Display panel and display device

Abstract

The invention provides a display panel and a display device. The display panel comprises a first substrate and a second substrate which are oppositely arranged; the touch electrode layer is located on the side, close to the first substrate, of the second substrate; the first binding pad is positioned on one side, far away from the second substrate, of the first substrate; the first conducting layer is connected with the touch electrode layer and the first binding bonding pad, and at least part of the first conducting layer is located on the side face of the first substrate and / or at least part of the first conducting layer is located on the side face of the second substrate. The problem that in the prior art, a touch display panel is prone to poor touch is solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the development of science and technology, the human-computer interaction interface is constantly developing, and the touch input devices are also constantly developing. The large-scale use of capacitive touch screens, such as resistive, infrared, acoustic wave, etc., to electric field sensing, has completely changed the industrial layout of the touch screen field. At present, the touch structure of the touch display panel is prone to scratches, etc., resulting in poor touch. Summary of the invention

[0003] The main purpose of the present application is to provide a display panel and a display device, so as to at least solve the problem that the touch display panel in the prior art is prone to poor touch.

[0004] In order to achieve the above objective, according to one aspect of the present application, a display panel is provided, comprising:

[0005] A first substrate and a second substrate arranged opposite to each other;

[0006] a touch electrode layer, wherein the touch electrode layer is located on a side of the second substrate close to the first substrate;

[0007] A first binding pad is located on a side of the first substrate away from the second substrate;

[0008] A first conductive layer connects the touch electrode layer and the first binding pad, and the first conductive layer is at least partially located on a side surface of the first substrate and / or at least partially located on a side surface of the second substrate.

[0009] According to another aspect of the present application, a display device is provided, comprising any one of the display panels described above.

[0010] Using the technical solution of the present application, the first binding pad is located on the side of the first substrate facing away from the second substrate, the touch electrode layer is arranged between the first substrate and the second substrate, the first conductive layer is at least partially located on the side of the first substrate and / or at least partially located on the side of the second substrate, and the first conductive layer realizes the electrical connection between the touch electrode layer and the first binding pad through side wiring. The present application arranges the touch electrode layer between the two substrates, and the two substrates can play a role in protecting the touch electrode layer, thereby avoiding the problem that when the touch operation surface of the display panel is scratched by an external structure, the touch electrode layer close to the touch operation surface is easily scratched, thereby ensuring the good touch performance of the display panel. In addition, the present application adopts a side wiring method to connect the touch electrode layer and the first binding pad located on the back side of the first substrate, thereby realizing the touch line wiring design of the display panel without a step area, which is conducive to realizing a narrow frame of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0012] Figure 1 A schematic cross-sectional structure diagram of a first display panel provided in an embodiment of the present application is shown;

[0013] Figure 2 A schematic cross-sectional structure diagram of a second display panel provided according to an embodiment of the present application is shown;

[0014] Figure 3 A schematic diagram of a top view of a first display panel provided according to an embodiment of the present application is shown;

[0015] Figure 4 A schematic diagram of a top view of a second display panel provided according to an embodiment of the present application is shown;

[0016] Figure 5 A schematic cross-sectional structure diagram of a third display panel provided according to an embodiment of the present application is shown;

[0017] Figure 6 A schematic diagram of a top view of a first spliced ​​screen provided according to an embodiment of the present application is shown;

[0018] Figure 7 A schematic diagram of a top view of a second spliced ​​screen provided according to an embodiment of the present application is shown;

[0019] Figure 8 A schematic diagram of a top view of a third spliced ​​screen provided according to an embodiment of the present application is shown;

[0020] Fig. 9 A schematic diagram of a top view of a fourth spliced ​​screen provided according to an embodiment of the present application is shown;

[0021] Fig.10 A schematic diagram of a top view of the structure of a fifth spliced ​​screen provided according to an embodiment of the present application is shown;

[0022] Fig.11 A schematic diagram of a top view of a sixth spliced ​​screen provided according to an embodiment of the present application is shown;

[0023] Fig.12 A schematic diagram of a top view of a seventh spliced ​​screen provided according to an embodiment of the present application is shown;

[0024] Fig.13 A schematic diagram of a top view of the structure of an eighth spliced ​​screen provided according to an embodiment of the present application is shown;

[0025] Fig.14 A schematic diagram of a top view of a ninth spliced ​​screen provided according to an embodiment of the present application is shown;

[0026] Fig.15 A schematic structural diagram of a display device provided according to an embodiment of the present application is shown.

[0027] The above drawings include the following reference numerals:

[0028] 10. Display panel; 11. First substrate; 111. Third side; 112. Fourth side; 12. Second substrate; 121. First side; 122. Second side; 13. Touch electrode layer; 131. Touch signal line; 14. First binding pad; 15. First conductive layer; 151. First conductive sublayer; 152. Second conductive sublayer; 17. Display device layer; 18. Second binding pad; 19. Signal line; 20. Second conductive layer; 21. First encapsulation layer; 22. Second encapsulation layer; 23. Third encapsulation layer; 24. Fourth encapsulation layer; 25. Organic filling layer; 26. Pixel driving circuit; 27. Self-luminous device; 28. Display device. DETAILED DESCRIPTION

[0029] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0030] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0031] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0032] As introduced in the background technology, the touch display panel in the prior art is prone to poor touch. To solve the above technical problems, the embodiments of the present application provide a display panel and a display device.

[0033] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0034] In this embodiment, a display panel is provided. Figure 1 is a schematic diagram of the structure of a display panel 10 according to an embodiment of the present application. Figure 1 As shown, the display panel includes:

[0035] A first substrate 11 and a second substrate 12 arranged opposite to each other;

[0036] Specifically, the first substrate 11 and the second substrate 12 may be a hard substrate formed of at least one of glass, glass fiber reinforced plastic and other polymer materials, or a flexible substrate formed of at least one of polyimide (PI), polyethylene naphthalate (PEN) or polyethylene terephthalate (PET), etc. The first substrate 11 and the second substrate 12 may be an organic layer or an inorganic layer.

[0037] A touch electrode layer 13, wherein the touch electrode layer 13 is located on a side of the second substrate 12 close to the first substrate 11;

[0038] Specifically, the touch electrode layer 13 includes a touch signal line 131, which is used to receive touch actions and respond, and can specifically work in a self-capacitance mode or a mutual capacitance mode. In order to prevent it from being easily recognized, the touch signal line 131 can be formed of a transparent material such as indium tin oxide (ITO), or a metal material. The pattern of the touch electrode layer 13 can specifically be a semiconductor oxide electrode pattern array, a nano-metal wire electrode pattern array, a nano-carbon electrode pattern array, a polydioxythiophene (PEDOT) electrode pattern array, or a metal grid.

[0039] A first binding pad 14 is located on a side of the first substrate 11 away from the second substrate 12;

[0040] Specifically, the first binding pad 14 is used to connect a driver chip or a driver circuit board.

[0041] The first conductive layer 15 connects the touch electrode layer 13 and the first binding pad 14 . The first conductive layer 15 is at least partially located on the side surface 11 a of the first substrate 11 and / or at least partially located on the side surface 12 a of the second substrate 12 .

[0042] Specifically, the side surface 11a of the first substrate 11 refers to at least one of the other surfaces of the first substrate 11 except the two surfaces 11b opposite to the second substrate 12, and the side surface 12a of the second substrate 12 refers to at least one of the other surfaces of the second substrate 12 except the two surfaces 12b opposite to the first substrate 11. The electrical connection between the first binding pad 14 and the touch electrode layer 13 is realized by the first conductive layer 15, and the first binding pad 14 is used to provide a touch signal for the touch electrode layer 13.

[0043] Through the above-mentioned embodiments, the above-mentioned first binding pad is located on the side of the above-mentioned first substrate away from the above-mentioned second substrate, the above-mentioned touch electrode layer is arranged between the first substrate and the second substrate, the above-mentioned first conductive layer is at least partially located on the side of the above-mentioned first substrate and / or at least partially located on the side of the above-mentioned second substrate, and the above-mentioned first conductive layer realizes the electrical connection between the above-mentioned touch electrode layer and the above-mentioned first binding pad through side wiring. In the present application, the touch electrode layer is arranged between the two substrates, and the two substrates can play a role in protecting the touch electrode layer, thereby avoiding the problem that when the external structure scratches the touch operation surface of the display panel, it is easy to scratch the touch electrode layer close to the touch operation surface, thereby ensuring the good touch performance of the display panel. In addition, the present application adopts the side wiring method to connect the touch electrode layer and the first binding pad located on the back side of the first substrate, thereby realizing the touch line wiring design of the display panel without step area, which is conducive to realizing the narrow frame of the display panel.

[0044] Among them, the above-mentioned first conductive layer 15 can respectively contact the side of the above-mentioned second substrate 12, the side of the above-mentioned touch electrode layer 13 and the above-mentioned first binding pad 14 to realize the electrical connection between the above-mentioned touch electrode layer 13 and the above-mentioned first binding pad 14; the above-mentioned first conductive layer 15 can also respectively contact the side of the above-mentioned touch electrode layer 13, the side of the above-mentioned first substrate 11 and the above-mentioned first binding pad 14 to realize the electrical connection between the above-mentioned touch electrode layer 13 and the above-mentioned first binding pad 14; the above-mentioned first conductive layer 15 can also respectively contact the side of the above-mentioned second substrate 12, the side of the above-mentioned touch electrode layer 13, the side of the above-mentioned first substrate 11 and the above-mentioned first binding pad 14 to realize the electrical connection between the above-mentioned touch electrode layer 13 and the above-mentioned first binding pad 14.

[0045] The above-mentioned display panel can be a liquid crystal display, an organic light emitting diode (OLED) display, a quantum dot LED (QLED) display, a millimeter light emitting diode (mini-LED) display, a micro light emitting diode (micro-LED) display, an electrophoretic display technology display (EPD) or a light emitting diode (LED) display.

[0046] Figure 2 The cross-sectional structure diagram of a display panel of the present application is exemplarily shown. Figure 2As shown, the touch electrode layer 13 is also located on the side surface 12a of the second substrate 12, and the first conductive layer 15 includes: a first conductive sublayer 151, which is at least partially located on the side surface 11a of the first substrate 11, and the first conductive sublayer 151 is connected to the first binding pad 14, that is, the first conductive sublayer 151 covers at least part of the first binding pad 14 and at least part of the side surface 11a of the first substrate 11; a second conductive sublayer 152, which is at least partially located on the side surface 12a of the second substrate 12, and the second conductive sublayer 152 is respectively connected to the touch electrode layer 13 and the first conductive sublayer 151, that is, the second conductive sublayer 152 is located on the side surface of the second substrate 12, and contacts the touch electrode layer 13 located on the side surface of the second substrate 12, and the second conductive sublayer 152 is also in contact with the first conductive sublayer 151.

[0047] In the above embodiment, firstly, the touch electrode is arranged on the side surface of the second substrate, so that the touch electrode located on the side surface of the second substrate can be effectively overlapped with the first conductive layer of the side wiring, thereby ensuring the stability of signal transmission; secondly, the above-mentioned first conductive layer includes an electrically connected first conductive sublayer and a second conductive sublayer, and the first binding pad is connected through the first conductive sublayer, and the touch electrode layer is connected through the second conductive sublayer, thereby further realizing the effective electrical connection between the above-mentioned first binding pad and the above-mentioned touch electrode layer; the above-mentioned touch electrode layer extends from between the second substrate and the first substrate to the side surface of the second substrate, and the second conductive sublayer is located on the side surface of the second substrate and contacts with the touch electrode layer on the side surface, thereby further ensuring that the contact area between the first conductive layer and the touch electrode layer is large, so that the connection is relatively firm and the connection reliability is high.

[0048] In an exemplary embodiment, the routing width of the second conductive sublayer is greater than the routing width of the first conductive sublayer. Compared with the first conductive sublayer, the second conductive sublayer has a larger step difference when routing on the side, so setting the line width of the second conductive sublayer greater than the first conductive sublayer can avoid problems such as breakage when routing on the side of the second conductive sublayer, and further ensure good signal transmission effect of the second conductive sublayer.

[0049] Those skilled in the art can select any suitable conductive material as the constituent material of the first conductive sublayer and the second conductive sublayer. In the present application, the material of the first conductive sublayer includes copper, and the material of the second conductive sublayer includes silver.

[0050] In the above embodiments of the present application, since copper has high growth accuracy but relatively harsh manufacturing conditions, and silver has a simple manufacturing process and is convenient for pad printing, copper is selected as the material for the first conductive sublayer and silver is selected as the material for the second conductive sublayer in consideration of the process matching problem.

[0051] Of course, in addition to the copper and silver mentioned above, the materials of the first conductive sublayer and the second conductive sublayer may also be other metal materials, which is not specifically limited in the present application.

[0052] In a specific application process, the first conductive sublayer 151 may be located on a portion of the surface of the second conductive sublayer 152 away from the second substrate 12 to achieve electrical connection between the first conductive sublayer 151 and the second conductive sublayer 152; the second conductive sublayer 152 may also be located on a portion of the surface of the first conductive sublayer 151 away from the first substrate 11 to achieve electrical connection between the first conductive sublayer 151 and the second conductive sublayer 152; the first conductive sublayer 151 and the second conductive sublayer 152 overlap in a light emitting direction parallel to the display panel, and have no overlap in a light emitting direction perpendicular to the display panel to achieve electrical connection between the first conductive sublayer 151 and the second conductive sublayer 152.

[0053] In the embodiments of the present application, Figure 2 As shown, the first binding pad 14 is located on the surface of the first substrate 11 away from the second substrate 12, and the touch electrode layer 13 is located on the surface and side of the second substrate 12 close to the first substrate 11. The first conductive sublayer 151 extends from the side of the first substrate 11 to the back of the first substrate 11 and is electrically connected to the first binding pad 14.

[0054] In a specific embodiment, the projection of the first conductive sublayer located on the side of the first substrate on the predetermined plane is a first projection, and the projection of the touch electrode layer located on the side of the second substrate on the predetermined plane is a second projection, and the predetermined plane is perpendicular to the light emitting direction of the display panel (i.e., the thickness direction of the display panel), and the first projection and the first projection may not overlap, that is, in the top perspective view of the display panel, the first conductive sublayer located on the side of the first substrate and the touch electrode layer located on the side of the second substrate are spaced apart.

[0055] In another specific embodiment, Figure 2 As shown, the first conductive sublayer 151 located on the side surface 11a of the first substrate 11 is in a predetermined plane (vertical to Figure 2 The projection of the touch electrode layer 13 on the side surface 12a of the second substrate 12 on the predetermined plane is the second projection. The predetermined plane is perpendicular to the light emitting direction of the display panel. The first projection at least partially overlaps with the second projection. That is, the first projection can coincide with the second projection ( Figure 2In the illustrated embodiment), the first projection and the second projection may partially overlap and partially not overlap.

[0056] In the above embodiment, at least a portion of the first conductive sublayer on the side of the first substrate and at least a portion of the touch electrode layer on the side of the second substrate are located on the same plane, which facilitates the formation of the second conductive sublayer on the plane to electrically connect the first conductive sublayer and the touch electrode layer, thereby ensuring that the formation process of the second conductive sublayer is relatively simple and easy to implement.

[0057] Based on the above embodiment, the second conductive sublayer 152 is located on a surface of the first conductive sublayer 151 away from a side of the first substrate 11 and a surface of the touch electrode layer 13 away from a side of the second substrate 12 .

[0058] Figure 3 and Figure 4 The schematic top views of two display panels of the present application are shown respectively and exemplarily, wherein: Figure 3 (a) and Figure 4 (a) shows the schematic structural diagram of the display panel viewed from the side of the second substrate 12 facing away from the first substrate 11, Figure 3 (b) and Figure 4 (b) are schematic structural diagrams showing the display panel viewed from the side of the first substrate 11 facing away from the second substrate 12. Figure 1 and Figure 2 is along Figure 3 or Figure 4 The cross-sectional view of the display panel along the AA' direction. Figure 5 is along Figure 3 or Figure 4 The cross-sectional view of the display panel in the BB' direction. Figure 3 and Figure 4 As shown, the first conductive layer 15 is located on at least two side surfaces of the second substrate 12 .

[0059] In an optional embodiment, Figure 3 and Figure 4As shown, the display panel is a capacitive touch display panel, the first conductive layer 15 is located on the first side surface 121 and the second side surface 122 of the second substrate 12, the touch electrode layer 13 includes a driving electrode and a sensing electrode, the first conductive layer 15 located on the first side surface 121 is electrically connected to the driving electrode and the first binding pad 14, and the first conductive layer 15 located on the second side surface 122 is electrically connected to the sensing electrode and the first binding pad 14. The electrical connection between the touch electrode and the first binding pad is achieved through the first conductive layer, and the electrical connection between the sensing electrode and the first binding pad is achieved, and the power supply of the sensing electrode and the touch electrode is further guaranteed through the first binding pad.

[0060] The first conductive layer 15 is also located on at least two side surfaces of the first substrate 11. Specifically, the first conductive layer 15 is located on the third side surface 111 and the fourth side surface 112 of the first substrate 11, the third side surface 111 and the first side surface 121 are located on the same plane, the fourth side surface 112 and the second side surface 122 are located on the same plane, the first conductive layer 15 located on the third side surface is electrically connected to the driving electrode and the first binding pad 14, and the first conductive layer 15 located on the fourth side surface is electrically connected to the sensing electrode and the first binding pad 14.

[0061] In actual application, when the display panel is touched, the capacitance between the driving electrode and the sensing electrode will change, causing the current on the lead connected to the electrode to change. The driving chip will determine the touched position based on the current change on the lead, thereby realizing the touch function.

[0062] The driving electrodes and the sensing electrodes may be made of different materials, such as metal blocks, metal grid lines, and indium tin oxide, etc. The driving electrodes and the sensing electrodes may also have different shapes, such as strips and blocks, etc.

[0063] Exemplarily, the driving electrodes and the sensing electrodes are respectively located on a surface of the second substrate 12 close to the first substrate 11, and the driving electrodes and the sensing electrodes are also respectively located on a side surface of the second substrate 12. The driving electrodes and the sensing electrodes may be located on the same side surface of the second substrate 12, or may be located on different sides of the second substrate 12.

[0064] The arrangement of the driving electrodes and the sensing electrodes on the second substrate may be in any appropriate manner. For example, the driving electrodes and the sensing electrodes are arranged alternately on the second substrate.

[0065] The first side surface and the second side surface may be as follows Figure 3 The two adjacent side surfaces of the second substrate 12 are shown. The first side surface and the second side surface may also be as shown in FIG. Figure 4 Shown are two opposite side surfaces of the second substrate 12 .

[0066] When the first side surface is opposite to the second side surface, the third side surface is also opposite to the fourth surface; when the first side surface is adjacent to the second side surface, the third side surface is also adjacent to the fourth surface.

[0067] The driving electrodes extend from the surface of the second substrate 12 close to the first substrate 11 to the first side surface 121 along a first direction, and the first direction intersects the first side surface 121. The sensing electrodes extend from the surface of the second substrate 12 close to the first substrate 11 to the second side surface 122 along a second direction, and the second direction intersects the second side surface 122. The first conductive layer 15 covers at least a portion of the driving electrodes on the first side surface, at least a portion of the third side surface, and at least a portion of the first binding pad 14. The first conductive layer 15 also covers at least a portion of the sensing electrodes on the second side surface, at least a portion of the fourth side surface, and at least a portion of the first binding pad.

[0068] Figure 5 The cross-sectional structure diagram of a display panel of the present application is exemplarily shown. Figure 5 As shown, the display panel 10 further includes: a display device layer 17, located between the first substrate 11 and the touch electrode layer 13, and the first conductive layer 15 is also located on the side of the display device layer 17, wherein the side of the display device layer 17 is at least one of the other surfaces of the display device layer except the two surfaces opposite to the first substrate 11.

[0069] like Figure 5 As shown, the first conductive layer 15 sequentially covers at least a portion of the first binding pad 14, at least a portion of the side surface of the first substrate 11, at least a portion of the side surface of the display device layer 17, and at least a portion of the touch electrode layer 13 located on the side surface of the second substrate 12, so as to achieve electrical connection between the first binding pad 14 and the touch electrode layer 13.

[0070] It should be noted that the side surfaces of the first substrate 11 , the side surfaces of the display device layer 17 , and the side surfaces of the second substrate 12 are all insulated.

[0071] The display device layer is a laminated structure, and the display device layer 17 includes a pixel driving circuit 26. In the case where the display panel is a self-luminous panel, the display device layer 17 also includes a self-luminous device 27, and the self-luminous device 27 can be an organic light-emitting device or an inorganic light-emitting device. Figure 2 and Figure 5 As shown, the self-luminous device 27 is electrically connected to the pixel driving circuit 26. The display device layer 17 further includes an organic filling layer 25, which is located between the touch electrode layer 13 and the display device layer 17. The organic filling layer has good fluidity and flatness, and can fill the gap between the touch electrode layer and the display device layer to ensure the overall flatness of the display panel.

[0072] Specifically, Figure 5 As shown, the display panel 10 further includes:

[0073] The second binding pad 18 is located on a side of the first substrate 11 away from the second substrate 12;

[0074] Specifically, the second binding pad 18 is used to connect a driver chip or a driver circuit board. The second binding pad 18 can be disposed adjacent to the first binding pad, or the second binding pad 18 can be disposed spaced apart from the first binding pad.

[0075] The signal line 19 is located on the surface of the display device layer 17 close to the touch electrode layer 13;

[0076] Specifically, the signal lines include electrode signal lines, such as pixel electrode signal lines and common electrode signal lines, or anode signal lines and cathode signal lines.

[0077] The second conductive layer 20 connects the signal line 19 and the second bonding pad 18 .

[0078] Specifically, the electrical connection between the second bonding pad 18 and the signal line 19 is realized through the second conductive layer 20, and the second bonding pad 18 is used to supply power to the signal line 19. The second conductive layer 20 may be overlapped on the surface of the signal line 19 away from the display device layer 17.

[0079] In the above embodiment, the second binding pad and the signal line are connected via the second conductive layer, so that the second binding pad can supply power to the signal line.

[0080] In order to further realize the narrow frame of the display panel, Figure 5As shown, the second conductive layer 20 is at least partially located on the side surface of the first substrate 11 and / or the side surface of the display device layer 17. That is, the second conductive layer is arranged from the side surface, and the second conductive layer realizes the electrical connection between the signal line and the second binding pad through the side wiring, thereby realizing the wiring design between the pad and the signal line of the display panel without the step area.

[0081] Furthermore, the second binding pad 18 is located on the surface of the first substrate 11 away from the second substrate 12, and the second conductive layer 20 is located on the surface of the second binding pad 18 away from the first substrate 11, on the side of the first substrate 11, on the side of the display device layer 17 and on at least part of the surface of the signal line 19.

[0082] Those skilled in the art can select any suitable conductive material as the constituent material of the second conductive layer. In the present application, the material of the second conductive layer includes copper.

[0083] This application Figure 3 and Figure 4 The embodiment in which the first conductive layer 15 and the second conductive layer 20 are located on different sides of the first substrate 11 is exemplarily shown. Of course, the first conductive layer 15 and the second conductive layer 20 may also be located on the same side of the first substrate 11. The relative positional relationship between the first conductive layer 15 and the second conductive layer 20 may be set according to the specific requirements of the display panel.

[0084] Figure 6 and Figure 7 The structural schematic diagrams of two splicing screens are shown respectively as examples, wherein: Figure 6 The spliced ​​screen obtained by splicing two display panels 10 of the present application is shown. Figure 7 FIG. 1 shows a spliced ​​screen obtained by splicing four display panels 10 of the present application. Figure 6 As shown, the display panel 10 is a sub-screen of the spliced ​​screen, and only one side of the display panel 10 needs to be spliced ​​with other sub-screens. In this case, the first conductive layer 15 and the second conductive layer 20 can be located on different sides of the first substrate / the second substrate, or the first conductive layer 15 and the second conductive layer 20 can be located on the same side of the first substrate / the second substrate. It is only necessary to ensure that one surface of the first substrate can be spliced. Figure 7As shown, the display panel 10 is a sub-screen of the spliced ​​screen, and the three sides of the display panel 10 need to be spliced ​​with other sub-screens. At this time, in order to ensure that the display panel 10 has enough sides to be spliced ​​with other sub-screens, the first conductive layer 15 and the second conductive layer 20 can only be located on the same side of the first substrate / the second substrate.

[0085] Figures 8 to 14 A top view schematic diagram of a spliced ​​screen obtained by splicing four display panels 10 of the present application is exemplarily shown. The top view schematic diagram is a structural schematic diagram obtained by looking down at the spliced ​​screen from the side of the first substrate 11 away from the second substrate 12.

[0086] in, Figure 8 and Fig. 9 Two schematic diagrams of the positions of the second conductive layer 20 on the first substrate 11 are given, such as Figure 8 As shown, in the above spliced ​​screen, the second conductive layer 20 extends from one side ( Figure 8 The lower side (shown) extends to the surface of the first substrate 11.

[0087] like Fig. 9 As shown, in the above spliced ​​screen, one display panel corresponds to two second conductive layers 20, and the two second conductive layers 20 are formed from two opposite sides of the display panel 10 ( Fig. 9 The upper and lower sides (shown) extend to the surface of the first substrate 11.

[0088] Fig.10 A schematic diagram of the position of the first conductive layer 15 on the first substrate 11 is given, such as Fig.10 As shown, in the above spliced ​​screen, one display panel corresponds to two first conductive layers 15, and the two first conductive layers 15 are formed from two opposite sides of the display panel 10 ( Fig.10 The left and right sides (shown) extend to the surface of the first substrate 11.

[0089] Figures 11 to 14 The relative positions of the first conductive layer 15 and the second conductive layer 20 on the first substrate 11 are shown as an example. Fig.11 As shown, in the spliced ​​screen, the first conductive layer 15 and the second conductive layer 20 are located on different sides of the display panel 10, and the first conductive layer 15 extends from two opposite sides of the display panel 10 ( Fig.11 The second conductive layer 20 extends from the remaining side surface of the display panel 10 ( Fig.11 The lower side (shown) extends to the surface of the first substrate 11. Fig.12As shown, in the spliced ​​screen, the first conductive layer 15 and the second conductive layer 20 are located on different sides of the display panel 10, and the first conductive layer 15 extends from two opposite sides of the display panel 10 ( Fig.12 The second conductive layer 20 extends from the remaining two opposite sides (left and right sides) of the display panel 10 to the surface of the first substrate 11. Fig.12 The upper and lower sides shown in the figure) extend to the surface of the first substrate 11. Fig.13 As shown, in the spliced ​​screen, the first conductive layer 15 and the second conductive layer 20 are located on the same side of the display panel 10 ( Fig.13 The first conductive layer 15 and the second conductive layer 20 extend from the same side of the display panel 10 to the surface of the first substrate 11, and both overlap and are insulated on the side of the display panel 10 and the first substrate 11. Fig.14 As shown, in the spliced ​​screen, the first conductive layer 15 and the second conductive layer 20 are located on the same side of the display panel 10 ( Fig.13 On the lower side surface shown in the figure, the first conductive layer 15 and the second conductive layer 20 extend from the same side surface of the display panel 10 to the surface of the first substrate 11, and both are spaced apart on the side surface of the display panel 10 and the first substrate 11.

[0090] In addition, if Figure 2 As shown, the display panel further includes: a first encapsulation layer 21, covering the second conductive sublayer 152; and a second encapsulation layer 22, covering the portion of the first conductive sublayer 151 located on the first binding pad 14 and the first encapsulation layer 21. By protecting the first conductive sublayer and the second conductive sublayer by two encapsulation layers, it is possible to prevent the first conductive sublayer and the second conductive sublayer from being damaged by the manufacturing process, thereby preventing the problem of poor touch.

[0091] The display panel 10 further includes: a third encapsulation layer 23, covering the second conductive layer 20 located on the side surface of the first substrate 11 and the side surface of the display device layer 17; and a fourth encapsulation layer 24, covering the portion of the second conductive layer 20 located on the second binding pad 18, the third encapsulation layer 23 and the side surface of the second substrate 12. The third encapsulation layer and the fourth encapsulation layer support and protect the side surfaces of the display panel.

[0092] The embodiment of the present application further provides a display device 28, Fig.15 A schematic diagram of the structure of the display device 28 is shown as an example. Fig.15 As shown, the display device 28 includes any one of the display panels 10 described above.

[0093] In the above embodiment, in the display panel of the display device, the touch electrode layer is arranged between two substrates, and the two substrates can protect the touch electrode layer, thereby avoiding the problem that when the touch operation surface of the display panel is scratched by an external structure, the touch electrode layer close to the touch operation surface is easily scratched, thereby ensuring good touch performance of the display panel. In addition, the present application adopts a side wiring method to connect the touch electrode layer and the first binding pad located on the back side of the first substrate, thereby realizing a touch line wiring design of a display panel without a step area, which is conducive to realizing a narrow frame of the display panel.

[0094] Specifically, Figure 6 and Figure 7 As shown, there are a plurality of the display panels 10 , and the plurality of display panels 10 have no step area. The plurality of display panels 10 can be spliced ​​into a spliced ​​panel. Figure 6 An embodiment of splicing a screen by splicing two display panels 10 is exemplarily shown. Figure 7 An embodiment in which four display panels 10 are spliced ​​together to obtain a spliced ​​screen is exemplarily shown, but the spliced ​​panels of the present application are not limited thereto.

[0095] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0096] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0097] 1) In the display panel of the present application, the first binding pad is located on the side of the first substrate facing away from the second substrate, the touch electrode layer is arranged between the first substrate and the second substrate, the first conductive layer is at least partially located on the side of the first substrate and / or at least partially located on the side of the second substrate, and the first conductive layer realizes the electrical connection between the touch electrode layer and the first binding pad through side wiring. The present application arranges the touch electrode layer between the two substrates, and the two substrates can play a role in protecting the touch electrode layer, thereby avoiding the problem that when the touch operation surface of the display panel is scratched by an external structure, the touch electrode layer close to the touch operation surface is easily scratched, thereby ensuring the good touch performance of the display panel. In addition, the present application adopts a side wiring method to connect the touch electrode layer and the first binding pad located on the back side of the first substrate, thereby realizing the touch line wiring design of the display panel without a step area, which is conducive to realizing a narrow frame of the display panel.

[0098] 2) In the display panel of the display device of the present application, the touch electrode layer is arranged between two substrates, and the two substrates can protect the touch electrode layer, thereby avoiding the problem that when the touch operation surface of the display panel is scratched by an external structure, the touch electrode layer close to the touch operation surface is easily scratched, thereby ensuring the good touch performance of the display panel. In addition, the present application adopts a side wiring method to connect the touch electrode layer and the first binding pad located on the back side of the first substrate, thereby realizing the touch line wiring design of the display panel without a step area, which is conducive to realizing a narrow frame of the display panel.

[0099] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: A first substrate and a second substrate arranged opposite to each other; a touch electrode layer, wherein the touch electrode layer is located on a side of the second substrate close to the first substrate; A first binding pad is located on a side of the first substrate away from the second substrate; A first conductive layer connects the touch electrode layer and the first binding pad, and the first conductive layer is at least partially located on a side surface of the first substrate and / or at least partially located on a side surface of the second substrate.

2. The display panel according to claim 1, characterized in that: The touch electrode layer is also located on a side surface of the second substrate, and the first conductive layer includes: A first conductive sublayer, at least partially located on a side surface of the first substrate, the first conductive sublayer being connected to the first binding pad; The second conductive sublayer is at least partially located on a side surface of the second substrate, and the second conductive sublayer is respectively connected to the touch electrode layer and the first conductive sublayer.

3. The display panel according to claim 2, characterized in that: The projection of the first conductive sublayer located on the side of the first substrate on the predetermined plane is a first projection, and the projection of the touch electrode layer located on the side of the second substrate on the predetermined plane is a second projection. The first projection and the second projection at least partially overlap, and the predetermined plane is perpendicular to the light emitting direction of the display panel.

4. The display panel according to claim 1, characterized in that: The first conductive layer is located on at least two side surfaces of the second substrate.

5. The display panel according to claim 4, characterized in that: The first conductive layer is located on the first side surface and the second side surface of the second substrate, the touch electrode layer includes a driving electrode and a sensing electrode, the first conductive layer located on the first side surface is electrically connected to the driving electrode and the first binding pad, and the first conductive layer located on the second side surface is electrically connected to the sensing electrode and the first binding pad.

6. The display panel according to claim 5, characterized in that: The first side surface and the second side surface are adjacent to or opposite to each other.

7. The display panel according to any one of claims 1 to 6, characterized in that: The display panel further includes: The display device layer is located between the first substrate and the touch electrode layer, and the first conductive layer is also located on a side surface of the display device layer.

8. The display panel according to claim 7, characterized in that: The display panel further includes: A second binding pad is located on a side of the first substrate away from the second substrate; A signal line is located on a surface of the display device layer close to the touch electrode layer; The second conductive layer connects the signal line and the second bonding pad.

9. The display panel according to claim 8, characterized in that: The second conductive layer is located on the second binding pad, on a side surface of the first substrate, on a side surface of the display device layer, and on a surface of the signal line.

10. The display panel according to claim 8, characterized in that: The signal lines include electrode signal lines.

11. The display panel according to claim 8, characterized in that: The first conductive layer and the second conductive layer are located on the same side or on different sides of the first substrate.

12. The display panel according to claim 2 or 3, characterized in that: The display panel further includes: a first encapsulation layer, covering the second conductive sublayer; The second packaging layer covers the portion of the first conductive sublayer located on the first binding pad and the first packaging layer.

13. The display panel according to claim 8, characterized in that: The display panel further includes: a third encapsulation layer covering the second conductive layer located on a side surface of the first substrate and a side surface of the display device layer; A fourth packaging layer covers a portion of the second conductive layer located on the second binding pad, the third packaging layer, and a side surface of the second substrate.

14. The display panel according to claim 2 or 3, characterized in that: The material of the first conductive sublayer includes copper, and the material of the second conductive sublayer includes silver.

15. A display device, characterized in that: include: The display panel according to any one of claims 1 to 14.

16. The display device according to claim 15, characterized in that: There are a plurality of display panels, and the plurality of display panels are spliced ​​into a spliced ​​panel.

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