Semiconductor dehumidification device

Abstract

The semiconductor dehumidification device comprises a machine shell, a semiconductor refrigerator arranged in the machine shell, a cold end heat exchanger and a hot end heat exchanger, the cold end heat exchanger and the hot end heat exchanger are arranged at the cold end and the hot end of the semiconductor refrigerator respectively, and an air inlet and an air outlet are formed in the two opposite side faces of the machine shell respectively. The cold-end heat exchanger is provided with a cold-end flow channel extending along a straight line, the cold-end flow channel and the upper side wall of the machine shell form a cold-end air channel, the hot-end heat exchanger is provided with a hot-end flow channel extending along a straight line, and the hot-end flow channel and the lower side wall of the machine shell form a hot-end air channel. Air flow enters the cold end air duct and the hot end air duct from the air inlet in the linear direction, and the air flow in the cold end air duct and the hot end air duct is discharged from the air outlet in the linear direction. The problems that an existing dehumidifier is large in size and cannot meet the requirement for a narrow installation space are solved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor refrigeration equipment, in particular to a semiconductor refrigeration humidity regulating device. Background Art

[0002] Semiconductor refrigeration technology has been widely used in the field of small space refrigeration and humidity control due to its small refrigeration system size, compact structure, and convenient cooling control. Therefore, semiconductor dehumidifiers of various specifications have appeared on the market. Among them, semiconductor dehumidifiers use semiconductor thermoelectric refrigeration technology and the Peltier effect of semiconductor materials to achieve refrigeration or heating. A kind of energy conversion technology, usually composed of several pairs of p and n type semiconductor thermocouples connected in series to form a semiconductor refrigeration component, which is generally in the form of a sheet. When connected to a DC power supply, the temperature of one end of the semiconductor refrigeration component will decrease, and the end with the lowered temperature is the cold end of the semiconductor refrigeration component. The temperature of the other end of the semiconductor refrigeration component will increase at the same time, and the end with the increased temperature is the hot end of the semiconductor refrigeration component. Among them, the greater the temperature difference between the cold end and the hot end of the semiconductor refrigeration component, the lower the dehumidification efficiency. Therefore, in order to improve the dehumidification efficiency, heat sinks with heat dissipation fins are provided at both ends of the semiconductor refrigeration component, and a high-speed fan is used to enhance the heat dissipation of the heat sink, reduce the temperature of the hot end, and ensure that the temperature difference between the cold end and the hot end is within a stable range.

[0003] However, the common disadvantage of semiconductor dehumidifiers on the market is that they are relatively large in size. Therefore, it is urgent to develop efficient dehumidifiers that can reduce the size and be suitable for smaller spaces. Summary of the invention

[0004] In view of the above defects in the prior art, the present invention provides a semiconductor dehumidification device to solve the problem that the existing dehumidifiers are large in size and cannot meet the needs of narrow installation spaces.

[0005] The present invention is implemented by the following technical solutions:

[0006] A semiconductor dehumidification device comprises a casing, a semiconductor refrigerator arranged in the casing, a cold-end heat exchanger and a hot-end heat exchanger, wherein the cold-end heat exchanger and the hot-end heat exchanger are respectively arranged at the cold end and the hot end of the semiconductor refrigerator, and an air inlet and an air outlet are respectively arranged on opposite sides of the casing. The cold-end heat exchanger has a cold-end flow channel extending along a straight line, and the cold-end flow channel and the upper side wall of the casing constitute a cold-end air duct. The hot-end heat exchanger has a hot-end flow channel extending along a straight line, and the hot-end flow channel and the lower side wall of the casing constitute a hot-end air duct. The airflow enters the cold-end air duct and the hot-end air duct from the air inlet in a straight line direction, and the airflow in the cold-end air duct and the hot-end air duct is discharged from the air outlet in a straight line direction.

[0007] Furthermore, the cross-sectional area of ​​the hot end flow channel is greater than the cross-sectional area of ​​the cold end flow channel.

[0008] Furthermore, the ratio of the cross-sectional area of ​​the hot end flow channel to the cross-sectional area of ​​the cold end flow channel is 6 to 1.2.

[0009] Furthermore, the housing is also provided with a cold end air supply port connected to the cold end air duct, and the air flow vertically enters the cold end air supply port into the cold end air duct.

[0010] Furthermore, the cold-end heat exchanger includes a plurality of cold-end heat exchange fins arranged perpendicularly to the end face of the semiconductor refrigerator, and two adjacent cold-end heat exchange fins and the end face of the semiconductor refrigerator are combined to form the cold-end flow channel; the hot-end heat exchanger includes a plurality of hot-end heat exchange fins arranged perpendicularly to the end face of the semiconductor refrigerator, and two adjacent hot-end heat exchange fins and the end face of the semiconductor refrigerator are combined to form the hot-end flow channel.

[0011] Furthermore, a fan for sucking or blowing air is also provided inside the casing.

[0012] Furthermore, the fan is arranged obliquely relative to a side of the casing and its wind surface faces the hot-end heat exchanger or the cold-end heat exchanger.

[0013] Furthermore, an adjusting mechanism for adjusting the wind surface of the fan to be inclined toward the hot-end heat exchanger or the cold-end heat exchanger is provided in the casing.

[0014] Furthermore, the thickness of the casing and the inclination angle of the fan satisfy the formula H=Lsinα, wherein H is the thickness of the casing, L is the side length of the fan, α is the inclination angle of the fan, and α is =0~90°.

[0015] Furthermore, the two opposite side surfaces of the casing respectively constitute an air inlet area and an air outlet area with the end surface of the semiconductor refrigerator, the air inlet is connected to the air inlet area, the air outlet is connected to the air outlet area, the air inlet area or the air outlet area is provided with the fan; or the air inlet area and the air outlet area are respectively provided with one of the fan.

[0016] Compared with the prior art, the beneficial effects of the present invention include at least:

[0017] The external airflow of the semiconductor dehumidifier of the present invention enters the cold-end air duct and the hot-end air duct from the air inlet, and the straight airflows in the cold-end air duct and the hot-end air duct are discharged from the air outlet, that is, the cold and hot air flows are both unidirectional and straight-line flow inside the casing, and the flow directions of the cold and hot air flows in the cold-end air duct and the hot-end air duct are consistent. They also share the air inlet and the air outlet at both ends of the inlet and outlet of each air duct, so as to form an airflow structure of straight-line entry and straight-line blowing, which reduces the flow resistance of the gas on the one hand, and reduces the cross-sectional size of the airflow at the same time, so that the thickness of the dehumidifier perpendicular to the airflow direction is compressed, thereby effectively reducing the overall thickness or height of the casing, and meeting the application scenario requirements of narrow installation space. Through the ingenious design of the one-way shared inlet and outlet of the cold-end air duct and the hot-end air duct, the dehumidifier of the present invention has a small air resistance and a large air volume in the one-way air duct compared with the traditional dehumidification structure with cold-end air inlet and hot-end air outlet, which meets the condition that the cooling capacity of the refrigeration system is large enough, and the dehumidification capacity is significantly greater than that of the traditional dehumidifier with the same cooling capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is one of the exploded views of the semiconductor dehumidification device according to an embodiment of the present invention;

[0019] Figure 2 It is one of the simple schematic diagrams of the air flow direction of the semiconductor dehumidification device according to the embodiment of the present invention;

[0020] Figure 3 This is a second simple schematic diagram of the airflow direction of the semiconductor dehumidification device according to an embodiment of the present invention;

[0021] Figure 4 is a schematic diagram of installing a fan of a semiconductor dehumidification device according to an embodiment of the present invention;

[0022] Figure 5 This is the second exploded view of the semiconductor dehumidification device according to the embodiment of the present invention;

[0023] In the figure: 1. Casing; 11. Air inlet; 12. Air outlet; 13. Air inlet area; 14. Air outlet area; 15. Cold end air supply inlet; 2. Semiconductor refrigerator; 3. Cold end heat exchanger; 31. Cold end flow channel; 4. Hot end heat exchanger; 41. Hot end flow channel; 5. Fan. DETAILED DESCRIPTION

[0024] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0025] The words expressing positions and directions described in the present invention are all explained with reference to the accompanying drawings as examples, but they can be changed as needed, and all such changes are included in the protection scope of the present invention.

[0026] like Figure 1-Figure 5 As shown, a semiconductor dehumidification device provided by the present invention includes a casing 1, a semiconductor refrigerator 2 arranged in the casing 1, a cold end heat exchanger 3 and a hot end heat exchanger 4, the cold end heat exchanger 3 and the hot end heat exchanger 4 are respectively arranged at the cold end and the hot end of the semiconductor refrigerator 2, the casing 1 is provided with an air inlet 11 and an air outlet 12 on two opposite sides, the cold end heat exchanger 3 includes a cold end flow channel 31 extending along a straight line, the cold end flow channel 31 and the upper side wall of the casing 1 constitute a cold end air channel, the hot end heat exchanger 4 includes a hot end flow channel 41 extending along a straight line, the hot end flow channel 41 and the lower side wall of the casing 1 constitute a hot end air channel, the airflow enters the cold end air channel and the hot end air channel from the air inlet 11, and the straight airflow in the cold end air channel and the hot end air channel is discharged from the air outlet 12.

[0027] In this embodiment, refer to Figure 2 , the direction indicated by arrow F is the airflow direction, that is, the external airflow enters the cold-end air duct and the hot-end air duct from the air inlet 11, and the straight airflows in the cold-end air duct and the hot-end air duct are both discharged from the air outlet 12, that is, the cold and hot air flows in the casing 1 are both unidirectional straight-line flow modes, and the flow directions of the cold and hot air flows in the cold-end air duct and the hot-end air duct are consistent, and they also share the air inlet 11 and the air outlet 12 at both ends of the inlet and outlet of their respective air ducts, so as to form an airflow structure with straight entry and straight blowing, which reduces the flow resistance of the gas on the one hand, and reduces the cross-sectional size of the airflow at the same time, so that the thickness dimension of the dehumidification device perpendicular to the airflow direction is compressed, thereby effectively reducing the overall thickness or height of the casing 1, meeting the application scenario requirements of a small installation space. Through experiments, it was found that, through the ingenious design of the one-way shared air inlet 11 and air outlet 12 for the cold-end air duct and the hot-end air duct, compared with the traditional dehumidification structure with cold-end air inlet and hot-end air outlet, the one-way air duct of the dehumidification device of the present invention has small air resistance and large air volume. Under the condition that the cooling capacity of the refrigeration system is large enough, the dehumidification capacity is significantly greater than that of traditional dehumidification devices with the same cooling capacity.

[0028] As a preferred embodiment, the cross-sectional area of ​​the hot-end flow channel 41 is greater than the cross-sectional area of ​​the cold-end flow channel 31 .

[0029] In this embodiment, the cold and hot air flows share the air inlet 11 and the air outlet 12, that is, q = q c +q h , where q, q c ,q hare the total airflow, cold air flow and hot air flow respectively. For semiconductor refrigerator 2, the cooling capacity Q c , heat production Q h And electrical input power P i Satisfy Q h =Q c +P i =(1+1 / cop)Q c , where cop is the cooling coefficient, i.e. cop = Q c / P i Since the conversion efficiency of semiconductor refrigeration is relatively low, assuming cop = 0.5, then Q h =3Q c , (the cop value decreases as the temperature difference between the cold and hot ends of the refrigerator increases, and vice versa), which shows that the heat exchange capacity of the hot end of the semiconductor refrigerator 2 is much higher than that of the cold end. Therefore, according to the relationship between the cold and hot ends of the semiconductor refrigerator 2, the heat and the heat exchange area (corresponding to the height of the heat exchanger), the cross-sectional area of ​​the hot end flow channel 41 in the shared air duct is larger than the cross-sectional area of ​​the cold end flow channel 31, so that under the premise that the thickness of the dehumidification device, i.e., the total air flow cross-sectional height or width is limited, the high-performance dehumidification requirements can be achieved. Among them, the preferred ratio of the cross-sectional area of ​​the hot end flow channel 41 to the cross-sectional area of ​​the cold end flow channel 31 is 6 to 1.2.

[0030] As a preferred embodiment, the cold-end heat exchanger 3 includes a plurality of cold-end heat exchange fins arranged perpendicularly to the end face of the semiconductor refrigerator 2, and two adjacent cold-end heat exchange fins and the end face of the semiconductor refrigerator 2 are combined into the cold-end flow channel 31; the hot-end heat exchanger 4 includes a plurality of hot-end heat exchange fins arranged perpendicularly to the end face of the semiconductor refrigerator 2, and two adjacent hot-end heat exchange fins and the end face of the semiconductor refrigerator 2 are combined into the hot-end flow channel 41.

[0031] In this embodiment, since the cold end heat exchanger and the hot end heat exchanger are perpendicular to the end surface of the semiconductor refrigerator 2, the direction of the semiconductor refrigerator 2 producing cold and heat is perpendicular to the direction of the airflow, that is, with the semiconductor refrigerator 2 as the boundary, the cold and hot air flows in their respective air ducts along the direction perpendicular to the direction of producing cold and heat, so as to achieve the isolation of the cold airflow and the hot airflow, avoid airflow short circuit and cold and hot offset, and help to improve the cooling capacity. In addition, according to the above heat exchange capacity Q = hS (T h -T c ) = hSΔT, where h, S, T h , T cThey are respectively the heat exchange coefficient, the heat exchange area, and the high and low temperatures (or temperature difference ΔT) corresponding to the heat exchanger and the ambient temperature. It can be seen that the first method to increase the heat exchange is to increase the heat exchange area; the second is to increase the heat exchange coefficient. Therefore, the cold end heat exchanger and the hot end heat exchanger of the present invention both use metal heat exchangers. The metal heat exchange fins have a high heat exchange coefficient, so the heat exchange can be increased. Preferably, the metal heat exchanger is an aluminum heat exchange fin, such as an extruded profile or a fin embedded in an aluminum heat exchanger, a fin-shaved aluminum heat exchanger, etc. In order to enhance the heat exchange effect, an aluminum fin-shaved heat exchanger is preferred, which has a high fin density, a large heat exchange area, and a high heat exchange.

[0032] As a preferred embodiment, refer to Figure 3 The housing 1 is also provided with a cold end air supply port 15 connected to the cold end air duct, and the air flow enters the cold end air duct vertically from the cold end air supply port 15.

[0033] In this embodiment, since the dehumidification capacity is related to the air volume passing through the cold end, the greater the air volume, the greater the amount of air vapor condensation, and the greater the dehumidification capacity, and vice versa. Due to the dimensional limitations of the dehumidifier in the thickness direction and the aforementioned proportional relationship between heat and cold, the one-way air outlet structure is often prone to insufficient cross-section of the cold end air inlet duct, affecting the dehumidification capacity. For this reason, the present invention proposes a structure for cold end air supply to increase the dehumidification capacity. Under the condition of not affecting the hot air flow, by setting a cold end air supply port 15, the airflow enters the cold end air duct vertically from the cold end air supply port 15, and the airflow direction is as follows: Figure 3 The direction indicated by arrow E; in this way, the one-way airflow siphon characteristic is utilized to form a superimposed air supply structure in two directions in the cold end air duct, thereby increasing the air volume passing through the cold end heat exchanger and thus improving the dehumidification capacity.

[0034] As a preferred embodiment, see Figure 2 The housing 1 is also provided with a fan 5 for suction or blowing. In order to increase the air intake, a fan 5 for suction can be provided at the air inlet 11, or in order to improve the heat dissipation effect, a fan 5 for blowing can be provided at the air outlet 12, so that the gas in the housing 1 can be discharged quickly and efficiently.

[0035] As a preferred embodiment, see Figure 4 The fan 5 is arranged obliquely relative to the side of the casing 1 and its wind surface faces the hot-end heat exchanger 4 or the cold-end heat exchanger 3 .

[0036] In this embodiment, since the fan 5 adopts a direct blowing or direct suction structure, the thickness direction of the casing 1 will be limited by the size of the fan 5, and the size of the fan 5 often determines the thickness of the dehumidifier. In order to reduce the thickness of the dehumidifier, the fan 5 of the present invention is placed at an angle relative to the side of the casing 1. The tilted placement of the fan 5 has two functions: the first function is to select a large-size and large-volume fan 5 to ensure the total air volume requirements of the cold end and the hot end. The effective height of the fan 5 is reduced by the tilt of the fan 5, that is, the thickness of the dehumidifier is reduced while ensuring the dehumidification amount. The second function is: based on the tilted setting of the fan 5, the air flow of the cold end air duct and the hot end air duct can be adjusted by the tilt angle to achieve a reasonable distribution of cold and hot air volumes to achieve the best dehumidification effect.

[0037] As a preferred embodiment, the casing 1 is provided with an adjusting mechanism (not shown) for adjusting the wind surface of the fan 5 to tilt toward the hot-end heat exchanger 4 or the cold-end heat exchanger 3 .

[0038] In this embodiment, the tilt direction of the fan 5 is automatically adjusted by the adjustment mechanism, so as to achieve the effect of adjusting the air flow rate entering the cold end air duct and the hot end air duct, thereby realizing the reasonable distribution of the cold and hot air volumes. The adjustment mechanism of this embodiment includes a rotating seat and a motor driving the rotating seat to rotate. The fan 5 is installed on the rotating seat, and the rotating seat is driven by the motor to rotate, and then the tilt angle of the fan 5 is adjusted. Of course, the adjustment mechanism can also be other structures, which are not specifically limited here. As long as the adjustment mechanism can adjust the tilt angle of the fan 5 and ensure that the wind surface of the fan 5 is tilted toward the hot end heat exchanger 4 or the cold end heat exchanger 3, it can be.

[0039] As a preferred embodiment, the thickness of the casing 1 and the inclination angle of the fan 5 satisfy the formula H=Lsinα, wherein H is the thickness of the casing 1, L is the side length of the fan 5, α is the inclination angle of the fan 5, and α is =0~90°.

[0040] In this embodiment, according to the formula H=Lsinα, when α is smaller, H is smaller, that is, the thickness of the housing 1 is smaller; when α=90°, the thickness H of the housing 1 is equal to the side length L of the fan 5, and the thickness H is the maximum value. Therefore, according to the above formula, the application scenario requirements of different narrow installation spaces can be met.

[0041] As a preferred embodiment, refer to Figure 5 The two opposite side surfaces of the casing 1 respectively form an air inlet area 13 and an air outlet area 14 with the end surface of the semiconductor refrigerator 2, the air inlet 11 is connected to the air inlet area 13, the air outlet 12 is connected to the air outlet area 14, and the air inlet area 13 or the air outlet area 14 is provided with the fan 5; or the air inlet area 13 and the air outlet area 14 are respectively provided with one of the fan 5.

[0042] In this embodiment, by tilting the fan 5 in the air inlet area 13, the air flow rate of the cold-end air duct and the hot-end air duct can be adjusted by the tilt angle of the fan 5, so as to realize the reasonable distribution of the cold and hot air volumes and achieve the best dehumidification effect; by tilting the fan 5 in the air outlet area 14, the fan 5 can drive the air of the cold-end air duct and the hot-end air duct to be blown out from the air outlet 12, so as to enhance the heat exchange effect.

[0043] In order to further increase the heat exchange air flow of the air duct and make the heat dissipation effect of the heat exchanger better, fans 5 are set in the air inlet area 13 and the air outlet area 14, and the fans 5 at both ends adopt the suction and blowing mode to cooperate with each other. The fan 5 at one end sucks air, and the corresponding fan 5 at the other end blows air, so that the air volume is superimposed, the air flow is increased, and the heat exchange effect is enhanced. In addition, since the fan 5 is consistent with the heat flow direction of the heat exchanger, the wind resistance of the air duct will be reduced, and the heat exchange effect of the hot end will be significantly enhanced, which plays a positive role in increasing the cold end production of the semiconductor refrigerator 2.

[0044] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, substitute and modify the above embodiments within the scope of the invention without departing from the principles and purpose of the present invention. All such changes should fall within the scope of protection of the claims of the present invention.

Claims

1. A semiconductor dehumidification device, characterized in that: The invention comprises a housing (1), a semiconductor refrigerator (2) arranged in the housing (1), a cold end heat exchanger (3) and a hot end heat exchanger (4), wherein the cold end heat exchanger (3) and the hot end heat exchanger (4) are respectively arranged at the cold end and the hot end of the semiconductor refrigerator (2), and the housing (1) has an air inlet (11) and an air outlet (12) respectively arranged on two opposite sides, and the cold end heat exchanger (3) has a cold end flow channel (31) extending in a straight line, and the cold end heat exchanger (3) and the hot end heat exchanger (4) are respectively arranged at the cold end and the hot end of the semiconductor refrigerator (2). The end flow channel (31) and the upper side wall of the casing (1) form a cold end air channel, the hot end heat exchanger (4) has a hot end flow channel (41) extending in a straight line, the hot end flow channel (41) and the lower side wall of the casing (1) form a hot end air channel, the air flow enters the cold end air channel and the hot end air channel from the air inlet (11) in a straight line direction, and the air flow in the cold end air channel and the hot end air channel is discharged from the air outlet (12) in a straight line direction.

2. The semiconductor dehumidification device according to claim 1, characterized in that: The cross-sectional area of ​​the hot end flow channel (41) is greater than the cross-sectional area of ​​the cold end flow channel (31).

3. The semiconductor dehumidification device according to claim 2, characterized in that: The ratio of the cross-sectional area of ​​the hot end flow channel (41) to the cross-sectional area of ​​the cold end flow channel (31) is 6 to 1.

2.

4. The semiconductor dehumidification device according to claim 1, characterized in that: The cold end heat exchanger (3) comprises a plurality of cold end heat exchange fins arranged perpendicularly to the end face of the semiconductor refrigerator (2), and two adjacent cold end heat exchange fins and the end face of the semiconductor refrigerator (2) are combined to form the cold end flow channel (31); the hot end heat exchanger (4) comprises a plurality of hot end heat exchange fins arranged perpendicularly to the end face of the semiconductor refrigerator (2), and two adjacent hot end heat exchange fins and the end face of the semiconductor refrigerator (2) are combined to form the hot end flow channel (41).

5. The semiconductor dehumidification device according to claim 1, characterized in that: The housing (1) is also provided with a cold end air supply port (15) connected to the cold end air duct, and air flow vertically enters the cold end air duct from the cold end air supply port (15).

6. The semiconductor dehumidification device according to any one of claims 1 to 5, characterized in that: A fan (5) for sucking or blowing air is also provided inside the casing (1).

7. The semiconductor dehumidification device according to claim 6, characterized in that: The fan (5) is arranged obliquely relative to the side of the casing (1) and its wind surface faces the hot-end heat exchanger (4) or the cold-end heat exchanger (3).

8. The semiconductor dehumidification device according to claim 7, characterized in that: The casing (1) is provided with an adjustment mechanism for adjusting the wind surface of the fan (5) to be inclined toward the hot end heat exchanger (4) or the cold end heat exchanger (3).

9. The semiconductor dehumidification device according to claim 7, characterized in that: The thickness of the casing (1) and the inclination angle of the fan (5) satisfy the formula H=Lsinα, wherein H is the thickness of the casing (1), L is the side length of the fan (5), α is the inclination angle of the fan (5), and α is =0 to 90°.

10. The semiconductor dehumidification device according to claim 6, characterized in that: An air inlet area (13) and an air outlet area (14) are respectively provided on two opposite side surfaces of the housing (1); the air inlet (11) is connected to the air inlet area (13); the air outlet (12) is connected to the air outlet area (14); the air inlet area (13) or the air outlet area (14) is provided with the fan (5); or the air inlet area (13) and the air outlet area (14) are respectively provided with one of the fan (5).

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