Electronic device

Abstract

The present disclosure relates to an electronic device capable of more appropriately configuring components. Provided is an electronic device provided with: a main substrate disposed in a second space on a different side from a first space on the side in which a battery unit is disposed in a case; a first antenna unit for performing communication using millimeter waves; and a vibration unit that vibrates the housing, in which the first antenna unit is disposed linearly in a first direction on the same plane as the main substrate in the second space, and in which the first antenna unit, the vibration unit, and other members other than the first antenna unit and the vibration unit are disposed side by side in a second direction orthogonal to the first direction. The present disclosure can be applied to, for example, an internal structure of a smartphone.

Description

Technical Field

[0001] The present disclosure relates to electronic devices, and more particularly, to electronic devices capable of more appropriately configuring components. Background Art

[0002] In recent years, various studies have been conducted on the fifth generation mobile communication system (5G). For example, in this mobile communication system, communication using wireless signals at frequencies called millimeter waves such as 28 GHz or 39 GHz (hereinafter also referred to as "millimeter waves") can be used (for example, see Patent Document 1).

[0003] Compared with ultrashort waves, millimeter waves can transmit more information, but on the other hand, they have high straightness and a narrow angular range of communication. Therefore, electronic devices that communicate using millimeter waves sometimes carry multiple millimeter wave antenna modules to respond to multiple directions.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application No. 2020-519082 Summary of the invention

[0007] Technical issues to be solved by the invention

[0008] A large number of components including a plurality of millimeter-wave antenna modules need to be arranged in a housing of an electronic device that performs communications using millimeter waves. However, since the space available for arrangement is limited, it is required to arrange the components appropriately.

[0009] The present disclosure has been made in view of such circumstances and enables components to be arranged more appropriately.

[0010] Technical solutions for solving technical problems

[0011] An electronic device according to one aspect of the present disclosure is an electronic device comprising: a main substrate arranged in a second space, the second space being a space on a different side of a shell from a first space on a side where a battery unit is arranged; a first antenna unit for communicating using millimeter waves; and a vibration unit for vibrating the shell, wherein the first antenna unit is arranged linearly along a first direction on the same plane as the main substrate in the second space, and in the second space, the first antenna unit, the vibration unit and other components except the first antenna unit and the vibration unit are arranged in a second direction orthogonal to the first direction.

[0012] In an electronic device according to one aspect of the present disclosure, there is provided: a main substrate arranged in a second space, which is a space on a different side of a housing than a first space on a side where a battery unit is arranged; a first antenna unit for communication using millimeter waves; and a vibration unit for vibrating the housing. In addition, the first antenna unit is arranged linearly along a first direction on the same plane as the main substrate in the second space, and in the second space, the first antenna unit, the vibration unit, and other components except the first antenna unit and the vibration unit are arranged in a second direction orthogonal to the first direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A diagram showing an example of the internal structure of an embodiment of an electronic device to which the present disclosure is applied.

[0014] Figure 2 To show Figure 1 A diagram showing a detailed configuration example of the upper space of the internal structure of an electronic device.

[0015] Figure 3 To show Figure 2 A diagram showing an example of a cross-sectional structure of the vibrating portion and its surrounding area.

[0016] Figure 4 To show Figure 2 FIG. 1 is a diagram showing an example of a cross-sectional structure of an audio jack.

[0017] Figure 5 A diagram for explaining positioning in the XY directions in the upper space.

[0018] Figure 6 A diagram for explaining positioning in the Z direction in the upper space.

[0019] Figure 7 A diagram for explaining details of positioning of the vibration unit in the XY directions.

[0020] Figure 8 A diagram for explaining details of positioning of the vibration unit and the front camera in the Z direction.

[0021] Fig. 9 This is a diagram showing an example of arrangement of heat sinks in the upper space.

[0022] Fig.10 To show Figure 2 A diagram showing an example of a cross-sectional structure in the X direction including a rear camera and a millimeter wave antenna unit.

[0023] Reference numerals

[0024] 10: electronic device; 101: main substrate; 102: battery unit; 103: display; 111 to 113: rear camera; 114: ranging sensor; 121R, 121S: millimeter wave antenna unit; 122: vibration unit; 123: front camera; 124: top speaker; 125: audio jack; 126: connector; 131, 132: flexible substrate; 151: main housing; 152: frame rear; 153, 154, 157: buffer member; 155, 156: tape; 161: screw; 181: heat sink DETAILED DESCRIPTION

[0025] <Internal structure of the device>

[0026] Figure 1 A diagram showing an example of the internal structure of an embodiment of an electronic device to which the present disclosure is applied.

[0027] exist Figure 1 In the embodiment, the electronic device 10 is an electronic device such as a smart phone. When the surface on which the display is provided among the outer surfaces of the electronic device 10 is referred to as the "front surface" and the surface on the opposite side to the front surface is referred to as the "back surface", Figure 1 The structure inside the housing is shown when the back side components such as the frame back are removed and viewed from the back side.

[0028] like Figure 1 As shown, a main substrate 101 electrically connected to each part and a battery part 102 for supplying power to each part are arranged in the housing of the electronic device 10. When the surface on the upper end side relative to the front surface and the back surface among the outer surfaces constituting the electronic device 10 is called the "upper surface", and the surface on the lower end side is called the "lower surface", the main substrate 101 is arranged in the space on the upper surface side of the housing (hereinafter also referred to as the upper space), and the battery part 102 is arranged in the space on the lower surface side of the housing that is closer to the upper space (hereinafter also referred to as the lower space). In other words, the upper space can also be called the space on the upper half side of the electronic device 10, and the lower space can also be called the space on the lower half side of the electronic device 10.

[0029] Various components such as rear cameras 111 to 113, a ranging sensor 114, millimeter wave antenna units 121R, 121S, a vibration unit 122, a front camera 123, a top speaker 124 and an audio jack 125 are arranged in the upper space within the shell and connected to the main substrate 101.

[0030] The rear cameras 111 to 113 are cameras disposed on the back of the device 10. The rear cameras 111 to 113 are used to capture still images or dynamic images. For example, the rear camera 111 is composed of an ultra-wide-angle camera, the rear camera 112 is composed of a wide-angle camera, and the rear camera 113 is composed of a telephoto camera. The distance sensor 114 is a sensor disposed on the back of the electronic device 10. For example, the distance sensor 114 is composed of a ToF (Time of Flight) sensor.

[0031] The millimeter wave antenna unit 121R and the millimeter wave antenna unit 121S are respectively composed of a millimeter wave module (millimeter wave antenna module) including an antenna for communication using millimeter waves (MMW: Millimeter Wave). The millimeter wave antenna unit 121R is arranged on the back of the electronic device 10. When the lateral surface relative to the front surface and the back surface among the outer surfaces constituting the electronic device 10 is called the "side surface", the millimeter wave antenna unit 121S is arranged on the side surface of the electronic device 10 (the left side surface when the back surface is used as the reference surface). In the electronic device 10, by providing a plurality of millimeter wave antennas arranged in a linear shape in a predetermined direction, the reception sensitivity of communication using millimeter waves is improved.

[0032] The vibration unit 122 vibrates (the housing of) the electronic device 10 . The vibration unit 122 is formed of a linear resonant actuator (LRA). The vibration unit 122 vibrates the housing, thereby being able to notify the user of an incoming call, a notification, and the like.

[0033] The front camera 123 is a camera provided on the front surface of the electronic device 10. A user using the electronic device 10 can take a picture of himself / herself using the front camera 123.

[0034] The ceiling speaker 124 is a speaker provided on the upper surface side of the electronic device 10. The ceiling speaker 124 outputs the sound when reproducing content such as music or moving images, the ringing sound, the voice of the other party during a call, and the like.

[0035] The audio jack 125 is a jack into which a plug at the tip of a cable connected to earphones or headphones is inserted. Sound of content such as music or moving images reproduced by the electronic device 10 is output from earphones or the like via a cable.

[0036] Various components such as a connector 126 are arranged in the lower space of the housing. External cards such as a SIM (Subscriber Identity Module) card and a memory card are installed in the card tray and connected through the connector 126. The connector 126 can connect one or more external cards. Thus, in the electronic device 10, data from an external card can be read or data can be written to an external card.

[0037] In the electronic device 10, by arranging the connector 126 in the lower space of the housing, the vibration unit 122 can be arranged in the upper space. Figure 1 The internal structure shown in FIG. 1 is different from the internal structure shown in FIG. 1 , assuming the following structure: in the case of the electronic device 10, the connector 126 is mounted on the main substrate 101 and arranged in the upper space. Due to the relationship of the arrangement space, the vibration part 122 is arranged in the lower space instead of the upper space. On the other hand, in Figure 1 In the internal structure shown, in order to maximize the mounting area of ​​the main substrate 101 , the connector 126 is moved to the lower space and the shape of the vibration part 122 is made appropriate, so that the vibration part 122 can be arranged in the upper space.

[0038] <Components Configuration in Upper Space>

[0039] Figure 2 To show Figure 1 FIG. 1 is a diagram showing a detailed configuration example of the upper space of the internal structure of the electronic device 10 .

[0040] like Figure 2 As shown, in the upper space, the millimeter wave antenna portion 121R, the vibration portion 122, the front camera 123, the top speaker 124, and the audio jack 125 are centrally arranged at predetermined intervals, thereby being densely arranged.

[0041] Here, by arranging the vibration unit 122 and the front camera 123 along the Y direction (vertical direction in the figure), the sizes of the vibration unit 122, the front camera 123, the top speaker 124 and the audio jack 125 in the Y direction are substantially the same, thereby realizing the centralized arrangement of the above five components. The above five components are the millimeter wave antenna unit 121R, the vibration unit 122, the front camera 123, the top speaker 124 and the audio jack 125.

[0042] When the vibration part 122 and the front camera 123 are arranged in the Y direction, the flexible substrate (FPC: Flexible Printed Circuits) 131 of the front camera 123 is connected to the main substrate 101 through the top surface of the vibration part 122. The flexible substrate 131 has a substantially L-shape (inverted L-shape) extending from the Y direction to the X direction, and is connected to the main substrate 101 near the vibration part 122 (on the left side in the figure).

[0043] By making the flexible substrate 131 substantially L-shaped and connecting near the vibration part 122, the components can be densely arranged. In particular, the vibration part 122 can be arranged close to the front camera 123. In order to maximize the distance between the vibration part 122 and the front camera 123, it is preferable to make the embedding angle of the front camera 123 larger.

[0044] In addition, when the millimeter wave antenna unit 121R is arranged, the flexible substrate 131 is formed into a substantially L-shaped shape, so that the position of the millimeter wave antenna unit 121R can be as close to the vibration unit 122 as possible. In addition, if the flexible substrate 131 passes over the top surface of the millimeter wave antenna unit 121R, the performance of the communication using the millimeter wave will be affected. Therefore, the shape of the flexible substrate 131 is formed to avoid the millimeter wave antenna unit 121R.

[0045] In addition, as Figure 1 The internal structure shown in FIG. 1 is different from the internal structure shown in FIG. 1 , and the following structure is assumed: in the case of adopting a structure in which the vibration unit 122 is arranged in the lower space instead of the upper space, the flexible substrate 131 of the front camera 123 is connected to the main substrate 101 straightly at the shortest distance. However, if this connection structure is also adopted in the case of a structure in which the vibration unit 122 is arranged in the upper space, the above structure cannot be achieved. Figure 2 The shown arrangement makes the components dense.

[0046] Figure 3 To show Figure 2 FIG. 1 is a diagram showing an example of a cross-sectional structure of the vibrating portion 122 and its surroundings. Figure 3 As shown, the main housing 151, the main substrate 101 and the frame back 152 are stacked and fixed by screws 161. The main substrate 101, the main housing 151 and the frame back 152 each have a predetermined shape, and a space is formed in the housing by stacking them, and the vibration part 122 is fixed in the space. The frame back 152 is configured as a part of the housing.

[0047] On the top surface of the vibration part 122, through which the flexible substrate 131 of the front camera 123 passes, the buffer member 153 and the buffer member 154 are provided to sandwich a portion of the substantially L-shaped flexible substrate 131. The buffer member 153 is composed of a buffer material or the like attached to the vibration part 122. The buffer member 154 is composed of a buffer material or the like attached to the frame back 152.

[0048] By sandwiching the flexible substrate 131 in the Z direction by the buffer member 153 and the buffer member 154, Figure 2 The structure in which the vibration part 122 and the front camera 123 are arranged in the Y direction can effectively conduct the vibration generated by the vibration part 122 even when the flexible substrate 131 passes through the top surface of the vibration part 122 .

[0049] Figure 4 To show Figure 2 FIG. 1 is a diagram showing an example of a cross-sectional structure of an audio jack 125. Figure 4 As shown, the flexible substrate 132 of the audio jack 125 is connected to the front surface side of the main substrate 101.

[0050] By connecting the flexible substrate 132 of the audio jack 125 to the side of the front surface of the main substrate 101 where the display 103 is provided, rather than to the back surface, it is possible to increase the space available for arranging components on the back side of the main substrate 101. As a result, it is possible to ensure the arrangement space of the millimeter wave antenna unit 121R on the back side of the main substrate 101, and the millimeter wave antenna unit 121R can be densely arranged together with the vibration unit 122, the front camera 123, the top speaker 124, and the audio jack 125.

[0051] In addition, as Figure 1 The internal structure shown is different from that shown in the figure. In the case of a structure in which the flexible substrate 132 of the audio jack 125 is connected to the back side of the main substrate 101, sufficient space for configuring the millimeter wave antenna unit 121R cannot be ensured near the audio jack 125 on the back side of the main substrate 101, and components including the millimeter wave antenna unit 121R cannot be densely arranged.

[0052] <Positioning method>

[0053] In the upper space of the housing, when the vibration unit 122 and the front camera 123 are arranged in the Y direction, the following method is used to determine the Figure 5 The configuration positions in the X and Y directions shown in FIG. Figure 6 The configuration position in the Z direction is shown.

[0054] That is, Figure 5As shown in FIG. 1 , the positions in the X direction are determined as follows: starting from the right side with the back side as the reference plane, the outer shape of the main substrate 101 and the audio jack 125 are arranged, followed by the vibration part 122 and the front camera 123 arranged in the Y direction. In the Y direction, the position of the front camera 123 is determined according to the embedding space. Here, Figure 7 As shown, the outer peripheral portion and the terminal portion of the vibration portion 122 are surrounded and fixed by the protrusions 151a to 151e of the main housing 151.

[0055] In addition, if Figure 8 As shown, the following structure is formed in the Z direction: the vibration part 122 is attached to the main housing 151 with the tape 155, and then pressed by the frame back 152. As described above, the following structure is formed: on the top surface of the vibration part 122, the flexible substrate 131 of the front camera 123 passes through the top surface, and in the Z direction, it is buffered and pressed by the buffer member 153 and the buffer member 154. In addition, the buffer member 154 is attached to the frame back 152 with the tape 156. The front camera 123 is fixed to the frame back 152 via the buffer member 157 such as a pad.

[0056] <Configuration of Heat Dissipation Components>

[0057] like Figure 1 , Figure 2 As shown, in the electronic device 10, the following structure is provided: in the upper space inside the housing, the rear cameras 111 to 113 and the distance measuring sensor 114 arranged in a row on the back side along the Y direction are arranged adjacent to the millimeter wave antenna unit 121S arranged in a straight line on the left side along the Y direction. These components (modules) generate a large amount of heat, forming a layout in which a large heat source is adjacent, so it is necessary to optimize the heat dissipation structure.

[0058] In the electronic device 10 , a heat sink having a substantially L-shape is provided as a heat dissipation member for transferring heat from the rear cameras 111 to 113 , the distance measuring sensor 114 , and the millimeter wave antenna unit 121S to a heat dissipation component to achieve a more appropriate heat dissipation structure.

[0059] Fig. 9 FIG. 1 is a diagram showing an example of disposition of a heat sink in the upper space of the internal structure of the electronic device 10. Fig. 9 , as the internal structure of the electronic device 10, the position where the heat sink 181 is arranged is shown after the main substrate 101, rear cameras 111 to 113, ranging sensor 114, and millimeter wave antenna unit 121S are removed. As shown in the area with dot patterns in the figure, a heat sink 181 is arranged in a roughly L-shaped shape from the left side to the bottom surface in the housing. The bottom surface here is the side where the main substrate 101, rear cameras 111 to 113, ranging sensor 114 and other components are arranged.

[0060] Fig.10 To show Figure 1 , Figure 2 FIG. 1 is a diagram showing an example of a cross-sectional structure in the X direction including the rear camera 112 and the millimeter wave antenna unit 121S. Fig.10 As shown, a heat sink 181 having a roughly L-shape is configured for the rear camera 112 arranged on the back side and the millimeter wave antenna unit 121S arranged on the left side. It not only serves as a heat dissipation structure for the millimeter wave antenna unit 121S, but also serves as a heat dissipation structure for the adjacent rear camera 112, thereby completing the heat dissipation structure using one heat sink 181.

[0061] exist Fig.10 In the cross-sectional structure example, a cross-sectional structure example of the rear camera 112 and the millimeter wave antenna unit 121S is shown, as shown in FIG. Fig. 9 As shown, the heat sink 181 is configured not only for the rear camera 112, but also for the rear camera 111 and the ranging sensor 114. That is, the heat sink 181 is not only a heat dissipation structure for the millimeter wave antenna unit 121S, but also serves as a heat dissipation structure for the rear camera 111, the rear camera 112 and the ranging sensor 114. Fig. 9 , Fig.10 In the structure shown, for the rear camera 113, a heat dissipation structure different from the heat dissipation structure using the heat sink 181 is adopted due to its structure. For example, when other cameras are configured as the rear camera 113, they can also be included in the heat dissipation structure using the heat sink 181 depending on the structure of the other cameras.

[0062] In addition, as Figure 1 In the case where the millimeter wave antenna unit 121S is arranged on the side of the lower space instead of the side of the upper space, the millimeter wave antenna unit 121S is arranged adjacent to the battery unit 102 in the lower space, so the size and degree of freedom of arrangement of the battery unit 102 are limited. Figure 1 , Figure 2 , Fig. 9 , Fig.10 As shown, in the electronic device 10, the millimeter wave antenna unit 121S is arranged on the side of the upper space, and together with the adjacent sensor unit such as the rear camera 112, a heat sink 181 is used to effectively deal with the heat, so that the size and configuration freedom of the battery unit 102 can be increased in the lower space. In particular, by making the size of the battery unit 102 larger, its capacity can be increased.

[0063] As described above, in the electronic device 10, there are provided: a main substrate 101, which is arranged in the upper space, which is a space on the side different from the lower space on the side where the battery unit 102 is arranged in the housing; a millimeter wave antenna unit 121R for communication using millimeter waves; a vibration unit 122 for vibrating the housing; and a front camera 123 on the front surface side, the millimeter wave antenna unit 121R is arranged linearly along the X direction on the same plane as the main substrate 101 in the upper space, and in the upper space, the millimeter wave antenna unit 121R, the vibration unit 122, and the front camera 123 are arranged in a row along the Y direction. In addition, in the upper space, the millimeter wave antenna unit 121R, the vibration unit 122, the front camera 123, the top speaker 124, and the audio jack 125 are arranged in a concentrated manner at predetermined intervals.

[0064] That is, in the electronic device 10, in order to maximize the installation area of ​​the main substrate 101, the configuration position of the connector 126 is moved from the main substrate 101 in the upper space to the lower space, etc., so that the millimeter wave antenna unit 121R, the vibration unit 122, the front camera 123, the top speaker 124 and the audio jack 125 are efficiently configured in the upper space. In particular, in the electronic device 10, by adopting a layout in which the vibration unit 122 and the front camera 123 are arranged in the Y direction (vertical direction), it helps to improve the efficiency of the layout. In this way, in the electronic device 10, components can be more appropriately configured.

[0065] <Modification>

[0066] In the above description, a structure is shown in which the millimeter wave antenna unit 121R, the vibration unit 122, and the front camera 123 are arranged in the Y direction in the upper space of the housing in the electronic device 10, but other components may be arranged instead of the front camera 123. That is, in the upper space, the millimeter wave antenna unit 121R, the vibration unit 122, and other components are arranged in the Y direction. The other components include a top speaker 124 or an audio jack 125. Here, when the direction in which the millimeter wave antenna unit 121R is arranged in a straight line is set as the X direction, the Y direction is a direction orthogonal to the X direction.

[0067] The rear cameras 111 to 113 are configured to include image sensors, and thus may also be referred to as sensor units. That is, the rear cameras 111 to 113 and the distance sensor 114 are each an example of a sensor unit, and in the electronic device 10, one or more sensor units may be provided on the back side. When a plurality of sensor units are arranged in the upper space in the housing, a heat sink 181 is arranged for the millimeter wave antenna unit 121S on the left side and for at least a portion of the sensor units.

[0068] Although the vibration unit 122 is described as being composed of a linear resonance actuator (LRA), other systems such as an eccentric motor (ERM: Eccentric Rotating Mass) or a system using a piezoelectric element may be adopted.

[0069] The electronic device 10 is not limited to a smartphone, and may be a small portable device such as a tablet terminal, a mobile phone, a wearable device, a notebook PC, etc. The electronic device 10 may be an independent device or an internal block constituting one device.

[0070] In this specification, "connection" means electrical connection. In addition, "component" means a module (module component) that integrates several components according to function and location, so the "component" recorded in this specification can also be renamed as "module".

[0071] In addition, the embodiments of the present disclosure are not limited to the above-mentioned embodiments, and various changes can be made within the scope of the present disclosure. For example, the "structure of centrally arranging 5 components" described in the title of "Component configuration of upper space" and the "structure of arranging 1 heat sink in an L-shape" described in the title of "Configuration of heat dissipation components" can be implemented in combination as described above, and each structure can also be implemented separately. In addition, the effects described in this specification are only illustrative and non-limiting, and there may be other effects.

[0072] In addition, the present disclosure can adopt the following structures.

[0073] (1) An electronic device having:

[0074] The main substrate is arranged in a second space, which is a space on a different side of the first space on the side where the battery unit is arranged in the housing;

[0075] a first antenna unit for performing communication using millimeter waves; and

[0076] a vibration unit that causes the housing to vibrate,

[0077] The first antenna portion is arranged linearly along the first direction on the same plane as the main substrate in the second space.

[0078] In the second space, the first antenna portion, the vibrating portion, and other members except the first antenna portion and the vibrating portion are arranged side by side in a second direction orthogonal to the first direction.

[0079] (2) The electronic device according to (1), wherein:

[0080] It also has a front-facing camera, speakers, and an audio jack.

[0081] In the second space, on the first surface side of the main substrate, the first antenna portion, the vibration portion, the front camera, the speaker, and the audio jack are arranged concentratedly at predetermined intervals.

[0082] (3) The electronic device according to (2), wherein:

[0083] The other component is the front camera,

[0084] The first antenna unit, the vibration unit, and the front camera are arranged in this order along the second direction and in a direction away from the battery unit.

[0085] (4) The electronic device according to (3), wherein:

[0086] The flexible substrate of the front camera is connected to the main substrate through the top surface of the vibration part.

[0087] (5) The electronic device according to (4), wherein:

[0088] The flexible substrate has a substantially L-shape extending from the second direction toward the first direction on the same plane as the main substrate, and is connected to the main substrate in the vicinity of the vibration portion.

[0089] (6) The electronic device according to (4) or (5), wherein:

[0090] The flexible substrate is sandwiched by the buffer member on the top surface of the vibration portion in a third direction of an axis perpendicular to a plane including the axis in the first direction and the axis in the second direction.

[0091] (7) The electronic device according to (2) or (3), wherein:

[0092] The audio jack is connected to the second surface of the main substrate which is opposite to the first surface.

[0093] (8) The electronic device according to (7), wherein:

[0094] It also has a display.

[0095] The first surface is a surface on the back side,

[0096] The second surface is a surface on the front side where the display is provided.

[0097] (9) The electronic device according to (1), further comprising:

[0098] a second antenna unit for performing communication using millimeter waves; and

[0099] One or more sensor units,

[0100] The second antenna unit is disposed on a side surface of the housing in the second space.

[0101] The sensor unit is arranged on a third surface which is a surface on the side where the main substrate is arranged in the second space.

[0102] A heat dissipation member that transfers heat from the second antenna unit and the sensor unit is provided.

[0103] (10) The electronic device according to (9), wherein:

[0104] The heat dissipation member is a heat dissipation fin having a substantially L-shape and is disposed from the side surface of the housing to the third surface.

[0105] (11) The electronic device according to (10), wherein:

[0106] When a plurality of the sensor units are arranged, the heat sink is arranged for at least a part of the sensor units.

[0107] (12) The electronic device according to any one of (9) to (11), wherein:

[0108] The sensor unit is a rear camera or a distance measuring sensor.

[0109] (13) The electronic device according to (1), wherein:

[0110] The second space is a space on the upper end side of the housing.

[0111] The first space is a space located closer to the lower end portion of the housing than the second space.

[0112] (14) The electronic device according to (13), wherein:

[0113] It also has connectors for connecting one or more external cards.

[0114] The connector is disposed at one side of the first space.

Claims

1. An electronic device comprising: The main substrate is arranged in a second space, which is a space on a different side of the first space on the side where the battery unit is arranged in the housing; a first antenna unit for performing communication using millimeter waves; and a vibration unit that causes the housing to vibrate, in, The first antenna portion is arranged linearly along a first direction on the same plane as the main substrate in the second space. In the second space, the first antenna portion, the vibrating portion, and other members except the first antenna portion and the vibrating portion are arranged side by side in a second direction orthogonal to the first direction.

2. The electronic device according to claim 1, wherein: It also has a front-facing camera, speakers, and an audio jack. In the second space, on the first surface side of the main substrate, the first antenna portion, the vibration portion, the front camera, the speaker, and the audio jack are arranged concentratedly at predetermined intervals.

3. The electronic device according to claim 2, wherein: The other component is the front camera, The first antenna unit, the vibration unit, and the front camera are arranged in this order along the second direction and in a direction away from the battery unit.

4. The electronic device according to claim 3, wherein: The flexible substrate of the front camera is connected to the main substrate through the top surface of the vibration part.

5. The electronic device according to claim 4, wherein: The flexible substrate has a substantially L-shape extending from the second direction toward the first direction on the same plane as the main substrate, and is connected to the main substrate in the vicinity of the vibration portion.

6. The electronic device according to claim 4, wherein: The flexible substrate is sandwiched by the buffer member on the top surface of the vibration portion in a third direction of an axis perpendicular to a plane including the axis in the first direction and the axis in the second direction.

7. The electronic device according to claim 3, wherein: The audio jack is connected to the second surface of the main substrate which is opposite to the first surface.

8. The electronic device according to claim 7, wherein: It also has a display. The first surface is a surface on the back side, The second surface is a surface on the front side where the display is provided.

9. The electronic device according to claim 1, further comprising: a second antenna unit for performing communication using millimeter waves; and One or more sensor units, in, The second antenna unit is arranged on a side surface of the housing in the second space. The sensor unit is arranged on a third surface which is a surface on the side where the main substrate is arranged in the second space. A heat dissipation member that transfers heat from the second antenna unit and the sensor unit is provided.

10. The electronic device according to claim 9, wherein: The heat dissipation member is a heat dissipation fin having a substantially L-shape and is disposed from the side surface of the housing to the third surface.

11. The electronic device according to claim 10, wherein: When a plurality of the sensor units are arranged, the heat sink is arranged for at least a part of the sensor units.

12. The electronic device according to claim 11, wherein: The sensor unit is a rear camera or a distance measuring sensor.

13. The electronic device according to claim 1, wherein: The second space is a space on the upper end side of the housing. The first space is a space located closer to the lower end portion of the housing than the second space.

14. The electronic device according to claim 13, wherein: It also has connectors for connecting one or more external cards. The connector is disposed at one side of the first space.

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