Segmented interface that minimizes impact on parasitic forces of strain measurement based sensors

Abstract

In a particular embodiment, a sensing element deforms in response to application of a force to the force sensor device, the sensing element comprising three or more defined contact features configured to engage with a counterpart; and one or more sensing gauges coupled to a top surface of the sensing element and configured to generate a signal indicative of a degree to which the sensing element deforms in response to application of a force to the force sensor device; wherein the sensing element includes three or more defined contact features that engage with a counterpart.

Description

Technical Field Background Art

[0001] Force sensors are often used to control or regulate the force applied to a component. In one type of force sensor, the force sensor is positioned so that the force to be measured acts on the sensor. The force sensor can be configured to convert the force measurement into an electrical signal that is used to further control or regulate the force. This type of force sensor can be used in a variety of applications, such as for measuring the braking force of an electromechanical brake in an automobile. For example, a sensing element of the force sensor can be coupled to a component of the braking system, and when a force is applied, the sensing element temporarily deforms. In this example, the strain on the sensing element can be measured and used to generate an electrical signal that indicates the force acting on the component of the braking system. Summary of the invention

[0002] Embodiments of the present disclosure minimize the effects of parasitic forces for strain-based measurement sensors by providing three or more contact features on a sensing element of a force sensor device. The force sensor device can be, for example, an electromechanical brake force sensor or a pedal force sensor. In some examples, the contact feature is a defined support contact interface on a sensor support structure of the sensing element. In other examples, the sensing element includes an integrated contact area that is provided as a contact feature when engaged with a counterpart during sensor integration. The contact feature improves sensor accuracy by reducing the effects of parasitic forces on strain-based measurement sensing elements, such as sensing elements that include micro-fused strain gauges.

[0003] In a specific embodiment, a force sensor device is disclosed, the force sensor device including a sensing element that deforms in response to a force applied to the force sensor device, the sensing element including three or more defined contact features configured to engage with a counterpart. The force sensor device also includes one or more sensing gauges, the one or more sensing gauges coupled to the top surface of the sensing element and configured to generate a signal indicating the extent to which the sensing element deforms in response to the force applied to the force sensor device. In some examples, the three or more defined contact features decouple the integrated force from the force measured by the force sensor device. In some examples, the three or more defined contact features minimize the effects of parasitic forces. In some examples, the one or more sensing gauges are micro-fused strain gauges.

[0004] In some examples, the force sensor device also includes a printed circuit board configured to receive signals from one or more sensing gauges. In some examples, the force sensor device also includes a support structure having a surface to which the printed circuit board is coupled, the support structure having an outer edge, the outer edge of the support structure being attached to the sensing element. In some examples, the force sensor device also includes a sensor housing covering the printed circuit board, the sensor housing having an outer edge, the outer edge of the sensor housing being attached to the sensing element.

[0005] In a specific embodiment, a method of assembling a force sensor device is disclosed, the method comprising electrically coupling an electrical component of a printed circuit board (PCB) to a sensing element that deforms in response to a force applied to the force sensor device. In this example embodiment, the sensing element comprises three or more defined contact features configured to engage with a counterpart. The method also comprises coupling one or more sensing gauges to a top surface of the sensing element. The one or more sensing gauges are configured to generate a signal indicating the extent to which the sensing element deforms in response to the force applied to the force sensor device.

[0006] The foregoing and other objects, features, and advantages of the invention will be apparent from the following more particular description of exemplary embodiments of the invention, as illustrated in the accompanying drawings, wherein like reference numerals generally represent like parts of exemplary embodiments of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1A is a diagram illustrating an example electromechanical brake force sensor;

[0008] Figure 1B is shown when integrated with the counterpart Figure 1A Schematic diagram of an electromechanical braking force sensor;

[0009] Figure 2 is a diagram showing one example of a fully circular press-fit sensing element;

[0010] Figure 3A is a diagram showing a front view of a sensing element according to some embodiments of the present disclosure;

[0011] Figure 3B It shows Figure 3A a diagram of a top view of a sensing element of;

[0012] Figure 4A is a diagram showing a partial cross-sectional view of a force sensor device according to some embodiments of the present disclosure;

[0013] Figure 4B It shows Figure 4A An illustration of a perspective view of a force sensor device;

[0014] Figure 4C It shows Figure 4A A diagram of a top view of a force sensor device;

[0015] Figure 5A is a diagram illustrating an example pedal force sensor;

[0016] Figure 5B is shown inserted into the fixture Figure 5A an illustration of a cross-sectional view of an example pedal force sensor;

[0017] Figure 5C is used for Figure 5A An example sensing element of a pedal force sensor;

[0018] Figure 5D Shows Figure 5C Example non-limiting support contacts on the sensing element of;

[0019] Fig. 6A It shows the use of Figure 5C A diagram of the expected performance of the force sensor of the sensing element;

[0020] Figure 6B It shows the use of Figure 5C A diagram of the actual performance of the force sensor of the sensing element;

[0021] Figure 6C It shows the use of Figure 5C A diagram of the expected performance of the force sensor of the sensing element;

[0022] Fig.6D It shows the use of Figure 5C A diagram of the actual performance of the force sensor of the sensing element;

[0023] Fig. 7A is a diagram showing a perspective view of another sensing element according to some embodiments of the present disclosure;

[0024] Figure 7B To illustrate the use of some embodiments according to the present disclosure Fig. 7A an illustration of a perspective view of another force sensor device having a sensing element;

[0025] Figure 7C It shows Figure 7B A diagram of a top view of a force sensor device in FIG.

[0026] Figure 8 is a flow chart illustrating an implementation of a method for assembling a force sensor device according to an embodiment of the present disclosure; DETAILED DESCRIPTION

[0027] Advantages and other features of the systems and methods disclosed herein will become more apparent to those skilled in the art from the following detailed description of certain embodiments taken in conjunction with the accompanying drawings that illustrate representative embodiments of the invention.

[0028] In the description, throughout the drawings, common features are designated by common reference numerals. As used herein, different terms are used only for the purpose of describing a particular implementation and are not intended to be restrictive. For example, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to also include the plural forms. It will be further understood that the terms "comprise", "comprises", and "comprising" can be used interchangeably with "include", "includes", or "including". In addition, it should be understood that the term "wherein" can be used interchangeably with "wherein". As used herein, "exemplary" can indicate examples, implementations, and / or aspects, and should not be interpreted as limiting or indicating a preference or preferred implementation. As used herein, ordinal terms (e.g., "first," "second," "third," etc.) used to modify elements (such as structures, components, operations, etc.) do not in themselves indicate any priority or order of the element relative to another element, but merely distinguish the element from another element with the same name (but with respect to the use of the ordinal term). As used herein, the term "set" refers to a grouping of one or more elements, and the term "plurality" refers to a plurality of elements.

[0029] As used herein, "coupling" may include "communicative coupling", "electrical coupling" or "physical coupling", and may also (or alternatively) include any combination thereof. Two devices (or components) may be directly or indirectly coupled (e.g., communicatively coupled, electrically coupled, or physically coupled) via one or more other devices, components, wires, etc. Two electrically coupled devices (or components) may be included in the same device or different devices, and may be connected via electronic devices, one or more connectors, or inductive couplings, as illustrative, non-limiting examples. In some implementations, two devices (or components) that are communicatively coupled (e.g., in electrical communication) may, for example, directly or indirectly send and receive electrical signals (digital signals or analog signals) via one or more wires, buses, networks, etc. As used herein, "direct coupling" may include coupling (e.g., communicatively coupled, electrically coupled, or physically coupled) two devices without intermediate components.

[0030] Further, words defining orientation such as "upper," "lower," "inner," and "outer" are used only to help describe the position of components relative to each other. For example, an "inner" surface of a part is merely intended to describe a surface that is separate from an "outer" surface of the same part. No words indicating orientation are used to describe an absolute orientation (i.e., where an "inner" part must always be inside a part).

[0031] Note that the techniques herein are well suited for use in any type of sensor application, such as the force sensor assemblies discussed herein. However, it should be noted that the embodiments herein are not limited to use in such applications, and the techniques discussed herein are well suited for use in other applications as well.

[0032] The function of a pressure sensor is to convert the physical "fluid pressure" into a ratiometric output voltage. This is achieved by measuring the strain field changes on the sensing element due to the applied pressure using, for example, a micro-fused strain gauge (MSG). The same MSG technology can be used to measure force, since the applied force will also cause a strain field change on the sensing element of the sensor. Current MSG sensors have a uniform flat support or a circular outer diameter. This is generally not a problem for pressure sensors or force sensors with additional integrated parts to decouple the integrated force from the sensing element.

[0033] An important difference between pressure sensors and force sensors is that pressure is a scalar quantity and force is a vector quantity. Since force is a vector quantity, the force and support interface are more important because they affect the accuracy of the sensor. With the current trend of force sensors needing to become smaller due to cost and integration reasons, the effect of parasitic forces on the sensing element is an issue that is becoming increasingly difficult to resolve.

[0034] To address these and other issues, embodiments of the present disclosure minimize the effects of parasitic forces for strain measurement-based sensors by providing three or more contact features on the sensor's support structure. In some embodiments, a defined support contact interface on the sensor support structure of the sensing element is provided as a contact feature. In other embodiments, the sensing element includes an integrated contact area that is provided as a contact feature when engaged with a counterpart during sensor integration. The contact features improve sensor accuracy by reducing the effects of parasitic forces on a strain measurement-based sensing element, such as a sensing element that includes a micro-fused strain gauge.

[0035] In some examples of force sensors, brake force sensors are used for force measurement in calipers of electromechanical brake (EMB) systems. Figure 1AAn example of an EMB force sensor 100 is shown. The example EMB force sensor 100 includes a sensing element 102 and a reaction ring 104 coupled to an outer edge 106 of the sensing element 102. The example EMB force sensor may also include a printed circuit board 120, a support structure 122 for the printed circuit board 120, and a sensor housing 124, wherein the support structure 122 is coupled to one edge of the sensing element 102 and the sensor housing 124 is coupled to another edge of the sensing element.

[0036] In some examples, the sensing element 102 includes a micro-fused strain gauge (MSG). The MSG can be arranged in a Wheatstone bridge or other bridge circuit applications. The sensing element can generate output signals for a full-bridge circuit and a half-bridge circuit. When the sensor 100 is integrated with a corresponding component (e.g., a brake caliper), the reaction ring 104 decouples the integrated force from the sensing element 102. Figure 2 An example EMB force sensor 100 is shown when integrated into a brake caliper 108. The brake caliper 108 includes a housing 110 that engages a reaction ring 104. The reaction ring 104 decouples the force applied by the brake caliper housing 110 or other structure of the brake caliper 108 that engages the EMB sensor 100. Since the reaction ring 104 is an expensive part, removing the reaction ring 104 will result in a cheaper design. However, removing the reaction ring 104 means that another solution to decouple the integrated force from the sensing element 102 should be found.

[0037] Due to integration, forces may act on the supporting / integration surface. This can be attributed to coefficient of thermal expansion (CTE) mismatch, but also to the integration method, such as forming a press fit between the sensor and the counterpart. Figure 2 An example EMB sensor 200 utilizing a full circular press fit is depicted. The use of a full circular press fit can significantly affect the sensor output.

[0038] Figure 3A FIG. 3 is a diagram showing a sensing element 300 according to some embodiments of the present disclosure. Figure 3BA top view of an example sensing element 300 is given. In some examples, the sensing element 300 is suitable for use in an EMB brake sensor device as described above. The sensing element 300 is configured to deform in response to a force applied to a force sensor device (e.g., an EMB brake sensor device). In a specific embodiment, the sensing element 300 has a first surface arranged to receive a first force. The sensing element 300 deforms in response to the application of one or more forces on the force sensor device. In a specific embodiment, the sensing element 300 is a material piece that deforms in response to the application of force, such as a metal or plastic piece. For example, the sensing element 300 can be a metal disk or an annular metal disk. The sensing element 300 can include one or more steps, edges or lips (as depicted) for supporting stacked components (such as a printed circuit board (PCB) support structure, a sensor housing, or other components). Readers of ordinary skill in the art will recognize that the sensing element 300 can be produced using a variety of methods and techniques, including but not limited to turning and milling and metal injection molding.

[0039] The sensing element includes a sensing gauge (not shown) coupled to the sensing element 300. In a specific embodiment, the top surface of the sensing element 300 is prepared to provide a good attachment surface for the sensing gauge. For example, the top surface of the sensing element 300 can be sandblasted. Each of the sensing gauges is configured to generate a signal indicating the extent to which the sensing element 300 is deformed in response to the application of a force on the sensor. In a specific embodiment, the sensing gauge is a micro-fused strain gauge (MSG). In order to measure the amount of force applied to the sensing element, the sensing gauges can be evenly distributed on a circle on the top surface of the sensing element 300. Readers of ordinary skill in the art will recognize that any number of sensing gauges (including specific embodiments in which a single gauge is used as a sensing gauge) can be used in accordance with the present disclosure.

[0040] In some embodiments according to the present disclosure, sensor errors are reduced by minimizing parasitic forces on the sensing element due to integrated forces without the use of reaction rings or other additional integrated components as used in previous configurations. Compared to the use of reaction rings or other integrated components, in embodiments of the present disclosure, the sensing element includes a defined integrated contact area. The sensing element 300 includes a segmented press-fit feature rather than a fully circular press-fit structure. In one example, the segmented press-fit feature includes three or more defined segments. The segments include defined integrated contact areas 304, 306, 308 that engage with counterparts during integration. The defined (as opposed to undefined or unpredetermined) integrated contact areas can be placed so that the net integrated force on the sensing surface of the sensing element 300 is zero or near zero, thereby reducing errors in MSG measurements. In some examples, the defined integrated contact areas 304, 306, 308 protrude from the outer edge 320 of the sensing element 300. In one example, as Figure 3B As shown, at least one contact area 308 includes a first portion 310 and a second portion 312 separated by a gap 314. In this example, the first portion 310 and the second portion 312 are combined to form an integrated contact area 308. In one example, the segmented press-fit sensing element reduces the effect of error-generating forces. If there is a CTE mismatch between the sensor port material and the counterpart material, the three or more defined integrated contact areas 304, 306, 308 are also beneficial. Therefore, by utilizing three or more defined integrated contact areas 304, 306, 308 of a smaller segmented support interface and aligning them optimally with the gauge, the integration effect for the EMB force sensor is minimized without adding integrated parts or complex features or simply accepting larger errors.

[0041] Figure 4A FIG. 4 is a cross-sectional view of an example segmented press-fit EMB force sensor 400 according to some embodiments of the present disclosure. The force sensor 400 includes a sensing element 402 (eg, Figure 3A-3B ), the sensing element 402 has three or more integrated contact areas 408 protruding from the outer edge of the sensing element 402. Figure 4B The sensor element 402 includes integrated contact areas 406, 408 protruding from the outer edge of the sensor element 402. Figure 4A 4 is a perspective view of a force sensor 400. The gap defines two sections. Figure 4C The schematic diagram of the sensing element 402 includes integrated contact areas 404, 406, 408 protruding from the outer edge of the sensing element 402. Figure 4A 4. A top view of a force sensor 400 of FIG. 4. The gap defines two sections. The integrated contact area 408 may be composed of two separate parts 410, 412.

[0042] Another example force sensor is a pedal force sensor used to measure the force applied to a vehicle pedal (eg, a brake or accelerator). Figure 5A An example pedal force sensor 500 is depicted, and Figure 5B A cross section of a pedal force sensor 500 in a tool is depicted. The pedal force sensor 500 includes a sensing element 502 having a flat circular support area 504 that provides support between the sensing element 502 and a counterpart such as a fixture 506. Figure 5CA view of a sensing element 502 including a flat circular support region 504 is given. The sensing element 502 can be designed by finite element analysis (FEA). In an ideal situation or during simulation, there is uniform contact between the support region 504 and the counterpart. However, in practice, the interface between the support region and the counterpart is not consistent. Instead, the interface between the support region and the counterpart may appear at random undefined points on the support region. Figure 5D Undefined support positions 510, 512, 514 are shown. Depending on the position of those supports (relative to the gauge position x-axis), the error may be too high.

[0043] Fig. 6A A graph of sensor sensitivity versus global goniometer position is given for an ideal situation where there is uniform contact between the sensor support area 504 and the counterpart. Here, the readings from the full bridge and the two half bridge circuits overlap consistently. Figure 6B A graph of sensor sensitivity versus global angle gauge position for a "real world" situation where there is no uniform contact between the sensor support area 504 and the counterpart is given. Here, while the reading 620 from the full bridge is similar to the ideal case, the readings 622, 624 from each half bridge (FC1, FC2) vary greatly based on the angle of the gauge. Figure 6C A graph of the percent error (Fs) in the characterization results in the calibrators (FC1 and FC2) is given. Fig.6D A graph of the percentage error (Fs) of the characterization results in the application (FC1 and FC2) is given. For the full bridge (FC1 and FC2 combined), the difference between the characterization during testing and in the actual application is smaller, but by comparing the individual half-bridge signals (FC1 and / or FC2), there is a clear difference.

[0044] Fig. 7Ais a diagram showing another sensing element 700 according to some embodiments of the present disclosure. The sensing element 700 is suitable for a pedal force sensor as described above. The sensing element 700 is configured to deform in response to a force applied to a force sensor device (such as a pedal force sensor). In a specific embodiment, the sensing element 700 has a first surface arranged to receive a first force. The sensing element 700 deforms in response to one or more forces being applied to the force sensor device. In a specific embodiment, the sensing element 700 is a material piece that deforms in response to the application of force, such as a metal or plastic piece. For example, the sensing element 700 may be a metal disk or an annular metal disk. The sensing element 700 may include one or more steps, edges or lips (as depicted) for supporting stacked components (such as a printed circuit board (PCB) support structure, a sensor housing or other components). Readers of ordinary skill in the art will recognize that the sensing element 700 can be produced using a variety of methods and techniques, including but not limited to turning and milling and metal injection molding.

[0045] The sensing element includes a sensing gauge (not shown) coupled to the sensing element 700. In a specific embodiment, the top surface of the sensing element 700 is prepared to provide a good attachment surface for the sensing gauge. For example, the top surface of the sensing element 700 can be sandblasted. Each of the sensing gauges is configured to generate a signal indicating the extent to which the sensing element 700 is deformed in response to the application of a force on the sensor. In a specific embodiment, the sensing gauge is a micro-fused strain gauge (MSG). In order to measure the amount of force applied to the sensing element, the sensing gauges can be evenly distributed on a circle on the top surface of the sensing element 700. Readers of ordinary skill in the art will recognize that any number of sensing gauges (including specific embodiments in which a single gauge is used as a sensing gauge) can be used in accordance with the present disclosure.

[0046] The sensing element 700 further comprises a circular support area 708 at the base of the sensing element. A fixture (not shown here) engages with the support area 708 and supports the sensor device when the sensor device is inserted into the fixture.

[0047] In some embodiments according to the present disclosure, sensor errors are reduced by minimizing parasitic forces on the sensing element due to non-uniform forces acting on the support area of ​​the sensing element. In these embodiments, the sensing element 700 includes a defined support position. Figure 5AUnlike the flat circular support area 504 of the sensing element 502 depicted in FIG, the sensing element 700 of FIG7 includes three or more defined support contact areas 702, 704, 706 in the support area 708 of the sensing element 700. In some examples, the defined support contact areas 702, 704, 706 are protrusions in the support area 708. In some examples, the defined support contact areas 702, 704, 706 are machined into the sensing element 700. By providing the support contact areas 702, 704, 706 in the sensing element 700, the sensing gauge can be positioned so that the effects of parasitic forces are zero. This is Fig.6D The crossover points between the readings 620, 622, 624 in (i.e., the crossover points of the full bridge, first half bridge (FC1), and second half bridge (FC2) readings) are shown in Table 1. At this point, the half bridge gives the same output as the full bridge, and those contact / support positions will not change between the initial calibration and the application. Figure 7B Explained including Fig. 7A 704. FIG. 705 is a front view of an exemplary pedal force sensor device 750 showing a sensing element 700. Sensing element support region 708 includes support contact regions 702, 704. Figure 7B Given a combination Fig. 7A 700 of an exemplary pedal force sensor device 750. The support area 708 includes defined support contact areas 702, 704, 706.

[0048] To explain further, Figure 8 A flow chart is presented, which illustrates an implementation of a method of assembling a force sensor device according to an embodiment of the present disclosure. Figure 8 The method includes electrically coupling (802) an electrical component of a printed circuit board (PCB) to a sensing element that deforms in response to a force being applied to a force sensor device. Figure 8 In an example of , the sensing element includes three or more defined contact features configured to engage with a counterpart. Electrically coupling (802) the electrical components of the PCB to the sensing element may be performed by connecting an electrical connector (eg, bonding) from the PCB to the sensing element.

[0049] Figure 8 The method also includes coupling (804) one or more sensing meters to the top surface of the sensing element. Figure 8 In an example of the present invention, one or more sensing gauges are configured to generate a signal indicating an extent to which a sensing element deforms in response to application of a force to the force sensor device.

[0050] Figure 8The method includes attaching (806) a printed circuit board (PCB) having electrical components to a support structure. Attaching (806) the printed circuit board (PCB) having electrical components to the support structure can be performed by soldering or applying an adhesive, tape or glue to the bottom of the PCB of the support structure.

[0051] Figure 8 The method also includes attaching (808) a sensor housing to a printed circuit board, the sensor housing having an outer edge, the outer edge of the sensor housing being attached to the sensing element. Attaching (808) the sensor housing to the printed circuit board may be accomplished by coupling the sensor housing to the PCB.

[0052] The flowcharts and diagrams in the figures illustrate the architecture, functions and operations of possible implementations of the devices and methods according to different embodiments of the present disclosure. In some alternative implementations, the functions annotated in the blocks or steps of the method may not occur in the order annotated in the figures. For example, depending on the functions involved, two blocks shown in succession may actually be executed substantially simultaneously, or the blocks may sometimes be executed in reverse order.

[0053] The advantages and features of the present disclosure can be further described by the following statements:

[0054] 1. A force sensor device comprising: a sensing element that deforms in response to a force applied to the force sensor device, the sensing element comprising three or more defined contact features configured to engage with a counterpart; and one or more sensing gauges coupled to a top surface of the sensing element and configured to generate a signal indicating the extent to which the sensing element deforms in response to the force applied to the force sensor device.

[0055] 2. The force sensor device of statement 1, wherein the three or more defined contact features decouple the integrated force from the force measured by the force sensor device.

[0056] 3. A force sensor device according to statement 1 or 2, wherein the three or more defined contact features minimize the effects of parasitic forces.

[0057] 4. A force sensor device according to any of statements 1-3, wherein the three or more defined contact features are defined integrated contact areas protruding from an outer edge of the sensing element.

[0058] 5. A force sensor device according to any of statements 1-4, wherein the sensing element is a segmented press-fit sensing element.

[0059] 6. A force sensor device according to any of statements 1-5, wherein three or more defined contact features are defined as a support contact area.

[0060] 7. A force sensor device according to any of statements 1 to 6, wherein the three or more defined contact areas are protrusions in the support area of ​​the sensing element.

[0061] 8. A force sensor apparatus according to any of statements 1-7, wherein one or more of the sensing gauges is a micro-fused strain gauge.

[0062] 9. The force sensor device according to any one of statements 1 to 8 further includes: a printed circuit board, which is configured to receive signals from one or more sensing meters; a support structure, which has a surface, the printed circuit board is coupled to the surface, the support structure has an outer edge, and the outer edge of the support structure is attached to the sensing element; and a sensor housing covering the printed circuit board, the sensor housing having an outer edge, and the outer edge of the sensor housing is attached to the sensing element.

[0063] 10. A method for assembling a force sensor device, the method comprising: electrically coupling an electrical component of a printed circuit board (PCB) to a sensing element, the sensing element deforming in response to the application of force to the force sensor device, the sensing element comprising three or more defined contact features configured to engage with a counterpart; and coupling one or more sensing gauges to a top surface of the sensing element, the one or more sensing gauges being configured to generate a signal indicating the extent to which the sensing element deforms in response to the application of force to the force sensor device.

[0064] 11. The method of statement 10, wherein the three or more defined contact features decouple the integrated force from the force measured by the force sensor device.

[0065] 12. A method according to statement 10 or 11, wherein three or more defined contact features minimize the effects of parasitic forces.

[0066] 13. A method according to any of statements 10-12, wherein the three or more defined contact features are defined integrated contact areas, the defined integrated contact areas protruding from an outer edge of the sensing element.

[0067] 14. The method of any one of clauses 10-13, wherein the sensing element is a segmented press-fit sensing element.

[0068] 15. A method according to any of statements 10-14, wherein the three or more defined contact features are defined support contact areas.

[0069] 16. A method according to any of statements 10-15, wherein the three or more defined contact areas are protrusions in the support area of ​​the sensing element.

[0070] 17. The method of any of clauses 10-16, wherein one or more of the sensing gauges are micro-fused strain gauges.

[0071] 18. The method of any of statements 10-17, further comprising: coupling the PCB to a support structure, the support structure having an outer edge, the outer edge of the support structure being attached to the sensing element.

[0072] 19. The method of any of statements 10-18, further comprising coupling a sensor housing to a printed circuit board, the sensor housing having an outer edge, the outer edge of the sensor housing being attached to the sensing element.

[0073] 20. A method according to any of statements 10-19, wherein the sensing element is annular in shape.

[0074] One or more embodiments may be described herein by means of method steps that illustrate the performance of a specified function and its relationship. For ease of description, the boundaries and order of these functional building blocks and method steps have been arbitrarily defined herein. As long as the specific functions and relationships are properly performed, alternative boundaries and orders can be defined. Therefore, any such alternative boundaries or orders are within the scope and spirit of the claims. In addition, for ease of description, the boundaries of these functional building blocks are arbitrarily defined. As long as certain important functions are properly performed, alternative boundaries can be defined. Similarly, flow chart blocks can also be arbitrarily defined herein to illustrate certain important functions.

[0075] To the extent used, the flow diagram block boundaries and sequences could be otherwise defined and still perform the certain significant functionality. Such alternate definitions of functional building blocks and flow diagram blocks and sequences are thus within the scope and spirit of the claims.

[0076] It will be understood from the foregoing description that modifications and changes may be made in different embodiments of the present invention without departing from the true spirit of the present invention. The description in this specification is for illustrative purposes only and should not be interpreted as limiting. The scope of the present invention is limited only by the language of the appended claims.

Claims

1. A force sensor device, comprising: a sensing element that deforms in response to application of a force to the force sensor device, the sensing element comprising three or more defined contact features configured to engage a counterpart; as well as One or more sensing gauges coupled to a top surface of the sensing element and configured to generate a signal indicative of an extent to which the sensing element deforms in response to application of a force to the force sensor device.

2. The force sensor device according to claim 1, wherein: The three or more defined contact features decouple an integrated force from a force measured by the force sensor device.

3. The force sensor device according to claim 1, wherein: The three or more defined contact features minimize the effects of parasitic forces.

4. The force sensor device according to claim 1, wherein: The three or more defined contact features are defined integrated contact areas that protrude from an outer edge of the sensing element.

5. The force sensor device according to claim 4, wherein: The sensing element is a segmented, press-fit sensing element.

6. The force sensor device according to claim 1, wherein: The three or more defined contact features are defined support contact areas.

7. The force sensor device according to claim 6, wherein: The three or more defined contact areas are protrusions in the support area of ​​the sensing element.

8. The force sensor device according to claim 1, wherein: The one or more sensing gauges are micro-fused strain gauges.

9. The force sensor device of claim 1 , further comprising: a printed circuit board configured to receive the signals from the one or more sensing meters; a support structure having a surface to which the printed circuit board is coupled, the support structure having an outer edge, the outer edge of the support structure being attached to the sensing element; as well as A sensor housing covers the printed circuit board, the sensor housing having an outer edge, the outer edge of the sensor housing being attached to the sensing element.

10. A method of assembling a force sensor device, the method comprising: electrically coupling an electrical component of a printed circuit board (PCB) to a sensing element that deforms in response to application of a force to the force sensor device, the sensing element including three or more defined contact features configured to engage a counterpart; as well as One or more sensing gauges are coupled to a top surface of the sensing element, the one or more sensing gauges being configured to generate a signal indicative of an extent to which the sensing element deforms in response to application of a force to the force sensor device.

11. The method according to claim 10, wherein: The three or more defined contact features decouple an integrated force from a force measured by the force sensor device.

12. The method according to claim 10, wherein: The three or more defined contact features minimize the effects of parasitic forces.

13. The method according to claim 10, wherein: The three or more defined contact features are defined integrated contact areas that protrude from an outer edge of the sensing element.

14. The method according to claim 13, wherein: The sensing element is a segmented, press-fit sensing element.

15. The method according to claim 10, wherein: The three or more defined contact features are defined support contact areas.

16. The method according to claim 15, wherein: The three or more defined contact areas are protrusions in the support area of ​​the sensing element.

17. The method according to claim 10, wherein: The one or more sensing gauges are micro-fused strain gauges.

18. The method according to claim 10, further comprising: The PCB is attached to a support structure having an outer edge, the outer edge of the support structure being attached to the sensing element.

19. The method according to claim 10, further comprising: A sensor housing is attached to the PCB, the sensor housing having an outer edge, the outer edge of the sensor housing being attached to the sensing element.

20. The method according to claim 10, wherein: The sensing element is annular.

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