Process for bonding between micro-thruster array charge chamber and ignition chip layer

Abstract

The application is a kind of process for bonding and coating between charge chamber and ignition chip of micro-propeller array. The process comprises the following steps: preparing epoxy resin charge chamber, ignition chip, coating positioning mold and ignition chip positioning mold, and mask; placing the epoxy resin charge chamber in the coating positioning mold, covering the mask on the epoxy resin charge chamber; placing the bottom of the coating positioning mold on the vacuum adsorption platform; dispersing and coating the bonding glue on the mask, scraping the bonding glue, and the bonding glue is absorbed into the window under the action of the vacuum pump, separating the epoxy resin charge chamber with the mask; closing the vacuum pump, removing the mask, covering the ignition chip positioning mold on the ignition chip, positioning the ignition chip, and covering the charge chamber on the ignition chip with the positioning mold. The application uses the mask to control the coating area and the amount of glue, and uses the mold to control the relative position of the distribution of the charge chamber and the chip ignition bridge.

Description

Technical Field

[0001] The present invention belongs to the field of microthrusters, and particularly relates to a process for bonding and gluing between the propellant chamber of a microthruster array and an ignition chip layer. Background Art

[0002] For the traditional processing technology of microthruster arrays, for example, the distance between ignition bridges of ignition chips with dense distribution is small. Often, due to the inability to control the distribution and amount of bonding glue, the bonding glue covers the ignition bridges in subsequent processes, resulting in ignition failure. In addition, in some processes, in order to avoid the problems caused by the dense distribution of ignition bridges, a design with a large distance between ignition bridges is selected, which sacrifices the number of combustion chambers in the microthruster array. These problems are caused by the inability to effectively control the distribution of glue application, the amount of glue application, and the relative positions of the propellant chamber and the chip. Summary of the Invention

[0003] The purpose of the present invention is to provide a process for bonding and gluing between the propellant chamber of a microthruster array and an ignition chip layer.

[0004] The technical solution for achieving the purpose of the present invention is: A process for bonding and gluing between the propellant chamber of a microthruster array and an ignition chip layer, comprising the following steps:

[0005] Step (1): Prepare an epoxy resin propellant chamber and an ignition chip: Both surfaces of the epoxy resin propellant chamber are provided with vertically and horizontally staggered overflow grooves, and the overflow grooves form a "mouth" shape around the periphery of each perforation.

[0006] Step (2): Prepare a glue application positioning mold and an ignition chip positioning mold: The glue application positioning mold is used to position the epoxy resin propellant chamber, and the ignition chip positioning mold is used to position the ignition chip and the epoxy resin propellant chamber.

[0007] Step (3): Prepare a steel sheet mask: The openings on the steel sheet mask are arranged to match the perforations on the epoxy resin propellant chamber.

[0008] Step (4): Place the epoxy resin propellant chamber in the glue application positioning mold, and cover the steel sheet mask on the epoxy resin propellant chamber; Place the bottom of the glue application positioning mold on a vacuum adsorption platform, and under the action of the vacuum adsorption platform, the mask is adsorbed on the epoxy resin propellant chamber.

[0009] Step (5): Disperse and dot-apply the bonding glue on the mask, scrape the bonding glue, the bonding glue is sucked into the openings under the action of a vacuum pump, and separate the epoxy resin propellant chamber with the distributed bonding glue from the mold.

[0010] Step (6): Turn off the vacuum pump, remove the mask, cover the ignition chip positioning mold on the ignition chip, the ignition chip is positioned, and cover the drug chamber obtained in step (5) on the ignition chip equipped with the positioning mold to achieve bonding between the drug chamber and the ignition chip layer.

[0011] Furthermore, the depth of the overflow trough in step (1) is 0.1-0.15 mm.

[0012] Furthermore, the glue-applying positioning mold in step (2) is a rectangular metal block with a square cross-section and three layers of inlaid windows;

[0013] The first layer of the window has the smallest area, penetrating the adhesive positioning mold. Its area is smaller than the area of ​​the epoxy resin chamber surface to be coated. The first layer of the window is used to connect the vacuum pump. The second layer is the epoxy resin chamber embedding groove, which has a larger area than the first layer of the window. Its length and width are both 0.15-0.25 mm larger than the length and width of the epoxy resin chamber, and its thickness is equal to the thickness of the epoxy resin chamber. The third layer is the mask embedding groove, which has both a length and width 0.05-0.15 mm larger than the length and width of the mask, and its thickness is equal to the thickness of the mask.

[0014] Furthermore, the ignition chip positioning mold in step (2) is a rectangular metal block with a square cross-section and two layers of inlaid windows;

[0015] The first layer is an epoxy resin chamber with a transparent window, which has the smallest area and penetrates the ignition chip positioning mold. Its length and width are 0.15-0.25mm larger than the epoxy resin chamber. The second layer is an ignition chip mounting slot, which is 0.15-0.25mm larger than the ignition chip in length and width.

[0016] Furthermore, the mask thickness in step (3) is 0.1 ± 0.05 mm.

[0017] Furthermore, in step (3), the perforated steel sheet area in the steel sheet mask corresponding to the perforation position of the epoxy resin chamber is larger than the cross-sectional area of ​​the perforation. A large rectangular window area shorter than the perforation diameter is opened on the outer periphery of the perforated steel sheet area of ​​the mask corresponding to the position of each overflow groove. A small rectangular window area is set at an angle between two orthogonal large rectangular window areas. A square window is opened at the position corresponding to the midpoint of the adjacent perforation.

[0018] Furthermore, the method for preparing the steel sheet mask in step (3) is laser engraving or etching engraving.

[0019] Compared with the prior art, the significant advantages of this invention are:

[0020] 1. The present invention can effectively control the position of the adhesive on the wall of the drug chamber, that is, it can effectively ensure that there is bonding adhesive in a suitable area on the drug chamber, and also ensure that there is no bonding adhesive in the pore part of the drug chamber.

[0021] 2. The present invention can effectively control the amount of glue applied, which can not only ensure sufficient amount of glue to firmly bond the medicine chamber and the chip, there are no gaps between the medicine holes, and no cross-fire occurs, but also prevent excessive agent from covering the ignition bridge in the ignition area.

[0022] 3. The present invention can effectively control the relative position between the chip and the ignition chip, and the hole chambers of the medicine chamber are aligned with the ignition bridges one by one. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Schematic diagrams of the positioning mold, mask and medicine chamber adopted by the present invention; where (a) is the glue application positioning mold, (b) is the ignition chip positioning mold, (c) is the steel sheet mask, and (d) is the epoxy resin medicine chamber.

[0024] Figure 2 Schematic diagrams of the products obtained by the process of the present invention; where (a) is Example 1, (b) is Example 2, and (3) is Example 3. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The present invention will be further described in detail below with reference to the accompanying drawings.

[0026] A process for glue application in the interlayer bonding of the medicine chamber and the ignition chip of a micro-thruster array charge uses two molds and one mask to accurately and low-costly achieve the bonding and scraping alignment of the medicine chamber and the ignition layer. It can reliably achieve uniform glue application, no residue in the hole chamber, no colloid coverage in the ignition bridge area, and fine alignment.

[0027] The device adopted by the process of the present invention includes an epoxy resin medicine chamber, a stainless steel mask, a glue application positioning mold, and an ignition chip positioning mold.

[0028] The structure of the epoxy resin medicine chamber is a cubic structure with a certain thickness and has a series of perforations. The distribution of the perforations is designed according to the distribution of the ignition bridges on the ignition chip, as shown in Figure 2 (a), (b), and (c). Each perforation on the upper and lower surfaces of the epoxy resin medicine chamber is wrapped by a "mouth" - shaped groove with a certain depth, and all the grooves are the same in cross - connection, as shown in Figure 1 (d). The groove is called an "overflow groove". The "mouth" - shaped frame structure composed of the overflow grooves wraps each hole chamber, and the depth of the overflow groove is between 0.1 - 0.15 mm. The function of the overflow groove is to accommodate the excess bonding glue and prevent the bonding glue from covering the ignition bridge too much.

[0029] The structure of the mask is a stainless steel sheet with a thickness of only 0.1 mm. It is designed according to the epoxy resin structure and has window - opening areas and stainless - steel covering areas respectively. The window - opening areas are distributed around the perforations and on the "mouth" - shaped overflow grooves, as shown in Figure 1As shown in (c), a stainless steel covering area covers all perforations and is larger than the perforations. Its function is to apply bonding adhesive to specific areas of the epoxy resin chamber wall.

[0030] The adhesive application positioning mold structure is a metal rectangular body with windows, such as... Figure 1 As shown in (a), it has three layers of embedded windows. The first layer is a window with the smallest area, penetrating the entire adhesive-coating positioning mold. Its surface area is smaller than the epoxy resin drug chamber, and its function is to connect the vacuum pump and facilitate the removal of the epoxy resin drug chamber. The second layer is an epoxy resin embedding groove, with an area larger than the first layer of windows. Compared to the epoxy resin drug chamber, its length and width are 0.2 mm larger, and its height is the same as the epoxy resin drug chamber. Its function is to embed the epoxy resin drug chamber. The third layer is a mask embedding groove, with its length and width being 0.1 mm larger than the stainless steel mask, and its height is the same as the stainless steel mask. Its function is to embed and position the stainless steel mask. The adhesive-coating positioning mold can fix the drug chamber. The mask area is larger than the drug chamber area. The mask area and the drug placed are on the same plane. The mask area can fix the mask. This design ensures that the relative position of the drug chamber and the mask is fixed and in close contact.

[0031] The ignition chip positioning mold structure is a metal rectangular body with windows, such as... Figure 1 As shown in (b), it has two layers of inlaid windows. The first layer is the window for placing the propellant chamber. It has the smallest area, penetrating the entire ignition chip positioning mold. Compared to the epoxy resin propellant chamber, its length and width are 0.2 mm larger, and its function is to inlay the epoxy resin propellant chamber. The second layer is the ignition chip inlay slot. Compared to the ignition chip, its length and width are 0.2 mm larger, and its function is to inlay the ignition chip.

[0032] Place the bottom of the adhesive positioning mold on the vacuum adsorption platform. The mold is tightly adsorbed on the vacuum adsorption platform, and the mask is tightly adsorbed on the epoxy resin drug chamber. Disperse 0.5ml of bonding adhesive evenly on the mask and use a lint-free cotton swab to evenly spread the bonding adhesive. Since no adhesive is used to contact the mask and the drug chamber, there is a gap. The bonding adhesive is sucked into the opening by the vacuum pump.

[0033] Align the window of the mask with the drug chamber wall, and align the metal area of ​​the mask with the drug chamber opening and the area that does not require adhesive.

[0034] The second layer of the ignition chip positioning mold has an ignition chip embedding slot that can fix the silicon-based chip ignition layer. The ignition bridge area of ​​the chip is exposed. Since the size of the first layer of the mold is designed to accommodate the drug chamber, the relative position of the ignition chip and the drug chamber is fixed.

[0035] The ignition chip and the propellant chamber are in fixed relative positions, so the distribution of the propellant chamber holes and the ignition bridge is aligned.

[0036] The adhesive application steps are as follows: 1. Thoroughly clean the epoxy resin chamber with water, immerse it in anhydrous ethanol solvent, and sonicate for 20 minutes, then bake in a 100℃ oven for 30 minutes. 2. Place the epoxy resin chamber in the adhesive application positioning mold, and cover the mask area of ​​the adhesive application positioning mold with the mask sheet covering the hollow hole in the chamber, while the chamber wall is exposed through the opening in the mask. 3. Place the bottom of the adhesive application positioning mold on a vacuum adsorption platform. The mold and the mask are tightly adsorbed onto the epoxy resin chamber. A slight airflow can pass through the gap between the mask and the chamber, but the adsorption strength of the mask is not significantly affected. 4. Disperse 0.5 ml of bonding adhesive evenly onto the mask, and use a lint-free cotton swab to evenly spread the bonding adhesive. Due to the tiny gap between the mask and the chamber, the bonding adhesive is drawn into the opening by the vacuum pump. 5. Turn off the vacuum pump and use tweezers to peel off the mask. The bonding adhesive can be seen distributed on the surface of the propellant chamber according to the shape of the window, but it has not entered the propellant chamber hole. 6. Cover the ignition chip positioning mold (ignition chip positioning mold) on the ignition layer chip. The chip is positioned, and the large window exposes the ignition part. Gently cover the propellant chamber with the distributed bonding adhesive on the chip.

[0037] The glue-applying positioning mold fixes the relative position of the drug chamber and the mask, the mask fixes the glue-applying position on the drug chamber, and the ignition chip positioning mold fixes the relative position of the drug chamber and the ignition chip.

[0038] Example 1

[0039] (1) Prepare a medicine chamber with a height of 3mm.

[0040] The processing chambers according to this invention have a height of 2mm and are distributed in an 8×8 pattern. The height of the chambers in the adhesive-coating positioning mold is fixed at 2mm, and the mask height is 0.1mm.

[0041] (2) Bonding adhesive

[0042] (1) Fix an 8×8, 2mm high drug chamber with a glue positioning mold, cover the drug chamber with a mask, and expose the glue coating area; (2) Use a vacuum pump to apply glue evenly, and the bonding glue adheres to the exposed area. Use tweezers to peel off the mask. The bonding glue that can be seen is distributed on the surface of the drug chamber according to the shape of the window, but does not enter the drug chamber hole. Take out the drug chamber; (3) Cover the ignition chip positioning mold on the ignition layer chip, and the chip is positioned; (4) Place the drug chamber in the window area of ​​the ignition chip positioning mold, and the opening of the drug chamber corresponds one-to-one with the chip ignition bridge; (5) Take out the chip and the drug chamber.

[0043] Example 2

[0044] (1) Prepare a medicine chamber with a height of 3mm.

[0045] The processing of the drug chamber according to the present invention has a height of 3mm and the chambers are distributed in an 8×8 pattern. The fixed height of the drug chamber of the adhesive positioning mold is modified to 3mm according to the change of the drug chamber height, and the mask height is 0.1mm.

[0046] (2) Bonding adhesive

[0047] (1) Fix an 8×8, 3mm high drug chamber with a glue positioning mold, cover the drug chamber with a mask, and expose the glue coating area; (2) Use a vacuum pump to apply glue evenly, and the bonding glue adheres to the exposed area. Use tweezers to peel off the mask. The bonding glue that can be seen is distributed on the surface of the drug chamber according to the shape of the window, but does not enter the drug chamber hole. Take out the drug chamber; (3) Cover the ignition chip positioning mold on the ignition layer chip, and the chip is positioned; (4) Place the drug chamber in the window area of ​​the ignition chip positioning mold, and the opening of the drug chamber corresponds one-to-one with the chip ignition bridge; (5) Take out the chip and the drug chamber.

[0048] Example 3

[0049] (1) Prepare a medicine chamber with a height of 4mm.

[0050] The processing of the drug chamber according to the present invention has a height of 4mm and the chambers are distributed in a 2×2 pattern. The fixed height of the drug chamber of the adhesive positioning mold is modified to 4mm according to the change of the drug chamber height, and the mask height is 0.1mm.

[0051] (2) Bonding adhesive

[0052] (1) Fix a 2×2, 4mm high drug chamber with a glue positioning mold, cover the drug chamber with a mask, and expose the glue coating area; (2) Use a vacuum pump to apply glue evenly, and the bonding glue adheres to the exposed area. Use tweezers to peel off the mask. The bonding glue that can be seen is distributed on the surface of the drug chamber according to the shape of the window, but does not enter the drug chamber hole. Take out the drug chamber; (3) Cover the ignition chip positioning mold on the ignition layer chip, and the chip is positioned; (4) Place the drug chamber in the window area of ​​the ignition chip positioning mold, and the opening of the drug chamber corresponds one-to-one with the chip ignition bridge; (5) Take out the chip and the drug chamber.

Claims

1. A process for bonding and coating the propellant chamber of a micro-thruster array with an ignition chip layer, characterized in that, It includes the following steps: Step (1): Prepare an epoxy resin chamber and an ignition chip: On both surfaces of the epoxy resin chamber, there are longitudinal and transverse overflow grooves that are interconnected. The overflow grooves form a "mouth" shape around the periphery of each perforation. Step (2): Prepare a glue application positioning mold and an ignition chip positioning mold: The glue application positioning mold is used to position the epoxy resin chamber, and the ignition chip positioning mold is used to position the ignition chip and the epoxy resin chamber. Step (3): Prepare a steel sheet mask: The openings on the steel sheet mask are set to match the perforations on the epoxy resin chamber. Step (4): Place the epoxy resin chamber in the glue application positioning mold, and cover the steel sheet mask on the epoxy resin chamber. Place the bottom of the glue application positioning mold on the vacuum adsorption platform, and under the action of the vacuum adsorption platform, the mask is adsorbed on the epoxy resin chamber. Step (5): Disperse and dot the bonding glue on the mask, scrape the bonding glue. The bonding glue is sucked into the openings under the action of the vacuum pump pump pump pump, and separate the epoxy resin chamber with the distributed bonding glue from the mold. Step (6): Close the vacuum pump,揭开掩膜 is translated as "uncover the mask", Place the ignition chip positioning mold over the ignition chip, the ignition chip is positioned, and cover the chamber obtained in step (5) on the ignition chip equipped with the positioning mold to achieve the bonding of the chamber and the ignition chip layer.

2. The process according to claim 1, characterized in that, The depth of the overflow groove in step (1) is 0.1 - 0.15 mm.

3. The process according to claim 2, characterized in that, The glue application positioning mold in step (2) is a rectangular metal block with a square cross-section and three layers of embedded transparent windows. Among them, the area of the first layer of transparent window is the smallest, penetrating the glue application positioning mold, and the area is smaller than the area of the surface of the epoxy resin chamber to be coated with glue. The first layer of transparent window is used to connect the vacuum pump; the second layer is an epoxy resin chamber embedding groove, with an area larger than the first layer of transparent window, and the length and width are each 0.15 - 0.25 mm larger than the length and width of the epoxy resin chamber, and the thickness is equal to the thickness of the epoxy resin chamber; the third layer is a mask embedding groove, with the length and width each 0.05 - 0.15 mm larger than the length and width of the mask, and the thickness is equal to the thickness of the mask.

4. The process according to claim 3, characterized in that, The ignition chip positioning mold in step (2) is a rectangular metal block with a square cross-section and two layers of embedded transparent windows. The first layer is an epoxy resin chamber embedding transparent window, with the smallest area, penetrating the ignition chip positioning mold, and the length and width are each 0.15 - 0.25 mm larger than the epoxy resin chamber; the second layer is an ignition chip embedding groove, and its size compared with the ignition chip, the length and width are each 0.15 - 0.25 mm larger than the ignition chip.

5. The process according to claim 4, characterized in that, The thickness of the mask in step (3) is 0.1 ± 0.05 mm.

6. The process according to claim 5, characterized in that, In the steel sheet mask in step (3), the position corresponding to the perforation of the epoxy resin chamber is a perforated steel sheet area larger than the cross-sectional area of the perforation. Around the perforated steel sheet area of the mask, large rectangular opening areas shorter than the perforation diameter are opened at the positions corresponding to each overflow groove. An inclined small rectangular opening area is set between two orthogonal large rectangular opening areas, and a square opening is opened at the position corresponding to the midpoint of adjacent perforations.

7. The process according to claim 1, characterized in that, The method for preparing the steel sheet mask in step (3) is laser engraving or etching engraving.

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