Photovoltaic module and preparation method thereof

Abstract

The invention discloses a photovoltaic module and a preparation method thereof, and relates to the technical field of solar cell manufacturing, and the photovoltaic module specifically comprises a cover plate, a cell array, a filling layer and a backboard. Wherein the cover plate and the back plate are stacked, and the lower main surface of the cover plate and the upper main surface of the back plate are fixedly connected and define one or more hollow cavities; the hollow cavity is used for placing a battery array; and the filling layer is filled in the hollow cavity and is used for sealing the battery array. According to the embodiment, the structures of the cover plate and the back plate are improved, so that after the cover plate and the back plate are stacked, the lower main surface of the cover plate and the upper main surface of the back plate can be in direct contact and define the hollow cavity for placing the battery array; the sealing performance of the side surface of the photovoltaic module is effectively improved, and the problems of water vapor erosion and delamination corrosion are avoided. And meanwhile, the battery array is sealed through the filling layer, so that the battery array is further protected.

Description

Technical Field

[0001] The present invention relates to the technical field of solar cell manufacturing, and in particular to a photovoltaic module and a preparation method thereof. Background Art

[0002] Existing photovoltaic modules usually stack a cover plate, a front film, a battery array, a rear film and a back plate and laminate them into an integrated structure through a lamination process. For this type of stacked structure with exposed sides, there are often problems in performance such as poor resistance to water vapor, easy aging and yellowing, and easy delamination and corrosion. Summary of the invention

[0003] In view of this, the embodiment of the present invention provides a photovoltaic module and a preparation method thereof, which improves the structure of the cover plate and the back plate so that after the cover plate and the back plate are stacked, the lower main surface of the cover plate and the upper main surface of the back plate can directly contact and enclose a hollow cavity for placing a battery array. Compared with the stacked structure with exposed sides in the prior art, the sealing of the sides of the photovoltaic module is effectively improved, and the problems of water vapor erosion and delamination corrosion are avoided. At the same time, the battery array is sealed by the filling layer, and the battery array is further protected.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0005] In a first aspect, the present invention provides a photovoltaic module, comprising: a cover plate, a battery array, a filling layer and a back plate; wherein the cover plate and the back plate are stacked, and the lower main surface of the cover plate is fixedly connected to the upper main surface of the back plate and encloses one or more hollow cavities; the hollow cavity is used to place the battery array; the filling layer is filled in the hollow cavity to seal the battery array.

[0006] Optionally, one or more first grooves for placing battery strings in the battery array are provided on the lower main surface of the cover plate and / or the upper main surface of the back plate; the first grooves on the cover plate and / or the back plate constitute the entire or partial structure of the hollow cavity.

[0007] Optionally, one or more second grooves for placing interconnection bands in the battery array are also provided on the lower main surface of the cover plate and / or the upper main surface of the back plate; wherein the second grooves are cross-connected with the first grooves; and the second grooves are part of the hollow cavity.

[0008] Optionally, the depth of the hollow cavity is 200 μm to 600 μm.

[0009] Optionally, the filling material in the filling layer is at least one of epoxy resin, polyurethane, liquid silicone and silicone oil, and the refractive index of the filling layer is 1.5-2.5.

[0010] Optionally, it further includes: a lead-out hole provided on the upper main surface of the cover plate or the lower main surface of the back plate; the position of the lead-out hole corresponds to the second groove and is connected to the hollow cavity.

[0011] Optionally, it further includes: a packaging film disposed in the lead-out hole; the packaging film encapsulates the filling layer in the hollow cavity.

[0012] In a second aspect, the present invention provides a method for preparing a photovoltaic module, comprising:

[0013] Step 1, laying a back plate, a battery array and a cover plate in sequence, so that the battery array is located in a hollow cavity formed between the cover plate and the back plate; the battery array is a battery array with a filling layer pre-cured on the surface or a battery array without a filling layer pre-cured on the surface;

[0014] Step 2, welding the contact surface between the cover plate and the back plate in the area where the hollow cavity is not provided;

[0015] Wherein, in case that the battery array surface is not pre-cured with a filling layer, after step 2, the method further includes: step 3, in case that the battery array surface is not pre-cured with a filling layer, pouring a filling material into the hollow cavity and curing it to form a filling layer that seals the battery array;

[0016] In the case where the battery array is a battery array with a filling layer pre-cured on the surface, before step 1, it also includes: step 0, in a vacuum environment, coating the filling material on the surface of the blank battery array, and obtaining the battery array with a filling layer pre-cured on the surface after curing.

[0017] The technical solution of the first aspect of the above invention has the following advantages or beneficial effects: by improving the structure of the cover plate and the back plate, after the cover plate and the back plate are stacked, the lower main surface of the cover plate and the upper main surface of the back plate can directly contact and enclose a hollow cavity for placing the battery array, which effectively improves the sealing of the side of the photovoltaic module compared with the stacked structure with exposed sides in the prior art, avoiding the problems of water vapor erosion and delamination corrosion. At the same time, the battery array is sealed by the filling layer, which further protects the battery array. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to better understand the present invention and do not constitute an improper limitation of the present invention.

[0019] Figure 1 It is a schematic diagram of the structure of a photovoltaic module in the prior art;

[0020] Figure 2 is a schematic cross-sectional structural diagram of a photovoltaic assembly in which only a first groove is provided on the lower main surface of a cover plate according to an embodiment of the present invention;

[0021] Figure 3 is a schematic cross-sectional structural diagram of a photovoltaic module in which first grooves are symmetrically arranged on a cover plate and a back plate according to an embodiment of the present invention;

[0022] Figure 4 is a schematic cross-sectional structural diagram of a photovoltaic module in which only a first groove is provided on the upper main surface of a back plate according to an embodiment of the present invention;

[0023] Figure 5 is a schematic diagram of a planar structure of a first groove and a second groove according to an embodiment of the present invention;

[0024] Figure 6 is a schematic cross-sectional structure diagram of a first groove according to an embodiment of the present invention;

[0025] Figure 7 is a schematic structural diagram of setting a lead-out hole at an edge of a cover plate or a back plate according to an embodiment of the present invention;

[0026] Figure 8 It is a structural schematic diagram of setting the lead-out hole in the middle area of ​​the cover plate or the back plate according to an embodiment of the present invention;

[0027] Fig. 9 is a schematic flow chart of a method for preparing a photovoltaic module according to an embodiment of the present invention;

[0028] Fig.10 It is a specific flowchart of step S903 according to an embodiment of the present invention.

[0029] The reference numerals are as follows:

[0030] 1-cover plate; 2-battery array; 3-filling layer; 4-back plate; 41-lead hole;

[0031] 100 - hollow cavity; 200 - first groove; 300 - second groove. DETAILED DESCRIPTION

[0032] A solar cell is a photoelectric semiconductor sheet that uses sunlight to generate electricity directly. It is also called a "solar chip" or "photovoltaic cell". As long as it is illuminated by light that meets certain illumination conditions, it can instantly output voltage and generate current in the presence of a circuit. In physics, it is called solar photovoltaic (PV), or photovoltaic for short. In order to conveniently and clearly describe the method for preparing a solar cell and the solar cell of the present invention, the following exemplary embodiments of the present invention are described in conjunction with the accompanying drawings, which include various details of the embodiments of the present invention to facilitate understanding, and they should be considered as merely exemplary. Therefore, those of ordinary skill in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. Similarly, for the sake of clarity and conciseness, the description of well-known functions and structures is omitted in the following description.

[0033] The photovoltaic module of the prior art is usually a cover plate 1, a front adhesive film, a battery array 2, a rear adhesive film and a back plate 4 are stacked and arranged and then laminated into an integrated structure through a lamination process, such as Figure 1 As shown. The multi-layer stacked structure makes the sides of the front film, the battery array 2, and the back film all exposed. Although there is a frame on the outside of the photovoltaic module and a packaging film filling the gap between the frame and the photovoltaic module, due to the material of the film itself, under long-term water vapor erosion, water vapor penetration will still occur, causing the photovoltaic module to age and turn yellow or even delaminate and corrode. Therefore, the embodiment of the present invention provides a new photovoltaic module structure, which can effectively avoid the problem of exposed sides of the photovoltaic module and improve the service life of the photovoltaic module.

[0034] Figures 2 to 4 The cross-sectional structure diagram of the photovoltaic module provided by the embodiment of the present invention is shown as follows: Figures 2 to 4 As shown, the photovoltaic module provided by the present invention includes: a cover plate 1, a battery array 2, a filling layer 3 and a back plate 4; wherein the cover plate 1 and the back plate 4 are stacked, and the lower main surface of the cover plate 1 and the upper main surface of the back plate 4 are fixedly connected and enclose one or more hollow cavities 100; the hollow cavity 100 is used to place the battery array 2; the filling layer 3 is filled in the hollow cavity 100 to seal the battery array 2.

[0035] from Figure 2It can be seen that the embodiment of the present invention provides a hollow cavity 100 enclosed by the cover plate 1 and the back plate 4, which effectively protects the battery array 2 and the filling layer 3, avoids the problem of directly exposing the filling layer 3 or the side of the battery array 2, and greatly improves the sealing of the photovoltaic module. Moreover, through the direct contact between the cover plate 1 and the back plate 4, the overall mechanical strength of the photovoltaic module is improved, and the deformation problem of the photovoltaic module is effectively avoided. At the same time, compared with the conventional filled cavity assembly, the filling layer 3 in the embodiment of the present invention is not only used to seal the battery array, but also can avoid the problem of excessive temperature caused by poor heat transfer inside the cavity.

[0036] In an optional embodiment, one or more first grooves 200 for placing battery strings in the battery array 2 are provided on the lower main surface of the cover plate 1 and / or the upper main surface of the back plate 4; the first grooves 200 on the cover plate 1 and / or the back plate 4 constitute the entire or partial structure of the hollow cavity 100. It can be understood that in the embodiment of the present invention, a part or all of the cavity for placing the battery strings in the battery array 2 is formed by the first grooves 200. As to whether the first grooves 200 are provided on the cover plate 1, the back plate 4, or both the cover plate 1 and the back plate 4, it can be arranged according to requirements. Specifically, the arrangement position of the hollow cavity 100 can be as follows: Figures 2 to 4 As shown, Figure 2 The first groove 200 is only provided on the lower main surface of the cover plate 1. Figure 3 The first groove 200 is symmetrically arranged on the cover plate 1 and the back plate 4. Figure 4 The first groove 200 is only provided on the upper main surface of the back plate 4. Figures 2 to 4 It can be seen that when the first groove 200 is set at different positions, the position of the hollow cavity 100 will also change accordingly. In an optional embodiment, in order to relatively simplify the manufacturing process of the cover plate 1 and the back plate 4, it is preferred to adopt Figure 3 In this way, the first groove 200 is provided on both the cover plate 1 and the back plate 4, so that in the production process of the cover plate 1 and the back plate 4, the same layout can be used for unified production, that is, the produced glass assembly can be used as both the cover plate 1 and the back plate 4, and there is no need to produce the cover plate 1 and the back plate 4 separately. Further, in order to ensure that the hollow cavity 100 can smoothly place the battery array 2 without causing unnecessary waste of space, in an optional embodiment, the depth of the hollow cavity 100 is 200 μm~600 μm, for example, 200 μm, 300 μm, 450 μm, 500 μm, 600 μm, etc.

[0037] In addition to the hollow area for placing the battery strings in the battery array 2, part of the hollow area is also required for placing the interconnection belts in the battery array 2. Therefore, in an optional embodiment, one or more second grooves 300 for placing the interconnection belts in the battery array 2 are further provided on the lower main surface of the cover plate 1 and / or the upper main surface of the back plate 4; wherein the second groove 200 is cross-connected with the first groove 100; and the second groove 300 is a part of the hollow cavity 100.

[0038] Specifically, since the battery array 2 is generally a sheet structure, in order to ensure that the battery array 2 does not bend and thus affect the performance of the battery array 2, in the embodiment of the present invention, if the first groove 200 is as Figure 2 As shown, the second groove 300 is only arranged on the lower main surface of the cover plate 1. Figure 3 As shown, the second groove 300 is synchronously arranged on the cover plate 1 and the back plate 4, and the second groove 300 is also synchronously arranged on the cover plate 1 and the back plate 4. Exemplarily, the positional relationship between the second groove 300 and the first groove 200 can be as follows: Figure 5 and Figure 6 As shown, Figure 5 is a schematic diagram of the planar structure of the first groove 200 and the second groove 300, Figure 6 2 is a schematic diagram of the cross-sectional structure of the first groove 200. It can be understood that in the battery array 2, the interconnection belt realizes the electrical connection between multiple battery strings, so the setting direction of the interconnection belt and the battery string is intersecting, usually vertically arranged, so the second groove 300 and the first groove 200 in the embodiment of the present invention are also arranged vertically to each other in a preferred embodiment. In addition, for different battery array 2 structures, the setting position of the interconnection belt is also different. Figure 5 Taking as an example, the case where the interconnection belt is arranged at the left and right ends of the battery string is described. When the interconnection belt is arranged at other positions, the position of the second groove 300 also changes accordingly and corresponds to the interconnection belt.

[0039] In order to ensure that the hollow cavity 100 can be used to place the battery array 2 and is neither too deep nor too shallow, in a further optional embodiment, the depth of the first groove 200 is 100 μm~600 μm, for example, 100 μm, 150 μm, 200 μm, 300 μm, 400 μm, 600 μm, etc.; the depth of the second groove 300 is 100 μm~600 μm, for example, 100 μm, 150 μm, 200 μm, 300 μm, 400 μm, 600 μm, etc. It can be understood that when the first groove 200 and the second groove 300 are only provided on the cover plate 1 or the back plate 4, the depth of the first groove 200 and the second groove 300 themselves constitutes the depth of the hollow cavity 100, so in a further optional embodiment, the depth of the first groove 200 or the second groove 300 is 200 μm~600 μm; when the first groove 200 and the second groove 300 are provided on both the cover plate 1 and the back plate 4 at the same time, the two first grooves 200 symmetrically arranged on the lower surface of the cover plate 1 and the upper surface of the back plate 4 jointly constitute the depth of the hollow cavity 100, and similarly, the second grooves 300 symmetrically arranged on the lower surface of the cover plate 1 and the upper surface of the back plate 4 also jointly constitute the depth of the hollow cavity 100, so in a further optional embodiment, the depth of the first groove 200 is 100 μm~300 μm, and the depth of the second groove 300 is also 100 μm~300 μm, the two first grooves 200 and the two second grooves 300 arranged opposite to each other together form a hollow cavity 100 with a depth of 200 μm-600 μm.

[0040] For the filling layer 3 of the sealed battery array 2, in an optional embodiment, the filling material in the filling layer 3 is at least one of epoxy resin, polyurethane, liquid silicone and silicone oil, and the refractive index of the filling layer 3 is 1.5 to 2.5, such as 1.5, 2.0, 2.5, etc. Among them, the cover plate 1 and the back plate 4 in the embodiment of the present invention can be selected from conventional glass materials. The refractive index of the selected filling material is close to that of the glass material and is between the battery array 2 and the glass material. Compared with the front adhesive film and the back adhesive film with lower refractive index in the prior art, the optical loss is effectively reduced and the overall efficiency of the photovoltaic module is improved.

[0041] For the photovoltaic module, it is also necessary to set a through hole for leading out the interconnection ribbon, so as to connect the interconnection ribbon with the junction box, so as to obtain a complete photovoltaic module. Therefore, in an optional embodiment, the photovoltaic module provided by the embodiment of the present invention also includes: a lead-out hole 41 provided on the upper main surface of the cover plate 1 or the lower main surface of the back plate 4; the position of the lead-out hole 41 corresponds to the second groove 300, and is connected to the hollow cavity 100. For example, Figure 7 and Figure 8The location of the lead-out hole 41 is specifically described by taking as an example, wherein: Figure 7 This is a schematic diagram of the structure in which the lead-out hole 41 is arranged at the edge of the cover plate 1 or the back plate 4. Figure 8 The schematic diagram of the structure in which the lead-out hole 41 is set in the middle area of ​​the cover plate 1 or the back plate 4. It can be understood that since the function of the lead-out hole 41 is to lead out the interconnection belt in the battery array 2 for subsequent electrical connection with the junction box, the position of the lead-out hole 41 is set corresponding to the second groove 300, which can shorten the setting length of the interconnection belt as much as possible. At the same time, the number of the lead-out holes 41 can be set according to the actual setting of the interconnection belt.

[0042] In order to ensure the sealing of the filling layer 3 and prevent the filling layer 3 from leaking out of the lead-out hole 41, in a further optional embodiment, the photovoltaic component provided by the embodiment of the present invention also includes: a packaging film arranged in the lead-out hole 41; wherein the packaging film encapsulates the filling layer 3 in the hollow cavity 100.

[0043] In summary, the photovoltaic module provided by the embodiment of the present invention improves the structure of the cover plate and the back plate, so that after the cover plate and the back plate are stacked, the lower main surface of the cover plate and the upper main surface of the back plate can directly contact and enclose a hollow cavity for placing the battery array. Compared with the stacked structure with exposed sides in the prior art, the sealing of the side of the photovoltaic module is effectively improved, avoiding the problems of water vapor erosion and delamination corrosion. At the same time, the battery array is sealed by the filling layer, which further protects the battery array.

[0044] In one embodiment of the present invention, Fig. 9 As shown, this embodiment provides a method for preparing a photovoltaic module, and the preparation method may include the following steps:

[0045] Step S901, laying a back plate, a battery array and a cover plate in sequence, so that the battery array is located in a hollow cavity formed between the cover plate and the back plate; the battery array is a battery array with a filling layer pre-cured on the surface or a battery array without a filling layer pre-cured on the surface;

[0046] Step S902, welding the contact surface between the cover plate and the back plate in the area where the hollow cavity is not provided;

[0047] In the case where there is no filling layer pre-cured on the surface of the battery array, the method further includes: step S903, pouring a filling material into the hollow cavity and curing it to form a filling layer that seals the battery array;

[0048] In the case where the battery array is a battery array with a filling layer pre-cured on the surface, before step 1, it also includes: step S900, in a vacuum environment, coating the filling material on the surface of the blank battery array, and obtaining a battery array with a filling layer pre-cured on the surface after curing.

[0049] It is understandable that for a battery array with a pre-cured filling layer, only steps S900 to S902 need to be performed, and the post-filling step of step S903 does not need to be performed. The battery array with a pre-cured filling layer is directly stacked with the back plate and the cover plate, and then welded in one step. For a battery array without a pre-cured filling layer, step S900 does not exist, and steps S901 to S903 only need to be performed.

[0050] Among them, the back plate and cover plate laid in step S901 can both be made of glass material, and in an optional embodiment, step S902 can use femtosecond laser welding technology or high-energy laser welding technology to weld the contact surface. It should be noted that compared with other welding technologies, femtosecond laser welding technology has a better welding effect on glass materials. Therefore, when the back plate and cover plate are made of glass material, the femtosecond welding technology is selected to achieve the welding function. It can be understood that for different welding materials, corresponding welding technologies can be selected in a targeted manner to ensure the welding effect between different welding materials. The present invention does not make specific limitations on this. In addition to welding technology, adhesive bonding or other methods can also be used to fix the cover plate and the back plate as one. In addition, compared with the technology of sealing the edge by hot-melt glass in the prior art, the above-mentioned welding process consumes less energy and has higher welding efficiency, and will not cause local stress changes in the glass, resulting in uneven stress in the glass or a decrease in the degree of toughening.

[0051] It should be noted that step S903 is limited to the case where there is no pre-cured filling layer on the surface of the battery array, that is, after step S902, the back plate, battery array and cover plate are only welded together, but the hollow cavity is not filled. Therefore, step S903 needs to be performed after welding to pour the filling material into the hollow cavity by post-filling to form a filling layer that seals the battery array. In an optional embodiment, when the filling material is at least one of epoxy resin, polyurethane, and liquid silicone, step S903 can be as follows: Fig.10 As shown, specifically including:

[0052] Step S1001, using the lead-out holes provided on the cover plate or the back plate, pouring a filling material into the hollow cavity;

[0053] Step S1002, vacuuming or curing the filling material to form a filling layer; wherein vacuuming is achieved by a laminator or a vacuum furnace; curing includes at least one of the following curing methods: light curing, room temperature curing, and high temperature curing.

[0054] When multiple lead-out holes are provided on the back plate, one of the lead-out holes can be used as the filling inlet, and conduits can be installed on the other lead-out holes. During the continuous filling process, it can be determined whether the hollow cavity is completely filled by observing whether filling material flows out of the conduits of the other lead-out holes. Specifically, a one-way valve can also be installed at the filling inlet to ensure the one-way nature of the filling process. When the filling is completed, the conduit and the one-way valve can be removed.

[0055] In an optional embodiment, the laminator is a double-chamber laminator, wherein the temperature of the first cavity is 65°C~70°C, and the temperature of the second cavity is 110°C~120°C; the vacuuming time is 5 min~20 min, for example, 5 min, 10 min, 15 min, 20 min, etc.; the curing time is 5 min~20 min, for example, 5 min, 10 min, 12 min, 15 min, 18 min, 20 min, etc.

[0056] In summary, the method for preparing a photovoltaic module provided by the embodiment of the present invention improves the structure of the cover plate and the back plate so that after the cover plate and the back plate are stacked, the lower main surface of the cover plate and the upper main surface of the back plate can directly contact and enclose a hollow cavity for placing the battery array. Compared with the stacked structure with exposed sides in the prior art, the sealing of the sides of the photovoltaic module is effectively improved, and the problems of water vapor erosion and delamination corrosion are avoided. At the same time, the battery array is sealed by the filling layer, and the battery array is further protected.

[0057] Example 1

[0058] A method for preparing a photovoltaic module, comprising:

[0059] S1. Laying the back glass with the first groove and the second groove pre-prepared, the battery array, and the cover glass with the first groove and the second groove pre-prepared from bottom to top in sequence; wherein the depth of the first groove and the second groove is 275 μm, and the thickness of the battery array is 540 μm; the first groove and the second groove together form a hollow cavity for placing the battery array;

[0060] S2. Use femtosecond laser welding technology to laser weld the contact surface between the cover glass and the back glass;

[0061] S3, pouring liquid silicone from one lead-out hole of the back panel glass, and sticking a catheter for guiding out silicone on the remaining lead-out holes, and judging whether the hollow cavity is filled with silicone by observing whether silicone flows out of the catheter, and removing the catheter after it is completely filled;

[0062] S4, using a double-chamber laminator for vacuuming and curing, with one chamber at 65°C for vacuuming for 10 min, and the second chamber at 110°C for curing for 15 min;

[0063] S5. Use butyl adhesive to fill the lead-out holes, frame them, install the junction box, cure them, and test them.

[0064] The test results are as follows: The photovoltaic module prepared in Example 1 was subjected to a damp heat test, a dynamic mechanical load, a static mechanical load, and a high and low temperature cycle test. After the damp heat test and the high and low temperature cycle, the appearance of the module did not change significantly, the power loss was within 2.5%, and the problem of blackening of the edges of the conventional module was not observed after the test; after the dynamic mechanical load and static mechanical load tests, the module did not break, and no new hidden cracks were observed.

[0065] Example 2

[0066] A method for preparing a photovoltaic module, comprising:

[0067] S1. In a vacuum environment, a filling material is coated on the surface of the battery array and cured to form a filling layer;

[0068] S2, laying the back glass with the first groove and the second groove prepared in advance, the battery array with the cured filling layer, and the cover glass with the first groove and the second groove prepared in advance from bottom to top; wherein the depth of the first groove and the second groove is 275 μm, and the thickness of the battery array is 540 μm; the first groove and the second groove together form a hollow cavity for placing the battery array;

[0069] S3, using femtosecond laser welding technology to laser weld the contact surface between the cover glass and the back glass;

[0070] S4. Use butyl adhesive to fill the lead-out holes, frame them, install the junction box, cure them, and test them.

[0071] The test results are as follows: The photovoltaic module prepared in Example 2 was subjected to a damp heat test, a dynamic mechanical load, a static mechanical load, and a high and low temperature cycle test. After the damp heat test and the high and low temperature cycle, the appearance of the module did not change significantly, the power loss was within 1.5%, and the problem of blackening of the edges of the conventional module was not observed after the test; after the dynamic mechanical load and static mechanical load tests, the module did not break, and no new hidden cracks were observed.

[0072] It can be seen from the test results of the above-mentioned Examples 1 and 2 that the photovoltaic module and the method for preparing the photovoltaic module provided by the embodiments of the present invention, while ensuring the battery performance, improve the dynamic mechanical load and the static mechanical load at the same time, thereby effectively improving the airborne strength of the photovoltaic module.

[0073] The introduction provided in the above steps is only used to help understand the structure, method and core idea of ​​the present invention. For ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also belong to the scope of protection of the claims of the present invention.

Claims

1. A photovoltaic module, characterized in that: include: A cover plate (1), a battery array (2), a filling layer (3) and a back plate (4); The cover plate (1) and the back plate (4) are stacked, and the lower main surface of the cover plate (1) and the upper main surface of the back plate (4) are fixedly connected to each other and enclose one or more hollow cavities (100); The hollow cavity (100) is used to house the battery array (2); The filling layer (3) is filled in the hollow cavity (100) and is used to seal the battery array (2).

2. The photovoltaic module according to claim 1, characterized in that: One or more first grooves (200) for placing battery strings in the battery array (2) are provided on the lower main surface of the cover plate (1) and / or the upper main surface of the back plate (4); The first groove (200) on the cover plate (1) and / or the back plate (4) constitutes the entire or partial structure of the hollow cavity (100).

3. The photovoltaic module according to claim 2, characterized in that: One or more second grooves (300) for placing interconnection ribbons in the battery array (2) are also provided on the lower main surface of the cover plate (1) and / or the upper main surface of the back plate (4); Wherein, the second groove (300) is cross-connected with the first groove (200); The second groove (300) is a part of the hollow cavity (100).

4. The photovoltaic module according to any one of claims 1 to 3, characterized in that: The depth of the hollow cavity (100) is 200 μm to 600 μm.

5. The photovoltaic module according to claim 1, characterized in that: The filling material in the filling layer (3) is at least one of epoxy resin, polyurethane, liquid silicone and silicone oil, and the refractive index of the filling layer (3) is 1.5-2.

5.

6. The photovoltaic module according to claim 3, characterized in that: Also includes: A lead-out hole (41) provided on the upper main surface of the cover plate (1) or the lower main surface of the back plate (4); The position of the lead-out wire hole (41) corresponds to the second groove (300), and is communicated with the hollow cavity (100).

7. The photovoltaic module according to claim 6, characterized in that: Also includes: A packaging adhesive film arranged in the lead-out hole (41); The packaging adhesive film encapsulates the filling layer (3) in the hollow cavity (100).

8. A method for preparing a photovoltaic module, characterized in that: include: Step 1, laying a back plate, a battery array and a cover plate in sequence, so that the battery array is located in a hollow cavity formed between the cover plate and the back plate; The battery array is a battery array with a filling layer pre-cured on the surface or a battery array without a filling layer pre-cured on the surface; Step 2, welding the contact surface between the cover plate and the back plate in the area where the hollow cavity is not provided; Wherein, in case that the filling layer is not pre-cured on the surface of the battery array, after step 2, the method further includes: Step 3, pouring a filling material into the hollow cavity and curing it to form a filling layer that seals the battery array; In the case where the battery array is a battery array with a filling layer pre-cured on the surface, before step 1, the method further includes: Step 0: In a vacuum environment, a filling material is coated on the surface of a blank battery array, and after curing, a battery array with a filling layer pre-cured on the surface is obtained.

9. The preparation method according to claim 8, characterized in that: When the filling material is at least one of epoxy resin, polyurethane and liquid silicone, step 3 includes: Step 31, using the lead-out holes provided on the cover plate or the back plate, pouring a filling material into the hollow cavity; Step 32, vacuuming or curing the filling material to form the filling layer; wherein vacuuming is achieved by a laminator or a vacuum furnace; and curing includes at least one of the following curing methods: light curing, room temperature curing, and high temperature curing.

10. The preparation method according to claim 8, characterized in that: The step 2 uses femtosecond laser welding technology or high-energy laser welding technology to weld the contact surface.

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