Electronic equipment, display screen assembly and forming method of display screen assembly

Abstract

The invention relates to the technical field of terminals, and discloses electronic equipment, a display screen assembly and a forming method of the display screen assembly. The display screen assembly comprises a base body layer, a film layer structure and a filling part, and the transmittance of a visible light wave band corresponding to the filling part is the same as or similar to the transmittance of a visible light wave band corresponding to the film layer structure. And the substrate layer and the film layer structure are arranged in an overlapping manner. One side, back to the base body layer, of the film layer structure is provided with a filling space sunken towards the film layer structure. The filling part is filled in the filling space. According to the display screen assembly, the filling space in the display screen assembly is filled with the filling part of which the transmittance of the visible light wave band is the same as or similar to that of the film layer structure, so that the size of the filling space is reduced, the visual effect of the filling space is weakened, the problems of white spots and bright spots in the display screen assembly are effectively solved, and the appearance reject ratio of the display screen assembly is reduced; and the appearance yield of the display screen assembly is effectively improved.

Description

Technical Field

[0001] The present application relates to the field of terminal technology, and in particular to an electronic device, a display screen assembly, and a molding method of the display screen assembly. Background Art

[0002] At present, electronic devices have become an indispensable tool in people's daily life. The aesthetics of the appearance of electronic devices is an important indicator for people to choose device models. In order to improve the aesthetics of the appearance of electronic devices, the design of the housing in the electronic devices is particularly important. The following will take the housing of a mobile phone as an example for description.

[0003] Figure 1 Exploded views of some mobile phones 1 are shown. Figure 1 As shown, the housing 10 of the mobile phone 1 includes a display assembly 11, a middle frame 12 and a rear shell 13. The display assembly 11 and the rear shell 13 are respectively located on opposite sides of the middle frame 12. In the assembled state, the display assembly 11, the middle frame 12 and the rear shell 13 together form a receiving cavity, and the receiving cavity is used to install functional modules such as a camera module, an audio module and a power module. The following will take how to improve the aesthetic appearance of the display assembly 11 of the housing as an example to describe.

[0004] In some technical solutions, in order to improve the aesthetic appearance of the display screen assembly 11, the base layer (not shown) in the display screen assembly 11 is made of glass material to improve the optical performance of the display screen assembly 11. However, without a protective film, visible scratches will appear on the base layer in a short period of time (e.g., one month), and the scratches will gradually increase with the extension of the use time. These scratches will affect the aesthetics of the display screen assembly 11, and further affect the aesthetics of the appearance of the electronic device.

[0005] Based on this, how to reasonably design the housing of the electronic device to improve the aesthetics of the appearance of the electronic device has become a technical problem to be solved urgently in this field. Summary of the invention

[0006] Based on this, the present application provides an electronic device, a display screen assembly and a molding method of a display screen assembly. The display screen assembly includes a base layer, a film layer structure and a filling portion, and the transmittance of the visible light band corresponding to the filling portion is the same as or similar to the transmittance of the visible light band corresponding to the film layer structure. The base layer and the film layer structure are arranged in a superimposed manner. The side of the film layer structure facing away from the base layer has a filling space that is recessed toward the film layer structure. The filling portion is filled in the filling space. In the above-mentioned display screen assembly, by filling the filling space in the display screen assembly with a filling portion whose transmittance of the visible light band is the same as or similar to that of the film layer structure, the size of the filling space is reduced, the visual effect of the filling space is weakened, the white spots and bright spots in the display screen assembly are effectively improved, the appearance defect rate of the display screen assembly is reduced, and the appearance yield rate of the display screen assembly is effectively improved.

[0007] The first aspect of the present application provides a display screen assembly, which includes a base layer, a film layer structure and a filling part. The film layer structure is superimposed on one side surface of the base layer. The transmittance of the visible light band corresponding to the film layer structure is greater than a preset transmittance threshold. The film layer structure has a filling space recessed toward the film layer structure on a side surface facing away from the base layer. The filling part is filled in the filling space, and the transmittance of the visible light band corresponding to the filling part is the same as or similar to the transmittance of the visible light band corresponding to the film layer structure.

[0008] The wavelength range of the visible light band is 380nm to 740nm. The transmittance of the visible light band refers to the ability of the light in the visible light band to pass through the medium, which can be characterized by the percentage of the light flux passing through the medium to the light flux incident on the medium. The higher the transmittance, the stronger the ability of the light to pass through the medium. Conversely, the lower the transmittance, the weaker the ability of the light to pass through the medium.

[0009] It can be understood that the transmittance of the visible light band corresponding to the filling part is similar to the transmittance of the visible light band corresponding to the film layer structure, and it can be that the difference between the transmittance of the visible light band corresponding to the filling part and the transmittance of the visible light band corresponding to the film layer structure is less than the preset difference threshold. Alternatively, it can also be that the ratio between the transmittance of the visible light band corresponding to the filling part and the transmittance of the visible light band corresponding to the film layer structure is close to 1. When the film layer structure is a multi-layer structure, the transmittance of the visible light band corresponding to the film layer structure refers to the transmittance of the corresponding visible light band after the multi-layer structure is taken as a whole.

[0010] In some possible implementations of the first aspect above, the preset transmittance threshold may be any one of 50%, 60%, 70%, 80%, 85%, 86%, 87%, 87.5%, 88%, 88.5%, 89%, 89.5%, 90%, 90.5% and 91%, and the present application does not make any specific limitation on this.

[0011] In the above-mentioned display screen assembly, the transmittance of the visible light band corresponding to the film layer structure is greater than the preset transmittance threshold, that is, the film layer structure has a certain transparency, that is, light can be transmitted from one side of the substrate layer through the film layer structure toward the direction opposite to the substrate layer, or external light can be transmitted from the side of the film layer structure opposite to the substrate layer through the film layer structure toward the substrate layer. Based on this, the present application can reduce or eliminate the concave points (that is, the filling space) in the display screen assembly by filling a filling part in the filling space, and the transmittance of the visible light band corresponding to the filling part is the same or similar to the transmittance of the visible light band corresponding to the film layer structure, weaken the interface at the concave points, effectively improve the transmission path of light at the concave points in the film layer structure, reduce the diffuse reflection and scattering of light on the interface, and then weaken the visual effect at the concave points, effectively improve the white point and bright point problems of the display screen assembly, reduce the appearance defect rate of the display screen assembly, and increase the appearance yield rate of the display screen assembly to more than 90%.

[0012] In addition, the technical solution in this application can also be applied to other components exposed to the outside of the electronic device. For example, the technical solution in this application can also be applied to components such as the middle frame and the back cover. The following will continue to describe the display assembly as an example. The film layer structure can be a hardening layer or a buffer layer in the display assembly, and this application does not specifically limit this.

[0013] In some embodiments of the present application, the refractive index (index of refraction, IOR) of the film structure ranges from 1.5 to 1.7. The refractive index of the filling portion is the same as or similar to the refractive index of the film structure. The refractive index refers to the ratio of the angle of incidence to the angle of refraction when light enters from one medium to another. The refractive index describes the ability of light to be refracted by a medium. The larger the value, the greater the degree of refraction of the light by the medium. Conversely, the smaller the value, the smaller the degree of refraction of the light by the medium.

[0014] It can be understood that the refractive index of the filling part is close to the refractive index of the film structure, and it can be that the difference between the refractive index of the filling part and the refractive index of the film structure is less than a preset difference threshold. Alternatively, it can be that the ratio between the refractive index of the filling part and the refractive index of the film structure is close to 1. When the film structure is a multi-layer structure, the refractive index of the film structure refers to the comprehensive refractive index of the multi-layer structure.

[0015] In some possible implementations of the first aspect, the filling portion partially fills the filling space. In some other alternative implementations, the filling portion completely fills the filling space.

[0016] In some possible implementations of the first aspect, the thickness of the film layer structure ranges from 0 to 20 μm, wherein the thickness refers to the size of the component in the overlapping direction of the film layer structure and the substrate layer, which will not be elaborated below.

[0017] In some possible implementations of the first aspect, the film layer structure includes a first sublayer, a second sublayer, and a third sublayer. The first sublayer is superimposed on the first substrate surface of the substrate layer. The second sublayer is superimposed on the surface of the first sublayer on the side facing away from the substrate layer. The third sublayer is superimposed on the surface of the second sublayer on the side facing away from the first sublayer.

[0018] In some implementations, the filling space extends to the third sublayer. In some alternative implementations, the filling space extends through the third sublayer to the second sublayer. In some other alternative implementations, the filling space extends through the third sublayer and the second sublayer to the first sublayer.

[0019] In some possible implementations of the first aspect, the thickness of the first sub-layer ranges from 0 to 200 nm, wherein the thickness direction refers to the overlapping direction of the substrate layer and the film layer structure.

[0020] In some possible implementations of the first aspect, the thickness of the second sublayer ranges from 0 to 20 μm.

[0021] In some possible implementations of the first aspect, the thickness of the third sublayer ranges from 0 to 500 nm.

[0022] In some possible implementations of the first aspect, the refractive index of the filling portion ranges from 1.4 to 1.7.

[0023] It can be understood that the above-mentioned film layer structure and the first sublayer, the second sublayer and the third sublayer in the film layer structure are only part of the implementation of the film layer structure in this application, and other film layer structures are also within the protection scope of this application. This application does not specifically limit the thickness of the film layer structure, the specific layers in the film layer structure, the optical properties, mechanical properties and thickness of each layer. Any film layer structure that can achieve the functions of protecting the substrate layer and resisting scratches is within the protection scope of this application, and this application does not specifically limit this.

[0024] In some possible implementations of the first aspect, the filling portion includes a base resin and an additive. In the filling portion, the mass percentage of the base resin ranges from 90% to 100%, and the mass percentage of the additive ranges from 0% to 10%.

[0025] In some possible implementations of the first aspect, the raw material components of the filling part include a base resin and a solvent, the mass percentage of the base resin ranges from 20% to 50%, and the mass percentage of the solvent ranges from 45% to 80%.

[0026] In the above display screen assembly, by reasonably setting the mass percentages of the base resin and the solvent in the raw material component corresponding to the filling part, the fluidity of the raw material component (i.e., the filling material) and the proportion of the base resin in the raw material component can be ensured at the same time. Furthermore, the difficulty of ensuring the application of the raw material component during the application process can be reduced, while ensuring the volume of the filling part after the raw material component is cured, that is, improving the effective filling of the filling space.

[0027] In some possible implementations of the first aspect, the matrix resin includes but is not limited to one or more of polyester resin, acrylic resin, vinyl chloride copolymer resin, vinyl acetate copolymer resin, cellulose derivative resin, polycarbonate resin, polyvinyl butyral resin, epoxy acrylic resin, polyurethane acrylic resin, polysilane acrylic resin, epoxy resin and polyamide resin.

[0028] In some possible implementations of the first aspect, the solvent includes, but is not limited to, one or more of butyl ester, ethyl ester, cyclohexanone, isopropanol, diacetone alcohol, xylene, benzyl alcohol, and methyl isobutyl ketone methyl acrylate.

[0029] In some possible implementations of the first aspect, the raw material components of the filling part also include additives, the mass percentage of the additives ranges from 0% to 5%, and the additives include one or more of a curing agent, a leveling agent, a coupling agent, and a photoinitiator.

[0030] In some possible implementations of the first aspect, the curing agent includes but is not limited to one or more of modified polyester resin, melamine formaldehyde resin, hexamethylene diisocyanate trimer, toluene diisocyanate, diphenylmethane diisocyanate, dicyclohexylmethane diisocyanate and polyetheramine I.

[0031] In some possible implementations of the first aspect, the leveling agent includes, but is not limited to, one or more of an organic silicone leveling agent, a non-silicon leveling agent, and a fluorine-containing leveling agent.

[0032] In some possible implementations of the first aspect, the coupling agent may include, but is not limited to, one or more of γ-aminopropyltriethoxysilane, γ-(2,3-epoxypropyloxy)propyltrimethoxysilane, R-mercaptopropyltriethoxysilane, and isopropyltri(dioctylpyrophosphate)titanate.

[0033] In some possible implementations of the first aspect, the photoinitiator may include, but is not limited to, one or more of alkyl phenones, acylphosphine oxides, benzophenones, thioxanthones, diaryl iodonium salts, triaryl iodonium salts, alkyl iodonium salts, and isopropyl ferrocenium hexafluorophosphate.

[0034] It is understood that the above-mentioned matrix resin is only a partial example of the raw material components of the filling layer in the present application, and does not constitute a specific limitation of the present application. The various components in the filling part can be calibrated by an energy spectrometer or X-ray photoelectron spectroscopy technology.

[0035] In some possible implementations of the first aspect, the material of the base layer includes at least one of glass, ceramic, metal, and plastic. For example, when the housing is a display screen assembly, the material of the base layer may be glass and / or plastic. For another example, when the housing is a middle frame, the material of the base layer may be glass and / or metal. For another example, when the housing is a rear housing, the material of the base layer may be at least one of glass, ceramic, and metal.

[0036] In some possible implementations of the first aspect, a size of the film layer structure in a first direction is greater than 300 nm, wherein the first direction is a superimposed direction of the film layer structure and the substrate layer.

[0037] In the above-mentioned display screen assembly, the greater the thickness of the film layer structure, the higher the probability of the appearance of concave spots, and the higher the probability of the concave spots superimposed in the thickness direction and / or horizontal direction. Therefore, the probability of large-sized concave spots appearing in the display screen assembly is also higher. Based on this, when the thickness of the film layer structure in the display screen assembly is greater than 300nm, the probability of the concave spots causing poor appearance is higher. The technical solution of the display screen assembly in the present application is more suitable for application scenarios where the thickness of the film layer structure is greater than 300nm. At the same time, in this application scenario, the improvement effect of white spots and bright spots caused by concave spots in the display screen assembly is also more obvious.

[0038] In some possible implementations of the first aspect, the display screen assembly further includes a protective layer, which is laminated on the side of the film layer structure and / or the filling portion facing away from the base layer. The protective layer includes but is not limited to at least one of an anti-fingerprint film layer, a tempered film layer, a solid silicone film layer, a liquid silicone film layer, and a nano-adsorption film layer, and the present application does not specifically limit this.

[0039] The above display screen assembly, through the molded protective layer, can prevent fingerprints, dirt and other features from being deposited on the surface of the display screen assembly, further improve the performance of the display screen assembly, and further enhance the user experience.

[0040] In some possible implementations of the first aspect, the thickness of the protective layer ranges from 0 to 80 nm.

[0041] The second aspect of the present application provides a method for forming a display screen assembly, the method comprising forming a film layer structure on a first substrate surface of a substrate layer, wherein a filling space is formed on a surface of the film layer structure facing away from the substrate layer. A filling layer is formed on a side of the film layer structure facing away from the substrate layer, wherein the filling layer at least partially fills the filling space. The filling layer protruding from the first substrate surface is at least partially removed to obtain a filling portion, wherein the filling portion at least partially fills the filling space.

[0042] The molding method of the display screen assembly molds a filling layer on the film layer structure, and removes the filling layer protruding from the film layer structure to obtain a filling part. The filling part fills the concave points on the film layer structure, which can reduce the number of concave points in the display screen assembly, reduce the size of the concave points in the display screen assembly, weaken the visual effect of the concave points, effectively improve the white point and bright point problems, reduce the appearance defect rate of the display screen assembly, and improve the appearance yield rate of the display screen assembly.

[0043] In some possible implementations of the second aspect, the raw material components of the filling layer include a base resin and a solvent, the mass percentage of the base resin ranges from 20% to 50%, and the mass percentage of the solvent ranges from 45% to 80%.

[0044] In some possible implementations of the second aspect, the base resin includes one or more of polyester resin, acrylic resin, vinyl chloride copolymer resin, vinyl acetate copolymer resin, cellulose derivative resin, polycarbonate resin, polyvinyl butyral resin, epoxy acrylic resin, polyurethane acrylic resin, polysilane acrylic resin, epoxy resin and polyamide resin.

[0045] In some possible implementations of the second aspect, the filling layer raw material components further include additives, the mass percentage of the additives ranges from 0% to 5%, and the additives include one or more of a curing agent, a leveling agent, a coupling agent, and a photoinitiator.

[0046] In some possible implementations of the second aspect, the filling layer is formed on the side of the film layer structure facing away from the substrate layer by any one of spraying, flow coating, dip coating, hand coating, sputtering, injection, vapor deposition and electrophoretic deposition.

[0047] In some possible implementations of the second aspect, the filling layer protruding from the surface of the first substrate is at least partially removed by at least one of grinding, polishing, scraping, milling, chemical dissolution, electrochemical removal and pyrolysis.

[0048] In some possible implementations of the second aspect, a size of the filling layer in a first direction ranges from 0 to 20 μm, wherein the first direction is a superimposed direction of the film layer structure and the base layer.

[0049] In some possible implementations of the second aspect, before the film layer structure is formed on the first substrate surface of the substrate layer, the forming method further includes forming a shielding layer on the first substrate surface of the substrate layer to obtain a prefabricated component, wherein the surface energy of the shielding layer is lower than a preset surface energy threshold. The prefabricated component is placed in a coating machine, and the shielding layer in the prefabricated component is removed to expose the first substrate surface of the substrate layer. The shielding layer is composed of low surface energy organic matter and has hydrophobic and oleophobic properties, which can increase the contact angle between impurities in the air and the shielding layer.

[0050] In the molding method of the display screen assembly, by adding a shielding layer, the prefabricated assembly is prevented from chemically adsorbing with impurities, making it easy to remove impurities, thereby reducing the difficulty of removing impurities on the surface of the prefabricated assembly. Therefore, by introducing a shielding layer, the influence of impurities on the coating of the substrate layer can be reduced, and impurities can be effectively prevented from entering the coating machine, and the product yield of the display screen assembly can be increased by more than 30%.

[0051] In some possible implementations of the second aspect, the shielding layer has a thickness ranging from 5 nm to 300 nm.

[0052] In some possible implementations of the second aspect, the material of the shielding layer includes, but is not limited to, one or more of perfluoropolyether, fluorosilanes, and short-chain fluoroether.

[0053] In some possible implementations of the second aspect, the preset surface energy threshold is 30 mJ / m 2 .

[0054] In some possible implementations of the second aspect, after the filling layer is polished to obtain the filling portion, and the filling portion at least partially fills the filling space, the molding method of the above-mentioned display screen assembly also includes molding a protective layer on the side of the film layer structure and / or the filling portion facing away from the base layer.

[0055] The third aspect of the present application provides an electronic device, which includes the display screen assembly of the first aspect and any one of the possible implementations of the first aspect. The electronic device includes but is not limited to mobile phones, tablets, personal computers, electronic watches, electronic bracelets and other electronic devices with display screen assemblies, and the present application does not specifically limit this.

[0056] The fourth aspect of the present application also provides a middle frame, which includes a base layer, a film layer structure and a filling part. The film layer structure is superimposed on one side surface of the base layer. The transmittance of the visible light band corresponding to the film layer structure is greater than 89%. The film layer structure has a filling space recessed toward the film layer structure on the side surface facing away from the base layer. The filling part is filled in the filling space, and the transmittance of the visible light band corresponding to the filling part is the same as or similar to the transmittance of the visible light band corresponding to the film layer structure.

[0057] The fifth aspect of the present application also provides a rear shell, which includes a base layer, a film layer structure and a filling part. The film layer structure is superimposed on one side surface of the base layer. The transmittance of the visible light band corresponding to the film layer structure is greater than 89%. The film layer structure has a filling space recessed toward the film layer structure on the side surface facing away from the base layer. The filling part is filled in the filling space, and the transmittance of the visible light band corresponding to the filling part is the same as or similar to the transmittance of the visible light band corresponding to the film layer structure.

[0058] The sixth aspect of the present application provides an electronic device, the electronic device comprising the middle frame of the fourth aspect and any one of the possible implementations of the fourth aspect and / or the rear shell of the fifth aspect and any one of the possible implementations of the fifth aspect. The electronic device includes but is not limited to electronic devices with display screen components such as mobile phones, tablets, personal computers, electronic watches and electronic bracelets, and the present application does not make specific restrictions on this. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] In order to more clearly illustrate the technical solution of the present application, the drawings used in the description of the implementation methods are briefly introduced below.

[0060] Figure 1 Exploded views of some mobile phones 1 are shown;

[0061] Figure 2 A top view of the display screen assembly 11 in some embodiments of the present application is shown;

[0062] Figure 3 It shows that the display screen assembly 11 in some embodiments of the present application is arranged along Figure 2 Cross-sectional view of the middle MM section;

[0063] Figure 4 It shows that the display screen assembly 11 in some embodiments of the present application Figure 3 A partial enlarged view of the middle A2 area;

[0064] Figure 5 Shows Figure 1 Top view of the S1 region in Figure 2;

[0065] Figure 6 It shows that the display screen assembly 11 in some other embodiments of the present application Figure 3 A partial enlarged view of the middle A2 area;

[0066] Figure 7 It shows that the display screen assembly 11 in some other embodiments of the present application Figure 3 A partial enlarged view of the middle A2 area;

[0067] FIG8( a ) shows a schematic diagram of a third space S3 in some implementations of the present application;

[0068] FIG8( b ) shows a schematic diagram of a third space S3 in some other implementations of the present application;

[0069] FIG8( c ) shows a schematic diagram of a third space S3 in some other implementations of the present application;

[0070] FIG8( d ) shows a schematic diagram of a third space S3 in some further implementations of the present application;

[0071] FIG. 9( a ) shows a schematic diagram of a third space S3 and a filling portion 500 in some implementations of the present application;

[0072] FIG9( b ) shows a schematic diagram of the third space S3 and the filling part 500 in some other implementations of the present application;

[0073] FIG. 9( c ) shows a schematic diagram of the third space S3 and the filling portion 500 in some other implementations of the present application;

[0074] Fig.10 It shows that the display screen assembly 11 in some embodiments of the present application Figure 3 A partial enlarged view of the middle A2 area;

[0075] Fig.11 A flow chart showing a molding scheme of the display screen assembly 11 in some embodiments of the present application is shown;

[0076] Figure 12(a) to Figure 12(f) A schematic diagram showing a molding scheme of the display screen assembly 11 in some embodiments of the present application is shown;

[0077] Fig.13 A flow chart showing a molding scheme of the display screen assembly 11 in some other embodiments of the present application is shown;

[0078] Figure 14(a) to Figure 14(c) Schematic diagrams showing molding solutions of the display screen assembly 11 in some other embodiments of the present application;

[0079] Fig.15 A flow chart showing a molding scheme for the display screen assembly 11 in some other embodiments of the present application is shown. DETAILED DESCRIPTION

[0080] The technical solution of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0081] The technical solution provided in this application is applicable to but not limited to electronic devices, housings, and methods for forming housings. Among them, electronic devices include but are not limited to mobile phones, tablets, personal computers, electronic watches, electronic bracelets, and other electronic devices with housings, and this application does not make specific limitations on this. Among them, the housing refers to the components exposed to the outside of the electronic device. For example, in a mobile phone, the housing includes but is not limited to the display assembly, the back shell, and the middle frame. For ease of understanding and description, the following will continue to describe the technical solution applicable to the display assembly in the mobile phone as an example.

[0082] For the convenience of description, before introducing the specific structure of the display screen assembly 11, the x-axis direction, y-axis direction and z-axis direction are first defined in combination with the specific structure of the mobile phone 1. Figure 1 As shown, the x-axis and y-axis are parallel to the display screen assembly 11 of the mobile phone 1, the x-axis can be from the bottom of the mobile phone 1 (for example, the end of the mobile phone 1 with a charging port) to the top of the mobile phone 1 (for example, the end of the mobile phone 1 with a camera), the y-axis intersects the x-axis, and the z-axis direction is the thickness direction of the mobile phone 1. In addition, the plane where the display screen assembly 11 is located is defined as the projection plane, that is, the projection plane is parallel to the xoy plane. The positive direction of the z-axis is defined as the first direction, and the size of the component in the z-axis direction is defined as the thickness.

[0083] In some embodiments of the present application, the x-axis direction, the y-axis direction and the z-axis direction intersect each other. In some implementations, the x-axis direction, the y-axis direction and the z-axis direction are perpendicular to each other.

[0084] It can be understood that the mutual perpendicularity in the present application is not absolutely perpendicular, and the approximate perpendicularity caused by factors such as processing errors and assembly errors (for example, the angle between two structural features is 92°, 89.9°, 89°, 88°, etc.) is also within the scope of the mutual perpendicularity in the present application. The limitation of mutual perpendicularity will not be repeated in the following text. The mutual parallelism in the present application is not absolutely parallel, and the approximate parallelism caused by factors such as processing errors and assembly errors (for example, the angle between two structural features is 181°, 179.8°, 179°, 178°, etc.) is also within the scope of the mutual parallelism in the present application. The limitation of mutual parallelism will not be repeated in the following text.

[0085] The structures of several display screen assemblies 11 will be described below with reference to the accompanying drawings.

[0086] Figure 2 A top view of the display screen assembly 11 in some embodiments of the present application is shown. Figure 3 It shows that the display screen assembly 11 in some embodiments of the present application is arranged along Figure 2 Cross-sectional view of the MM section.

[0087] In some technical solutions of the present application, in the display screen assembly, a film layer structure is formed on the base layer, and the base layer is protected by the film layer structure. The film layer structure may be a hardening layer and / or a buffer layer. The following will be described in detail with reference to the accompanying drawings.

[0088] In order to solve the problem that the base layer 100 is easily scratched in the background technology, the present application can plate a hardening layer 200 on the base layer 100 and plate a protective layer 300 on the hardening layer 200 . Figure 4 It shows that the display screen assembly 11 in some embodiments of the present application Figure 3 A partial enlarged view of the A2 area. Figure 4 As shown, in some embodiments of the present application, the display screen assembly 11 includes a base layer 100, a hardening layer 200 and a protective layer 300 stacked in sequence along the positive direction of the z-axis. The hardening layer 200 is used to prevent the base layer 100 from being scratched, and the protective layer 300 is used to prevent fingerprints and the like from being left on the surface of the hardening layer 200. In some implementations, the thickness of the hardening layer 200 ranges from 100 nm to 5000 nm.

[0089] The display screen assembly 11 improves the scratch resistance of the base layer 100 by providing a hardening layer 200 on the base layer 100 , and improves the dirt resistance of the display screen assembly 11 by providing a protective layer 300 on the hardening layer 200 .

[0090] However, due to the introduction of the hardening layer 200, the above display screen assembly 11 still has the problem of concave spots (also called white spots), which will be described in detail below with reference to the accompanying drawings. Figure 4 As shown, a first space S1 is formed between the hardening layer 200 and the protective layer 300 , and the first space S1 extends into the hardening layer 200 . Figure 5 Shows Figure 1 A top view of the S1 region in Figure 1, where Figure 5 Can be Figure 1 The image of the A1 area in the display screen assembly 11 under an electron microscope or an optical microscope. Figure 5 As shown, there is a concave point P1 in the display screen assembly 11. It can be understood that Figure 5 The concave point P1 in Figure 4 The optical display effect of the first space S1.

[0091] This is mainly due to the fact that the surface energy of the substrate layer 100 is relatively large (for example, when the substrate layer 100 is made of glass, the surface energy is greater than 78 mJ / m 2), the base layer 100 easily absorbs impurities such as dust and fiber in the air, so as to reduce its own surface energy by absorbing impurities in the air. In addition, since the surface contact angle of impurities on the base layer 100 is less than 90°, the impurities adsorbed on the base layer 100 are not easy to be blown off. However, when the hardening layer 200 is plated on the base layer 100, pits appear in the area where these impurities are located, and as the molding thickness of the hardening layer 200 increases, the size of the pits formed in the area where the impurities are located gradually increases.

[0092] When the thickness of the hardened layer 200 is greater than 300 nm, the pits will cause the display screen assembly 11 to have appearance defects, ultimately increasing the appearance defect rate of the display screen assembly 11. It is worth noting that the appearance defect rate of the display screen assembly 11 will also increase linearly with the thickness of the hardened layer.

[0093] It is understandable that the above description only shows some of the reasons why the concave point P1 appears in the display screen assembly 11. There may be other reasons that lead to the concave point P1 in the molding scheme of the display screen assembly 11, which will not be described one by one here.

[0094] In order to solve the technical problem in the background technology that the stress imbalance of the base layer 100 leads to low impact resistance of the base layer 100, that is, low impact resistance of the display screen assembly 11, the present application may set a buffer layer 400 on the base layer 100. Figure 6 It shows that the display screen assembly 11 in some other embodiments of the present application Figure 3 A partial enlarged view of the A2 area. Figure 6 As shown, in some other embodiments of the present application, the display screen assembly 11 includes a base layer 100, a buffer layer 400, a hardening layer 200 and a protective layer 300 which are sequentially stacked along the positive direction of the z-axis.

[0095] In the above display screen assembly 11 , by providing the buffer layer 400 on the base layer 100 , it is possible to buffer the external load, reduce the load acting on the base layer 100 , and improve the balance state of the base layer 100 .

[0096] However, due to the introduction of the buffer layer 400, impurities such as dust fibers are also introduced when the buffer layer 400 is formed, resulting in concave spots on the buffer layer 400, which will be described in detail below with reference to the accompanying drawings. Figure 6 As shown, a second space S2 is formed on the side of the buffer layer 400 facing away from the base layer 100 and extending toward the inside of the buffer layer 400, resulting in concave spots on the display screen assembly 11, which ultimately leads to an increase in the appearance defect rate of the display screen assembly 11.

[0097] In summary, the pits on the film structure such as the hardening layer and the buffer layer will affect the aesthetic appearance of the display assembly, resulting in an increase in the appearance defect rate of the display assembly.

[0098] In order to solve the technical problem of the increased appearance defect rate of the display screen assembly 11, the present application provides a technical solution, which forms a film layer structure on the base layer 100, wherein the film layer structure is used to protect the base layer. In addition, the concave points on the film layer structure are filled with a filling material having the same or similar optical properties as the film layer structure, so as to reduce the visual effect of the concave points, thereby improving the appearance aesthetics of the display screen assembly 11.

[0099] The technical solution of the present application will be described in detail below by taking the film layer structure as the hardening layer 200 as an example. Figure 7 It shows that the display screen assembly 11 in some embodiments of the present application Figure 3 A partial enlarged view of the A2 area. Figure 7 As shown, in some embodiments of the present application, the display screen assembly 11 includes a base layer 100, a hardening layer 200 and a filling part 500, and the filler part 500 has the same or similar transmittance in the visible light band as the hardening layer 200. The base layer 100 and the hardening layer 200 are stacked. The hardening layer 200 has a third space S3 on the side surface facing away from the base layer 100, and the third space S3 is at least partially recessed toward the inside of the hardening layer 200. The filling part 500 is at least partially filled in the third space S3.

[0100] The wavelength range of the visible light band is 380nm to 740nm. The transmittance of the visible light band refers to the ability of the light in the visible light band to pass through the medium, which can be characterized by the percentage of the light flux passing through the medium to the light flux incident on the medium. The higher the transmittance, the stronger the ability of the light to pass through the medium. Conversely, the lower the transmittance, the weaker the ability of the light to pass through the medium.

[0101] In some possible implementations of the first aspect above, the preset transmittance threshold may be any one of 50%, 60%, 70%, 80%, 85%, 86%, 87%, 87.5%, 88%, 88.5%, 89%, 89.5%, 90%, 90.5% and 91%, and the present application does not make any specific limitation on this.

[0102] In the above-mentioned display screen assembly 11, the transmittance of the visible light band corresponding to the hardened layer 200 is greater than the preset transmittance threshold, that is, the hardened layer 200 has a certain transparency, that is, light can pass through the hardened layer 200 from one side of the base layer 100 to the direction away from the base layer 100, or external light can pass through the hardened layer 200 from the side away from the base layer 100 to the base layer 100. Based on this, by filling the filling part 500 in the third space S3, and the transmittance of the visible light band corresponding to the filling part 500 is the same or similar to the transmittance of the visible light band corresponding to the hardening layer 200, the concave points in the display screen assembly 11 (that is, the third space S3) can be reduced or eliminated, the interface at the concave points can be weakened, and the transmission path of light at the concave points in the hardening layer 200 can be effectively improved, and the diffuse reflection and scattering of light on the interface can be reduced, thereby weakening the visual effect at the concave points, weakening the visual effect of the concave points, effectively improving the white point and bright spot problems of the display screen assembly 11, reducing the appearance defective rate of the display screen assembly 11, and increasing the appearance yield of the display screen assembly 11 to more than 90%.

[0103] It can be understood that the transmittance of the visible light band corresponding to the filling part 500 is similar to the transmittance of the visible light band corresponding to the hardened layer 200, which can be that the difference between the transmittance of the visible light band corresponding to the filling part 500 and the transmittance of the visible light band corresponding to the hardened layer 200 is less than the preset difference threshold. Alternatively, it can also be that the ratio between the transmittance of the visible light band corresponding to the filling part 500 and the transmittance of the visible light band corresponding to the hardened layer 200 is close to 1. When the hardened layer 200 is a multi-layer structure, the transmittance of the visible light band corresponding to the hardened layer 200 refers to the transmittance of the corresponding visible light band after the multi-layer structure is taken as a whole.

[0104] In some embodiments of the present application, the refractive index of the hardened layer 200 is in the range of 1.5 to 1.7. The refractive index of the filling portion 500 is the same as or similar to that of the hardened layer 200. The refractive index refers to the ratio of the incident angle to the refraction angle when light enters from one medium into another medium. The refractive index describes the ability of light to be refracted by a medium. The larger the value, the greater the degree of refraction of the light by the medium. Conversely, the smaller the value, the smaller the degree of refraction of the light by the medium.

[0105] It is worth noting that the refractive index of the filling portion 500 is close to that of the hardened layer 200, and the difference between the refractive index of the filling portion 500 and that of the hardened layer 200 may be less than a preset difference threshold, for example, the preset difference threshold is 0.1. Alternatively, the ratio between the refractive index of the filling portion 500 and that of the hardened layer 200 may be close to 1, for example, the ratio between the refractive index of the filling portion 500 and that of the hardened layer 200 may range from 0.9 to 1.1. In the present application, the refractive index of the filling portion 500 is the same as or close to that of the hardened layer 200, so that the optical effects of the filling portion 500 and the hardened layer 200 are similar.

[0106] In some embodiments of the present application, the refractive index of the filling portion 500 is in the range of 1.4 to 1.8. For example, the refractive index of the filling portion 500 is any one of 1.4, 1.43, 1.46, 1.49, 1.52, 1.55, 1.60, 1.65, 1.70, 1.75 and 1.80.

[0107] In some embodiments of the present application, the refractive index of the hardened layer 200 is in the range of 1.5 to 1.7. The refractive index of the filling portion 500 is any one of 1.5, 1.55, 1.6, 1.65 and 1.7.

[0108] In some embodiments of the present application, the thickness of the hardened layer 200 ranges from 0 to 20 μm. For example, the thickness of the hardened layer 200 is any one of 0, 0.5 μm, 1 μm, 1.5 μm, 2.5 μm, 5 μm, 7.5 μm, 10 μm, 12.5 μm, 15 μm, 17.5 μm and 20 μm.

[0109] It is not difficult to find that the greater the thickness of the hardened layer 200, the higher the probability of the appearance of pits, and the higher the probability of the pits superimposed in the thickness direction and / or the horizontal direction. Therefore, the probability of large-sized pits appearing in the display screen assembly 11 is also higher. Based on this, when the thickness of the hardened layer 200 in the display screen assembly 11 is greater than 300nm, the probability of the pits causing poor appearance is higher. The technical solution of the display screen assembly 11 in the present application is more suitable for application scenarios where the thickness of the hardened layer 200 is greater than 300nm. At the same time, in this application scenario, the improvement effect of white spots and bright spots caused by pits in the display screen assembly 11 is also more obvious.

[0110] In some other embodiments of the present application, the display screen assembly 11 includes a base layer 100, a hardening layer 200 and a protective layer 300. The hardening layer 200 is disposed on one side of the base layer 100, and the protective layer 300 is disposed on the side of the hardening layer 200 facing away from the base layer 100. A third space S3 is formed between the protective layer 300 and the hardening layer 200, and the third space S3 at least partially extends into the hardening layer 200. In some implementations, the filling portion 500 is filled in the third space S3, and the refractive index of the filling portion 500 is the same as or similar to the refractive index of the hardening layer 200. The refractive index of the hardening layer 200 may be the equivalent refractive index of the hardening layer 200, which is the refractive index determined after the entire hardening layer 200 is taken as a whole.

[0111] In some implementations, the base layer 100 includes a first base surface 101 and a second base surface 102 disposed opposite to each other. The hardening layer 200 is disposed on the first base surface 101 of the base layer 100, and the protective layer 300 is disposed on the surface of the hardening layer 200 facing away from the base layer 100. It can be understood that in the display screen assembly 11, the second base surface 102 is the backlight surface, and the surface of the protective layer 300 facing away from the hardening layer 200 is the light emitting surface.

[0112] In some embodiments of the present application, the thickness of the protective layer 300 ranges from 0 to 80 nm. For example, the thickness of the protective layer 300 is any one of 0, 10 nm, 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm and 80 nm.

[0113] The above-mentioned display screen assembly 11 reduces the size of the concave points in the display screen assembly 11 and weakens the visual effect of the concave points by filling the filling part 500 in the third space S3 between the protective layer 300 and the hardening layer 200, effectively improves the white spot and bright spot problems, reduces the appearance defective rate of the display screen assembly 11, and increases the appearance yield of the display screen assembly 11 to more than 90%.

[0114] In some embodiments of the present application, the material of the filling part 500 is an organic substance having a refractive index that is the same as or close to the refractive index of the hardening layer 200. An example will be given below.

[0115] In some embodiments of the present application, the filling portion 500 includes a base resin and an additive. In the filling portion 500 , the mass percentage of the base resin ranges from 90% to 100%, and the mass percentage of the additive ranges from 0% to 10%.

[0116] In some embodiments of the present application, the filling part 500 may be filled and solidified by a filling material. The filling material may include a matrix resin, a solvent, and an additive. The matrix resin is the main body of the filling part 500. The solvent is a chemical substance with a solubility property, which is used to dissolve the matrix resin and the additive to form a solution. The additive is a material added according to the components of the matrix resin and the solvent to adjust the solution properties.

[0117] In some embodiments of the present application, in the filling material, the mass percentage of the base resin ranges from 20% to 50%, the mass percentage of the solvent ranges from 45% to 80%, and the mass percentage of the additive ranges from 0 to 5%.

[0118] In the above display screen assembly, by reasonably setting the mass percentages of the base resin and the solvent in the raw material component corresponding to the filling part, the fluidity of the raw material component (i.e., the filling material) and the proportion of the base resin in the raw material component can be ensured at the same time. Furthermore, the difficulty of ensuring the application of the raw material component during the application process can be reduced, while ensuring the volume of the filling part after the raw material component is cured, that is, improving the effective filling of the filling space.

[0119] In some implementations, in the filling material, the mass percentage of the base resin is 30%, the mass percentage of the solvent is in the range of 67%, and the mass percentage of the additive is 2%.

[0120] In some embodiments of the present application, the additive may include, but is not limited to, a curing agent, a leveling agent, a coupling agent, and a combination of one or more of a photoinitiator. Among them, the curing agent is used to convert a liquid or semi-solid material into a solid material, and can react chemically with the active groups in the material to form a network structure, thereby solidifying and stabilizing the material. The leveling agent is used to adjust the surface tension and viscosity of the coating so that the coating flows more easily during the coating and drying process, so as to improve the leveling performance of the coating and obtain a smoother and more uniform coating surface. The coupling agent is used to enhance the interaction between various materials so that various materials can better bond to each other. The photoinitiator (also called a photosensitizer) is used to induce or promote a photochemical reaction between materials by absorbing light energy, thereby achieving the optical properties of the filling portion 500.

[0121] In some embodiments of the present application, in the filling material, the mass percentage of the curing agent ranges from 1% to 5%, the mass percentage of the leveling agent ranges from 0 to 2%, the mass percentage of the coupling agent ranges from 0 to 0.5%, and the mass percentage of the photosensitizer ranges from 1.5% to 5%.

[0122] In some embodiments of the present application, the matrix resin may include, but is not limited to, one or a combination of polyester resin, acrylic resin, vinyl chloride copolymer resin, vinyl acetate copolymer resin, cellulose derivative resin, polycarbonate resin, polyvinyl butyral resin, epoxy acrylic resin, polyurethane acrylic resin, polysilane acrylic resin, epoxy resin and polyamide resin.

[0123] In some embodiments of the present application, the curing agent may include but is not limited to one or a combination of several of modified polyester resin, melamine formaldehyde resin, hexamethylene diisocyanate trimer, toluene diisocyanate, diphenylmethane diisocyanate, dicyclohexylmethane diisocyanate and polyetheramine I.

[0124] In some embodiments of the present application, the leveling agent may include, but is not limited to, one or a combination of a silicone leveling agent, a non-silicon leveling agent, and a fluorine-containing leveling agent.

[0125] In some embodiments of the present application, the coupling agent may include but is not limited to one or a combination of γ-aminopropyltriethoxysilane, γ-(2,3-epoxypropyloxy)propyltrimethoxysilane, R-mercaptopropyltriethoxysilane, and isopropyltri(dioctylpyrophosphate)titanate.

[0126] In some embodiments of the present application, the photoinitiator may include, but is not limited to, one or a combination of alkyl phenones, acylphosphine oxides, benzophenones, thioxanthones, diaryl iodonium salts, triaryl iodonium salts, alkyl iodonium salts, and isopropyl ferrocenium hexafluorophosphate.

[0127] In some embodiments of the present application, the solvent may include, but is not limited to, one or a combination of butyl ester, ethyl ester, cyclohexanone, isopropyl alcohol, diacetone alcohol, xylene, benzyl alcohol, and methyl isobutyl ketone methyl acrylate.

[0128] It is understood that the various components in the filling part 500 can be calibrated by an energy dispersive spectrometer (EDS) or X-ray photoelectron spectroscopy (XPS). The above-mentioned curing agent, leveling agent, coupling agent and solvent are only part of the implementation methods and do not constitute a limitation on the technical solution of the present application.

[0129] The above-mentioned display screen assembly 11 can ensure good puncture resistance and scratch resistance by reasonably designing the material components of the filling part 500. The overall Vickers hardness of the display screen assembly 11 is greater than or equal to 1400HV. Under a load of 500g, the overall Mohs hardness of the display screen assembly 11 is greater than or equal to 7. In terms of optical performance, for light waves with a wavelength range of 380nm to 780nm, the reflectivity of the display screen assembly 11 is less than 8.6%, and the transmittance is greater than 90%. In addition, there is no film shedding phenomenon in the display screen assembly 11, and in the firmness test, the hundred-grid test result is greater than or equal to 4B. Among them, reflectivity refers to the ratio of the intensity of the reflected light to the intensity of the incident light when a part of the light is reflected back when it is incident on the surface of the medium. The reflectivity describes the degree of reflection of the medium to the light. The larger the value, the greater the degree of reflection of the light by the medium. Conversely, the smaller the value, the smaller the degree of reflection of the light by the medium.

[0130] The distribution of the filling portion 500 in the display screen assembly 11 will be described in detail below with reference to the accompanying drawings.

[0131] Before describing the filling portion 500 , several possible third spaces S3 of the present application are described first.

[0132] In some embodiments of the present application, the third space S3 extends entirely into the hardening layer 200. FIG8(a) shows a schematic diagram of the third space S3 in some implementations of the present application. As shown in FIG8(a), in the positive direction of the z-axis, the hardening layer 200 and the protective layer 300 are sequentially superimposed, and the surface of the hardening layer 200 facing the protective layer 300 extends toward the inside of the hardening layer 200 to form the third space S3.

[0133] In some embodiments of the present application, the third space S3 partially extends into the hardening layer 200. FIG. 8( b) shows a schematic diagram of the third space S3 in some other implementations of the present application. As shown in FIG. 8( b), the third space S3 includes a first subspace S31 and a second subspace S32 that are interconnected. In the positive direction of the z-axis, the hardening layer 200 and the protective layer 300 are arranged in sequence, and a gap is formed between the hardening layer 200 and the protective layer 300, which serves as the first subspace S31. The surface of the hardening layer 200 facing the protective layer 300 extends toward the inside of the hardening layer 200 to form a second subspace S32.

[0134] In some embodiments of the present application, the third space S3 partially extends into the hardening layer 200 and partially extends into the protective layer 300. Figure 8(c) shows a schematic diagram of the third space S3 in some other implementations of the present application. As shown in Figure 8(c), the third space S3 includes a third subspace S33 and a fourth subspace S34 that are interconnected. In the positive direction of the z-axis, the hardening layer 200 and the protective layer 300 are arranged in sequence, and the protective layer 300 extends toward the surface of the hardening layer 200 toward the inside of the protective layer 300 to form the third subspace S33. The surface of the hardening layer 200 toward the protective layer 300 extends toward the inside of the hardening layer 200 to form the fourth subspace S34.

[0135] In some embodiments of the present application, the third space S3 partially extends into the hardening layer 200. FIG8(d) shows a schematic diagram of the third space S3 in some other implementations of the present application. As shown in FIG8(d), in the positive direction of the z-axis, the protective layer 300 is disposed on one side of the hardening layer 200, and the hardening layer 200 extends toward the surface of the protective layer 300 toward the inside of the hardening layer 200 to form a first extended curved surface, and the protective layer 300 extends toward the surface of the hardening layer 200 toward the inside of the hardening layer 200 to form a second extended curved surface, and the first extended curved surface and the second extended curved surface form the third space S3.

[0136] It can be understood that the third space S3 in the above-mentioned implementation methods is only a partial implementation method of the third space S3 in this application. Other third spaces S3 that meet the conditions are also within the protection scope of this application, and this application does not give examples one by one.

[0137] After describing several third spaces S3 in the present application, the following will continue to describe several forms of the filling portion 500 in the present application by taking the third space S3 in FIG. 8( a ) as an example.

[0138] In some embodiments of the present application, the filling portion 500 fills the entire third space S3. Figure 9(a) shows a schematic diagram of the third space S3 and the filling portion 500 in some implementations of the present application. In some of the implementations, as shown in Figure 9(a), the filling portion 500 fills the entire third space S3. There is no space between the hardening layer 200, the protective layer 300 and the filling portion 500. In the above-mentioned display screen assembly 11, the filling portion 500 fills the entire third space S3, thereby avoiding the formation of white spots in the internal space, thereby improving the appearance yield of the display screen assembly 11.

[0139] In some embodiments of the present application, the filling portion 500 partially fills the third space S3.

[0140] FIG9(b) shows a schematic diagram of the third space S3 and the filling part 500 in some implementations of the present application. In some other alternative implementations, as shown in FIG9(b), the filling part 500 fills the area of ​​the third space S3 close to the hardening layer 200. A new space S5 is formed between the hardening layer 200, the protective layer 300 and the filling part 500. In the above-mentioned display screen assembly 11, the filling part 500 fills the area of ​​the third space S3 close to the hardening layer 200, reduces the thickness of the third space S3, and the formed new space S5 weakens the visual effect, thereby improving the appearance yield of the display screen assembly 11.

[0141] FIG9(c) shows a schematic diagram of the third space S3 and the filling part 500 in some other implementations of the present application. In some other alternative implementations, as shown in FIG9(c), the filling part 500 fills the area of ​​the third space S3 close to the hardening layer 200, and the filling part 500 partially fills the area of ​​the third space S3 close to the protective layer 300. A new space S6 is formed between the protective layer 300 and the filling part 500. The above-mentioned display screen assembly 11 reduces the projection area of ​​the third space S3 in the projection plane, and the formed new space S6 weakens the visual effect, thereby improving the appearance yield of the display screen assembly 11.

[0142] It can be understood that the filling part in the above implementation only shows a partial filling method of the filling part 500 in the third space S3, but does not constitute a limitation on the distribution method of the filling part 500 in the third space S3 of the present application. Other distribution methods are also within the protection scope of the present application.

[0143] The base layer 100 , the hardening layer 200 and the protective layer 300 in the present application will be described in detail below.

[0144] In some embodiments of the present application, when the housing is a display screen assembly 11 , the material of the base layer 100 may be glass and / or plastic.

[0145] In some other embodiments of the present application, when the shell is the middle frame 12, the material of the base layer 100 can be glass and / or metal.

[0146] In some other embodiments of the present application, when the shell is the rear shell 13, the material of the base layer 100 can be at least one of glass, ceramic and metal.

[0147] It can be understood that the material of the above-mentioned base layer 100 is only part of the implementation method combined with the application scenario. In some other implementation methods, the base layer 100 can also be other materials that meet the needs, and this application does not make specific limitations on this.

[0148] Fig.10 It shows that the display screen assembly 11 in some embodiments of the present application Figure 3 A partial enlarged view of the A2 area. Fig.10 As shown, in some embodiments of the present application, the hardening layer 200 includes a first sub-hardening layer 210, a second sub-hardening layer 220 and a third sub-hardening layer 230. The first sub-hardening layer 210 is superimposed on the first substrate surface 101 of the substrate layer 100. The second sub-hardening layer 220 is superimposed on the surface of the first sub-hardening layer 210 facing away from the substrate layer 100. The third sub-hardening layer 230 is superimposed on the surface of the second sub-hardening layer 220 facing away from the first sub-hardening layer 210.

[0149] The first sub-hardening layer 210 has a relatively low refractive index and can be used to enhance the bonding force between the base layer 100 and other layers (e.g., the second sub-hardening layer 220). The second sub-hardening layer 220 has a relatively low refractive index and a relatively high hardness and can be used to reduce the refractive index of the hardening layer 200 and to increase the hardness of the hardening layer 200. The third sub-hardening layer 230 has a relatively low refractive index and can be used to increase the transmittance of the hardening layer 200.

[0150] Among them, transmittance refers to the ratio of the intensity of the light that passes through the medium to the intensity of the incident light when the light passes through the medium. Transmittance describes the degree of light transmission through the medium. The larger the value, the greater the degree of light transmission through the medium. Conversely, the smaller the value, the smaller the degree of light transmission through the medium.

[0151] In some embodiments of the present application, the refractive index of the first sub-hardening layer 210 is lower than 1.52. For example, the material of the first sub-hardening layer 210 includes silicon dioxide.

[0152] In some implementations, the thickness of the first sub-hardening layer 210 ranges from 0 to 200 nm. For example, the thickness of the first sub-hardening layer 210 is any one of 0, 10 nm, 20 nm, 30 nm, 40 nm, 50 nm, 100 nm, 150 nm and 200 nm.

[0153] In some embodiments of the present application, the second sub-hardening layer 220 may be formed by atomically mixing a high-hardness material having a refractive index higher than 1.6 and a material having a refractive index lower than 1.52. For example, the high-hardness material having a refractive index higher than 1.6 includes at least one of niobium pentoxide, tantalum pentoxide, silicon nitride, silicon carbide, aluminum nitride, and titanium dioxide. The material having a refractive index lower than 1.52 includes silicon dioxide.

[0154] In some implementations, the second sub-hardening layer 220 has a thickness ranging from 0 to 20 μm and a refractive index of 1.52±0.08. For example, the second sub-hardening layer 220 has a thickness of any one of 0, 0.5 μm, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 7.5 μm, 10 μm, 12.5 μm, 15 μm, 17.5 μm and 200 μm.

[0155] In some embodiments of the present application, the refractive index of the third sub-hardening layer 230 is lower than 1.52. For example, the material of the third sub-hardening layer 230 includes silicon dioxide.

[0156] In some implementations, the thickness of the third sub-hardening layer 230 ranges from 0 to 500 nm. For example, the thickness of the third sub-hardening layer 230 is any one of 0, 10 nm, 40 nm, 70 nm, 100 nm, 150 nm, 200 nm, 300 nm, 400 nm and 500 nm.

[0157] The relative positions of the third space and the first sub-hardening layer 210, the second sub-hardening layer 220, and the third sub-hardening layer 230 will be briefly described below. In some implementations, the third space extends to the third sub-hardening layer 230. In some other alternative implementations, the third space extends through the third sub-hardening layer 230 to the second sub-hardening layer 220. In some other alternative implementations, the third space extends through the third sub-hardening layer 230 and the second sub-hardening layer 220 to the first sub-hardening layer 210. This application does not specifically limit this.

[0158] It can be understood that the above-mentioned hardened layer 200 and the first sub-hardened layer 210, the second sub-hardened layer 220 and the third sub-hardened layer 230 in the hardened layer 200 are only part of the implementation of the hardened layer 200 in this application, and other hardened layers 200 are also within the protection scope of this application. This application does not specifically limit the thickness of the hardened layer 200, the specific layers in the hardened layer 200, the optical properties, mechanical properties and thickness of each layer. Any hardened layer 200 that can achieve the functions of protecting the base layer 100 and resisting scratches is within the protection scope of this application, and this application does not specifically limit this.

[0159] In some embodiments of the present application, the protective layer 300 includes but is not limited to at least one of an anti-fingerprint film layer, a tempered film layer, a solid silicone film layer, a liquid silicone film layer, and a nano-adsorption film layer. It can be understood that the above protective layer 300 only shows some implementation methods, and other film layers that can prevent fingerprint deposition are also within the scope of protection of the present application, and the present application does not make specific limitations on this.

[0160] In addition, the present application also provides an electronic device, which includes at least one of the above-mentioned shells.

[0161] After describing the specific structure corresponding to the molding scheme of the present application, the molding method corresponding to the molding scheme of the present application will be described below. For the convenience of description and understanding, the following will continue to describe the display screen assembly 11 in the housing 10 of the mobile phone 1 as an example.

[0162] Based on the above description, it is not difficult to find that when the display screen assembly 11 is formed, the base layer 100 absorbs impurities in the air, so that pits are formed in the formed hardened layer 200, and these pits cause the display screen assembly 11 to have poor appearance points, ultimately resulting in a higher poor appearance of the display screen assembly 11.

[0163] In order to solve the problem of high appearance defective rate of the above-mentioned display screen assembly 11, the present application provides a molding scheme for the display screen assembly 11, which fills the concave points in the hardened layer 200 with filling materials, reduces the number of concave points in the hardened layer 200 and reduces the size of the concave points in the hardened layer 200, weakens the appearance defective points of the display screen assembly 11 by weakening the concave points, and reduces the appearance defective rate of the display screen assembly 11.

[0164] The following will be combined Fig.11 The molding scheme of the display screen assembly 11 in the present application is described in detail. Fig.11 A flow chart showing a molding scheme of the display screen assembly 11 in some embodiments of the present application is shown. Fig.11 As shown, the molding scheme of the display screen assembly 11 provided in the present application may include the following steps:

[0165] S1101: Arrange the base layer 100 in a coating machine.

[0166] Among them, the coating machine can be an electron gun coating machine (such as electron gun evaporation equipment) or a sputtering coating machine (such as a vertical single-body magnetron furnace). This application does not specifically limit the type of coating machine.

[0167] In some embodiments of the present application, the substrate layer 100 is arranged on a bracket of a coating machine, and the first substrate surface 101 in the substrate layer 100 is exposed. As shown in FIG. 12( a ), the substrate layer 100 includes a first substrate surface 101 and a second substrate surface 102 disposed opposite to each other. The first substrate surface 101 is the surface of the substrate layer 100 on which the hardened layer 200 is to be plated. Subsequently, the coating machine is evacuated to 3.6E-3 Pa.

[0168] In some embodiments of the present application, after the base layer 100 is placed in the coating machine, it is necessary to clean the surface of the base layer 100. Several common cleaning methods are described below.

[0169] In some embodiments of the present application, the surface of the base layer 100 is cleaned by a plasma cleaning process (PCP) to remove dirt on the first base surface 101 of the base layer 100. The plasma cleaning process uses plasma to release a large number of active particles in a high-energy field to produce a chemical reaction with the first base surface 101 of the base layer 100, thereby cleaning the first base surface 101.

[0170] In some implementations, pure Ar / O2 mixed gas is used to perform plasma cleaning on the surface of the substrate layer 100. The process parameters of the plasma cleaning process are: the gas type is Ar / O2 mixed gas, the power range is 1 to 4KW, and the cleaning time range is 10 minutes to 30 minutes. For example, the cleaning time may include but is not limited to any one of 10 minutes, 15 minutes, 20 minutes, 25 minutes, and 30 minutes.

[0171] The above-mentioned coating method uses a plasma cleaning process to clean the first substrate surface 101 of the substrate layer 100 , and many substances that are difficult to clean can be removed by generating chemical reactions, thereby improving the cleaning effect of the first substrate surface 101 .

[0172] In some other embodiments of the present application, the surface of the base layer 100 is cleaned by a deionized water cleaning process (DWCP) to remove dirt on the first base surface 101 of the base layer 100. The deionized water cleaning process is to purify the water by removing ions in the water to obtain deionized water, and then use the high cleanliness and low residue of the deionized water to clean the first base surface 101 of the base layer 100.

[0173] The above-mentioned coating method adopts deionized water for cleaning. Deionized water cleaning can achieve a very high cleaning effect due to its high cleanliness and low residue, and will not cause secondary pollution to the base layer 100.

[0174] It can be understood that the above-mentioned plasma cleaning process and deionized water cleaning process are only partial implementation methods of cleaning the surface of the base layer 100, and other forms of surface cleaning methods are also within the protection scope of this application, and this application does not make specific limitations on this.

[0175] In some other embodiments of the present application, before placing the base layer 100 in the coating machine, it is necessary to clean the surface of the base layer 100 in advance. The specific cleaning method may be at least one of the above-mentioned common cleaning methods.

[0176] In some other embodiments of the present application, before the base layer 100 is arranged in the coating machine, the surface of the base layer 100 is cleaned for the first time, and after the base layer 100 is arranged in the coating machine, the surface of the base layer 100 is cleaned for the second time. Among them, the cleaning method of the first cleaning and the cleaning method of the second cleaning can be at least one of the above-mentioned common cleaning methods. In some implementations, the cleaning method of the first cleaning and the cleaning method of the second cleaning can be different. For example, the cleaning method of the first cleaning can be a plasma cleaning process, and the cleaning method of the second cleaning can be a deionized water cleaning process.

[0177] S1102 : forming a hardened layer 200 on the first base surface 101 of the base layer 100 .

[0178] In some embodiments of the present application, as shown in FIG12( b ), different materials are sequentially sputtered on the first substrate surface 101 of the substrate layer 100 to sequentially form corresponding sub-hardened layers in the hardened layer 200 on the first substrate surface of the substrate layer 100. For example, in combination with the specific structure of the hardened layer 200 mentioned above, it can be known that: first, a first sub-hardened layer 210 is formed on the first substrate surface 101 of the substrate layer 100 using a pure silicon target, and then, a second sub-hardened layer 220 is formed on the side of the first sub-hardened layer 210 facing away from the substrate layer 200 using a silicon / aluminum or other oxide target, and finally, a third sub-hardened layer 230 is formed on the side of the second sub-hardened layer 220 facing away from the first sub-hardened layer 210 using a pure silicon target.

[0179] S1103 : forming a filling layer 600 on the surface of the hardened layer 200 facing away from the base layer 100 .

[0180] In some embodiments of the present application, as shown in FIG12(c), the filling material 600' is applied to the surface of the hardened layer 200 facing away from the base layer 100, and the filling material 600' is filled into the concave points on the first hardened surface 201. Combining FIG12(c) and FIG12(d), it can be seen that when the filling material 600' tends to be in a stable state, the filling material 600' is cured to obtain the filling layer 600.

[0181] In some embodiments of the present application, the filling material 600 ′ may include a base resin, a solvent, and an additive.

[0182] In some embodiments of the present application, in the filling material, the mass percentage of the base resin ranges from 20% to 50%, the mass percentage of the solvent ranges from 45% to 80%, and the mass percentage of the additive ranges from 0 to 5%.

[0183] In some implementations, in the filling material, the mass percentage of the base resin is 30%, the mass percentage of the solvent is in the range of 67%, and the mass percentage of the additive is 2%.

[0184] In some embodiments of the present application, the additives may include, but are not limited to, one or a combination of curing agents, leveling agents, coupling agents, and photoinitiators. It is understood that the base resin, solvent, curing agent, leveling agent, coupling agent, and photoinitiator can be specifically referred to the above description, and will not be described in detail here.

[0185] In some embodiments of the present application, the thickness of the filling layer 600 ranges from 0 μm to 20 μm. The filling thickness of the filling layer 600 can be understood as the thickness of the filling layer 600 attached to the surface 201 of the hardening layer 200 after the filling material 600' is cured. In some implementations, the thickness of the filling layer 600 is any one of 0 μm, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm and 20 μm.

[0186] In some embodiments of the present application, the filling material 600 ′ is applied to the surface of the hardening layer 200 by at least one of spraying, flow coating, hand coating, sputtering, injection, vapor deposition and electrophoretic deposition dip coating, which is not specifically limited in the present application.

[0187] In some embodiments of the present application, the filling material 600 ′ is applied to the surface of the hardened layer 200 of the hardened layer 200 at one time, and when the filling material 600 ′ tends to a stable state, the filling material is cured to obtain the filling layer 600 .

[0188] In some other embodiments of the present application, the filling material 600' is applied to the surface of the hardened layer 200 of the hardened layer 200 in batches, and the filling material 600' is cured after each application of the filling material 600' tends to a stable state. After multiple applications and multiple curings, the filling layer 600 is finally obtained. In the above-mentioned method for forming the display screen assembly 11, the filling material 600 is formed by applying and curing in batches, which facilitates effective spraying on the hardened layer 200 and further improves the filling effect of the filling material 600' on the concave points on the hardened layer 200. The following text will be described in detail in combination with experimental data, which will not be expanded here.

[0189] S1104: removing the redundant filling layer 600.

[0190] The redundant filling layer 600 refers to the filling layer 600 attached to the surface of the hardening layer 200 facing away from the base layer 100. That is, the redundant filling layer 600 is the filling layer 600 protruding from the hardening layer 200.

[0191] In some embodiments of the present application, the excess filling layer 600 on the surface of the hardened layer 200 is removed by grinding, polishing, scraping with a scraper, milling, chemical dissolution, electrochemical removal and pyrolysis. Among them, the polishing method may include but is not limited to mechanical polishing and manual polishing. The material of the polishing cloth may include but is not limited to any one of a sponge, a brush, abrasive leather and a carpet. The polishing agent may include but is not limited to any one of calcium carbonate, polymethyl methacrylate (PMMA) powder, zinc oxide, cerium oxide, and iron oxide. The particle size range of the polishing agent is 10 mesh to 6000 mesh.

[0192] In some implementations, as shown in FIG. 12( e ), after removing the excess filling layer 600, the outer surface of the filling portion 500 is flush with the surface of the hardening layer 200 facing away from the base layer 100. It can be understood that the flushing in the present application can mean that the two surfaces are roughly flush, not that the two surfaces are absolutely flush. The above solution can completely eliminate the third space S3.

[0193] In some alternative implementations, after removing the excess filling layer 600, the outer surface of the filling portion 500 is lower than the surface of the hardening layer 200 facing away from the base layer 100. The above solution can partially eliminate the third space S3.

[0194] In some alternative implementations, after removing the excess filling layer 600 , the filling portion 500 covers the first base surface 101 of the base layer 100 . In addition to being able to completely fill the third space S3 , the above solution can also cover the first base surface 101 of the base layer 100 .

[0195] S1105 : forming a protective layer 300 on the side of the hardening layer 200 facing away from the base layer 100 .

[0196] In some embodiments of the present application, as shown in FIG. 12( f ), a protective layer 300 is formed on a surface of the hardened layer 200 facing away from the base layer 100 and on a surface of the filling portion 500 facing away from the base layer 100 .

[0197] In some embodiments of the present application, the protective layer 300 may be an anti-fingerprint film layer. The AF film layer is generally made of a polymer material, and the surface of the material is covered with a layer of hydrophobic substance, which reduces the surface energy of the film layer. By forming the AF film layer on the side of the hardening layer 200 facing away from the base layer 100, fingerprints, oil stains, dust, etc. can be effectively reduced from adhering to the surface of the display screen assembly 11, thereby keeping the display screen assembly 11 clean and transparent.

[0198] In some embodiments of the present application, the thickness of the protective layer 300 ranges from 10 nm to 30 nm. For example, the thickness of the protective layer 300 can be 10 nm, 15 nm, 20 nm, 25 nm, and 30 nm.

[0199] It can be understood that the molding method of the employee protection layer 300 in S1105 can be adaptively adjusted according to the filling part 500 and the hardening layer 200 obtained in S1104, and will not be described in detail here.

[0200] In the molding method of the above-mentioned display screen assembly 11, after molding the hardening layer 200, a filling layer 600 is molded on the hardening layer 200. By filling the concave points on the hardening layer 200 with the filling layer 600, the number of concave points in the display screen assembly 11 can be reduced, and the size of the concave points in the display screen assembly 11 can be reduced, the visual effect of the concave points can be weakened, the white spot and bright spot problems can be effectively improved, the appearance defect rate of the display screen assembly 11 can be reduced, and the appearance yield rate of the display screen assembly 11 can be improved.

[0201] It can be understood that the molding method of the display screen assembly 11 is only a partial implementation method in the present application. In some other embodiments of the present application, after filling the filling material 600', the excess filling material 600' is scraped off by a scraper, and then the remaining filling material 600' is solidified. The molding method of the display screen assembly 11 can reduce the difficulty of removing the excess filling layer and improve the molding efficiency of the display screen assembly 11.

[0202] In addition, based on the above description, it is not difficult to find that in some molding solutions of the display screen assembly 11, OCO spraying is used to spray resin on the surface of the base layer 100 to form a buffer layer 400 on the surface of the base layer 100. During the molding process, the base layer 100 and / or the buffer layer 400 absorb impurities in the air, so that concave points are formed in the molded hardened layer 200, and these concave points cause the display screen assembly 11 to have poor appearance points, that is, the display screen assembly 11 has a poor appearance.

[0203] In order to solve the above problems, the present application provides a molding solution for a display screen assembly 11, which improves the cleanliness of the display screen assembly 11 during molding by controlling the environment, reduces the number of pits formed in the hardening layer 200 and reduces the size of the pits formed in the hardening layer 200, thereby avoiding the formation of appearance defects in the display screen assembly 11.

[0204] In some embodiments of the present application, the OCO spraying production line is transformed into a Class 100 workshop and fully automatic loading and unloading, and the environment of the entire spray coating process is transformed. For example, the entire process of cleaning, inserting and loading, patching, feeding, coating, and unloading is managed in a closed manner, and the entire process is automated by a robot to reduce personnel flow and environmental pollution, so as to effectively improve the coating yield of the OCO process. The OCO spraying process refers to the process of spraying OCO material on the substrate layer 100.

[0205] The molding method of the display screen assembly 11 can effectively reduce the probability of impurities falling on the surface of the base layer 100 and the buffer layer 400 by modifying the environment, thereby improving the product yield of the display screen assembly 11. Secondly, the drop resistance of the display screen assembly 11 can be improved by 30% to 50%. Finally, the automated production line can also improve the production efficiency of the display screen assembly 11.

[0206] However, in the molding method of the display screen assembly 11, product defects caused by impurities still exist, and there is limited room for improving product yield. The production environment is difficult to control and has poor stability. Environmental abnormalities in a single work section will significantly reduce product yield. The cost of workshop improvement and maintenance is high.

[0207] In order to solve the problem of high appearance defective rate of the above-mentioned display screen assembly 11, the present application provides a molding scheme for the display screen assembly 11, which forms a shielding layer 700 on the surface to be coated of the base layer 100 before the base layer 100 enters the coating machine, and the surface energy of the shielding layer 700 is relatively low, thereby reducing impurities brought into the base layer 100 when entering the coating machine, thereby reducing the probability of pits appearing in the hardening layer 200, reducing the probability of appearance defective points appearing in the display screen assembly 11, and reducing the appearance defective rate of the display screen assembly 11.

[0208] The following will be combined Fig.13 The molding scheme of the display screen assembly 11 in the present application is described in detail. Fig.13 A flow chart showing the molding scheme of the display screen assembly 11 in some other embodiments of the present application is shown. Fig.13 As shown, the molding scheme of the display screen assembly 11 provided in the present application may include the following steps:

[0209] S1301: forming a shielding layer 700 on the first substrate surface 101 of the substrate layer 100 to obtain a prefabricated component 20, wherein the surface energy of the shielding layer 700 is lower than a preset surface energy threshold.

[0210] In some embodiments of the present application, it can be seen from FIG. 14(a) and FIG. 14(b) that the base layer 100 includes a first base surface 101 and a second base surface 102 that are disposed opposite to each other. A shielding layer 700 of a first preset thickness is formed on the first base surface 101 of the base layer 100, and the base layer 100 and the shielding layer 700 are used as a prefabricated component 20. The shielding layer 700 is composed of low surface energy organic matter and has hydrophobic and oleophobic properties, which can increase the contact angle between impurities in the air and the shielding layer 700.

[0211] Among them, surface energy (SE), also known as interfacial energy, refers to the energy required for the interaction between the components of a material at the interface of a liquid, solid or gas. The higher the surface energy, the stronger the ability of the material to adhere to other materials; conversely, the lower the surface energy, the weaker the ability of the material to adhere to other materials. The preset surface energy threshold refers to the critical value of the surface energy determined based on historical experience.

[0212] In some embodiments of the present application, the preset surface energy threshold is 30 J / m 2 The shielding layer 700 may be formed by a surface energy lower than 30 J / m 2 The organic matter may contain elements such as C, O, H, and F.

[0213] In some implementations, the material of the shielding layer 700 includes, but is not limited to, one or more of perfluoropolyether, fluorosilane, and short-chain fluoroether. In addition, the material of the shielding layer 700 may also include other materials with a surface energy lower than 30 mJ / m 2 The organic matter containing C, O, H and F is not described in detail in this application.

[0214] In some embodiments of the present application, the contact angle between the shielding layer 700 and impurities such as dust and fiber filaments in the air is greater than 90°. The contact angle is the angle at which the liquid surface intersects the solid or gas when the liquid contacts the solid or gas. That is, at the point of contact between the liquid surface and the solid or gas, the angle between the tangent of the liquid surface and the tangent of the contact surface of the solid or gas. The size of the contact angle is related to the affinity between the liquid and the solid or gas. The greater the affinity, the smaller the contact angle.

[0215] In some embodiments of the present application, the initial water contact angle of the shielding layer 700 is greater than 100°. The initial water contact angle refers to the angle formed at one of the three-phase contact points (i.e., the contact point between the liquid, gas, and solid surface) when the droplet just contacts the solid surface. In other words, when a water droplet falls on the solid surface, the angle between the surface of the water droplet at the first contact point and the solid surface is the initial water contact angle. It can be used to characterize the affinity between liquid and solid, and the smaller it is, the more affinity the liquid has for the solid.

[0216] In some embodiments of the present application, the melting point of the shielding layer 700 is lower than 150° C., so that the shielding layer 700 can be completely removed by a plasma cleaning process in a coating machine.

[0217] In some implementations, the shielding layer 700 may be formed on the surface of the base layer 100 by spraying, physical vapor deposition (PVD), or the like.

[0218] In some implementations, the first preset thickness may range from 5 nm to 300 nm. For example, the first preset thickness may be any one of 5 nm, 6 nm, 8 nm, 10 nm, 20 nm, 30 nm, 40 nm, 50 nm, 100 nm, 150 nm, 200 nm, 250 nm, and 300 nm.

[0219] S1302: Arrange the prefabricated component 20 in the coating machine.

[0220] Among them, the coating machine can be an electron gun coating machine (such as electron gun evaporation equipment) or a sputtering coating machine (such as a vertical single-body magnetron furnace). This application does not specifically limit the type of coating machine.

[0221] In some embodiments of the present application, the prefabricated component 20 is arranged on a bracket of a coating machine.

[0222] In some embodiments of the present application, after the prefabricated component 20 is arranged on the bracket of the coating machine, the surface of the prefabricated component 20 is cleaned. The cleaning method of the prefabricated component 20 can refer to the cleaning method of the base layer 100 in S1101, which will not be repeated here.

[0223] S1303 : removing the shielding layer 700 to expose the first base surface 101 of the base layer 100 .

[0224] In some embodiments of the present application, as shown in FIG. 14( c ), the shielding layer 700 in the prefabricated component 20 is removed to expose the first substrate surface 101 of the substrate layer 100 .

[0225] In some embodiments of the present application, the shielding layer 700 is removed by a plasma cleaning process (PCP) to expose the first substrate surface 101 of the substrate layer 100. In some implementations, pure Ar / O2 mixed gas is used to perform plasma cleaning on the surface of the substrate layer 100.

[0226] In some implementations, the duration of plasma cleaning ranges from 10 minutes to 30 minutes. For example, the duration of plasma cleaning may include, but is not limited to, any one of 10 minutes, 15 minutes, 20 minutes, 25 minutes, and 30 minutes.

[0227] In some implementations, the shielding layer 700 is removed by an inductively coupled plasma cleaning process (ICPCP). A high-frequency electric field is used to convert an inert gas (such as Ar) into plasma to generate active species such as high-energy ion beams and free radicals. At the same time, an appropriate amount of gas source is added to cause a chemical reaction, thereby removing the shielding layer 700 on the first substrate surface 101 of the substrate layer 100.

[0228] The molding method of the display screen assembly 11 adopts an inductively coupled plasma cleaning process to remove the shielding layer 700, which has high removal efficiency and low damage. At the same time, the cleaning speed, cleaning depth and cleaning area can be controlled, and the operation is convenient.

[0229] S1304 : forming a hardened layer 200 on the first base surface 101 of the base layer 100 .

[0230] By comparison, it is not difficult to find that S1304 is the same as S1102, so the technical details of S1304 can be found in S1102 and will not be described in detail here.

[0231] S1305 : forming a protective layer 300 on the side of the hardening layer 200 facing away from the base layer 100 .

[0232] By comparison, it is not difficult to find that S1305 is similar to S1105. The difference between S1305 and S1102 is that in S1105, the protective layer 300 is formed on the surface of the side of the hardened layer 200 facing away from the base layer 100 and the surface of the filling part 500 facing away from the base layer 100, while in S1305, the protective layer 300 is formed on the surface of the side of the hardened layer 200 facing away from the base layer 100.

[0233] In the molding method of the display screen assembly 11, by adding the shielding layer 700, the prefabricated assembly 20 is prevented from chemically adsorbing with impurities, so that the impurities are easily removed by ion wind and plasma, and the difficulty of removing impurities on the surface of the prefabricated assembly 20 is reduced. Therefore, by introducing the shielding layer 700, the influence of impurities on the coating of the base layer 100 can be reduced, and impurities can be effectively prevented from entering the coating machine, thereby improving the product yield of the display screen assembly 11, and the product yield of the display screen assembly 11 is improved by more than 30%.

[0234] In addition, in order to solve the problem of the high appearance defective rate of the above-mentioned display screen assembly 11, the present application provides a molding scheme for the display screen assembly 11. The scheme forms a shielding layer 700 on the surface to be coated of the base layer 100 before the base layer 100 enters the coating machine, and the surface energy of the shielding layer 700 is relatively low, thereby reducing impurities brought into the base layer 100 when entering the coating machine, thereby reducing the probability of pits appearing in the hardening layer 200, reducing the probability of appearance defective points appearing in the display screen assembly 11, and reducing the appearance defective rate of the display screen assembly 11.

[0235] The following will be combined Fig.15 The molding scheme of the display screen assembly 11 in the present application is described in detail. Fig.15 A flow chart showing the molding scheme of the display screen assembly 11 in some other embodiments of the present application is shown. Fig.15 As shown, the molding scheme of the display screen assembly 11 provided in the present application may include the following steps:

[0236] S1501: forming a shielding layer 700 on the first substrate surface 101 of the substrate layer 100 to obtain a prefabricated component 20, wherein the surface energy of the shielding layer 700 is lower than a preset surface energy threshold.

[0237] By comparison, it is not difficult to find that S1501 is the same as S1301, so the technical details of S1501 can be found in S1301 and will not be described in detail here.

[0238] S1502: Arrange the prefabricated component 20 in the coating machine.

[0239] By comparison, it is not difficult to find that S1502 is the same as S1302, so the technical details of S1502 can be found in S1302, which will not be described in detail here.

[0240] S1503 : removing the shielding layer 700 to expose the first base surface 101 of the base layer 100 .

[0241] By comparison, it is not difficult to find that S1503 is the same as S1303, so the technical details of S1503 can be found in S1303, which will not be described in detail here.

[0242] S1504 : forming a hardened layer 200 on the first base surface 101 of the base layer 100 .

[0243] By comparison, it is not difficult to find that S1504 is the same as S1304, so the technical details of S1504 can be found in S1304, which will not be described in detail here.

[0244] S1505 : forming a filling layer 600 on the surface of the hardened layer 200 facing away from the base layer 100 .

[0245] By comparison, it is not difficult to find that S1505 is the same as S1103, so the technical details of S1505 can be found in S1103 and will not be described in detail here.

[0246] S1506: removing the redundant filling layer 600.

[0247] By comparison, it is not difficult to find that S1506 is the same as S1104, so the technical details of S1506 can be found in S1104 and will not be described in detail here.

[0248] S1507 : forming a protective layer 300 on the side of the hardening layer 200 facing away from the base layer 100 .

[0249] By comparison, it is not difficult to find that S1507 is the same as S1105, so the technical details of S1507 can be found in S1105 and will not be described in detail here.

[0250] After describing the molding scheme of the display screen assembly 11 in this application, the degree to which each molding scheme improves the product yield will be described in combination with a table. Among them, Table 1 shows the product yield of the display screen assembly 11 corresponding to different process parameters. The following specifically analyzes the influence of each process parameter on the product yield of the display screen assembly 11 based on the data in Table 1.

[0251] Table 1 Product yield of display screen assembly 11 corresponding to different process parameters

[0252]

[0253] Combined with the figures mentioned above: By comparing the data of the first group and the second group, it is not difficult to find that the initial water drop angle increases significantly with the addition of the shielding layer 700. By comparing the data of the second group and the third group, it is not difficult to find that with the increase in the thickness of the shielding layer 700, although the initial water drop angle does not change, the shielding layer 100 on the surface of the base layer 100 is more evenly distributed, that is, the shielding effect of the shielding layer 700 on the base layer 100 is more comprehensive, so the product yield is improved. By comparing the data of the third group and the fourth group, it is not difficult to find that adding a filling layer 600 before forming the protective layer 300, and then filling the third space S3 through the filling part 500, can improve the product yield of the display screen assembly 11. By comparing the data of the fourth group and the fifth group, it is not difficult to find that with the increase in the thickness of the filling layer 600, the filling effect of the filling part 500 on the third space S3 is improved, so the product yield of the display screen assembly 11 is improved. Comparing the data of Group 5 and Group 6, it is not difficult to find that when the total thickness of the filling layer is the same, the yield rate of the product with multiple filling and multiple curing is higher than that of the product with one filling and then curing. Comparing the data of Group 6 and Group 7, it is not difficult to find that when other process parameters are the same, the product yield rate increases with the increase of filling times.

[0254] In the molding method of the above-mentioned display screen assembly 11, by adding the shielding layer 700, the impurities on the surface of the prefabricated component 20 and the difficulty of removing the impurities are reduced, and the impurities entering the coating machine are reduced. At the same time, it is also possible to prevent the prefabricated component 20 from forming chemical adsorption with the impurities, so that the impurities are easily removed by ion wind and plasma. In addition, the concave points on the hardening layer 200 are filled with a filling material 600' having a refractive index close to that of the film layer, thereby reducing the white spot defects in the display screen assembly 11. Therefore, by introducing the shielding layer 700, the influence of impurities on the coating of the base layer 100 can be reduced, and by using the filling component 500, the influence of impurities on the coating of the base layer 100 can be compensated, and the product yield of the display screen assembly 11 can be increased to more than 50%. In addition, the stability of the product yield is significantly improved, and there is a lot of room for improving the product yield.

[0255] The above is a description of the implementation mode of the present application by specific specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation mode. On the contrary, the purpose of introducing the application in conjunction with the implementation mode is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, the following description will include many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0256] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "setting", "installation", "connection" and "fitting" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0257] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A display screen assembly, characterized in that: The display screen assembly includes a base layer and a film layer structure superimposed on one side surface of the base layer; the transmittance of the visible light band corresponding to the film layer structure is greater than a preset transmittance threshold, and the film layer structure has a filling space recessed toward the film layer structure on a side surface facing away from the base layer; the filling space is filled with a filling part, and the transmittance of the visible light band corresponding to the filling part is the same as or similar to the transmittance of the visible light band corresponding to the film layer structure.

2. The display screen assembly according to claim 1, characterized in that: The preset transmittance threshold is 89%.

3. The display screen assembly according to claim 1 or 2, characterized in that: The filling part comprises a base resin and an additive, wherein the mass percentage of the base resin ranges from 90% to 100%, and the mass percentage of the additive ranges from 0% to 10%.

4. The display screen assembly according to claim 3, characterized in that: The matrix resin includes one or more of polyester resin, acrylic resin, vinyl chloride copolymer resin, vinyl acetate copolymer resin, cellulose derivative resin, polycarbonate resin, polyvinyl butyral resin, epoxy acrylic resin, polyurethane acrylic resin, polysilane acrylic resin, epoxy resin and polyamide resin.

5. The display screen assembly according to any one of claims 1 to 4, characterized in that: The filling portion fills up the filling space.

6. The display screen assembly according to any one of claims 1 to 5, characterized in that: The material of the base layer includes glass and / or plastic.

7. The display screen assembly according to any one of claims 1 to 6, characterized in that: The size of the film layer structure in a first direction is greater than 300 nm, wherein the first direction is the overlapping direction of the film layer structure and the base layer.

8. The display screen assembly according to claim 7, characterized in that: The film layer structure comprises a first sublayer, a second sublayer and a third sublayer sequentially stacked on the surface of the base layer: The filling space extends to the third sublayer; or The filling space passes through the third sublayer and extends to the second sublayer; or The filling space passes through the third sub-layer and the second sub-layer and extends to the first sub-layer.

9. The display screen assembly according to claim 8, characterized in that: The size of the first sublayer in the first direction ranges from 0 to 200 nm, the size of the second sublayer in the first direction ranges from 0 to 20 μm, and the size of the third sublayer in the first direction ranges from 0 to 500 nm.

10. The display screen assembly according to any one of claims 1 to 9, characterized in that: The display screen assembly further comprises a protection layer, and the protection layer is stacked on the film layer structure and / or the side of the filling portion facing away from the base layer.

11. A method for forming a display screen assembly, characterized in that: The molding method comprises: Forming a film layer structure on the first substrate surface of the substrate layer, wherein a filling space is formed on a surface of the film layer structure facing away from the substrate layer; forming a filling layer on a side of the film layer structure facing away from the base layer, wherein the filling layer at least partially fills the filling space; The filling layer protruding from the membrane layer structure is at least partially removed to obtain a filling portion, and the filling portion at least partially fills the filling space.

12. The method for forming a display screen assembly according to claim 11, characterized in that: The raw material components of the filling layer include base resin and solvent, the mass percentage of the base resin ranges from 20% to 50%, and the mass percentage of the solvent ranges from 45% to 80%.

13. The method for forming a display screen assembly according to claim 12, characterized in that: The matrix resin includes one or more of polyester resin, acrylic resin, vinyl chloride copolymer resin, vinyl acetate copolymer resin, cellulose derivative resin, polycarbonate resin, polyvinyl butyral resin, epoxy acrylic resin, polyurethane acrylic resin, polysilane acrylic resin, epoxy resin and polyamide resin.

14. The method for forming a display screen assembly according to claim 12 or 13, characterized in that: The raw material components of the filling layer also include additives, the mass percentage of the additives ranges from 0% to 5%, and the additives include one or more of a curing agent, a leveling agent, a coupling agent and a photoinitiator.

15. The method for forming a display screen assembly according to any one of claims 11 to 14, characterized in that: The filling layer is formed on the side of the film layer structure facing away from the base layer by any one of spraying, flow coating, dip coating, hand coating, sputtering, injection, vapor deposition and electrophoretic deposition.

16. The method for forming a display screen assembly according to any one of claims 11 to 15, characterized in that: The filling layer protruding from the surface of the first substrate is at least partially removed by at least one of grinding, polishing, scraping with a scraper, milling, chemical dissolution, electrochemical removal and pyrolysis.

17. The method for forming a display screen assembly according to any one of claims 11 to 16, characterized in that: The size of the filling layer in the first direction ranges from 0 μm to 20 μm, wherein the first direction is the overlapping direction of the film layer structure and the base layer.

18. The method for forming a display screen assembly according to any one of claims 11 to 17, characterized in that: Before forming the film layer structure on the first substrate surface of the substrate layer, the forming method further comprises: Forming a shielding layer on the first substrate surface of the substrate layer to obtain a prefabricated component, wherein the surface energy of the shielding layer is lower than a preset surface energy threshold; The prefabricated component is placed in a coating machine, and the shielding layer in the prefabricated component is removed to expose the first substrate surface of the substrate layer.

19. The method for forming a display screen assembly according to claim 18, characterized in that: The preset surface energy threshold is 30 mJ / m 2 .

20. The method for forming a display screen assembly according to any one of claims 11 to 19, characterized in that: After grinding the filling layer to obtain a filling portion, wherein the filling portion at least partially fills the filling space, the method further comprises forming a protective layer on a side of the film layer structure and / or the filling portion facing away from the base layer.

21. An electronic device, characterized in that: The electronic device comprises the display screen assembly according to any one of claims 1 to 10.

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