Electronic component manufacturing apparatus and electronic component manufacturing method

Abstract

The invention provides an electronic component manufacturing device and an electronic component manufacturing method, which can shorten lamination time. A device (100) for manufacturing an electronic component is provided with: a crimping head (130) having a crimping surface for conveying a ceramic green sheet (20); a device (100) for manufacturing an electronic component, which is provided with a plurality of ceramic green sheets (20), and a plurality of laminating tables (110a, 110b, 110c, 110d, 110e) on which the conveyed ceramic green sheets (20) are laminated, is characterized by having a laminating region (L) in which the ceramic green sheets (20) are laminated on the laminating tables (110), and in which the plurality of laminating tables (110a, 110b) are disposed close to each other in the laminating region (L).

Description

Technical Field

[0001] The present invention relates to an apparatus for manufacturing an electronic component and a method for manufacturing an electronic component. Background Art

[0002] There is known a method of mass-producing small electronic components at one time by stacking ceramic green sheets obtained by forming a ceramic material into a sheet shape before firing, performing pressure molding, and then firing and individualizing.

[0003] As a method for manufacturing such electronic components, for example, Patent Document 1 discloses the following method: a raw sheet is conveyed while a ceramic sheet is held by a holding unit, and the ceramic raw sheet is peeled off from a carrier film by bending a middle portion of the raw sheet along an edge of a scraper member, and stacked on a stacking table.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2011-91309 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] In the method described in Patent Document 1, ceramic sheets are sequentially stacked using a stacking head for a single stacking stage, so there is room for shortening the stacking time required for each stacking unit.

[0009] In addition, in order to stack ceramic green sheets in the method of Patent Document 1, all ceramic green sheets constituting the stack need to be arranged on the holding unit in the stacking order in advance. On the other hand, it is rare that ceramic green sheets with the same pattern are stacked continuously in two or more layers. Therefore, it is necessary to arrange ceramic green sheets with different patterns on the holding unit, and there is also a problem that such ceramic green sheets cannot be mass-produced and it is difficult to suppress the time and cost required for manufacturing.

[0010] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an electronic component manufacturing apparatus capable of shortening lamination time.

[0011] Means used to solve problems

[0012] The manufacturing device of the electronic component of the present invention comprises: a crimping head having a crimping surface for conveying ceramic green sheets; and a plurality of stacking workbenches for stacking the conveyed ceramic green sheets. The manufacturing device of the electronic component is characterized in that it has a stacking area in which the ceramic green sheets are stacked on the stacking workbenches, and in the stacking area, the plurality of stacking workbenches are closely arranged.

[0013] Effects of the Invention

[0014] According to the present invention, it is possible to provide an electronic component manufacturing apparatus capable of shortening lamination time. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a diagram schematically showing an example of an electronic component manufacturing apparatus according to the present invention.

[0016] Figure 2 This is an enlarged side view of the vicinity of the stacking area.

[0017] Figure 3 yes Figure 1 A-A' line section view.

[0018] Figure 4 1 is a cross-sectional view schematically showing another example of the lamination stage.

[0019] Figure 5 This is a diagram showing an example of a method of cutting a ceramic green sheet.

[0020] Figure 6 is a cross-sectional view schematically showing another example of the crimping head.

[0021] Description of Reference Numerals

[0022] 10: resin film;

[0023] 20: Ceramic green sheet;

[0024] 30: raw material sheet;

[0025] 100: Electronic component manufacturing equipment;

[0026] 110a, 110b, 110c, 110d, 110e, 110f: stacking workbench;

[0027] 120: conveyor track;

[0028] 130, 135: crimping joints;

[0029] 130a, 135a: crimping surfaces of the crimping joint;

[0030] 135b: lower end of the crimping head;

[0031] 140: stripping station;

[0032] 140a: front end portion;

[0033] 150, 151: Cut-off unit;

[0034] 160, 161: movable parts;

[0035] 170: Linear motor;

[0036] 180: Supporting components;

[0037] E: extraction area;

[0038] L: Lamination area. DETAILED DESCRIPTION

[0039] The following is an explanation of the manufacturing device of the electronic component of the present invention. However, the present invention is not limited to the following structure, and can be appropriately changed and applied within the scope of not changing the main purpose of the present invention. In addition, the structure obtained by combining two or more of the preferred structures of the present invention described below is also the present invention.

[0040] In this specification, terms that indicate the relationship between elements (for example, "opposite", "orthogonal", etc.) and terms that indicate the shape of an element (for example, "rectangular", etc.) do not have strict meanings but rather indicate a range of substantial equivalence, for example, also including a difference of a few percent.

[0041] The drawings shown below are schematic diagrams, and their dimensions, aspect ratios, and scales may differ from those of actual products.

[0042] [Electronic component manufacturing equipment]

[0043] The manufacturing device of the electronic component of the present invention comprises: a crimping head having a crimping surface for conveying ceramic green sheets; and a plurality of stacking workbenches for stacking the conveyed ceramic green sheets. The manufacturing device of the electronic component is characterized in that it has a stacking area in which the ceramic green sheets are stacked on the stacking workbenches, and in the stacking area, the plurality of stacking workbenches are closely arranged.

[0044] Figure 1 This is a diagram schematically showing an example of an electronic component manufacturing apparatus according to the present invention.

[0045] Figure 1 The electronic component manufacturing apparatus 100 shown includes a plurality of laminating stages 110 a , 110 b , 110 c , 110 d , and 110 e for laminating ceramic green sheets.

[0046] The plurality of stacking workstations 110a, 110b, 110c, 110d and 110e are configured to move along a circular (track-shaped) conveying track 120, and to rotate clockwise (in a clockwise direction) on a circular conveying path including a stacking area L and a take-out area E. Figure 1 , the conveying track 120 moves in the direction of the arrow shown.

[0047] The shape of the conveying track 120 does not necessarily need to be a circular ring. For example, the conveying track 120 may be a circular shape with the terminal end and the starting end connected, or the terminal end and the starting end may be disconnected.

[0048] exist Figure 1 In the electronic component manufacturing apparatus 100 shown, the stacking stations 110a and 110b are arranged in the stacking region L. The stacking station 110c is arranged in the take-out region E. Furthermore, the stacking stations 110d and 110e are arranged in regions other than the stacking region L and the take-out region E.

[0049] However, since the stacking tables 110a, 110b, 110c, 110d, and 110e are transported along the transport track 120, the area where the stacking tables are arranged is not limited to Figure 1 The area shown changes in sequence.

[0050] Each stacking table can move smoothly along the conveying track without using bearings.

[0051] The method of moving each stacking stage along the conveying track will be described later.

[0052] Next, the stacking region L will be described.

[0053] In the lamination area L, ceramic green sheets are laminated on a lamination table.

[0054] The ceramic green sheets may be stacked directly on the stacking table or on a flat jig disposed on the stacking table.

[0055] exist Figure 1 In the electronic component manufacturing apparatus 100 shown, in the lamination area L, the lamination stage 110 a and the lamination stage 110 b are arranged close to each other.

[0056] The so-called "closeness" of multiple stacking workbenches in the stacking area means a state where the shortest distance between the stacking workbenches is less than 10 mm (including zero). In addition, "closeness" also includes "contacting state". Therefore, it is preferred that two stacking workbenches arranged close to each other in the stacking area are in contact with each other.

[0057] Ceramic green sheets (not shown) are stacked on the stacking stages 110a and 110b in the stacking region L. The assembly of the ceramic green sheets stacked on the stacking stages is also referred to as a stacked body.

[0058] The number of ceramic green sheets stacked on the stacking stage while the stacking stage passes through the stacking region L is not particularly limited, and one ceramic green sheet may be stacked, or a plurality of ceramic green sheets may be stacked.

[0059] There is no need to sequentially stack ceramic green sheets on a plurality of adjacent stacking stations.

[0060] For example, when the first stacking workbench and the second stacking workbench are arranged close to each other in the stacking area, the operation of stacking 10 ceramic green sheets on the first stacking workbench and then stacking 10 ceramic green sheets on the second stacking workbench can be performed, or the process of stacking 1 ceramic green sheet on the first workbench and then stacking 1 ceramic green sheet on the second stacking workbench can be repeated 10 times in succession.

[0061] In the laminating area, the ceramic green sheets are stacked on the laminating table while being conveyed by the press head. Figure 2 An example of this process will be described below.

[0062] Figure 2 yes Figure 1 An enlarged cross-sectional view of the vicinity of a lamination region in the electronic component manufacturing apparatus shown.

[0063] Figure 2 The illustrated process is an example of a process in which the ceramic green sheet 20 is peeled off from the raw material sheet 30 by the pressure head 130 in the lamination area L and is laminated on the lamination stage 110 a .

[0064] In the lamination area L, a plurality of lamination stages 110 a and 110 b are arranged, and the plurality of lamination stages 110 a and 110 b are transported in a certain direction.

[0065] The stacking stages 110a and 110b are in the shape of a flat plate. Therefore, the upper surfaces of the stacking stages 110a and 110b (the surfaces on which the ceramic green sheets 20 are stacked) are flat.

[0066] The green sheet 30 includes a resin film 10 serving as a support and a ceramic green sheet 20 disposed on the resin film 10 .

[0067] The raw material sheet 30 is wound along the direction of the unwinding mechanism (not shown) until it is wound up by the winding mechanism (not shown). Figure 2 The surface of the peeling stage 140 arranged in the lamination area L shown is conveyed.

[0068] The green sheet 30 is conveyed along the surface of the peeling table 140 from the upper left to the lower right of the paper, and then the conveying direction is changed at the front end 140a of the peeling table 140, and it is conveyed from the right side to the left side of the paper. At this time, the ceramic green sheet 20 is sucked by the pressing head 130, and is peeled from the resin film 10 constituting the green sheet 30.

[0069] In the lamination region L, the ceramic green sheets 20 are laminated on the lamination stage 110 a in the following steps.

[0070] In the lamination region L, a peeling stage 140 is disposed.

[0071] The raw material sheet 30 conveyed on the peeling stage 140 is first cut by the cutting unit 150 .

[0072] The raw material sheet 30 is a long sheet formed by laminating a long resin film 10 having a given width and a ceramic green sheet 20. Regarding the lamination order of the resin film 10 and the ceramic green sheet 20, the resin film 10 is on the side in contact with the peeling table 140, and the ceramic green sheet 20 is on the side not in contact with the peeling table 140.

[0073] The cutting unit 150 extends in the width direction (from the front of the paper to the depth direction) of the raw material sheet 30, and its length is longer than the length in the width direction of the ceramic green sheet 20. Therefore, the cutting unit 150 is inserted into a position deeper than the thickness of the ceramic green sheet 20, so that the ceramic green sheet 20 is completely cut in the width direction. In addition, it is preferred that the cutting unit 150 does not completely cut the resin film 10 in the thickness direction.

[0074] Since the cut ceramic green sheet 20 is supported by the resin film 10 , it is conveyed along the surface of the peeling table 140 even after being cut.

[0075] Next, the cut ceramic green sheet 20 is sucked onto the pressing surface 130 a by the pressing head 130 .

[0076] The method of adsorbing the ceramic green sheet 20 through the crimping surface 130a of the crimping head 130 is not particularly limited, but for example, the following method can be listed: a plurality of suction holes are provided on the surface to be crimped, and air is sucked from the suction holes while the crimping surface is in close contact with the surface of the ceramic green sheet 20.

[0077] When such a method is used, the pressing surface 130a of the pressing head 130 sucks the ceramic green sheet 20 while the air is being sucked. On the other hand, the ceramic green sheet 20 is not sucked while the air is being sucked.

[0078] Therefore, the adsorption and detachment of the ceramic green sheet 20 can be controlled by the presence or absence of air suction.

[0079] The ceramic green sheet 20 is adsorbed by the above-mentioned crimping head 130, and at the same time, the crimping head 130 is transported in the direction in which the ceramic green sheet 20 should originally move, and the transport direction of the resin film 10 supporting the ceramic green sheet 20 adsorbed by the crimping head 130 is changed at the front end portion 140a of the peeling table 140, thereby peeling the ceramic green sheet 20 adsorbed on the crimping surface 130a of the crimping head 130 from the resin film 10 constituting the raw material sheet 30.

[0080] exist Figure 2In the drawing, the resin film 10 is transported to the left of the paper, but the cut ceramic green sheet 20 is sucked by the crimping head 130 and transported to the lower right of the paper, so the cut ceramic green sheet 20 is peeled off from the resin film 10 .

[0081] Finally, the pressing head 130 adsorbing the ceramic green sheet 20 is moved onto the stacking table 110a. After the ceramic green sheet 20 contacts the stacking table 110a, the pressing head 130 is released from adsorption and moved from the stacking table 110a.

[0082] Through the above steps, the ceramic green sheets 20 can be peeled off from the surface of the raw material sheet 30 using the pressing head 130 and stacked on the stacking stage 110 a .

[0083] When the ceramic green sheets 20 are stacked on the stacking stage 110 a by the crimping head 130 , some force may be applied to the ceramic green sheets 20 to thereby press-bond the ceramic green sheets 20 to the stacking stage 110 a .

[0084] The same process can be performed on the lamination stage 110b.

[0085] Alternatively, the ceramic green sheet 20 may be unwound by the unwinding mechanism in a state of being cut in advance. Figure 2 The shown cutting unit becomes unnecessary.

[0086] The plurality of laminating stages 110a and 110b are closely arranged in the laminating region L. Therefore, the distance from the peeling region to each laminating stage 110a and 110b is short, and the time required for conveying the ceramic green sheets 20 by the crimping head 40 and laminating them on the laminating stages 110a and 110b is shortened.

[0087] Furthermore, three or more lamination stages may be disposed in close proximity within the lamination region L.

[0088] For example, when stacking table A, stacking table B, and stacking table C are arranged in the stacking area, if stacking table A is close to stacking table B, and stacking table B is close to stacking table C, then the three stacking tables A to C are considered to be close to each other. Therefore, stacking table A and stacking table C may not be directly close to each other.

[0089] Preferably, in the laminating area L, the laminating table and the crimping head are conveyed in the same direction in a direction substantially parallel to the crimping surface.

[0090] exist Figure 2In the stacking area L shown, when the ceramic green sheet 20 adsorbed by the pressing head 130 is stacked on the stacking workbench 110a or 110b, the pressing surface 130a constituting the pressing head 130 becomes roughly parallel to the upper surface of the stacking workbench 110a or 110b (the surface on which the ceramic green sheet is stacked).

[0091] At the moment when the ceramic green sheets are stacked, the conveying direction of the stacking workstations 110a and 110b in the stacking area is from the left side of the paper to the right side. On the other hand, the conveying direction of the crimping head 130 is from the left side of the paper to the right side, which is consistent with the conveying direction of the stacking workstations 110a and 110b. Furthermore, it can be said that this direction is a direction substantially parallel to the crimping surface 130a.

[0092] Preferably, the surface of the laminating table on which the ceramic green sheets are to be laminated is flat. Therefore, the shape of the laminating table may be a flat plate.

[0093] The crimping surface of the crimping head does not necessarily need to be flat, and may be curved, for example.

[0094] If necessary, a coating such as DLC (diamond-like carbon) may be formed on the crimping surface of the crimping head.

[0095] The number of crimping heads arranged in the stacking region may be one, but may also be plural.

[0096] A camera may be arranged in the lamination area. For example, the camera is arranged near the crimping head and reads marks on the lamination table and the ceramic green sheet, and can be used for position alignment.

[0097] As a method for adsorbing the ceramic green sheet to the surface of the crimping head, in addition to the method of sucking air through the above-mentioned holes, there can be mentioned a method of adsorbing by an electrical method.

[0098] A stacked body in which a given number of ceramic green sheets are stacked is taken out from the stacking stage in the take-out area E.

[0099] The method of taking out the laminated body in the taking-out region E is not particularly limited, and for example, a method of taking out the laminated body by a robot arm or the like can be mentioned.

[0100] The stacked body may be taken out together with the stacking table or only the stacked body may be taken out in the take-out area E. In addition, when a plate-shaped jig or the like is arranged on the stacking table and the stacked body is stacked on the jig, the stacked body may be taken out together with the jig.

[0101] In addition, the laminated body formed by laminating ceramic green sheets in the laminating region L does not necessarily need to be taken out in the taking-out region E.

[0102] For example, a camera or the like may be provided in the take-out area to recognize a marker or the like provided on the ceramic green sheets constituting the stacked body, thereby determining whether or not to take out the stacked body.

[0103] The stacking table determined to be unnecessary to take out the stacked body in the take-out area is transported out of the take-out area again along the transport track.

[0104] The laminated body taken out in the take-out region is then pressure-bonded to form a mother block, and then cut into small pieces, fired, and external electrodes are formed to form an electronic component.

[0105] Next, a method of moving the laminating table along the conveyor rail will be described.

[0106] Figure 3 yes Figure 1 A-A' line section view.

[0107] like Figure 3 As shown, the laminating table 110a is arranged on the conveying rail 120 via the movable member 160. By moving the movable member 160 by the linear motor 170, the laminating table 110a connected to the movable member 160 can be independently operated.

[0108] In addition, sometimes the laminating table 110a is pressed downward by the aforementioned crimping head. In this case, in order to prevent the laminating table 110a from being deformed, a supporting member 180 may be arranged below the laminating table 110a.

[0109] Figure 4 is a cross-sectional view schematically showing another example of the lamination stage. Figure 4 This is also an example in which the stacking table is suspended to the side and below the conveyor track.

[0110] Figure 4 The stacking table 110f shown is connected to the conveying rail 120 via a movable member 161 having a crank-shaped cross section. Therefore, the stacking table 110f is not arranged on the conveying rail 120 but is arranged at a position to the side and below the conveying rail 120.

[0111] By moving the movable element 161 by the linear motor 170 , the laminating table 110 f connected to the movable element 161 can be transported independently of other laminating tables.

[0112] In addition, there is a case where a downward pressing force is applied to the laminating table 110f by the aforementioned crimping head. In this case, in order to prevent the laminating table 110f from being deformed, a supporting member 180 may be disposed below the laminating table 110f.

[0113] in addition, Figure 4The movable part 161 shown is set to a crank shape, so when the movable part 161, the laminating table 110f and the supporting member 180 are regarded as a single rigid body, the center of gravity thereof does not overlap with the linear motor 170 and the conveying rail 120. Therefore, the shape of the movable part may be changed so that when the movable part, the laminating table and the supporting member are regarded as a single rigid body, the center of gravity thereof overlaps with the linear motor and the rail.

[0114] For example, the shape of the movable part may be set to a shape that spans both sides of the track in the width direction, the stacking table and the support member may be arranged on one side, and the counterweight may be arranged on the other side so that the center of gravity of the whole overlaps with the linear motor and the track. If the center of gravity of the movable part, the stacking table, the support member, and the counterweight when regarded as a single rigid body overlaps with the linear motor and the track, the stability when the stacking table is transported can be improved.

[0115] In the electronic component manufacturing apparatus of the present invention, the timing for cutting the ceramic green sheet is not limited to Figure 2 Timing shown.

[0116] For example, after the raw material sheet is prepared, the ceramic green sheet may be cut into a predetermined shape before being unrolled by the unwinding mechanism. In this case, the ceramic green sheet unrolled by the unwinding mechanism is cut in advance. Figure 2 Thus, the step of cutting the ceramic green sheet 20 constituting the raw material sheet 30 on the peeling stage 140 becomes unnecessary.

[0117] That is, in the above case, the electronic component manufacturing apparatus of the present invention may not include a cutting unit that cuts the ceramic green sheet into a specific shape.

[0118] The method of cutting the ceramic green sheet is not limited to Figure 2 Cutting method shown.

[0119] Figure 5 This is a diagram showing an example of a method of cutting a ceramic green sheet.

[0120] exist Figure 2 In the embodiment, the ceramic green sheet 20 is cut by a cutting unit 150 whose length in the width direction is longer than the width of the ceramic green sheet. However, for example, Figure 5 As shown, two or more cutting units 151 are combined to cut the ceramic green sheet 20 into a predetermined shape.

[0121] In this case, Figure 2 Similarly to the case shown, it is also preferable that the resin film 10 is not completely cut by the cutting unit 150 .

[0122] In addition, Figure 5A method for cutting a ceramic green sheet 20 by using two cutting units is disclosed, but the number of cutting units is not particularly limited. A cutting knife having a rectangular shape as a whole (such as a Thomson knife) can be pressed against the ceramic green sheet to cut it, or a disc-shaped knife can be pressed against the ceramic green sheet while rotating it to cut it.

[0123] also, Figure 5 The cutting unit 151 shown is a single-edged one, but the cutting unit may also be a double-edged one.

[0124] The method of cutting the ceramic green sheet is not limited to the method using the above-mentioned cutting blade, and for example, cutting using a laser or the like may be performed.

[0125] The shape of the crimping head is not limited to a flat plate, and may be, for example, a cylindrical shape.

[0126] When the crimping head is cylindrical, the side surface of the crimping head (side surface of the cylinder) can be made to attract the ceramic green sheet. Furthermore, by rotating the crimping head, the ceramic green sheet attracted to the side surface of the crimping head can be transported.

[0127] For example, a raw material sheet on which ceramic green sheets cut into a given shape are arranged on a resin film is brought close so that the surface of the ceramic green sheet faces the side of the pressing head, and at the moment when the surface of the ceramic green sheet contacts the side of the pressing head, the ceramic green sheet is adsorbed on the pressing surface of the adsorption head, thereby enabling the ceramic green sheet to be peeled off from the raw material sheet.

[0128] After the ceramic green sheet is sucked onto the side surface of the crimping head in the above-described manner, if the crimping head is further rotated, the ceramic green sheet can be sucked and transported along the side surface of the crimping head.

[0129] Furthermore, the stacking worktable is moved so that the ceramic green sheet adsorbed on the side of the pressing head contacts the stacking worktable, and by releasing the adsorption of the pressing head at the moment when the ceramic green sheet adsorbed on the side of the pressing head contacts the stacking worktable, the ceramic green sheet originally adsorbed on the surface of the pressing head can be moved to the surface of the stacking worktable.

[0130] That is, by using a cylindrical crimping head, although the conveying path of the sucked ceramic green sheets is limited to a path along the side surface when the crimping head is rotated, the ceramic green sheets can be continuously peeled and stacked by the rotation of the crimping head.

[0131] Therefore, by using a cylindrical crimping head, the time required to stack the ceramic green sheets can be shortened.

[0132] At this time, it is preferable that the laminating table and the crimping head are conveyed in the same direction on a plane substantially parallel to the crimping surface.

[0133] Figure 6 FIG. 1 is a cross-sectional view schematically showing an example of laminating ceramic green sheets using another example of a compression head.

[0134] Figure 6 This is also an example of a stacking region in which a cylindrical crimping head is arranged.

[0135] exist Figure 6 In the stacking area shown, the crimping head 135 rotates counterclockwise, and the stacking worktables 110a and 110b are transported in one direction from the left side to the right side of the paper so as to contact the lower end 135b of the crimping head.

[0136] In the cylindrical crimping head 135 , the side surface of the cylinder serves as a crimping surface 135 a .

[0137] However, the portion actually in contact with the ceramic green sheet 20 is the lower end 135b of the crimping head 135, so when considering the direction of the crimping surface, the direction of the crimping surface 135a at the lower end 135b of the crimping surface 135a is considered.

[0138] At the lower end 135b of the crimping head 135, the adsorption of the crimping head 135 is released at the moment when the crimping surface 135a contacts the stacking workbench 110a or 110b, so that the ceramic green sheet 20 originally adsorbed on the crimping surface 135a of the crimping head 135 is stacked on the stacking workbench 110a or 110b.

[0139] like Figure 6 As shown, the cylindrical crimping head 135 is rotated, and the positional relationship between the crimping head 135 and the stacking worktables 110a, 110b and the conveying path of the stacking worktables 110a, 110b are adjusted so that the stacking worktables 110a, 110b and the crimping head 135 are conveyed in the same direction on a plane roughly parallel to the crimping surface 135a. In this way, the cylindrical crimping head can be used to stack the ceramic green sheets held on the crimping surface of the crimping head on the stacking worktable.

[0140] At this time, it is preferred that the conveying speed of the crimping head is the same as the conveying speed of the laminating table. In other words, it is preferred that the crimping surface of the crimping head moves synchronously with the movement of the laminating table at the moment when the ceramic green sheets are laminated on the laminating table.

[0141] Alternatively, when the pressing head contacts the laminating table, a downward force may be applied to the pressing head or an upward force may be applied to the laminating table to press the ceramic green sheets moved onto the laminating table. By pressing the ceramic green sheets, positional deviation can be prevented.

[0142] The ceramic green sheet is formed, for example, by applying a slurry containing ceramic particles including Ba and Ti and also including a binder, a dispersant, and the like on a resin film and drying the slurry.

[0143] The coating method is not particularly limited, and various coating methods such as gravure coating and die coating can be used.

[0144] The thickness of the ceramic green sheet is not particularly limited, but is about 0.2 μm or more and 3.0 μm or less.

[0145] If necessary, an internal electrode pattern may be printed on the surface of the ceramic green sheet. The ceramic green sheet on which the internal electrode pattern is printed is also referred to as an internal electrode sheet.

[0146] The internal electrode pattern can be formed by printing an internal electrode paste obtained by mixing metal particles, a binder, an organic solvent, and a dispersant on a ceramic green sheet.

[0147] The printing method is not particularly limited, and various printing methods such as screen printing and gravure printing can be used.

[0148] The thickness of the internal electrode pattern is not particularly limited, but is approximately 0.1 μm or more and 1.0 μm or less.

[0149] The ceramic green sheet may be stacked on a resin film serving as a support (raw sheet) and handled in a state of being wound into a roll.

[0150] In this case, the film is unwound by the unwinding mechanism, cut into a predetermined shape at or near the peeling region, peeled from the surface of the resin film by a crimping head, and stacked on a laminating table.

[0151] [Method for manufacturing electronic component]

[0152] The method for producing an electronic component of the present invention is characterized by laminating ceramic green sheets using the apparatus for producing an electronic component of the present invention.

[0153] By using the electronic component manufacturing apparatus of the present invention, the time required to stack ceramic green sheets can be shortened.

[0154] Therefore, in the method for manufacturing an electronic component of the present invention, the time required for manufacturing the electronic component can be shortened.

[0155] In this specification, the following matters are described.

[0156] The present disclosure (1) is an electronic component manufacturing device comprising:

[0157] a crimping head having a crimping surface for conveying the ceramic green sheet; and

[0158] Multiple stacking workstations for stacking the transported ceramic green sheets.

[0159] The electronic component manufacturing device is characterized in that:

[0160] having a stacking area in which ceramic green sheets are stacked on the stacking table,

[0161] In the stacking area, a plurality of the stacking stages are arranged closely together.

[0162] The present disclosure (2) is the electronic component manufacturing apparatus described in the present disclosure (1), wherein a plurality of the lamination stages are arranged in contact with each other in the lamination area.

[0163] The present disclosure (3) is a manufacturing device for electronic components according to the present disclosure (1) or (2), wherein the plurality of stacking stations are arranged on a circulating conveying path including the stacking area.

[0164] The present disclosure (4) is an electronic component manufacturing device based on any combination of any items in the present disclosure (1) to (3), wherein in the stacking area, the stacking table and the crimping head are transported in the same direction on a plane substantially parallel to the crimping surface.

[0165] The present disclosure (5) is a method for manufacturing an electronic component, characterized in that ceramic green sheets are stacked using the electronic component manufacturing apparatus described in any one of the present disclosures (1) to (4).

Claims

1. An electronic component manufacturing device comprising: a crimping head having a crimping surface for conveying the ceramic green sheet; and Multiple stacking workstations for stacking the transported ceramic green sheets. The electronic component manufacturing device is characterized in that: having a stacking area in which ceramic green sheets are stacked on the stacking table, In the stacking area, a plurality of the stacking stages are arranged closely together.

2. The electronic component manufacturing device according to claim 1, wherein: In the stacking area, a plurality of the stacking stages are arranged in contact with each other.

3. The electronic component manufacturing device according to claim 1 or 2, wherein: The plurality of stacking stations are arranged on a circulating conveying path including the stacking area.

4. The electronic component manufacturing apparatus according to any one of claims 1 to 3, wherein: In the laminating area, the laminating table and the crimping head are conveyed in the same direction on a plane substantially parallel to the crimping surface.

5. A method for manufacturing an electronic component, characterized in that: The ceramic green sheets are stacked using the electronic component manufacturing apparatus according to any one of claims 1 to 4.

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