Bonding wire defect detection method and device, computer equipment and readable storage medium

Abstract

The invention relates to a bonding wire defect detection method and device, computer equipment and a readable storage medium. The method comprises the following steps: acquiring a magnetic field distribution image obtained by acquiring a magnetic field generated by a target power device by a magnetic field camera; according to the target type of the target power device, a reference magnetic field distribution image corresponding to the target type is inquired from a database, the reference magnetic field distribution image corresponds to one power device of the target type, and the reference magnetic field distribution image corresponds to one power device of the target type; the image is an image obtained by acquiring a magnetic field generated by a corresponding power device through a magnetic field camera; and obtaining bonding wire state information corresponding to the reference magnetic field distribution image, comparing the magnetic field distribution image with the reference magnetic field distribution image, and determining a defect detection result of the bonding wire in the target power device based on a comparison result and the bonding wire state information. By adopting the method, the defect detection efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic device defect detection, and in particular to a bonding wire defect detection method, device, computer equipment and readable storage medium. Background Art

[0002] Currently, power devices have been widely used in new energy vehicles, wind power generation and other equipment. During the use of power devices, long-term high-frequency disconnection will accelerate the aging of the bonding wire solder joints in the power devices, causing the power devices to fail, so it is necessary to detect the bonding wires in the power devices. At this time, a method is needed to quickly and non-destructively determine the damage and the location of the damage without cutting the module.

[0003] In traditional technology, X-ray images are usually used to detect bonding wires, but they can only determine whether the metal wires are severely damaged or broken, and the detection accuracy is low, resulting in low accuracy in bonding wire defect detection. Summary of the invention

[0004] Based on this, it is necessary to provide a bonding wire defect detection method, device, computer equipment and readable storage medium that can improve defect detection efficiency in response to the above technical problems.

[0005] On the one hand, the present application provides a bonding wire defect detection method, including: obtaining a magnetic field distribution image obtained by collecting the magnetic field generated by a target power device with a magnetic field camera; according to the target type of the target power device, querying a reference magnetic field distribution image corresponding to the target type from a database, the reference magnetic field distribution image corresponding to a power device of the target type, and the reference magnetic field distribution image is an image obtained by collecting the magnetic field generated by the corresponding power device with a magnetic field camera; obtaining bonding wire status information corresponding to the reference magnetic field distribution image, the bonding wire status information is used to characterize the status information of the bonding wire in the power device corresponding to the reference magnetic field distribution image when collecting the reference magnetic field distribution image; comparing the magnetic field distribution image with the reference magnetic field distribution image, and determining the defect detection result of the bonding wire in the target power device based on the comparison result and the bonding wire status information.

[0006] On the other hand, the present application also provides a bonding wire defect detection device, including: an image acquisition module, used to acquire a magnetic field distribution image obtained by collecting the magnetic field generated by a target power device with a magnetic field camera; an image query module, used to query the reference magnetic field distribution image corresponding to the target type from a database according to the target type of the target power device, the reference magnetic field distribution image corresponds to a power device of the target type, and the reference magnetic field distribution image is an image obtained by collecting the magnetic field generated by the corresponding power device with a magnetic field camera; a status information acquisition module, used to acquire bonding wire status information corresponding to the reference magnetic field distribution image, the bonding wire status information is used to characterize the status information of the bonding wire in the power device corresponding to the reference magnetic field distribution image when collecting the reference magnetic field distribution image; a detection result determination module, used to compare the magnetic field distribution image with the reference magnetic field distribution image, and determine the defect detection result of the bonding wire in the target power device based on the comparison result and the bonding wire status information.

[0007] In some embodiments, the reference magnetic field distribution image is acquired when the relative position between the corresponding power device and the magnetic field camera is the target relative position, and the magnetic field distribution image is acquired when the relative position between the target power device and the magnetic field camera is the target relative position.

[0008] In some embodiments, the reference magnetic field distribution image is acquired when the voltage connected to the corresponding power device is a specified voltage and the current connected is a specified current, and the magnetic field distribution image is acquired when the voltage connected to the target power device is a specified voltage and the current connected is a specified current.

[0009] In some embodiments, the detection result determination module is also used to compare the magnetic field distribution image with the reference magnetic field distribution image, and determine a difference image area that is different from the reference magnetic field distribution image from the magnetic field distribution image; when the bonding wire status information represents that the bonding wire in the power device is in a normal state, it is determined that there is a suspected defect in the bonding wire in the difference image area.

[0010] On the other hand, the present application also provides a bonding wire defect detection system, the system comprising: a stand for fixing a target power device; a magnetic field camera for collecting the magnetic field generated by the target power module to obtain a magnetic field distribution image, wherein the magnetic field distribution image is used for a computer device: according to the target type of the target power device, querying a reference magnetic field distribution image corresponding to the target type from a database, wherein the reference magnetic field distribution image corresponds to a power device of the target type, and the reference magnetic field distribution image is an image obtained by collecting the magnetic field generated by the corresponding power device with a magnetic field camera; obtaining bonding wire status information corresponding to the reference magnetic field distribution image, wherein the bonding wire status information is used to characterize the status information of the bonding wire in the power device corresponding to the reference magnetic field distribution image when collecting the reference magnetic field distribution image; comparing the magnetic field distribution image with the reference magnetic field distribution image, and determining the defect detection result of the bonding wire in the target power device based on the comparison result and the bonding wire status information.

[0011] In some embodiments, the system further includes: a voltage source for accessing a gate terminal of a target power device; and a current source for accessing a drain terminal of the target power device.

[0012] On the other hand, the present application further provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps in the above-mentioned bonding wire defect detection method when executing the computer program.

[0013] On the other hand, the present application further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps in the above-mentioned bonding wire defect detection method are implemented.

[0014] On the other hand, the present application also provides a computer program product, including a computer program, which implements the steps in the above-mentioned bonding wire defect detection method when executed by a processor.

[0015] The above-mentioned bonding wire defect detection method, device, computer equipment, computer-readable storage medium and computer program product obtain a magnetic field distribution image obtained by collecting the magnetic field generated by the target power device with a magnetic field camera, query the reference magnetic field distribution image corresponding to the target type from the database according to the target type of the target power device, the reference magnetic field distribution image corresponds to a power device of a target type, the reference magnetic field distribution image is an image obtained by collecting the magnetic field generated by the corresponding power device with a magnetic field camera, obtain the bonding wire state information corresponding to the reference magnetic field distribution image, the bonding wire state information is used to characterize the state information of the bonding wire in the power device corresponding to the reference magnetic field distribution image when collecting the reference magnetic field distribution image, compare the magnetic field distribution image with the reference magnetic field distribution image, and determine the defect detection result of the bonding wire in the target power device based on the comparison result and the bonding wire state information. The bonding wire defect detection method improves the accuracy of bonding wire defect detection through the magnetic field distribution image. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A diagram of an application environment of a bonding line defect detection method in some embodiments;

[0018] Figure 2 is a schematic flow chart of a bonding line defect detection method in some embodiments;

[0019] Figure 3 is a schematic diagram of a bonding wire defect detection system in some embodiments;

[0020] Figure 4 A flowchart of performing bond line defect detection in some embodiments;

[0021] Figure 5 is a structural block diagram of a bonding line defect detection device in some embodiments;

[0022] Figure 6 1 is a diagram of the internal structure of a computer device in some embodiments. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0024] The bonding wire defect detection method provided in the embodiment of the present application can be applied to Figure 1 In the application environment shown, the application environment includes a computer device, a magnetic field camera and a power device. The computer device obtains a magnetic field distribution image obtained by collecting the magnetic field generated by the target power device with the magnetic field camera, queries the reference magnetic field distribution image corresponding to the target type from the database according to the target type of the target power device, the reference magnetic field distribution image corresponds to a power device of a target type, the reference magnetic field distribution image is an image obtained by collecting the magnetic field generated by the corresponding power device with the magnetic field camera, obtains the bonding wire state information corresponding to the reference magnetic field distribution image, the bonding wire state information is used to characterize the state information of the bonding wire in the power device corresponding to the reference magnetic field distribution image when collecting the reference magnetic field distribution image, compares the magnetic field distribution image with the reference magnetic field distribution image, and determines the defect detection result of the bonding wire in the target power device based on the comparison result and the bonding wire state information.

[0025] Among them, the magnetic field camera is a high-resolution, high-precision measurement and visualization system for magnetic materials, components and surfaces. It captures and analyzes subtle changes in the magnetic field through a unique sensor array, achieving real-time visualization and precise measurement of the magnetic field. The magnetic field camera is a device that uses advanced sensor technology and imaging technology to capture and present the distribution of the magnetic field in real time. Through high-sensitivity and high-resolution imaging technology, the magnetic field camera can capture and present the distribution of the magnetic field in real time. The magnetic field camera can measure magnetic field parameters such as magnetic flux density and provide accurate magnetic field data for researchers.

[0026] The computer device may be, but is not limited to, various personal computers, laptops, smart phones, tablet computers, IoT devices and portable wearable devices. The IoT devices may be smart speakers, smart TVs, smart air conditioners, smart car devices, projection devices, etc. Portable wearable devices may be smart watches, smart bracelets, head-mounted devices, etc. The head-mounted devices may be virtual reality (VR) devices, augmented reality (AR) devices, smart glasses, etc. The computer device and the magnetic field camera communicate in a wired or wireless manner.

[0027] In some embodiments, Figure 2 As shown, a bonding line defect detection method is provided, and the method is applied to Figure 1 The computer device in the example is used to illustrate, including the following steps 202 to 208. Among them:

[0028] Step 202 : acquiring a magnetic field distribution image obtained by collecting the magnetic field generated by the target power device with a magnetic field camera.

[0029] Among them, the target power device can be any power device. The power device can also be called a power module. The power device includes but is not limited to IGBT (insulated gate bipolar transistor) and SiC Mosfet (silicon carbide metal oxide semiconductor field effect transistor). IGBT and SiC Mosfet are two different types of power electronic devices, namely power modules. IGBT is made of silicon (Si)-based materials and is a traditional semiconductor material. SiC MOSFET uses a wide bandgap material, silicon carbide (SiC). SiC has the advantages of higher breakdown electric field strength, higher thermal conductivity, higher operating temperature and smaller chip area.

[0030] Power devices contain power chips. Power chips refer to a type of integrated circuit chip that can process high-power signals. A magnetic field distribution image is an image used to represent the distribution of magnetic field strength and direction in space.

[0031] Specifically, the computer device and the magnetic field camera can communicate, for example, by connecting the magnetic field camera to the computer device, the computer device can communicate with the magnetic field camera. Then, the computer device can read the magnetic field distribution image captured by the magnetic field camera from the magnetic field camera.

[0032] Step 204, according to the target type of the target power device, query the reference magnetic field distribution image corresponding to the target type from the database, the reference magnetic field distribution image corresponds to a power device of a target type, and the reference magnetic field distribution image is an image obtained by collecting the magnetic field generated by the corresponding power device through a magnetic field camera.

[0033] There may be multiple types of power devices, and different types of power devices may be understood as different types of power devices. The target type refers to the type of the target power device. The same type of power devices may be understood as the same power devices, and under the same conditions, the magnetic fields generated by the same type of power devices are the same or similar. The same conditions include, but are not limited to, connecting to the same current and connecting to the same voltage.

[0034] The database may store multiple reference magnetic field distribution images, each of which corresponds to a power device. The power device corresponding to the magnetic field distribution image is an image obtained by collecting the magnetic field generated by the corresponding power device using a magnetic field camera. Different magnetic field distribution images may correspond to the same type of power device or different types of power devices.

[0035] Specifically, the computer device may acquire the type of the target power device, obtain the target type, and query a reference magnetic field distribution image corresponding to the target type from a database.

[0036] Step 206 , obtaining bonding wire status information corresponding to the reference magnetic field distribution image, wherein the bonding wire status information is used to represent status information of bonding wires in the power device corresponding to the reference magnetic field distribution image when the reference magnetic field distribution image is acquired.

[0037] Among them, bonding wires, also often referred to as wire bonding wires, are metal wires that connect chip electrode terminals, diode chips, insulating linings and other components. They use wire bonding technology to tightly connect the various components together to form an electrical circuit to ensure that current and signals can be transmitted smoothly. Wire bonding technology is a key technology for realizing the connection between chips and package pins in power chip packaging. The basic principle of wire bonding technology is to use a high-conductivity metal wire (aluminum, copper, etc.) with a diameter of usually tens or hundreds of microns, and press it on the pad under the action of thermal ultrasound, so that the metal atoms of the pad and the wire diffuse to form intermetallic compounds, thereby realizing the connection between the chip and the pin. There can be multiple bonding wires in a power device.

[0038] Specifically, the database may store the bonding wire status information corresponding to each reference magnetic field distribution image. When the reference magnetic field distribution image is collected, the bonding wires in the power device corresponding to the reference magnetic field distribution image are all in a normal state, and the bonding wire status information is information indicating that the bonding wires in the power device are all in a normal state.

[0039] In some embodiments, when a reference magnetic field distribution image is acquired, if a bonding wire in at least one of the power devices corresponding to the reference magnetic field distribution image is in an abnormal state, the bonding wire status information may include at least one of an identification of the position of the bonding wire in the abnormal state, or an identification of the fault type to which the bonding wire in the abnormal state belongs.

[0040] Step 208 : comparing the magnetic field distribution image with the reference magnetic field distribution image, and determining a defect detection result of the bonding wire in the target power device based on the comparison result and the bonding wire state information.

[0041] Specifically, the computer device can calculate the similarity between the magnetic field distribution image and the reference magnetic field distribution image. When the similarity is greater than or equal to the similarity threshold, the bonding wire status information corresponding to the reference magnetic field distribution image is used as the bonding wire status information corresponding to the magnetic field distribution image. According to the bonding wire status information corresponding to the magnetic field distribution image, the defect detection result of the bonding wire in the target power device is determined. For example, when the bonding wire status information indicates that the bonding wires are all normal, the defect detection result is a result that indicates that the bonding wires of the chip are all normal. When the bonding wire status information indicates that the bonding wire at the specified position is faulty, the defect detection result is a result that indicates that the bonding wire at the specified position is faulty. The similarity threshold is set as needed, such as 95%, 99% or 100%.

[0042] In the above-mentioned bonding wire defect detection method, a magnetic field distribution image is obtained by acquiring the magnetic field generated by the target power device through the magnetic field camera, and a reference magnetic field distribution image corresponding to the target type is queried from the database according to the target type of the target power device. The reference magnetic field distribution image corresponds to a power device of a target type. The reference magnetic field distribution image is an image obtained by acquiring the magnetic field generated by the corresponding power device through the magnetic field camera, and the bonding wire state information corresponding to the reference magnetic field distribution image is obtained. The bonding wire state information is used to characterize the state information of the bonding wire in the power device corresponding to the reference magnetic field distribution image when the reference magnetic field distribution image is acquired. The magnetic field distribution image is compared with the reference magnetic field distribution image, and the defect detection result of the bonding wire in the target power device is determined based on the comparison result and the bonding wire state information. The bonding wire defect detection method has a simple detection process and improves the bonding wire defect detection efficiency. The bonding wire defect detection method can determine whether the metal wire is seriously damaged or broken through the magnetic field distribution image, and can also locate the bad point or abnormal point, realize the judgment of desoldering or cold soldering, and judge whether the physical properties of the bonding wire meet the design requirements. The judgment accuracy is high, and the bonding wire defect detection efficiency is improved.

[0043] The bonding wire defect detection method provided in the present application is highly sensitive and is a non-destructive fault location method. It can directly and efficiently detect and locate very weak magnetic field changes, and lock in which specific bonding wire has an abnormality. It does not require the use of multiple additional equipment for detection. The detection process is extremely simple and the detection cost is greatly reduced, which is conducive to its application and promotion in the industry.

[0044] In some embodiments, the reference magnetic field distribution image is acquired when the relative position between the corresponding power device and the magnetic field camera is the target relative position, and the magnetic field distribution image is acquired when the relative position between the target power device and the magnetic field camera is the target relative position.

[0045] Specifically, in order to obtain a clear image, any power device of the target type can be fixed on a stand, and the relative position between the power device and the magnetic field camera can be adjusted by adjusting the position of the stand. After each adjustment, the computer device can control the magnetic field camera to collect the magnetic field to obtain a collected image. If the collected image does not show the magnetic field distribution condition generated by the power device on the stand or the presented magnetic field distribution condition is unclear, readjustment is performed until a clear magnetic field distribution condition generated by the power device on the stand is shown in the collected image, and the relative position between the power device and the magnetic field camera when the adjustment is stopped is recorded to obtain the target relative position, establish a corresponding relationship between the target type and the target relative position, and store the corresponding relationship between the target type and the target relative position.

[0046] Thus, when it is necessary to collect the magnetic field generated by the power device of the target type, the power device is fixed on the stand, and the relative position between the power device and the magnetic field camera is made consistent with the target relative position by adjusting the position of the stand according to the target relative position corresponding to the target type. Similarly, when it is necessary to collect the magnetic field generated by the target power device, the target power device is fixed on the stand, and the relative position between the power device and the magnetic field camera is made consistent with the target relative position by adjusting the position of the stand according to the target relative position corresponding to the target type. The magnetic field camera can be located directly above the power device, so that the magnetic field camera can be located directly above the target power device.

[0047] In this embodiment, since the relative position between the magnetic field camera and the target power device is the same when collecting the magnetic field distribution image and the relative position between the magnetic field camera and the power device is the same when collecting the reference magnetic field distribution image, the error caused by the relative position can be eliminated, thereby reducing the error of the defect detection result and improving the accuracy of the defect detection result.

[0048] In some embodiments, the reference magnetic field distribution image is acquired when the voltage connected to the corresponding power device is a specified voltage and the current connected is a specified current, and the magnetic field distribution image is acquired when the voltage connected to the target power device is a specified voltage and the current connected is a specified current.

[0049] The specified voltage and the specified current can be set as needed, for example, the specified current is a DC current of 25A or 27A. For any target type of power device, the specified voltage is used to access the gate of the power device, and the specified current is used to access the drain terminal of the power device. The source of the power device is connected to the load inductor.

[0050] Specifically, as mentioned above, in order to obtain a clear image, the relative position is adjusted. Similarly, in order to obtain a clear image, at least one of the voltage or the current can also be adjusted, for example, the connected voltage and current can be adjusted. The specified voltage and the specified current are determined by adjustment, and under the condition of the specified voltage and the specified current, the magnetic field camera can capture a clear image.

[0051] In some embodiments, the computer device can use the target relative position, the specified voltage, and the specified current as acquisition parameters, establish a corresponding relationship between the target type and the acquisition parameters, and store the corresponding relationship between the target type and the acquisition parameters. Thus, when it is necessary to acquire the magnetic field generated by a power device of any target type, if the acquisition parameters are met, a clear magnetic field distribution image can be obtained by performing acquisition.

[0052] In this embodiment, since the voltage connected to the target power device when collecting the magnetic field distribution image is the same as the voltage connected to the power device when collecting the reference magnetic field distribution image, and the current connected to the target power device when collecting the magnetic field distribution image is the same as the current connected to the power device when collecting the reference magnetic field distribution image, the error caused by voltage and current can be eliminated, thereby reducing the error of the defect detection results and improving the accuracy of the defect detection results.

[0053] In some embodiments, the magnetic field distribution image is compared with a reference magnetic field distribution image, and based on the comparison result and the bonding wire status information, the defect detection result of the bonding wire in the target power device is determined, including: comparing the magnetic field distribution image with the reference magnetic field distribution image, and determining a difference image area that is different from the reference magnetic field distribution image from the magnetic field distribution image; when the bonding wire status information indicates that the bonding wire in the power device is in a normal state, determining that the bonding wire in the difference image area is suspected to have a defect.

[0054] Specifically, when the similarity between the magnetic field distribution image and the reference magnetic field distribution image is less than a similarity threshold, the magnetic field distribution image is compared with the reference magnetic field distribution image, and based on the comparison result and the bonding wire status information, the defect detection result of the bonding wire in the target power device is determined.

[0055] In some embodiments, after determining that the bonding wire in the difference image area is suspected to be defective, the health of the bonding wire can be identified by comparing the bare power device with a reference or a layout drawing. A layout drawing is a drawing used to show the design layout and arrangement.

[0056] In this embodiment, the health of the bonding wire is determined by the difference image area, thereby improving the efficiency of defect detection. This method can not only identify the abnormal bonding position of the bonding wire, but also evaluate the degree of bonding wire cracking. In particular, when analyzing the failure of modules that failed in tests such as power cycling, it avoids secondary, imperceptible damage to the already fragile bonding points during the uncapping process. Traditional superscanning and laser detection are prone to misjudgment because they cannot accurately identify problems such as whether the bonding wire is about to break or not, or whether the bottom part is disconnected.

[0057] In some embodiments, a bonding wire defect detection system is provided, and the system includes: a stand for fixing a target power device; a magnetic field camera for collecting a magnetic field generated by a target power module to obtain a magnetic field distribution image, and the magnetic field distribution image is used for a computer device: according to a target type of the target power device, querying a reference magnetic field distribution image corresponding to the target type from a database, the reference magnetic field distribution image corresponds to a power device of a target type, and the reference magnetic field distribution image is an image obtained by collecting the magnetic field generated by the corresponding power device with a magnetic field camera; obtaining bonding wire status information corresponding to the reference magnetic field distribution image, and the bonding wire status information is used to characterize the status information of the bonding wire in the power device corresponding to the reference magnetic field distribution image when collecting the reference magnetic field distribution image; comparing the magnetic field distribution image with the reference magnetic field distribution image, and determining the defect detection result of the bonding wire in the target power device based on the comparison result and the bonding wire status information.

[0058] Among them, the stand can be a stand that can automatically move its position and memorize coordinates. The stand can be a stand that can automatically move in three directions of XYZ in a small range by controlling a motor such as a servo motor, and is used to fix and adjust the relative position of the power module and the magnetic field camera, that is, the stand can be a 3-axis mobile machine, and the 3-axis mobile machine can also be called a 3-axis mobile test machine. The movement of the stand can be achieved by a computer device controlling a motor. Of course, there can also be a control device, and a mobile control system is deployed in the control device. The mobile control system can control the servo motor to move the stand. Of course, a mobile control system can also be deployed in the computer device, and the computer device controls the servo motor to move the stand through the mobile control system.

[0059] A servo motor is an engine used to control the operation of mechanical components in a servo system. It is an auxiliary motor indirect speed change device. A servo motor can convert voltage signals into torque and speed to drive the controlled object. After receiving a pulse signal, the servo motor will rotate the angle corresponding to the pulse to achieve displacement control.

[0060] like Figure 3 As shown, an architecture diagram of a defect detection system in some embodiments is shown, wherein a data analysis system is deployed in a computer device, and the computer device compares a magnetic field distribution image with a reference magnetic field distribution image through the data analysis system to generate a data comparison report. The module fixing slot is used to fix the power module on a 3-axis mobile test machine.

[0061] The above-mentioned bonding wire defect detection system obtains the magnetic field distribution image obtained by the magnetic field camera collecting the magnetic field generated by the target power device, and queries the reference magnetic field distribution image corresponding to the target type from the database according to the target type of the target power device. The reference magnetic field distribution image corresponds to a power device of a target type. The reference magnetic field distribution image is an image obtained by collecting the magnetic field generated by the corresponding power device through the magnetic field camera. The bonding wire state information corresponding to the reference magnetic field distribution image is obtained. The bonding wire state information is used to characterize the state information of the bonding wire in the power device corresponding to the reference magnetic field distribution image when collecting the reference magnetic field distribution image. The magnetic field distribution image is compared with the reference magnetic field distribution image, and the defect detection result of the bonding wire in the target power device is determined based on the comparison result and the bonding wire state information. The defect detection method has a simple detection process and improves the efficiency of bonding wire defect detection. The bonding wire defect detection method has a simple detection process and improves the efficiency of bonding wire defect detection. The bonding wire defect detection method can determine whether the metal wire is severely damaged or broken through the magnetic field distribution image, and can also locate bad points or abnormal points, realize the judgment of phenomena such as desoldering or cold soldering, and judge whether the physical properties of the bonding wire meet the design requirements. The judgment has high accuracy and improves the efficiency of bonding wire defect detection.

[0062] In some embodiments, the system further includes: a voltage source for accessing a gate terminal of a target power device; and a current source for accessing a drain terminal of the target power device.

[0063] In this embodiment, the target power device may generate a magnetic field by powering on the target power device.

[0064] In some embodiments, Figure 4As shown, a flow chart for detecting bonding wire defects is provided. In this process, the power module is fixed at a suitable position on the machine platform so that it cannot slide relatively on the machine platform. The power module is a power device, and the machine platform is a stand. Connect the gate terminal of one bridge arm of the power module to the voltage source, and the drain-source terminal to the positive and negative poles of the current source. For example, during the test, move the power module to a suitable position, connect the voltage source to power on the module gate to open a bridge arm to be tested, and then connect a DC current of less than 30A from the module drain terminal, and the source is connected to the load inductor. By adjusting the DC current size and the position of the power module. Move the machine platform in the Z direction to keep a safe distance between the magnetic field camera and the power module. Move the machine platform in the XY direction to move the power module to the lower side of the magnetic field camera. Set the voltage source output voltage according to the gate drive voltage, and the current source outputs current at the same time. Turn on the magnetic field camera to confirm the resolution effect, adjust the current output value until the resolution is clear, and if necessary, fine-tune the Z-axis lifting platform to make the distance between the module and the magnetic field camera appropriate. The computer device connected to the magnetic field camera controls the magnetic field camera to start detecting the magnetic field distribution and generate magnetic field intensity data and Map. The generated magnetic field strength data and map, the current applied to the power module, voltage, test point coordinates and other information are recorded and saved to the database and a test report is generated. The test point coordinates can be the coordinates of the magnetic field camera or the coordinates of the power module. The computer equipment calls up the map from the database for analysis and comparison, automatically marks the difference points and generates a comparison report. The map refers to the magnetic field distribution image.

[0065] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0066] Based on the same inventive concept, the embodiment of the present application also provides a bonding wire defect detection device for implementing the bonding wire defect detection method involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations of one or more bonding wire defect detection device embodiments provided below can refer to the limitations of the bonding wire defect detection method above, and will not be repeated here.

[0067] In some embodiments, Figure 5As shown, a bonding line defect detection device is provided, including: an image acquisition module 502, an image query module 504, a state information acquisition module 506 and a detection result determination module 508, wherein:

[0068] The image acquisition module 502 is used to acquire a magnetic field distribution image obtained by collecting the magnetic field generated by the target power device with a magnetic field camera.

[0069] The image query module 504 is used to query the reference magnetic field distribution image corresponding to the target type from the database according to the target type of the target power device. The reference magnetic field distribution image corresponds to a power device of a target type. The reference magnetic field distribution image is an image obtained by collecting the magnetic field generated by the corresponding power device through a magnetic field camera.

[0070] The state information acquisition module 506 is used to acquire the bond wire state information corresponding to the reference magnetic field distribution image. The bond wire state information is used to represent the state information of the bond wire in the power device corresponding to the reference magnetic field distribution image when the reference magnetic field distribution image is acquired.

[0071] The detection result determination module 508 is used to compare the magnetic field distribution image with the reference magnetic field distribution image, and determine the defect detection result of the bonding wire in the target power device based on the comparison result and the bonding wire state information.

[0072] In some embodiments, the reference magnetic field distribution image is acquired when the relative position between the corresponding power device and the magnetic field camera is the target relative position, and the magnetic field distribution image is acquired when the relative position between the target power device and the magnetic field camera is the target relative position.

[0073] In some embodiments, the reference magnetic field distribution image is acquired when the voltage connected to the corresponding power device is a specified voltage and the current connected is a specified current, and the magnetic field distribution image is acquired when the voltage connected to the target power device is a specified voltage and the current connected is a specified current.

[0074] In some embodiments, the detection result determination module 508 is also used to compare the magnetic field distribution image with the reference magnetic field distribution image, and determine a difference image area that is different from the reference magnetic field distribution image from the magnetic field distribution image; when the bonding wire status information represents that the bonding wire in the power device is in a normal state, it is determined that there is a suspected defect in the bonding wire in the difference image area.

[0075] In some embodiments, a bonding wire defect detection system is provided, and the system includes: a stand for fixing a target power device; a magnetic field camera for collecting a magnetic field generated by a target power module to obtain a magnetic field distribution image, and the magnetic field distribution image is used for a computer device: according to a target type of the target power device, querying a reference magnetic field distribution image corresponding to the target type from a database, the reference magnetic field distribution image corresponds to a power device of a target type, and the reference magnetic field distribution image is an image obtained by collecting the magnetic field generated by the corresponding power device with a magnetic field camera; obtaining bonding wire status information corresponding to the reference magnetic field distribution image, and the bonding wire status information is used to characterize the status information of the bonding wire in the power device corresponding to the reference magnetic field distribution image when collecting the reference magnetic field distribution image; comparing the magnetic field distribution image with the reference magnetic field distribution image, and determining the defect detection result of the bonding wire in the target power device based on the comparison result and the bonding wire status information.

[0076] In some embodiments, the system further includes: a voltage source for accessing a gate terminal of a target power device; and a current source for accessing a drain terminal of the target power device.

[0077] Each module in the above-mentioned bonding wire defect detection device can be implemented in whole or in part by software, hardware and their combination. Each of the above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the corresponding operations of each of the above modules.

[0078] In some embodiments, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as follows: Figure 6As shown. The computer device includes a processor, a memory, an input / output interface, a communication interface, a display unit and an input device. The processor, the memory and the input / output interface are connected through a system bus, and the communication interface, the display unit and the input device are connected to the system bus through the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is used to exchange information between the processor and the external device. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be implemented through WIFI, a mobile cellular network, near field communication (NFC) or other technologies. When the computer program is executed by the processor, a bonding wire defect detection method is implemented. The display unit of the computer device is used to form a visually visible picture, which can be a display screen, a projection device or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covering the display screen, or a button, trackball or touchpad set on the computer device shell, or an external keyboard, touchpad or mouse.

[0079] Those skilled in the art will understand that Figure 6 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0080] In some embodiments, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above-mentioned method embodiments when executing the computer program.

[0081] In some embodiments, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0082] In some embodiments, a computer program product is provided, including a computer program, which implements the steps in the above-mentioned method embodiments when executed by a processor.

[0083] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0084] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., but are not limited to this.

[0085] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0086] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A bonding line defect detection method, characterized in that: The method comprises: Acquire a magnetic field distribution image obtained by collecting the magnetic field generated by the target power device with a magnetic field camera; According to the target type of the target power device, query a reference magnetic field distribution image corresponding to the target type from a database, wherein the reference magnetic field distribution image corresponds to a power device of the target type, and the reference magnetic field distribution image is an image obtained by collecting the magnetic field generated by the corresponding power device through a magnetic field camera; Acquiring bonding wire state information corresponding to the reference magnetic field distribution image, wherein the bonding wire state information is used to represent state information of bonding wires in a power device corresponding to the reference magnetic field distribution image when the reference magnetic field distribution image is acquired; The magnetic field distribution image is compared with the reference magnetic field distribution image, and based on the comparison result and the bonding wire state information, a defect detection result of the bonding wire in the target power device is determined.

2. The method according to claim 1, characterized in that The reference magnetic field distribution image is acquired when the relative position between the corresponding power device and the magnetic field camera is the target relative position, and the magnetic field distribution image is acquired when the relative position between the target power device and the magnetic field camera is the target relative position.

3. The method according to claim 1, characterized in that The reference magnetic field distribution image is acquired when the voltage connected to the corresponding power device is a specified voltage and the current connected is a specified current, and the magnetic field distribution image is acquired when the voltage connected to the target power device is the specified voltage and the current connected is the specified current.

4. The method according to claim 1, characterized in that: The comparing the magnetic field distribution image with the reference magnetic field distribution image, and determining a defect detection result of the bonding wire in the target power device based on the comparison result and the bonding wire state information, includes: Comparing the magnetic field distribution image with the reference magnetic field distribution image, and determining a difference image region from the magnetic field distribution image that is different from the reference magnetic field distribution image; When the bonding wire status information indicates that the bonding wire in the power device is in a normal state, it is determined that there is a suspected defect in the bonding wire in the difference image area.

5. A bonding line defect detection system, characterized in that: The system comprises: A test bench for fixing the target power device; A magnetic field camera is used to collect the magnetic field generated by the target power module to obtain a magnetic field distribution image, wherein the magnetic field distribution image is used for computer equipment: according to the target type of the target power device, a reference magnetic field distribution image corresponding to the target type is queried from a database, wherein the reference magnetic field distribution image corresponds to a power device of the target type, and the reference magnetic field distribution image is an image obtained by collecting the magnetic field generated by the corresponding power device with a magnetic field camera; obtaining bonding wire status information corresponding to the reference magnetic field distribution image, wherein the bonding wire status information is used to characterize the status information of the bonding wire in the power device corresponding to the reference magnetic field distribution image when collecting the reference magnetic field distribution image; comparing the magnetic field distribution image with the reference magnetic field distribution image, and determining the defect detection result of the bonding wire in the target power device based on the comparison result and the bonding wire status information.

6. The system according to claim 5, characterized in that The system further comprises: A voltage source for accessing the gate of a target power device; A current source is used to be connected to the drain terminal of the target power device.

7. A bonding line defect detection device, characterized in that: The device comprises: An image acquisition module is used to acquire a magnetic field distribution image obtained by a magnetic field camera collecting the magnetic field generated by a target power device; An image query module, used for querying a reference magnetic field distribution image corresponding to a target type of the target power device from a database according to the target type of the target power device, wherein the reference magnetic field distribution image corresponds to a power device of the target type, and the reference magnetic field distribution image is an image obtained by collecting a magnetic field generated by the corresponding power device through a magnetic field camera; a state information acquisition module, used to acquire the state information of the bonding wires corresponding to the reference magnetic field distribution image, wherein the state information of the bonding wires is used to represent the state information of the bonding wires in the power device corresponding to the reference magnetic field distribution image when the reference magnetic field distribution image is acquired; The detection result determination module is used to compare the magnetic field distribution image with the reference magnetic field distribution image, and determine the defect detection result of the bonding wire in the target power device based on the comparison result and the bonding wire state information.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 4 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 4 are implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 4 are implemented.

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