Display panel and display device

Abstract

The invention relates to the technical field of display, in particular to a display panel and a display device. The display panel includes: a substrate; the light-emitting structure is positioned on one side of the substrate; the photoelectric receiving structure and the light-emitting structure are jointly located on the same side of the substrate; and the light reflecting structure is positioned between the light emitting structure and the photoelectric receiving structure. According to the invention, the light reflection structure is arranged between the light emitting structure and the photoelectric receiving structure, and more light emitted by the light emitting structure is irradiated to the target object after being reflected by the light reflection structure instead of being blocked by the absorption structure. Furthermore, the efficiency of light received by the photoelectric receiving structure can be improved, and the signal-to-noise ratio of the photoelectric receiving structure is increased, so that a more accurate electric signal is obtained, and a more accurate image of the target object is formed.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the development of display technology, more and more functions have been integrated into the display, such as camera, touch, fingerprint recognition, etc. In the field of fingerprint recognition function-optical sensor, organic photodiodes are usually used as photoelectric receiving structures. The organic photodiode is located between adjacent light-emitting structures. The light emitted by the light-emitting structure first irradiates the fingerprint, and then is reflected by the fingerprint to the organic photodiode. Due to the ups and downs of the fingerprint, the reflected light received by the organic photodiode is different, thereby realizing fingerprint information recognition.

[0003] However, the light emitted by the light-emitting structure will propagate inside the panel, thereby interfering with the fingerprint recognition process and causing a decrease in the signal-to-noise ratio of the photoelectric receiving structure. Summary of the invention

[0004] Based on this, it is necessary to provide a display panel and a display device to address the problem of reduced signal-to-noise ratio of the photoelectric receiving structure in the prior art.

[0005] In order to achieve the above object, on the one hand, a display panel is provided, comprising:

[0006] substrate;

[0007] A light emitting structure, located on one side of the substrate;

[0008] A photoelectric receiving structure, located on the same side of the substrate as the light emitting structure;

[0009] The light reflecting structure is located between the light emitting structure and the photoelectric receiving structure.

[0010] In some embodiments, the light reflecting structure includes a dam and a light reflecting layer covering the dam;

[0011] Optionally, the dam is in the shape of a regular trapezoid;

[0012] Optionally, the light reflecting structure is located on both sides of the photoelectric receiving structure, and / or the light reflecting structure is located on both sides of the light emitting structure.

[0013] In some embodiments, the display panel further comprises:

[0014] A pixel definition layer and the light-emitting structure are located on the same side of the substrate, and the pixel definition layer includes a first opening and a second opening, the first opening is used to define a light-emitting area, and the second opening is used to define a light-receiving area, the light-reflecting structure is located on a side of the pixel definition layer away from the substrate, the light-emitting structure is located in the light-emitting area, and the photoelectric receiving structure is located in the light-receiving area.

[0015] In some embodiments, the substrate includes a first electrode, the pixel definition layer partially covers the first electrode, and the first opening and the second opening expose the first electrode;

[0016] The light reflection structure includes a dam and a light reflecting layer, wherein the light reflecting layer covers the dam, the material of the light reflecting layer is a conductive material, and the light reflecting layer also covers the side walls of the first opening and the second opening and the first electrode.

[0017] In some embodiments, the display panel further comprises:

[0018] A multi-layer common film layer is shared by the light emitting structure and the photoelectric receiving structure, and the multi-layer common film layer includes a partition common layer, and the partition common layer partitions between the light emitting structure and the photoelectric receiving structure.

[0019] Optionally, the display panel includes a first common layer and a second common layer, the light-emitting structure includes a light-emitting layer, the photoelectric receiving structure includes an active layer, the first common layer is located on a side of the light-emitting layer and the active layer close to the substrate, the second common layer is located on a side of the light-emitting layer and the active layer away from the substrate, and the partition common layer includes at least the first common layer.

[0020] In some embodiments, there is at least one partition groove between the light emitting structure and the photoelectric receiving structure, and the partition common layer is partitioned by the partition groove;

[0021] Optionally, the partition groove is in an inverted trapezoidal shape.

[0022] In some embodiments, the display panel further comprises:

[0023] A filling structure to fill the partition groove;

[0024] A second electrode covering the common film layer and the filling structure;

[0025] Optionally, the upper surface of the filling structure is higher than the upper surface of the partition groove, and the portion of the filling structure that exceeds the partition groove is spherical or regular trapezoidal;

[0026] Optionally, a plurality of partition grooves are provided between the light emitting structure and the photoelectric receiving structure, and the plurality of partition grooves are filled with the same filling structure.

[0027] In some embodiments, an eaves structure is provided between the light-emitting structure and the photoelectric receiving structure, and the partition common layer is separated by the eaves structure.

[0028] In some embodiments, the plurality of common film layers are all partition common layers, and the display panel includes a second electrode, which covers the common film layer and overlaps with the eaves structure;

[0029] Optionally, the bottom of the eaves structure is spaced apart from the common membrane layer;

[0030] Optionally, the eaves structure comprises a cover plate, a column and a bottom plate connected to each other, the column is located between the cover plate and the bottom plate, the bottom plate is close to the base plate, the cover plate is far from the base plate, the orthographic projection of the column on the base plate is located within the orthographic projection of the cover plate on the base plate, and is located at or within the orthographic projection of the bottom plate on the base plate;

[0031] Optionally, the material of the base plate includes insulating material;

[0032] Optionally, a dimension of the bottom plate along a thickness direction of the display panel is greater than a dimension of the partition common layer along the thickness direction of the display panel.

[0033] On the other hand, a display device is further provided, comprising the display panel as described in any of the preceding items.

[0034] The display panel and display device of the present specification have the following beneficial effects: First, by setting a light reflection structure between the light emitting structure and the photoelectric receiving structure, the light emitted by the light emitting structure is reflected by the light reflection structure and irradiates more to the target object instead of being blocked by the absorption structure. Furthermore, the present disclosure can also improve the efficiency of the light received by the photoelectric receiving structure, increase the signal-to-noise ratio of the photoelectric receiving structure, thereby obtaining a more accurate electrical signal, and then forming a more accurate image of the target object. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0036] Figures 1 to 6A schematic diagram of an intermediate structure obtained during the preparation of a display panel provided in an embodiment;

[0037] Figures 7 and 8 A schematic diagram of an intermediate structure obtained in a process of preparing a display panel provided in another embodiment;

[0038] Fig. 9 A schematic diagram of an eave structure provided in an embodiment;

[0039] Fig.10 A schematic diagram of a touch screen in the related art;

[0040] Fig.11 Schematic diagram of a display panel in the related art.

[0041] Explanation of the reference numerals: display panel -100; light emitting structure -110; light emitting layer -111; photoelectric receiving structure -120; active layer -121; light reflecting structure -130; dam -131; light reflecting layer -132; planarizing layer -140; conductive layer -141; pixel definition layer -150; first electrode -160; second electrode -161; common film layer -170; first common layer -171; second common layer 172; filling structure -180; eaves structure -181; cover plate -1811; column -1812; bottom plate -1813; thin film encapsulation -190; absorption structure -200; first opening -210; second opening -220; partition groove -230.

[0042] In order to better describe and illustrate the embodiments and / or examples of the inventions disclosed herein, reference may be made to one or more drawings. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed inventions, the embodiments and / or examples currently described, and the best modes of these inventions currently understood. DETAILED DESCRIPTION

[0043] In order to facilitate understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thorough and comprehensive.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure.

[0045] In each embodiment, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in each embodiment can be understood according to the specific situation.

[0046] It should be understood that when an element or layer is referred to as being "on, adjacent to, or connected to other elements or layers, it may be directly on, adjacent to, or connected to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, or directly connected to other elements or layers, there may be no intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present embodiment, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part.

[0047] Spatial relationship terms such as "under", "below", "below", "under", "above", "above", etc., may be used herein to describe the relationship between an element or feature shown in the figures and other elements or features. It should be understood that in addition to the orientations shown in the figures, spatial relationship terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, the element or feature described as "under other elements" or "under it" or "under it" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0048] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "consisting of" and / or "comprising" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups is not excluded. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0049] Embodiments of the embodiments are described herein with reference to cross-sectional illustrations that are schematic representations of idealized embodiments (and intermediate structures) of the present specification, and variations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are anticipated. Thus, embodiments of the present embodiments should not be limited to the particular shapes of the regions illustrated herein, but are to include deviations in shapes due to, for example, manufacturing techniques. The regions shown in the figures are schematic in nature, and their shapes do not represent the actual shapes of the regions of the device and do not limit the scope of the present embodiments.

[0050] See also Figures 1 to 8 ,in, Figures 1 to 6 The manufacturing process of the display panel 100 provided in one embodiment is as follows: Figures 7 and 8 The display panel 100 prepared in accordance with another embodiment includes a substrate (not shown), a light emitting structure 110 , a photoelectric receiving structure 120 and a light reflecting structure 130 .

[0051] The substrate can be used to support the structure thereon. The substrate can include a substrate and a plurality of film layers covering the substrate. The substrate can be made of semiconductor material, insulating material or any combination thereof. For example, the substrate can be a glass substrate, a silicon substrate, etc.

[0052] The multiple film layers covering the substrate may include a planarization layer 140 (Planarization Layer, PLN) and a conductive layer 141, etc. The planarization layer 140 may be a film layer obtained after a planarization process. The material of the planarization layer 140 may include an organic compound, etc. The conductive layer 141 may be a conductive line for connecting the light-emitting structure 110 and the pixel circuit. For example, the conductive layer 141 may include a thin-film transistor (Thin-Film Transistor, TFT) connection line. The material of the conductive layer 141 may include indium tin oxide (Indium Tin Oxide, ITO), etc. The planarization layer 140 and the conductive layer 141 may be arranged in the same layer. Of course, the planarization layer 140 and the conductive layer 141 may also be located in different layers.

[0053] The light emitting structure 110 may include a structure capable of emitting light. The light emitting structure 110 is located on one side of the substrate. As an example, the light emitting structure 110 may be located on a side of the conductive layer 141 away from the substrate.

[0054] The light emitting structure 110 may be at least a partial structure of a light emitting diode (LED). Specifically, the light emitting diode may be an organic light emitting diode (OLED) or the like.

[0055] A plurality of light emitting structures 110 may be provided on the display panel 100 to form a plurality of light emitting devices. For example, the light emitting structure 110 may be used to form a red light emitting diode, a green light emitting diode and a blue light emitting diode. A red light emitting diode, a green light emitting diode and a blue light emitting diode constitute a light emitting unit, and a plurality of light emitting units may be arranged in a matrix on the substrate.

[0056] The photoelectric receiving structure 120 can be used to convert the received reflected light into an electrical signal. For example, the photoelectric receiving structure 120 can be at least a partial structure of an organic photodiode (OPD). The photoelectric receiving structure 120 and the light-emitting structure 110 are located on the same side of the substrate, and the photoelectric receiving structure 120 and the light-emitting structure 110 are spaced apart and arranged in the same layer. At this time, as an example, the photoelectric receiving structure 120 can be combined with a light-emitting unit to form a pixel unit.

[0057] After the light emitting structure 110 emits light, the light can be emitted longitudinally (extending in the thickness direction of the display panel 100). When the light irradiates the target object (for example, a fingerprint), the light can be reflected on the surface of the target object to form reflected light. The photoelectric receiving structure 120 receives the reflected light and converts the reflected light into different electrical signals according to the properties such as the intensity of the reflected light.

[0058] During this process, the light emitted by the light emitting structure 110 can first be directed toward the light reflecting structure 130, and after being reflected on the surface of the light reflecting structure 130, the light path of the light is changed, so that the light reflecting structure 130 can control the light emitted by the light emitting structure 110 to irradiate more of the target object.

[0059] The light reflective structure 130 may be located between the light emitting structure 110 and the photoelectric receiving structure 120. For example, the light reflective structure 130 may be located on a side of the conductive layer 141 away from the substrate.

[0060] The material of the light reflective structure 130 may include metals such as copper and gold. The light reflective structure 130 extends along the thickness direction of the display panel 100 and protrudes from the photoelectric receiving structure 120 and the light emitting structure 110 .

[0061] For related technologies, see Fig.10 In order to reduce the influence of the stray light of the pixel at a large angle on the signal received by the photoelectric receiving structure 20, an absorption structure 200 is often provided to absorb the stray light. However, the absorption structure 200 will block the effective emission of the light, so that part of the light emitted by the light emitting structure 10 cannot be irradiated to the target object (such as Fig.10 The pixel luminous efficiency is reduced, which affects the light received by the photoelectric receiving structure 20.

[0062] In this embodiment, by setting the light reflection structure 130 between the light emitting structure 110 and the photoelectric receiving structure 120, the light reflection structure 130 can focus the light to a certain extent, thereby improving the collimation of its light path. After the light emitted by the light emitting structure 110 is reflected by the light reflection structure 130, it is more irradiated to the target object instead of being blocked by the absorption structure 200, while improving the light extraction efficiency of the light emitting structure 110. Furthermore, this embodiment can also improve the efficiency of the light received by the photoelectric receiving structure 120, effectively reduce or even suppress the influence of stray light on the signal-to-noise ratio of the photoelectric receiving structure 120, thereby obtaining a more accurate electrical signal, and then forming a more accurate image of the target object.

[0063] In one embodiment, the light reflecting structure 130 may include a dam 131 and a light reflecting layer 132 .

[0064] The bank 131 extends along the thickness direction of the display panel 100. As an example, the cross-sectional view of the bank 131 may be a regular trapezoid or a triangle.

[0065] The reflective layer 132 covers the dam 131. As an example, the material of the reflective layer 132 may include metals such as copper and gold.

[0066] The light reflective structure 130 may be located on both sides of the photoelectric receiving structure 120, or the light reflective structure 130 may be located on both sides of the light emitting structure 110, or the light reflective structure 130 may be located on both sides of the photoelectric receiving structure 120 and both sides of the light emitting structure 110. It can be understood that when the light reflective structure 130 is located on both sides of the photoelectric receiving structure 120, the light reflective structure 130 may collect more reflected light directed to the photoelectric receiving structure 120 to the photoelectric receiving structure 120. When the light reflective structure 130 is located on both sides of the light emitting structure 110, the light reflective structure 130 may reflect the light emitted by the light emitting structure 110 and allow more light to irradiate the target object.

[0067] In this embodiment, the cross-sectional view of the dam 131 can be a regular trapezoid, and the reflective layer 132 covers the dam 131 , so that the reflective layer 132 can be continuous on the surface of the dam 131 , thereby facilitating the preparation of the reflective layer 132 .

[0068] In one embodiment, the display panel 100 further includes a pixel definition layer 150 and a first electrode 160 .

[0069] The pixel definition layer 150 is used to define the light emitting area and the light receiving area. The pixel definition layer 150 and the light emitting structure 110 are located on the same side of the substrate. As an example, the pixel definition layer 150 covers the planarization layer 140 and the conductive layer 141.

[0070] The pixel definition layer 150 includes a first opening 210 and a second opening 220 that are spaced apart, wherein the first opening 210 is used to define a light emitting area, and the second opening 220 is used to define a light receiving area. The light emitting structure 110 is located in the light emitting area, and the photoelectric receiving structure 120 is located in the light receiving area. At this time, the light reflecting structure 130 is located on the side of the pixel definition layer 150 away from the substrate.

[0071] The first electrode 160 can be used to power the light emitting structure 110 and the photoelectric receiving structure 120. As an example, the first electrode 160 can be an anode. The first electrode 160 penetrates the conductive layer 141 and is connected to the pixel circuit and other structures below the conductive layer 141. The pixel definition layer 150 partially covers the first electrode 160, and the first opening 210 and the second opening 220 expose the first electrode 160.

[0072] The reflective layer 132 of the light reflective structure 130 may cover the sidewalls of the first opening 210 and the second opening 220, and the reflective layer 132 may also cover the first electrode 160 exposed by the first opening 210 and the second opening 220. As an example, the material of the reflective layer 132 may be consistent with the material of the first electrode 160, both of which are conductive materials. At this time, the reflective layer 132 covers the bottom and sidewalls of the first opening 210 and the second opening 220, and at the same time, the reflective layer 132 is a conductive material and contacts the first electrode 160, which increases the control ability of the first electrode 160 over the light emitting structure 110 and the photoelectric receiving structure 120, and increases the light extraction efficiency of the light emitting structure 110 and the signal-to-noise ratio of the photoelectric receiving structure 120.

[0073] The following is an exemplary description of the preparation process of the light reflection structure 130. First, a substrate is provided. A planarization layer 140 and a conductive layer 141 are formed on the substrate in the same layer. Through holes are formed on the conductive layer 141 at intervals, and the through holes are filled with a conductive material, and a first electrode 160 covering a portion of the conductive layer 141 is formed. After that, a pixel definition material layer covering the planarization layer 140, the conductive layer 141 and the first electrode 160 is formed. The pixel definition material layer is etched to form a first opening 210 and a second opening 220, the first opening 210 and the second opening 220 expose a portion of the first electrode 160, and the remaining pixel definition material layer forms a pixel definition layer 150. Next, after forming a dam material layer covering the pixel definition layer 150, the excess dam material layer is removed to form a dam. Subsequently, a whole-surface deposition is performed to form a reflective material layer covering the dam, the pixel definition layer 150, the first opening 210 and the second opening 220. Finally, the reflective material layer partially covering the pixel definition layer 150 is removed (for example, the reflective material layer of the pixel definition layer 150 on both sides of the first dam opening 210 and the second dam opening 220 is removed) to prevent the reflective material layer from being conductive, and finally form the light reflection structure 130.

[0074] In this embodiment, first, the light reflecting structure 130 is arranged to be located on the side of the pixel definition layer 150 away from the substrate, so that the light reflecting structure 130 protrudes from the light-emitting structure 110 and the photoelectric receiving structure 120, so that the reflective layer 132 can reflect more light to the target object, or the reflective layer 132 can collect more reflected light directed to the photoelectric receiving structure 120 to the photoelectric receiving structure 120.

[0075] In one embodiment, the display panel 100 further includes a plurality of common film layers 170 .

[0076] The common film layer 170 is used to transfer electrons and charges. The common film layer 170 can cover the light-emitting layer 111 and the pixel definition layer 150. The common film layer 170 is shared by the light-emitting structure 110 and the photoelectric receiving structure 120, and the multi-layer common film layer 170 includes a partition common layer, which is partitioned between the light-emitting structure 110 and the photoelectric receiving structure 120.

[0077] The display panel 100 may include a first common layer 171 and a second common layer 172. The light emitting structure 110 includes a light emitting layer 111, and the light emitting layer 111 may be located in the first opening 210. The photoelectric receiving structure 120 includes an active layer 121. The active layer 121 may be located in the second opening 220. The first common layer 171 is located on a side of the light emitting layer 111 and the active layer 121 close to the substrate, and the second common layer 172 is located on a side of the light emitting layer 111 and the active layer 121 away from the substrate, and the partition common layer includes at least the first common layer 171. At this time, the first common layer 171 is partitioned. Of course, the partition common layer may also include the first common layer 171 and the second common layer 172. At this time, either the first common layer 171 or the second common layer 172 may be partitioned, or both may be partitioned.

[0078] The following is an exemplary description of the formation process of the light-emitting layer 111, the active layer 121, the first common layer 171 and the second common layer 172. First, after obtaining the above-mentioned structure with the first opening 210 and the second opening 220, the first common material layer (for example, the first common material layer may include a hole injection layer and a hole transport layer) is formed on the entire surface by vapor deposition, and the first common material layer covers the first opening 210 and the second opening 220. Afterwards, the light-emitting layer 111 is formed in the first opening 210, and the active layer 121 is formed in the second opening 220 by vapor deposition. Next, the second common material layer (for example, the second common material layer may include an electron injection layer and an electron transport layer) is formed on the entire surface by vapor deposition. Finally, the first common material layer and / or the second common material layer between the light-emitting structure 110 and the photoelectric receiving structure 120 are separated to form the first common layer 171 and the second common layer 172.

[0079] In this embodiment, by setting the common film layer 170 between the light emitting structure 110 and the photoelectric receiving structure 120 to include a partition common layer, the transfer of charges in the partition common layer is blocked, thereby reducing the possibility of the partition common layer lateral transmission of part of the charge (such as Fig.11 As shown), the influence of these charges on the photoelectric receiving structure 120 and the light-emitting structure 110 is reduced, the strength of the electrical signal actually converted by the photoelectric receiving structure 120 is increased, the signal-to-noise ratio of the photoelectric receiving structure 120 is increased, and the low grayscale display performance of the light-emitting structure 110 is improved.

[0080] In one embodiment, there is at least one partitioning groove 230 (undercut) between the light emitting structure 110 and the photoelectric receiving structure 120, and the partitioning common layer is partitioned by the partitioning groove 230. At this time, when the partitioning common layer is formed on the entire surface, part of the partitioning common layer is formed at the bottom of the partitioning groove 230, and part of the partitioning common layer is formed above the pixel definition layer 150, so that the partitioning common layer is partitioned by the partitioning groove 230.

[0081] The cross-sectional view of the partition groove 230 may be in an inverted trapezoidal shape, thereby avoiding the formation of a partition common layer on the side wall of the partition groove 230, and ensuring that the partition common layer is completely isolated by the partition groove 230. As an example, at this time, the partition groove 230 may extend from the reflective layer 132 to the inside of the pixel definition layer 150. Since the etching ratios of the reflective layer 132 and the pixel definition layer 150 are different, when the reflective layer 132 and the pixel definition layer 150 are continuously etched, the etching rates of the etching gas or the etching liquid in the reflective layer 132 and the pixel definition layer are different, thereby forming an inverted trapezoidal partition groove 230. During etching, dry etching or wet etching may be used. For example, dry etching may include at least any one of reactive ion etching, inductively coupled plasma etching or high concentration plasma etching.

[0082] There may be a plurality of partition grooves 230 between adjacent light emitting structures 110 and photoelectric receiving structures 120. For example, there may be two or three partition grooves 230 between adjacent light emitting structures 110 and photoelectric receiving structures 120. As an example, the side length of the upper opening of each partition groove 230 may be greater than μm, the depth of each partition groove 230 may be between 0.2 μm and 1 μm, and the spacing between adjacent partition grooves 230 may be greater than 2 μm. The above data are only used as examples. In actual embodiments, the size of the partition groove 230 is not limited to the above data.

[0083] In one embodiment, the display panel 100 further includes a filling structure 180 .

[0084] The filling structure 180 is used to fill the partitioning groove 230, so that when the second electrode 161 covers the partitioning common layer, the second electrode 161 can be continuous through the filling structure 180. For example, the first electrode 160 can be an anode, and the second electrode 161 can be a cathode.

[0085] In a possible example, the upper surface of the filling structure 180 may be higher than the upper surface of the partition groove 230. Of course, the upper surface of the filling structure 180 may also be flush with the upper surface of the partition groove 230, or the upper surface of the filling structure 180 may also be slightly lower than the upper surface of the partition groove 230.

[0086] In another possible example, the cross-sectional view of the portion of the filling structure 180 that exceeds the partition groove 230 is spherical or trapezoidal. It can be understood that the surface of the portion of the filling structure 180 that exceeds the partition groove 230 can be a relatively gentle slope with the upper surface of the partition groove 230, so as to facilitate the continuity of the second electrode 161 on the surface of the filling structure 180.

[0087] In yet another possible example, a plurality of partition grooves 230 may be provided between the light emitting structure 110 and the photoelectric receiving structure 120 , and the plurality of partition grooves 230 are filled with the same filling structure 180 , so as to facilitate the preparation of the filling structure 180 .

[0088] The following is an exemplary description of the preparation process of the filling structure 180. First, after obtaining the structure with the partition groove 230, an inkjet printing process (IJP) can be used to print the organic glue at the position, and then solidify it to form the filling structure 180. Alternatively, the organic glue can be formed on the entire surface first, and then the organic glue is patterned by a photolithography process to form the filling structure 180.

[0089] In this embodiment, the filling structure 180 that fills the partition groove 230 is formed to facilitate the preparation of the second electrode 161 , so that the second electrode 161 can be continuous through the filling structure 180 , and multiple light-emitting structures 110 can share the second electrode 161 .

[0090] After forming the filling structure 180 , the display panel 100 may be packaged, for example, by forming a thin film encapsulation 190 (TFE) or an atomic layer deposition (ALD) on the obtained structure, thereby forming a packaged panel.

[0091] In one embodiment, see Figures 7 to 9 A roof structure 181 (Roof) is provided between the light emitting structure 110 and the photoelectric receiving structure 120 , and the partition common layer is separated by the roof structure 181 .

[0092] like Figure 7 and Figure 8 As shown, in Figure 7 In the obtained structure, part of the reflective layer 132 and part of the first electrode 160 between the adjacent light emitting structure 110 and the photoelectric receiving structure 120 are removed to form a groove. The eaves structure 181 can be located in the groove between the adjacent light emitting structure 110 and the photoelectric receiving structure 120.

[0093] In a possible example, the eaves structure 181 includes a cover plate 1811 and a column 1812 connected to each other, and the cross-sectional view of the eaves structure 181 is T-shaped. When forming a partition common layer, a part of the partition common layer can be formed above the cover plate 1811, so that no partition common layer is formed below the cover plate 1811 (within the orthographic projection of the cover plate 1811), so that the bottom of the eaves structure 181 is spaced from the partition common layer. Of course, the cross-sectional view of the eaves structure 181 can also be an inverted trapezoid or other graphics, which can achieve the effect of spacing the bottom of the eaves structure 181 from the partition common layer.

[0094] In another possible example, the eaves structure 181 includes a cover plate 1811, a column 1812 and a bottom plate 1813 connected to each other. The column 1812 is located between the cover plate 1811 and the bottom plate 1813, the bottom plate 1813 is close to the base plate, and the cover plate 1811 is far from the base plate. At this time, the orthographic projection of the column 1812 on the base plate is located within the orthographic projection of the cover plate 1811 on the base plate, and is located or within the orthographic projection of the bottom plate 1813 on the base plate. It can be understood that the cross-sectional view of the eaves structure 181 is I-shaped. At this time, the partition common layer is separated by the bottom plate 1813.

[0095] In this embodiment, the above-mentioned filling structure 180 may not be formed, and only the eaves structure 181 is used to realize that the second electrode 161 covers the partition common layer and overlaps with the eaves structure 181, thereby reducing the process steps for preparing the filling structure 180. As an example, the material of the column 1812 of the eaves structure 181 may include a conductive material, for example, the material of the column 1812 of the eaves structure 181 may include ITO, gold. Copper, etc. At the same time, the material of the bottom plate 1813 includes an insulating material, thereby further preventing the partition common layer on both sides of the bottom plate 1813 from being electrically connected. For example, the material of the bottom plate 1813 includes silicon dioxide, etc. At this time, by adjusting the evaporation angle of the partition common layer and the second electrode 161, the partition common layer is separated by the eaves structure 181, and the second electrode 161 can be overlapped by the column 1812 of the eaves structure 181, so that multiple light-emitting structures 110 can share the second electrode 161.

[0096] In a possible example, the dimension of the bottom plate 1813 along the thickness direction of the display panel 100 is greater than the dimension of the partition common layer along the thickness direction of the display panel 100. When the partition common layer is formed first, the partition common layer will not be higher than the bottom plate 1813, so that the partition common layer will not be formed on the surface of the bottom plate 1813, but will be lower than the height of the bottom plate 1813, ensuring that the partition common layer is partitioned by the bottom plate 1813, and ensuring that the partition common layer will not be electrically connected through the pillars 1812.

[0097] In addition, the display panel 100 may not be provided with the partition groove 230, and the eaves structure 181 is located on the pixel definition layer 150 between the light emitting structure 110 and the photoelectric receiving structure 120. At this time, when the partition common layer is formed, the partition common layer is partitioned by the eaves structure 181. Afterwards, in order to continue to form the dielectric layer and the second electrode 161, the dielectric layer can prevent the charges from crosstalking in the second electrode 161 and the partition common layer, thereby increasing the partition effect of the partition common layer.

[0098] The following is an exemplary description of the formation process of the eaves structure 181. First, three film layers with different etching ratios are formed. Then, the three film layers are continuously etched using etching gas or etching liquid. Due to the different etching ratios, the etching rates of the etching gas or etching liquid on the three film layers are different. Finally, an eaves structure 181 with an I-shaped cross-section can be formed.

[0099] Based on the same inventive concept, the present disclosure further provides a display device, which includes a display panel 100 formed by any one or more of the above embodiments.

[0100] It can be understood that the display device in the embodiments of the present application can be an OLED display device, a QLED display device, electronic paper, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, a wearable device, an Internet of Things device, or any other product or component with a display function, and the embodiments disclosed in the present application are not limited to this.

[0101] The display device provided by the present disclosure, by arranging the light reflection structure 130 between the light emitting structure 110 and the photoelectric receiving structure 120, the light emitted by the light emitting structure 110 is reflected by the light reflection structure 130, and is more irradiated to the target object, rather than being blocked by the absorption structure 200. Furthermore, the display device provided by the present disclosure can also improve the efficiency of the light received by the photoelectric receiving structure 120, increase the signal-to-noise ratio of the photoelectric receiving structure 120, thereby obtaining a more accurate electrical signal, and then forming a more accurate image of the target object.

[0102] The present disclosure provides one or more embodiments and combinations thereof that can be applied to technologies such as white organic light emitting diodes (White OLED, WOLED), quantum dot organic light emitting diodes (Quantum Dot OL light emitting structure ED, QD-OLED) and tandem OLED (Tandem OLED). The specific type of the light emitting structure 110 should not limit the protection scope of the present disclosure to provide one or more embodiments and combinations thereof.

[0103] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features of the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0104] The above-described embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: include: substrate; A light emitting structure, located on one side of the substrate; A photoelectric receiving structure, located on the same side of the substrate as the light emitting structure; The light reflecting structure is located between the light emitting structure and the photoelectric receiving structure.

2. The display panel according to claim 1, characterized in that: The light reflecting structure comprises a dam and a light reflecting layer covering the dam; Optionally, the dam is in the shape of a regular trapezoid; Optionally, the light reflecting structure is located on both sides of the photoelectric receiving structure, and / or the light reflecting structure is located on both sides of the light emitting structure.

3. The display panel according to claim 1, characterized in that: The display panel further includes: A pixel definition layer and the light-emitting structure are located on the same side of the substrate, and the pixel definition layer includes a first opening and a second opening, the first opening is used to define a light-emitting area, and the second opening is used to define a light-receiving area, the light-reflecting structure is located on a side of the pixel definition layer away from the substrate, the light-emitting structure is located in the light-emitting area, and the photoelectric receiving structure is located in the light-receiving area.

4. The display panel according to claim 3, characterized in that: The substrate includes a first electrode, the pixel definition layer partially covers the first electrode, and the first opening and the second opening expose the first electrode; The light reflection structure includes a dam and a light reflecting layer, wherein the light reflecting layer covers the dam, the material of the light reflecting layer is a conductive material, and the light reflecting layer also covers the side walls of the first opening and the second opening and the first electrode.

5. The display panel according to claim 1, characterized in that: The display panel further includes: A multi-layer common film layer is shared by the light emitting structure and the photoelectric receiving structure, and the multi-layer common film layer includes a partition common layer, and the partition common layer partitions between the light emitting structure and the photoelectric receiving structure. Optionally, the display panel includes a first common layer and a second common layer, the light-emitting structure includes a light-emitting layer, the photoelectric receiving structure includes an active layer, the first common layer is located on a side of the light-emitting layer and the active layer close to the substrate, the second common layer is located on a side of the light-emitting layer and the active layer away from the substrate, and the partition common layer includes at least the first common layer.

6. The display panel according to claim 5, characterized in that: There is at least one partition groove between the light emitting structure and the photoelectric receiving structure, and the partition common layer is partitioned by the partition groove; Optionally, the partition groove is in an inverted trapezoidal shape.

7. The display panel according to claim 6, characterized in that: The display panel further includes: A filling structure to fill the partition groove; A second electrode covering the common film layer and the filling structure; Optionally, the upper surface of the filling structure is higher than the upper surface of the partition groove, and the portion of the filling structure that exceeds the partition groove is spherical or regular trapezoidal; Optionally, a plurality of partition grooves are provided between the light emitting structure and the photoelectric receiving structure, and the plurality of partition grooves are filled with the same filling structure.

8. The display panel according to claim 5, characterized in that: An eaves structure is provided between the light emitting structure and the photoelectric receiving structure, and the partition common layer is partitioned by the eaves structure.

9. The display panel according to claim 8, characterized in that: The multiple common film layers are all partition common layers, and the display panel includes a second electrode, which covers the common film layers and overlaps with the eaves structure; Optionally, the bottom of the eaves structure is spaced apart from the common membrane layer; Optionally, the eaves structure comprises a cover plate, a column and a bottom plate connected to each other, the column is located between the cover plate and the bottom plate, the bottom plate is close to the base plate, the cover plate is far from the base plate, the orthographic projection of the column on the base plate is located within the orthographic projection of the cover plate on the base plate, and is located at or within the orthographic projection of the bottom plate on the base plate; Optionally, the material of the base plate includes insulating material; Optionally, a dimension of the bottom plate along a thickness direction of the display panel is greater than a dimension of the partition common layer along the thickness direction of the display panel.

10. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 9.

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