Ultrasonic transducer and cooling method thereof

Abstract

The invention relates to an ultrasonic transducer and a cooling method thereof. The ultrasonic transducer comprises at least one transducer body, a backing is arranged on one side of each transducer body, a first heat dissipation device is arranged in the backing, and the first heat dissipation device comprises a cooling channel which is arranged in the backing and used for circulation of cooling liquid. And the cooling channels are respectively communicated with a power mechanism for driving cooling liquid to circulate through an inlet channel and an outlet channel which are arranged on the backing. According to the ultrasonic transducer, the active heat dissipation device is arranged in the ultrasonic transducer, the cooling liquid is driven to circulate in the backing, heat conducted to the backing in the working process of the ultrasonic transducer is taken away, the heat dissipation performance of the ultrasonic transducer is enhanced, the working temperature of the ultrasonic transducer is reduced, and the stability of the ultrasonic transducer in the working process is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of ultrasonic transducers, and in particular to an ultrasonic transducer and a cooling method thereof. Background Art

[0002] Ultrasonic phased array technology was first used in the field of medical ultrasound diagnosis in the 1970s. With the rapid development of medical diagnosis, ultrasonic phased array probes are widely used in many fields such as cardiac imaging, intravascular imaging, prenatal diagnosis, musculoskeletal system, interventional ultrasound, small organ imaging, surgical navigation, treatment detection, ultrasound-guided drug delivery, etc., due to its advantages of high-resolution imaging, real-time dynamic imaging, non-invasive and safe, flexible operation, and short detection time. It is widely used in medical imaging and treatment detection.

[0003] The development of ultrasonic phased array technology is based on the research idea of ​​electromagnetic wave phased array technology. Ultrasonic phased array transducers are based on an array of ultrasonic oscillators of the same shape and size. Each oscillator can transmit and receive ultrasonic energy independently, and can excite each piezoelectric oscillator in a pre-set order to achieve control and design of the limited point position and the focusing direction of the field.

[0004] When a medical phased array probe receives an electrical signal and works through the piezoelectric effect, the piezoelectric ceramic is excited by the electrical signal and generates high-frequency mechanical vibrations, namely ultrasound. When a single ultrasonic probe receives vibrations, this vibration is also converted into an electrical signal. This conversion process generates a lot of heat, and long-term continuous operation may also cause the probe temperature to rise. Excessive temperature not only affects performance, but also poses a risk of causing discomfort to patients. Better cooling of the transducer is particularly important in the field of ultrasonic phased array technology.

[0005] The invention patent application with publication number CN 101468240A specifically discloses an ultrasonic treatment head, including a shell, an ultrasonic transducer in the shell, an opening at one end of the shell, the opening is closed by an energy guide window, and the ultrasonic wave emitted by the ultrasonic transducer is emitted outward through the energy guide window, wherein an air inlet and an exhaust port are opened on the shell, and the cavity between the air inlet and the exhaust port forms a cooling cavity, and the heat generated by the ultrasonic transducer during operation passes through the cooling cavity and is discharged from the exhaust port. This invention patent application uses gas to dissipate the heat generated by the ultrasonic transducer, but its heat dissipation effect needs to be further improved. Summary of the invention

[0006] Based on this, it is necessary to provide an ultrasonic transducer and a cooling method thereof to address the problem of unsatisfactory heat dissipation effect of ultrasonic transducers in the prior art, especially the problem that multi-vibrator elements of phased array ultrasonic transducers will generate a lot of heat during operation, heat up too quickly and at high temperatures during operation, affecting the performance of the ultrasonic transducer. A heat dissipation device is provided in the ultrasonic transducer to enhance the heat dissipation performance of the ultrasonic transducer, take away the heat generated by the ultrasonic transducer during operation, reduce the operating temperature of the ultrasonic transducer, and improve its stability during operation.

[0007] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0008] An ultrasonic transducer includes at least one transducer body that generates a piezoelectric effect, a backing is provided on one side of each transducer body, a first heat dissipation device is provided in the backing, the first heat dissipation device includes a cooling channel provided in the backing for the circulation of a cooling liquid, and the cooling channel is connected to a power mechanism that drives the circulation of the cooling liquid through an inlet channel and an outlet channel provided on the backing. The ultrasonic transducer, by providing an active heat dissipation device in the ultrasonic transducer, drives the cooling liquid to circulate in the backing, takes away the heat conducted to the backing by the ultrasonic transducer during operation, enhances the heat dissipation performance of the ultrasonic transducer, reduces the operating temperature of the ultrasonic transducer, and improves its stability during operation.

[0009] In a feasible implementation, the first heat dissipation device also includes a heat dissipation structure filled in the cooling channel, the heat dissipation structure has at least one channel, and the coolant flows in the heat dissipation structure. The interior of the cooling channel is filled with a heat dissipation structure with a porous structure, especially a heat dissipation structure with a porous structure. The channel structure expands the contact area of ​​the coolant, so that the temperature transfer from the backing to the coolant is more efficient, thereby improving the cooling rate.

[0010] In a feasible implementation, the first heat dissipation device further includes a heat dissipation layer disposed at the periphery of the cooling channel, and the heat dissipation layer realizes rapid conduction transfer of heat on the backing.

[0011] In a feasible implementation, the heat dissipation layer is made of a metal material, which has excellent thermal conductivity and improves the heat conduction efficiency.

[0012] In a feasible implementation, the heat dissipation structure is made of a porous material. The porous material does not completely block the flow of coolant, has a larger specific surface area, and can greatly increase the contact with the coolant, transferring the accumulated heat to the cooling liquid.

[0013] In a feasible implementation, the heat dissipation structure is made of a porous metal material, which has a large specific surface area and high heat exchange and heat dissipation capacity.

[0014] In a feasible implementation, the backing and the heat dissipation structure are made of the same material, which can achieve higher heat transfer efficiency.

[0015] In a feasible implementation, the backing is made of a metal material, which has excellent thermal conductivity and improves the heat conduction efficiency.

[0016] In a feasible implementation, the backing is made of a porous metal material, which has a large specific surface area and high heat exchange and heat dissipation capacity.

[0017] In a feasible implementation, it also includes a second heat dissipation device arranged on the transducer body, and the second heat dissipation device includes a filling layer, and the filling layer is filled with insulating heat-conductive material. Such a configuration can better conduct heat generated on the transducer body.

[0018] In a feasible implementation, the insulating thermally conductive material is selected from insulating thermally conductive silicone grease, which is a composite of metal oxides with excellent thermal conductivity and insulation properties and organic silicon oxides, and has excellent thermal conductivity and good electrical insulation.

[0019] In a feasible implementation, at least two transducer bodies are included, and the two transducer bodies are arranged in parallel with a gap between them. The second heat dissipation device is arranged in the gap. Since the thermal conductivity of the air in the gap is relatively small, the second heat dissipation device is arranged in the gap, and the filling layer is filled with insulating thermally conductive material. Insulating thermally conductive materials such as insulating thermally conductive silicone grease are used instead of air, which can greatly improve the radiation speed of heat.

[0020] In a feasible implementation, each cooling channel is connected through a coolant connecting layer, and the coolant can flow between each cooling channel. Here, the cooling channels are connected into a whole, and the coolant is recycled to save costs.

[0021] In a feasible implementation, each cooling channel is connected to the main pump body through the main inlet and the main outlet arranged on the backing, forming a coolant circulation system, reducing the number of pump bodies and saving costs.

[0022] In order to solve the above technical problems, another technical solution adopted by the present invention is:

[0023] According to the cooling method of the ultrasonic transducer as described above, when the ultrasonic transducer is working, heat is dissipated through the first heat dissipation device, specifically: the power mechanism drives the coolant to flow in the cooling channel in the backing, thereby reducing the heat conducted to the backing when the ultrasonic transducer is working.

[0024] In a feasible implementation, the cooling channel is filled with a heat dissipation structure, the heat dissipation structure has at least one channel, and the coolant flows in the heat dissipation structure.

[0025] In a feasible implementation, the first heat dissipation device further includes a heat dissipation layer disposed on the periphery of the cooling channel to quickly conduct heat from the backing.

[0026] In a feasible implementation, the heat dissipation layer is made of metal material.

[0027] In a feasible implementation, the heat dissipation structure is made of porous material.

[0028] In a feasible implementation, the heat dissipation structure is made of porous metal material.

[0029] In a feasible implementation, the backing is made of metal material.

[0030] In a feasible implementation, the backing is made of porous metal material.

[0031] In a feasible implementation, the backing and the heat dissipation structure are made of the same material.

[0032] In a feasible implementation, a second heat dissipation device is provided on the transducer body to reduce the heat accumulated on the transducer body when the ultrasonic transducer is working. The second heat dissipation device includes a filling layer filled with insulating heat-conducting material.

[0033] In a feasible implementation, the insulating thermally conductive material is selected from insulating thermally conductive silicone grease.

[0034] The present invention enhances the heat dissipation performance by combining a first heat dissipation device for active heat dissipation and a second heat dissipation device for passive heat dissipation, achieves a rapid cooling effect of an ultrasonic transducer, especially a phased array ultrasonic transducer, and improves the stability of the vibration unit of the super energy transducer during operation.

[0035] Due to the adoption of the above technical solution, the present invention has the following advantages compared with the prior art:

[0036] 1. The present invention adds a first heat dissipation device, especially a porous heat dissipation structure, between each backing of the ultrasonic transducer to increase the heat transfer surface area to enhance heat transfer, and passes a coolant into the first heat dissipation device to take away more heat generated by the vibration unit of the ultrasonic transducer during operation, thereby enhancing the heat dissipation performance and reducing the temperature of the vibration unit of the ultrasonic transducer during operation;

[0037] 2. The present invention sets a second heat sink on the transducer body, and the second heat sink includes a filling layer, and the filling layer is filled with an insulating heat-conducting material. The insulating heat-conducting material is used to replace the air medium. While ensuring that the volume remains unchanged, the heat transfer performance is changed by the filling medium, which can greatly improve the heat dissipation efficiency of the vibration unit of the ultrasonic transducer during operation, improve the thermal conductivity efficiency, and reduce the working temperature of the ultrasonic transducer;

[0038] 3. The present invention enhances the heat dissipation performance by combining a first heat dissipation device for active heat dissipation and a second heat dissipation device for passive heat dissipation, thereby achieving a rapid cooling effect of the ultrasonic transducer, especially the phased array ultrasonic transducer, and improving the stability of the vibration unit of the super energy transducer during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is an overall structural diagram of a phased array ultrasonic transducer according to Embodiment 1 of the present invention;

[0040] Figure 2 This is a schematic diagram of the structure of a single-vibration ultrasonic transducer according to Embodiment 1 of the present invention;

[0041] Figure 3 It is a side view of a single-element ultrasonic transducer according to Embodiment 1 of the present invention;

[0042] Figure 4 This is a schematic diagram of an array heat dissipation device according to Embodiment 1 of the present invention;

[0043] Figure 5 This is a schematic diagram of the heat dissipation structure of the single-element ultrasonic transducer according to Example 2 of the present invention.

[0044] Among them, 001, backing; 002, piezoelectric ceramic; 003, acoustic matching layer; 004, acoustic lens; 005, ground electrode; 006, signal electrode; 007, gap; 101, coolant input channel; 102, coolant connecting layer; 103, coolant output channel; 201, coolant inlet; 202, coolant outlet; 203, cooling channel; 204, heat dissipation layer; 205, filling layer; 206, heat dissipation structure; 207, channel. DETAILED DESCRIPTION

[0045] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0046] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right", "upper", "lower" and similar expressions used herein are for illustrative purposes only.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0048] The ultrasonic transducer of the present invention includes at least one transducer body capable of generating piezoelectric effect, that is, any structure or component capable of generating piezoelectric effect can be used as the transducer body. In a specific embodiment, the transducer body is a piezoelectric ceramic vibration unit.

[0049] The transducer of the present invention further includes an electrode, an acoustic lens, an acoustic matching layer, a backing, and a flexible circuit, etc. The electrode includes a ground electrode located above the transducer body and a signal electrode located below the transducer body, the acoustic matching layer and the acoustic lens are stacked on the ground electrode from bottom to top, and a backing is also provided below the signal electrode. Since the electrode, the acoustic lens, the acoustic matching layer, and the flexible circuit are not the innovative points of the present invention, they will not be discussed in detail here.

[0050] Since the transducer body, that is, the structure or component that can produce piezoelectric effect, generates a lot of heat during operation, causing the temperature of the ultrasonic transducer to rise too quickly or be too high, affecting the performance of the ultrasonic transducer, the applicant made the present invention on this basis.

[0051] A backing is provided on one side of the transducer body, and a first heat dissipation device is provided in the backing. The first heat dissipation device includes a cooling channel for the circulation of coolant arranged in the backing, and the cooling channel is connected to a power mechanism for driving the circulation of coolant through an inlet channel and an outlet channel arranged on the backing. In some specific embodiments, the cooling channel can be integrally formed with the backing, that is, a cooling channel is reserved in the backing, and the cooling channel can also be a separate structure from the backing, that is, a receiving area is provided in the backing, and a structure with a cooling channel made of a profile is provided in the receiving area. By arranging a first heat dissipation device for active heat dissipation in the backing and driving the coolant to circulate in the cooling channel, the heat conducted to the backing by the ultrasonic transducer during operation can be taken away, the heat dissipation performance of the ultrasonic transducer can be enhanced, the working temperature of the ultrasonic transducer can be reduced, and its stability during operation can be improved.

[0052] In a specific embodiment, in order to achieve a better heat dissipation effect, the coolant inlet and outlet of the cooling channel are respectively arranged on one side of the cooling channel away from the transducer body. For example, the transducer body is arranged at the top and the cooling channel is arranged at the bottom of the transducer body, and the coolant inlet and outlet of the cooling channel are arranged at the bottom of the cooling channel. Preferably, the coolant inlet and outlet are arranged on opposite sides, that is, the inlet is arranged on the left side and the outlet is arranged on the right side, and vice versa.

[0053] In a specific embodiment, the first heat dissipation device further includes a heat dissipation structure filled in the cooling channel, the heat dissipation structure has at least one channel, preferably greater than or equal to three channels, and the coolant flows in the heat dissipation structure. The cooling channel is filled with a heat dissipation structure having a porous structure, especially a heat dissipation structure having a porous structure, and its channel structure expands the contact area of ​​the coolant, so that the efficiency of temperature transfer from the backing to the coolant is higher, thereby improving the cooling speed.

[0054] In a specific embodiment, the first heat dissipation device further comprises a heat dissipation layer disposed on the periphery of the cooling channel, and the heat dissipation layer realizes rapid conduction transfer of heat on the backing. Preferably, the heat dissipation layer covers at least one third of the outer surface area of ​​the cooling channel. Preferably, the heat dissipation layer is made of a metal material, which has excellent thermal conductivity and can improve the heat conduction efficiency.

[0055] In a specific embodiment, the heat dissipation structure is made of a porous material, which does not completely block the flow of the coolant and has a larger specific surface area, which can greatly increase the contact with the coolant and transfer the accumulated heat to the coolant. Preferably, the heat dissipation structure is made of a porous metal material, which has a large specific surface area and high heat exchange and heat dissipation capacity.

[0056] In a specific embodiment, the backing is made of metal material, which has excellent thermal conductivity and improves the heat conduction efficiency. Preferably, the backing is made of porous metal material, which has a large specific surface area and high heat exchange and heat dissipation capacity.

[0057] In a specific embodiment, the backing and the heat dissipation structure are made of the same material, which can achieve higher heat transfer efficiency compared to when the heat dissipation structure and the backing are made of different materials.

[0058] In a specific embodiment, the ultrasonic transducer further comprises a second heat sink disposed on the transducer body, the second heat sink comprising a filling layer, the filling layer being filled with an insulating heat-conducting material, such a configuration can better conduct heat generated on the transducer body. Preferably, the insulating heat-conducting material is selected from insulating heat-conducting silicone grease, which is a composite of metal oxides with excellent thermal conductivity and insulation properties and organic silicon oxides, and has excellent thermal conductivity and good electrical insulation.

[0059] In a specific embodiment, the ultrasonic transducer includes at least two transducer bodies, which are arranged in parallel with a gap between them. The second heat dissipation device is arranged in the gap. Since the thermal conductivity of the air in the gap is relatively small, the second heat dissipation device is arranged in the gap, and the filling layer is filled with insulating thermally conductive materials. Insulating thermally conductive materials such as insulating thermally conductive silicone grease are used instead of air, which can greatly improve the radiation speed of heat.

[0060] In a specific embodiment, each cooling channel is connected through a coolant connecting layer, and the coolant can flow between each cooling channel. Specifically, it can be set that the coolant outlet of the cooling channel is connected to the inlet of the coolant connecting layer, and the outlet of the coolant connecting layer is connected to the coolant inlet of another cooling channel, and this setting is repeated. Here, the cooling channels are connected as a whole, and the coolant is recycled to save costs.

[0061] In a specific embodiment, each cooling channel is connected to the main pump body through a main inlet and a main outlet arranged on the backing, forming a coolant circulation system. Such an arrangement can reduce the number of pump bodies and save costs.

[0062] The present invention also provides a cooling method for the ultrasonic transducer as described above. When the ultrasonic transducer is working, heat is dissipated through a first heat dissipation device, specifically: a power mechanism is used to drive the coolant to flow in a cooling channel in the backing, thereby reducing the heat conducted to the backing when the ultrasonic transducer is working.

[0063] In a specific embodiment, the cooling channel is filled with a heat dissipation structure, the heat dissipation structure has at least one channel, and the coolant flows in the heat dissipation structure. Preferably, the heat dissipation structure is made of porous material, and more preferably, the heat dissipation structure is made of porous metal material.

[0064] In a specific embodiment, the first heat dissipation device further includes a heat dissipation layer disposed on the periphery of the cooling channel to quickly conduct heat from the backing. Preferably, the heat dissipation layer is made of metal material.

[0065] In a specific embodiment, the backing is made of metal material, preferably, the backing is made of porous metal material.

[0066] In a specific embodiment, the backing and the heat dissipation structure are made of the same material.

[0067] In a specific embodiment, a second heat dissipation device is provided on the transducer body to reduce the heat accumulated on the transducer body when the ultrasonic transducer is working. The second heat dissipation device includes a filling layer filled with insulating thermally conductive material. Preferably, the insulating thermally conductive material is selected from insulating thermally conductive silicone grease.

[0068] Example 1

[0069] As attached Figure 1 As shown, the ultrasonic transducer of this embodiment is an ultrasonic phased array transducer, which is composed of a plurality of piezoelectric ceramic vibration units of the same shape and size arranged in an array, and a gap 007 is provided between each piezoelectric ceramic vibration unit. Each piezoelectric ceramic vibration unit includes a piezoelectric ceramic 002, an electrode, an acoustic matching layer 003, and an acoustic lens 004. The electrode includes a ground electrode 005 located above the piezoelectric ceramic 002 and a signal electrode 006 located below the piezoelectric ceramic 002. The acoustic matching layer 003 and the acoustic lens 004 are sequentially stacked on the ground electrode 005 from bottom to top. A backing 001 is provided below the signal electrode 006. In this embodiment, the backing 001 is made of a porous metal material, and the porous metal material has a large specific surface area and high heat exchange and heat dissipation capacity.

[0070] The core heating area in the transducer of this embodiment is the same piezoelectric ceramic vibration unit, part of the heat generated by it is radiated outward through the air in the gap 007, and part of it is diffused after being conducted to the backing 001.

[0071] In this embodiment, the heat dissipation of the transducer is optimized, and a first heat dissipation device for active heat dissipation and a second heat dissipation device for passive heat dissipation are added.

[0072] As attached Figure 2-3As shown, specifically for each piezoelectric ceramic vibration unit, a first heat dissipation device is provided in the backing 001, and the first heat dissipation device includes a cooling channel 203 for cooling liquid circulation arranged in the backing 001, and a cooling liquid inlet 201 and a cooling liquid outlet 202 are provided on the cooling channel 203, and the cooling liquid inlet 201 and the cooling liquid outlet 202 are located on the side of the cooling channel 203 away from the piezoelectric ceramic 002, and the cooling liquid inlet 201 and the cooling liquid outlet 202 are relatively arranged at two ends of one side of the cooling channel 203. The cooling channel 203 is connected to the power mechanism for driving the cooling liquid circulation through the inlet channel and the outlet channel arranged on the backing 001 respectively. The power mechanism drives the cooling liquid to circulate in the backing, takes away the heat conducted to the backing by the ultrasonic transducer during operation, enhances the heat dissipation performance of the ultrasonic transducer, reduces the working temperature of the ultrasonic transducer, and improves its stability during operation.

[0073] In this embodiment, the first heat dissipation device further includes a heat dissipation layer 204 disposed on the periphery of the cooling channel 203. The heat dissipation layer 204 is disposed outside the cooling channel 203 and is connected to the piezoelectric ceramic 002. The heat dissipation layer 204 covers at least one third of the outer surface area of ​​the cooling channel 203. The heat dissipation layer 204 is made of metal material, which has excellent thermal conductivity and improves the heat conduction efficiency. The heat on the backing 001 accounts for most of the heat generated by the working vibration of the piezoelectric ceramic 002. The heat on the backing 001 is quickly transferred through the heat dissipation layer 204. The heat accumulated on the heat dissipation layer 204 is transferred to the coolant through the cooling channel 203, thereby reducing the heat accumulated in the core piezoelectric ceramic vibration unit.

[0074] In this embodiment, the backing 001 is made of metal material, especially porous metal material. The porous metal material has a large specific surface area and high heat exchange and heat dissipation capacity.

[0075] In this embodiment, a second heat dissipation device is arranged on the piezoelectric ceramic 002. The second heat dissipation device is arranged in the gap 007, and includes a filling layer 205. The filling layer 205 is filled with insulating thermal conductive material, especially insulating thermal conductive silicone grease. The insulating thermal conductive silicone grease is a composite of metal oxides with excellent thermal conductivity and insulation properties and organic silicon oxides, and has excellent thermal conductivity and good electrical insulation.

[0076] Since there is a gap 007 between each piezoelectric ceramic vibration unit, the thermal conductivity of the air in the gap 007 is relatively small, and a second heat dissipation device is set in the gap 007. The filling layer 205 is filled with insulating thermal conductive material. Insulating thermal conductive materials such as insulating thermal conductive silicone grease are used instead of air. This can greatly improve the heat radiation speed, enhance the heat transfer and the ability of heat radiation to the outside, and reduce the heat accumulated in the core piezoelectric ceramic vibration unit through passive heat dissipation.

[0077] As attached Figure 4 As shown, specifically, with respect to an ultrasonic phased array transducer composed of an array of several piezoelectric ceramic vibration units of the same shape and size, the ultrasonic phased array transducer of this embodiment is composed of a group of 10 piezoelectric ceramic vibration units arranged longitudinally, and two groups of piezoelectric ceramic vibration units arranged transversely, wherein the longitudinal direction is the width direction of the piezoelectric ceramic vibration unit in the figure, and the transverse direction is the length direction of the piezoelectric ceramic vibration unit.

[0078] In this embodiment, each cooling channel 203 is arranged in the same manner as the piezoelectric ceramic vibration unit to form an array heat dissipation device, that is, every 10 cooling channels 203 are arranged longitudinally to form a group, and two groups of cooling channels 203 are arranged transversely to form a group, wherein the longitudinal direction is the width direction of the piezoelectric ceramic vibration unit in the figure, and the transverse direction is the length direction of the piezoelectric ceramic vibration unit. The coolant outlet of one group of cooling channels 203 in the array heat dissipation device is arranged adjacent to the coolant inlet of another group of cooling channels 203. In this embodiment, a coolant connecting layer 102 is provided to connect all the coolant outlets of one group of cooling channels 203 with all the coolant inlets of another group of cooling channels 203. Each cooling channel 203 is connected through the coolant connecting layer 102, and the coolant can flow between each cooling channel.

[0079] In this embodiment, a coolant input channel 101 and a coolant output channel 103 are provided in the backing 001. The coolant input channel 101 is connected to all coolant inlets of a group of cooling channels 203, and the coolant output channel 103 is connected to all coolant outlets of another group of cooling channels 203. The coolant input channel 101 is connected to the main pump body through the main inlet provided on the backing 001, and the coolant output channel 103 is connected to the main pump body through the main outlet provided on the backing 001, thus forming a coolant circulation system, so that the coolant can flow quickly and improve the heat dissipation efficiency.

[0080] The cooling method of the ultrasonic transducer of this embodiment is: when the ultrasonic transducer is working, part of the heat is dissipated through the first heat dissipation device, specifically: the power mechanism drives the coolant to flow in the cooling channel 203 in the backing 001, thereby reducing the heat conducted to the backing when the ultrasonic transducer is working.

[0081] Part of the heat is passed through a second heat dissipation device arranged on the transducer body to reduce the heat accumulated on the transducer body when the ultrasonic transducer is working. Specifically, the second heat dissipation device includes a filling layer 205, and the filling layer 205 is filled with insulating thermal conductive materials such as insulating thermal conductive silicone grease. The heat is transferred or radiated outward through the insulating thermal conductive materials such as insulating thermal conductive silicone grease.

[0082] In this embodiment, there is a gap 007 between each vibration unit of the phased array transducer. The thermal conductivity of air is relatively low. A filling layer 205 is provided between the gaps 007 and filled with insulating thermal conductive materials such as insulating thermal conductive silicone grease. Using insulating thermal conductive materials such as insulating thermal conductive silicone grease to replace air can greatly increase the radiation speed of heat.

[0083] For the transducer of this embodiment, a cooling channel for active heat dissipation is constructed to connect the fluid heat dissipation arrays. Through active heat dissipation, most of the heat conducted to the backing through insulating thermal grease, electrodes, etc. is taken away, so as to reduce the heat of the core piezoelectric ceramic vibration unit and improve the working stability of the transducer.

[0084] This embodiment combines active heat dissipation with passive heat dissipation to jointly reduce the temperature of the vibration unit of the ultrasonic transducer during operation, achieve a rapid cooling effect of the ultrasonic transducer, and improve its stability during operation, so as to solve the problem of rapid heating and high temperature of the phased array transducer during operation.

[0085] Example 2

[0086] This embodiment optimizes the first heat dissipation device based on the basic structure of embodiment 1, and fills and sets a heat dissipation structure 206 in the cooling channel 203. The heat dissipation structure 206 has a plurality of channels 207, and coolant is passed through the plurality of channels 207. Since the plurality of channels 207 structure enlarges the contact area of ​​the coolant, the efficiency of temperature transfer from the backing to the coolant is higher, thereby improving the cooling speed.

[0087] As attached Figure 5 As shown, in this embodiment, a porous channel is constructed by 3D printing using the same material as the backing. In this embodiment, a 5 mm cube is used to construct the array, and after structural optimization calculations, a cylinder with a diameter of 1.7 mm is selected to construct the channel.

[0088] In this embodiment, those skilled in the art can achieve a certain degree of cooling effect by replacing the pores by constructing the pores with the same backing material or similar metal materials through 3D printing, or by changing the pore shapes such as hexagons and octagons, and by optimizing the pore shapes through topological structures, as well as by optimizing the flow pipes.

[0089] In this embodiment, the heat dissipation structure 206 is made of porous material, especially porous metal material. The porous material does not completely block the circulation of the coolant. At the same time, the porous material can receive the heat transferred from the heat dissipation layer 204 more quickly, and the porous material has a larger specific surface area, which can greatly increase the contact with the coolant and transfer the accumulated heat to the cooling liquid.

[0090] In this embodiment, the backing 001 and the heat dissipation structure 206 are made of the same material. The one-piece 3D printing using the same material as the backing 001 can achieve higher heat transfer efficiency than porous materials of other materials.

[0091] In this embodiment, the heat dissipation structure 206 is added, compared with the embodiment 1 in which the heat dissipation structure 206 is not added, the temperature of the piezoelectric ceramic 002 can be reduced by more than 3° C., thereby greatly improving the cooling performance of the transducer.

[0092] In this embodiment, the power mechanism uses a pressurized pump body for circulation, because a heat dissipation structure is added in the cooling channel 203 to expand the contact area with the coolant, which requires a greater pressure for the flow of the coolant. The external pressurized pump body can accelerate the coolant circulation faster and quickly reduce the heat on the heat dissipation layer 204.

[0093] This embodiment combines active heat dissipation with passive heat dissipation to jointly reduce the temperature of the vibration unit of the ultrasonic transducer during operation, achieve a rapid cooling effect of the ultrasonic transducer, and improve its stability during operation, so as to solve the problem of rapid heating and high temperature of the phased array transducer during operation.

[0094] This embodiment further adds a porous heat dissipation structure to the first heat dissipation device for active heat dissipation, so that the coolant passing therein can better improve the cooling efficiency.

[0095] Example 3

[0096] This embodiment reduces the second heat dissipation device on the basis of the second embodiment, and other structures are the same as those of the second embodiment.

[0097] For the transducer of this embodiment, an active heat dissipation cooling channel is constructed to connect the fluid heat dissipation arrays. Through active heat dissipation, most of the heat conducted to the backing through the electrodes is taken away, thereby reducing the heat of the core piezoelectric ceramic vibration unit and improving the working stability of the transducer.

[0098] The ultrasonic transducer and cooling method provided by the patent of the present invention enable a part of the heat generated by the ultrasonic transducer during operation to be diffused through a first heat dissipation device for active heat dissipation added in the backing, and the cooling efficiency can be better improved by passing coolant into the porous heat dissipation structure added therein, while the other part is diffused through a second heat dissipation device for passive heat dissipation (insulating thermally conductive silicone grease). Finally, the temperature of the vibration unit of the ultrasonic transducer during operation is reduced by combining active heat dissipation with passive heat dissipation, thereby achieving a rapid cooling effect of the ultrasonic transducer and improving its stability during operation, so as to solve the problem of rapid heating and high temperature of the phased array transducer during operation.

[0099] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An ultrasonic transducer, It is characterized in that It includes at least one transducer body that produces a piezoelectric effect, and each of the transducer bodies is provided with a backing on one side, and a first heat dissipation device is provided in the backing. The first heat dissipation device includes a cooling channel arranged in the backing for the circulation of cooling liquid, and the cooling channel is connected to a power mechanism that drives the circulation of cooling liquid through an inlet channel and an outlet channel arranged on the backing.

2. The ultrasonic transducer according to claim 1, It is characterized in that The first heat dissipation device further comprises a heat dissipation structure filled in the cooling channel, the heat dissipation structure having at least one hole, and a coolant flowing in the heat dissipation structure; Preferably, the first heat dissipation device further comprises a heat dissipation layer arranged at the periphery of the cooling channel; Preferably, the heat dissipation layer is made of metal material.

3. The ultrasonic transducer according to claim 2, It is characterized in that The heat dissipation structure is made of porous material; Preferably, the heat dissipation structure is made of porous metal material.

4. The ultrasonic transducer according to claim 2, It is characterized in that The backing and the heat dissipation structure are made of the same material.

5. The ultrasonic transducer according to claim 1, It is characterized in that The backing is made of metal material; Preferably, the backing is made of porous metal material.

6. The ultrasonic transducer according to claim 1, It is characterized in that Also included is a second heat sink disposed on the transducer body, the second heat sink comprising a filling layer, the filling layer being filled with an insulating heat-conducting material; Preferably, the insulating thermally conductive material is selected from insulating thermally conductive silicone grease.

7. The ultrasonic transducer according to any one of claims 1 to 6, It is characterized in that It comprises at least two transducer bodies, which are arranged in parallel with a gap between them, and the second heat sink is arranged in the gap.

8. The ultrasonic transducer according to claim 7, It is characterized in that Each of the cooling channels is connected via a coolant communication layer, and the coolant can flow between each of the cooling channels.

9. The ultrasonic transducer according to claim 8, It is characterized in that Each of the cooling channels is connected to the main pump body through a main inlet and a main outlet arranged on the backing, forming a cooling liquid circulation system.

10. The method for cooling an ultrasonic transducer according to any one of claims 1 to 9, It is characterized in that When the ultrasonic transducer is working, heat is dissipated through the first heat dissipation device, specifically: a power mechanism is used to drive the coolant to flow in the cooling channel in the backing, so as to reduce the heat conducted to the backing when the ultrasonic transducer is working; Preferably, the cooling channel is filled with a heat dissipation structure, the heat dissipation structure has at least one channel, and the coolant flows in the heat dissipation structure; Preferably, the first heat sink further comprises a heat sink layer disposed at the periphery of the cooling channel to quickly conduct heat from the backing; Preferably, the heat dissipation layer is made of metal material; Preferably, the heat dissipation structure is made of porous material; Preferably, the heat dissipation structure is made of porous metal material; Preferably, the backing is made of metal material; Preferably, the backing is made of porous metal material; Preferably, the backing and the heat dissipation structure are made of the same material; Preferably, a second heat dissipation device is provided on the transducer body to reduce the heat accumulated on the transducer body when the ultrasonic transducer is working, and the second heat dissipation device comprises a filling layer, and the filling layer is filled with an insulating heat-conducting material; Preferably, the insulating thermally conductive material is selected from insulating thermally conductive silicone grease.

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