Temperature determination method and device, heating equipment, electronic equipment and storage medium

Abstract

According to the temperature determination method and device, the heating equipment, the electronic equipment and the storage medium provided by the embodiment of the invention, the current resistivity is determined according to the current resistance, the length and the cross sectional area by acquiring the current resistance, the length and the cross sectional area of the metal to be subjected to temperature measurement and the calibrated resistivity of the metal to be subjected to temperature measurement at multiple different preset temperatures; and if the current resistivity is different from the plurality of calibration resistivity, determining a theoretical temperature corresponding to the current resistivity based on at least two target calibration resistivity in the plurality of calibration resistivity and a preset temperature corresponding to each target calibration resistivity so as to perform temperature determination on the metal to be subjected to temperature measurement, compared with the prior art, a novel more concise, efficient and accurate mode is provided for determining the temperature of the metal to be subjected to temperature measurement, excessive manual intervention is not needed, cost is lower, potential safety hazards are reduced, and due to the fact that resistance determination is more accurate and more timely, the reliability of final temperature determination is better.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature measurement of a heating body of a heating device, and in particular to a temperature determination method, device, heating device, electronic device and storage medium. Background Art

[0002] Taking the gas separation system as an example, the separation equipment uses tungsten filament for heating. The outside of the gas separation chamber where the tungsten filament is located is a circulating cooling water chamber. The temperature of the gas in the gas separation chamber is increased by heating the tungsten filament, and the temperature difference between the tungsten filament and the cooling water wall is used to separate gases of different qualities.

[0003] The separation device in the related art uses a method of physically measuring the elongation of the tungsten wire after heating to measure the real-time temperature of the tungsten wire. According to the thermal expansion coefficient of the tungsten wire, the elongation of the tungsten wire when heated to a certain temperature is obtained through theoretical calculation. The length of the tungsten wire in the hot state is manually measured, and the length of the tungsten wire in the cold state is subtracted to obtain the elongation at this moment. When the elongation at this moment is the same as the theoretically calculated elongation, it is considered that the tungsten wire has been heated to the target temperature. However, this method often relies on manual measurement for the measurement of elongation, which is greatly affected by the measurement personnel. There are deviations in the measurement results of different measurement personnel, and it is greatly affected by the measurement method and the accuracy of the measuring instrument, resulting in inaccurate measurement results. On the other hand, due to the high temperature during the heating process of the equipment and the situation of live measurement operation, there are also safety hazards in measuring the elongation during this process.

[0004] In addition, in the heating equipment control system in the related art, temperature measuring components can also be used to detect the temperature of the heating body, and the output power of the heating execution device can be controlled by the feedback of the detected temperature, so as to control the heating of the device. However, in some scenarios, the heating body is encapsulated inside the device as a whole, and the temperature of the heating body encapsulated inside the device cannot be directly measured by external temperature measuring components. Instead, the temperature of the heating body inside the device is inferred by measuring the temperature outside the device, and the temperature measurement is also inaccurate. Summary of the invention

[0005] The present invention provides a temperature determination method, device, heating equipment, electronic equipment and storage medium to solve the technical problems of inaccurate temperature measurement of a heating body, poor timeliness and potential safety hazards in the related art.

[0006] The present invention provides a temperature determination method, which includes: obtaining the current resistance, length and cross-sectional area of ​​a metal to be measured, and the calibrated resistivity of the metal to be measured at multiple different preset temperatures, wherein the metal to be measured is used to heat a target object; determining the current resistivity of the metal to be measured according to the current resistance, length and cross-sectional area; if the current resistivity is different from multiple calibrated resistivities, determining the theoretical temperature corresponding to the current resistivity based on at least two target calibrated resistivities and the preset temperatures corresponding to each of the target calibrated resistivities, so as to determine the temperature of the metal to be measured, wherein the target calibrated resistivity is one of the multiple calibrated resistivities.

[0007] In one embodiment of the present invention, the theoretical temperature corresponding to the current resistivity is determined based on at least two target calibrated resistivities and the preset temperatures corresponding to each of the target calibrated resistivities, including: determining a calibrated resistivity greater than the current resistivity as the first target calibrated resistivity, and determining a calibrated resistivity less than the current resistivity as the second target calibrated resistivity; determining a calibrated resistivity difference according to the first target calibrated resistivity and the second target calibrated resistivity, and determining a calibrated temperature difference according to the first target preset temperature and the second target preset temperature, the first target preset temperature being the preset temperature corresponding to the first target calibrated resistivity, and the second target preset temperature being the preset temperature corresponding to the second target calibrated resistivity; determining a theoretical rate of change of temperature with resistivity at the current stage according to the calibrated temperature difference and the calibrated resistivity difference; determining a current resistivity difference based on the current resistivity and a target calibrated resistivity; determining a theoretical temperature change based on the current resistivity difference and the theoretical rate of change; and obtaining the theoretical temperature according to the theoretical temperature change and the preset temperature corresponding to the one target calibrated resistivity.

[0008] In one embodiment of the present invention, the theoretical temperature corresponding to the current resistivity is determined based on at least two target calibrated resistivities and the preset temperatures corresponding to each of the target calibrated resistivities, including: determining a resistivity-temperature correlation function based on all the target calibrated resistivities and the preset temperatures corresponding to each of the target calibrated resistivities to obtain a resistivity-temperature correlation function; substituting the current resistivity into the resistivity-temperature correlation function to obtain the theoretical temperature.

[0009] In one embodiment of the present invention, before obtaining the current resistance of the metal to be measured, the method includes: obtaining the current voltage across the metal to be measured, and obtaining the current current across the metal to be measured; and obtaining the current resistance according to the current voltage and the current current.

[0010] In one embodiment of the present invention, after determining the theoretical temperature corresponding to the current resistivity, the method further includes: obtaining the target temperature of the metal to be measured; if the theoretical temperature is different from the target temperature, determining the theoretical resistivity corresponding to the target temperature based on at least two selected calibrated resistivities and the preset temperatures corresponding to each of the selected calibrated resistivities; determining the theoretical resistance based on the theoretical resistivity, the length and the cross-sectional area, and controlling the resistance of the metal to be measured to reach the theoretical resistance, wherein the selected calibrated resistivity is one of multiple calibrated resistivities, and the target temperature is different from multiple preset temperatures.

[0011] The present invention also provides a temperature determination device, which includes: an acquisition module, used to acquire the current resistance, length and cross-sectional area of ​​the metal to be measured, and the calibrated resistivity of the metal to be measured at multiple different preset temperatures, and the metal to be measured is used to heat a target object; a current resistivity determination module, used to determine the current resistivity of the metal to be measured according to the current resistance, length and cross-sectional area; a temperature determination module, used to determine the theoretical temperature corresponding to the current resistivity based on at least two target calibrated resistivities and the preset temperatures corresponding to each of the target calibrated resistivities if the current resistivity is different from the multiple calibrated resistivities, so as to determine the temperature of the metal to be measured, wherein the target calibrated resistivity is one of the multiple calibrated resistivities.

[0012] The present invention also provides a temperature determination device, the heating device includes a metal to be measured for heating a target object, a power supply, a voltage acquisition device, a current acquisition device and a temperature determination device, wherein: the power supply is used to supply power to the metal to be measured; the voltage acquisition device is arranged at both ends of the metal to be measured, and is used to acquire the current voltage of the metal to be measured; the current acquisition device is used to acquire the current current of the metal to be measured; the temperature determination device respectively acquires the current voltage acquired by the voltage acquisition device and the current current acquired by the current acquisition device, and based on the current voltage and the current current to obtain the current resistance, which is used to obtain the current resistance, length and cross-sectional area of ​​the metal to be measured, and the calibrated resistivity of the metal to be measured at multiple different preset temperatures; the current resistivity of the metal to be measured is determined according to the current resistance, length and cross-sectional area; if the current resistivity is different from multiple calibrated resistivities, the theoretical temperature corresponding to the current resistivity is determined based on at least two target calibrated resistivities and the preset temperatures corresponding to each of the target calibrated resistivities, so as to determine the temperature of the metal to be measured, wherein the target calibrated resistivity is one of the multiple calibrated resistivities.

[0013] In one embodiment of the present invention, if the power supply provides alternating current, the heating device also includes a conversion module, one end of the conversion module is connected to the power supply, and the other end of the conversion module is connected to the metal to be measured, and the conversion module is used to convert the alternating current into direct current.

[0014] The present invention also provides an electronic device, comprising a processor, a memory and a communication bus; the communication bus is used to connect the processor and the memory; the processor is used to execute a computer program stored in the memory to implement a method provided in any one of the above embodiments.

[0015] The present invention also provides a computer-readable storage medium on which a computer program is stored, wherein the computer program is used to enable a computer to execute the method provided in any one of the above embodiments.

[0016] Beneficial effects of the present invention: The present invention proposes a temperature determination method, device, heating equipment, electronic equipment and storage medium. The method obtains the current resistance, length and cross-sectional area of ​​the metal to be measured and the calibrated resistivity of the metal to be measured at multiple different preset temperatures, and determines the current resistivity according to the current resistance, length and cross-sectional area. If the current resistivity is different from multiple calibrated resistivities, the theoretical temperature corresponding to the current resistivity is determined based on at least two target calibrated resistivities among the multiple calibrated resistivities and the preset temperatures corresponding to each target calibrated resistivity, so as to determine the temperature of the metal to be measured. This provides a new, simpler, more efficient and accurate way to determine the temperature of the metal to be measured, does not require excessive manual intervention, has lower costs, and reduces safety hazards. Since the resistance determination is more accurate and more timely, the reliability of the final temperature determination is also better. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a flow chart of a temperature determination method provided in one embodiment of the present invention;

[0018] Figure 2 is a structural schematic diagram of a temperature determination device provided by an embodiment of the present invention;

[0019] Figure 3 is a structural schematic diagram of a heating device provided by an embodiment of the present invention;

[0020] Figure 4 It is a structural schematic diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0021] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0022] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0023] In the following description, numerous details are discussed to provide a more thorough explanation of the embodiments of the present invention. However, it is obvious to those skilled in the art that the embodiments of the present invention can be implemented without these specific details. In other embodiments, well-known structures and devices are shown in the form of block diagrams rather than in detail to avoid making the embodiments of the present invention difficult to understand.

[0024] See also Figure 1 , Figure 1 A flow chart of a temperature determination method provided in an embodiment of the present invention is shown in FIG. Figure 1 , the temperature determination method comprises the following steps:

[0025] Step S101: obtaining the current resistance, length and cross-sectional area of ​​the metal to be measured, and the calibrated resistivity of the metal to be measured at a plurality of different preset temperatures.

[0026] The metal to be measured is used to heat the target object, and can be tungsten, platinum, molybdenum, tantalum and other metal materials whose resistivity changes greatly between hot and cold states.

[0027] In some embodiments, the metal to be measured is encapsulated inside a preset component. That is, since the metal to be measured is encapsulated inside a preset component, the elongation cannot be directly measured visually, nor can the temperature be directly measured by a temperature measuring device. In this case, the temperature determination method provided in the embodiment of the present application is applicable to this scenario.

[0028] In one embodiment, the metal to be measured is heated by a power supply, and the current voltage at both ends of the metal to be measured can be detected by a voltage acquisition device, and the current current of the metal to be measured can be acquired by a current acquisition device, and then the current resistance can be obtained by Ohm's law.

[0029] In one embodiment, before obtaining the current resistance of the metal to be measured, the method includes: obtaining the current voltage across the metal to be measured, and obtaining the current current across the metal to be measured; and obtaining the current resistance according to the current voltage and the current current.

[0030] For example, the current resistance can be calculated using a modified formula of Ohm's law:

[0031] R=U / I Formula (1),

[0032] Among them, U is the voltage value at both ends of the metal to be measured when it is heated, that is, the current voltage, I is the current value passing through the metal to be measured when the tungsten wire is heated, that is, the current current, and R is the current resistance.

[0033] As an example, a current-controllable DC power supply (an example of a power supply) is used to apply voltage to both ends of the tungsten wire, and the heating temperature of the tungsten wire is controlled by adjusting the current. During the heating process, the voltage is collected using a DC voltage detection element, and the current is collected using an average-value DC current detection element. The voltage signal is collected and connected to the terminals at both ends of the tungsten wire. The current signal is collected by passing the positive power supply cable of the power supply through the current detection element, collecting real-time voltage and current values, and transmitting them to the PLC (Programmable Logic Controller) through the detection element to transmit them as 4-20mA signals. The temperature is determined by the algorithm provided in this embodiment and is monitored, calculated, and controlled.

[0034] It should be noted that the length and cross-sectional area are data measured under preset environmental parameters, and the preset environmental parameters can be selected by those skilled in the art according to actual needs. As an example, the length is the length of the two ends of the heating load, and for the metal to be measured with a regular shape, its cross-sectional area is the cross-sectional area relative to the length direction. For the metal to be measured with an irregular shape, those skilled in the art can select a method for determining the cross-sectional area according to needs, such as selecting an average cross-sectional area or other measurement methods.

[0035] The calibrated resistivity of the metal to be measured at multiple different preset temperatures can be obtained by consulting technical manuals, such as the "Industrial Furnace Design Manual", or by pre-calibration, or by other methods known to those skilled in the art, which are not limited here. However, whether by consulting technical manuals or other existing documents, or by one's own experimental calibration, it is impossible to know the calibrated resistivity at any temperature, so there must be some temperatures corresponding to the resistivity that cannot be directly obtained by the above methods.

[0036] Please refer to Table 1, which is an example of the resistivity ρ of common electric heating materials at different temperatures.

[0037] Table 1

[0038]

[0039] As shown in Table 1, the calibrated resistivity of various metals to be measured at different preset temperatures (such as at least some temperatures among 20, 100, 200...2900) is provided.

[0040] Step S102: determining the current resistivity of the metal to be measured according to the current resistance, length and cross-sectional area.

[0041] As an example, the current resistivity can be determined by transforming the following formula (9):

[0042] ρ=R / (L / S) Formula (2),

[0043] Where ρ is the current resistivity, R is the current resistance, L is the length, and S is the cross-sectional area.

[0044] Step S103: If the current resistivity is different from the multiple calibrated resistivities, determine the theoretical temperature corresponding to the current resistivity based on at least two target calibrated resistivities and the preset temperatures corresponding to the target calibrated resistivities, so as to determine the temperature of the metal to be measured.

[0045] The target calibrated resistivity is one of a plurality of calibrated resistivities.

[0046] As an example, at least one target calibration resistivity is greater than the current resistivity, and at least one target calibration resistivity is less than the current resistivity. It can be understood that when selecting the target calibration resistivity from the calibration resistivity, the current resistivity needs to be selected as a value between at least two target calibration resistivities, so that the accuracy of subsequent temperature determination can be guaranteed as much as possible. Since the temperature span in the calibration process of the calibration resistivity or the records in the technical manual is generally large, it can generally cover the heating temperature of the heating equipment. Therefore, it is generally possible to select a target calibration resistivity that meets the requirements. However, in extreme cases, if the target calibration resistivity that meets the requirements cannot be found, the first N (N≥2) calibration resistivities with the smallest difference from the current resistivity can also be used as the target calibration resistivity, and then the temperature is determined in the manner provided in this embodiment, but the reliability of the temperature value obtained in this manner is relatively poor.

[0047] In one embodiment, the theoretical temperature corresponding to the current resistivity is determined based on at least two target calibration resistivities and the preset temperatures corresponding to the target calibration resistivities, including: determining a calibration resistivity greater than the current resistivity as the first target calibration resistivity, and determining a calibration resistivity less than the current resistivity as the second target calibration resistivity; determining a calibration resistivity difference according to the first target calibration resistivity and the second target calibration resistivity, and determining a calibration temperature difference according to the first target preset temperature and the second target preset temperature, the first target preset temperature being the preset temperature corresponding to the first target calibration resistivity, and the second target preset temperature being the preset temperature corresponding to the second target calibration resistivity; determining the theoretical rate of change of temperature with resistivity at the current stage according to the calibration temperature difference and the calibration resistivity difference; determining the current resistivity difference based on the current resistivity and a target calibration resistivity; determining the theoretical temperature change based on the current resistivity difference and the theoretical change rate; and obtaining the theoretical temperature according to the theoretical temperature change and the preset temperature corresponding to a target calibration resistivity. The above embodiment takes two target calibration resistivities as an example, and determines the theoretical temperature by interpolation.

[0048] For example, the current resistivity to be calculated is expressed as ρ t , the first target calibrated resistivity is represented by ρ1, the second target calibrated resistivity is represented by ρ0, the first target preset temperature is represented by T1, the second target preset temperature is represented by T0, and the current resistivity to be calculated is ρ t The corresponding theoretical temperature is expressed as T t , then the process of determining the theoretical temperature can be:

[0049] ΔT=T1-T0 Formula (3),

[0050] Δρ1 =ρ1-ρ0 formula (4),

[0051] Δk=ΔT / Δρ1 Formula (5),

[0052] Δρ2 = ρ t -ρ0 formula (6),

[0053] T t = T0+Δρ2*Δk formula (7),

[0054] Wherein, ΔT is the calibration temperature difference, T1 is the first target preset temperature, T0 is the second target preset temperature, Δρ1 is the calibration resistivity difference, ρ1 is the first target calibration resistivity, ρ0 is the second target calibration resistivity, Δk is the theoretical change rate, Δρ2 is the current resistivity difference, ρ t is the current resistivity, T t is the theoretical temperature.

[0055] Here, the second target calibration resistivity is taken as an example as a target calibration resistivity. In actual calculation, those skilled in the art can also adaptively select the first target calibration resistivity as a target calibration resistivity. In this case, the plus sign in formula (7) is adaptively modified to a minus sign.

[0056] Based on the above formulas (3)-(7), those skilled in the art can also transform the formula into:

[0057] ρ t =Δρ1 / ΔT*(T t - T0)+ρ0 formula (8),

[0058] At this time, ρ t The current resistivity can be understood as the theoretical resistivity to be achieved, Δρ1 is the calibrated resistivity difference, ΔT is the calibrated temperature difference, T t The theoretical temperature can be understood as the target temperature that needs to be achieved, and ρ0 is the second target calibrated resistivity.

[0059] This modified formula (8) can be used to calculate the theoretical resistivity and then the theoretical resistance after knowing any target temperature. By controlling the power supply voltage, the temperature of the metal to be measured can be adjusted to the target temperature. One way to determine the current resistance is as follows:

[0060] R=ρ*L / S Formula (9),

[0061] Wherein, R is the current resistance (that is, the theoretical resistance at this time), ρ is the current resistivity (that is, the theoretical resistivity), L is the length, and S is the cross-sectional area.

[0062] In another embodiment, a theoretical temperature corresponding to a current resistivity is determined based on at least two target calibrated resistivities and a preset temperature corresponding to each target calibrated resistivity, including: determining a resistivity-temperature correlation function based on all target calibrated resistivities and a preset temperature corresponding to each target calibrated resistivity to obtain a resistivity-temperature correlation function; substituting the current resistivity into the resistivity-temperature correlation function to obtain a theoretical temperature.

[0063] At this time, a curve fitting can be performed in advance based on all the calibrated temperatures and resistivities, and then a resistivity-temperature correlation function that may be a piecewise function can be obtained, so that if one of the parameters is known, the other parameter can be obtained. Based on this resistivity-temperature correlation function, not only the current resistivity can be known to obtain the theoretical temperature, but also the target temperature can be known, and then the theoretical resistivity can be obtained, and then the theoretical resistance can be obtained, so as to control the resistance of the metal to be measured to reach the target temperature. The fitting method of the resistivity-temperature correlation function can be implemented in a manner known to those skilled in the art, such as by software-assisted fitting.

[0064] In one embodiment, after determining the theoretical temperature corresponding to the current resistivity, the method further includes: obtaining the target temperature of the metal to be measured; if the theoretical temperature is different from the target temperature, determining the theoretical resistivity corresponding to the target temperature based on at least two selected calibrated resistivities and the preset temperatures corresponding to each selected calibrated resistivity; determining the theoretical resistance based on the theoretical resistivity, length and cross-sectional area, and controlling the resistance of the metal to be measured to reach the theoretical resistance, wherein the selected calibrated resistivity is one of multiple calibrated resistivities, and the target temperature is different from multiple preset temperatures.

[0065] Furthermore, in order to make the result more accurate, it can be stipulated that the preset temperature corresponding to at least one selected calibrated resistivity is greater than the target temperature, and the preset temperature corresponding to at least one selected calibrated resistivity is less than the target temperature.

[0066] The determination method of the theoretical resistance can refer to the above embodiment and will not be described in detail here. The control method for the resistance of the metal to be measured to reach the theoretical resistance can be achieved by adjusting the power supply voltage applied to the metal to be measured, thereby achieving resistance adjustment.

[0067] In one embodiment, when the target temperature is greater than the theoretical temperature, the theoretical resistance can be adjusted in this way to quickly increase the temperature. However, when the target temperature is less than the theoretical temperature, the process takes longer because heat dissipation is also involved.

[0068] As an example, if the target temperature is lower than the theoretical temperature, the resistance of the metal to be measured can be controlled to be lower than the theoretical resistance, less heat can be applied, and the heat can be dissipated faster, and then the resistance of the metal to be measured can be controlled to be equal to the theoretical resistance to speed up the temperature adjustment. The heat dissipation time of different temperature differences in different temperature ranges can be pre-calibrated, and then the resistance of the metal to be measured can be controlled to be equal to the theoretical resistance after the heat dissipation time is satisfied.

[0069] The temperature determination method provided above is described below with a specific embodiment. Take the tungsten wire as an example. The values ​​in Table 1 are the calibrated resistivity of the tungsten wire at different preset temperatures. If the target temperature is set to 800°C, it can be obtained from Table 1 that the resistivity of the tungsten wire at 800°C is ρ = 0.273Ω*mm2 / m, the length of the tungsten wire is L = 6m, and the diameter of the tungsten wire is 1mm. Then the cross-sectional area S = 7.854*10-1mm2 (the calculation result is rounded to four decimal places, the same below). Substituting the above data into formula (9) to calculate the theoretical resistance value of the tungsten wire at 800 degrees is: R 800 =0.273*6 / 0.7854=2.0856Ω. If the temperature needs to be adjusted to 800°C, the resistance of the tungsten filament needs to be controlled to 2.0856Ω.

[0070] For example, to find the resistance value of tungsten wire at 750 degrees, you need to first find the corresponding resistivity of tungsten wire at 750 degrees. From Table 1, we can see that the corresponding resistivity of tungsten wire at 700℃ is 0.243, and the corresponding resistivity of tungsten wire at 800℃ is 0.273. Take the resistivity of tungsten wire at 700℃ as the calculation reference resistivity (a target mark resistivity), 700℃ as the corresponding reference temperature, and substitute it into formula 8: ρ 750 =(0.273-0.243) / (800-700)*(750-700)+0.243=0.258Ω*mm2 / m, and then the resistivity of the tungsten wire at 750℃ can be obtained. According to the resistivity formula, the resistance of the tungsten wire at 750℃ can be calculated: R 750 =0.258*6 / 0.7854=1.971Ω. According to the data collected by the DC voltage and current detection elements, the resistance value R of the tungsten filament at the current moment during the heating process is calculated. When R=1.971Ω, it can be determined that the current temperature of the tungsten filament is 750℃.

[0071] In one embodiment, the metal to be measured is powered by a DC power supply. For example, an AC power supply can be converted into DC power, and then the metal to be measured is powered. This can improve the accuracy of current current and current voltage measurements, thereby improving the accuracy of temperature determination.

[0072] The temperature determination method proposed in this embodiment obtains the current resistance, length and cross-sectional area of ​​the metal to be measured and the calibrated resistivity of the metal to be measured at multiple different preset temperatures, determines the current resistivity according to the current resistance, length and cross-sectional area, and if the current resistivity is different from the multiple calibrated resistivities, determines the theoretical temperature corresponding to the current resistivity based on at least two target calibrated resistivities among the multiple calibrated resistivities and the preset temperatures corresponding to each target calibrated resistivity, so as to determine the temperature of the metal to be measured, and provides a new, more concise, efficient and accurate way to determine the temperature of the metal to be measured, which does not require excessive manual intervention, has lower costs, and reduces safety hazards. Since the determination of resistance is more accurate and more timely, the reliability of the final temperature determination is also better. Specifically, the main reason for adopting this method is that the current voltage and current current are accurately collected, and the collection equipment of these two parameters is relatively mature and can ensure the accuracy of their parameters. The temperature determination method provided in this embodiment does not require manual measurement, and the results are no longer subject to deviations caused by different measurement personnel, which further improves the reliability of the results. On the other hand, this method can measure the temperature in real time, which is more timely, and does not require manual observation, which reduces safety hazards.

[0073] See also Figure 2 , Figure 2 FIG. 1 is a schematic diagram of a temperature determination device provided by an embodiment of the present invention. Figure 2 As shown, a temperature determination device 200 is provided, including: an acquisition module 201, used to acquire the current resistance, length and cross-sectional area of ​​the metal to be measured, and the calibrated resistivity of the metal to be measured at multiple different preset temperatures, wherein the metal to be measured is used to heat a target object; a current resistivity determination module 202, used to determine the current resistivity of the metal to be measured according to the current resistance, length and cross-sectional area; a temperature determination module 203, used to determine the theoretical temperature corresponding to the current resistivity based on at least two target calibrated resistivities and preset temperatures corresponding to each target calibrated resistivity if the current resistivity is different from multiple calibrated resistivities, so as to determine the temperature of the metal to be measured, wherein the target calibrated resistivity is one of the multiple calibrated resistivities.

[0074] In one embodiment, at least one target calibrated resistivity is greater than the current resistivity, and at least one target calibrated resistivity is less than the current resistivity.

[0075] In one embodiment, the temperature determination module is configured to: determine a calibrated resistivity greater than the current resistivity as the first target calibrated resistivity, and determine a calibrated resistivity less than the current resistivity as the second target calibrated resistivity; determine a calibrated resistivity difference based on the first target calibrated resistivity and the second target calibrated resistivity, and determine a calibrated temperature difference based on the first target preset temperature and the second target preset temperature, the first target preset temperature being the preset temperature corresponding to the first target calibrated resistivity, and the second target preset temperature being the preset temperature corresponding to the second target calibrated resistivity; determine a theoretical rate of change of temperature with resistivity at the current stage based on the calibrated temperature difference and the calibrated resistivity difference; determine the current resistivity difference based on the current resistivity and a target calibrated resistivity; determine a theoretical temperature change based on the current resistivity difference and the theoretical rate of change; and obtain a theoretical temperature based on the theoretical temperature change and a preset temperature corresponding to a target calibrated resistivity.

[0076] In another embodiment, the temperature determination module is configured to: determine the resistivity-temperature correlation function based on all target calibrated resistivities and the preset temperatures corresponding to each target calibrated resistivity to obtain the resistivity-temperature correlation function; substitute the current resistivity into the resistivity-temperature correlation function to obtain the theoretical temperature.

[0077] In one embodiment, the device further includes a collection module for obtaining the current voltage at both ends of the metal to be measured and the current current at both ends of the metal to be measured; and obtaining the current resistance according to the current voltage and the current current.

[0078] In one embodiment, the device also includes an adjustment module, which is used to obtain the target temperature of the metal to be measured after determining the theoretical temperature corresponding to the current resistivity; if the theoretical temperature is different from the target temperature, the theoretical resistivity corresponding to the target temperature is determined based on at least two selected calibrated resistivities and the preset temperatures corresponding to each selected calibrated resistivity; the theoretical resistance is determined based on the theoretical resistivity, length and cross-sectional area, and the resistance of the metal to be measured is controlled to reach the theoretical resistance, wherein the selected calibrated resistivity is one of multiple calibrated resistivities, and the target temperature is different from multiple preset temperatures.

[0079] In this embodiment, the temperature determination device is substantially provided with a plurality of modules for executing the temperature determination method in the above embodiment. The specific functions and technical effects may refer to the above embodiment and will not be described in detail here.

[0080] See also Figure 3 , Figure 3 is a structural schematic diagram of a heating device provided by an embodiment of the present invention, such as Figure 3As shown, a heating device 300 is provided, comprising a metal to be measured 301 for heating a target object, a power supply 302, a voltage acquisition device 303, a current acquisition device 304 and a temperature determination device 200, wherein: the power supply 302 is used to supply power to the metal to be measured 301; the voltage acquisition device 303 is arranged at both ends of the metal to be measured 301, and is used to acquire the current voltage of the metal to be measured 301; the current acquisition device 304 is used to acquire the current current of the metal to be measured 301; the temperature determination device 200 respectively acquires the current voltage and current acquired by the voltage acquisition device 303. The current current collected by the device 304 is used to obtain the current resistance based on the current voltage and the current current, and the current resistance, length and cross-sectional area of ​​the metal to be measured, as well as the calibrated resistivity of the metal to be measured 301 at multiple different preset temperatures. The current resistivity of the metal to be measured is determined according to the current resistance, length and cross-sectional area. If the current resistivity is different from multiple calibrated resistivities, the theoretical temperature corresponding to the current resistivity is determined based on at least two target calibrated resistivities and the preset temperatures corresponding to each target calibrated resistivity, so as to determine the temperature of the metal to be measured, and the target calibrated resistivity is one of the multiple calibrated resistivities.

[0081] In one embodiment, the heating device further comprises a conversion module, one end of which is connected to the power supply, and the other end of which is connected to the metal to be measured for temperature measurement, for converting AC power into DC power if the power supply provides AC power.

[0082] In one embodiment, the temperature determination device of the heating device is substantially provided with multiple modules for executing the temperature determination method in the above embodiment. The specific functions and technical effects can be referred to in the above embodiment and will not be repeated here.

[0083] The heating device provided in the above embodiment can determine the temperature of the heating body (metal to be measured) encapsulated inside, and can perform more accurate temperature regulation.

[0084] See also Figure 4 An embodiment of the present invention further provides an electronic device 1000, including a processor 1001, a memory 1002 and a communication bus 1003; the communication bus 1003 is used to connect the processor 1001 and the memory 1002; the processor 1001 is used to execute a computer program stored in the memory 1002 to implement one or more of the methods described in the above embodiments.

[0085] An embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored. The computer program is used to enable a computer to execute the method described in any one of the above embodiments.

[0086] The embodiment of the present application also provides a non-volatile readable storage medium, which stores one or more modules (programs). When the one or more modules are applied to a device, the device can execute instructions (instructions) of the steps included in the embodiment 1 of the embodiment of the present application.

[0087] It should be noted that the computer-readable medium mentioned above in the present disclosure may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present disclosure, a computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device. In the present disclosure, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, which carries a computer-readable program code. This propagated data signal may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. The computer readable signal medium may also be any computer readable medium other than a computer readable storage medium, which may send, propagate or transmit a program for use by or in conjunction with an instruction execution system, apparatus or device. The program code contained on the computer readable medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (radio frequency), etc., or any suitable combination of the above.

[0088] The computer-readable medium may be included in the electronic device, or may exist independently without being incorporated into the electronic device.

[0089] Computer program code for performing the operations of the present disclosure may be written in one or more programming languages, or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., through the Internet using an Internet service provider).

[0090] The flowcharts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the methods and computer program products according to various embodiments of the present disclosure. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of the code contains one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart, can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0091] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A temperature determination method, characterized in that: The temperature determination method comprises: Obtaining the current resistance, length and cross-sectional area of ​​the metal to be measured, and the calibrated resistivity of the metal to be measured at a plurality of different preset temperatures, wherein the metal to be measured is used to heat the target object; Determine the current resistivity of the metal to be temperature measured according to the current resistance, length and cross-sectional area; If the current resistivity is different from the multiple calibrated resistivities, the theoretical temperature corresponding to the current resistivity is determined based on at least two target calibrated resistivities and the preset temperatures corresponding to the target calibrated resistivities, so as to determine the temperature of the metal to be measured, wherein the target calibrated resistivity is one of the multiple calibrated resistivities.

2. The temperature determination method according to claim 1, characterized in that: Determining a theoretical temperature corresponding to the current resistivity based on at least two target calibrated resistivities and preset temperatures corresponding to each of the target calibrated resistivities includes: Determine a calibration resistivity greater than the current resistivity as a first target calibration resistivity, and determine a calibration resistivity less than the current resistivity as a second target calibration resistivity; Determining a calibration resistivity difference according to the first target calibration resistivity and the second target calibration resistivity, and determining a calibration temperature difference according to the first target preset temperature and the second target preset temperature, wherein the first target preset temperature is the preset temperature corresponding to the first target calibration resistivity, and the second target preset temperature is the preset temperature corresponding to the second target calibration resistivity; Determining the theoretical rate of change of temperature with resistivity at the current stage according to the calibrated temperature difference and the calibrated resistivity difference; determining a current resistivity difference based on the current resistivity and a target calibrated resistivity; Determining a theoretical temperature change based on the current resistivity difference and the theoretical change rate; The theoretical temperature is obtained according to the theoretical temperature change and a preset temperature corresponding to the target calibrated resistivity.

3. The temperature determination method according to claim 1, characterized in that: Determining a theoretical temperature corresponding to the current resistivity based on at least two target calibrated resistivities and preset temperatures corresponding to each of the target calibrated resistivities includes: Determining a resistivity-temperature correlation function according to all target calibration resistivities and preset temperatures corresponding to each of the target calibration resistivities to obtain a resistivity-temperature correlation function; The current resistivity is substituted into the resistivity-temperature correlation function to obtain the theoretical temperature.

4. The temperature determination method according to any one of claims 1 to 3, characterized in that: Before obtaining the current resistance of the metal to be measured, the method includes: Acquire the current voltage at both ends of the metal to be measured, and acquire the current current at both ends of the metal to be measured; The current resistance is obtained according to the current voltage and the current current.

5. The temperature determination method according to any one of claims 1 to 3, characterized in that: After determining the theoretical temperature corresponding to the current resistivity, the method further includes: Obtaining the target temperature of the metal to be measured; If the theoretical temperature is different from the target temperature, determining the theoretical resistivity corresponding to the target temperature based on at least two selected calibrated resistivities and a preset temperature corresponding to each of the selected calibrated resistivities; The theoretical resistance is determined based on the theoretical resistivity, the length and the cross-sectional area, and the resistance of the metal to be measured is controlled to reach the theoretical resistance, wherein the selected calibrated resistivity is one of multiple calibrated resistivities, and the target temperature is different from multiple preset temperatures.

6. A temperature determination device, characterized in that: The temperature determining device comprises: An acquisition module, used to acquire the current resistance, length and cross-sectional area of ​​the metal to be measured, and the calibrated resistivity of the metal to be measured at a plurality of different preset temperatures, wherein the metal to be measured is used to heat the target object; A current resistivity determination module, used to determine the current resistivity of the metal to be temperature measured according to the current resistance, length and cross-sectional area; A temperature determination module is used to determine the theoretical temperature corresponding to the current resistivity based on at least two target calibrated resistivities and preset temperatures corresponding to each of the target calibrated resistivities if the current resistivity is different from the multiple calibrated resistivities, so as to determine the temperature of the metal to be measured, wherein the target calibrated resistivity is one of the multiple calibrated resistivities.

7. A heating device, characterized in that: The heating device comprises a metal to be measured for heating a target object, a power supply, a voltage acquisition device, a current acquisition device and a temperature determination device, wherein: The power supply is used to supply power to the metal to be temperature measured; The voltage acquisition device is arranged at both ends of the metal to be measured temperature, and is used to acquire the current voltage of the metal to be measured temperature; The current acquisition device is used to acquire the current current of the metal to be temperature measured; The temperature determination device respectively obtains the current voltage collected by the voltage acquisition device and the current current collected by the current acquisition device, and obtains the current resistance based on the current voltage and the current current, so as to obtain the current resistance, length and cross-sectional area of ​​the metal to be measured, and the calibrated resistivity of the metal to be measured at multiple different preset temperatures, and determines the current resistivity of the metal to be measured according to the current resistance, length and cross-sectional area. If the current resistivity is different from multiple calibrated resistivities, the theoretical temperature corresponding to the current resistivity is determined based on at least two target calibrated resistivities and the preset temperatures corresponding to each of the target calibrated resistivities, so as to determine the temperature of the metal to be measured, wherein the target calibrated resistivity is one of the multiple calibrated resistivities.

8. The heating device according to claim 7, characterized in that If the power supply provides alternating current, the heating device further comprises a conversion module, one end of which is connected to the power supply, and the other end of which is connected to the metal to be measured, and the conversion module is used to convert the alternating current into direct current.

9. An electronic device, characterized in that: including a processor, a memory and a communication bus; The communication bus is used to connect the processor and the memory; The processor is configured to execute the computer program stored in the memory to implement the method according to any one of claims 1 to 5.

10. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and the computer program is used to make a computer execute the method according to any one of claims 1 to 5.

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