Drought-resistant thinning-free precision seeding method and equipment for dry farming millet

Through the technology of forming spacer bonding rings and water inlet holes on the mulch, the problem of waste and growth difficulties in millet sowing in arid areas is solved, and the precision sowing and efficient utilization of water resources are achieved, ensuring the normal growth of millet .

CN119183744AActive Publication Date: 2024-12-27GRAIN RES INST HEBEI ACAD OF AGRI & FORESTRY SCI
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Patent Information

Application Number
CN202411621808.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-14
Publication Date
2024-12-27
Estimated Expiration
2044-11-14

AI Technical Summary

Technical Problem

In arid areas, it is difficult for the existing technology to ensure the smooth emergence of millet without increasing the seeding volume, and there is a waste of excess seedlings, and how to ensure the normal growth of millet under drought conditions is a challenge.

Method used

By applying glue liquid on the soil side of the plastic film to form a bonding ring arranged at intervals, the bonding points arranged at intervals in the bonding ring, the bonding points adhere to the grain seeds, and hammering and puncture on the bonding ring to form Planting belts and water inlet holes achieve precision sowing and efficient utilization of water resources.

Benefits of technology

The smooth emergence of millet without increasing the seed volume is achieved, reducing the waste of water resources, improving the drought resistance of millets, and ensuring the normal growth of millets.

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Abstract

The invention belongs to the field of millet planting methods, and particularly relates to a drought-resistant thinning-free precision sowing method and equipment for dry farming millet, and the sowing method comprises the following steps: carrying out land leveling operation on field soil after rotary tillage; the soil attaching side of the mulching film to be laid is coated with glue liquid along rows, a set of bonding rings arranged at intervals are formed on the soil attaching side through the glue liquid, and bonding points arranged at intervals are included in the bonding rings; the grain seeds are bonded through the bonding points; the method comprises the following steps: laying a mulching film, covering the mulching film with soil on two sides of the mulching film to press the mulching film and form a retaining wall, hammering and pressing the parts, provided with bonding rings, of the mulching film, and puncturing along the bonding rings and the middle parts of the bonding rings, so that grooves are formed in the bonding rings, water inlet holes are formed in the middle parts of the grooves, the bonding rings arranged along the row form a planting belt, and seeding is completed. According to the method, smooth seedling emergence of the millet can be guaranteed on the premise of not increasing the seeding rate, precision seeding is achieved, thinning work is omitted, and good drought resistance is achieved.
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Description

Technical Field

[0001] The invention belongs to the field of millet planting methods, and in particular relates to a drought-resistant and thinning-free precision sowing method and equipment for dryland millet. Background Art

[0002] Millet is a small-grain crop with poor soil-penetrating ability. In order to ensure a sufficient germination rate, a sowing method of increasing the sowing amount and densely planting in rows is usually adopted. After germination, the excess seedlings need to be artificially thinned out, which is time-consuming and labor-intensive, and wastes millet seeds and water and fertilizer resources, especially in arid areas where fresh water resources are scarce. Fresh water resources are scarce, and the growth of excess seedlings causes a waste of the originally scarce fresh water. On the other hand, how to carry out drought resistance work in arid areas to ensure the normal growth of millet is also a problem to be solved by technical personnel in this field. Summary of the invention

[0003] In order to solve the problems existing in the above-mentioned prior art, the present invention provides a drought-resistant and thinning-free precision sowing method and equipment for dryland millet, which can ensure the smooth emergence of millet without increasing the sowing amount, realize precision sowing, eliminate the work of thinning, and has good drought resistance, fully utilizes water resources, reduces the waste of water resources, and ensures the normal growth of millet.

[0004] The specific technical solution adopted by the present invention is:

[0005] A drought-resistant and thinning-free precision sowing method for dryland millet, which mainly comprises the following steps:

[0006] S1. Leveling the field soil after rotary tillage;

[0007] S2, coating the adhesive on the soil-facing side of the ground film to be laid along the line, so that the adhesive forms a group of adhesive rings arranged at intervals on the soil-facing side, wherein the adhesive rings include adhesive points arranged at intervals in sequence along the contour of the adhesive rings;

[0008] S3, the grain seeds are adhered by the bonding points on the ground film;

[0009] S4. Lay the mulch film with its soil-adhering side facing the ground in the field, cover the mulch film with soil on both sides to form a retaining wall, then hammer the part of the mulch film where the adhesive ring is provided, and puncture along the contour of the adhesive ring and in the middle of the adhesive ring to form a groove with a water inlet hole in the middle at the adhesive ring, form a planting belt between the adhesive rings arranged along the row, and complete the sowing.

[0010] The row spacing between the planting belts is 35-50 cm, and the planting belts are arranged with equal row spacing or with wide and narrow rows.

[0011] A sowing equipment is used to implement the above-mentioned drought-resistant and thinning-free precision sowing method for dryland millet, comprising a frame, a film spreading roller, a glue coating roller, a seed delivery unit, a soil covering unit and a hammer pressing unit which are sequentially arranged on the frame along the direction of film conveying. The glue coating roller is provided with a group of glue outlet parts in a ring-shaped structure which are arranged in a circular array along the glue coating roller. The glue outlet part includes a group of glue outlet points which are arranged at intervals along the contour of the ring structure. The glue coating roller uses the glue outlet points to apply glue to the soil-adhering side of the film to form bonding points. The seed delivery unit provides millet seeds to the film and makes the millet seeds adhere to the bonding points on the soil-adhering side.

[0012] The seed delivery unit includes a seed bin, a lifting rod matched with a bonding point, and an air blowing unit connected to the lifting rod. The lifting rod is connected to the seed bin and has the freedom to rise and fall in the seed bin. When the ground film passes through the seed delivery unit, the soil side is arranged downward. The lifting rod is a hollow tubular structure. A seed supporting plate is arranged at the end of the lifting rod. The air blowing unit is connected to the lifting rod and drives the grain seeds on the seed supporting plate to be thrown upward to adhere to the bonding point.

[0013] The glue coating roller is located above the ground film, the seed delivery unit is located below the ground film, a reversing roller is arranged between the glue coating roller and the seed delivery unit, the ground film is arranged with the soil side facing upward after being unfolded by the film spreading roller, and the ground film is arranged with the soil side facing downward after passing through the reversing roller.

[0014] The seed supporting disc is a rubber disc.

[0015] The hammer pressing unit comprises a rotating wheel and a pressing hammer arranged on the rotating wheel along the circumferential direction. The lower end of the pressing hammer is provided with piercing rods arranged at intervals along the contour of the bonding ring and a piercing protrusion corresponding to the center of the bonding ring.

[0016] The soil covering unit comprises a group of soil covering plates respectively arranged on both sides of the ground film.

[0017] The beneficial effects of the present invention are:

[0018] The present invention adopts the method of coating glue on the soil-adhering side of the ground film so that the glue forms a group of bonding points on the soil-adhering side, and the grain seeds are adhered by the bonding points to control the sowing amount and realize precision sowing; a plurality of bonding rings arranged at intervals are formed between the bonding points, that is, the grain seeds are arranged in a ring shape, the ground film is laid and hammered to make the grain seeds contact with the soil, and a plurality of holes are punctured in the soil and on the ground film to facilitate the emergence of the grain seeds; a water inlet hole is punctured in the middle of the bonding ring on the ground film, and the soil covering both sides of the ground film forms a retaining wall, the bonding ring is located between the two retaining walls on both sides of the ground film, and the retaining wall cooperates with the ground film to form a ridge ditch, and the accumulated water in the ridge ditch can enter the ground film along the water inlet hole and be absorbed by the soil around the grain seeds, thereby improving the utilization of water and reducing the waste of water resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A top view of the seed drill used in the present invention;

[0020] Figure 2 The state diagram of the seeder laying the mulch film in the main viewing direction;

[0021] Figure 3 for Figure 2 A magnified schematic diagram of the local A in the middle;

[0022] Figure 4 It is the axonometric view of the rubber coating roller;

[0023] Figure 5 This is the front view of the seed sending unit;

[0024] Figure 6 for Figure 5 A cross-sectional view along the BB direction;

[0025] Figure 7 It is a schematic diagram of the assembly of the upper support roller and the lower support roller;

[0026] Figure 8 This is the state diagram of the ground film after passing through the glue roller;

[0027] In the attached drawings, 1, ground film, 2, soil-adhering side, 3, bonding ring, 4, bonding point, 5, film spreading roller, 6, glue coating roller, 7, seed delivery unit, 8, soil covering unit, 9, hammer pressing unit, 10, glue discharge unit, 11, glue discharge point, 12, seed bin, 13, lifting rod, 14, blowing unit, 15, seed support plate, 16, rotating wheel, 17, pressing hammer, 18, puncture protrusion, 19, reversing roller, 20, puncture rod, 21, upper support roller, 22, lower support roller. DETAILED DESCRIPTION

[0028] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments:

[0029] Embodiment 1, a drought-resistant and thinning-free precision sowing method for dryland millet, the key is that it comprises the following steps:

[0030] S1. Level the field soil after rotary tillage to improve the flatness of the field ground;

[0031] S2, coating glue along the soil-facing side 2 of the mulch film 1 to be laid, so that the glue forms a group of adhesive rings 3 arranged at intervals on the soil-facing side 2, and the adhesive rings 3 include adhesive points 4 arranged at intervals in sequence along the contour of the adhesive rings 3; the glue can be starch glue, which is inexpensive, non-toxic and soluble in water, and does not affect the normal germination of grain seeds;

[0032] Each bonding ring 3 may be provided with 2-6 bonding points 4, and the bonding points 4 are arranged in a circular array on the bonding ring 3; by controlling the diameter of the bonding points 4, each bonding point 4 can only adhere to one grain seed;

[0033] S3, the grain seeds are adhered by the bonding points 4 on the ground film 1; each bonding point 4 can adhere to one grain seed, and the grain seeds are arranged along the bonding ring 3 on the ground film 1 with the help of the bonding points 4 to form a plurality of spaced sowing rings, and the sowing quantity of the grains and the spacing between the grains can be effectively controlled with the help of the bonding points 4;

[0034] S4, make the soil-contacting side 2 of the ground film 1 face the ground in the field and lay the ground film 1, cover the ground film 1 with soil on both sides to press the ground film 1 and form a retaining wall, then hammer the part of the ground film 1 where the adhesive ring 3 is provided, and at the same time puncture along the contour of the adhesive ring 3 and puncture in the middle of the adhesive ring 3 respectively; puncturing along the adhesive ring 3 can press the seeds on the adhesive ring 3 into the soil, and pierce holes in the soil and the ground film to facilitate the germination of the millet seeds, and can achieve the arching of the ground film 1 when the sowing amount and the seedling amount are the same, that is, the millet seedlings emerge smoothly, and the gap between the millet plants after emergence meets the growth needs of the millet, and there is no need for thinning; puncturing in the middle of the adhesive ring 3 can form a groove at the adhesive ring 3 and the middle of the groove has a water inlet hole, and the adhesive ring 3 arranged along the row is a planting belt to complete the sowing. With the help of the retaining walls on both sides, furrows are formed on the ground film 1 to facilitate water retention. Rainwater and irrigation water in the furrows enter the soil below the ground film 1 through the water inlet holes, are absorbed by the soil around the grain seeds, and are fully utilized, thereby achieving drought-resistant sowing.

[0035] There is no soil covering the top of the ground film 1 corresponding to the adhesive ring 3, which reduces the pressure on the grain seeds and facilitates germination; on the other hand, the overall performance of the punctured ground film is greatly weakened and puncture holes are formed on it. After the hammering is completed, the soil falls back and only the floating soil above the seeds is covered, which can be easily arched out of the soil by the millet seedlings and out of the ground film along the puncture holes. The smooth emergence of millet seedlings can be achieved without increasing the sowing amount.

[0036] In this embodiment, the planting belts are evenly spaced, and the row spacing between the planting belts is 45 cm.

[0037] The drought-resistant and non-thinning precision sowing method of dryland millet is implemented by means of a sowing device, such as Figure 1 , Figure 4As shown, the sowing equipment includes a frame, a film spreading roller 5, a glue coating roller 6, a seed delivery unit 7, a soil covering unit 8 and a hammer pressing unit 9 which are sequentially arranged on the frame along the conveying direction of the ground film. The glue coating roller 6 is provided with a group of glue discharge parts 10 in a ring structure which are arranged in a circular array along the glue coating roller 6. The glue discharge part 10 includes a group of glue discharge points 11 arranged at intervals along the contour of the ring structure. The glue coating roller 6 applies glue to the soil-adhering side 2 of the ground film 1 by means of the glue discharge points 11 to form bonding points 4. The seed delivery unit 7 provides grain seeds to the ground film 1 and makes the grain seeds adhere to the bonding points 4 on the soil-adhering side 2.

[0038] A reversing roller 19 is provided between the glue coating roller 6 and the seed delivery unit 7 .

[0039] like Figure 2 , Figure 3 , Figure 8 As shown, when working, the film spreading roller 5 spreads the ground film 1, and the soil-adhering side 2 of the ground film 1 is set upward when the film spreading roller 5 is spread. The glue coating roller 6 is located above the ground film 1, and the glue coating roller 6 rotates with the spreading of the ground film 1. The glue outlet 10 on the glue coating 6 contacts the soil-adhering side 2 of the ground film 1 in turn, and the glue discharged from the glue outlet point 11 forms a bonding point 4 on the soil-adhering side 2, and a plurality of bonding rings 3 arranged at intervals are formed between the bonding points 4. Then, the ground film 1 is reversed by the reversing roller 19, so that the soil-adhering side 2 with the bonding ring 3 is set toward the ground and passes above the seed delivery unit 7;

[0040] like Figure 5 , Figure 6 As shown, the seed delivery unit 7 includes a seed bin 12, a lifting rod 13 and a blowing unit 14 connected to the lifting rod 13. In this embodiment, the blowing unit 14 is an air pump and an air pipe. The air pump is connected to the lifting rod 13 by means of the air pipe. The lifting rod 13 is connected to the seed bin 12 and has the freedom to rise and fall in the seed bin 12. The lifting rod 13 is a hollow tubular structure. A seed supporting plate 15 is provided at the end of the lifting rod 13, wherein the seed supporting plate 15 is a rubber plate. In the initial state, the bottom of the seed supporting plate 15 is concave downward, which can support the grain seeds and prevent the grain seeds from falling. The lifting rod 13 is raised, and the seed supporting plate 15 supports the grain seeds to make the grain seeds rise. The blowing unit 14 is connected to the lifting rod 13. When the seed supporting plate 15 approaches the soil-attached side 2, the blowing unit 14 blows air into the lifting rod 13, and the seed supporting plate 15 bulges outward to throw the grain seeds upward. The grain seeds contact with the bonding point 4 to form adhesion, and the excess grain seeds fall back into the seed bin 12 under their own gravity. One bonding ring 3 may correspond to one larger lifting rod 13, or one bonding ring 3 may correspond to multiple lifting rods 13, that is, one bonding point 4 may correspond to one smaller lifting rod 13. In this embodiment, one bonding ring 3 may correspond to multiple lifting rods 13.

[0041] As a further improvement, the bottom edge of the inner cavity of the seed bin 12 is chamfered, and the inner cavity of the seed bin 12 has a structure that is larger at the top and smaller at the bottom due to the chamfer. The grain seeds in the seed bin 12 slide to the bottom along the slope formed by the chamfer and gather together. The lifting rods 13 are all arranged in the bottom plane of the inner cavity of the seed bin 12 to prevent the lifting rods 13 from being unloaded.

[0042] As a further improvement, Figure 2 , Figure 7 As shown, an upper support roller 21 and a lower support roller 22 are further arranged at the rear of the seed delivery unit 7, wherein the lower support roller 22 forms an avoidance with the bonding point 4 and contacts with both sides of the ground film 1, and the upper support roller 21 and the lower support roller 22 match to clamp the ground film 1 and convey it, to prevent the ground film 1 from deflecting and causing the grain seeds to collide with the lower support roller 22 and fall off, and at the same time, it can ensure that the ground film 1 is in a horizontal state when passing through the seed delivery unit 7, and the grain seeds can effectively contact with the bonding point 4 to achieve adhesion;

[0043] Then the ground film 1 falls to the ground and is laid in the field. The covering unit 8 includes a group of covering plates respectively arranged on both sides of the ground film 1. The covering plates move at the position where the ground film 1 is not laid to cover the soil on both sides of the ground film 1 for preliminary fixation to prevent the ground film 1 from being lifted. The soil forms two rows of retaining walls on both sides of the ground film 1, and ridges are formed between the retaining walls.

[0044] Finally, the bonding ring 3 is hammered by the hammering unit 9, as shown in FIG. Figure 2 As shown, the hammer pressing unit 9 includes a rotating wheel 16 and a pressing hammer 17 arranged on the rotating wheel 16 along the circumferential direction. The lower end of the pressing hammer 17 is provided with a piercing rod arranged at intervals along the bonding ring 3 and a piercing protrusion 18 corresponding to the center of the bonding ring 3. The piercing rod 20 is matched with the bonding point 4. The cam 16 moves, so that the heavy hammer 17 drops when passing above the bonding ring 3, and the bonding ring 3 of the ground film 1 is hammered downward, so that the seeds adhered to the bonding ring 3 form a close contact with the soil, and at the same time, the soil below the bonding ring 3 sinks to form a groove. Due to the gravity of the glue and the grain seeds, the ground film 1 at the bonding ring 3 sinks and fits the groove, and the depth of the groove is about 1 cm; the heavy hammer 17 and When the ground film 1 contacts, the puncture protrusion 18 pierces the ground film 1 to form a water inlet hole in the adhesive ring 3, and the puncture rod 20 presses the ground film 1 down along the adhesive ring 3 at multiple points to press the grain seeds adhered to the ground film 1 into the soil. At the same time, multiple holes are formed on the ground film 1 and the tillage layer, so that the ground film 1 and the tillage layer are in the shape of sieve holes. When the heavy hammer 17 rises, the puncture rod 20 is pulled out. During the pulling out process, the floating soil on the upper layer of the field slides above the grain seeds, which has little pressure on the grain seeds and is convenient for the millet seedlings to sprout. The millet seedlings can drill out of the ground film 1 along the holes on the ground film 1; irrigation water or precipitation is stored in the ridge furrow and absorbed by the soil around the grain seeds along the water inlet hole, thereby improving the utilization rate of water for the grain seeds and achieving drought-resistant sowing.

[0045] The number of piercing rods 20 can be greater than the number of bonding points 4, that is, the density of the piercing rods 20 on the pressing hammer 17 is increased to prevent position errors between the piercing rods 20 and the bonding points 4, ensuring that the piercing rods 20 can effectively press the grain seeds on the bonding points 4 into the soil.

[0046] Example 2 is basically the same as Example 1, except that the planting belts are arranged in wide and narrow rows, with the wide row being 50 cm and the narrow row being 35 cm.

Claims

1. A drought-resistant and thinning-free precision sowing method for dryland millet, characterized in that: The following steps are involved: S1. Leveling the field soil after rotary tillage; S2, coating glue along the soil-facing side (2) of the ground film (1) to be laid, so that the glue forms a group of adhesive rings (3) arranged at intervals on the soil-facing side (2), wherein the adhesive rings (3) include adhesive points (4) arranged in sequence at intervals along the contour of the adhesive rings (3); S3, the grain seeds are adhered by the bonding points (4) on the ground film (1); S4, the ground film (1) is laid with the soil-contacting side (2) facing the ground in the field, and the ground film (1) is covered with soil on both sides of the ground film (1) to cover the ground film (1) and form a retaining wall, and then the part of the ground film (1) where the adhesive ring (3) is provided is hammered, and the adhesive ring (3) is punctured along the contour and in the middle of the adhesive ring (3) to form a groove with a water inlet hole in the middle of the adhesive ring (3), and a planting belt is formed between the adhesive rings (3) arranged along the row, and sowing is completed.

2. The drought-resistant and thinning-free precision sowing method for dryland millet according to claim 1, characterized in that: The row spacing between the planting belts is 35-50 cm, and the planting belts are arranged with equal row spacing or with wide and narrow rows.

3. A sowing equipment for implementing the drought-resistant and thinning-free precision sowing method for dryland millet according to claim 1, comprising a frame, characterized in that: The machine also comprises a film spreading roller (5), a glue coating roller (6), a seed delivery unit (7), a soil covering unit (8) and a hammer pressing unit (9) which are sequentially arranged on the frame along the conveying direction of the ground film. The glue coating roller (6) is provided with a group of glue delivery parts (10) in a ring-shaped structure which are arranged in a circular array along the circumference of the glue coating roller (6). The glue delivery part (10) comprises a group of glue delivery points (11) arranged at intervals along the contour of the ring-shaped structure. The glue coating roller (6) applies glue to the soil-adhering side (2) of the ground film (1) by means of the glue delivery points (11) to form bonding points (4). The seed delivery unit (7) provides seeds to the ground film (1) and makes the seeds adhere to the bonding points (4) on the soil-adhering side (2).

4. A sowing device according to claim 3, characterized in that: The seed delivery unit (7) comprises a seed bin (12), a lifting rod (13) matched with the bonding point (4), and a blowing unit (14) connected to the lifting rod (13); the lifting rod (13) is connected to the seed bin (12) and has the freedom to rise and fall in the seed bin (12); the ground film (1) is arranged with the soil-adhering side (2) downward when passing through the seed delivery unit (7); the lifting rod (13) is a hollow tubular structure; a seed supporting plate (15) is arranged at the end of the lifting rod (13); the blowing unit (14) is connected to the lifting rod (13) and drives the grain seeds on the seed supporting plate (15) to be thrown upward to adhere to the bonding point (4).

5. A sowing device according to claim 4, characterized in that: The glue coating roller (6) is located above the ground film (1), and the seed delivery unit (7) is located below the ground film (1). A reversing roller (19) is arranged between the glue coating roller (6) and the seed delivery unit (7). After the ground film (1) is unfolded by the film spreading roller (5), the soil-adhering side (2) is arranged upward, and after the ground film (1) passes through the reversing roller (19), the soil-adhering side (2) is arranged downward.

6. A sowing device according to claim 4, characterized in that: The seed supporting plate (15) is a rubber plate.

7. A sowing device according to claim 3, characterized in that: The hammer pressing unit (9) comprises a rotating wheel (16), a pressing hammer (17) arranged on the rotating wheel (16) along the circumferential direction, and a piercing rod (20) arranged at intervals along the contour of the bonding ring (3) and a piercing protrusion (18) corresponding to the center of the bonding ring (3) are arranged at the lower end of the pressing hammer (17).

8. A sowing device according to claim 3, characterized in that: The soil covering unit (8) comprises a group of soil covering plates respectively arranged on both sides of the ground film (1).

Citation Information

Patent Citations

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