Preparation method of display panel, display panel and display device

Abstract

The invention discloses a preparation method of a display panel, the display panel and a display device. The preparation method comprises the following steps: preparing an isolation structure on one side of a substrate, the isolation structure enclosing to form a plurality of isolation openings, including first isolation openings and second isolation openings; arranging a first preparation material layer on one side, deviating from the substrate, of the isolation structure and the isolation opening, wherein the first preparation material layer comprises a first light-emitting material layer; a first photoresist protection layer is manufactured on the side, away from the substrate, of the first preparation material layer; part of the first photoresist protection layer in the first isolation opening is removed in the thickness direction of the substrate, all of the first photoresist protection layer in the second isolation opening is removed, a first photoresist protection part is formed, and the first photoresist protection part covers the first isolation opening and part of the isolation structure surrounding the first isolation opening; and patterning the first preparation material layer through the first photoresist protection part to form a first light-emitting structure. The risk that the anode of the display panel is damaged can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for preparing a display panel, a display panel and a display device. Background Art

[0002] When manufacturing an organic light emitting diode display panel, if a vertical evaporation technology of an organic light emitting material without a metal mask is used, the anode may be damaged during the process of etching and removing the light emitting material, thereby affecting the display effect of the display panel. Summary of the invention

[0003] The embodiments of the present application provide a method for manufacturing a display panel, a display panel, and a display device, which can reduce the risk of damage to the anode of the display panel.

[0004] In a first aspect, an embodiment of the present application provides a method for preparing a display panel, comprising: preparing an isolation structure on one side of a substrate, the isolation structure enclosing a plurality of isolation openings, the plurality of isolation openings comprising a first isolation opening and a second isolation opening; providing a first preparation material layer at least in the isolation structure and the isolation openings, the first preparation material layer comprising a first light-emitting material layer; making a first photoresist protection layer on a side of the first preparation material layer away from the substrate; removing a portion of the first photoresist protection layer in the first isolation opening along a thickness direction of the substrate, and removing all of the first photoresist protection layer in the second isolation opening to form a first photoresist protection portion, the first photoresist protection portion covering the first preparation material layer in the first isolation opening and a portion of the isolation structure surrounding the first isolation opening; patterning the first preparation material layer through the first photoresist protection portion to form a first light-emitting structure located in the first isolation opening.

[0005] According to an embodiment of the first aspect of the present application, in the step of removing part of the first photoresist protection layer in the first isolation opening along the thickness direction of the substrate, and removing all of the first photoresist protection layer in the second isolation opening to form a first photoresist protection part, the first photoresist protection part covers the first preparation material layer in the first isolation opening and part of the isolation structure surrounding the first isolation opening, and the thickness of the first photoresist protection part in the first isolation opening is equal to the thickness of the first light-emitting material layer.

[0006] According to an embodiment of the first aspect of the present application, a portion of the first photoresist protection layer in the first isolation opening is removed along the thickness direction of the substrate, and the entire first photoresist protection layer in the second isolation opening is removed to form a first photoresist protection portion, wherein the first photoresist protection portion covers the first preparation material layer in the first isolation opening and a portion of the isolation structure surrounding the first isolation opening, including: using a first mask to process the first photoresist protection layer, the first mask including a first area and a second area; when processing the first photoresist protection layer, along the thickness direction of the substrate, the orthographic projection of the first area at least partially overlaps with the orthographic projection of the first isolation opening, and the orthographic projection of the second area at least partially overlaps with the orthographic projection of the second isolation opening; the transmittance of the first area is less than the transmittance of the second area.

[0007] According to an embodiment of the first aspect of the present application, a portion of the first photoresist protection layer in the first isolation opening is removed along the thickness direction of the substrate, and all of the first photoresist protection layer in the second isolation opening is removed to form a first photoresist protection portion, wherein the first photoresist protection portion covers the first preparation material layer in the first isolation opening and a portion of the isolation structure surrounding the first isolation opening, including: removing at least a portion of the first photoresist protection layer located on a side of the isolation structure away from the substrate along the thickness direction of the substrate, the first photoresist protection portion including a first covering portion covering the first isolation opening and a second covering portion at least partially covering the isolation structure, wherein the thickness of the second covering portion is greater than the thickness of the first covering portion.

[0008] According to an embodiment of the first aspect of the present application, a step of removing a portion of the first photoresist protection layer in the first isolation opening along the thickness direction of the substrate, and removing the entire first photoresist protection layer in the second isolation opening to form a first photoresist protection portion, wherein the first photoresist protection portion covers the first preparation material layer in the first isolation opening and a portion of the isolation structure surrounding the first isolation opening, includes: using a first mask to process the first photoresist protection layer, the first mask comprising a first region, a second region and a third region; when processing the first photoresist protection layer, along the thickness direction of the substrate, the orthographic projection of the first region at least partially overlaps with the orthographic projection of the first isolation opening, the orthographic projection of the second region at least partially overlaps with the orthographic projection of the second isolation opening, the third region at least partially surrounds the first region and the second region, the transmittance of the first region is less than the transmittance of the second region, and the transmittance of the third region is less than the transmittance of the first region.

[0009] According to an embodiment of the first aspect of the present application, the orthographic projection of the third region at least partially overlaps with the orthographic projection of the isolation structure;

[0010] Preferably, along the thickness direction of the substrate, the area of ​​the orthographic projection of the first region is smaller than or equal to the orthographic projection of the first isolation opening;

[0011] Preferably, along the thickness direction of the substrate, the area of ​​the orthographic projection of the second region is smaller than or equal to the orthographic projection of the second isolation opening.

[0012] According to an embodiment of the first aspect of the present application, a step of removing a portion of the first photoresist protection layer in the first isolation opening along the thickness direction of the substrate, and removing all of the first photoresist protection layer in the second isolation opening to form a first photoresist protection portion, wherein the first photoresist protection portion covers the first preparation material layer in the first isolation opening and a portion of the isolation structure surrounding the first isolation opening, includes: retaining the first photoresist protection layer on the side of the isolation structure away from the substrate along the thickness direction of the substrate, the first photoresist protection portion including a first covering portion covering the first isolation opening and a second covering portion at least partially covering the isolation structure, the thickness of the second covering portion being greater than the thickness of the first covering portion.

[0013] According to an embodiment of the first aspect of the present application, a portion of the first photoresist protection layer in the first isolation opening is removed along the thickness direction of the substrate, and all of the first photoresist protection layer in the second isolation opening is removed to form a first photoresist protection portion, wherein the first photoresist protection portion covers the first preparation material layer in the first isolation opening and a portion of the isolation structure surrounding the first isolation opening, including: using a first mask to process the first photoresist protection layer, the first mask comprising a first region, a second region and a third region; when processing the first photoresist protection layer, along the thickness direction of the substrate, the orthographic projection of the first region at least partially overlaps with the orthographic projection of the first isolation opening, the orthographic projection of the second region at least partially overlaps with the orthographic projection of the second isolation opening, and the third region at least partially surrounds the first region and the second region; the transmittance of the first region is less than the transmittance of the second region, and the transmittance of the third region is 0.

[0014] According to an embodiment of the first aspect of the present application, the orthographic projection of the third region at least partially overlaps with the orthographic projection of the isolation structure;

[0015] Preferably, along the thickness direction of the substrate, the area of ​​the orthographic projection of the first region is less than or equal to the area of ​​the orthographic projection of the first isolation opening;

[0016] Preferably, along the thickness direction of the substrate, the area of ​​the orthographic projection of the second region is smaller than or equal to the area of ​​the orthographic projection of the second isolation opening.

[0017] According to an embodiment of the first aspect of the present application, the first preparation material layer also includes a first electrode material layer located on the side of the first light-emitting material layer facing away from the substrate; before the step of patterning the first preparation material layer through the first photoresist protection portion to form a first light-emitting structure located in the first isolation opening, the method for preparing the display panel also includes: removing the first electrode material layer in the second isolation opening to form a first sub-electrode located on the side of the first light-emitting structure facing away from the substrate.

[0018] According to an embodiment of the first aspect of the present application, the first preparation material layer also includes a first packaging material layer located on the side of the first electrode material layer facing away from the substrate. Before making the first sub-electrode, the method for preparing the display panel also includes: making the first packaging material layer on the side of the first electrode material layer facing away from the substrate; before the step of patterning the first preparation material layer through the first photoresist protection part to form a first light-emitting structure located in the first isolation opening, the method for preparing the display panel also includes: removing the first packaging material layer in the second isolation opening to form a first packaging part located on the side of the first sub-electrode facing away from the substrate.

[0019] According to an embodiment of the first aspect of the present application, the substrate includes: an array layer, the array layer includes a plurality of second electrodes; in the step of preparing an isolation structure on one side of the substrate, the second electrode is at least partially exposed to the first isolation opening and / or the second isolation opening.

[0020] According to an embodiment of the first aspect of the present application, it also includes: at least a second preparation material layer is set in the isolation structure and the isolation opening, the second preparation material layer includes a second light-emitting material layer; a second photoresist protection layer is made on the side of the second preparation material layer facing away from the substrate; a portion of the second photoresist protection layer in the second isolation opening is removed along the thickness direction of the substrate, and all of the second photoresist protection layer in the first isolation opening is removed to form a second photoresist protection portion, the second photoresist protection portion covers the second preparation material layer in the second isolation opening and a portion of the isolation structure surrounding the second isolation opening; the second preparation material layer is patterned by the second photoresist protection portion to form a second light-emitting structure located in the second isolation opening.

[0021] According to an embodiment of the first aspect of the present application, in the step of removing part of the second photoresist protection layer in the second isolation opening along the thickness direction of the substrate, and removing all of the second photoresist protection layer in the first isolation opening to form a second photoresist protection portion, the second photoresist protection portion covers the second preparation material layer in the second isolation opening and part of the isolation structure surrounding the second isolation opening, and the thickness of the second photoresist protection portion in the second isolation opening is equal to the thickness of the second light-emitting material layer.

[0022] In the second aspect, an embodiment of the present application provides a display panel, comprising: a substrate, comprising: an array layer, the array layer comprising a plurality of second electrodes; an isolation structure, arranged on one side of the substrate, the isolation structure enclosing a plurality of isolation openings, the plurality of isolation openings comprising a first isolation opening and a second isolation opening; a plurality of first light-emitting structures, at least part of the first light-emitting structures being arranged in the first isolation opening; a first electrode, comprising a plurality of first sub-electrodes, at least part of the first sub-electrodes being arranged on a side of the first light-emitting structure away from the substrate; the second electrode being at least partially exposed to the isolation opening, and the work function of at least part of the second electrode exposed to the isolation opening is less than or equal to a first preset work function.

[0023] According to an embodiment of the second aspect of the present application, the first preset work function is less than or equal to 6 eV.

[0024] According to an embodiment of the second aspect of the present application, it also includes: a first packaging part, the first packaging part includes a first packaging sub-part and a second packaging sub-part, at least part of the first packaging sub-part is arranged on the side of the first light-emitting structure away from the substrate, and at least part of the second packaging sub-part is arranged on the side of the isolation structure away from the substrate; a first light-emitting material part is arranged between the second packaging sub-part and the isolation structure.

[0025] According to an embodiment of the second aspect of the present application, the isolation structure includes a first isolation portion and a second isolation portion; along the thickness direction of the display panel, the first isolation portion and the second isolation portion are stacked in sequence, and the first isolation portion is located on the side of the second isolation portion away from the substrate; along the thickness direction of the display panel, the orthographic projection of the first isolation portion covers the orthographic projection of the second isolation portion; optionally, the isolation structure also includes a third isolation portion, which is located on the side of the second isolation portion close to the substrate, and the orthographic projection of the third isolation portion covers part of the orthographic projection of the second isolation portion.

[0026] According to an embodiment of the second aspect of the present application, it also includes: a plurality of second light-emitting structures, at least some of which are arranged in the second isolation openings; the first electrode also includes a plurality of second sub-electrodes, at least some of which are arranged on the side of the second light-emitting structure away from the substrate.

[0027] In a third aspect, an embodiment of the present application provides a display device, including a display panel prepared by the method for preparing a display panel according to an embodiment of the first aspect of the present application, or a display panel according to an embodiment of the second aspect of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 A flow chart of a method for preparing a display panel according to an embodiment of the present application.

[0030] Figure 2 A structural schematic diagram of step S1 in the method for preparing a display panel according to an embodiment of the present application.

[0031] Figure 3 A structural schematic diagram of step S2 in the method for preparing a display panel according to an embodiment of the present application.

[0032] Figure 4 A structural schematic diagram of step S3 in the method for preparing a display panel according to an embodiment of the present application.

[0033] Figure 5 A structural schematic diagram of step S4 in the method for preparing a display panel according to an embodiment of the present application.

[0034] Figure 6 Another structural schematic diagram of step S4 in the method for preparing a display panel according to an embodiment of the present application.

[0035] Figure 7 A structural schematic diagram of step S5 in the method for preparing a display panel according to an embodiment of the present application.

[0036] Figure 8 A structural schematic diagram of a first mask in the method for preparing a display panel according to an embodiment of the present application.

[0037] Fig. 9 Another structural schematic diagram of step S5 in the method for preparing a display panel according to an embodiment of the present application.

[0038] Fig.10 A schematic diagram of the structure of a display panel according to an embodiment of the present application.

[0039] Fig.11 Another structural schematic diagram of a display panel according to an embodiment of the present application.

[0040] Fig.12 A schematic diagram of the structure of a display device according to an embodiment of the present application.

[0041] Reference numerals:

[0042] 1. substrate; 11. array layer; 111. second electrode;

[0043] 2. Isolation structure; 21. First isolation opening; 22. Second isolation opening;

[0044] 3. First preparation material layer; 31a. First light-emitting material layer; 31b. First light-emitting structure; 31c. Second light-emitting structure; 32a. First electrode material layer; 32b. First sub-electrode; 32c. Second sub-electrode; 33a. First packaging material layer; 33b. First packaging unit;

[0045] 4. first photoresist protection layer; 41. first photoresist protection portion; 411. first covering portion; 412. second covering portion;

[0046] 5. first mask; 51. first region; 52. second region; 53. third region;

[0047] 100. Display panel; 200. Display device. DETAILED DESCRIPTION

[0048] The features and exemplary embodiments of various aspects of the application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the application. However, it is obvious to those skilled in the art that the application can be implemented when some details in these specific details are not needed. The following description of the embodiments is only to provide a better understanding of the application by illustrating the example of the application.

[0049] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The embodiments will be described in detail below in conjunction with the accompanying drawings.

[0050] Relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also other elements that are not explicitly listed, or also includes elements that are inherent to such process, method, article, or device. In the absence of further restrictions, the elements defined by the statement "comprising ..." do not exclude the presence of additional identical elements in the process, method, article, or device that includes the elements.

[0051] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0052] In addition, the term "and / or" in this article is only a description of the association relationship between the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0053] It should be understood that in the embodiment of the present application, "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0054] The applicant has found that when manufacturing an organic light emitting diode (OLED) display panel, if a metal mask-free vertical evaporation technology of organic light emitting materials is used, after the encapsulation layer is manufactured, it is necessary to etch and remove the unnecessary first photoresist protective layer to expose the underlying encapsulation layer, cathode and unnecessary light emitting material. After further removing the encapsulation layer and cathode, it is necessary to remove the remaining first photoresist protective layer and unnecessary light emitting material. Considering that the remaining first photoresist protective layer is relatively thick, when removing the remaining first photoresist protective layer and unnecessary light emitting material, the electrode located below the unnecessary light emitting material may be damaged, thereby affecting the display effect of the display panel.

[0055] In view of the above analysis, the applicant proposes a method for preparing a display panel, a display panel and a display device. The method for preparing a display panel includes: preparing an isolation structure on one side of a substrate; preparing a first preparation material layer; making a first photoresist protection layer; removing part of the first photoresist protection layer in the first isolation opening along the thickness direction of the substrate, and removing all of the first photoresist protection layer in the second isolation opening to form a first photoresist protection part; patterning the first preparation material layer through the first photoresist protection part to form a first light-emitting structure located in the first isolation opening. Since part of the first photoresist protection layer in the first isolation opening is removed first, and all of the first photoresist protection layer in the second isolation opening is removed, the difference between the thickness of the photoresist protection part and the thickness of the first light-emitting material layer can be reduced. On the basis of not increasing the process flow, the first photoresist protection part is removed while removing the unnecessary first light-emitting material layer, thereby reducing damage to the second electrode under the removed first light-emitting material layer, thereby improving the display effect of the display panel.

[0056] Figure 1 A flow chart of a method for preparing a display panel according to an embodiment of the present application.

[0057] See also Figure 1 , an embodiment of the present application provides a method for preparing a display panel, comprising:

[0058] Figure 2 A structural schematic diagram of step S1 in the method for preparing a display panel according to an embodiment of the present application.

[0059] See also Figure 2 , step S1, preparing an isolation structure 2.

[0060] An isolation structure 2 is prepared on one side of the substrate 1. The substrate 1 can be a finished substrate 1 or a substrate 1 can be directly manufactured. The isolation structure 2 encloses a plurality of isolation openings, and it can be understood that the isolation openings should correspond to the pixel openings. The plurality of isolation openings include a first isolation opening 21 and a second isolation opening 22, and there is no obvious structural difference between the first isolation opening 21 and the second isolation opening 22. In the structure of the corresponding display panel, the colors of the pixel units corresponding to the first isolation opening 21 and the second isolation opening 22 are different. Along the thickness direction of the substrate 1, the isolation structure 2 may include a first isolation portion, a second isolation portion, and a third isolation portion stacked in sequence, wherein the orthographic projection of the first isolation portion covers the orthographic projection of the second isolation portion, and the orthographic projection of the third isolation portion covers part of the orthographic projection of the second isolation portion. In the direction away from the substrate 1, the isolation structure 2 presents a first isolation portion whose width is greater than the width of the second isolation portion, and greater than the width of the third isolation portion, so the isolation structure 2 can separate the first light-emitting material layer 31a used to prepare the first light-emitting structure 31b at the edge of the isolation opening.

[0061] The composition, preparation, etc. of the isolation structure 2 are further described in patent CN118251982A, patent 202410864269.8, patent PCT / CN2024 / 098407, patent PCT / CN2024 / 102783, patent PCT / CN2024 / 098217, patent PCT / CN2024 / 099419, and patent PCT / CN2024 / 099072, the contents of which are incorporated into this application by reference for reference. Figure 3 A structural schematic diagram of step S2 in the method for preparing a display panel according to an embodiment of the present application.

[0062] See also Figure 3 , step S2, preparing a first preparation material layer 3.

[0063] A first preparation material layer 3 is disposed in the isolation structure 2 and the isolation opening, and the first preparation material layer 3 includes a first light-emitting material layer 31a, that is, part of the first light-emitting material layer 31a is located at the first isolation opening 21, and part of the first light-emitting material layer 31a is located at the second isolation opening 22. The purpose of the embodiment of the present application is to manufacture a first light-emitting device at the position of the first isolation opening 21, so the first light-emitting material located in the second isolation opening 22 is unnecessary.

[0064] Figure 4 A structural schematic diagram of step S3 in the method for preparing a display panel according to an embodiment of the present application.

[0065] See also Figure 4 , step S3, preparing a first photoresist protection layer 4.

[0066] The first photoresist protection layer 4 is formed on the side of the first preparation material layer 3 facing away from the substrate 1 , that is, part of the first photoresist protection layer 4 is located at the first isolation opening 21 , and part of the first photoresist protection layer 4 is located at the second isolation opening 22 .

[0067] Figure 5 A structural schematic diagram of step S4 in the method for preparing a display panel according to an embodiment of the present application. Figure 6 Another structural schematic diagram of step S4 in the method for preparing a display panel according to an embodiment of the present application.

[0068] See also Figure 5 and Figure 6 , step S4, forming a first photoresist protection portion 41.

[0069] Part of the first photoresist protection layer 4 in the first isolation opening 21 is removed along the thickness direction of the substrate, and all of the first photoresist protection layer 4 in the second isolation opening 22 is removed, and the remaining first photoresist protection layer 4 in the first isolation opening 21 is thinned to form a first photoresist protection portion 41. At this time, the first photoresist protection portion 41 covers the first preparation material layer 3 in the first isolation opening 21 and the partial isolation structure 2 surrounding the first isolation opening 21, and the thickness difference between the first photoresist protection portion 41 and the first light-emitting material layer 31a located at the second isolation opening 22 is reduced. Step S4 can be performed in the form of dry etching.

[0070] Figure 7 A structural schematic diagram of step S5 in the method for preparing a display panel according to an embodiment of the present application.

[0071] See also Figure 7 , step S5, forming a first light emitting structure 31b.

[0072] The first preparation material layer 3 is patterned through the first photoresist protection portion 41 to form a first light-emitting structure 31b located at the first isolation opening 21, wherein the first photoresist protection portion 41 and the first light-emitting material layer 31a located at the second isolation opening 22 need to be removed simultaneously. Since the thickness difference between the first photoresist protection portion 41 and the first light-emitting material layer 31a located at the second isolation opening 22 is reduced, excessive etching at the second isolation opening 22 is reduced, thereby reducing damage to the film layer of the substrate 1 located below the second isolation opening 22, thereby improving the display effect of the obtained display panel.

[0073] It should be noted that, through the above method, the preparation of a light emitting structure of a certain color of the display panel can be completed. If the display panel also includes light emitting structures of other colors, the above method should be repeated to make light emitting structures of other colors to obtain a finished display panel. In addition, step S5 can be performed in the form of dry etching.

[0074] Further, see Figure 5 and Figure 6 , in step S4, the thickness of the first photoresist protection portion 41 in the first isolation opening 21 is equal to the thickness of the first light-emitting material layer 31a. At this time, in step S5, while the first photoresist protection portion is completely removed, the first light-emitting material layer 31a is also completely removed, so the over-etching at the second isolation opening 22 can be significantly reduced, thereby reducing the damage to the substrate 1 at the second isolation opening 22. It can be understood that the thickness of the first photoresist protection portion 41 in the first isolation opening 21 is equal to the thickness of the first light-emitting material layer 31a, wherein "equal" is not strictly equal, and errors caused by factors such as process flow are allowed. At this time, the thickness of the first photoresist protection portion 41 in the first isolation opening 21 is deemed to be equal to the thickness of the first light-emitting material layer 31a.

[0075] Figure 8 A structural schematic diagram of a first mask in the method for preparing a display panel according to an embodiment of the present application.

[0076] Further, see Figure 5 and Figure 6 , and combined with Figure 8 In step S4, the first photoresist protection layer 4 is processed using the first mask 5, and the first mask 5 includes a first area 51 and a second area 52; when processing the first photoresist protection layer 4, along the thickness direction of the substrate 1, the orthographic projection of the first area 51 at least partially overlaps with the orthographic projection of the first isolation opening 21, and the orthographic projection of the second area 52 at least partially overlaps with the orthographic projection of the second isolation opening 22; the transmittance of the first area 51 is less than the transmittance of the second area 52.

[0077] The first mask 5 is in the form of a semi-transparent mask with uneven transmittance. When the first mask 5 is used, the first area 51 corresponds to the first isolation opening 21, the second area 52 corresponds to the second isolation opening 22, and the transmittance of the first area 51 is less than the transmittance of the second area 52. Therefore, the first photoresist protection layer 4 at the first isolation opening 21 will be partially removed and thinned to form a first photoresist protection portion 41; the first photoresist protection layer 4 at the second isolation opening 22 will be completely removed, so that the first preparation material layer 3 is exposed at the second isolation opening 22, so as to facilitate the removal of the first preparation material layer 3 at the second isolation opening 22.

[0078] Further, see Figure 5 and Figure 6 In step S4, at least a portion of the first photoresist protection layer 4 located on the side of the isolation structure 2 facing away from the substrate 1 is removed along the thickness direction of the substrate, and the first photoresist protection portion 41 includes a first covering portion 411 covering the first isolation opening 21 and a second covering portion 412 at least partially covering the isolation structure 2, and the thickness of the second covering portion 412 is greater than the thickness of the first covering portion 411.

[0079] Considering that in step S5, the first photoresist protection part 41 at the first isolation opening 21 and the first light-emitting material layer 31a at the second isolation opening 22 are removed simultaneously, the first photoresist protection part 41 at the isolation structure 2 will not have a significant impact on the substrate 1 at the second isolation opening 22. Therefore, the thickness of the first covering part 411 covering the first isolation opening 21 can be made smaller than the second covering part 412 covering the isolation structure 2. Reducing the etching amount at the isolation structure 2 can save costs and reduce damage to the isolation structure, thereby improving the yield of the display panel.

[0080] Further, see Figure 5 and Figure 6 , and combined with Figure 8 In step S4, the first photoresist protection layer 4 is processed using the first mask 5, and the first mask 5 includes a first area 51, a second area 52 and a third area 53; when processing the first photoresist protection layer 4, along the thickness direction of the substrate 1, the orthographic projection of the first area 51 at least partially overlaps with the orthographic projection of the first isolation opening 21, the orthographic projection of the second area 52 at least partially overlaps with the orthographic projection of the second isolation opening 22, the third area 53 at least partially surrounds the first area 51 and the second area 52, and the orthographic projection of the third area 53 at least partially overlaps with the orthographic projection of the isolation structure 2; the transmittance of the first area 51 is less than that of the second area 52, and the transmittance of the third area 53 is less than that of the first area 51.

[0081] The first mask 5 is in the form of a semi-transparent mask with uneven transmittance. When the first mask 5 is used, the first area 51 corresponds to the first isolation opening 21, the second area 52 corresponds to the second isolation opening 22, and the third area 53 corresponds to the partial isolation structure 2 surrounding the first isolation opening 21 and the second isolation opening 22, and the transmittance of the first area 51 is less than the transmittance of the second area 52, and the transmittance of the third area 53 is less than the transmittance of the first area 51. Therefore, the first photoresist protection layer 4 at the first isolation opening 21 will be partially removed and thinned to form a first covering portion 411; at the isolation structure 2, the first photoresist protection layer 4 will be removed less to form a second covering portion 412 with a larger thickness; the first photoresist protection layer 4 at the second isolation opening 22 will be completely removed, so that the first preparation material layer 3 is exposed at the second isolation opening 22, so as to facilitate the removal of the first preparation material layer 3 at the second isolation opening 22.

[0082] Further, see Figure 5 and Figure 6 In step S4 , along the thickness direction of the substrate 1 , the area of ​​the orthographic projection of the first region 51 is smaller than or equal to the area of ​​the orthographic projection of the first isolation opening 21 .

[0083] Further, see Figure 5 and Figure 6 In step S4, the first photoresist protection layer 4 located on the side of the isolation structure 2 away from the substrate 1 is retained along the thickness direction of the substrate. The first photoresist protection portion 41 includes a first covering portion 411 covering the first isolation opening and a second covering portion 412 at least partially covering the isolation structure, the thickness of the second covering portion 412 is greater than the thickness of the first covering portion 411, and the retained first photoresist protection layer 4 corresponds to the second covering portion 412, and the thickness of the second covering portion 412 remains substantially unchanged. Reducing the etching of the first photoresist protection layer 4 at the isolation structure 2 can further save costs and reduce damage to the isolation structure 2, thereby improving the yield of the display panel.

[0084] Further, see Figure 5 and Figure 6In step S4, the first photoresist protection layer 4 is processed using the first mask 5, and the first mask 5 includes a first region 51, a second region 52, and a third region 53; when processing the first photoresist protection layer 4, along the thickness direction of the substrate 1, the orthographic projection of the first region 51 at least partially overlaps with the orthographic projection of the first isolation opening 21, the orthographic projection of the second region 52 at least partially overlaps with the orthographic projection of the second isolation opening 22, the third region 53 at least partially surrounds the first region 51 and the second region 52, and the orthographic projection of the third region 53 at least partially overlaps with the orthographic projection of the isolation structure 2; the transmittance of the first region 51 is less than the transmittance of the second region 52, and the transmittance of the third region 53 is 0. In this way, the first photoresist protection layer 4 at the isolation structure can be retained.

[0085] Further, see Figure 3 In step S2, the first preparation material layer 3 further includes a first electrode material layer 32a located on the side of the first light emitting material layer 31a away from the substrate 1. Before step S5, the first electrode material layer 32a in the second isolation opening 22 is removed to form a first sub-electrode 32b located on the side of the first light emitting structure 31b away from the substrate 1.

[0086] In step S2, similar to the first light-emitting material layer 31a, the first electrode material layer 32a is also made as a whole layer, part of the first electrode material layer 32a is located in the first isolation opening 21, and part of the second electrode 111 material layer is located in the second isolation opening 22. Before step S5, the first electrode material layer 32a in the second isolation opening 22 needs to be removed so that the first light-emitting material layer 31a is exposed. At this time, the first electrode material layer 32a located at the first isolation opening 21 forms a first sub-electrode 32b, which can be used as the cathode of the first light-emitting structure 31b. It can be understood that wet etching can be used to remove the first electrode material layer 32a in the second isolation opening 22.

[0087] Further, see Figure 3 In step S2, the first preparation material layer 3 further includes a first packaging material layer 33a located on the side of the first electrode material layer 32a away from the substrate 1. The first electrode material layer 32a is first made, and then the first packaging material layer 33a is made. Before step S5, the first packaging material layer 33a in the second isolation opening 22 is first removed to form a first packaging portion 33b, and then the first electrode material layer 32a in the second isolation opening 22 is removed to form a first sub-electrode 32b.

[0088] In step S2, similar to the first light-emitting material layer 31a, the first packaging material layer 33a is also made as a whole layer, part of the first packaging material layer 33a is located in the first isolation opening 21, and part of the first packaging material layer 33a is located in the second isolation opening 22. Before step S5, the first packaging material layer 33a and the first electrode material layer 32a in the second isolation opening 22 need to be removed so that the first light-emitting material layer 31a is exposed. At this time, the first electrode material layer 32a located at the first isolation opening 21 forms a first sub-electrode 32b, which can be used as the cathode of the first light-emitting structure 31b; the first packaging material layer 33a located at the first isolation opening 21 forms a first packaging part 33b, which encapsulates the first light-emitting structure 31b. It can be understood that wet and dry etching can be used to remove the first electrode material layer 32a and the first packaging material layer 33a in the second isolation opening 22.

[0089] Fig. 9 Another structural schematic diagram of step S5 in the method for preparing a display panel according to an embodiment of the present application.

[0090] For further information, see Fig. 9 In step S1, the substrate 1 includes: an array layer 11, the array layer 11 includes a plurality of second electrodes 111; after step S1, the second electrode 111 is at least partially exposed to the first isolation opening 21 and / or the second isolation opening 22. Taking the case where the second electrode 111 is exposed to the second isolation opening 22 after step S1 as an example, after step S5, the second electrode 111 can be exposed to the second isolation opening 22 again. At this time, since the method for preparing a display panel according to the embodiment of the present application can reduce over-etching at the second isolation opening 22, the method for preparing a display panel according to the embodiment of the present application can reduce damage to the second electrode 111 at the second isolation opening 22.

[0091] Further, in the embodiment of the present application, after the steps S1 to S5 are completed, a light-emitting structure of a certain color in the display panel can be completed. If the display panel only includes a light-emitting structure of one color, then a display panel can be obtained. If the display panel also includes a light-emitting structure of another color, then the process of steps S2 to S5 can be repeated to produce a light-emitting structure of another color. Exemplarily, the method for preparing a display panel in the embodiment of the present application also includes:

[0092] Step S2', preparing a second preparation material layer.

[0093] A second preparation material layer is arranged in the isolation structure 2 and the isolation opening, and the second preparation material layer includes a second luminescent material layer, that is, part of the second luminescent material layer is located at the second isolation opening 22 , and part of the second luminescent material layer is located at the first isolation opening 21 .

[0094] Step S3', preparing a second photoresist protection layer.

[0095] A second photoresist protection layer is formed on the side of the second preparation material layer facing away from the substrate 1 , that is, part of the second photoresist protection layer is located at the second isolation opening 22 , and part of the second photoresist protection layer is located at the first isolation opening 21 .

[0096] Step S4', forming a first photoresist protection portion.

[0097] Part of the second photoresist protection layer in the second isolation opening 22 is removed along the thickness direction of the substrate 1, and all of the second photoresist protection layer in the first isolation opening 21 is removed, and the remaining second photoresist protection layer in the second isolation opening 22 is thinned to form a second photoresist protection portion. At this time, the second photoresist protection covers the second preparation material layer in the second isolation opening 22 and the part of the isolation structure 2 surrounding the second isolation opening 22, and the difference in thickness between the second photoresist protection portion and the second light-emitting material layer located at the first isolation opening 21 is reduced.

[0098] Step S5', forming a second light-emitting structure.

[0099] The second preparation material layer is patterned through the second photoresist protection portion to form a second light emitting structure located at the second isolation opening 23 , wherein the second photoresist protection portion and the second light emitting material layer located at the first isolation opening 21 need to be removed simultaneously.

[0100] Further, in step S4', the thickness of the second photoresist protection portion in the second isolation opening 22 is equal to the thickness of the second light-emitting material layer. At this time, in step S5', while the second photoresist protection portion is completely removed, the second light-emitting material layer is also completely removed. Among them, "equal" is not strictly equal, and errors caused by factors such as process flow are allowed. At this time, the thickness of the second photoresist protection portion in the second isolation opening 22 is considered to be equal to the thickness of the second light-emitting material layer.

[0101] Fig.10 A schematic diagram of the structure of a display panel according to an embodiment of the present application. Fig.11 Another structural schematic diagram of a display panel according to an embodiment of the present application.

[0102] See also Fig.10 and Fig.11The embodiment of the present application also provides a display panel 100, including: a substrate 1, including: an array layer 11, the array layer 11 includes a plurality of second electrodes 111; an isolation structure 2, arranged on one side of the substrate 1, the isolation structure 2 encloses a plurality of isolation openings, the plurality of isolation openings include a first isolation opening 21 and a second isolation opening 22; a plurality of first light-emitting structures 31b, at least part of the first light-emitting structures 31b are arranged in the first isolation opening 21; a first electrode, including a plurality of first sub-electrodes 32b, at least part of the first sub-electrodes 32b are arranged on a side of the first light-emitting structure 31b away from the substrate 1; the second electrode 111 is at least partially exposed to the isolation opening, and the work function of at least part of the second electrode 111 exposed to the isolation opening is less than or equal to the first preset work function.

[0103] It should be noted that the display panel 100 of the embodiment of the present application can be prepared using the method for preparing the display panel 100 of the foregoing embodiment of the present application.

[0104] The second electrode 111 and the first sub-electrode 32b of the array layer 11 can serve as an anode and a cathode, respectively, and form a first light-emitting device together with the first light-emitting structure 31b. The isolation structure 2 can separate the first light-emitting material layer 31a, and form the first light-emitting structure 31b after patterning. Considering that the display panel 100 of the embodiment of the present application is prepared using the preparation method of the display panel 100 of the aforementioned embodiment of the present application, the risk of damage to the second electrode 111 can be reduced, that is, the work function of at least a portion of the second electrode 111 exposed to the isolation opening is less than or equal to the first preset work function, thereby reducing the impact of the damaged second electrode 111 on the conduction of the display signal, thereby improving the display effect.

[0105] Furthermore, the first preset work function is less than or equal to 6 eV. When the work function of the second electrode 111 is greater than 6 eV, it can be considered that there are defects on the surface of the second electrode 111, and there is a risk of affecting the display effect of the display panel 100 of the embodiment of the present application.

[0106] Optionally, the first preset work function may be 6 eV, 5.5 eV, 5 eV, 4.5 eV, or 4.3 eV.

[0107] Optionally, the work function of the second electrode is in the range of 3.5 to 4.5 eV, and further, the work function of the second electrode is in the range of 3.7 to 4.3 eV. It can be understood that a work function in a suitable range is beneficial to improving the display effect of the display panel.

[0108] Further, see Fig.10 and Fig.11The display panel 100 of the embodiment of the present application also includes: a first packaging portion 33b, the first packaging portion 33b includes a first packaging sub-portion and a second packaging sub-portion, at least part of the first packaging sub-portion is arranged on the side of the first light-emitting structure 31b away from the substrate 1, and at least part of the second packaging sub-portion is arranged on the side of the isolation structure 2 away from the substrate 1; a first light-emitting material portion is arranged between the second packaging sub-portion and the isolation structure 2.

[0109] In the process of manufacturing the display panel 100 of the embodiment of the present application using the preparation method of the display panel 100 of the aforementioned embodiment of the present application, the isolation structure 2 is away from the side of the substrate 1. Since in step S4, the thickness of the second covering portion 412 is greater than the thickness of the first covering portion 411, and in step S5, the first photoresist protection portion 41 and the first light-emitting material layer 31a located at the second isolation opening 22 are removed simultaneously, and dry etching can be used, a portion of the first light-emitting material layer 31a covered by the second covering portion 412 will remain, and is located between the second covering portion 412 and the isolation structure 2. In this way, excessive etching at the second isolation opening 22 is reduced, thereby reducing the damage to the film layer of the substrate 1 located below the second isolation opening 22, especially reducing the damage to the second electrode 111, and can improve the display effect of the obtained display panel.

[0110] Further, see Fig.10 and Fig.11 , the isolation structure 2 includes a first isolation part, a second isolation part and a third isolation part (not shown); along the thickness direction of the display panel 100, the first isolation part, the second isolation part and the third isolation part are stacked in sequence, and the first isolation part is located on the side of the second isolation part away from the substrate 1; along the thickness direction of the display panel 100, the orthographic projection of the first isolation part covers the orthographic projection of the second isolation part, and the orthographic projection of the third isolation part covers part of the orthographic projection of the second isolation part. In the direction away from the substrate 1, the isolation structure 2 presents that the width of the first isolation part is greater than the width of the second isolation part, and greater than the width of the third isolation part, so the isolation structure 2 can separate the first light-emitting material layer 31a used to prepare the first light-emitting structure 31b at the edge of the isolation opening.

[0111] Further, see Fig.10 and Fig.11 The display panel 100 of the embodiment of the present application also includes: a plurality of second light-emitting structures 31c, at least part of the second light-emitting structures 31c are arranged in the second isolation opening 22; the first electrode also includes a plurality of second sub-electrodes 32c, at least part of the second sub-electrodes 32c are arranged on the side of the second light-emitting structure 31c away from the substrate 1.

[0112] The second light-emitting structure 31c can be prepared by a method similar to that of the first light-emitting structure 31b, which will not be described in detail here. The second electrode 111 and the second sub-electrode 32c of the array layer 11 can be used as an anode and a cathode, respectively, and together with the second light-emitting structure 31c, form a second light-emitting device. The isolation structure 2 can separate the second light-emitting material layer and form the second light-emitting structure 31c after patterning.

[0113] It should be noted that if the display panel 100 also includes light-emitting structures of other colors, the display panel preparation method of the aforementioned embodiment of the present application is also used to manufacture the light-emitting structures of other colors to obtain the finished product of the display panel 100 . Fig.12 A schematic diagram of the structure of a display device according to an embodiment of the present application.

[0114] See also Fig.12 The embodiment of the present application also provides a display device 200, including the display panel 100 of the aforementioned embodiment of the present application. The display device 200 provided in the embodiment of the present application can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc.

[0115] In summary, the embodiments of the present application provide a method for preparing a display panel, a display panel, and a display device. When preparing the display panel, first remove part of the first photoresist protection layer in the first isolation opening, and remove all of the first photoresist protection layer in the second isolation opening to form a first photoresist protection portion, and then remove the first photoresist protection portion and the first light-emitting material layer simultaneously. Since the first photoresist protection portion is removed simultaneously when the first light-emitting material layer is finally removed, it is possible to remove the first photoresist protection portion and the unnecessary first light-emitting material layer at the same time without increasing the process flow, thereby reducing damage to the second electrode under the removed first light-emitting material layer, thereby improving the display effect of the display panel.

[0116] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A method for preparing a display panel, It is characterized in that include: An isolation structure is prepared on one side of the substrate, wherein the isolation structure encloses a plurality of isolation openings, and the plurality of isolation openings include a first isolation opening and a second isolation opening; Disposing a first preparation material layer at least in the isolation structure and the isolation opening, wherein the first preparation material layer includes a first luminescent material layer; Forming a first photoresist protection layer on a side of the first preparation material layer away from the substrate; Removing a portion of the first photoresist protection layer in the first isolation opening along the thickness direction of the substrate, and removing all of the first photoresist protection layer in the second isolation opening to form a first photoresist protection portion, wherein the first photoresist protection portion covers the first preparation material layer in the first isolation opening and a portion of the isolation structure surrounding the first isolation opening; The first preparation material layer is patterned through the first photoresist protection portion to form a first light emitting structure located in the first isolation opening.

2. The method for preparing a display panel according to claim 1, It is characterized in that In the step of removing a portion of the first photoresist protection layer in the first isolation opening along the thickness direction of the substrate, and removing all of the first photoresist protection layer in the second isolation opening to form a first photoresist protection portion, wherein the first photoresist protection portion covers the first preparation material layer in the first isolation opening and a portion of the isolation structure surrounding the first isolation opening, the thickness of the first photoresist protection portion in the first isolation opening is equal to the thickness of the first light-emitting material layer.

3. The method for preparing a display panel according to claim 1, It is characterized in that The step of removing part of the first photoresist protection layer in the first isolation opening along the thickness direction of the substrate, and removing all of the first photoresist protection layer in the second isolation opening to form a first photoresist protection portion, wherein the first photoresist protection portion covers the first preparation material layer in the first isolation opening and a part of the isolation structure surrounding the first isolation opening, comprises: The first photoresist protection layer is processed using a first mask, wherein the first mask includes a first area and a second area; when processing the first photoresist protection layer, along the thickness direction of the substrate, the orthographic projection of the first area at least partially overlaps with the orthographic projection of the first isolation opening, and the orthographic projection of the second area at least partially overlaps with the orthographic projection of the second isolation opening; the transmittance of the first area is less than the transmittance of the second area.

4. The method for preparing a display panel according to claim 1, It is characterized in that The step of removing part of the first photoresist protection layer in the first isolation opening along the thickness direction of the substrate, and removing all of the first photoresist protection layer in the second isolation opening to form a first photoresist protection portion, wherein the first photoresist protection portion covers the first preparation material layer in the first isolation opening and a part of the isolation structure surrounding the first isolation opening, comprises: At least a portion of the first photoresist protection layer located on a side of the isolation structure away from the substrate is removed along the thickness direction of the substrate, the first photoresist protection portion includes a first covering portion covering the first isolation opening and a second covering portion at least partially covering the isolation structure, and the thickness of the second covering portion is greater than the thickness of the first covering portion.

5. The method for preparing a display panel according to claim 4, It is characterized in that The step of removing part of the first photoresist protection layer in the first isolation opening along the thickness direction of the substrate, and removing all of the first photoresist protection layer in the second isolation opening to form a first photoresist protection portion, wherein the first photoresist protection portion covers the first preparation material layer in the first isolation opening and a part of the isolation structure surrounding the first isolation opening, comprises: The first photoresist protection layer is processed using a first mask, wherein the first mask includes a first region, a second region, and a third region; when processing the first photoresist protection layer, along the thickness direction of the substrate, the orthographic projection of the first region at least partially overlaps with the orthographic projection of the first isolation opening, the orthographic projection of the second region at least partially overlaps with the orthographic projection of the second isolation opening, the third region at least partially surrounds the first region and the second region, the transmittance of the first region is less than the transmittance of the second region, and the transmittance of the third region is less than the transmittance of the first region.

6. The method for preparing a display panel according to claim 5, It is characterized in that The orthographic projection of the third region at least partially overlaps with the orthographic projection of the isolation structure; Preferably, along the thickness direction of the substrate, the area of ​​the orthographic projection of the first region is smaller than or equal to the orthographic projection of the first isolation opening; Preferably, along the thickness direction of the substrate, the area of ​​the orthographic projection of the second region is smaller than or equal to the orthographic projection of the second isolation opening.

7. The method for preparing a display panel according to claim 1, It is characterized in that The step of removing part of the first photoresist protection layer in the first isolation opening along the thickness direction of the substrate, and removing all of the first photoresist protection layer in the second isolation opening to form a first photoresist protection portion, wherein the first photoresist protection portion covers the first preparation material layer in the first isolation opening and a part of the isolation structure surrounding the first isolation opening, comprises: The first photoresist protection layer is retained on the side of the isolation structure away from the substrate along the thickness direction of the substrate, and the first photoresist protection part includes the first covering part covering the first isolation opening and the second covering part at least partially covering the isolation structure, and the thickness of the second covering part is greater than the thickness of the first covering part.

8. The method for preparing a display panel according to claim 7, It is characterized in that The step of removing part of the first photoresist protection layer in the first isolation opening along the thickness direction of the substrate, and removing all of the first photoresist protection layer in the second isolation opening to form a first photoresist protection portion, wherein the first photoresist protection portion covers the first preparation material layer in the first isolation opening and a part of the isolation structure surrounding the first isolation opening, comprises: The first photoresist protection layer is processed using a first mask, wherein the first mask includes a first region, a second region, and a third region; when processing the first photoresist protection layer, along the thickness direction of the substrate, the orthographic projection of the first region at least partially overlaps with the orthographic projection of the first isolation opening, the orthographic projection of the second region at least partially overlaps with the orthographic projection of the second isolation opening, and the third region at least partially surrounds the first region and the second region; the transmittance of the first region is less than the transmittance of the second region, and the transmittance of the third region is 0.

9. The method for preparing a display panel according to claim 8, It is characterized in that The orthographic projection of the third region at least partially overlaps with the orthographic projection of the isolation structure; Preferably, along the thickness direction of the substrate, the area of ​​the orthographic projection of the first region is less than or equal to the area of ​​the orthographic projection of the first isolation opening; Preferably, along the thickness direction of the substrate, an area of ​​an orthographic projection of the second region is smaller than or equal to an area of ​​an orthographic projection of the second isolation opening.

10. The method for preparing a display panel according to claim 1, It is characterized in that The first preparation material layer further includes a first electrode material layer located on a side of the first light-emitting material layer facing away from the substrate; Before the step of patterning the first preparation material layer through the first photoresist protection part to form a first light-emitting structure located in the first isolation opening, the method for preparing the display panel also includes: removing the first electrode material layer in the second isolation opening to form a first sub-electrode located on the side of the first light-emitting structure away from the substrate.

11. The method for preparing a display panel according to claim 10, It is characterized in that The first preparation material layer further includes a first packaging material layer located on a side of the first electrode material layer away from the substrate. Before manufacturing the first sub-electrode, the method for manufacturing the display panel further includes: manufacturing a first packaging material layer on a side of the first electrode material layer away from the substrate; Before the step of patterning the first preparation material layer through the first photoresist protection part to form a first light-emitting structure located in the first isolation opening, the method for preparing the display panel also includes: removing the first packaging material layer in the second isolation opening to form a first packaging part located on the side of the first sub-electrode away from the substrate.

12. The method for preparing a display panel according to claim 1, It is characterized in that The substrate comprises: an array layer, wherein the array layer comprises a plurality of second electrodes; In the step of preparing the isolation structure on one side of the substrate, the second electrode is at least partially exposed to the first isolation opening and / or the second isolation opening.

13. The method for preparing a display panel according to claim 1, It is characterized in that Also includes: A second preparation material layer is provided at least in the isolation structure and the isolation opening, wherein the second preparation material layer includes a second light-emitting material layer; Forming a second photoresist protection layer on a side of the second preparation material layer away from the substrate; Removing part of the second photoresist protection layer in the second isolation opening along the thickness direction of the substrate, and removing all of the second photoresist protection layer in the first isolation opening to form a second photoresist protection portion, wherein the second photoresist protection portion covers the second preparation material layer in the second isolation opening and part of the isolation structure surrounding the second isolation opening; The second preparation material layer is patterned through the second photoresist protection portion to form a second light emitting structure located at the second isolation opening.

14. The method for preparing a display panel according to claim 13, It is characterized in that In the step of removing part of the second photoresist protection layer in the second isolation opening along the thickness direction of the substrate, and removing all of the second photoresist protection layer in the first isolation opening to form a second photoresist protection part, wherein the second photoresist protection part covers the second preparation material layer in the second isolation opening and part of the isolation structure surrounding the second isolation opening, the thickness of the second photoresist protection part in the second isolation opening is equal to the thickness of the second light-emitting material layer.

15. A display panel, It is characterized in that include: The substrate comprises: an array layer, wherein the array layer comprises a plurality of second electrodes; An isolation structure is disposed on one side of the substrate, the isolation structure encloses a plurality of isolation openings, and the plurality of isolation openings include a first isolation opening and a second isolation opening; a plurality of first light emitting structures, at least part of the first light emitting structures being disposed in the first isolation opening; A first electrode, including a plurality of first sub-electrodes, at least part of the first sub-electrodes being disposed on a side of the first light-emitting structure away from the substrate; The second electrode is at least partially exposed to the isolation opening, and a work function of at least a portion of the second electrode exposed to the isolation opening is less than or equal to a first preset work function.

16. The display panel according to claim 15, It is characterized in that The first preset work function is less than or equal to 6 eV.

17. The display panel according to claim 15, It is characterized in that Also includes: a first encapsulation part, the first encapsulation part comprising a first encapsulation sub-part and a second encapsulation sub-part, at least a portion of the first encapsulation sub-part is disposed on a side of the first light-emitting structure away from the substrate, and at least a portion of the second encapsulation sub-part is disposed on a side of the isolation structure away from the substrate; The first light emitting material portion is disposed between the second packaging sub-portion and the isolation structure.

18. The display panel according to claim 15, It is characterized in that The isolation structure comprises a first isolation portion and a second isolation portion; along the thickness direction of the display panel, the first isolation portion and the second isolation portion are stacked in sequence, and the first isolation portion is located on a side of the second isolation portion away from the substrate; Along the thickness direction of the display panel, the orthographic projection of the first isolation portion covers the orthographic projection of the second isolation portion; Preferably, the isolation structure further comprises a third isolation portion, the third isolation portion is located on a side of the second isolation portion close to the substrate, and an orthographic projection of the third isolation portion covers a portion of the orthographic projection of the second isolation portion.

19. The display panel according to claim 15, It is characterized in that Also includes: a plurality of second light emitting structures, at least part of the second light emitting structures being disposed in the second isolation opening; The first electrode further includes a plurality of second sub-electrodes, and at least part of the second sub-electrodes are disposed on a side of the second light emitting structure away from the substrate.

20. A display device, It is characterized in that A display panel prepared by the method for preparing a display panel according to any one of claims 1 to 14, or a display panel according to any one of claims 15 to 19.

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