Temperature dependent calibration of mobile detection device

Abstract

An electronic system has a board having a thermal interface with an exposed surface. A thermoelectric device is placed against the thermal interface to heat the plate. Heat is transferred through the plate from a first area in which the thermal interface is located to a second area in which the electronic device is mounted. The electronic device has a temperature sensor that detects a temperature of the electronic device. The temperature of the electronic device is used to calibrate an accelerometer and a gyroscope in the electronic device. The calibration data includes a temperature and a corresponding acceleration offset and a corresponding angular offset. The on-site computer simultaneously senses temperatures, accelerations, and angles from the temperature sensors, accelerometers, and gyroscopes and adjusts the measured data using offset data at the same temperature. The field computer provides the corrected data to the controlled system.

Description

[0001] This application is a divisional application of an application with a filing date of July 23, 2019, a PCT international application number of PCT / US2019 / 043099, a Chinese national phase application number of 201980060018.1, and an invention name of “Temperature-dependent calibration of mobile detection equipment”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims priority to U.S. Provisional Patent Application No. 62 / 702,870, filed on July 24, 2018, the entire contents of which are incorporated herein by reference in their entirety. Technical Field

[0004] The present invention generally relates to electronic systems, methods of constructing electronic systems, and methods of operating electronic devices, and more particularly, to calibration of mobile detection devices. Background Art

[0005] Electronic devices such as semiconductor chips often include motion detection devices such as accelerometers and gyroscopes. Accelerometers can detect the acceleration of an electronic device in a specified direction, and gyroscopes can detect angular changes in an electronic device. Such measurement devices are often manufactured using micro-electromechanical systems (MEMS) technology. Summary of the invention

[0006] The present invention provides an electronic system including a board. The board may include: a structural material; a heat pipe on the structural material, the heat pipe having a higher thermal conductivity than the structural material and having a first region, a second region, and a connecting portion connecting the first region to the second region; a thermal interface on the structural material, the thermal interface having a higher thermal transfer capacity than the structural material and attached to the first region of the heat pipe; and an electronic device mounted to the board at the second region of the heat pipe, the heat pipe forming a thermal path between a surface of the thermal interface and the electronic device.

[0007] The present invention also provides a method for constructing an electronic system, comprising: constructing a board, which includes forming a heat pipe on a structural material, the heat pipe having a heat transfer capacity higher than that of the structural material and having a first area, a second area, and a connecting portion connecting the first area to the second area; forming a thermal interface on the structural material, the thermal interface having a heat transfer capacity conductivity higher than that of the structural material and attached to the first area of ​​the heat pipe; and mounting an electronic device to the board at the second area of ​​the heat pipe, the heat pipe forming a thermal path between a surface of the thermal interface and the electronic device.

[0008] The present invention also provides a method for operating an electronic device, comprising: operating the electronic device mounted to a board; positioning a thermal device adjacent to a thermal interface of the board formed on a structural material of the board; and transferring heat between the thermal device and the electronic device via a heat pipe located on the structural material, the heat pipe having a higher heat transfer capacity than the structural material and having a first area attached to the thermal interface, a second area located at the electronic device, and a connecting portion connecting the first area to the second area. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The present invention is described by way of example with reference to the accompanying drawings, in which:

[0010] Figure 1 is a top view in a first plane of an electronic system according to an embodiment of the present invention;

[0011] Figure 2 yes Figure 1 A cross-sectional side view of the electronic system in a second plane on 2-2 in FIG.

[0012] Figure 3 yes Figure 1 A cross-sectional side view of the electronic system in the third plane on 3-3 in FIG.

[0013] Figure 4 is similar to Figure 1 and also showing an electronic device forming part of the electronic system;

[0014] Figure 5 yes Figure 4 A cross-sectional side view at 5-5 in which a close-up detailed view of the electronic device is shown;

[0015] Figure 6 is a cross-sectional side view of the electronic system, which also shows a calibration station;

[0016] Figure 7 is a cross-sectional side view of an electronic system, which also illustrates the use of a calibration station to heat and calibrate the electronic equipment of the electronic system;

[0017] Figure 8 is a cross-sectional side view of the electronic system, which also shows the field computer and the controlled system using the calibration data; and

[0018] Fig. 9 is a cross-sectional side view of an electronic system according to another embodiment of the present invention. DETAILED DESCRIPTION

[0019] Output readings from mobile detection devices such as accelerometers and gyroscopes can be affected by temperature changes in the device, thereby introducing temperature-dependent errors in the output measurements. For example, a stationary accelerometer should provide an output measurement corresponding to the acceleration of gravity; however, when the accelerometer is subjected to different temperatures, the output measurement will be different due to the error associated with the accelerometer at a higher temperature. Because the output should not change when the accelerometer is stationary, that is, the acceleration is still just gravity regardless of the temperature, the output measurement error associated with temperature can be isolated by finding the difference (or "offset") between the erroneous measurement and the known baseline measurement (gravity in the case of the accelerometer). By performing this measurement comparison at multiple temperatures, many data points are collected, and the offset distribution over the temperature range can be obtained. A collection of data associating temperature with a specific offset reading can be compiled for each mobile detection device during the calibration process. The data can be stored in a table as calibration data for lookup or extrapolation, or can be used to define a best fit function. The calibration data may be accessed by a virtual reality, augmented reality, or mixed reality system to obtain an adjusted measurement from the mobile detection device given the temperature of the mobile detection device and its initial "raw" measurement.

[0020] A calibration system and process for improving calibration accuracy are described herein. Known methods for calibrating mobile detection devices involve contacting the mobile detection device with a thermal probe to introduce heat by conduction or require actively blowing air on the mobile detection device to adjust its temperature by convection. Both methods can move the device so that the measurements obtained from the device during calibration will include errors associated with temperature and errors associated with movement introduced by the measurement method. Because it is impossible to know how much movement the measurement method introduces, it is impossible to isolate the errors associated with temperature. As a result, errors cannot be accurately removed from the original output measurements of the device. In virtual, augmented and mixed reality systems, the accuracy of the measurements obtained by the device is crucial for determining where to display virtual content to the user relative to the movement between the user and the real or virtual environment. Therefore, there is a need for a highly accurate calibration system and method in a virtual, augmented or mixed reality device.

[0021] Figure 1 , 2 3 show an electronic system 10 according to an embodiment of the present disclosure. Figure 1 is a top view of an example configuration of board 12 in electronic system 10 . Figure 2 yes Figure 1 2-2 is a cross-sectional side view. Figure 3 yes Figure 1The electronic system 10 includes a board 12 formed of a plurality of different material layers. An electronic device 14 (see FIG. 1 ) such as a sensor or a sensor assembly connected to the board 12 Figure 4 and 5 The layers and various features provided therein provide specific functions during calibration and use of the device as discussed above.

[0022] The board 12 is composed of a structural material 22, such as a FR4 dielectric, and a thermally and electrically conductive material, such as a metal component 24. The metal component 24 may include a copper material. The metal of the metal component 24 is more thermally conductive and therefore has a higher heat transfer capability than the structural material 22. The metal of the metal component 24 is electrically conductive and the structural material 22 is electrically insulating.

[0023] Multiple layers of structural material 22 may be included in the panel 12, such as Figure 2 and Figure 3 As shown in the example of , two structural layers 28 and 30 may be provided. The metal component 24 may be disposed between layers of the structural material 22. For example, the metal component 24 may include first, second and third metal layers 34, 36 and 38 separated by a first structural layer 28 and a second structural layer 30. The board 12 also includes a top insulating layer 32 and a bottom insulating layer 26 covering the first and third metal layers 34 and 38. The top insulating layer 32 and the bottom insulating layer 26 may include an electrically insulating solder resist material 25.

[0024] The metal component 24 also includes a first set of vias 40 and a second set of vias 42, respectively. The first set of vias 40 connects a portion of the first metal layer 34 to a portion of the second metal layer 36. The second set of vias 42 connects a portion of the second metal layer 36 to a portion of the third metal layer 38. Thus, the metal layers 34, 36, and 38 are electrically and thermally connected to each other. The metal layers 34, 36, and 38, together with the first set of vias 40 and the second set of vias 42, form a heat pipe of thermally conductive material that connects a first region 46 of the heat pipe to a second region 48 of the heat pipe.

[0025] Portions of the third metal layer 38 are isolated as metal lines 76 to serve as traces for electrical signals. These metal lines 76 can be isolated from each other and from other metal components 24 so that each line is surrounded by non-conductive materials, such as structural material 22 and insulating solder resist material 25. Those skilled in the art will appreciate that more or less than three metal lines 76 may be provided depending on the design of the electronic device 14 mounted to the board 12 at the second region 48. The metal lines 76 may be disposed in one or more metal layers in the board 12. In addition, although the metal lines 76 are shown as exposed portions of the metal components 24, portions of the metal lines 76 may also be coated with insulating solder resist material 25.

[0026] Metal component 24 also includes thermal interface 52. Thermal interface 52 is an area of ​​third metal layer 38 at first area 46 that is exposed by removing a portion of top insulating layer 32. Thermal interface 52 is an upper surface 54 of third metal layer 38 that is exposed and configured to contact a portion of electronic device calibration station 80. Upper surface 54 forms only a portion of the upper surface of board 12, with the remainder of the upper surface being comprised of structural layer 30 and the upper surface of the insulating solder mask layer.

[0027] Reference Figure 1 and 2 , the first, second, and third metal layers 34, 36, 38 have an inner portion 58 and an outer portion 60. The structural material 22 forms a plurality of barriers 62 that distinguish the inner portion 58 from the outer portion 60. The barriers 62 act as a thermal barrier to prevent heat from being conducted from the inner portion 58 of the second metal layer 36 to the outer portion 60, so that the outer portion 60 remains cooler than the inner portion 58, and additional electronic components can be connected to the board 12. Such components can be connected to the board 12 at the outer portion 60 to prevent the components from experiencing high heat during the calibration process.

[0028] Reference Figure 1 and 3 It can be seen that the first, second and third metal layers 34, 36, 38 also have connecting portions 64 connecting the inner portion 58 to the outer portion 60. The connecting portions 64 ensure that the metal layers are electrically grounded so that an equal reference voltage exists between the inner portion 58 and the outer portion 60.

[0029] See attached Figure 1 and 2 , it can be seen that similar thermal barriers 62 are formed at one or more locations within the first, second and third metal layers 34, 36 and 38 ( Figure 1 ), and each metal layer has a corresponding connecting portion 64 connecting its inner and outer regions. The barrier 62 prevents or at least slows down the transfer of heat from the inner portion 58 to the outer portion 60 to protect other components attached to the board 12 from being subjected to high temperatures during calibration of the electronic device 14.

[0030] refer to Figure 4 and 5 , electronic system 10 also includes electronic device 14 and system storage 18. Electronic device 14 is mounted to the upper surface of board 12 via connection 74. Electronic device 14 and thermal interface 52 are within barrier 62 defining interior portion 58. Electronic device 14 is mounted over second region 48 of heat pipe as described above.

[0031] The electronic system 10 also includes a board interface 16 that is attached to the board 12 and connected to measurement devices in the electronic device 14. The electronic device 14 includes a structural body 66 and a plurality of measurement devices in the structural body 66. The measurement devices include a temperature sensor 68 and two movement detection devices in the form of an accelerometer 70 and a gyroscope 72. Although two movement detection devices are used for the purpose of this embodiment, various aspects of the present invention can be implemented using only one measurement device. For example, an electronic device having only a gyroscope or only an accelerometer can be calibrated. The structural body 66 can be, for example, a silicon or other semiconductor structural body that can be packaged using conventional packaging techniques. The temperature sensor 68, the accelerometer 70, and the gyroscope 72 are connected to the board interface 16 via connections 74 on the upper surface of the board 12 and metal lines 76 in the board 12. Data traces from the temperature sensor 68, the accelerometer 70, and the gyroscope 72 are routed to a microprocessor 73 in the structural body 66 that serves as an input / output interface for the measurement devices. The system memory 18 is used to store calibration data associated with the accelerometer 70 and the gyroscope 72 received from the calibration station 80. The system memory 18 may include, for example, solid-state memory. The system memory 18 is shown as being near the electronic device 14, however, the system memory may be a remote memory located on a cloud-based storage or located on other areas of the electronic device so that it is in contact with the board 12. Those skilled in the art will appreciate that the system memory 18 may be located anywhere in communication with the electronic device 14 to allow data transfer between the electronic device 14 and the system memory 18. The system memory 18 does not include data immediately after the electronic system 10 has been assembled (that is, before undergoing calibration), but is uniquely associated with the electronic device 14 by enabling data to be transferred between the electronic device 14 and the system memory 18.

[0032] Figure 6Also shown is a calibration station 80 for calibrating the accelerometer 70 and the gyroscope 72. The calibration station 80 includes a frame 82, a calibration computer 84, a calibration computer interface 86, a thermoelectric device 88, a transformer 90, and a power connector 92. The components of the calibration station 80 are mounted in a stationary position relative to each other via the frame 82. The spacing between the calibration computer interface 86 and the thermoelectric device 88 is the same as the spacing between the board interface 16 and the thermal interface 52. The calibration computer 84 is connected to the calibration computer interface 86 so that signals can be passed between the calibration computer 84 and the calibration computer interface 86. Information from the microprocessor 73 can be accessed by the calibration station 80. The calibration computer 84 is connected to the power connector 92 so that power can be provided to the calibration computer 84 through the power connector 92. The thermoelectric device 88 is connected to the power connector 92 through the transformer 90. Power can be provided by the power connector 92 and provided to the thermoelectric device 88 through the transformer 90. The transformer 90 reduces the voltage provided by the power connector 92 before providing power to the thermoelectric device 88. Thermoelectric device 88 is preferably a reversible heat pump, such as a thermoelectric cooler, that can provide heat into board 12 or pull heat out of board 12. This flexibility to achieve a wide range of temperatures on board 12 and therefore at electronic device 14 can improve the calibration accuracy of electronic device 14.

[0033] In use, the electronic system 10 is in contact with a portion of the calibration station 80. As the electronic system 10 and the calibration station 80 move relative to each other, the calibration computer interface 86 is connected to the board interface 16 and can begin receiving data from the electronic device 14 while the thermoelectric device 88 is in contact with the thermal interface 52. In the described embodiment, the calibration computer interface 86 and the board interface 16 are wired interfaces that contact each other to create a communication link and can release each other to disconnect the communication link. Data is received through wired communication between the electronic system 10 and the calibration station 80. In another embodiment, the calibration station 80 and the board may include a wireless interface that creates a wireless link for data transfer and then disconnects the wireless link.

[0034] Power is provided to the calibration computer 84 through the power connector 92 to power the calibration computer 84. Power is also provided to the thermoelectric device 88 through the power connector 92 and the transformer 90.

[0035] The entire electronic system 10 can be calibrated initially at room temperature, for example, approximately 21° C. The temperature sensor 68 ( Figure 5) provides an output of temperature to a calibration computer 84. The accelerometer 70 and gyroscope 72 simultaneously provide an output to the calibration computer 84 that is associated with the output temperature from the temperature sensor 68. The baseline outputs of the accelerometers and gyroscopes are known because the device is stationary or established at a reference temperature (such as room temperature). These baseline outputs are used later in the calibration process to isolate errors ("offsets") in the measurements associated with temperature changes of the sensors.

[0036] Figure 7 The calibration computer 84 is shown connected to the system memory 18 and records calibration data 96 in the system memory 18 when the calibration offset is calculated. The first entry in the table of calibration data 96 includes the initial temperature (in this example, 21° C.), the acceleration offset (calculated by finding the difference between the acceleration measurement at temperature and the known acceleration), and the angle offset (calculated by finding the difference between the gyro measurement at temperature and the known position information) calculated for a given temperature sensor measurement using inputs from the accelerometer 70 and gyroscope 72, respectively.

[0037] Thermoelectric device 88 has an upper surface at a temperature below room temperature and a lower surface at a temperature above room temperature. Heat is transferred from the high temperature, lower surface of thermoelectric device 88 through upper surface 54 of thermal interface 52 into thermal interface 52. The heat transfer is primarily by conduction. The heat is then conducted to first and second metal layers 34 and 36 through third metal layer 38 and first and second groups of vias 40 and 42. The heat is then conducted outwardly toward second region 48 from first region 46 closest to the heat source through first, second and third metal layers 34, 36 and 38. Barrier 62 prevents or at least substantially blocks heat from being transferred from interior portion 58 to exterior portion 60.

[0038] The heating of the second region 48 causes its temperature to increase. Heat conduction through the metal layers 34, 36, 38 and the thermal vias 40, 42 occurs rapidly, while significantly slower heat conduction occurs in the structural layers 28, 30. Conduction through the top metal layer 38 evenly distributes heat under the electronic device 14 in the second region 48. The increased temperature of the second region 48 results in heat transfer caused by conduction through the connection 74 and passive convection through the air around the electronic device 14. This method of heating the electronic device 14 closely mimics the field conditions that the electronic device 14 will experience. The temperature sensor 68 continues to detect the temperature of the electronic device 14. The calibration computer 84 samples the temperature of the temperature sensor 68 at predetermined intervals (e.g., every five seconds) or more frequently to improve accuracy. While the calibration computer 84 samples the temperature from the temperature sensor 68, the calibration computer 84 also samples the outputs from the accelerometer 70 and the gyroscope 72. The calibration computer 84 then calculates and stores each temperature and each acceleration offset and each angle offset using the calibration data 96. As previously described herein, each temperature is associated with an acceleration offset component and an angle offset component within the measurement readings of the accelerometer and gyroscope, respectively. The offset distribution can be obtained by measuring the output of each sensor across a range of temperatures, each time subtracting the known value that the sensor should measure from the actual measurement to calculate the error. Thus, each temperature has a different acceleration offset and angle offset associated with it, even if the accelerometer 70 and gyroscope 72 remain stationary from one measurement to the next. In some embodiments, multiple measurements are obtained at each temperature, and an average offset is calculated to improve accuracy.

[0039] When sufficient data is collected, calibration station 80 removes contact with board 12. Calibration computer interface 86 writes the collected calibration data to system memory 18 and disconnects from board interface 16. Thermoelectric device 88 is disengaged from thermal interface 52. Heat is convected and conducted from electronic device 14 until the entire electronic device 14 returns to room temperature.

[0040] The above-described calibration system and process does not require physical contact between the calibration station and the electronic device 14, and also does not require forced convection across the electronic device 14. Instead, the electronic device 14 is heated by conduction through the permanent connection to the board 12 (connection 74 and metal wire 76) and by passive convection, without the need for additional probe contact with the electronic device 14 or forced air blowing over the electronic device 14. Therefore, the electronic device 14 can be calibrated for temperature without disturbing the accelerometer 70 or gyroscope 72. This system and process allows for more accurate offset calibration while simulating real field conditions of the sensor on the board electronics 14.

[0041] Figure 8An electronic system is shown in combination with an on-site computer 100, an on-site computer interface 102, and a controlled system 104. The controlled system 104 may be, for example, a virtual reality, augmented reality, or mixed reality device. The on-site computer 100 is connected to the on-site computer interface 102. The controlled system 104 is connected to the on-site computer 100. The on-site computer 100 may be, for example, a computer that processes movement data for an augmented reality viewing system, and the controlled system 104 may be a vision processing system for the viewing device. The on-site computer 100 is connected to the system storage 18 and has access to the calibration data 96.

[0042] In use, the electronic system 10 moves, for example, in a linear direction or a rotational direction. The accelerometer 70 and the gyroscope 72 detect such movement of the electronic system 10. The field computer 100 senses the signals received from the temperature sensor 68, the accelerometer 70, and the gyroscope 72. The field computer 100 uses the temperature detected by the temperature sensor 68 to find the corresponding temperature in the calibration data 96. The calibration data 96 may include a table with data as described above, or may include a formula representing the calibration data, such as a linear regression. The field computer 100 retrieves the acceleration offset and the angle offset corresponding to the temperature measured by the temperature sensor 68 in the calibration data 96. Then, the field computer 100 adjusts the acceleration detected by the accelerometer 70 by the acceleration offset (acceleration=measured acceleration-acceleration offset). The field computer 100 also adjusts the angle measured by the gyroscope 72 by the angle offset corresponding to the temperature (adjusted angle=measured angle-angle offset). Then, the field computer 100 provides the adjusted acceleration and the adjusted angle to the controlled system 104. The controlled system 104 utilizes the adjusted acceleration and the adjusted angle in one or more formulas. By way of example, the controlled system 104 adjusts the placement of the rendered image in the augmented reality or mixed reality viewing device according to a placement formula using the adjusted acceleration and the adjusted angle received from the live computer 100.

[0043] Fig. 9 Alternative embodiments are shown, in which heat pipes are provided by any known heat sink that can be built into the chip. In some embodiments, the heat sink can be a heat pipe 110. Heat pipe 110 has an evaporator end 112 and a condenser end 114. Evaporator end 112 is positioned close to thermal interface 52 or positioned adjacent to thermal interface 52, and condenser end 114 is positioned adjacent to electronic device 14. In use, thermal interface 52 heats the liquid in heat pipe 110 and evaporates the liquid. The resulting vapor flows from evaporator end 112 to condenser end 114 and condenses. Then, the resulting condensed liquid flows back to evaporator end 112 from condenser end 114 through a wicking system.

[0044] Figures 1 to 8One type of heat pipe constructed from a thermally conductive metal is shown. Figures 1 to 8 The design in is relatively cheap to manufacture. Fig. 9 A different type of heat conduit in the form of a heat pipe is shown. Heat pipes can transfer more heat through flow than heat-conducting metals, but are more expensive to manufacture. Figures 1 to 8 The heat pipe provided by the heat conductive metal in the Fig. 9 The heat pipes in the heat pipes 52 provide heat conduits that both have a higher heat transfer capability than the structural material 22 of the board 12 , and both form a thermal path between the surface of the thermal interface 52 and the electronic device 14 .

[0045] Although certain exemplary embodiments have been described and shown in the drawings, it is to be understood that such embodiments are merely illustrative and not restrictive of the invention, and that the invention is not limited to the specific construction and arrangements shown and described, as modifications may occur to those skilled in the art.

Claims

1. An electronic system comprising: Board, including: Structural materials; a heat pipe on the structural material, the heat pipe having a thermal conductivity higher than that of the structural material and having a first region, a second region, and a connecting portion connecting the first region to the second region, the first region and the second region being horizontally spaced apart; a thermal interface on the structural material above the first region of the heat pipe, the thermal interface having an exposed upper surface and having a heat transfer capability greater than that of the structural material and attached to the first region of the heat pipe; an electronic device mounted to the board over the second region of the heat pipe, the heat pipe forming a thermal path between a surface of the thermal interface and the electronic device; and a board interface attached to the board and electrically connected to the electronic device, the board interface being adapted to interchangeably connect to a calibration computer interface of a calibration station and to connect to a field computer interface connected to a field computer, the calibration station having a thermoelectric device for releasably contacting the exposed upper surface.

2. The electronic system according to claim 1, wherein: The heat pipe includes a metal conductor.

3. The electronic system according to claim 2, wherein: The heat pipe comprises at least two metal layers separated by a layer of the structural material.

4. The electronic system according to claim 3, wherein: The heat pipe includes at least one metal via connecting the layers to each other.

5. The electronic system according to claim 4, wherein: The heat pipe includes a plurality of metal vias connecting the layers to each other.

6. The electronic system according to claim 2, wherein: The metal conductor is made of a metal that is more thermally conductive than the structural material.

7. The electronic system according to claim 2, wherein: The board has at least one metal layer having an inner portion and an outer portion, and the structural material forms a barrier between the inner portion and the outer portion, the inner portion forming the heat pipe, and the thermal interface and the electronic device are located on the inner portion.

8. The electronic system according to claim 7, wherein: The metal layer is more conductive than the structural material.

9. The electronic system according to claim 7, wherein: The structural material forms a plurality of barriers between the inner portion and the outer portion, wherein the barriers alternate with portions of the metal layer connecting the inner portions to each other.

10. The electronic system according to claim 1, further comprising: a movement detection device in said electronic device; System storage; as well as Calibration data on the system memory, the calibration data comprising: a first temperature of the mobile detection device; a first output from the movement detection device recorded for the first temperature; and a second temperature of the movement detection device different from the first temperature; and A second output from the movement detection device is recorded for the second temperature.

11. The electronic system according to claim 10, wherein: The movement detection device is an accelerometer.

12. The electronic system according to claim 10, wherein: The movement detection device is a gyroscope.

13. The electronic system according to claim 10, further comprising: A temperature detector in the electronic device.

14. The electronic system according to claim 13, further comprising: On-site computers; connecting the field computer to the interface of the mobile detection device and the temperature detector; as well as A controlled system is connected to the field computer.

15. A method of constructing an electronic system, comprising: Structural plates, including: forming a heat pipe on a structural material, the heat pipe having a heat transfer capability higher than that of the structural material and having a first region, a second region, and a connecting portion connecting the first region to the second region, the first region and the second region being horizontally spaced apart; forming a thermal interface on the structural material over the first region of the heat pipe, the thermal interface having an exposed upper surface and having a higher thermal conductivity than the thermal conductivity of the structural material and attached to the first region of the heat pipe; mounting an electronic device to the board over the second region of the heat pipe, the heat pipe forming a thermal path between a surface of the thermal interface and the electronic device; and A board interface is attached to the board and electrically connected to the electronic device, the board interface being adapted to be interchangeably connected to a calibration computer interface of a calibration station and to be connected to a field computer interface connected to a field computer, the calibration station having a thermoelectric device for releasably contacting the exposed upper surface.

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