Wafer cleaning equipment based on magnetic levitation motor

Abstract

The application discloses a wafer cleaning equipment based on a magnetic suspension motor, which comprises a magnetic suspension motor, wherein the magnetic suspension motor comprises a stator and a rotor, the middle part of the rotor is provided with a cavity, and a wafer is placed on the rotor; a stator lifting mechanism is fixedly connected with the stator to drive the stator to move up and down along the axial direction; and a cleaning assembly comprises at least one spray head and at least one treatment container, and the inside of the treatment container is configured as a treatment space to accommodate the rotor. The equipment uses a magnetic suspension device to replace a conventional motor, so that the stator drives the rotor to rotate without contact, and particle pollution caused by long-time friction between the rotor and the stator is avoided; the stator lifting mechanism is arranged at the bottom of the stator to drive the stator to move in the axial direction, and the stator can further drive the rotor to move in the axial direction, so that the wafer can be subjected to different cleaning processes, and the structure is simple and convenient to operate.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning equipment technology, specifically a wafer cleaning device based on a magnetic levitation motor. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit element structures can be fabricated on silicon wafers to become IC products with specific electrical functions.

[0003] In the current wafer manufacturing process, after processes such as CMP (Chemical Mechanical Polishing), PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), or DF (Diffusion Diffusion), all wafers require cleaning. The equipment used for cleaning is mostly single-wafer cleaning machines and rotary tank cleaning machines. Rotary tank cleaning machines are suitable for cleaning multiple wafers at once, but the cleanliness is relatively poor. Single-wafer cleaning machines, on the other hand, clean only one wafer per tank, resulting in lower cleaning efficiency but better cleaning effect. During wafer cleaning, a rotating device drives the carrier holding the wafer to rotate, which in turn rotates the wafer, spraying the processing solution (cleaning solution, rinsing solution, etc.) onto the wafer surface. Simultaneously, the sprayed processing solution is ejected by the rotating wafer and dispersed as a mist around the carrier.

[0004] In existing technologies, rotating equipment typically uses a traditional electric motor, where the rotor is driven to rotate by a mechanical shaft. A carrier supporting the wafer is fixed to the rotor. The mechanical shaft drives the rotor to rotate, simultaneously rotating the wafer to perform comprehensive cleaning. Figure 1 Traditional wafer cleaning equipment often suffers from two main problems. Firstly, after prolonged operation, the continuous friction between the mechanical shaft and rotor generates particles. Some of these particles may adhere to the wafer surface, affecting the cleanliness of the wafer. Other particles may flow into the drain pipe with the chemical solution in the processing container, causing blockages when there are many particles. Secondly, wafer cleaning often requires multiple steps, such as initial chemical cleaning followed by rinsing with pure water to remove residual chemicals. In traditional motors, the mechanical shaft is usually fixed to the base, and the rotor can only rotate relative to the shaft, unable to move axially. Therefore, for a wafer to move from one process to the next, a processing container that can move axially is often required on its outer side. Figure 1Both the first and second processing containers can move axially, allowing the wafers to be located within different containers during different processes, thus solving the problem of the rotor's inability to move axially. However, the processing containers are typically large, making movement labor-intensive. This structure still suffers from inconvenient operation and is difficult for workers to operate. Furthermore, when using traditional motors for wafer cleaning, if only one processing container is available, multiple processes can only be performed within the same space of the same container. This can lead to the mixing of various chemical solutions, resulting in poor cleaning performance of the wafers during the corresponding processes, rendering them unusable and increasing production costs. Summary of the Invention

[0005] To overcome the deficiencies in the prior art, embodiments of the present invention provide a wafer cleaning device based on a magnetic levitation motor, which is used to solve at least one of the above problems.

[0006] This application discloses a wafer cleaning device based on a magnetic levitation motor. This device uses a magnetic levitation motor instead of a traditional motor to achieve contactless driving of the rotor to rotate and levitate, avoiding particulate contamination caused by long-term friction between the rotor and stator of a traditional motor, thus improving the wafer cleaning effect to a certain extent. Furthermore, a stator lifting mechanism is set on the stator, which drives the stator to move in the axial direction. At the same time, the stator can drive the rotor to move in the axial direction, further enabling the wafer to undergo different cleaning processes. The structure is simple and easy to operate.

[0007] The wafer cleaning equipment based on a magnetic levitation motor described in this application includes:

[0008] A magnetic levitation motor, comprising a stator and a rotor, wherein the rotor has a cavity in the middle and a wafer is placed on the rotor;

[0009] A stator lifting mechanism is fixedly connected to the stator to drive the stator to move up and down along the axial direction;

[0010] A cleaning assembly, comprising at least one nozzle and at least one processing container, the processing container being configured internally as a processing space to accommodate the rotor.

[0011] Furthermore, the top of the processing container is configured as an opening, which is bent toward the central axis of the processing container, and the top of the opening has a first inner diameter in the radial direction, which is larger than the maximum outer diameter of the rotor.

[0012] Furthermore, the rotor is arranged around the stator, both the rotor and the stator are located within the processing container, and the wafer is located above the stator.

[0013] Furthermore, the processing containers are configured in multiple ways, with different inner diameters. The multiple processing containers are arranged in order of increasing size and spaced apart outside the rotor. A preset space is provided between the sides and bottom of two adjacent processing containers, and the preset space is configured as a processing space.

[0014] Furthermore, the stator lifting mechanism is located inside the processing container with the smallest inner diameter; or, the stator lifting mechanism passes through the bottom of the plurality of processing containers and is connected to the processing containers by a dynamic seal.

[0015] Furthermore, the processing containers are configured in multiple ways, with different inner diameters. The multiple processing containers are sequentially and spaced apart from the rotor in ascending order of size. A preset space is provided between the sides of two adjacent processing containers, and the preset space is configured as a processing space. The multiple processing containers are configured to have the same bottom.

[0016] Furthermore, the bottom of the plurality of processing containers is provided with through holes along the central axis direction, the inner diameter of the through holes is larger than the maximum outer diameter of the stator lifting mechanism, and the stator lifting mechanism passes through the through holes.

[0017] Furthermore, the inner wall of the through hole is sealed to the stator lifting mechanism by means of dynamic sealing.

[0018] Furthermore, there is a certain gap in the radial direction between the inner wall of the through hole and the stator lifting mechanism. The inner wall of the through hole is fixedly connected to one end of the axially extending bellows, and the other end of the bellows is fixedly connected to the stator lifting mechanism through a connector.

[0019] Furthermore, the inner wall of the through hole is configured to extend toward the opening of the processing container to form a groove with the side of the processing container with the smallest inner diameter. A plurality of sealing elements are disposed between the outer edge of the groove on the inner wall side of the through hole and the stator lifting mechanism to seal the groove and the stator lifting mechanism. The sealing elements are sealing rings and magnetohydrodynamic sealing elements.

[0020] Furthermore, there is a certain gap in the radial direction between the inner wall of the through hole and the stator lifting mechanism. The inner wall of the through hole is configured to extend towards the opening to form a groove with the side of the processing container with the smallest inner diameter. The groove is filled with a sealing liquid. One end of the sealing post is externally connected to the stator lifting mechanism, and the other end of the sealing post is immersed in the sealing liquid in the groove. Multiple sealing elements are arranged between the outer edge of the groove on the inner wall side of the through hole and the stator lifting mechanism to seal the groove and the stator lifting mechanism. The sealing elements are sealing rings and magnetohydrodynamic seals.

[0021] Furthermore, the stator is arranged around the rotor, the rotor is located inside the processing container, the stator is located outside the processing container, and the wafer is located above the stator.

[0022] Furthermore, the processing containers are configured as a plurality of containers, the plurality of processing containers having equal inner diameters, the plurality of processing containers being arranged at intervals along the axial direction, and configured to have common sides and bottoms.

[0023] Furthermore, the processing container is configured as a single unit, and the single processing container is configured as a processing space for multiple processes.

[0024] Furthermore, a support unit is disposed on the top of the rotor. The support unit includes a plurality of support rods extending axially. The inner edges of the plurality of support rods form a first circle. The diameter of the first circle is smaller than the outer diameter of the wafer, so as to support the wafer.

[0025] Furthermore, a linear motion mechanism is provided on the top of the stator, which is connected to the nozzle to drive the nozzle to move linearly in the radial direction relative to the stator.

[0026] Furthermore, the inner wall of the rotor is provided with a clamping assembly, which includes multiple support rods and multiple buckles. Each support rod is equipped with a corresponding buckle, and the ends of the multiple buckles form a first circle, the diameter of which is smaller than the outer diameter of the wafer.

[0027] Furthermore, the at least one nozzle is configured as a first nozzle and a second nozzle, the first nozzle and the second nozzle being respectively disposed above and below the wafer to clean the wafer.

[0028] Furthermore, the processing container is provided with a first nozzle fixing member to fix the first nozzle. The first nozzle fixing member includes a first fixing rod connected to the first nozzle. The first fixing rod has a hollow tube inside, which is configured as a liquid inlet pipe. The tail end of the liquid inlet pipe is connected to the first nozzle. The processing container is provided with a second nozzle fixing member to fix the second nozzle. The second nozzle fixing member includes a second fixing rod connected to the second nozzle. The second fixing rod has a hollow tube inside, which is configured as a liquid inlet pipe. The tail end of the liquid inlet pipe is connected to the second nozzle. The first fixing rod and the second fixing rod are configured to have a common liquid inlet.

[0029] Furthermore, the nozzle performs two-phase cleaning on the wafer by spraying supercritical carbon dioxide cleaning solution.

[0030] Furthermore, each of the processing spaces is provided with a liquid guiding groove at the bottom, and the liquid guiding groove is provided with at least one recovery hole, and each recovery hole is connected to a drain pipe.

[0031] The beneficial effects of this invention are as follows:

[0032] This magnetic levitation cleaning equipment uses a magnetic levitation motor instead of the traditional motor, enabling the stator to drive the rotor to rotate and levitate without contact. This avoids the particulate contamination caused by long-term friction between the rotor and stator of the traditional motor, thus improving the cleaning effect of the wafer to a certain extent. In addition, a stator lifting mechanism is set on the stator, which drives the stator to move in the axial direction. At the same time, the stator can drive the rotor to move in the axial direction, further enabling the wafer to perform different cleaning processes. The structure is simple and easy to operate.

[0033] To make the above and other objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the structure of a conventional motor wafer cleaning equipment using existing technology;

[0036] Figure 2 This is a schematic diagram of the structure of the first embodiment of the wafer cleaning equipment based on a magnetic levitation motor in this invention.

[0037] Figure 3 This is a schematic diagram of the structure of a second embodiment of the wafer cleaning equipment based on a magnetic levitation motor in this invention.

[0038] Figure 4 This is a schematic diagram of the third embodiment of the wafer cleaning equipment based on a magnetic levitation motor in this invention.

[0039] Figure 5 This is a schematic diagram of the fourth embodiment of the wafer cleaning equipment based on a magnetic levitation motor in this invention.

[0040] Figure 6 This is a schematic diagram of the fifth embodiment of the wafer cleaning equipment based on a magnetic levitation motor in this invention.

[0041] Figure 7 This is a schematic diagram of the sixth embodiment of the wafer cleaning equipment based on a magnetic levitation motor in this invention.

[0042] Figure 8 This is a top view of the magnetic levitation motor and clamping assembly in an embodiment of the present invention.

[0043] The reference numerals in the above figures are as follows: 10', motor; 11', mechanical shaft; 12', rotor; 20', first processing container; 30', second processing container; 40', wafer;

[0044] 10. Magnetic levitation motor; 11. Stator; 12. Rotor; 120. Cavity; 20. First nozzle; 21. Second nozzle;

[0045] 30. Stator lifting mechanism; 40. Processing container; 41. Opening; 42. Liquid guide tank; 43. Through hole;

[0046] 50. Drain pipe; 60. Corrugated pipe; 61. Connector; 70. Groove; 80. Sealing liquid; 90. Sealing column; 100. Sealing element; 110. Linear motion mechanism; 120. First support rod; 121. Second support rod; 122. Buckle; 130. Wafer. Detailed Implementation

[0047] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. The terms "comprising" and "equipped with," and any variations thereof, in the specification, claims, and the aforementioned drawings of this invention are intended to cover non-exclusive inclusion. For example, a system, product, or device that includes a series of units is not necessarily limited to those units explicitly listed, but may include other units not explicitly listed or inherent to such products or devices.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more, unless explicitly defined otherwise.

[0050] The accompanying drawings in this disclosure are not drawn to scale, and the specific dimensions and quantity of each structure can be determined according to actual needs. The drawings described in this disclosure are only schematic diagrams.

[0051] like Figure 1 In existing technologies, rotating equipment is typically a conventional motor 10', where the rotor is driven to rotate via a mechanical shaft 11'. The carrier supporting the wafer is fixed on the rotor 12'. The mechanical shaft 11' drives the rotor 12' to rotate, simultaneously rotating the wafer 40' to perform comprehensive cleaning of the wafer 40'. Figure 1 The conventional wafer cleaning equipment using the motor 10' often suffers from two problems. Firstly, after prolonged operation, the continuous friction between the mechanical shaft 11' and the rotor 12' generates particles. Some of these particles may adhere to the surface of the wafer 40', affecting its cleaning cleanliness. Some particles may also flow into the drain pipe with the chemical solution in the processing container, potentially causing blockage when there are many particles. Secondly, wafer cleaning often requires multiple steps, such as first cleaning the wafer 40' with chemical solution, and then rinsing the surface with pure water to remove any remaining chemicals. In conventional motors, the mechanical shaft 11' is often fixed to the base, and the rotor 12' can only rotate relative to the mechanical shaft 11', unable to move axially. Therefore, for the wafer 40' to move from one process to the next, a processing container that can move axially is often required on its outer side. Figure 1 Both the first processing container 20' and the second processing container 30' can move axially, allowing the wafer 40' to be located in different processing containers during different processes, thus solving the problem of the rotor 12' being unable to move axially. However, this structure still has the problem of inconvenient operation and difficulty for workers to operate; and when using a traditional motor to clean the wafer 40', if there is only one processing container, multiple processes can only be carried out in the same space of the same processing container, which will lead to the problem of mixing between various chemical solutions, resulting in poor cleaning effect of the wafer in the corresponding process, making it unusable and increasing production costs.

[0052] To address the aforementioned issues, this invention provides a wafer cleaning device based on a magnetic levitation motor. This device uses a magnetic levitation motor instead of a traditional motor, enabling the stator to drive the rotor to rotate and levitate without contact. This avoids particulate contamination caused by prolonged friction between the rotor and stator in traditional motors, thus improving the wafer cleaning effect to a certain extent. Furthermore, a stator lifting mechanism is installed on the stator, which drives the stator to move axially. Simultaneously, the stator drives the rotor to move axially, further enabling the wafer to undergo different cleaning processes. The device has a simple structure and is easy to operate.

[0053] To enable those skilled in the art to better understand the present invention, please refer to the appendix below. Figure 2-8 The present invention will be further described in detail below with reference to specific embodiments.

[0054] Figure 1 This is a schematic diagram of the structure of a conventional motor wafer cleaning equipment using existing technology; Figure 2 This is a schematic diagram of the structure of the first embodiment of the wafer cleaning equipment based on a magnetic levitation motor in this invention. Figure 3 This is a schematic diagram of the structure of a second embodiment of the wafer cleaning equipment based on a magnetic levitation motor in this invention. Figure 4 This is a schematic diagram of the third embodiment of the wafer cleaning equipment based on a magnetic levitation motor in this invention. Figure 5 This is a schematic diagram of the fourth embodiment of the wafer cleaning equipment based on a magnetic levitation motor in this invention. Figure 6 This is a schematic diagram of the fifth embodiment of the wafer cleaning equipment based on a magnetic levitation motor in this invention. Figure 7 This is a schematic diagram of the sixth embodiment of the wafer cleaning equipment based on a magnetic levitation motor in this invention. Figure 8 This is a top view of the magnetic levitation motor and clamping assembly in an embodiment of the present invention.

[0055] According to an embodiment of the present invention, a wafer cleaning device based on a magnetic levitation motor is provided, comprising a magnetic levitation motor 10, a stator lifting mechanism 30, and a cleaning assembly. The magnetic levitation motor includes a stator 11 and a rotor 12, the rotor 12 having a cavity 120 in the middle, and a wafer 130 is held on the rotor 12; the stator lifting mechanism 30 is connected to the stator 11 to drive the stator 11 to move up and down along the axial direction; the cleaning assembly includes at least one nozzle and at least one processing container 40, the processing container 40 being configured with a processing space to accommodate the rotor 12.

[0056] refer to Figure 2The monolithic wafer cleaning magnetic levitation equipment includes a magnetic levitation motor 10, a stator lifting mechanism, and a cleaning assembly. The magnetic levitation motor 10 includes a stator 11 and a rotor 12. The stator 11 is arranged around the rotor 12, i.e., the rotor 12 is disposed inside the stator 11; or, the rotor 12 is arranged around the stator 11, i.e., the stator 11 is disposed inside the rotor 12. The rotor 12 has a cavity 120 in its middle, which is used to place the wafer 130 to be cleaned. The rotor 12 holds the wafer 130. The placement position of the wafer 130 is determined according to the specific structure of the magnetic levitation motor 10; it can be placed on top of the rotor 12 or inside the cavity 120 of the rotor 12. A stator lifting mechanism 30 is connected to the bottom of the stator 11. The stator lifting mechanism 30 is connected to the stator 11. The stator lifting mechanism 30 can rise or fall axially to drive the stator 11 to move axially. Since the stator 11 can generate a magnetic field that drives the rotor 12 to rotate and levitate, when the stator 11 moves in the axial direction, the rotor 12 simultaneously moves in the axial direction along with the stator 11, further driving the wafer 130 to perform cleaning processes in different directions. The cleaning assembly includes at least one nozzle and at least one processing container. In the embodiments of this application, the number of nozzles is always two, so as to achieve thorough cleaning of both the upper and lower surfaces of the wafer 130, improving cleaning efficiency and cleanliness. Of course, those skilled in the art can also determine the number of nozzles according to actual needs, such as setting only one, or setting three, four, etc., to ensure cleaning effect while maintaining low production costs. The number of processing containers can be one, two, or three, etc., specifically determined according to actual needs and cleaning processes. The interior of the processing container is configured as a processing space to accommodate the rotor. The processing container 40 is a sealed cavity to completely isolate the stator 11 from the rotor 12. The processing container 40 serves two purposes: firstly, it acts as a container for cleaning the wafer 130, and secondly, it separates the stator 11 from the rotor 12 to prevent corrosive cleaning solutions from damaging the stator 11 and affecting its service life. The rotor carries the wafer 130, allowing it to undergo multiple cleaning processes within the processing space. This equipment uses a magnetic levitation motor 10 instead of the traditional motor 10', enabling the stator 11 to drive the rotor 12 without contact, avoiding particulate contamination caused by prolonged friction between the rotor 12 and the stator 11. Furthermore, a stator lifting mechanism 30 is installed at the bottom of the stator 11, which drives the stator 11 to move axially. The stator 11 can simultaneously drive the rotor 12 to move axially, ensuring that the wafer 130 can undergo different cleaning processes. The structure is simple and easy to operate.

[0057] Specifically, in this embodiment, the top of the processing container 40 is configured as an opening 41. The opening 41 is bent towards the central axis of the processing container 40, that is, the top of the processing container 40 is configured as a baffle to prevent chemical solutions from splashing out of the wafer 130 during cleaning, thus avoiding certain safety risks. The top of the opening 41 has a first inner diameter in the radial direction, which is larger than the maximum outer diameter of the rotor 12, so that the rotor 12 and the wafer 130 can be easily placed into or removed from the processing container 40.

[0058] Example 1 of this application:

[0059] Specifically, in this embodiment, the rotor 12 is arranged around the stator 11. Both the rotor 12 and the stator 11 are located within the processing container 40. The central axis of the stator 11 coincides with the central axis of the processing container 40. The wafer 130 is clamped on the rotor 12, and the wafer 130 is located directly above the stator 11. The outer diameter of the wafer 130 is larger than the outer diameter of the stator 11. Furthermore, in the magnetic levitation motor 10 structure with an inner stator 11 and an outer rotor 12, multiple processing containers 40 can be configured, and by placing both the rotor 12 and the stator 11 within the processing container 40, the influence of the side wall thickness of the processing container 40 will not be affected. If the magnetic levitation motor 10 is configured with an inner rotor 12 and an outer stator 11 in the case of multiple processing containers 40, the stator 11 needs to be located outside the multiple processing containers 40, and the rotor 12 needs to be located inside the multiple processing containers 40. This arrangement will result in a large air gap between the stator 11 and the rotor 12, affecting the stator 11's ability to drive the rotor 12 to rotate and levitate. An excessively large air gap may prevent the rotor 12 from rotating and levitating. Therefore, when there are multiple processing containers 40, the magnetic levitation motor 10 can only adopt the form of an inner stator 11 and an outer rotor 12. The air gap between the stator 11 and the rotor 12 will not be affected by the thickness of the sides of the multiple processing containers 40, so as to ensure the stable operation of the magnetic levitation motor 10. The multiple processing containers 40 have different inner diameters and are arranged in sequence from smallest to largest outside the rotor 12, so that the multiple processing containers 40 completely cover the magnetic levitation motor 10, so that the corresponding process can be performed under each processing container 40 to clean the wafer 130.

[0060] Furthermore, in this embodiment, a preset space is provided between the sides and bottom of two adjacent processing containers 40, that is, the outer processing container 40 is fitted onto the inner processing container 40. The interior of the processing container 40 with the smallest inner diameter is configured as a processing space, and the preset space between two adjacent processing containers 40 is configured as a processing space. After the chemical solution cleans the wafer 130, it flows into the processing space under the swaying of the wafer 130 and is discharged through the drain pipe connected to the processing container 40.

[0061] A support unit is disposed on the top of the rotor 12. The support unit includes a plurality of first support rods 120 extending axially. The first support rods 120 are used to support and fix the wafer 130 so that the wafer 130 is not thrown off when the rotor 12 rotates the wafer 130. The inner edges of the plurality of first support rods 120 form a first circle, the diameter of which is smaller than the outer diameter of the wafer 130, so that the first support rods 120 can fully contact the wafer 130, thereby providing stable support for the wafer 130.

[0062] Furthermore, a linear motion mechanism 110 is disposed on the top of the stator 11. Since the stator 11 is located below the wafer 130, and a nozzle is located below the wafer 130, the linear motion mechanism 110 is also disposed below the wafer 130 to connect with the nozzle and drive the nozzle to move linearly in the radial direction relative to the stator 11. The linear motion mechanism 110 can be a linear cylinder mechanism, a crank-slider mechanism, a ball screw mechanism, etc. Here, a linear cylinder mechanism is taken as an example. The linear cylinder mechanism includes a linear cylinder and a push rod that is connected to it. The linear cylinder is fixed to the stator 11, and the push rod is connected to the nozzle. During the rotation of the wafer 130, the linear cylinder drives the nozzle to move forward and backward via the push rod, thereby causing the nozzle to move linearly and thus thoroughly rinsing the lower surface of the wafer 130.

[0063] Further reference Figure 2Since the wafer 130 requires different processing steps, each process needs to be performed in a corresponding processing space. In the case of a magnetic levitation cleaning device with multiple processing containers 40, the wafer 130 needs to move axially to the corresponding processing space for cleaning. Because the wafer 130 is mounted on the rotor 12, which is driven by the stator 11, for the wafer 130 to move axially, the stator 11 must also move axially, thereby driving the rotor 12 to move axially. Therefore, a stator lifting mechanism 30 is configured below the stator 11, connected to and driving the stator 11 to move axially. The stator lifting mechanism 30 is located within the processing container 40 with the smallest inner diameter; that is, the lowest position of the axial movement space of the stator lifting mechanism 30 is the bottom position within the processing container 40 with the smallest inner diameter. This is suitable when the height of the processing spaces corresponding to the multiple processing containers 40 is not high. Furthermore, the stator lifting mechanism 30 is disposed within the processing container 40, saving external space. In another scenario, the stator lifting mechanism 30 passes through the bottom of the plurality of processing containers 40 and is connected to the bottom of the processing container 40 via a dynamic seal. Some of the stator lifting mechanisms 30 are located outside the processing container 40, meaning fewer stator lifting mechanisms 30 are located inside the processing container 40, thus avoiding corrosion of the stator lifting mechanisms 30 by strong acid and alkali chemicals and improving their service life. The dynamic seal connection between the stator lifting mechanism 30 and the bottom of the processing container 40 can be achieved in various ways, such as packing seals, bellows seals, etc., including but not limited to these. Those skilled in the art can select the dynamic seal method according to actual needs, achieving both good sealing performance and simple operation.

[0064] Embodiment 2 of this application:

[0065] Specifically, in this embodiment, the rotor 12 is arranged around the stator 11. Both the rotor 12 and the stator 11 are located within the processing container 40. The central axis of the stator 11 coincides with the central axis of the processing container 40. The wafer 130 is clamped on the rotor 12, and the wafer 130 is located directly above the stator 11. The outer diameter of the wafer 130 is larger than the outer diameter of the stator 11. Furthermore, in the magnetic levitation motor 10 structure with an inner stator 11 and an outer rotor 12, multiple processing containers 40 can be configured, and by placing both the rotor 12 and the stator 11 within the processing container 40, the influence of the side wall thickness of the processing container 40 will not be affected. If the magnetic levitation motor 10 is configured with an inner rotor 12 and an outer stator 11 in the case of multiple processing containers 40, the stator 11 needs to be located outside the multiple processing containers 40, and the rotor 12 needs to be located inside the multiple processing containers 40. This arrangement will result in a large air gap between the stator 11 and the rotor 12, affecting the stator 11's ability to drive the rotor 12 to rotate and levitate. An excessively large air gap may prevent the rotor 12 from rotating and levitating. Therefore, when there are multiple processing containers 40, the magnetic levitation motor 10 can only adopt the form of an inner stator 11 and an outer rotor 12. The air gap between the stator 11 and the rotor 12 will not be affected by the thickness of the sides of the multiple processing containers 40, so as to ensure the stable operation of the magnetic levitation motor 10. The multiple processing containers 40 have different inner diameters and are arranged in sequence from smallest to largest outside the rotor 12, so that the multiple processing containers 40 completely cover the magnetic levitation motor 10, so that the corresponding process can be performed under each processing container 40 to clean the wafer 130.

[0066] Furthermore, a preset space is provided between the sides of two adjacent processing containers 40, that is, the outer processing container 40 is fitted onto the inner processing container 40. The interior of the processing container 40 with the smallest inner diameter is configured as a processing space, and the preset space between two adjacent processing containers 40 is also configured as a processing space. The plurality of processing containers 40 are configured to have the same bottom, that is, the bottoms of the plurality of processing containers 40 are connected as one piece. A through hole 43 is provided on the bottom of the plurality of processing containers 40 along the central axis direction. The inner diameter of the through hole 43 is larger than the maximum outer diameter of the stator lifting mechanism 30. The stator lifting mechanism 30 passes through the through hole 43. That is, the maximum axial distance that the stator lifting mechanism 30 can drive the stator 11 to move is the axial height of the processing container 40 with the largest inner diameter. When moving inside the processing container 40 with the smallest inner diameter, the stator 11 lifting mechanism can drive the stator 11, and further drive the wafer 130 to move completely into the processing container 40 with the smallest inner diameter, so that the processing space is relatively sealed, avoiding chemical liquids from splashing out of the processing container 40, especially strong acid and strong alkali liquids, which pose certain safety risks.

[0067] Further reference Figure 3 There is a certain gap in the radial direction between the inner wall of the through hole 43 and the stator lifting mechanism 30, meaning there is no connection between the inner wall of the through hole 43 and the stator lifting mechanism 30. In this embodiment, the bellows 60 extends axially, one end of the bellows 60 is fixedly connected to the inner wall of the through hole 43, and the other end of the bellows 60 is fixedly connected to the stator lifting mechanism 30 through a connector. The bellows 60 and the connector are L-shaped. In this structure, since the bottom of the processing container 40 with the smallest inner diameter is a sealed structure without the bellows 60, and the bellows 60 is a certain distance from the bottom of the processing container 40, the connection point between the connector and the stator lifting mechanism 30 is far from the bottom of the processing container 40, which further improves the sealing of the processing space to a certain extent.

[0068] Embodiment 3 of this application:

[0069] Specifically, in this embodiment, the rotor 12 is arranged around the stator 11. Both the rotor 12 and the stator 11 are located within the processing container 40. The central axis of the stator 11 coincides with the central axis of the processing container 40. The wafer 130 is clamped on the rotor 12, and the wafer 130 is located directly above the stator 11. The outer diameter of the wafer 130 is larger than the outer diameter of the stator 11. Furthermore, in the magnetic levitation motor 10 structure with an inner stator 11 and an outer rotor 12, multiple processing containers 40 can be configured, and by placing both the rotor 12 and the stator 11 within the processing container 40, the influence of the side wall thickness of the processing container 40 will not be affected. If the magnetic levitation motor 10 is configured with an inner rotor 12 and an outer stator 11 in the case of multiple processing containers 40, the stator 11 needs to be located outside the multiple processing containers 40, and the rotor 12 needs to be located inside the multiple processing containers 40. This arrangement will result in a large air gap between the stator 11 and the rotor 12, affecting the stator 11's ability to drive the rotor 12 to rotate and levitate. An excessively large air gap may prevent the rotor 12 from rotating and levitating. Therefore, when there are multiple processing containers 40, the magnetic levitation motor 10 can only adopt the form of an inner stator 11 and an outer rotor 12. The air gap between the stator 11 and the rotor 12 will not be affected by the thickness of the sides of the multiple processing containers 40, so as to ensure the stable operation of the magnetic levitation motor 10. The multiple processing containers 40 have different inner diameters and are arranged in sequence from smallest to largest outside the rotor 12, so that the multiple processing containers 40 completely cover the magnetic levitation motor 10, so that the corresponding process can be performed under each processing container 40 to clean the wafer 130.

[0070] Furthermore, a preset space is provided between the sides of two adjacent processing containers 40, that is, the outer processing container 40 is fitted onto the inner processing container 40. The interior of the processing container 40 with the smallest inner diameter is configured as a processing space, and the preset space between two adjacent processing containers 40 is also configured as a processing space. The plurality of processing containers 40 are configured to have the same bottom, that is, the bottoms of the plurality of processing containers 40 are connected as one piece. A through hole 43 is provided on the bottom of the plurality of processing containers 40 along the central axis direction. The inner diameter of the through hole 43 is larger than the maximum outer diameter of the stator lifting mechanism 30. The stator lifting mechanism 30 passes through the through hole 43. That is, the maximum axial distance that the stator lifting mechanism 30 can drive the stator 11 to move is the axial height of the processing container 40 with the largest inner diameter. When moving inside the processing container 40 with the smallest inner diameter, the stator 11 lifting mechanism can drive the stator 11, and further drive the wafer 130 to move completely into the processing container 40 with the smallest inner diameter, so that the processing space is relatively sealed, avoiding chemical liquids from splashing out of the processing container 40, especially strong acid and strong alkali liquids, which pose certain safety risks.

[0071] Further reference Figure 4 There is a certain gap in the radial direction between the inner wall of the through hole 43 and the stator lifting mechanism 30, that is, there is no connection between the inner wall of the through hole 43 and the stator lifting mechanism 30. The inner wall of the through hole 43 is configured to extend towards the opening 41 of the processing container 40 to form a groove 70 with the side of the processing container 40 with the smallest inner diameter. A plurality of sealing elements 100 are arranged between the outer edge of the groove 70 on the inner wall side of the through hole 43 and the stator lifting mechanism 30 to seal the groove 70 and the stator lifting mechanism 30. The sealing element 100 is a sealing ring or a magnetohydrodynamic seal. The number of sealing elements 100 can be determined according to actual needs to ensure good sealing between the outer edge of the groove 70 and the stator lifting mechanism 30, prevent air from entering the processing container 40, and ensure the cleaning effect of the wafer 130.

[0072] Example 4 of this application:

[0073] Specifically, in this embodiment, the rotor 12 is arranged around the stator 11. Both the rotor 12 and the stator 11 are located within the processing container 40. The central axis of the stator 11 coincides with the central axis of the processing container 40. The wafer 130 is clamped on the rotor 12, and the wafer 130 is located directly above the stator 11. The outer diameter of the wafer 130 is larger than the outer diameter of the stator 11. Furthermore, in the magnetic levitation motor 10 structure with an inner stator 11 and an outer rotor 12, multiple processing containers 40 can be configured, and by placing both the rotor 12 and the stator 11 within the processing container 40, the influence of the side wall thickness of the processing container 40 will not be affected. If the magnetic levitation motor 10 is configured with an inner rotor 12 and an outer stator 11 in the case of multiple processing containers 40, the stator 11 needs to be located outside the multiple processing containers 40, and the rotor 12 needs to be located inside the multiple processing containers 40. This arrangement will result in a large air gap between the stator 11 and the rotor 12, affecting the stator 11's ability to drive the rotor 12 to rotate and levitate. An excessively large air gap may prevent the rotor 12 from rotating and levitating. Therefore, when there are multiple processing containers 40, the magnetic levitation motor 10 can only adopt the form of an inner stator 11 and an outer rotor 12. The air gap between the stator 11 and the rotor 12 will not be affected by the thickness of the sides of the multiple processing containers 40, so as to ensure the stable operation of the magnetic levitation motor 10. The multiple processing containers 40 have different inner diameters and are arranged in sequence from smallest to largest outside the rotor 12, so that the multiple processing containers 40 completely cover the magnetic levitation motor 10, so that the corresponding process can be performed under each processing container 40 to clean the wafer 130.

[0074] Furthermore, a preset space is provided between the sides of two adjacent processing containers 40, that is, the outer processing container 40 is fitted onto the inner processing container 40. The interior of the processing container 40 with the smallest inner diameter is configured as a processing space, and the preset space between two adjacent processing containers 40 is also configured as a processing space. The plurality of processing containers 40 are configured to have the same bottom, that is, the bottoms of the plurality of processing containers 40 are connected as one piece. A through hole 43 is provided on the bottom of the plurality of processing containers 40 along the central axis direction. The inner diameter of the through hole 43 is larger than the maximum outer diameter of the stator lifting mechanism 30. The stator lifting mechanism 30 passes through the through hole 43. That is, the maximum axial distance that the stator lifting mechanism 30 can drive the stator 11 to move is the axial height of the processing container 40 with the largest inner diameter. When moving inside the processing container 40 with the smallest inner diameter, the stator 11 lifting mechanism can drive the stator 11, and further drive the wafer 130 to move completely into the processing container 40 with the smallest inner diameter, so that the processing space is relatively sealed, avoiding chemical liquids from splashing out of the processing container 40, especially strong acid and strong alkali liquids, which pose certain safety risks.

[0075] Further reference Figure 5 There is a certain gap in the radial direction between the inner wall of the through hole 43 and the stator lifting mechanism 30, that is, there is no connection between the inner wall of the through hole 43 and the stator lifting mechanism 30. The inner wall of the through hole 43 is configured to extend toward the opening 41 of the processing container 40 to form a groove 70 with the side of the processing container 40 with the smallest inner diameter. The groove 70 is filled with a sealing liquid 80, and the height of the sealing liquid 80 is lower than the height of the groove 70. The sealing liquid 80 can be water, oil, or other similar substances. A sealing post 90 is disposed outside the stator lifting mechanism 30 and located inside the processing container 40. The sealing post 90 is L-shaped. The top of the sealing post 90 contacts the bottom of the stator. The maximum outer diameter of the sealing post 90 is smaller than the maximum outer diameter of the stator. One end of the sealing post 90 is connected to the outside of the stator lifting mechanism 30, and the other end of the sealing post 90 is immersed in the sealing liquid 80 in the groove 70, so that the top of the groove 70 is sealed with the processing container 40. Multiple sealing elements 100 are disposed between the outer edge of the groove 70 on the inner wall side of the through hole 43 and the stator lifting mechanism 30 to seal the groove 70 and the stator lifting mechanism 30. The sealing element 100 is a sealing ring or a magnetohydrodynamic seal. The number of sealing elements 100 can be determined according to actual needs to ensure good sealing between the outer edge of the groove 70 and the stator lifting mechanism 30, preventing air from entering the processing container 40 and ensuring the cleaning effect of the wafer 130.

[0076] It should be noted that in the above four embodiments, a linear motion mechanism 110 is configured on the top of the stator 11. Since the stator 11 is located below the wafer 130, and a nozzle is located below the wafer 130, the linear motion mechanism 110 is also configured below the wafer 130 to connect with the nozzle and drive the nozzle to move linearly in the radial direction relative to the stator 11. The linear motion mechanism 110 can be a linear cylinder mechanism, a crank-slider mechanism, a ball screw mechanism, etc. Here, a linear cylinder mechanism is taken as an example. The linear cylinder mechanism includes a linear cylinder and a push rod that is connected to it. The linear cylinder is fixed on the stator 11, and the push rod is connected to the nozzle. During the rotation of the wafer 130, the linear cylinder drives the nozzle to move forward and backward through the push rod, thereby causing the nozzle to move linearly and thus fully rinsing the lower surface of the wafer 130.

[0077] Furthermore, since the wafer 130 requires different processing steps, each process needs to be performed in a corresponding processing space. In the case of a magnetic levitation cleaning device with multiple processing containers 40, the wafer 130 needs to move axially to the corresponding processing space for cleaning. Since the wafer 130 is mounted on the rotor 12, which is driven by the stator 11, for the wafer 130 to move axially, the stator 11 must also be able to move axially, thereby driving the rotor 12 to move axially. Therefore, a stator lifting mechanism 30 is configured below the stator 11, connected to and driving the stator 11 to move axially.

[0078] Example 5 of this application:

[0079] Specifically, in this embodiment, the stator 11 is arranged around the rotor 12. The rotor 12 is located inside the processing container 40, and the stator 11 is located outside the processing container 40. The central axis of the rotor 12 coincides with the central axis of the processing container 40. The wafer 130 is clamped on the rotor 12, and the wafer 130 is located above the stator 11. The outer diameter of the wafer 130 is smaller than the outer diameter of the stator 11. Further, in the magnetic levitation motor 10 structure with an inner rotor 12 and an outer stator 11, the processing container 40 can be configured as a single unit, with the rotor 12 disposed inside the processing container 40 and the stator 11 disposed outside the processing container 40. Since there is only one processing container 40, the thickness of the stator 11 and the rotor 12 is only the thickness of the side of the processing container 40, which can better control the air gap between the stator 11 and the rotor 12, allowing the stator 11 to drive the rotor 12 to rotate and levitate stably. The processing space within the processing container 40 is configured as a multi-processing space, and the wafer 130 undergoes multiple processing steps within the processing container 40. The internal space of the processing container 40 is divided into multiple processing steps. A control device connected to the magnetic levitation cleaning equipment determines the cleaning process required for the wafer 130 based on the position of the rotor 12 within the processing container 40. After determining the required process, the corresponding cleaning solution is sprayed through nozzles to clean the wafer 130. After one process is completed, the rotor 12 moves axially to the next processing container 40 under the drive of the stator 11 to perform the next process. During rotation, the rotor 12 must ensure that its central axis is aligned with the central axis of the stator 11 for stable operation. In this operating state, the radial distance from the inner wall of each processing container 40 to the outer edge of the rotor 12 is the same, meaning the wafer 130 is located at the center of the processing container 40. This ensures that the wafer 130 receives better cleaning and improves its cleanliness. Multiple drain pipes are provided at the bottom of each processing container 40, each corresponding to a specific process step, to discharge the cleaning solution after cleaning, maintaining the cleanliness inside the processing container 40.

[0080] Further reference Figure 6In the structure of the inner rotor 12 and the outer stator 11, the wafer 130 is disposed within the cavity of the rotor 12. Therefore, a clamping assembly is provided on the inner wall of the rotor 12 to clamp the wafer 130. The clamping assembly includes multiple second support rods 121 and multiple latches 122. The multiple second support rods 121 extend radially, and each second support rod 121 is correspondingly fixed with one latch 122. The outer edge of the wafer 130 is fixed to the second support rods 121 by the latches 122, and further fixed to the rotor 12. The ends of the multiple latches 122 form a first circle, the diameter of which is smaller than the outer diameter of the wafer 130, so that the latches 122 can firmly clamp the wafer 130, allowing the wafer 130 to rotate stably for the cleaning process and improving the cleaning effect.

[0081] Example 6 of this application:

[0082] Specifically, in this embodiment, the stator 11 is arranged around the rotor 12. The rotor 12 is located inside the processing container 40, and the stator 11 is located outside the processing container 40. The central axis of the rotor 12 coincides with the central axis of the processing container 40. The wafer 130 is clamped on the rotor 12, and the wafer 130 is located above the stator 11. The outer diameter of the wafer 130 is smaller than the outer diameter of the stator 11. Further, in the magnetic levitation motor 10 structure with an inner rotor 12 and an outer stator 11, the processing container 40 can be configured as multiple, with the rotor 12 disposed inside the processing container 40 and the stator 11 disposed outside the processing container 40. Since there are multiple processing containers 40, if the multiple processing containers 40 are arranged in the manner of embodiment 1, the air gap between the stator 11 and the rotor 12 will be large, affecting the stator 11's ability to drive the rotor 12 to rotate and levitate. An excessively large air gap may prevent the rotor 12 from rotating and levitating. Therefore, in this embodiment, the inner diameters of the plurality of processing containers 40 are set to be equal, the plurality of processing containers 40 are arranged at intervals along the axial direction, and are configured to have a common side and bottom. This structure ensures that even when there are multiple processing containers 40, the thickness of only one side of the processing container 40 remains between the stator 11 and the rotor 12, which can better control the air gap between the stator 11 and the rotor 12, allowing the stator 11 to drive the rotor 12 to rotate stably and levitate.

[0083] Further reference Figure 7 and Figure 8In the structure of inner rotor 12 and outer stator 11, the wafer 130 is disposed within the cavity of the rotor 12. Therefore, a clamping assembly is provided on the inner wall of the rotor 12 to clamp the wafer 130. The clamping assembly includes a plurality of second support rods 121 and a plurality of latches 122. The plurality of second support rods 12 extend radially, and a latch 122 is fixed to each second support rod 121. The outer edge of the wafer 130 is fixed to the second support rod 121 by the latches 122, and further fixed to the rotor 12. In this embodiment, the number of latches 23 is set to 2. The ends of the two latches 23 form a second circle, the diameter of which is smaller than the outer diameter of the wafer 130, so that a portion of the outer edge of the wafer 130 is engaged inside the latches 23, thereby stably fixing the wafer 130 on the clamping assembly. This allows the wafer 130 to rotate stably under the drive of the rotor 12, and enables comprehensive and efficient cleaning of the wafer 130, improving the cleaning effect.

[0084] Specifically, in the above six embodiments, each of the at least one nozzle is configured as two nozzles, namely a first nozzle 20 and a second nozzle 21. The first nozzle 20 and the second nozzle 21 are respectively disposed above and below the wafer 130 to clean the upper and lower surfaces of the wafer 130, thereby improving the cleaning efficiency and cleanliness of the wafer 130. Those skilled in the art can determine the relative setting angle of the first nozzle 20 and the second nozzle 21 according to actual needs, so that the spraying areas of the first nozzle 20 and the second nozzle 21 cover more comprehensively, making the wafer 130 cleaner.

[0085] Furthermore, a first nozzle fixing member (not shown in the figure) is provided on the outside of the processing container 40 to fix the first nozzle 20. The first nozzle fixing member includes a first fixing rod connected to the first nozzle 20. The first fixing rod is fixed to the outside of the processing container 40. The first fixing rod extends from the outside into the inside of the processing container 40, such that the first nozzle 20 is positioned above the wafer 130, with the nozzle of the first nozzle 20 facing the upper surface of the wafer 130. A hollow conduit is provided inside the first fixing rod. The hollow conduit is configured as a liquid inlet pipe (not shown in the figure), the tail of which is connected to the first nozzle 20 to spray chemical solution and water onto the wafer 130 through the first nozzle 20, thereby cleaning the wafer 130. A second nozzle fixing member (not shown in the figure) is provided inside the processing container 40 to fix the second nozzle 21. The second nozzle fixing member includes a second fixing rod connected to the second nozzle 21. The second fixing rod is fixed to the bottom wall of the innermost processing container 40. The second nozzle 21 is located below the wafer 130, with its nozzle facing the lower surface of the wafer 130. The second fixing rod has a hollow conduit configured as a liquid inlet pipe (not shown in the figure). The end of the liquid inlet pipe is connected to the second nozzle 21, allowing the first nozzle 20 to spray chemical solutions and water onto the wafer 130, thereby cleaning the wafer 130.

[0086] Furthermore, the first fixing rod and the second fixing rod are configured to have a common liquid inlet, meaning that the same type of cleaning fluid is simultaneously introduced into the pipes inside the first fixing rod and the second fixing rod to perform the same cleaning process on the upper and lower surfaces of the wafer 130 simultaneously. The wafer cleaning technology used in this application is supercritical carbon dioxide gas-liquid two-phase cleaning technology. Supercritical carbon dioxide has a strong dissolving ability for organic and some inorganic contaminants on the wafer surface. Supercritical carbon dioxide cleaning leaves no residue and, unlike water-based solvent cleaning, does not cause hydroxylation of the wafer surface, thus providing excellent cleaning results. Specifically, the device storing the cleaning fluid contains supercritical carbon dioxide cleaning fluid, which is delivered to the first nozzle and the second nozzle through the first fixing rod and the second fixing rod, respectively. The nozzles spray supercritical carbon dioxide cleaning fluid to perform two-phase cleaning on the wafer, improving the cleaning effect of the wafer.

[0087] Furthermore, each of the processing containers 40 has a liquid guiding groove 42 on its inner wall at the bottom. Multiple recovery holes (not shown in the figure) are spaced apart on the liquid guiding groove 42. Each recovery hole is connected to a drain pipe 43. The cleaning fluid remaining in the processing container 40 after cleaning the wafer 130 is collected in the processing container 40 through the liquid guiding groove 42, and then discharged through the recovery hole corresponding to each process into the connected drain pipe, and then discharged to an external sorting and storage device (not shown in the figure) for recycling. When the magnetic levitation motor is an inner stator 11 and an outer rotor 12, multiple processing containers 40 are configured. Each processing container has a drain pipe at its bottom to collect the cleaning fluid in the corresponding processing container 40. When the magnetic levitation motor is an inner rotor 12 and an outer stator 11, one or more processing containers 40 can be configured. When there is one processing container 40, the bottom of the processing container 40 is provided with multiple drain pipes, each drain pipe corresponding to a processing step to discharge the cleaning fluid of the corresponding step. When there are multiple processing containers 40, the bottom of the processing space of each processing container 40 is provided with a drain pipe to discharge the cleaning fluid in the corresponding processing space.

[0088] Specific embodiments have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are only for the purpose of helping to understand the technical solutions and core ideas of this invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this invention. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. A wafer cleaning device based on a magnetic levitation motor, characterized in that, include: A magnetic levitation motor, comprising a stator and a rotor, wherein the rotor has a cavity in the middle and a wafer is placed on the rotor; A stator lifting mechanism is fixedly connected to the stator to drive the stator to move up and down along the axial direction; A cleaning assembly, comprising at least one nozzle and at least one processing container, the processing container being configured as a processing space for multiple cleaning processes to accommodate the rotor; The rotor is arranged around the stator, and both the rotor and the stator are located inside the processing container, with the wafer located above the stator; the stator lifting mechanism is located inside the processing container; or, the stator lifting mechanism passes through the bottom of the processing container and is connected to the bottom of the processing container by a dynamic seal; or, the stator lifting mechanism is located outside the processing container, the stator is arranged around the rotor, the rotor is located inside the processing container, the stator is located outside the processing container, and the wafer is located above the stator.

2. The wafer cleaning equipment based on a magnetic levitation motor according to claim 1, characterized in that, The top of the processing container is configured as an opening, which is bent toward the central axis of the processing container. The top of the opening has a first inner diameter in the radial direction, which is larger than the maximum outer diameter of the rotor.

3. The wafer cleaning equipment based on a magnetic levitation motor according to claim 2, characterized in that, The processing containers are configured in multiple ways, and the inner diameters of the multiple processing containers are different. The multiple processing containers are arranged in order of increasing size and spaced apart outside the rotor. A preset space is provided between the sides and bottom of two adjacent processing containers, and the preset space is configured as a processing space.

4. The wafer cleaning equipment based on a magnetic levitation motor according to claim 1, characterized in that, The processing containers are configured in multiple ways, with different inner diameters. The processing containers are arranged in order of increasing size and spaced apart outside the rotor. A preset space is provided between the sides of two adjacent processing containers, and the preset space is configured as a processing space. The multiple processing containers are configured to have a common bottom.

5. The wafer cleaning equipment based on a magnetic levitation motor according to claim 4, characterized in that, The bottom of the plurality of processing containers is provided with through holes along the central axis direction. The inner diameter of the through holes is larger than the maximum outer diameter of the stator lifting mechanism, and the stator lifting mechanism passes through the through holes.

6. The wafer cleaning equipment based on a magnetic levitation motor according to claim 5, characterized in that, The inner wall of the through hole is sealed to the stator lifting mechanism by means of dynamic sealing.

7. The wafer cleaning equipment based on a magnetic levitation motor according to claim 6, characterized in that, There is a certain gap in the radial direction between the inner wall of the through hole and the stator lifting mechanism. The upper part of the inner wall of the through hole is fixedly connected to one end of the bellows extending along the axial direction, and the other end of the bellows is fixedly connected to the stator lifting mechanism through a connector.

8. The wafer cleaning equipment based on a magnetic levitation motor according to claim 6, characterized in that, The inner wall of the through hole is configured to extend toward the opening of the processing container to form a groove with the side of the processing container with the smallest inner diameter. A plurality of sealing elements are arranged between the outer edge of the groove on the inner wall side of the through hole and the stator lifting mechanism to seal the groove and the stator lifting mechanism. The sealing elements are sealing rings and magnetohydrodynamic sealing elements.

9. The wafer cleaning equipment based on a magnetic levitation motor according to claim 6, characterized in that, There is a certain gap in the radial direction between the inner wall of the through hole and the stator lifting mechanism. The inner wall of the through hole is configured to extend toward the opening of the processing container to form a groove with the side of the processing container with the smallest inner diameter. The groove is filled with a sealing liquid. A sealing post located inside the processing container is disposed outside the stator lifting mechanism. One end of the sealing post is connected to the outside of the stator lifting mechanism, and the other end of the sealing post is immersed in the sealing liquid in the groove. Multiple sealing elements are disposed between the outer edge of the groove on the inner wall side of the through hole and the stator lifting mechanism to seal the groove and the stator lifting mechanism. The sealing elements are sealing rings and magnetohydrodynamic seals.

10. The wafer cleaning equipment based on a magnetic levitation motor according to claim 1, characterized in that, The processing container is configured as one, and the processing container is configured as a processing space for multiple cleaning processes.

11. The wafer cleaning equipment based on a magnetic levitation motor according to claim 10, characterized in that, The processing containers are configured in multiple ways, with the multiple processing containers having the same inner diameter. The multiple processing containers are arranged at intervals along the axial direction and are configured to have a common side and bottom.

12. The wafer cleaning equipment based on a magnetic levitation motor according to any one of claims 1-9, characterized in that, The rotor is provided with a support unit at its top. The support unit includes a plurality of first support rods extending axially. The inner edges of the plurality of first support rods form a first circle. The diameter of the first circle is smaller than the outer diameter of the wafer, so as to support the wafer.

13. The wafer cleaning equipment based on a magnetic levitation motor according to claim 12, characterized in that, A linear motion mechanism is provided on the top of the stator, and the linear motion mechanism is connected to the nozzle adjacent to the stator to drive the nozzle to move linearly in the radial direction relative to the stator.

14. The wafer cleaning equipment based on a magnetic levitation motor according to any one of claims 10-12, characterized in that, The inner wall of the rotor is provided with a clamping assembly, which includes a plurality of second support rods and a plurality of buckles. Each second support rod is provided with a corresponding buckle, and the ends of the plurality of buckles form a second circle, the diameter of which is smaller than the outer diameter of the wafer.

15. The wafer cleaning equipment based on a magnetic levitation motor according to any one of claims 1-9, characterized in that, The at least one nozzle is configured as a first nozzle and a second nozzle, the first nozzle and the second nozzle being respectively disposed above and below the wafer to clean the wafer.

16. The wafer cleaning equipment based on a magnetic levitation motor according to claim 15, characterized in that, The processing container is externally provided with a first nozzle fixing component to fix the first nozzle. The first nozzle fixing component includes a first fixing rod connected to the first nozzle. The first fixing rod has a hollow tube inside, which is configured as a liquid inlet pipe. The tail end of the liquid inlet pipe is connected to the first nozzle. The processing container is internally provided with a second nozzle fixing component to fix the second nozzle. The second nozzle fixing component includes a second fixing rod connected to the second nozzle. The second fixing rod has a hollow tube inside, which is configured as a liquid inlet pipe. The tail end of the liquid inlet pipe is connected to the second nozzle. The first fixing rod and the second fixing rod are configured to have a common liquid inlet.

17. The wafer cleaning equipment based on a magnetic levitation motor according to claim 1, characterized in that, The nozzle performs two-phase cleaning on the wafer by spraying supercritical carbon dioxide cleaning solution.

18. The wafer cleaning equipment based on a magnetic levitation motor according to any one of claims 1-11, characterized in that, Each of the processing spaces is provided with a liquid guiding channel at the bottom, and the liquid guiding channel is provided with at least one recovery hole, and each recovery hole is connected to a corresponding drain pipe.

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