Server cooling system, control method and server

Abstract

The invention discloses a server heat dissipation system, a control method and a server, and relates to the technical field of heat dissipation. The server heat dissipation system comprises a shell, a heat conduction element, a heat dissipation assembly and a piezoelectric fan assembly. One end of the heat conducting element penetrates through the shell and is connected to a radiator of a heating element in the server; the heat dissipation assembly is located in the shell, the other end of the heat conduction element is connected to the heat dissipation assembly, and the heat dissipation assembly is provided with a phase change heat dissipation piece. The piezoelectric fan assembly is located in the shell and provided with a piezoelectric fan body. According to the server heat dissipation system provided by the invention, the piezoelectric fan assembly can be selectively started according to different heat dissipation requirements of the heating element, the piezoelectric fan assembly is prevented from being started for a long time, and noise can be effectively reduced; in addition, compared with a common cooling fan at present, noise generated in the working process of the piezoelectric fan assembly is small, even if the piezoelectric fan assembly is started, the generated noise is limited, and the influence of the noise on workers can be effectively avoided.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a server heat dissipation system. In addition, the present invention also relates to a control method applied to the server heat dissipation system and a server including the server heat dissipation system. Background Art

[0002] Regarding the heat dissipation of the server, the current technical solution is to set the heat absorption end of the thermoelectric cooler inside the chassis shell and below the upper cover of the chassis shell, the heat absorption end is in contact with the surface of the chip unit, and the heat release end of the thermoelectric cooler is set outside the chassis shell and above the upper cover. When the heat dissipation demand is low, the thermoelectric cooler is used for heat dissipation; when the passive heat dissipation cannot meet the heat dissipation demand of the chip and other power consumption, a fan module is generally used for heat dissipation. This heat dissipation method will inevitably produce a lot of noise.

[0003] In summary, how to provide a server cooling system that can effectively reduce noise is a problem that needs to be urgently solved by those skilled in the art. Summary of the invention

[0004] The object of the present invention is to provide a server cooling system, which can effectively reduce noise and reduce the impact of noise on staff by dissipating heat through phase change of phase change heat sinks and / or piezoelectric fan assemblies.

[0005] In addition, another object of the present invention is to provide a control method applied to the above-mentioned server cooling system and a server including the above-mentioned server cooling system.

[0006] In order to solve the above technical problems, the present invention provides a

[0007] A server cooling system, comprising:

[0008] case;

[0009] a heat-conducting element, one end of which passes through the housing and is connected to a heat sink of a heating element in the server;

[0010] A heat dissipation component is located in the housing, the other end of the heat-conducting element is connected to the heat dissipation component, and the heat dissipation component is provided with a phase-change heat dissipation element, which absorbs heat when changing from a solid phase to a liquid phase and releases heat when changing from a liquid phase to a solid phase;

[0011] The piezoelectric fan assembly is located in the housing and is provided with a piezoelectric fan body. The piezoelectric fan body is used to generate vibration under the drive of alternating current and increase the flow speed of the gas flowing through the heat dissipation assembly.

[0012] On the one hand, it also includes:

[0013] A circuit board provided with a control circuit for connecting to the piezoelectric fan body;

[0014] The first temperature detection component is arranged at one end of the heat-conducting element connected to the heat-dissipating assembly, and is used to detect first temperature information of one end of the heat-conducting element close to the heat-dissipating assembly.

[0015] A second temperature detection element, disposed on the circuit board, and used to detect second temperature information of the air inlet of the piezoelectric fan body;

[0016] A controller is arranged on the circuit board. The first temperature detection component and the second temperature detection component are both connected to the controller. The controller is used to control the action of the piezoelectric fan body according to the first temperature information and the second temperature information.

[0017] On the other hand, it also includes a third temperature detection element, which is arranged on the phase-change heat sink or at a position adjacent to the phase-change heat sink in the heat dissipation assembly; the third temperature detection element is used to detect third temperature information of the phase-change heat sink;

[0018] And / or, the controller includes a timer.

[0019] On the other hand, the heat dissipation component comprises:

[0020] A heat transfer element connected to the other end of the heat conducting element; a heat dissipation fin is arranged on the outer side of the heat transfer element;

[0021] a baffle, arranged around the outer periphery of the heat transfer element, wherein the baffle and the heat transfer element are combined into a cavity structure;

[0022] A side plate, wherein at least one of the baffles is provided with a mounting hole, a first sealing groove for placing a first sealing structure is provided at an edge of the mounting hole, the side plate is detachably mounted at the mounting hole, and the side plate is pressed against the first sealing structure to seal the mounting hole;

[0023] The phase-change heat sink is arranged in a cavity structure formed by the baffle and the heat transfer element.

[0024] On the other hand, the piezoelectric fan assembly is arranged on one side of the heat dissipation assembly, and the air outlet direction of the piezoelectric fan assembly is toward the heat dissipation assembly;

[0025] The housing is provided with an air inlet and an air outlet;

[0026] A contact plate is provided on one side of the housing for contacting the server, the contact plate includes a first structure member and a second structure member, one of the first structure member and the second structure member is provided with a plug-in portion, the other of the first structure member and the second structure member is provided with a connecting recess for plugging or releasing with the plug-in portion, at least one of the first structure member and the second structure member is provided with a through hole for the heat conducting element to pass through, and a second sealing groove for placing a second sealing structure is provided at an edge of the through hole;

[0027] The heat conducting element is a heat pipe; the heat transfer element is a 3D temperature plate; the heat dissipation fin is a columnar structure, the number of the heat dissipation fins is multiple, the multiple heat dissipation fins are distributed in an array in the cavity structure, and the height of the columnar structure is greater than the height of the baffle; the phase change heat sink is in contact with the 3D temperature plate of the heat transfer element and the heat dissipation fins;

[0028] There are multiple heat-conducting elements, and one end of the multiple heat-conducting elements used for connecting with the heat-transferring element is evenly distributed along the outer peripheral edge of the heat-transferring element;

[0029] The phase change temperature of the phase change heat sink from solid to liquid is lower than the frequency reduction temperature of the heating element, and the difference between the phase change temperature of the phase change heat sink from solid to liquid and the frequency reduction temperature of the heating element is 8°C-14°C.

[0030] On the other hand, the piezoelectric fan assembly includes an air guide cover arranged on the air outlet of the piezoelectric fan body, the air guide cover is provided with a first air guide outlet and a second air guide outlet, the first air guide outlet is toward the phase change heat sink of the heat dissipation assembly, and the second air guide outlet is toward the heat transfer element.

[0031] A control method, applied to any of the above-mentioned server cooling systems, wherein the server cooling system comprises a first temperature detection element and a timer;

[0032] The control method comprises:

[0033] Acquiring first temperature information detected by the first temperature detecting component;

[0034] Determine whether the first temperature information is higher than a first preset temperature, if so, control the timer to start timing and proceed to the next step, if not, maintain the current state;

[0035] Acquiring real-time first temperature information detected by the first temperature detection component;

[0036] Determine whether the real-time first temperature information is lower than the first preset temperature. If so, continue to time the first preset time and then end the time to obtain total time information; if not, return to the step of obtaining the real-time first temperature information;

[0037] Controlling the timer to restart timing;

[0038] Determine whether the time counted by the timer reaches a second preset time. If so, control the piezoelectric fan body to start and control the piezoelectric fan body to continue working for a third preset time. If not, maintain the current state.

[0039] On the one hand, after obtaining the first temperature information detected by the first temperature detection component, the method includes:

[0040] Determine whether the first temperature information is higher than a second preset temperature, and whether the second preset temperature is higher than the first preset temperature. If so, control to start the piezoelectric fan body; if not, proceed to the next step;

[0041] Controlling the timer to restart timing;

[0042] Determine whether the time counted by the timer reaches a fourth preset time, if so, control to start the piezoelectric fan body; if not, maintain the current state.

[0043] On the other hand, the server heat dissipation system further includes a second temperature detection member;

[0044] The controlling the piezoelectric fan body to continue working for a third preset time comprises:

[0045] Acquiring second temperature information of the second temperature detecting element;

[0046] Obtaining total timing information calculated by the timer;

[0047] The third preset time is obtained according to the second temperature information, the total time information, and the quality and type information of the phase change heat sink.

[0048] A server comprises a server body and any one of the server cooling systems described above.

[0049] It can be seen from the above technical scheme that during the actual use of the server cooling system provided by the present invention, in the initial stage, when the power consumption of the server is low and the temperature of the heating element is low, the heat of the heating element is transferred to the cooling component through the heat-conducting element, and the heat dissipation is achieved by the phase change of the phase change heat sink in the cooling component to meet the heat dissipation demand of the heating element; when the power consumption of the server is high and the temperature of the heating element is high, the heat of the heating element is transferred to the cooling component through the heat-conducting element, and the heat dissipation is achieved by the phase change of the phase change heat sink in the cooling component. At the same time, the piezoelectric fan component can be turned on, and the piezoelectric fan body vibrates under the drive of alternating current, so that the gas flow rate around the piezoelectric fan component is increased, and then the flow rate of the gas flowing through the heat dissipation component is increased. Under the dual action of the phase change heat sink and the piezoelectric fan component, the heat dissipation effect is further improved to meet the heat dissipation demand of the heating element; when the server switches to a state with lower power consumption, the piezoelectric fan component can be turned on again to make the piezoelectric fan body blow toward the phase change heat sink, so that the phase change heat sink releases heat and returns to its initial state.

[0050] The beneficial effects of the present invention are as follows: in the present invention, heat dissipation of the heating elements in the server is achieved through phase change heat sinks and piezoelectric fan assemblies. According to different heat dissipation requirements of the heating elements, the piezoelectric fan assembly can be selectively turned on to avoid the piezoelectric fan assembly being turned on for a long time, which can effectively reduce noise; in addition, energy can be saved; in addition, compared with the current ordinary cooling fans, the noise generated by the piezoelectric fan assembly during operation is smaller. Even if the piezoelectric fan assembly is turned on, the noise generated is limited, which can effectively avoid the impact of noise on the staff.

[0051] In addition, the present invention also provides a control method applied to the above server cooling system and a server including the above server cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0053] Figure 1 A schematic diagram of the structure of a specific embodiment of a server provided in an embodiment of the present invention;

[0054] Figure 2 A schematic diagram of the structure of a server heat dissipation system provided by an embodiment of the present invention;

[0055] Figure 3 A schematic diagram of the internal structure of a server heat dissipation system provided by an embodiment of the present invention;

[0056] Figure 4 Schematic diagram of the installation method of the phase change heat sink;

[0057] Figure 5 It is a schematic diagram of the appearance structure of the heat dissipation component;

[0058] Figure 6 is a front view of the contact plate;

[0059] Figure 7 is an axonometric view of the contact plate;

[0060] Figure 8 The present invention is a flowchart of a specific embodiment of the control method provided by the present invention.

[0061] Figures 1 to 8 middle:

[0062] 1-Server body;

[0063] 11-heating element, 12-radiator;

[0064] 2- Shell;

[0065] 21-air inlet, 22-contact plate, 221-first structural member, 2211-plug-in portion, 222-second structural member, 2221-connecting recess, 2222-through hole;

[0066] 3-Heat conducting element;

[0067] 4- Heat dissipation components;

[0068] 41-heat transfer element, 42-baffle, 421-mounting hole, 43-side plate, 44-phase change heat sink;

[0069] 5- Piezoelectric fan assembly;

[0070] 6- Circuit board;

[0071] 7- first temperature detection member;

[0072] 8- second temperature detection member;

[0073] 9-Controller. DETAILED DESCRIPTION

[0074] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0075] The core of the present invention is to provide a server cooling system, which dissipates heat through phase change of phase change heat sinks and / or dissipates heat through piezoelectric fan assemblies, which can effectively reduce noise and reduce the impact of noise on staff.

[0076] Another core of the present invention is to provide a control method applied to the above-mentioned server cooling system and a server including the above-mentioned server cooling system.

[0077] The server cooling system provided in the present invention can be applied to ordinary servers or edge servers. As the brain of edge computing, edge servers play a vital role in edge scenarios. When edge servers are used in office environments or scenarios that require human supervision, the noise of edge servers needs to be limited. With the development of society and technology, the performance requirements for edge servers are getting higher and higher, and passive cooling is increasingly difficult to meet the cooling needs of servers; and using fans and other methods to dissipate heat will bring about greater noise, making it difficult to achieve the goal of human-machine coexistence; using the server cooling system of the present application to dissipate heat for edge servers, dissipating heat through the phase change of phase change heat sinks, and dissipating heat through piezoelectric fan assemblies, can effectively reduce noise, reduce the impact of noise on staff, and help achieve the goal of human-machine coexistence.

[0078] This specific embodiment discloses a server heat dissipation system, including a shell 2, a heat-conducting element, a heat dissipation component 4 and a piezoelectric fan component 5; wherein one end of the heat-conducting element 3 passes through the shell 2 and is connected to the heat sink 12 of the heating element 11 in the server; the heat dissipation component 4 is located in the shell 2, and the other end of the heat-conducting element 3 is connected to the heat dissipation component 4, and the heat dissipation component 4 is provided with a phase change heat dissipation element 44, which absorbs heat when changing from a solid phase to a liquid phase and releases heat when changing from a liquid phase to a solid phase; the piezoelectric fan component 5 is located in the shell 2, and the piezoelectric fan component 5 is provided with a piezoelectric fan body, and the piezoelectric fan body is used to generate vibration under the drive of alternating current and increase the flow rate of the gas flowing through the heat dissipation component 4.

[0079] It should be noted that when the heat generating element 11 in the server is not provided with a heat sink 12 , the heat conducting element 3 in this specific embodiment may be directly connected to the heat generating element 11 .

[0080] During actual use of the server heat dissipation system provided in this specific embodiment, in the initial stage, when the power consumption of the server is low and the temperature of the heating element 11 is low, the heat dissipation structure of the server itself can meet the heat dissipation demand of the heating element 11. At this time, the temperature of the heat-conducting element 3 is lower than the phase change temperature of the phase change heat sink 44; when the power consumption of the server increases, the temperature of the heating element 11 rises, and the temperature transmitted by the heat-conducting element 3 is higher than the phase change temperature of the phase change heat sink 44, the heat of the heating element 11 is transmitted to the heat dissipation component 4 through the heat-conducting element 3, and the heat dissipation in the heat dissipation component 4 is achieved through the phase change of the phase change heat sink 44, thereby meeting the heat dissipation demand of the heating element 11; when the power consumption of the server is further increased, the temperature of the heating element 11 is further increased. When the temperature rises step by step, the heat of the heating element 11 is transferred to the heat dissipation component 4 through the heat-conducting element 3, and the heat dissipation is realized by the phase change of the phase change heat sink 44 in the heat dissipation component 4. At the same time, the piezoelectric fan component 5 can be turned on, and the piezoelectric fan body vibrates under the drive of alternating current, so that the gas flow rate around the piezoelectric fan component 5 is increased, and then the flow rate of the gas flowing through the heat dissipation component 4 is increased. Under the dual action of the phase change heat sink 44 and the piezoelectric fan component 5, the heat dissipation effect is further improved to meet the heat dissipation requirements of the heating element 11; when the server switches to a state with lower power consumption, the piezoelectric fan component 5 can be turned on continuously to make the piezoelectric fan body blow toward the phase change heat sink 44, so that the phase change heat sink 44 releases heat and returns to its initial state.

[0081] In this specific embodiment, the heat dissipation of the heating element 11 at medium and high power in the server is achieved through the phase change heat sink 44 and the piezoelectric fan assembly 5. According to the different heat dissipation requirements of the heating element 11, the piezoelectric fan assembly 5 can be selectively turned on to avoid the piezoelectric fan assembly 5 being turned on for a long time, which can effectively reduce noise; in addition, it can also save energy and extend the service life of the piezoelectric fan assembly 5; in addition, compared with the current ordinary heat dissipation fans, the noise generated by the piezoelectric fan assembly 5 during operation is smaller. Even if the piezoelectric fan assembly 5 is turned on, the noise generated is limited, which can effectively avoid the impact of noise on the staff.

[0082] On the basis of the above embodiment, the server cooling system may further include a circuit board 6, a first temperature detection member 7, a second temperature detection member 8 and a controller 9, wherein the circuit board 6 is provided with a control circuit for connecting to the piezoelectric fan body; the first temperature detection member 7 is provided at one end of the heat-conducting element 3 connected to the heat-dissipating assembly 4; and is used to detect the first temperature information of one end of the heat-conducting element 3 close to the heat-dissipating assembly 4. The second temperature detection member 8 is provided on the circuit board 6, and is used to detect the second temperature information of the air inlet of the piezoelectric fan body; the second temperature information of the air inlet of the fan body is the temperature of the air generated by the piezoelectric fan body before it contacts the heat-dissipating assembly 4; the controller 9 is provided on the circuit board 6, and the first temperature detection member 7 and the second temperature detection member 8 are both connected to the controller 9, and the controller 9 is used to control the action of the piezoelectric fan body according to the first temperature information and the second temperature information.

[0083] In actual use, the first temperature information obtained by the first temperature detection element 7 is the temperature of one end of the heat-conducting element 3 close to the heat dissipation component 4. When the first temperature information is higher than the first preset temperature, the first preset temperature is lower than or equal to the phase change temperature of the phase change heat sink 44, and the phase change temperature of the phase change heat sink 44 from solid to liquid is lower than the frequency reduction temperature of the heating element 11, and the difference between the phase change temperature of the phase change heat sink 44 from solid to liquid and the frequency reduction temperature of the heating element 11 is 8°C-14°C; the frequency reduction temperature of the heating element 11 is ‌‌‌‌ The frequency reduction temperature refers to the temperature point at which the operating frequency of the hardware (such as the CPU or graphics card) is automatically reduced to prevent the hardware from overheating when the temperature reaches a certain threshold. ‌ This mechanism is intended to protect the hardware from damage caused by overheating. Different hardware and manufacturers may have different frequency reduction temperature settings, but generally, when the temperature exceeds the safe range, the hardware will automatically reduce its operating frequency to reduce the heat generated, thereby preventing overheating from seriously affecting the normal operation of the heating element 11.

[0084] When the use environment of the server cooling system has low requirements on noise and the noise generated during the operation of the piezoelectric fan assembly 5 is acceptable, the control method of the server cooling system may include:

[0085] Acquiring first temperature information detected by the first temperature detection element 7;

[0086] It is determined whether the first temperature information is higher than the first preset temperature. If so, the piezoelectric fan assembly 5 is controlled to start and the piezoelectric fan body starts to work; if not, the current state is maintained.

[0087] When the use environment of the server cooling system has high requirements on noise, it is necessary to reduce the working time of the piezoelectric fan assembly 5 as much as possible, reduce the impact of the noise generated by the piezoelectric fan assembly 5 on the staff as much as possible, and try to control the opening time of the piezoelectric fan body so as not to affect the staff, the controller 9 can include a timer; the control method of the server cooling system can include:

[0088] Acquiring first temperature information detected by the first temperature detection element 7;

[0089] Determine whether the first temperature information is higher than the first preset temperature, if so, control the timer to start timing and enter the next step, if not, maintain the current state;

[0090] Acquire the real-time first temperature information detected by the first temperature detection member 7; the real-time first temperature information in this step is the first temperature information acquired by the first temperature detection member 7 during the timing of the timer;

[0091] Determine whether the real-time first temperature information is lower than the first preset temperature. If so, continue to time the first preset time and then end the time to obtain total time information; if not, return to the step of obtaining the real-time first temperature information;

[0092] Afterwards, according to the needs of the actual use environment, the piezoelectric fan assembly 5 is turned on when the staff gets off work, so that the phase change heat sink 44 can dissipate heat and restore the initial phase state; in this specific embodiment, the continuous working time of the piezoelectric fan assembly 5 needs to be determined based on the total timing information and the type and quality of the phase change heat sink 44. Specifically, the heat dissipation achieved by the airflow generated during the operation of the piezoelectric fan assembly 5 needs to be greater than the heat absorbed by the phase change heat sink 44 due to phase change heat absorption in the previous process of dissipating heat for the heating element 11, so that the phase change heat sink 44 can smoothly restore the initial phase state.

[0093] For safety reasons, in actual use, a second preset temperature may be set, the second preset temperature being higher than the first preset temperature, the second preset temperature being lower than the frequency reduction temperature of the heating element 11, and the difference between the second preset temperature and the frequency reduction temperature of the heating element 11 is 6.5-7.5°C; the control method of the server cooling system may include:

[0094] Acquiring first temperature information detected by the first temperature detection element 7;

[0095] It is determined whether the first temperature information is higher than the second preset temperature. If so, the piezoelectric fan assembly 5 is controlled to start and the piezoelectric fan body starts to work; if not, the current state is maintained.

[0096] In this specific embodiment, by setting the first temperature detection component 7, the temperature information of the end where the heat conducting element 3 and the heat dissipation component 4 are connected can be obtained in real time, the temperature of the end where the heat conducting element 3 and the heat dissipation component 4 are connected can be monitored in real time, the heat dissipation situation can be obtained in time, and adjustments can be made according to the heat dissipation situation.

[0097] The setting of the second temperature detection component 8 can obtain the second temperature information of the air inlet of the piezoelectric fan body. In the process of blowing air to the phase change heat sink 44 through the piezoelectric fan assembly 5 to restore the phase change heat sink 44 from liquid to solid, based on the second temperature information of the air inlet of the piezoelectric fan body and the heat required to dissipate the phase change heat sink 44 to restore its original phase, the time that the piezoelectric fan body needs to work continuously can be roughly obtained, which is convenient for controlling the continuous working time of the piezoelectric fan body.

[0098] On the basis of the above embodiment, the server cooling system may further include a third temperature detection element, which is arranged on the phase change heat sink 44 or at a position adjacent to the phase change heat sink 44 in the heat dissipation assembly 4; the third temperature detection element is used to detect the third temperature information of the phase change heat sink 44.

[0099] By setting a third temperature detection element, the temperature condition of the phase change heat sink 44 can be obtained in time. When the third temperature information is greater than the phase change temperature of the phase change heat sink 44, it means that the phase change heat sink 44 begins to change from solid to liquid. When the third temperature information is lower than the phase change temperature of the phase change heat sink 44, it means that the phase change heat sink 44 has recovered or is recovering to the solid state.

[0100] In this specific embodiment, by providing a third temperature detection element, the temperature of the phase-change heat sink 44 can be obtained in time, which facilitates real-time monitoring of the state information of the phase-change heat sink so as to adjust to emergencies in time.

[0101] In a specific embodiment, the heat dissipation assembly 4 includes a heat transfer element 41, a baffle 42, a side plate 43 and a phase change heat dissipation element 44; the heat transfer element 41 is connected to the other end of the heat conductive element 3; a heat dissipation fin is arranged on the outer side of the heat transfer element 41; the baffle 42 is arranged around the outer periphery of the heat transfer element 41, and the baffle 42 and the heat transfer element 41 are combined into a cavity structure; at least one baffle 42 is provided with a mounting hole 421, and a first sealing groove for placing a first sealing structure is provided at the edge of the mounting hole 421, the side plate 43 is detachably installed at the mounting hole 421, and the side plate 43 is pressed on the first sealing structure to seal the mounting hole 421; the phase change heat dissipation element 44 is arranged in the cavity structure formed by the baffle 42 and the heat transfer element 41.

[0102] The installation hole 421 is provided to facilitate placement or removal of the phase-change heat sink 44 . The side plate 43 is sealed at the installation hole 421 , which can effectively prevent the phase-change heat sink 44 from flowing out of the installation hole 421 after melting.

[0103] In this specific embodiment, by setting the phase change heat sink 44 in the cavity structure, the outflow of the phase change heat sink 44 after the phase change can be effectively avoided. At the same time, the heat dissipation of the heat transfer element 41 can be achieved through the phase change of the phase change heat sink 44. The heat transfer element 41 serves as the bottom plate of the cavity structure and can fully contact the phase change heat sink 44.

[0104] In order to improve the heat conduction effect, the heat conducting element 3 can be set as a heat pipe, and the heat transfer element 41 can be set as a 3D temperature averaging plate. The 3D temperature averaging plate can evenly transfer the heat transferred from the heat conducting element 3.

[0105] Combination Figure 3 , Figure 4 , Figure 5 As shown, the heat sink fin is a columnar structure, and the number of the heat sink fins is multiple, and the multiple heat sink fins are distributed in an array in the cavity structure, and the height of the columnar structure is greater than the height of the baffle 42; the phase change heat sink 44 is in contact with the 3D temperature equalizing plate and the heat sink fins of the heat transfer element 41.

[0106] During specific use, the heat transferred by the heat conducting element 3 is transferred to the heat dissipating fins via the 3D temperature equalizing plate. The phase change heat sink 44 is in contact with the 3D temperature equalizing plate and the heat dissipating fins of the heat transfer element 41 at the same time, which can effectively increase the contact area between the phase change heat sink 44 and the heat transfer element 41, which is beneficial to heat exchange. In addition, when the piezoelectric fan assembly 5 is turned on, the portion of the heat dissipating fin higher than the baffle 42 can effectively increase the heat exchange area of ​​the heat transfer element 41 and enhance the cooling effect. As a cooling section, it is beneficial for the phase change heat sink 44 to recover to a solid state or to dissipate heat for the heating element 11.

[0107] Based on the above embodiment, the piezoelectric fan assembly 5 can be arranged on one side of the heat dissipation assembly 4, and the air outlet direction of the piezoelectric fan assembly 5 is toward the heat dissipation assembly 4. The shell 2 is provided with an air inlet 21 and an air outlet to facilitate the air intake and outlet of the piezoelectric fan assembly 5 during use.

[0108] By directing the air outlet direction of the piezoelectric fan assembly 5 toward the heat dissipation assembly 4, the heat dissipation assembly 4 can be effectively cooled. At the same time, the phase change heat dissipation element 44 can be cooled, so that the phase change heat dissipation element 44 generates a phase change and returns to its original state.

[0109] In a specific embodiment, the piezoelectric fan body of the piezoelectric fan assembly 5 can be set as a rotatable structure. During actual use, the air outlet angle of the piezoelectric fan body can be adjusted by adjusting the rotation angle of the piezoelectric fan body.

[0110] During actual use, when the power consumption of the server is large and the heat dissipation requirement of the heating element 11 is high, the piezoelectric fan body can be controlled to rotate to blow air toward the cooling fins of the heat transfer element 41, thereby improving the heat dissipation effect of the heat transfer element 41; when the power consumption of the server is reduced and the phase change heat sink 44 and the piezoelectric fan body are no longer needed to dissipate heat at the same time, the piezoelectric fan body can be controlled to rotate to blow air toward the phase change heat sink 44, so that the phase change heat sink 44 can be restored to its initial phase.

[0111] In this specific embodiment, by adjusting the rotation angle of the piezoelectric fan body of the piezoelectric fan assembly 5, the air outlet direction of the piezoelectric fan body can be adjusted, which can effectively improve the heat dissipation efficiency. At the same time, the phase change heat sink 44 can be restored to the initial phase state in time under appropriate circumstances, so as to prepare for heat dissipation in the subsequent high power consumption state of the server.

[0112] In a specific embodiment, a contact plate 22 is provided on one side of the shell 2 for contacting the server, and the contact plate 22 includes a first structural member 221 and a second structural member 222, one of the first structural member 221 and the second structural member 222 is provided with a plug-in portion 2211, and the other of the first structural member 221 and the second structural member 222 is provided with a connecting recess 2221 for cooperating with the plug-in portion 2211 for plugging or releasing, at least one of the first structural member 221 and the second structural member 222 is provided with a through hole 2222 for allowing the heat conducting element 3 to pass through, and a second sealing groove for placing a second sealing structure is provided at the edge of the through hole 2222.

[0113] like Figure 6 , Figure 7 As shown, in order to facilitate the passage of the heat-conducting element 3, a through hole 2222 is provided. Specifically, the through hole 2222 is a rectangular structure with a depth of 0.8mm-1mm and a width of 1.2mm-1.5mm. Of course, it can also be set to other shapes or sizes, which are determined according to actual conditions and will not be elaborated here.

[0114] In order to prevent external dust, rain and the like from affecting the heat conducting element 3 , a sealing structure may be provided on the periphery of the heat conducting element 3 at the penetration hole 2222 , and the sealing structure is provided in the second sealing groove.

[0115] Specifically, the material of the housing 2 can be the same as that of the server housing, and the contact plate 22 is connected to the server by screws.

[0116] In this specific embodiment, by providing the contact plate 22, the heat-conducting element 3 can be easily passed from the server to the server cooling system. At the same time, the provision of the sealing structure can effectively prevent external dust, rainwater, etc. from affecting the heat-conducting element 3, further improving the heat conduction effect.

[0117] Based on the above embodiment, the number of heat-conducting elements 3 can be set to multiple, and multiple heat-conducting elements 3 are connected to the outer peripheral edge of the heat-transfer element 41, and the end of the heat-conducting element 3 used for connecting with the heat-transfer element 41 is evenly distributed along the outer peripheral edge of the heat-transfer element 41.

[0118] On the basis of the above-mentioned embodiments, the piezoelectric fan assembly 5 can include an air guide cover arranged on the air outlet of the piezoelectric fan body, the air guide cover is provided with a first air guide outlet and a second air guide outlet, the first air guide outlet is toward the phase change heat sink 44 of the heat sink assembly 4, and the second air guide outlet is toward the heat transfer element 41.

[0119] Specifically, a first control valve for controlling the opening of the first air guide outlet can be set at the first air guide outlet, and a second control valve for controlling the opening of the second air guide outlet can be set at the second air guide outlet; in actual use, when the power consumption of the server is low, the heat dissipation of the heating element 11 can be performed only through the phase change heat sink 44; when the heat dissipation of the heating element 11 only through the phase change heat sink 44 cannot meet the heat dissipation demand of the heating element 11, the piezoelectric fan assembly 5 can be turned on, and the first air guide outlet and the second air guide outlet are both in an open state. When the heat dissipation demand of the heating element 11 is further increased, the opening of the second air guide outlet can be increased by controlling the piezoelectric fan assembly 5 to open the second air guide outlet. The generated airflow is blown more toward the heat transfer element 41, so that the heat transfer element 41 dissipates heat, and the heat dissipation effect of the heat transfer component is further improved; when the power consumption of the server is reduced and the heat dissipation demand of the heating element 11 is reduced, the opening of the first air guide port can be increased by controlling the airflow generated by the piezoelectric fan to blow more toward the phase change heat sink 44. During this process, the phase change heat sink 44 will dissipate heat and return to its initial phase. However, since the heat generated by the phase change heat sink 44 is limited and the heat dissipation demand of the heating element 11 is relatively low, the phase change demand of the phase change heat sink 44 can be met while the heat dissipation demand of the heating element 11 is met, so as to prepare for heat dissipation in the subsequent high power consumption state of the server.

[0120] In this specific embodiment, by providing an air guide cover, the airflow generated by the piezoelectric fan body can be blown toward the heat dissipation component 4 more, thereby improving the utilization rate of the airflow generated by the piezoelectric fan body; in addition, according to different actual conditions, the ratio of the airflow blown toward the heat transfer element 41 and the phase change heat sink 44 can be reasonably allocated, which can effectively improve the heat dissipation efficiency and enable the phase change heat sink 44 to restore the initial phase state in time under appropriate circumstances, thereby preparing for heat dissipation in the subsequent high power consumption state of the server.

[0121] In addition to the above-mentioned server cooling system, the present invention also provides a control method applied to the above-mentioned server cooling system. The server cooling system includes a first temperature detection component 7 and a timer. The control method includes:

[0122] Step S1, obtaining first temperature information detected by the first temperature detection component 7;

[0123] Step S2, determining whether the first temperature information is higher than the first preset temperature, if so, controlling the timer to start timing and entering step S3, if not, maintaining the current state;

[0124] Step S3, obtaining real-time first temperature information detected by the first temperature detection component 7;

[0125] Step S4, determining whether the real-time first temperature information is lower than the first preset temperature, if so, continuing to time the first preset time and then ending the timer to obtain total time information; if not, returning to step S3;

[0126] Step S5, controlling the timer to restart timing;

[0127] Step S6, determining whether the time counted by the timer reaches the second preset time, if yes, then controlling the piezoelectric fan body to start, and controlling the piezoelectric fan body to continue working for a third preset time, if no, then maintaining the current state.

[0128] After the above step S1, the control method includes:

[0129] Step S101, determining whether the first temperature information is higher than the second preset temperature, and the second preset temperature is higher than the first preset temperature, if so, controlling to start the piezoelectric fan body, if not, proceeding to step S102;

[0130] Step S102, controlling the timer to restart timing;

[0131] Step S103, determining whether the time counted by the timer reaches a fourth preset time, if so, controlling the piezoelectric fan body to start; if not, maintaining the current state.

[0132] In a specific embodiment, the server cooling system further includes a second temperature detection element 8; in the above step S6, controlling the piezoelectric fan body to continue working for a third preset time includes:

[0133] Step S61, obtaining the second temperature information of the second temperature detection element 8;

[0134] Step S62, obtaining the total timing information calculated by the timer;

[0135] Step S63 , obtaining a third preset time according to the second temperature information, the total time information, and the quality and type information of the phase change heat sink 44 .

[0136] It should be noted that in the above step S63, the third preset time is obtained based on the second temperature information, the total time information, the quality and type information of the phase change heat sink 44. Specifically, it is necessary to obtain the heat absorbed by the phase change heat sink 44 during the phase change process based on the total time information, the quality and type information of the phase change heat sink 44, and obtain the heat that can be dissipated by the airflow generated by the piezoelectric fan assembly 5 per unit time based on the second temperature information. The continuous working time of the piezoelectric fan assembly 5 is controlled based on the heat absorbed by the phase change heat sink 44 during the phase change process, so that the phase change heat sink 44 can dissipate heat smoothly to restore to the initial phase.

[0137] In addition to the above-mentioned server cooling system, the present application also provides a server including the above-mentioned server cooling system.

[0138] like Figure 1 As shown, the server includes a server body 1 and a server cooling system arranged on one side of the server body 1. The server body 1 can be set as an edge server or other types of servers, which is determined according to actual conditions and will not be described in detail here.

[0139] It should be noted that the server heat dissipation system is set at a height smaller than the height of the server body 1 to avoid affecting the heat dissipation of the server body 1 .

[0140] It should also be noted that, in this specification, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises", or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also other elements that are not explicitly listed, or also includes elements that are inherent to such process, method, article, or device.

[0141] The server cooling system, control method and server provided by the present invention are introduced in detail above. The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the embodiments can be referenced to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A server cooling system, characterized in that: include: Housing (2); A heat-conducting element (3), one end of which passes through the housing (2) and is connected to a heat sink (12) of a heating element (11) in the server; A heat dissipation component (4) is located in the housing (2); the other end of the heat-conducting element (3) is connected to the heat dissipation component (4); the heat dissipation component (4) is provided with a phase-change heat dissipation element (44); the phase-change heat dissipation element (44) absorbs heat when changing from a solid phase to a liquid phase, and releases heat when changing from a liquid phase to a solid phase; A piezoelectric fan assembly (5) is located in the housing (2), and the piezoelectric fan assembly (5) is provided with a piezoelectric fan body, and the piezoelectric fan body is used to generate vibration under the drive of alternating current and increase the flow speed of the gas flowing through the heat dissipation assembly (4).

2. The server cooling system according to claim 1, characterized in that: Also includes: A circuit board (6) provided with a control circuit for connecting to the piezoelectric fan body; A first temperature detection element (7) is arranged at one end of the heat-conducting element (3) connected to the heat-dissipating component (4); and is used to detect first temperature information of one end of the heat-conducting element (3) close to the heat-dissipating component (4); A second temperature detection component (8) is arranged on the circuit board (6), and the second temperature detection component (8) is used to detect second temperature information of the air inlet of the piezoelectric fan body; A controller (9) is arranged on the circuit board (6); the first temperature detection component (7) and the second temperature detection component (8) are both connected to the controller (9); and the controller (9) is used to control the movement of the piezoelectric fan body according to the first temperature information and the second temperature information.

3. The server cooling system according to claim 2, characterized in that: It also comprises a third temperature detection element, the third temperature detection element being arranged on the phase-change heat sink (44) or arranged at a position adjacent to the phase-change heat sink (44) in the heat sink assembly (4); the third temperature detection element being used to detect third temperature information of the phase-change heat sink (44); And / or, the controller (9) comprises a timer.

4. The server cooling system according to claim 1, characterized in that: The heat dissipation component (4) comprises: A heat transfer element (41) is connected to the other end of the heat conducting element (3); a heat dissipation fin is arranged on the outer side of the heat transfer element (41); a baffle (42) arranged around the outer periphery of the heat transfer element (41), the baffle (42) and the heat transfer element (41) being combined into a cavity structure; A side plate (43), wherein at least one of the baffle plates (42) is provided with a mounting hole (421), a first sealing groove for accommodating a first sealing structure is provided at an edge of the mounting hole (421), the side plate (43) is detachably mounted at the mounting hole (421), and the side plate (43) is pressed against the first sealing structure to seal the mounting hole (421); The phase-change heat sink (44) is arranged in a cavity structure formed by the baffle (42) and the heat transfer element (41).

5. The server cooling system according to claim 4, characterized in that: The piezoelectric fan assembly (5) is arranged on one side of the heat dissipation assembly (4), and the air outlet direction of the piezoelectric fan assembly (5) is toward the heat dissipation assembly (4); The housing (2) is provided with an air inlet (21) and an air outlet; A contact plate (22) is provided on one side of the shell (2) for contacting the server, the contact plate (22) comprising a first structural member (221) and a second structural member (222), one of the first structural member (221) and the second structural member (222) being provided with a plug-in portion (2211), the other of the first structural member (221) and the second structural member (222) being provided with a connecting recess (2221) for mating with or releasing the plug-in portion (2211), at least one of the first structural member (221) and the second structural member (222) being provided with a through hole (2222) for allowing the heat-conducting element (3) to pass through, and a second sealing groove for accommodating a second sealing structure being provided at the edge of the through hole (2222); The heat conducting element (3) is a heat pipe; the heat transfer element (41) is a 3D temperature equalizing plate; the heat dissipation fin is a columnar structure, the number of the heat dissipation fins is multiple, the multiple heat dissipation fins are distributed in an array in the cavity structure, and the height of the columnar structure is greater than the height of the baffle (42); the phase change heat sink (44) is in contact with the 3D temperature equalizing plate of the heat transfer element (41) and the heat dissipation fins; The number of the heat-conducting elements (3) is multiple, and the ends of the multiple heat-conducting elements (3) used for connecting to the heat-transfer element (41) are evenly distributed along the outer peripheral edge of the heat-transfer element (41); The phase change temperature of the phase change heat sink (44) from solid to liquid is lower than the frequency reduction temperature of the heating element (11), and the difference between the phase change temperature of the phase change heat sink (44) from solid to liquid and the frequency reduction temperature of the heating element (11) is 8°C-14°C.

6. The server cooling system according to claim 4 or 5, characterized in that: The piezoelectric fan assembly (5) comprises an air guide cover arranged at the air outlet of the piezoelectric fan body, the air guide cover being provided with a first air guide outlet and a second air guide outlet, the first air guide outlet being oriented toward the phase change heat sink (44) of the heat sink assembly (4), and the second air guide outlet being oriented toward the heat transfer element (41).

7. A control method, characterized in that: The server cooling system according to any one of claims 1 to 6 comprises a first temperature detection element (7) and a timer; The control method comprises: Acquiring first temperature information detected by the first temperature detection component (7); Determine whether the first temperature information is higher than a first preset temperature, if so, control the timer to start timing and proceed to the next step, if not, maintain the current state; Acquiring real-time first temperature information detected by the first temperature detection component (7); Determine whether the real-time first temperature information is lower than the first preset temperature. If so, continue to time the first preset time and then end the time to obtain total time information; if not, return to the step of obtaining the real-time first temperature information; Controlling the timer to restart timing; Determine whether the time counted by the timer reaches a second preset time. If so, control the piezoelectric fan body to start and control the piezoelectric fan body to continue working for a third preset time. If not, maintain the current state.

8. The control method according to claim 7, characterized in that: After obtaining the first temperature information detected by the first temperature detection element (7), the method further comprises: Determine whether the first temperature information is higher than a second preset temperature, and whether the second preset temperature is higher than the first preset temperature. If so, control to start the piezoelectric fan body; if not, proceed to the next step; Controlling the timer to restart timing; Determine whether the time counted by the timer reaches a fourth preset time, if so, control to start the piezoelectric fan body; if not, maintain the current state.

9. The control method according to claim 7, characterized in that: The server heat dissipation system further comprises a second temperature detection component (8); The controlling the piezoelectric fan body to continue working for a third preset time comprises: Acquiring second temperature information of the second temperature detection component (8); Obtaining total timing information calculated by the timer; The third preset time is obtained according to the second temperature information, the total time information, and the quality and type information of the phase change heat sink (44).

10. A server, characterized in that: It comprises a server body (1) and the server cooling system according to any one of claims 1 to 6.

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