A fully automatic loading and unloading device

Abstract

The fully automatic loading and unloading device provided by the present invention includes a lifting and grasping structure, a conveying mechanism, a tray pushing assembly, a tray pushing mechanism and a controller, wherein the conveying mechanism is connected to the lifting and grasping structure, and the conveying mechanism is located below the strip-shaped opening, the controller is electrically connected to the first motor, and the controller is electrically connected to the conveying motor. Through the coordinated work of the lifting and grasping structure, the conveying mechanism, the tray pushing assembly and the tray pushing mechanism, in conjunction with the remaining processing and testing equipment, the fully automated processing of the IC tray from storage, transportation and processing is realized, which greatly improves the automation level of the production line and the integration and compactness of the equipment, reduces manual intervention and errors caused by human factors, improves production efficiency and accuracy, and improves product quality and consistency.

Description

Technical Field

[0001] The present invention relates to the field of fully automatic loading and unloading devices, and in particular to a fully automatic loading and unloading device. Background Art

[0002] At present, in the existing technology, the equipment cannot achieve full automation, and can only achieve semi-automation at best. The semi-automated equipment is also redundant and complicated, or bulky. The production of the equipment requires long-term manual participation, which is inefficient. Summary of the invention

[0003] The present invention aims to at least solve the technical problems existing in the prior art or related technology.

[0004] To this end, a first aspect of the present invention provides a fully automatic loading and unloading device.

[0005] In view of this, the first aspect of the present invention provides a fully automatic loading and unloading device, including: a lifting and grasping structure, a strip opening is provided on one side of the lifting and grasping structure; a conveying mechanism, the conveying mechanism is connected to the lifting and grasping structure, and the conveying mechanism is located below the strip opening; a controller, the controller is electrically connected to the lifting and grasping structure, and the controller is electrically connected to the conveying mechanism; wherein, the lifting and grasping structure is used to transport and grasp the IC material tray in the vertical direction, the vertical direction is a straight line direction parallel to the direction of gravity, and the conveying mechanism is used to transport the IC material tray in the horizontal direction, and the horizontal direction is a straight line direction perpendicular to the direction of gravity.

[0006] In addition, the fully automatic loading and unloading device in the above technical solution provided by the present invention may also have the following additional technical features:

[0007] In some technical solutions of the present invention, optionally, the lifting and grabbing structure includes: a first sub-plate bracket, the first sub-plate bracket is provided with a square opening; a third sub-plate bracket, the number of the third sub-plate bracket is two, and the two third sub-plate brackets are respectively connected to the two sides of the first sub-plate bracket; a second sub-plate bracket, the second sub-plate bracket is provided with a strip opening, the second sub-plate bracket is connected to the conveying mechanism, and the two sides of the second sub-plate bracket are respectively connected to the side of the third sub-plate bracket away from the first sub-plate bracket; a feeding door, the feeding door is detachably connected to the first sub-plate bracket, and the feeding door is located at the square opening. The shape of the square opening matches the shape of the feed door; a tray lifting assembly, the tray lifting assembly is electrically connected to the controller, the tray lifting assembly is located at a first height, and the tray lifting assembly is used to transport the IC tray in the vertical direction; a first middle-layer tray assembly, the first middle-layer tray assembly is connected to the first tray bracket, and the first middle-layer tray assembly is located at a third height; a second middle-layer tray assembly, the second middle-layer tray assembly is connected to the second tray bracket, and the second middle-layer tray assembly is located at the third height; a first upper-layer tray assembly, the first upper-layer tray assembly is connected to the first tray bracket, and the first upper-layer tray assembly is connected to the first tray bracket. The layer tray assembly is located at a fourth height; a second upper layer tray assembly, the second upper layer tray assembly is connected to the second tray bracket, and the second upper layer tray assembly is located at a fourth height; a lower layer tray assembly, the number of lower layer tray assemblies is two, the two lower layer tray assemblies are respectively arranged on the third tray bracket, the two lower layer tray assemblies are arranged in a mirror image, the lower layer tray assembly is located at the second height, the lower layer tray assembly can receive the IC tray located at the third height and lift the IC tray to the second height; a tray pushing assembly, the tray pushing assembly is fixed on the first tray bracket, and the tray pushing assembly faces The strip-shaped opening, the tray pushing assembly is located at the second height, and the tray pushing assembly can push the IC tray on the lower tray assembly to the conveying mechanism; wherein, the first middle tray assembly and the second middle tray assembly are used to grab the IC tray located at the third height, the first upper tray assembly and the second upper tray assembly are used to grab the IC tray located at the fourth height, the first tray bracket, the two third tray brackets and the second tray bracket enclose a tray position, the tray lifting assembly is partially located in the tray position, and the first height, the second height, the third height and the fourth height increase in sequence.

[0008] In some technical solutions of the present invention, optionally, the tray lifting assembly includes: a first shell, in which a accommodating space is provided; a tray lifting mechanism, which is located in the accommodating space and is electrically connected to the controller; and a pallet assembly, in which the bottom of the pallet assembly is connected to the top of the tray lifting mechanism.

[0009] In some technical schemes of the present invention, optionally, the first middle-layer partition assembly includes a first mounting plate, a first cylinder and a first partition block, and the second middle-layer partition assembly includes a second mounting plate, a second cylinder, a second partition block and a corresponding sensor; the first mounting plate is connected to the first partition bracket, the first mounting plate is located on both sides of the first partition bracket, and the first mounting plate is located at a third height; the first cylinder is fixed to an end of the first mounting plate away from the first partition bracket, and the first cylinder is connected to the valve island; the first partition block is connected to the first cylinder, and the first cylinder can drive the first partition block to move; the second mounting plate is connected to the second partition bracket, and the second mounting plate is located at the second On both sides of the sub-disk bracket, the second mounting plate is located at a third height; the second cylinder is fixed to one end of the second mounting plate away from the second sub-disk bracket, and the second cylinder is connected to the valve island; the second sub-disk block is connected to the second cylinder, and the second cylinder can drive the second sub-disk block to move; the through-beam sensor is arranged on the second mounting plate, and the height of the through-beam sensor is the same as the height of the second sub-disk block, and the through-beam sensor is electrically connected to the controller, and the through-beam sensor is used to detect whether the IC material tray has reached the third height; wherein, the number of the first mounting plate, the first cylinder and the first sub-disk block are all two, and the number of the second mounting plate, the second cylinder, the second sub-disk block and the through-beam sensor are all two.

[0010] In some technical schemes of the present invention, optionally, the first upper disk assembly includes a third mounting plate, a third cylinder and a third disk block, and the second upper disk assembly includes a fourth mounting plate, a fourth cylinder, a fourth disk block, a first track and a limit reflection sensor; the third mounting plate is connected to the first disk bracket, the third mounting plate is located on both sides of the first disk bracket, the third mounting plate is located at a fourth height, and the fourth height is higher than the third height; the third cylinder is fixed to an end of the third mounting plate away from the first disk bracket, and the third cylinder is connected to the valve island; the third disk block is connected to the third cylinder, and the third cylinder can drive the third disk block to move; the fourth mounting plate is connected to the second disk bracket, and the fourth mounting plate is located at the second disk bracket. On both sides of the disk bracket, the fourth mounting plate is located at a fourth height; the fourth cylinder is fixed at one end of the fourth mounting plate away from the second disk bracket, and the fourth cylinder is connected to the valve island; the fourth disk block is connected to the fourth cylinder, and the fourth cylinder can drive the fourth disk block to move; the first track is set on one side of the second disk bracket, and the height of the bottom of the first track is higher than the fourth height; the limit reflection sensor is slidably set on the first track, the limit reflection sensor is electrically connected to the controller, and the limit reflection sensor is used to detect the height of the IC material tray at the fourth height; wherein, the number of the third mounting plate, the third cylinder and the third disk block are all two, and the number of the fourth mounting plate, the fourth cylinder and the fourth disk block are all two.

[0011] In some technical schemes of the present invention, optionally, the lower layer partition assembly includes: a fifth cylinder, which is fixed on the third layer partition bracket and connected to the valve island; a lower partition block support plate, which is connected to the fifth cylinder; a lower partition block, which is connected to the lower partition block support plate; a pin, one end of which is connected to the lower partition block, and the other end of which is connected to the lower partition block support plate.

[0012] In some technical solutions of the present invention, optionally, a proximity sensor is provided on one side of the first sub-plate bracket, the proximity sensor is electrically connected to the controller, and a proximity sensor detection block is provided on one side of the feed door, and the proximity sensor and the proximity sensor detection block are aligned in a vertical direction; wherein the proximity sensor is used to detect whether the feed door is closed.

[0013] In some technical schemes of the present invention, optionally, a tray pushing assembly is fixed on the first sub-tray bracket, the tray pushing assembly faces the strip opening, and the tray pushing assembly is located at a third height; wherein, the tray pushing assembly includes: a tray pushing base plate; a tray pushing cylinder, the tray pushing cylinder is fixed on the tray pushing base plate, and the tray pushing cylinder is electrically connected to the controller; a joint assembly, the joint assembly is connected to the tray pushing cylinder; wherein, the tray pushing cylinder can drive the joint assembly to move, and the joint assembly pushes the IC tray located at the second height into the conveying mechanism.

[0014] In some technical schemes of the present invention, optionally, the conveying mechanism includes: a conveyor belt main body, the conveyor belt main body is arranged below the strip opening, the conveyor belt main body is electrically connected to the controller, and a material tray block is provided at one end of the conveyor belt main body away from the strip opening; the conveyor belt main body is provided with a tray entry position, and the side walls on both sides of the tray entry position are provided with a belt track assembly, and the belt track assembly is used to transport the IC material tray; a first position sensor, the first position sensor is located at the first position of the conveyor belt main body, the first position sensor is electrically connected to the controller, and the first position sensor is used to detect whether the IC material tray reaches the first position; a second position sensor, the second position sensor is located at the second position of the conveyor belt main body, the second position sensor is electrically connected to the controller, and the second position sensor is used to detect whether the IC material tray reaches the second position; a positioning locking mechanism, the positioning locking mechanism is arranged on one side of the conveyor belt main body, and the positioning locking mechanism is electrically connected to the controller; a conveying motor, the conveying motor is connected to the conveyor belt main body, is located on one side of the conveyor belt main body, and is electrically connected to the controller; a material tray push-out mechanism, the material tray push-out mechanism is arranged in the conveyor belt main body, and the material tray push-out mechanism is located below the belt track assembly.

[0015] In some technical schemes of the present invention, optionally, the tray pushing mechanism includes: a tray pushing bracket; a tray pushing cylinder, the tray pushing cylinder is fixed on the tray pushing bracket, and the tray pushing cylinder is electrically connected to the controller; a flip block, the flip block is connected to the tray pushing cylinder; a push rod bracket, one end of the push rod bracket is connected to the tray pushing cylinder, and the tray pushing cylinder can drive the push rod bracket to push the flip block; a torsion spring, one end of the torsion spring is connected to the other end of the push rod bracket, and the other end of the torsion spring is connected to the flip block, and the torsion spring can drive the flip block to reset; a stop block, the stop block is connected to the tray pushing bracket, and is located at one end of the strip notch adjacent to the tray pushing cylinder; wherein the tray pushing cylinder can drive the flip block to move and push out the IC tray.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 This is one of the schematic diagrams of a fully automatic loading and unloading device according to an embodiment of the present invention;

[0019] Figure 2 is one of the schematic diagrams of a lifting and grabbing structure according to an embodiment of the present invention;

[0020] Figure 3 is one of the schematic diagrams of a lifting and grabbing structure according to an embodiment of the present invention;

[0021] Figure 4 is one of the schematic diagrams of a lifting and grabbing structure according to an embodiment of the present invention;

[0022] Figure 5 is one of the exploded views of a feed door according to one embodiment of the present invention;

[0023] Figure 6 This is one of the schematic diagrams of a tray lifting assembly according to an embodiment of the present invention;

[0024] Figure 7 One of the schematic diagrams of a first middle layer partition assembly, a second middle layer partition assembly, a first upper layer partition assembly, and a second upper layer partition assembly according to an embodiment of the present invention;

[0025] Figure 8 This is one of the schematic diagrams of a lower layer disk assembly according to an embodiment of the present invention;

[0026] Fig. 9This is one of the schematic diagrams of a tray pushing assembly according to an embodiment of the present invention;

[0027] Fig.10 is one of the schematic diagrams of a transmission mechanism according to an embodiment of the present invention;

[0028] Fig.11 This is a schematic diagram showing a tray ejection mechanism in an extended state according to an embodiment of the present invention;

[0029] Fig.12 This is one of the schematic diagrams showing a material tray ejection mechanism in a retracted state according to an embodiment of the present invention;

[0030] Fig.13 is one of the schematic diagrams of a screen mounting assembly according to an embodiment of the present invention;

[0031] in, Figures 1 to 13 The corresponding relationship between the reference numerals and component names in the figure is:

[0032] Conveying mechanism 10, lifting and grabbing structure 20, screen mounting assembly 40, feeding door 50, mounting plate assembly 5002, door panel assembly 5004, door lock body 5006, handle 5008, buckle 5010, first anti-fool block 5012, second anti-fool block 5014, proximity sensor detection block 5016, tray lifting assembly 210, first shell 2100, tray lifting mechanism 2102, support plate assembly 2104, first sub-disk bracket 3002, proximity sensor 2202, first mounting plate 2203, first cylinder 2204, first sub-disk block 2205, third mounting plate 2210, third cylinder 2211, third sub-disk block 2212, second sub-disk bracket 3004, second mounting plate 2302, second cylinder 2303, second sub-disk block 2304, through-shooting sensor 2305, fourth mounting plate 2310, fourth cylinder 2311, The fourth tray block 2312, the first track 2313, the limit reflection sensor 2314, the tray push assembly 240, the tray push bottom plate 2401, the tray push cylinder 2402, the joint assembly 2403, the conveyor belt body 100, the belt track assembly 110, the first position sensor 120, the second position sensor 130, the positioning locking mechanism 140, the tray push mechanism 250, the tray push bracket 2501, the tray Push-out cylinder 2502, flip block 2503, push rod bracket 2504, torsion spring 2505, stop block 2506, lower disk assembly 260, third disk bracket 3006, fifth cylinder 2602, lower disk block support plate 2604, lower disk block 2606, guide column 2610, linear bearing 2612, pin 2608, lock 3214, screen bracket 4001, screen 4002, screen guard plate 4003. DETAILED DESCRIPTION

[0033] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0034] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0035] Refer to the following Figures 1 to 13 A fully automatic loading and unloading device according to some embodiments of the present invention is described.

[0036] like Figure 1 As shown, the first aspect of the present invention provides a fully automatic loading and unloading device, including: a lifting and grasping structure 20, a strip opening is provided on one side of the lifting and grasping structure 20; a conveying mechanism 10, the conveying mechanism 10 is connected to the lifting and grasping structure 20, and the conveying mechanism 10 is located below the strip opening; a controller, the controller is electrically connected to the lifting and grasping structure 20, and the controller is electrically connected to the conveying mechanism 10; wherein, the lifting and grasping structure 20 is used to transport and grasp IC trays in the vertical direction, the vertical direction is a straight line direction parallel to the gravity direction, and the conveying mechanism 10 is used to transport IC trays in the horizontal direction, and the horizontal direction is a straight line direction perpendicular to the gravity direction.

[0037] The fully automatic loading and unloading device provided by the present invention includes a lifting and grasping structure 20, a conveying mechanism 10 and a controller, wherein the conveying mechanism 10 is connected to the lifting and grasping structure 20, and the conveying mechanism 10 is located below the strip-shaped opening, and the controller is electrically connected to the lifting and grasping structure 20, and the controller is electrically connected to the conveying mechanism 10. Through the coordinated work of the lifting and grasping structure 20 and the conveying mechanism, in conjunction with the remaining processing and testing equipment, the fully automated processing of the IC tray from storage, transportation and processing is realized, which greatly improves the automation level of the production line and the integration and compactness of the equipment, reduces manual intervention and errors caused by human factors, improves production efficiency and accuracy, and improves product quality and consistency.

[0038] It should be noted that the fully automatic loading and unloading device can be used as both a feeding device and a discharging device. Therefore, two fully automatic loading and unloading devices proposed in the present invention can be used together to form a fully automatic loading and unloading system. Among them, a fully automatic loading and unloading system includes two fully automatic loading and unloading devices, one of which is used to place an empty IC tray, and the other is used to place an IC tray with chips, wherein an external device transports the chips on the IC tray with chips to another place for testing and rating, and when the external device finishes testing and sorting the chips, the chips will move the chips with the same rating to the empty IC tray. That is, one of the fully automatic loading and unloading devices is an empty IC tray when placed, and an IC tray with chips when taken out; the other fully automatic loading and unloading device is an IC tray with chips, and an empty IC tray when taken out, and then the two fully automatic loading and unloading devices are used to realize the testing, rating and classification of chips.

[0039] Specifically, a complete operation process of the fully automatic loading and unloading device is as follows: the lifting and grasping structure 20 first lifts the IC tray to the third height, and then lowers the IC tray to the second height through the lifting and grasping structure 20, and pushes the IC tray to the conveying mechanism 10 through the bar opening, and the conveying mechanism 10 transfers the IC tray to the end away from the bar opening, and the external equipment detects, grades and classifies the chips on the IC tray or loads the IC tray with chips. When the external equipment finishes processing the chips on the IC tray or finishes loading the IC tray, the conveying mechanism 10 transfers the IC tray through the bar opening back to the second height of the lifting and grasping structure 20, and the lifting and grasping structure 20 raises the processed IC tray to the fourth height.

[0040] It should be understood that the fully automatic loading and unloading device can only process one IC tray in one complete operation.

[0041] Specifically, the lifting and grasping structure 20 can transport the IC tray to a first height, a second height, a third height and a fourth height, wherein the first height, the second height, the third height and the fourth height increase sequentially, that is, the first height is less than the second height, which is less than the third height and is less than the fourth height, and the initial height of the lifting and grasping structure 20 is the first height.

[0042] It is understandable that the IC (Integrated Circuit) tray, whose full name is the integrated circuit (IC) packaging tray or IC packaging tray, is a packaging tray used by semiconductor packaging and testing companies for their chip packaging and testing. These trays play a vital role in semiconductor manufacturing and supply chain management of electronic components. They are not only used to load and transport chips, but also play a key role in protecting chips from environmental factors such as static electricity, high temperature, corrosion, etc. The design and material selection of IC trays are carefully considered to ensure the safety and stability of chips during transportation, storage and testing. It should be noted that the fully automatic loading and unloading device can be used as both a feeding device and a discharging device. When the fully automatic loading and unloading device is feeding, the IC tray enters the lifting and grabbing structure 20 through the conveying mechanism 10; when the fully automatic loading and unloading device is discharging, the IC tray enters the conveying mechanism 10 through the lifting and grabbing structure 20.

[0043] Optionally, the lifting and grabbing structure 20 is fixedly connected to the conveying mechanism 10 .

[0044] like Figures 1 to 9As shown, in some embodiments, the lifting and grabbing structure 20 includes: a first plate bracket 3002, the first plate bracket 3002 is provided with a square opening; a third plate bracket 3006, the number of the third plate bracket 3006 is two, and the two third plate brackets 3006 are respectively connected to the two sides of the first plate bracket 3002; a second plate bracket 3004, the second plate bracket 3004 is provided with a strip opening, the second plate bracket 3004 is connected to the conveying mechanism 10, and the two sides of the second plate bracket 3004 are respectively connected to the side of the third plate bracket 3006 away from the first plate bracket 3002; a feeding door 50, the feeding door 50 is connected to the first plate bracket 300 2 is detachably connected, the feed door 50 is located at the square opening, and the shape of the square opening matches the shape of the feed door 50; the tray lifting assembly 210, the tray lifting assembly 210 is electrically connected to the controller, the tray lifting assembly 210 is located at a first height, and the tray lifting assembly 210 is used to transport the IC tray in the vertical direction; the first middle-layer tray assembly, the first middle-layer tray assembly is connected to the first tray bracket 3002, and the first middle-layer tray assembly is located at a third height; the second middle-layer tray assembly, the second middle-layer tray assembly is connected to the second tray bracket 3004, and the second middle-layer tray assembly is located at the third height; the first upper-layer tray assembly, the first upper-layer tray assembly is connected to the first tray bracket 3004, and the second middle-layer tray assembly is located at the third height; 002 is connected, the first upper tray assembly is located at the fourth height; the second upper tray assembly, the second upper tray assembly is connected to the second tray bracket 3004, and the second upper tray assembly is located at the fourth height; the lower tray assembly 260, the number of the lower tray assembly 260 is two, the two lower tray assemblies 260 are respectively arranged on the third tray bracket 3006, the two lower tray assemblies 260 are mirror-imaged, the lower tray assembly 260 is located at the second height, the lower tray assembly 260 can receive the IC tray located at the third height and lift the IC tray to the second height; the tray pushing assembly 240, the tray pushing assembly 240 is fixed on the first tray bracket 3002, The tray pushing assembly 240 faces the strip opening and is located at the second height. The tray pushing assembly 240 can push the IC tray on the lower tray assembly 260 to the conveying mechanism 10; wherein, the first middle tray assembly and the second middle tray assembly are used to grab the IC tray located at the third height, the first upper tray assembly and the second upper tray assembly are used to grab the IC tray located at the fourth height, the first tray bracket 3002, the two third tray brackets 3006 and the second tray bracket 3004 together enclose a tray position, the tray lifting assembly 210 is partially located in the tray position, and the first height, the second height, the third height and the fourth height increase sequentially.

[0045] In this embodiment, the lifting and grasping structure 20 includes a first plate bracket 3002, a third plate bracket 3006, a second plate bracket 3004, a feed door 50, a tray lifting assembly 210, a first middle layer plate bracket assembly, a second middle layer plate bracket assembly, a first upper layer plate bracket assembly, a second upper layer plate bracket assembly, a lower layer plate bracket assembly 260, and a tray pushing assembly 240.

[0046] The following is the workflow of this embodiment:

[0047] When the lifting and grabbing structure 20 is in operation, the operator opens the feed door 50 and places the IC tray on the tray lifting assembly 210. At this time, the tray lifting assembly 210 is at a first height, and then the tray lifting assembly 210 drives multiple IC trays to rise to a third height.

[0048] The first middle layer tray assembly and the second middle layer tray assembly cooperate with each other to hold the IC tray on the tray lifting assembly 210. At this time, the IC tray held by the first middle layer tray assembly and the second middle layer tray assembly is at the third height, and the tray lifting assembly 210 returns to the first height (ie, the initial position).

[0049] The lower tray assembly 260 rises and holds up the IC tray held by the first and second middle tray assemblies. At this time, the first and second middle tray assemblies no longer hold the IC tray tightly, and the IC tray falls on the lower tray assembly 260. The lower tray assembly 260 descends to the second height with the IC tray.

[0050] The tray pushing component 240 pushes the IC tray on the lower tray assembly 260 to the conveying mechanism 10, and an external device inspects, grades and classifies the chips on the IC tray or loads the IC tray with chips (which can be understood as an external device processing the chips on the IC tray or filling the IC tray with chips). When the external device finishes processing the chips on the IC tray or finishes loading the IC tray, the conveying mechanism 10 conveys the IC tray back to the lower tray assembly 260 through the strip opening.

[0051] The tray lifting assembly 210 rises and takes over the IC tray on the lower tray assembly 260. At this time, there is an IC tray on the tray lifting assembly 210. The tray lifting assembly 210 drives the IC tray to rise to the fourth height. The first upper tray assembly and the second upper tray assembly cooperate with each other to hold the IC tray on the tray lifting assembly 210. At this time, the IC tray held by the first upper tray assembly and the second upper tray assembly is at the fourth height. Then, after the whole set of operation procedures are completed, the operator takes away the IC tray at the fourth height.

[0052] By lifting and lowering the grabbing structure 20, the production efficiency and accuracy of the production line are improved, the labor cost is reduced, and automation is achieved.

[0053] like Figure 6 As shown, in some embodiments, the tray lifting assembly 210 includes: a first shell 2100, in which a receiving space is provided; a tray lifting mechanism 2102, which is located in the receiving space and is electrically connected to the controller; and a pallet assembly 2104, in which the bottom of the pallet assembly 2104 is connected to the top of the tray lifting mechanism 2102.

[0054] In this embodiment, the lifting and grabbing structure 20 includes a tray lifting assembly 210, which is disposed in the bracket 30. The tray lifting assembly 210 includes a first shell 2100, a tray lifting mechanism 2102, and a support plate assembly 2104. Among them, a receiving space is provided in the first shell 2100, and the tray lifting mechanism 2102 is located in the receiving space of the first shell 2100. The tray lifting mechanism 2102 is electrically connected to the controller, and the top of the tray lifting mechanism 2102 is connected to the bottom of the support plate assembly 2104.

[0055] The following is the workflow of this embodiment:

[0056] In the initial state, the tray lifting mechanism 2102 is at a first height, the pallet assembly 2104 is firmly mounted on the tray lifting mechanism 2102, the IC tray is placed on the pallet assembly 2104, and the tray lifting assembly 210 is in a stationary state, ready for lifting and lowering operations. When the height of the IC tray needs to be adjusted, the control system sends a command to the tray lifting mechanism 2102. The tray lifting mechanism 2102 is then started to realize the vertical lifting of the pallet assembly 2104, and the IC tray is firmly positioned at the required docking height.

[0057] By cooperating with the tray lifting mechanism 2102 and the pallet assembly 2104, the height of the IC tray can be quickly adjusted to meet the needs of different production processes, reducing the time and labor intensity of manual adjustment, improving production efficiency, and ensuring the accuracy and stability of the pallet assembly 2104 and the IC tray during the lifting process.

[0058] It should be noted that the tray lifting mechanism 2102 can stop at the first height, the second height, the third height and the fourth height respectively.

[0059] Specifically, the valve island is electrically connected to the controller.

[0060] Specifically, the tray lifting mechanism 2102 includes a first motor, a control valve island mounting plate, left and right guide pillars 2610 connectors, an upper limit detection plate, an oil receiving anti-collision plate, a guide pillar 2610, and a linear bearing 2612. Among them, the first motor, the control valve island mounting plate, and the linear bearing 2612 are all connected to the support plate assembly 2104, the valve island is connected to the control valve island mounting plate, and the left and right guide pillars 2610 connectors, the upper limit detection plate, the oil receiving anti-collision plate, and the guide pillar 2610 are all connected to the first motor. It should be noted that the tray lifting mechanism 2102 includes at least a first motor, the first motor is connected to the support plate assembly 2104, and the first motor is electrically connected to the controller, thereby realizing the lifting and lowering of the IC tray.

[0061] Specifically, the pallet assembly 2104 includes a zeroing sensor, a buffer block, a zeroing sheet, a pallet main body transition plate, a screw mounting block, a guide plate, a pallet main body, a silo bottom plate, a host connecting plate, and an upper limit sensor. Among them, the zeroing sensor, the buffer block, the pallet main body transition plate, the silo bottom plate, the host connecting plate, and the upper limit sensor are all connected to the pallet main body, and the zeroing sheet, the screw mounting block, and the guide plate are all connected to the pallet main body transition plate.

[0062] Preferably, the first motor is a screw motor.

[0063] like Figure 7As shown, in some embodiments, the first middle-layer disk-dividing assembly includes a first mounting plate 2203, a first cylinder 2204 and a first disk-dividing block 2205, and the second middle-layer disk-dividing assembly includes a second mounting plate 2302, a second cylinder 2303, a second disk-dividing block 2304 and a beam sensor 2305; the first mounting plate 2203 is connected to the first disk-dividing bracket 3002, the first mounting plate 2203 is located on both sides of the first disk-dividing bracket 3002, and the first mounting plate 2203 is located at a third height; the first cylinder 2204 is fixed on the first mounting plate 2203 away from the first disk-dividing bracket The first cylinder 2204 is electrically connected to the controller at one end of the bracket 3002; the first disk block 2205 is connected to the first cylinder 2204, and the first cylinder 2204 can drive the first disk block 2205 to move; the second mounting plate 2302 is connected to the second disk bracket 3004, the second mounting plate 2302 is located on both sides of the second disk bracket 3004, and the second mounting plate 2302 is located at a third height; the second cylinder 2303 is fixed to one end of the second mounting plate 2302 away from the second disk bracket 3004, and the second cylinder 2303 is electrically connected to the controller; the second disk block 2304 is connected to the second cylinder 2303, and the second cylinder 2303 can drive the second disk block 2304 to move; the through-beam sensor 2305 is arranged on the second mounting plate 2302, and the height of the through-beam sensor 2305 is the same as the height of the second disk block 2304. The through-beam sensor 2305 is electrically connected to the controller, and the through-beam sensor 2305 is used to detect whether the IC tray reaches the third height; wherein, the number of the first mounting plate 2203, the first cylinder 2204 and the first disk block 2205 are all two, and the two first mounting plates 2203, the two first cylinders 2204 and the first disk block 2205 are 2204 and the two first sub-disk blocks 2205 are arranged opposite to each other, the number of the second mounting plate 2302, the second cylinder 2303, the second sub-disk block 2304 and the corresponding sensor 2305 are two each, and the second mounting plate 2302, the second cylinder 2303, the second sub-disk block 2304 and the corresponding sensor 2305 are arranged opposite to each other; there are four first cylinders 2204 and second cylinders 2303 in total, two first mounting plates 2203 are arranged on the first sub-disk bracket 3002, and two second mounting plates 2302 are arranged on the second sub-disk bracket 3004.

[0064] In this embodiment, the first middle layer disk assembly includes a first mounting plate 2203 , a first cylinder 2204 and a first disk block 2205 , and the second middle layer disk assembly includes a second mounting plate 2302 , a second cylinder 2303 , a second disk block 2304 and a corresponding sensor 2305 .

[0065] The following is the workflow of this embodiment:

[0066] When the fully automatic loading and unloading device needs to transfer the IC tray to the conveying mechanism 10, when the tray lifting assembly 210 raises the IC tray from the first height to the third height, the shooting sensor 2305 is triggered to detect the signal, and the two first cylinders 2204 and the two second cylinders 2303 work together to extend the first tray block 2205 and the second tray block 2304, thereby holding the IC tray, avoiding erroneous operation caused by inaccurate tray position due to manual judgment or mechanical errors, optimizing the overall production process, and promoting the automation and intelligence of the production process.

[0067] Specifically, the strip-shaped opening of the lifting and grabbing structure 20 is arranged on the second plate-dividing bracket 3004 .

[0068] Specifically, a first cylinder sensor is provided on the first sub-disk bracket 3002, and the first cylinder sensor is electrically connected to the controller. The first cylinder sensor is used to detect whether the first cylinder is retracted, thereby preventing the first cylinder 2204 from interfering with the operation of the tray lifting assembly 210; a second cylinder sensor is provided on the second sub-disk bracket 3004, and the second cylinder sensor is electrically connected to the controller. The second cylinder sensor is used to detect whether the second cylinder 2303 is retracted, thereby preventing the second cylinder 2303 from interfering with the operation of the tray lifting assembly 210.

[0069] Specifically, steps are provided at the bottom of the first dividing plate block 2205 and the second dividing plate block 2304, so that the IC material tray can be supported while the first dividing plate block 2205 and the second dividing plate block 2304 clamp the IC material tray, thereby providing an additional layer of protection.

[0070] like Figure 7As shown, in some embodiments, the first upper disk assembly includes a third mounting plate 2210, a third cylinder 2211 and a third disk block 2212, and the second upper disk assembly includes a fourth mounting plate 2310, a fourth cylinder 2311, a fourth disk block 2312, a first track 2313 and a limit reflection sensor 2314; the third mounting plate 2210 is connected to the first disk bracket 3002, the third mounting plate 2210 is located on both sides of the first disk bracket 3002, the third mounting plate 2210 is located at a fourth height, and the fourth height is higher than the third height; the third cylinder 2211 is fixed on the first disk bracket 3002, and the third mounting plate 2210 is located at a fourth height. The third mounting plate 2210 is at one end away from the first partition bracket 3002, and the third cylinder 2211 is electrically connected to the controller; the third partition block 2212 is connected to the third cylinder 2211, and the third cylinder 2211 can drive the third partition block 2212 to move; the fourth mounting plate 2310 is connected to the second partition bracket 3004, the fourth mounting plate 2310 is located on both sides of the second partition bracket 3004, and the fourth mounting plate 2310 is located at a fourth height; the fourth cylinder 2311 is fixed to the end of the fourth mounting plate 2310 away from the second partition bracket 3004, and the fourth cylinder 2311 is electrically connected to the controller The fourth disk block 2312 is electrically connected to the fourth cylinder 2311, and the fourth cylinder 2311 can drive the fourth disk block 2312 to move; the first track 2313 is arranged on one side of the second disk bracket 3004, and the height of the bottom of the first track 2313 is higher than the fourth height; the limit reflection sensor 2314 is slidably arranged on the first track 2313, the limit reflection sensor 2314 is electrically connected to the controller, and the limit reflection sensor 2314 is used to detect the height of the IC tray at the fourth height; wherein the third mounting plate 2210, the third cylinder 2211 and the third disk The number of blocks 2212 is two, and the third mounting plate 2210, the third cylinder 2211 and the third sub-disk block 2212 are two, and the fourth mounting plate 2310, the fourth cylinder 2311 and the fourth sub-disk block 2312 are two, and the fourth mounting plate 2310, the fourth cylinder 2311 and the fourth sub-disk block 2312 are two; the fourth mounting plate 2310, the fourth cylinder 2311 and the fourth sub-disk block 2312 are two; there are four third cylinders 2211 and four fourth cylinders 2311 in total, two third mounting plates 2210 are provided on the first sub-disk bracket 3002, and two fourth mounting plates 2310 are provided on the second sub-disk bracket 3004.

[0071] In this embodiment, the first upper disk assembly includes a third mounting plate 2210, a third cylinder 2211 and a third disk block 2212, and the second upper disk assembly includes a fourth mounting plate 2310, a fourth cylinder 2311, a fourth disk block 2312, a first track 2313 and a limit reflection sensor 2314.

[0072] The following is the workflow of this embodiment:

[0073] It should be noted that a complete operation process of a fully automatic loading and unloading device of the present invention can process multiple IC trays, and the following workflow is the process of the first upper tray sub-tray component and the second upper tray sub-tray component processing one IC tray among multiple trays. For ease of understanding and to avoid unnecessary ambiguity, this workflow takes 20 trays as an example, and the IC trays selected by the present invention are all IC trays that can be stacked together.

[0074] After the IC tray is processed by the external device and is transferred back to the lifting and grabbing structure 20 by the transfer mechanism 10 , the lower tray separation assembly 260 receives the IC tray. At this time, the IC tray is located at the second height.

[0075] Based on the instruction, the tray lifting assembly 210 rises, and the tray lifting assembly 210 takes over the IC tray on the lower tray assembly 260 while rising. If there is an IC tray on the tray lifting assembly 210, the IC tray on the lower tray assembly 260 is stacked on the topmost layer of the IC tray on the tray lifting assembly 210 (taking 20 IC trays as an example, the lower tray assembly 260 has 1 IC tray, and there are 19 IC trays on the tray lifting assembly 210. After the tray lifting assembly 210 takes over the IC tray on the lower tray assembly 260 while rising, there are 20 IC trays on the tray lifting assembly 210, and the topmost IC tray on the tray lifting assembly 210 is the IC tray just on the lower tray assembly 260).

[0076] There is an IC tray on the tray lifting assembly 210, and the tray lifting assembly 210 drives the IC tray to rise to a fourth height.

[0077] At this time, the third cylinder 2211 and the fourth cylinder 2311 work together to drive the third sub-tray block 2212 and the fourth sub-tray block 2312 to hold an IC tray on the top layer of the tray lifting assembly 210 (taking 20 IC trays as an example, in the current state, the third sub-tray block 2212 and the fourth sub-tray block 2312 hold 0 IC trays, and there are 20 IC trays on the tray lifting assembly 210. The third sub-tray block 2212 and the fourth sub-tray block 2312 hold one IC tray, which is located at the top layer of the 20 IC trays on the tray lifting assembly 210, that is, the IC tray just on the lower sub-tray assembly 260).

[0078] If the third tray block 2212 and the fourth tray block 2312 are already in the state of holding the IC tray, the tray lifting assembly 210 will lift the topmost IC tray to the bottom of the trays on the third tray block 2212 and the fourth tray block 2312, and the topmost IC tray on the tray lifting assembly 210 is only 0.1mm to 0.5mm away from the IC trays held tightly by the third tray block 2212 and the fourth tray block 2312 (taking 20 IC trays as an example, at this time the third tray block 2212 and the fourth tray block 2312 hold one IC tray, and there are 19 IC trays on the tray lifting assembly 210. At this time, the top of the IC tray on the tray lifting assembly 210 rises to the bottom of the one IC tray held by the third tray block 2212 and the fourth tray block 2312, and at this time, the bottom of the one IC tray held by the third tray block 2212 and the fourth tray block 2312 is only 0.1mm to 0.5mm away from the top of the 19 IC trays on the tray lifting assembly 210).

[0079] At this time, the third tray block 2212 and the fourth tray block 2312 are driven to retract by the third cylinder 2211 and the fourth cylinder 2311, and all the trays on the third tray block 2212 and the fourth tray block 2312 fall onto the pallet assembly 2104 (because the IC trays selected for use in the present invention are all IC trays that can be stacked together, and when the bottom of one IC tray held by the third tray block 2212 and the fourth tray block 2312 is only 0.1mm to 0.5mm away from the top of the 19 IC trays on the tray lifting assembly 210, the one IC tray held by the third tray block 2212 and the fourth tray block 2312 can fall on top of the 19 IC trays on the tray lifting assembly 210. At this time, except for the tray lifting assembly 210 supporting 20 IC trays, no other components touch the IC trays).

[0080] Then, the tray lifting assembly 210 rises to the height of one IC tray again, and the third sub-tray block 2212 and the fourth sub-tray block 2312 extend again to embrace the IC tray at the fourth height (so in the case just now, the 20 IC trays of the tray lifting assembly 210 are sorted from top to bottom, and the first IC tray is still at the fourth height, that is, the height of the third sub-tray block 2212 and the fourth sub-tray block 2312. At this time, the tray lifting assembly 210 rises to the height of one IC tray and is sorted from top to bottom, so the second IC tray on the tray lifting assembly 210 is at the fourth height. At this time, the third sub-tray block 2212 and the fourth sub-tray block 2312 extend to embrace the second IC tray on the tray lifting assembly 210, and because the IC trays can be stacked on top of each other, the third sub-tray block 2212 and the fourth sub-tray block 2312 embrace two IC trays).

[0081] By repeating the above-mentioned actions, the remaining trays on the tray lifting assembly 210 can be divided into the third tray dividing block 2212 and the fourth tray dividing block 2312 .

[0082] Through the cooperation of the above components, efficient and automated sorting of IC trays is achieved. The entire process does not require human intervention, which significantly improves production efficiency and accuracy, optimizes the overall production process, and promotes the automation and intelligence of the production process.

[0083] Specifically, steps are provided at the bottom of the third dividing plate block 2212 and the fourth dividing plate block 2312, so that the IC material tray can be supported while the third dividing plate block 2212 and the fourth dividing plate block 2312 clamp the IC material tray, thereby providing an additional layer of protection.

[0084] The first track 2313 is disposed on one side of the second disk distribution bracket 3004, and the height of the bottom of the first track 2313 is higher than the fourth height.

[0085] like Figure 8 As shown, in some embodiments, the lower disk assembly 260 includes: a fifth cylinder 2602, which is fixed on the third disk bracket 3006 and connected to the valve island; a lower disk block support plate 2604, a notch is provided on the lower disk block support plate 2604, and the output end of the fifth cylinder 2602 is connected to the lower disk block support plate 2604 through the notch; and a lower disk block 2606, which is connected to the lower disk block support plate 2604.

[0086] In this embodiment, the lifting and grasping structure 20 further includes a lower layer partition assembly 260, the number of which is two, and the lower layer partition assemblies 260 are respectively arranged on the third disk bracket 3006, and the two lower layer partition assemblies 260 are arranged in a mirror image, and the lower layer partition assembly includes a fifth cylinder 2602, a lower partition block support plate 2604 and a lower partition block 2606. The fifth cylinder 2602 is fixed on the third disk bracket 3006, the fifth cylinder 2602 is connected to the valve island, the lower partition block support plate 2604 is connected to the fifth cylinder 2602, and the lower partition block 2606 is connected to the lower partition block support plate 2604.

[0087] When the IC tray is held by the first tray block 2205 and the second tray block 2304, that is, the IC tray is at the third height, based on the instruction, the lower tray block support plate 2604 drives the lower tray block 2606 to move under the action of the fifth cylinder 2602, and the lower tray block support plate 2604 and the lower tray block 2606 rise to hold the IC tray held by the first tray block 2205 and the second tray block 2304, and then the first cylinder 2204 and the second cylinder 2303 retract to place the IC tray on the lower tray block 2606, and then the fifth cylinder 2602 retracts, and the tray also descends, so that the IC tray can be brought to the second height, which makes it easier to push the IC tray to the conveying mechanism 10.

[0088] Through the cooperation among the lower dividing plate block support plate 2604, the lower dividing plate block 2606 and the fifth cylinder 2602, the overall production process is optimized, the stability and reliability of the production process are improved, and the automation and intelligence of the production process are promoted.

[0089] It should be noted that the lower tray assembly 260 of the present invention holds the IC tray, because the IC tray is pushed in or out at the second height, if the IC tray is clamped, the subsequent process cannot be carried out. Therefore, the present invention holds the IC tray by the lower tray block support plate 2604 and the lower tray block 2606.

[0090] Specifically, the fifth cylinder 2602 is connected to the third sub-disk bracket 3006 via the fifth cylinder base.

[0091] Furthermore, the lower disk assembly 260 further includes a guide post 2610, a linear bearing 2612 and a pin 2608. There are two guide posts 2610, which are respectively located on both sides of the lower disk block 2606, and the guide posts 2610 pass through the lower disk block support plate 2604, and both ends of the guide posts 2610 are connected to the third disk support bracket 3006; there are two linear bearings 2612, which are sleeved on the guide posts 2610, and both sides of the lower disk block support plate 2604 are provided with receiving grooves, and the linear bearings 2612 are located in the receiving grooves, and one end of the pin 2608 is connected to the lower disk block 2606, and the other end of the pin 2608 is connected to the lower disk block support plate 2604.

[0092] When the tray lifting assembly 210 rises, the lower tray block 2606 can rotate around the pin 2608, and then under the action of the pin 2608, the lower tray block 2606 is pushed open by the IC tray on the tray lifting assembly 210, so the lower tray block 2606 does not affect the lifting of the tray lifting assembly 210. At the same time, because the lower tray block 2606 is pushed open, the IC tray lifted by the lower tray block 2606 falls on the tray lifting assembly 210.

[0093] It is understandable that for ease of understanding, Figure 8 The center pin 2608 and guide post 2610 have not yet been installed to facilitate observation.

[0094] Specifically, the lower layer sub-disk assembly 260 also includes a linear bearing fixing plate, an in-position detection sensor, and an air joint. Among them, the linear bearing 2612 is arranged on the linear bearing 2612 fixing plate, and the in-position detection sensor and the air head block are both arranged on the fifth cylinder.

[0095] like Figure 5 and Figure 7 As shown, in some embodiments, a proximity sensor 2202 is provided on one side of the first sub-plate bracket 3002, and the proximity sensor 2202 is electrically connected to the controller. A proximity sensor detection block 5016 is provided on one side of the feed door 50, and the proximity sensor 2202 and the proximity sensor detection block 5016 are aligned in the vertical direction; wherein, the proximity sensor 2202 is used to detect whether the feed door 50 is closed.

[0096] In this embodiment, a proximity sensor 2202 is provided on one side of the first tray bracket 3002, the proximity sensor 2202 is electrically connected to the controller, the square opening is located below the proximity sensor 2202, a proximity sensor detection block 5016 is provided on one side of the feed door 50, and the proximity sensor 2202 is vertically aligned with the proximity sensor detection block 5016. The proximity sensor 2202 is used to detect whether the feed door 50 is closed.

[0097] If the proximity sensor 2202 does not detect the proximity sensor detection block 5016, the proximity sensor 2202 will not trigger a signal, and the controller will prohibit the full-automatic loading and unloading device from moving; if the proximity sensor 2202 detects the proximity sensor detection block 5016, the proximity sensor 2202 will trigger a signal, and the full-automatic loading and unloading device will execute the command according to the instruction.

[0098] Through the cooperation between the proximity sensor 2202 and the proximity sensor detection block 5016, the proximity sensor 2202 can determine whether the feed door 50 of the fully automatic loading and unloading device is in a closed state, thereby deciding whether to allow the fully automatic loading and unloading device to move, ensuring the smooth progress of the process, reducing human intervention, improving the safety and reliability of the equipment, making the equipment more intelligent, and reducing the burden on workers.

[0099] Preferably, the proximity sensor detection block 5016 is arranged on the door lock body 5006.

[0100] like Fig. 9As shown, in some embodiments, the tray pushing assembly 240 includes: a tray pushing base plate 2401; a tray pushing cylinder 2402, which is fixed on the tray pushing base plate 2401 and electrically connected to the controller; a joint assembly 2403, which is connected to the tray pushing cylinder 2402; wherein, the tray pushing cylinder 2402 can push the joint assembly 2403 to move and push out the IC tray at the second height.

[0101] In this embodiment, the tray pushing component 240 is located at the third height. The tray pushing component 240 includes a tray pushing base plate 2401, a tray pushing cylinder 2402, a joint component 2403, and a fourth sensor. The tray pushing cylinder 2402 is fixed on the tray pushing base plate 2401, and is connected to the joint component 2403, and the joint component 2403 is fixed on the tray pushing base plate 2401. Based on the instruction, the tray pushing cylinder 2402 drives the joint component 2403 to move and then push the IC tray into the conveying mechanism 10. The tray pushing component 240 realizes the automation of IC tray identification and the unmanned pushing process, reduces manual intervention, improves production efficiency, reduces employees' operations in dangerous areas, improves the safety of the working environment, optimizes the overall production process, and promotes the automation and intelligence of the production process.

[0102] Specifically, the tray pushing assembly 240 also includes an air joint, a baffle, a push plate connecting plate, a fourth sensor, and a fourth sensor mounting seat. The air joint, the baffle, the push plate connecting plate, and the fourth sensor mounting seat are all arranged on the tray pushing bottom plate 2401, and the fourth sensor is arranged on the fourth sensor mounting seat.

[0103] Specifically, the joint assembly 2403 includes a first joint, a main connecting rod, a second joint, a secondary connecting rod, a third joint, and a fourth joint. Among them, the tray push cylinder 2402, the first joint, the main connecting rod, the second joint, the secondary connecting rod, the third joint, and the fourth joint are connected in sequence, and the tray push cylinder 2402 drives the main connecting rod to move around the third joint. The main connecting rod is an IC tray push part, and pushes the IC tray onto the belt. Through the joint action of the first joint, the main connecting rod, the second joint, the secondary connecting rod, the third joint, and the fourth joint, a stroke amplification mechanism is formed. Through various joint transmissions, the stroke of the tray push cylinder 2402 is amplified to achieve a compact structure.

[0104] like Figures 10 to 12As shown, in some embodiments, the conveying mechanism 10 includes: a conveyor belt body 100, the conveyor belt body 100 is arranged below the strip opening, the conveyor belt body 100 is electrically connected to the controller, and a tray stopper is provided at one end of the conveyor belt body 100 away from the strip opening; the conveyor belt body 100 is provided with a tray entry position, and the side walls on both sides of the tray entry position are provided with a belt track assembly 110, and the belt track assembly 110 is used to transport the IC tray; a first position sensor 120, the first position sensor 120 is located at the first position of the conveyor belt body 100, the first position sensor 120 is electrically connected to the controller, and the first position sensor 120 is used to detect whether the IC tray has reached the first position; a second position sensor The second position sensor 130 is located at the second position of the conveyor belt body 100, and the second position sensor 130 is electrically connected to the controller. The second position sensor 130 is used to detect whether the IC tray reaches the second position; the positioning locking mechanism 140, the positioning locking mechanism 140 is arranged on one side of the conveyor belt body 100, and the positioning locking mechanism 140 is electrically connected to the controller; the conveying motor, the conveying motor is connected to the conveyor belt body 100, and is located on one side of the conveyor belt body 100, and the conveying motor is electrically connected to the controller; the tray pushing mechanism 250, the tray pushing mechanism 250 is arranged in the conveyor belt body 100, and the tray pushing mechanism 250 is located below the belt track assembly 110.

[0105] In this embodiment, the conveying mechanism 10 includes a conveyor belt body 100 , a conveying motor, a first position sensor 120 , a second position sensor 130 , a positioning locking mechanism 140 and a tray pushing mechanism 250 . Among them, the conveyor belt body 100 is arranged below the strip opening, the conveyor belt body 100 is electrically connected to the controller, a material tray block is provided at one end of the conveyor belt body 100 away from the strip opening, the conveyor belt body 100 is provided with a tray entry position, and the side walls on both sides of the tray entry position are provided with a belt track assembly 110, the belt track assembly 110 is used to transport IC material trays, the conveying motor is connected to the conveyor belt body 100, and is located on one side of the conveyor belt body 100, the conveying motor is electrically connected to the controller, the first position sensor 120 is located at the first position of the conveyor belt body 100, the first position sensor 120 is electrically connected to the controller, the first position sensor 120 is used to detect whether the material tray reaches the first position, the second position sensor 130 is located at the second position of the conveyor belt body 100, the second position sensor 130 is electrically connected to the controller, the second position sensor 130 is used to detect whether the material tray reaches the second position, and the positioning locking mechanism 140 is arranged on one side of the conveyor belt body 100, and the positioning locking mechanism 140 is electrically connected to the controller. Through the first position sensor 120, it is possible to determine whether the material tray has reached the first position and to slow down the conveyor belt body 100; through the second position sensor 130, it is possible to determine whether the IC material tray has reached the second position, and through the positioning locking mechanism 140, the IC material tray can be precisely positioned, thereby being able to accurately control the position of the IC material tray, improve the level of automation, optimize the entire production process, and ensure coordination and continuity between various links.

[0106] The following is the workflow of this embodiment:

[0107] When the IC tray is pushed onto the conveying mechanism 10, the conveying motor rotates forward to drive the belt track assembly 110 to move, and then the IC tray is transmitted in the horizontal direction through the belt track assembly 110. When the IC tray reaches the first position, the first position sensor 120 is used to control the conveying motor to drive the belt track assembly 110 to decelerate, and the position of the IC tray is detected by the second position sensor 130. When the IC tray reaches the second position, the positioning locking mechanism 140 helps to lock the IC tray in position, and then locks the IC tray before the external equipment detects, rates and classifies the chips on the IC tray, so as to facilitate the external equipment to operate and process the IC tray.

[0108] When the external device inspects, rates and classifies the chips on the IC tray or loads the chips onto an empty IC tray, the conveying motor reverses and the tray ejection mechanism 250 helps the IC tray return to the lower tray assembly 260 when the IC tray is close to the strip opening.

[0109] Specifically, the positioning locking mechanism 140 includes an inclined ejection block, a sixth cylinder and a positive ejection cylinder. The inclined ejection block is connected to the sixth cylinder, the sixth cylinder is arranged on the conveyor belt body 100, and the positive ejection cylinder is connected to the conveyor belt body 100. The present invention drives the inclined ejection block and the positive cylinder to cooperate with each other through the sixth cylinder, and then locks the position of the IC tray when the IC tray reaches the second position, which is convenient for the next step of processing of the external device.

[0110] Specifically, the conveying mechanism 10 also includes a track 1, a sensor mounting bracket, a limited reflection sensor, an adjusting screw, a cylindrical head screw, a gasket, a driving pulley, a bearing washer, a bearing, a key, a transmission shaft, a lower support, a pulley, a belt, an upper support, a cylinder, a gas joint, a one-way throttle valve, a tilting block, a track 2, a sensor mounting block, a beam sensor, a gas joint mounting block, a throttle valve, a bracket, a gas joint, and a flip block mounting plate. Among them, the track 1, the sensor mounting bracket, the limited reflection sensor, the adjusting screw, the cylindrical head screw, a gasket, a driving pulley, a bearing washer, a bearing, a key, a transmission shaft, a lower support, a pulley, a belt, an upper support, a cylinder, a gas joint, a one-way throttle valve, a tilting block, a track 2, a sensor mounting block, a beam sensor, a gas joint mounting block, a throttle valve, a bracket, a gas joint, and a flip block mounting plate are all arranged on the conveyor belt body 100.

[0111] like Fig.11 and Fig.12 As shown, in some embodiments, the tray pushing mechanism 250 includes: a tray pushing bracket 2501; a tray pushing cylinder 2502, which is fixed on the tray pushing bracket 2501 and is electrically connected to the controller; a flip block 2503, which is connected to the tray pushing cylinder 2502; a push rod bracket 2504, one end of which is connected to the tray pushing cylinder 2502, and the tray pushing cylinder 2502 can drive the push rod bracket 2504 pushes the flip block 2503; the torsion spring 2505, one end of the torsion spring 2505 is connected to the other end of the push rod bracket 2504, and the other end of the torsion spring 2505 is connected to the flip block 2503, and the torsion spring 2505 can drive the flip block 2503 to reset; the stopper 2506, the stopper 2506 is connected to the tray pushing bracket 2501, and is located at one end of the strip notch adjacent to the tray pushing cylinder 2502; wherein, the tray pushing cylinder 2502 can drive the flip block 2503 to move and push out the IC tray.

[0112] In this embodiment, the tray pushing mechanism 250 includes a tray pushing bracket 2501, a tray pushing cylinder 2502, a flip block 2503, a torsion spring 2505, a block 2506 and a push rod bracket 2504. The tray pushing cylinder 2502 is fixed on the tray pushing bracket 2501, the tray pushing cylinder 2502 is electrically connected to the controller, the flip block 2503 is connected to the tray pushing cylinder 2502, one end of the push rod bracket 2504 is connected to the tray pushing cylinder 2502, the tray pushing cylinder 2502 can drive the push rod bracket 2504 to push the flip block 2503, one end of the torsion spring 2505 is connected to the other end of the push rod bracket 2504, the other end of the torsion spring 2505 is connected to the flip block 2503, and the torsion spring 2505 can drive the flip block 2503 to reset. The tray pushing mechanism 250 realizes automatic pushing of the IC tray, thereby improving production efficiency, reducing labor intensity, and improving stability and accuracy of the tray during the pushing process.

[0113] The following is the workflow of this embodiment:

[0114] When the IC tray needs to be pushed out, the force of the belt alone is not enough to push the IC tray back to the lifting and grabbing structure 20, so the tray pushing cylinder 2502 drives the push rod bracket 2504 to move, thereby driving the flipping fast movement. Among them, the flip block and the push rod bracket 2504 are connected by a torsion spring 2505. When the flip block is not pushed, the block 2506 and the flip block squeeze each other, thereby compressing the torsion spring 2505, so that the flip block is in an inactive state, which is arranged in parallel with the tray pushing bracket 2501, thereby not affecting the conveying mechanism 10 to transport the IC tray; when the IC tray needs to be pushed out, the flip block is pushed, the torsion spring 2505 is no longer squeezed by the block 2506, thereby releasing the elastic force, causing the flip block to tilt up, thereby achieving the pushing out of the IC tray.

[0115] It should be noted that if the belt alone cannot completely push the IC tray back to the lifting and grasping structure 20, when the motor reverses and most of the tray is pushed back to the lower tray block, the tray pushing mechanism 250 assists in pushing the tray completely back to the lifting and grasping structure 20, and then the IC tray can be pushed onto the lifting and grasping structure 20.

[0116] Specifically, the tray push-out mechanism 250 includes an air joint, a cylinder protection cover, a torsion spring 2505 baffle, and an in-place detection sensor block 2506. Among them, the air joint, the cylinder protection cover, the torsion spring 2505 baffle, and the in-place detection sensor block 2506 are all arranged on the tray push-out bracket 2501.

[0117] like Fig.13As shown, in some embodiments, a screen mounting assembly is provided on the lifting and grasping structure 20, and the screen mounting assembly 40 includes: a screen bracket 4001, a screen 4002, and a screen guard plate 4003. The screen guard plate 4003 is fixed on the screen bracket 4001, the screen 4002 is connected to the screen guard plate 4003, and the screen 4002 is electrically connected to the controller.

[0118] In this embodiment, the screen installation component can control the screen and send instructions to the device.

[0119] like Figure 5 and Figure 8 As shown, the feed door 50 includes: a mounting plate assembly 5002; a door panel assembly 5004, the front of which is connected to the back of the mounting plate assembly 5002; a door lock body 5006, the front of which is connected to the back of the door panel assembly 5004; a handle 5008, which is fixedly connected to the main surface of the mounting plate assembly 5002; and a buckle 5010, which is two in number and is connected to the door. The plate assembly 5004 is connected and respectively arranged on both sides of the door panel assembly 5004; the first anti-foolproofing block 5012, the first anti-foolproofing block 5012 is arranged on one side of the back side of the door lock body 5006; the second anti-foolproofing block 5014, the second anti-foolproofing block 5014 is arranged on the other side of the back side of the door lock body 5006; wherein, the two third sub-disc brackets 3006 are provided with a lock 3214 on one side close to the buckle 5010, and the lock 3214 matches the buckle 5010.

[0120] In this embodiment, the feed door 50 includes a mounting plate assembly 5002, a door panel assembly 5004, a door lock body 5006, a handle 5008, a buckle 5010, a first foolproof block 5012, and a second foolproof block 5014. The back of the mounting plate assembly 5002 is connected to the front of the door panel assembly 5004, the main surface of the mounting plate assembly 5002 is fixedly connected to the handle 5008, and there are two buckles 5010, which are connected to the door panel assembly 5004 and are respectively fixed on both sides of the door panel assembly 5004. A lock buckle 3214 is provided on one side of the third tray bracket 3006 close to the buckle 5010, and the lock buckle 3214 matches the buckle 5010.

[0121] By driving the handle 5008 to move, the buckle 5010 and the lock buckle 3214 are completely aligned, and they are in a locked state, thereby realizing the locking function of the door. In the unlocking process, by driving the handle 5008 to move, the locked state between the buckle 5010 and the lock buckle 3214 is released, so that the door leaf can be opened freely. Among them, by pressing the handle 5008, the feed door 50 can be opened; by lifting the handle 5008, the buckle 5010 will be locked with the lock buckle 3214 along with the feed door 50, so that the feed door 50 is closed.

[0122] The back of the door panel assembly 5004 is fixedly connected to the front of the door lock body 5006, and the two sides of the back of the door lock body 5006 are respectively connected to the front of the first foolproof block 5012 and the front of the second foolproof block 5014. Among them, the IC tray is provided with a first avoidance position and a second avoidance position, the first foolproof block 5012 is adapted to the first avoidance position, and the second foolproof block 5014 is adapted to the second avoidance position. Through the first foolproof block 5012 and the second foolproof block 5014, it can be ensured that the direction of the IC tray is correct when it is placed, thereby reducing the downtime, rework and readjustment caused by the wrong placement of the tray, improving production efficiency, increasing the safety of the equipment, and avoiding the occurrence of errors.

[0123] It is understandable that the feed door 50 can be opened and materials can be placed into it manually. When the feed door 50 is opened, either a loaded IC tray or an empty tray can be placed in the square opening. Specifically, the mounting plate assembly 5002 includes a mounting plate, a spring, and a top screw. The spring is connected to the mounting plate, and the top screw is connected to the spring.

[0124] Specifically, the door panel assembly 5004 includes a door panel body, a rotating shaft, a hinge, a hinge support and a shaft bushing, wherein the rotating shaft, the hinge, the hinge support and the shaft bushing are all connected to the door panel body.

[0125] Specifically, the buckle 5010 is connected to the rotating shaft, the rotating shaft passes through the bushing, the bushing is installed on the door panel assembly 5004, and a retaining spring is installed on the rotating shaft to prevent the buckle 5010 from falling out.

[0126] The following is a workflow of one embodiment of a fully automatic loading and unloading device of the present invention:

[0127] First of all, it should be noted that the fully automatic loading and unloading devices of the present invention work together in groups of two. For ease of understanding, the following content describes the fully automatic loading and unloading devices, distinguishing between the first fully automatic loading and unloading device and the second fully automatic loading and unloading device. In addition, the fully automatic loading and unloading device of the present invention can handle multiple IC trays in one complete operation process. The following content is mainly aimed at the workflow of processing one IC tray among multiple trays. For ease of understanding and to avoid unnecessary ambiguity, the workflow is taken as an example of 20 trays, and the IC trays selected by the present invention are all IC trays that can be stacked together. Such IC trays meet international standards, and the IC trays are used to accommodate chips. In addition, the workflows of the first fully automatic loading and unloading device and the second fully automatic loading and unloading device are consistent, and only appropriate explanations are given for the differences in the placed IC trays to facilitate understanding.

[0128] The first fully automatic loading and unloading device and the second fully automatic loading and unloading device of the present invention are started and operated simultaneously. First, the operator opens the feed door 50 and places 20 IC trays on the tray lifting assembly 210 at the first height. The first fully automatic loading and unloading device places 20 IC trays without chips, and the second fully automatic loading and unloading device places 20 IC trays full of chips.

[0129] Then, the tray lifting assembly 210 rises and drives the 20 IC trays placed on the tray lifting assembly 210 to the third height, and the first tray dividing block 2205 and the second tray dividing block 2304 work together to hold the topmost IC tray on the tray lifting assembly 210 (at this time, if the IC trays are sorted from top to bottom, the first tray dividing block 2205 and the second tray dividing block 2304 hold the first IC tray on the tray lifting assembly 210, and there are 19 IC trays left on the tray lifting assembly 210).

[0130] Then, the tray lifting assembly 210 leads the remaining 19 IC trays to return to the first height (i.e., the initial position), and based on the instruction, the lower tray block 2606 rises and holds the IC tray held by the first tray block 2205 and the second tray block 2304. The first tray block 2205 and the second tray block 2304 are retracted under the action of the first cylinder 2204 and the second cylinder 2303, and the IC tray falls on the lower tray block 2606. The fifth cylinder 2602 drives the lower tray block 2606 to drive the IC tray down to the second height.

[0131] At this time, the tray pushing component 240 pushes the IC tray on the lower tray dividing component 260 onto the conveying mechanism 10, and the conveying mechanism 10 drives the IC tray to move to the tray stopper.

[0132] At this time, the external equipment detects, selects and classifies the chips on the IC tray on the second fully automatic loading and unloading device, and transports the processed chips to the IC tray on the first fully automatic loading and unloading device based on the classification (it should be noted that the first fully automatic loading and unloading device and the second fully automatic loading and unloading device can work simultaneously. Before the external equipment operates, there will be an IC tray without chips placed on the conveying mechanism 10 of the first fully automatic loading and unloading device, and there will be an IC tray full of chips placed on the conveying mechanism 10 of the second fully automatic loading and unloading device; and when the external equipment operates, because the external equipment will transport the processed chips, there will be an IC tray with chips placed on the conveying mechanism 10 of the first fully automatic loading and unloading device, and there will be an IC tray without chips placed on the conveying mechanism 10 of the second fully automatic loading and unloading device. It can be understood that the reason why the chips on the IC tray on the conveying mechanism 10 of the first fully automatic loading and unloading device are not necessarily full is because the external equipment may choose to fill or move them elsewhere according to the classification).

[0133] The conveying mechanism 10 drives the IC tray to move toward the strip-shaped opening, and the IC tray is pushed out of the conveying mechanism 10 by the tray pushing mechanism 250 . The lower tray assembly 260 receives the IC tray pushed out by the tray pushing mechanism 250 .

[0134] The tray lifting assembly 210 rises, and while rising, the tray lifting assembly 210 takes over the IC tray on the lower tray assembly 260. At this time, the IC tray on the lower tray assembly 260 is stacked on the topmost layer of the IC tray on the tray lifting assembly 210 (at this time, there is 1 IC tray with chips and 19 IC trays without chips placed on the tray lifting assembly 210 of the first fully automatic loading and unloading device, and there are 19 IC trays full of chips and 1 IC tray without chips placed on the tray lifting assembly 210 of the second fully automatic loading and unloading device).

[0135] At this time, if the third tray dividing block 2212 and the fourth tray dividing block 2312 are not holding the IC tray, the third cylinder 2211 and the fourth cylinder 2311 work together to drive the third tray dividing block 2212 and the fourth tray dividing block 2312 to separate the topmost IC tray on the tray lifting assembly 210 (here is a description of the first working condition of the third tray dividing block 2212 and the fourth tray dividing block 2312. In the current state, the third tray dividing block 2212 and the fourth tray dividing block 2312 hold 0 IC trays, and the tray lifting assembly 2 There are 20 IC trays on 10, and the IC trays are arranged from top to bottom. The third tray block 2212 and the fourth tray block 2312 hold the first IC tray on the tray lifting assembly 210. If it is the tray lifting assembly 210 of the first fully automatic loading and unloading device, the third tray block 2212 and the fourth tray block 2312 hold an IC tray with chips; if it is the tray lifting assembly 210 of the second fully automatic loading and unloading device, the third tray block 2212 and the fourth tray block 2312 hold an IC tray without chips).

[0136] If the third tray block 2212 and the fourth tray block 2312 are already in a state of holding the IC tray, the IC trays on the tray lifting assembly 210 are arranged from top to bottom, and the first IC tray on the tray lifting assembly 210 rises to below the IC trays on the third tray block 2212 and the fourth tray block 2312. In this case, the first IC tray on the tray lifting assembly 210 may only be 0.1mm to 0.5mm away from the IC trays on the third tray block 2212 and the fourth tray block 2312 (here is a description of the second working condition of the third tray block 2212 and the fourth tray block 2312. In the current state, assuming that the third tray block 2212 and the fourth tray block 2312 hold 1 IC tray, and there are 19 IC trays on the tray lifting assembly 210, at this time the tray lifting assembly 210 rises to below the 1 IC tray held by the third tray block 2212 and the fourth tray block 2312).

[0137] The third tray block 2212 and the fourth tray block 2312 retract under the drive of the third cylinder 2211 and the fourth cylinder 2311, and at this time all the trays on the third tray block 2212 and the fourth tray block 2312 fall onto the pallet assembly 2104 (because the IC trays selected for use in the present invention are all IC trays that can be stacked together, and when the bottom of one IC tray held by the third tray block 2212 and the fourth tray block 2312 is only 0.1mm to 0.5mm away from the top of the 19 IC trays on the tray lifting assembly 210, one IC tray held by the third tray block 2212 and the fourth tray block 2312 can fall on top of the 19 IC trays on the tray lifting assembly 210, and at this time, except for the tray lifting assembly 210 supporting 20 IC trays, no other components touch the IC trays).

[0138] Then, the tray lifting assembly 210 rises to the height of one IC tray, and the third sub-tray block 2212 and the fourth sub-tray block 2312 extend again to embrace the IC tray at the fourth height (so in the case just now, the 20 IC trays of the tray lifting assembly 210 are sorted from top to bottom, and the first IC tray is still at the fourth height, that is, the height of the third sub-tray block 2212 and the fourth sub-tray block 2312. At this time, the tray lifting assembly 210 rises to the height of one IC tray and is sorted from top to bottom, so the second IC tray on the tray lifting assembly 210 is at the fourth height. At this time, the third sub-tray block 2212 and the fourth sub-tray block 2312 extend to embrace the second IC tray on the tray lifting assembly 210, and because the IC trays can be stacked on top of each other, the third sub-tray block 2212 and the fourth sub-tray block 2312 embrace two IC trays). Multiple IC trays can be embraced by the third sub-tray block 2212 and the fourth sub-tray block 2312.

[0139] Until the limit reflection sensor 2314 detects that the height of the IC trays held by the third dividing tray block 2212 and the fourth dividing tray block 2312 is too high, and then issues an alarm through the controller, at this time, the third dividing tray block 2212 and the fourth dividing tray block 2312 of the first fully automatic loading and unloading device should carry 20 IC trays with chips, and the third dividing tray block 2212 and the fourth dividing tray block 2312 of the second fully automatic loading and unloading device should carry 20 IC trays without chips, that is, there are 20 IC trays with chips at the fourth height of the first fully automatic loading and unloading device, and there are 20 IC trays without chips at the fourth height of the second fully automatic loading and unloading device.

[0140] In the claims, specification and drawings of the present invention, the term "multiple" refers to two or more than two. Unless otherwise clearly defined, the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the drawings, which is only for the purpose of more conveniently describing the present invention and making the description process simpler, rather than indicating or implying that the device or element referred to must have the specific orientation described, be constructed and operated in a specific orientation, so these descriptions cannot be understood as limiting the present invention; the terms "connect", "install", "fix" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection between multiple objects, or a detachable connection between multiple objects, or an integral connection; it can be a direct connection between multiple objects, or an indirect connection between multiple objects through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood based on the specific circumstances of the above data.

[0141] In the claims, specification and drawings of the present invention, the description of the terms "one embodiment", "some embodiments", "specific embodiments" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In the claims, specification and drawings of the present invention, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0142] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A fully automatic loading and unloading device, characterized in that: include: A lifting and grabbing structure (20), wherein one side of the lifting and grabbing structure (20) is provided with a strip-shaped opening; A conveying mechanism (10), the conveying mechanism (10) being connected to the lifting and grabbing structure (20), and the conveying mechanism (10) being located below the strip-shaped opening; A controller, the controller being electrically connected to the lifting and grasping structure (20), and the controller being electrically connected to the conveying mechanism (10); The lifting and grabbing structure (20) is used to transport and grab the IC tray in a vertical direction, the vertical direction being a straight line direction parallel to the gravity direction, and the conveying mechanism (10) is used to transport the IC tray in a horizontal direction, the horizontal direction being a straight line direction perpendicular to the gravity direction; The lifting and grabbing structure (20) comprises a first tray bracket (3002), a third tray bracket (3006), a second tray bracket (3004), a first middle tray assembly, a second middle tray assembly, a first upper tray assembly, a second upper tray assembly, a lower tray assembly (260) and a tray pushing assembly (240); The first middle-layer disk-dividing assembly is connected to the first disk-dividing bracket (3002), and the first middle-layer disk-dividing assembly is located at a third height; The second middle-layer disk-dividing assembly is connected to the second disk-dividing bracket (3004), and the second middle-layer disk-dividing assembly is located at the third height; The first upper disk-dividing assembly is connected to the first disk-dividing bracket (3002), and the first upper disk-dividing assembly is located at a fourth height; The second upper layer plate dividing assembly is connected to the second plate dividing support (3004), and the second upper layer plate dividing assembly is located at the fourth height; The number of the lower tray separation components (260) is two, the two lower tray separation components (260) are respectively arranged on the third tray separation bracket (3006), the two lower tray separation components (260) are arranged in a mirror image, the lower tray separation components (260) are located at the second height, and the lower tray separation components (260) can receive the IC material tray located at the third height and lift the IC material tray at the second height; The tray pushing component (240) is fixed on the first tray separation bracket (3002), the tray pushing component (240) faces the strip-shaped opening, the tray pushing component (240) is located at the second height, and the tray pushing component (240) can push the IC tray on the lower tray separation component (260) to the conveying mechanism (10); The lower layer disc separation assembly (260) comprises a fifth cylinder (2602), a lower disc separation block support plate (2604), a lower disc separation block (2606) and a pin shaft (2608); The fifth cylinder (2602) is fixed on the third sub-disk bracket (3006), and the fifth cylinder (2602) is connected to the valve island; The lower disk block support plate (2604) is connected to the fifth cylinder (2602); The lower plate dividing block (2606) is connected to the lower plate dividing block support plate (2604); One end of the pin shaft (2608) is rotatably connected to the lower dividing disk block (2606), and the other end of the pin shaft (2608) is connected to the lower dividing disk block support plate (2604).

2. The fully automatic loading and unloading device according to claim 1 is characterized in that: The lifting and grabbing structure (20) further comprises: The first tray bracket (3002) is provided with a square opening; The number of the third disk-dividing brackets (3006) is two, and the two third disk-dividing brackets (3006) are respectively connected to two sides of the first disk-dividing bracket (3002); The second plate dividing support (3004) is provided with the strip-shaped opening, the second plate dividing support (3004) is connected to the conveying mechanism (10), and two sides of the second plate dividing support (3004) are respectively connected to one side of the third plate dividing support (3006) away from the first plate dividing support (3002); A feeding door (50), the feeding door (50) being detachably connected to the first tray support (3002), the feeding door (50) being located at the square opening, and the shape of the square opening matches the shape of the feeding door (50); A tray lifting component (210), the tray lifting component (210) is electrically connected to the controller, the tray lifting component (210) is located at a first height, and the tray lifting component (210) is used to transport the IC tray in the vertical direction; The first middle-layer tray-dividing assembly and the second middle-layer tray-dividing assembly are used to grab the IC tray located at the third height. The first upper tray separation assembly and the second upper tray separation assembly are used to grab the IC tray located at the fourth height, The first tray-dividing support (3002), the two third tray-dividing supports (3006) and the second tray-dividing support (3004) together form a tray-dividing position, and the tray lifting assembly (210) is partially located in the tray-dividing position. The first height, the second height, the third height and the fourth height increase in sequence.

3. The fully automatic loading and unloading device according to claim 2 is characterized in that: The tray lifting assembly (210) comprises: A first shell (2100), wherein a receiving space is provided in the first shell (2100); A material tray lifting mechanism (2102), the material tray lifting mechanism (2102) is located in the accommodating space, and the material tray lifting mechanism (2102) is electrically connected to the controller; A support plate assembly (2104), the bottom of which is connected to the top of the tray lifting mechanism (2102).

4. The fully automatic loading and unloading device according to claim 3 is characterized in that: The first middle-layer disk-dividing assembly comprises a first mounting plate (2203), a first cylinder (2204) and a first disk-dividing block (2205); the second middle-layer disk-dividing assembly comprises a second mounting plate (2302), a second cylinder (2303), a second disk-dividing block (2304) and a counter-beam sensor (2305); The first mounting plate (2203) is connected to the first disk-dividing bracket (3002), the first mounting plate (2203) is located on both sides of the first disk-dividing bracket (3002), and the first mounting plate (2203) is located at a third height; The first cylinder (2204) is fixed to an end of the first mounting plate (2203) away from the first sub-disk bracket (3002), and the first cylinder (2204) is connected to the valve island; The first disk dividing block (2205) is connected to the first cylinder (2204), and the first cylinder (2204) can drive the first disk dividing block (2205) to move; The second mounting plate (2302) is connected to the second disk-dividing bracket (3004), the second mounting plate (2302) is located on both sides of the second disk-dividing bracket (3004), and the second mounting plate (2302) is located at the third height; The second cylinder (2303) is fixed to an end of the second mounting plate (2302) away from the second sub-disk bracket (3004), and the second cylinder (2303) is connected to the valve island; The second disk-dividing block (2304) is connected to the second cylinder (2303), and the second cylinder (2303) can drive the second disk-dividing block (2304) to move; The through-beam sensor (2305) is arranged on the second mounting plate (2302), the height of the through-beam sensor (2305) is the same as the height of the second tray block (2304), the through-beam sensor (2305) is electrically connected to the controller, and the through-beam sensor (2305) is used to detect whether the IC tray reaches the third height; The number of the first mounting plate (2203), the first cylinder (2204) and the first dividing disk block (2205) are all two. The number of the second mounting plate (2302), the second cylinder (2303), the second partition block (2304) and the corresponding sensor (2305) are all two. There are four first cylinders (2204) and four second cylinders (2303) in total. Two first mounting plates (2203) are provided on the first sub-disk bracket (3002), and two second mounting plates (2302) are provided on the second sub-disk bracket (3004).

5. The fully automatic loading and unloading device according to claim 4 is characterized in that: The first upper disk-dividing assembly comprises a third mounting plate (2210), a third air cylinder (2211) and a third disk-dividing block (2212); the second upper disk-dividing assembly comprises a fourth mounting plate (2310), a fourth air cylinder (2311), a fourth disk-dividing block (2312), a first track (2313) and a limit reflection sensor (2314); The third mounting plate (2210) is connected to the first disk-dividing bracket (3002), the third mounting plate (2210) is located on both sides of the first disk-dividing bracket (3002), and the third mounting plate (2210) is located at a fourth height, which is higher than the third height; The third cylinder (2211) is fixed to an end of the third mounting plate (2210) away from the first sub-disk bracket (3002), and the third cylinder (2211) is electrically connected to the valve island; The third disk-dividing block (2212) is connected to the third cylinder (2211), and the third cylinder (2211) can drive the third disk-dividing block (2212) to move; The fourth mounting plate (2310) is connected to the second disk-dividing bracket (3004), the fourth mounting plate (2310) is located on both sides of the second disk-dividing bracket (3004), and the fourth mounting plate (2310) is located at the fourth height; The fourth cylinder (2311) is fixed to an end of the fourth mounting plate (2310) away from the second sub-disk bracket (3004), and the fourth cylinder (2311) is electrically connected to the valve island; The fourth partitioning disk block (2312) is connected to the fourth cylinder (2311), and the fourth cylinder (2311) can drive the fourth partitioning disk block (2312) to move; The first track (2313) is arranged on one side of the second tray-dividing bracket (3004), and the height of the bottom of the first track (2313) is higher than the fourth height; The position limiting reflection sensor (2314) is slidably arranged on the first track (2313), the position limiting reflection sensor (2314) is electrically connected to the controller, and the position limiting reflection sensor (2314) is used to detect the height of the IC tray located at the fourth height; There are two third mounting plates (2210), two third cylinders (2211) and two third dividing disk blocks (2212). The number of the fourth mounting plate (2310), the fourth cylinder (2311) and the fourth dividing disk block (2312) are all two. There are four third cylinders (2211) and four fourth cylinders (2311) in total. Two third mounting plates (2210) are provided on the first sub-disk bracket (3002), and two fourth mounting plates (2310) are provided on the second sub-disk bracket (3004).

6. The fully automatic loading and unloading device according to claim 5 is characterized in that: A proximity sensor (2202) is provided on one side of the first tray bracket (3002), the proximity sensor (2202) is electrically connected to the controller, a proximity sensor detection block (5016) is provided on one side of the feed door (50), and the proximity sensor (2202) and the proximity sensor detection block (5016) are aligned in the vertical direction; Wherein, the proximity sensor (2202) is used to detect whether the feed door (50) is closed.

7. The fully automatic loading and unloading device according to claim 6 is characterized in that: The tray pushing assembly (240) comprises: The tray is pushed into the bottom plate (2401); A tray pushing cylinder (2402), wherein the tray pushing cylinder (2402) is fixed on the tray pushing base plate (2401), and the tray pushing cylinder (2402) is electrically connected to the controller; A joint assembly (2403), wherein the joint assembly (2403) is connected to the tray pushing cylinder (2402); The tray pushing cylinder (2402) is capable of driving the joint assembly (2403) to move, and the joint assembly (2403) pushes the IC tray located at the second height into the conveying mechanism (10).

8. The fully automatic loading and unloading device according to claim 7 is characterized in that: The transmission mechanism (10) comprises: A conveyor belt body (100), the conveyor belt body (100) being arranged below the strip-shaped opening, the conveyor belt body (100) being electrically connected to the controller, and a material tray stopper being arranged at one end of the conveyor belt body (100) away from the strip-shaped opening; The conveyor belt body (100) is provided with a tray entry position, and the side walls on both sides of the tray entry position are provided with belt track components (110), and the belt track components (110) are used to transport IC trays; A first position sensor (120), the first position sensor (120) is located at a first position of the conveyor belt body (100), the first position sensor (120) is electrically connected to the controller, and the first position sensor (120) is used to detect whether the IC tray reaches the first position; a second position sensor (130), the second position sensor (130) being located at a second position of the conveyor belt body (100), the second position sensor (130) being electrically connected to the controller, and the second position sensor (130) being used to detect whether the IC tray has reached the second position; A positioning locking mechanism (140), wherein the positioning locking mechanism (140) is disposed on one side of the conveyor belt body (100), and the positioning locking mechanism (140) is electrically connected to the controller; A conveying motor, the conveying motor is connected to the conveyor belt body (100), is located on one side of the conveyor belt body (100), and is electrically connected to the controller; A material tray pushing mechanism (250), wherein the material tray pushing mechanism (250) is arranged in the conveyor belt body (100), and the material tray pushing mechanism (250) is located below the belt track assembly (110).

9. The fully automatic loading and unloading device according to claim 8, characterized in that: The tray ejection mechanism (250) comprises: A tray ejecting bracket (2501), wherein the tray ejecting bracket (2501) is provided with a strip-shaped notch; A tray pushing cylinder (2502), wherein the tray pushing cylinder (2502) is fixed on the tray pushing bracket (2501), and the tray pushing cylinder (2502) is electrically connected to the controller; A turning block (2503), the turning block (2503) being connected to the tray pushing cylinder (2502); A push rod bracket (2504), one end of which is connected to the tray pushing cylinder (2502), and the tray pushing cylinder (2502) can drive the push rod bracket (2504) to push the flip block (2503); A torsion spring (2505), one end of the torsion spring (2505) is connected to the other end of the push rod bracket (2504), and the other end of the torsion spring (2505) is connected to the flip block (2503), and the torsion spring (2505) can drive the flip block (2503) to reset; A stopper (2506), the stopper (2506) being connected to the tray pushing bracket (2501) and being located at one end of the strip-shaped notch adjacent to the tray pushing cylinder (2502); The tray ejecting cylinder (2502) is capable of driving the flip block (2503) to move and eject the IC tray.

Images