Power module and electronic device having the same

Abstract

A power module and an electronic device having the same are provided. The power module includes a power frame and a plurality of power chips. The power frame includes a plurality of base islands. Each base island comprises a chip welding part, a connecting part, a bending part, a platform part and a power pin which are sequentially connected in the width direction of the power module, and the chip welding part, the connecting part, the bending part, the platform part and the power pin are of an integrated structure. Each connecting part comprises at least one inclined edge, and the inclined edges, close to each other, of the two connecting parts of the adjacent base islands extend in the basically same direction. And the bending part is obliquely arranged relative to the platform part. The platform part of at least the middle base island in the plurality of base islands comprises a chamfer far away from one side of the power pin; and the orthographic projection of the edge of the chamfer of the platform part of one base island on the plane where the plurality of base islands are located and the orthographic projection of the edge of the bent part of another adjacent base island on the plane where the plurality of base islands are located extend along basically the same direction. The plurality of power chips are arranged on the chip welding parts of the plurality of base islands.

Description

Power module and electronic device having the same

[0001] This application claims priority to Chinese patent applications with application number 202223074596.9 filed on November 17, 2022, application number 202321049262.8 filed on April 28, 2023, and application number 202310495811.2 filed on April 28, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the technical field of electronic equipment, and in particular to a power module and an electronic device having the same. Background Art

[0003] Electronic devices often incorporate power modules to realize their functional applications. Encapsulated in a molded resin, these modules contain a power chip and a driver chip that drives it. With the increasing popularity of electronic devices, the demand for smaller power modules is increasing.

[0004] Summary of the Invention

[0005] On the one hand, a power module is provided, comprising a power frame and a plurality of power chips. The power frame comprises a plurality of base islands. Each base island comprises a chip welding portion, a connecting portion, a bending portion, a platform portion and a power pin connected in sequence along the width direction of the power module, and the chip welding portion, the connecting portion, the bending portion, the platform portion and the power pin are an integrated structure. The connecting portion comprises at least one oblique edge, and the mutually approaching oblique edges of the two connecting portions of adjacent base islands extend in substantially the same direction. The bending portion is arranged obliquely relative to the platform portion. The platform portion of at least the middle base island among the plurality of base islands comprises a chamfer away from the power pin side, and the orthographic projection of the chamfered edge of the platform portion of one base island on the plane where the plurality of base islands are located and the orthographic projection of the edge of the bending portion of another base island adjacent thereto on the plane where the plurality of base islands are located extend in substantially the same direction. The plurality of power chips are arranged on the chip welding portions of the plurality of base islands.

[0006] On the other hand, an electronic device is provided, comprising the above-mentioned power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] FIG1 is a plan view of a power module according to some embodiments of the present disclosure;

[0008] FIG2 is a structural diagram of multiple base islands according to some embodiments of the present disclosure;

[0009] FIG3 is another plan view of a power module according to some embodiments of the present disclosure;

[0010] FIG4 is a cross-sectional view of a power module according to some embodiments of the present disclosure;

[0011] FIG5 is a cross-sectional view of another power module according to some embodiments of the present disclosure;

[0012] 6-7 are schematic diagrams of a packaging process of a power module in the related art;

[0013] 8 is a structural diagram of an ejector pin supporting a power frame in a packaging mold according to some embodiments of the present disclosure;

[0014] FIG9 is a structural diagram of ejector pins detaching from a power frame in a packaging mold according to some embodiments of the present disclosure;

[0015] 10-12 are schematic diagrams of a packaging process according to some embodiments of the present disclosure;

[0016] FIG13 is a distribution diagram of a first residual portion in a power module according to some embodiments of the present disclosure;

[0017] FIG14 is a structural diagram showing adjacent first residual portions being tangent to each other in a power module according to some embodiments of the present disclosure;

[0018] FIG15 is another plan view of a power module according to some embodiments of the present disclosure;

[0019] FIG16 is a distribution diagram of the second residual portion in the power module according to some embodiments of the present disclosure;

[0020] FIG. 17 is a distribution diagram of first residual portions and second residual portions in a power module according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0021] The following will be combined with the accompanying drawings to clearly and completely describe some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0022] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0023] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0024] When describing some embodiments, the term "connected" and its derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the embodiments disclosed herein.

[0025] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0026] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0027] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. The exemplary embodiments disclosed herein should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0028] Electronic devices are often built with power modules to implement their functional applications. The power module may include a power frame carrying a power chip and a driver frame carrying a driver chip, and the power frame and the driver frame are encapsulated in a package formed of molded resin. The power frame of the power module may include multiple chip pads spaced apart, and each chip pad needs to be welded to a corresponding pin. However, in order to ensure sufficient welding strength, the size of the welding part between the chip pad and the corresponding pin is relatively large, resulting in a relatively large overall size of the power module, which cannot meet the requirements of the miniaturized design of the power module.

[0029] Based on this, an embodiment of the present disclosure provides a power module. As shown in Figures 1 to 5, the power module 10 includes multiple power chips 100 and a power frame 20. The power frame 20 includes multiple base islands 200, each of which includes a chip welding portion 210, a connecting portion 220, a bending portion 230, a platform portion 240, and a power pin 250 connected in sequence along the width direction Y of the power module 10. The chip welding portion 210, the connecting portion 220, the bending portion 230, the platform portion 240, and the power pin 250 form an integrated structure. The power chip 100 is arranged on the chip welding portion 210 of the base island 200.

[0030] It is understood that the power frame 20 can provide space for the placement of multiple power chips 100, thereby simplifying the placement of the multiple power chips 100 on the power frame 20 and making the assembly more stable. The number of power chips 100 placed on each base island 200 of the power frame 20 can be designed based on actual needs. For example, some base islands can be used to place lower bridge chips in the inverter circuit, while other base islands can be used to place upper bridge chips in the inverter circuit.

[0031] The die bonding portion 210 is configured to provide a location for the power chip 100 . The connection portion 220 is connected between the die bonding portion 210 and the bent portion 230 . The bent portion 230 is connected between the connection portion 220 and the platform portion 240 . One end of the power pin 250 is connected to the platform portion 240 .

[0032] Because the dimension of the connection portion 220 along the length direction X of the power module 10 is greater than the dimension of the die bonding portion 210 along the length direction X of the power module 10, to achieve a compact design of the power module 10, the connection portion 220 may include at least one oblique edge 221. The adjacent oblique edges 221 of two connection portions 220 of adjacent base islands 200 extend in the same or substantially the same direction, for example, parallel to each other. This reduces the distance between adjacent base islands 200, making the structure of the power frame 20 relatively compact and improving space utilization.

[0033] It should be noted that on the plane where the multiple base islands 200 are located, the extending direction of the integrated chip bonding portion 210, connecting portion 220, bent portion 230, platform portion 240, and power pin 250 is the width direction Y of the power module 10, and the arrangement direction of the multiple base islands 200 is the length direction X of the power module 10. The direction perpendicular to the plane where the multiple base islands 200 are located is the thickness direction Z of the power module 10. The thickness direction Z can be, for example, the direction from the power chip 100 to the power frame 20 or the opposite direction. The length direction X intersects with the width direction Y, for example, is perpendicular to it, and both the length direction X and the width direction Y are perpendicular to the thickness direction Z.

[0034] On this basis, the bending portion 230 is arranged to be inclined relative to the platform portion 240, and the platform portion 240 of at least the middle base island 200 among the multiple base islands 200 includes a chamfer 241 arranged on the side away from the power pin 250, and the orthographic projection of the edge of the chamfer 241 of the platform portion 240 of one base island 200 on the plane where the multiple base islands 200 are located and the orthographic projection of the edge of the bending portion 230 of another adjacent base island 200 on the plane where the multiple base islands 200 are located extend in the same or substantially the same direction, for example, parallel to each other.

[0035] It can be understood that, along the thickness direction Z of the power module 10 , the platform portion 240 is higher than the connecting portion 220 , and the bent portion 230 is connected between the platform portion 240 and the connecting portion 220 .

[0036] The bent portion 230 is tilted relative to the platform portion 240, meaning that the orthographic projection of the side of the bent portion 230 on the plane where the power chip 100 is located intersects the orthographic projection of the side of the platform portion 240 on the plane where the power chip 100 is located. For example, the angle between the orthographic projection of the side of the bent portion 230 on the plane where the power chip 100 is located and the orthographic projection of the side of the platform portion 240 on the plane where the power chip 100 is located is an obtuse angle, for example, between 100° and 170°.

[0037] In this way, it can be ensured that the bent portion 230 has a certain inclination angle relative to the platform portion 240, so that the bent portion 230 located between the connecting portion 220 and the platform portion 240 can be obliquely connected between the two. This not only avoids the increase in the size of the connecting portion 220 along the length direction X of the power module 10 due to the need to connect the connecting portion 220 and the platform portion 240, but also reduces the size of the connecting portion between the connecting portion 220 and the bent portion 230 along the length direction X of the power module 10, which is beneficial to improving the structural compactness of the power frame 20.

[0038] The side of the chamfer 241 of the platform portion 240 of one base island 200 and the side of the bent portion 230 of another adjacent base island 200 are parallel, which means that the orthographic projection of the side of the chamfer 241 of the platform portion 240 of one base island 200 on the plane where the power chip 100 is located and the orthographic projection of the side of the bent portion 230 of another adjacent base island 200 on the plane where the power chip 100 is located are parallel.

[0039] In this way, the inclined bend portion 230 of one base island 200 cooperates with the platform portion 240 with the chamfer 214 of the adjacent base island 200. While maintaining the insulation distance between the platform portion 240 and the bend portion 230, the platform portion 240 is brought closer to the connection portion 220 in the width direction Y of the power module 10. This reduces the overall size of the bend portion 230 and the platform portion 240 in the width direction Y of the power module 10, making the structure of the power frame 20 more compact. In this way, space utilization can be further improved, achieving a miniaturized design of the power module 10.

[0040] The chip welding part 210, the connection part 220, the bending part 230, the platform part 240 and the power pin 250 of the same base island 200 can be set into an integrated structure. For example, the base island 200 can be an integrally formed copper frame, and the chip welding part 210, the connection part 220, the bending part 230, the platform part 240 and the power pin 250 correspond to different parts of the copper frame. In this way, not only can the preparation steps of the power frame 20 be reduced and the production process of the power frame 20 be simplified, but also the connection strength between the chip welding part 210, the connection part 220, the bending part 230, the platform part 240 and the power pin 250 can be improved, so as to increase the reliability of the power frame 20 and thus improve its performance.

[0041] In the power module 10 provided in the embodiment of the present disclosure, a base island 200 composed of a chip welding portion 210, a connecting portion 220, a bending portion 230, a platform portion 240 and a power pin 250 is used as a function derivation structure of the power chip 100. This can reduce the distance between adjacent base islands 200 and the size of the base island 200 in the width direction Y of the power module 10, making the structural design of the power frame 20 more compact, thereby improving the space utilization of the power frame 20 and realizing the miniaturized design of the power module 10.

[0042] In some embodiments, as shown in Figures 1 and 2, the plurality of base islands 200 of the power frame 20 include a first base island 201, a second base island 202, a third base island 203, and a fourth base island 204. The first base island 201, the second base island 202, the third base island 203, and the fourth base island 204 are sequentially spaced apart in the length direction X of the power module 10. The second base island 202 and the third base island 203 are located between the first base island 201 and the fourth base island 204. The connecting portion 220 of the first base island 201 and the connecting portion 220 of the fourth base island 204 each include a bevel 221, and the connecting portion 220 of the second base island 202 and the connecting portion 220 of the third base island 203 each include two bevels 221. The bevels 221 of the two connecting portions 220 of adjacent base islands 200 that are adjacent to each other are parallel.

[0043] For example, the oblique side 221 of the connecting portion 220 of the first island 201 is parallel to the oblique side 221 of the connecting portion 220 of the second island 202 near the first island 201, the oblique side 221 of the connecting portion 220 of the second island 202 near the third island 203 is parallel to the oblique side 221 of the connecting portion 220 of the third island 203 near the second island 202, and the oblique side 221 of the connecting portion 220 of the third island 203 near the fourth island 204 is parallel to the oblique side 221 of the connecting portion 220 of the fourth island 204. Furthermore, the oblique sides 221 of each island 200 may all be parallel to one another. Alternatively, the oblique sides 221 of each island 200 may not be completely parallel.

[0044] In some embodiments, as shown in FIG1 , the platform portion 240 of the first base island 201, the platform portion 240 of the second base island 202, and the platform portion 240 of the third base island 203 all include chamfers 241. In the first base island 201, the second base island 202, and the third base island 203, the edge of the chamfer 241 of the platform portion 240 of one base island 200 is parallel to the edge of the bent portion 230 of another adjacent base island 200.

[0045] For example, the edge of the chamfer 241 of the platform portion 240 of the first base island 201 is parallel to the edge of the bent portion 230 of the second base island 202, the edge of the chamfer 241 of the platform portion 240 of the second base island 202 is parallel to the edge of the bent portion 230 of the third base island 203, and the edge of the chamfer 241 of the platform portion 240 of the third base island 203 is parallel to the edge of the bent portion 230 of the fourth base island 204.

[0046] It is understood that, along the length direction X of the power module 10, if no other base islands are provided on the side of the fourth base island 204 away from the third base island 203, the platform portion 240 of the fourth base island 204 may not be chamfered. Of course, if other base islands are provided on the side of the fourth base island 204 away from the third base island 203, the platform portion 240 of the fourth base island 204 may also be provided with a chamfer 241, and the bent portion of the other base island may also be inclined like the bent portion 230 of the fourth base island 204, thereby achieving a compact design of the power frame 20.

[0047] On this basis, as shown in FIG1 , along the length direction X of the power module 10, the power frame 20 may further include a plurality of pads 205 disposed on a side of the first base island 201 away from the second base island 202. The plurality of pads 205 also include a platform portion and a pin portion. The platform portion of the pad 205 closest to the first base island 201 is chamfered on a side away from the pin portion. The chamfer is parallel to the edge of the bent portion 230 of the first base island 201.

[0048] For example, the power frame 20 may include first to fourth base islands 201 to 204, and three pads 205 disposed on a side of the first base island 201 away from the second base island 202. The pins corresponding to the three pads 205 may be direct current (DC) input pins of the UVW phases in the power module 10, and the power pins 250 corresponding to the first to fourth base islands 201 to 204 may be DC output pins of the UVW phases in the power module 10.

[0049] Based on the above arrangement, by making the edge of the chamfer 241 of the platform portion 240 of one base island 200 parallel to the edge of the bent portion 230 of another adjacent base island 200, and making the edge of the chamfer of the platform portion of the solder pad closest to the first base island 201 parallel to the edge of the bent portion 230 of the first base island 201, the size of the power frame 20 in the width direction Y of the power module 10 can be reduced, making the structure of the power frame 20 more compact.

[0050] In some embodiments, as shown in FIG1 , the bent portions 230 of at least two of the plurality of base islands 200 are arranged in parallel. For example, at least two of the bent portions 230 of the first, second, third, and fourth base islands 201, 202, 203, and 204 are arranged in parallel. Thus, by arranging at least two of the bent portions 230 of the first, second, third, and fourth base islands 201, 202, 203, and 204 in parallel, the structural design of the power frame 20 can be simplified, and the structure of the power module 10 can be made compact.

[0051] For example, to make the structure of the power frame 20 more compact, the bent portions 230 of each base island 200, such as the bent portions 230 of the first base island 201, the second base island 202, the third base island 203, and the fourth base island 204, are all arranged in parallel. This can greatly simplify the structural design.

[0052] In some embodiments, as shown in Figures 1, 4 and 5, a plurality of power chips 100 can be arranged on the chip welding portion 210 of each base island 200 of the power frame 20. For example, the plurality of power chips 100 can include three first power chips, such as low-voltage power chips, and three second power chips, such as high-voltage power chips. The three first power chips can be respectively arranged on the first base island 201, the second base island 202 and the third base island 203, and the three second power chips can all be arranged on the fourth base island 204, and the three second power chips are arranged at intervals along the length direction X of the power module 10. That is, a first power chip is respectively arranged on the first base island 201, the second base island 202 and the third base island 203, and three second power chips are simultaneously arranged on the fourth base island 204.

[0053] In this way, the first base island 201, the second base island 202, and the third base island 203 provide space for the construction of low-voltage power chips, while the fourth base island 204 provides space for the construction of high-voltage power chips. Because multiple high-voltage power chips are integrated on the fourth base island 204, space is saved and the structural compactness of the power module 10 is improved. In addition, the spacing of the low-voltage power chips and the high-voltage power chips not only meets the power requirements of different circuits, but also prevents mutual interference between different power areas, thereby ensuring the stability and reliability of the power chips.

[0054] For example, the power chip 100 may include an IGBT (Insulated Gate Bipolar Transistor) chip, an FRD (Fast Recovery Diode) chip, two chips consisting of an IGBT chip and an FRD chip, or an RC-IGBT (Reverse-Conducting Insulated Gate Bipolar Transistor) chip in which the FRD chip is built into the IGBT chip. In this way, at least one of the IGBT chip, FRD chip, and RC-IGBT chip can be selected as needed, thereby improving the convenience of use.

[0055] In some embodiments, as shown in FIG1 , because multiple power chips 100 are disposed on the fourth island 204, the area of ​​the fourth island 204 is larger than the areas of the first island 201, the second island 202, and the third island 203. Considering that smaller islands are more easily bonded to the resin than larger islands during resin encapsulation of the power frame 20, at least the fourth island 204 is provided with at least one first through-hole 206 among the first island 201, the second island 202, the third island 203, and the fourth island 204. This ensures the strength of the island 200, which is comprised of the chip bonding portion 210, the connecting portion 220, the bent portion 230, the platform portion 240, and the power pins 250, while also enhancing the bonding between the island and the resin, thereby ensuring the reliability of the power frame 20.

[0056] For example, as shown in Figure 1, the area of ​​the fourth island 204 is larger than the area of ​​the first island 201, the area of ​​the first island 201, the area of ​​the second island 202, and the area of ​​the third island 203. The first island 201 and the fourth island 204 are located on both sides of the second island 202 and the third island 203, so the area of ​​the connecting portion of the first island 201 is larger than the area of ​​the connecting portion of the second island 202 and the area of ​​the connecting portion of the third island 203. In this case, a first through hole 206 is provided on both the fourth island 204 and the first island 201. One first through hole 206 can be provided on the first island 201, and multiple first through holes 206 can be provided on the fourth island 204. The first through hole 206 can be a long strip through hole, such as a waist-shaped hole. This ensures that the first through hole 206 has a sufficiently large opening, thereby further ensuring the reliability of the bonding between the island and the resin.

[0057] For example, one first through hole 206 may be provided on the first base island 201, and the first through hole 206 is located on a side of the connection portion 220 of the first base island 201 close to the chip bonding portion 210. For another example, a plurality of first through holes 206 may be provided on the fourth base island 204, one of the first through holes 206 being located on a side of the connection portion 220 of the fourth base island 204 close to the chip bonding portion 210, and any of the remaining first through holes 206 being located on a portion of the fourth base island 204 corresponding to an area between adjacent power chips 100.

[0058] It should be noted that the location of the first through hole 206 can be adjusted according to the design requirements of the power frame 20 or the structural design of the power module 10 , so that the power module 10 has a compact structure.

[0059] In some embodiments, as shown in FIG1 , a first notch 242 is provided on the platform portion 240 of the base island 200. The first notch 242 is provided at a position of the platform portion 240 near the bent portion 230, for example, at a position of the platform portion 240 adjacent to the connection between the bent portion and the platform portion 240. For example, the first notch 242 provided on the platform portion 240 may be a U-shaped notch.

[0060] In this way, by providing the first notch 242 on the platform portion 240 , the stamping stress generated when the power pins 250 are bent during the construction of the power frame 20 is released, thereby making the power frame 20 have higher structural strength and performance.

[0061] 1 , a second through hole 243 is provided on the platform portion 240 of the base island 200. The second through hole 243 is provided on a side of the platform portion 240 close to the power pin 250. For example, the second through hole 243 provided on the platform portion 240 may be a circular hole or an elliptical hole.

[0062] In this way, the provision of the second through-holes 243 can enhance the bonding between the base island and the resin, thereby ensuring the reliability of the power frame 20. Furthermore, the second through-holes 243 are provided on the side of the platform portion 240 near the power pins 250, that is, near the edge of the outward lead portion. This can prevent external air or moisture from entering the vicinity of the power chip 100 along the base island 200, thereby ensuring the reliability of the power chip 100. In addition, because the platform portion 240 is also configured to provide a location for soldering wires used to connect to the power chip 100, the second through-holes 243 are provided near the edge of the outward lead portion, avoiding the location of wire soldering.

[0063] In some embodiments, as shown in Figure 1 , an isolation portion 251 is provided on the power pin 250 of the base island 200, and the isolation portion 251 is provided near the connection between the isolation portion 251 and the platform portion. For example, the isolation portion 251 provided on the power pin 250 may include a plurality of parallel grooves.

[0064] In this way, the provision of the isolation portion 251 can increase the wettability of the power pin 250 to isolate external air or moisture from entering the vicinity of the power chip 100 along the base island 200 , thereby ensuring the reliability of the power chip 100 .

[0065] In some embodiments, as shown in FIG1 to FIG5 , the power module 10 may further include a driving frame 400 and a driving chip 300 . The driving chip 300 is used to drive the power chip 100 , thereby realizing the functions of the power module 10 .

[0066] The drive frame 400 may include a plurality of drive pins 500 spaced apart along the length direction X of the power module 10. The drive pins 500 and the power pins 250 are located on both sides of the power module 10 along the width direction Y thereof. The plurality of drive pins 500 and the plurality of power pins 250 are spaced apart along the length direction of the power module 10. The driver chip 300 may be disposed on the drive frame 400. That is, in addition to the plurality of drive pins 500, the drive frame 400 may also include a soldering portion for providing a soldering position for the driver chip 300.

[0067] The plurality of driving pins 500 and the soldering portion for providing a soldering location for the driver chip 300 can be an integral structure. For example, the plurality of driving pins 500 can be connected to the soldering portion of the driver frame 400. That is, the plurality of driving pins 500 and the aforementioned soldering portion together constitute the driver frame 400. This can make the connection structure of the driver frame more reliable, thereby ensuring the performance of the driver chip 300.

[0068] 1 to 5 , the power module 10 further includes a package 600 . The package 600 is disposed outside the driving frame 400 and the power frame 20 , and the free ends of the driving pins 500 and the free ends of the power pins 250 extend out of the package 600 .

[0069] Based on this, the package body 600 arranged on the outside of the driving frame 400 and the power frame 20 can provide protection, making the assembly of the driving frame 400 and the power frame 20 more reliable, and the driving chip 300 and the power chip 100 can be well protected, thereby improving the performance and reliability of the power module 10.

[0070] In some embodiments, as shown in Figures 3 and 4, the power module 10 may further include a heat sink 700 and an insulating resin layer 800. The insulating resin layer 800 is disposed on a side of the power frame 20 away from the power chip 100, and the heat sink 700 is disposed on a side of the insulating resin layer 800 away from the power frame 20. The bottom surface of the heat sink 700 away from the insulating resin layer 800 is flush with the bottom surface of the package 600, so that the bottom surface of the heat sink 700 is exposed at the bottom surface of the package 600.

[0071] For example, the heat sink 700 can be made of a metal material with good heat dissipation properties, and the insulating resin layer 800 can be made of an insulating resin material with good thermal conductivity. The insulating resin layer 800 is disposed between the heat sink 700 and the power frame 20. The edge of the insulating resin layer 800 is flush with the edge of the heat sink 700, and the bottom surface of the heat sink 700 is exposed by the package body 600. In this way, the insulating resin layer 800 can be used to transfer heat generated by the power chip 100 during operation to the heat sink 700, and the heat is then dissipated promptly through the heat sink 700. Therefore, while preventing current leakage, the power module 10 can ensure good heat dissipation, thereby improving the reliability and performance of the power module 10.

[0072] It should be noted that the power module 10 is a package structure obtained by encapsulating its main structure (including the driver frame 400, the driver chip 300, the power frame 20, and the power chip 100) using a molding method. For example, the main structure of the power module 10 can be placed in the cavity of the packaging mold, and then liquid resin can be injected into the cavity of the packaging mold. After the resin solidifies, the external package body 600 can be formed. The packaging effect of the packaging structure will affect the connection reliability between the frame and the chip it carries, and between the chips, and this connection reliability will further affect the performance of the power module 10.

[0073] In order to achieve a miniaturized design of the power module 10 while ensuring a good packaging effect, when packaging the main structure of the power module 10, it is necessary to design the distance d between the lower surface of the power frame 20 and the lower surface of the cavity of the packaging mold. The larger the distance d, the more conducive it is to filling the resin. However, in the related art, as shown in Figures 6 and 7, due to the fluidity of the resin, the power frame 20 will deform under the pressure of the resin, which will cause the distance d to decrease. At the same time, the thermal conductivity of the resin is low, resulting in poor heat dissipation of the packaging structure, making it easy for small holes to appear in the area of ​​the cavity that has become thinner due to the pressure of the resin, and the packaging is not utilized.

[0074] Based on this, as shown in Figures 8 and 9, the packaging mold 90 may include a cavity 900, an ejector plate 910 located below the cavity 900, a sleeve 920 located inside the cavity 900 and close to the ejector plate 910, and an ejector 930.

[0075] During the process of molding resin encapsulation of the power module 10, as shown in Figures 8 to 12, the ejector pins 930 in the encapsulation mold 90 can be used to pass through the ejector plate 910 and the sleeve 920 to support the power frame 20 in the thickness direction Z of the power module 10 from the bottom of the power frame 20 (the side away from the power chip 100), so that the power frame 20 will not be deformed by the pressure of the flowing resin, thereby avoiding the formation of small holes. When the resin begins to solidify, the ejector pins 930 begin to reset. After the encapsulation is completed, the encapsulation mold is completely removed, and multiple indentations will be formed on the lower surface of the encapsulation body 600. For example, the ejector pins 930 pass through the ejector plate 910 and the sleeve 920 and are fixed by the bottom plate. The oil circuit provides power to the ejector rod to eject the ejector pins 930; after the oil circuit power is cut off, the return spring or the reverse oil circuit action resets the ejector pins 930.

[0076] It is understood that the reset position of sleeve 920 and ejector pin 930 is generally higher than the lower surface of the mold cavity to prevent resin from filling into sleeve 920. As a result, two circular nested annular grooves are ultimately formed on the lower surface of package body 600 (sleeve 920 corresponds to the outer circle, and ejector pin 930 corresponds to the inner circle), which is referred to as first residual portion 62 below. In addition, ejector pin 930 is a retractable ejector pin design that initially supports power frame 20 during resin filling to prevent deformation. When resin filling is complete and pressure maintenance begins, it retracts to complete the entire molding process. Since the resin has been filled when ejector pin 930 retracts, the power frame 20 can be prevented from deformation.

[0077] Accordingly, as shown in Figures 4 and 13 , the package body 600 has a first surface 610 and a second surface 620. The first surface 610 is the surface of the package body 600 that is relatively far from the power chip 100, while the second surface 620 is the surface of the package body 600 that is relatively close to the power chip 100. The upper surface of the base island 200 (i.e., the surface close to the first surface 610) is used to mount the power chip 100, while the lower surface of the base island 200 (i.e., the surface close to the second surface 620) is the surface supported by the ejector pins 930 during the packaging process. A plurality of first residual portions 62 are provided on the second surface 620 of the package body 600. Along the thickness direction Z of the power module 10, each base island 200 corresponds to at least one first residual portion 62. Along the length direction X of the power module 10, the first residual portions 62 corresponding to two adjacent base islands 200 are staggered.

[0078] It is understood that the correspondence between the base island 200 and the first residual portion 62 means that, along the thickness direction Z of the power module 10, the orthographic projection of the first residual portion 62 on the base island 200 is located within the base island 200. The first residual portion 62 is essentially a dent left over from the packaging process. Therefore, the distribution of the first residual portion 62 on the package body 600 corresponds to the distribution of the support positions of the ejector pins in the packaging mold.

[0079] Here, the staggered arrangement of the first residual portions 62 corresponding to two adjacent base islands 200 means that, in the longitudinal direction X of the power module 10, the first residual portion 62 corresponding to one base island 200 and the first residual portion 62 corresponding to the other adjacent base island 200 are not located on the same straight line. Furthermore, if the same base island 200 corresponds to multiple first residual portions 62, these multiple first residual portions 62 may or may not be located on the same straight line, and this is not specifically limited here.

[0080] For example, along the thickness direction Z of the power module 10, the first base island 201, the second base island 202, and the third base island 203 may each correspond to one first residual portion 62, and the fourth base island 204 may correspond to two first residual portions 62. The two first residual portions 62 corresponding to the fourth base island 204 may be located on the same straight line. The first residual portion 62 may be, for example, a circular groove.

[0081] Based on the above design, as shown in Figures 13 and 14 , the first residual portions 62 corresponding to two adjacent base islands 200 are staggered along the length direction X of the power module 10. This prevents interference between adjacent counterbores of the ejector plate 910 during the packaging process (see Figure 14 ). This prevents the ejector pins 930 from damaging the ejector plate 910 when retracted, thereby ensuring the strength of the ejector plate without changing the distance between adjacent base islands 200 along the length direction X of the power module 10, thereby achieving a miniaturized design for the power module 10. Furthermore, the fourth base island 204 has a relatively large area. Therefore, the fourth base island 204 is disposed corresponding to the two first residual portions 62. Two ejector pins 930 can be used to support the fourth base island 204 during the packaging process, preventing the fourth base island 204 from tilting and maintaining its balance.

[0082] In some embodiments, as shown in FIG15 , along the width direction Y of the power module 10, the first residual portion 62 can be provided in a portion of the package body corresponding to the die bonding portion 210 away from the power pins 250. This prevents interference between the power pins 250 and the plurality of ejector pins 930 corresponding to the first residual portion 62 during the packaging process. Furthermore, the ejector pins 930 can be provided with support at locations on the base island 200 away from the power pins 250, thereby preventing the base island 200 from shifting in position.

[0083] In some embodiments, as shown in Figure 13 , the center-to-center distance d1 of the first residual portions 62 corresponding to two adjacent islands 200 along the width direction Y of the power module 10 is greater than or equal to 1.3 mm, i.e., d1 satisfies d1 ≥ 1.3 mm. Furthermore, / or, the minimum distance d2 of the first residual portions 62 corresponding to two adjacent islands 200 is greater than or equal to 3.292 mm, i.e., d2 satisfies d2 ≥ 3.292 mm. Based on the above design, the position of the ejector pins 930 can be optimized and adjusted to achieve the packaging of multiple islands 200 while using ejector pins 930 of the same specifications.

[0084] For example, the center distance d1 of the first residual portions 62 corresponding to two adjacent base islands 200 along the width direction Y of the power module 10 is 1.3 mm, 1.4 mm or 1.5 mm, and the minimum distance d2 of the first residual portions 62 corresponding to two adjacent base islands 200 is 3.292 mm, 3.293 mm or 3.294 mm.

[0085] For example, the first base island 201, the second base island 202, and the third base island 203 can each correspond to one first residual portion 62, and the fourth base island 204 can correspond to two first residual portions 62. The first residual portion 62 corresponding to the first base island 201 and the first residual portion 62 corresponding to the third base island 203 are located on the same straight line, and the first residual portion 62 corresponding to the second base island 202 and the two first residual portions 62 corresponding to the fourth base island 204 are located on another straight line. These two straight lines are parallel and 1.3 mm apart. When the diameter of the expanded hole of the ejector plate 910 is 4.5 mm, the position of the first residual portion 62 can be designed to avoid interference between adjacent expanded holes of the ejector plate 910, thereby ensuring the strength of the ejector plate to extend the service life of the packaging mold, and at the same time ensuring that the distance between adjacent base islands 200 in the length direction X and width direction Y of the power module 10 remains unchanged, thereby achieving a miniaturized design of the power module 10.

[0086] In some embodiments, as shown in FIG13 , the center-to-center distance d3 of the first residual portions 62 corresponding to two adjacent base islands 200 along the length direction X of the power module 10 is less than 4.5 mm, that is, d3 satisfies d3<4.5 mm. For example, the center-to-center distance d3 of the first residual portions 62 corresponding to two adjacent base islands 200 along the length direction X of the power module 10 is 4.5 mm, 4.3 mm, or 4.2 mm.

[0087] For example, when the diameter of the expanded hole of the ejector plate 910 is 4.5 mm, if the center distance d3 between the first residual portions 62 corresponding to two adjacent base islands 200 along the length direction X of the power module 10 is greater than or equal to 4.5 mm, there is no interference between the adjacent expanded holes, and the first residual portions 62 can be directly arranged along the length direction X of the power module 10. However, if the center distance d3 between the first residual portions 62 corresponding to two adjacent base islands 200 along the length direction X of the power module 10 is less than 4.5 mm, interference between the adjacent expanded holes will occur, and therefore the staggered design solution provided in the embodiments of the present disclosure needs to be adopted.

[0088] As a result, the center distance d3 between the first residual portions 62 of two adjacent islands 200 along the length direction X of the power module 10 is less than 4.5 mm, ensuring a compact design of the power module 10. Furthermore, the position of the first residual portion 62 can be designed based on the center distance d3 between the first residual portions 62 of two adjacent islands 200 along the length direction X of the power module 10 and the minimum distance d2 between the first residual portions 62 of two adjacent islands 200.

[0089] For example, the center distance d3 of the first residual portions 62 corresponding to two adjacent base islands 200 along the length direction X of the power module 10 is 4.3 mm, the minimum distance d2 of the first residual portions 62 corresponding to two adjacent base islands 200 is 3.292 mm, and the diameter of the expanded hole is 4.5 mm. Based on this, the distribution position of the first residual portions 62 can be designed to avoid interference between adjacent first residual portions 62 and realize the miniaturized design of the power module 10.

[0090] In some embodiments, as shown in FIG. 15 , a line connecting the centers of the first residual portions 62 corresponding to at least two base islands 200 among the plurality of base islands 200 may extend along the length direction X of the power module 10 .

[0091] Because the multiple base islands 200 are spaced apart along the length direction X of the power module 10, the centerline connecting the first residual portions 62 of at least two base islands 200 extends along the length direction X of the power module 10. Consequently, at least a portion of the first residual portions 62 lies on the same straight line. This portion of the first residual portion 62 can be located at the same distance from the straight line along the width direction Y of the power module 10, where the edges of the multiple base islands 200 near the drive frame 400 lie. This ensures that the force applied to these portions of the base islands 200 is uniformly distributed, thereby improving the uniformity of force applied to the power frame 20 and facilitating the reliable molding of the power module 10.

[0092] In some embodiments, as shown in FIG15 , the plurality of base islands 200 may include a plurality of odd-numbered base islands 200 (e.g., a first base island 201 and a third base island 203 ) and a plurality of even-numbered base islands 200 (e.g., a second base island 202 and a fourth base island 204 ), and the plurality of odd-numbered base islands 200 and the plurality of even-numbered base islands 200 are alternately arranged in the length direction X of the power module 10 . A line 63 connecting the centers of the first residual portions 62 corresponding to the plurality of odd-numbered base islands 200 and a line 64 connecting the centers of the first residual portions 62 corresponding to the plurality of even-numbered base islands 200 both extend in the length direction X of the power module 10 and are both located on the same side of a central axis 66 of the power module 10 in the width direction Y thereof.

[0093] For example, the plurality of odd-numbered base islands 200 include a first base island 201 and a third base island 203, and the plurality of even-numbered base islands 200 include a second base island 202 and a fourth base island 204. The first base island 201, the second base island 202, the third base island 203, and the fourth base island 204 are sequentially spaced apart in the length direction X of the power module 10. A line connecting the centers of the first residual portion 62 corresponding to the first base island 201 and the first residual portion 62 corresponding to the third base island 203 is located on a straight line, and a line connecting the centers of the first residual portion 62 corresponding to the second base island 202 and the first residual portion 62 corresponding to the fourth base island 204 is located on another straight line. These two straight lines are parallel to each other and extend along the length direction X of the power module 10, and are both located on the same side of the central axis of the power module 10 along its width direction.

[0094] The first residual portions 62 corresponding to the odd-numbered base islands 200 and the first residual portions 62 corresponding to the even-numbered base islands 200 are arranged alternately in the longitudinal direction X of the power module 10. The counterbores on the ejector plate 910 through which the ejector pins 930 pass correspond to the counterbores corresponding to the odd-numbered base islands 200 and the even-numbered base islands 200. Therefore, these counterbores on the ejector plate 910 are arranged alternately in the longitudinal direction X of the power module 10. This prevents stress concentration on the ejector plate 910, thereby ensuring the strength of the ejector plate 910. It also improves the uniformity of force applied to the power frame 20, which is beneficial to the molding reliability of the power module 10. In addition, the straight line connecting the centers of the first residual portion 62 corresponding to the first base island 201 and the first residual portion 62 corresponding to the third base island 203 and the straight line connecting the centers of the first residual portion 62 corresponding to the second base island 202 and the first residual portion 62 corresponding to the fourth base island 204 are both located on the same side of the central axis of the power module 10 along its width direction, so that all the first residual portions 62 are biased toward the same side of multiple base islands 200, thereby providing space for the arrangement of the power chip 100, which is beneficial to improving the carrying capacity of the power module 10.

[0095] In some embodiments, as shown in FIG15 , the first residual portions 62 corresponding to the even-numbered islands 200 may intersect the central axis of the power module 10 along its width, placing this portion of the first residual portion 62 adjacent to the central axis of the power module 10 to facilitate placement of the ejector pins 930 in the package mold. The first residual portions 62 corresponding to the odd-numbered islands 200 may be tangent to the edges of the islands 200 near the drive frame 400, ensuring good support.

[0096] In other embodiments, as shown in FIG15 , the first residual portions 62 corresponding to the odd-numbered islands 200 may intersect the central axis of the power module 10 along its width, placing this portion of the first residual portion 62 adjacent to the central axis of the power module 10 to facilitate placement of the ejector pins 930 in the package mold. The first residual portions 62 corresponding to the even-numbered islands 200 may be tangent to the edges of the islands 200 near the drive frame 400, placing this portion of the first residual portion 62 adjacent to the edge of the islands 200 to ensure good support.

[0097] Since the packaging effect of the power module 10 will affect its performance, in order to ensure that the power module 10 has a good packaging effect, during the packaging process, in addition to supporting it on the second surface 620 side of the package body 600 to prevent the power frame 20 from deforming, it can also be supported (pressed) on the first surface 610 side of the package body 600 to ensure the structural stability of the power frame 20.

[0098] Therefore, when encapsulating the main structure of the power module 10, the power frame 20 can also be supported (pressed) in the thickness direction Z of the power module 10 from above the power frame 20 (the side where the power chip 100 is provided) with the help of the ejector pins of the encapsulation mold, so that the power frame 20 can be supported in different directions to ensure the stability of the structure and position of the power frame 20, thereby facilitating the acceleration of the plastic encapsulation rate. Of course, during the encapsulation process, the ejector pins supporting the power frame 20 from above will also gradually reset when the resin begins to solidify. After the encapsulation is completed and the encapsulation mold is completely removed, multiple indentations will also be formed on the upper surface of the encapsulation body 600, namely the second residual portion 61 below. It can be seen that the first residual portion 62 and the second residual portion 61 are both indentations left on the surface of the encapsulation body 600 by the encapsulation process.

[0099] 5 , 16 , and 17 , a plurality of second residual portions 61 are provided on the first surface 610 of the package body 600. Along the thickness direction Z of the power module 10 , two base islands 200 located at opposite ends along the length direction X of the power module 10 correspond to one second residual portion 61 , respectively.

[0100] Among them, the second residual portion 61 only corresponds to two base islands 200 located at both ends along the length direction X of the power module 10 among the multiple base islands 200, that is, the ejector pins used to form the second residual portion 61 only press on the surfaces of the two base islands 200, so that pressure can be generated from above on the base islands 200 located on the outside.

[0101] It is understood that a plurality of first residual portions 62 are also disposed on the second surface 620 of the package body 600, and the arrangement and beneficial effects of the plurality of first residual portions 62 can be referred to in the above-described embodiment. Furthermore, the formation and shape of the second residual portions 61 are similar to those of the first residual portions 62 described above and will not be further described here.

[0102] In this way, during the packaging process of the power frame 20, it can be supported in different directions to ensure the structural and positional stability of the power frame 20, thereby facilitating a faster plastic packaging process. Furthermore, the front surface (i.e., first surface 610) of the package body 600 of the power module 10 configured in this manner can be formed using the same packaging mold as the front surface of the package body of a power module with other structures, such as a power module with a DBC (Direct Bond Copper) structure. This improves the versatility of the packaging mold, thereby shortening the R&D cycle and reducing R&D costs.

[0103] In some embodiments, as shown in Figures 15 to 17 , along the width direction Y of the power module 10, both the first residual portion 62 and the second residual portion 61 can be disposed on the side of the package body 600 corresponding to the die bonding portion 210 away from the power pins 250. This prevents interference between the power pins and the ejector pins corresponding to the first residual portion 62 and the second residual portion 61 during the packaging process. Furthermore, the ejector pins can be provided with support at locations on the base island 200 away from the power pins 250, thereby preventing the base island 200 from shifting in position.

[0104] In some embodiments, as shown in FIG17 , the plurality of base islands 200 may include a plurality of odd-numbered base islands 200 (e.g., a first base island 201 and a third base island 203 ) and a plurality of even-numbered base islands 200 (e.g., a second base island 202 and a fourth base island 204 ), and the plurality of odd-numbered base islands 200 and the plurality of even-numbered base islands 200 are alternately arranged in the length direction X of the power module 10 . A line 63 connecting the centers of the first residual portions 62 corresponding to the plurality of odd-numbered base islands 200 and a line 64 connecting the centers of the first residual portions 62 corresponding to the plurality of even-numbered base islands 200 both extend along the length direction X of the power module 10 , and a line 65 connecting the centers of the plurality of second residual portions 61 also extends along the length direction X of the power module 10 . On this basis, the center line 63 of the first residual parts 62 corresponding to multiple odd-numbered base islands 200 and the center line 64 of the first residual parts 62 corresponding to multiple even-numbered base islands 200 can both be located between the center line 65 of the multiple second residual parts 61 and the central axis 66 of the power module 10 along its width direction Y.

[0105] For example, the odd-numbered base islands 200 include a first base island 201 and a third base island 203, and the even-numbered base islands 200 include a second base island 202 and a fourth base island 204. The first base island 201, the second base island 202, the third base island 203, and the fourth base island 204 are sequentially spaced apart in the length direction X of the power module 10. The first base island 201, the second base island 202, and the third base island 203 may each correspond to one first residual portion 62, the fourth base island 204 may correspond to two first residual portions 62, and the first base island 201 and the fourth base island 204 may each correspond to one second residual portion 61. A center line 63 connecting the first residual portion 62 corresponding to the first base island 201 and the first residual portion 62 corresponding to the third base island 203 is located on a first straight line, a center line 64 connecting the first residual portion 62 corresponding to the second base island 202 and the first residual portion 62 corresponding to the fourth base island 204 is located on a second straight line, a center line 65 connecting the second residual portion 61 corresponding to the first base island 201 and the fourth base island 204 is located on a third straight line, and the first straight line and the second straight line are located between the third straight line and the central axis 66 of the power module 10 along its width direction Y.

[0106] Based on the above arrangement, multiple first residual portions 62 are staggered on the second surface 620 of the package body 600. Therefore, the counterbores on the ejector plate 910 through which the ejector pins 930 pass correspond to each first residual portion 62. These counterbores are also alternately arranged on the ejector plate in the longitudinal direction X of the power module 10. This prevents stress concentration on the ejector plate 910, thereby ensuring its strength and improving the uniformity of force applied to the power frame 20, which is beneficial for the molding reliability of the power module 10. Furthermore, multiple second residual portions 61 are arranged along the same straight line on the first surface 610 of the package body 600, so that the ejector pins corresponding to the second residual portions 61 are also arranged along the same straight line, thereby maintaining a balance of pressure from above. Furthermore, the center line 63 of the first residual parts 62 corresponding to the multiple odd-numbered base islands 200 and the center line 64 of the first residual parts 62 corresponding to the multiple even-numbered base islands 200 are located between the center line 65 of the multiple second residual parts 61 and the central axis 66 of the power module 10 along its width direction Y. This not only facilitates the arrangement of multiple pins on different sides of the power frame 20 during the packaging process, but also avoids interference between the power pins 250 and the pins corresponding to the multiple first residual parts 62 and the multiple second residual parts 61.

[0107] In some embodiments, as shown in FIG17 , the center-to-center distance d4 of the second residual portion 61 corresponding to the first island 201 and the second residual portion 61 corresponding to the fourth island 204 can be greater than the center-to-center distance d5 of the first residual portion 62 corresponding to the first island 201 and the first residual portion 62 corresponding to the fourth island 204, which is farthest from the first island 201. That is, d4>d5. In other words, along the length direction X of the power module 10, the center-to-center distance d4 of the two second residual portions 61 at the endmost portion is greater than the center-to-center distance d5 of the two first residual portions 61 at the endmost portion.

[0108] In this way, during the packaging process, it is possible to avoid the ejector pins corresponding to the two second residual portions 61 at both ends and the ejector pins corresponding to the two first residual portions 62 at both ends from completely overlapping in the thickness direction Z of the power module 10, thereby facilitating the positioning of the base island 200 within the package body 600.

[0109] In some embodiments, as shown in FIG17 , a second notch 67 and two blind holes 68 are respectively provided on both sides of the package body 600 along its length direction X. The second notch 67 and two blind holes 68 on one side of the package body 600 are symmetrical with the second notch 67 and two blind holes 68 on the other side of the package body 600 about the centerline of the package body 600 along its length direction X. The center of the second notch 67 is located on the central axis 66 of the power module 10 along its width direction Y, and the two blind holes 68 are located on the second surface 620 (back surface) of the package body 600 and are symmetrical with respect to the central axis 66 of the power module 10 along its width direction Y.

[0110] For example, the second notch 67 can be a U-shaped notch provided on both sides of the package body 600 along its length direction X, which passes through the power module 10 along the thickness direction Z; the blind hole 68 can be a circular shallow groove provided on the surface of the package body 600, and its depth can be less than the depth of the first residual portion 62.

[0111] Based on this, the center of the second notch 67 is located on the central axis 66 of the power module 10 along its width direction Y, which can facilitate the fixation of the package body 600. In addition, the two blind holes 68 are located on the second surface 620 (back surface) of the package body 600 and are symmetrical with respect to the central axis 66 of the power module 10 along its width direction Y. This can prevent damage to the package body 600 during the demolding process and prevent deformation of the package body 600.

[0112] For example, as shown in FIG17 , the intersection of the second notch 67 and the central axis 66 of the power module 10 along its width direction Y can be defined as point A, and the intersection of the line connecting the centers of the two blind holes 68 and the central axis 66 of the power module 10 along its width direction Y can be defined as point B. Point B is located between the center of the second notch 67 and point A. This facilitates demolding and avoids damage to the package body 600 during the demolding process, thereby extending the service life of the package mold and facilitating a miniaturized design of the power module 10.

[0113] The structure of the power module 10 is described below with reference to Figures 13 to 17. The power module 10 may include a power frame 20 and a drive frame 400, a power chip 100 located on the power frame 20, a drive chip 300 located on the drive frame 400, and a package body 600 located outside the power frame 20 and the drive frame 400. The power frame 20 may include a first base island 201, a second base island 202, a third base island 203, and a fourth base island 204 arranged in sequence along the length direction X of the power module 10, and each base island may include a chip welding portion 210, a connecting portion 220, a bending portion 230, a platform portion 240, and a power pin 250 connected in sequence along the width direction Y of the power module 10. The drive frame 400 may include a plurality of drive pins 500 arranged in sequence along the length direction X of the power module 10.

[0114] The package body 600 has a first surface 610 and a second surface 620 .

[0115] A plurality of first residual portions 62 are provided on the second surface 620 of the package body 600. Along the thickness direction Z of the power module 10, each island 200 corresponds to at least one first residual portion 62. Along the length direction X of the power module 10, the first residual portions 62 corresponding to two adjacent islands 200 are staggered. For example, along the thickness direction Z of the power module 10, the first island 201 corresponds to a first first residual portion 62, the second island 202 corresponds to a second first residual portion 62, the third island 203 corresponds to a third first residual portion 62, and the fourth island 204 corresponds to a fourth first residual portion 62 and a fifth first residual portion 62.

[0116] A plurality of second residual portions 61 are provided on the first surface 610 of the package body 600. Along the thickness direction Z of the power module 10, two of the plurality of base islands 200 located at the ends along the length direction X of the power module 10 correspond to a second residual portion 61, respectively. The plurality of second residual portions 61 are arranged along the length direction X of the power module 10 and lie on the same straight line. For example, along the thickness direction Z of the power module 10, the first base island 201 corresponds to the first second residual portion 61, and the fourth base island 204 corresponds to the second second residual portion 61.

[0117] Accordingly, during packaging of the main structure of the power module 10, along the thickness direction Z of the power module 10, the ejector plate corresponding to the first surface 610 (front) of the package body 600 is formed with counterbores corresponding to the first and second second residual portions 61, and the ejector plate corresponding to the second surface 620 (back) of the package body 600 is formed with counterbores corresponding to the first, second, third, fourth, and fifth first residual portions 62. This not only prevents interference between the counterbores of the ejector plate, but also prevents tilting of the fourth base island 204.

[0118] In the description of the present disclosure, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature therebetween. A first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is at a higher level than the second feature.

[0119] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation.

[0120] Although the embodiments of the present disclosure have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

[0121] Those skilled in the art will understand that the scope of the disclosure of the present invention is not limited to the specific embodiments described above, and that certain elements of the embodiments may be modified and replaced without departing from the spirit of the present application. The scope of the disclosure of the present application is limited by the appended claims.

Claims

1. A power module, comprising: A power frame comprising a plurality of base islands; the base islands comprising a chip welding portion, a connecting portion, a bending portion, a platform portion and a power pin sequentially connected along the width direction of the power module, wherein the chip welding portion, the connecting portion, the bending portion, the platform portion and the power pin are an integrated structure; and A plurality of power chips are arranged on the chip bonding portions of the plurality of base islands; In which, the connecting portion includes at least one oblique edge, and the mutually approaching oblique edges of the two connecting portions of adjacent base islands extend in basically the same direction; the bending portion is inclined relative to the platform portion; the platform portion of at least the middle base island among the multiple base islands includes a chamfer away from the side of the power pin, and the orthographic projection of the edge of the chamfer of the platform portion of one base island on the plane where the multiple base islands are located and the orthographic projection of the edge of the bending portion of another adjacent base island on the plane where the multiple base islands are located extend in basically the same direction.

2. The power module according to claim 1, wherein: The plurality of base islands include a first base island, a second base island, a third base island and a fourth base island; the first base island, the second base island, the third base island and the fourth base island are sequentially spaced in the length direction of the power module; The connecting portion of the first base island and the connecting portion of the fourth base island each include a hypotenuse, the connecting portion of the second base island and the connecting portion of the third base island each include two hypotenuses, and the mutually adjacent hypotenuses of the two connecting portions of adjacent base islands are parallel.

3. The power module according to claim 2, wherein: The area of ​​the fourth base island is greater than the area of ​​the first base island, the area of ​​the second base island, and the area of ​​the third base island; Among the first base island, the second base island, the third base island and the fourth base island, at least the fourth base island is provided with at least one first through hole.

4. The power module according to claim 3, wherein: A first through hole is provided on the first base island, and the first through hole is located on a side of the connection portion of the first base island close to the chip soldering portion; and / or A plurality of first through holes are arranged on the fourth base island; some of the plurality of power chips are arranged on the fourth base island; one of the plurality of first through holes is located on a side of the connection portion of the fourth base island close to the chip welding portion, and any one of the remaining first through holes is located in a portion of the area between adjacent power chips corresponding to the fourth base island.

5. The power module according to any one of claims 2 to 4, wherein: The platform portion of the first base island, the platform portion of the second base island, and the platform portion of the third base island include chamfers; In the first base island, the second base island, and the third base island, the chamfered side of the terrace portion of one base island is parallel to the side of the bent portion of another adjacent base island.

6. The power module according to any one of claims 1 to 5, wherein: The bent portions of at least two base islands among the plurality of base islands are arranged in parallel.

7. The power module according to any one of claims 1 to 6, wherein: The platform portion includes a first notch, and the first notch is arranged at a position of the platform portion close to the bending portion; and / or The platform portion includes a second through hole, and the second through hole is arranged on a side of the platform portion close to the power pin; and / or The power pin includes an isolation portion, which is adjacent to a connection between the power pin and the platform portion and is configured to isolate external air and moisture.

8. The power module according to any one of claims 1 to 7, further comprising: A driving frame comprising a plurality of driving pins spaced apart along the length direction of the power module; the driving pins and the power pins are located on both sides along the width direction of the power module; A driving chip is arranged on the driving frame; as well as The packaging body is arranged outside the driving frame and the power frame, and the free ends of the driving pins and the free ends of the power pins extend out of the packaging body.

9. The power module according to claim 8, further comprising: an insulating resin layer, disposed on a side of the power frame away from the power chip; as well as The heat sink is arranged on a side of the insulating resin layer away from the power frame, and the bottom surface of the heat sink away from the insulating resin layer is flush with the bottom surface of the package body, so that the bottom surface of the heat sink is exposed at the bottom surface of the package body.

10. The power module according to claim 1, further comprising: A package body, packaged outside the plurality of base islands and having a first surface and a second surface; one end of the power pin is located within the package body, and the other end extends out of the package body; The plurality of power chips are arranged on surfaces of the plurality of base islands close to the first surface; A plurality of first residual portions are provided on the second surface of the package body; along the thickness direction of the power module, each base island corresponds to at least one first residual portion; along the length direction of the power module, the first residual portions corresponding to two adjacent base islands are staggered.

11. The power module according to claim 10, wherein: A center distance d1 between the first residual portions corresponding to two adjacent base islands along the width direction of the power module satisfies d1≥1.3 mm; and / or The minimum distance d2 between the first residual parts of two adjacent base islands satisfies d2 ≥ 3.292 mm; and / or A center distance d3 of the first residual portions corresponding to two adjacent base islands along the length direction of the power module satisfies d3<4.5 mm.

12. The power module according to claim 10 or 11, wherein: Along the width direction of the power module, the first residual portion is provided at a portion of the package body corresponding to the chip bonding portion on a side away from the power pin.

13. The power module according to claim 10 or 11, wherein: A line connecting centers of the first residual portions corresponding to at least two of the plurality of base islands extends along a length direction of the power module.

14. The power module according to claim 13, wherein: The plurality of base islands include a plurality of odd-numbered base islands and a plurality of even-numbered base islands; the plurality of odd-numbered base islands and the plurality of even-numbered base islands are alternately arranged in the length direction of the power module; A center line connecting the first residual portions corresponding to the odd-numbered base islands and a center line connecting the first residual portions corresponding to the even-numbered base islands both extend along the length direction of the power module and are located on the same side of the central axis of the power module along its width direction.

15. The power module according to claim 14, wherein: A plurality of second residual portions are provided on the first surface of the package body; along the thickness direction of the power module, two base islands located at both ends along the length direction of the power module among the plurality of base islands respectively correspond to one second residual portion.

16. The power module according to claim 15, wherein: The first residual portion and the second residual portion are both arranged at a portion of the package body corresponding to the chip bonding portion on a side away from the power pin.

17. The power module according to claim 15 or 16, wherein: The center lines of the multiple second residual parts extend along the length direction of the power module; the center lines of the first residual parts corresponding to the multiple odd-numbered base islands and the center lines of the first residual parts corresponding to the multiple even-numbered base islands are located between the center lines of the multiple second residual parts and the central axis of the power module along its width direction.

18. The power module according to any one of claims 15 to 17, wherein: The plurality of base islands include a first base island, a second base island, a third base island and a fourth base island sequentially arranged along the length direction of the power module; The plurality of first residual portions include a first first residual portion corresponding to the first base island, a second first residual portion corresponding to the second base island, a third first residual portion corresponding to the third base island, and a fourth first residual portion and a fifth first residual portion corresponding to the fourth base island; The plurality of second residual portions include a first second residual portion corresponding to the first base island and a second second residual portion corresponding to the fourth base island.

19. The power module according to claim 18, wherein: The plurality of power chips include three first power chips and three second power chips; The three first power chips are respectively arranged on the first base island, the second base island and the third base island; the three second power chips are all arranged on the fourth base island and are spaced apart along the length direction of the power module.

20. The power module according to claim 18, wherein: A center distance d4 between the first second residual portion and the second second residual portion is greater than a center distance d5 between the first first residual portion and the fifth first residual portion.

21. An electronic device comprising the power module according to any one of claims 1 to 20.

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