PCB defect hotspot map generation method and device, electronic equipment and storage medium

Abstract

The invention discloses a PCB defect hotspot map generation method and device, electronic equipment and a storage medium, and the method comprises the steps: loading a background image of a PCB, obtaining defect data of a plurality of detected PCBs in one batch, generating defect marks in the background image according to the defect coordinates of the plurality of PCBs to generate a defect hotspot map, according to the method, the defects of the PCB are visually displayed through the defect hot spot map, the positions, density distribution, types, the number and the like of the defects in the PCB can be visually and clearly positioned through the defect hot spot map, and due to the fact that the defect marks in the defect hot spot map are associated with the defect images, the defects of the PCB can be visually and clearly positioned through the defect hot spot map. And the corresponding defect image can be triggered and displayed through the defect hotspot map, so that the defect analysis of the PCB product is facilitated, and the defect tracing and analysis efficiency of the PCB product is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB detection and analysis, and in particular to a method, device, electronic device and storage medium for generating a PCB defect hotspot map. Background Art

[0002] In the production process of PCB (Printed circuit board), in order to ensure the quality of PCB, AOI (Automated Optical Inspection) equipment is usually required to detect PCB defects and repair the defects in a repair machine.

[0003] Currently in the PCB industry, most of the defect data detected by AOI equipment is displayed through EXCEL report data. The EXCEL report data displays summarized and isolated data with low visualization. It is difficult to clearly and intuitively locate the defect position, quantity, type and defect density on the PCB through the EXCEL report data, which is not conducive to product defect analysis. Summary of the invention

[0004] The present invention provides a PCB defect heat map generation method, device, electronic device and storage medium to solve the problem of low visualization of defect data displayed through EXCEL report data.

[0005] In a first aspect, the present invention provides a method for generating a PCB defect heat map, comprising:

[0006] Load the background image of the PCB;

[0007] Acquire defect data of a batch of multiple inspected PCBs, wherein the defect data includes defect coordinates and defect images;

[0008] Generating defect marks in the background image according to the defect coordinates of the plurality of PCBs to generate a defect heat map;

[0009] The defect marks in the defect heat map are associated with the defect image.

[0010] Optionally, the defect data further includes defect types, and defect marks are generated in the background image according to the defect coordinates of the multiple PCBs to generate a defect heat map, including:

[0011] Determining a defect type for each defect and determining a target defect label corresponding to the defect type;

[0012] Determine a target position of defect coordinates of the defect in the background image;

[0013] The target defect mark is loaded at the target position in the background image to generate a defect heat map.

[0014] Optionally, associating the defect mark in the defect heat map with the defect image includes:

[0015] A key-value pair is established with the defect coordinates of the defect mark as the key and the defect image corresponding to the defect coordinates of the defect mark as the value, so as to associate the defect mark in the defect heat map with the defect image.

[0016] Optionally, also include:

[0017] When a selection operation for a target type of defect is received, a defect mark of the target type of defect is displayed in the defect heat map.

[0018] Optionally, also include:

[0019] When receiving an operation acting on the defect mark on the defect heat map, determining the defect mark being operated in response to the operation;

[0020] A target defect image and a defect name associated with the defect mark being operated are acquired, and the target defect image and the defect name are displayed.

[0021] Optionally, also include:

[0022] Upon receiving an analysis operation of a defect heat map, determining whether a production process abnormality occurs according to the defect heat map;

[0023] If so, an alarm message is generated, wherein the alarm message includes information about the production process where the process abnormality occurs.

[0024] Optionally, judging whether a production process abnormality occurs according to the defect heat map includes:

[0025] In the defect heat map, based on the defect marks, count the defect quantity, defect location, and defect density of defects of the same type;

[0026] When the number of defects is greater than a preset number, or the defect position is within a preset area, or the defect density is greater than a preset density, it is determined that a production process abnormality occurs.

[0027] In a second aspect, the present invention provides a PCB defect heat map generating device, comprising:

[0028] Background image loading module, used to load the background image of PCB;

[0029] A defect data acquisition module, used to acquire defect data of a batch of multiple PCBs, wherein the defect data includes defect coordinates and defect images;

[0030] A defect heat map generating module, used for generating defect marks in the background image according to the defect coordinates of the plurality of PCBs, so as to generate a defect heat map;

[0031] The defect image association module is used to associate the defect mark in the defect heat map with the defect image.

[0032] In a third aspect, the present invention provides an electronic device, the electronic device comprising:

[0033] at least one processor; and

[0034] a memory communicatively connected to the at least one processor; wherein,

[0035] The memory stores a computer program that can be executed by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the PCB defect hotspot map generating method described in any one of the first aspects of the present invention.

[0036] In a fourth aspect, the present invention provides a computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable a processor to implement the PCB defect hotspot map generation method described in any one of the first aspects of the present invention when executed.

[0037] After the PCB background image is loaded, the embodiment of the present invention obtains defect data of a batch of multiple inspected PCBs, generates defect marks in the background image according to the defect coordinates in the defect data of the multiple PCBs, and associates the defect marks with corresponding defect images to generate a defect heat map of the PCB, thereby realizing a visual display of PCB defects through the defect heat map. The defect heat map can be used to intuitively and clearly locate the position, density distribution, type and quantity of defects in the PCB, and because the defect marks in the defect heat map are associated with the defect images, the defect heat map can trigger the display of the corresponding defect images, thereby facilitating PCB product defect analysis and improving the efficiency of PCB product defect tracing and analysis.

[0038] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0040] Figure 1 It is a flow chart of a method for generating a PCB defect heat map provided in Embodiment 1 of the present invention;

[0041] Figure 2 It is a flow chart of a method for generating a PCB defect hotspot map provided in Embodiment 2 of the present invention;

[0042] Figure 3 is a schematic diagram of the background image;

[0043] Figure 4 is a schematic diagram of a defect image;

[0044] Figure 5 It is a schematic diagram of the interface for generating a defect heat map;

[0045] Figure 6 is a schematic diagram showing a defect image;

[0046] Figure 7 It is a structural schematic diagram of a PCB defect heat map generating device provided by Embodiment 3 of the present invention;

[0047] Figure 8 It is a schematic diagram of the structure of an electronic device provided in Embodiment 4 of the present invention. DETAILED DESCRIPTION

[0048] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0049] Embodiment 1

[0050] Figure 1 The flowchart of a method for generating a PCB defect heat map is provided in the first embodiment of the present invention. This embodiment is applicable to the case where a PCB defect heat map is generated based on PCB defect data. The method can be executed by a PCB defect heat map generating device. The PCB defect heat map generating device can be implemented in the form of hardware and / or software and can be configured in an electronic device. Figure 1As shown, the PCB defect hotspot map generation method includes:

[0051] S101, loading the background image of PCB.

[0052] In this embodiment, in a scenario of generating a PCB defect heat map, the defect heat map can be generated in real time during the PCB batch production process, that is, when the current batch of PCBs is produced, each time a PCB is produced and inspected, a defect heat map is generated or updated. In this scenario, since the PCBs in a batch are the same, the background image of the batch of PCBs can be loaded when the first PCB is inspected at the beginning of the production of the current batch of PCBs.

[0053] In another scenario, a background image of the PCB may be loaded when a batch of PCBs needs to be generated after the production and inspection of the batch of PCBs.

[0054] The background image may be a blank image having the same outline as the PCB. In one embodiment, when the PCB is a single board (piece part), the background image may be a blank image having the same outline as the single board (piece part). When the PCB is a whole board (panel), the background image may be a blank image having the same outline as the whole board (panel). In the PCB industry, the whole board (panel) may be a panel composed of multiple single boards (piece parts).

[0055] In one example, when a PCB is inspected by an AOI device, the AOI device can scan a QR code on the PCB, identify the PCB through the QR code, and read a background image of the PCB in svg format from a pre-stored database and store it in a shared directory. The background image can then be read from the shared directory to generate a defect hotspot map.

[0056] S102, acquiring defect data of a batch of multiple inspected PCBs, where the defect data includes defect coordinates and defect images.

[0057] In this embodiment, the defect data of the PCB may include defect coordinates, defect code, defect name, PCB layer where the defect is located, surface number and other data, wherein the defect coordinates may be the x, y coordinates of the defect in the PCB, the defect code may be a code commonly used in the PCB industry to represent defects or a code customized by the PCB manufacturer, and the defect code may represent the defect type, wherein the defect data may be recorded and generated during AOI inspection, or may be recorded and generated during inspection by an inspection machine after AOI inspection. This embodiment does not limit the process for recording and generating PCB defect data, and the defect data may be stored in association with the QR code of the PCB so that the defect data can be read by scanning the QR code of the PCB.

[0058] The defect image can be an image captured when the defect is detected, for example, it can be an image captured of the defect detected during AOI inspection, or it can be a defect image captured by a camera before the repair machine repairs the defect. The defect image can be stored in a shared directory according to the PCB model, production batch, serial number, level, etc., and each defect image can be associated with the QR code of the PCB.

[0059] In this embodiment, the defect data and defect images of the PCB can be read from a shared directory or a proprietary database according to the production batches and board serial numbers of multiple inspected PCBs in a batch. Of course, the defect data and defect images of the PCB can also be obtained by scanning the QR code of the PCB. This embodiment does not limit the acquisition of pre-stored defect data and defect images of the PCB.

[0060] S103 , generating defect marks in the background image according to the defect coordinates of the multiple PCBs to generate a defect hotspot map.

[0061] Since the defect data includes the coordinates of the detected defects in the PCB, the target position corresponding to the defect coordinates in the background image can be determined, and then the defect mark is loaded at the target position. After loading the defect marks of defects of multiple PCBs in a batch, a defect hotspot map of the batch of PCBs is obtained. In the defect hotspot map, each defect mark represents a defect, and the position of the defect mark in the background image represents the position of the defect in the PCB. That is, the defect hotspot map can represent information such as the number, position distribution and defect density of defects occurring in a batch of PCBs.

[0062] S104: Associating the defect mark in the defect heat map with the defect image.

[0063] In one embodiment, each defect is collected with a defective image, and the defect mark in the defect heat map can be associated with the corresponding defect image. Exemplarily, the defect mark can be associated with the corresponding defect coordinates, and the defect image is also associated with the defect coordinates. When the user selects or clicks the defect mark in the defect heat map, the defect coordinates corresponding to the defect mark can be determined first, and then the defect image matching the defect coordinates can be searched in the image library through the defect coordinates, thereby realizing the viewing of the defect image of a specific defect through the defect heat map, thereby improving the visualization of quality defect management.

[0064] After the PCB background image is loaded, the embodiment of the present invention obtains defect data of a batch of multiple PCBs that have been inspected, generates defect marks in the background image according to the defect coordinates in the defect data of the multiple PCBs, and associates the defect marks with corresponding defect images to generate a defect heat map of the PCB, thereby realizing a visual display of PCB defects through the defect heat map. The defect heat map can be used to intuitively and clearly locate the position, density distribution, type and quantity of defects in the PCB, and because the defect marks in the defect heat map are associated with the defect images, the defect heat map can trigger the display of the corresponding defect images, thereby facilitating PCB product defect analysis and improving the efficiency of PCB product defect tracing and analysis.

[0065] Embodiment 2

[0066] Figure 2 A flowchart of a method for generating a PCB defect heat map provided in the second embodiment of the present invention is provided. The embodiment of the present invention is optimized on the basis of the above-mentioned first embodiment. Figure 2 As shown, the PCB defect hotspot map generation method includes:

[0067] S201, scanning the graphic code on the PCB to obtain the identity of the PCB.

[0068] The graphic code in this embodiment may be a two-dimensional code, which may be set on the PCB by printing, or may be a graphic code formed by punching holes in the PCB. In a scenario, when it is necessary to generate a defect hotspot map of the current batch of PCBs online in real time, the graphic code of the first PCB that has been inspected may be scanned during the production of the current batch of PCBs to obtain an identity identifier of the first PCB, which may be an identity ID of the PCB, such as a PCB product number.

[0069] S202: Searching for an image matching the identity mark in a background image database to serve as a background image of the PCB.

[0070] The background image database may be a database pre-stored with background images of various PCBs, and the identity of the PCB may be used as an index in the background image database. The background image of a specific PCB may be searched in the background image database through the identity of the PCB.

[0071] like Figure 3 Shown is a schematic diagram of the background image of the PCB. Figure 3 The PCB is a whole panel, i.e., a puzzle, which is composed of multiple single boards. The background image can be a blank image, which is the basic image for generating a defect hotspot map.

[0072] S203, acquiring defect data of a batch of multiple inspected PCBs, where the defect data includes defect coordinates and defect images.

[0073] In this embodiment, after the PCB is inspected by an inspection device (such as an AOI device), defects on the PCB can be detected and defect data can be recorded. The defect data may include defect coordinates, defect code, defect name, PCB layer where the defect is located, the side (front or back) where the defect is located, and other data. The defect data can be stored in a defect database through the PCB identity or QR code. At the same time, the defect image can be acquired by capturing the defect image, and the defect image can also be stored in the image library through the PCB identity or QR code.

[0074] For the current batch of inspected PCBs, the defect data can be read from the defect database and the defect image can be read from the image library through the QR code on the PCB. Figure 4 is a schematic diagram of a defect image.

[0075] S204: Determine the defect type of each defect and determine the target defect mark corresponding to the defect type.

[0076] This embodiment can classify defects in advance. Exemplarily, the defect types may include residual copper, short circuit, open circuit, cold solder joint, etc. This embodiment does not limit the defect types.

[0077] Specifically, the defect data may include a defect type, which can be represented by a defect code. The defect type of each detected defect can be determined by the defect code, and the target defect mark used to represent the defect type in the defect heat map can be determined by the defect type. The defect mark is a mark used to represent a defect occurring at a specific location in the defect heat map. Exemplarily, the defect mark can be a solid dot pattern, a hollow dot pattern, a square pattern, a triangle, a cross pattern, etc. The defect mark can be different patterns, or patterns with the same appearance but different colors. This embodiment does not limit the form of expression of the defect mark.

[0078] S205: Determine the target position of the defect coordinates of the defect in the background image.

[0079] Exemplarily, the defect coordinates are the position of the defect in the PCB, and the defect coordinates can be converted into image coordinates of the background image. Specifically, the geometric scaling ratio of the PCB to the background image can be determined first, and the product of the geometric scaling ratio and the x, y coordinates in the defect coordinates can be calculated to obtain the x, y coordinates of the defect in the background image as the target position of the defect in the background image, wherein the x, y coordinates in the background image can be the columns and rows of pixels in the background image.

[0080] S206 , loading a target defect mark at a target position in the background image to generate a defect hotspot map.

[0081] After determining the target position of each defect in the background image, the target defect mark corresponding to the defect can be loaded at the target position in the background image. After the target defect marks of defects in a batch of PCBs are loaded into the background image, a defect hotspot map of the batch of PCBs can be generated.

[0082] like Figure 5 The figure shows a schematic diagram of generating a defect hotspot map in the interactive interface. In the defect hotspot map, defect A is displayed as a hollow circle mark, and defect C is displayed as a solid diamond. What is displayed is the defect of the SIG (Signal) layer.

[0083] S207 , establishing a key-value pair with the defect coordinates of the defect mark as the key and the defect image corresponding to the defect coordinates of the defect mark as the value, so as to associate the defect mark in the defect hotspot map with the defect image.

[0084] In this embodiment, the defect mark and the defect image can be associated through a key-value pair. Specifically, a key-value pair can be established with the defect coordinates of the defect mark as the key and the defect image corresponding to the defect coordinates of the defect mark as the value to associate the defect mark in the defect heat map with the defect image. Of course, in actual applications, those skilled in the art can also establish an association relationship between the defect mark and the defect image through an array, a hash table, etc., and this embodiment does not limit this.

[0085] In one embodiment, a key-value pair association between a defect mark and a defect image can be automatically established through the defect coordinates. In another embodiment, a key-value pair association between a defect mark and a defect image can also be established in response to a user operation, such as Figure 5 As shown, the user can select a defect mark in the defect heat map, use the coordinates of the defect mark as the key, and then select a defect image as the value in the image interface on the right, thereby establishing an association relationship between the defect mark and the defect image.

[0086] S208. When an operation acting on a defect mark on the defect heat map is received, determine the defect mark being operated in response to the operation.

[0087] Among them, the operations acting on the defect mark on the defect heat map may include mouse click operations (single or double click), touch operations, mouse hover operations, etc. on the defect mark. When an operation acting on the defect mark is received, the defect mark being operated is determined.

[0088] Specifically, when the defect heat map is displayed on the screen, each pixel on the defect heat map corresponds to each pixel on the screen. Taking the mouse operation as an example, when the mouse stays on the screen, the coordinates of the mouse on the screen are detected. Through the coordinates of the mouse on the screen and the coordinates of each pixel on the defect heat map on the screen, the pixel on the defect heat map corresponding to the mouse operation can be determined, and the defect mark being operated can be determined through the correspondence between the pixels on the defect heat map and the defect mark.

[0089] S209: Acquire the target defect image and defect name associated with the operated defect mark, and display the target defect image and defect name.

[0090] Specifically, after determining the defect mark being operated, the defect coordinates of the defect mark being operated can be used as the key to search for the corresponding value to obtain the target defect image associated with the defect mark being operated, and the target defect image and the corresponding defect name can be displayed on the screen, such as Figure 6 As shown, after selecting the defect mark in the defect heat map, the target defect image is displayed in the image display area on the right. The user can select the mark of the defect to be analyzed through the defect heat map during defect analysis, and the corresponding defect image can be displayed. The user does not need to search for the defect image in the local directory where the defect image is placed, thereby improving the efficiency of defect analysis.

[0091] S210: When receiving an analysis operation of a defect hotspot map, determine whether a production process abnormality occurs according to the defect hotspot map.

[0092] This embodiment may also be provided with a process anomaly analysis function. When an analysis operation of a defect hotspot map is received, it may be triggered to determine whether a production process anomaly occurs according to the defect hotspot map. In one scenario, a defect mark is loaded into the defect hotspot map after each PCB is detected in the current production batch, so as to represent in real time the defect hotspot distribution of multiple PCBs produced and detected in the current production batch through the defect hotspot map. The analysis operation of the defect hotspot map may be a manual operation, such as a user clicking a corresponding control to trigger the operation, or a timed operation, such as triggering the operation at intervals of a certain period of time, or according to the number of PCBs that have been detected, such as triggering the operation every time a preset number of PCBs are detected. This embodiment does not limit the method of triggering the analysis operation of the defect hotspot map.

[0093] In an optional embodiment, the defect quantity, defect location and defect density of the same type of defects can be counted based on the defect mark in the defect heat map, and when the defect quantity is greater than the preset quantity, or the defect location is within the preset area, or the defect density is greater than the preset density, it is determined that the generation process abnormality occurs, and S211 is executed. The preset area may be an important area in the PCB, and the user may determine the preset area based on the PCB, and the defect density may refer to the number of one or more types of defect marks appearing on a preset unit area.

[0094] Exemplarily, the PCB can be divided into multiple areas according to the function of the PCB or the production process, and preset areas can be determined. The number of defects in each area can be counted and the defect density can be calculated, and a preset number and preset density can be set for each area. If the number of defects in an area is greater than the preset number, or the defect density is greater than the preset density, or the defect location of the defect is within the area, it is determined that a generation process abnormality has occurred.

[0095] In another embodiment, the defect hotspot map may be input into a pre-trained process anomaly analysis model to obtain the probability of process anomaly. If the probability is greater than a threshold, it is determined that a process anomaly has occurred, and S211 is executed, wherein the process anomaly analysis model may be trained by defect hotspot map samples during process anomalies, wherein the defect hotspot map samples during process anomalies are annotated with the probabilities of various types of process anomalies. The defect hotspot map samples may be input into the process anomaly analysis model to predict the probabilities of various types of process anomalies, and then the loss rate is calculated using the annotated probabilities and the predicted probabilities, such as calculating the mean square error loss or the cross entropy loss. If the loss rate is less than the threshold, the training is completed. If the loss rate is greater than the threshold, the model parameters are adjusted using the loss rate and the training continues until the loss rate is less than the threshold.

[0096] S211. Generate alarm information, where the alarm information includes information about the production process where the process abnormality occurs.

[0097] When a process abnormality occurs, an alarm message including the name or code of the production process where the process abnormality occurs can be generated to warn of the production process abnormality, so as to promptly adjust the production process to eliminate the abnormality. This enables the analysis of production process abnormalities through a defect hotspot map generated in real time from real-time detected PCB defect data during the PCB production process.

[0098] This embodiment obtains the identity identification by scanning the graphic code of the PCB and then loads the background image of the PCB, and determines the target defect mark according to various defect types in the defect data of multiple PCBs that have been inspected in a batch, further determines the target position in the background image through the defect coordinates, loads the target defect mark at the target position to produce a defect hotspot map, and establishes a key-value pair with the defect coordinates of the defect mark as the key and the defect image corresponding to the defect coordinates of the defect mark as the value, so as to associate the defect mark in the defect hotspot map with the defect image, and when receiving an operation acting on the defect mark on the defect hotspot map, responds to the operation to determine the operated defect mark, obtains the target defect image and the defect name associated with the operated defect mark, and displays the target defect image and the defect name, so as to realize the visual display of PCB defects through the defect hotspot map. Through the defect hotspot map, the position, density distribution, type and quantity of defects in the PCB can be intuitively and clearly located, and because the defect mark in the defect hotspot map is associated with the defect image, the corresponding defect image can be triggered to be displayed through the defect hotspot map, which is convenient for PCB product defect analysis and improves the efficiency of PCB product defect tracing and analysis.

[0099] Furthermore, when an analysis operation of a defect hotspot map is received, it is determined whether a production process abnormality occurs based on the defect hotspot map. If so, an alarm message is generated. The alarm message includes the production process where the process abnormality occurs. This enables process abnormality analysis and process abnormality alarms to be performed through a real-time generated defect hotspot map, so that corresponding improvement measures can be taken to eliminate process abnormalities and improve the quality and yield of PCB products.

[0100] Embodiment 3

[0101] Figure 7 This is a schematic diagram of the structure of a PCB defect heat map generating device provided by the third embodiment of the present invention. Figure 7 As shown, the PCB defect heat map generating device includes:

[0102] Background image loading module 701, used to load the background image of PCB;

[0103] The defect data acquisition module 702 is used to acquire defect data of a batch of multiple PCBs, wherein the defect data includes defect coordinates and defect images;

[0104] A defect heat map generating module 703 is used to generate defect marks in the background image according to the defect coordinates of the multiple PCBs to generate a defect heat map;

[0105] The defect image association module 704 is used to associate the defect mark in the defect heat map with the defect image.

[0106] Optionally, the defect data also includes defect types, and the defect heat map generation module 703 includes:

[0107] A defect mark determination unit, used to determine a defect type of each defect and determine a target defect mark corresponding to the defect type;

[0108] A position determination unit, used to determine a target position of defect coordinates of the defect in the background image;

[0109] A defect heat map generating unit is used to load the target defect mark at the target position in the background image to generate a defect heat map.

[0110] Optionally, the defect image association module 704 includes:

[0111] A key-value pair generating unit is used to establish a key-value pair with the defect coordinates of the defect mark as a key and the defect image corresponding to the defect coordinates of the defect mark as a value, so as to associate the defect mark in the defect heat map with the defect image.

[0112] Optionally, also include:

[0113] The target type defect mark display module is used to display the defect mark of the target type defect in the defect heat map when receiving a selection operation for the target type defect.

[0114] Optionally, also include:

[0115] In the defect mark determination module, when receiving an operation acting on the defect mark on the defect heat map, responding to the operation to determine the defect mark being operated;

[0116] The defect image and name display module is used to obtain the target defect image and defect name associated with the operated defect mark, and display the target defect image and defect name.

[0117] Optionally, also include:

[0118] A process abnormality judgment module, configured to judge whether a production process abnormality occurs according to the defect heat map when receiving an analysis operation of the defect heat map;

[0119] The alarm information generation module is used to generate alarm information, wherein the alarm information includes information about the production process where the process abnormality occurs.

[0120] Optionally, the process abnormality judgment module includes:

[0121] A defect heat map analysis unit, configured to count the number of defects, defect locations, and defect density of defects of the same type in the defect heat map based on the defect marks;

[0122] The process abnormality determination unit is used to determine that a generation process abnormality occurs when the number of defects is greater than a preset number, or the defect position is within a preset area, or the defect density is greater than a preset density.

[0123] The PCB defect hotspot map generating device provided in the embodiment of the present invention can execute the PCB defect hotspot map generating method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0124] Embodiment 4

[0125] Figure 8 A schematic diagram of the structure of an electronic device 40 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0126] like Figure 8 As shown, the electronic device 40 includes at least one processor 41, and a memory connected to the at least one processor 41, such as a read-only memory (ROM) 42, a random access memory (RAM) 43, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 41 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 42 or the computer program loaded from the storage unit 48 to the random access memory (RAM) 43. In the RAM 43, various programs and data required for the operation of the electronic device 40 can also be stored. The processor 41, the ROM 42, and the RAM 43 are connected to each other through a bus 44. An input / output (I / O) interface 45 is also connected to the bus 44.

[0127] A number of components in the electronic device 40 are connected to the I / O interface 45, including: an input unit 46, such as a keyboard, a mouse, etc.; an output unit 47, such as various types of displays, speakers, etc.; a storage unit 48, such as a disk, an optical disk, etc.; and a communication unit 49, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 49 allows the electronic device 40 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0128] The processor 41 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 41 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 41 performs the various methods and processes described above, such as a PCB defect heat map generation method.

[0129] In some embodiments, the PCB defect heat map generation method can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 48. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 40 via the ROM 42 and / or the communication unit 49. When the computer program is loaded into the RAM 43 and executed by the processor 41, one or more steps of the PCB defect heat map generation method described above can be performed. Alternatively, in other embodiments, the processor 41 can be configured to perform the PCB defect heat map generation method in any other appropriate manner (for example, by means of firmware).

[0130] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0131] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0132] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0133] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0134] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0135] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0136] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0137] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for generating a PCB defect heat map, characterized in that: include: Load the background image of the PCB; Acquire defect data of a batch of multiple inspected PCBs, wherein the defect data includes defect coordinates and defect images; Generating defect marks in the background image according to the defect coordinates of the plurality of PCBs to generate a defect heat map; The defect marks in the defect heat map are associated with the defect image.

2. The PCB defect heat map generation method according to claim 1, characterized in that: The defect data also includes defect types, and defect marks are generated in the background image according to the defect coordinates of the multiple PCBs to generate a defect heat map, including: Determining a defect type for each defect and determining a target defect label corresponding to the defect type; Determine a target position of defect coordinates of the defect in the background image; The target defect mark is loaded at the target position in the background image to generate a defect heat map.

3. The PCB defect heat map generation method according to claim 1, characterized in that: Associating the defect mark in the defect heat map with the defect image includes: A key-value pair is established with the defect coordinates of the defect mark as the key and the defect image corresponding to the defect coordinates of the defect mark as the value, so as to associate the defect mark in the defect heat map with the defect image.

4. The method for generating a PCB defect heat map according to any one of claims 1 to 3, characterized in that: Also includes: When a selection operation for a target type of defect is received, a defect mark of the target type of defect is displayed in the defect heat map.

5. The method for generating a PCB defect heat map according to any one of claims 1 to 3, characterized in that: Also includes: When receiving an operation acting on the defect mark on the defect heat map, determining the defect mark being operated in response to the operation; A target defect image and a defect name associated with the defect mark being operated are acquired, and the target defect image and the defect name are displayed.

6. The method for generating a PCB defect heat map according to any one of claims 1 to 3, characterized in that: Also includes: Upon receiving an analysis operation of a defect heat map, determining whether a production process abnormality occurs according to the defect heat map; If so, an alarm message is generated, wherein the alarm message includes information about the production process where the process abnormality occurs.

7. The method for generating a PCB defect heat map according to any one of claims 1 to 3, characterized in that: Judging whether a production process abnormality occurs according to the defect hot spot map includes: In the defect heat map, based on the defect marks, count the defect quantity, defect location, and defect density of defects of the same type; When the number of defects is greater than a preset number, or the defect position is within a preset area, or the defect density is greater than a preset density, it is determined that a production process abnormality occurs.

8. A PCB defect heat map generating device, characterized in that: include: Background image loading module, used to load the background image of PCB; A defect data acquisition module, used to acquire defect data of a batch of multiple PCBs, wherein the defect data includes defect coordinates and defect images; A defect heat map generating module, used for generating defect marks in the background image according to the defect coordinates of the plurality of PCBs, so as to generate a defect heat map; The defect image association module is used to associate the defect mark in the defect heat map with the defect image.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the PCB defect hotspot map generating method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the PCB defect hotspot map generating method according to any one of claims 1 to 7 when executed.

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