Switch cabinet equipped with combined intelligent temperature control device

Abstract

According to the switch cabinet provided with the combined intelligent temperature control device, the real-time air dew point is calculated according to the detection data of the humidity sensor hung in the inner cavity of the switch cabinet and the detection data of the first temperature sensor, so that the situation that the temperature around a heat dissipation pipe is too low is prevented, and the heat dissipation efficiency is improved. Liquefied suspended small water drops appear in the switch cabinet when the temperature is too low. Therefore, the probability of arc discharge in a high-voltage large-current environment in the switch cabinet is greatly reduced. Specifically, when the temperature around the heat dissipation pipe is too low, the heating wire close to the liquid inlet end of the heat dissipation pipe heats the heat-conducting medium in the heat dissipation pipe, and the temperature around the heat dissipation pipe is prevented from being too low. It is worth mentioning that the heat dissipation pipe surrounds the humidity sensor and is actually tightly attached to the inner wall of the switch cabinet, due to the fact that the interior of the switch cabinet is heated, the temperature is relatively high, and the temperature difference still exists between the warm heat-conducting medium and a heat source of the switch cabinet, the warm heat-conducting medium can still execute the efficient heat dissipation task.

Description

Technical Field

[0001] The present application relates to the field of electrical engineering technology, and in particular to a switch cabinet equipped with a combined intelligent temperature control device. Background Art

[0002] In electrical engineering, switchgear is mostly used in high-voltage environments above 1,000 volts or high-current environments with hundreds of amperes. During use, this type of switchgear often faces high temperature problems caused by high voltage or high current. The energy source of high temperature is mainly the electric heat generated by high voltage or high current in the electrical circuit. Since the electrical circuits of the switchgear mostly use organic materials as insulating materials, these organic materials are prone to fire at high temperatures. At the same time, since the switchgear is accompanied by high voltage and strong current during operation, traditional cooling methods cannot be applied to the switchgear. Traditional cooling methods will cause water vapor in the air to liquefy, and tiny water droplets are prone to arc discharge in high-voltage and high-current environments, and the arc will break through the insulating material and damage the equipment. To this end, it is necessary to propose a switchgear equipped with a combined intelligent temperature control device in response to the defect that traditional switchgear is prone to fire. Summary of the invention

[0003] Based on this, it is necessary to propose a switch cabinet equipped with a combined intelligent temperature control device to address the defect that traditional switch cabinets are prone to fire.

[0004] The present application provides a switch cabinet equipped with a combined intelligent temperature control device, which is arranged in the switch cabinet. The switch cabinet equipped with the combined intelligent temperature control device includes:

[0005] Switchgear;

[0006] A humidity sensor is suspended in the inner cavity of the switch cabinet;

[0007] A first temperature sensor is suspended in the inner cavity of the switch cabinet;

[0008] A heat dissipation pipe is attached to the inner cavity surface of the switch cabinet, and the heat dissipation pipe surrounds the humidity sensor;

[0009] A storage tank, comprising a body and a pump, wherein the body is connected to the liquid inlet end of the heat dissipation pipe, the pump is arranged in a connecting pipeline between the body and the liquid inlet end of the heat dissipation pipe, the body is connected to the liquid outlet end of the heat dissipation pipe, and the body is hung on the shell of the switch cabinet;

[0010] A heating wire is wound around the outer surface of the heat dissipation pipe, and the heating wire is close to the liquid inlet end of the heat dissipation pipe;

[0011] A processor is electrically connected to the humidity sensor, the processor is electrically connected to the first temperature sensor, the processor is electrically connected to the heating wire, and the pump is electrically connected to the processor;

[0012] A power supply is electrically connected to the processor.

[0013] Furthermore, the combined intelligent temperature control device also includes heat dissipation fins;

[0014] The heat dissipation fin comprises a substrate and a plurality of fins;

[0015] Each of the fins is fixedly connected to the substrate;

[0016] Each of the fins is parallel to each other;

[0017] Each of the fins is perpendicular to the horizontal plane.

[0018] Furthermore, each of the fins is provided with a plurality of through holes;

[0019] The geometric centers of all through holes of the same fin are located on the same straight line; the straight line is defined as the reference straight line;

[0020] The extension direction of the reference straight line is perpendicular to the horizontal plane.

[0021] Furthermore, the heat dissipation fins also include a liquid guide tube;

[0022] The liquid guide tube is attached to one side of the substrate;

[0023] The substrate is disposed between the liquid guide tube and the fin;

[0024] The liquid guide pipe is arranged in a connecting pipeline between the body and the liquid outlet end of the heat dissipation pipe.

[0025] Furthermore, the heat dissipation fins are hung on the housing of the switch cabinet;

[0026] The heat dissipation fin further includes a second temperature sensor;

[0027] The second temperature sensor is disposed between adjacent fins;

[0028] The second temperature sensor is electrically connected to the processor.

[0029] Furthermore, the processor includes a single chip microcomputer and an electric regulator;

[0030] The single chip microcomputer is electrically connected to the power supply;

[0031] The single chip microcomputer is electrically connected to the signal end of the electric regulator;

[0032] The input end of the electric regulator is electrically connected to the power supply;

[0033] The output end of the electric regulator is electrically connected to the pump.

[0034] Further, the electric regulator includes a resistor, a first NPN transistor and a second NPN transistor;

[0035] The drain of the first NPN transistor and the drain of the second NPN transistor are both electrically connected to the power supply;

[0036] The gate of the first NPN transistor is electrically connected to the single chip computer;

[0037] The resistor is electrically connected to the connection link between the gate of the first NPN transistor and the single chip microcomputer;

[0038] The source of the first NPN transistor is electrically connected to the gate of the second NPN transistor;

[0039] A source of the second NPN transistor is electrically connected to the pump.

[0040] Further, the processor also includes a current amplifier;

[0041] The structure of the current amplifier is the same as that of the electric regulator;

[0042] The single chip microcomputer is electrically connected to the signal terminal of the current amplifier;

[0043] An input terminal of the current amplifier is electrically connected to the power supply;

[0044] The output end of the current amplifier is electrically connected to the heating wire.

[0045] The present application provides a temperature control method for a switch cabinet, comprising:

[0046] Receive humidity data sent by the humidity sensor;

[0047] receiving temperature data sent by a first temperature sensor;

[0048] The dew point of the air is calculated according to the temperature data sent by the first temperature sensor, the humidity data sent by the humidity sensor and the standard atmospheric pressure parameter; the relative humidity is calculated using the humidity data and the standard atmospheric pressure parameter;

[0049] receiving temperature data sent by a second temperature sensor;

[0050] Determine whether the temperature of the heat-conducting medium is lower than the dew point of the air; the temperature of the heat-conducting medium is real-time data measured by the second temperature sensor;

[0051] If the temperature of the heat-conducting medium is less than or equal to the dew point of the air, an action level is sent to the current amplifier to enable the heating wire to perform the action of heating the heat-conducting medium at the liquid inlet end of the heat dissipation pipe;

[0052] If the temperature of the heat transfer medium is greater than the dew point of the air, it is determined whether the temperature of the heat transfer medium is greater than the target temperature;

[0053] If the temperature of the heat transfer medium is less than or equal to the target temperature, the working state of the pump is kept unchanged;

[0054] If the temperature of the heat transfer medium is greater than the target temperature, an action level is sent to the electric regulator to make the pump speed up the circulation speed of the heat transfer medium.

[0055] The present application relates to a switch cabinet equipped with a combined intelligent temperature control device. The real-time dew point of the air is calculated by the detection data of the humidity sensor suspended in the inner cavity of the switch cabinet and the detection data of the first temperature sensor, which is conducive to preventing the temperature around the heat dissipation pipe from being too low. Too low temperature will cause liquefied suspended small water droplets to appear inside the switch cabinet. This greatly reduces the probability of arc discharge in the high-voltage and high-current environment in the switch cabinet. Specifically, when the temperature around the heat dissipation pipe is too low, the heating wire close to the liquid inlet end of the heat dissipation pipe heats the heat-conducting medium inside the heat dissipation pipe to prevent the temperature around the heat dissipation pipe from being too low. It is worth mentioning that the heat dissipation pipe surrounds the humidity sensor and is actually close to the inner wall of the switch cabinet. Due to the heat generated inside the switch cabinet, the temperature is relatively high. There is still a temperature difference between the warm heat-conducting medium and the heat source of the switch cabinet, so the warm heat-conducting medium can still perform efficient heat dissipation tasks. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 A schematic structural diagram of a switch cabinet equipped with a combined intelligent temperature control device provided in one embodiment of the present application.

[0057] Figure 2 A schematic diagram of the connection relationship between the heat dissipation fins and the body of a storage tank in a switch cabinet equipped with a combined intelligent temperature control device provided in one embodiment of the present application.

[0058] Figure 3 A connection diagram between a processor, a pump, a heating wire, a humidity sensor, a first temperature sensor, a second temperature sensor and a power supply in a switch cabinet equipped with a combined intelligent temperature control device provided in one embodiment of the present application.

[0059] Figure 4 A method flow chart of a temperature control method for a switch cabinet provided in one embodiment of the present application.

[0060] Reference numerals:

[0061] a-switch cabinet; 100-humidity sensor; 200-first temperature sensor; 300-heat dissipation pipe;

[0062] 310 - liquid outlet end of the heat dissipation pipe; 320 - liquid inlet end of the heat dissipation pipe;

[0063] 400-storage tank; 410-body; 420-pump; 500-heating wire; 600-processor; 610-single chip microcomputer;

[0064] 620-electric regulator; 621-resistor; 622-first NPN transistor; 623-second NPN transistor;

[0065] 630-current amplifier; 700-power supply; 800-heat sink; 810-substrate; 820-fin;

[0066] 830 - through hole; 840 - reference straight line; 850 - liquid guiding tube; 860 - second temperature sensor. DETAILED DESCRIPTION

[0067] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0068] The present application provides a switch cabinet equipped with a combined intelligent temperature control device.

[0069] like Figure 1 As shown, in one embodiment of the present application, a switch cabinet equipped with a combined intelligent temperature control device includes a switch cabinet a, a humidity sensor 100, a first temperature sensor 200, a heat pipe 300, a storage tank 400, a heating wire 500, a processor 600 and a power supply 700.

[0070] The humidity sensor 100 is suspended in the inner cavity of the switch cabinet a.

[0071] The first temperature sensor 200 is suspended in the inner cavity of the switch cabinet a.

[0072] Specifically, the real-time dew point of the air is calculated through the detection data of the humidity sensor 100 suspended in the inner cavity of the switch cabinet a and the detection data of the first temperature sensor 200, which is helpful to prevent the temperature around the heat pipe 300 from being too low, which will cause liquefied suspended water droplets to appear inside the switch cabinet a.

[0073] The heat dissipation pipe 300 is attached to the surface of the inner cavity of the switch cabinet a, and the heat dissipation pipe 300 surrounds the outside of the humidity sensor 100 .

[0074] Specifically, the heat dissipation pipe 300 surrounds the humidity sensor 100 and is actually close to the inner wall of the switch cabinet a. Since the switch cabinet a generates heat internally and the temperature is relatively high, there is still a temperature difference between the warm heat-conducting medium and the heat source of the switch cabinet a, so the warm heat-conducting medium can still perform efficient heat dissipation tasks.

[0075] The storage tank 400 includes a main body 410 and a pump 420. The main body 410 is connected to the liquid inlet end 320 of the heat dissipation pipe. The pump 420 is arranged in the connecting pipeline between the main body 410 and the liquid inlet end 320 of the heat dissipation pipe. The main body 410 is connected to the liquid outlet end 310 of the heat dissipation pipe. The main body 410 is hung on the shell of the switch cabinet a.

[0076] The heating wire 500 is wound around the outer surface of the heat dissipation tube 300 , and the heating wire 500 is disposed close to the liquid inlet end 320 of the heat dissipation tube.

[0077] Specifically, when the temperature around the heat pipe 300 is too low, the heating wire 500 close to the liquid inlet end of the heat pipe 300 heats the heat-conducting medium inside the heat pipe 300 to prevent the temperature around the heat pipe 300 from being too low.

[0078] The processor 600 is electrically connected to the humidity sensor 100 , the processor 600 is electrically connected to the first temperature sensor 200 , the processor 600 is electrically connected to the heating wire 500 , and the pump 420 is electrically connected to the processor 600 .

[0079] The power supply 700 is electrically connected to the processor 600 .

[0080] This embodiment relates to a switch cabinet equipped with a combined intelligent temperature control device, which prevents the air in the switch cabinet A from not being liquefied by controlling the temperature of the heat-conducting medium in the heat-dissipating pipe 300, reduces the probability of arc discharge in the switch cabinet A, and realizes efficient heat dissipation through the temperature difference between the temperature of the heat-conducting medium and the temperature in the switch cabinet A. Thus, the defect that the traditional switch cabinet A is prone to fire is solved.

[0081] like Figure 2 As shown, in one embodiment of the present application, the combined intelligent temperature control device further includes a heat dissipation fin 800. The heat dissipation fin 800 includes a substrate 810 and a plurality of fins 820. Each of the fins 820 is fixedly connected to the substrate 810. Each of the fins 820 is parallel to each other. Each of the fins 820 is perpendicular to the horizontal plane.

[0082] Specifically, the switch cabinet a is often placed in a constant temperature or ventilated environment. Since the inside of the switch cabinet a is relatively sealed, high temperature is easily accumulated. When the heat transfer medium carries the heat inside the switch cabinet a out, the heat dissipation fins 800 can use the constant temperature environment or ventilated environment to reduce the temperature of the heat transfer medium, thereby achieving the reflux of the low-temperature heat transfer medium.

[0083] More specifically, the heat dissipation fin 800 includes a plurality of fins 820 , and the fins 820 increase the contact area with the low-temperature air in the environment, which can enhance the heat dissipation and cooling of the heat-conducting medium, thereby enhancing the heat dissipation efficiency of the heat-conducting medium.

[0084] like Figure 2 As shown, in one embodiment of the present application, each of the fins 820 is provided with a plurality of through holes 830. The geometric centers of all through holes 830 of the same fin 820 are on the same straight line. The straight line is defined as the reference straight line 840. The extension direction of the reference straight line 840 is perpendicular to the horizontal plane.

[0085] Specifically, the conventional fins 820 are complete heat dissipation metal plates, and the air circulation between adjacent heat dissipation metal plates can be enhanced. However, when the fins 820 are perpendicular to the horizontal plane and there is horizontal air flow, the air flow function between the fins 820 will be greatly reduced.

[0086] The through holes 830 are provided in the fins 820 to enhance the efficiency of the horizontal air flow, thereby enhancing the heat dissipation efficiency of the entire heat fin.

[0087] like Figure 2 As shown, in one embodiment of the present application, the heat dissipation fin 800 further includes a liquid guide tube 850. The liquid guide tube 850 is attached to one side of the substrate 810. The substrate 810 is disposed between the liquid guide tube 850 and the fin 820. The liquid guide tube 850 is disposed on the connecting pipeline between the body 410 and the liquid outlet end 310 of the heat dissipation pipe.

[0088] Specifically, the liquid conduit 850 is arranged in an S shape on one side of the substrate 810, so that the substrate 810 is arranged between the liquid conduit 850 and the fins 820. The substrate 810 can disperse the heat received by the liquid conduit 850 to the fins 820 as much as possible, which can greatly increase the heat dissipation area and thus increase the heat dissipation efficiency.

[0089] It is worth mentioning that the liquid guide tube 850 is disposed in the connecting pipeline between the body 410 and the liquid outlet end 310 of the heat dissipation pipe. In fact, the heat dissipation fin 800 is also disposed in the space between the body 410 and the liquid outlet end 310 of the heat dissipation pipe. This is conducive to using the heat-conducting medium with a higher temperature to achieve temperature exchange with the air, and scientifically enhances the heat dissipation efficiency of the heat dissipation fin 800. The greater the temperature difference, the higher the heat dissipation efficiency. That is, before the heat-conducting medium flows into the body 410 of the storage tank 400, the heat-conducting medium can be reduced to a relatively low temperature, reducing the influence of the heat-conducting medium on the heat-conducting medium in the body 410 of the storage tank 400.

[0090] like Figure 2 As shown, in one embodiment of the present application, the heat dissipation fin 800 is hung on the housing of the switch cabinet a. The heat dissipation fin 800 also includes a second temperature sensor 860. The second temperature sensor 860 is disposed between two adjacent fins 820. The second temperature sensor 860 is electrically connected to the processor 600.

[0091] Specifically, the second temperature sensor 860 is disposed on a side of the heat dissipation fin 800 close to the ground, which is helpful for the processor 600 to obtain the temperature of the heat-conducting medium after the heat dissipation operation.

[0092] In fact, when the second temperature sensor 860 detects that the temperature of the heat transfer medium is too low, it will start the heating program to prevent the temperature of the liquid inlet end 320 of the heat dissipation pipe from being too low, causing liquefied suspended small droplets to appear inside the switch cabinet a.

[0093] In a constant temperature storage environment, due to the large area of ​​the heat dissipation fin 800, the long-term low temperature of the liquid inlet end 320 of the heat dissipation pipe will cause local water accumulation in the switch cabinet A, which may cause a short circuit in the electrical circuit inside the switch cabinet A. Therefore, the second temperature sensor 860 can also prevent the occurrence of short circuit fire events inside the switch cabinet A.

[0094] like Figure 3 As shown, in one embodiment of the present application, the processor 600 includes a single chip microcomputer 610 and an electric regulator 620. The single chip microcomputer 610 is electrically connected to the power supply 700. The single chip microcomputer 610 is electrically connected to the signal end of the electric regulator 620. The input end of the electric regulator 620 is electrically connected to the power supply 700. The output end of the electric regulator 620 is electrically connected to the pump 420.

[0095] Specifically, the main function of the pump 420 is to extract the heat-conducting medium inside the storage tank 400 body 410, push the heat-conducting medium into the liquid inlet end 320 of the heat dissipation pipe, and realize the circulation of the heat-conducting medium from the heat dissipation pipe 300 to the liquid guide pipe 850 and finally to the storage tank 400 body 410.

[0096] Since the pump 420 requires a large amount of electrical power, the power regulator 620 is required to increase the output power of the power supply 700 .

[0097] In one embodiment of the present application, the electric regulator 620 includes a resistor 621, a first NPN transistor 622, and a second NPN transistor 623. The drain of the first NPN transistor 622 and the drain of the second NPN transistor 623 are both electrically connected to the power supply 700. The gate of the first NPN transistor 622 is electrically connected to the single-chip microcomputer 610. The resistor 621 is electrically connected to the connection link between the gate of the first NPN transistor 622 and the single-chip microcomputer 610. The source of the first NPN transistor 622 is electrically connected to the gate of the second NPN transistor 623. The source of the second NPN transistor 623 is electrically connected to the pump 420.

[0098] Specifically, the single-chip computer 610 outputs the working level to the gate of the first NPN transistor 622, and the first NPN transistor 622 is turned on. The source of the first NPN transistor 622 is electrically connected to the gate of the second NPN transistor 623. When the first NPN transistor 622 is turned on, the second NPN transistor 623 is also turned on. At the same time, the second NPN transistor 623 has the function of amplifying the current, which realizes a larger electric power driving effect of the pump 420.

[0099] It is worth mentioning that the electric power obtained by the pump 420 actually has a positive linear relationship with the output power of the pump 420. The circulation speed of the heat transfer medium from the heat dissipation pipe 300 to the liquid guide pipe 850 and finally to the storage tank 400 body 410 has a positive linear relationship with the output power of the pump 420. The faster the circulation speed, the faster the heat transfer medium dissipates heat.

[0100] In one embodiment of the present application, the processor 600 further includes a current amplifier 630. The structure of the current amplifier 630 is the same as that of the electric regulator 620. The single chip microcomputer 610 is electrically connected to the signal end of the current amplifier 630. The input end of the current amplifier 630 is electrically connected to the power supply 700. The output end of the current amplifier 630 is electrically connected to the heating wire 500.

[0101] Specifically, the current amplifier 630 can increase the output power of the power supply 700. The greater the output power obtained by the heating wire 500, the more electric heat is generated by the heating wire 500. This can maintain the temperature of the heat-conducting medium at the liquid inlet end of the heat pipe 300 stable.

[0102] The present application provides a temperature control method for a switch cabinet.

[0103] like Figure 4As shown, in one embodiment of the present application, the temperature control method of the switch cabinet includes:

[0104] S100, receiving humidity data sent by a humidity sensor.

[0105] S200: Receive temperature data sent by a first temperature sensor.

[0106] S300, calculating the dew point of the air according to the temperature data sent by the first temperature sensor, the humidity data sent by the humidity sensor and the standard atmospheric pressure parameter. The relative humidity is calculated using the humidity data and the standard atmospheric pressure parameter.

[0107] Specifically, T a＝ T-[ ( 1 00-R h ) / 5] Formula 1

[0108] In formula 1:

[0109] T a It is the dew point of the air, that is, the dew point of the air in the switch cabinet.

[0110] T is the temperature measured by the first temperature sensor.

[0111] Rh is relative humidity, which can be obtained by converting the real-time data measured by the humidity sensor.

[0112] S400, receiving temperature data sent by the second temperature sensor, and determining whether the temperature of the heat transfer medium is lower than the dew point of the air.

[0113] Specifically, the temperature of the heat-conducting medium is real-time data measured by the second temperature sensor.

[0114] S500: If the temperature of the heat-conducting medium is less than or equal to the dew point of the air, an action level is sent to the current amplifier to enable the heating wire to heat the heat-conducting medium at the liquid inlet end of the heat dissipation pipe.

[0115] S600: If the temperature of the heat transfer medium is greater than the dew point of the air, determine whether the temperature of the heat transfer medium is greater than the target temperature.

[0116] S700: If the temperature of the heat transfer medium is less than or equal to the target temperature, the working state of the pump is kept unchanged.

[0117] S800: If the temperature of the heat transfer medium is greater than the target temperature, an action level is sent to the electric regulator to enable the pump to speed up the circulation speed of the heat transfer medium.

[0118] Specifically, since the circulation speed of the heat-conducting medium will affect the temperature of the heat-conducting medium and the flow rate per unit time flowing through the heating wire, the single chip will output the electrical power of the heating wire's execution process according to the circulation speed to achieve temperature stability at the liquid inlet end of the heat dissipation pipe.

[0119] The present application relates to a temperature control method for a switch cabinet, which calculates the real-time dew point of the air through the detection data of the humidity sensor suspended in the inner cavity of the switch cabinet and the detection data of the first temperature sensor, which is conducive to preventing the temperature around the heat dissipation pipe from being too low. Too low temperature will cause liquefied suspended small water droplets to appear inside the switch cabinet. This greatly reduces the probability of arc discharge in the high-voltage and high-current environment in the switch cabinet. Specifically, when the temperature around the heat dissipation pipe is too low, the heating wire close to the liquid inlet end of the heat dissipation pipe heats the heat-conducting medium inside the heat dissipation pipe to prevent the temperature around the heat dissipation pipe from being too low. It is worth mentioning that the heat dissipation pipe surrounds the humidity sensor and is actually close to the inner wall of the switch cabinet. Due to the heat generated inside the switch cabinet, the temperature is relatively high, and there is still a temperature difference between the warm heat-conducting medium and the heat source of the switch cabinet, so the warm heat-conducting medium can still perform efficient heat dissipation tasks.

[0120] The technical features of the above-described embodiments may be arbitrarily combined, and the execution order of the method steps is not limited. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0121] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A switch cabinet equipped with a combined intelligent temperature control device, characterized in that: include: switchgear; a humidity sensor, suspended in the inner cavity of the switch cabinet; a first temperature sensor, suspended in the inner cavity of the switch cabinet; a heat dissipation pipe attached to the surface of the inner cavity of the switch cabinet, the heat dissipation pipe surrounding the outside of the humidity sensor; A storage tank comprising a body and a pump, wherein the body is connected to the liquid inlet end of the heat dissipation pipe, the pump is arranged on the connecting pipeline between the body and the liquid inlet end of the heat dissipation pipe, the body is connected to the liquid outlet end of the heat dissipation pipe, and the body is hung on the housing of the switch cabinet; A heating wire is wound around the outer surface of the heat dissipation tube, and the heating wire is arranged close to the liquid inlet end of the heat dissipation tube; a processor, electrically connected to the humidity sensor, the processor electrically connected to the first temperature sensor, the processor electrically connected to the heating wire, and the pump electrically connected to the processor; A power supply is electrically connected to the processor.

2. The switch cabinet equipped with a combined intelligent temperature control device according to claim 1, characterized in that: The combined intelligent temperature control device also includes heat dissipation fins; The heat dissipation fin comprises a base plate and a plurality of fins; Each of the fins is fixedly connected to the substrate; Each of the fins is parallel to each other; Each of the fins is perpendicular to the horizontal plane.

3. The switch cabinet equipped with a combined intelligent temperature control device according to claim 2, characterized in that: Each of the fins is provided with a plurality of through holes; The geometric centers of all through holes of the same fin are located on the same straight line; this straight line is defined as the reference straight line; The extension direction of the reference straight line is perpendicular to the horizontal plane.

4. The switch cabinet equipped with a combined intelligent temperature control device according to claim 3, characterized in that: The heat dissipation fin further includes a liquid guide tube; The liquid guide tube is attached to one side of the substrate; The substrate is disposed between the liquid guide tube and the fin; The liquid guide pipe is arranged on the connecting pipe between the body and the liquid outlet end of the heat dissipation pipe.

5. The switch cabinet equipped with a combined intelligent temperature control device according to claim 4, characterized in that: The heat dissipation fins are hung on the outer shell of the switch cabinet; The heat dissipation fin further includes a second temperature sensor; The second temperature sensor is arranged between two adjacent fins; The second temperature sensor is electrically connected to the processor.

6. The switch cabinet equipped with a combined intelligent temperature control device according to claim 5, characterized in that: The processor includes a single chip microcomputer and an electric regulator; The single chip microcomputer is electrically connected to the power supply; The single chip microcomputer is electrically connected to the signal terminal of the electric regulator; The input end of the electric regulator is electrically connected to the power supply; The output end of the electric regulator is electrically connected to the pump.

7. The switch cabinet equipped with a combined intelligent temperature control device according to claim 6, characterized in that: The electric regulator includes a resistor, a first NPN transistor and a second NPN transistor; The drain of the first NPN transistor and the drain of the second NPN transistor are both electrically connected to the power supply; The gate of the first NPN transistor is electrically connected to the single chip computer; The resistor is electrically connected to the connection link between the gate of the first NPN transistor and the single chip microcomputer; The source of the first NPN transistor is electrically connected to the gate of the second NPN transistor; A source of the second NPN transistor is electrically connected to the pump.

8. The switch cabinet equipped with a combined intelligent temperature control device according to claim 7, characterized in that: The processor also includes a current amplifier; The structure of the current amplifier is the same as that of the electric regulator; The single chip microcomputer is electrically connected to the signal terminal of the current amplifier; The input end of the current amplifier is electrically connected to the power supply; The output end of the current amplifier is electrically connected to the heating wire.

9. A temperature control method for a switch cabinet, characterized in that: include: Receive humidity data sent by the humidity sensor; receiving temperature data sent by a first temperature sensor; Calculating the dew point of the air based on the temperature data sent by the first temperature sensor, the humidity data sent by the humidity sensor, and the standard atmospheric pressure parameter; Relative humidity is calculated using humidity data and standard atmospheric pressure parameters; receiving temperature data sent by a second temperature sensor; Determine whether the temperature of the heat transfer medium is lower than the dew point of the air; The temperature of the heat-conducting medium is real-time data measured by the second temperature sensor; If the temperature of the heat-conducting medium is less than or equal to the dew point of the air, an action level is sent to the current amplifier to make the heating wire perform the action of heating the heat-conducting medium at the liquid inlet end of the heat pipe; If the temperature of the heat transfer medium is greater than the dew point of the air, then it is determined whether the temperature of the heat transfer medium is greater than the target temperature; If the temperature of the heat transfer medium is less than or equal to the target temperature, the working state of the pump remains unchanged; If the temperature of the heat transfer medium is higher than the target temperature, an action level is sent to the electric regulator to make the pump speed up the circulation speed of the heat transfer medium.

10. The temperature control method for a switch cabinet according to claim 9, characterized in that: The calculating the dew point of the air according to the temperature data sent by the first temperature sensor, the humidity data sent by the humidity sensor, and the standard atmospheric pressure parameter includes: Calculate the dew point of air according to formula 1; T a＝ T -[ ( 100-Rh ) / 5] Formula 1: in, T a is the dew point of the air; T is the temperature measured by the first temperature sensor; Rh is the relative humidity.

Images