Wafer scanning device

Abstract

The invention relates to the field of wafer scanning inspection, in particular to a wafer scanning device which comprises a machine table and a scanning unit, the machine table is provided with an operation area for placing a wafer, the scanning unit comprises a moving mechanism and at least one scanner, the moving mechanism is installed on the machine table, and the at least one scanner is installed on the moving mechanism along a straight line. The moving mechanism is used for driving the scanners to move, the at least one scanner is used for scanning the top wall and the bottom wall of the wafer located in the operation area at the same time, the machine table is provided with at least four electric control seats located in the operation area, each electric control seat is provided with a bearing piece, and the bearing pieces are used for abutting against the side wall of the wafer. According to the wafer detection device and the wafer detection method, the problem that wafer detection is inaccurate in a traditional mode is solved, and the effect of improving the wafer detection precision can be achieved.

Description

Technical Field

[0001] The present application relates to the technical field of wafer scanning inspection, and in particular to a wafer scanning device. Background Art

[0002] After the wafer is processed and ground at the primary stage, it is usually subjected to automated optical inspection (AOI), which uses a high-speed and high-precision optical image detection system and machine vision as the standard detection technology. In this embodiment, a scanner is used to scan the surface of the wafer, and the image recognition system is used for comparison to find defects on the surface of the wafer. When scanning, a set of fixtures is required to fix the wafer. If a single surface of the wafer is scanned, the fixture can be adsorbed on the other side of the wafer, so interference is not easy to occur. However, if the inspection time is to be shortened and the top and bottom surfaces of the wafer are scanned at the same time, the fixture can only be clamped on the circumferential wall of the wafer. At this time, because the fixture is too close to the wafer, the shadow of the fixture is easy to be imaged on the surface of the wafer, which ultimately affects the accuracy of the scanned image and leads to misjudgment. Summary of the invention

[0003] In order to improve the accuracy of wafer detection, the present application provides a wafer scanning device, which adopts the following technical solutions: A wafer scanning device comprises a machine table and a scanning unit, wherein the machine table is provided with an operating area for placing wafers, and the scanning unit comprises a moving mechanism and at least one scanner, wherein the moving mechanism is mounted on the machine table, and at least one of the scanners is mounted on the moving mechanism along a straight line, the moving mechanism is used to drive the scanner to move, and at least one of the scanners is used to simultaneously scan the top wall and the bottom wall of the wafer located in the operating area, and the machine table is provided with at least four electric control seats at the operating area, each of which is provided with a receiving member, the receiving member being used to abut against the side wall of the wafer, and the receiving members on at least one of the electric control seats located on a straight line parallel to the straight line where at least one of the scanners is located are staggered with each other, and when scanning the wafer, the receiving member located on the straight line where at least one of the scanners is located is separated from the wafer.

[0004] By adopting the above technical solution, the wafer is transported to the working area, and the side wall of the wafer is limited by the electrically controlled seat driving the receiving part, so that the wafer is positioned in the working area, and then the scanner is driven to move to the wafer by the moving mechanism, and the top wall and the bottom wall of the wafer are scanned and detected. In the detection process, the receiving part on the electrically controlled seat located on the straight line where at least one scanner is located is separated from the wafer, and the wafer is continued to be limited by the remaining receiving parts, so that when the scanner scans the wafer, the shadow of the wafer imaging caused by the receiving part being located on the scanning path of the scanner is reduced, thereby reducing the impact on the detection accuracy of the wafer, thereby facilitating the improvement of the detection accuracy of the wafer.

[0005] In a specific possible implementation manner, a vertical wall surface of the receiving member is provided with an arc wall, and the arc wall is used to contact the circumferential wall of the wafer.

[0006] By adopting the above technical solution, when the wafer is transported to the working area, the arc wall on the receiving part abuts against the peripheral side wall of the wafer, so that the contact between the receiving part and the wafer is point contact, reducing the contact area between the receiving part and the wafer, thereby facilitating reducing the damage caused by the receiving part to the side wall of the wafer.

[0007] In a specific feasible implementation scheme, at least two power seats are installed on the machine in the working area, and at least two of the power seats are distributed at equal angles in the circumferential direction of the wafer in the working area, and each of the power seats is installed with a carrier for receiving the wafer.

[0008] By adopting the above technical solution, when the wafer is transported to the working area, the carrier is first driven by the power seat to support the wafer, so that the receiving part can successfully complete the positioning of the peripheral side wall of the wafer.

[0009] In a specific possible implementation manner, the carrier is provided with an arc-shaped wall, and the arc-shaped wall is used to receive the wafer.

[0010] By adopting the above technical solution and arranging an arc-shaped wall on the carrier, the contact area between the carrier and the wafer is reduced, thereby reducing the damage caused by the carrier to the surface of the wafer.

[0011] In a specific possible implementation scheme, the scanner includes an upper scanner group and a lower scanner group, both of which are installed on a moving mechanism, and the upper scanner group is located above the electric control seat, and the upper scanner group is used to scan the top wall of the wafer, and the lower scanner group is located below the electric control seat, and the lower scanner group is used to scan the bottom wall of the wafer.

[0012] By adopting the above technical solution, an upper scanner group and a lower scanner group are set up, so that when the moving mechanism drives the scanner to move, the top wall and the bottom wall of the wafer can be scanned and inspected simultaneously by the upper scanner group and the lower scanner group, thereby improving the efficiency of wafer surface inspection.

[0013] In a specific feasible implementation scheme, a feeding mechanism for conveying wafers to an electric control seat is installed on the machine platform, and the feeding mechanism includes a lifting assembly, and the lifting assembly includes a lifting motor, a lifting screw and a lifting frame. The lifting screw is installed on the machine platform in a vertical direction, and the lifting motor is also installed on the machine platform, and the output shaft of the lifting motor is connected to one end of the lifting screw. The lifting frame is threadedly installed on the lifting screw, and the lifting frame is also slidably connected to the machine platform, and the lifting frame is used to carry wafers.

[0014] By adopting the above technical solution, the wafer is transported to the lifting frame, and then the lifting motor drives the lifting screw to rotate, so that the lifting screw drives the lifting frame to rise and fall, thereby transporting the wafer to the working area, making it convenient for the receiving part to position the wafer.

[0015] In a specific possible implementation scheme, a driving wheel is coaxially mounted on the output shaft of the lifting motor, a transmission wheel is coaxially mounted on one end of the lifting screw, and the driving wheel and the transmission wheel are connected by a synchronous belt.

[0016] By adopting the above technical solution, the lifting motor drives the driving wheel to rotate, so that the driving wheel drives the transmission wheel to rotate through the synchronous belt, thereby driving the lifting screw to rotate, thereby facilitating the lifting action of the lifting frame.

[0017] In a specific possible implementation scheme, the feeding mechanism also includes an adsorption component, the adsorption component includes a vacuum suction cup, the vacuum suction cup is installed on a lifting frame, and the vacuum suction cup is connected to an external air source, and the vacuum suction cup is used to adsorb the wafer.

[0018] By adopting the above technical solution, by arranging a vacuum suction cup on the lifting frame, it is convenient to adsorb the wafer through the vacuum suction cup when the wafer is transported to the lifting frame, thereby facilitating the wafer to be kept stable when the lifting frame transports the wafer to the working area.

[0019] In a specific feasible implementation scheme, the feeding mechanism also includes a centering component, the centering component includes a centering part, a reset part and a driving part, the centering part includes a centering ring and a centering block, a positioning ring is also installed on the platform at the lifting component, the centering ring is rotatably installed on the inner ring of the positioning ring, and the centering ring is used for the lifting frame to pass through, and the centering ring is used to support the wafer, at least three centering blocks are provided, and at least three centering blocks are installed on the positioning ring, and at least three centering blocks are distributed at equal angles along the circumferential direction, an adjustment block is installed on the centering block, and the adjustment block is used to resist the side wall of the wafer, an adjustment rod is also installed on the side of the centering block away from the adjustment block, the adjustment rod is slidably connected to the positioning ring, and a driving groove for sliding the adjustment rod is installed on the positioning ring, the driving groove is arc-shaped, and one end of the driving groove extends toward the center of the positioning ring, the reset part is installed on the platform, and the reset part is connected to the centering ring, the driving part is installed on the lifting frame, and the driving part is connected to the centering ring.

[0020] By adopting the above technical scheme and setting a centering component, when the wafer is conveyed to the centering ring, the lifting frame is driven to rise to the wafer through the lifting component, thereby driving the driving member to drive the centering ring to rotate, so that the centering ring drives the centering block to rotate, and the adjusting rod on the centering block slides along the driving groove, thereby driving the adjusting rod to move toward the center of the centering ring through the driving groove, so that the adjusting rod drives the centering block to move toward the center of the centering ring, so that the centering block drives the adjusting block to move toward the center of the centering ring, so that the side wall of the adjusting block contacts the peripheral side wall of the wafer, thereby pushing the wafer along the peripheral side of the wafer, so that the center of the wafer coincides with the center of the centering ring, so that when the lifting frame conveys the wafer, the weight of the wafer is evenly distributed on the lifting frame, so as to facilitate maintaining the center of gravity of the wafer, and when the wafer is conveyed to the receiving member, the center of the wafer is just located at the center position of at least four receiving members, so as to facilitate the receiving member to position the wafer.

[0021] In a specific feasible implementation scheme, a control groove for sliding of the driving member is opened on the inner wall of the inner ring of the centering ring, and the control groove includes a driving section and a return section. The return section is arranged on the inner wall of the inner ring of the centering ring along the vertical direction. The driving section is spiral, and the driving section is arranged along the axial direction of the centering ring, and the lower end of the driving section is connected with the lower end of the return section, and the upper end of the driving section extends to the top wall of the centering ring. A limit plate is rotatably installed at the position where the driving section and the return section are connected, and the limit plate is used to separate the driving section from the return section. A limit torsion spring is installed on the rotating shaft of the limit plate, and the limit torsion spring is connected to the limit plate.

[0022] By adopting the above technical solution, when the driving member is inserted into the driving section of the control groove, the limiting plate blocks the driving section from the return section, so that the driving member slides along the driving section, thereby driving the centering ring to rotate, so that the centering ring can drive the centering block to rotate, and the centering block can slide along the driving groove, so as to realize the action of centering the wafer. And when the lifting frame transports the wafer to the working area, the centering ring is reset under the drive of the reset member, so that the return section rotates to the bottom of the driving member, so that when the lifting frame returns, it drives the driving member to be inserted into the return section, and the driving member slides along the return section to the initial position, so as to facilitate the continuous centering of the wafer.

[0023] In summary, the present application includes at least one of the following beneficial effects: 1. Compared with the prior art, the wafer scanning device of the present invention is controlled by at least four electric control seats to control four receiving parts to contact with the wafer and fix its position, and when the scanning area is scanned, one receiving part is withdrawn from the location, and the other three receiving parts are temporarily used to fix the wafer position. During the scanning process, the shadow of the receiving part will not appear on the wafer surface. In this way, the problem that the shadow of the receiving part may affect the correctness of the scanned image can be eliminated, which is beneficial to improving the accuracy of the wafer inspection results.

[0024] 2. The present application sets a centering component to facilitate the centering of the wafer transported to the machine table through the centering component, so that when the lifting component transports the centered wafer to the working area, the center of the wafer just coincides with the center of at least four receiving parts, thereby facilitating the receiving parts to position the wafer and reducing the wear of the wafer or the skewness of the wafer due to the shift of the center of gravity of the wafer when the receiving parts are positioning the wafer, thereby facilitating maintaining the accuracy of wafer detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a three-dimensional diagram of the wafer scanning device of the present application.

[0026] Figure 2 It is a top view of the first embodiment of the present application.

[0027] Figure 3 It is a right side view of the first embodiment of the present application.

[0028] Figure 4 It is a planar diagram of the initial state of the scanning operation in the first embodiment of the present application.

[0029] Figure 5 It is a plan view of the first embodiment of the present application before the scanning operation is performed.

[0030] Figure 6 It is a plan view schematic diagram of the scanning operation in progress in the first embodiment of the present application.

[0031] Figure 7 It is a structural schematic diagram of the lifting component in the first embodiment of the present invention.

[0032] Figure 8 This is a schematic diagram of the installation of the side wall scanner in Example 1 of the present application.

[0033] Fig. 9 It is a structural schematic diagram of the centering component in Example 2 of the present application.

[0034] Fig.10 This is a schematic diagram of the installation of the centering component in the second embodiment of the present application.

[0035] Fig.11 It is a schematic diagram of the structure of the control slot in the second embodiment of the present application.

[0036] Fig.12 It is an exploded view of the centering component in the second embodiment of the present application.

[0037] Fig.13 It is a schematic diagram of the feeding mechanism in the second embodiment of the present application when it is reset after conveying the wafer.

[0038] Description of reference numerals: 1. Scanning unit; 11. Moving mechanism; 12. Scanner; 13. Scanning area; 14. Frame; 15. Side wall scanner; 2. Machine; 21. Working area; 22. Electric control seat; 221. Receiver; 222. Arc wall; 23. Support wall; 24. Carrying platform; 25. Power seat; 251. Carrier; 252. Arc wall; 26. Lifting port; 3. Scanning path; 4. Wafer; 5. Feeding mechanism; 51. Lifting assembly; 511. Mounting frame; 512. Lifting motor; 513. Lifting screw rod; 514. Lifting frame; 515. Drive Driving wheel; 516, transmission wheel; 517, synchronous belt; 52, adsorption assembly; 521, vacuum suction cup; 522, rotating table; 523, rotating motor; 53, centering assembly; 531, centering ring; 5311, guide rod; 5312, driving section; 5313, straight section; 5314, return section; 532, centering block; 5321, adjusting rod; 5322, adjusting block; 533, positioning ring; 5331, driving groove; 5332, sliding groove; 534, reset torsion spring; 535, driving rod; 536, limit plate; 537, limit torsion spring. DETAILED DESCRIPTION

[0039] The technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments and accompanying drawings. It should be noted that when an element is referred to as being "mounted on or fixed to" another component, it means that it can be directly on the other component or there can also be a central element. When a component is considered to be "connected" to another component, it means that it can be directly connected to the other component or there can be a central component at the same time. In the illustrated embodiments, the directions indicating up, down, left, right, front and back are relative, and are used to explain that the structures and movements of different components in this case are relative. These representations are appropriate when the components are in the positions shown in the figures. However, if the description of the component positions changes, it is believed that these representations will also change accordingly.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the present invention. The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0041] Embodiment 1: The present application embodiment discloses a wafer scanning device, such as Figure 1 and Figure 2 As shown, it includes a scanning unit 1 and a platform 2. The scanning unit 1 includes a moving mechanism 11 and at least one group of scanners 12. The platform 2 is provided with an operating area 21 for detecting the wafer 4. Both sides of the platform 2 are provided with raised support walls 23. The moving mechanism 11 includes a moving electric cylinder. The moving electric cylinder is fixedly mounted on the support wall 23 of the platform 2 in the horizontal direction, and one end of the moving electric cylinder extends to the operating area 21. The moving electric cylinder is a prior art in the art and will not be described in detail here. The scanner 12 is fixedly mounted on the output end of the moving electric cylinder, and the scanner 12 includes an upper scanner group and a lower scanner group. There is a gap between the upper scanner group and the lower scanner group for the wafer to pass through, and the upper scanner group is used to scan the top wall of the wafer 4, and the lower scanner group is used to scan the bottom wall of the wafer 4. The upper scanner group and the lower scanner group are each provided with three groups of scanning parts, and the three groups of scanning parts in the upper scanner group and the lower scanner group are arranged along a straight line, and the straight line is perpendicular to the straight line where the moving electric cylinder is located, and the three groups of scanning parts in the upper scanner group and the three groups of scanning parts in the lower scanner group form a scanning area 13 for scanning the wafer 4. The figure shows the area covered by the scanning area 13 with an imaginary line. The scanning parts are existing technologies in this field and will not be elaborated here.

[0042] like Figure 1 and Figure 2A supporting platform 24 is fixedly installed on the machine 2 at the working area 21, and at least four electric control seats 22 are fixedly installed on the supporting platform 24. In this embodiment, the electric control seats 22 are selected from cylinders. The four electric control seats 22 are distributed in the circumferential direction of the wafer 4 located in the working area 21, and the electric control seats 22 are located between the upper scanner group and the lower scanner group, and a receiving part 221 is fixedly installed at the output end of each electric control seat 22. The receiving part 221 is used to contact the peripheral side wall of the wafer 4, and the receiving parts 221 on the two electric control seats 22 located on a straight line parallel to the scanning area 13 are staggered with each other. When the moving mechanism 11 drives the scanner 12 to move along the axis of the moving electric cylinder, the scanning area 13 of the scanner 12 scans the surface of the wafer 4 along the axis of the moving electric cylinder, and drives the receiving part 221 located in the scanning area 13 to separate from the wafer through the electric control seat 22, and the receiving parts 221 on the remaining three electric control seats 22 continue to position the wafer 4, thereby reducing the shadow of the receiving part 221 projected on the wafer 4, thereby affecting the correctness of the scanned image, so as to improve the accuracy of scanning the wafer 4.

[0043] like Figure 1 and Figure 4 , a circular arc wall 222 is provided on the vertical wall of the end of the receiving member 221 away from the electric control seat 22. The circular arc wall 222 is used to contact the peripheral side wall of the wafer 4. The circular arc wall 222 is made of a specific material and has appropriate hardness. When in contact with the wafer 4, it has appropriate friction but will not damage the wafer 4. Three power seats 25 are also fixedly installed on the top wall of the supporting platform 24. In this embodiment, the power seats 25 are also selected from cylinders. The three power seats 25 are distributed at equal angles in the circumferential direction of the wafer 4 in the working area 21. A carrier 251 is fixedly installed on the output end of each power seat 25. The carrier 251 is provided with an upward arc wall 252. The arc wall 252 is used to hold up the wafer 4. When the external device moves the wafer 4 into the central position of the working area 21, the power seat 25 drives the carrier 251 to extend, so that the wafer 4 is placed on the three arc walls 252, that is, the wafer 4 is temporarily carried.

[0044] Next, the actual scanning operation mode of the present invention is explained. For the convenience of explanation, only the main components such as the electric control base 22, the power base 25, and the scanning area 13 of the scanner 12 are shown in the figure.

[0045] like Figure 4 As shown, in the initial state, the wafer 4 in the working area 21 is contacted by three carriers 251 of three power bases 25 at equal angles, so that the wafer 4 is placed on the arc wall 252 .

[0046] like Figure 5As shown, before scanning, the four electric control seats 22 drive the receiving member 221 to extend, so that the four arc walls 222 contact the side wall of the wafer 4 at different positions, thereby fixing the wafer 4 and maintaining a horizontal state. Then, the other three power seats 25 drive the carrier 251 to retract and exit the working area 21.

[0047] like Figure 6 As shown, when the scanner 12 scans the wafer 4 with the scanning area 13, the electric control seat 22 located in the scanning area 13 drives the receiving member 221 to separate from the wafer 4. At this time, the other three receiving members 221 maintain the horizontal state of the wafer 4. In this way, the receiving member 221 will not be too close to the wafer 4 so that the shadow is projected on the surface, affecting the accuracy of the image obtained during scanning. Therefore, the structure of the present invention can obtain the most accurate scanned image during scanning. In this embodiment, since the upper and lower scanners 12 are provided, the top and bottom surfaces of the wafer 4 can be scanned synchronously at the same time, thereby shortening the time required for scanning.

[0048] like Figure 7 The machine table 2 is also provided with a feeding mechanism 5, which includes a lifting assembly 51 and an adsorption assembly 52. ​​The lifting assembly 51 includes a mounting frame 511, a lifting motor 512, a lifting screw rod 513 and a lifting frame 514. A lifting port 26 is provided on the bottom wall of the machine table 2. The lifting port 26 is located below the electric control seat 22. The mounting frame 511 is fixedly mounted on the bottom wall of the machine table 2 near the lifting port 26 in the vertical direction. The lifting screw rod 513 is rotatably mounted on the mounting frame 51 in the vertical direction. The lifting motor 512 is fixedly mounted on the side wall of the lower end of the mounting frame 511, and the lifting motor 512 is located on the side of the mounting frame 511 away from the lifting screw rod 513. The output end of the lifting motor 512 extends vertically downward, and a driving wheel 515 is coaxially mounted on the output end of the lifting motor 512, and a transmission wheel 516 is coaxially mounted on the lower end of the lifting screw rod 513. The driving wheel 515 and the transmission wheel 516 are connected by a synchronous belt 517. The lifting frame 514 is slidably mounted on the mounting frame 511 in the vertical direction, and the lifting frame 514 is threadedly connected to the lifting screw rod 513. The lifting frame 514 is located below the lifting opening 26, and the lifting frame 514 can extend upward and out of the lifting opening 26.

[0049] like Figure 7The adsorption component 52 includes a vacuum suction cup 521, a rotating table 522 and a rotating motor 523. The rotating table 522 is fixedly mounted on the top wall of the lifting frame 514, and the rotating table 522 is located below the lifting port 26. The vacuum suction cup 521 is rotatably mounted on the top wall of the rotating table 522. The center of the vacuum suction cup 521 and the center of the circle surrounded by the three power seats 25 are located on the same vertical line, and the vacuum suction cup 521 is used to adsorb the wafer 4, and the vacuum suction cup 521 is connected to an external air source. The rotating motor 523 is fixedly mounted on the bottom wall of the rotating table 522, and the rotating motor 523 is connected to the vacuum suction cup 521, and the rotating motor 523 is used to drive the vacuum suction cup 521 to rotate. The way in which the vacuum suction cup 521 adsorbs the wafer 4 and the way in which the rotating motor 523 drives the vacuum suction cup 521 are both existing technologies in the field, and will not be elaborated here.

[0050] like Figure 8 A side wall scanner 15 is also fixedly installed on the top wall of the supporting platform 24 located at the starting position of the scanner 12 on the machine 2. The side wall scanner 15 faces the wafer 4 and is used to scan the peripheral side wall of the wafer 4. The specific scanning method is the existing technology in this field and will not be elaborated here.

[0051] The working principle of the embodiment of the present application is as follows: by conveying the wafer 4 to the vacuum suction cup 521, the vacuum suction cup 521 adsorbs the wafer 4, and then the lifting motor 512 drives the driving wheel 515 to rotate, so that the driving wheel 515 drives the transmission wheel 516 to rotate through the synchronous belt 517, so that the transmission wheel 516 drives the lifting screw 513 to rotate, thereby driving the lifting frame 514 to move upward, so that the lifting frame 514 drives the vacuum suction cup 521 to move upward, so that the vacuum suction cup 521 drives the wafer 4 to move upward to the working area 21, and then the vacuum suction cup 521 is driven to rotate by the rotating motor 523, thereby driving the wafer 4 to rotate, and at the same time, the peripheral side wall of the wafer 4 is scanned by the side wall scanner 15 arranged on the supporting platform 24.

[0052] After the scanning of the peripheral side wall of the wafer 4 is completed, the rotating motor 523 stops working, the vacuum chuck 521 releases the wafer 4, and drives the carrier 251 to move to the wafer 4 through the three power seats 25, so that the wafer 4 is lifted by the arc wall 252 on the carrier 251, and then the receiving member 221 is driven by the electric control seat 22 to move to the wafer 4, and the arc wall 222 on the receiving member 221 contacts the peripheral side wall of the wafer 4, so as to position the wafer 4. Subsequently, the vacuum chuck 521 is driven to descend to the lifting port 26 by the lifting assembly 51.

[0053] After the receiving member 221 positions the wafer 4, the scanner 12 is driven by the moving mechanism 11 to move to the working area 21 to scan the wafer 4, and during the scanning process, the receiving member 221 located in the scanning area 13 of the scanner 12 is separated from the wafer 4 under the drive of the electric control seat 22, and the wafer 4 is positioned by the remaining three receiving members 221, thereby reducing the shadow of the receiving member 221 appearing on the scanning graph during scanning, thereby facilitating the improvement of the scanning accuracy of the wafer 4, and after the scanning area 13 is moved away, the electric control seat 22 drives the receiving member 221 to resume contact with the side wall of the wafer 4, thereby continuing to position the wafer 4.

[0054] Embodiment 2: The difference between the embodiment of the present application and the embodiment 1 is that Fig. 9 and Fig.10 The feeding mechanism 5 also includes a centering component 53, which includes a centering part, a reset part and a driving part. The centering part includes a centering ring 531 and a centering block 532. A positioning ring 533 is fixedly installed on the top wall of the table 2 above the lifting port 26. The centering ring 531 is rotatably installed on the top wall of the table 2 along the axial direction of the positioning ring 533, and the centering ring 531 is coaxially arranged with the positioning ring 533, and the centering ring 531 is located on the inner side of the positioning ring 533, and the area surrounded by the inner circle of the centering ring 531 is larger than the area of ​​the lifting port 26, and the top wall of the centering ring 531 extends upward to the top of the top wall of the positioning ring 533, and the axis of the centering ring 531 is on the same straight line as the axis of the vacuum suction cup 521, and the top wall of the centering ring 531 is used to receive the wafer 4, and the plane where the top wall of the centering ring 531 is located is below a group of scanners 12 below.

[0055] like Fig.11 and Fig.12A guide rod 5311 is fixedly installed on the side wall of the centering ring 531 along the diameter direction of the centering ring 531, one end of the guide rod 5311 extends toward the direction of the positioning ring 533 and passes through the side wall of the positioning ring 533, and a slide groove 5332 for the guide rod 5311 to slide horizontally is provided on the side wall of the positioning ring 533. At least three centering blocks 532 are provided, and four are provided in the embodiment of the present application, and the four centering blocks 532 are all slidably installed on the top wall of the centering ring 531 along the diameter direction of the centering ring 531, and the four centering blocks 532 are equidistantly distributed along the circumferential direction of the centering ring 531. An adjustment block 5322 is also fixedly installed on the top wall of the centering block 532, and the adjustment block 5322 is used to abut the edge of the wafer 4. An adjustment rod 5321 is fixedly installed on the bottom wall of the centering block 532 in the vertical direction. The adjustment rod 5321 passes downward through the top walls of the centering ring 531 and the positioning ring 533 in sequence, and a driving groove 5331 for sliding the adjustment rod 5321 is also provided on the top wall of the positioning ring 533. The driving groove 5331 is arc-shaped, and one end of the driving groove 5331 is located on the top wall of the positioning ring 533 close to the edge of the outer ring of the positioning ring 533, and the other end extends to the inner wall of the inner ring of the positioning ring 533.

[0056] like Fig.10 and Fig.11 The reset member includes a reset torsion spring 534, which is installed on the side wall of the outer ring of the positioning ring 533, and one end of the reset torsion spring 534 is connected to the guide rod 5311 of the centering ring 531, and the other end is fixedly connected to the top wall of the machine table 2.

[0057] like Fig.10 and Fig.11 The driving member includes a driving rod 535, which is fixedly mounted on the side wall of the rotating table 522 in the horizontal direction, and one end of the driving rod 535 extends in a direction away from the lifting screw rod 513, and an avoidance groove for avoiding the driving rod 535 is opened on the top wall of the machine table 2. A control groove for inserting the driving rod 535 is provided on the inner wall of the inner ring of the centering ring 531, and the control groove includes a driving section 5312 and a return section 5314. The driving section 5312 is arranged on the inner wall of the inner ring of the centering ring 531 away from the lifting screw rod 513, and the driving section 5312 is spiral, and one end of the driving section 5312 is located on the bottom wall of the centering ring 531 and is connected to the avoidance groove, and the other end of the driving section 5312 extends along the axis of the centering ring 531 to the top wall of the centering ring 531, and a straight line section 5313 is also provided on the inner wall of the inner ring of the centering ring 531 at the upper end of the driving section 5312, and the straight line section 5313 is arranged in the vertical direction, and the lower end of the straight line section 5313 is connected to the upper end of the driving section 5312, and the upper end of the straight line section 5313 extends to the top wall of the centering ring 531.

[0058] like Fig.11 and Fig.12The return section 5314 is arranged on the inner wall of the inner ring of the centering ring 531 along the vertical direction, and the lower end of the return section 5314 is connected to the lower end of the driving section 5312, and a limiting plate 536 is arranged at the connection position between the return section 5314 and the driving section 5312, one end of the limiting plate 536 is rotatably mounted on the inner wall of the inner ring of the centering ring 531 through a rotating shaft, and is located at the side wall of the return section 5314 on the side close to the driving section 5312, and the limiting plate 536 The other end of the limit plate 536 is inclined downward toward the side wall on the other side of the return section 5314, and extends to abut against the side wall on the other side of the return section 5314, so that the bottom wall of the limit plate 536 and the side wall of the driving section 5312 close to the return section 5314 are located in the same plane, and a limit torsion spring 537 is also installed on the rotating shaft of the limit plate 536, one end of the limit torsion spring 537 is fixedly connected to the limit plate 536, and the other end is fixedly connected to the inner wall of the inner ring of the centering ring 531.

[0059] like Fig.10 and Fig.13 When the wafer 4 is transported to the top wall of the positioning ring 533 on the machine table 2, the wafer 4 falls between the centering blocks 532 on the top wall of the centering ring 531. Then, the vacuum suction cup 521 is driven upward by the lifting assembly 51, and the driving rod 535 is driven upward, so that the driving rod 535 moves upward to the avoidance groove, and the driving rod 535 is inserted into the control groove on the inner wall of the inner ring of the centering ring 531, and slides along the driving section 5312 of the control groove. As the lifting frame 514 drives the driving rod 535 to continue to move upward in the vertical direction, when the driving rod 535 moves to abut against the limit plate 536, the end of the limit plate 536 away from the rotating shaft abuts against the side wall of the return section 5314, so that the driving rod 535 slides along the side wall of the limit plate 536 and slides from the side wall of the limit plate 536 to the side wall of the driving section 5312, thereby driving the centering ring 531 to rotate clockwise through the driving rod 535 and twist the reset torsion spring 534, so that the centering ring 531 drives the centering block 532 to rotate, so that the adjustment rod 5321 on the centering block 532 slides in the driving groove 5331, and the adjustment rod 5321 slides along the side wall of the driving groove 5331 The wall moves toward the inner circle direction of the positioning ring 533, so that the adjusting rod 5321 drives the centering block 532 to move along the diameter of the centering ring 531 toward the axial direction of the centering ring 531, so that the centering block 532 drives the adjusting block 5322 to move until it contacts the edge of the wafer 4, and the adjusting blocks 5322 on the centering blocks 532 evenly distributed in the circumferential direction of the centering ring 531 move toward the axial direction of the centering ring 531 at the same time, so that the wafer 4 is adjusted by the adjusting blocks 5322 on the centering blocks 532 to make the center of the wafer 4 and the axis of the centering ring 531 located on the same straight line, so that the center of the wafer 4 and the center of the vacuum suction cup 521 are located on the same vertical line.

[0060] like Fig.10 and Fig.13 When the driving rod 535 slides from the driving section 5312 to the straight section 5313, the vacuum suction cup 521 just moves to the bottom wall of the wafer 4 and absorbs the wafer 4. Then, the vacuum suction cup 521 is driven to move upward by the lifting assembly 51, thereby driving the wafer 4 to move upward, and the driving rod 535 moves upward along the straight section 5313 until it is separated from the centering ring 531, so that the centering ring 531 rotates counterclockwise and resets under the action of the reset torsion spring 534, so that The centering ring 531 drives the centering block 532 to move, so that the adjusting rod 5321 on the centering block 532 moves along the driving groove 5331 in the direction away from the inner circle of the positioning ring 533, thereby driving the adjusting rod 5321 to move in the axial direction away from the centering ring 531, thereby driving the centering block 532 to move in the axial direction away from the centering ring 531, thereby making several centering blocks 532 on the centering ring 531 open, so that the centering ring 531 can receive a new wafer 4.

[0061] like Fig. 9 and Fig.13 When the lifting component 51 drives the vacuum suction cup 521 to rise to the carrier 251, the power seat 25 drives the carrier 251 to extend, so that the arc wall 252 of the carrier 251 moves to the bottom of the wafer 4, so that the arc wall 252 can support the wafer 4, and then the lifting component 51 drives the vacuum suction cup 521 to move downward, so that the vacuum suction cup 521 drives the wafer 4 to descend until the edge of the wafer 4 falls on the arc wall 252, so that the wafer 4 is supported by the arc wall 252, and then the vacuum suction cup 521 releases the wafer 4 and descends to the lifting port 26.

[0062] like Fig.10 and Fig.12 When the vacuum suction cup 521 descends to the centering ring 531, the driving rod 535 on the rotating table 522 descends to be inserted into the return section 5314 and slides downward along the return section 5314. At this time, the centering ring 531 remains stationary, and when the driving rod 535 descends to the limit plate 536, the driving rod 535 contacts the top wall of the limit plate 536 and pushes the limit plate 536 downward, so that the limit plate 536 rotates downward, thereby opening the connection between the return section 5314 and the driving section 5312, so that The driving rod 535 can be lowered from the return section 5314 to the driving section 5312, and exit the control groove from the lower end of the driving section 5312, thereby facilitating the resetting of the driving rod 535. After the driving rod 535 is separated from the limit plate 536, the limit plate 536 is rotated upward and reset under the action of the limit torsion spring 537, so that one end of the limit plate 536 again contacts the side wall of the return section 5314 away from the driving section 5312, thereby separating the return section 5314 from the driving section 5312 again.

[0063] The working principle of the embodiment of the present application is as follows: when it is necessary to scan and detect the wafer 4, the wafer 4 is transported to the top wall of the centering ring 531, and then the lifting frame 514 is driven to move upward by the lifting assembly 51, so that the lifting frame 514 drives the vacuum suction cup 521 to move in the direction of the wafer 4, so that the driving rod 535 on the rotating table 522 is inserted from the avoidance groove to the control groove, thereby driving the centering ring 531 to rotate clockwise, so that the centering ring 531 drives the wafer 4 and the centering block 532 to rotate, and the adjusting rod 5321 on the rotating centering block 532 slides along the driving groove 5331, and drives the adjusting rod 5321 to move toward the inner circle of the centering ring 531 through the arc-shaped driving groove 5331, thereby driving the centering block 532 to move toward the axis of the centering ring 531, and pushing the wafer 4 through the adjusting block 5322 on the centering block 532, so that the center of the circle on the wafer 4 gradually aligns with the axis of the centering ring 531 and the vacuum suction cup 521. The axis of the suction cup 521 is located on the same vertical line, so that the vacuum suction cup 521 can maintain the coaxiality of the wafer 4 and the vacuum suction cup 521 when sucking the wafer 4, so that the vacuum suction cup 521 can be in the center of the area surrounded by the three power seats 25 when transporting the wafer 4 to the power seat 25, so that the power seat 25 can drive the carrier 251 to support the edge of the wafer 4, thereby reducing the uneven distribution of gravity of the wafer 4 on the vacuum suction cup 521 when there is a deviation between the center of the wafer 4 and the axis of the vacuum suction cup 521, resulting in the wafer 4 being skewed when the vacuum suction cup 521 releases the wafer 4, causing the wafer 4 to fall from the carrier 251, or when the receiving part 221 positions the wafer 4, the receiving part 221 pushes the wafer 4 to move, causing the wafer 4 to rub against the arc wall 252 on the carrier 251, thereby causing the surface of the wafer 4 to be damaged by friction, thereby affecting the scanning accuracy of the wafer 4.

[0064] The above are preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer scanning device, characterized in that: The invention comprises a machine platform (2) and a scanning unit (1), wherein the machine platform (2) is provided with an operating area (21) for placing a wafer (4), and the scanning unit (1) comprises a moving mechanism (11) and at least one scanner (12), wherein the moving mechanism (11) is installed on the machine platform (2), and at least one of the scanners (12) is installed on the moving mechanism (11) along a straight line, wherein the moving mechanism (11) is used to drive the scanner (12) to move, and the at least one of the scanners (12) is used to simultaneously scan the top wall and the bottom wall of the wafer (4) located in the operating area (21). For scanning, the machine (2) is provided with at least four electric control seats (22) located in the working area (21), each of the electric control seats (22) is installed with a receiving member (221), the receiving member (221) is used to contact with the side wall of the wafer (4), and the receiving members (221) on at least one electric control seat (22) located on a straight line parallel to the straight line where at least one of the scanners (12) is located are staggered, and when scanning the wafer (4), the receiving member (221) located on the straight line where at least one of the scanners (12) is located is separated from the wafer (4).

2. A wafer scanning device according to claim 1, characterized in that: The vertical wall surface of the receiving member (221) is provided with an arc wall (222), and the arc wall (222) is used to contact the circumferential wall of the wafer (4).

3. A wafer scanning device according to claim 1, characterized in that: At least two power seats (25) are also installed on the machine (2) in the working area (21), and the at least two power seats (25) are distributed at equal angles in the circumferential direction of the wafer (4) located in the working area (21), and each of the power seats (25) is installed with a carrier (251), and the carrier (251) is used to receive the wafer (4).

4. A wafer scanning device according to claim 3, characterized in that: The carrier (251) is provided with an arc-shaped wall (252), and the arc-shaped wall (252) is used to receive the wafer (4).

5. A wafer scanning device according to claim 1, characterized in that: The scanner (12) comprises an upper scanner group and a lower scanner group, the upper scanner group and the lower scanner group are both mounted on a moving mechanism (11), the upper scanner group is located above an electric control seat (22), and the upper scanner group is used to scan the top wall of a wafer (4), the lower scanner group is located below the electric control seat (22), and the lower scanner group is used to scan the bottom wall of a wafer (4).

6. A wafer scanning device according to claim 1, characterized in that: The machine platform (2) is provided with a feeding mechanism (5) for conveying the wafer (4) to the electric control seat (22). The feeding mechanism (5) comprises a lifting assembly (51). The lifting assembly (51) comprises a lifting motor (512), a lifting screw (513) and a lifting frame (514). The lifting screw (513) is vertically mounted on the machine platform (2). The lifting motor (512) is also mounted on the machine platform (2). The output shaft of the lifting motor (512) is connected to one end of the lifting screw (513). The lifting frame (514) is threadedly mounted on the lifting screw (513). The lifting frame (514) is also slidably connected to the machine platform (2). The lifting frame (514) is used to carry the wafer (4).

7. A wafer scanning device according to claim 6, characterized in that: A driving wheel (515) is coaxially mounted on the output shaft of the lifting motor (512), a transmission wheel (516) is coaxially mounted on one end of the lifting screw rod (513), and the driving wheel (515) and the transmission wheel (516) are connected via a synchronous belt (517).

8. A wafer scanning device according to claim 6, characterized in that: The feeding mechanism (5) further comprises an adsorption component (52), wherein the adsorption component (52) comprises a vacuum suction cup (521), wherein the vacuum suction cup (521) is mounted on a lifting frame (514), and the vacuum suction cup (521) is connected to an external air source, and the vacuum suction cup (521) is used to adsorb the wafer (4).

9. A wafer scanning device according to claim 6, characterized in that: The feeding mechanism (5) further comprises a centering component (53), the centering component (53) comprising a centering part, a reset part and a drive part, the centering part comprising a centering ring (531) and a centering block (532), a positioning ring (533) is further installed on the platform (2) at the lifting component (51), the centering ring (531) is rotatably installed on the inner ring of the positioning ring (533), and the centering ring (531) is used for the lifting frame (514) to pass through, and the centering ring (531) is used to support the wafer (4), at least three centering blocks (532) are provided, and at least three centering blocks (532) are installed on the positioning ring (533), and at least three centering blocks (532) are distributed at equal angles along the circumferential direction, and the centering blocks (532) ) is installed with an adjustment block (5322), the adjustment block (5322) is used to abut against the side wall of the wafer (4), an adjustment rod (5321) is also installed on the side of the centering block (532) away from the adjustment block (5322), the adjustment rod (5321) is slidably connected to the positioning ring (533), and the positioning ring (533) is installed with a driving groove (5331) for the adjustment rod (5321) to slide, the driving groove (5331) is arc-shaped, and one end of the driving groove (5331) extends toward the center of the positioning ring (533), the reset member is installed on the machine table (2), and the reset member is connected to the centering ring (531), and the driving member is installed on the lifting frame (514), and the driving member is connected to the centering ring (531).

10. A wafer scanning device according to claim 9, characterized in that: A control groove for sliding the driving member is provided on the inner wall of the inner ring of the centering ring (531), and the control groove includes a driving section (5312) and a return section (5314). The return section (5314) is arranged on the inner wall of the inner ring of the centering ring (531) in a vertical direction. The driving section (5312) is spiral-shaped and is arranged along the axial direction of the centering ring (531). The lower end of the driving section (5312) is aligned with the return section (5314). The lower end of the driving section (5312) is connected, the upper end of the driving section (5312) extends to the top wall of the centering ring (531), and a limiting plate (536) is rotatably installed at the connection position between the driving section (5312) and the return section (5314), and the limiting plate (536) is used to separate the driving section (5312) from the return section (5314). A limiting torsion spring (537) is installed on the rotating shaft of the limiting plate (536), and the limiting torsion spring (537) is connected to the limiting plate (536).

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