Flower basket sheet taking and placing mechanism
Through the flower basket pick-and-place mechanism in the form of multi-arm cross-reciprocating transmission, the problems of low pick-and-place efficiency and high debris rate in the existing technology are solved, the silicon wafer transfer efficiency is doubled, the capacity bottleneck is improved, and the production capacity is not only not only not only not Increased space to improve productivity.
Patent Information
- Application Number
- CN202411526237.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-30
- Publication Date
- 2024-12-20
AI Technical Summary
The existing flower basket pick-up and placement mechanism has low pick-up and placement efficiency, high debris rate, and high maintenance costs. Increasing the number of structural units will increase the equipment space, limiting the improvement of production efficiency.
The flower basket pick-and-placement mechanism adopts a multi-arm cross-reciprocating transmission, through the cross-reciprocating movement of multiple force arms, and is driven by a single or multiple power sources, so as to double the efficiency of the sucking and inserting the sucking and reciprocating, and reduce the rhythm of the sucking and releasing.
Without changing the original design space, the rhythm of picking and dropping of the sheets is effectively reduced, the efficiency of silicon wafer transfer is improved, the industry's production capacity bottleneck is improved, and the future industry development is promoted.
Smart Images
Figure CN119170544A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of CVD / PVD automatic loading and unloading equipment, and in particular to a flower basket taking and placing sheet mechanism. Background Art
[0002] Existing flower basket pick-and-place mechanisms usually have problems such as low efficiency, high fragmentation rate, high maintenance cost and limited production efficiency. The flower basket pick-and-place mechanisms of the current mainstream CVD and PVD automatic loading and unloading equipment in the market mostly use a single force arm to move forward and backward, and drive the force arm back and forth through power sources such as motors and electric cylinders to achieve the purpose of taking silicon wafers out of the flower basket or inserting silicon wafers into the flower basket. The single cycle limit of similar mechanisms in the market is about 1.5s to 2s. The production line can only reduce the loading and unloading cycle by speeding up the force arm transfer speed, or increase the number of structural units to achieve the purpose of increasing production capacity.
[0003] The above two "increase production" methods have certain limitations:
[0004] 1. According to the original structural characteristics, the rhythm of the pulling and inserting mechanism has reached its upper limit. Continuing to increase the arm transfer speed will significantly reduce the operational stability of the entire structure, increase the uncontrollable factors caused by vibration during operation and environmental wind resistance, and thus lead to more abnormal situations such as more fragments and sheet jumping.
[0005] 2. Although increasing the number of structural units can ensure the stability of a single structure, it will inevitably increase the space occupied by the entire automation equipment, thereby increasing the cost pressure on the client and being detrimental to the future technology promotion of the industry.
[0006] In order to overcome these limitations, a new form of flower basket picking and placing is designed, which achieves a higher degree of automation and production efficiency through optimized mechanical structure design and advanced control strategy. Summary of the invention
[0007] In view of the above problems, the present invention provides a flower basket picking and placing mechanism adopting a multi-arm cross reciprocating transmission form.
[0008] In order to solve the above technical problems, the technical solution adopted by the present invention is: a flower basket chip loading and unloading mechanism, comprising a first chip loading mechanism, a second chip loading mechanism, a base assembly, and a silicon chip, wherein the first chip loading mechanism and the second chip loading mechanism are mounted on the base assembly;
[0009] The first sheet loading mechanism includes a first force arm, a first supporting tooth, a first extension plate, a first lifting motor, a first base plate, a first vertical guide rail, a first slide seat, and a first slider. The first supporting tooth is regularly distributed on the first force arm. The first force arm is connected to the first base plate through the first extension plate. The first base plate and the first slide seat are connected through the first vertical guide rail. The first base plate is relatively fixed to the moving block of the first lifting motor. The moving block is driven by the first lifting motor to drive the first base plate to move vertically up and down on the first vertical guide rail. The first slide seat is equipped with a first slider.
[0010] The second sheet-carrying mechanism includes a second force arm, a second supporting tooth, a second extension plate, a second vertical guide rail, a second slide seat, a second slider, and a second lifting motor. The second supporting tooth is regularly distributed on the second force arm. The second force arm is fixed on the second extension plate. The second extension plate and the second slide seat are connected through the second vertical guide rail. The second extension plate is relatively fixed to the moving block of the second lifting motor. The moving block is driven by the second lifting motor to drive the second extension plate to move vertically up and down on the second vertical guide rail. The second slide seat is equipped with a second slider.
[0011] The base assembly includes side seat plates, a middle seat plate, legs, front and rear drive motors, a base plate, a drive wheel, a drive belt, a second clamping block, a first slide rail, a first clamping block, a driven wheel, and a second slide rail. The base assembly fixes the side seat plates and the middle seat plate on the same plane through the legs. The front and rear drive motors are installed on the base plate, and the shaft ends are connected to the drive wheels. A driven wheel is installed at the other end of the base plate, and the drive wheel and the driven wheel are driven by a drive belt. The first clamping block and the second clamping block are respectively fixed on the symmetrical planes of the drive belt, and are respectively connected to the first sheet-carrying mechanism and the second sheet-carrying mechanism. The first slide rail and the second slide rail are installed on the base plate.
[0012] Furthermore, the first supporting teeth and the second supporting teeth are arranged in groups of two, the spacing between each group of supporting teeth is set according to the specifications of the silicon wafer, and adjacent groups are arranged with equal spacing.
[0013] Furthermore, matching guide grooves are provided on the base plate corresponding to the first extension plate and the second extension plate.
[0014] Furthermore, the movable distance of the first slide rail and the second slide rail is a conveying distance of the length of a silicon wafer.
[0015] Furthermore, the first slide rail and the second slide rail are arranged parallel to each other and are respectively adapted to the first slider and the second slider of the first sheet-carrying mechanism and the second sheet-carrying mechanism.
[0016] It can be seen from the above description of the present invention that, compared with the prior art, the present invention has the following advantages:
[0017] The present invention can adjust the original single-arm to a multi-arm without changing the original design space, and adopt a single or multiple power sources to drive the multiple arms to perform cross-reciprocating motion, thereby doubling the efficiency of digging and inserting the sheets, effectively reducing the rhythm of taking and placing the sheets, improving the industry's production capacity bottleneck, and playing a positive role in promoting the future development of the industry. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:
[0019] Figure 1 It is a schematic diagram of the overall front view structure of the present invention;
[0020] Figure 2 is an isometric view of a first sheet-carrying mechanism of the present invention;
[0021] Figure 3 is an isometric view of a second sheet-carrying mechanism of the present invention;
[0022] Figure 4 This is an isometric view of an initial working state of an embodiment of the present invention;
[0023] Figure 5 This is a working state diagram of a silicon wafer being transferred to a first placement position according to an embodiment of the present invention;
[0024] Figure 6 This is a working state diagram of a silicon wafer being transferred to a second placement position according to an embodiment of the present invention;
[0025] Figure 7 This is a working state diagram of a silicon wafer being transferred to a wafer placement position according to an embodiment of the present invention. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0027] Example
[0028] refer to Figure 1-Figure 4 A flower basket fetching and placing chip mechanism comprises a first chip loading mechanism 100, a second chip loading mechanism 200, a base assembly 300, and a silicon chip 001, wherein the first chip loading mechanism 100 and the second chip loading mechanism 200 are mounted on the base assembly 300;
[0029] The first sheet loading mechanism 100 includes a first force arm 101, a first supporting tooth 102, a first extension plate 103, a first lifting motor 104, a first bottom plate 105, a first vertical guide rail 106, a first slide seat 107, and a first slider 108. The first supporting tooth 102 is regularly distributed on the first force arm 101. The first force arm 101 is connected to the first bottom plate 105 through the first extension plate 103. The first bottom plate 105 is connected to the first slide seat 107 through the first vertical guide rail 106. The first bottom plate 105 is relatively fixed to the moving block of the first lifting motor 104. The moving block is driven by the first lifting motor 104 to drive the first bottom plate 105 to move vertically up and down on the first vertical guide rail 106. The first slide seat 107 is equipped with a first slider 108.
[0030] The second sheet loading mechanism 200 includes a second force arm 201, a second supporting tooth 202, a second extension plate 203, a second vertical guide rail 204, a second slide seat 205, a second slider 206, and a second lifting motor 207. The second supporting tooth 202 is regularly distributed on the second force arm 201. The second force arm 201 is fixed on the second extension plate 203. The second extension plate 203 is connected to the second slider seat 205 through the second vertical guide rail 204. The second extension plate 203 is relatively fixed to the moving block of the second lifting motor 207. The moving block is driven by the second lifting motor 207 to drive the second extension plate 203 to move vertically up and down on the second vertical guide rail 204. The second slider seat 205 is equipped with a second slider 206.
[0031] The base assembly 300 includes a side seat plate 301, a middle seat plate 302, a support leg 303, a front and rear drive motor 304, a base plate 305, a drive wheel 306, a drive belt 307, a second clamping block 308, a first slide rail 309, a first clamping block 310, a driven wheel 311, and a second slide rail 312. The base assembly 300 fixes the side seat plate 301 and the middle seat plate 302 on the same plane through the support leg 303, and the front and rear drive motor 304 is installed on the base On the plate 305, the shaft end is connected to the driving wheel 306, and a driven wheel 311 is installed at the other end of the base plate 305. The driving wheel 306 and the driven wheel 311 are transmitted through a driving belt 307. The first clamping block 310 and the second clamping block 308 are respectively fixed on the symmetrical planes of the driving belt 307, and are respectively connected to the first wafer carrier mechanism 100 and the second wafer carrier mechanism 200. The first slide rail 309 and the second slide rail 312 are installed on the base plate 305.
[0032] The first supporting teeth 102 and the second supporting teeth 202 are grouped in two, the spacing between each group of supporting teeth is set according to the specifications of the silicon wafer, and adjacent groups are arranged with equal spacing.
[0033] The base plate 305 is provided with matching guide grooves 313 corresponding to the first extension plate 103 and the second extension plate 203 .
[0034] The movable distance of the first slide rail 309 and the second slide rail 312 is the conveying distance of a silicon wafer length. The first slide rail 309 and the second slide rail 312 are arranged parallel to each other and are respectively adapted to the first slider 108 and the second slider 206 of the first wafer loading mechanism 100 and the second wafer loading mechanism 200.
[0035] like Figure 4 As shown, during operation, first, the first wafer loading mechanism 100 is placed in the front conveying position, wherein the first supporting teeth 102 are lower than the upper working surfaces of the side seat plate 301 and the middle seat plate 302; the second wafer loading mechanism 200 is placed in the rear conveying position separated by a silicon wafer length dimension, wherein the second supporting teeth 202 are lower than the upper working surfaces of the side seat plate 301 and the middle seat plate 302.
[0036] The first lifting motor 104 drives the moving block to drive the first bottom plate 105 to move vertically upward on the first vertical guide rail 106, and the first extension plate 103 and the first lever arm 101 are lifted to a certain height as a whole, so as to lift the first silicon wafer 001 in the equipment basket; at this time, the first supporting teeth 102 are higher than the upper working surfaces of the side seat plate 301 and the middle seat plate 302;
[0037] like Figure 5 As shown, the front and rear drive motors 304 work, and through the drive wheel 306 and the driven wheel 311, the drive belt 307 is driven to move the first wafer carrier 100 to the rear conveying position at a distance of one wafer length, and at the same time, the second wafer carrier 200 is transferred to the front conveying position at a distance of one wafer length. The first support teeth 102 on the first force arm 101 move the first silicon wafer 001 to the first placement position 002 on the working surface of the side seat plate 301 and the middle seat plate 302.
[0038] The first lifting motor 104 drives the moving block, driving the first base plate 105 to move vertically downward on the first vertical guide rail 106. The first extension plate 103 and the first lever arm 101 are lowered to a certain height as a whole, and the first silicon wafer 001 in the equipment basket is dropped and placed on the first placement position 002 on the working surface of the side seat plate 301 and the middle seat plate 302.
[0039] At the same time, the second lifting motor 207 drives the moving block, driving the second extension plate 203 to move vertically upward on the second vertical guide rail 204, and the second extension plate 203 together with the second force arm 201 are lifted to a certain height as a whole, lifting the second silicon wafer 001 in the equipment basket and the first silicon wafer 001 on the first placement position 002; at this time, the second supporting teeth 202 are higher than the upper working surfaces of the side seat plate 301 and the middle seat plate 302.
[0040] like Figure 6 As shown, the front and rear drive motors 304 work, and drive the belt 307 through the driving wheel 306 and the driven wheel 311, so as to move the second wafer carrier 200 to the rear conveying position at a distance of one wafer length, and at the same time, transfer the first wafer carrier 100 to the front conveying position at a distance of one wafer length. The second supporting teeth 202 on the second force arm 201 transfer the second wafer 001 to the first placement position 002 on the working surface of the side seat plate 301 and the middle seat plate 302, and at the same time transfer the first wafer 001 above the first placement position 002 to the second placement position 003.
[0041] The second lifting motor 207 drives the moving block, driving the second extension plate 203 to move vertically downward on the second vertical guide rail 204. The second extension plate 203 and the second force arm 201 are lowered to a certain height as a whole, and the first silicon wafer 001 is dropped and placed on the second placement position 003 on the working surface of the side seat plate 301 and the middle seat plate 302; at the same time, the second silicon wafer 001 is dropped and placed on the first placement position 002 on the working surface of the side seat plate 301 and the middle seat plate 302.
[0042] Next, the first lifting motor 104 drives the moving block, driving the first base plate 105 to move vertically upward on the first vertical guide rail 106, and the first extension plate 103 together with the first lever arm 101 are lifted to a certain height as a whole, while lifting the third silicon wafer 001 in the equipment basket, the second silicon wafer 001 on the first placement position 002, and the first silicon wafer 001 on the second placement position 003; at this time, the first supporting teeth 102 are higher than the upper working surfaces of the side seat plate 301 and the middle seat plate 302.
[0043] like Figure 7 As shown, the front and rear drive motors 304 work, and through the driving wheel 306 and the driven wheel 311, the driving belt 307 is driven to move the first wafer carrier 100 to the rear conveying position at a distance of one wafer length, and at the same time, the second wafer carrier 200 is transferred to the front conveying position at a distance of one wafer length. The first supporting teeth 102 on the first force arm 101 transfer the third wafer 001 to the first placement position 002 on the working surface of the side seat plate 301 and the middle seat plate 302, transfer the second wafer 001 to the second placement position 003, and transfer the first wafer 001 to the wafer placement position 004 of the next process.
[0044] The first lifting motor 104 drives the moving block, driving the first base plate 105 to move vertically downward on the first vertical guide rail 106, and the first extension plate 103 together with the first force arm 101 are lowered to a certain height as a whole, and the first silicon wafer 001 is dropped and placed in the wafer placement position 004 for the next process; at the same time, the second silicon wafer 001 is dropped and placed in the second placement position 003 on the working surface of the side seat plate 301 and the middle seat plate 302, and the third silicon wafer 001 is dropped and placed in the first placement position 002.
[0045] According to the above mode, the silicon wafers in the equipment basket are transferred one by one to the wafer placement position 004 and enter the next station. Assuming that the round trip cycle of each single set of wafer loading mechanism is equal to the mainstream beat t in the market, under the conveying mode of the present invention, the transfer cycle of the silicon wafer is t / 2, and the wafer transfer efficiency is doubled.
[0046] The present invention can adjust the original single-arm to a multi-arm without changing the original design space, and adopt a single or multiple power sources to drive the multiple arms to perform cross-reciprocating motion, thereby doubling the efficiency of digging and inserting the sheets, effectively reducing the rhythm of taking and placing the sheets, improving the industry's production capacity bottleneck, and playing a positive role in promoting the future development of the industry.
[0047] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A flower basket taking and placing mechanism, characterized in that: It comprises a first chip-carrying mechanism (100), a second chip-carrying mechanism (200), a base assembly (300), and a silicon chip (001), wherein the first chip-carrying mechanism (100) and the second chip-carrying mechanism (200) are mounted on the base assembly (300); The first sheet-carrying mechanism (100) comprises a first force arm (101), a first supporting tooth (102), a first extension plate (103), a first lifting motor (104), a first base plate (105), a first vertical guide rail (106), a first slide seat (107), and a first slider (108); the first supporting tooth (102) is regularly distributed on the first force arm (101); the first force arm (101) is connected to the first base plate (105) through the first extension plate (103); the first base plate (105) and the first slide seat (107) are connected through the first vertical guide rail (106); the first base plate (105) is relatively fixed to the moving block of the first lifting motor (104); the moving block is driven by the first lifting motor (104) to drive the first base plate (105) to move vertically up and down on the first vertical guide rail (106); and the first slide seat (107) is provided with a first slider (108); The second sheet-carrying mechanism (200) comprises a second force arm (201), a second supporting tooth (202), a second extension plate (203), a second vertical guide rail (204), a second slide seat (205), a second slider (206), and a second lifting motor (207); the second supporting tooth (202) is regularly distributed on the second force arm (201); the second force arm (201) is fixed on the second extension plate (203); the second extension plate (203) and the second slider seat (205) are connected via the second vertical guide rail (204); the second extension plate (203) is relatively fixed to a moving block of the second lifting motor (207); the moving block is driven by the second lifting motor (207) to drive the second extension plate (203) to move vertically up and down on the second vertical guide rail (204); and the second slider seat (205) is provided with a second slider (206); The base assembly (300) comprises a side seat plate (301), a middle seat plate (302), a support leg (303), a front and rear drive motor (304), a base plate (305), a drive wheel (306), a drive belt (307), a second clamping block (308), a first slide rail (309), a first clamping block (310), a driven wheel (311), and a second slide rail (312). The base assembly (300) fixes the side seat plate (301) and the middle seat plate (302) on the same plane through the support leg (303). The front and rear drive motor (304) is installed On the base plate (305), the shaft end is connected to the driving wheel (306), and the other end of the base plate (305) is installed with a driven wheel (311). The driving wheel (306) and the driven wheel (311) are driven by a driving belt (307). The first clamping block (310) and the second clamping block (308) are respectively fixed on the symmetric plane of the driving belt (307) and are respectively connected to the first sheet-carrying mechanism (100) and the second sheet-carrying mechanism (200). The first slide rail (309) and the second slide rail (312) are installed on the base plate (305).
2. A flower basket taking and placing mechanism according to claim 1, characterized in that: The first supporting teeth (102) and the second supporting teeth (202) are each arranged in groups of two, the spacing between each group of supporting teeth is set according to the specifications of the silicon wafer, and adjacent groups are arranged with equal spacing.
3. A flower basket taking and placing mechanism according to claim 1, characterized in that: The base plate (305) is provided with matching guide grooves (313) corresponding to the first extension plate (103) and the second extension plate (203).
4. A flower basket taking and placing mechanism according to claim 1, characterized in that: The movable distance of the first slide rail (309) and the second slide rail (312) is a conveying distance of the length of a silicon wafer.
5. The flower basket taking and placing mechanism according to claim 1, characterized in that: The first slide rail (309) and the second slide rail (312) are arranged parallel to each other and are respectively adapted to the first slide block (108) and the second slide block (206) of the first sheet carrier mechanism (100) and the second sheet carrier mechanism (200).