Electronic packaging equipment

Abstract

The present invention provides an electronic packaging device, which relates to the technical field of ball planting machines and includes: a ball supply mechanism: including an implantation site for accommodating an implantation component; a ball supply assembly: arranged above the ball supply mechanism to provide the implantation component to the ball supply mechanism; a pressure assembly: arranged on the upper surface of the ball supply mechanism to apply a downward pressure to the ball supply mechanism. The ball supply mechanism includes a ball planting net and a substrate. The substrate is located below the ball planting net. The position on the substrate for accommodating the implantation component coincides with the mesh holes of the ball planting net to form an implantation site for accommodating the implantation component; the downward pressure applied by the pressure assembly acts on the ball planting net to make the ball planting net fit the substrate. By applying a downward pressure to the ball planting net of the ball supply mechanism through the pressure assembly, it is possible to adapt to the ball laying work for warped ball supply products, and avoid gaps between the substrate and the ball planting net during the ball laying process, so as to ensure that the solder balls can all correctly fall into the mesh holes of the ball planting net, thereby improving the ball planting yield.

Description

Technical Field

[0001] The present invention relates to the technical field of ball planting machines, and more particularly to an electronic packaging device. Background Art

[0002] The ball planting technology is a key electronic packaging technology used for electrical connection between integrated circuit chips and printed circuit boards (PCBs). This technology is a process of precisely placing implant components (usually solder alloys) at the implant positions of the chips.

[0003] A ball planting machine is a dedicated device for performing the ball planting process. It usually has an automated feeding system, a precise heating and cooling system, a precise position control system, and a quality control system. This ball planting machine needs to be flexible and capable of adapting to different packaging types (such as the number of balls, ball diameter, pitch, etc.) and different specifications of chips. Therefore, modern ball planting machines usually have adjustable parameters and process settings to meet the needs of different customers and applications.

[0004] In the existing technology, when the ball planting machine performs ball planting operations on substrates with a large degree of warping, the ball planting effect is poor, and the ball planting yield is significantly reduced. It is difficult for the existing ball planting machines to solve the problem of ball planting on warped substrates because when the substrate warps, a gap will be generated between the substrate and the ball planting stencil, resulting in multiple solder balls leaking between the gaps and causing defects. Summary of the Invention

[0005] Aiming at the defects in the prior art, the purpose of the present invention is to provide an electronic packaging device.

[0006] According to an electronic packaging device provided by the present invention, it includes:

[0007] A ball supply mechanism: including an implant site for accommodating implant components;

[0008] A ball supply component: disposed above the ball supply mechanism to provide implant components to the ball supply mechanism;

[0009] A pressure component: disposed on the upper surface of the ball supply mechanism to apply a downward pressure to the ball supply mechanism.

[0010] Preferably, the pressure component is configured to move on the ball supply mechanism along with the ball supply component.

[0011] Preferably, the ball supply mechanism includes a ball planting stencil and a substrate. The substrate is located below the ball planting stencil, and the positions for configuring implant components on the substrate coincide with the mesh holes of the ball planting stencil to form an implant site for accommodating implant components; the downward pressure applied by the pressure component acts on the ball planting stencil to make the ball planting stencil fit with the substrate.

[0012] Preferably, the relative movement mode between the pressure assembly and the upper surface of the ball supply mechanism includes translational motion and / or rolling.

[0013] Preferably, the pressure assembly includes one or more of a plunger assembly, a roller assembly, a roller drum assembly, and a forced deformation self-resetting assembly.

[0014] Preferably, the ball supply assembly includes a ball outlet, the forced deformation self-resetting assembly is installed on the periphery of the ball outlet, and the forced deformation self-resetting assembly protrudes from the bottom surface of the ball supply assembly;

[0015] The bottom surface of the forced deformation self-resetting assembly contacts the ball planting mesh of the ball supply mechanism, and the deformation amount of the ball planting mesh caused by the forced deformation self-resetting assembly can reach or exceed the deformation amount of the product.

[0016] Preferably, the forced deformation self-resetting assembly deforms under the action of an external force, and when the external force decreases or disappears, the shape of the forced deformation self-resetting assembly automatically restores.

[0017] Preferably, the movement of the ball supply assembly includes translational motion on the upper surface of the ball supply mechanism;

[0018] At least one set of brackets is respectively arranged on the front and rear sides in the translational direction of the ball supply assembly, and any bracket gradually approaches the ball outlet of the ball supply assembly from top to bottom;

[0019] The bottom of the bracket is configured to install one or more of a plunger assembly, a roller assembly, and a roller drum assembly.

[0020] Preferably, elastic shims are arranged on both the front and rear sides of the ball outlet of the ball supply assembly along the translational direction of the ball supply assembly, and the elastic shims contact the upper surface of the ball planting mesh.

[0021] Preferably, it further includes:

[0022] An air supply system, the air supply system is configured such that the air outlet extends towards the direction close to the ball outlet of the ball supply assembly, and the orifice of the air outlet faces directly below the ball outlet of the ball supply assembly;

[0023] And / or, a vibration system, the vibration system acts on the ball supply assembly.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] 1. By applying a downward pressure on the ball planting mesh of the ball supply mechanism through the pressure assembly, the present invention can adapt to the ball laying work for the warped ball supply product, and can avoid the gap between the substrate and the ball planting mesh during the ball laying process, so as to ensure that all solder balls can correctly fall into the mesh holes of the ball planting mesh, thereby improving the ball planting yield. Description of the Drawings

[0026] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non - limiting embodiments read in conjunction with the accompanying drawings:

[0027] Figure 1 This is an exploded view mainly showing the ball box assembly of the present invention;

[0028] Figure 2 This is a front view mainly showing the ball box assembly of the present invention;

[0029] Figure 3 is Figure 2 a cross - sectional view taken along the A - A direction of

[0030] Figure 4 This is a schematic diagram mainly showing in the first embodiment that the implant member falls from the ball storage groove into the mesh holes of the ball - implanting net and adheres to the substrate;

[0031] Figure 5 This is a three - dimensional structure schematic diagram mainly showing the second embodiment of the present invention;

[0032] Figure 6 This is a side sectional view mainly showing the second embodiment of the present invention;

[0033] Figure 7 is Figure 6 an enlarged schematic diagram at the plunger position in

[0034] Figure 8 This is a plunger installation schematic diagram mainly showing the second embodiment of the present invention;

[0035] Figure 9 This is a structure schematic diagram mainly showing that an elastic baffle is added beside the ball outlet of the ball box in the present invention;

[0036] Figure 10 This is an enlarged side sectional view at the ball outlet position;

[0037] Figure 11 This is a structure schematic diagram mainly showing the use of an elastic roller in the third embodiment of the present invention;

[0038] Figure 12 This is a structure schematic diagram mainly showing the use of an elastic drum in the fourth embodiment of the present invention;

[0039] Figure 13 This is an elastic drum installation schematic diagram mainly showing the fourth embodiment of the present invention.

[0040] As shown in the figure:

[0041] Substrate 10, Horizontal drive mechanism 420, Plunger head 622

[0042] Implant component 20, horizontal slide rail 421, roller assembly 623

[0043] Ball-planting net 200, support slide plate 423, roller assembly 624

[0044] Ball supply component 400, lifting drive mechanism 430, elastic retaining piece 625

[0045] Ball box 410, connecting plate 610, wear-resistant layer 630

[0046] Ball storage groove 411, ball outlet 611, support 640

[0047] Ball outlet 412, groove 612, vertical rod 641

[0048] Cover plate 413, air groove 613, cross rod 642

[0049] Jack 414, air outlet 614, cylinder seat 650

[0050] Goal tube 415, forced deformation self-resetting component 620, inclined mounting surface 651 Inlet air flow channel 416, plunger assembly 621, cylinder 652

[0051] Vibrator 660 Detailed implementation manners

[0052] The present invention will be described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several changes and improvements can still be made. These all belong to the protection scope of the present invention.

[0053] It should be emphasized that: the implant component 20 of the present application can be a columnar structure or a spherical structure. The equipment of the technical solution of the present application is particularly applicable to the spherical implant component 20, and can also be applicable to the columnar implant component 20.

[0054] Example 1

[0055] As Figures 1 to 4 shown, an electronic packaging device provided according to the present invention includes a ball-supplying mechanism, a ball supply component 400, and a pressure component. The ball-supplying mechanism includes an implant site for accommodating the implant component 20. The ball supply component 400 is arranged above the ball-supplying mechanism and supplies the implant component 20 to the ball-supplying mechanism. The pressure component is arranged on the upper surface of the ball-supplying mechanism and applies a downward pressure to the ball-supplying mechanism.

[0056] Specifically, the ball feeding mechanism includes a ball planting net 200 and a substrate 10. The substrate 10 is located below the ball planting net 200. The positions on the substrate 10 where the implanting members 20 are arranged coincide with the meshes of the ball planting net 200 to form implanting sites for accommodating the implanting members 20. The downward pressure applied by the pressure assembly acts on the ball planting net 200 to make the ball planting net 200 fit with the substrate 10.

[0057] More specifically, the substrate 10 is stably installed below the ball planting net 20 through a supporting device. The present application proposes a feasible way to support the substrate 10, which does not specifically limit the content to be protected in the present application: the supporting platform is supported by four supporting legs. There is an opening on the supporting platform. The ball planting net 200 is fixed inside the opening. The ball planting net 200 is preferably a steel net, and of course, nets made of other materials can also be used.

[0058] The supporting device is arranged below the ball planting net 200 and includes a fixing plate, a carrier plate arranged below the fixing plate, a supporting plate arranged below the carrier plate, and four guide posts. The fixing plate is located below the ball planting net 200 and is fixed at both ends on the supporting platform. The four guide posts are vertically and fixedly connected between the fixing plate and the supporting plate. There are four linear bearings on the carrier plate. The four linear bearings are sleeved on the four guide posts to enable the carrier plate to lift along the guide posts. There is a hole in the middle of the fixing plate. There is a carrier for positioning and placing the substrate 10 at the position corresponding to the hole on the carrier plate. Rubber-made limit pads are provided at the roots of the four guide posts.

[0059] A handle is provided on the lower surface of the carrier plate. By holding the handle, the carrier plate can be lifted, so that the substrate 10 on the carrier plate passes through the hole of the fixing plate and is lifted to the lower surface of the ball planting net 200. After the substrate 10 is located on the lower surface of the ball planting net 200, the carrier plate can be fixed to the fixing plate by using bolts, so that the substrate 10 can be stably located on the lower surface of the ball planting net 200 during ball planting. In this embodiment, the lifting of the carrier plate is realized manually. In addition to this solution, a motor or a cylinder drive method can also be used to drive the lifting of the carrier plate to realize the automation of the supporting device.

[0060] The ball feeding assembly 400 includes a ball box 410, a horizontal driving mechanism 420 for driving the horizontal movement of the ball box 410, and a lifting driving mechanism 430 for driving the lifting movement of the ball box 410.

[0061] The ball box 410 is provided with a ball storage groove 411 at the bottom. An outlet 412 is provided at the bottom of the ball storage groove 411. A cover plate 413 is provided at the top opening of the ball storage groove 411. The cover plate 413 is provided with insertion holes 414 at intervals. An inlet pipe 415 is fixed on each insertion hole 414. The inlet pipe 415 is connected to an external ball feeding device. The ball feeding device can inject the implanting members 20 into the ball storage groove 411 through the inlet pipe 415.

[0062] The horizontal drive mechanism 420 includes a horizontal slide rail 421, a horizontal linear module, and a support slide plate 423. The horizontal slide rail 421 and the horizontal linear module are fixed on the support platform and are arranged on both sides of the opening. One end of the support slide plate 423 is arranged on the horizontal slide rail 421, and the other end is arranged on the horizontal linear module. A through hole is formed in the support slide plate 423. The through hole can pass above the hole of the fixed plate under the sliding of the support slide plate 423.

[0063] The lifting drive mechanism 430 is fixed on the support slide plate 423 and is located on one side of the through hole. The ball box 410 is installed on the lifting drive mechanism 430 and is located above the through hole. Under the lifting drive of the lifting drive mechanism 430, the ball box 410 can pass through the through hole so that the ball outlet 412 reaches above the ball planting net 200. The lifting drive mechanism 430 is a vertical linear module.

[0064] Both the horizontal linear module and the vertical linear module are motor-driven linear modules. Since they are in the prior art and can be directly purchased from the market, the specific structures of the two are not described in detail here.

[0065] The pressure assembly is configured to move on the ball supply mechanism along with the ball supply assembly 400. The pressure assembly of the present application can be installed on the ball supply assembly 400, or can be installed on other transmission components, and the transmission components drive the pressure assembly to move on the ball supply mechanism along with the ball supply assembly 400. The relative movement mode between the pressure assembly and the upper surface of the ball supply mechanism includes translation and / or rolling. The pressure assembly includes one or more of a plunger assembly 621, a roller assembly 623, a roller assembly 624, and a forced deformation self-resetting assembly 620.

[0066] This specific embodiment further elaborates with the pressure assembly being the forced deformation self-resetting assembly 620 as an example:

[0067] It should be noted that the forced deformation self-resetting assembly 620 of the present application deforms under the action of an external force, and when the external force decreases or disappears, the shape of the forced deformation self-resetting assembly 620 automatically restores. The forced deformation self-resetting assembly 620 of the present application can include non-metallic elastic members such as rubber, sponge, and foam cotton, can also include metallic elastic members such as springs and thin-walled metal members, and can also be a composite elastic structure made by utilizing the elastic characteristics of elastic elements or materials. For example, a hollow metal roller structure, and the hollow roller made of the ductility of metal has a certain deformation recovery ability.

[0068] The ball supply assembly 400 includes a ball outlet 412. The forced deformation self - resetting assembly 620 is embedded and installed on the periphery of the ball outlet 412, and the forced deformation self - resetting assembly 620 protrudes from the bottom surface of the ball supply assembly 400. The bottom surface of the forced deformation self - resetting assembly 620 contacts the ball - planting net 200 of the ball supply mechanism. The forced deformation self - resetting assembly 620 exerts a downward force on the ball - planting net 200 by virtue of its adaptive deformation ability, and the deformation amount of the ball - planting net caused by the forced deformation self - resetting assembly 620 can reach or exceed the deformation amount of the product.

[0069] Specifically, a connecting plate 610 is detachably fixed to the lower surface of the bottom of the ball box 410. For example, the connecting plate 610 is fixed to the bottom of the ball box 410 by means of bolt fastening. A ball - dropping port 611 having the same size as the ball outlet 412 is opened at a position below the ball outlet 412 on the lower surface of the connecting plate 610. A groove 612 is formed around the ball outlet 412 on the lower surface of the connecting plate 610. The forced deformation self - resetting assembly 620 surrounding the ball outlet 412 is arranged in the groove 612.

[0070] The forced deformation self - resetting assembly 620 is fixed in the groove 612 by means of glue bonding and protrudes from the lower surface of the connecting plate 610. By using the connecting plate 610 to connect the non - metallic elastic member 620 to the bottom of the ball box 410, it is convenient to replace the forced deformation self - resetting assembly 620 and maintain the bottom of the ball box 410.

[0071] The forced deformation self - resetting assembly 620 preferably uses sponge. The thickness of the forced deformation self - resetting assembly 620 should be greater than the maximum warpage amount of the ball supply base. In a feasible implementation, the thickness of the sponge is 15 - 25 mm, and the density of the sponge is 90 kg / cm 3 。

[0072] A wear - resistant layer 630 is further arranged on the lower surface of the forced deformation self - resetting assembly 620. The wear - resistant layer 630 is a wear - resistant coating applied on the lower surface of the forced deformation self - resetting assembly 620 or a wear - resistant thin sheet pasted on the lower surface of the forced deformation self - resetting assembly 620. By adding the wear - resistant layer 630, the situation where the forced deformation self - resetting assembly 620 directly contacts and rubs against the ball - planting net 200 can be avoided. For example, when the wear - resistant layer 630 is a wear - resistant thin sheet, a film is used. The wear - resistant layer 630 can also use an antistatic material, such as a stainless - steel thin sheet or a conductive plastic, with a thickness of 0.1 - 0.3 mm. It should be further noted that for some forced deformation self - resetting assemblies 620, their own materials and / or structures have self - wear - resistant functions and adapt to the deformation amount, and in this case, the wear - resistant layer 630 can be not added additionally.

[0073] Further, it further includes a gas supply system which is configured such that the air outlet hole 614 extends in a direction close to the ball outlet 412 of the ball supply assembly 400, and the orifice of the air outlet hole 614 faces directly below the ball outlet 412 of the ball supply assembly 400. Specifically, an air groove 613 is further formed inside the connecting plate 610. A plurality of air outlet holes 614 communicating with the air groove 613 are formed on the lower surface of the connecting plate 610. The plurality of air outlet holes 614 are spaced around the ball outlet 412. The orifice of the air outlet hole 614 is located inside the forced deformation self-resetting assembly 620, and the air outlet hole 614 is an inclined hole with the orifice inclined towards the ball outlet 412. The inclined hole enables the gas coming out of the air outlet hole 614 to blow on the implant member 20 of the ball implanting net 200, enabling the implant member 20 to jump, so that the implant member 20 can be scattered and fall into the mesh holes of the ball implanting net 200. In this embodiment, an air inlet flow channel 416 communicating with the air groove 613 is formed in the plate body at the bottom of the ball box 410. The air inlet flow channel 416 is connected to an external gas source through a trachea.

[0074] Its working process is as follows:

[0075] 1. The substrate 10 is lifted to the lower surface of the ball implanting net 200 and waits for ball laying;

[0076] 2. The lifting drive mechanism 430 drives the ball box 410 to descend to the upper surface of the ball implanting net 200 and presses down the ball implanting net 200 to complete the preparation action for ball laying;

[0077] 3. An external ball supply device supplies balls into the ball storage groove 411 of the ball box 410;

[0078] 4. The horizontal drive mechanism 420 drives the ball box 410 to move forward. During the forward movement, the ball laying mechanism presses down the ball implanting net 200 by means of the elastic force of the sponge so that the ball implanting net 200 is completely attached to the substrate 10 and restricts the implant member 20 within the area surrounded by the sponge and drives the implant member 20 to move forward together for ball laying. When the implant member 20 passes through the mesh holes of the ball implanting net 200, it enters the mesh holes by its own gravity. After the ball box 410 passes through the mesh hole area of the ball implanting net 200, the ball laying action is completed.

[0079] During the ball laying process, since the sponge is elastic and can change according to the warped shape of the substrate 10, it ensures that the sponge, the steel mesh, and the substrate 10 are completely attached, thereby completing the ball laying on the warped substrate 10.

[0080] During the ball laying process, gas is also introduced into the air inlet flow channel 416, and the gas is blown out from the air outlet through the air groove 613. The blown gas can blow the implant member 20 on the surface of the ball implanting net 200, enabling the implant member 20 to jump during the ball laying process so as to be scattered and fall into each mesh hole.

[0081] Example 2

[0082] Based on Embodiment 1, an electronic packaging device adaptable to a warped substrate 10 provided by the present invention will be further elaborated by taking the pressure assembly as the plunger assembly 621 as an example in this specific embodiment:

[0083] As Figures 5 to 10 shown, in this specific embodiment, the ball storage groove 411 of the ball box 410 is an inverted trapezoidal narrow groove, the ball outlet 412 is a narrow opening, and the width of the ball outlet 412 is between 1 mm and 2 mm.

[0084] The movement of the ball supply assembly 400 includes translation on the upper surface of the ball supply mechanism. At least one set of brackets 640 is respectively arranged on the front and rear sides in the translation direction of the ball supply assembly 400. Any bracket 640 gradually approaches the ball outlet 412 of the ball supply assembly 400 from top to bottom. The bottom of the bracket 640 is configured to mount the plunger assembly 621. The plunger assembly 621 includes an elastic plunger. The plunger head 622 of the elastic plunger is spherical and presses on the ball planting net 200 under the action of an internal spring. The elastic plunger can be directly purchased from the market.

[0085] The bracket 640 is composed of two vertical rods 641 and a cross rod 642 connected between the lower ends of the two vertical rods 641. Cylinder seats 650 are respectively arranged on the left and right sides of the ball box 410 on the support slide plate 423. Inclined mounting surfaces 651 with lower outer sides and higher inner sides are symmetrically distributed on the cylinder seats 650. A cylinder 652 is respectively mounted on each inclined mounting surface 651. The upper ends of the vertical rods 641 are connected to the cylinders 652, and the elastic plungers are arranged and fixed on the cross rod 642 with the plunger heads 622 facing downwards. In this embodiment, due to the adoption of the inclined mounting surface 651, the cylinders 652 and the brackets 640 are both inclinedly mounted, and finally the plunger heads 622 of the elastic plungers are inclinedly mounted on both sides of the ball box 410 in a manner of deflecting towards the ball box 410. Moreover, the outer walls on the front and rear sides of the ball box 410 are inclined walls with the bottom inclined inwards, and the wall thickness of the ball box 410 at the front and rear sides of the ball outlet 412 is between 1.2 mm and 1.8 mm. This enables the plunger heads 622 of the plunger assembly 621 to be as close as possible to the ball outlet 412 (i.e., the elastic force application point is as close as possible to the ball laying point). To ensure a linear and uniform force application point, as many elastic plungers as possible should be arranged on both sides of the ball laying box 410.

[0086] It should be noted that the elastic plungers of the technical solution of the present application are arranged at intervals as much as possible along the length direction of the cross rod 642. The number and size of the elastic plungers can be selected according to the actual working conditions. The more the number of elastic plungers, when pressing on the ball planting net 200, a more reasonable arc-shaped deformation can be achieved, and the situation of pressing out single pits at the crimping sites will not occur.

[0087] In this embodiment, the elastic member driving mechanism uses a cylinder 652. Of course, other driving mechanisms can also be used, such as a linear module driven by a motor.

[0088] The plunger assembly 621 can move up and down under the synchronous drive of two cylinders 652 on the same side. During the ball laying process, a row of plunger assemblies 621 on the forward side in the advancing direction descend under the drive of the cylinders 652 to press the ball implantation net 200, while the plunger assemblies 621 on the opposite side rise under the drive of the cylinders 652 and separate from the ball implantation net 200. During the ball laying process, a row of plunger assemblies 621 on the advancing side press down the ball implantation net 200 by means of elastic force, so that the ball implantation net 200 is completely attached to the substrate 10.

[0089] Furthermore, a vibration system is further included, and the vibration system acts on the ball supply assembly 400. The vibration system includes a vibrator 660, and a vibrator 660 is also installed on the top of the ball box 410. Through the vibration of the vibrator 660, the solder balls in the ball box 410 can be made to jump, which can effectively improve the ball laying yield.

[0090] There are vacuum suction holes in the positioning grooves of the carrier. The substrate 10 is positioned in the positioning grooves of the carrier and sucked by vacuum, and is fixed by means of buckles or bolts locking, etc.

[0091] Further preferably, elastic retaining pieces 625 are arranged on both the front and rear sides of the ball outlet 412 of the ball supply assembly 400 along the translational direction of the ball supply assembly 400, and the elastic retaining pieces 625 are in contact with the upper surface of the ball implantation net 200. Specifically, elastic retaining pieces 625 are additionally arranged on both the front and rear sides of the ball outlet 412 of the ball box 410. Specifically, the elastic retaining pieces 625 are fixed on the outer walls of both the front and rear sides of the ball box 410, and the ends extend beyond the lower surface of the bottom of the ball box 410 and bend inward to contact the ball implantation net 200. Adding the elastic retaining pieces 625 can prevent the implanting member 20 from leaking out from the side during the ball laying process. The elastic retaining pieces 625 are made of stainless steel or spring steel.

[0092] It can be seen from the above detailed description that the electronic packaging equipment of the present invention can adapt to the ball laying work for the warped substrate 10, and can avoid the gap between the substrate 10 and the ball implantation net 200 during the ball laying process, so as to ensure that all the solder balls can correctly fall into the mesh holes of the ball implantation net 200, thereby improving the ball implantation yield.

[0093] It should be noted that the technical solution of the present application can be used not only for the ball laying of the substrate 10, but also for the ball laying of other products, such as the ball laying of chips or wafers.

[0094] Other structures are the same as those in Embodiment 1, and will not be repeated here.

[0095] Example 3

[0096] Based on Embodiment 2, an electronic packaging device provided by the present invention will be further described by taking the pressure component as the roller assembly 623 as an example in this specific embodiment:

[0097] As Figure 11 shown, in this specific embodiment, the roller assembly 623 is used to replace the plunger assembly 621 in Embodiment 2, and other structures are the same as those in Embodiment 2, which will not be elaborated here. The roller assembly 623 includes an elastic roller, which is composed of an elastic telescopic column and a roller installed at the lower end of the elastic telescopic column. This elastic roller can also be directly purchased from the market.

[0098] Similarly, during the ball laying process, a row of elastic rollers on the forward direction side descend under the drive of the cylinder 652 to press the ball planting net 200, while the elastic rollers on the opposite direction side rise under the drive of the cylinder 652 and disengage from the ball planting net 200.

[0099] Example 4

[0100] Based on Embodiment 2, an electronic packaging device provided by the present invention will be further described by taking the pressure component as the drum assembly 624 as an example in this specific embodiment:

[0101] As Figure 12 and Figure 13 shown, in this specific embodiment, the drum assembly 624 is used to replace the plunger assembly 621 in Embodiment 2. The drum assembly 624 includes an elastic drum, and an elastic drum is connected between the lower ends of two vertical rods 641. This elastic drum can be directly purchased from the market, and the surface of the elastic drum has an elastic rubber coating, and the rubber material can be rubber or plastic. The drum assembly 624 can also preferably use a hollow drum, which can be made of a metal material. Its own deformation recovery ability of the metal hollow structure acts on the ball planting net 200, so that when pressing on the ball planting net 200, the ball planting net 200 generates an arc-shaped deformation and does not show the situation of pressing out individual pits.

[0102] Similarly, during the ball laying process, the elastic drum on the forward direction side descends under the drive of the cylinder 652 to press the ball planting net 200, while the drum on the opposite direction side rises under the drive of the cylinder 652 and disengage from the ball planting net 200.

[0103] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0104] The specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. An electronic packaging device, characterized in that: include: The ball supply mechanism includes an implantation site for accommodating the implantation member; Ball supply assembly: arranged above the ball supply mechanism, providing implant components to the ball supply mechanism; Pressure assembly: arranged on the upper surface of the ball supply mechanism, exerting downward pressure on the ball supply mechanism; The pressure assembly is configured to move with the ball supply assembly on the ball supplied mechanism; The pressure assembly includes one or more of a plunger assembly, a roller assembly, a drum assembly, and a forced deformation self-resetting assembly; The ball supply assembly includes a ball outlet, the forced deformation self-resetting assembly is installed on the peripheral side of the ball outlet, and the forced deformation self-resetting assembly protrudes from the bottom surface of the ball supply assembly; The bottom surface of the forced deformation self-resetting component is in contact with the ball planting net of the ball supply mechanism, and the deformation of the ball planting net caused by the forced deformation self-resetting component can reach or exceed the deformation of the product; The movement of the ball supply assembly includes translation on the upper surface of the ball supply mechanism; At least one set of brackets is respectively arranged on the front and rear sides of the ball supply assembly in the translation direction, and any bracket gradually approaches the ball outlet of the ball supply assembly from top to bottom; The bottom of the bracket is configured to mount one or more of a plunger assembly, a roller assembly, and a drum assembly; The ball supply assembly includes a ball box and a horizontal driving mechanism for driving the ball box to move horizontally; The horizontal driving mechanism drives the ball box forward. During the forward movement, the ball-laying mechanism presses down the ball planting net with the elastic force of the forced deformation self-resetting component so that the ball planting net and the substrate are completely fitted together and the implanted components are restricted in the area surrounded by the forced deformation self-resetting component and drive the implanted components forward to lay the balls. When the implanted components pass through the mesh holes of the ball planting net, they enter the mesh holes by their own gravity. After the ball box passes through the mesh area of ​​the ball planting net, the ball-laying action is completed.

2. The electronic packaging device according to claim 1, characterized in that: The ball supply mechanism comprises a ball planting net and a base plate, wherein the base plate is located below the ball planting net, and the points on the base plate where the implant components are arranged overlap with the meshes of the ball planting net to form an implantation site for accommodating the implant components; The downward pressure applied by the pressure assembly acts on the ball planting net, so that the ball planting net is attached to the substrate.

3. The electronic packaging device according to claim 1, characterized in that: The relative movement between the pressure component and the upper surface of the ball-supplied mechanism includes translation and / or rolling.

4. The electronic packaging device according to claim 1, characterized in that: The forced deformation self-resetting component is deformed under the action of external force, and when the external force is reduced or disappears, the shape of the forced deformation self-resetting component is automatically restored.

5. The electronic packaging device according to claim 1, characterized in that: The ball outlet of the ball supply component is provided with elastic baffles at both the front and rear sides along the translation direction of the ball supply component, and the elastic baffles are in contact with the upper surface of the ball planting net.

6. The electronic packaging device according to claim 1, characterized in that: Also includes: An air supply system, wherein the air supply system is configured such that the air outlet extends in a direction close to the ball outlet of the ball supply assembly, and the orifice of the air outlet faces directly below the ball outlet of the ball supply assembly; And / or, a vibration system, which acts on the ball supply assembly.

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