Photovoltaic modules and their manufacturing methods

Abstract

This application relates to the field of photovoltaic technology, and particularly to a photovoltaic module and its manufacturing method. The photovoltaic module comprises a glass cover plate, an anti-PID coating, a first adhesive layer, solar cells, a second adhesive layer, and a backsheet, stacked sequentially. The raw materials for preparing the anti-PID coating include component A and component B. By weight, component A comprises 2-20 parts of a peroxide-based oxidant, 20-55 parts of a first monomer, 1-15 parts of a first crosslinking agent, 12-40 parts of a first polymer resin, and 0.1-5 parts of a first additive. By weight, component B comprises 0.2-10 parts of an amine reducing agent, 20-55 parts of a second monomer, 1-15 parts of a second crosslinking agent, 12-40 parts of a second polymer resin, and 0.1-5 parts of a second additive. The photovoltaic module of this application has a low risk of PID and a long service life.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to a photovoltaic module and its preparation method. Background Technology

[0002] Photovoltaic (PV) modules convert solar energy into electrical energy by absorbing sunlight. During operation, PV modules experience the PID effect, or Potential Induced Degradation, which refers to the power degradation that occurs when a PV module is subjected to a certain external voltage over a long period. The PID effect leads to a decrease in the open-circuit voltage, short-circuit current, and fill factor of the PV module, thereby affecting its power generation efficiency and lifespan.

[0003] Therefore, it is necessary to reduce the risk of PID in photovoltaic modules. Summary of the Invention

[0004] The first aspect of this application provides a photovoltaic module, the technical solution of which is as follows:

[0005] A photovoltaic module includes a glass cover, an anti-PID coating, a first adhesive layer, solar cells, a second adhesive layer, and a backsheet stacked sequentially.

[0006] The raw materials for preparing the anti-PID coating include component A and component B;

[0007] By weight, component A comprises 2-20 parts of a peroxide oxidant, 20-55 parts of a first monomer, 1-15 parts of a first crosslinking agent, 12-40 parts of a first polymer resin, and 0.1-5 parts of a first auxiliary agent;

[0008] By weight, component B comprises 0.2-10 parts of amine reducing agent, 20-55 parts of second monomer, 1-15 parts of second crosslinking agent, 12-40 parts of second polymer resin, and 0.1-5 parts of second auxiliary agent.

[0009] The second aspect of this application provides a method for manufacturing a photovoltaic module, the technical solution of which is as follows:

[0010] A method for manufacturing a photovoltaic module includes the following steps:

[0011] Component A is prepared by mixing the peroxide oxidant, the first monomer, the first crosslinking agent, the first polymer resin, and the first auxiliary agent according to the above-mentioned mass proportions;

[0012] Component B is prepared by mixing the amine reducing agent, the second monomer, the second crosslinking agent, the second polymer resin, and the second auxiliary agent according to the above-mentioned mass proportions;

[0013] The A component and the B component are coated on the inner surface of the glass cover to form an anti-PID coating;

[0014] A photovoltaic module is fabricated using a glass cover plate with the aforementioned anti-PID coating. The structure of the photovoltaic module includes a glass cover plate, an anti-PID coating, a first adhesive layer, solar cells, a second adhesive layer, and a backsheet stacked sequentially.

[0015] Compared with traditional solutions, this application has the following advantages:

[0016] The raw materials for preparing the anti-PID coating of this application include component A and component B. Component A contains a specific oxidant, and component B contains a specific reducing agent. By combining the oxidant and reducing agent, component A and component B can be mixed and cured at room temperature to form an anti-PID coating. Compared with the photocuring method, the formation method of the anti-PID coating is more convenient. In addition to being convenient, the anti-PID coating can also block Na+ migration, preventing Na+ precipitated from the glass cover from migrating through the first adhesive layer to the surface of the solar cell, thereby reducing the risk of PID in the photovoltaic module, improving the anti-PID performance of the photovoltaic module, ensuring the normal operation of the photovoltaic module, and extending the service life of the photovoltaic module. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application and to more completely understand this application and its beneficial effects, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a photovoltaic module according to one embodiment. Detailed Implementation

[0019] The present application will be further described in detail below with reference to specific embodiments. The present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0021] the term

[0022] Unless otherwise stated or in case of contradiction, the terms or phrases used herein shall have the following meanings:

[0023] In this application, the terms "multiple", "various", "multiple times", "multi-dimensional", etc., unless otherwise specified, refer to a quantity greater than or equal to 2. For example, "one or more" means one or more or more.

[0024] In this application, the terms "optionally," "optionally," and "optional" refer to options that are optional, meaning they can be selected from either "with" or "without." If multiple "optional" options appear in a technical solution, unless otherwise specified and there are no contradictions or mutual constraints, each "optional" option is independent.

[0025] In this application, the terms "first aspect," "second aspect," "third aspect," and "fourth aspect," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or quantity, nor should they be construed as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "first," "second," "third," and "fourth," etc., serve only a non-exhaustive enumeration purpose and should be understood not to constitute a closed limitation on quantity.

[0026] In this application, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0027] In this application, when an element is referred to as "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. It should also be understood that, in interpreting the connection or positional relationship of elements, although not explicitly described, connection and positional relationships are interpreted to include a range of error, which should be within the acceptable deviation range of a specific value as determined by a person skilled in the art.

[0028] In this application, numerical intervals (i.e., numerical ranges) are involved. Unless otherwise specified, the selected numerical distributions within the aforementioned numerical intervals are considered continuous and include the two endpoints (i.e., the minimum and maximum values) of the numerical range, as well as every value between these two endpoints. Unless otherwise specified, when a numerical interval refers only to integers within that interval, it includes the two endpoint integers of the numerical range, as well as every integer between the two endpoints. In this document, this is equivalent to directly listing every integer. For example, if t is an integer selected from 1 to 10, it means that t is any integer selected from the group of integers consisting of 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10. Furthermore, when multiple ranges are provided to describe features or characteristics, these ranges can be merged. In other words, unless otherwise specified, the ranges disclosed herein should be understood to include any and all subranges to which they are included.

[0029] Unless otherwise specified, the temperature parameters in this application are permitted to be either constant-temperature treatment or variations within a certain temperature range. It should be understood that the constant-temperature treatment allows temperature fluctuations within the precision range of the instrument control, such as ±5℃, ±4℃, ±3℃, ±2℃, or ±1℃.

[0030] In this application, percentage content refers to mass percentage for solid-liquid mixtures and solid-phase-solid mixtures, and volume percentage for liquid-phase-liquid mixtures, unless otherwise specified.

[0031] In this application, unless otherwise specified, percentage concentrations refer to final concentrations. The final concentration refers to the percentage of the added component in the system after its addition.

[0032] In this application, room temperature refers to 10℃~40℃.

[0033] The first aspect of this application provides a photovoltaic module; please refer to [link / reference]. Figure 1 The photovoltaic module 100 includes a glass cover plate 11, an anti-PID coating 12, a first adhesive layer 13, a solar cell 14, a second adhesive layer 15, and a backsheet 16 stacked in sequence.

[0034] The raw materials for preparing the anti-PID coating include component A and component B;

[0035] By weight, component A comprises 2-20 parts of a peroxide oxidant, 20-55 parts of a first monomer, 1-15 parts of a first crosslinking agent, 12-40 parts of a first polymer resin, and 0.1-5 parts of a first auxiliary agent;

[0036] By weight, component B comprises 0.2-10 parts of amine reducing agent, 20-55 parts of second monomer, 1-15 parts of second crosslinking agent, 12-40 parts of second polymer resin, and 0.1-5 parts of second auxiliary agent.

[0037] The raw materials for preparing the anti-PID coating of this application include component A and component B. Component A contains a specific oxidant, and component B contains a specific reducing agent. By combining the oxidant and reducing agent, component A and component B can be mixed and cured at room temperature to form an anti-PID coating. Compared with the photocuring method, the formation method of the anti-PID coating is more convenient. In addition to being convenient, the anti-PID coating can also block Na+ migration, preventing Na+ precipitated from the glass cover from migrating through the first adhesive layer to the surface of the solar cell, thereby reducing the risk of PID in the photovoltaic module, improving the anti-PID performance of the photovoltaic module, ensuring the normal operation of the photovoltaic module, and extending the service life of the photovoltaic module.

[0038] The peroxide oxidant comprises, but is not limited to, 2 parts, 5 parts, 10 parts, 15 parts, and 20 parts by weight. The first monomer comprises, but is not limited to, 20 parts, 30 parts, 40 parts, 50 parts, and 55 parts by weight. The first crosslinking agent comprises, but is not limited to, 1 part, 5 parts, 10 parts, and 15 parts by weight. The first polymer resin comprises, but is not limited to, 12 parts, 20 parts, 30 parts, and 40 parts by weight. The first auxiliary agent comprises, but is not limited to, 0.1 parts, 1 part, 3 parts, and 5 parts by weight.

[0039] The mass fractions of the amine reducing agent include, but are not limited to, 0.2 parts, 0.5 parts, 1 part, 5 parts, and 10 parts. The mass fractions of the second monomer include, but are not limited to, 20 parts, 30 parts, 40 parts, 50 parts, and 55 parts. The mass fractions of the second crosslinking agent include, but are not limited to, 1 part, 5 parts, 10 parts, and 15 parts. The mass fractions of the second polymer resin include, but are not limited to, 12 parts, 20 parts, 30 parts, and 40 parts. The mass fractions of the second auxiliary agent include, but are not limited to, 0.1 parts, 1 part, 3 parts, and 5 parts.

[0040] Optionally, the peroxide oxidant is selected from one or more of benzoyl peroxide, lauroyl peroxide, cumene hydroperoxide, tert-butyl hydroperoxide, di-tert-butyl peroxide, dicumyl peroxide, tert-butyl peroxide, tert-butyl valerate peroxide, methyl ethyl ketone peroxide, cyclohexanone peroxide, diisopropyl peroxide, and dicyclohexyl peroxide.

[0041] Optionally, the amine reducing agent is selected from one or more of N,N-dimethylaniline (DMA), N,N-dimethyl-p-toluidine (DMPT), N-methyl-N-2-hydroxyethyl-p-toluidine (MHPT), N,N-diethylaniline (DEA), N,N-dimethylacetamide (DMMA), and N-ethyl-N-hydroxyethylaniline (QA).

[0042] Optionally, the first monomer is selected from one or more of methyl methacrylate, methyl acrylate, butyl acrylate, isooctyl acrylate, n-octyl acrylate, lauryl acrylate, stearyl acrylate, decyl acrylate, dodecyl acrylate, tetradecyl acrylate, and hexadecyl acrylate.

[0043] Optionally, the second monomer is selected from one or more of methyl methacrylate, methyl acrylate, butyl acrylate, isooctyl acrylate, n-octyl acrylate, lauryl acrylate, stearyl acrylate, decyl acrylate, dodecyl acrylate, tetradecyl acrylate, and hexadecyl acrylate.

[0044] In some examples, the first monomer and the second monomer are chosen the same.

[0045] Optionally, the first crosslinking agent is selected from one or more of 1,4-butanediol dimethacrylate, tripropylene glycol diacrylate, hexanediol diacrylate, dipropylene glycol diacrylate, and tetrahydrofuran acrylate.

[0046] Optionally, the second crosslinking agent is selected from one or more of 1,4-butanediol dimethacrylate, tripropylene glycol diacrylate, hexanediol diacrylate, dipropylene glycol diacrylate, and tetrahydrofuran acrylate.

[0047] In some examples, the first crosslinking agent and the second crosslinking agent are the same.

[0048] Optionally, the first polymer resin is selected from acrylic resins.

[0049] Optionally, the second polymer resin is selected from acrylic resins.

[0050] Optionally, the weight-average molecular weight of the acrylic resin is 10,000 Da to 20,000 Da. The weight-average molecular weight of the acrylic resin includes, but is not limited to, 10,000 Da, 13,000 Da, 15,000 Da, 18,000 Da, and 20,000 Da.

[0051] In some examples, the first polymer resin and the second polymer resin are the same.

[0052] Optionally, the first additive is selected from one or more of polyethylene glycol dimethacrylate, pentaerythritol ethoxylate tetraacrylate, diisopropyl disulfide xanthate, and zirconium phosphate.

[0053] Optionally, the second additive is selected from one or more of polyethylene glycol dimethacrylate, pentaerythritol ethoxylate tetraacrylate, diisopropyl disulfide xanthate, and zirconium phosphate.

[0054] In some examples, the first and second adjuvants are the same.

[0055] Optionally, the amounts of components A and B satisfy the following condition: the total mass of the first monomer in component A is the same as the total mass of the second monomer in component B.

[0056] Optionally, the thickness of the anti-PID coating is 300nm to 3000nm. The thickness of the anti-PID coating includes, but is not limited to, 300nm, 500nm, 800nm, 1000nm, 1500nm, 2000nm, 2500nm, and 3000nm.

[0057] Optionally, the material of the first adhesive layer includes ethylene-vinyl acetate copolymer (EVA).

[0058] Optionally, the second adhesive layer material includes ethylene-vinyl acetate copolymer (EVA).

[0059] The EVA adhesive layer has excellent encapsulation performance, meeting the needs of photovoltaic modules. Furthermore, the EVA adhesive layer is resistant to ultraviolet radiation and high temperatures.

[0060] In one example, the material of the first adhesive layer is the same as the material of the second adhesive layer.

[0061] A second aspect of this application provides a method for manufacturing a photovoltaic module. In one embodiment, the method for manufacturing a photovoltaic module includes the following steps:

[0062] Component A is prepared by mixing the peroxide oxidant, the first monomer, the first crosslinking agent, the first polymer resin, and the first auxiliary agent according to the above-mentioned mass proportions;

[0063] Component B is prepared by mixing the amine reducing agent, the second monomer, the second crosslinking agent, the second polymer resin, and the second auxiliary agent according to the above-mentioned mass proportions;

[0064] The A component and the B component are coated on the inner surface of the glass cover to form an anti-PID coating;

[0065] A photovoltaic module is fabricated using a glass cover plate with the aforementioned anti-PID coating. The structure of the photovoltaic module includes a glass cover plate, an anti-PID coating, a first adhesive layer, solar cells, a second adhesive layer, and a backsheet stacked sequentially.

[0066] The A component of this application contains a specific oxidant and the B component contains a specific reducing agent. By combining the oxidant and the reducing agent, the A component and the B component can be mixed and cured at room temperature to form an anti-PID coating. Compared with the photocuring method, the method of forming the anti-PID coating is more convenient.

[0067] Optionally, the amounts of components A and B satisfy the following condition: the total mass of the first monomer in component A is the same as the total mass of the second monomer in component B. The amounts of components A and B affect the overall performance of the coating, including curing, cost, and light transmittance of the photovoltaic module.

[0068] A photovoltaic module is prepared using a glass cover plate with the aforementioned anti-PID coating. The anti-PID coating can block Na+ migration, preventing Na+ precipitated from the glass cover plate from migrating through the first adhesive layer to the surface of the solar cells, thereby reducing the risk of PID in the photovoltaic module and improving the anti-PID performance of the photovoltaic module.

[0069] The following description is further illustrated with specific embodiments and comparative examples. Unless otherwise specified, the raw materials involved in the following specific embodiments and comparative examples are all commercially available. Unless otherwise specified, the instruments used are all commercially available. Unless otherwise specified, the processes involved are conventionally selected by those skilled in the art.

[0070] Example 1

[0071] This embodiment provides a component A, a component B, and an anti-PID coating. Component A, by weight, comprises 8 parts methyl methacrylate (first monomer), 6 parts isooctyl acrylate (first monomer), 8 parts butyl acrylate (first monomer), 5 parts tripropylene glycol diacrylate (first crosslinking agent), 6 parts benzoyl peroxide (peroxide oxidant), 15 parts acrylic resin with a weight average molecular weight of 10,000 (first polymer resin), and 0.5 parts polyethylene glycol dimethacrylate (first auxiliary agent). Component B, by weight, comprises 8 parts methyl methacrylate (second monomer), 6 parts isooctyl acrylate (second monomer), 8 parts butyl acrylate (second monomer), 5 parts tripropylene glycol diacrylate (second crosslinking agent), 3 parts N,N-dimethylaniline (DMA, amine reducing agent), 15 parts acrylic resin with a weight average molecular weight of 10,000 (second polymer resin), and 0.5 parts polyethylene glycol dimethacrylate (second auxiliary agent).

[0072] The method for forming the anti-PID coating in this embodiment is as follows: At room temperature, components A and B are simultaneously sprayed using a dual-tube system, and cured for 1 hour to obtain the anti-PID coating. The amounts of components A and B satisfy the following condition: the total mass of the first monomer in component A is the same as the total mass of the second monomer in component B.

[0073] Example 2

[0074] This embodiment provides a component A, a component B, and an anti-PID coating. Component A, by weight, comprises 12 parts methyl methacrylate (first monomer), 10 parts n-octyl acrylate (first monomer), 12 parts butyl acrylate (first monomer), 2 parts hexanediol diacrylate (first crosslinking agent), 4 parts benzoyl peroxide (peroxide oxidant), 12 parts acrylic resin with a weight average molecular weight of 15000 (first polymer resin), and 0.5 parts polyethylene glycol dimethacrylate (first auxiliary agent). Component B, by weight, comprises 12 parts methyl methacrylate (second monomer), 10 parts n-octyl acrylate (second monomer), 12 parts butyl acrylate (second monomer), 2 parts hexanediol diacrylate (second crosslinking agent), 2 parts N,N-dimethyl-p-toluidine (DMPT, amine reducing agent), 12 parts acrylic resin with a weight average molecular weight of 15000 (second polymer resin), and 1 part polyethylene glycol dimethacrylate (second auxiliary agent).

[0075] The method for forming the anti-PID coating in this embodiment is as follows: At room temperature, components A and B are simultaneously sprayed using a dual-tube system, and cured for 1 hour to obtain the anti-PID coating. The amounts of components A and B satisfy the following condition: the total mass of the first monomer in component A is the same as the total mass of the second monomer in component B.

[0076] Example 3

[0077] This embodiment provides a component A, a component B, and an anti-PID coating. Component A, by weight, comprises 20 parts of methyl methacrylate (first monomer), 15 parts of isooctyl acrylate (first monomer), 5 parts of methyl acrylate (first monomer), 10 parts of dipropylene glycol diacrylate (first crosslinking agent), 6 parts of benzoyl peroxide (peroxide oxidant), 20 parts of acrylic resin with a weight average molecular weight of 10,000 (first polymer resin), and 1.5 parts of polyethylene glycol dimethacrylate (first additive). Component B, by weight, comprises... 20 parts of methyl methacrylate (second monomer), 15 parts of isooctyl acrylate (second monomer), 5 parts of methyl acrylate (second monomer), 10 parts of dipropylene glycol diacrylate (second crosslinking agent), 4 parts of reducing agent N,N-dimethylaniline (DMA, amine reducing agent), 1 part of N,N-dimethyl-p-toluidine (DMPT, reducing agent), 20 parts of acrylic resin with a weight average molecular weight of 10,000 (second polymer resin), and 1.5 parts of polyethylene glycol dimethacrylate (second auxiliary agent).

[0078] The method for forming the anti-PID coating in this embodiment is as follows: At room temperature, components A and B are simultaneously sprayed using a dual-tube system, and cured for 1 hour to obtain the anti-PID coating. The amounts of components A and B satisfy the following condition: the total mass of the first monomer in component A is the same as the total mass of the second monomer in component B.

[0079] Performance testing

[0080] Components A and B from the above embodiments were coated onto a photovoltaic glass cover plate to form an anti-PID coating for each embodiment, resulting in the test samples for each embodiment. Specifically, components A and B were simultaneously sprayed onto the photovoltaic glass cover plate using a dual-tube system and cured at room temperature for 1 hour. The PID coating thickness on the test samples of each embodiment is shown in Table 1. An uncoated photovoltaic glass cover plate was also provided as a blank control sample.

[0081] The PID test was performed on the test samples and blank control samples of the above embodiments in accordance with the IEC61215 standard, and the transmittance test was performed on the test samples and blank control samples of the above embodiments in accordance with the GB / T 40415-2021 standard. The test results are shown in Table 1.

[0082] Table 1

[0083]

[0084] As can be clearly seen from Table 1, compared with the blank photovoltaic glass cover without components A and B, the photovoltaic glass cover coated with components A and B to form an anti-PID coating in each embodiment showed significantly lower PID96h and PID192h attenuation rates, indicating that the formed anti-PID coating plays a positive role in improving anti-PID performance. Furthermore, the anti-PID coating also has high light transmittance, effectively ensuring the light transmittance of the photovoltaic module.

[0085] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0086] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A photovoltaic module, characterized in that, It includes a glass cover, an anti-PID coating, a first adhesive layer, a battery cell, a second adhesive layer, and a backsheet, which are stacked in sequence. The raw materials for preparing the anti-PID coating include component A and component B; By weight, component A comprises 2-20 parts of a peroxide oxidant, 20-55 parts of a first monomer, 1-15 parts of a first crosslinking agent, 12-40 parts of a first polymer resin, and 0.1-5 parts of a first auxiliary agent; By weight, component B comprises 0.2-10 parts of amine reducing agent, 20-55 parts of second monomer, 1-15 parts of second crosslinking agent, 12-40 parts of second polymer resin, and 0.1-5 parts of second auxiliary agent.

2. The photovoltaic module according to claim 1, characterized in that, The peroxide-based oxidant is selected from one or more of benzoyl peroxide, lauroyl peroxide, cumene hydroperoxide, tert-butyl hydroperoxide, di-tert-butyl peroxide, dicumyl peroxide, tert-butyl peroxide, tert-butyl valerate peroxide, methyl ethyl ketone peroxide, cyclohexanone peroxide, diisopropyl peroxide, and dicyclohexyl peroxide.

3. The photovoltaic module according to claim 1, characterized in that, The amine reducing agent is selected from one or more of N,N-dimethylaniline, N,N-dimethyl-p-toluidine, N-methyl-N-2-hydroxyethyl-p-toluidine, N,N-diethylaniline, N,N-dimethylacetamide, and N-ethyl-N-hydroxyethylaniline.

4. The photovoltaic module according to any one of claims 1 to 3, characterized in that, The first monomer and the second monomer are each independently selected from one or more of methyl methacrylate, methyl acrylate, butyl acrylate, isooctyl acrylate, n-octyl acrylate, lauryl acrylate, stearyl acrylate, decyl acrylate, dodecyl acrylate, tetradecyl acrylate and hexadecyl acrylate.

5. The photovoltaic module according to any one of claims 1 to 3, characterized in that, The first crosslinking agent and the second crosslinking agent are each independently selected from one or more of 1,4-butanediol dimethacrylate, tripropylene glycol diacrylate, hexanediol diacrylate, dipropylene glycol diacrylate and tetrahydrofuran acrylate.

6. The photovoltaic module according to any one of claims 1 to 3, characterized in that, The first polymer resin and the second polymer resin are each independently selected from acrylic resins, wherein the weight-average molecular weight of the acrylic resins is 10,000 Da to 20,000 Da.

7. The photovoltaic module according to any one of claims 1 to 3, characterized in that, The first and second additives are each independently selected from one or more of polyethylene glycol dimethacrylate, pentaerythritol ethoxylate tetraacrylate, diisopropyl disulfide xanthate, and zirconium phosphate.

8. The photovoltaic module according to any one of claims 1 to 3, characterized in that, The thickness of the anti-PID coating is 300nm~3000nm.

9. The photovoltaic module according to claims 1 to 3, characterized in that, The materials of the first adhesive layer and the second adhesive layer each independently comprise ethylene-vinyl acetate copolymer.

10. A method for preparing a photovoltaic module, characterized in that, Includes the following steps: Component A is prepared by mixing a peroxide-based oxidant, a first monomer, a first crosslinking agent, a first polymer resin, and a first auxiliary agent in the proportions by weight of any one of claims 1 to 9. Component B is prepared by mixing an amine reducing agent, a second monomer, a second crosslinking agent, a second polymer resin, and a second auxiliary agent in the proportions by weight of any one of claims 1 to 9. The A component and the B component are coated on the inner surface of the glass cover to form an anti-PID coating; A photovoltaic module is fabricated using a glass cover plate with the aforementioned anti-PID coating. The structure of the photovoltaic module includes a glass cover plate, an anti-PID coating, a first adhesive layer, solar cells, a second adhesive layer, and a backsheet stacked sequentially.

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