Implantable temperature measurement RFID electronic tag system and manufacturing method thereof

Abstract

The invention discloses an implantable temperature measurement RFID electronic tag system and a manufacturing method, the system comprises an electronic tag, and the electronic tag comprises a radio frequency chip, an antenna, a tag base material and a reflecting plate; the antenna and the reflecting plate are located on the upper surface and the lower surface of the tag base material respectively, a through hole is formed in the tag base material, the radio frequency chip and the antenna are arranged in the through hole, the radio frequency chip is electrically connected with the antenna, and the radio frequency chip detects the temperature and is embedded with a prefabricated tag code. By implanting the electronic tag into the cable, accurate traceability and comprehensive management of the cable can be realized, and accurate measurement of the temperature in the cable is realized.

Description

Technical Field

[0001] The present invention belongs to the technical field of implantable electronic tags, and in particular relates to an implantable temperature measuring RFID electronic tag system and a manufacturing method thereof. Background Art

[0002] The construction of a modern smart supply chain system has put forward newer and higher requirements for the construction and application of material traceability and unified identity coding (physical "ID") of physical assets. Physical "ID" IoT tags are important media and information carriers for the ubiquitous interconnection of power grid materials, and play an important role in the construction of modern smart supply chains. In the future, combined with blockchain technology, it can provide reliable guarantees for the transmission and interaction of data such as the physical "ID" of power materials, solve the problems of secure storage and sharing of physical "ID" IoT tag data, cross-subject trust, etc., and lay the foundation for the development of future supply chain finance and other businesses.

[0003] At present, the physical "ID" is used in the cable operation and maintenance management work, and a pilot construction is carried out in the form of bundling RFID electronic tags on the outside of the cable. For example, CN108197689A is a passive RFID cable temperature measurement tag, and the temperature data of the passive RFID cable temperature measurement tag is identified by an external reader device. The passive RFID cable temperature measurement tag includes: a metal tie, an antenna and an FPC circuit board. The metal tie is installed on the cable to conduct the temperature of the cable. The antenna is located on the metal tie and is used to transmit radio frequency signals between the passive RFID cable temperature measurement tag and the external reader device, and is also used to conduct the temperature of the cable. The FPC circuit board is located above the antenna and includes a passive UFH temperature tag chip. The FPC circuit board couples the radio frequency signal transmitted by the antenna and conducts the temperature of the cable to enable the passive UFH temperature tag chip to detect the cable temperature. However, with the rapid advancement of urban construction, the distribution network cable supply chain management work has highlighted the following deficiencies in the actual construction process:

[0004] (1) On-site coding is expensive: On-site coding of RFID tags for distribution cables involves secondary coding and binding, which consumes a lot of manpower and material resources. In addition, with the continuous construction of power grid projects and the continuous entry of incremental assets into the network, asset coding and labeling work is difficult. At the same time, on-site coding of existing equipment cannot provide effective support for production supervision, logistics distribution, warehouse management and other businesses, resulting in the independent implementation of additional on-site coding of material identity codes.

[0005] (2) Difficulty in cable asset inventory: Due to the length management characteristics of cable materials, inventory counting, remaining material tracking, and material collection mainly rely on on-site manual reading of the remaining cable meter marks. This is greatly affected by factors such as weather environment, personnel status, and cable sheath wear. The accuracy of the inventory cannot be guaranteed and the inventory efficiency is low.

[0006] (3) Equipment collection is difficult to trace: After the cables are collected and shipped out of the warehouse, the actual amount and type of use by the construction unit cannot be effectively controlled, which leads to the risk of theft such as passing inferior equipment off as good ones and taking the long ones for the short ones. The original purchase and collection information needs to be transmitted to the construction site, supervision unit, and acceptance unit through technical means to establish a "real-time, secure information channel" in order to fundamentally solve this problem.

[0007] (4) Difficulty in implementing incremental asset coding: At present, RFID electronic tags used in the cable field are mainly attached to the cable body in an external manner. If incremental equipment is coded at the factory, there is a risk that the label will fall off due to collisions during equipment storage and transfer, and the straps / adhesive will fall off due to the external environment and time, which cannot effectively support the needs of unified equipment coding and full life cycle management.

[0008] (5) Lack of terminal material management: Power construction is affected by many factors, and it is easy to have multiple turnovers of materials, scattered construction sites, and long project cycles. Construction units often store batches of construction materials at mobile or temporary material management points, and then allocate them to daily construction sites according to the progress of project implementation. This leads to the lack of terminal material management, making it difficult to timely discover and locate the required cable equipment and its exact location, and it is also more likely to cause problems such as material loss and theft.

[0009] (6) The temperature detection object is limited: Due to the setting method of the electronic tag, it can only detect the temperature of the outside / outer layer of the cable. In the actual cable temperature measurement process, it is often necessary to detect the temperature of the conductor inside the cable. The existing RFID electronic tags can no longer meet the requirements.

[0010] Therefore, how to provide an implantable electronic tag for measuring the temperature inside a cable is an urgent problem to be solved in the art. Summary of the invention

[0011] In view of the defects in the above-mentioned prior art, the present invention provides an implantable temperature measurement RFID electronic tag system and a manufacturing method. By implanting the electronic tag into the cable, the accurate traceability and comprehensive management of the cable can be achieved, and the temperature inside the cable can be accurately detected.

[0012] In a first aspect, the present invention provides an implantable temperature measurement RFID electronic tag system, comprising: an electronic tag, the electronic tag comprising a radio frequency chip, an antenna, a tag substrate and a reflector;

[0013] The antenna and the reflector are respectively located on the upper and lower surfaces of the tag substrate. The tag substrate is provided with a through hole. A radio frequency chip and an antenna are arranged in the through hole. The radio frequency chip is electrically connected to the antenna. The radio frequency chip detects temperature and embeds a prefabricated tag code.

[0014] The production module is used to configure the coding information and issuance information of the radio frequency chip, wherein the coding information includes the label code, and the issuance information includes a unique identifier and a temperature test strategy for realizing the internal temperature detection of the cable.

[0015] Furthermore, the antenna is formed by folding a plate to form a box-shaped structure with a hollow interior. The box-shaped structure includes an upper plate and a lower plate. A pad for fixing the radio frequency chip is provided inside the box-shaped structure.

[0016] Furthermore, the radio frequency chip is electrically connected to one side of the lower board through an impedance matching adjustment loop, and the other side of the lower board is connected to the upper board.

[0017] Furthermore, one end of the impedance matching adjustment loop connected to the radio frequency chip is provided with a feeding port that matches the antenna impedance.

[0018] Furthermore, the antenna includes a rectangular metal sheet, a ground plane, a short-circuit metal plate, a feed line and a dielectric substrate. The ground plane is fixed on one side of the dielectric substrate, and the rectangular metal sheet and the short-circuit metal plate are fixed on the other side. The feed line is connected to the short-circuit metal plate, and both ends of the short-circuit metal plate are respectively connected to the rectangular metal sheet and the ground plane.

[0019] Furthermore, the RF chip includes a temperature sensor circuit for detecting temperature, the temperature sensor circuit includes an analog front-end circuit and an analog-to-digital converter circuit connected to the analog front-end circuit, the analog front-end circuit outputs a voltage and a voltage difference to the analog-to-digital converter circuit through two transistors with different bias currents, and the analog-to-digital converter circuit determines the detected temperature result based on the voltage and the voltage difference.

[0020] Furthermore, the radio frequency chip is embedded with a prefabricated label code, the label code includes the implantation information of the electronic label and the production information of the cable, the implantation information includes the sequence information, and the production information includes the manufacturer information, batch information and cable serial number information;

[0021] Label encoding, specifically expressed as:

[0022] TE=[(mi,bi,cr,si,cc)|mi∈M,bi∈B,cr∈CR,si∈S]

[0023]

[0024] Among them, TE is the label encoding dataset, M is the data encoding subset of manufacturer information, B is the data encoding subset of batch information, CR is the data encoding subset of cable serial number information, S is the data encoding subset of sequence information, cc is the check code, mi is the data encoding of manufacturer information, bi is the data encoding of batch information, cr is the data encoding of cable serial number information, si is the data encoding of sequence information, d is the manufacturer information, and D j(d) is the ASCII code corresponding to the j-th symbol of the manufacturer information, and k is the number of symbols corresponding to the manufacturer information.

[0025] Furthermore, the system also includes a production module electrically connected to the electronic tag, the production module is used to configure the coding information and issuance information of the radio frequency chip, the coding information includes the tag code, and the issuance information includes a unique identifier and a temperature test strategy for realizing the internal temperature detection of the cable;

[0026] The production module is used to configure the encoding information and issuance information of the RF chip, including:

[0027] Generate a tag code based on the implantation information of the electronic tag and the production information of the cable, and write the tag code into the radio frequency chip;

[0028] Based on the cable parameters at the location where the electronic tag is implanted and the detected temperature parameters, combined with the ambient temperature parameters at the location where the cable is located, a temperature test strategy is given;

[0029] A unique identifier is generated based on the electronic tag parameters and the card reader parameters that match the electronic tag, and the unique identifier and the temperature test strategy are uploaded and stored.

[0030] Furthermore, the cable includes multiple cable conductors, an insulating layer, a metal shielding layer, a filling layer, an armor layer and an outer sheath from the inside to the outside, and the electronic tag is implanted between the armor layer and the outer sheath;

[0031] Temperature test strategy, satisfying the following relationship:

[0032] θ c =θ0-2θ p +(W c +0.5W d )A1T1-3[W d +(1+λ1)W c ]A2T2+3[W d +(1+λ1+λ2)W c ](A3T3+A4T4)

[0033] In the formula, θ c is the cable conductor temperature, θ0 is the ambient temperature where the cable is located, θ p is the temperature detected by the electronic tag, W c is the cable conductor loss, W d is the dielectric loss of the insulation layer, T1 is the thermal resistance of the insulation layer, T2 is the thermal resistance of the filling layer, T3 is the thermal resistance of the outer sheath, T4 is the thermal resistance of the surrounding medium, λ1 is the resistance loss factor of the metal shielding layer, λ2 is the resistance loss factor of the armor layer, A1, A2, A3, and A4 are all correction coefficients.

[0034] Furthermore, the card reader parameters include the card reader power and frequency, and the electronic tag parameters include the data length and key type of the electronic tag.

[0035] Furthermore, the unique identifier is written into the radio frequency chip and uploaded for storage, including:

[0036] Verify the tag code of the electronic tag, and verify the electronic tag parameters and card reader parameters in the RF chip based on the unique identifier;

[0037] The unique identification after the tag code, electronic tag parameters and card reader parameters are verified is written into the RF chip and uploaded for storage.

[0038] In a second aspect, the present invention further provides a method for manufacturing an implantable temperature measuring RFID electronic tag, using the above-mentioned implantable temperature measuring RFID electronic tag system, the manufacturing method comprises:

[0039] Assembling a radio frequency chip, an antenna, a tag substrate and a reflective plate into an electronic tag;

[0040] Configure the encoding and issuance information of the RF chip.

[0041] The present invention provides an implantable temperature measurement RFID electronic tag system and a manufacturing method, which at least include the following beneficial effects:

[0042] (1) By implanting electronic tags into cables and configuring the distribution information, accurate cable traceability and comprehensive management can be achieved. At the same time, the configured temperature test strategy can accurately detect the internal temperature of the cable, improving the application scenarios of electronic tags.

[0043] (2) By reading the cable electronic tags, cable information can be obtained, and the identification code requirements of production and manufacturing units, material management units, on-site operation and maintenance personnel can be coordinated. In addition, the business pain points faced in cable material management, such as theft of goods, false reporting of usage, and inventory of remaining quantities, can be solved. This can greatly improve the accuracy of equipment supervision and contract performance tracking, and ensure a stable and orderly supply of power grid materials.

[0044] (3) By calculating and processing the easily detectable ambient temperature and cable armor layer temperature, the corresponding internal cable conductor temperature to be detected can be accurately obtained, ensuring the need to obtain the cable conductor temperature in actual applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A schematic diagram of an implantable temperature measurement RFID electronic tag system provided by the present invention;

[0046] Figure 2 Another structural schematic diagram of an RFID electronic tag system provided by an embodiment of the present invention;

[0047] Figure 3 A schematic diagram of the structure of an electronic tag provided by an embodiment of the present invention;

[0048] Figure 4 A circuit diagram of a T-type matching network provided in an embodiment of the present invention;

[0049] Figure 5 A circuit diagram of an antenna provided in accordance with an embodiment of the present invention;

[0050] Figure 6 A circuit diagram of a temperature sensor circuit provided by an embodiment of the present invention;

[0051] Figure 7 A schematic diagram of the structure of a cable provided in one embodiment of the present invention;

[0052] Figure 8 The present invention provides a flow chart of a method for producing an implantable temperature measuring RFID electronic tag.

[0053] Explanation of the reference numerals: 11 - RF chip, 12 - antenna, 121 - rectangular metal sheet, 122 - ground plane, 123 - short-circuit metal plate, 124 - dielectric substrate, 13 - label substrate, 14 - reflector, 21 - cable conductor, 22 - insulation layer, 23 - metal shielding layer, 24 - filling layer, 25 - armor layer, 26 - outer sheath. DETAILED DESCRIPTION

[0054] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two.

[0056] It should also be noted that the term "includes", "comprising" or any other variation thereof is intended to cover non-exclusive inclusion, so that a commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the commodity or device including the elements.

[0057] like Figures 1 to 3 As shown, the present invention provides an implantable temperature measurement RFID electronic tag system, comprising: an electronic tag and a production module electrically connected to the electronic tag, the electronic tag comprising a radio frequency chip, an antenna, a tag substrate and a reflector;

[0058] The antenna and the reflector are respectively located on the upper and lower surfaces of the tag substrate. The tag substrate is provided with a through hole. A radio frequency chip and an antenna are arranged in the through hole. The radio frequency chip is electrically connected to the antenna. The radio frequency chip detects temperature and embeds a prefabricated tag code.

[0059] The production module is used to configure the coding information and issuance information of the radio frequency chip, wherein the coding information includes the label code, and the issuance information includes a unique identifier and a temperature test strategy for realizing the internal temperature detection of the cable.

[0060] In actual application scenarios, the antenna can be formed by folding a plate to form a hollow box-shaped structure. The box-shaped structure includes an upper plate and a lower plate. A gasket for fixing the RF chip is provided inside the box-shaped structure. The RF chip is electrically connected to one side of the lower plate through an impedance matching adjustment loop, and the other side of the lower plate is connected to the upper plate. A feeding port that matches the antenna impedance is provided at one end of the impedance matching adjustment loop connected to the RF chip. The gasket is made of silicone with a thickness of 1 mm. The impedance matching adjustment loop can be a T-type matching network, such as Figure 4 As shown, the T-type matching network connects two dipole antennas through a microstrip transmission line. The larger dipole antenna has a length of L and a radius of a; the other dipole has a length of L' (L'≠L) and a radius of a', (a'≠a); the two form an unbalanced parallel transmission line with a core diameter distance of s. Since the dipole length of the T-type matching network is relatively short, a size of 0.03λ~0.06λ is selected, and the impedance of the antenna is in complex form and is inductive. Since the impedance of the electronic tag antenna must be an inductive impedance, the T-type matching network structure can be applied to the electronic tag antenna. By appropriately adjusting the parameters of the T-type matching network, the required impedance can be obtained, thereby obtaining the impedance bandwidth of the project. In addition, if Figure 5As shown, the antenna can also be a planar inverted F antenna structure, which is formed by a microstrip antenna with one end short-circuited. Its structure includes a planar rectangular metal sheet, a large ground plane, a narrow short-circuit metal plate, a dielectric substrate, and a feeder (not shown). The ground plane is fixed on one side of the dielectric substrate, and the rectangular metal sheet and the short-circuit metal plate are fixed on the other side. The feeder is connected to the short-circuit metal plate, and the two ends of the short-circuit metal plate are respectively connected to the rectangular metal sheet and the ground plane. One end of the antenna is short-circuited, which can greatly reduce the size of the antenna. The ground plate in the antenna has a certain effect of isolating the influence of the metal surface. When placed on the surface of the cable armor layer, the armor layer metal has little effect on the antenna matching and the band frame, so it has anti-metal characteristics. When the antenna of the electronic tag is placed in free space (non-metal surface), its half-power bandwidth is 15MHz, the frequency band range is 910MHz~920MHz, and the maximum reading distance is 2.8 meters. When the tag is placed on the metal surface of the armor layer, the half-power bandwidth is 15MHz, the frequency band range is 910MHz~925MHz, and the maximum reading distance is 3 meters. It can be seen that the performance of the tag placed on the metal surface is not deteriorated, and the ground plane design of the antenna structure plays an anti-metal role. And when the tag is placed on the metal surface, the metal surface reflects electromagnetic waves, which improves the directivity coefficient of the electronic tag antenna, increases the gain of the antenna, and further increases the recognition distance of the electronic tag.

[0061] The electronic chip of this embodiment detects temperature through a temperature sensor circuit, specifically, Figure 6 As shown, the RF chip may include a temperature sensor circuit for detecting temperature, and the temperature sensor circuit includes an analog front-end circuit (such as Figure 6 A1) and an analog-to-digital converter circuit connected to the analog front-end circuit (such as Figure 6 In A2), the analog front-end circuit outputs the voltage and voltage difference to the analog-to-digital converter circuit through two transistors with different bias currents. The analog-to-digital converter circuit determines the detected temperature result based on the voltage and voltage difference. In actual application scenarios, the difference ΔVBE voltage between the VBEs of the two transistors with different bias currents in the AFE circuit (analog front-end circuit) has a PTAT characteristic. By quantizing the value of ΔVBE, the current ambient temperature can be accurately obtained. When quantizing ΔVBE, a VREF that does not change with temperature is also required as a reference. Generally, a VREF reference voltage with a zero temperature coefficient can be obtained by adding a negative temperature coefficient VBE and αΔVBE. In this way, the ratio of VBE and VREF will contain temperature information. In order to make full use of the full scale of the ADC circuit (analog-to-digital converter circuit), αΔVBE is used as the quantization object, and the ADC circuit can be fully utilized. In the ADC circuit, it is necessary to determine the structure and end of the ADC. Specifically, the output of the ADC circuit can be set to:

[0062]

[0063]

[0064] Among them, the value of X changes nonlinearly with temperature. After the X value is processed by algorithm and appropriate calibration parameters (α, A and B) are selected in the algorithm, a higher linearity can be achieved in the appropriate range to obtain the best temperature difference curve (linear curve), for example, α=13, A≈600, B≈283.

[0065] For ADC, SARADC and ΣΔADC are used for performance, power consumption, area and accuracy considerations. Specifically, SARADC is designed to be 5-bit and ΣΔADC is designed to be 8-bit. The ADC circuit also includes a CIC digital filter. Specifically, the most significant bit MSB<4:0> in ADC_DATA<12:0> corresponds to the decimal value of SARADC, and LSB<8:0> is obtained by the extraction filter. The total result ADC_DATA<12:0> is obtained by the following method: X=n+2μ, where X is the decimal value of ADC_DATA<12:0>, n is the decimal value obtained by SARADC, and μ is the remainder of ΣΔADC after CIC extraction (the lowest 8 digits are converted to decimal and then divided by the decimal number represented by 8'b11111111, 0<μ<1). Then the temperature is calculated through the calibration parameters.

[0066] In order to achieve cross-professional and cross-departmental cable information security traceability, this embodiment designs the label code of the radio frequency chip so that it can better adapt to the tracking and tracing management of the entire life cycle of the cable product. Specifically, the radio frequency chip is embedded with a prefabricated label code, which contains the implantation information of the electronic tag and the production information of the cable. The implantation information includes the sequence information, and the production information includes the manufacturer information, batch information and cable serial number information;

[0067] Label encoding can be specifically expressed as:

[0068] TE=[(mi,bi,cr,si,cc)|mi∈M,bi∈B,cr∈CR,si∈S]

[0069]

[0070] Among them, TE is the label encoding dataset, M is the data encoding subset of manufacturer information, B is the data encoding subset of batch information, CR is the data encoding subset of cable serial number information, S is the data encoding subset of sequence information, cc is the check code, mi is the data encoding of manufacturer information, bi is the data encoding of batch information, cr is the data encoding of cable serial number information, si is the data encoding of sequence information, d is the manufacturer information, and D j(d) is the ASCII code corresponding to the j-th symbol of the manufacturer information, and k is the number of symbols corresponding to the manufacturer information. The check code is generated by processing other data codes in the tag code except itself, and the specific generation method can be parity check bit, cyclic redundancy check, hash function, error correction code, Base64 encoding, random number generation, etc. Among them, since the ASCII code maps each character to a specific number, it is helpful for data storage and transmission, so when converting the manufacturer information into data code, the data structure can be simplified and the performance requirements of the radio frequency chip in the electronic tag can be reduced; in addition, since the ASCII code can be applied to different systems and has good compatibility, it is ensured that the label code of this embodiment can be applied to electronic tags with different parameter specifications.

[0071] In addition, in order to improve the functional characteristics of the label coding, the coding content of the label coding can also be expanded. For example, the label coding can also include data coding of cable type information, data coding of cable model information, data coding of cable voltage level information, etc. Specifically expressed as:

[0072] TE=[(mi,to,mo,vl,bi,cr,si,cc)|mi∈M,to∈T,mo∈O,vl∈V,bi∈B,cr∈CR,si∈S]

[0073]

[0074] Wherein, TE is the data set of label encoding, T is the data encoding subset of cable type information, O is the data encoding subset of cable model information, V is the data encoding subset of cable voltage level information, M is the data encoding subset of manufacturer information, B is the data encoding subset of batch information, CR is the data encoding subset of cable serial number information, S is the data encoding subset of sequence information, cc is the check code, mi is the data encoding of manufacturer information, to is the data encoding of cable type information, mo is the data encoding of cable model information, vl is the data encoding of cable voltage level information, bi is the data encoding of batch information, cr is the data encoding of cable serial number information, si is the data encoding of sequence information, and the sequence information is related to the setting interval of the electronic tag. For example, adjacent electronic tags are implanted in the cable at a predetermined distance, and the sequence information data encoding of adjacent electronic tags is a continuous number. d is the manufacturer information, and D j(d) is the ASCII code corresponding to the j-th symbol of the manufacturer information, and k is the number of symbols corresponding to the manufacturer information. The data encoding of the cable type information, the data encoding of the cable model information, and the data encoding of the cable voltage level information can be obtained by encoding during production or warehousing, or can be calculated according to specific information through other encoding methods. For example, the encoding can be implemented by ASCII encoding, Unicode encoding, Base64 encoding, URL encoding, etc.

[0075] The tag code of the electronic tag is configured by the production module on the radio frequency chip, and when it is finally accessed by the reading and writing device, the tag code can be read and verified. In addition, in addition to configuring the tag code, this embodiment also needs to configure the temperature test strategy, etc. Specifically, the production module is used to configure the coding information and issuance information of the radio frequency chip, which may include:

[0076] Generate a label code based on the implantation information of the electronic tag and the production information of the cable, and write the label code into the radio frequency chip; wherein the production information of the cable may also include cable type information, cable model information and cable voltage level information, etc.;

[0077] Based on the cable parameters at the location where the electronic tag is implanted and the detected temperature parameters, combined with the ambient temperature parameters at the location where the cable is located, a temperature test strategy is given and the temperature test strategy is applied;

[0078] A unique identifier is generated based on the electronic tag parameters and the card reader parameters matching the electronic tag, and the unique identifier and the temperature test strategy are uploaded and stored. The unique identifier and the temperature test strategy can also be stored on the RF chip when the RF chip meets the storage requirements.

[0079] When determining the temperature test strategy in this embodiment, the corresponding design is mainly based on the overall structure of the cable, and finally the accurate calculation of the cable conductor temperature is achieved. Figure 7 As shown, the cable includes multiple cable conductors, an insulating layer, a metal shielding layer, a filling layer, an armor layer and an outer sheath from the inside to the outside, and the electronic tag is implanted between the armor layer and the outer sheath. The cable conductor, the insulating layer, and the metal shielding layer can be provided with a corresponding number of components according to different requirements. Preferably, three components are provided. Correspondingly, the temperature test strategy satisfies the following relationship:

[0080] θ c =θ0-2θ p +(W c +0.5W d )A1T1-3[W d +(1+λ1)W c ]A2T2+3[W d+(1+λ1+λ2)W c ](A3T3+A4T4)

[0081] In the formula, θ c is the cable conductor temperature, θ0 is the ambient temperature where the cable is located, θ p is the temperature detected by the electronic tag, W c is the cable conductor loss, W d is the dielectric loss of the insulation layer, T1 is the thermal resistance of the insulation layer, T2 is the thermal resistance of the filling layer, T3 is the thermal resistance of the outer sheath, T4 is the thermal resistance of the surrounding medium, λ1 is the resistance loss factor of the metal shielding layer, λ2 is the resistance loss factor of the armor layer, A1, A2, A3, A4 are all correction coefficients, and the correction coefficients can be empirical values ​​or obtained through experiments. Specifically, the values ​​of A1, A2, A3, and A4 are in the range of [0.8, 1.2]. In addition, the cable in this embodiment can also include a conductor shielding layer arranged between the cable conductor and the insulation layer, and an inner sheath arranged between the filling layer and the armor layer.

[0082] The thermal resistance parameters in the temperature test strategy can be pre-calculated based on the test or simulation data, the size parameters and correlation coefficients of the cable conductor, insulation layer, metal shielding layer, armor layer, outer sheath, and the temperature description and correlation coefficient of the surrounding environment. Figure 2 In the structure shown, T1, T2, T3, and T4 are calculated as follows:

[0083] The thermal resistance of the insulation layer in the temperature test strategy satisfies the following relationship:

[0084]

[0085] In the formula, ρ T is the thermal resistance coefficient of the insulation layer, in K·m / W, t1 is the thickness of the insulation layer, in mm, D c is the cable conductor diameter, in mm. Specifically, the thermal resistance coefficient of the insulation layer is 3.5K·m / W, the thickness of the insulation layer is 6-7 mm, preferably 6.4 mm, and the cable conductor diameter is 22-22.5 mm, preferably 22.2 mm.

[0086] The thermal resistance of the filling layer satisfies the following relationship:

[0087]

[0088] Where ρ2 is the thermal resistance coefficient of the filling layer, in K·m / W, specifically 5K·m / W. G is the geometric factor, which can be obtained by looking up the table according to the cable structure.

[0089] The thermal resistance of the outer sheath satisfies the following relationship:

[0090]

[0091] Where t3 is the outer sheath thickness in mm, D a It is the outer diameter of the armor layer, in mm.

[0092] The thermal resistance of the ambient medium is selected according to the cable laying scenario. For example, if the cable is laid in the air, the thermal resistance of the ambient medium satisfies the following relationship:

[0093]

[0094] Where h is the heat dissipation coefficient, preferably h is 3.5, D e is the outer diameter of the cable; Δθ s It is the temperature rise of the cable surface above the environment.

[0095] For the loss parameters in the temperature test strategy, they can be pre-calculated based on the test or simulation data, the size parameters of the cable conductor and insulation layer, and the correlation coefficient. c , W d The calculation of is as follows:

[0096] When calculating the cable conductor loss, the single cable conductor loss satisfies the following relationship:

[0097] W c =I 2 R c

[0098] Among them, I is the current carrying capacity of the cable conductor, the unit is A, R c is the AC resistance of the cable conductor, in Ω.

[0099] The AC resistance per unit length of cable conductor (Ω / m) is:

[0100] R=R d (1+Y1+Y2)

[0101] R d =R0[1+α 20 (θ c -20)]

[0102]

[0103] Among them, R d is the DC resistance of the cable conductor per unit length, in Ω / m, Y1 is the skin effect factor, Y2 is the proximity effect factor, R0 is the DC resistance of the cable conductor per unit length at 20°C, in Ω / m, α 20 The resistance temperature coefficient of the cable conductor at 20°C, θ cD is the cable conductor temperature, in degrees Celsius. Its value depends on the type of insulation material used. The long-term temperature tolerance of cross-linked polyethylene is 90 degrees Celsius. c is the cable conductor diameter in mm, f is the power frequency in Hz, s is the axial distance between adjacent cable conductors in mm, k s , k p is a constant. For copper conductor tightly compressed round stranded wire, k s =1, k p =0.8.

[0104] When calculating the dielectric loss of the insulation layer, the insulation loss in the insulation medium is obtained by applying voltage to the cable line. Specifically, the insulation loss per unit length in each phase satisfies the following relationship:

[0105]

[0106] Where f1 is the line frequency in Hz; U0 is the rated voltage of the cable in V; tanδ is the dielectric loss factor; c is the cable capacitance per unit length in F / m, satisfying the following relationship:

[0107]

[0108] Where ε is the relative dielectric constant of the insulating material, ε0 is the absolute dielectric constant, preferably ε0 = 8.86 × 10 -12 F / m,D i D is the diameter of the insulation layer in mm. c is the conductor diameter in mm.

[0109] For the loss factor parameters in the temperature test strategy, they can be pre-calculated based on the size parameters and correlation coefficients of the cable conductor, metal shielding layer, and armor layer in combination with test or simulation data. λ1 and λ2 are calculated as follows:

[0110] The three-core cable has a metal shielding layer wrapped around the insulation layer, which will generate an induced voltage when running in alternating current. Part of the magnetic flux generated by the conductor loop is linked to the metal shielding layer, which generates an induced electromotive force in the metal shielding layer, causing eddy current loss. In order to prevent the induced electromotive force from causing harm to the safe operation of the cable, the metal shielding layer is often grounded, but this will form a current loop and generate circulating current loss. Therefore, the loss in the metal shielding layer mainly includes circulating current loss and eddy current loss, which satisfy the following relationship:

[0111] λ1=λ1'+λ1"

[0112] Where λ1 is the ratio of the total loss of the metal shielding layer to the cable conductor loss, that is, the metal shielding layer resistance loss factor; λ'1 is the ratio of the metal shielding layer circulating current loss to the cable conductor loss; λ"1 is the ratio of the metal shielding layer eddy current loss to the conductor loss.

[0113] The center distance s between the two cable conductors is much larger than the diameter D of the cable metal shielding layer. s When the induced potential E per unit length of the metal shielding layer s , satisfying the following relationship:

[0114]

[0115] The two ends of the metal shielding layer are grounded. When the grounding resistance is very small, the current I s , satisfying the following relationship:

[0116]

[0117] R s is the resistance of the metal shielding layer per unit length of the cable Ω / m; X is the reactance of the metal shielding layer per unit length of the cable Ω / m; R is the AC resistance of the cable conductor per unit length (Ω / m).

[0118] For the cable metal shielding loss per unit length W s , satisfying the following relationship:

[0119]

[0120] Then λ'1 satisfies the following relationship:

[0121]

[0122] When three single-core cable conductors are arranged in a triangle, the metal shielding layer circulation loss factor satisfies the following relationship:

[0123]

[0124] Among them, R s is the resistance of the metal shielding layer per unit length of the cable, in Ω / m; X is the reactance of the metal shielding layer per unit length of the cable, in Ω / m; R is the AC resistance of the conductor, in Ω / m; s is the center axis spacing of each conductor of the cable, in mm; D s is the average diameter of the metal shielding layer, in mm; ρ s A is the resistivity of the material used for the metal shielding layer, in Ω·m; s is the cross-sectional area of ​​the metal shielding layer, in m 2 θ s It is the temperature of the metal shielding layer, which is generally equivalent to 70% to 80% of the conductor operating temperature.

[0125] For the case where a metal shielding layer is laid on the surface of each conductor insulation layer, λ'1 satisfies the following relationship:

[0126]

[0127] In this case, the eddy current loss of the metal shielding layer is negligible, that is, λ"1 is 0, that is, λ=λ'1 in this case. In the cable structure of this embodiment, a metal shielding layer is laid on the surface of each conductor insulation layer.

[0128] The loss factor λ2 of the armor layer is the sum of the hysteresis loss λ”2 and the eddy current loss λ”2 of the armor layer, satisfying the following relationship:

[0129] λ2=λ2'+λ2"

[0130]

[0131] Where s is the distance between the axial centers of adjacent cable conductors, in mm, and δ is the equivalent thickness of the armor layer, in mm; D a is the average diameter of the armor layer, in mm; μ is the relative magnetic permeability of the armor layer, usually 300.

[0132] After the temperature test strategy is given in this embodiment, the final result can be obtained by MATLAB calculation, and the final result can be calculated by Newton iteration method. c , T4, λ1, λ2 with respect to θ c After the expression of the variable, the test environment temperature of 22℃ is set as the initial value, and the error range in the program is set to 10 -6 , and iterate continuously until the error range is met, which is the final result.

[0133] In this embodiment, when configuring and issuing information to the radio frequency chip through the production module, the unique identifier is written into the radio frequency chip and uploaded for storage, which may include:

[0134] Verify the tag code of the electronic tag, and verify the electronic tag parameters and card reader parameters in the RF chip based on the unique identifier;

[0135] The unique identification after the tag code, electronic tag parameters and card reader parameters are verified is written into the RF chip and uploaded for storage.

[0136] The card reader parameters include the card reader power and frequency, and the electronic tag parameters include the data length and key type of the electronic tag.

[0137] The electronic tag of this embodiment adopts ultra-high frequency RFID chip technology, which breaks through the efficiency limit of traditional rectifier circuit, realizes high-efficiency self-biased rectifier, and meets the long-distance reading of tag chip. High-reliability data read-write circuit technology is adopted to realize high-reliability memory, which meets the requirements of high-reliability operation of tag chip at normal application temperature (<40°C).

[0138] The use of this electronic tag can realize the coding management of cable equipment production and manufacturing, and the electronic tag meets the performance requirements of anti-metal, high temperature resistance, and anti-destruction. By completing the segment coding of cable equipment at each fixed interval before the cable leaves the factory, applying RFID Internet of Things tags, and based on the "inventory self-coding and labeling + incremental supplier coding and labeling" mode, the front-end supplier of incremental assets installs electronic tags to achieve batch, efficient and fast tag reading and writing. Through the association between the physical "ID" and the sub-tag of the equipment component, the equipment is transformed from batch management to single management, and then refined to the traceability management of components, which improves the lean and refined level of material management. By reading the information of the cable reel cable electronic tag, the cable manufacturer, model, length, equipment order, serial number and other information are obtained, and the identification code requirements of production and manufacturing units, material management units, on-site operation and maintenance personnel are coordinated, and the business pain points such as stealing goods, false reporting of usage, and inventory of surplus in cable material management are solved, which greatly improves the accuracy of equipment supervision and performance tracking, and ensures the stable and orderly supply of power grid materials.

[0139] like Figure 8 As shown, the present invention also provides a method for making an implantable temperature measuring RFID electronic tag, using the above-mentioned implantable temperature measuring RFID electronic tag system, the making method comprises:

[0140] Assembling a radio frequency chip, an antenna, a tag substrate and a reflective plate into an electronic tag;

[0141] Configure the encoding and issuance information of the RF chip.

[0142] Although preferred embodiments of the present invention have been described, additional changes and modifications may be made to these embodiments by those skilled in the art once the basic inventive concepts are known. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention. Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. An implantable temperature measurement RFID electronic tag system, characterized in that: include: Electronic tag, the electronic tag includes a radio frequency chip, an antenna, a tag substrate and a reflective plate; The antenna and the reflector are respectively located on the upper and lower surfaces of the tag substrate. The tag substrate is provided with a through hole. The radio frequency chip and the antenna are arranged in the through hole. The radio frequency chip is electrically connected to the antenna. The radio frequency chip detects temperature and embeds a prefabricated tag code.

2. The implantable temperature measurement RFID electronic tag system according to claim 1, characterized in that: The antenna is formed by folding a plate to form a hollow box-shaped structure inside. The box-shaped structure includes an upper plate and a lower plate. A pad for fixing the RF chip is provided inside the box-shaped structure. The RF chip is electrically connected to one side of the lower plate through an impedance matching adjustment loop, and the other side of the lower plate is connected to the upper plate.

3. The implantable temperature measurement RFID electronic tag system according to claim 2, characterized in that: The antenna includes a rectangular metal sheet, a ground plane, a short-circuit metal plate, a feed line and a dielectric substrate. The ground plane is fixed on one side of the dielectric substrate, and the rectangular metal sheet and the short-circuit metal plate are fixed on the other side. The feed line is connected to the short-circuit metal plate, and both ends of the short-circuit metal plate are respectively connected to the rectangular metal sheet and the ground plane.

4. The implantable temperature measurement RFID electronic tag system according to claim 1, characterized in that: The radio frequency chip includes a temperature sensor circuit for detecting temperature. The temperature sensor circuit includes an analog front-end circuit and an analog-to-digital converter circuit connected to the analog front-end circuit. The analog front-end circuit outputs a voltage and a voltage difference to the analog-to-digital converter circuit through two transistors with different bias currents. The analog-to-digital converter circuit determines the detected temperature result based on the voltage and the voltage difference.

5. The implantable temperature measurement RFID electronic tag system according to claim 1, characterized in that: The radio frequency chip is embedded with a prefabricated label code, which contains the implantation information of the electronic label and the production information of the cable. The implantation information includes the sequence information, and the production information includes the manufacturer information, batch information and cable serial number information. Label encoding, specifically expressed as: TE=[(mi,bi,cr,si,cc)|mi∈M,bi∈B,cr∈CR,si∈S] Among them, TE is the label encoding dataset, M is the data encoding subset of manufacturer information, B is the data encoding subset of batch information, CR is the data encoding subset of cable serial number information, S is the data encoding subset of sequence information, cc is the check code, mi is the data encoding of manufacturer information, bi is the data encoding of batch information, cr is the data encoding of cable serial number information, si is the data encoding of sequence information, d is the manufacturer information, and D j (d) is the ASCII code corresponding to the j-th symbol of the manufacturer information, and k is the number of symbols corresponding to the manufacturer information.

6. The implantable temperature measurement RFID electronic tag system according to claim 1, characterized in that: The system also includes a production module electrically connected to the electronic tag, the production module is used to configure the coding information and issuance information of the radio frequency chip, the coding information includes the tag code, and the issuance information includes a unique identifier and a temperature test strategy for realizing the internal temperature detection of the cable; Among them, the production module is used to configure the encoding information and issuance information of the RF chip, including: Generate a tag code based on the implantation information of the electronic tag and the production information of the cable, and write the tag code into the radio frequency chip; Based on the cable parameters at the location where the electronic tag is implanted and the detected temperature parameters, combined with the ambient temperature parameters at the location where the cable is located, a temperature test strategy is given; A unique identifier is generated based on the electronic tag parameters and the card reader parameters that match the electronic tag, and the unique identifier and the temperature test strategy are uploaded and stored.

7. The implantable temperature measurement RFID electronic tag system according to claim 6, characterized in that: The cable includes multiple cable conductors, insulation layers, metal shielding layers, filling layers, armor layers and outer sheaths from the inside to the outside, and the electronic tag is implanted between the armor layer and the outer sheath; Temperature test strategy, satisfying the following relationship: i c =θ0-2θ p +(W c +0.5W d )A1T1-3[W d +(1+λ1)W c ]A2T2+3[W d +(1+λ1+λ2)W c ](A3T3+A4T4) In the formula, θ c is the cable conductor temperature, θ0 is the ambient temperature where the cable is located, θ p is the temperature detected by the electronic tag, W c is the cable conductor loss, W d is the dielectric loss of the insulation layer, T1 is the thermal resistance of the insulation layer, T2 is the thermal resistance of the filling layer, T3 is the thermal resistance of the outer sheath, T4 is the thermal resistance of the surrounding medium, λ1 is the resistance loss factor of the metal shielding layer, λ2 is the resistance loss factor of the armor layer, A1, A2, A3, and A4 are all correction coefficients.

8. The implantable temperature measurement RFID electronic tag system according to claim 6, characterized in that: The reader parameters include the reader power and frequency, and the electronic tag parameters include the data length and key type of the electronic tag.

9. The implantable temperature measurement RFID electronic tag system according to claim 6 or 8, characterized in that: Write the unique identifier into the RF chip and upload it for storage, including: Verify the tag code of the electronic tag, and verify the electronic tag parameters and card reader parameters in the RF chip based on the unique identifier; The unique identification after the tag code, electronic tag parameters and card reader parameters are verified is written into the RF chip and uploaded for storage.

10. A method for making an implantable temperature measuring RFID electronic tag, characterized in that: The implantable temperature measurement RFID electronic tag system according to any one of claims 1 to 9 is used, and the manufacturing method includes: Assembling a radio frequency chip, an antenna, a tag substrate and a reflective plate into an electronic tag; Configure the encoding and issuance information of the RF chip.

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