Low-density high-performance insulation board and preparation method thereof

Abstract

The invention belongs to the technical field of building board preparation, and relates to a low-density high-performance insulation board and a preparation method thereof. The composite material is prepared from the following substances in parts by weight: 1-2 parts of ceramic microbeads, 1-3 parts of clay, 0.5-2 parts of mica, 2-4 parts of diatomite particles, 1-2 parts of glass fibers, 0.5-2 parts of vermiculite, 1-2 parts of perlite, 0.5-1 part of glass microbeads and 0.8-1.5 parts of magnesium oxide. The thermal insulation board provided by the invention has excellent thermal insulation performance, can be used as a residential building thermal insulation material, and can also be used as an industrial special thermal insulation material. The fire-proof barbecue grill has good fire-proof performance and cannot be ignited at the temperature of open fire barbecue. The sound absorption effect is good, and the finished heat insulation board has a good sound absorption function due to the fact that the raw materials of the heat insulation board are all hollow loose materials. The insulation board provided by the invention is excellent in environmental protection performance, and has the characteristics of no smoke, no odor, no color, no dust and no toxicity.

Description

Technical Field

[0001] The invention belongs to the technical field of building board preparation, and relates to a low-density high-performance insulation board and a preparation method thereof. Background Art

[0002] Insulation board is a common building material, which is fixed by embedding in the wall or sticking on the wall. At present, due to the problem of high overall density and insufficient strength, insulation board is usually fixed by splicing multiple pieces in actual construction. This construction method is cumbersome and not beautiful enough, and there are also problems such as insufficient sealing at the joints. In addition, the existing insulation boards have limited effects in terms of comprehensive performance, such as poor fire prevention and sound absorption, and are not environmentally friendly. Summary of the invention

[0003] Aiming at the problems existing in traditional thermal insulation boards, the present invention proposes a novel low-density high-performance thermal insulation board and a preparation method thereof.

[0004] In order to achieve the above object, the present invention is implemented by adopting the following technical solutions: A low-density, high-performance insulation board is prepared from the following materials in parts by weight: 1-2 parts of ceramic microbeads, 1-3 parts of clay, 0.5-2 parts of mica, 2-4 parts of diatomaceous earth particles, 1-2 parts of glass fiber, 0.5-2 parts of vermiculite, 1-2 parts of perlite, 0.5-1 parts of glass microbeads, and 0.8-1.5 parts of magnesium oxide.

[0005] Preferably, the low-density, high-performance insulation board is prepared from the following materials in parts by weight: 1 part of ceramic microspheres, 1.2 parts of clay, 0.8 parts of mica, 2.1 parts of diatomaceous earth particles, 1 part of glass fiber, 1 part of vermiculite, 1.5 parts of perlite, 0.6 parts of glass microspheres, and 0.8 parts of magnesium oxide.

[0006] The present invention provides a method for preparing a low-density, high-performance insulation board, the steps of which are as follows: (1) Ceramic microbeads, clay, mica, diatomaceous earth particles, glass fiber, vermiculite, perlite, glass microbeads, and magnesium oxide are mixed evenly according to a certain proportion, a binder is added, and the mixture is fully mixed to obtain a masterbatch.

[0007] (2) Place a layer of paper in the mold, evenly spread part of the masterbatch into the mold, then cover the surface of the masterbatch with a layer of fiber mesh cloth, evenly spread the remaining masterbatch on the top of the fiber mesh cloth, and then cover the surface with another piece of paper. Press it into shape using a press to obtain a wet material board.

[0008] (3) Dry the wet board for more than 4 hours to obtain an insulation board.

[0009] Preferably, the preparation process of the adhesive in step (1) is as follows: polyurethane is added to dimethylformamide and mixed evenly to obtain solution A, sodium alginate is added to water to obtain a sodium alginate solution, and the mixture is stirred until the mixture is evenly mixed, and then solution A is slowly added under stirring, and stirring is continued for more than 5 hours; then, a silane coupling agent and nano zinc oxide particles are added under continuous stirring, and stirring is continued for 2-3 hours to obtain an adhesive.

[0010] Preferably, the molecular weight of the polyurethane is 50-80k, the mass fraction of the polyurethane in solution A is 15-17%, the mass fraction of the sodium alginate solution is 6-7%, the volume ratio of solution A to the sodium alginate solution is 1:2-3, the mass ratio of sodium alginate: silane coupling agent: nano zinc oxide particles is 1: (0.5-0.8): (0.1-0.3), and the silane coupling agent is KH550 or KH560.

[0011] Preferably, the total thickness of the wet material plate in step (2) is 12±0.5 mm, and the drying temperature in step (3) is 90-200°C.

[0012] The adhesive prepared by the method of the present invention can be used in combination with a masterbatch to increase the compressive and flexural strengths of the insulation board, so that the insulation board can be used for the entire wall during actual decoration, the construction is convenient, there are no structural defects when multiple boards are overlapped, and it has good sound insulation and heat insulation effects.

[0013] Compared with the prior art, the advantages and positive effects of the present invention are: 1. The thermal insulation board proposed by the present invention has excellent thermal insulation performance and can be used as a residential building thermal insulation material or as an industrial special thermal insulation material.

[0014] 2. It has good fire resistance and will not ignite at the temperature of open flame barbecue.

[0015] 3. Good sound absorption effect. Since the raw materials of the insulation board are hollow loose materials, the finished insulation board has good sound absorption function.

[0016] 4. The thermal insulation board provided by the present invention has excellent environmental performance and is smokeless, odorless, colorless, dust-free and non-toxic. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is the state of the sample prepared in Example 1 after being baked for 1 hour. DETAILED DESCRIPTION

[0018] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below in conjunction with specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0019] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0020] Example 1 10g of ceramic microspheres, 12g of clay, 8g of mica, 21g of diatomaceous earth particles, 10g of glass fiber, 10g of vermiculite, 15g of perlite, 6g of glass microspheres, and 8g of magnesium oxide were mixed evenly, and then 55g of homemade adhesive was added, and the mixer was slowly stirred at 100rpm for 30min. The above materials were provided by Gaotang County Zhongxin New Materials Co., Ltd.

[0021] The preparation process of the homemade adhesive is as follows: 50 ml of dimethylformamide solution containing 16.8% polyurethane (average molecular weight 65k) is measured, and 100 ml of sodium alginate aqueous solution with a mass fraction of 6.5% is slowly added under stirring. The stirring rate is 250 rpm, and the total addition time of the sodium alginate aqueous solution is controlled at 5-10 min. After the sodium alginate solution is added, continue to stir and mix at 250 rpm for 6 hours. Then add 3.8 g of KH550 and 1.4 g of nano zinc oxide (aladdin, particle size ≤15 nm) at a stirring rate of 250 rpm, continue stirring for 3, and obtain the adhesive for use. Note: After the adhesive is prepared, if it is not used for more than 10 minutes, it needs to be stirred at 200-300 rpm for more than 5 minutes before use.

[0022] A layer of paper (Gaotang County Zhongxin New Materials Co., Ltd., model MPK-568, ordinary waterproof paper can also be used) is laid in the square mold with demoulding at the bottom, half of the masterbatch is evenly spread in the mold, and then a layer of fiber mesh cloth (Hu City Jingfeng Chemical Fiber Co., Ltd., thickness 2mm) is covered on the surface of the masterbatch, and then the remaining masterbatch is evenly laid on the upper part of the fiber mesh cloth, and then a piece of MPK-568 paper is covered on the surface. The total thickness of the masterbatch in the mold is controlled at 15±1mm. When the press is pressed, the pressure of the press is controlled to reduce the overall compression thickness of the masterbatch by about 3mm. After the press is pressed and formed, a wet plate is obtained, and the total thickness of the wet plate is 12±0.5mm. The wet plate is added to a 90℃ drying room and dried for 4h to obtain an insulation board.

[0023] Cut the insulation board into 5cm*5cm size for testing, bake it for 1 hour at 1100℃ on the front and 80℃ on the back. Figure 1 After testing, it was found that under this condition, there was no obvious dent on the surface of the insulation board, no smoke or odorous gas appeared during baking.

[0024] Example 2 Unless otherwise specified in this example, the conditions and preparation process are consistent with those in Example 1.

[0025] 20 g of ceramic microbeads, 10 g of clay, 5 g of mica, 40 g of diatomaceous earth particles, 15 g of glass fiber, 18 g of vermiculite, 10 g of perlite, 10 g of glass microbeads, and 12 g of magnesium oxide were mixed evenly, and then 68 g of homemade adhesive was added, and the mixer was slowly stirred at 100 rpm for 30 min.

[0026] Place a layer of paper in a square mold with a demoulding bottom, evenly spread half of the masterbatch into the mold, then cover the surface of the masterbatch with a layer of fiber mesh cloth, evenly spread the remaining masterbatch on the upper part of the fiber mesh cloth, and then cover the surface with another piece of paper. Put the wet material board into a 100℃ oven and dry it for 4 hours to obtain an insulation board.

[0027] The insulation board was cut into 5cm*5cm specifications for testing. It was baked for 1 hour at 1100℃ on the front and 40℃ on the back. There was no obvious dent on the surface of the insulation board, no smoke or odorous gas appeared during baking.

[0028] Other test properties of the insulation boards prepared in Example 1 and Example 2 are shown in Table 1 below.

[0029] Table 1 Insulation board performance test results After use on actual building walls and long-term irregular testing, the insulation board prepared by the present invention can still have high strength under the specifications of 3m long and 1.2m wide (the corresponding mold can be commercially customized). Therefore, the solution provided by the present invention can use a whole piece of insulation board for the entire wall, which is convenient for construction and has good insulation effect. In addition, the insulation board provided by the present invention has excellent heat insulation and sound insulation properties and is suitable for large-scale promotion and use.

[0030] Comparative Example 1 The adhesive in Example 1 was replaced with conventional board adhesives produced by commercially available Nippon and Carpoly, and the rest of the preparation and testing processes were consistent with Example 1. The obtained insulation board was baked at 1100°C on the front side and 80°C on the back side for 1 hour. During the testing, it was found that the board made with Nippon adhesive had bulging; while the adhesive of Carpoly had obvious cracks.

[0031] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A low-density, high-performance insulation board, characterized in that: Prepared from the following materials in parts by weight: 1-2 parts of ceramic microbeads, 1-3 parts of clay, 0.5-2 parts of mica, 2-4 parts of diatomaceous earth particles, 1-2 parts of glass fiber, 0.5-2 parts of vermiculite, 1-2 parts of perlite, 0.5-1 parts of glass microbeads, and 0.8-1.5 parts of magnesium oxide.

2. The low-density, high-performance insulation board according to claim 1, characterized in that: It is prepared from the following materials in parts by weight: 1 part of ceramic microspheres, 1.2 parts of clay, 0.8 parts of mica, 2.1 parts of diatomaceous earth particles, 1 part of glass fiber, 1 part of vermiculite, 1.5 parts of perlite, 0.6 parts of glass microspheres, and 0.8 parts of magnesium oxide.

3. The method for preparing the low-density high-performance insulation board according to claim 1 or 2, characterized in that: Here are the steps: (1) Ceramic microbeads, clay, mica, diatomaceous earth particles, glass fiber, vermiculite, perlite, glass microbeads, and magnesium oxide are mixed evenly according to a certain proportion, a binder is added, and the mixture is fully mixed to obtain a masterbatch; (2) Lay a layer of paper in the mold, evenly spread part of the masterbatch into the mold, then cover the surface of the masterbatch with a layer of fiber mesh cloth, evenly spread the remaining masterbatch on the top of the fiber mesh cloth, and then cover the surface with another piece of paper, and press it into shape by a press to obtain a wet material plate; (3) Dry the wet board for more than 4 hours to obtain an insulation board.

4. The method for preparing the low-density high-performance insulation board according to claim 3, characterized in that: The preparation process of the adhesive in step (1) is as follows: polyurethane is added to dimethylformamide and mixed evenly to obtain solution A, sodium alginate is added to water to obtain a sodium alginate solution, and the mixture is stirred until the mixture is evenly mixed. Then, solution A is slowly added under stirring and stirring is continued for more than 5 hours. Then, a silane coupling agent and nano zinc oxide particles are added under continuous stirring and stirring is continued for 2-3 hours to obtain an adhesive.

5. The method for preparing a low-density, high-performance insulation board according to claim 4, characterized in that: The molecular weight of the polyurethane is 50-80k, the mass fraction of the polyurethane in solution A is 15-17%, the mass fraction of the sodium alginate solution is 6-7%, the volume ratio of solution A to the sodium alginate solution is 1:2-3, the mass ratio of sodium alginate: silane coupling agent: nano zinc oxide particles is 1: (0.5-0.8): (0.1-0.3), and the silane coupling agent is KH550 or KH560.

6. The method for preparing the low-density high-performance insulation board according to claim 3, characterized in that: The total thickness of the wet material plate in step (2) is 12±0.5 mm, and the drying temperature in step (3) is 90-200° C.

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