Driving assembly, camera module and multi-camera camera module

Abstract

According to the driving assembly, the camera module and the multi-camera camera module, a photosensitive assembly of the camera module is arranged in an eccentric mode relative to the center of the driving assembly used for driving the photosensitive assembly, so that one side of a photosensitive chip of the photosensitive assembly is closer to the edge of mobile electronic equipment; therefore, the appearance and function requirements of the mobile electronic equipment are met, for example, a screen opening, corresponding to the camera module, of the mobile electronic equipment is closer to the edge of the mobile electronic equipment, and the screen of the mobile electronic equipment is more complete.

Description

Drive components, camera modules and multi-camera modules Technical Field

[0001] The present application relates to the field of camera modules, and in particular to a driving component, a camera module and a multi-camera module. Background Art

[0002] With the increasing popularity of mobile electronic devices, the technology behind camera modules used in these devices to help users capture images has rapidly developed and progressed. Currently, consumers are demanding increasingly advanced and diverse features in camera modules for mobile devices (e.g., smartphones), such as image stabilization.

[0003] When using mobile electronic devices to record videos, the camera effect will be reduced due to the physiological tremors of a certain frequency that normally exist in the human body and the shaking caused by movement. Therefore, mobile electronic devices are usually equipped with anti-shake motors to drive the optical lens and / or photosensitive chip to move to achieve the anti-shake function.

[0004] As the demand for camera module image quality continues to rise, the size and weight of optical lenses are increasing, and the driving force required for anti-shake motors is also increasing. Current mobile electronic devices also have significant limitations on the size of camera modules, and the volume occupied by anti-shake motors increases accordingly with the size of lenses. In other words, as optical lenses tend to become larger and heavier, the driving force provided by anti-shake motors is difficult to increase accordingly.

[0005] Under the premise of limited driving force, the heavier the lens, the shorter the travel of the anti-shake motor can drive the optical lens, affecting the anti-shake performance. On the other hand, the heavier the optical lens, the slower the anti-shake motor can drive the optical lens, and the longer the optical lens takes to reach the predetermined compensation position, which also affects the anti-shake effect.

[0006] In order to overcome the above-mentioned defects, the applicant has proposed a driving component that drives the photosensitive chip to move to achieve the purpose of optical image stabilization.

[0007] Summary of the Invention

[0008] One advantage of the present application is that it provides a driving component, a camera module and a multi-camera module, wherein the driving component can achieve optical image stabilization by driving the photosensitive chip to move, so as to meet the requirements of optical image stabilization for driving stroke and driving speed, and the camera module meets its application requirements in mobile electronic devices by reasonably designing the positional relationship between the driving component and the photosensitive component.

[0009] One advantage of the present application is that it provides a driving component, a camera module and a multi-camera module, wherein the driving component can achieve optical image stabilization by driving the photosensitive chip to move, so as to meet the requirements of optical image stabilization for driving stroke and driving speed, and the camera module can reasonably arrange the magnetic elements in its driving component so that different magnetic elements can play different roles.

[0010] Another advantage of the present application is that it provides a driving component, a camera module and a multi-camera module, wherein the photosensitive component of the camera module is arranged in an eccentric manner relative to the center of the driving component, so that one side of the photosensitive chip of the photosensitive component is closer to the edge of the mobile electronic device to meet the appearance and functional requirements of the mobile electronic device, for example, the screen opening of the mobile electronic device corresponding to the camera module is closer to the edge of the mobile electronic device, thereby making the screen of the mobile electronic device more complete.

[0011] Other advantages and features of the present application will become apparent from the following description, and may be achieved by means of the instruments and combinations particularly pointed out in the claims.

[0012] To achieve at least one of the above advantages, according to one aspect of the present application, the present application provides a drive assembly, comprising:

[0013] A chip anti-shake fixing portion having a receiving cavity;

[0014] a chip anti-shake movable portion movably received in the receiving cavity, the chip anti-shake movable portion comprising a chip movable carrier, the chip movable carrier being suitable for mounting a photosensitive component thereon, the photosensitive component having a first central axis; and

[0015] a chip driving element for driving the chip movable carrier of the chip anti-shake movable part to move relative to the chip fixing part within the receiving cavity;

[0016] The drive assembly has a second central axis, and the first central axis is offset from the second central axis.

[0017] In the driving assembly according to the present application, the photosensitive assembly includes a photosensitive chip, and the central axis of the photosensitive chip is the first central axis of the photosensitive assembly.

[0018] In the driving assembly according to the present application, the photosensitive assembly includes a photosensitive chip, and the photosensitive chip is arranged in an eccentric manner relative to the center of the driving assembly.

[0019] In the driving component according to the present application, the photosensitive component is suitable for being installed on the chip movable carrier, wherein the chip anti-shake fixing part includes an upper cover and a base that are interlocked to form the accommodating cavity, and there is a gap between the chip movable carrier and the base.

[0020] In the driving component according to the present application, the driving component also includes a chip holding component, and the chip holding component includes at least one chip magnetic attraction element enclosed in the chip movable carrier, wherein the chip driving component includes a chip coil component arranged on the chip movable carrier, and a chip magnet component fixed to the upper cover and corresponding to the chip coil component, so that the chip movable carrier is suspended in the receiving cavity of the chip anti-shake fixing part through the magnetic attraction force between the chip magnet component and the at least one chip magnetic attraction element.

[0021] In the driving component according to the present application, the chip coil component includes at least one chip coil, and the driving component also includes a chip anti-shake conductive part, and the chip anti-shake conductive part includes at least one coil conductive element enclosed in the chip anti-shake movable carrier, each of the coil conductive elements has an exposed first coil conductive end, an exposed second coil conductive end opposite to the first coil conductive end, and a coil conductive extension part extending between the first coil conductive end and the second coil conductive end, wherein at least one chip coil is electrically connected to the first coil conductive end, and the second coil conductive end is suitable for electrically connecting to the circuit board of the photosensitive component.

[0022] In the driving component according to the present application, the chip coil component also includes a coil circuit board arranged on the movable chip carrier, the at least one chip coil is fixed and electrically connected to the coil circuit board, and the coil circuit board is electrically connected to the conductive end of the first coil.

[0023] In the driving component according to the present application, the chip holding component also includes a chip support component arranged between the chip movable carrier and the upper cover, and the chip support component includes a ball groove recessedly formed in the chip movable carrier and a ball arranged in the ball groove, wherein the ball is clamped between the upper cover and the chip movable carrier through the magnetic attraction force between the at least one chip magnetic attraction element and the chip magnet component.

[0024] In the driving assembly according to the present application, the chip support assembly further includes a ball support sheet embedded in the movable chip carrier and located at the bottom of the ball groove, and the ball is supported on the ball support sheet.

[0025] In the driving assembly according to the present application, the coil conductive element and the ball support plate do not have magnetic conductivity, and the chip magnetic element has magnetic conductivity.

[0026] In the driving assembly according to the present application, the coil conductive element, the ball support sheet and the chip magnetic element are integrally formed with the chip movable carrier through an injection molding process.

[0027] In the driving component according to the present application, the chip driving element includes a chip coil component arranged on the chip movable carrier, and a chip magnet component fixed to the upper cover and corresponding to the chip coil component, wherein the chip coil component includes at least one chip coil group, and the chip coil group is not arranged on at least one side of the chip movable carrier.

[0028] In the driving component according to the present application, the chip movable carrier includes a first side, a second side, a third side and a fourth side that are enclosed with each other, the first side is opposite to the third side, and the second side is opposite to the fourth side, wherein the chip coil component includes a first chip coil group arranged on the first side, and a second chip coil group and a third chip coil group arranged on the opposite second side and the fourth side.

[0029] In the driving assembly according to the present application, the distance between the first central axis of the photosensitive chip and the third side of the chip movable carrier is smaller than the distance between the first central axis of the photosensitive chip and the first side of the chip movable carrier.

[0030] In the driving component according to the present application, the first side and the third side extend along the X-axis direction set by the driving component, and the second side and the fourth side extend along the Y-axis direction set by the driving component, and the Y-axis direction is perpendicular to the X-axis direction, wherein the first chip coil group includes a first chip coil and a second chip coil arranged on the first side, the second chip coil group includes a third chip coil arranged on the second side, and the third chip coil group includes a fourth chip coil arranged on the fourth side.

[0031] In the driving assembly according to the present application, the first chip coil and the second chip coil are arranged relatively parallel along the X-axis direction, and the third chip coil and the fourth chip coil are arranged relatively parallel along the Y-axis direction.

[0032] According to one aspect of the present application, the present application provides a drive assembly, comprising:

[0033] A chip anti-shake fixing portion having a receiving cavity;

[0034] A chip anti-shake movable part movably received in the receiving cavity, the chip anti-shake movable part being suitable for mounting a photosensitive component thereon;

[0035] a chip driving element for driving the chip anti-shake movable portion to move relative to the chip fixing portion within the receiving cavity;

[0036] a chip support assembly, comprising at least three support assemblies clamped between the chip anti-shake movable portion and the chip anti-shake fixed portion, wherein the at least three support assemblies are arranged in a non-completely collinear manner; and

[0037] The chip magnetic component includes a first chip magnetic element and a second chip magnetic element arranged on the chip anti-shake movable part, wherein the first chip magnetic element is adjacent to the first support component of the at least three support components, and the distance between the second chip magnetic element and any support component of the at least three support components is greater than the distance between the first chip magnetic element and the first support component.

[0038] In the driving assembly according to the present application, the chip anti-shake movable part includes a chip movable carrier, and the photosensitive assembly is suitable for being mounted on the chip movable carrier.

[0039] In the driving component according to the present application, the chip movable carrier includes a first side, a second side, a third side and a fourth side that are enclosed with each other, the first side is opposite to the third side, and the second side is opposite to the fourth side, wherein the chip support component includes a first support component, a second support component and a third support component, the first support component is arranged on the first side of the chip movable carrier, the second support component and the third support component are arranged at two corner areas of the third side of the chip movable carrier opposite to the first side, and the first support component is arranged in the middle area of ​​the first side.

[0040] In the driving component according to the present application, the chip magnetic component includes a pair of first chip magnetic elements, and the pair of first chip magnetic elements are arranged on opposite sides of the first supporting component, wherein the chip magnetic component includes a pair of second chip magnetic elements, one second chip magnetic element is arranged in the middle area of ​​the second side, and the other second chip magnetic element is arranged in the middle area of ​​the fourth side.

[0041] In the driving assembly according to the present application, the size of the first chip magnetic attraction element is larger than the size of the second chip magnetic attraction element.

[0042] In the driving component according to the present application, the chip magnetic component further includes a pair of third chip magnetic elements, one of the third chip magnetic elements is adjacent to the second supporting component, and the other of the third magnetic elements is adjacent to the third supporting component.

[0043] In the driving assembly according to the present application, a pair of the first chip magnetic elements, a pair of the second chip magnetic elements, and a pair of the third chip magnetic elements are coated on the chip movable carrier.

[0044] In the driving assembly according to the present application, each of the first supporting assembly, the second supporting assembly and the third supporting assembly includes a ball groove recessedly formed in the movable chip carrier and a ball arranged in the ball groove, and the ball protrudes from the ball groove.

[0045] In the driving assembly according to the present application, the movable chip carrier further includes three extension columns protrudingly formed on the upper surface of the chip carrier body, and the ball groove is recessedly formed on the upper surface of each of the extension columns.

[0046] In the driving assembly according to the present application, each of the supporting assemblies further includes a ball support sheet embedded in the movable chip carrier and located at the bottom of the ball groove, and the balls are supported on the ball support sheet.

[0047] In the driving component according to the present application, the chip driving element includes a chip coil component arranged on the chip movable carrier, and a chip magnet component fixed to the chip anti-shake fixing part and corresponding to the chip coil component, wherein the chip magnet component includes a pair of first chip magnets corresponding to a pair of the first chip magnetic elements respectively and a pair of second chip magnets corresponding to a pair of the second chip magnetic elements respectively.

[0048] In the driving component according to the present application, the chip coil component includes at least one chip coil group, and the chip coil group is not set on at least one side of the chip movable carrier, wherein the chip coil component includes a first chip coil group set on the first side, and a second chip coil group and a third chip coil group set on the opposite second side and the fourth side.

[0049] In the driving component according to the present application, the driving component also includes a chip anti-shake conductive part, and the chip anti-shake conductive part includes at least one coil conductive element enclosed in the chip anti-shake movable carrier, each of the coil conductive elements has an exposed first coil conductive end, a second coil conductive end opposite to the first coil conductive end and exposed, and a coil conductive extension part extending between the first coil conductive end and the second coil conductive end, wherein at least one chip coil is electrically connected to the first coil conductive end, and the second coil conductive end is suitable for electrically connecting to the circuit board of the photosensitive component.

[0050] In the driving component according to the present application, the chip coil component also includes a coil circuit board arranged on the movable carrier of the chip, the first chip coil group, the second chip coil group and the third chip coil group are fixed and electrically connected to the coil circuit board, and the coil circuit board is electrically connected to the conductive end of the first coil.

[0051] In the driving assembly according to the present application, the coil conductive element and the ball support sheet do not have magnetic conductivity, and the chip magnetic element has magnetic conductivity.

[0052] In the driving assembly according to the present application, the coil conductive element, the ball support sheet and the chip magnetic element are integrally formed with the chip movable carrier through an injection molding process.

[0053] According to another aspect of the present application, the present application also provides a camera module, which includes: the driving component as described above.

[0054] According to another aspect of the present application, the present application also provides a multi-camera module, which includes:

[0055] a first camera module; and

[0056] Second camera module;

[0057] Among them, at least one camera module among the first camera module and the second camera module includes the driving component as described above.

[0058] In the multi-camera module according to the present application, no chip driving element is set on the first side of the driving component of the first camera module, and no chip driving element is set on the second side of the driving component of the second camera module, wherein the first side of the driving component of the first camera module and the second side of the driving component of the second camera module are adjacent.

[0059] Further objectives and advantages of the present application will be fully reflected through understanding of the following description and drawings.

[0060] These and other objects, features and advantages of the present application are fully reflected in the following detailed description, drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] The above and other purposes, features, and advantages of the present application will become more apparent through a more detailed description of the embodiments of the present application in conjunction with the accompanying drawings. The accompanying drawings are intended to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0062] FIG1A illustrates an application schematic diagram of a single-camera module according to an embodiment of the present application.

[0063] FIG1B illustrates a schematic diagram of an application of a multi-camera module according to an embodiment of the present application.

[0064] FIG2 illustrates a schematic structural diagram of a camera module according to an embodiment of the present application.

[0065] FIG3 illustrates a schematic diagram of a partial structure of a camera module according to an embodiment of the present application.

[0066] FIG4 illustrates a partial explosion diagram of a camera module according to an embodiment of the present application.

[0067] FIG5 illustrates another partial structural schematic diagram of a camera module according to an embodiment of the present application.

[0068] FIG6 illustrates a schematic diagram of a partial structure of a driving component of a camera module according to an embodiment of the present application.

[0069] FIG7 illustrates another partial structural schematic diagram of the driving component of the camera module according to an embodiment of the present application.

[0070] FIG8 illustrates another partial explosion diagram of the camera module according to an embodiment of the present application.

[0071] FIG9 illustrates another partial structural schematic diagram of the driving component of the camera module according to an embodiment of the present application.

[0072] FIG10 illustrates another partial schematic diagram of the driving component of the camera module according to an embodiment of the present application.

[0073] Figure 11 illustrates a partial disassembled schematic diagram of the driving component of the camera module according to an embodiment of the present application.

[0074] FIG12 illustrates another partial structural schematic diagram of a camera module according to an embodiment of the present application.

[0075] Figure 13A illustrates another partial structural schematic diagram of the driving component of the camera module according to an embodiment of the present application.

[0076] Figure 13B illustrates another partial structural schematic diagram of the driving component of the camera module according to an embodiment of the present application.

[0077] Figure 14A illustrates a schematic diagram of the structural force analysis of the driving component of the camera module according to an embodiment of the present application.

[0078] Figure 14B illustrates another structural force analysis diagram of the driving component of the camera module according to an embodiment of the present application.

[0079] Figure 14C illustrates another structural force analysis diagram of the driving component of the camera module according to an embodiment of the present application.

[0080] Figure 15 illustrates a schematic diagram of the partial structure of the driving component of the multi-camera module according to an embodiment of the present application.

[0081] Figure 16 illustrates a schematic structural diagram of a multi-camera module according to an embodiment of the present application.

[0082] Figure 17 illustrates a partial explosion diagram of a camera module according to an embodiment of the present application.

[0083] FIG18 illustrates another partial structural schematic diagram of a camera module according to an embodiment of the present application.

[0084] FIG19 illustrates another partial explosion diagram of the camera module according to an embodiment of the present application.

[0085] Figure 20 illustrates another partial structural schematic diagram of the driving component of the camera module according to an embodiment of the present application.

[0086] Figure 21 illustrates a partial disassembly schematic diagram of the driving component of the camera module according to an embodiment of the present application.

[0087] Figure 22 illustrates another partial structural schematic diagram of the camera module according to an embodiment of the present application.

[0088] Figure 23 illustrates another partial structural schematic diagram of the driving component of the camera module according to an embodiment of the present application.

[0089] Figure 24 illustrates a schematic diagram of the structural force analysis of the driving component of the camera module according to an embodiment of the present application.

[0090] Figure 25 illustrates another structural force analysis diagram of the driving component of the camera module according to an embodiment of the present application.

[0091] Figure 26 illustrates another structural force analysis diagram of the driving component of the camera module according to an embodiment of the present application.

[0092] Figure 27 illustrates a schematic diagram of the partial structure of the driving component of the multi-camera module according to an embodiment of the present application. DETAILED DESCRIPTION

[0093] Below, the exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the exemplary embodiments described herein.

[0094] Exemplary electronic devices

[0095] As shown in Figures 1A and 1B, the present application provides a mobile electronic device equipped with at least one camera module 1 and a camera module 1 applicable to the mobile electronic device, wherein the camera module 1 has optical focus and / or optical image stabilization functions, so that the camera module 1 can capture clearer images. The number and specific installation positions of the camera modules 1 are not limited by the present application. For example, in one embodiment of the present application, the mobile electronic device is equipped with one camera module 1, and in another embodiment, the mobile electronic device is equipped with multiple (two or more) camera modules 1. The camera module 1 can be arranged on the front of the mobile electronic device as the front camera module 1 of the mobile electronic device, and can also be arranged on the back of the mobile electronic device as the rear camera module 1 of the mobile electronic device.

[0096] In one embodiment of the present application, when there is only one camera module 1 on the front and / or back of the mobile electronic device, the optical lens 10 and the photosensitive chip 42 of the camera module 1 are eccentrically arranged in the camera module 1 so that the camera module 1 is in an eccentric state. This arrangement makes the optical lens 10 and the photosensitive chip 42 of the camera module 1 closer to one side of the mobile electronic device, and thus the screen opening of the mobile electronic device is closer to one side of the mobile electronic device, such as the top side, left side or right side.

[0097] In another embodiment of the present application, when two camera modules 1 are provided on the front and / or back of the mobile electronic device, the two optical lenses 10 and two photosensitive chips 42 of the two camera modules 1 are eccentrically arranged in the dual-camera module so that the two optical lenses 10 of the dual-camera module are as close as possible to enhance optical function. The two camera modules 1 may have the same structure or different structures, and this application does not impose any restrictions on this.

[0098] In summary, the present application provides a camera module 1 with an eccentric optical lens 10 and a photosensitive chip 42, combined with a drive motor to drive the optical lens 10 and / or the photosensitive chip 42 to move. On the one hand, it can meet the structural design requirements of mobile electronic devices, and on the other hand, it can enhance optical performance and realize the optical focus and / or optical image stabilization functions of the camera module 1. Below, the camera module 1 proposed in this application will be described in detail with reference to the accompanying drawings.

[0099] Exemplary camera module

[0100] As shown in Figure 2, a camera module 1 according to an embodiment of the present application is illustrated, and the camera module 1 includes a photosensitive component 40, an optical lens 10 held on the photosensitive path of the photosensitive component 40, and a driving component for driving the optical lens 10 and / or the photosensitive component 40 to move to achieve optical performance adjustment, such as optical image stabilization, optical focus, etc.

[0101] Correspondingly, the optical lens 10 includes a lens barrel 11 and a lens group 12 installed in the lens barrel 11. The lens group 12 includes at least one optical lens. The number of the at least one optical lens can be one or more and is not limited.

[0102] The driving component includes a chip driving motor 30, and the chip driving motor 30 is suitable for driving the photosensitive component 40 to translate and / or rotate, thereby realizing the chip anti-shake function of the camera module 1. The chip driving motor 30 includes a chip anti-shake fixed part 31, a chip anti-shake movable part 33, a chip driving element 32 and a chip driving conductive part (i.e., a chip anti-shake conductive part 35). The chip anti-shake fixed part 31 has a receiving cavity to accommodate the chip anti-shake movable part 33, the chip driving element 32 and the chip anti-shake conductive part 35. The chip anti-shake conductive part 35 provides current to the chip driving element 32, and the chip driving element 32 is used to drive the chip anti-shake movable part 33 to move relative to the chip anti-shake fixed part 31. The photosensitive component 40 is fixed to the chip anti-shake movable part 33, so that the chip driving element 32 drives the photosensitive component 40 to move relative to the chip anti-shake fixed part 31.

[0103] The drive assembly also includes a lens drive motor 20, which is adapted to drive the optical lens 10 to translate and / or rotate, thereby achieving functions such as lens focusing and lens anti-shake of the camera module 1. The lens drive motor 20 includes a fixed lens drive portion, a movable lens drive portion, a lens drive element, and a conductive lens drive portion. The fixed lens drive portion has a housing for accommodating the movable lens drive portion, the lens drive element, and the conductive lens drive portion. The conductive lens drive portion provides driving power to the lens drive element, and the lens drive element is configured to drive the movable lens drive portion to move relative to the fixed lens drive portion. The optical lens 10 is fixed to the movable lens drive portion, so that the lens drive element drives the optical lens 10 to move relative to the fixed lens drive portion. For example, the lens drive element drives the optical lens 10 to move along its optical axis to achieve lens focusing, or drives the optical lens 10 to translate in a direction perpendicular to its optical axis or to rotate about a direction perpendicular to its optical axis to achieve lens anti-shake. The lens driving motor 20 fixes the lens driving fixing part to the chip anti-shake fixing part 31 of the chip driving motor 30 , so that the optical lens 10 is set on the light sensing path of the photosensitive component 40 .

[0104] In one embodiment of the present application, the lens driving motor 20 is not provided in the camera module 1, and the optical lens 10 is directly mounted on the chip anti-shake fixing part 31 of the chip driving motor 30, or the optical lens 10 is indirectly mounted on the chip anti-shake fixing part 31 of the chip driving motor 30 through a support member, so that the optical lens 10 is set on the photosensitive path of the photosensitive component 40.

[0105] As shown in Figure 2, the photosensitive component 40 includes a circuit board 41, a photosensitive chip 42 electrically connected to the circuit board 41, and an electronic component 43. The photosensitive chip 42 is used to receive the external light imaging collected by the optical lens 10 and is electrically connected to the external mobile electronic device through the circuit board 41. In one embodiment of the present application, the electronic component 43 can be one or more of passive electronic devices such as resistors and capacitors and active electronic devices such as driver chips and memory chips. The electronic component 43 can be electrically connected to the front of the circuit board 41 or to the back of the circuit board 41, depending on the design requirements of the camera module 1.

[0106] The photosensitive chip 42 is directly or indirectly fixed to the circuit board 41. The photosensitive chip 42 includes a photosensitive area and a non-photosensitive area. The photosensitive chip 42 is electrically connected to the circuit board 41 through a chip pad located in the non-photosensitive area. For example, the photosensitive chip 42 can be electrically connected to the circuit board 41 through wire bonding (gold wire), welding, FC process (chip flip-chip) or RDL (rewiring layer technology).

[0107] In one embodiment of the present application, the circuit board 41 includes a circuit board body 411 and a connecting tape 412. The connecting tape 412 is connected to and electrically connected to the circuit board body 411, thereby transmitting imaging information acquired by the photosensitive chip 42 to an external mobile electronic device through the circuit board body 411 and the connecting tape 412.

[0108] In a specific embodiment of the present application, the connecting strip 412 includes a first connecting strip 4121 and a second connecting strip 4122. The first connecting strip 4121 and the second connecting strip 4122 extend outward from opposite sides of the circuit board body 411, and further bend upward and laterally to electrically connect the first connecting strip 4121 and the second connecting strip 4122. This arrangement can ensure that the circuit board body 411 remains stable during movement, further reducing the resistance when driving the circuit board 411 to move. Of course, in another specific example of the present application, the first connecting strip 4121 and the second connecting strip 4122 can extend outward from adjacent sides of the circuit board body 411 and bend upward, and this application is not limited to this.

[0109] The photosensitive component 40 further includes a filter element 44, which is retained on the photosensitive path of the photosensitive chip 42 and is used to filter the imaging light entering the photosensitive chip 42. In a specific example, the filter element 44 is mounted and fixed to the base 45 of the photosensitive component 40 and corresponds to at least a portion of the photosensitive area of ​​the photosensitive chip 42. The filter element 44 can be attached to the base 45 either upright or upside down. The base 45 has a light hole, so that the light from the optical lens 10 can pass through the light hole of the base 45 and enter the photosensitive chip 42.

[0110] The photosensitive component 40 can be fixed to the chip anti-shake movable part 33 of the chip driving motor 30 through the circuit board 41 (the circuit board body 411) or the base 45, so that the photosensitive component 40 moves with the movement of the chip anti-shake movable part 33.

[0111] Exemplary Chip Driven Motor

[0112] 3 to 13 show an embodiment of a chip drive motor 30 of the present application. The chip drive motor 30 includes a chip anti-shake fixed portion 31 , a chip anti-shake movable portion 33 , a chip drive element 32 , and a chip anti-shake conductive portion 35 .

[0113] The chip driver element 32 is disposed between the chip anti-shake movable portion 33 and the chip anti-shake fixed portion 31 in a manner of connecting the chip anti-shake movable portion 33 and the chip anti-shake fixed portion 31 respectively. The chip anti-shake conductive portion 35 electrically connects the chip driver element 32 and the photosensitive component 40 and provides a driving power supply to the chip driver element 32 to drive the chip anti-shake movable portion 33 to translate in the X-axis direction (i.e., the direction set by the X-axis) and the Y-axis direction (i.e., the direction set by the Y-axis) and / or rotate around the Z-axis direction (i.e., the direction set by the Z-axis) to achieve translational anti-shake and / or rotational anti-shake of the photosensitive component 40. It is worth mentioning that in the embodiment of the present application, the X-axis direction and the Y-axis direction are perpendicular to each other, the Z-axis direction is perpendicular to the plane in which the X-axis direction and the Y-axis direction are located, and the Z-axis direction is also the direction of the optical axis of the optical lens 10. In other words, the X-axis, Y-axis, and Z-axis constitute a three-dimensional coordinate system, and the XOY plane in which the X-axis direction and the Y-axis direction are located is also called the plane in which the horizontal direction is located.

[0114] As shown in Figures 3 and 4, in one embodiment of the present application, the chip anti-shake fixing part 31 includes an upper cover 311 and a base 312 that are fastened to each other to form the receiving cavity. The upper cover 311 and the base 312 are fixed to each other and form a receiving cavity (that is, the receiving cavity of the chip anti-shake fixing part 31) to accommodate the chip anti-shake movable part 33, the chip driving element 32, the chip anti-shake conductive part 35, and the photosensitive component 40 and other camera module components, which can not only protect the above-mentioned camera module components, but also reduce dust, dirt or stray light from entering the interior of the chip driving motor 30. In a specific example of the present application, the material of the upper cover 311 and the base 312 can be a metal material such as non-magnetic stainless steel.

[0115] Specifically, in the embodiment of the present application, the upper cover 311 is disposed above the base 312. The upper cover 311 includes a cover body 3111 having an opening in the center. The opening corresponds to the photosensitive component 40, so that light can enter the photosensitive component 40 through the opening to form an image. Preferably, the opening is circular. Furthermore, the upper cover 311 may also include a cover body peripheral side 3112 extending integrally from the cover body 3111 toward the base 312, so that the cover body peripheral side 3112 is fixedly connected to the base 312 via the cover body peripheral side 3112, for example, by laser welding or bonding with an adhesive medium. The cover body peripheral side 3112 also includes at least one peripheral recess 31121. In this way, at least one connecting strip 412 outlet is formed between the upper cover 311 and the base 312, allowing the connecting strip 412 of the circuit board 41 to extend outward from the accommodating cavity of the chip anti-shake fixing portion 31. In a specific example of the present application, the peripheral side 3112 of the cover body includes two relatively arranged peripheral recesses 31121, and two connecting belt 412 outlets are formed between the upper cover 311 and the base 312 to allow the first connecting belt 4121 and the second connecting belt 4122 of the circuit board 41 to extend outward from the accommodating cavity of the chip anti-shake fixing part 31.

[0116] In the embodiment of the present application, the chip anti-shake movable part 33 is movably received in the receiving cavity of the chip anti-shake fixed part 31. Specifically, the chip anti-shake movable part 33 is suspended or suspended in the receiving cavity of the chip anti-shake fixed part 31, so that the chip anti-shake movable part 33 can move relative to the chip anti-shake fixed part 31.

[0117] As shown in Figures 4 to 6, the chip anti-shake movable part 33 includes a chip movable carrier 331 having opposite upper and lower surfaces. The chip driving element 32 is provided between the chip movable carrier 331 and the upper cover 311, and the chip driving element 32 drives the chip movable carrier 331 to move relative to the chip anti-shake fixed part 31; the chip movable carrier 331 is suitable for mounting a photosensitive component 40 thereon, that is, the photosensitive component 40 is suitable for being mounted on the chip movable carrier 331. In one embodiment of the present application, the photosensitive component 40 is provided between the chip movable carrier 331 and the base 312, and the photosensitive component 40 is mounted on the chip movable carrier 331 via the circuit board 41, so that the photosensitive component 40 moves with the chip movable carrier 331. In an embodiment of the present application, there is a gap between the chip movable carrier 331 and the base 312, and there is also a certain air gap between the bottom surface of the photosensitive component 40 (that is, the side of the photosensitive component 40 close to the base 312) and the base 312. In this way, the movement of the photosensitive component 40 is not easily hindered by the base 312, thereby reducing the driving force requirement of the chip driving element 32. In other words, the photosensitive component 40 is suspended above the base 312.

[0118] In particular, in the embodiment of the present application, the photosensitive component 40 has a first central axis, the driving component has a second central axis, and the first central axis is offset from the second central axis. Specifically, the central axis of the photosensitive chip 42 of the photosensitive component 40 is the first central axis of the photosensitive component 40, the central axis of the chip driving motor 30 is the second central axis of the driving component, and the photosensitive chip 42 is arranged in an eccentric manner relative to the center of the driving component, that is, the photosensitive chip 42 of the photosensitive component 40 is arranged in an eccentric state in the chip driving motor 30, that is, the central axis of the photosensitive chip 42 of the photosensitive component 40 is arranged in an eccentric state, that is, the central axis of the photosensitive chip 42 of the photosensitive component 40 is arranged in an eccentric state, that is, the central axis of the photosensitive chip 42 is inconsistent with the central axis of the chip driving motor 30. (The central axis of the photosensitive chip 42 is the axis that passes through the intersection of the diagonals of the photosensitive chip 42 when viewed from above and is parallel to the Z-axis direction; the central axis of the chip driving motor 30 is the axis that passes through the intersection of the diagonals of the chip driving motor 30 when viewed from above and is parallel to the Z-axis direction).

[0119] As shown in Figure 6, the movable chip carrier 331 of the movable chip anti-shake unit 33 includes a fixed chip carrier body 3311 and a chip carrier side portion 3312. The circuit board 41 is fixed to the bottom surface of the chip carrier body 3311 (i.e., the side facing the base 312). The chip carrier body 3311 has a carrier body through hole 33111. The carrier body through hole 33111 is suitable for not only providing a light path for the photosensitive chip 42 of the photosensitive component 40, but also providing a mounting space for the electronic components 43 on the photosensitive component 40, preventing the electronic components 43 from interfering with the chip carrier body 3311. The chip carrier side portion 3312 includes a first carrier side portion 33121, a second carrier side portion 33122, a third carrier side portion 33123, and a fourth carrier side portion 33124 extending integrally outward from the chip carrier body 3311. The first carrier side portion 33121 is disposed opposite the third carrier side portion 33123 and is adjacent to the second carrier side portion 33122 and the fourth carrier side portion 33124. The second carrier side portion 33122 is disposed opposite the fourth carrier side portion 33124. The first carrier side portion 33121, the second carrier side portion 33122, the third carrier side portion 33123, and the fourth carrier side portion 33124 are adapted to serve as anti-collision components when the chip carrier body 3311 moves, preventing the chip carrier body 3311 from directly colliding with the chip anti-shake fixing portion 31.

[0120] In one embodiment of the present application, the chip carrier side 3312 (the first carrier side 33121, the second carrier side 33122, the third carrier side 33123 and the fourth carrier side 33124) further extends toward the side of the chip carrier body 3311, that is, the chip carrier side 3312 further extends outward from the outer periphery of the chip carrier body 3311, and the chip carrier side 3312 protrudes from the side wall of the chip carrier body 3311, so that the chip anti-shake movable part 33 collides with the chip anti-shake fixed part 31 through the chip carrier side 3312 during movement, thereby avoiding the chip carrier body 3311 where the photosensitive component 40 is set to directly collide with the chip anti-shake fixed part 31, thereby causing damage to the photosensitive component 40.

[0121] As shown in Figure 7, the photosensitive chip 42 is eccentrically disposed within the movable chip carrier 331, and the distances from the center O of the photosensitive chip 42 to the two opposite sides of the movable carrier are unequal. Alternatively, the photosensitive chip 42 is closer to at least one side of the movable chip carrier 331, that is, closer to at least one side of the chip drive motor 30. In a specific example of the present application, the photosensitive chip 42 of the photosensitive component 40 has a rectangular structure with long and wide sides. The edges of the photosensitive component 40 can be defined as a first side, a second side, a third side, and a fourth side. A rectangular coordinate system is established with the intersection of the diagonals of the photosensitive chip 42 as the center origin. The first and third sides are parallel to the X-axis, and the second and fourth sides are parallel to the Y-axis. Accordingly, the movable chip carrier 331 also has a first side, a second side, a third side, and a fourth side corresponding to the photosensitive component 40.

[0122] Among them, the distance from the center O of the photosensitive chip 42 to the first side of the chip movable carrier 331 is H1, and the distance from the center O of the photosensitive chip 42 to the third side of the chip movable carrier 331 is H2, H1>H2, that is, the distance between the first central axis of the photosensitive chip 42 and the third side of the chip movable carrier 331 is smaller than the distance between the first central axis of the photosensitive chip 42 and the first side of the chip movable carrier 331, and the photosensitive chip 42 is closer to the third side of the chip movable carrier 331 and away from the first side of the chip movable carrier 331. That is, the distance between the first central axis of the photosensitive chips 42A, 42B and the third side of the movable chip carrier 331A, 331B is smaller than the distance between the first central axis of the photosensitive chips 42A, 42B and the first side of the movable chip carrier 331A, 331B. The photosensitive chips 42A, 42B are closer to the third side of the movable chip carrier 331A, 331B and farther from the first side of the movable chip carrier 331A, 331B. For example, H1 ranges from 6 mm to 8 mm, and H2 ranges from 3 mm to 4 mm. Preferably, H1 is 7.14 mm and H2 is 3.74 mm.

[0123] Of course, in other embodiments of the present application, H1 < H2, that is, the photosensitive chip 42 is closer to the third side of the chip movable carrier 331 and farther from the first side of the chip movable carrier 331. This application does not impose any limitation on this.

[0124] The distance from the center O of the photosensitive chip 42 to the second side of the movable chip carrier 331 is H3, and the distance from the center O of the photosensitive chip 42 to the fourth side of the movable chip carrier 331 is H4. H3 can be equal to H4, H3 can be smaller than H4, or H3 can be larger than H4. In other words, the photosensitive chip 42 only needs to be closer to at least one side of the movable chip carrier 331, and this application does not impose any restrictions on this.

[0125] When the eccentric photosensitive chip 42 described in this application is applied to a single-camera module 1, especially when applied to a front-camera module 1, the side of the photosensitive chip 42 with a shorter distance to the chip driving motor 30 is arranged closer to a side of the mobile electronic device to facilitate meeting the appearance and functional requirements of the mobile electronic device, for example, so that the screen opening of the mobile electronic device corresponding to the camera module 1 is closer to the edge of the mobile electronic device, thereby making the screen of the mobile electronic device more complete.

[0126] As shown in Figures 5 and 8, the chip driving element 32 includes a chip magnet assembly 321 and a chip coil assembly 322, wherein the chip coil assembly 322 is disposed on the chip movable carrier 331 of the chip anti-shake movable part 33, and the chip magnet assembly 321 is fixed to the upper cover 311 of the chip anti-shake fixed part 31 and corresponds to the chip coil assembly 322. The chip magnet assembly 321 is fixed to the upper cover 311 of the chip anti-shake fixed part 31 by, for example, bonding with an adhesive medium, and the chip coil assembly 322 is fixed to the chip movable carrier 331 of the chip anti-shake movable part 33. The chip magnet assembly 321 and the chip coil assembly 322 are arranged opposite to each other, so that the chip anti-shake movable part 33 is driven to move relative to the chip anti-shake fixed part 31 by the magnetic field force between the chip coil assembly 322 and the chip magnet assembly 321. That is to say, in this application, the chip magnet assembly 321 is the stator, and the chip coil assembly 322 is the mover. This setting method can prevent the movement of the chip movable carrier 331 from being affected by magnetic interference, thereby avoiding affecting the chip anti-shake effect.

[0127] Further, the specific structure of the chip driver element 32 is described. Each chip coil assembly 322 includes at least one chip coil. Referring to FIG. 4 , in one embodiment of the present application, the chip coil assembly 322 is not provided on at least one side of the movable chip carrier 331. Specifically, the movable chip carrier 331 includes a first side, a second side, a third side, and a fourth side that surround each other. The first side is opposite the third side, and the second side is opposite the fourth side. The first and third sides extend along the X-axis direction set by the driver assembly, and the second and fourth sides extend along the Y-axis direction set by the driver assembly, with the Y-axis direction being perpendicular to the X-axis direction. The chip coil assembly 322 includes a first chip coil group 3221 provided on the first side, and a second chip coil group 3222 and a third chip coil group 3223 provided on the opposing second and fourth sides.

[0128] The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are arranged in the plane of the X-axis and the Y-axis. That is, the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are arranged horizontally. The first chip coil group 3221 is arranged along the X-axis, the second chip coil group 3222 is arranged along the Y-axis, and the third chip coil group 3223 is arranged along the Y-axis. The second chip coil group 3222 and the third chip coil group 3223 are arranged opposite each other along the Y-axis. Furthermore, the second chip coil group 3222 and the third chip coil group 3223 are symmetrical with respect to the Y-axis. The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are arranged around three sides of the photosensitive component 40.

[0129] The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 each include at least one chip coil. Specifically, the first chip coil group 3221 includes at least one chip coil, the second chip coil group 3222 includes at least one chip coil, and the third chip coil group 3223 includes at least one chip coil. For example, in a specific example of the present application, the first chip coil group 3221 includes a first chip coil 732211 and a second chip coil 732212 arranged on the first side, and the first chip coil 732211 and the second chip coil 732212 are arranged along the X-axis direction. Specifically, the first chip coil 732211 and the second chip coil 732212 are arranged relatively parallel along the X-axis direction; the second chip coil group 3222 includes a third chip coil 732221 arranged on the second side; the third chip coil group 3223 includes a fourth chip coil 732231 arranged on the fourth side; the third chip coil 732221 and the fourth chip coil 732231 are arranged relatively parallel along the Y-axis direction. In other words, the first chip coil 732211 and the second chip coil 732212 are arranged on the first side or the third side of the photosensitive component 40, and the third chip coil 732221 and the fourth chip coil 732231 are respectively arranged on the second side and the fourth side of the photosensitive component 40.

[0130] The first chip coil 732211 and the second chip coil 732212 work together to drive the chip anti-shake movable part 33 to move along the Y-axis direction and / or rotate around the Z-axis direction, and the third chip coil 732221 and the fourth chip coil 732231 work together to drive the chip anti-shake movable part 33 to move along the X-axis direction.

[0131] Preferably, the first chip coil 732211 and the second chip coil 732212 have the same size, and the third chip coil 732221 and the fourth chip coil 732231 have the same size. The sizes of the third chip coil 732221 and the fourth chip coil 732231 are smaller than the sizes of the first chip coil 732211 and the second chip coil 732212. This is because the third chip coil 732221 and the fourth chip coil 732231 only need to drive the chip anti-shake movable part 33 to achieve translation along the X-axis, while the first chip coil 732211 and the second chip coil 732212 need to drive the chip anti-shake movable part 33 to achieve translation along the Y-axis and rotation about the Z-axis.

[0132] In one embodiment of the present application, the chip coil assembly 322 further includes a coil circuit board 3224 disposed on the chip movable carrier 331, and at least one chip coil in the chip coil assembly 322 is fixed and electrically connected to the coil circuit board 3224. In a specific example of the present application, the first chip coil group 3221 (the first chip coil 732211, the second chip coil 732212), the second chip coil group 3222 (the third chip coil 732221), and the third chip coil group 3223 (the fourth chip coil 732231) are all fixed and electrically connected to the coil circuit board 3224. The chip coil assembly 322 is electrically connected to the chip anti-shake conductive part 35 through the coil circuit board 3224, and is further electrically connected to the circuit board 41 of the photosensitive component 40. Specifically, the first chip coil assembly 3221, the second chip coil assembly 3222, and the third chip coil assembly 3223 can be wound coils fixedly and electrically connected to the coil circuit board 3224. Alternatively, the first chip coil assembly 3221, the second chip coil assembly 3222, and the third chip coil assembly 3223 can be wound directly on the coil circuit board 3224. Alternatively, the first chip coil assembly 3221, the second chip coil assembly 3222, and the third chip coil assembly 3223 can be etched directly on the coil circuit board 3224 to form planar coils (FP-coils). This approach can reduce the height of the chip coil assembly 322, thereby reducing the height of the chip drive motor 30. Furthermore, the coil circuit board 3224 has a circuit board light hole 32241, which provides a light hole for light from the optical lens 10 to enter the photosensitive component 40.

[0133] Accordingly, in one embodiment of the present application, the chip magnet assembly 321 includes a first chip magnet group 3211, a second chip magnet group 3212, and a third chip magnet group 3213. The first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 are arranged on the plane where the X-axis and the Y-axis are located (i.e., arranged in the horizontal direction). Furthermore, the first chip magnet group 3211 and the first chip coil group 3221 are arranged vertically opposite each other, the second chip magnet group 3212 and the second chip coil group 3222 are arranged vertically opposite each other, and the third chip magnet group 3213 and the third chip coil group 3223 are arranged vertically opposite each other, so that each chip coil is located in the magnetic field of the corresponding chip magnet. Thus, the first chip magnet group 3211 is arranged along the X-axis, the second chip magnet group 3212 and the third chip magnet group 3213 are arranged along the Y-axis, the second chip magnet group 3212 and the third chip magnet group 3213 are arranged opposite each other along the Y-axis, and the second chip magnet group 3212 and the third chip magnet group 3213 are symmetrical with respect to the X-axis. In this application, the upper side refers to the side away from the photosensitive component 40, and the lower side refers to the side close to the photosensitive component 40.

[0134] The first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 each include at least one chip magnet. For example, in a specific example of the present application, the first chip magnet group 3211 includes a first chip magnet 732111 and a second chip magnet 732112. The first chip magnet 732111 and the second chip magnet 732112 are arranged along the X-axis. Specifically, the first chip magnet 732111 and the second chip magnet 732112 are arranged relatively parallel to each other along the X-axis. The second chip magnet group 3212 includes a third chip magnet 732121. The third chip magnet group 3213 includes a fourth chip magnet 732131. The third chip magnet 732121 and the fourth chip magnet 732131 are arranged relatively parallel to each other along the Y-axis. More specifically, in an embodiment of the present application, the first chip magnet group 3211 is arranged at two opposite corners of the photosensitive component 40 along the X-axis direction (i.e., corner areas), and the second chip magnet group 3212 and the third chip magnet group 3213 are arranged at two opposite sides of the photosensitive component 40 along the Y-axis direction.

[0135] The first chip magnet 732111 and the second chip magnet 732112 work together to drive the chip anti-shake movable part 33 to move along the Y-axis direction and / or rotate around the Z-axis direction, and the third chip magnet 732121 and the fourth chip magnet 732131 work together to drive the chip anti-shake movable part 33 to move along the X-axis direction.

[0136] Preferably, the first chip magnet 732111 and the second chip magnet 732112 have the same size, the third chip magnet 732121 and the fourth chip magnet 732131 have the same size, and the third chip magnet 732121 and the fourth chip magnet 732131 are smaller than the first chip magnet 732111 and the second chip magnet 732112. This is because the third chip magnet 732121 and the fourth chip magnet 732131 only need to drive the chip anti-shake movable part 33 to achieve translation along the X-axis, while the first chip magnet 732111 and the second chip magnet 732112 need to drive the chip anti-shake movable part 33 to achieve translation along the Y-axis and to drive the chip anti-shake movable part 33 to achieve rotation about the Z-axis.

[0137] The first chip coil group 3221 and the first chip magnet group 3211 interact with each other, driving the chip anti-shake movable part 33, and then driving the photosensitive component 40 to translate in the Y-axis direction and / or rotate around the Z-axis direction; the second chip coil group 3222 and the second chip magnet group 3212 interact with each other, and the third chip coil group 3223 and the third chip magnet group 3213 interact with each other, and together drive the chip anti-shake movable part 33, and then drive the photosensitive component 40 to translate in the X-axis direction.

[0138] As shown in Figure 17, in one embodiment of the present application, the chip coil assembly 322 is not provided on at least one side of the chip movable carrier 331. Specifically, the chip movable carrier 331 includes a first side, a second side, a third side, and a fourth side that are mutually enclosed, the first side being opposite to the third side, and the second side being opposite to the fourth side. The first side and the third side extend along the X-axis direction set by the drive component, and the second side and the fourth side extend along the Y-axis direction set by the drive component, and the Y-axis direction is perpendicular to the X-axis direction. The chip coil assembly 322 includes a first chip coil group 3221 provided on the first side, and a second chip coil group 3222 and a third chip coil group 3223 provided on the second and fourth sides that are opposite to each other.

[0139] The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are arranged in the plane of the X-axis and the Y-axis. That is, the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are arranged horizontally. The first chip coil group 3221 is arranged along the X-axis, the second chip coil group 3222 is arranged along the Y-axis, and the third chip coil group 3223 is arranged along the Y-axis. The second chip coil group 3222 and the third chip coil group 3223 are arranged opposite each other along the Y-axis. Furthermore, the second chip coil group 3222 and the third chip coil group 3223 are symmetrical with respect to the Y-axis. The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 are arranged around three sides of the photosensitive component 40.

[0140] The first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 each include at least one chip coil. Specifically, the first chip coil group 3221 includes at least one chip coil, the second chip coil group 3222 includes at least one chip coil, and the third chip coil group 3223 includes at least one chip coil. For example, in a specific example of the present application, the first chip coil group 3221 includes two opposing first chip coils 832211 disposed on the first side, forming a pair of first chip coils 832211. The pair of first chip coils 832211 are arranged along the X-axis. Specifically, the pair of first chip coils 832211 are arranged parallel to the X-axis. The second chip coil group 3222 includes a second chip coil 832212 disposed on the second side. The third chip coil group 3223 includes another second chip coil 832212 disposed on the fourth side, opposing the second chip coil 832212 disposed on the second side, forming a pair of second chip coils 832212. The pair of second chip coils 832212 are arranged parallel to each other along the Y-axis. Alternatively, the pair of first chip coils 832211 is disposed on the first or third side of the photosensitive component 40, and the two second chip coils 832212 of the pair of second chip coils 832212 are disposed on the second and fourth sides of the photosensitive component 40, respectively.

[0141] A pair of the first chip coils 832211 work together to drive the chip anti-shake movable part 33 to move along the Y-axis direction and / or rotate around the Z-axis direction, and a pair of the second chip coils 832212 work together to drive the chip anti-shake movable part 33 to move along the X-axis direction.

[0142] Preferably, the pair of first chip coils 832211 have the same size, and the pair of second chip coils 832212 have the same size, with the second chip coils 832212 being smaller than the first chip coils 832211. This is because the second chip coils 832212 only need to drive the chip anti-shake movable portion 33 to achieve translation along the X-axis, while the first chip coil 832211 needs to drive the chip anti-shake movable portion 33 to achieve both translation along the Y-axis and rotation about the Z-axis.

[0143] In one embodiment of the present application, the chip coil assembly 322 further includes a coil circuit board 3224 disposed on the chip movable carrier 331, and at least one chip coil in the chip coil assembly 322 is fixed and electrically connected to the coil circuit board 3224. In a specific example of the present application, the first chip coil group 3221 (a pair of first chip coils 832211), the second chip coil group 3222 (one second chip coil 832212), and the third chip coil group 3223 (one second chip coil 832212) are all fixed and electrically connected to the coil circuit board 3224. The chip coil assembly 322 is electrically connected to the chip anti-shake conductive part 35 through the coil circuit board 3224, and is further electrically connected to the circuit board 41 of the photosensitive component 40. Specifically, the first chip coil assembly 3221, the second chip coil assembly 3222, and the third chip coil assembly 3223 can be wound coils fixedly and electrically connected to the coil circuit board 3224. Alternatively, the first chip coil assembly 3221, the second chip coil assembly 3222, and the third chip coil assembly 3223 can be wound directly on the coil circuit board 3224. Alternatively, the first chip coil assembly 3221, the second chip coil assembly 3222, and the third chip coil assembly 3223 can be etched directly on the coil circuit board 3224 to form planar coils (FP-coils). This approach can reduce the height of the chip coil assembly 322, thereby reducing the height of the chip drive motor 30. Furthermore, the coil circuit board 3224 has a circuit board light hole 32241, which provides a light hole for light from the optical lens 10 to enter the photosensitive component 40.

[0144] Accordingly, in one embodiment of the present application, the chip magnet assembly 321 includes a first chip magnet group 3211, a second chip magnet group 3212, and a third chip magnet group 3213. The first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 are arranged on the plane where the X-axis and the Y-axis are located (i.e., arranged in the horizontal direction). Furthermore, the first chip magnet group 3211 and the first chip coil group 3221 are arranged vertically opposite each other, the second chip magnet group 3212 and the second chip coil group 3222 are arranged vertically opposite each other, and the third chip magnet group 3213 and the third chip coil group 3223 are arranged vertically opposite each other, so that each chip coil is located in the magnetic field of the corresponding chip magnet. Thus, the first chip magnet group 3211 is arranged along the X-axis, the second chip magnet group 3212 and the third chip magnet group 3213 are arranged along the Y-axis, the second chip magnet group 3212 and the third chip magnet group 3213 are arranged opposite each other along the Y-axis, and the second chip magnet group 3212 and the third chip magnet group 3213 are symmetrical with respect to the Y-axis. In this application, the upper side refers to the side away from the photosensitive component 40, and the lower side refers to the side close to the photosensitive component 40.

[0145] The first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 each include at least one chip magnet. For example, in a specific example of the present application, the first chip magnet group 3211 includes two opposing first chip magnets 832111, forming a pair of first chip magnets 832111. The pair of first chip magnets 832111 is arranged along the X-axis. Specifically, the two first chip magnets 832111 are arranged parallel to the X-axis. The second chip magnet group 3212 includes one second chip magnet 832112. The third chip magnet group 3213 includes one second chip magnet 832112, forming a pair of second chip magnets 832112. The pair of second chip magnets 832112 is arranged parallel to each other along the Y-axis. More specifically, in an embodiment of the present application, the first chip magnet group 3211 is arranged at two opposite corners of the photosensitive component 40 along the X-axis direction (i.e., corner areas), and the second chip magnet group 3212 and the third chip magnet group 3213 are arranged at two opposite sides of the photosensitive component 40 along the Y-axis direction.

[0146] A pair of the first chip magnets 832111 work together to drive the chip anti-shake movable part 33 to move along the Y-axis direction and / or rotate around the Z-axis direction, and a pair of the second chip magnet groups 3212 work together to drive the chip anti-shake movable part 33 to move along the X-axis direction.

[0147] Preferably, the pair of first chip magnets 832111 are of the same size, and the pair of second chip magnet groups 3212 are of the same size, with the second chip magnet group 3212 being smaller than the first chip magnet 832111. This is because the second chip magnet group 3212 only needs to drive the chip anti-shake movable portion 33 to achieve translation along the X-axis, while the first chip magnet 832111 needs to drive the chip anti-shake movable portion 33 to achieve both translation along the Y-axis and rotation about the Z-axis.

[0148] The first chip coil group 3221 and the first chip magnet group 3211 interact with each other, driving the chip anti-shake movable part 33, and then driving the photosensitive component 40 to translate in the Y-axis direction and / or rotate around the Z-axis direction; the second chip coil group 3222 and the second chip magnet group 3212 interact with each other, and the third chip coil group 3223 and the third chip magnet group 3213 interact with each other, and together drive the chip anti-shake movable part 33, and then drive the photosensitive component 40 to translate in the X-axis direction.

[0149] As shown in FIG9 , in one embodiment of the present application, the chip driving element 32 is not provided on at least one side of the chip driving motor 30, so as to provide a larger space for the eccentric setting of the photosensitive chip 42. That is, the photosensitive chip 42 can be arranged close to the side of the chip driving motor 30 on which the chip driving element 32 is not provided, so that the central axis of the photosensitive chip 42 is inconsistent with the central axis of the chip driving motor 30. Furthermore, when the eccentric photosensitive chip 42 described in the present application is applied to the camera module 1, the setting mode in which the chip driving element 32 is not provided on at least one side of the chip driving motor 30 can avoid the magnetic interference problem affecting the selection of the matching scheme of the lens driving motor 20.

[0150] Specifically, in one embodiment of the present application, the chip magnet assembly 321 and the chip coil assembly 322 are concentrated on the three sides of the photosensitive chip 42, and the chip driving element 32 is not provided on one side of the photosensitive chip 42 except the three sides. This arrangement enables the central axis of the photosensitive chip 42 to be set in an eccentric state on the chip movable carrier 331, and the center O of the photosensitive chip 42 is closer to the side of the chip movable carrier 331 where the chip driving element 32 is not provided. For example, in a specific example of the present application, the first chip magnet group 3211 and the first chip coil group 3221 are arranged on the first side of the photosensitive chip 42, and the second chip magnet group 3212, the second chip coil group 3222 and the third chip magnet group 3213, the third chip coil group 3223 are arranged on the second side and the fourth side of the photosensitive chip 42. This arrangement makes the center O of the photosensitive chip 42 close to the first side of the chip movable carrier 331, that is, the central axis of the photosensitive chip 42 is inconsistent with the central axis of the chip driving motor 30.

[0151] In one embodiment of the present application, the chip magnet assembly 321 further includes a magnetic conductive member (not shown) disposed between the first chip magnet group 3211, the second chip magnet group 3212, the third chip magnet group 3213, and the upper cover 311. The first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 are indirectly fixed to the upper cover 311 via the magnetic conductive member. The magnetic conductive member is adapted to enhance the magnetic field force of the chip magnet assembly 321 toward the coil magnet assembly, thereby enhancing the driving force of the chip driving element 32.

[0152] In one embodiment of the present application, the chip driving motor 30 also includes a chip position sensing component 36 and a chip holding component 34. The chip position sensing component 36 is used to obtain the position or motion information of the photosensitive component 40. The chip holding component 34 is suitable for allowing the chip movable carrier 331 to be suspended in the receiving cavity of the chip anti-shake fixing part 31. In this way, the photosensitive component 40 can be suspended in the chip anti-shake fixing part 31 by the chip holding component 34.

[0153] As shown in Figures 7 and 8, the chip position sensing component 36 is fixed to the chip movable carrier 331, so that when the chip movable carrier 331 moves, the chip position sensing component 36 is suitable for obtaining the position information of the chip movable carrier 331 by obtaining the magnetic field changes of the chip magnet component 321.

[0154] The chip position sensing component 36 includes at least one position sensing element, and the number of the position sensing elements is not limited by the present application. In a specific example of the present application, the chip position sensing component 36 includes a first position sensing element 361, a second position sensing element 362, and a third position sensing element 363, so as to sense the position information of the three movements of the chip movable carrier 331: translation along the X-axis direction, translation along the Y-axis direction, and rotation around the Z-axis direction. In an embodiment of the present application, the first position sensing element 361, the second position sensing element 362, and the third position sensing element 363 are Hall elements; in other embodiments of the present application, the first position sensing element 361, the second position sensing element 362, and the third position sensing element 363 are driver chips with position sensing functions.

[0155] In a specific example of the present application, a sensing element recess 33114 (as shown in FIG6 ) is formed on the chip carrier body 3311. The chip position sensing component 36 is disposed in the sensing element recess 33114, thereby preventing the chip position sensing component 36 from being too high. The chip position sensing component 36 is electrically connected to the circuit board 41 of the photosensitive component 40. In the height (Z-axis) direction set by the movable chip carrier 331, the chip position sensing component is disposed between the chip coil assembly 322 and the circuit board 41. Preferably, the chip position sensing component 36 is accommodated in the sensing element recess 33114 and does not protrude therefrom.

[0156] The chip holding assembly 34 includes a chip support assembly 341 and a chip magnetic assembly 342 disposed between the movable chip carrier 331 and the upper cover 311. The chip magnetic assembly 342 is fixed to the movable chip carrier 331 of the chip anti-shake movable portion 33. The magnetic attraction between the chip magnetic assembly 342 and the chip magnet assembly 321 causes the movable chip anti-shake portion 33 to be attracted to the upper cover 311. The chip support assembly 341 is disposed between the upper cover 311 of the chip anti-shake fixed portion 31 and the movable chip carrier 331 of the chip anti-shake movable portion 33. Under the action of the magnetic attraction between the chip magnetic assembly 342 and the chip magnet assembly 321, the chip support assembly 341 is clamped between the upper cover 311 and the movable chip carrier 331. A gap is maintained between the movable chip carrier 331 and the upper cover 311, thereby reducing resistance to movement of the movable chip anti-shake portion 33.

[0157] In an embodiment of the present application, the chip support component 341 includes at least three support components clamped between the chip anti-shake movable part 33 and the chip anti-shake fixed part 31, and each group of support components includes a ball groove 3412 recessedly formed in the chip movable carrier 331 and a ball 3411 arranged in the ball groove 3412, as shown in Figures 10 to 12. The number of the balls 3411 and the ball grooves is not limited by the present application. In one embodiment of the present application, the chip support assembly 341 includes three support assemblies, each support assembly includes at least one ball 3411 and at least one ball groove 3412, that is, the chip support assembly 341 includes at least three balls 3411 arranged between the chip movable carrier 331 and the upper cover 311. In order to limit the movement range of the balls 3411, the chip support assembly 341 also includes at least three ball grooves 3412 corresponding to the at least three balls 3411. Preferably, at least three ball grooves 3412 are formed on the chip movable carrier 331, and the depth of the ball groove 3412 is less than the diameter of the ball 3411. At least a portion of the ball 3411 can protrude from the ball groove 3412 so that the ball 3411 can maintain friction contact with the upper cover 311.

[0158] Furthermore, the movable chip carrier 331 also includes an extension column 3313 protruding from the upper surface of the chip carrier body 3311, and the ball rolling groove 3412 is recessed in the upper surface of the extension column 3313. In one embodiment of the present application, the movable chip carrier 331 includes at least three extension columns 3313 formed on the chip carrier body 3311, at least three of the extension columns 3313 protruding from the upper surface of the chip carrier body 3311, and at least three of the ball rolling grooves 3412 are formed in at least three of the extension columns 3313. The chip support assembly 341 is disposed between the extension columns 3313 and the upper cover 311 to maintain a certain gap between the movable chip carrier 331 and the upper cover 311, and this gap does not change with the movement of the movable chip carrier 331.

[0159] In a specific example of the present application, the chip movable carrier 331 includes three extension columns 3313 formed on the chip carrier body 3311, and the chip support component 341 includes three ball grooves 3412 formed by the concave top surface of the extension column 3313 and three balls 3411 arranged between the three ball grooves 3412 and the upper cover 311.

[0160] In particular, in the embodiment of the present application, the at least three support components are arranged in a non-completely collinear manner. Accordingly, in the above specific example, the three extension columns 3313 are distributed at two adjacent corners of the chip carrier body 3311 and on the side opposite to the side connecting the adjacent corners. In other words, the three balls 3411 are distributed in a triangular arrangement to provide stable support for the movable chip carrier 331.

[0161] 12 , the chip support assembly 341 further includes a ball support sheet 3413 embedded in the movable chip carrier 331 and located at the bottom of the ball groove 3412. The ball 3411 is supported by the ball support sheet 3413. In one embodiment of the present application, the chip support assembly 341 further includes at least three ball support sheets 3413. The ball support sheets 3413 are fixed to the movable chip carrier 331 and serve as the bottom surface of the ball groove 3412. The ball support sheets 3413 can be made of metal such as stainless steel, thereby providing a smoother support surface for the ball 3411 and reducing the friction of the ball 3411 during rolling. In a specific example of the present application, the chip support assembly 341 includes three ball support pieces 3413, each ball support piece 3413 is fixed in the extension column 3313 of the chip movable carrier 331 by insert molding and exposes its upper surface as the bottom surface of each ball groove 3412. Further referring to FIG13A, the ball support piece 3413 includes a support piece body 34131 and a support piece connecting portion 34132, the support piece body 34131 and the support piece connecting portion The support piece connecting portion 34132 extends integrally therewith, the upper surface of the support piece main body 34131 being exposed and serving as the bottom surface of the ball rolling groove 3412. The support piece connecting portion 34132 is used to maintain the position of the ball rolling support piece 3413 in the movable chip carrier 331 during the insert molding process. The support piece connecting portion 34132 can be connected to the support piece connecting portion 34132 of another ball rolling support piece 3413 or to other supporting components for supporting the support piece connecting portion 34132. After the ball rolling support piece 3413 is formed in the movable chip carrier 331 through the insert molding process, the support piece connecting portion 34132 is sheared, and a portion of the support piece connecting portion 34132 can be exposed outside the movable chip carrier 331. That is, in some embodiments of the present application, the ball support piece 3413 includes a support piece body 34131 located at the bottom of the ball groove 3412 and a support piece connection portion 34132 extending from the support piece body 34131 to the outside of the chip movable carrier 331 .

[0162] As shown in Figures 11 and 13A, in some embodiments of the present application, the chip magnetic assembly 342 includes at least one chip magnetic element 3421, and the chip magnetic element 3421 is enclosed in the chip movable carrier 331 of the chip anti-shake movable part 33, so that the chip movable carrier 331 is suspended in the receiving cavity of the chip anti-shake fixed part 31 through the magnetic force between the chip magnet assembly 321 and the at least one chip magnetic element 3421. In a specific example of the present application, at least one chip magnetic element 3421 is embedded in the chip movable carrier 331 of the chip anti-shake movable part 33 through an insert molding process, and at least one chip magnetic element 3421 is arranged opposite to the chip magnet component 321 to generate a magnetic attraction force between at least one chip magnetic element 3421 and the chip magnet component 321. On the one hand, the chip support component 341 is clamped between the chip anti-shake fixed part 31 and the chip anti-shake movable part 33 by the action of the magnetic attraction force. Specifically, the ball 3411 is clamped between the upper cover 311 and the chip movable carrier 331 by the magnetic attraction force between the at least one chip magnetic element 3421 and the chip magnet component 321; on the other hand, after the chip movable carrier 331 moves, the chip movable carrier 331 is maintained in a position by the action of the magnetic attraction force, wherein the position can be the initial position before the chip movable carrier 331 is driven. The chip magnetic element 3421 is made of a material with magnetic conductivity, which is suitable for generating magnetic attraction with a magnet.

[0163] The chip magnetic element 3421 includes a magnetic element body 34211 and a magnetic element connection portion 34212. The magnetic element body 34211 and the magnetic element connection portion 34212 extend integrally. The magnetic element connection portion 34212 is used to maintain the position of the chip magnetic element 3421 within the chip movable carrier 331 during the insert molding process. The magnetic element connection portion 34212 can connect to the magnetic element connection portion 34212 of another chip magnetic element 3421 or to other supporting components for supporting the magnetic element connection portion 34212. After the chip magnetic element 3421 is formed within the chip movable carrier 331 through the insert molding process, the magnetic element connection portion 34212 is sheared, and a portion of the magnetic element connection portion 34212 may be exposed outside the chip movable carrier 331. That is, in some embodiments of the present application, the chip magnetic element 3421 includes a magnetic element body 34211 enclosed in the chip movable carrier 331 and a magnetic element connection portion 34212 extending from the magnetic element body 34211 to the outside of the chip movable carrier 331.

[0164] In one embodiment of the present application, the upper surface of the chip magnetic element 3421 is exposed and is not wrapped by the chip movable carrier 331; in other embodiments of the present application, the upper surface of the chip magnetic element 3421 may also be wrapped by the chip movable carrier 331, and the present application is not limited to this.

[0165] In particular, in one embodiment of the present application, as shown in Figures 11 and 13A, the chip magnetic component 342 includes a first chip magnetic component 3422 and a second chip magnetic component 3423, wherein, by rationally arranging the first chip magnetic component 3422 and the second chip magnetic component 3423, the first chip magnetic component 3422 and the second chip magnetic component 3423 play different main roles. Looking at its surface along the Z-axis direction, the three balls 3411 are arranged in a triangular shape, the first chip magnetic component 3422 is arranged at the corner of the triangular plane (i.e., the corner area), the first chip magnetic component 3422 is arranged close to the balls 3411, and the main function of the first chip magnetic component 3422 is to generate a magnetic attraction force along the Z-axis direction with the chip magnet component 321, so that the chip support component 341 is clamped between the chip anti-shake fixed part 31 and the chip anti-shake movable part 33. The second chip magnetic component 3423 is disposed at the edge of the triangular plane, that is, the distance between the second chip magnetic component 3423 and the ball 3411 is greater than the distance between the first chip magnetic component 3422 and the ball 3411. The main function of the second chip magnetic component 3423 is to generate a magnetic attraction force with a certain angle to the Z-axis direction with the chip magnet group after the movable chip carrier 331 moves. The main function of this magnetic attraction force is to restore the movable chip carrier 331 to a certain position. Of course, the main functions of the first chip magnetic component 3422 and the second chip magnetic component 3423 in this application are different, which does not mean that the first chip magnetic component 3422 and the second chip magnetic component 3423 will not have other functions. That is to say, the first chip magnetic component 3422 will also have the function of restoring the chip movable carrier 331 to a position through the action of magnetic force after the chip movable carrier 331 moves, and the second chip magnetic component 3423 will also have the function of clamping the chip support component 341 between the chip anti-shake fixed part 31 and the chip anti-shake movable part 33 through the action of magnetic force. The first chip magnetic component 3422 and the second chip magnetic component 3423 cooperate with each other and act on the chip movable carrier 331 together, but since the positions of the first chip magnetic component 3422 and the second chip magnetic component 3423 are different, the main functions of the two are different.

[0166] Specifically, in the embodiment of the present application, the number of the first chip magnetic components 3422 is 4, including a first chip magnetic element 734221 , a second chip magnetic element 734222 , a third chip magnetic element 734223 and a fourth chip magnetic element 734224 . The first chip magnetic element 734221 and the first chip magnet 732111 are arranged relative to each other along the height direction set by the chip movable carrier 331, the second chip magnetic element 734222 and the second chip magnet 732112 are arranged relative to each other along the height direction set by the chip movable carrier 331, the third chip magnetic element 734223 and the third chip magnet 732121 are arranged relative to each other along the height direction set by the chip movable carrier 331, and the fourth chip magnetic element 734224 and the fourth chip magnet 732131 are arranged relative to each other along the height direction set by the chip movable carrier 331. In this application, the chip magnet assembly 321 and the first chip magnetic assembly 3422 do not need to be completely opposite to each other when they are arranged relative to each other along the height direction set by the chip movable carrier 331, that is, the projection of the chip magnet assembly 321 and the projection of the first chip magnetic assembly 3422 can overlap at least partially.

[0167] The first and second chip magnetic elements 734221 and 734222 are located on a first side of the movable chip carrier 331, while the third and fourth chip magnetic elements 734223 and 734224 are located on a second and fourth side of the movable chip carrier 331, respectively. Alternatively, the first, second, third, and fourth chip magnetic elements 734221, 734222, 734223, and 734224 are positioned relative to the position of the ball bearing 3411.

[0168] Furthermore, the first and second chip magnetic elements 734221 and 734222 are arranged close to the balls 3411 along the X-axis, and are respectively arranged on either side of two of the balls 3411. The third and fourth chip magnetic elements 734223 and 734224 are also arranged close to the balls 3411 along the Y-axis, and are respectively arranged on either side of one of the balls 3411. Because the first chip magnetic element 3422 is closer to the balls 3411, the magnetic attraction force generated between it and the chip magnet element 321 to clamp the chip support element 341 is more significant.

[0169] More specifically, in an embodiment of the present application, the number of the second chip magnetic components 3423 is two, including a fifth chip magnetic element 734231 and a sixth chip magnetic element 734232, wherein the fifth chip magnetic element 734231 is arranged relative to the third chip magnet 732121 along the height direction set by the movable chip carrier 331, and the sixth chip magnetic element 734232 is arranged relative to the fourth chip magnet 732131 along the height direction set by the movable chip carrier 331. Furthermore, in a specific example of the present application, the fifth chip magnetic element 734231 is arranged between the first chip magnet 732111 and the third chip magnet 32131, and the sixth chip magnetic element 734232 is arranged between the second chip magnet 732112 and the fourth chip magnet 32121. In other words, the fifth chip magnetic element 734231 is arranged on the second side of the movable chip carrier 331, and the sixth chip magnetic element 734232 is arranged on the fourth side of the movable chip carrier 331. This arrangement allows the second chip magnetic group and the chip magnet assembly 321 to generate a magnetic attraction force with a certain angle to the Z-axis direction after the movable chip carrier 331 moves. The magnetic attraction force causes the movable chip carrier 331 to return to a certain position. Of course, it is understandable that during this process, a magnetic attraction force is also generated between the first chip magnetic assembly 3422 and the chip magnet assembly 321, causing the movable chip carrier 331 to return to a certain position.

[0170] It is worth mentioning that the magnetic attraction force generated between the second chip magnetic component 3423 and the chip magnet component 321 can be a force opposite to the moving direction of the chip movable carrier 331. At this time, the magnetic attraction force is a reset force, so that the chip movable carrier 331 returns to a position; the magnetic attraction force generated between the second chip magnetic component 3423 and the chip magnet component 321 can also be a force in the same direction as the moving direction of the chip movable carrier 331. At this time, the magnetic attraction force is an external attraction force. This is because when the chip movable carrier 331 moves, the circuit board 41 of the photosensitive component 40 will also generate a certain reset force. The external attraction force and the reset force of the circuit board 41 are slightly offset to compensate for the thrust of the chip movable carrier 331 in the edge stroke.

[0171] In particular, in one embodiment of the present application, as shown in Figures 21 and 23, the chip magnetic component 342 includes a first chip magnetic component 3422 and a second chip magnetic component 3423, wherein, by rationally arranging the first chip magnetic component 3422 and the second chip magnetic component 3423, the first chip magnetic component 3422 and the second chip magnetic component 3423 play different main roles. Looking at its surface along the Z-axis direction, the three balls 3411 are arranged in a triangular shape, the first chip magnetic component 3422 is arranged at the corner of the triangular plane (i.e., the corner area), the first chip magnetic component 3422 is arranged close to the balls 3411, and the main function of the first chip magnetic component 3422 is to generate a magnetic attraction force along the Z-axis direction with the chip magnet component 321, so that the chip support component 341 is clamped between the chip anti-shake fixed part 31 and the chip anti-shake movable part 33. The second chip magnetic component 3423 is disposed at the edge of the triangular plane, that is, the distance between the second chip magnetic component 3423 and the ball 3411 is greater than the distance between the first chip magnetic component 3422 and the ball 3411. The main function of the second chip magnetic component 3423 is to generate a magnetic attraction force with a certain angle to the Z-axis direction with the chip magnet group after the movable chip carrier 331 moves. The main function of this magnetic attraction force is to restore the movable chip carrier 331 to a certain position. Of course, the main functions of the first chip magnetic component 3422 and the second chip magnetic component 3423 in this application are different, which does not mean that the first chip magnetic component 3422 and the second chip magnetic component 3423 will not have other functions. That is to say, the first chip magnetic component 3422 will also have the function of restoring the chip movable carrier 331 to a position through the action of magnetic force after the chip movable carrier 331 moves, and the second chip magnetic component 3423 will also have the function of clamping the chip support component 341 between the chip anti-shake fixed part 31 and the chip anti-shake movable part 33 through the action of magnetic force. The first chip magnetic component 3422 and the second chip magnetic component 3423 cooperate with each other and act on the chip movable carrier 331 together, but since the positions of the first chip magnetic component 3422 and the second chip magnetic component 3423 are different, the main functions of the two are different.

[0172] Specifically, the first chip magnetic component 3422 includes at least one first chip magnetic element 834221, the second chip magnetic component 3423 includes at least one second chip magnetic element 834231, the first chip magnetic element 834221 is adjacent to the first support component among the at least three support components, and the distance between the second chip magnetic element 834231 and any support component among the at least three support components is greater than the distance between the first chip magnetic element 834221 and the first support component.

[0173] In the embodiment of the present application, the number of the first chip magnetic components 3422 is 4, and the number of the second chip magnetic components 3423 is 2. The first chip magnetic components 3422 include two opposing first chip magnetic elements 834221 and two opposing third chip magnetic elements 834222, forming a pair of first chip magnetic elements 834221 and a pair of third chip magnetic elements 834222. The second chip magnetic components 3423 include two second chip magnetic elements 834231, forming a pair of second chip magnetic elements 834231.

[0174] The pair of first chip magnetic elements 834221 and the pair of first chip magnets 832111 are arranged opposite each other along the height direction set by the movable chip carrier 331, and the pair of second chip magnetic elements 834231 and the pair of second chip magnets 832112 are arranged opposite each other along the height direction set by the movable chip carrier 331. That is, the pair of first chip magnetic elements 834221 correspond to the pair of first chip magnets 832111 along the height direction set by the movable chip carrier 331, and the pair of second chip magnetic elements 834231 correspond to the pair of second chip magnets 832112 along the height direction set by the movable chip carrier 331. In this application, the chip magnet assembly 321 and the first chip magnetic assembly 3422 do not need to be completely opposite each other along the height direction set by the movable chip carrier 331. In other words, it is sufficient that the projection of the chip magnet assembly 321 and the projection of the first chip magnetic assembly 3422 at least partially overlap.

[0175] A pair of first chip magnetic elements 834221 are positioned on a first side of the movable chip carrier 331, on opposite sides of the first support assembly. A pair of third chip magnetic elements 834222 are positioned on a second side and a fourth side of the movable chip carrier 331, with one third chip magnetic element 834222 adjacent to the second support assembly, and the other third chip magnetic element 834222 adjacent to the third support assembly. Alternatively, the first and third chip magnetic elements 834221 and 834222 are positioned relative to the position of the support assembly's ball bearings 3411.

[0176] Furthermore, a pair of first chip magnetic elements 834221 are disposed close to the balls 3411 along the X-axis, with the pair of first chip magnetic elements 834221 being disposed on either side of two of the balls 3411. A pair of third chip magnetic elements 834222 are disposed close to the balls 3411 along the Y-axis, with the third chip magnetic elements 834222 being disposed on either side of one of the balls 3411. Because the first chip magnetic elements 3422 are closer to the balls 3411, the magnetic attraction generated between them and the chip magnet assembly 321 to clamp the chip support assembly 341 is more pronounced.

[0177] It is worth noting that the dimensions of the first chip magnetic element 834221 and the third chip magnetic element 834222 are larger than those of the second chip magnetic element 834231. This is because the primary function of the first and third chip magnetic elements 834221 and 834222 is to clamp the ball 3411 and also to reset the movable chip carrier 331. The second chip magnetic element 834231 and its corresponding chip magnet element only generate a reset force to reset the movable chip carrier 331.

[0178] In the embodiment of the present application, a pair of second chip magnetic elements 834231 and a second chip magnet 832112 are arranged relative to each other along a predetermined height of the movable chip carrier 331. Furthermore, in a specific example of the present application, the pair of second chip magnetic elements 834231 are arranged between the pair of first chip magnets 832111 and the pair of third chip magnets 32131. Specifically, one of the pair of second chip magnetic elements 834231 is positioned in the middle of the second side of the movable chip carrier 331, and the other second chip magnetic element 834231 is positioned in the middle of the fourth side of the movable chip carrier 331. This arrangement ensures that after the movable chip carrier 331 moves, a magnetic attraction force at a predetermined angle to the Z-axis is generated between the second chip magnetic assembly 3423 and the chip magnet assembly 321. This magnetic attraction force causes the movable chip carrier 331 to return to a predetermined position. Of course, it is understandable that during this process, a magnetic attraction force is also generated between the first chip magnetic component 3422 and the chip magnet component 321, so that the chip movable carrier 331 returns to a position.

[0179] It is worth mentioning that the magnetic attraction force generated between the second chip magnetic component 3423 and the chip magnet component 321 can be a force opposite to the moving direction of the chip movable carrier 331. At this time, the magnetic attraction force is a reset force, so that the chip movable carrier 331 returns to a position; the magnetic attraction force generated between the second chip magnetic component 3423 and the chip magnet component 321 can also be a force in the same direction as the moving direction of the chip movable carrier 331. At this time, the magnetic attraction force is an external attraction force. This is because when the chip movable carrier 331 moves, the circuit board 41 of the photosensitive component 40 will also generate a certain reset force. The external attraction force and the reset force of the circuit board 41 are slightly offset to compensate for the thrust of the chip movable carrier 331 in the edge stroke.

[0180] In a specific example of the present application, the chip magnetic attraction component 342 includes six chip magnetic attraction elements 3421, and every two of the chip magnetic attraction elements 3421 have the same shape, thereby providing a uniform and stable magnetic attraction force, so that the chip movable carrier 331 is stably adsorbed to the upper cover 311.

[0181] In the present application, the chip movable carrier 331 can be integrally formed with the ball support plate 3413 and the chip magnetic element 3421 by means of insert molding through an injection molding process to reduce the number of parts of the chip drive motor 30. The chip anti-shake conductive part 35 can also be embedded in the chip anti-shake movable part 33 by means of insert molding.

[0182] Therefore, the present application embeds the chip anti-shake conductive part 35 into the chip anti-shake movable part 33 by, for example, insert molding, to provide a chip anti-shake movable part 33 with a conductive function, so that the chip coil assembly 322 can be electrically connected to the circuit board 41 through the chip anti-shake movable part 33. In addition, since the chip anti-shake conductive part 35 is embedded in the chip anti-shake movable part 33 by insert molding, the chip anti-shake movable part 33 is suitable for providing two flat mounting surfaces for mounting and fixing the chip coil assembly 322 and the circuit board 41, which can also reduce the number of components of the chip anti-shake motor, reduce the assembly complexity of the chip anti-shake motor, and protect the chip anti-shake conductive part 35.

[0183] Specifically, Figures 11 and 13B illustrate the embedded structure of the chip anti-shake movable portion 33 and the chip anti-shake conductive portion 35. The chip anti-shake conductive portion 35 includes at least one coil conductive component 351. In one embodiment of the present application, the chip anti-shake conductive portion 35 includes multiple (two or more) coil conductive elements 3511. The multiple coil conductive elements 3511 are embedded in the chip movable carrier 331 by, for example, insert molding. That is, the coil conductive elements 3511 are enclosed in the chip anti-shake movable carrier so that the multiple coil conductive elements 3511 can electrically connect the chip coil component 322 and the circuit board 41.

[0184] The number of coil conductive elements 3511 in the coil conductive assembly 351 is related to the number of circuits required by the chip coil assembly 322. Referring to FIG13B , in a specific example of the present application, the coil conductive assembly 351 includes six coil conductive elements 3511. Each coil conductive element 3511 has an exposed first coil conductive end 35111, an exposed second coil conductive end 35113 opposite to the first coil conductive end 35111, and a coil conductive extension 35112 extending and electrically conducting between the first coil conductive end 35111 and the second coil conductive end 35113. The first coil conductive end 35111 is positioned higher than the second coil conductive end 35113, and the coil conductive extension 35112 extends downward from the first coil conductive end 35111 to the second coil conductive end 35113. When the coil conductive element 3511 is embedded in the movable chip carrier 331, the movable chip carrier 331 does not cover the upper surface of the first coil conductive end 35111, leaving the upper surface of the first coil conductive end 35111 exposed for electrical connection to the chip coil assembly 322. The movable chip carrier 331 does not cover the lower surface of the second coil conductive end 35113, leaving the lower surface of the second coil conductive end 35113 exposed for electrical connection to the circuit board 41, thereby electrically connecting the chip coil assembly 322 and the circuit board 41. In some embodiments of the present application, at least some of the coil conductive elements 3511 have their first coil conductive end 35111 exposed on the upper surface of the movable chip carrier 331, while their second coil conductive end 35113 is exposed on the lower surface of the movable chip carrier 331. At least one chip coil in the chip coil assembly 322 is electrically connected to the first coil conductive end 35111 by means of the coil circuit board 3224, and the second coil conductive end 35113 is suitable for electrically connecting to the circuit board 41 of the photosensitive component 40, thereby achieving electrical conduction between the chip coil assembly 322 and the circuit board 41.

[0185] In the embodiment of the present application, the first coil conductive end portion 35111 of the coil conductive element 3511 constitutes a portion of the upper conductive portion 33112 of the chip carrier body 3311 of the movable chip carrier 331, and the second coil conductive end portion 35113 of the coil conductive element 3511 constitutes a portion of the lower conductive portion 33113 of the chip carrier body 3311 of the movable chip carrier 331. In other words, the upper conductive portion 33112 includes the first coil conductive end portion 35111, and the lower conductive portion 33113 includes the second coil conductive end portion 35113.

[0186] Furthermore, to maintain the position of the coil conductive component 351 within the movable chip carrier 331 during the insert molding process, the coil conductive element 3511 further includes a coil conductive connecting portion 35114. This coil conductive connecting portion 35114 can connect to the coil conductive connecting portion 35114 of another coil conductive component 3511 or to another supporting component for supporting the coil conductive connecting portion 35114. After the coil conductive component 351 is formed within the movable chip carrier 331 through the insert molding process, the coil conductive connecting portion 35114 is trimmed, leaving a portion of the coil conductive connecting portion 35114 exposed outside the movable chip carrier 331. That is, in some embodiments of the present application, the coil conductive element 3511 further includes a coil conductive connecting portion 35114 extending from the coil conductive body formed by the first coil conductive end portion 35111, the second coil conductive end portion 35113, and the coil conductive extension portion 35112 to the outside of the movable chip carrier 331.

[0187] In one embodiment of the present application, the first coil conductive end portion 35111, the second coil conductive end portion 35113, the coil conductive extension portion 35112, and the coil conductive connection portion 35114 are integrally formed from a conductive material. In another embodiment of the present application, the coil conductive element 3511 is not provided with the coil conductive connection portion 35114, and thus the first coil conductive end portion 35111, the second coil conductive end portion 35113, and the coil conductive extension portion 35112 are integrally formed from a conductive material.

[0188] In one embodiment of the present application, the chip anti-shake conductive part 35 may further include a sensing element conductive component (not shown in the figure), and the sensing element conductive component includes at least one sensing element conductive element enclosed in the chip movable carrier 331. Each of the sensing element conductive elements includes a first sensing element conductive end exposed on the upper surface of the chip movable carrier 331, a second sensing element conductive end exposed on the lower surface of the chip movable carrier 331 and opposite to the first sensing element conductive end, and a sensing element conductive extension extending between the first sensing element conductive end and the second sensing element conductive end, wherein the first sensing element conductive end is electrically connected to the position sensing element, the second sensing element conductive end is suitable for being electrically connected to the circuit board 41, and the first sensing element conductive end is lower than the first coil conductive end 35111 in the height direction set by the chip movable carrier 331.

[0189] In one embodiment of the present application, the ball support plate 3413, the chip magnetic assembly 342 (including the chip magnetic element 3421) and the chip anti-shake conductive part 35 (including the coil conductive element 3511 and the sensing element conductive element) are all embedded in the chip movable carrier 331 in an insert molding manner through an injection molding process, and are integrally formed with the chip movable carrier 331, thereby reducing the number of parts of the chip drive motor 30 and simplifying the structure and assembly complexity of the chip drive motor 30.

[0190] It is worth mentioning that the chip magnetic component 342 (including the chip magnetic element 3421) needs to be made of a material with magnetic conductivity, while the ball support piece 3413 and the chip anti-shake conductive part 35 (including the coil conductive element 3511 and the sensing element conductive element) need to be made of a material without magnetic conductivity. Therefore, in the insert molding process, the chip magnetic component 342 is the same layer of material strip, and the ball support piece 3413 and the chip anti-shake conductive part 35 are another layer of material strip. Therefore, after manufacturing, the height of the magnetic element connection part 34212 of at least one chip magnetic element 3421 of the chip magnetic component 342 is inconsistent with the height of the support connection part of the ball support piece 3413 and the coil conductive connection part 35114 of the chip anti-shake conductive part 35. That is, the coil conductive element 3511 and the ball support plate 3413 of the chip anti-shake conductive part 35 are not magnetically conductive, the chip magnetic element 3421 of the magnetic component is magnetically conductive, and the magnetic element connection part 34212 and the coil conductive connection part 35114 and the support plate connection part 34132 are different in the height direction set by the chip movable carrier 331.

[0191] Furthermore, the installation and power-on method of the movable chip carrier 331 is described. In one embodiment of the present application, solder (e.g., solder) is provided on the upper conductive portion 33112 of the movable chip carrier 331 to electrically connect with the pad on the back side of the coil circuit board 3224 of the chip coil assembly 322, an adhesive medium is provided between the movable chip carrier 331 and the coil circuit board 3224 to bond and fix the coil circuit board 3224 and the movable chip carrier 331; an adhesive medium is provided between the movable chip carrier 331 and the circuit board 41 to bond and fix the movable chip carrier 331 and the circuit board 41, and then the lower conductive portion 33113 on the back side of the movable chip carrier 331 and the side of the circuit board body 411 of the circuit board 41 are electrically connected by solder.

[0192] The present application further provides a driving method of the chip driving motor 30:

[0193] 14A to 14C respectively show the current direction and the force direction of each chip anti-shake coil when the chip anti-shake movable part 33 translates along the X-axis direction or the Y-axis direction and rotates around the Z-axis direction.

[0194] As shown in Figure 14A, the third chip coil 732221 and the fourth chip coil 732231 are connected in series. When the movable chip carrier 331 is driven to translate along the -X axis, a clockwise current flows through the third chip coil 732221, and a counterclockwise current flows through the fourth chip coil 732231. These coils are driven by electromagnetic force, causing the movable chip carrier 331 with the photosensitive component 40 to move along the -X axis for compensation. Arrow I indicates the direction of the current, and F indicates the force applied to the coils. When the movable chip carrier 331 translates along the -X axis, the currents flowing through the third and fourth chip coils 732221 and 732231 are equal in magnitude, and the forces applied to the third and fourth chip coils 732221 and 732231 are equal in magnitude and direction. On the contrary, when a counterclockwise current is applied to the third chip coil 732221 and a clockwise current is applied to the fourth chip coil 732231, the chip movable carrier 331 with the photosensitive component 40 is translated along the +X axis direction for compensation.

[0195] As shown in Figure 14B, the first chip coil 732211 and the second chip coil 732212 are independently energized. When the movable chip carrier 331 is driven to translate along the +Y axis, a clockwise current flows through the first chip coil 732211 and a clockwise current flows through the second chip coil 732212. The electromagnetic force drives the first and second chip coils 732211 and 732212, causing the movable chip carrier 331 with the photosensitive component 40 to move along the +Y axis for compensation. Arrow I indicates the direction of the current, and F indicates the force applied to the coils. When the movable chip carrier 331 translates along the +Y axis, the currents flowing through the first and second chip coils 732211 and 732212 are equal in magnitude, and the forces applied to the first and second chip coils 732211 and 732212 are equal in magnitude and direction. On the contrary, when a counterclockwise current is applied to the first chip coil 732211 and a counterclockwise current is applied to the second chip coil 732212, the movable chip carrier 331 with the photosensitive component 40 moves along the -Y axis direction for compensation.

[0196] As shown in FIG14C , the first chip coil 732211 and the second chip coil 732212 are separately energized. When the movable chip carrier 331 is driven to rotate clockwise about the Z-axis, a counterclockwise current flows through the first chip coil 732211 and a clockwise current flows through the second chip coil 732212. The first chip coil 732211 is driven by an electromagnetic force in the -Y direction, while the second chip coil 732212 is driven by an electromagnetic force in the +Y direction. This in turn applies a torsional force to the movable chip carrier 331, causing the movable chip carrier 331 with the photosensitive component 40 to rotate clockwise about the Z-axis to compensate. Arrow I indicates the direction of current flow, and arrow F indicates the force applied to the coils. When the movable chip carrier 331 translates along the +Y axis, the currents flowing through the first chip coil 732211 and the second chip coil 732212 are equal, and the forces acting on the first and second chip coils 732211 and 732212 are equal in magnitude and opposite in direction. Conversely, when a clockwise current flows through the first chip coil 732211 and a counterclockwise current flows through the second chip coil 732212, the movable chip carrier 331 with the photosensitive assembly 40 rotates counterclockwise about the Z axis to compensate.

[0197] 24 to 26 respectively show the current direction and force direction of each chip anti-shake coil when the chip anti-shake movable part 33 translates along the X-axis direction or the Y-axis direction and rotates around the Z-axis direction.

[0198] As shown in Figure 24, the third chip coil 832221 and the fourth chip coil 832231 are connected in series. When the movable chip carrier 331 is driven to translate along the -X axis, a clockwise current flows through the third chip coil 832221, and a counterclockwise current flows through the fourth chip coil 832231. The third and fourth chip coils 832221 and 832231 are driven by electromagnetic force, causing the movable chip carrier 331 with the photosensitive component 40 to move along the -X axis for compensation. Arrow I indicates the direction of the current, and F indicates the force applied to the coils. When the movable chip carrier 331 translates along the -X axis, the currents flowing through the third and fourth chip coils 832221 and 832231 are equal in magnitude, and the forces applied to the third and fourth chip coils 832221 and 832231 are equal in magnitude and direction. On the contrary, when the third chip coil 832221 is supplied with counterclockwise current and the fourth chip coil 832231 is supplied with clockwise current, the chip movable carrier 331 with the photosensitive component 40 is translated along the +X axis direction for compensation.

[0199] As shown in Figure 25, the first chip coil 832211 and the second chip coil 832212 are separately energized. When the movable chip carrier 331 is driven to translate along the +Y axis, a clockwise current flows through the first chip coil 832211 and a clockwise current flows through the second chip coil 832212. The first and second chip coils 832211 and 832212 are driven by electromagnetic force, causing the movable chip carrier 331 with the photosensitive component 40 to move along the +Y axis to compensate. Arrow I indicates the direction of the current, and F indicates the force applied to the coils. When the movable chip carrier 331 translates along the +Y axis, the currents flowing through the first and second chip coils 832211 and 832212 are equal in magnitude, and the forces applied to the first and second chip coils 832211 and 832212 are equal in magnitude and direction. On the contrary, when a counterclockwise current is applied to the first chip coil 832211 and a counterclockwise current is applied to the second chip coil 832212, the movable chip carrier 331 with the photosensitive component 40 moves along the -Y axis direction for compensation.

[0200] As shown in FIG26 , the first chip coil 832211 and the second chip coil 832212 are separately energized. When the movable chip carrier 331 is driven to rotate clockwise about the Z-axis, a counterclockwise current flows through the first chip coil 832211, while a clockwise current flows through the second chip coil 832212. The first chip coil 832211 is driven by an electromagnetic force in the -Y direction, while the second chip coil 832212 is driven by an electromagnetic force in the +Y direction. This in turn applies a torsional force to the movable chip carrier 331, causing the movable chip carrier 331 with the photosensitive component 40 to rotate clockwise about the Z-axis to compensate. Arrow I indicates the direction of current flow, and arrow F indicates the force applied to the coils. When the movable chip carrier 331 translates along the +Y axis, the currents flowing through the first chip coil 832211 and the second chip coil 832212 are equal in magnitude, and the forces acting on the first and second chip coils 832211 and 832212 are equal in magnitude and opposite in direction. Conversely, when a clockwise current flows through the first chip coil 832211 and a counterclockwise current flows through the second chip coil 832212, the movable chip carrier 331 with the photosensitive assembly 40 rotates counterclockwise about the Z axis to compensate.

[0201] Furthermore, in the embodiment of the present application, when the chip anti-shake movable part 33 moves along the X-axis direction, the first position sensing element 361 senses obvious magnetic field changes and provides feedback on the magnetic field changes; when the chip anti-shake movable part 33 moves along the Y-axis direction and rotates around the Z-axis direction, the first position sensing element 361 senses no obvious magnetic field changes, and the second position sensing element 362 and the third position sensing element 363 sense obvious magnetic field changes.

[0202] To sum up, the driving component and camera module 1 based on the embodiment of the present application are explained, wherein the camera module 1 enables different magnetic elements to play different roles by reasonably arranging the magnetic elements in its driving component; and the photosensitive component 40 of the camera module 1 is arranged in an eccentric manner relative to the center of the driving component, so that one side of the photosensitive chip 42 of the photosensitive component 40 is closer to the edge of the mobile electronic device, so as to meet the appearance and functional requirements of the mobile electronic device.

[0203] Exemplary multi-camera module

[0204] As shown in Figures 15, 16, and 27, the present application further provides a dual-camera module using the aforementioned photosensitive chip, wherein the dual-camera module includes two single-camera modules (a first camera module 1A and a second camera module 1B) arranged side by side. The specific structure and function of at least one of the first camera module 1A and the second camera module 1B are consistent with the specific structure and function of the camera module illustrated in Figures 2 to 14C and Figures 17 to 25. In one embodiment of the present application, the specific structure and function of the first camera module 1A and the second camera module 1B are consistent with the specific structure and function of the camera module illustrated in Figures 2 to 14C and Figures 17 to 25.

[0205] Specifically, the first camera module 1A includes a first optical lens 10A, a first photosensitive component 40A and a first driving component, and the second camera module 1B includes a second optical lens 10B, a second photosensitive component 40B and a second driving component, wherein the first optical lens 10A and the second optical lens 10B are respectively maintained on the light-sensing path of the first photosensitive component 40A and the second photosensitive component 40B, the first driving component of the first camera module 1A is used to drive the first photosensitive component 40A and / or the first optical lens 10A to move to achieve optical performance adjustment, and the second driving component of the second camera module 1A is used to drive the first photosensitive component 40B and / or the second optical lens 10B to move to achieve optical performance adjustment, for example, optical image stabilization, optical focus, etc. It can be understood that in one embodiment of the present application, the first camera module 1A and the second camera module 1B of the dual-camera module are connected to each other by a bracket (not shown).

[0206] Correspondingly, the first optical lens 10A includes a first lens barrel 11A and a first lens group 12A installed in the first lens barrel 11A, the first lens group 12A includes at least one optical lens, the second optical lens 10B includes a second lens barrel 11B and a second lens group 12B installed in the second lens barrel 11B, the second lens group 12B includes at least one optical lens, and the number of the optical lenses can be one or more and is not limited.

[0207] The first drive component includes a chip drive motor 30A, and the second drive component includes a chip drive motor 30B. The first chip drive motor 30A and the second chip drive motor 30B are respectively suitable for driving the first photosensitive component 40A and the second photosensitive component 40B to translate and / or rotate, thereby realizing the chip anti-shake function of the first camera module 1A and the second camera module 1B. The first chip drive motor 30A includes a first chip anti-shake fixed part 31A, a first chip anti-shake movable part 33A, a first chip drive element 32A, and a first chip drive conductive part (i.e., a first chip anti-shake conductive part 35A). The second chip drive motor 30B includes a second chip anti-shake fixed part 31B, a second chip anti-shake movable part 33B, a second chip drive element 32B, and a second chip drive conductive part (i.e., a second chip anti-shake conductive part 35B). The first chip anti-shake fixed portion 31A has a receiving cavity to accommodate the first chip anti-shake movable portion 33A, the first chip driver component 32A, and the first chip anti-shake conductive portion 35A. The second chip anti-shake fixed portion 31B has a receiving cavity to accommodate the second chip anti-shake movable portion 33B, the second chip driver component 32B, and the second chip anti-shake conductive portion 35B. The first chip anti-shake conductive portion 35A and the second chip anti-shake conductive portion 35B provide current to the first chip driver component 32A and the second chip driver component 32B, respectively. The first chip driver component 32A is used to drive the first chip anti-shake movable portion 33A to move relative to the first chip anti-shake fixed portion 31A, and the second chip driver component 32B is used to drive the second chip anti-shake movable portion 33B to move relative to the second chip anti-shake fixed portion 31B. The first photosensitive component 40A and the second photosensitive component 40B are respectively fixed to the first chip anti-shake movable part 33A and the second chip anti-shake movable part 33B, so that the first chip anti-shake movable part 33A and the second chip anti-shake movable part 33B respectively drive the first photosensitive component 40A and the second photosensitive component 40B to move relative to the first chip anti-shake fixed part 31A and the second chip anti-shake fixed part 31B.

[0208] The first driving assembly of the first camera module 1A further includes a first lens driving motor 20A, and the second driving assembly of the second camera module 1B further includes a second lens driving motor 20B. The first lens driving motor 20A is suitable for driving the first optical lens 10A to translate and / or rotate, and the second lens driving motor 20B is suitable for driving the second optical lens 10B to translate and / or rotate, thereby realizing lens focusing, lens anti-shake and other functions of the first camera module 1A and the second camera module 1B. The first lens driving motor 20A includes a first lens driving fixed part, a first lens driving movable part, a first lens driving element and a first lens driving conductive part. The first lens driving fixed part has an accommodating cavity to accommodate the first lens driving movable part, the first lens driving element and the first lens driving conductive part. The first lens driving conductive part provides driving power for the first lens driving element. The first lens driving element is used to drive the first lens driving movable part to move relative to the first lens driving fixed part. The second lens drive motor 20B includes a second lens drive fixed part, a second lens drive movable part, a second lens drive element and a second lens drive conductive part. The second lens drive fixed part has a accommodating cavity to accommodate the second lens drive movable part, the second lens drive element and the second lens drive conductive part. The second lens drive conductive part provides a driving power supply for the second lens drive element. The second lens drive element is used to drive the second lens drive movable part to move relative to the second lens drive fixed part.

[0209] The first optical lens 10A and the second optical lens 10B are fixed to the first lens driving movable portion and the second lens driving movable portion, respectively, so that the first lens driving element drives the first optical lens 10A to move relative to the first lens driving fixed portion, and the second lens driving element drives the second optical lens 10B to move relative to the second lens driving fixed portion. For example, the first optical lens 10A and the second optical lens 10B are driven to move along their optical axes to achieve lens focusing; or the first optical lens 10A and the second optical lens 10B are driven to translate in a direction perpendicular to their optical axes or to rotate in a direction perpendicular to their optical axes to achieve lens anti-shake function. The first lens driving motor 20A fixes the first lens driving fixed portion to the chip anti-shake fixed portion 31A of the first chip driving motor 30A, thereby positioning the first optical lens 10A in the light-sensing path of the first photosensitive component 40A. The second lens driving motor 20B fixes the second lens driving fixing part to the chip anti-shake fixing part 31B of the second chip driving motor 30B, so that the second optical lens 10B is set on the light-sensing path of the second photosensitive component 40B.

[0210] In one embodiment of the present application, the first lens driving motor 20A and / or the second lens driving motor 20B are not provided in the multi-camera module, and the first optical lens 10A and / or the second optical lens 10B are directly mounted on the first chip anti-shake fixing part 31A of the first chip driving motor 30A and / or the second chip anti-shake fixing part 31B of the second chip driving motor 30B, or, the first optical lens 10A and / or the second optical lens 10B are indirectly mounted on the first chip anti-shake fixing part 31A of the first chip driving motor 30A and / or the second chip anti-shake fixing part 31B of the second chip driving motor 30B through a supporting member, so that the first optical lens 10A is set on the photosensitive path of the first photosensitive component 40A, and the second optical lens 10B is set on the photosensitive path of the second photosensitive component 40B.

[0211] The first photosensitive assembly 40A includes a first circuit board 41A, a first photosensitive chip 42A electrically connected to the first circuit board 41A, and a first electronic component 43A. The second photosensitive assembly 40B includes a second circuit board 41B, a second photosensitive chip 42B electrically connected to the second circuit board 41B, and a second electronic component 43B. The first photosensitive chip 42A is used to receive the external light imaging collected by the first optical lens 10A and is electrically connected to an external mobile electronic device through the first circuit board 41A. The second photosensitive chip 42B is used to receive the external light imaging collected by the second optical lens 10B and is electrically connected to an external mobile electronic device through the second circuit board 41B. In one embodiment of the present application, the first electronic component 43A and the second electronic component 43B can be one or more of passive electronic components such as resistors and capacitors and active electronic components such as driver chips and memory chips. The first electronic component 43A and the second electronic component 43B can be electrically connected to the front of the first circuit board 41A and the second circuit board 41B, or can be electrically connected to the back of the first circuit board 41A and the second circuit board 41B, depending on the design requirements of the first camera module 1A and the second camera module 1B.

[0212] The first photosensitive chip 42A is directly or indirectly fixed to the first circuit board 41A. The first photosensitive chip 42A includes a photosensitive area and a non-photosensitive area. The first photosensitive chip 42A is electrically connected to the first circuit board 41A via a chip pad located in the non-photosensitive area. For example, the first photosensitive chip 42A can be electrically connected to the first circuit board 41A by wire bonding (gold wire), welding, FC process (chip flip-chip) or RDL (rewiring layer technology). The second photosensitive chip 42B can be directly or indirectly fixed to the second circuit board 41B. The second photosensitive chip 42B includes a photosensitive area and a non-photosensitive area. The second photosensitive chip 42B is electrically connected to the second circuit board 41B via a chip pad located in the non-photosensitive area. For example, the second photosensitive chip 42B can be electrically connected to the second circuit board 41B by wire bonding (gold wire), welding, FC process (chip flip-chip) or RDL (rewiring layer technology).

[0213] In one embodiment of the present application, the first circuit board 41A includes a circuit board body 411A and a connecting strip 412A, and the second circuit board 41B includes a circuit board body 411B and a connecting strip 412B. The connecting strip 412A of the first circuit board 41A is connected to and electrically connected to the circuit board body 411A, thereby transmitting imaging information acquired by the first photosensitive chip 42A to an external mobile electronic device through the circuit board body 411A and the connecting strip 412A. The connecting strip 412B of the second circuit board 41B is connected to and electrically connected to the circuit board body 411B, thereby transmitting imaging information acquired by the second photosensitive chip 42B to an external mobile electronic device through the circuit board body 411B and the connecting strip 412B.

[0214] In a specific embodiment of the present application, the connecting belt 412A of the first circuit board 41A includes a first connecting belt 4121A and a second connecting belt 4122A. The first connecting belt 4121A and the second connecting belt 4122A extend outward from opposite sides of the circuit board body 411A, respectively, and are further bent upward and to the side so that the first connecting belt 4121 and the second connecting belt 4122A are electrically connected. This arrangement can enable the circuit board body 411A to remain stable during movement, further reducing the resistance when driving the first circuit board 41A to move. In one specific embodiment of the present application, the connecting strips 412B of the second circuit board 41B include a first connecting strip 4121B and a second connecting strip 4122B. The first connecting strip 4121B and the second connecting strip 4122B extend outward from opposite sides of the circuit board body 411B, further bend upward and laterally, so as to electrically connect the first connecting strip 4121 and the second connecting strip 4122B. This arrangement can ensure that the circuit board body 411B remains stable during movement, further reducing the resistance when driving the second circuit board 41B to move. Of course, in another specific example of the present application, the first connecting strip 4121A and the second connecting strip 4122A of the first circuit board 41A can extend outward from adjacent sides of the circuit board body 411A and bend upward, while the first connecting strip 4121B and the second connecting strip 4122B of the second circuit board 41B can extend outward from adjacent sides of the circuit board body 411B and bend upward. This application is not limited to this.

[0215] The first photosensitive component 40A further includes a first filter element 44A, which is retained on the photosensitive path of the first photosensitive chip 42A and is used to filter the imaging light entering the first photosensitive chip 42A. The second photosensitive component 40B further includes a second filter element 44B, which is retained on the photosensitive path of the second photosensitive chip 42B and is used to filter the imaging light entering the second photosensitive chip 42B. In a specific example, the first filter element 44A is mounted and fixed on the first base 45A of the first photosensitive component 40A and corresponds to at least part of the photosensitive area of ​​the first photosensitive chip 42A. The first filter element 44A can be attached to the first base 45A upright or upside down. The first base 45A has a light hole, so that the light of the first optical lens 10A can pass through the light hole of the first base 45A and enter the first photosensitive chip 42A. The second filter element 44B is mounted and fixed on the second base 45B of the second photosensitive component 40B and corresponds to at least part of the photosensitive area of ​​the second photosensitive chip 42B. The second filter element 44B can be attached upright or upside down to the second base 45B. The second base 45B has a light hole, so that the light of the second optical lens 10B can pass through the light hole of the second base 45B and enter the second photosensitive chip 42B.

[0216] The first photosensitive component 40A can be fixed to the first chip anti-shake movable part 33A of the first chip driving motor 30A via the first circuit board 41A (the first circuit board body 411A) or the first base 45A, so that the first photosensitive component 40A moves with the movement of the first chip anti-shake movable part 33A. The second photosensitive component 40B can be fixed to the second chip anti-shake movable part 33B of the second chip driving motor 30B via the second circuit board body 411B of the second circuit board 41B or the second base 45B, so that the second photosensitive component 40B moves with the movement of the second chip anti-shake movable part 33B.

[0217] In one embodiment of the present application, the first photosensitive chip 42A and the second photosensitive chip 42B are eccentrically arranged in the two single-camera modules (the first camera module 1A and the second camera module 1B) of the dual-camera module, that is, the central axis of the first photosensitive chip 42A is inconsistent with the central axis of the first chip drive motor 30A, and the central axis of the second photosensitive chip 42B is inconsistent with the central axis of the second chip drive motor 30B. Specifically, the side of the first photosensitive chip 42A with a shorter distance to the first chip movable carrier 331A and the side of the second photosensitive chip 42B with the shortest distance to the second chip movable carrier 331B are close to each other, that is, the side of the photosensitive chip 42A close to the chip movable carrier 331A and the side of the photosensitive chip 42B close to the chip movable carrier 331B are adjacent to each other, so that the first optical lens 10A and the second optical lens 10B are arranged closer to each other to enhance the optical performance of the dual-camera module.

[0218] The first chip driving element 32A is arranged between the first chip anti-shake movable part 33A and the first chip anti-shake fixed part 31A. The first chip anti-shake conductive part 35A electrically connects the first chip driving element 32A and the first photosensitive component 40A, and provides a driving power supply for the first chip driving element 32A to drive the first chip anti-shake movable part 33A to translate in the X-axis direction (i.e., the direction set by the X-axis) and the Y-axis direction (i.e., the direction set by the Y-axis) and / or rotate around the Z-axis direction (i.e., the direction set by the Z-axis) to achieve translational anti-shake and / or rotational anti-shake of the first photosensitive component 40A. The second chip driving element 32B is arranged between the second chip anti-shake movable part 33B and the second chip anti-shake fixed part 31B. The second chip anti-shake conductive part 35B electrically connects the second chip driving element 32B and the second photosensitive component 40B, and provides a driving power supply for the second chip driving element 32B to drive the second chip anti-shake movable part 33B to translate in the X-axis direction (i.e., the direction set by the X-axis) and the Y-axis direction (i.e., the direction set by the Y-axis) and / or rotate around the Z-axis direction (i.e., the direction set by the Z-axis) to achieve translational anti-shake and / or rotational anti-shake of the second photosensitive component 40B.

[0219] It is worth mentioning that in the embodiment of the present application, the X-axis direction and the Y-axis direction are perpendicular to each other, the Z-axis direction is perpendicular to the plane where the X-axis direction and the Y-axis direction are located, and the Z-axis direction is also the direction of the optical axis of the first optical lens 10A and the second optical lens 10B. In other words, the X-axis, Y-axis and Z-axis constitute a three-dimensional coordinate system, and the XOY plane where the X-axis direction and the Y-axis direction are located is also called the plane where the horizontal direction is located.

[0220] In one embodiment of the present application, the first chip anti-shake fixing part 31A includes an upper cover 311A ​​and a base 312A that are interlocked to form the receiving cavity, and the second chip anti-shake fixing part 31B includes an upper cover 311B and a base 312B that are interlocked to form the receiving cavity. The upper cover 311A ​​and the base 312A are fixed to each other and form a receiving cavity (i.e., the receiving cavity of the first chip anti-shake fixed part 31A) to accommodate the first chip anti-shake movable part 33A, the first chip driving component 32A, the first chip anti-shake conductive part 35A, and the first photosensitive component 40A and other camera module components. The upper cover 311B and the base 312B are fixed to each other and form a receiving cavity (i.e., the receiving cavity of the second chip anti-shake fixed part 31B) to accommodate the second chip anti-shake movable part 33B, the second chip driving component 32B, the second chip anti-shake conductive part 35B, and the second photosensitive component 40B and other camera module components. This not only protects the above-mentioned camera module components, but also reduces dust, dirt, or stray light from entering the interior of the first chip driving motor 30A and the second chip driving motor 30B. In a specific example of the present application, the upper covers 311A, 311B and the bases 312A, 312B can be made of a metal material such as non-magnetic stainless steel.

[0221] Specifically, in the embodiment of the present application, the upper cover 311A ​​of the first chip anti-shake fixing part 31A is disposed above the base 312A, and the upper cover 311B of the second chip anti-shake fixing part 31B is disposed above the base 312B. The upper cover 311A ​​of the first chip anti-shake fixing part 31A includes a cover body 3111A having an opening in the center, which corresponds to the first photosensitive component 40A, so that light can enter the first photosensitive component 40A through the opening for imaging. The upper cover 311B of the second chip anti-shake fixing part 31B includes a cover body 3111B having an opening in the center, which corresponds to the second photosensitive component 40B, so that light can enter the second photosensitive component 40B through the opening for imaging. Preferably, the opening is circular. Furthermore, the upper cover 311A ​​of the first chip anti-shake fixing part 31A may also include a cover body peripheral side 3112A extending integrally from the cover body main body 3111A toward the base 312A, thereby being fixedly connected to the base 312A through the cover body peripheral side 3112A. The upper cover 311B of the second chip anti-shake fixing part 31B may also include a cover body peripheral side 3112B extending integrally from the cover body main body 3111B toward the base 312B, thereby being fixedly connected to the base 312B through the cover body peripheral side 3112B. For example, the cover body peripheral sides 3112A, 3112B and the bases 312A, 312B are fixed by laser welding or bonding with an adhesive medium. The cover 3112A of the first chip anti-shake fixing portion 31A also includes at least one peripheral recess 31121A. This allows at least one exit for the connection strip 412A to be formed between the upper cover 311A ​​and the base 312A, allowing the connection strip 412A of the first circuit board 41A to extend outward from the accommodating cavity of the first chip anti-shake fixing portion 31A. The cover 3112B of the second chip anti-shake fixing portion 31B also includes at least one peripheral recess 31121B. This allows at least one exit for the connection strip 412B to be formed between the upper cover 311B and the base 312B, allowing the connection strip 412B of the second circuit board 41B to extend outward from the accommodating cavity of the second chip anti-shake fixing portion 31B. In a specific example of the present application, the peripheral side 3112A of the cover body of the first chip anti-shake fixing part 31A includes two relatively arranged peripheral recesses 31121A, and two connecting belt 412A outlets are formed between the upper cover 311A ​​and the base 312A to allow the first connecting belt 4121A and the second connecting belt 4122A of the first circuit board 41A to extend outward from the accommodating cavity of the first chip anti-shake fixing part 31A.The peripheral side 3112B of the cover body of the second chip anti-shake fixing part 31B includes two relatively arranged peripheral recesses 31121B, and two connecting belt 412B outlets are formed between the upper cover 311B and the base 312B to allow the first connecting belt 4121B and the second connecting belt 4122B of the second circuit board 41B to extend outward from the accommodating cavity of the second chip anti-shake fixing part 31B.

[0222] In the embodiment of the present application, the first chip anti-shake movable portion 33A is movably received within the receiving cavity of the first chip anti-shake fixed portion 31A, and the second chip anti-shake movable portion 33B is movably received within the receiving cavity of the second chip anti-shake fixed portion 31B. Specifically, the first chip anti-shake movable portion 33A is suspended within the receiving cavity of the first chip anti-shake fixed portion 31A, so that the first chip anti-shake movable portion 33A can move relative to the first chip anti-shake fixed portion 31A, and the second chip anti-shake movable portion 33B is suspended within the receiving cavity of the second chip anti-shake fixed portion 31B, so that the second chip anti-shake movable portion 33B can move relative to the second chip anti-shake fixed portion 31B.

[0223] The first chip stabilization movable portion 33A includes a movable chip carrier 331A having opposing upper and lower surfaces. A first chip driver element 32A is disposed between the movable chip carrier 331A of the first chip stabilization movable portion 33A and the upper cover 311A. The first chip driver element 32A drives the movable chip carrier 331A to move relative to the first chip stabilization fixed portion 31A. The movable chip carrier 331A of the first chip stabilization movable portion 33A is adapted to mount a first photosensitive component 40A thereon. Specifically, the first photosensitive component 40A is adapted to be mounted on the movable chip carrier 331A of the first chip stabilization movable portion 33A. In one embodiment of the present application, the first photosensitive component 40A is provided between the chip movable carrier 331A of the first chip anti-shake movable part 33A and the base 312A. The first photosensitive component 40A is installed on the chip movable carrier 331A of the first chip anti-shake movable part 33A through the first circuit board 41A, and then the first photosensitive component 40A moves with the chip movable carrier 331A of the first chip anti-shake movable part 33A. In an embodiment of the present application, there is a gap between the chip movable carrier 331A of the first chip anti-shake movable part 33A and the base 312A, and there is also a certain air gap between the bottom surface of the first photosensitive component 40A (that is, the side of the first photosensitive component 40A close to the base 312A) and the base 312A. In this way, the movement of the first photosensitive component 40A is not easily hindered by the base 312A, reducing the driving force requirement of the first chip driving element 32A. In other words, the first photosensitive component 40A is suspended above the base 312A of the first chip anti-shake movable part 33A.

[0224] The second chip stabilization movable portion 33B includes a movable chip carrier 331B having opposing upper and lower surfaces. A second chip driver 32B is disposed between the movable chip carrier 331B of the second chip stabilization movable portion 33B and the upper cover 311B. The second chip driver 32B drives the movable chip carrier 331B to move relative to the second chip stabilization fixed portion 31B. The movable chip carrier 331B of the second chip stabilization movable portion 33B is suitable for mounting a second photosensitive component 40B thereon. Specifically, the second photosensitive component 40B is suitable for being mounted on the movable chip carrier 331B of the second chip stabilization movable portion 33B. In one embodiment of the present application, the second photosensitive component 40B is provided between the chip movable carrier 331B of the second chip anti-shake movable part 33B and the base 312B, and the second photosensitive component 40B is installed on the chip movable carrier 331B of the second chip anti-shake movable part 33B through the second circuit board 41B, and then the second photosensitive component 40B moves with the chip movable carrier 331B of the second chip anti-shake movable part 33B. In an embodiment of the present application, there is a gap between the chip movable carrier 331B of the second chip anti-shake movable part 33B and the base 312B, and there is also a certain air gap between the bottom surface of the second photosensitive component 40B (that is, the side of the second photosensitive component 40B close to the base 312B) and the base 312B. In this way, the movement of the second photosensitive component 40B is not easily hindered by the base 312B, reducing the driving force requirement of the second chip driving element 32B. In other words, the second photosensitive component 40B is suspended above the base 312B of the second chip anti-shake movable part 33B.

[0225] It is worth mentioning that in the dual-camera module, the first chip driving element 32A is not provided on at least one side (for example, the first side) of the driving component (i.e., the first driving component) of the first camera module 1A, and the second chip driving element 32B is not provided on at least one side (for example, the second side) of the driving component (i.e., the second driving component) of the second camera module 1B, wherein the side (for example, the first side) of the driving component of the first camera module 1A where the chip driving element 32A is not provided and the side (for example, the second side) of the driving component of the second camera module 1B where the chip driving element 32B is not provided are adjacent.

[0226] Specifically, the first chip driving component 32A is not provided on the first side of the first chip driving motor 30A (i.e., the first side of the driving component of the first camera module 1A), and the second chip driving component 32B is not provided on the second side of the second chip driving motor 30B (i.e., the second side of the driving component of the second camera module 1B). The first side of the first chip driving motor 30A and the second side of the second chip driving motor 30B are adjacent to each other because the first chip driving component 32A and the second chip driving component 32B do not need to be provided on the first side of the first chip driving motor 30A and the second side of the second chip driving motor 30B that are adjacent to each other. 32B, the first photosensitive chip 42A and the second photosensitive chip 40B have a larger placement space on the first side of the first chip driving motor 30A and the second side of the second chip driving motor 30B, so that the first photosensitive chip 42A can be closer to the edge of the first side of the first chip driving motor 30A where the first chip driving element 32A is not set, and the second photosensitive chip 40B can be closer to the edge of the second side of the second chip driving motor 30B where the second chip driving element 32B is not set, thereby achieving the effect of eccentric setting of the first photosensitive chip 42A and the second photosensitive chip 40B.

[0227] The first side of the first chip driving motor 30A where the first chip driving element 32A is not set and the second side of the second chip driving motor 30Bd are arranged adjacent to each other, that is, the first side of the first chip driving motor 30A where the first chip driving element 32A is not set and the second side of the second chip driving motor 30Bd are arranged close to each other. This arrangement ensures that no chip driving elements (that is, the first chip driving element 32A and the second chip driving component 32B) are set adjacent to the first camera module 1A and the second camera module 1B of the dual-camera module, so as to avoid the influence of magnetic interference.

[0228] Specifically, the first photosensitive component 40A has a first central axis, the first driving component has a second central axis, and the first central axis is offset from the second central axis. Specifically, the central axis of the first photosensitive chip 42A of the first photosensitive component 40A is the first central axis of the first photosensitive component 40A, the central axis of the first chip driving motor 30A is the second central axis of the first driving component, and the first photosensitive chip 42A is eccentrically arranged relative to the center of the first driving component, that is, the photosensitive chip 42A of the first photosensitive component 40A is eccentrically arranged in the first chip driving motor 30A, and the central axis of the first photosensitive chip 42A of the first photosensitive component 40A is eccentrically arranged, that is, the central axis of the first photosensitive chip 42A is inconsistent with the central axis of the first chip driving motor 30A. (The central axis of the first photosensitive chip 42A is the axis passing through the intersection of the diagonals of the first photosensitive chip 42A when viewed from above and parallel to the Z-axis direction; the central axis of the first chip driving motor 30A is the axis passing through the intersection of the diagonals of the first chip driving motor 30A when viewed from above and parallel to the Z-axis direction).

[0229] The second photosensitive assembly 40B has a first central axis, and the second drive assembly has a second central axis, with the first central axis being offset from the second central axis. Specifically, the central axis of the second photosensitive chip 42B of the second photosensitive assembly 40B is the first central axis of the second photosensitive assembly 40B, and the central axis of the second chip drive motor 30B is the second central axis of the second drive assembly. The second photosensitive chip 42B is disposed eccentrically relative to the center of the second drive assembly, i.e., the photosensitive chip 42B of the second photosensitive assembly 40B is disposed eccentrically within the second chip drive motor 30B, and the central axis of the second photosensitive chip 42B of the second photosensitive assembly 40B is disposed eccentrically, i.e., the central axis of the second photosensitive chip 42B is not aligned with the central axis of the second chip drive motor 30B. (The central axis of the second photosensitive chip 42B is the axis that passes through the intersection of the diagonals of the second photosensitive chip 42B when viewed from above and is parallel to the Z-axis; the central axis of the second chip drive motor 30B is the axis that passes through the intersection of the diagonals of the second chip drive motor 30B when viewed from above and is parallel to the Z-axis.)

[0230] The movable chip carrier 331A of the first movable chip anti-shake unit 33A includes a fixed chip carrier body 3311A and a chip carrier side portion 3312B. The first circuit board 41A is fixed to the bottom surface of the chip carrier body 3311A of the first movable chip anti-shake unit 33A (i.e., the side facing the base 312A). The chip carrier body 3311A of the first movable chip anti-shake unit 33A has a carrier body through hole 33111A and 33111B. The carrier body through hole 33111A is suitable for not only providing a light path for the first photosensitive chip 42A of the first photosensitive component 40A, but also providing a mounting space for the first electronic component 43A on the first photosensitive component 40A, thereby preventing interference between the first electronic component 43A and the first chip carrier body 3311A. The chip carrier side portion 3312A of the first chip anti-shake movable part 33A includes a first carrier side portion 33121A, a second carrier side portion 33122A, a third carrier side portion 33123A, and a fourth carrier side portion 33124, extending integrally outward from the chip carrier main body 3311A. The first carrier side portion 33121A and the third carrier side portion 33123A of the first chip anti-shake movable part 33A are disposed opposite each other and are adjacent to the second carrier side portions 33122A, 33122B, and the fourth carrier side portions 33124A, 33124B. The second carrier side portion 33122A and the fourth carrier side portion 33124A are disposed opposite each other. The first carrier side portion 33121A, the second carrier side portion 33122A, the third carrier side portion 33123A and the fourth carrier side portion 33124A are suitable as anti-collision components when the chip carrier body 3311A moves, so as to avoid the chip carrier body 3311A of the first chip anti-shake movable portion 33A directly colliding with the first chip anti-shake fixed portion 31A.

[0231] The movable chip carrier 331B of the second movable chip anti-shake unit 33B includes a fixed chip carrier body 3311B and a chip carrier side portion 3312B. The second circuit board 41B is fixed to the bottom surface of the chip carrier body 3311B of the second movable chip anti-shake unit 33B (i.e., the side facing the base 312B). The chip carrier body 3311B of the second movable chip anti-shake unit 33B has a carrier body through hole 33111B, 33111B. The carrier body through hole 33111B is suitable for not only providing a light path for the second photosensitive chip 42B of the second photosensitive assembly 40B, but also providing a mounting space for the second electronic component 43B on the second photosensitive assembly 40B, thereby preventing interference between the second electronic component 43B and the second chip carrier body 3311B. The chip carrier side portion 3312B of the second chip anti-shake movable part 33B includes a first carrier side portion 33121B, a second carrier side portion 33122B, a third carrier side portion 33123B, and a fourth carrier side portion 33124, extending integrally outward from the chip carrier main body 3311B. The second carrier side portion 33121B of the first chip anti-shake movable part 33B is disposed opposite the third carrier side portion 33123B and adjacent to the second carrier side portion 33122B and the fourth carrier side portion 33124B. The second carrier side portion 33122B is disposed opposite the fourth carrier side portion 33124B. The first carrier side 33121B, the second carrier side 33122B, the third carrier side 33123B and the fourth carrier side 33124B are suitable as anti-collision components when the chip carrier body 3311B moves, so as to prevent the chip carrier body 3311B of the second chip anti-shake movable part 33B from directly colliding with the second chip anti-shake fixed part 31B.

[0232] In one embodiment of the present application, the chip carrier side portion 3312A (the first carrier side portion 33121A, the second carrier side portion 33122A, the third carrier side portion 33123A and the fourth carrier side portion 33124A) of the first chip anti-shake movable part 33A further extends toward the side of the chip carrier main body 3311A, that is, the chip carrier side portion 3312A further extends outward from the outer periphery of the chip carrier main body 3311A, and the chip carrier side portion 3312A protrudes from the side wall of the chip carrier main body 3311A, so that the first chip anti-shake movable part 33A collides with the first chip anti-shake fixed part 31A through the chip carrier side portion 3312A during movement, thereby avoiding direct collision between the chip carrier main body 3311A where the first photosensitive component 40A is set and the first chip anti-shake fixed part 31A, thereby causing damage to the first photosensitive component 40A.

[0233] In one embodiment of the present application, the chip carrier side portion 3312B (the first carrier side portion 33121B, the second carrier side portion 33122B, the third carrier side portion 33123B and the fourth carrier side portion 33124B) of the second chip anti-shake movable part 33B further extends toward the side of the chip carrier main body 3311B, that is, the chip carrier side portion 3312B further extends outward from the outer periphery of the chip carrier main body 3311B, and the chip carrier side portion 3312B protrudes from the side wall of the chip carrier main body 3311B, so that the second chip anti-shake movable part 33B collides with the second chip anti-shake fixed part 31B through the chip carrier side portion 3312B during movement, thereby avoiding direct collision between the chip carrier main body 3311B where the second photosensitive component 40B is set and the second chip anti-shake fixed part 31B, thereby causing damage to the second photosensitive component 40B.

[0234] The first photosensitive chip 42A is eccentrically arranged in the chip movable carrier 331A. The center of the first photosensitive chip 42A is A The distances to the two opposing sides of the movable chip carrier 331 of the first chip stabilization movable unit 33A are unequal. Alternatively, the first photosensitive chip 42A is closer to at least one side of the movable chip carrier 331A of the first chip stabilization movable unit 33A, that is, the first photosensitive chip 42A is closer to at least one side of the first chip drive motor 30A. In a specific example of the present application, the first photosensitive chip 42A of the first photosensitive component 40A has a rectangular structure with a long side and a wide side. The edges of the first photosensitive component 40A can be defined as a first side, a second side, a third side, and a fourth side. A rectangular coordinate system is established with the intersection of the diagonals of the first photosensitive chip 42A as the center origin. The first and third sides are parallel to the X-axis, and the second and fourth sides are parallel to the Y-axis. Accordingly, the movable chip carrier 331A of the first chip stabilization movable unit 33A also has a first side, a second side, a third side, and a fourth side corresponding to the first photosensitive component 40A.

[0235] The second photosensitive chip 42B is eccentrically arranged in the chip movable carrier 331B, and the center of the second photosensitive chip 42B is BThe distances to the two opposing sides of the movable chip carrier 331 of the second chip stabilization movable unit 33B are unequal. Alternatively, the second photosensitive chip 42B is closer to at least one side of the movable chip carrier 331B of the second chip stabilization movable unit 33B, that is, the second photosensitive chip 42B is closer to at least one side of the second chip drive motor 30B. In a specific example of the present application, the second photosensitive chip 42B of the second photosensitive component 40B has a rectangular structure with a long side and a wide side. The outer edges of the second photosensitive component 40B can be defined as a first side, a second side, a third side, and a fourth side. A rectangular coordinate system is established with the intersection of the diagonals of the second photosensitive chip 42B as the center origin. The first and third sides are parallel to the X-axis, and the second and fourth sides are parallel to the Y-axis. Accordingly, the movable chip carrier 331B of the second chip stabilization movable unit 33B also has a first side, a second side, a third side, and a fourth side corresponding to the second photosensitive component 40B.

[0236] The side of the third side of the chip movable carrier 331A adjacent to the first chip anti-shake movable part 33A of the first camera module 1A is the first side of the first camera module 1A, the side of the first side of the chip movable carrier 331A adjacent to the first chip anti-shake movable part 33A is the second side of the first camera module 1A, the side of the fourth side of the chip movable carrier 331A adjacent to the first chip anti-shake movable part 33A is the third side of the first camera module 1A, and the side of the second side of the chip movable carrier 331A adjacent to the first chip anti-shake movable part 33A is the fourth side of the first camera module 1A. The side of the first side of the chip movable carrier 331B of the second chip anti-shake movable part 33B adjacent to the second chip anti-shake movable part 33B of the second camera module 1B is the first side of the second camera module 1B, the side of the third side of the chip movable carrier 331B adjacent to the second chip anti-shake movable part 33B is the second side of the first camera module 1B, the side of the second side of the chip movable carrier 331B adjacent to the second chip anti-shake movable part 33B is the third side of the first camera module 1B, and the side of the fourth side of the chip movable carrier 331B adjacent to the second chip anti-shake movable part 33B is the fourth side of the second camera module 1B.

[0237] The center O of the first photosensitive chip 42A A The distance from the first side of the chip movable carrier 331A is H1 A , the center O of the first photosensitive chip 42A A The distance from the third side of the chip movable carrier 331A is H2 A , H1 A >H2 AThat is, the distance between the first central axis of the first photosensitive chip 42A and the third side of the chip movable carrier 331A is smaller than the distance between the first central axis of the first photosensitive chip 42A and the first side of the chip movable carrier 331A of the first chip anti-shake movable part 33A. The first photosensitive chip 42A is closer to the third side of the chip movable carrier 331A of the first chip anti-shake movable part 33A and farther away from the first side of the chip movable carrier 331A of the first chip anti-shake movable part 33A. The center O of the second photosensitive chip 42B B The distance from the first side of the chip movable carrier 331B is H1 B , the center O of the second photosensitive chip 42B B The distance from the third side of the chip movable carrier 331B is H2 B , H1 B >H2 B That is, the distance between the first central axis of the second photosensitive chip 42B and the third side of the chip movable carrier 331B is smaller than the distance between the first central axis of the second photosensitive chip 42B and the first side of the chip movable carrier 331B of the second chip anti-shake movable part 33B. The second photosensitive chip 42B is closer to the third side of the chip movable carrier 331B of the second chip anti-shake movable part 33B and farther away from the first side of the chip movable carrier 331B of the second chip anti-shake movable part 33B. For example, the H1 A 、H1 B The range is: 6mm-8mm, H2 A 、H2 B The range is: 3mm-4mm, preferably, H1 A 、H1 B 7.14mm, H2 A 、H2 B The third side of the movable chip carrier 331A of the first movable chip anti-shake unit 33A is adjacent to the third side of the movable chip carrier 331B of the second movable chip anti-shake unit 33B, while the first side of the movable chip carrier 331A of the first movable chip anti-shake unit 33A is spaced apart from the first side of the movable chip carrier 331B of the second movable chip anti-shake unit 33B, as shown in Figures 15 and 16.

[0238] Of course, in other embodiments of the present application, H1 may also be A <H2 A , H1 B <H2 BThat is, the first photosensitive chip 42A is closer to the third side of the chip movable carrier 331A of the first chip anti-shake movable part 33A, and away from the first side of the chip movable carrier 331A; the second photosensitive chip 42B is closer to the third side of the chip movable carrier 331B of the second chip anti-shake movable part 33B, and away from the first side of the chip movable carrier 331B. This application does not impose any restrictions on this.

[0239] The center O of the first photosensitive chip 42A A The distance from the second side of the chip movable carrier 331A of the first chip anti-shake movable part 33A is H3 A , the center O of the first photosensitive chip 42A A The distance from the fourth side of the chip movable carrier 331A to the first chip anti-shake movable part 33A is H4 A , the H3 A Can be equal to H4 A , the H3 A Can be smaller than H4 A , the H3 A It can also be larger than H4 A That is to say, the first photosensitive chip 42A only needs to be closer to at least one side of the chip movable carrier 331A of the first chip anti-shake movable part 33A, and this application does not impose any limitation on this.

[0240] The center O of the second photosensitive chip 42B B The distance from the second side of the chip movable carrier 331B to the second chip anti-shake movable part 33B is H3 B , the center O of the second photosensitive chip 42B B The distance from the fourth side of the chip movable carrier 331B of the second chip anti-shake movable part 33B is H4 B , the H3 B Can be equal to H4 B , the H3 B Can be smaller than H4 B , the H3 B It can also be larger than H4 B That is to say, the second photosensitive chip 42B only needs to be closer to at least one side of the chip movable carrier 331B of the second chip anti-shake movable part 33B, and this application does not impose any limitation on this.

[0241] The first chip driving element 32A includes a chip magnet component 321A and a chip coil component 322A, wherein the chip coil component 322A of the first chip anti-shake movable part 33A is arranged on the chip movable carrier 331A, and the chip magnet component 321A of the first chip driving element 32A is fixed to the upper cover 311A ​​of the first chip anti-shake fixed part 31A and corresponds to the chip coil component 322A. The chip magnet assembly 321A of the first chip anti-shake fixed portion 31A is fixed to the upper cover 311A ​​of the first chip anti-shake fixed portion 31A by, for example, bonding with an adhesive medium. The chip coil assembly 322A of the first chip driver element 32A is fixed to the chip movable carrier 331A of the first chip anti-shake movable portion 33A. The chip magnet assembly 321A of the first chip driver element 32A and the chip coil assembly 322A are arranged relative to each other, so that the magnetic field force between the chip coil assembly 322A and the chip magnet assembly 321A drives the first chip anti-shake movable portion 33A to move relative to the first chip anti-shake fixed portion 31A. In other words, in the present application, the chip magnet assembly 321A of the first chip driver element 32A is a stator, and the chip coil assembly 322A of the first chip driver element 32A is a mover. This arrangement ensures that the movement of the chip movable carrier 331A of the first chip anti-shake movable portion 33A will not be affected by magnetic interference, thereby avoiding affecting the chip anti-shake effect.

[0242] The second chip driving element 32B includes a chip magnet component 321B and a chip coil component 322B, wherein the chip coil component 322B of the second chip anti-shake movable part 33B is arranged on the chip movable carrier 331B, and the chip magnet component 321B of the second chip driving element 32B is fixed to the upper cover 311B of the second chip anti-shake fixed part 31B and corresponds to the chip coil component 322B. The chip magnet assembly 321B of the second chip anti-shake fixed part 31B is fixed to the upper cover 311B of the second chip anti-shake fixed part 31B by, for example, bonding with an adhesive medium, and the chip coil assembly 322B of the second chip driving element 32B is fixed to the chip movable carrier 331B of the second chip anti-shake movable part 33B. The chip magnet assembly 321B of the second chip driving element 32B and the chip coil assembly 322B are arranged relative to each other, so that the magnetic field force between the chip coil assembly 322B and the chip magnet assembly 321B drives the second chip anti-shake movable part 33B to move relative to the second chip anti-shake fixed part 31B. In other words, in the present application, the chip magnet assembly 321B of the second chip driving element 32B is a stator, and the chip coil assembly 322B of the second chip driving element 32B is a mover. This arrangement ensures that the movement of the chip movable carrier 331B of the second chip anti-shake movable part 33B will not be affected by magnetic interference, thereby avoiding affecting the chip anti-shake effect.

[0243] Further describing the specific structure of the first chip driver component 32A, each chip-coil assembly 322A of the first chip driver component 32A includes at least one chip coil. In one embodiment of the present application, at least one side of the chip movable carrier 331A of the first chip anti-shake movable portion 33A is not provided with the chip-coil assembly 322A. Specifically, the chip movable carrier 331A of the first chip anti-shake movable portion 33A includes a first side, a second side, a third side, and a fourth side that surround each other. The first side is opposite the third side, and the second side is opposite the fourth side. The first and third sides extend along the X-axis direction set by the driver component, while the second and fourth sides extend along the Y-axis direction set by the driver component, with the Y-axis direction being perpendicular to the X-axis direction. The chip-coil assembly 322A of the first chip driver component 32A includes a first chip coil group 3221A provided on the first side, and a second chip coil group 3222A and a third chip coil group 3223A provided on the opposing second and fourth sides.

[0244] Further, the specific structure of the second chip driving element 32B is described. Each chip coil assembly 322B of the second chip driving element 32B includes at least one chip coil. In one embodiment of the present application, the chip coil assembly 322B is not provided on at least one side of the chip movable carrier 331B of the second chip anti-shake movable part 33B. Specifically, the chip movable carrier 331B of the second chip anti-shake movable part 33B includes a first side, a second side, a third side and a fourth side that are enclosed with each other, the first side is opposite to the third side, and the second side is opposite to the fourth side. The first side and the third side extend along the X-axis direction set by the driving component, and the second side and the fourth side extend along the Y-axis direction set by the driving component, and the Y-axis direction is perpendicular to the X-axis direction. The chip coil assembly 322B of the second chip driving component 32B includes a first chip coil group 3221B disposed on the first side, and a second chip coil group 3222B and a third chip coil group 33223B disposed on the second side and the fourth side opposite to each other.

[0245] The first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A of the first chip driver component 32A are arranged in the plane of the X-axis and the Y-axis. That is, the first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A are arranged horizontally. The first chip coil group 3221A of the first chip driver component 32A is arranged along the X-axis, the second chip coil group 3222A is arranged along the Y-axis, and the third chip coil group 3223A is arranged along the Y-axis. The second chip coil group 3222A and the third chip coil group 3223A are arranged opposite each other along the Y-axis. Furthermore, the second chip coil group 3222A and the third chip coil group 3223A of the first chip driver component 32A are symmetrical with respect to the Y-axis. The first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 3223A of the first chip driving element 32A are arranged around three sides of the first photosensitive component 40A.

[0246] The first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B of the second chip driver component 32B are arranged in the plane of the X-axis and the Y-axis. That is, the first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B are arranged horizontally. The first chip coil group 3221B of the second chip driver component 32B is arranged along the X-axis, the second chip coil group 3222B is arranged along the Y-axis, and the third chip coil group 33223B is arranged along the Y-axis. The second chip coil group 3222B and the third chip coil group 33223B are arranged opposite each other along the Y-axis. Furthermore, the second chip coil group 3222B and the third chip coil group 33223B of the second chip driver component 32B are symmetrical with respect to the Y-axis. The first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B of the second chip driving element 32B are arranged around three sides of the second photosensitive component 40B.

[0247] The first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A of the first chip driver component 32A each include at least one chip coil. Specifically, the first chip coil group 3221A of the first chip driver component 32A includes at least one chip coil, the second chip coil group 3222A includes at least one chip coil, and the third chip coil group 3223A includes at least one chip coil. For example, in a specific example of the present application, the first chip coil group 3221A of the first chip driver component 32A includes a first chip coil 732211A and a second chip coil 732212A disposed on the first side, with the first chip coil 732211A and the second chip coil 732212A arranged along the X-axis. Specifically, the first chip coil 732211A and the second chip coil 732212A of the first chip driver component 32A are arranged relatively parallel to each other along the X-axis; the second chip coil assembly 3222A includes a third chip coil 732221A arranged on the second side; the third chip coil assembly 3223A includes a fourth chip coil 732231A arranged on the fourth side; and the third chip coil 732221A and the fourth chip coil 732231A are arranged relatively parallel to each other along the Y-axis. Alternatively, the first chip coil 732211A and the second chip coil 732212A of the first chip driver component 32A are arranged on the first side or the third side of the first photosensitive component 40A, while the third chip coil 732221A and the fourth chip coil 732231A are arranged on the second side and the fourth side of the first photosensitive component 40A, respectively.

[0248] The first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 33223B of the second chip driver component 32B each include at least one chip coil. That is, the first chip coil group 3221B of the second chip driver component 32B includes at least one chip coil, the second chip coil group 3222B includes at least one chip coil, and the third chip coil group 33223B includes at least one chip coil. For example, in one specific example of the present application, the first chip coil group 3221B of the second chip driver component 32B includes a first chip coil 732211B and a second chip coil 732212B disposed on the first side, with the first chip coil 732211B and the second chip coil 732212B arranged along the X-axis. Specifically, the first chip coil 732211B and the second chip coil 732212B of the second chip driver component 32B are arranged relatively parallel to each other along the X-axis direction; the second chip coil group 3222B includes a third chip coil 732221B arranged on the second side; the third chip coil group 33223B includes a fourth chip coil 732231B arranged on the fourth side; and the third chip coil 732221B and the fourth chip coil 732231B are arranged relatively parallel to each other along the Y-axis direction. Alternatively, the first chip coil 732211B and the second chip coil 732212B of the second chip driver component 32B are arranged on the first side or the third side of the second photosensitive component 40B, and the third chip coil 732221B and the fourth chip coil 732231B are arranged on the second side and the fourth side of the second photosensitive component 40B, respectively.

[0249] The first chip coil 732211A and the second chip coil 732212A of the first chip driving element 32A work together to drive the first chip anti-shake movable part 33A to move along the Y-axis direction and / or rotate around the Z-axis direction, and the third chip coil 732221A and the fourth chip coil 732231A work together to drive the first chip anti-shake movable part 33A to move along the X-axis direction.

[0250] The first chip coil 732211B and the second chip coil 732212B of the second chip driving element 32B work together to drive the second chip anti-shake movable part 33B to move along the Y-axis direction and / or rotate around the Z-axis direction, and the third chip coil 732221B and the fourth chip coil 732231B work together to drive the second chip anti-shake movable part 33B to move along the X-axis direction.

[0251] Preferably, the first chip coil 732211A and the second chip coil 732212A of the first chip driver element 32A have the same size, and the third chip coil 732221A and the fourth chip coil 732231A have the same size. The third chip coil 732221A and the fourth chip coil 732231A are smaller than the first chip coil 732211A and the second chip coil 732212A. This is because the third chip coil 732221A and the fourth chip coil 732231A of the first chip driver element 32A only need to drive the first chip anti-shake movable part 33 to achieve translation along the X-axis, while the first chip coil 732211A and the second chip coil 732212A of the first chip driver element 32A need to drive the first chip anti-shake movable part 33 to achieve both translation along the Y-axis and rotation about the Z-axis.

[0252] Preferably, the first chip coil 732211B and the second chip coil 732212B of the second chip driver element 32B are of the same size, and the third chip coil 732221B and the fourth chip coil 732231B are of the same size. The third chip coil 732221B and the fourth chip coil 732231B are smaller than the first chip coil 732211B and the second chip coil 732212B. This is because the third chip coil 732221B and the fourth chip coil 732231B of the second chip driver element 32B only need to drive the first chip anti-shake movable part 33 to achieve translation along the X-axis, while the first chip coil 732211B and the second chip coil 732212B of the second chip driver element 32B need to drive both translation along the Y-axis and rotation about the Z-axis.

[0253] In one embodiment of the present application, the chip coil assembly 322A of the first chip driver element 32A further includes a coil circuit board 3224A disposed on the chip movable carrier 331A, and at least one chip coil in the chip coil assembly 322A is fixed and electrically connected to the coil circuit board 3224A. In a specific example of the present application, the first chip coil group 3221A (the first chip coil 732211A, the second chip coil 732212A), the second chip coil group 3222A (the third chip coil 732221A) and the third chip coil group 3223A (the fourth chip coil 732231A) of the first chip driver element 32A are all fixed and electrically connected to the coil circuit board 3224A, and the chip coil assembly 322A is electrically connected to the first chip anti-shake conductive part 35A through the coil circuit board 3224A, thereby further electrically connected to the first circuit board 41A of the first photosensitive component 40A. Specifically, the first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 3223A of the first chip driving element 32A can be wound coils fixedly electrically connected to the coil circuit board 3224A; or, the first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 3223A can be directly wound on the coil circuit board 3224A; or, the first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 3223A are directly etched on the coil circuit board 3224A to form a planar coil (FP-Coil). This method can reduce the height of the chip coil assembly 322A of the first chip driving element 32A, thereby reducing the height of the chip driving motor 30A. Furthermore, the coil circuit board 3224A of the first chip driving element 32A has a circuit board light through hole 32241A, and the circuit board light through hole 32241A provides a light through hole for the light of the first optical lens 10A to enter the first photosensitive component 40A.

[0254] In one embodiment of the present application, the chip coil assembly 322B of the second chip driving element 32B further includes a coil circuit board 3224B provided on the chip movable carrier 331B, and at least one chip coil in the chip coil assembly 322B is fixed and electrically connected to the coil circuit board 3224B. In a specific example of the present application, the first chip coil group 3221B (the first chip coil 732211B, the second chip coil 732212B), the second chip coil group 3222B (the third chip coil 732221B) and the third chip coil group 33223B (the fourth chip coil 732231B) of the second chip driving element 32B are all fixed and electrically connected to the coil circuit board 3224B, and the chip coil assembly 322B is electrically connected to the second chip anti-shake conductive part 35B through the coil circuit board 3224B, thereby further electrically connected to the second circuit board 41B of the second photosensitive component 40B. Specifically, the first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B of the second chip driving element 32B can be wound coils fixedly electrically connected to the coil circuit board 3224B; or, the first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B can be directly wound on the coil circuit board 3224B; or, the first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B are directly etched on the coil circuit board 3224B to form a planar coil (FP-Coil). This method can reduce the height of the chip coil assembly 322B of the second chip driving element 32B, thereby reducing the height of the chip driving motor 30B. Furthermore, the coil circuit board 3224B of the second chip driving element 32B has a circuit board light through hole 32241B, and the circuit board light through hole 32241B provides a light through hole for the light of the second optical lens 10B to enter the second photosensitive component 40B.

[0255] Accordingly, in one embodiment of the present application, the chip magnet assembly 321A of the first chip driver component 32A includes a first chip magnet group 3211A, a second chip magnet group 3212A, and a third chip magnet group 3213A. The first chip magnet group 3211A, the second chip magnet group 3212A, and the third chip magnet group 3213A are arranged on the plane where the X-axis and the Y-axis are located (i.e., arranged in the horizontal direction). Furthermore, the first chip magnet group 3211A of the first chip driver component 32A is arranged vertically opposite to the first chip coil group 3221A, the second chip magnet group 3212A is arranged vertically opposite to the second chip coil group 3222A, and the third chip magnet group 3213A is arranged vertically opposite to the third chip coil group 3223A, so that each chip coil is located in the magnetic field of the corresponding chip magnet. Thus, the first chip magnet group 3211A of the first chip driver element 32A is arranged along the X-axis, the second chip magnet group 3212A and the third chip magnet group 3213A are arranged along the Y-axis, the second chip magnet group 3212A and the third chip magnet group 3213A are arranged opposite each other along the Y-axis, and the second chip magnet group 3212A and the third chip magnet group 3213A are symmetrical with respect to the Y-axis. In this application, the upper side refers to the side away from the first photosensitive component 40A, and the lower side refers to the side close to the first photosensitive component 40A.

[0256] The chip magnet assembly 321B of the second chip driver component 32B includes a first chip magnet group 3211B, a second chip magnet group 3212B, and a third chip magnet group 3213B. The first chip magnet group 3211B, the second chip magnet group 3212B, and the third chip magnet group 3213B are arranged on the plane of the X-axis and the Y-axis (i.e., arranged horizontally). Furthermore, the first chip magnet group 3211B of the second chip driver component 32B is arranged vertically opposite the first chip coil group 3221B, the second chip magnet group 3212B is arranged vertically opposite the second chip coil group 3222B, and the third chip magnet group 3213B is arranged vertically opposite the third chip coil group 33223B, so that each chip coil is located in the magnetic field of the corresponding chip magnet. Thus, the first chip magnet group 3211B of the second chip driver element 32B is arranged along the X-axis, the second chip magnet group 3212B and the third chip magnet group 3213B are arranged along the Y-axis, the second chip magnet group 3212B and the third chip magnet group 3213B are arranged opposite each other along the Y-axis, and the second chip magnet group 3212B and the third chip magnet group 3213B are symmetrical with respect to the Y-axis. In this application, the upper side refers to the side away from the second photosensitive component 40B, and the lower side refers to the side close to the second photosensitive component 40B.

[0257] The first chip magnet group 3211A, the second chip magnet group 3212A, and the third chip magnet group 3213A of the first chip driver component 32A each include at least one chip magnet. For example, in one specific example of the present application, the first chip magnet group 3211A of the first chip driver component 32A includes a first chip magnet 732111A and a second chip magnet 732112A. The first chip magnet 732111A and the second chip magnet 732112A are arranged along the X-axis. Specifically, the first chip magnet 732111A and the second chip magnet 732112A are arranged relatively parallel to each other along the X-axis. The second chip magnet group 3212A of the first chip driver component 32A includes a third chip magnet 732121A; the third chip magnet group 3213A includes a fourth chip magnet 732131A, and the third chip magnet 732121A and the fourth chip magnet 732131A are arranged relatively parallel to each other along the Y-axis direction. More specifically, in the embodiment of the present application, the first chip magnet group 3211A of the first chip driver component 32A is arranged at two opposite corners (i.e., corner regions) of the first photosensitive component 40A along the X-axis direction, and the second chip magnet group 3212A and the third chip magnet group 3213A are arranged at two opposite sides of the first photosensitive component 40A along the Y-axis direction.

[0258] The first chip magnet group 3211B, the second chip magnet group 3212B, and the third chip magnet group 3213B of the second chip driver component 32B each include at least one chip magnet. For example, in one specific example of the present application, the first chip magnet group 3211B of the second chip driver component 32B includes a first chip magnet 732111B and a second chip magnet 732112B. The first chip magnet 732111B and the second chip magnet 732112B are arranged along the X-axis. Specifically, the first chip magnet 732111B and the second chip magnet 732112B are arranged relatively parallel to each other along the X-axis. The second chip magnet group 3212B of the second chip driver element 32B includes a third chip magnet 732121B; the third chip magnet group 3213B includes a fourth chip magnet 732131B, and the third chip magnet 732121B and the fourth chip magnet 732131B are arranged relatively parallel to each other along the Y-axis direction. More specifically, in the embodiment of the present application, the first chip magnet group 3211B of the second chip driver element 32B is arranged at two opposite corners (i.e., corner regions) of the second photosensitive component 40B along the X-axis direction, and the second chip magnet group 3212B and the third chip magnet group 3213B are arranged at two opposite sides of the second photosensitive component 40B along the Y-axis direction.

[0259] The first chip magnet 732111A and the second chip magnet 732112A of the first chip driving element 32A work together to drive the first chip anti-shake movable part 33A to move along the Y-axis direction and / or rotate around the Z-axis direction, and the third chip magnet 732121A and the fourth chip magnet 732131A work together to drive the first chip anti-shake movable part 33A to move along the X-axis direction.

[0260] The first chip magnet 732111B and the second chip magnet 732112B of the second chip driving element 32B work together to drive the second chip anti-shake movable part 33B to move along the Y-axis direction and / or rotate around the Z-axis direction, and the third chip magnet 732121B and the fourth chip magnet 732131B work together to drive the second chip anti-shake movable part 33B to move along the X-axis direction.

[0261] Preferably, the first chip magnet 732111A and the second chip magnet 732112A of the first chip driver element 32A are of the same size, and the third chip magnet 732121A and the fourth chip magnet 732131A are of the same size, with the third chip magnet 732121A and the fourth chip magnet 732131A being smaller than the first chip magnet 732111A and the second chip magnet 732112A. This is because the third chip magnet 732121A and the fourth chip magnet 732131A only need to drive the first chip anti-shake movable portion 33A to achieve translational movement along the X-axis, while the first chip magnet 732111A and the second chip magnet 732112A need to drive both translational movement along the Y-axis and rotation about the Z-axis.

[0262] Preferably, the first chip magnet 732111B and the second chip magnet 732112B of the second chip driver element 32B are of the same size, and the third chip magnet 732121B and the fourth chip magnet 732131B are of the same size. The third chip magnet 732121B and the fourth chip magnet 732131B are smaller than the first chip magnet 732111B and the second chip magnet 732112B. This is because the third chip magnet 732121B and the fourth chip magnet 732131B only need to drive the second chip anti-shake movable portion 33B to achieve translational movement along the X-axis, while the first chip magnet 732111B and the second chip magnet 732112B need to drive both the second chip anti-shake movable portion 33B to achieve translational movement along the Y-axis and rotation about the Z-axis.

[0263] The first chip coil group 3221A of the first chip driving element 32A and the first chip magnet group 3211A interact with each other, driving the first chip anti-shake movable part 33A, and then driving the first photosensitive component 40A to translate in the Y-axis direction and / or rotate around the Z-axis direction; the second chip coil group 3222A and the second chip magnet group 3212A interact with each other, and the third chip coil group 3223A and the third chip magnet group 3213A interact with each other, and together drive the first chip anti-shake movable part 33A, and then drive the first photosensitive component 40A to translate in the X-axis direction.

[0264] The first chip coil group 3221B of the second chip driving element 32B interacts with the first chip magnet group 3211B to drive the second chip anti-shake movable part 33B, and then drive the second photosensitive component 40B to translate in the Y-axis direction and / or rotate around the Z-axis direction; the second chip coil group 3222B and the second chip magnet group 3212B interact with each other, and the third chip coil group 33223B and the third chip magnet group 3213B interact with each other, and together drive the second chip anti-shake movable part 33B, and then drive the second photosensitive component 40B to translate in the X-axis direction.

[0265] The first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A of the first chip driver component 32A each include at least one chip coil. That is, the first chip coil group 3221A of the first chip driver component 32A includes at least one chip coil, the second chip coil group 3222A includes at least one chip coil, and the third chip coil group 3223A includes at least one chip coil. For example, in a specific example of the present application, the first chip coil group 3221A of the first chip driver component 32A includes two opposing first chip coils 832211A disposed on the first side, forming a pair of first chip coils 832211A, and the pair of first chip coils 832211A is arranged along the X-axis direction. Specifically, the pair of first chip coils 832211A of the first chip driver component 32A are arranged parallel to each other along the X-axis. The second chip coil group 3222A includes a second chip coil 832212A located on the second side. The third chip coil group 3223A includes another second chip coil 832212A located on the fourth side, opposite the second chip coil 832212A located on the second side, forming a pair of second chip coils 832212A. The pair of second chip coils 832212A are arranged parallel to each other along the Y-axis. Alternatively, the pair of first chip coils 832211A of the first chip driver component 32A are arranged on the first side or the third side of the first photosensitive component 40A, while the two second chip coils 832212A of the pair of second chip coils 832212A are respectively arranged on the second side and the fourth side of the first photosensitive component 40A.

[0266] The first chip coil group 3221B, the second chip coil group 3222B, and the third chip coil group 3223B of the second chip driver component 32B each include at least one chip coil. That is, the first chip coil group 3221B of the second chip driver component 32B includes at least one chip coil, the second chip coil group 3222B includes at least one chip coil, and the third chip coil group 3223B includes at least one chip coil. For example, in a specific example of the present application, the first chip coil group 3221B of the second chip driver component 32B includes two opposing first chip coils 832211B disposed on the first side, forming a pair of first chip coils 832211B, and the pair of first chip coils 832211B is arranged along the X-axis direction. Specifically, the pair of first chip coils 832211B of the second chip driver component 32B are arranged parallel to each other along the X-axis. The second chip coil group 3222B includes a second chip coil 832212B arranged on the second side. The third chip coil group 3223B includes another second chip coil 832212B arranged on the fourth side, opposite the second chip coil 832212B arranged on the second side, forming a pair of second chip coils 832212B. The pair of second chip coils 832212B are arranged parallel to each other along the Y-axis. Alternatively, the pair of first chip coils 832211B of the second chip driver component 32B are arranged on the first side or the third side of the second photosensitive component 40B, and the two second chip coils 832212B of the pair of second chip coils 832212B are arranged on the second side and the fourth side of the second photosensitive component 40B, respectively.

[0267] A pair of first chip coils 832211A of the first chip driving element 32A jointly drive the first chip anti-shake movable part 33A to move along the Y-axis direction and / or rotate around the Z-axis direction, and a pair of second chip coils 832212A jointly drive the first chip anti-shake movable part 33A to move along the X-axis direction.

[0268] A pair of the first chip coils 832211B of the second chip driving element 32B work together to drive the second chip anti-shake movable part 33B to move along the Y-axis direction and / or rotate around the Z-axis direction, and a pair of the second chip coils 832212B work together to drive the second chip anti-shake movable part 33B to move along the X-axis direction.

[0269] Preferably, the pair of first chip coils 832211A of the first chip driver component 32A have the same size, and the pair of second chip coils 832212A have the same size, with the second chip coils 832212A being smaller than the first chip coil 832211A. This is because the second chip coils 832212A of the first chip driver component 32A only need to drive the first chip anti-shake movable portion 33A to achieve translational movement along the X-axis, while the first chip coils 832211A need to drive both translational movement along the Y-axis and rotation about the Z-axis.

[0270] The pair of first chip coils 832211B of the second chip driver component 32B have the same size, and the pair of second chip coils 832212B have the same size. The second chip coils 832212B are smaller than the first chip coils 832211B. This is because the second chip coils 832212B of the second chip driver component 32B only need to drive the second chip anti-shake movable part 33B to translate along the X-axis, while the first chip coils 832211B need to drive both the second chip anti-shake movable part 33B to translate along the Y-axis and to rotate about the Z-axis.

[0271] In one embodiment of the present application, the chip coil assembly 322A of the first chip driver element 32A further includes a coil circuit board 3224A disposed on the chip movable carrier 331A of the first chip anti-shake movable portion 33A, and at least one chip coil in the chip coil assembly 322A is fixed and electrically connected to the coil circuit board 3224A. In a specific example of the present application, the first chip coil group 3221A (a pair of the first chip coils 832211A), the second chip coil group 3222A (one second chip coil 832212A), and the third chip coil group 3223A (one second chip coil 832212A) of the first chip driver element 32A are all fixed and electrically connected to the coil circuit board 3224A, and the chip coil assembly 322A is electrically connected to the first chip anti-shake conductive portion 35A through the coil circuit board 3224A, thereby further electrically connected to the first circuit board 41A of the first photosensitive component 40A. Specifically, the first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 33223A of the first chip driving element 32A can be wound coils fixedly electrically connected to the coil circuit board 3224A; or, the first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 33223A can be directly wound on the coil circuit board 3224A; or, the first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 33223A are directly etched on the coil circuit board 3224A to form a planar coil (FP-Coil). This method can reduce the height of the chip coil assembly 322A of the first chip driving element 32A, thereby reducing the height of the first chip driving motor 30A. Furthermore, the coil circuit board 3224A of the first chip driving element 32A has a circuit board light through hole 32241A, and the circuit board light through hole 32241A provides a light through hole for the light of the first optical lens 10A to enter the first photosensitive component 40A.

[0272] The chip coil assembly 322B of the second chip driving element 32B also includes a coil circuit board 3224B of the chip movable carrier 331B provided on the second chip anti-shake movable part 33B, and at least one chip coil in the chip coil assembly 322B is fixed and electrically connected to the coil circuit board 3224B. In a specific example of the present application, the first chip coil group 3221B (a pair of the first chip coils 832211B), the second chip coil group 3222B (one second chip coil 832212B) and the third chip coil group 3223B (one second chip coil 832212B) of the second chip driving element 32B are all fixed and electrically connected to the coil circuit board 3224B, and the chip coil assembly 322B is electrically connected to the second chip anti-shake conductive part 35B through the coil circuit board 3224B, thereby further electrically connected to the second circuit board 41B of the second photosensitive component 40B. Specifically, the first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B of the second chip driving element 32B can be wound coils fixedly electrically connected to the coil circuit board 3224B; or, the first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B can be directly wound on the coil circuit board 3224B; or, the first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B are directly etched on the coil circuit board 3224B to form a planar coil (FP-Coil). This method can reduce the height of the chip coil assembly 322B of the second chip driving element 32B, thereby reducing the height of the second chip driving motor 30B. Furthermore, the coil circuit board 3224B of the second chip driving element 32B has a circuit board light through hole 32241B, and the circuit board light through hole 32241B provides a light through hole for the light of the second optical lens 10B to enter the second photosensitive component 40B.

[0273] Accordingly, in one embodiment of the present application, the chip magnet assembly 321A of the first chip driver component 32A includes a first chip magnet group 3211A, a second chip magnet group 3212A, and a third chip magnet group 3213A. The first chip magnet group 3211A, the second chip magnet group 3212A, and the third chip magnet group 3213A are arranged on the plane where the X-axis and the Y-axis are located (i.e., arranged in the horizontal direction). Furthermore, the first chip magnet group 3211A of the first chip driver component 32A is arranged vertically opposite to the first chip coil group 3221A, the second chip magnet group 3212A is arranged vertically opposite to the second chip coil group 3222A, and the third chip magnet group 3213A is arranged vertically opposite to the third chip coil group 33223A, so that each chip coil is located in the magnetic field of the corresponding chip magnet. Thus, the first chip magnet group 3211A of the first chip driver element 32A is arranged along the X-axis, the second chip magnet group 3212A and the third chip magnet group 3213A are arranged along the Y-axis, the second chip magnet group 3212A and the third chip magnet group 3213A are arranged opposite each other along the Y-axis, and the second chip magnet group 3212A and the third chip magnet group 3213A are symmetrical with respect to the Y-axis. In this application, the upper side refers to the side away from the first photosensitive component 40A, and the lower side refers to the side close to the first photosensitive component 40A.

[0274] The chip magnet assembly 321B of the second chip driver component 32B includes a first chip magnet group 3211B, a second chip magnet group 3212B, and a third chip magnet group 3213B. The first chip magnet group 3211B, the second chip magnet group 3212B, and the third chip magnet group 3213B are arranged on the plane of the X-axis and the Y-axis (i.e., arranged horizontally). Furthermore, the first chip magnet group 3211B of the second chip driver component 32B is arranged vertically opposite the first chip coil group 3221B, the second chip magnet group 3212B is arranged vertically opposite the second chip coil group 3222B, and the third chip magnet group 3213B is arranged vertically opposite the third chip coil group 33223B, so that each chip coil is located in the magnetic field of the corresponding chip magnet. Thus, the first chip magnet group 3211B of the second chip driver element 32B is arranged along the X-axis, the second chip magnet group 3212B and the third chip magnet group 3213B are arranged along the Y-axis, the second chip magnet group 3212B and the third chip magnet group 3213B are arranged opposite each other along the Y-axis, and the second chip magnet group 3212B and the third chip magnet group 3213B are symmetrical with respect to the Y-axis. In this application, the upper side refers to the side away from the second photosensitive component 40B, and the lower side refers to the side close to the second photosensitive component 40B.

[0275] The first chip magnet group 3211A, the second chip magnet group 3212A, and the third chip magnet group 3213A of the first chip driver component 32A each include at least one chip magnet. For example, in a specific example of the present application, the first chip magnet group 3211A of the first chip driver component 32A includes two opposing first chip magnets 832111A, forming a pair of first chip magnets 832111A. The pair of first chip magnets 832111A are arranged along the X-axis. Specifically, the two first chip magnets 832111A are arranged parallel to the X-axis. The second chip magnet group 3212A of the first chip driver component 32A includes one second chip magnet 832112A. The third chip magnet group 3213A includes one second chip magnet 832112A, forming a pair of second chip magnets 832112A. The pair of second chip magnets 832112A are arranged parallel to each other along the Y-axis. More specifically, in an embodiment of the present application, the first chip magnet group 3211A of the first chip driving element 32A is arranged at two opposite corners (i.e., corner areas) of the first photosensitive component 40A along the X-axis direction, and the second chip magnet group 3212A and the third chip magnet group 3213A are arranged at two opposite sides of the first photosensitive component 40A along the Y-axis direction.

[0276] The first chip magnet group 3211B, the second chip magnet group 3212B, and the third chip magnet group 3213B of the second chip driver component 32B each include at least one chip magnet. For example, in a specific example of the present application, the first chip magnet group 3211B of the second chip driver component 32B includes two opposing first chip magnets 832111B, forming a pair of first chip magnets 832111B. The pair of first chip magnets 832111B are arranged along the X-axis. Specifically, the two first chip magnets 832111B are arranged parallel to the X-axis. The second chip magnet group 3212B of the second chip driver component 32B includes one second chip magnet 832112B. The third chip magnet group 3213B includes one second chip magnet 832112B, forming a pair of second chip magnets 832112B. The pair of second chip magnets 832112B are arranged parallel to each other along the Y-axis. More specifically, in an embodiment of the present application, the first chip magnet group 3211B of the second chip driving element 32B is arranged at two opposite corners of the second photosensitive component 40B along the X-axis direction (i.e., corner areas), and the second chip magnet group 3212B and the third chip magnet group 3213B are arranged at two opposite sides of the second photosensitive component 40B along the Y-axis direction.

[0277] A pair of the first chip magnets 832111A of the first chip driving element 32A work together to drive the first chip anti-shake movable part 33A to move along the Y-axis direction and / or rotate around the Z-axis direction, and a pair of the second chip magnet groups 3212A work together to drive the first chip anti-shake movable part 33A to move along the X-axis direction.

[0278] A pair of the first chip magnets 832111B of the second chip driving element 32B work together to drive the second chip anti-shake movable part 33B to move along the Y-axis direction and / or rotate around the Z-axis direction, and a pair of the second chip magnet groups 3212B work together to drive the second chip anti-shake movable part 33B to move along the X-axis direction.

[0279] Preferably, the pair of first chip magnets 832111A of the first chip driver component 32A have the same size, and the pair of second chip magnet groups 3212A have the same size, with the second chip magnet group 3212A being smaller than the first chip magnet 832111A. This is because the second chip magnet group 3212A of the first chip driver component 32A only needs to drive the first chip anti-shake movable portion 33A to achieve translational movement along the X-axis, while the first chip magnet 832111A needs to drive both translational movement along the Y-axis and rotation about the Z-axis.

[0280] The second chip driver component 32B has a pair of first chip magnets 832111B of the same size, and a pair of second chip magnet groups 3212B of the same size. However, the second chip magnet group 3212B is smaller than the first chip magnet 832111B. This is because the second chip magnet group 3212B of the second chip driver component 32B only needs to drive the second chip anti-shake movable part 33B to translate along the X-axis, while the first chip magnet 832111B needs to drive both the second chip anti-shake movable part 33B to translate along the Y-axis and to rotate about the Z-axis.

[0281] Preferably, the first chip magnet 832111B and the second chip magnet 832112B of the second chip driver element 32B are of the same size, and the third chip magnet 832121B and the fourth chip magnet 832131B are of the same size. The third chip magnet 832121B and the fourth chip magnet 832131B are smaller than the first chip magnet 832111B and the second chip magnet 832112B. This is because the third chip magnet 832121B and the fourth chip magnet 832131B only need to drive the second chip anti-shake movable portion 33B to achieve translational movement along the X-axis, while the first chip magnet 832111B and the second chip magnet 832112B need to drive both the second chip anti-shake movable portion 33B to achieve translational movement along the Y-axis and rotation about the Z-axis.

[0282] The first chip coil group 3221A of the first chip driving element 32A and the first chip magnet group 3211A interact with each other, driving the first chip anti-shake movable part 33A, and then driving the first photosensitive component 40A to translate in the Y-axis direction and / or rotate around the Z-axis direction; the second chip coil group 3222A and the second chip magnet group 3212A interact with each other, and the third chip coil group 33223A and the third chip magnet group 3213A interact with each other, and together drive the first chip anti-shake movable part 33A, and then drive the first photosensitive component 40A to translate in the X-axis direction.

[0283] The first chip coil group 3221B of the second chip driving element 32B interacts with the first chip magnet group 3211B to drive the second chip anti-shake movable part 33B, and then drive the second photosensitive component 40B to translate in the Y-axis direction and / or rotate around the Z-axis direction; the second chip coil group 3222B and the second chip magnet group 3212B interact with each other, and the third chip coil group 33223B and the third chip magnet group 3213B interact with each other, and together drive the second chip anti-shake movable part 33B, and then drive the second photosensitive component 40B to translate in the X-axis direction.

[0284] In one embodiment of the present application, at least one side of the first chip-driving motor 30A is not provided with the first chip-driving component 32A, thereby providing more space for the off-center placement of the first photosensitive chip 42A. Specifically, the first photosensitive chip 42A can be positioned close to the side of the first chip-driving motor 30A that is not provided with the first chip-driving component 32A, so that the central axis of the first photosensitive chip 42A is not aligned with the central axis of the first chip-driving motor 30A.

[0285] In one embodiment of the present application, at least one side of the second chip-driving motor 30B is not provided with the second chip-driving element 32B, thereby providing more space for the off-center placement of the second photosensitive chip 42B. Specifically, the second photosensitive chip 42B can be positioned close to the side of the second chip-driving motor 30B that is not provided with the second chip-driving element 32B, so that the central axis of the second photosensitive chip 42B is not aligned with the central axis of the second chip-driving motor 30B.

[0286] Furthermore, when the eccentrically arranged first photosensitive chip 42A in the present application is applied to the first camera module 1A and the eccentrically arranged second photosensitive chip 42B is applied to the second camera module 1B, the first chip driving element 32A is not provided on at least one side of the first chip driving motor 30A, the second chip driving element 32B is not provided on at least one side of the second chip driving motor 30B, and the side of the first chip driving motor 30A where the first chip driving element 32A is not provided and the side of the second chip driving motor 30B where the second chip driving element 32B is not provided Adjacent arrangement, that is, the side of the first chip driving motor 30A where the first chip driving element 32A is not set and the side of the second chip driving motor 30B where the second chip driving element 32B is not set are set close to each other. This arrangement makes it possible for the first chip driving element 32A and / or the second chip driving element 32B to be not set adjacent to the first camera module 1A and the second camera module 1B of the dual-camera module, so as to avoid the magnetic interference problem affecting the selection of the matching scheme of the first lens driving motor 20A and the second lens driving motor 20B.

[0287] Specifically, in one embodiment of the present application, the chip magnet component 321A and the chip coil component 322A of the first chip driving element 32A are concentrated on the three sides of the first photosensitive chip 42A, and the first chip driving element 32A is not provided on one side of the first photosensitive chip 42A except the three sides. This arrangement enables the center axis of the first photosensitive chip 42A to be eccentrically arranged on the chip movable carrier 331A of the first chip anti-shake movable part 33A, and the center O of the first photosensitive chip 42A is closer to the side of the chip movable carrier 331A where the first chip driving element 32A is not provided. For example, in a specific example of the present application, the first chip magnet group 3211A and the first chip coil group 3221A of the first chip driving element 32A are arranged on the third side and the fourth side of the first photosensitive chip 42A, and the second chip magnet group 3212A, the second chip coil group 3222A and the third chip magnet group 3213A, the third chip coil group 3223A are arranged on the second side of the first photosensitive chip 42A. This arrangement makes the center O of the first photosensitive chip 42A close to the first side of the chip movable carrier 331A, that is, the center axis of the first photosensitive chip 42A is inconsistent with the center axis of the first chip driving motor 30A.

[0288] The chip magnet component 321B and the chip coil component 322B of the second chip driving element 32B are concentrated on the three sides of the second photosensitive chip 42B. The second chip driving element 32B is not provided on one side of the second photosensitive chip 42B except the three sides. This arrangement makes the center axis of the second photosensitive chip 42B eccentrically arranged on the chip movable carrier 331B of the second chip anti-shake movable part 33B. The center O of the second photosensitive chip 42B is closer to the side of the chip movable carrier 331B where the second chip driving element 32B is not provided. For example, in a specific example of the present application, the first chip magnet group 3211B and the first chip coil group 3221B of the second chip driving element 32B are arranged on the third side and the fourth side of the second photosensitive chip 42B, and the second chip magnet group 3212B, the second chip coil group 3222B and the third chip magnet group 3213B, the third chip coil group 33223B are arranged on the second side of the second photosensitive chip 42B. This arrangement makes the center O of the second photosensitive chip 42B close to the first side of the chip movable carrier 331B, that is, the center axis of the second photosensitive chip 42B is inconsistent with the center axis of the second chip driving motor 30B.

[0289] In one embodiment of the present application, the chip magnet assembly 321A of the first chip driver element 32A further includes a magnetic conductive member (not shown) disposed between the first chip magnet group 3211A, the second chip magnet group 3212A, the third chip magnet group 3213A, and the upper cover 311A ​​of the first chip anti-shake fixing portion 31A. The first chip magnet group 3211A, the second chip magnet group 3212A, and the third chip magnet group 3213A of the first chip driver element 32A are indirectly fixed to the upper cover 311A ​​of the first chip anti-shake fixing portion 31A via the magnetic conductive member. The magnetic conductive member is adapted to enhance the magnetic field force of the chip magnet assembly 321A toward the chip coil assembly 322A, thereby enhancing the driving force of the first chip driver element 32A.

[0290] The chip magnet assembly 321B of the second chip driver element 32B further includes a magnetic conductive member (not shown) disposed between the first chip magnet group 3211B, the second chip magnet group 3212B, the third chip magnet group 3213B, and the upper cover 311B of the second chip anti-shake fixing portion 31B. The first chip magnet group 3211B, the second chip magnet group 3212B, and the third chip magnet group 3213B of the second chip driver element 32B are indirectly fixed to the upper cover 311B of the second chip anti-shake fixing portion 31B via the magnetic conductive member. The magnetic conductive member is adapted to enhance the magnetic field force of the chip magnet assembly 321B toward the chip coil assembly 322B, thereby enhancing the driving force of the second chip driver element 32B.

[0291] In one embodiment of the present application, the first chip driving motor 30A also includes a first chip position sensing component 36A and a first chip holding component 34A. The first chip position sensing component 36A is used to obtain the position or motion information of the first photosensitive component 40A. The first chip holding component 34A is suitable for allowing the chip movable carrier 331A to be suspended in the receiving cavity of the first chip anti-shake fixing part 31A. In this way, the first photosensitive component 40A can be suspended in the first chip anti-shake fixing part 31A by the first chip holding component 34A.

[0292] The second chip driving motor 30B also includes a second chip position sensing component 36B and a second chip holding component 34B. The second chip position sensing component 36B is used to obtain the position or movement information of the second photosensitive component 40B. The second chip holding component 34B is suitable for allowing the chip movable carrier 331B to be suspended in the receiving cavity of the second chip anti-shake fixing part 31B. In this way, the second photosensitive component 40B can be suspended in the second chip anti-shake fixing part 31B by the second chip holding component 34B.

[0293] The first chip position sensing component 36A is fixed to the chip movable carrier 331A, so that when the chip movable carrier 331A moves, the first chip position sensing component 36A is suitable for obtaining the position information of the chip movable carrier 331A by obtaining the magnetic field changes of the chip magnet component 321A of the first chip anti-shake movable part 33A.

[0294] The second chip position sensing component 36B is fixed to the chip movable carrier 331B, so that when the chip movable carrier 331B moves, the second chip position sensing component 36B is suitable for obtaining the position information of the chip movable carrier 331B by obtaining the magnetic field changes of the chip magnet component 321B of the second chip anti-shake movable part 33B.

[0295] The first chip position sensing component 36A includes at least one position sensing element, and the number of the position sensing elements is not limited by the present application. In a specific example of the present application, the first chip position sensing component 36A includes a first position sensing element 361A, a second position sensing element 362A, and a third position sensing element 363A, so as to sense the position information of the three movements of the chip movable carrier 331A of the first chip anti-shake movable part 33A, namely, translation along the X-axis direction, translation along the Y-axis direction, and rotation around the Z-axis direction. In an embodiment of the present application, the first position sensing element 361A, the second position sensing element 362A, and the third position sensing element 363A of the first chip position sensing component 36A are Hall elements; in other embodiments of the present application, the first position sensing element 361A, the second position sensing element 362A, and the third position sensing element 363A are driver chips with position sensing functions.

[0296] The second chip position sensing component 36B includes at least one position sensing element, and the number of the position sensing elements is not limited by the present application. In a specific example of the present application, the second chip position sensing component 36B includes a first position sensing element 361B, a second position sensing element 362B, and a third position sensing element 363B, so as to sense the position information of the three movements of the chip movable carrier 331B of the second chip anti-shake movable part 33B, namely, translation along the X-axis direction, translation along the Y-axis direction, and rotation around the Z-axis direction. In an embodiment of the present application, the first position sensing element 361B, the second position sensing element 362B, and the third position sensing element 363B of the second chip position sensing component 36B are Hall elements; in other embodiments of the present application, the first position sensing element 361B, the second position sensing element 362B, and the third position sensing element 363B are driver chips with position sensing functions.

[0297] In a specific example of the present application, a sensing element recess 33114A is formed on the chip carrier body 3311A of the first movable chip anti-shake portion 33A. The first chip position sensing component 36A is disposed in the sensing element recess 33114A, thereby preventing the first chip position sensing component 36A from being too high. The first chip position sensing component 36A is electrically connected to the first circuit board 41A of the first photosensitive component 40A. In the height (Z-axis) direction determined by the chip carrier body 331A of the first movable chip anti-shake portion 33A, the first chip position sensing component 36A is disposed between the chip coil assembly 322A of the first chip driver component 32A and the first circuit board 41A. Preferably, the first chip position sensing component 36A is housed in the sensing element recess 33114A of the first movable chip anti-shake portion 33A and does not protrude therefrom.

[0298] A sensing element recess 33114B is formed in the chip carrier body 3311B of the second movable chip anti-shake portion 33B. The second chip position sensing component 36B is disposed in this recess, thereby preventing the second chip position sensing component 36B from being too high. The second chip position sensing component 36B is electrically connected to the second circuit board 41B of the second photosensitive component 40B. In the height (Z-axis) determined by the chip carrier body 331B of the second movable chip anti-shake portion 33B, the second chip position sensing component 36B is disposed between the chip coil assembly 322B of the second chip driver 32B and the second circuit board 41B. Preferably, the second chip position sensing component 36B is housed in the sensing element recess 33114B of the second movable chip anti-shake portion 33B and does not protrude therefrom.

[0299] The first chip holding component 34A includes a chip supporting component 341A and a chip magnetic component 342A, which are arranged between the chip movable carrier 331A of the first chip anti-shake movable part 33A and the upper cover 311A. The chip magnetic component 342A is fixed to the chip movable carrier 331A of the first chip anti-shake movable part 33A. In this way, the magnetic attraction force between the chip magnetic component 342A and the chip magnet component 321A causes the first chip anti-shake movable part 33A to be adsorbed to the upper cover 311A. The chip support component 341A of the first chip holding component 34A is arranged between the upper cover 311A ​​of the first chip anti-shake fixed part 31A and the chip movable carrier 331A of the first chip anti-shake movable part 33A. Under the action of the magnetic attraction force between the chip magnetic attraction component 342A and the chip magnet component 321A, the chip support component 341A is clamped by the upper cover 311A ​​and the chip movable carrier 331A, and a gap is maintained between the chip movable carrier 331A and the upper cover 311A, thereby reducing the resistance of the first chip anti-shake movable part 33A during movement.

[0300] The second chip holding component 34B includes a chip supporting component 341B and a chip magnetic component 342B, which are arranged between the chip movable carrier 331B of the second chip anti-shake movable part 33B and the upper cover 311B. The chip magnetic component 342B is fixed to the chip movable carrier 331B of the second chip anti-shake movable part 33B. In this way, the magnetic attraction force between the chip magnetic component 342B and the chip magnet component 321B causes the second chip anti-shake movable part 33B to be adsorbed to the upper cover 311B. The chip support component 341B of the second chip holding component 34B is arranged between the upper cover 311B of the second chip anti-shake fixed part 31B and the chip movable carrier 331B of the second chip anti-shake movable part 33B. Under the action of the magnetic attraction force between the chip magnetic attraction component 342B and the chip magnet component 321B, the chip support component 341B is clamped by the upper cover 311B and the chip movable carrier 331B, and a gap is maintained between the chip movable carrier 331B and the upper cover 311B, thereby reducing the resistance of the second chip anti-shake movable part 33B during movement.

[0301] In this embodiment of the present application, the chip support assembly 341A of the first chip holding assembly 34A is clamped and disposed between the first chip anti-shake movable portion 33A and the first chip anti-shake fixed portion 31A, comprising at least three support assemblies. Specifically, the chip support assembly 341A of the first chip holding assembly 34A includes a first support assembly, a second support assembly, and a third support assembly, which are clamped and disposed between the first chip anti-shake movable portion 33A and the first chip anti-shake fixed portion 31A. Each set of the first, second, and third support assemblies includes a ball groove 3412A recessed in the movable chip carrier 331A of the first chip anti-shake movable portion 33A, and a ball 3411A disposed within the ball groove 3412A.

[0302] The chip support assembly 341B of the second chip holding assembly 34B is sandwiched between the second chip anti-shake movable portion 33B and the second chip anti-shake fixed portion 31B, comprising at least three support assemblies. Specifically, the chip support assembly 341B of the second chip holding assembly 34B includes a first support assembly, a second support assembly, and a third support assembly, which are sandwiched between the second chip anti-shake movable portion 33B and the second chip anti-shake fixed portion 31B. Each set of the first, second, and third support assemblies includes a ball groove 3412B recessed in the movable chip carrier 331B of the second chip anti-shake movable portion 33B, and a ball 3411B disposed within the ball groove 3412B.

[0303] In particular, in an embodiment of the present application, the at least three support components are arranged in an incompletely collinear manner. In a specific example of the present application, the first support component, the second support component, and the third support component are distributed in a triangular arrangement. The first support component is arranged on the first side of the chip movable carrier, and the second support component and the third support component are arranged on the two corner areas of the third side of the chip movable carrier opposite to the first side. Preferably, the first support component is arranged in the middle area of ​​the first side to form a stable support for the chip movable carrier 331A of the first chip anti-shake movable part 33A and the chip movable carrier 331B of the first chip anti-shake movable part 33B.

[0304] The number of the balls 3411A and the ball grooves 3412A of the first chip holding assembly 34A is not limited by the present application. In one embodiment of the present application, the chip support assembly 341A of the first chip holding assembly 34A includes three support assemblies, each support assembly includes at least one ball 3411A and at least one ball groove 3412A, that is, the chip support assembly 341A includes at least three balls 3411A disposed between the chip movable carrier 331A of the first chip anti-shake movable portion 33A and the upper cover 311A. A. In order to limit the moving range of the ball 3411A, the chip support assembly 341A also includes at least three ball grooves 3412A corresponding to the at least three balls 3411A. Preferably, at least three ball grooves 3412A are formed on the chip movable carrier 331A, and the depth of the ball groove 3412A is smaller than the diameter of the ball 3411A. At least a portion of the ball 3411A can protrude from the ball groove 3412A so that the ball 3411A can maintain friction contact with the upper cover 311A.

[0305] The chip support assembly 341B of the second chip holding assembly 34B is sandwiched between the second chip anti-shake movable portion 33B and the second chip anti-shake fixed portion 31B, comprising at least three support assemblies. Specifically, the chip support assembly 341B of the second chip holding assembly 34B includes a first support assembly, a second support assembly, and a third support assembly, which are sandwiched between the second chip anti-shake movable portion 33B and the second chip anti-shake fixed portion 31B. Each set of the first, second, and third support assemblies includes a ball groove 3412B recessed in the movable chip carrier 331B of the second chip anti-shake movable portion 33B, and a ball 3411B disposed within the ball groove 3412B. The number of the balls 3411B and the ball grooves 3412B of the second chip holding assembly 34B is not limited by the present application. In one embodiment of the present application, the chip support assembly 341B of the second chip holding assembly 34B includes three support assemblies, each support assembly includes at least one ball 3411B and at least one ball groove 3412B, that is, the chip support assembly 341B includes at least three chip movable carriers 331B and the second chip anti-shake movable portion 33B. The ball 3411B between the upper cover 311B, in order to limit the movement range of the ball 3411B, the chip support assembly 341B also includes at least three ball grooves 3412B corresponding to the at least three balls 3411B. Preferably, at least three ball grooves 3412B are formed on the chip movable carrier 331B, and the depth of the ball groove 3412B is smaller than the diameter of the ball 3411B. At least a part of the ball 3411B can protrude from the ball groove 3412B so that the ball 3411B can maintain friction contact with the upper cover 311B.

[0306] Furthermore, the movable chip carrier 331A of the first movable chip stabilization unit 33A further includes an extension post 3313A protruding from the upper surface of the chip carrier body 3311A, and the ball rolling groove 3412A is recessed in the upper surface of the extension post 3313A. In one embodiment of the present application, the movable chip carrier 331A includes at least three extension posts 3313A formed on the chip carrier body 3311A, at least three of which protrude from the upper surface of the chip carrier body 3311A, and at least three of which are formed in the ball rolling grooves 3412A. The chip support component 341A of the first chip holding component 34A is arranged between the extension column 3313A of the first chip anti-shake movable part 33A and the upper cover 311A, so that a certain gap is maintained between the chip movable carrier 331A of the first chip anti-shake movable part 33A and the upper cover 311A, and the gap does not change with the movement of the chip movable carrier 331A.

[0307] The movable chip carrier 331B of the second movable chip stabilization unit 33B further includes an extension column 3313B protruding from the upper surface of the chip carrier body 3311B, and the ball rolling groove 3412B is recessed in the upper surface of the extension column 3313B. In one embodiment of the present application, the movable chip carrier 331B includes at least three extension columns 3313B formed on the chip carrier body 3311B, at least three of which protrude from the upper surface of the chip carrier body 3311B, and at least three of which are formed in the ball rolling grooves 3412B. The chip support component 341B of the second chip holding component 34B is arranged between the extension column 3313B of the second chip anti-shake movable part 33B and the upper cover 311B, so that a certain gap is maintained between the chip movable carrier 331B of the second chip anti-shake movable part 33B and the upper cover 311B, and the gap does not change with the movement of the chip movable carrier 331B.

[0308] In a specific example of the present application, the chip movable carrier 331A of the first chip anti-shake movable part 33A includes three extension columns 3313A formed on the chip carrier body 3311A, and the chip support component 341A of the first chip holding component 34A includes three ball grooves 3412A formed by the concave top surface of the extension column 3313A and three balls 3411A arranged between the three ball grooves 3412A and the upper cover 311A.

[0309] The chip movable carrier 331B of the second chip anti-shake movable part 33B includes three extension columns 3313B formed on the chip carrier body 3311B, and the chip support component 341B of the second chip holding component 34B includes three ball grooves 3412B formed by the concave top surface of the extension column 3313B and three balls 3411B arranged between the three ball grooves 3412B and the upper cover 311B.

[0310] In particular, in the embodiment of the present application, at least three support components of the first chip retaining assembly 34A are arranged in a non-colinear manner. Accordingly, in the specific example above, the three extension columns 3313A of the first chip anti-shake movable portion 33A are distributed at two adjacent corners of the chip carrier body 3311A and on the side opposite the side where the line connecting the adjacent corners lies. In other words, the three balls 3411A are arranged in a triangular configuration to provide stable support for the chip carrier 331A. At least three support components of the second chip retaining assembly 34B are arranged in a non-colinear configuration. Accordingly, in the specific example above, the three extension columns 3313B of the second chip anti-shake movable portion 33B are distributed at two adjacent corners of the chip carrier body 3311B and on the side opposite the side where the line connecting the adjacent corners lies. In other words, the three balls 3411B are arranged in a triangular configuration to provide stable support for the chip carrier 331B.

[0311] The chip support assembly 341A of the first chip holding assembly 34A further includes a ball support sheet 3413A embedded within the movable chip carrier 331A of the first chip anti-shake movable portion 33A and located at the bottom of the ball groove 3412A. The ball 3411A is supported by the ball support sheet 3413A. In one embodiment of the present application, the chip support assembly 341A of the first chip holding assembly 34A further includes at least three ball support sheets 3413A. The ball support sheets 3413A are fixed to the movable chip carrier 331A of the first chip anti-shake movable portion 33A and serve as the bottom surface of the ball groove 3412A. The ball support sheets 3413A can be made of a metal material such as stainless steel, thereby providing a smoother support surface for the ball 3411A and reducing the friction caused by the rolling of the ball 3411A. In a specific example of the present application, the chip support component 341A of the first chip holding component 34A includes three ball support pieces 3413A, each ball support piece 3413A is fixed to the extension column 3313A of the chip movable carrier 331A of the first chip anti-shake movable part 33A by insert molding and exposes its upper surface as the bottom surface of each ball groove 3412A, the ball support piece 3413A includes a support piece body 34131A and a support piece connecting portion 34132A, the support piece body 34131A The support piece main body 34131A extends integrally with the support piece connection portion 34132A. The upper surface of the support piece main body 34131A is exposed and serves as the bottom surface of the ball groove 3412A. The support piece connection portion 34132A is used to maintain the position of the ball support piece 3413A in the movable chip carrier 331A during the insert molding process. The support piece connection portion 34132A can be connected to the support piece connection portion 34132A of another ball support piece 3413A or to other supporting components for supporting the support piece connection portion 34132A. After the ball support piece 3413A of the first chip holding assembly 34A is formed in the movable chip carrier 331A of the first chip anti-shake movable part 33A through the insert molding process, the support piece connection portion 34132A is sheared, and a portion of the support piece connection portion 34132A can be exposed outside the movable chip carrier 331A. That is, in some embodiments of the present application, the ball support plate 3413A of the first chip retaining assembly 34A includes a support plate main body 34131A located at the bottom of the ball groove 3412A and a support plate connecting portion 34132A extending from the support plate main body 34131A to the outside of the chip movable carrier 331A of the first chip anti-shake movable portion 33A.

[0312] The chip support assembly 341B of the second chip holding assembly 34B further includes a ball support sheet 3413B embedded in the chip movable carrier 331B of the second chip anti-shake movable portion 33B and located at the bottom of the ball groove 3412B. The ball 3411B is supported by the ball support sheet 3413B. In one embodiment of the present application, the chip support assembly 341B of the second chip holding assembly 34B further includes at least three ball support sheets 3413B. The ball support sheets 3413B are fixed to the chip movable carrier 331B of the second chip anti-shake movable portion 33B and serve as the bottom surface of the ball groove 3412B. The ball support sheets 3413B can be made of a metal material such as stainless steel, thereby providing a smoother support surface for the ball 3411B and reducing the friction caused by the rolling of the ball 3411B. In a specific example of the present application, the chip support component 341B of the second chip holding component 34B includes three ball support pieces 3413B, each ball support piece 3413B is fixed to the extension column 3313B of the chip movable carrier 331B of the second chip anti-shake movable part 33B by insert molding and exposes its upper surface as the bottom surface of each ball groove 3412B, the ball support piece 3413B includes a support piece main body 34131B and a support piece connecting part 34132B, the support piece main body 34131B The support piece main body 34131B extends integrally with the support piece connection portion 34132B. The upper surface of the support piece main body 34131B is exposed and serves as the bottom surface of the ball groove 3412B. The support piece connection portion 34132B is used to maintain the position of the ball support piece 3413B in the movable chip carrier 331B during the insert molding process. The support piece connection portion 34132B can be connected to the support piece connection portion 34132B of another ball support piece 3413B or to other supporting components for supporting the support piece connection portion 34132B. After the ball support piece 3413B of the second chip holding assembly 34B is formed in the movable chip carrier 331B of the second chip anti-shake movable part 33B through the insert molding process, the support piece connection portion 34132B is sheared, and a portion of the support piece connection portion 34132B can be exposed outside the movable chip carrier 331B. That is, in some embodiments of the present application, the ball support plate 3413B of the second chip retaining assembly 34B includes a support plate main body 34131B located at the bottom of the ball groove 3412B and a support plate connecting portion 34132B extending from the support plate main body 34131B to the outside of the chip movable carrier 331B of the second chip anti-shake movable portion 33B.

[0313] In some embodiments of the present application, the chip magnetic component 342A of the first chip holding component 34A includes at least one chip magnetic element 3421A, and the chip magnetic element 3421A is enclosed in the chip movable carrier 331A of the first chip anti-shake movable part 33A, so that the chip movable carrier 331A is suspended in the receiving cavity of the first chip anti-shake fixed part 31A through the magnetic attraction force between the chip magnet component 321A of the first chip driving component 32A and the at least one chip magnetic element 3421A. In a specific example of the present application, at least one chip magnetic element 3421A of the first chip holding component 34A is embedded in the chip movable carrier 331A of the first chip anti-shake movable part 33A through an insert molding process, and at least one chip magnetic element 3421A is arranged opposite to the chip magnet component 321A to generate a magnetic attraction force between at least one chip magnetic element 3421A and the chip magnet component 321A. On the one hand, the chip support component 341A of the first chip holding component 34A is clamped between the first chip anti-shake fixed part 31A and the first chip anti-shake movable part 33A through the action of the magnetic attraction force. Specifically, the ball bearing 3411A is clamped between the upper cover 311A ​​and the movable chip carrier 331A by the magnetic attraction between at least one chip magnetic element 3421A of the first chip holding assembly 34A and the chip magnet assembly 321A of the first chip anti-shake movable portion 33A. Furthermore, after the movable chip carrier 331A moves, the magnetic attraction maintains the movable chip carrier 331A in a certain position, which may be the initial position of the movable chip carrier 331A before it is driven. The chip magnetic element 3421A of the first chip holding assembly 34A is made of a magnetically permeable material suitable for generating magnetic attraction with a magnet.

[0314] The chip magnetic component 342B of the second chip holding component 34B includes at least one chip magnetic element 3421B, and the chip magnetic element 3421B is enclosed in the chip movable carrier 331B of the second chip anti-shake movable part 33B, so that the chip movable carrier 331B is suspended in the receiving cavity of the second chip anti-shake fixed part 31B through the magnetic attraction force between the chip magnet component 321B of the second chip driving component 32B and the at least one chip magnetic element 3421B. In a specific example of the present application, at least one of the chip magnetic elements 3421B of the second chip holding component 34B is embedded in the chip movable carrier 331B of the second chip anti-shake movable part 33B through an insert molding process, and at least one of the chip magnetic elements 3421B is arranged opposite to the chip magnet component 321B to generate a magnetic attraction force between at least one of the chip magnetic elements 3421B and the chip magnet component 321B. On the one hand, the chip support component 341B of the second chip holding component 34B is clamped between the second chip anti-shake fixed part 31B and the second chip anti-shake movable part 33B through the action of the magnetic attraction force. Specifically, the ball bearing 3411B is clamped between the upper cover 311B and the movable chip carrier 331B by the magnetic attraction between at least one chip magnetic element 3421B of the second chip retaining assembly 34B and the chip magnet assembly 321B of the second chip anti-shake movable portion 33B. Furthermore, after the movable chip carrier 331B moves, the magnetic attraction maintains the movable chip carrier 331B in a certain position, which may be the initial position of the movable chip carrier 331B before it is driven. The chip magnetic element 3421B of the second chip retaining assembly 34B is made of a magnetically permeable material suitable for generating magnetic attraction with a magnet.

[0315] The chip magnetic element 3421A of the first chip holding component 34A includes a magnetic element main body 34211A and a magnetic element connecting part 34212A, and the magnetic element main body 34211A and the magnetic element connecting part 34212A extend as one body. The magnetic element connecting part 34212A is used to maintain the position of the chip magnetic element 3421A in the chip movable carrier 331A of the first chip anti-shake movable part 33A during the insert molding process. The magnetic element connecting part 34212A can be connected to the magnetic element connecting part 34212A of other chip magnetic elements 3421A or connected to other supporting components for supporting the magnetic element connecting part 34212A. After the chip magnetic element 3421A of the first chip holding assembly 34A is formed in the chip movable carrier 331A of the first chip anti-shake movable part 33A through an insert molding process, the magnetic element connecting portion 34212A is sheared, and a portion of the magnetic element connecting portion 34212A may be exposed outside the chip movable carrier 331A. That is, in some embodiments of the present application, the chip magnetic element 3421A of the first chip holding assembly 34A includes a magnetic element main body 34211A encased within the chip movable carrier 331A of the first chip anti-shake movable part 33A, and a magnetic element connecting portion 34212A extending from the magnetic element main body 34211A to the outside of the chip movable carrier 331A.

[0316] The chip magnetic element 3421B of the second chip holding component 34B includes a magnetic element main body 34211B and a magnetic element connecting part 34212B, and the magnetic element main body 34211B and the magnetic element connecting part 34212B extend as one body. The magnetic element connecting part 34212B is used to maintain the position of the chip magnetic element 3421B in the chip movable carrier 331B of the second chip anti-shake movable part 33B during the insert molding process. The magnetic element connecting part 34212B can be connected to the magnetic element connecting part 34212B of other chip magnetic elements 3421B or connected to other supporting components for supporting the magnetic element connecting part 34212B. After the chip magnetic element 3421B of the second chip holding assembly 34B is formed in the chip movable carrier 331B of the second chip anti-shake movable part 33B through an insert molding process, the magnetic element connecting portion 34212B is sheared, and a portion of the magnetic element connecting portion 34212B may be exposed outside the chip movable carrier 331B. That is, in some embodiments of the present application, the chip magnetic element 3421B of the second chip holding assembly 34B includes a magnetic element main body 34211B enclosed within the chip movable carrier 331B of the second chip anti-shake movable part 33B, and a magnetic element connecting portion 34212B extending from the magnetic element main body 34211B to the outside of the chip movable carrier 331B.

[0317] In one embodiment of the present application, the upper surface of the chip magnetic element 3421A of the first chip holding component 34A is exposed and is not wrapped by the chip movable carrier 331A of the first chip anti-shake movable part 33A; in other embodiments of the present application, the upper surface of the chip magnetic element 3421A may also be wrapped by the chip movable carrier 331A, and the present application is not limited to this.

[0318] The upper surface of the chip magnetic element 3421B of the second chip holding component 34B is exposed and is not wrapped by the chip movable carrier 331B of the second chip anti-shake movable part 33B; in other embodiments of the present application, the upper surface of the chip magnetic element 3421B can also be wrapped by the chip movable carrier 331B, and the present application is not limited to this.

[0319] In particular, in one embodiment of the present application, the chip magnetic component 342A of the first chip retaining component 34A includes a first chip magnetic component 3422A and a second chip magnetic component 3423A, wherein, through the reasonable arrangement of the first chip magnetic component 3422A and the second chip magnetic component 3423A, the first chip magnetic component 3422A and the second chip magnetic component 3423A play different main roles. Looking at its surface along the Z-axis direction, the three balls 3411A of the first chip holding component 34A are arranged in a triangular shape, and the first chip magnetic component 3422A is set at the corner of the triangular plane (that is, the corner area). The first chip magnetic component 3422A is set close to the ball 3411A. The main function of the first chip magnetic component 3422A is to generate a magnetic attraction force along the Z-axis direction with the chip magnet component 321A of the first chip driving element 32A, so that the chip support component 341A is clamped between the first chip anti-shake fixing part 31A and the The first chip anti-shake movable part 33A is located between the second chip magnetic component 3423A and the second chip magnetic component 3423A. The second chip magnetic component 3423A is located at the edge of the triangular plane, that is, the distance between the second chip magnetic component 3423A and the ball 3411A is farther than the distance between the first chip magnetic component 3422A and the ball 3411A. The main function of the second chip magnetic component 3423A is to generate a magnetic attraction force with a certain angle to the Z-axis direction with the chip magnet group after the chip movable carrier 331A moves. The main function of this magnetic attraction force is to make the chip movable carrier 331A return to a certain position. Of course, the main functions of the first chip magnetic component 3422A and the second chip magnetic component 3423A of the first chip holding component 34A in this application are different, which does not mean that the first chip magnetic component 3422A and the second chip magnetic component 3423A will not have other functions. That is to say, the first chip magnetic component 3422A of the first chip holding component 34A will also have the function of restoring the chip movable carrier 331A to a position through the action of magnetic force after the chip movable carrier 331A of the first chip anti-shake movable part 33A moves. The second chip magnetic component 3423A will also have the function of clamping the chip supporting component 341A between the first chip anti-shake fixed part 31A and the first chip anti-shake movable part 33A through the action of magnetic force. The first chip magnetic component 3422A and the second chip magnetic component 3423A cooperate with each other and act on the chip movable carrier 331A together. However, since the positions of the first chip magnetic component 3422A and the second chip magnetic component 3423A are different, their main functions are different.

[0320] The chip magnetic component 342B of the second chip holding component 34B includes a first chip magnetic component 3422B and a second chip magnetic component 3423B, wherein, by rationally arranging the first chip magnetic component 3422B and the second chip magnetic component 3423B, the first chip magnetic component 3422B and the second chip magnetic component 3423B play different main roles. Looking at its surface along the Z-axis direction, the three balls 3411B of the second chip holding component 34B are arranged in a triangular shape, the first chip magnetic component 3422B is arranged at the corner of the triangular plane (i.e., the corner area), the first chip magnetic component 3422B is arranged close to the balls 3411B, and the main function of the first chip magnetic component 3422B is to generate a magnetic attraction force along the Z-axis direction with the chip magnet component 321B of the second chip driving element 32B, so that the chip support component 341B is clamped between the second chip anti-shake fixing part 31B and the The second chip anti-shake movable part 33B is located between the second chip magnetic component 3423B and the second chip magnetic component 3423B. The second chip magnetic component 3423B is located at the edge of the triangular plane, that is, the distance between the second chip magnetic component 3423B and the ball 3411B is farther than the distance between the first chip magnetic component 3422B and the ball 3411B. The main function of the second chip magnetic component 3423B is to generate a magnetic attraction force with a certain angle to the Z-axis direction with the chip magnet group after the movable chip carrier 331B moves. The main function of this magnetic attraction force is to make the movable chip carrier 331B return to a certain position. Of course, the main functions of the first chip magnetic component 3422B and the second chip magnetic component 3423B of the second chip holding component 34B in this application are different, which does not mean that the first chip magnetic component 3422B and the second chip magnetic component 3423B will not have other functions. That is to say, the first chip magnetic component 3422B of the second chip holding component 34B will also have the function of restoring the chip movable carrier 331B to a position through the action of magnetic force after the chip movable carrier 331B of the second chip anti-shake movable part 33B moves. The second chip magnetic component 3423B will also have the function of clamping the chip supporting component 341B between the second chip anti-shake fixed part 31B and the second chip anti-shake movable part 33B through the action of magnetic force. The first chip magnetic component 3422B and the second chip magnetic component 3423B cooperate with each other and act on the chip movable carrier 331B together, but since the positions of the first chip magnetic component 3422B and the second chip magnetic component 3423B are different, the main functions of the two are different.

[0321] Specifically, in the embodiment of the present application, the number of the first chip magnetic components 3422A of the first chip holding component 34A is 4, including a first chip magnetic element 734221A, a second chip magnetic element 734222A, a third chip magnetic element 734223A and a fourth chip magnetic element 734224A. The first chip magnetic element 734221A of the first chip holding component 34A and the first chip magnet 732111A of the first chip driving component 32A are arranged relative to each other along the height direction set by the chip movable carrier 331A of the first chip anti-shake movable part 33A, the second chip magnetic element 734222A and the second chip magnet 732112A are arranged relative to each other along the height direction set by the chip movable carrier 331A, and the third chip magnetic element 734223A and the third chip magnet 732121A are arranged relative to each other along the height direction set by the chip movable carrier 331A. The movable carrier 331A is relatively arranged in the height direction set by the fourth chip magnetic element 734224A and the fourth chip magnet 732131A are relatively arranged along the height direction set by the chip movable carrier 331A. The chip magnet component 321A and the first chip magnetic component 3422A in this application do not need to be completely opposite to each other in the height direction set by the chip movable carrier 331A, that is, the projection of the chip magnet component 321A and the projection of the first chip magnetic component 3422A can overlap at least partially.

[0322] The number of the first chip magnetic components 3422B of the second chip holding component 34B is 4, including a first chip magnetic element 734221B, a second chip magnetic element 734222B, a third chip magnetic element 734223B and a fourth chip magnetic element 734224B. The first chip magnetic element 734221B of the second chip holding component 34B and the first chip magnet 732111B of the second chip driving component 32B are arranged relative to each other along the height direction set by the chip movable carrier 331B of the second chip anti-shake movable part 33B, the second chip magnetic element 734222B and the second chip magnet 732112B are arranged relative to each other along the height direction set by the chip movable carrier 331B, and the third chip magnetic element 734223B and the third chip magnet 732121B are arranged relative to each other along the height direction set by the chip movable carrier 331B. The movable carrier 331B is relatively arranged in the height direction set by the fourth chip magnetic element 734224B and the fourth chip magnet 732131B are relatively arranged along the height direction set by the chip movable carrier 331B. The chip magnet component 321A and the first chip magnetic component 3422A in this application do not need to be completely opposite to each other in the height direction set by the chip movable carrier 331B, that is, the projection of the chip magnet component 321B and the projection of the first chip magnetic component 3422B can overlap at least in part.

[0323] The first and second magnetic elements 734221A and 734222A of the first chip holding assembly 34A are located on a first side of the movable chip carrier 331A of the first chip anti-shake movable portion 33A. The third and fourth magnetic elements 734223A and 734224A are located on a second and fourth side of the movable chip carrier 331A, respectively. Alternatively, the first, second, third, and fourth magnetic elements 734221A, 734222A, 734223A, and 734224A of the first chip holding assembly 34A are positioned relative to the position of the ball bearing 3411A.

[0324] The first and second magnetic elements 734221B and 734222B of the second chip holding assembly 34B are located on a first side of the movable chip carrier 331B of the second chip anti-shake movable portion 33B. The third and fourth magnetic elements 734223B and 734224B are located on a second and fourth side of the movable chip carrier 331B, respectively. Alternatively, the first, second, third, and fourth magnetic elements 734221B, 734222B, 734223B, and 734224B of the second chip holding assembly 34B are positioned relative to the position of the ball bearing 3411B.

[0325] Furthermore, the first chip magnetic element 734221A and the second chip magnetic element 734222A of the first chip holding component 34A are arranged close to the ball 3411A along the X-axis, and the first and second chip magnetic elements 734221A and 734222A are respectively arranged on either side of two of the ball 3411A. The third and fourth chip magnetic elements 734223A and 734224A are also arranged close to the ball 3411A along the Y-axis, and the third and fourth chip magnetic elements 734223A and 734224A are respectively arranged on either side of one of the ball 3411A. Because the first chip magnetic element 3422A of the first chip holding component 34A is closer to the ball 3411A, the magnetic attraction force generated between the first chip magnetic element 3422A and the chip magnet element 321A of the first chip driving component 32A, which clamps the chip support component 341A, is more pronounced.

[0326] The first and second chip magnetic elements 734221B and 734222B of the second chip holding assembly 34B are positioned proximate to the balls 3411B along the X-axis, with the first and second chip magnetic elements 734221B and 734222B respectively positioned on either side of two of the balls 3411B. The third and fourth chip magnetic elements 734223B and 734224B are positioned proximate to the balls 3411B along the Y-axis, with the third and fourth chip magnetic elements 734223B and 734224B respectively positioned on either side of a ball 3411B. Because the first chip magnetic element 3422B of the second chip holding assembly 34B is closer to the balls 3411B, the magnetic attraction between the first chip magnetic element 3422B and the chip magnet element 321B of the second chip driving assembly 32B is more pronounced, clamping the chip support assembly 341B.

[0327] More specifically, in the embodiment of the present application, the number of the second chip magnetic components 3423A of the first chip retaining component 34A is 2, including a fifth chip magnetic element 734231A and a sixth chip magnetic element 734232A, wherein the fifth chip magnetic element 734231A and the third chip magnet 732121A of the first chip driving component 32A are arranged relative to each other along the height direction set by the chip movable carrier 331A of the first chip anti-shake movable part 33A, and the sixth chip magnetic element 734232A and the fourth chip magnet 732131A are arranged relative to each other along the height direction set by the chip movable carrier 331A. Furthermore, in a specific example of the present application, the fifth chip magnetic element 734231A of the first chip holding component 34A is disposed between the first chip magnet 732111A and the third chip magnet 32131 of the first chip driving component 32A, and the sixth chip magnetic element is disposed between the second chip magnet 732112A and the fourth chip magnet 32121. Alternatively, the fifth chip magnetic element 734231A of the first chip holding component 34A is disposed on the second side of the movable chip carrier 331A of the first chip driving component 32A, and the sixth chip magnetic element 734232A is disposed on the fourth side of the movable chip carrier 331A. This arrangement allows for the movement of the movable chip carrier 331A of the first chip anti-shake movable portion 33A, generating a magnetic attraction force at a certain angle to the Z-axis direction between the second chip magnetic attraction component 3423A and the chip magnet component 321A of the first chip driver component 32A. This magnetic attraction force causes the movable chip carrier 331A to return to a certain position. Of course, it is understood that during this process, a magnetic attraction force is also generated between the first chip magnetic attraction component 3422A of the first chip retaining component 34A and the chip magnet component 321A of the first chip driver component 32A, causing the movable chip carrier 331A of the first chip anti-shake movable portion 33A to return to a certain position.

[0328] The second chip magnetic components 3423B of the second chip holding assembly 34B are two in number and include a fifth chip magnetic component 734231B and a sixth chip magnetic component 734232B. The fifth chip magnetic component 734231B is positioned relative to the third chip magnet 732121B of the second chip driver 32B along a height direction set by the movable chip carrier 331B of the second chip anti-shake movable portion 33B, and the sixth chip magnetic component 734232B is positioned relative to the fourth chip magnet 732131B along a height direction set by the movable chip carrier 331B. Furthermore, in a specific example of the present application, the fifth chip magnetic component 734231B of the second chip holding assembly 34B is positioned between the first chip magnet 732111B and the third chip magnet 32131 of the second chip driver 32B, and the sixth chip magnetic component is positioned between the second chip magnet 732112B and the fourth chip magnet 32121. Alternatively, the fifth chip magnetic element 734231B of the second chip retaining assembly 34B is positioned on the second side of the movable chip carrier 331B of the second chip driver 32B, and the sixth chip magnetic element 734232B is positioned on the fourth side of the movable chip carrier 331B. This arrangement allows for the generation of a magnetic attraction force at a predetermined angle with respect to the Z-axis between the second chip magnetic element 3423B and the chip magnet element 321B of the second chip driver 32B after the movable chip carrier 331B of the second chip anti-shake movable portion 33B moves. This magnetic attraction force causes the movable chip carrier 331B to return to a predetermined position. Of course, it is understood that during this process, a magnetic attraction force is also generated between the first chip magnetic element 3422B of the second chip retaining assembly 34B and the chip magnet element 321B of the second chip driver 32B, causing the movable chip carrier 331B of the second chip anti-shake movable portion 33B to return to a predetermined position.

[0329] The first chip magnetic component 3422A of the first chip holding component 34A includes at least one first chip magnetic element 834221A, and the second chip magnetic component 3423A includes at least one second chip magnetic element 834231A. The first chip magnetic element 834221A is adjacent to the first support component of the at least three support components, and the distance between the second chip magnetic element 834231A and any support component of the at least three support components is greater than the distance between the first chip magnetic element 834221A and the first support component.

[0330] The first chip magnetic component 3422B of the second chip holding component 34B includes at least one first chip magnetic element 834221B, the second chip magnetic component 3423B includes at least one second chip magnetic element 834231B, the first chip magnetic element 834221B is adjacent to the first support component of the at least three support components, and the distance between the second chip magnetic element 834231B and any support component of the at least three support components is greater than the distance between the first chip magnetic element 834221B and the first support component.

[0331] In the embodiment of the present application, the number of the first chip magnetic components 3422A of the first chip holding component 34A is 4, and the number of the second chip magnetic components 3423A is 2. The first chip magnetic component 3422A of the first chip holding component 34A includes two opposing first chip magnetic elements 834221A and two opposing third chip magnetic elements 834222A, forming a pair of first chip magnetic elements 834221A and a pair of third chip magnetic elements 834222A. The second chip magnetic component 3423A includes two second chip magnetic elements 834231A, forming a pair of second chip magnetic elements 834231A.

[0332] The number of first chip magnetic components 3422B of the second chip holding assembly 34B is 4, and the number of second chip magnetic components 3423B is 2. The first chip magnetic components 3422B of the second chip holding assembly 34B include two opposing first chip magnetic elements 834221B and two opposing third chip magnetic elements 834222B, forming a pair of first chip magnetic elements 834221B and a pair of third chip magnetic elements 834222B. The second chip magnetic component 3423B includes two second chip magnetic elements 834231B, forming a pair of second chip magnetic elements 834231B.

[0333] The pair of first chip magnetic elements 834221A of the first chip holding assembly 34A and the pair of first chip magnets 832111A of the first chip driving element 32A are arranged opposite each other along the height direction set by the movable chip carrier 331A of the first chip anti-shake movable portion 33A, and the pair of second chip magnetic elements 834231A and the pair of second chip magnets 832112A are arranged opposite each other along the height direction set by the movable chip carrier 331A. In other words, the pair of first chip magnetic elements 834221A of the first chip holding assembly 34A correspond to the pair of first chip magnets 832111A along the height direction set by the movable chip carrier 331A of the first chip anti-shake movable portion 33A, and the pair of second chip magnetic elements 834231A correspond to the pair of second chip magnets 832112A along the height direction set by the movable chip carrier 331A. In this application, the chip magnet component 321A and the first chip magnetic component 3422A are not required to be completely opposite to each other in the height direction set along the chip movable carrier 331A, that is, the projection of the chip magnet component 321A and the projection of the first chip magnetic component 3422A can overlap at least partially.

[0334] The pair of first chip magnetic elements 834221B of the second chip holding assembly 34B and the pair of first chip magnets 832111B of the second chip driving element 32B are arranged opposite each other along a height direction set by the movable chip carrier 331B of the first chip anti-shake movable portion 33B, while the pair of second chip magnetic elements 834231B and the pair of second chip magnets 832112B are arranged opposite each other along a height direction set by the movable chip carrier 331B. Specifically, the pair of first chip magnetic elements 834221B of the second chip holding assembly 34B correspond to the pair of first chip magnets 832111B along a height direction set by the movable chip carrier 331B of the first chip anti-shake movable portion 33B, and the pair of second chip magnetic elements 834231B correspond to the pair of second chip magnets 832112B along a height direction set by the movable chip carrier 331B. In this application, the chip magnet component 321B and the first chip magnetic component 3422B do not need to be completely opposite to each other in the height direction set along the chip movable carrier 331B, that is, the projection of the chip magnet component 321B and the projection of the first chip magnetic component 3422B can overlap at least partially.

[0335] The pair of first chip magnetic elements 834221A of the first chip holding assembly 34A are positioned on a first side of the movable chip carrier 331A, on opposite sides of the first support assembly. A pair of third chip magnetic elements 834222A are positioned on a second side and a fourth side of the movable chip carrier 331A, with one third chip magnetic element 834222A adjacent to the second support assembly, and the other third chip magnetic element 834222A adjacent to the third support assembly. Alternatively, the first and third chip magnetic elements 834221A and 834222A of the first chip holding assembly 34A are positioned relative to the position of the ball bearings 3411A of the support assembly.

[0336] The pair of first chip magnetic elements 834221B of the second chip holding assembly 34B are positioned on a first side of the movable chip carrier 331B, on opposite sides of the first support assembly. A pair of third chip magnetic elements 834222B are positioned on the second and fourth sides of the movable chip carrier 331B, with one third chip magnetic element 834222B adjacent to the second support assembly, and the other third chip magnetic element 834222B adjacent to the third support assembly. Alternatively, the first and third chip magnetic elements 834221B and 834222B of the second chip holding assembly 34B are positioned relative to the position of the ball bearings 3411B of the support assembly.

[0337] Furthermore, the pair of first chip magnetic elements 834221A of the first chip holding component 34A are positioned proximate to the balls 3411A along the X-axis, with the pair of first chip magnetic elements 834221A being positioned on either side of two of the balls 3411A. A pair of third chip magnetic elements 834222A are positioned proximate to the balls 3411A along the Y-axis, with the third chip magnetic elements 834222A being positioned on either side of one of the balls 3411A. Because the first chip magnetic elements 3422A of the first chip holding component 34A are closer to the balls 3411A, the magnetic attraction generated between them and the chip magnet element 321A of the first chip driving component 32A, which clamps the chip support components 341A and 341B, is more pronounced.

[0338] The pair of first chip magnetic elements 834221B of the second chip holding assembly 34B are positioned proximate to the balls 3411B along the X-axis, with the pair of first chip magnetic elements 834221B positioned on either side of two of the balls 3411B. A pair of third chip magnetic elements 834222B are positioned proximate to the balls 3411B along the Y-axis, with the third chip magnetic elements 834222B positioned on either side of a ball 3411B. Because the first chip magnetic element 3422B of the second chip holding assembly 34B is closer to the balls 3411B, the magnetic attraction between the first chip magnetic element 3422B and the chip magnet element 321B of the second chip driving assembly 32B is more pronounced, clamping the chip support assemblies 341B and 341B.

[0339] It is worth mentioning that the first chip magnetic element 834221A and the third chip magnetic element 834222A of the first chip holding assembly 34A are larger than the second chip magnetic element 834231A. This is because the first chip magnetic element 834221A and the third chip magnetic element 834222A of the first chip holding assembly 34A primarily function to clamp the ball 3411 and also serve to reset the movable chip carrier 331A of the first chip anti-shake movable portion 33A. The second chip magnetic element 834231A and its corresponding chip magnet element only generate a reset force to reset the movable chip carrier 331A.

[0340] The first and third chip magnetic elements 834221B and 834222B of the second chip holding assembly 34B are larger than the second chip magnetic element 834231B. This is because the first and third chip magnetic elements 834221B and 834222B of the second chip holding assembly 34B primarily hold the ball 3411 and also serve to reset the movable chip carrier 331B of the second chip anti-shake movable portion 33B. Therefore, the second chip magnetic element 834231B and its corresponding chip magnet element only need to generate a reset force to reset the movable chip carrier 331B.

[0341] In the embodiment of the present application, the pair of second chip magnetic elements 834231A of the first chip holding assembly 34A and the second chip magnet 832112 of the first chip driver component 32A are arranged relative to each other along the height direction set by the movable chip carrier 331A of the first chip anti-shake movable part 33A. Furthermore, in a specific example of the present application, the pair of second chip magnetic elements 834231A of the first chip holding assembly 34A are arranged between the pair of first chip magnets 832111A and the pair of third chip magnets 32131 of the first chip driver component 32A. In other words, one of the pair of second chip magnetic elements 834231A of the first chip holding assembly 34A is arranged in the middle of the second side of the movable chip carrier 331A of the first chip anti-shake movable part 33A, and the other second chip magnetic element 834231A is arranged in the middle of the fourth side of the movable chip carrier 331A. This arrangement allows for the movable chip carrier 331A of the first chip anti-shake movable portion 33A to move, generating a magnetic attraction force at a certain angle to the Z-axis direction between the second chip magnetic attraction component 3423A of the first chip retaining component 34A and the chip magnet component 321A of the first chip driving component 32A. This magnetic attraction force causes the movable chip carrier 331A to return to a certain position. Of course, it is understood that during this process, a magnetic attraction force is also generated between the first chip magnetic attraction component 3422A of the first chip retaining component 34A and the chip magnet component 321A of the first chip driving component 32A, causing the movable chip carrier 331A of the first chip anti-shake movable portion 33A to return to a certain position.

[0342] The pair of second chip magnetic elements 834231B of the second chip holding assembly 34B and the second chip magnet 832112 of the second chip driving component 32B are arranged opposite each other along a height direction set by the movable chip carrier 331B of the second chip anti-shake movable part 33B. Furthermore, in a specific example of the present application, the pair of second chip magnetic elements 834231B of the second chip holding assembly 34B are arranged between the pair of first chip magnets 832111B and the pair of third chip magnets 32131 of the second chip driving component 32B. In other words, one of the pair of second chip magnetic elements 834231B of the second chip holding assembly 34B is arranged in the middle of the second side of the movable chip carrier 331B of the second chip anti-shake movable part 33B, and the other second chip magnetic element 834231B is arranged in the middle of the fourth side of the movable chip carrier 331B. This arrangement allows for the movable chip carrier 331B of the second chip anti-shake movable portion 33B to move, generating a magnetic attraction force at a certain angle to the Z-axis direction between the second chip magnetic attraction component 3423B of the second chip retaining assembly 34B and the chip magnet component 321B of the second chip driving component 32B. This magnetic attraction force causes the movable chip carrier 331B to return to a certain position. Of course, it is understood that during this process, a magnetic attraction force is also generated between the first chip magnetic attraction component 3422B of the second chip retaining assembly 34B and the chip magnet component 321B of the second chip driving component 32B, causing the movable chip carrier 331B of the second chip anti-shake movable portion 33B to return to a certain position.

[0343] It is worth mentioning that the magnetic attraction force generated between the second chip magnetic attraction component 3423A of the first chip holding component 34A and the chip magnet component 321A of the first chip driving element 32A can be a force opposite to the moving direction of the chip movable carrier 331A of the first chip anti-shake movable part 33A. At this time, the magnetic attraction force is a reset force, so that the chip movable carrier 331A returns to a position; the magnetic attraction force generated between the second chip magnetic attraction component 3423A and the chip magnet component 321A can also be a force with the same moving direction as the chip movable carrier 331A. At this time, the magnetic attraction force is an external attraction force. This is because when the chip movable carrier 331A moves, the first circuit board 41A of the first photosensitive component 40A will also generate a certain reset force. The external attraction force is slightly offset by the reset force of the first circuit board 41A to compensate for the thrust of the chip movable carrier 331A in the edge stroke.

[0344] The magnetic attraction force generated between the second chip magnetic attraction component 3423B of the second chip holding component 34B and the chip magnet component 321B of the second chip driving element 32B can be a force opposite to the moving direction of the chip movable carrier 331B of the second chip anti-shake movable part 33B. At this time, the magnetic attraction force is a reset force, so that the chip movable carrier 331B returns to a position; the magnetic attraction force generated between the second chip magnetic attraction component 3423B and the chip magnet component 321B can also be a force in the same direction as the moving direction of the chip movable carrier 331B. At this time, the magnetic attraction force is an external attraction force. This is because when the chip movable carrier 331B moves, the second circuit board 41B of the second photosensitive component 40B will also generate a certain reset force. The external attraction force and the reset force of the second circuit board 41B are slightly offset to compensate for the thrust of the chip movable carrier 331B in the edge stroke.

[0345] In a specific example of the present application, the chip magnetic component 342A of the first chip holding component 34A includes six chip magnetic elements 3421A, and every two of the chip magnetic elements 3421A have the same shape, thereby providing a uniform and stable magnetic force, so that the chip movable carrier 331A of the first chip anti-shake movable part 33A is smoothly adsorbed to the upper cover 311A ​​of the first chip anti-shake fixed part 31A.

[0346] The chip magnetic assembly 342B of the second chip holding assembly 34B includes six chip magnetic elements 3421B, and every two of the chip magnetic elements 3421B have the same shape, thereby providing a uniform and stable magnetic force, so that the chip movable carrier 331B of the second chip anti-shake movable part 33B is stably adsorbed to the upper cover 311B of the second chip anti-shake fixed part 31B.

[0347] In the present application, the chip movable carrier 331A of the first chip anti-shake movable part 33A can be integrally formed with the ball support piece 3413A of the first chip holding component 34A and the chip magnetic element 3421A in the form of insert molding through an injection molding process to reduce the number of parts of the first chip driving motor 30A. The first chip anti-shake conductive part 35A can also be embedded in the first chip anti-shake movable part 33A through insert molding.

[0348] The chip movable carrier 331B of the second chip anti-shake movable part 33B can be integrally formed with the ball support piece 3413B of the second chip holding component 34B and the chip magnetic element 3421B in an insert molding manner through an injection molding process to reduce the number of parts of the second chip driving motor 30B. The second chip anti-shake conductive part 35B can also be embedded in the second chip anti-shake movable part 33B through insert molding.

[0349] Therefore, the present application embeds the first chip anti-shake conductive portion 35A into the first chip anti-shake movable portion 33A by, for example, insert molding, providing a first chip anti-shake movable portion 33A with a conductive function, so that the chip coil assembly 322A of the first chip driver element 32A can be electrically connected to the first circuit board 41A through the first chip anti-shake movable portion 33A. In addition, since the first chip anti-shake conductive portion 35A is embedded in the first chip anti-shake movable portion 33A by insert molding, the first chip anti-shake movable portion 33A is suitable for providing two flat mounting surfaces for mounting and fixing the chip coil assembly 322A of the first chip driver element 32A and the first circuit board 41A. This can also reduce the number of components of the chip anti-shake motor, reduce the assembly complexity of the chip anti-shake motor, and protect the first chip anti-shake conductive portion 35A.

[0350] In this application, the second chip anti-shake conductive portion 35B is embedded in the second chip anti-shake movable portion 33B through, for example, insert molding, providing a second chip anti-shake movable portion 33B with a conductive function. This allows the chip coil assembly 322B of the second chip driver 32B to be electrically connected to the second circuit board 41B through the second chip anti-shake movable portion 33B. Furthermore, because the second chip anti-shake conductive portion 35B is embedded in the second chip anti-shake movable portion 33B through insert molding, the second chip anti-shake movable portion 33B is suitable for providing two flat mounting surfaces for mounting and fixing the chip coil assembly 322B of the second chip driver 32B and the second circuit board 41B. This can also reduce the number of components in the chip anti-shake motor, reduce the assembly complexity of the chip anti-shake motor, and protect the second chip anti-shake conductive portion 35B.

[0351] Specifically, the first chip anti-shake movable part 33A and the first chip anti-shake conductive part 35A form an embedded structure. The first chip anti-shake conductive part 35A includes at least one coil conductive component 351A. In one embodiment of the present application, the first chip anti-shake conductive part 35A includes multiple (two or more) coil conductive elements 3511A. The multiple coil conductive elements 3511A are embedded in the chip movable carrier 331A by, for example, insert molding. That is, the coil conductive elements 3511A are enclosed in the chip anti-shake movable carrier so that the multiple coil conductive elements 3511A can electrically connect the chip coil component 322A and the first circuit board 41A.

[0352] The second chip anti-shake movable portion 33B and the second chip anti-shake conductive portion 35B form an embedded structure. The second chip anti-shake conductive portion 35B includes at least one coil conductive component 351B. In one embodiment of the present application, the second chip anti-shake conductive portion 35B includes multiple (two or more) coil conductive elements 3511B. The multiple coil conductive elements 3511B are embedded in the chip movable carrier 331B by, for example, insert molding. That is, the coil conductive elements 3511B are enclosed in the chip anti-shake movable carrier so that the multiple coil conductive elements 3511B can electrically connect the chip coil component 322B and the second circuit board 41B.

[0353] The number of coil conductive elements 3511A in the coil conductive assembly 351A of the first chip anti-shake conductive part 35A is related to the number of circuits required by the chip coil assembly 322A of the first chip driving element 32A. In a specific example of the present application, the coil conductive assembly 351A of the first chip anti-shake conductive part 35A includes 6 coil conductive elements 3511A. Each of the coil conductive elements 3511A of the first chip anti-shake conductive part 35A has an exposed first coil conductive end 35111A, an exposed second coil conductive end 35113A opposite to the first coil conductive end 35111A, and a coil conductive extension part 35112A extending and electrically conducting between the first coil conductive end 35111A and the second coil conductive end 35113A. The first coil conductive end 35111A is positioned higher than the second coil conductive end 35113A, and the coil conductive extension part 35112A extends downward from the first coil conductive end 35111A to the...

Claims

1. A drive assembly, characterized in that: include: A chip anti-shake fixing portion having a receiving cavity; A chip anti-shake movable portion movably received in the receiving cavity, the chip anti-shake movable portion comprising a chip movable carrier, the chip movable carrier being suitable for mounting a photosensitive component thereon, the photosensitive component having a first central axis; as well as a chip driving element for driving the chip movable carrier of the chip anti-shake movable part to move relative to the chip fixing part within the receiving cavity; The drive assembly has a second central axis, and the first central axis is offset from the second central axis.

2. The drive assembly according to claim 1, wherein: The photosensitive component includes a photosensitive chip, and the central axis of the photosensitive chip is the first central axis of the photosensitive component.

3. The drive assembly according to claim 1, wherein: The photosensitive component includes a photosensitive chip, and the photosensitive chip is arranged in an eccentric manner relative to the center of the driving component.

4. The drive assembly according to claim 2, wherein: The photosensitive component is suitable for being installed on the chip movable carrier, wherein the chip anti-shake fixing part includes an upper cover and a base that are buckled together to form the accommodating cavity, and there is a gap between the chip movable carrier and the base.

5. The drive assembly according to claim 4, wherein: The driving component also includes a chip holding component, and the chip holding component includes at least one chip magnetic attraction element enclosed in the chip movable carrier, wherein the chip driving component includes a chip coil component arranged on the chip movable carrier, and a chip magnet component fixed to the upper cover and corresponding to the chip coil component, so that the chip movable carrier is suspended in the receiving cavity of the chip anti-shake fixing part through the magnetic attraction force between the chip magnet component and the at least one chip magnetic attraction element.

6. The drive assembly according to claim 5, wherein: The chip coil assembly includes at least one chip coil, and the driving assembly also includes a chip anti-shake conductive part. The chip anti-shake conductive part includes at least one coil conductive element enclosed in the chip anti-shake movable carrier. Each of the coil conductive elements has an exposed first coil conductive end, an exposed second coil conductive end opposite to the first coil conductive end, and a coil conductive extension extending between the first coil conductive end and the second coil conductive end, wherein at least one chip coil is electrically connected to the first coil conductive end, and the second coil conductive end is suitable for electrically connecting to the circuit board of the photosensitive component.

7. The drive assembly according to claim 6, wherein: The chip coil assembly further includes a coil circuit board disposed on the chip movable carrier, the at least one chip coil is fixed and electrically connected to the coil circuit board, and the coil circuit board is electrically connected to the first coil conductive end.

8. The drive assembly according to claim 5, wherein: The chip holding assembly also includes a chip support assembly arranged between the chip movable carrier and the upper cover, and the chip support assembly includes a ball groove recessedly formed in the chip movable carrier and a ball arranged in the ball groove, wherein the ball is clamped between the upper cover and the chip movable carrier through the magnetic attraction force between the at least one chip magnetic element and the chip magnet assembly.

9. The drive assembly according to claim 8, wherein: The chip support assembly further includes a ball support sheet embedded in the movable chip carrier and located at the bottom of the ball groove, and the ball is supported by the ball support sheet.

10. The drive assembly according to claim 9, wherein: The coil conductive element and the ball support sheet are not magnetically conductive, and the chip magnetic element is magnetically conductive.

11. The drive assembly according to claim 10, wherein: The coil conductive element, the ball support sheet and the chip magnetic element are integrally formed with the chip movable carrier through an injection molding process.

12. The drive assembly according to claim 1, wherein: The chip driving element includes a chip coil assembly arranged on the chip movable carrier, and a chip magnet assembly fixed to the upper cover and corresponding to the chip coil assembly, wherein the chip coil assembly includes at least one chip coil group, and the chip coil group is not arranged on at least one side of the chip movable carrier.

13. The drive assembly according to claim 12, wherein: The chip movable carrier includes a first side, a second side, a third side and a fourth side that are surrounded by each other, the first side is opposite to the third side, and the second side is opposite to the fourth side, wherein the chip coil assembly includes a first chip coil group arranged on the first side, and a second chip coil group and a third chip coil group arranged on the opposite second side and the fourth side.

14. The drive assembly according to claim 13, wherein: The distance between the first central axis of the photosensitive chip and the third side of the chip movable carrier is smaller than the distance between the first central axis of the photosensitive chip and the first side of the chip movable carrier.

15. The drive assembly of claim 14, wherein: The first side and the third side extend along the X-axis direction set by the driving component, and the second side and the fourth side extend along the Y-axis direction set by the driving component, and the Y-axis direction is perpendicular to the X-axis direction, wherein the first chip coil group includes a first chip coil and a second chip coil arranged on the first side, the second chip coil group includes a third chip coil arranged on the second side, and the third chip coil group includes a fourth chip coil arranged on the fourth side.

16. The drive assembly of claim 15, wherein: The first chip coil and the second chip coil are arranged relatively parallel to each other along the X-axis direction, and the third chip coil and the fourth chip coil are arranged relatively parallel to each other along the Y-axis direction.

17. A camera module, characterized in that: include: A drive assembly as claimed in any one of claims 1 to 16.

18. A multi-camera module, characterized in that: include: First camera module; as well as Second camera module; Wherein, at least one of the first camera module and the second camera module includes a driving component as described in any one of claims 1-16.

19. The multi-camera module according to claim 18, wherein: No chip driving element is set on the first side of the driving component of the first camera module, and no chip driving element is set on the second side of the driving component of the second camera module, wherein the first side of the driving component of the first camera module and the second side of the driving component of the second camera module are adjacent.

20. A drive assembly, characterized in that: include: A chip anti-shake fixing portion having a receiving cavity; A chip anti-shake movable part movably received in the receiving cavity, the chip anti-shake movable part being suitable for mounting a photosensitive component thereon; a chip driving element for driving the chip anti-shake movable portion to move relative to the chip fixing portion within the receiving cavity; A chip support assembly, comprising at least three support assemblies clamped between the chip anti-shake movable portion and the chip anti-shake fixed portion, wherein the at least three support assemblies are arranged in a non-completely collinear manner; as well as The chip magnetic component includes a first chip magnetic element and a second chip magnetic element arranged on the chip anti-shake movable part, wherein the first chip magnetic element is adjacent to the first support component of the at least three support components, and the distance between the second chip magnetic element and any support component of the at least three support components is greater than the distance between the first chip magnetic element and the first support component.

21. The drive assembly of claim 20, wherein: The chip anti-shake movable part includes a chip movable carrier, and the photosensitive component is suitable for being installed on the chip movable carrier.

22. The drive assembly of claim 21, wherein: The chip movable carrier includes a first side, a second side, a third side and a fourth side that are surrounded by each other, the first side is opposite to the third side, and the second side is opposite to the fourth side, wherein the chip support component includes a first support component, a second support component and a third support component, the first support component is arranged on the first side of the chip movable carrier, the second support component and the third support component are arranged at two corner areas of the third side of the chip movable carrier opposite to the first side, and the first support component is arranged in the middle area of ​​the first side.

23. The drive assembly of claim 21, wherein: The chip magnetic attraction component includes a pair of first chip magnetic attraction elements, which are arranged on opposite sides of the first support component, wherein the chip magnetic attraction component includes a pair of second chip magnetic attraction elements, one second chip magnetic attraction element is arranged in the middle area of ​​the second side, and the other second chip magnetic attraction element is arranged in the middle area of ​​the fourth side.

24. The drive assembly of claim 23, wherein: The size of the first chip magnetic attraction component is larger than that of the second chip magnetic attraction component.

25. The drive assembly of claim 23, wherein: The chip magnetic attraction component further includes a pair of third chip magnetic attraction elements, one of the third chip magnetic attraction elements is adjacent to the second supporting component, and the other of the third magnetic attraction elements is adjacent to the third supporting component.

26. The drive assembly of claim 25, wherein: A pair of the first chip magnetic elements, a pair of the second chip magnetic elements, and a pair of the third chip magnetic elements are covered on the chip movable carrier.

27. The drive assembly of claim 22, wherein: Each of the first supporting assembly, the second supporting assembly and the third supporting assembly includes a ball groove recessedly formed in the movable chip carrier and a ball disposed in the ball groove, wherein the ball protrudes from the ball groove.

28. The drive assembly of claim 27, wherein: The movable chip carrier further includes three extension columns protrudingly formed on the upper surface of the chip carrier body, and the ball groove is concavely formed on the upper surface of each of the extension columns.

29. The drive assembly of claim 27, wherein: Each of the supporting components further includes a ball support sheet embedded in the movable chip carrier and located at the bottom of the ball groove, and the ball is supported by the ball support sheet.

30. The drive assembly of claim 26, wherein: The chip driving element includes a chip coil assembly arranged on the chip movable carrier, and a chip magnet assembly fixed to the chip anti-shake fixing part and corresponding to the chip coil assembly, wherein the chip magnet assembly includes a pair of first chip magnets corresponding to a pair of first chip magnetic elements and a pair of second chip magnets corresponding to a pair of second chip magnetic elements.

31. The drive assembly of claim 30, wherein: The chip coil assembly includes at least one chip coil group, and the chip coil group is not set on at least one side of the chip movable carrier, wherein the chip coil assembly includes a first chip coil group set on the first side, and a second chip coil group and a third chip coil group set on the opposite second side and the fourth side.

32. A drive assembly according to claim 31, wherein: The driving component also includes a chip anti-shake conductive part, which includes at least one coil conductive element enclosed in the chip anti-shake movable carrier, each of the coil conductive elements having an exposed first coil conductive end, an exposed second coil conductive end opposite to the first coil conductive end, and a coil conductive extension extending between the first coil conductive end and the second coil conductive end, wherein at least one chip coil is electrically connected to the first coil conductive end, and the second coil conductive end is suitable for electrically connecting to the circuit board of the photosensitive component.

33. A drive assembly according to claim 32, wherein: The chip coil assembly also includes a coil circuit board arranged on the chip movable carrier, the first chip coil group, the second chip coil group and the third chip coil group are fixed and electrically connected to the coil circuit board, and the coil circuit board is electrically connected to the conductive end of the first coil.

34. A drive assembly according to claim 33, wherein: The coil conductive element and the ball support sheet are not magnetically conductive, and the chip magnetic element is magnetically conductive.

35. The drive assembly of claim 34, wherein: The coil conductive element, the ball support sheet and the chip magnetic element are integrally formed with the chip movable carrier through an injection molding process.

36. A camera module, characterized in that: include: A drive assembly as claimed in any one of claims 20 to 35.

37. A multi-camera module, characterized in that: include: First camera module; as well as Second camera module; Wherein, at least one of the first camera module and the second camera module includes a driving component as described in any one of claims 20-35.

38. The multi-camera module according to claim 37, wherein: No chip driving element is set on the first side of the driving component of the first camera module, and no chip driving element is set on the second side of the driving component of the second camera module, wherein the first side of the driving component of the first camera module and the second side of the driving component of the second camera module are adjacent.

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