Display panel, preparation method of display panel, jig and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel, a jig and electronic equipment, and relates to the technical field of display. The wiring layer is located on one side of the flexible substrate, and the wiring layer extends to a bending area from the bonding area; the bending protection layer is located on the side, away from the flexible substrate, of the wiring layer, the bending protection layer extends to the bonding area from the bending area, and the thickness of the bending protection layer in the bending area is smaller than that of the bending protection layer in the bonding area. According to the display panel, by thinning the bending protection layer of the bending area, the neutral layer of the bending protection layer can be adjusted to the wiring layer, so that the stress borne by the wiring layer can be reduced, the risk of breakage of metal wires in the wiring layer can be reduced, and finally the reliability of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for preparing a display panel, a fixture, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display panels.

[0003] However, the reliability of the display panel in the related art is not good enough. Summary of the invention

[0004] In order to overcome the technical problems mentioned in the above technical background, an embodiment of the present application provides a display panel, wherein the display panel includes a display area and a non-display area, wherein the non-display area includes a bonding area folded to the back of the display area and a bending area located between the bonding area and the display area; the display panel includes:

[0005] Flexible substrate;

[0006] a routing layer located on one side of the flexible substrate, the routing layer extending from the bonding area to the bending area;

[0007] A bending protection layer is located on a side of the routing layer away from the flexible substrate, the bending protection layer extends from the bending area to the bonding area, and the thickness of the bending protection layer in the bending area is less than the thickness of the bending protection layer in the bonding area.

[0008] In some possible implementations, in the bending region, along a direction perpendicular to the flexible substrate, the thickness of the bending protection layer ranges from 40 μm to 60 μm;

[0009] Preferably, in the bending region, along a direction perpendicular to the flexible substrate, the thickness of the bending protection layer is uniformly set.

[0010] In some possible implementations, in the bonding area, along a direction perpendicular to the flexible substrate, the thickness of the bending protection layer ranges from 70 μm to 110 μm;

[0011] Preferably, in the bonding area, along a direction perpendicular to the flexible substrate, the thickness of the bending protection layer is uniformly set.

[0012] In some possible implementations, in the bending region, a concave-convex structure is provided on a side of the bending protection layer away from the flexible substrate;

[0013] Preferably, the concave-convex structure and the bending protection layer are formed integrally.

[0014] In some possible implementations, the material of the bending protection layer includes bending protection glue;

[0015] Preferably, the bending protection adhesive comprises UV-curable adhesive.

[0016] In some possible implementations, the present application further provides a method for preparing a display panel, the method comprising:

[0017] A flexible substrate is provided; the flexible substrate comprises a display area and a non-display area, the non-display area comprises a bonding area and a bending area between the bonding area and the display area;

[0018] forming a wiring layer on one side of the flexible substrate, wherein the wiring layer extends from the bonding area to the bending area;

[0019] forming a bending protection layer on a side of the routing layer away from the flexible substrate, wherein the bending protection layer extends from the bending area to the bonding area;

[0020] Bending the bending area to fold the bonding area to the back side of the display area;

[0021] The bending area of ​​the bent display panel is set on a jig, and the jig is used to heat the bending protection layer to reduce the thickness of the bending protection layer in the bending area, so that the thickness of the bending protection layer in the bending area is less than the thickness of the bending protection layer in the bonding area.

[0022] In some possible implementations, the step of disposing the bent region of the bent display panel on a jig and causing the jig to heat the bending protection layer includes:

[0023] The bent region of the bent display panel is disposed on a jig, and the jig is used to heat the bending protection layer for 45s-60s.

[0024] In some possible implementations, the step of disposing the bent region of the bent display panel on a jig, and allowing the jig to heat the bending protection layer for 45s-60s includes:

[0025] The bent region of the bent display panel is disposed on a jig, and the jig is used to heat the bending protection layer at 80° C.-100° C. for 45 seconds-60 seconds.

[0026] In some possible implementations, the jig includes a heating area, and the heating area is provided with an exhaust hole; the step of setting the bending area of ​​the bent display panel on a jig and allowing the jig to heat the bending protection layer includes:

[0027] Disposing a bent region of the bent display panel on a jig, and making the bending protection layer of the bent region contact with a heating area of ​​the jig;

[0028] heating the bending protection layer to form a concave-convex structure on a side of the bending protection layer away from the flexible substrate;

[0029] Preferably, the step of disposing the bent region of the bent display panel on a jig and allowing the jig to heat the bending protection layer further includes:

[0030] While heating the bending protection layer in the bending area, the bending protection layer in the bonding area is also heated to thin the thickness of the bending protection layer in the bonding area, and the thickness of the bending protection layer thinned in the bonding area is less than the thickness of the bending protection layer thinned in the bending area.

[0031] In some possible implementations, the present application further provides a jig for preparing a display panel, wherein the jig is used to prepare the display panel described in the present application; the jig includes:

[0032] A jig body, wherein a heating groove is provided on the jig body, and a plurality of air extraction holes connected to the heating groove are also provided in the jig body, and the shape of the heating groove matches the shape of the bending area of ​​the display panel;

[0033] A heating unit, the heating unit is disposed in the fixture body, and the heating unit provides heat for the heating groove;

[0034] A power button is disposed on the fixture body and is electrically connected to the heating unit.

[0035] In some possible implementations, the present application further provides an electronic device, which includes the display panel described in the present application.

[0036] Compared with the prior art, this application has the following beneficial effects:

[0037] The present application provides a display panel, a method for preparing a display panel, a jig and an electronic device. By thinning the bending protection layer in the bending area, the neutral layer of the bending protection layer can be adjusted to the routing layer, thereby reducing the stress on the routing layer, and further reducing the risk of metal routing breakage in the routing layer, and ultimately improving the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 A schematic cross-sectional view of a display panel in the related art provided by an embodiment of the present application;

[0040] Figure 2 A schematic cross-sectional view of a display panel provided in an embodiment of the present application;

[0041] Figure 3 A schematic cross-sectional view of a bending protection layer in a bending area provided in an embodiment of the present application including a concave-convex structure;

[0042] Figure 4 A schematic diagram of a process for preparing a display panel provided in an embodiment of the present application;

[0043] Figure 5 A schematic cross-sectional view of a flexible substrate provided in an embodiment of the present application;

[0044] Figure 6 A cross-sectional schematic diagram of providing a routing layer on a flexible substrate provided in an embodiment of the present application;

[0045] Figure 7 According to an embodiment of the present application, a bending protection layer extending from the bending area to the bonding area is provided on a side of the routing layer away from the flexible substrate;

[0046] Figure 8 A cross-sectional schematic diagram of placing a bent display panel on a fixture for heating according to an embodiment of the present application;

[0047] Fig. 9 A flowchart of a specific execution method of step S14 provided in an embodiment of the present application;

[0048] Fig.10 A schematic cross-sectional view of a fixture provided in an embodiment of the present application;

[0049] Fig.11A schematic diagram showing that the heating zone of the fixture provided in the embodiment of the present application includes a plurality of exhaust holes.

[0050] Figure numerals: 1. flexible substrate; 2. neutral layer; 3. routing layer; 4. bending protection layer; 5. concave-convex structure; 6. fixture; 601. fixture body; 6011. heating groove; 61. heating area; 62. exhaust hole; 63. power button; 64. heating unit. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0052] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0053] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0054] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0055] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0056] See also Figure 1The display panel in the related art includes a display area AA and a non-display area AB, and the non-display area AB includes a bonding area AD folded to the back of the display area AA and a bending area AC located between the bonding area AD and the display area AA. The display panel also includes a flexible substrate 1, a wiring layer 3 located on one side of the flexible substrate 1, and a bending protection layer 4 located on the side of the wiring layer 3 away from the substrate. The thickness of the bending protection layer 4 located in the bonding area AD and the bending area AC is the same, and the thickness D of the bending protection layer 4 ranges from 70μm to 110μm. For example, the thickness D can be 70μm, 80μm, 90μm, 100μm or 110μm, etc.

[0057] The neutral layer 2 in the bending area AC is not subjected to stress, the film layer located on the side of the neutral layer 2 close to the flexible substrate 1 is subjected to compressive stress, and the film layer located on the side of the neutral layer 2 away from the flexible substrate 1 is subjected to tensile stress. The routing layer 3 in the bending area AC is not located in the neutral layer 2, so that the metal routing of the routing layer 3 in the bending area AC will be subjected to greater stress, which may easily cause the metal routing to break, and may further affect the effect of lighting up the luminous sub-pixels in the display area of ​​the display panel, and ultimately affect the reliability of the display panel.

[0058] In view of this, the present embodiment provides a solution that can improve the reliability of the display panel. The solution provided by the present embodiment is described in detail below.

[0059] See also Figure 2 This embodiment provides a display panel, which includes a display area AA and a non-display area AB, the non-display area AB includes a bonding area AD folded to the back of the display area AA and a bending area AC located between the bonding area AD and the display area AA; the display panel includes a flexible substrate 1, a routing layer 3 and a bending protection layer 4.

[0060] The non-display area AB includes the frame of the display panel, for example, the lower frame of the display panel. The bending area AC and the bonding area AD can both be located at the lower frame of the display panel. A circuit board can be set in the bonding area AD, and the metal wiring of the wiring layer 3 can be connected to the circuit board.

[0061] The wiring layer 3 is located on one side of the flexible substrate 1, and the wiring layer 3 extends from the bonding area AD to the bending area AC. The wiring layer 3 includes metal wiring, for example, the metal wiring can be a scan line, a data line, etc. The scan line, the data line, etc. can also extend from the bending area AC to the display area AA, and light up the light-emitting sub-pixel of the display area AA.

[0062] The bending protection layer 4 is located on a side of the routing layer 3 away from the substrate. The bending protection layer 4 extends from the bending area AC to the bonding area. The thickness D1 of the bending protection layer 4 in the bending area AC is less than the thickness D2 of the bending protection layer 4 in the bonding area AD.

[0063] The bending protection layer 4 extends from the bending area AC to the bonding area AD, and plays a protective role on the bending area AC. The bending protection layer 4 in the bending area AC is thinned, so that the thickness D1 of the bending protection layer 4 in the bending area AC is less than the thickness D2 of the bending protection layer 4 in the bonding area AD. In this way, the neutral layer 2 in the bending area AC will move away from the flexible substrate 1, so that the wiring layer 3 is located at the position of the neutral layer 2, thereby greatly reducing the stress on the metal wiring in the wiring layer 3, making it difficult for the metal wiring in the bending area AC to break, and thus making it easier to light up the light-emitting sub-pixel in the display area AA.

[0064] Based on the above design, this embodiment can adjust the neutral layer 2 of the bending protection layer 4 to the routing layer 3 by thinning the bending protection layer 4 in the bending area AC, thereby reducing the stress on the routing layer 3 and further reducing the risk of metal routing breakage in the routing layer 3, and ultimately improving the reliability of the display panel.

[0065] For some possible implementations, see again Figure 2 In the bending area AC, along the direction perpendicular to the flexible substrate 1, the thickness D1 of the bending protection layer 4 ranges from 40μm to 60μm, for example, the thickness D1 can be 40μm, 45μm, 50μm, 55μm or 60μm, etc. In the bonding area AD, along the direction perpendicular to the flexible substrate 1, the thickness D2 of the bending protection layer 4 ranges from 70μm to 110μm; for example, the thickness D2 can be 70μm, 80μm, 90μm, 100μm or 110μm, etc.

[0066] The thickness D2 of the bending protection layer 4 in the bonding area AD is the same as the thickness D of the bending protection layer 4 in the related art. The bending protection layer 4 in the bending area AC is thinned to 40μm-60μm, and the neutral layer 2 in the bending area AC can be adjusted to the routing layer 3, so that the routing layer 3 is located at the position of the neutral layer 2, thereby reducing the stress on the metal routing in the routing layer 3 in the bending area AC.

[0067] Preferably, see again Figure 2 In the bending region AC, the thickness D1 of the bending protection layer 4 is uniformly set along the direction perpendicular to the flexible substrate 1. The bending protection layer 4 in the bending region AC is uniformly thinned, which can make it easier for the metal wiring in the wiring layer 3 to be located in the neutral layer 2, thereby further reducing the stress on the metal wiring in the bending region AC.

[0068] Preferably, see again Figure 2In the bonding area AD, the thickness D2 of the bending protection layer 4 is uniformly set along the direction perpendicular to the flexible substrate 1. The thickness D2 of the bending protection layer 4 in the bonding area AD is the same as the thickness D of the bending protection layer 4 in the related art, and the thickness D2 of the bending protection layer 4 is uniformly set, which can reduce the influence of the bending protection layer 4 in the bonding area AD on the bending protection layer 4 in the bending area AC, so that the metal wiring in the wiring layer 3 can be more easily located in the neutral layer 2.

[0069] For some possible implementations, see Figure 3 In the bending area AC, a concave-convex structure 5 is provided on the side of the bending protection layer 4 away from the flexible substrate 1. The concave-convex structure 5 may include grooves and protrusions arranged at intervals, and the concave-convex structure 5 is conducive to adjusting the neutral layer 2 in the bending area AC to the routing layer 3.

[0070] Preferably, see again Figure 3 The concavo-convex structure 5 is integrally formed with the bending protection layer 4. In this way, the concavo-convex structure 5 can be arranged more easily and the stability of the concavo-convex structure 5 can be improved.

[0071] In some possible implementations, the material of the bending protection layer 4 includes bending protection glue, for example, the bending protection glue includes UV light curing glue, and the UV light curing glue is easier to be thinned, thereby making it easier to thin the bending protection layer 4 in the bending area AC.

[0072] For some possible implementations, see Figure 4 The present application also provides a method for preparing a display panel, the method comprising:

[0073] S10: providing a flexible substrate 1; the flexible substrate 1 comprises a display area AA and a non-display area AB, the non-display area AB comprises a bonding area AD and a bending area AC located between the bonding area AD and the display area AA.

[0074] See also Figure 5 The flexible substrate 1 includes a display area AA and a non-display area AB, wherein the non-display area AB includes a bonding area AD and a bending area AC located between the bonding area AD and the display area AA. The non-display area AB includes a frame of the display panel, for example, a lower frame of the display panel, and the bending area AC and the bonding area AD may both be located at the lower frame of the display panel.

[0075] S11: forming a wiring layer 3 on one side of the flexible substrate 1, wherein the wiring layer 3 extends from the bonding area AD to the bending area AC.

[0076] See also Figure 6A wiring layer 3 is formed on one side of the flexible substrate 1. The wiring layer 3 includes metal wiring. For example, the metal wiring can be a scan line, a data line, etc. The scan line, the data line, etc. can also extend from the bending area AC to the display area AA and light up the light-emitting sub-pixel of the display area AA.

[0077] S12: forming a bending protection layer 4 on a side of the routing layer 3 away from the flexible substrate 1, wherein the bending protection layer 4 extends from the bending area AC to the bonding area AD.

[0078] See also Figure 7 A bending protection layer 4 is formed on the side of the routing layer 3 away from the flexible substrate 1. The bending protection layer 4 extends from the bending area AC to the bonding area AD to protect the bending area AC. The material of the bending protection layer 4 may include ultraviolet light curing glue.

[0079] S13: bending the bending area AC to fold the bonding area AD to the back side of the display area.

[0080] Please see again Figure 1 The bending area AC is bent in a conventional manner so that the bonding area AD is folded to the back of the display area AA. A circuit board can be set in the bonding area AD, and the metal wiring of the wiring layer 3 can be connected to the circuit board.

[0081] S14: The bending area AC of the bent display panel is set on a jig 6, and the jig 6 heats the bending protection layer 4 to reduce the thickness of the bending protection layer 4 in the bending area, so that the thickness D1 of the bending protection layer 4 in the bending area AC is smaller than the thickness D2 of the bending protection layer 4 in the bonding area AD.

[0082] See also Figure 8 , the bending area AC of the bent display panel is set on a jig 6, and the bending protection layer 4 of the bending area AC is heated by the jig 6. The material of the bending protection layer 4 melts after being heated. After the bending protection layer 4 of the bending area AC melts, the bending protection layer 4 of the bending area AC can be thinned, and the bending protection layer 4 of the bonding area AD is not thinned, or the thinned thickness of the bending protection layer 4 of the bonding area AD is smaller than the thinned thickness of the bending protection layer 4 of the bending area AC. Therefore, the thickness D1 of the bending protection layer 4 in the bending area AC is smaller than the thickness D2 of the bending protection layer 4 in the bonding area AD. In this way, the neutral layer 2 of the bending area AC will move away from the flexible substrate 1, so that the wiring layer 3 is located at the position of the neutral layer 2, thereby greatly reducing the stress on the metal wiring in the wiring layer 3, making it difficult for the metal wiring in the bending area AC to break, and thus making it easier to light up the light-emitting sub-pixel of the display area AA.

[0083] In some possible implementations, the step of setting the bending region AC of the bent display panel on a jig 6 and causing the jig 6 to heat the bending protection layer 4 includes: setting the bending region AC of the bent display panel on a jig 6 and causing the jig 6 to heat the bending protection layer 4 for 45s-60s, for example, 45s, 50s, 55s, 58s or 60s. By controlling the heating time of the bending protection layer 4 in the bending region AC, the accuracy and efficiency of thinning the bending protection layer 4 in the bending region AC can be improved.

[0084] The step of setting the bending area AC of the bent display panel on a jig 6 and allowing the jig 6 to heat the bending protection layer 4 for 45s-60s includes: setting the bending area AC of the bent display panel on a jig 6 and allowing the jig 6 to heat the bending protection layer 4 at 80℃-100℃ for 45s-60s.

[0085] For example, the jig 6 generates 80°C to heat the bending protection layer 4 for 60s, the jig 6 generates 85°C to heat the bending protection layer 4 for 58s, the jig 6 generates 90°C to heat the bending protection layer 4 for 55s, the jig 6 generates 95°C to heat the bending protection layer 4 for 50s, and the jig 6 generates 100°C to heat the bending protection layer 4 for 45s. In this way, the heating time and heating temperature of the bending protection layer 4 in the bending area AC by the jig 6 can be precisely controlled to further improve the accuracy and efficiency of thinning the bending protection layer 4 in the bending area AC, so that the neutral layer 2 in the bending area AC can be more accurately adjusted to the routing layer 3.

[0086] For some possible implementations, see again Figure 8 The fixture 6 includes a heating area 61, and the heating area 61 is provided with an exhaust hole 62. Fig. 9 The step of setting the bending area AC of the bent display panel on a fixture 6 and allowing the fixture 6 to heat the bending protection layer 4 includes:

[0087] S141 : placing the bent region AC of the display panel on a jig 6 , and making the bending protection layer 4 in the bent region AC contact the heating area 61 of the jig 6 .

[0088] By making the bending protection layer 4 of the bending area AC directly contact with the heating zone 61 of the fixture 6, the temperature of the heating zone 61 of the fixture 6 can be more easily transferred to the bending protection layer 4 of the bending area AC, thereby making it easier to thin the bending protection layer 4 of the bending area AC.

[0089] S142 : heating the bending protection layer 4 to form a concave-convex structure 5 on a side of the bending protection layer 4 away from the flexible substrate 1 .

[0090] When the jig 6 is heating the bending protective layer 4 in the bending area AC, the exhaust holes 62 of the jig 6 can exhaust the bending protective layer 4 in the bending area AC. In this way, it is not only easier to thin the bending protective layer 4 in the bending area AC, but also possible to form a concave-convex structure 5 at the bending protective layer 4 in the bending area AC. The concave-convex structure 5 can further make it easier to adjust the neutral layer 2 in the bending area AC to the routing layer 3.

[0091] Preferably, the step of disposing the bent region of the bent display panel on a jig and causing the jig to heat the bending protection layer further includes:

[0092] While heating the bending protection layer 4 in the bending area AC, the bending protection layer 4 in the bonding area AD is also heated to thin the thickness of the bending protection layer 4 in the bonding area AD. The thinned thickness of the bending protection layer 4 in the bonding area AD is smaller than the thinned thickness of the bending protection layer 4 in the bending area AC.

[0093] In the process of heating the bending protection layer 4 in the bending area AC, the heat of the heating area 61 may be transferred to the bonding area AD, thereby also heating the bending protection layer 4 in the bonding area AD. Since the amount of heat transferred to the bonding area AD is less than the amount of heat in the bending area AC, the thickness of the bending protection layer 4 reduced in the bonding area AD is less than the thickness of the bending protection layer 4 reduced in the bending area AC, and finally the thickness D1 of the bending protection layer 4 in the bending area AC is less than the thickness D2 of the bending protection layer 4 in the bonding area AD.

[0094] For some possible implementations, see Fig.10 and Fig.11 The present application also provides a jig for preparing a display panel, which is used to prepare the display panel in the present application; the jig includes a jig body 601, a heating unit 64 and a power button 63.

[0095] A heating groove 6011 is provided on the jig body 601 , and a plurality of exhaust holes 62 connected to the heating groove 6011 are also provided in the jig body 601 . The shape of the heating groove 6011 matches the shape of the bending area AC of the display panel.

[0096] The heating unit 64 is disposed in the fixture body 601 , and the heating unit 64 provides heat for the heating groove 6011 . The power button 63 is disposed on the fixture body 601 , and the power button 63 is electrically connected to the heating unit 64 .

[0097] The heating groove 6011 is located in the heating area 61 of the fixture 6 , and the bending area AC of the display panel can be located at the heating groove 6011 , so as to heat the bending protection layer 4 in the bending area AC.

[0098] Fig.10 The positions and shapes of the power button 63 and the heating unit 64 are exemplary and do not limit the positions and shapes of the power button 63 and the heating unit 64. The circuit connection of the power button 63 and the heating unit 64 is known to those skilled in the art. The device for generating gas in the exhaust hole 62 and how to set the device are also known to those skilled in the art. For example, the exhaust device can be an exhaust fan, and the exhaust fan can be set in the fixture body 601.

[0099] Please see again Fig. 9 and Fig.10 When it is necessary to heat the bending protection layer 4 of the bending area AC of the display panel, the bending area AC of the display panel is set at the heating groove 6011, and then the power button 63 is pressed to turn on the power of the heating unit 64. After the heating unit 64 is powered on, the heat generated is transferred to the heating groove 6011, so that the bending area AC of the display panel can be heated.

[0100] During the process of heating the bending protective layer 4 in the bending area AC, the exhaust holes 62 of the jig 6 can exhaust the bending protective layer 4 in the bending area AC. In this way, it is not only easier to thin the bending protective layer 4 in the bending area AC, but also possible to form a concave-convex structure 5 at the bending protective layer 4 in the bending area AC. The concave-convex structure 5 can further make it easier to adjust the neutral layer 2 in the bending area AC to the routing layer 3.

[0101] Therefore, the fixture 6 can make the routing layer 3 be located at the position of the neutral layer 2, thereby greatly reducing the stress on the metal routing in the routing layer 3, making the metal routing in the bending area AC less likely to break, and making it easier to light up the luminous sub-pixel in the display area AA.

[0102] In some possible implementations, the present application further provides an electronic device, the electronic device including the display panel in the present application. The electronic device may include a device with image processing capabilities, such as a server, a personal computer, a laptop computer, etc. Since the electronic device includes the display panel in the present application, the reliability of the electronic device is higher.

[0103] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0104] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a non-display area, wherein the non-display area includes a bonding area folded to the back of the display area and a bending area between the bonding area and the display area; the display panel includes: Flexible substrate; a routing layer located on one side of the flexible substrate, the routing layer extending from the bonding area to the bending area; A bending protection layer is located on a side of the routing layer away from the flexible substrate, the bending protection layer extends from the bending area to the bonding area, and the thickness of the bending protection layer in the bending area is less than the thickness of the bending protection layer in the bonding area.

2. The display panel according to claim 1, characterized in that: In the bending region, along a direction perpendicular to the flexible substrate, the thickness of the bending protection layer ranges from 40 μm to 60 μm; Preferably, in the bending region, along a direction perpendicular to the flexible substrate, the thickness of the bending protection layer is uniformly set.

3. The display panel according to claim 1, characterized in that: In the bonding area, along a direction perpendicular to the flexible substrate, the thickness of the bending protection layer ranges from 70 μm to 110 μm; Preferably, in the bonding area, along a direction perpendicular to the flexible substrate, the thickness of the bending protection layer is uniformly set.

4. The display panel according to claim 1, characterized in that: In the bending area, a concave-convex structure is provided on a side of the bending protection layer away from the flexible substrate; Preferably, the concave-convex structure and the bending protection layer are formed integrally; Preferably, the material of the bending protection layer includes bending protection glue; Preferably, the bending protection adhesive comprises UV-curable adhesive.

5. A method for preparing a display panel, characterized in that: The method comprises: A flexible substrate is provided; the flexible substrate comprises a display area and a non-display area, the non-display area comprises a bonding area and a bending area between the bonding area and the display area; forming a wiring layer on one side of the flexible substrate, wherein the wiring layer extends from the bonding area to the bending area; forming a bending protection layer on a side of the routing layer away from the flexible substrate, wherein the bending protection layer extends from the bending area to the bonding area; Bending the bending area to fold the bonding area to the back side of the display area; The bending area of ​​the bent display panel is set on a jig, and the jig is used to heat the bending protection layer to reduce the thickness of the bending protection layer in the bending area, so that the thickness of the bending protection layer in the bending area is less than the thickness of the bending protection layer in the bonding area.

6. The method for preparing a display panel according to claim 5, characterized in that: The step of disposing the bent region of the bent display panel on a jig and causing the jig to heat the bending protection layer comprises: The bent region of the bent display panel is disposed on a jig, and the jig is used to heat the bending protection layer for 45s-60s.

7. The method for preparing a display panel according to claim 6, characterized in that: The step of setting the bent region of the bent display panel on a jig and causing the jig to heat the bending protection layer for 45s-60s comprises: The bent region of the bent display panel is disposed on a jig, and the jig is used to heat the bending protection layer at 80° C.-100° C. for 45 seconds-60 seconds.

8. The method for preparing a display panel according to claim 5, characterized in that: The jig includes a heating area, and the heating area is provided with an exhaust hole; the step of setting the bending area of ​​the bent display panel on a jig and allowing the jig to heat the bending protection layer includes: Disposing a bent region of the bent display panel on a jig, and making the bending protection layer of the bent region contact with a heating area of ​​the jig; heating the bending protection layer to form a concave-convex structure on a side of the bending protection layer away from the flexible substrate; Preferably, the step of disposing the bent region of the bent display panel on a jig and allowing the jig to heat the bending protection layer further includes: While heating the bending protection layer in the bending area, the bending protection layer in the bonding area is also heated to thin the thickness of the bending protection layer in the bonding area, and the thickness of the bending protection layer thinned in the bonding area is less than the thickness of the bending protection layer thinned in the bending area.

9. A jig for preparing a display panel, characterized in that: The jig is used to prepare the display panel according to any one of claims 1 to 4; the jig comprises: A jig body, wherein a heating groove is provided on the jig body, and a plurality of air extraction holes connected to the heating groove are also provided in the jig body, and the shape of the heating groove matches the shape of the bending area of ​​the display panel; A heating unit is disposed in the fixture body and provides heat for the heating groove.

10. An electronic device, characterized in that: The electronic device comprises the display panel described in any one of claims 1 to 4, or is prepared by the method for preparing a display panel described in any one of claims 5 to 8.

Images