Pressure transducer package including rigid transfer block and assembly tolerance portion

Abstract

The present disclosure relates to a pressure transducer package including a rigid transfer block and an assembly tolerance portion. The present disclosure relates to a pressure transducer package (100) comprising a substrate (110) and a cover (120) attached to the substrate (110) with a cavity (130) defined below the cover (120). A MEMS pressure transducer (150) is disposed within the cavity (130), the MEMS pressure transducer (150) covering the fluid port (140). A package pad (160) is disposed on a first side (101) of the package body (100) and a fluid port (140) is disposed on an opposite second side (102) of the package body (100). The transfer block (180) is configured to provide an electrical path between the MEMS pressure transducer (150) and the oppositely arranged package pad (160), where at least one of the cover (120) and the rigid transfer block (180) includes an assembly tolerance portion (170) for providing a mechanical assembly tolerance between the rigid transfer block (180) and at least one of the substrate (110) and the cover (120).

Description

Technical Field

[0001] Embodiments of the present disclosure relate to housed electronic components, and in particular to microstructured MEMS (micro-electromechanical systems) pressure transducers, such as ambient pressure sensors.Impacting sound waves can also be detected by pressure transducers, in which case they can be referred to as sound transducers, such as microphones or speakers. Background Art

[0002] MEMS pressure transducers, and in particular MEMS sound transducers, are an integral part of today's consumer electronic devices. For example, smartphones, tablets, smart watches, etc. are often equipped with one or more sound transducers, such as miniature phones and speakers. In addition, these consumer devices include more and more integrated electronic components to meet consumer demand and expectations for increased features. At the same time, the size and form factor of the devices tend to decrease. Therefore, there is a trade-off between the increase in electronic components and the reduction in available assembly space.

[0003] In some cases, the assembly space within the housing of an electronic device is very limited, so that manufacturers of integrated electronic components need to find new solutions for mounting their components into small devices. One of the challenging tasks is to properly mount MEMS pressure transducers, including microphones and speakers, into the housing of consumer electronic devices, because these MEMS components require additional space for fluid channels that communicate with the environment. For example, microphones and speakers require sound ports and sound channels for receiving and transmitting sound waves from the external environment around the housing. Therefore, these types of MEMS devices may additionally include a predetermined mounting direction that must be considered.

[0004] MEMS devices are usually housed in a package, which must also include fluid openings for allowing fluid communication between the MEMS and the surrounding environment. For performance reasons, the MEMS pressure transducer will be mounted to cover the corresponding fluid openings of the package. Thus, the MEMS pressure transducer can use the entire volume of the package as the back volume.

[0005] However, due to the reduced assembly space mentioned above, some packages may need to be installed so that their fluid openings are positioned opposite to the electronic connection area for electrically connecting the MEMS to the internal circuit. Accordingly, the package pads and the fluid openings must be positioned on opposite sides of the package. Therefore, a gap remains between the MEMS and the oppositely arranged package pads within the package. In order to electrically connect the MEMS to the package pads, this gap must be bridged in some way.

[0006] Typically, the MEMS device can be connected to the package pad by a flexible bonding wire, i.e., the above-mentioned gap can be bridged by the bonding wire. The flexibility of the bonding wire is preferred because it is necessary to cope with assembly misalignment, for example, if the MEMS device is not accurately positioned in its actual installation position. The flexible bonding wire can be connected to the MEMS by welding.

[0007] However, once the package cover is mounted on the package substrate, the package is closed and its interior is no longer accessible. Since the MEMS is enclosed in the closed package, it is impossible to access the MEMS and the flexible bonding wires, that is, once the package is closed, the MEMS can no longer be accessed and welding of the flexible bonding wires is impossible. Therefore, when the package is closed, a stiff and rigid connection device must be used to provide physical and electrical contact between the MEMS and the package pad. Therefore, if the package is closed, the rigid connection device provides mechanical and electrical contact similar to a plug and socket connection.

[0008] However, due to the rigid nature of the rigid connection, the MEMS must be placed very precisely (preferably without any assembly tolerance) at its intended mounting location. Even the smallest assembly tolerance (which cannot be completely avoided in real life) may result in a statically overdefined indeterminate mechanical system, leading to undesirable malfunctions and damage to the rigid connection.

[0009] It is therefore desirable to provide a MEMS pressure transducer package having electrical connections that reliably bridge the physical gap between a MEMS enclosed within a closed package housing and a packaging pad while allowing for assembly tolerances of the MEMS relative to the packaging pad within the closed housing. Summary of the invention

[0010] This can be achieved by a pressure transducer package including a rigid transfer block according to independent claim 1. The pressure transducer package includes a substrate and a cover attached to the substrate, and a MEMS pressure transducer arranged in a cavity, wherein the cavity is defined below the cover. The package also includes a fluid port for allowing fluid communication between the interior and the exterior of the cavity, wherein the MEMS pressure transducer is mounted to cover the above-mentioned fluid port. The package also includes a conductive packaging pad for electrically contacting the MEMS pressure transducer from the outside of the package. The packaging pad is arranged on a first side of the package, and the fluid port is arranged on an opposite second side of the package. Therefore, in the package, a physical gap is retained between the MEMS pressure transducer at the fluid port and the packaging pad arranged oppositely. In order to bridge the gap, the package also includes a rigid transfer block arranged in the cavity, which is configured to provide an electrical path between the MEMS pressure transducer and the packaging pad arranged oppositely. According to the innovative principles described herein, at least one of the cover and the rigid transfer block includes an assembly tolerance portion for providing a mechanical assembly tolerance between the rigid transfer block and at least one of the base plate and the cover.

[0011] Further examples and embodiments of the inventive pressure transducer package are described in the dependent claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In the following, embodiments of the present disclosure are described in more detail with reference to the accompanying drawings, in which:

[0013] Figure 1A shows a schematic side view of a MEMS microphone package in a so-called standard top port configuration;

[0014] Figure 1B shows a schematic side view of a MEMS microphone package in a so-called standard bottom port configuration;

[0015] Figure 1C shows a schematic side view of a MEMS microphone package in a so-called standard flip top port configuration;

[0016] Figure 2 shows a schematic side view of an innovative pressure transducer package having a rigid transfer block including an assembly tolerance portion according to one embodiment;

[0017] Figure 3 shows a schematic side view of an innovative pressure transducer package having a rigid transfer block including an assembly tolerance portion according to another embodiment;

[0018] Figure 4shows a schematic side view of an innovative pressure transducer package having a rigid transfer block including an assembly tolerance portion according to another embodiment;

[0019] Figure 5 shows a schematic side view of an innovative pressure transducer package having a rigid transfer block including an assembly tolerance portion according to another embodiment;

[0020] Figure 6 shows a schematic side view of an innovative pressure transducer package having a rigid transfer block including an assembly tolerance portion according to another embodiment;

[0021] Figure 7 shows a schematic side view of an innovative pressure transducer package having a rigid transfer block including an assembly tolerance portion according to another embodiment;

[0022] Figure 8 shows a schematic side view of an innovative pressure transducer package having a rigid transfer block including an assembly tolerance portion according to another embodiment;

[0023] Fig. 9 shows a schematic side view of an innovative pressure transducer package having a rigid transfer block and a cover including an assembly tolerance portion according to another embodiment;

[0024] Fig.10 shows a schematic side view of an innovative pressure transducer package having a rigid transfer block including an assembly tolerance portion according to another embodiment;

[0025] Fig.11 shows a schematic side view of an innovative pressure transducer package having a rigid transfer block including an assembly tolerance portion according to another embodiment; and

[0026] Fig.12 A schematic block diagram of an innovative method for manufacturing a pressure transducer package according to one embodiment is shown. DETAILED DESCRIPTION

[0027] The same or equivalent elements or elements having the same or equivalent functions are denoted by the same or equivalent reference numerals in the following description.

[0028] The method steps described by the block diagrams and described with reference to the above block diagrams may also be performed in an order different from the order depicted and / or described. Furthermore, method steps relating to specific features of the apparatus may be replaced with the above features of the above apparatus, and vice versa.

[0029] In the following, MEMS sound transducers, in particular MEMS microphones, may generally be described as non-limiting examples of MEMS pressure transducers. However, each embodiment described herein may include a general pressure transducer, such as an ambient pressure sensor or the like.

[0030] For introductory purposes, Figure 1A A MEMS microphone package 10 is shown in a standard top port configuration. The package 10 comprises a substrate 11. A lid 12 is attached to the substrate 11 such that a cavity 13 is formed between the lid 12 and the substrate 11.

[0031] In this top port configuration, the cover 12 includes an opening 14 through which the cavity 13 is in fluid communication with the environment outside the package, i.e., the opening 14 allows fluid exchange between the interior and the exterior of the cavity 13. Therefore, the opening 14 may also be referred to as a fluid port. In the case of a MEMS microphone package, as exemplarily described herein, the opening 14 may also be referred to as a sound port.

[0032] The MEMS microphone 15 is arranged within the cavity 13. The MEMS microphone 15 may be attached to the substrate 11. Furthermore, the package 10 includes a conductive package pad 16 for electrically contacting the MEMS microphone 15 from outside the package 10.

[0033] Electrical conductors, such as bond wires 17, 18, may provide an electrical path between the package pad 16 and the MEMS microphone 15. Optionally, the control circuit 21 may be located between the package pad 16 and the MEMS microphone 15 in the electrical path described above.

[0034] In the exemplary illustrated standard top port configuration, sound waves can enter the cavity 13 through the sound port 14 provided in the lid 12. The sound waves can strike the microphone membrane 19 of the MEMS microphone 15, in response to which the microphone membrane 19 oscillates. These oscillations generate corresponding electrical signals, which can be conducted through the electrical conductors 17, 18 via the optional available circuit 21 to the package pad 16, from which the signal can be accessed from outside the package 10.

[0035] The free space below the microphone membrane 19 (ie between the microphone membrane 19 and the substrate 11) may be referred to as a so-called back volume 20. The larger the back volume 20, the better the sensitivity of the MEMS microphone 15 and its signal-to-noise ratio (SNR). Figure 1A As shown, the size of rear volume 20 is limited by the size of the free space below microphone membrane 19 .

[0036] Figure 1BAn alternative solution for providing a larger rear volume 20 is shown. This exemplary configuration may be referred to as a so-called bottom port configuration. The sound port 14 is not provided in the cover 12, but in the substrate 11. More specifically, the substrate 11 includes the sound port 14, which enables fluid exchange between the interior and the exterior of the cavity 13. In this bottom port configuration, the MEMS microphone 15 covers the sound port 14.

[0037] and Figure 1A Compared with the top port configuration, Figure 1B The bottom port configuration provides a larger back volume 20. In particular, the entire cavity 13 can be used as the back volume 20. Therefore, the MEMS microphone 15 in the bottom port configuration can include better sensitivity and lower SNR than in the top port configuration described above.

[0038] like Figure 1A and Figure 1B As shown, in both the top port and bottom port configurations, the MEMS microphone 15 is mounted on the substrate 11, and the package pad 16 is also provided in the substrate 11, i.e., the MEMS microphone 15 and the package pad 16 are arranged on the same side (i.e., the substrate side) of the package 10. Therefore, during the package assembly process, the substrate 11 can be completely pre-assembled before the lid 12 is attached, i.e., all components such as the MEMS microphone 15, the control circuit 21, etc. can be placed and mounted on the substrate 11 before the lid 12 is finally mounted on the substrate 11.

[0039] However, in some cases, it may be desirable to position the MEMS microphone 15 and the packaging pad 16 on two opposite sides of the package 10. This may occur if only limited available mounting space dictates a particular mounting location of the package 10 within an electronic device (eg, a smartphone).

[0040] For example, Figure 1C A flip top port configuration is shown, wherein a packaging pad 16 may be disposed on the substrate 11 and a MEMS microphone 15 may be attached to the lid 12 for covering the acoustic port 14 formed therein.

[0041] In this case, the substrate 11 cannot be fully pre-assembled during the package assembly process, i.e., before the lid 12 is attached. Once the lid 12 is attached to the substrate 11, the package 10 is closed, so that the interior 13 of the package 10 is no longer accessible. Therefore, no flexible bonding wires for connecting the MEMS microphone 15 (lid side) with the opposite packaging pad 16 (substrate side) can be provided, because the interior 13 of the closed package 10 is no longer accessible.

[0042] Existing solutions suggest providing a rigid and stiff connection for providing physical and electrical contact between the MEMS microphone 15 and the package pad 16. Thus, if the package is closed, the rigid connection may provide mechanical and electrical contact similar to a plug and socket connection.

[0043] However, due to the rigid nature of the rigid connection means, the MEMS microphone 15 must be placed very accurately (preferably without any assembly tolerances) in its intended mounting position. Even the smallest assembly tolerances, which cannot be avoided in real life, may result in a statically overdetermined indeterminate mechanical system, resulting in undesired malfunctions and damage to the rigid connection means. For example, the distance d between the cover 12 and the substrate 11 is determined by the height h of the cover 12 and the thickness t of the applied mounting means 22 (e.g., adhesive, solder, etc.). If rigid and stiff connection means are applied between the MEMS microphone 15 and the packaging pad 16, they will have to have extremely precise shapes and lengths in order to accurately match the distance d. Otherwise, they will be too short and thus fail to provide a proper electrical connection, or they will be too large and thus create an obstruction, making it impossible to properly close the cover 12. Both situations describe a statically overdetermined indeterminate mechanical system.

[0044] It is therefore desirable to provide a solution for a MEMS package configuration having a MEMS microphone 15 and a package pad 16 arranged on two opposing package sides, which solution allows mounting the cover 12 to the substrate 11 with a certain assembly tolerance so that the package 10 is provided as a statically underdefined indeterminate mechanical system.

[0045] Figure 2 A first embodiment of the solution disclosed herein, which relates to a pressure transducer package 100 including an innovative relative port pad configuration, is shown. The package 100 comprises a substrate 110 and a cover 120 attached to the substrate 110. A cavity 130 is defined between the substrate 110 and the cover 120, i.e., below the cover 120. The cover 120 may be attached to the substrate 110 by solder and / or glue 201, 202.

[0046] The MEMS pressure transducer 150 is arranged in the cavity 130. According to this non-limiting example, the MEMS pressure transducer 150 can be configured as a MEMS sound transducer, and in particular as a MEMS microphone. However, the MEMS pressure transducer 150 can also be configured as a MEMS speaker, a MEMS ambient pressure sensor, or any other type of MEMS pressure transducer.

[0047] The package 100 also includes a fluid port 140 for allowing fluid exchange between the interior and exterior of the cavity 130, wherein the MEMS pressure transducer 150 is mounted to cover the above-mentioned fluid port 140. In this non-limiting example, the fluid port 140 is provided in the cover 120. However, the fluid port 140 may also be provided in the substrate 110, an example of which may be described later in this specification. In the case where the MEMS pressure transducer 150 is configured as a sound transducer, the fluid port 140 may also be referred to as a sound port.

[0048] The package 100 also includes a conductive packaging pad 160 for electrically contacting the MEMS pressure transducer 150 from outside the package 100. According to the innovative relative port pad configuration, the packaging pad 160 and the fluid port 140 are positioned at two opposite sides 101, 102 of the package 100, that is, the packaging pad 160 can be disposed on the first side 101 of the package 100, and the fluid port 140 can be disposed on the opposite second side 102 of the package 100. More specifically, the fluid port 140 can be disposed in at least one of the cover 120 and the substrate 110 (or at least one of them), and the packaging pad 160 can be disposed in the other of the cover 120 and the substrate 110 (or at the other of them). According to Figure 2 In the non-limiting example shown, the fluid port 140 is disposed in the cover 120 , while the packaging pad 160 is disposed in the substrate 110 .

[0049] Since the MEMS pressure transducer 150 is mounted directly at the fluid port 140, i.e., so that it covers the fluid port 140, the MEMS pressure transducer 150 and the packaging pad 160 can also be positioned at two opposite sides 101, 102 of the package body 100. However, the MEMS pressure transducer 150 must be electrically connected to the oppositely arranged packaging pad 160 in some way.

[0050] However, as described above, when the cover 120 is finally installed and attached to the substrate 110 during the assembly process, the package 100 is closed, and a physical gap remains between the MEMS pressure transducer 150 on one package side 101 and the packaging pad 160 on the opposite package side 102 within the closed package 100. As described above, this gap needs to be bridged in some way with an electrical conductor for electrically connecting the MEMS pressure transducer 150 to the oppositely positioned packaging pad 160. However, since the package 100 is closed, it is no longer accessible, and therefore, it is not possible to subsequently provide a flexible electrical conductor (e.g., bonding wire, etc.) within the closed package 100 for connecting the MEMS pressure transducer 150 to the packaging pad 160.

[0051] Thus, the inventive package 100 includes a rigid transfer block 180 disposed within the cavity 130 , the rigid transfer block 180 being configured to provide an electrical path between the MEMS pressure transducer 150 and the oppositely disposed packaging pad 160 .

[0052] According to the innovative principle, the rigid transfer block 180 is configured to provide an assembly tolerance between the MEMS pressure transducer 150 and the packaging pad 160 when assembling the package body 100, so that the cover 120 (including the MEMS pressure transducer 150) can be installed and attached to the substrate 110 with a certain assembly tolerance. Therefore, according to one embodiment, the rigid transfer block 180 includes an assembly tolerance portion 170. The assembly tolerance portion 170 provides a mechanical assembly tolerance between the rigid transfer block 180 and the substrate 110 and / or between the rigid transfer block 180 and the cover 120.

[0053] Additionally or alternatively, the cover 120 may include an assembly tolerance portion 170. Also in this case, the assembly tolerance portion 170 may provide a mechanical assembly tolerance between the rigid transfer block 180 and the cover 120, examples and embodiments of which will be described later.

[0054] Since the assembly tolerance portion 170 provides a mechanical assembly tolerance, the assembly tolerance portion 170 allows for relative displacement / misalignment between the cover 120 (including any components arranged thereon) and the substrate 110 (including any components arranged thereon) during assembly of the package 100, while still properly establishing an electrical path between the MEMS pressure transducer 150 and the oppositely arranged packaging pad 160. In other words, even if the cover 120 is attached to the substrate 110 with a certain misalignment, the electrical path between the MEMS pressure transducer 150 and the oppositely arranged packaging pad 160 can still be properly established. This is because the assembly tolerance portion 170 can provide a certain predetermined assembly tolerance.

[0055] When assembling the package in an opposing port pad configuration, a flexible electrical connector (e.g., a bonding wire) is actually advantageous between the MEMS pressure transducer 150 and the oppositely arranged packaging pad 160 to allow for relative displacement / misalignment between the cover 120 and the substrate 110. However, a flexible connector cannot be provided subsequently after the package 100 is closed. In contrast, a rigid connector (plug and socket) can be easily provided before the cover 120 is attached to the substrate 110. However, the rigid connector must include a very precise shape and / or length to allow the cover 120 to be properly attached to the substrate 110. If the rigid connector is too large, it will cause an obstruction so that the cover 120 will no longer fit and will protrude from the substrate 110. Conversely, if the rigid connector is too small, an electrical path within the closed package 100 cannot be properly established between the MEMS pressure transducer 150 and the packaging pad 160.

[0056] In more technical terms, flexible connectors will provide a statically underdetermined uncertain mechanical system, which is desirable for relative port pad configurations because it allows for certain assembly tolerances or misalignment. However, they are subsequently unable to install. In contrast, rigid connectors may be easy to install, but will provide a statically overdetermined uncertain mechanical system.

[0057] The innovative concept described herein combines the advantages of both connection principles. Even if the transfer block 180 is rigid, the innovative assembly tolerance scheme 170 allows for a certain displacement / misalignment between the cover 120 and the base plate 110. In other words, even if the transfer block 180 is rigid, the additional assembly tolerance portion 170 provides a statically underdetermined indeterminate mechanical system. The description relates to a static mechanical system in which the cover 120, the rigid transfer block 180 and the base plate 110 are mechanically connected to each other.

[0058] The assembly tolerance section 170 even allows for a certain misalignment of the rigid transfer block 180 itself. Figure 2 As shown in the illustrated example, a rigid transfer block 180 may be mounted between the base plate 110 and the cover 120. The rigid transfer block 180 may be fixedly attached to at least one (or exactly one) of the base plate 110 and the cover 120. Figure 2 In the example shown, the transfer block 180 can be fixedly attached (e.g., by glue) to the interior of the cover 120. In an alternative embodiment to be explained later, the rigid transfer block 180 can be fixedly attached to the base plate 110. In any case, the position where the transfer block 180 is fixedly mounted / attached is referred to as its predetermined mounting position. The assembly tolerance portion 170 enables the rigid transfer block 180 to remain in its predetermined mounting position even if the cover 120 and the base plate 110 are misaligned during assembly.

[0059] like Figure 2 As shown, an electrical path may be provided between the MEMS pressure transducer 150 and the oppositely disposed packaging pad 160 within the package 100. In particular, the transfer block 180 may be configured to provide an electrical path between the MEMS pressure transducer 150 and the oppositely disposed packaging pad 160. Thus, the transfer block 180 may be electrically connected to the MEMS pressure transducer 150 and the packaging pad 160, for example, through a rigid or flexible connector, such as a wire bond 121.

[0060] The wire bonding connection 121 between the MEMS pressure transducer 150 and the rigid transfer block 180 can be easily provided since both are arranged at the same package side, for example at the lid 120 , so that pre-assembly is possible before final closing of the package 100 .

[0061] To keep the length of conductive connector 121 as short as possible, transfer block 180 can be mounted directly adjacent to MEMS pressure transducer 150 without any other components in between. The short length of conductive connector 121 can enhance RF stability because a short conductive connector 121 is less susceptible to RF interference.

[0062] For example, a first conductive path may be provided between rigid transfer block 180 and MEMS pressure transducer 150, and a second conductive path may be provided between rigid transfer block 180 and packaging pad 160. The first conductive path and the second conductive path may be part of the electrical path between MEMS pressure transducer 150 and packaging pad 160.

[0063] Optionally, a control circuit 190 (e.g., an ASIC) for controlling the MEMS pressure transducer 150 may be disposed within the package 100, wherein the control circuit 190 may be located in an electrical path between the MEMS pressure transducer 150 and the package pad 160. The control circuit 190 may be connected to the MEMS pressure transducer 150 through an electrical conductor (e.g., Figure 2 The device may be coupled to the electrical path via wire bonding as shown) or via flip chip bonding.

[0064] However, the control circuit 190 is optional, as it can also be arranged outside the package 100, in which case it will not be located in the electrical path between the MEMS pressure transducer 150 and the packaging pad 160. Figure 2 It is exemplarily described in that the rigid transfer block 180 can be coupled to the internal control circuit 190 , but the rigid transfer block 180 can also be directly coupled to the package pad 160 .

[0065] Any electrical connection on the substrate 110 may be provided by conductive wiring provided in or at the substrate 110. The wiring may include at least one of wire bonds 122, conductive surface pads 123, conductive surface traces (not shown), and conductive layers 124 integrated into the substrate 110. The substrate 110 may be a printed circuit board (PCB).

[0066] In the same manner, the transfer block 180 may include at least one of the above-mentioned electrical conductors. For example, the transfer block 180 may be made of a material similar to a printed circuit board (PCB), such as a resin, or may include such a material, wherein one or more electrical conductors 125 may be implemented in one or more layers of the transfer block 180. Additionally or alternatively, the rigid transfer block 180 may include at least one of a conductive surface pad 126 and a conductive surface trace 125.

[0067] exist Figure 2In the illustrated embodiment, the rigid transfer block 180 is securely attached to the cover 120 and is spaced apart from the substrate 110, wherein a physical gap remains between the rigid transfer block 180 and the substrate 110. In this exemplary embodiment, the assembly tolerance portion 170 may include a conductive pin 171 for bridging the gap and for providing a conductive path between the rigid transfer block 180 and the substrate 110.

[0068] The assembly tolerance portion 170 may further include a recess 172 disposed in the rigid transfer block 180, wherein the conductive pin 171 is at least partially disposed within the recess 172. The recess 172 may be wider than the width of the conductive pin 171, so that the conductive pin 171 is accommodated within the recess 172 by a clearance fit. Therefore, when the cover 120 is attached to the substrate 110, the pin 171 may move within the recess 172 in a clearance fit manner, thereby providing an assembly tolerance that allows for misalignment of the cover 120 relative to the substrate 110.

[0069] In addition to or in place of the above-mentioned recess 172 provided in the transfer block 180, a recess 173 may be provided in the substrate 110. The recesses 172, 173 may be positioned relative to each other. The conductive pin 171 may be at least partially arranged in the above-mentioned recess 173 in the substrate 110. The recess 173 in the substrate 110 may be wider than the width of the conductive pin 171, so that the conductive pin 171 is accommodated in the recess 173 by a clearance fit. Therefore, when the cover 120 is attached to the substrate 110, the pin 171 can move in the recess 173 in a clearance fit manner, thereby providing an assembly tolerance that allows misalignment of the cover 120 relative to the substrate 110.

[0070] Optionally, the gap between the conductive pin 171 and the recess 172, and / or the gap between the conductive pin 171 and the recess 173 can be filled with a conductive filling material, such as solder, solder paste, or a conductive adhesive. For example, the conductive adhesive can include an anisotropic conductive adhesive material (ACA) or an anisotropic conductive film material (ACF). In this case, the recesses 172, 173 can be used for the purpose of a reservoir, such as a solder reservoir or a glue reservoir, which can be partially or completely filled with the corresponding conductive filling material.

[0071] The conductive filling material may be elastic, at least before or during assembly of the package 100. For example, at least before curing, the conductive filling material may include an elastic adhesive. The filling material may be applied to the recesses 172, 173 during a pre-assembly step (i.e., before the cover 120 is attached to the substrate 110). The filling material may be liquid, pasty, or viscous. After assembly, i.e., after the cover 120 has been attached to the substrate 110, the filling material may be cured, wherein the filling material may remain elastic at room temperature or may become inelastic. For example, the adhesive may be permanently elastic at room temperature even after curing, or may be temporarily elastic at room temperature, thereby becoming hard and inelastic after curing. For example, the bonding material 250 may include a permanently elastic soft glue.

[0072] Alternatively, the filling material may be solid at room temperature. The filling material may then be heated so that the filling material becomes liquid, pasty, or viscous. For example, if the filling material includes solder, the package 100 may undergo a thermal reflow process in which the solder is heated so that it becomes viscous. In this state, the conductive pin 171 may be easily inserted into the viscous filling material contained in the recesses 172, 173. After the temperature is lowered below the reflow temperature of the filling material, the filling material returns to its solid state at room temperature.

[0073] For example, prior to assembly, the conductive pin 171 may be inserted into a recess 172 provided in the transfer block 180. During this pre-assembly stage, the conductive pin 171 may be fixedly secured within the recess 172, for example, by a conductive filling material (e.g., solder or glue). When attaching the cover 120 to the substrate 110, the conductive pin 171 may be inserted into an opposing recess 173 provided in the substrate 110. After the cover 120 has been attached to the substrate 110, the conductive pin 171 may be fixedly secured within the opposing recess 173, for example, by a conductive filling material.

[0074] In an alternative embodiment not explicitly depicted, the conductive pin 171 may be omitted. In this case, the assembly tolerance portion 170 may include recesses 172, 173 filled with a conductive filling material. During assembly, when the cover 120 is attached to the substrate 110, the filling material contained in one of the recesses 172, 173 may be combined with the filling material contained in the other of the two recesses 172, 173. For example, if the filling material includes solder, the package 100 may undergo a thermal reflow process in which the solder is heated so that it becomes viscous. Therefore, the solder contained in the two recesses 172, 173 may reflow and combine with each other.

[0075] exist Figure 2In the embodiment, the conductive pin 171 may be formed as a straight rigid pin, ie, the conductive pin 171 may not be flexible. Figure 3 An alternative configuration of the conductive pin 171 is shown, with Figure 2 The same elements with the same or similar functions are denoted by the same reference numerals.

[0076] Figure 3 Another embodiment of the package 100 is shown, wherein the Figure 2 The same elements with the same or similar functions are denoted by the same reference numerals. According to this embodiment, the MEMS pressure transducer 150 covering the fluid port 140 may be arranged at or on the cover 120, and the packaging pad 160 may be arranged at or on the substrate 110. Therefore, the MEMS pressure transducer 150 and the packaging pad 160 are located at two opposite sides of the package body 100.

[0077] Figure 3 A conductive pin 171 is shown that includes a curved portion 174 that provides greater flexibility to the conductive pin 171 compared to a straight pin. For example, the conductive pin 171 can be provided as a curved metal piece to accommodate process tolerances. The curved portion 174 enhances the flexibility of the pin 171 in the vertical direction (i.e., in the direction between the cover 120 and the substrate 110). This flexibility allows additional degrees of freedom in assembly tolerances to be provided by the assembly tolerance portion 170.

[0078] As mentioned above Figure 2 and Figure 3 As described above, it is sufficient if the assembly tolerance portion 170 can include exactly one single transfer block 180 and / or exactly one single pin 171. Alternatively, two or more pins 171 may be provided with or without the above-mentioned bent portion 174. Two or more pins 171 may be arranged in a corresponding number of additional recesses provided in the transfer block 180. Alternatively, two or more pins 171 may be arranged in a corresponding number of recesses provided in two or more transfer blocks 180. Furthermore, two or more pins 171 may be arranged in a corresponding number of additional recesses provided in the base plate 110.

[0079] Figure 4 Another embodiment of the package 100 is shown, wherein the Figure 2 and Figure 3 The same elements with the same or similar functions are denoted by the same reference numerals. According to this embodiment, the MEMS pressure transducer 150 covering the fluid port 140 may be arranged at or on the cover 120, and the packaging pad 160 may be arranged at or on the substrate 110. Therefore, the MEMS pressure transducer 150 and the packaging pad 160 are arranged at two opposite sides of the package body 100.

[0080] In this embodiment, the conductive pin 171 may include a bent portion 174. Alternatively, the conductive pin 171 may be formed as a straight rigid pin, such as Figure 2 shown.

[0081] The difference compared to the previous figures is the addition of an environmental barrier structure 210, which may cover the fluid port 140 from the outside of the cover 120. The environmental barrier structure 210 may act as a mechanical barrier to prevent the ingress of dust, fluids, solid matter, etc., which may otherwise cause mechanical damage to the MEMS membrane 151. The environmental barrier structure 210 may be provided as a hard rigid mesh or a compliant / flexible membrane.

[0082] The environmental barrier structure 210 may be integrated into the cover 120 to avoid expensive laser cavity structuring that would otherwise be required if the environmental barrier structure 210 were integrated into or attached to the substrate 110. Therefore, the cover 120 may include a recess or depression 220 at its outer surface in which the environmental barrier structure 210 may be received.

[0083] Figure 5 Another embodiment of the package 100 is shown, in which the same elements having the same or similar functions as in the previous figures are denoted by the same reference numerals. According to this embodiment, the MEMS pressure transducer 150 covering the fluid port 140 can be arranged at or on the cover 120, and the packaging pad 160 can be arranged at or on the substrate 110. Therefore, the MEMS pressure transducer 150 and the packaging pad 160 are arranged on two opposite sides of the package 100.

[0084] In this embodiment, the conductive pin 171 may include a bent portion 174, such as Figure 3 As shown, or the conductive pin 171 can be formed as a straight rigid pin, such as Figure 2 shown.

[0085] The difference compared to the previously discussed embodiment is the additional insulating structure 230 provided at the periphery of the conductive pin 171. The insulating structure 230 may protect the conductive pin 171 from short circuiting.

[0086] Figure 6 Another embodiment of the package 100 is shown, in which the same elements having the same or similar functions as in the previous figures are denoted by the same reference numerals. According to this embodiment, the MEMS pressure transducer 150 covering the fluid port 140 can be arranged at or on the cover 120, and the packaging pad 160 can be arranged at or on the substrate 110. Therefore, the MEMS pressure transducer 150 and the packaging pad 160 are arranged on two opposite sides of the package 100.

[0087] According to this embodiment, the rigid transfer block 180 may be configured as an integral part extending seamlessly between the cover 120 and the substrate 110, that is, there is no physical gap between the transfer block 180 and the substrate 110. In addition, the MEMS pressure transducer 150 is mounted on the cover 120 so that it covers the fluid port 140 provided in the cover 120. The packaging pad 160 is provided at the substrate 110, and thus arranged on the opposite side of the MEMS pressure transducer 150.

[0088] In this embodiment, the rigid transfer block 180 may include an assembly tolerance portion 170. The assembly tolerance portion 170 may include an accommodating portion 175 provided at the rigid transfer block 180, wherein the accommodating portion 175 may be accommodated in the hole 128 provided in the cover 120. The accommodating portion 175 may be provided as a protruding portion protruding from the surface of the transfer block 180. The accommodating portion 175 may be provided at the upper surface of the transfer block 180 facing the cover 120. The accommodating portion 175 may be inserted into the hole 128 in the cover 120. The accommodating portion 175 may be flush with the outer surface of the cover 120.

[0089] Additionally or alternatively (not shown here), the rigid transfer block 180 may include a receiving portion provided at a lower surface of the transfer block 180, the receiving portion facing the substrate 110. The receiving portion may be received in a hole provided in the substrate 110. The receiving portion 175 may be inserted into the hole in the substrate 110.

[0090] The hole 128 in the cover 120 and / or in the substrate 110 can be wider than the width of the receiving portion 175, so that the receiving portion 175 is received in the hole 128 by a clearance fit. The receiving portion 175 of the transfer block 180 can include a width that is 1.2 to 1.8 times smaller than the width of the hole 128. For example, the hole 128 in the cover 120 can include a width between 0.7 mm and 0.8 mm, while the receiving portion 175 can include a width between 0.4 mm and 0.6 mm. Therefore, the gap between the receiving portion 175 and the hole 128 in the cover 120 can be between 0.1 mm and 0.4 mm.

[0091] The gap between the receiving portion 175 and the hole 128 can be filled with a bonding material 250, in particular a non-conductive bonding material such as glue. For example, the non-conductive bonding material 250 can be permanently elastic, so that it is elastic before and after curing. For example, the bonding material 250 can include a permanent elastic soft glue. Alternatively, the non-conductive bonding material 250 can be temporarily elastic, so that it is elastic before curing, but inelastic after curing.

[0092] In a pre-assembly step, the receiving portion 175 carrying the bonding material 250 can be loosely inserted into the hole 128. Therefore, the rigid transfer block 180 will also be subsequently loosely attached to the cover 120. The rigid transfer block 180 can be electrically coupled to the MEMS pressure transducer 150, which can be fixedly fixed to the cover 120, for example, by bonding wires 121. During assembly, i.e., after the cover 120 is attached to the substrate 110, the transfer block 180 can be fixedly fixed to the cover 120, for example, by curing the non-conductive bonding material 250. Then, the rigid transfer block 180 can be electrically coupled to and fixedly fixed to the substrate 110 by the solder 240 using a thermal reflow process.

[0093] Alternatively, in a pre-assembly step, the rigid transfer block 180 may be attached and fixedly secured to the substrate 110, for example, by solder or glue 240. During assembly, the cover 120 may be attached to the substrate 110 such that the hole 128 in the cover 120 is positioned opposite the receiving portion 175 of the rigid transfer block 180. When the cover 120 is attached to the substrate 110, the hole 128 in the cover 120 may be placed over the receiving portion 175 carrying the bonding material 250. The clearance fit between the receiving portion 175 and the hole 128 provides a mechanical assembly tolerance so that the cover 120 may be attached to the substrate 110 with some misalignment.

[0094] Figure 7 Another embodiment of the package 100 is shown, in which the same elements having the same or similar functions as in the previous figures are indicated by the same reference numerals. According to this embodiment, the MEMS pressure transducer 150 covering the fluid port 140 can be arranged at or on the substrate 110, while the packaging pad 160 can be arranged at or on the rigid transfer block 180, in particular at the surface of the transfer block 180 facing away from the substrate 110. Therefore, the MEMS pressure transducer 150 and the packaging pad 160 are arranged on two opposite sides of the package 100.

[0095] As previously discussed Figure 6 In contrast, the fluid port 140 is provided in the substrate 110 , for example formed as a through hole extending between two opposing surfaces of the substrate 110 . The MEMS pressure transducer 150 is mounted on the substrate 110 such that it covers the fluid port 140 .

[0096] according to Figure 7 In the illustrated embodiment, the rigid transfer block 180 may be configured as an integral component extending seamlessly between the cover 120 and the substrate 110 , ie, there is no physical gap between the transfer block 180 and the substrate 110 .

[0097] The assembly tolerance portion 170 may include a receiving portion 175 disposed at the rigid transfer block 180, wherein the receiving portion 175 may be received in the hole 128 disposed in the cover 120. With respect to the rigid transfer block 180, the receiving portion 175, the hole 128, and the bonding material 250, it should be noted that the above reference Figure 6 All content mentioned applies accordingly Figure 7 Embodiment of the invention.

[0098] However, in Figure 7 In the embodiment of the present invention, the packaging pad 160 can be arranged at the rigid transfer block 180, in particular at the receiving portion 175 received in the hole 128 in the cover 120. The packaging pad 160 can protrude from the hole 128 in the cover 120 to be accessible from the outside of the package body 100.

[0099] On the opposite side of the rigid transfer block 180, i.e., the side facing the substrate 110, the rigid transfer block 80 may be electrically and mechanically coupled to the substrate 110 by a bonding means 260 such as solder or glue. For example, the rigid transfer block 180 may be coupled to a surface pad 260 disposed at the surface of the substrate 110. The integrated conductive layer 124 may electrically connect the surface pad 260 with the MEMS pressure transducer 150, wherein the aforementioned integrated circuit 190 may be optionally located therebetween.

[0100] As previously described, the conductive surface pads, conductive surface traces, and integrated conductive layers may be part of the wiring of the substrate 110. Thus, more generally, the rigid transfer block 180 may be conductively coupled to wiring disposed in or at the substrate 110 for establishing an electrical path between the package pad 160 and the oppositely disposed MEMS pressure transducer 150.

[0101] Figure 8 Another embodiment of the package 100 is shown, in which the same elements having the same or similar functions as in the previous figures are indicated by the same reference numerals. According to this embodiment, the MEMS pressure transducer 150 covering the fluid port 140 can be arranged at or on the substrate 110, while the packaging pad 160 can be arranged at or on the rigid transfer block 180, in particular at the surface of the transfer block 180 facing away from the substrate 110. Therefore, the MEMS pressure transducer 150 and the packaging pad 160 are arranged on two opposite sides of the package 100.

[0102] As previously discussed Figure 7 In contrast, the rigid transfer block 180 may include a conductive connection pad 270 for establishing an electrical path between the package pad 160 and the MEMS pressure transducer 150 , wherein the conductive connection pad 270 is spatially and galvanically separated from the substrate 110 .

[0103] For example, the rigid transfer block 180 may include a protrusion 181 at which the conductive connection pad 270 may be disposed. The protrusion 181 may protrude laterally from the profile of the rigid transfer block 180. The conductive connection pad 270 may be disposed at the protrusion 181 such that the protrusion 181 is positioned between the conductive connection pad 270 and the substrate 110.

[0104] The electrical path between the packaging pad 160 and the oppositely arranged MEMS pressure transducer 150 can be established by an electrical connector 121 such as a bonding wire. The electrical connector 121 can be connected to the conductive connection pad 270. The conductive connection pad 270 and the packaging pad 160 can be electrically coupled to each other by wiring provided in or at the rigid transfer block 180. Accordingly, by connecting the MEMS pressure transducer 150 to the conductive connection pad 270, the MEMS pressure transducer 150 is also coupled to the packaging pad 160. Optionally, the control circuit 190 can be located in the electrical path between the MEMS pressure transducer 150 and the packaging pad 160.

[0105] according to Figure 8 In the illustrated embodiment, the substrate 110 can be configured as a wiring-free substrate, ie, the substrate 110 does not need to be provided with expensive wiring, such as surface pads, surface traces or integrated conductive layers. In this case, a simple plastic substrate is sufficient.

[0106] Fig. 9 Another embodiment of the package 100 is shown, in which the same elements having the same or similar functions as in the previous figures are denoted by the same reference numerals. According to this embodiment, the MEMS pressure transducer 150 covering the fluid port 140 can be arranged at or on the cover 120, and the packaging pad 160 can be arranged at or on the substrate 110. Therefore, the MEMS pressure transducer 150 and the packaging pad 160 are arranged on two opposite sides of the package 100.

[0107] The rigid transfer block 180 may be similar to the reference Figure 6 However, Figure 8 The embodiment of may be combined with each embodiment in which the rigid transfer block 180 is coupled to the cover 120 .

[0108] like Fig. 9 As shown, the cover 120 includes one or more flexible tongues 221, 222. The flexible tongues 221, 222 may be formed integrally with the cover 120. For example, the one or more flexible tongues 221, 222 may be formed by providing some cutout portions in the cover 120 and bending the remaining cover material portion to the inside (i.e., in the direction of the cavity 130).

[0109] Due to the flexible nature of the flexible tongues 221, 222, the flexible tongues 221, 222 can provide a certain mechanical assembly tolerance. Therefore, the flexible tongues 221, 222 are an exemplary embodiment of the innovative assembly tolerance portion 170. In the previously discussed embodiment, the assembly tolerance portion 170 is part of the rigid transfer block 180. However, additionally or alternatively, the assembly tolerance portion 170 can include the above-mentioned flexible tongues 221, 222 that can be part of the cover 120.

[0110] The resilient or flexible tongues 221, 222 allow compensation of vertical assembly misalignments, ie misalignments in the direction between the cover 120 and the base plate 110. In other words, the resilient or flexible tongues 221, 222 preferably provide vertical assembly tolerances.

[0111] One or more flexible tongues 221, 222 can be attached to the rigid transfer block 180, for example, by a non-conductive bonding material 250 such as glue. As described above, the bonding material 250 can be permanently or temporarily elastic. For example, the bonding material 250 can include a permanently elastic soft glue. As long as the bonding material 250 is flexible, it allows for lateral misalignment, that is, it provides lateral assembly tolerance.

[0112] In a pre-assembly step, i.e., before attaching the cover 120 to the substrate 110, the transfer block 180 can be attached to the flexible tongues 221, 222 by the bonding material 250. The transfer block 180 can be loosely attached to the tongues 221, 222. For example, if the bonding material 250 is flexible before curing, a loose connection can be provided. During assembly, i.e., when the cover 120 is attached to the substrate 110, the flexible tongues 221, 222 in combination with the flexible bonding material 250 can compensate for lateral and vertical assembly misalignments. After the cover 120 has been attached to the substrate 110, the bonding material 250 can be cured.

[0113] Fig.10 Another embodiment of the package 100 is shown, in which the same elements having the same or similar functions as in the previous figures are denoted by the same reference numerals. According to this embodiment, the MEMS pressure transducer 150 covering the fluid port 140 can be arranged at or on the cover 120, and the packaging pad 160 can be arranged at or on the substrate 110. Therefore, the MEMS pressure transducer 150 and the packaging pad 160 are arranged on two opposite sides of the package 100.

[0114] According to this embodiment, the assembly tolerance portion 170 may include a solder connector 280, such as a stud bump or a solder ball. During assembly, i.e., while the lid 120 is attached to the substrate 110, the package 100 may undergo a thermal reflow process so that the solder connector 280 is heated to its reflow temperature, at which the solder connector begins to flow slightly. At this stage, the sticky solder connector 280 allows the transfer block 180 to move, thereby providing a certain assembly tolerance.

[0115] The transfer block 180 may include a conductive connection pad 260 via which the transfer block 180 is conductively coupled to the solder connector 280. The solder connector 280 may be conductively coupled to the substrate 110 through wiring of the substrate 110 (eg, through a conductive surface pad, etc.).

[0116] In a pre-assembly step, the MEMS pressure transducer 150 and the transfer block 180 can be arranged within the cover 120, preferably directly adjacent to each other. The MEMS pressure transducer 150 can be electrically coupled to the transfer block 180 via a flexible connector such as a bonding wire 121. Thus, the cover 120 including the MEMS pressure transducer 150 and the rigid transfer block 180 can be pre-assembled before the cover 120 is attached to the substrate 110.

[0117] Fig.11 Another embodiment of the package 100 is shown, in which the same elements having the same or similar functions as in the previous figures are denoted by the same reference numerals. According to this embodiment, the MEMS pressure transducer 150 covering the fluid port 140 can be arranged at or on the cover 120, and the packaging pad 160 can be arranged at or on the substrate 110. Therefore, the MEMS pressure transducer 150 and the packaging pad 160 are arranged on two opposite sides of the package 100.

[0118] In this embodiment, the rigid transfer block 180 may be securely attached to the substrate 110 and indirectly attached to the cover 120 via the MEMS pressure transducer 150 , wherein the assembly tolerance portion 170 may be disposed between the rigid transfer block 180 and the MEMS pressure transducer 150 .

[0119] The assembly tolerance portion 170 may include a bonding material 250, in particular a non-conductive bonding material, such as glue. The bonding material 250 may be permanently elastic, such that it is elastic before and after curing. For example, the bonding material 250 may include a permanent elastic soft glue. Alternatively, the non-conductive bonding material 250 may be temporarily elastic, such that it is elastic before curing, but inelastic after curing.

[0120] In another embodiment not explicitly depicted here, the MEMS pressure transducer 150 may be attached to the substrate 110. The rigid transfer block 180 may be firmly attached to the cover 120 and indirectly attached to the substrate 110 via the MEMS pressure transducer 150. In this case, the assembly tolerance portion 170 may be provided between the rigid transfer block 180 and the MEMS pressure transducer 150.

[0121] Mechanical stress can be reduced by mounting the rigid transfer block 180 to the cover 120 via the MEMS pressure transducer 150 via the soft / flexible bonding material 250. The bonding material 250 can provide a fixation between the transfer block 180 and the MEMS pressure transducer 150 that is sufficiently stable to allow the MEMS pressure transducer 150 and the transfer block 180 to be electrically coupled via the flexible bonding device 121 during a pre-assembly step.

[0122] In each of the embodiments discussed herein, the innovative assembly tolerance portion 170 provides mechanical assembly tolerance during assembly of the package 100. This solves the overdetermination problem, i.e., overdetermination of a statically indeterminate system can be avoided. In contrast, the innovative assembly tolerance portion provides a statically underdetermined indeterminate system.

[0123] In the relative port pad configuration discussed herein, the rigid transfer block 180 is firmly attached to one of the substrate 110 and the cover 120, while the rigid transfer block 180 is (flexibly) attached to one of the substrate 110 and the cover 120 via the assembly tolerance portion 170. In other words, when the rigid transfer block 180 is coupled to one of the cover 120 and the substrate 110 via the assembly tolerance portion 170, it may be sufficient even if the rigid transfer block 180 is fixedly fixed to the other of the cover 120 or the substrate 110.

[0124] In some embodiments, the assembly tolerance portion 170 can provide a clearance fit between the rigid transfer block 180 and one of the substrate 110 and the cover 120. Any gap between the rigid transfer block 180 and one of the substrate 110 and the cover 120 can be filled with a conductive or non-conductive bonding material 250, such as solder or glue.

[0125] The bonding material 250 can be permanently elastic, so that it is elastic before and after curing. For example, the bonding material 250 can include a permanent elastic soft glue. Alternatively, the non-conductive bonding material 250 can be temporarily elastic, so that it is elastic before curing, but inelastic after curing.

[0126] According to some embodiments, the assembly tolerance portion 170 may include a permanent elastic bonding material 250 applied to the rigid transfer block 180 for permanently elastically attaching the rigid transfer block 180 to at least one of the cover 120 and the base plate 110 .

[0127] The innovation described herein may also include a corresponding method for manufacturing the pressure transducer package 100 as described above. A schematic block diagram of a method according to one embodiment is shown in FIG. Fig.12 shown.

[0128] As schematically shown at block 101 , the method may include the steps of providing a substrate 110 and a cover 120 , wherein one of the substrate 110 and the cover 120 includes a fluid port 140 , and wherein the other of the substrate 110 and the cover 120 includes a conductive packaging pad 160 .

[0129] As schematically shown at block 102 , the method may further include the step of mounting the MEMS pressure transducer 150 so that it covers the fluid port 140 .

[0130] As schematically shown at block 103 , the method may further include the step of providing a rigid transfer block 180 configured to provide an electrical path between the MEMS pressure transducer 150 and the packaging pad 160 .

[0131] As schematically shown at block 104 , the method may also include the step of performing a pre-assembly step in which the MEMS pressure transducer 150 is electrically coupled to the rigid transfer block 180 .

[0132] After the preassembly step, as schematically shown in box 105, the method may also include the following steps: closing the package 100 by attaching the cover 120 to the substrate 110, so that the packaging pad 160 is arranged on the first side 101 of the package 100, and the fluid port 140 is arranged on the opposite second side 102 of the package 100.

[0133] As schematically shown in block 106, the method may further include the step of providing an assembly tolerance portion 170 in or at least one of the cover 120 and the rigid transfer block 180 for providing a mechanical assembly tolerance between the rigid transfer block 180 and at least one of the substrate 110 and the cover 120 during the step of attaching the cover 120 to the substrate 110. The assembly tolerance portion 170 is provided before attaching the cover 120 to the substrate 110.

[0134] Although some aspects have been described in the context of an apparatus, it is clear that these aspects also represent the description of the corresponding method, wherein a block or device corresponds to a method step or a feature of a method step. Similarly, the aspects described in the context of a method step also represent the description of the feature of a corresponding block or item or corresponding device.

[0135] Although the present disclosure has been described with reference to illustrative embodiments, this description is not intended to be interpreted as having a limiting meaning. Various modifications and combinations of the illustrative embodiments and other embodiments of the present invention will be clear to those skilled in the art with reference to the specification. Therefore, the appended claims are intended to include any such modifications or embodiments.

Claims

1. A pressure transducer package (100), include: a substrate (110) and a cover (120) attached to the substrate (110), wherein a cavity (130) is defined below the cover (120), A MEMS pressure transducer (150) is disposed in the cavity (130), a fluid port (140) for allowing fluid exchange between the interior and exterior of the chamber (130), the MEMS pressure transducer (150) covering the fluid port (140), a conductive packaging pad (160) for electrically contacting the MEMS pressure transducer (150) from outside the package (100), wherein the packaging pad (160) is disposed on a first side (101) of the packaging body (100), and the fluid port (140) is disposed on an opposite second side (102) of the packaging body (100), a rigid transfer block (180) disposed in the cavity (130), the rigid transfer block (180) being configured to provide an electrical path between the MEMS pressure transducer (150) and the oppositely disposed packaging pad (160), and At least one of the cover (120) and the rigid transfer block (180) includes an assembly tolerance portion (170), and the assembly tolerance portion (170) is used to provide a mechanical assembly tolerance between the rigid transfer block (180) and at least one of the substrate (110) and the cover (120).

2. The pressure transducer package (100) according to claim 1, wherein the rigid transfer block (180) is mounted between the cover (120) and the base plate (110), and The assembly tolerance portion (170) is configured to allow relative displacement between the substrate (110) and the cover (120) while maintaining the rigid transfer block (180) in its predetermined installation position during assembly of the package (100).

3. The pressure transducer package (100) according to claim 1 or 2, wherein the rigid transfer block (180) is installed between the cover (120) and the base plate (110), and The assembly tolerance portion (170) is configured to make a static mechanical system in which the cover (120), the rigid transfer block (180) and the base plate (110) are mechanically connected to each other statically indeterminate.

4. The pressure transducer package (100) according to any one of claims 1 to 3, wherein the rigid transfer block (180) is attached to one of the base plate (110) and the cover (120) via the assembly tolerance portion (170), and wherein the rigid transfer block (180) is securely attached to the other of the base plate (110) and the cover (120).

5. The pressure transducer package (100) according to any one of claims 1 to 4, The assembly tolerance portion (170) provides a clearance fit between the rigid transfer block (180) and one of the base plate (110) and the cover (120).

6. The pressure transducer package according to any one of claims 1 to 5, Wherein the assembly tolerance portion comprises a permanent elastic bonding material applied to the rigid transfer block for permanently elastically attaching the rigid transfer block to at least one of the cover and the base plate.

7. The pressure transducer package (100) according to any one of claims 1 to 6, wherein the rigid transfer block (180) is securely attached to the cover (120) and is spaced apart from the base plate (110), wherein a gap is retained between the rigid transfer block (180) and the base plate (110), The assembly tolerance portion (170) includes a conductive pin (171) for bridging the gap and providing a conductive path between the rigid transfer block (180) and the substrate (110).

8. The pressure transducer package (100) according to claim 7, The conductive pin (171) comprises a bent portion (174), and the bent portion is used to provide the conductive pin (171) with higher flexibility than a straight pin.

9. The pressure transducer package (100) according to claim 7 or 8, wherein the assembly tolerance portion (170) comprises a recess (172) disposed in the rigid transfer block (180), wherein the conductive pin (171) is at least partially disposed in the recess (172), The recess (172) is wider than the width of the conductive pin (171), so that the conductive pin (171) is accommodated in the recess (172) through clearance fit, and The gap between the conductive pin (171) and the recess (172) is filled with a conductive filling material.

10. The pressure transducer package (100) according to any one of claims 7 to 9, The conductive pin (171) is at least partially arranged in a recess (173), and the recess (173) is provided in the substrate (110). The recess (173) is wider than the width of the conductive pin (171), so that the conductive pin (171) is accommodated in the recess (173) through clearance fit, and The gap between the conductive pin (171) and the recess (173) is filled with a conductive filling material.

11. The pressure transducer package (100) according to claim 9 or 10, The conductive filling material includes at least one of solder, solder paste and conductive adhesive.

12. The pressure transducer package (100) according to any one of claims 7 to 11, The conductive pin (171) comprises an electrical isolation structure (230), wherein the electrical isolation structure (230) is arranged around the outer periphery of the conductive pin (171).

13. The pressure transducer package (100) according to any one of claims 1 to 6, wherein the rigid transfer block (180) is configured as an integral part extending without a gap between the cover (120) and the base plate (110), and wherein the assembly tolerance portion (170) includes a receiving portion (175) disposed at the rigid transfer block (180), wherein the receiving portion (175) is received in a hole (128) disposed in the cover (120), wherein the hole (128) in the cover (120) is wider than the width of the receiving portion (175), so that the receiving portion (175) is received in the hole (128) by a clearance fit, and The gap between the receiving portion (175) and the hole (128) is filled with a bonding material (250).

14. The pressure transducer package (100) according to claim 13, The packaging pad (160) is arranged at the receiving portion (175) of the rigid transfer block (180), wherein the packaging pad (160) protrudes from the hole (128) in the cover (120) for being accessible from outside the package body (100).

15. The pressure transducer package (100) according to any one of the preceding claims, The rigid transfer block (180) is conductively coupled to wiring, which is arranged in or at the substrate (110) for establishing the electrical path between the packaging pad (160) and the MEMS pressure transducer (150) arranged oppositely.

16. The pressure transducer package (100) according to any one of claims 1 to 14, The rigid transfer block (180) includes a conductive connection pad (270) for establishing the electrical path between the packaging pad (160) and the MEMS pressure transducer (150), wherein the conductive connection pad (270) is spatially and electrically separated from the substrate (110).

17. The pressure transducer package (100) according to claim 16, The substrate (110) is configured as a wiring-free substrate.

18. The pressure transducer package (100) according to any one of the preceding claims, wherein the assembly tolerance portion (170) comprises one or more flexible tongues (221, 222) formed integrally with the cover (120), and Wherein the one or more flexible tongues (221, 222) are attached to the rigid transfer block (180).

19. The pressure transducer package (100) according to any one of the preceding claims, wherein the MEMS pressure transducer (150) is attached to the cover (120), wherein the rigid transfer block (180) is arranged between the substrate (110) and the MEMS pressure transducer (150), wherein the rigid transfer block (180) is securely attached to the substrate (110), and The assembly tolerance portion (170) is disposed between the rigid transfer block (180) and the MEMS pressure transducer (150).

20. The pressure transducer package (100) according to any one of claims 1 to 18, wherein the MEMS pressure transducer (150) is attached to the substrate (110), wherein the rigid transfer block (180) is disposed between the cover (120) and the MEMS pressure transducer (150), wherein the rigid transfer block (180) is securely attached to the cover (120), and The assembly tolerance portion (170) is disposed between the rigid transfer block (180) and the MEMS pressure transducer (150).

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