more complex configurations become more difficult to develop as the number of modules increases. The description of the module operation that requires each module to be housed in different orientations and positions makes the module unsuitable as a vessel component. Maher failed to disclose the way in which the modules can be used in applications that require magnetic constraints to construct a specific vessel shape or the way in which such modules can be used to produce complex magnetic fields without the need for an unrealistic number of modules.

[0009] With respect to coils, the prior art teaches several methods for constructing coils (e.g., the superconducting coils described in U.S. Pat. No. 8,655,423 to Miyazaki et al.). Miyazaki describes a superconducting coil formed from several layers of different materials. Groups of these layers are described as constituting superconducting coil sections formed from thin film superconducting wires. The coils described by Miyazaki and coils commonly found in the art are constructed by arranging a superconducting film (also referred to as a superconducting tape) into the shape of a wire, which is then further configured into the shape of a coil. Based on a review of the prior art, a superconducting coil is formed by stacking superconducting films or superconducting layers so that current can flow in a desired direction and produce an appropriate magnetic field configuration. To the best of the inventor's knowledge and understanding, the prior art does not teach any other method by which a superconducting film or tape can be used to conduct current.

[0010] Superconducting tapes themselves are also in short supply, as they are in high demand. There is also the problem of the size and shape of the tapes: they can only be constructed a few centimeters wide. In addition, the process of arranging the tapes into wires and further into coils is long and prone to errors.

[0011] Thus, there remains a need for an efficient and lower cost alternative to coils used in magnetic applications, and there remains a need for a magnetic chamber that can confine a magnetic field within it. There is a need for a magnetic chamber that can be any possible configuration or shape and produce any magnetic field configuration regardless of the shape. Fundamentally, there is a need for a magnetic chamber that can be constructed with a small number of parts and can be manufactured at a better cost. In addition, there is a need for a magnetic chamber that is simple to construct in a manner that allows the confined magnetic field to be replicated and quickly modified. Summary of the invention

[0012] One embodiment addresses all or some of the disadvantages of known magnetic modules and magnetic chambers.

[0013] One embodiment provides an assembly including a plurality of modular coils mechanically and electrically coupled together, wherein each modular coil includes a groove that divides the modular coil into at least two distinct conductive regions.

[0014] In one embodiment, the plurality of modular coils include at least a first modular coil and a second modular coil, the first modular coil having a first groove, the second modular coil being connected to the first modular coil and having a second groove, wherein the first groove and the second groove are suitable for forming a continuous groove, the continuous groove dividing the connected first modular coil and second modular coil into at least two different conductive areas.

[0015] In one embodiment, the grooves are adapted to direct current flow through the connected modular coils in a particular direction so as to generate a magnetic field that is at least partially confined within the assembly.

[0016] In one embodiment, the shape of the grooves of at least one of the modular coils determines the configuration of current flow through the modular coil and, therefore, the shape of the magnetic field formed when current flows.

[0017] In one embodiment, the groove of at least one of the modular coils contains a metal such as silver.

[0018] In one embodiment, the plurality of modular coils include a first modular coil and a second modular coil, the first modular coil having a first connecting mechanism such as a flange, and the second modular coil having a second connecting mechanism such as a flange, the second connecting mechanism being suitable for being connected to the first connecting mechanism, preferably being connected to the first connecting mechanism.

[0019] In a particular embodiment, each linking mechanism is further adapted to provide an electrical connection between the first modular coil and the second modular coil.

[0020] In one embodiment, at least one of the modular coils comprises a channel, for example, to enable a cooling fluid such as nitrogen or helium to flow through the modular coil.

[0021] In a particular embodiment, the plurality of modular coils include a first modular coil and a second modular coil, the first modular coil having a first channel, the second modular coil being connected to the first modular coil and having a second channel, the second channel being suitable for connecting to the first channel to form a single channel passing through the connected first modular coil and second modular coil.

[0022] In one embodiment, at least one of the modular coils is configured to have superconducting properties.

[0023] In one embodiment, at least one of the modular coils is constructed as a stack of different materials, the stack comprising at least a superconducting layer comprising a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide, wherein the grooves of the modular coil are patterned at least in the superconducting layer.

[0024] In one embodiment, the stack comprises:

[0025] a structural layer, which for example consists of or is covered by a material such as Hastelloy;

[0026] - a plurality of buffer layers, the plurality of buffer layers being located on the structural layer;

[0027] - the superconducting layer, the superconducting layer being located on the plurality of buffer layers;

[0028] Wherein, the grooves are patterned in the buffer layer and the superconducting layer.

[0029] In one embodiment, the stack includes a silver layer on the superconducting layer.

[0030] In one embodiment, the stack comprises:

[0031] a structural layer, which for example consists of or is covered by a material such as Hastelloy;

[0032] - a plurality of buffer layers, the plurality of buffer layers being located on the structural layer;

[0033] - the superconducting layer, the superconducting layer being on the plurality of buffer layers; and

[0034] - a shunt layer on the superconducting layer and in the groove, the shunt layer being made of a metal such as silver;

[0035] Wherein, the grooves are patterned in the buffer layer and the superconducting layer.

[0036] In one embodiment, the stack includes a repeating portion layer, which is located below the shunt layer, and the repeating portion layer is made of repetitions of the buffer layer and the superconducting layer and in some cases the silver layer, preferably made of multiple repetitions, for example between 4 and 80 repetitions, wherein the grooves are patterned in the buffer layer, the superconducting layer and the repeating portion layer.

[0037] In one embodiment, the stack comprises a further superconducting layer, preferably a non-perforated and non-grooved layer, on the shunt layer, the further superconducting layer comprising, for example, a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide.

[0038] In a particular embodiment, the passage of the at least one modular coil passes through the structural layer.

[0039] In one embodiment, at least one of the modular coils comprises a first portion and a second portion adapted to be coupled together, for example, the first portion comprises a connecting seam and the second portion comprises a receiving cavity adapted to engage the connecting seam.

[0040] In one embodiment, at least one of the modular coils and for example each of the first and second parts of the modular coil is formed by at least two walls, for example two or three walls, assembled together.

[0041] In one embodiment, the modular coils form a magnetic chamber.

[0042] One embodiment provides a modular coil suitable for use in an assembly according to an embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The foregoing features and advantages and other features and advantages will be detailed in the following description of specific embodiments given by way of illustration and not limitation in the accompanying drawings, in which:

[0044] Figure 1A is an overall perspective view of two modular coils in the first embodiment.

[0045] Figure 1B is a perspective view of two modular coils in a linked configuration in the first embodiment.

[0046] Figure 1C is an exploded view of two joined modular coils of a first embodiment separated by a center line.

[0047] Figure 2A is an overall perspective view of a single modular coil having specific grooves according to a first embodiment.

[0048] Figure 2B is according to the first embodiment having Figure 2A An overall perspective view of a single modular coil with different specific grooves in the grooves.

[0049] Figure 3 is a perspective view of the internal structure of the modular coil according to the first embodiment.

[0050] Figure 4 is a perspective view of a magnetic chamber constructed of modular coils according to a first embodiment.

[0051] Figure 5 is a perspective view of a cross section of the interior of a magnetic chamber constructed of modular coils according to a first embodiment.

[0052] Fig. 6A is a perspective view of two modules in the second embodiment.

[0053] Figure 6B is a perspective view of two modular coils in a linked configuration in a second embodiment.

[0054] Figure 6Cis an exploded view of two connected modules in the second embodiment. DETAILED DESCRIPTION

[0055] In the various figures, the same features have been designated by the same reference numerals. In particular, structural and / or functional features common to the various embodiments may have the same reference numerals and may employ the same structures, dimensions, and material properties.

[0056] For clarity, only operations and elements useful for understanding the embodiments described herein have been explained and described in detail.

[0057] Unless otherwise indicated, when reference is made to two elements being connected together, this means a direct connection without any intermediate elements except conductors, and when reference is made to two elements being coupled together, this means the two elements may be connected or they may be coupled via one or more other elements.

[0058] In the following disclosure, unless otherwise indicated, when reference is made to absolute position qualifiers (e.g., terms "front", "back", "top", "bottom", "left", "right", etc.) or relative position qualifiers (e.g., terms "above", "below", "higher", "lower", etc.) or orientation qualifiers (e.g., "horizontal", "vertical", etc.), reference is made to the orientation shown in the figures.

[0059] Unless otherwise specified, the expressions "about," "approximately," "substantially," and "approximately" mean within 10% and preferably within 5%.

[0060] The drawings are not to scale. It should be noted that when unambiguous is intended, the drawings refer to embodiments of the disclosed magnetic chambers and modular coils (sometimes also referred to simply as devices). Other embodiments may be possible as can be readily understood by a person with appropriate training. The actual dimensions and / or shape of each of the components of the embodiments may vary. Only the important details of the embodiments are shown, however, a person of ordinary skill in the art can understand how to construct the entire device without undue experimentation. Some details have been omitted from the drawings, but the inventors believe that adding these details is unnecessary for a full understanding of the features of the disclosed invention. These omitted details include, in particular, elements for holding or fixing the device or its functional components, etc. Some features of the embodiments appear exaggerated to facilitate understanding. The disclosed embodiments and observed alternatives should not be construed as limiting the present invention in any way.

[0061] The magnetic chamber is composed of modular coils that are mechanically and electrically linked together to carry electrical current that creates a magnetic field that is confined within the magnetic chamber.

[0062] exist Figure 1AAn embodiment of two of these modular coils is shown in . The first modular coil 100a has an interlocking, locking or connecting mechanism (e.g., flange 102a) and a tunnel, channel or passage 104a passing through it. The second modular coil 100b also has a flange 102b and a channel 104b.

[0063] When reference is made to a joining mechanism this also includes interlocking or locking mechanisms and when reference is made to a passageway this also includes a duct, tunnel or channel.

[0064] From Figure 1A The modular coils are mechanically linked together, such as Figure 1B As shown. The flange 102a of the first modular coil 100a is connected to the flange 102b of the second modular coil 100b. At the flange or by some other means, an electrical connection can be provided so that current can flow from one modular coil to the other modular coil. The channel 104a of the first modular coil 100a can also be connected to the channel 104b of the second modular coil 100b, forming a single channel through the two structures. A cooling fluid can be flowed through the channel 104a and / or the channel 104b. In addition, Figure 1B The joined modular coils shown may be joined to another such structure, creating a larger structure. In another example, the channels of the joined modular coils may not be connected, and other means may be provided to pass cooling fluid through the channels of each modular coil.

[0065] Figure 1C Shown when from Figure 1B The internal structure of the connected modular coils when they are separated by a plane parallel to the channel 104a. The internal structure includes a groove 110, which runs from the first modular coil 100a to the second modular coil 100b, or vice versa. The groove 110 (continuous groove) is formed by continuously connecting the first groove 110a of the first modular coil 100a with the second groove 110b of the second modular coil 100b. The groove 110 divides the connected modular coils into different conductive areas. Therefore, the groove 110 allows different current configurations to pass through the connected modular coils. The shape of the groove 110 ultimately determines the shape of the magnetic field formed when the current flows. In another example, the grooves of some connected modular coils may not be continuously connected. For example, in some configurations, each of the different conductive areas of the first modular coil can be connected to the corresponding conductive area of ​​the second modular coil, and their grooves do not need to be connected together.

[0066] like Figure 2A As shown, a particular groove pattern 110 results in a magnetic field having a particular configuration 202a. Figure 2B, different groove patterns 210 result in different magnetic field configurations 202b. The actual magnetic field configuration will depend on the rest of the structure and the way current flows through each of the modular coils.

[0067] Figure 1B The modular coils in a can be connected to other modular coils in a similar configuration to form a larger structure which can be called a module. A module is a closed chamber that maintains a magnetic field; therefore, it includes a magnetic chamber. The magnetic chamber can be of any shape that is suitable for the construction of the module. One such module is Figure 4 The dome 400 is shown. Figure 5 A cross-sectional view of dome 400 is shown in FIG.

[0068] The dome 400 is assembled from a plurality of modular coils 401. The channels 104a pass through the dome 400 through the outer wall of the dome. All channels 104a of all modular coils 401 can be connected together to form a single channel covering the entire dome 400 to ensure that any cooling fluid reaches each modular coil. In another example, as described above, the channels of the modular coils may not all be connected together.

[0069] Example of operation

[0070] You can refer to Figure 5 An example of the operation of the modular coils and magnetic chambers is explained. During operation, the modular coils 401 are powered, meaning that current is flowing through them. The power used to power the coils 401 can come from an external power source. When current flows through the coils 401, a magnetic field 500 is formed inside the dome 400. The shape, strength, and configuration of the magnetic field 500 depend on the characteristics of the modular coils 401. The characteristics of the magnetic field 500 also depend on the shape of the magnetic chamber. Each modular coil 401 has a groove 110a, such as from Figure 1C The grooves guide the flow of current. Figure 2A and Figure 2B As shown, different groove 110 patterns result in different shapes for the magnetic field 500 .

[0071] The modular coil 401 may be constructed to have superconducting properties that may be used to exploit the Meissner effect and capture the magnetic field 500 inside the magnetic chamber.

[0072] Proper operation of the device may require that the modular coil 401 maintain a certain temperature. The channel 104a passing through the inner wall of the modular coil 401 can be used to supply a cooling fluid. For example, if the modular coil 401 is to exhibit superconducting properties, a fluid such as nitrogen or helium can be flowed through the channel 104a and ensure the superconducting properties of the modular coil 401.

[0073] Example of construction of a modular coil

[0074] Modular coils can be constructed as stacked layers (stacks) of different materials, such as Figure 3 As shown. Starting from the bottom, which may be closest to the side where the magnetic field will be formed, the stack includes a first structural layer 300, which may be composed of or covered by a material such as Hastelloy. A channel 104a for a cooling fluid may pass through the first structural layer 300. Several buffer layers are deposited on top of the first structural layer 300. Sputtered on top of the first structural layer 300 is a layer of a material such as aluminum oxide, referred to as a first buffer layer 301. A second buffer layer 302 is sputtered on top of the first buffer layer 301. The second buffer layer 302 is composed of a material such as yttrium oxide. The third buffer layer 303 is composed of a material such as magnesium oxide and may be deposited by metal organic chemical vapor deposition MOCVD or ion beam assisted deposition IBAD. A superconducting layer 304 is deposited on top of the third buffer layer 303. The superconducting layer 304 may be deposited by MOCVD and may be composed of a material such as REBCO or YBCO or other suitable superconducting material. Material from the first buffer layer 301, the second buffer layer 302, the third buffer layer 303, and the superconducting layer 304 may be removed to create a description which may also be seen in Figure 1C To remove material, a technique such as laser patterning may be used. Other techniques such as mechanical techniques or photolithography may be used to remove material.

[0075] Alternatively, material may be removed only from the superconducting layer 304 to create the grooves 110a.

[0076] The buffer layer may form a suitable template for forming the superconducting layer.There may be only one buffer layer, rather than multiple buffer layers.

[0077] Other suitable materials may be used in place of the materials described herein.

[0078] The groove 110a can be filled with a metal, which can be silver, to form a shunt layer 306 that can also be positioned above the superconducting layer 304. The shunt layer provides a path for current in the event of quenching of the superconducting layer 304. The shunt layer 306 is optional. There are other solutions for solving the quenching problem (e.g., operating at sufficiently low current, temperature, and / or magnetic field). Quenching is generally a problem for superconductivity, which is not related to the problem solved by the embodiments.

[0079] The described sequence of buffer layers and superconducting layers can be repeated several times before the grooves are formed, wherein best results are achieved with a layer sequence repetition of between 4 and 80 times (e.g., for a magnetic field of approximately 10 Tesla, with a layer sequence repetition of between 20 and 40 times). Figure 3 In FIG. 5 , this is indicated by the repeating portion layer 308 , wherein the grooves 110 a are also formed and the shunt layer 306 is deposited after the grooves are formed so that the shunt layer 306 fills the grooves 110 a and covers the last sequence of superconducting layers.

[0080] The repeated sequence of layers may include a silver layer 305 on the superconducting layer 304 or a layer of another material suitable for forming another sequence of buffer layers and superconducting layers on the sequence.

[0081] For example, for one sequence of buffer layers and superconducting layers, the depth of the groove 110a is comprised between 3 μm and 5 μm. If the sequence is repeated, the depth of the groove can be multiplied by the number of sequences. For example, the depth of the groove is comprised between 3×N μm and 5×N μm, where N is the number of sequences.

[0082] In order to at least partially exploit the Meissner effect, a single, preferably non-perforated (and non-grooved) layer of superconducting material should be placed on top of all the described layers (e.g., on top of the shunt layer 306). This layer is the Meissner effect layer 310 and is composed of a superconducting material such as YBCO or REBCO.

[0083] The correct operation of the device may require other material layers above or below the described layers, however, it should be apparent to those skilled in the art how to achieve the functions described herein with different layer configurations. As an example of this, a stabilization layer composed of silver, copper, and other metals may be placed below the first structural layer 300.

[0084] Other layer configurations and / or methods for constructing modular coils as stacked layers formed of different materials should be apparent to a person skilled in the art. Another example of a method or coil is given in European patent application number EP22305437 filed on April 4, 2022 by the same applicant "RENAISSANCEFUSION" and entitled "METHOD FOR MANUFACTURING SUPERCONDUCTING COILS AND DEVICE", which is hereby incorporated by reference to the maximum extent permitted by law.

[0085] Additional Embodiments

[0086] exist Fig. 6AA second embodiment of a modular coil is shown in . In the second embodiment, the modular coil is formed of six parts connected together by means of a connecting seam 610 and a receiving cavity 612, joined together like puzzle pieces. A modular coil having such a receiving portion 600a (first portion) and a connecting portion 600b (second portion) suitable for fitting together in the manner of a puzzle or any other assembly means allows the formation of different and specific forms of assemblies. The embodiment also includes a channel 104a for cooling. In this embodiment, the modular coil is formed of the following six parts: a left outer wall 606a, a left middle wall 604a and a left inner wall 602a, which are located on the cavity 612 side (receiving portion or first portion 600a); and a right outer wall 606b, a right middle wall 604b and a right inner wall 602b, which are located on the connecting seam 610 side (connecting portion or second portion 600b). The modular coils from the second embodiment can be connected to form components such as Figure 6B Such a single coil structure can then be coupled (preferably connected) to other similar coil structures and form an assembly that can describe a magnetic chamber. For example, they can be used to construct a magnetic chamber from Figure 4 The dome is 400.

[0087] The inner wall may be referred to as a “first wall”, the middle wall may be referred to as a “second wall”, and the outer wall may be referred to as a “third wall”.

[0088] Figure 6C An exploded view of a modular coil according to a second embodiment is shown. Each of the wall sections forms a continuous structure, and thus they can be configured to have different characteristics. For example, the inner wall pair formed by walls 602a and 602b can have a current defining pattern that is different from the pattern in the middle wall formed by walls 604a and 604b and the outer wall segment formed by walls 606a and 606b.

[0089] The inner wall 602a, 602b on each side may include Figure 3 The middle wall 604a, 604b on each side of the layer 300 may include Figure 3 The layers 301, 302, 303, 304, possibly 305 and / or 308, the groove 110a and the layer 306, and the outer walls 606a, 606b on each side may include Figure 3 Layer 310.

[0090] Example embodiments of the present invention are summarized herein. Other embodiments may also be understood from the complete specification and claims submitted herein.

[0091] Example 1. A component comprising a plurality of modular coils (100a, 100b; 401), the plurality of modular coils being mechanically and electrically connected together, wherein each modular coil comprises a groove (110a, 110b), the groove dividing the modular coil into at least two different conductive areas.

[0092] Example 2. A component as described in Example 1, wherein the plurality of modular coils include at least a first modular coil (100a) and a second modular coil (100b), the first modular coil (100a) having a first groove (110a), the second modular coil (100b) being connected to the first modular coil and having a second groove (110b), wherein the first groove and the second groove are suitable for forming a continuous groove (110; 210), the continuous groove dividing the connected first modular coil and second modular coil into at least two different conductive areas.

[0093] Example 3. A component as described in Example 1 or 2, wherein the groove (110a, 110b, 110; 210) is suitable for guiding current to flow through the connected modular coils in a specific direction so as to generate a magnetic field (202a; 202b; 500) that is at least partially confined in the component.

[0094] Example 4. A component as described in any one of claims 1 to 3, wherein the shape of the groove (110a, 110b, 110; 210) of at least one of the modular coils determines the current configuration for passing through the modular coil and thereby determines the shape of the magnetic field (202a; 202b) formed when current flows.

[0095] Example 5. An assembly as described in any of Examples 1 to 4, wherein the groove (110a, 110b, 110; 210) of at least one of the modular coils contains a metal such as silver.

[0096] Example 6. A component as described in any of Examples 1 to 5, wherein the plurality of modular coils include a first modular coil (100a) and a second modular coil (100b), the first modular coil (100a) having a first connecting mechanism (102a) such as a flange, the second modular coil (100b) having a second connecting mechanism (102b) such as a flange, the second connecting mechanism (102b) being suitable for connecting to the first connecting mechanism (102a), preferably connected to the first connecting mechanism (102a).

[0097] Example 7. The assembly of Example 6, wherein each coupling mechanism is further adapted to provide an electrical connection between the first modular coil and the second modular coil.

[0098] Example 8. A component as described in any of Examples 1 to 7, wherein at least one of the modular coils (100a, 100b; 401) includes a channel (104a, 104b), for example to enable a cooling fluid such as nitrogen or helium to flow through the modular coil.

[0099] Example 9. A component as described in Example 8, wherein the plurality of modular coils include a first modular coil (100a) and a second modular coil (100b), the first modular coil (100a) having a first channel (104a), the second modular coil (100b) being connected to the first modular coil and having a second channel (104b), the second channel (104b) being suitable for connecting to the first channel (104a) to form a single channel passing through the connected first modular coil and second modular coil.

[0100] Example 10. An assembly as described in any of Examples 1 to 9, wherein at least one of the modular coils is constructed to have superconducting properties.

[0101] Example 11. A component as described in any of Examples 1 to 10, wherein at least one of the modular coils is constructed as a stack formed of different materials, the stack comprising at least a superconducting layer (304), the superconducting layer (304) comprising a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide, wherein the grooves (110a) of the modular coil are patterned at least in the superconducting layer.

[0102] Example 12. The assembly of Example 11, wherein the stack comprises:

[0103] a structural layer (300), the structural layer (300) for example consisting of or covered by a material such as Hastelloy;

[0104] - a plurality of buffer layers, the plurality of buffer layers being located on the structural layer;

[0105] - the superconducting layer (304), the superconducting layer (304) being on the plurality of buffer layers; and

[0106] - a shunt layer (306), the shunt layer (306) being located on the superconducting layer (304) and in the groove (110a), the shunt layer being made of a metal such as silver;

[0107] Wherein, the grooves are patterned in the buffer layer and the superconducting layer.

[0108] Example 13. The assembly of Example 12, wherein the plurality of buffer layers comprises:

[0109] - a first buffer layer (301), the first buffer layer (301) being on the structural layer (300), the first buffer layer (301) being, for example, a layer of a material such as aluminum oxide;

[0110] - a second buffer layer (302), the second buffer layer (302) being on the first buffer layer (301), the second buffer layer (302) being, for example, a layer of a material such as yttrium oxide;

[0111] - a third buffer layer (303) located on the second buffer layer (302), the third buffer layer (303) being, for example, a layer of a material such as magnesium oxide.

[0112] Example 14. The assembly of any of Examples 11 to 13, wherein the stack includes a silver layer (305) disposed on the superconducting layer (304).

[0113] Example 15. A component as described in any of Examples 12 or 14, wherein the stack includes a repeating portion layer (308), the repeating portion layer (308) being located below the shunt layer (306), the repeating portion layer being made of repetitions of the buffer layer and the superconducting layer and in some cases the silver layer, preferably being made of multiple repetitions, for example between 4 and 80 repetitions, wherein the grooves are patterned in the buffer layer, the superconducting layer and the repeating portion layer.

[0114] Example 16. A component as described in any one of claims 12 or 15, wherein the stack includes another superconducting layer (310), the other superconducting layer (310) is preferably a non-perforated and non-grooved layer, the other superconducting layer (310) is located on the shunt layer (306), and the other superconducting layer includes, for example, a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide.

[0115] Example 17. The assembly of any one of Examples 11 to 16 in combination with Example 8 or 9, wherein the channel (104a) of the at least one modular coil passes through the structural layer (300).

[0116] Example 18. A component as described in any of Examples 1 to 17, wherein at least one of the modular coils includes a first part (600a) and a second part (600b), and the first part and the second part are suitable for being connected together, for example, the first part includes a connecting seam (610) and the second part includes a receiving cavity (612), and the receiving cavity is suitable for engaging the connecting seam.

[0117] Example 19. A component as described in any of Examples 1 to 18, wherein at least one of the modular coils and, for example, each of the first and second parts of the modular coil are formed by at least two walls assembled together, the at least two walls being, for example, two or three walls.

[0118] Example 20. A component as described in Example 19 in combination with Example 18, wherein each of the first part and the second part is formed by a first wall (602a, 602b), a second wall (604a, 604b) and a third wall (606a, 606b), the second wall being between the first wall and the third wall; and wherein the first wall (602a) of the first part (600a) is suitable for forming a continuous first wall pairing with the first wall (602b) of the second part (600b), the second wall (604a) of the first part (600a) is suitable for forming a continuous second wall pairing with the second wall (604b) of the second part (600b), and the third wall (606a) of the first part (600a) is suitable for forming a continuous third wall pairing with the third wall (606b) of the second part (600b), for example, one of the wall pairs has a current limiting pattern different from that of the other wall pairing.

[0119] Example 21. A component as described in any of Examples 1 to 20, wherein the modular coil (401) forms a magnetic chamber (400).

[0120] Example 22. A modular coil (100a, 100b), wherein the modular coil (100a, 100b) is suitable for use in the assembly of any one of Examples 1 to 21.

[0121] Example 23. A method for manufacturing the modular coil (100a, 100b) of Example 22, the method comprising:

[0122] - providing a structural layer (300);

[0123] - forming a plurality of buffer layers, wherein the plurality of buffer layers are located on the structural layer;

[0124] - depositing a superconducting layer (304) on the plurality of buffer layers, for example by metal organic chemical vapor deposition;

[0125] - removing material from at least the superconducting layer, for example using laser patterning techniques, to form recesses (110a); and

[0126] - depositing a layer of metal on said superconducting layer, comprising: filling said grooves with said metal, such as silver, to form a shunt layer (306).

[0127] Example 24. The method of Example 23 further includes:

[0128] - forming a silver layer (305) on the superconducting layer (304).

[0129] Example 25. The method of Example 23 or 24, further comprising:

[0130] - before forming the grooves and forming the shunt layer (306), repeating the buffer layer, the superconducting layer and in some cases the silver layer, preferably a plurality of times, for example between 4 and 80 repetitions.

[0131] Example 26. The method of any one of Examples 23 to 25, wherein forming the plurality of buffer layers comprises:

[0132] - sputtering a first buffer layer (301) on the structural layer (300), the first buffer layer (301) being, for example, a layer of a material such as aluminum oxide;

[0133] - sputtering a second buffer layer (302) on the first buffer layer (301), the second buffer layer (302) being, for example, a layer of a material such as yttrium oxide;

[0134] - depositing a third buffer layer (303) on said second buffer layer (302), for example by metal organic chemical vapor deposition or ion beam assisted deposition, said third buffer layer (303) being for example a layer of a material such as magnesium oxide.

[0135] Example 27. The method of any one of Examples 22 to 26, further comprising:

[0136] - depositing a further superconducting layer (310) on the shunt layer (306), the further superconducting layer (310) preferably being a non-perforated and non-grooved layer, the further superconducting layer (310) comprising a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide, for example.

[0137] Various embodiments and variations have been described. Those skilled in the art will appreciate that the specific features of these embodiments can be combined, and that other variations will readily occur to those skilled in the art.

[0138] Finally, actual implementation of the embodiments and variations described herein is within the capabilities of those skilled in the art based on the functional description provided above.

[0139] List of acronyms:

[0140] MRI (Magnetic Resonance Imaging)

[0141] MOCVD Metal-organic chemical vapor deposition

[0142] IBAD (Ion beam assisted deposition)

[0143] REBCO Rare-earth barium copper oxide

[0144] YBCO yttrium barium copper oxide (Yttrium barium copper oxide).

Claims

1. An assembly comprising a plurality of modular coils (100a, 100b; 401), the plurality of modular coils (100a, 100b; 401) being mechanically and electrically connected together, wherein: Each modular coil comprises a groove (110a, 110b), the groove (110a, 110b) dividing the modular coil into at least two different conductive areas; wherein at least one of the modular coils is configured to have superconducting properties and is configured as a stack formed of different materials, the stack comprising at least a superconducting layer (304), the superconducting layer (304) comprising a superconducting material, wherein the groove of the modular coil is patterned at least in the superconducting layer.

2. The assembly according to claim 1, wherein The plurality of modular coils include at least a first modular coil (100a) and a second modular coil (100b), wherein the first modular coil (100a) has a first groove (110a), and the second modular coil (100b) is connected to the first modular coil and has a second groove (110b), wherein the first groove and the second groove are suitable for forming a continuous groove (110; 210), and the continuous groove (110; 210) divides the connected first modular coil and the second modular coil into at least two different conductive areas.

3. The assembly according to claim 1 or 2, wherein: The grooves (110a, 110b, 110; 210) are adapted to direct current flow through the connected modular coils in a particular direction so as to generate a magnetic field (202a; 202b; 500) that is at least partially confined within the assembly.

4. The assembly according to any one of claims 1 to 3, wherein: The shape of the grooves (110a, 110b, 110; 210) of at least one of the modular coils determines the current configuration for passing through the modular coil and thus determines the shape of the magnetic field (202a; 202b) formed when current flows.

5. The assembly according to any one of claims 1 to 4, wherein: The groove (110a, 110b, 110; 210) of at least one of the modular coils contains a metal such as silver.

6. An assembly according to any one of claims 1 to 5, wherein: The plurality of modular coils include a first modular coil (100a) having a first connection mechanism (102a) such as a flange, and a second modular coil (100b) having a second connection mechanism (102b) such as a flange, wherein the second connection mechanism (102b) is suitable for being coupled to the first connection mechanism (102a), preferably connected to the first connection mechanism (102a).

7. The assembly according to claim 6, wherein: Each linking mechanism is further adapted to provide an electrical connection between the first modular coil and the second modular coil.

8. An assembly according to any one of claims 1 to 7, wherein At least one of the modular coils (100a, 100b; 401) comprises a channel (104a, 104b), for example to enable a cooling fluid such as nitrogen or helium to flow through the modular coil.

9. The assembly according to claim 8, wherein: The plurality of modular coils include a first modular coil (100a) having a first channel (104a) and a second modular coil (100b) coupled to the first modular coil and having a second channel (104b) adapted to be coupled to the first channel (104a) to form a single channel passing through the coupled first and second modular coils.

10. An assembly according to any one of claims 1 to 9, wherein The superconducting material is yttrium barium copper oxide or rare earth barium copper oxide.

11. An assembly according to any one of claims 1 to 10, wherein The stack comprises: a structural layer (300), which for example consists of or is covered by a material such as Hastelloy; - a plurality of buffer layers, the plurality of buffer layers being located on the structural layer; - the superconducting layer (304), the superconducting layer (304) being located on the plurality of buffer layers; Wherein, the grooves are patterned in the buffer layer and the superconducting layer.

12. An assembly according to any one of claims 1 to 11, wherein The stack includes a silver layer (305) on the superconducting layer (304).

13. An assembly according to claim 11 or 12, wherein: The stack further comprises: - a shunt layer (306) located on the superconducting layer (304) and in the groove (110a), the shunt layer being made of a metal such as silver.

14. The assembly of claim 13, wherein: The stack comprises a repeating portion layer (308) below the shunt layer (306), the repeating portion layer being made of repetitions of the buffer layer and the superconducting layer and in some cases the silver layer, preferably of a plurality of repetitions, for example between 4 and 80 repetitions, wherein the grooves are patterned in the buffer layer, the superconducting layer and the repeating portion layer.

15. An assembly according to claim 13 or 14, wherein The stack comprises a further superconducting layer (310), which is preferably a non-perforated and non-grooved layer, on the shunt layer (306), the further superconducting layer comprising, for example, a superconducting material such as yttrium barium copper oxide or rare earth barium copper oxide.

16. An assembly according to any one of claims 11 to 15 when appended to claim 8 or 9, wherein The passage (104a) of the at least one modular coil passes through the structural layer (300).

17. An assembly according to any one of claims 1 to 16, wherein At least one of the modular coils includes a first portion (600a) and a second portion (600b), wherein the first portion and the second portion are adapted to be coupled together, for example, the first portion includes a connecting seam (610) and the second portion includes a receiving cavity (612), wherein the receiving cavity (612) is adapted to engage the connecting seam.

18. An assembly according to any one of claims 1 to 17, wherein At least one of the modular coils and for example each of the first part and the second part of the modular coil is formed by at least two walls, for example two or three walls, assembled together.

19. An assembly according to any one of claims 1 to 18, wherein The modular coil (401) forms a magnetic chamber (400).

20. A modular coil (100a, 100b) suitable for use in an assembly according to any one of claims 1 to 19.

Images