Clamping device and cleaning equipment

Abstract

The invention discloses a clamping device and cleaning equipment, and belongs to the technical field of wafer transmission. The clamping device comprises a base plate, a driving mechanism, a sliding seat, a transmission assembly and a clamping assembly, the driving mechanism is arranged on the base plate, and the driving mechanism is connected with the sliding seat so as to drive the sliding seat to move relative to the base plate; a first end of the clamping assembly is rotatably arranged on the substrate, and a second end of the clamping assembly is used for clamping a wafer; the sliding base is provided with a first slope and a second slope which are connected, the slope of the first slope is smaller than that of the second slope, one end of the transmission assembly can make contact with the first slope and the second slope, and the other end of the transmission assembly is connected with the first end of the clamping assembly. And in the moving process of the sliding seat, one end of the transmission assembly can be in contact with one of the first inclined surface and the second inclined surface and then in contact with the other one of the first inclined surface and the second inclined surface, so that the transmission assembly drives the second end of the clamping assembly to be far away from or close to the wafer.

Description

Technical Field

[0001] The present application belongs to the field of wafer transmission technology, and specifically relates to a clamping device and a cleaning device. Background Art

[0002] In semiconductor processing, cleaning equipment is usually used to remove organic matter, natural oxide layer, particles, metal ions and other contaminants in wafers. During the cleaning process, the clamping device of the cleaning equipment usually clamps the wafer and moves it, places the wafer on the carrier, and then uses the transmission device to transfer the carrier to the cleaning tank of the cleaning equipment. At this time, the wafer on the carrier can be cleaned. After the wafer is cleaned, the transmission device is used to transfer the carrier out of the cleaning tank, and the clamping device is used to clamp the cleaned wafer on the carrier for subsequent processing of the wafer.

[0003] Specifically, during the process of clamping or placing the wafer, in order to avoid the clamping device damaging the wafer and to ensure that the clamping device can move smoothly, the two relatively arranged clamping parts of the clamping device are always at a uniform and slower speed of clamping or placing the wafer, which easily leads to low efficiency of the clamping device in clamping or placing the wafer.

[0004] In summary, the clamping device involved in the related art has the problem of low efficiency in clamping or placing wafers. Summary of the invention

[0005] The present application discloses a clamping device and a cleaning device to solve the problem of low efficiency in clamping or placing wafers in the clamping device involved in the related art.

[0006] In order to solve the above technical problems, this application adopts the following technical solutions:

[0007] A clamping device comprises a base plate, a driving mechanism, a sliding seat, a transmission assembly and a clamping assembly.

[0008] The driving mechanism is disposed on the substrate, and the driving mechanism is connected to the sliding seat to drive the sliding seat to move relative to the substrate;

[0009] The first end of the clamping assembly is rotatably disposed on the substrate, and the second end of the clamping assembly is used to clamp the wafer;

[0010] The sliding seat has a first inclined surface and a second inclined surface connected to each other, the inclination of the first inclined surface is smaller than the inclination of the second inclined surface, one end of the transmission component can contact the first inclined surface and the second inclined surface, and the other end of the transmission component is connected to the first end of the clamping component;

[0011] During the movement of the sliding seat, one end of the transmission component may first contact one of the first inclined surface and the second inclined surface, and then contact the other of the first inclined surface and the second inclined surface, so that the transmission component drives the second end of the clamping component away from or close to the wafer.

[0012] A cleaning device comprises a cleaning tank, a carrying device, a transmission device and the clamping device mentioned above, wherein the carrying device is used to carry the wafer, the transmission device can be movably arranged in the cleaning tank, the transmission device is connected to the carrying device to drive the carrying device to move into or out of the cleaning tank, the clamping device is used to clamp the wafer on the carrying device, or the clamping device is used to place the wafer on the carrying device.

[0013] The technical solution adopted in this application can achieve the following beneficial effects:

[0014] In the present application, in the process that the driving mechanism drives the sliding seat to move relative to the substrate, the sliding seat can drive the second end of the clamping assembly to place and move away from the wafer or approach and clamp the wafer through the transmission assembly. In the process that the second end of the clamping assembly approaches the wafer and clamps the wafer, the transmission assembly first contacts the second inclined plane with a larger slope. At this time, the speed at which the second end of the clamping assembly approaches the wafer is faster. When the transmission assembly contacts the first inclined plane with a smaller slope, the speed at which the second end of the clamping assembly approaches the wafer decreases. In the process that the second end of the clamping assembly places the wafer and moves away from the wafer, the transmission assembly first contacts the first inclined plane with a smaller slope. At this time, the second end of the clamping assembly slowly moves away from the wafer. When the transmission assembly contacts the second inclined plane with a larger slope, the second end of the clamping assembly will quickly move away from the wafer. It can be seen that the clamping assembly adopts a variable speed mode to clamp or place the wafer, which makes the clamping assembly clamp or place the wafer with a higher efficiency. Therefore, the clamping device disclosed in the present application can solve the problem that the clamping device involved in the related art has a low efficiency in clamping or placing the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the clamping device disclosed in the embodiment of the present application;

[0016] Figure 2 It is a schematic diagram of the structure of the sliding seat, the transmission assembly and the clamping assembly disclosed in the embodiment of the present application;

[0017] Figure 3 It is a schematic diagram of the structure of the sliding seat disclosed in the embodiment of the present application;

[0018] Figure 4 A schematic diagram of a partial structure of a cleaning device disclosed in an embodiment of the present application;

[0019] Figure 5 A schematic diagram of the structure of a transmission assembly disclosed in an embodiment of the present application;

[0020] Figure 6 It is a schematic cross-sectional structural diagram of the transmission assembly disclosed in the embodiment of the present application.

[0021] Description of reference numerals:

[0022] 100-substrate;

[0023] 200-driving mechanism;

[0024] 300 - sliding seat, 310 - first inclined surface, 320 - second inclined surface, 330 - sliding channel, 331 - bottom wall, 332 - side wall, 333 - top wall, 340 - first plane, 350 - second plane;

[0025] 400-transmission assembly, 410-rolling member, 411-first rotating part, 412-second rotating part, 413-first rolling member, 414-second rolling member, 420-connecting member, 421-first connecting member, 422-second connecting member, 430-threaded connecting member;

[0026] 500-clamping assembly, 510-clamping member, 511-first clamping member, 512-second clamping member, 513-clamping frame, 514-adapter plate, 520-rotating rod, 521-first rotating rod, 522-second rotating rod, 530-limiter;

[0027] 610-wafer, 620-carrying device;

[0028] 710-pressing plate, 720-elastic member, 730-guide pin shaft, 740-limiting member;

[0029] 810 - first adjusting member, 820 - second adjusting member, 830 - third adjusting member, 840 - first buffer, 850 - second buffer, 860 - first sensor, 870 - second sensor;

[0030] 910-bearing seat, 920-bearing, 930-bearing stopper, 940-bearing lock nut, 950-first threaded connector, 960-second threaded connector. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] The clamping device disclosed in the embodiment of the present application is described in detail below through specific embodiments and application scenarios in conjunction with the accompanying drawings.

[0033] Please refer to Figure 1-Figure 6 The present application discloses a clamping device, which includes a substrate 100, a driving mechanism 200, a sliding seat 300, a transmission assembly 400 and a clamping assembly 500.

[0034] The clamping device disclosed in the present application can be applied to the cleaning equipment described later. Specifically, the cleaning equipment includes a cleaning tank, a carrying device 620 and a transmission device. The cleaning tank is used to clean the wafer 610, and the carrying device 620 is used to carry the wafer 610. The transmission device can be movably arranged in the cleaning tank, and the transmission device is connected to the carrying device 620 to drive the carrying device 620 to move into the cleaning tank so that the cleaning liquid in the cleaning tank can clean the wafer 610 carried on the carrying device 620, or drive the carrying device 620 to move out of the cleaning tank so as to transport the cleaned wafer 610 out of the cleaning tank. The clamping device can clamp the cleaned wafer 610 on the carrying device 620, or the clamping device can place the wafer 610 to be cleaned on the carrying device 620.

[0035] The base plate 100 is a basic component of the clamping device, which can provide a mounting base for other components of the clamping device, such as providing a mounting base for the drive mechanism 200, the sliding seat 300, the transmission assembly 400 and the clamping assembly 500. Specifically, the drive mechanism 200 is arranged on the base plate 100, and the drive mechanism 200 is connected to the sliding seat 300 to drive the sliding seat 300 to move relative to the base plate 100. Optionally, the drive mechanism 200 can be a linear guide cylinder or a combination of a motor and a guide rail, and the drive mechanism 200 can drive the sliding seat 300 to perform reciprocating linear motion on the guide rail of the drive mechanism 200 relative to the base plate 100, that is, the guide rail can constrain the movement path of the sliding seat 300.

[0036] The first end of the clamping assembly 500 is rotatably disposed on the substrate 100 , and the second end of the clamping assembly 500 is used to clamp the wafer 610 . During the rotation of the clamping assembly 500 , the second end of the clamping assembly 500 can approach and clamp the wafer 610 or move away from and place the wafer 610 .

[0037] Please refer to Figure 2 and Figure 3 The sliding seat 300 has a first inclined surface 310 and a second inclined surface 320 connected to each other, and the slope of the first inclined surface 310 is smaller than that of the second inclined surface 320, that is, the slope of the first inclined surface 310 is smaller and gentler, and the slope of the second inclined surface 320 is larger and steeper. One end of the transmission component 400 can contact the first inclined surface 310 and the second inclined surface 320, and the other end of the transmission component 400 is connected to the first end of the clamping component 500; in the process of the driving mechanism 200 driving the sliding seat 300 to move relative to the substrate 100, one end of the transmission component 400 can first contact one of the first inclined surface 310 and the second inclined surface 320, and then contact the other of the first inclined surface 310 and the second inclined surface 320, so that the transmission component 400 drives the second end of the clamping component 500 away from or close to the wafer 610.

[0038] Specifically, the clamping assembly 500 may have a first side and a second side, and the transmission assembly 400 may be located on the first side or the second side of the clamping assembly 500. The first side here may specifically be the side of the first rotating rod 521 described later facing the second rotating rod 522, and the second side may specifically be the side of the first rotating rod 521 away from the second rotating rod 522 or the side of the second rotating rod 522 away from the first rotating rod 521.

[0039] When the transmission component 400 is located on the first side of the clamping component 500, in the height direction of the sliding seat 300, the height of the first inclined surface 310 can be greater than the height of the second inclined surface 320. At this time, when one end of the transmission component 400 first contacts the first inclined surface 310 and then contacts the second inclined surface 320, the transmission component 400 can drive the second end of the clamping component 500 away from the wafer 610. When one end of the transmission component 400 first contacts the second inclined surface 320 and then contacts the first inclined surface 310, the transmission component 400 can drive the second end of the clamping component 500 close to the wafer 610.

[0040] When the transmission assembly 400 is located at the second side of the clamping assembly 500, in the height direction of the sliding seat 300, the height of the first inclined surface 310 can be less than the height of the second inclined surface 320. At this time, the number of transmission assemblies 400 can be at least two, including a first transmission assembly and a second transmission assembly. The first transmission assembly can be located on the side of the first rotating rod 521 away from the second rotating rod 522 and connected to the first rotating rod 521. The second transmission assembly can be located on the side of the second rotating rod 522 away from the first rotating rod 521 and connected to the second rotating rod 522. That is, the first rotating rod 521 and the second rotating rod 522 are driven by different transmission assemblies 400. Correspondingly, the number of driving mechanisms 200 and the number of sliding seats 300 can also be at least two. Each driving mechanism 200, each sliding seat 300 and each transmission assembly 400 corresponds to each other one by one and can work synchronously, thereby driving the first rotating rod 521 and the second rotating rod 522 to rotate synchronously. When one end of the transmission component 400 first contacts the first inclined surface 310 and then contacts the second inclined surface 320, the transmission component 400 can drive the second end of the clamping component 500 away from the wafer 610. When one end of the transmission component 400 first contacts the second inclined surface 320 and then contacts the first inclined surface 310, the transmission component 400 can drive the second end of the clamping component 500 close to the wafer 610.

[0041] For the above two situations, the specific analysis is as follows: when the transmission assembly 400 is located on the first side of the clamping assembly 500, that is, taking the height of the first inclined surface 310 as greater than the height of the second inclined surface 320, and the second end of the clamping assembly 500 as an example for placing the wafer 610 on the carrier 620, one end of the transmission assembly 400 may first contact the first inclined surface 310 and then contact the second inclined surface 320, and at one end of the transmission assembly 400, the starting point of the first inclined surface 310 (the starting point is the first inclined surface 310 away from the second inclined surface 320) is formed. In the process of moving from one end of the first inclined surface 310 to the end point of the first inclined surface 310 (the end point is the end of the first inclined surface 310 close to the second inclined surface 320, and the end point can also be understood as the starting point of the second inclined surface 320), one end of the transmission assembly 400 is always in a descending state, that is, the transmission assembly 400 is always in a downward swinging state, so that the other end of the transmission assembly 400 can drive the clamping assembly 500 to rotate, that is, drive the second end of the clamping assembly 500 to rotate away from the wafer 610 to ensure the placement stability of the wafer 610. And because the slope of the first inclined surface 310 is small, that is, the first inclined surface 310 is relatively gentle, therefore, the descending speed of one end of the transmission assembly 400 on the first inclined surface 310 is slow, that is, one end of the transmission assembly 400 can move slowly on the first inclined surface 310, and then the clamping assembly 500 can rotate smoothly and slowly, and then the second end of the clamping assembly 500 can slowly move away from the wafer 610, so that there is a certain safety distance between the second end of the clamping assembly 500 and the wafer 610.

[0042] Subsequently, in the process of one end of the transmission component 400 moving from the end point of the first slope 310 to the end point of the second slope 320 (the end point is the end of the second slope 320 away from the first slope 310), one end of the transmission component 400 is still in a descending state, that is, the transmission component 400 is still in a downward swinging state, which allows the transmission component 400 to continue to drive the clamping component 500 to rotate so that its second end is away from the wafer 610, and because the slope of the second slope 320 is larger, that is, the second slope 320 is steeper, therefore, the descending speed of one end of the transmission component 400 on the second slope 320 is faster, that is, one end of the transmission component 400 can move quickly on the second slope 320, and then the second end of the clamping component 500 can quickly move away from the wafer 610, thereby completing the operation of quickly placing the wafer 610.

[0043] Taking the case where the height of the first inclined surface 310 is greater than the height of the second inclined surface 320, and the second end of the clamping assembly 500 is used to clamp the wafer 610 placed on the carrier 620 as an example, one end of the transmission assembly 400 may first contact the second inclined surface 320, and then contact the first inclined surface 310. In the process of one end of the transmission assembly 400 moving from the end point of the second inclined surface 320 to the starting point of the second inclined surface 320 (or the end point of the first inclined surface 310), one end of the transmission assembly 400 is always in an ascending state, that is, the transmission assembly 400 is always in an upward swinging state, which enables the other end of the transmission assembly 400 to drive the clamping assembly 500 to rotate, that is, drive the second end of the clamping assembly 500 to rotate to gradually approach the wafer 610. And because the slope of the second slope 320 is large, that is, the second slope 320 is steeper, therefore, one end of the transmission component 400 rises faster on the second slope 320, that is, one end of the transmission component 400 can move quickly on the second slope 320, and then the second end of the clamping component 500 approaches the wafer 610 faster. When one end of the transmission component 400 moves to the starting point of the second slope 320, there is a certain safety distance between the second end of the clamping component 500 and the wafer 610.

[0044] Subsequently, in the process of one end of the transmission component 400 moving from the starting point of the second inclined surface 320 (or the end point of the first inclined surface 310) to the starting point of the first inclined surface 310, one end of the transmission component 400 is still in an ascending state, that is, the transmission component 400 is still in an upward swinging state, which allows the transmission component 400 to continue to drive the clamping component 500 to rotate so that its second end is close to the wafer 610, and because the slope of the first inclined surface 310 is small, that is, the first inclined surface 310 is relatively flat, therefore, the rising speed of one end of the transmission component 400 on the first inclined surface 310 is slow, that is, one end of the transmission component 400 can move slowly on the first inclined surface 310, and then the second end of the clamping component 500 can slowly approach the wafer 610 to avoid the fast-moving clamping component 500 from colliding with and damaging the wafer 610, that is, the second end of the slowly moving clamping component 500 can stably clamp the wafer 610.

[0045] Similarly, when the transmission component 400 is located on the second side of the clamping component 500, that is, taking the height of the first slope 310 as less than the height of the second slope 320, and the second end of the clamping component 500 is used to place the wafer 610 on the supporting device 620 as an example, one end of the transmission component 400 can first contact the first slope 310 and then contact the second slope 320. During this movement, one end of the transmission component 400 is always in an ascending state, and the transmission component 400 can drive the second end of the clamping component 500 to first slowly move away from the wafer 610 and then quickly move away from the wafer 610. Correspondingly, taking the example in which the height of the first slope 310 is smaller than the height of the second slope 320, and the second end of the clamping assembly 500 is used to clamp the wafer 610 placed on the supporting device 620, in the process in which one end of the transmission assembly 400 first contacts the second slope 320 and then contacts the first slope 310, one end of the transmission assembly 400 is always in a descending state, and the transmission assembly 400 can drive the second end of the clamping assembly 500 to first quickly approach the wafer 610 and then slowly approach the wafer 610.

[0046] It can be seen that no matter which side of the clamping assembly 500 the transmission assembly 400 is located on, as long as the second end of the clamping assembly 500 is in the process of clamping the wafer 610, that is, in the process of approaching the wafer 610, the clamping assembly 500, under the action of the transmission assembly 400, will first quickly approach the wafer 610, then slowly approach the wafer 610, and clamp the wafer 610. At the same time, as long as the second end of the clamping assembly 500 is in the process of placing the wafer 610, that is, in the process of moving away from the wafer 610, the clamping assembly 500, under the action of the transmission assembly 400, will first slowly move away from the wafer 610, and then quickly move away from the wafer 610. That is to say, by differentially designing the inclinations of the first slope 310 and the second slope 320, the following effects can be achieved: when the distance between the second end of the clamping assembly 500 and the wafer 610 is less than or equal to a preset distance, the movement speed of the second end of the clamping assembly 500 is less than or equal to a preset speed; when the distance between the second end of the clamping assembly 500 and the wafer 610 is greater than the preset distance, the movement speed of the second end of the clamping assembly 500 is greater than the preset speed.

[0047] In addition, since the guide rails can constrain the movement path of the sliding seat 300, the sliding seat 300 can constrain the transmission assembly 400, and the transmission assembly 400 can constrain the clamping assembly 500, which makes the clamping assembly 500 more precise in clamping the wafer 610 each time.

[0048] In the present application, when the driving mechanism 200 drives the sliding seat 300 to move relative to the substrate 100, the sliding seat 300 can drive the second end of the clamping assembly 500 to be placed away from the wafer 610 or to be close to and clamp the wafer 610 through the transmission assembly 400. When the second end of the clamping assembly 500 is close to the wafer 610 and clamps the wafer 610, the transmission assembly 400 first contacts the second inclined surface 320 with a larger slope. At this time, the speed at which the second end of the clamping assembly 500 approaches the wafer 610 is faster. When the driving assembly 400 contacts the first inclined surface 310 with a smaller slope, the speed at which the second end of the clamping assembly 500 approaches the wafer 610 becomes smaller. In the process of placing the wafer 610 and moving away from the wafer 610 at the second end of the clamping assembly 500, the driving assembly 400 first contacts the first inclined surface 310 with a smaller slope. At this time, the second end of the clamping assembly 500 slowly moves away from the wafer 610. When the driving assembly 400 contacts the second inclined surface 320 with a larger slope, the second end of the clamping assembly 500 will quickly move away from the wafer 610. It can be seen that the clamping assembly 500 adopts a variable speed method to clamp or place the wafer 610, which makes the clamping assembly 500 more efficient in clamping or placing the wafer 610. Therefore, the clamping device disclosed in the present application can solve the problem of low efficiency in clamping or placing the wafer 610 in the clamping device involved in the related art.

[0049] In addition, after the wafer 610 carried by the carrier device 620 is cleaned by the cleaning liquid in the cleaning tank, the transmission device can transmit the carrier device 620 to the outside of the cleaning tank. At this time, the cleaned wafer 610 will be exposed to the air. Since the clamping device is more efficient in clamping or placing the wafer 610, the interaction time between the clamping device and the carrier device 620 carrying the wafer 610 will be greatly reduced, that is, the clamping device can quickly clamp the cleaned wafer 610 on the carrier device 620 for quick transmission to the next production process. It can be seen that this can reduce the exposure time of the wafer 610 to the air, thereby improving the production yield of the wafer 610.

[0050] Optionally, the sliding seat 300 is provided with a sliding channel 330, the outer wall of the sliding seat 300 is connected to the driving mechanism 200, the bottom wall 331 of the sliding channel 330, that is, the inner bottom wall of the sliding seat 300 has a first inclined surface 310 and a second inclined surface 320, and at least part of the transmission assembly 400 is located in the sliding channel 330. At this time, the sliding seat 300 can protect at least part of the transmission assembly 400, and during the movement of the sliding seat 300, the transmission assembly 400 can be limited by the side wall 332 of the sliding channel 330, that is, the side wall 332 of the sliding channel 330 can limit the transmission assembly 400 from sliding out of the sliding seat 300, thereby avoiding the occurrence of one end of the transmission assembly 400 falling off, causing the transmission assembly 400 to drive the clamping assembly 500 that is clamping the wafer 610 to accidentally open, that is, avoiding the phenomenon of the wafer 610 falling off.

[0051] Of course, the sliding seat 300 may not be provided with the sliding channel 330. In this case, the first inclined surface 310 and the second inclined surface 320 may both be the outer surface of the sliding seat 300. In order to avoid the wafer 610 from accidentally falling off, the present application can accurately control the moving distance of the sliding seat 300 relative to the substrate 100 through the driving mechanism 200. For example, the driving mechanism 200 can switch between the initial state and the full stroke state to drive the sliding seat 300 to move the same distance each time, so that one end of the transmission assembly 400 is not easy to fall off the sliding seat 300. In addition, this setting method can also accurately control the opening and closing angle of the clamping assembly 500, that is, the opening and closing of the clamping assembly 500 is smoother and the error rate is lower.

[0052] Optionally, refer to Figure 2The clamping device may further include a clamping assembly, which may be movably disposed on the top wall 333 of the sliding channel 330. The clamping assembly may squeeze the transmission assembly 400 so that one end of the transmission assembly 400 is in more stable contact with the first inclined surface 310 and the second inclined surface 320, and the transmission assembly 400 may stably drive the second end of the clamping assembly 500 away from or close to the wafer 610, that is, eliminate the movement gap, so that the opening and closing action of the clamping assembly 500 is more stable. Of course, the clamping device may not include a clamping assembly.

[0053] Optionally, the clamping assembly may include a clamping plate 710 and a motor, the clamping plate 710 may squeeze the transmission assembly 400 , the motor is disposed between the top wall 333 of the sliding channel 330 and the clamping plate 710 , and the motor may drive the clamping plate 710 to squeeze the transmission assembly 400 .

[0054] In another embodiment, the clamping assembly may include a clamping plate 710 and an elastic member 720, wherein the elastic member 720 is disposed between the top wall 333 of the sliding channel 330 and the clamping plate 710, that is, the elastic member 720 is always in a compressed state, and in the process that one end of the transmission assembly 400 contacts the first inclined surface 310 and the second inclined surface 320, the height of one end of the transmission assembly 400 on the sliding seat 300 changes continuously, and therefore, the extrusion force applied by the clamping plate 710 to the transmission assembly 400 also needs to change continuously, and the elastic member 720 can flexibly, continuously and smoothly apply the extrusion force to the clamping plate 710, and thus the clamping plate 710 can continuously and smoothly apply the extrusion force to the transmission assembly 400. In addition, since the elastic member 720 is always in a compressed state, the service life of the elastic member 720 is longer, and the structure of the compressed elastic member 720 is more delicate and compact, and thus the elastic member 720 occupies less space.

[0055] Optionally, the clamping assembly may further include a guide pin 730, one end of which is connected to the clamping plate 710, and the other end of which is slidably matched with the sliding seat 300. The elastic member 720 is sleeved outside the guide pin 730, and one end of the elastic member 720 abuts against the top wall 333 of the sliding channel 330, and the other end of the elastic member 720 abuts against the clamping plate 710. In addition to being used to install the clamping plate 710 and the elastic member 720, the guide pin 730 also has a certain limiting effect on the elastic member 720, so that the elastic member 720 can apply a squeezing force to the clamping plate 710 more continuously and smoothly. Of course, the clamping assembly may also not include the guide pin 730.

[0056] Optionally, the end of the guide pin 730 can pass through the sliding seat 300, that is, part of the structure of the guide pin 730 can be located outside the sliding seat 300. In order to prevent the guide pin 730 from falling off the sliding seat 300, that is, to prevent the guide pin 730 from completely sliding into the sliding channel 330, the clamping assembly can also include a limiter 740, which is clamped at the end of the guide pin 730, that is, the part of the guide pin 730 located outside the sliding seat 300. During the process of restoring the elastic deformation, the elastic member 720 squeezes the clamping plate 710 so that the clamping plate 710 drives the portion of the guide pin shaft 730 located outside the sliding seat 300 to slide into the sliding channel 330. When the limiting member 740 contacts the outer wall of the sliding seat 300, the limiting member 740 cooperates with the outer wall of the sliding seat 300, that is, the limiting member 740 can prevent the guide pin shaft 730 from continuing to slide into the sliding channel 330, so as to prevent the guide pin shaft 730 from falling off the sliding seat 300.

[0057] Optionally, the number of elastic members 720 can be at least two, and correspondingly, the number of guide pin shafts 730 and the number of limit members 740 can both be at least two, each elastic member 720 corresponds to each guide pin shaft 730 one-to-one, each limit member 740 corresponds to each guide pin shaft 730 one-to-one, and each guide pin shaft 730 is arranged at intervals on the clamping plate 710. Each elastic member 720 can apply extrusion pressure to the clamping plate 710 at different locations of the clamping plate 710, so that each location of the clamping plate 710 can continuously and smoothly apply extrusion pressure to the transmission assembly 400.

[0058] Optionally, refer to Figure 1 The clamping assembly 500 may include a clamping member 510 and a rotating rod 520, one end of the rotating rod 520 is rotatably disposed on the substrate 100, and the other end of the rotating rod 520 is connected to the clamping member 510, and the clamping member 510 is used to clamp the wafer 610. The transmission assembly 400 may be specifically connected to the other end of the rotating rod 520.

[0059] In this embodiment, please refer to Figure 1 , Figure 5 and Figure 6The transmission assembly 400 may include a rolling element 410 and a connecting element 420. The rolling element 410 includes a first rotating portion 411 and a second rotating portion 412 that are rotatably connected, that is, the first rotating portion 411 and the second rotating portion 412 can rotate relative to each other. Optionally, the rolling element 410 may be a component similar to a bearing structure, the first rotating portion 411 may be an outer ring of the bearing structure, and the second rotating portion 412 may be an inner ring of the bearing structure. The first rotating part 411 can roll relative to the first inclined surface 310 and the second inclined surface 320, and the second rotating part 412 is connected to the rotating rod 520 through the connecting member 420, that is, the connecting member 420 connects the second rotating part 412 and the rotating rod 520, and the connecting member 420 can drive the rotating rod 520 to rotate by swinging, and the first rotating part 411 has a spherical rolling surface. After being set in this way, no matter what angle the connecting member 420 swings to, the first rotating part 411 and the first inclined surface 310 and the second inclined surface 320 can maintain a large contact area to ensure the rolling stability of the first rotating part 411, and then ensure the swinging stability of the connecting member 420.

[0060] Optionally, the connecting member 420 and the rotating rod 520 can be fixedly connected, and the connecting member 420 and the second rotating part 412 can be fixedly connected by a threaded connecting member 430. At this time, the rolling member 410 can drive one end of the connecting member 420 connected thereto to rise or fall, that is, the connecting member 420 can swing, and the swinging connecting member 420 can drive the rotating rod 520 to rotate. At the same time, the rotating rotating rod 520 can drive the clamping member 510 to approach and clamp the wafer 610, or move away from and place the wafer 610.

[0061] In this embodiment, the rotation axis of the first rotating part 411 relative to the second rotating part 412 is parallel to the rolling axis of the first rotating part 411 relative to the first inclined surface 310 and the second inclined surface 320, that is, when the driving mechanism 200 drives the sliding seat 300 to move relative to the substrate 100, the first rotating part 411 will rotate around the second rotating part 412, at this time, the first rotating part 411 has a rotation axis, and at the same time, the first rotating part 411 will roll along the first inclined surface 310 and the second inclined surface 320, at this time, the first rotating part 411 has a rolling axis, and the rotation axis is parallel to the rolling axis. That is, at this time, during the movement of the sliding seat 300, the first rotating part 411 can roll on the first inclined surface 310 and the second inclined surface 320, and the friction resistance generated between the rolling first rotating part 411 and the first inclined surface 310 and the second inclined surface 320 is small, so that the transmission assembly 400 can more easily drive the clamping member 510 away from or close to the wafer 610. Of course, the first rotating portion 411 can slide relative to the first inclined surface 310 and the second inclined surface 320 .

[0062] Optionally, refer to Figure 1The clamping member 510 may include a first clamping member 511 and a second clamping member 512 disposed at intervals, and the rotating rod 520 may include a first rotating rod 521 and a second rotating rod 522 disposed at intervals, one end of the first rotating rod 521 and one end of the second rotating rod 522 may be rotatably disposed on the substrate 100, and the first rotating rod 521 and the second rotating rod 522 rotate in opposite directions, the other end of the first rotating rod 521 is connected to the first clamping member 511, and the other end of the second rotating rod 522 is connected to the second clamping member 512, and the first clamping member 511 and the second clamping member 512 work together to clamp the wafer 610. During the rotation of the first rotating rod 521 and the second rotating rod 522, the first clamping member 511 and the second clamping member 512 will approach each other to clamp the wafer 610, or the first clamping member 511 and the second clamping member 512 will move away from each other to place the wafer 610.

[0063] In this embodiment, please refer to Figure 1 , Figure 5 and Figure 6 The number of the connecting members 420 may be at least two, including a first connecting member 421 and a second connecting member 422. The number of the rolling members 410 may also be at least two, including a first rolling member 413 and a second rolling member 414 arranged at intervals. The first connecting member 421 and the second connecting member 422 are symmetrically arranged on opposite sides of the rolling member 410, and one end of the first connecting member 421 is connected to the second rotating portion 412 of the first rolling member 413, and one end of the second connecting member 422 is connected to the second rotating portion 412 of the second rolling member 414, that is, the first connecting member 421 and the second connecting member 422 are symmetrically arranged on opposite sides of the two second rotating portions 412. When the first rotating part 411 rotates relative to the second rotating part 412 and the first rotating part 411 rolls along the first inclined surface 310 and the second inclined surface 320, different first rotating parts 411 drive one end of the corresponding connecting member 420 to rise or fall through the corresponding second rotating part 412, thereby driving the corresponding connecting member 420 to swing. Since the other end of the first connecting member 421 is connected to the first rotating rod 521 and the other end of the second connecting member 422 is connected to the second rotating rod 522, the swinging first connecting member 421 can drive the first rotating rod 521 to rotate, and the swinging second connecting member 422 can drive the second rotating rod 522 to rotate.

[0064] It can be seen that the first rotating rod 521 and the first clamping member 511 and the second rotating rod 522 and the second clamping member 512 are respectively arranged on opposite sides of the driving mechanism 200, that is, the first rotating rod 521 and the first clamping member 511 and the second rotating rod 522 and the second clamping member 512 are symmetrically arranged. In addition, the first rotating rod 521 and the first clamping member 511 and the second rotating rod 522 and the second clamping member 512 are connected to the same driving mechanism 200 and the transmission assembly 400, which can ensure the rotation consistency of the first rotating rod 521 and the second rotating rod 522, and further ensure the consistency of the opening and closing angles of the first clamping member 511 and the second clamping member 512, and further ensure that the first clamping member 511 and the second clamping member 512 can stably clamp the wafer 610.

[0065] At the same time, during the rolling process of the rolling member 410 relative to the first inclined surface 310 or the second inclined surface 320, that is, when the rolling member 410 rolls along the first inclined surface 310 or the second inclined surface 320, the connecting member 420 will pull the rolling member 410 to move slightly in the direction of the rolling axis of the rolling member 410. Since the two connecting members 420 on different sides of the rolling member 410 drive the rolling member 410 to move in completely opposite directions, the embodiment of the present application arranges at least two rolling members 410 to facilitate the first connecting member 421 to drive the first rolling member 413 and the second connecting member 422 to drive the second rolling member 414 to move in opposite directions, that is, to avoid interference between the first connecting member 421 and the second connecting member 422, thereby avoiding affecting the rotation of the first rotating rod 521 and the second rotating rod 522.

[0066] Of course, one end of the first connecting member 421 and one end of the second connecting member 422 can be connected to the same second rotating part 412, that is, at this time, the number of rolling members 410 can be one, and in the direction of the rolling axis of the rolling member 410, the connecting member 420 can move slightly relative to the second rotating part 412, that is, the first connecting member 421 and the second connecting member 422 can move slightly relative to the same second rotating part 412, and the first connecting member 421 and the second connecting member 422 will not drive the rolling member 410 to move, so as to avoid interference between the first connecting member 421 and the second connecting member 422.

[0067] Optionally, refer to Figure 1In order to ensure that the distance between the two ends of the first rotating rod 521 and the second rotating rod 522 away from the substrate 100 remains unchanged, a limiter 530 can be provided between the end of the first rotating rod 521 and the end of the second rotating rod 522, that is, one end of the limiter 530 can be sleeved in the end of the first rotating rod 521 and rotatably cooperate with the first rotating rod 521, and the other end of the limiter 530 can be sleeved in the end of the second rotating rod 522 and rotatably cooperate with the second rotating rod 522. This can ensure that the distance between the two ends of the first rotating rod 521 and the second rotating rod 522 away from the substrate 100 remains unchanged without affecting the rotation of the first rotating rod 521 and the second rotating rod 522.

[0068] Optionally, the clamping device may further include a first adjusting member 810, and the connecting member 420 is connected to the rotating rod 520 through the first adjusting member 810, so that the position of the connecting member 420 in the circumferential direction of the rotating rod 520 is adjustable. The connecting member 420 may specifically be a connecting clamp, that is, the connecting member 420 is clamped on the rotating rod 520 and fixed by the first adjusting member 810. After the clamping assembly 500 is used for a long time, the initial rotation position of the rotating rod 520 may change, and then the initial position of the clamping member 510 clamping the wafer 610 may change accordingly, which is likely to affect the stability of the clamping member 510 clamping the wafer 610.

[0069] Therefore, the initial rotation position of the clamping assembly 500 can be adjusted by adjusting the position of the connecting member 420 on the circumferential direction of the rotating rod 520, that is, adjusting the connection position of the connecting member 420 and the rotating rod 520, and under the connection action of the second rotating part 412, the connecting member 420 can drive the rotating rod 520 to rotate. Of course, the clamping device may also not include the first adjusting member 810, that is, the position of the connecting member 420 on the circumferential direction of the rotating rod 520 is not adjustable.

[0070] Optionally, the clamping member 510 may only include a clamping frame 513, which is directly connected to the rotating rod 520. The clamping frame 513 is used to clamp the wafer 610, and a clamping groove may be provided on the clamping frame 513, and the wafer 610 may be placed in the clamping groove.

[0071] In another embodiment, the clamping member 510 may further include an adapter plate 514, one end of the clamping frame 513 is used to clamp the wafer 610, and the other end of the clamping frame 513 is connected to the rotating rod 520 through the adapter plate 514. Specifically, the clamping frame 513 and the adapter plate 514 can be detachably connected through the second threaded connector 960, and the adapter plate 514 and the rotating rod 520 can be detachably connected through the first threaded connector 950. When the clamping frame 513 needs to be replaced or repaired, the operator can only remove the clamping frame 513 from the adapter plate 514, and when the clamping frame 513 is subsequently installed, the clamping frame 513 can be directly connected to the adapter plate 514. This arrangement does not require repeated adjustment of the initial angle of the clamping frame 513 relative to the rotating rod 520, that is, it is not necessary to repeatedly adjust the initial angle of the clamping frame 513 to clamp the wafer 610.

[0072] Optionally, the clamping device may further include a second adjusting member 820, which may be movably disposed on the adapter plate 514, and one end of the second adjusting member 820 abuts against the clamping frame 513. During the movement of the second adjusting member 820, the position of the clamping frame 513 in the extension direction of the rotating rod 520 is adjustable, that is, the position of the clamping frame 513 in the length direction of the adapter plate 514 is adjustable. Specifically, when adjusting the position of the clamping frame 513 in the length direction of the adapter plate 514, the second threaded connector 960 is first loosened to facilitate adjustment of the position of the clamping frame 513 in the length direction of the adapter plate 514. The embodiment of the present application can adapt to the adjustment of the position of the clamping frame 513 initially clamping the wafer 610 by adjusting the position of the clamping frame 513 in the extension direction of the rotating rod 520. Of course, the clamping device may also not include the second adjusting member 820.

[0073] Optionally, the second adjusting member 820 may specifically be a first threaded adjusting member. Since one end of the second adjusting member 820 abuts against the clamping frame 513, the position of the clamping frame 513 in the length direction of the adapter plate 514 can be adjusted by adjusting the length of the first threaded adjusting member extending out of the adapter plate 514. Optionally, there may be at least two second adjusting members 820, each of which is disposed on both sides of the adapter plate 514, that is, one end of each second adjusting member 820 abuts against different sides of the clamping frame 513, so that each second adjusting member 820 can adjust the position of the clamping frame 513 on the adapter plate 514 in two opposite directions.

[0074] Optionally, the clamping device may further include a third adjusting member 830, which may be movably disposed on the adapter plate 514, and one end of the third adjusting member 830 abuts against the clamping frame 513. During the movement of the third adjusting member 830, the position of the clamping frame 513 in the height direction of the adapter plate 514 is adjustable, that is, the third adjusting member 830 may change the position of the clamping frame 513 in the height direction of the adapter plate 514.

[0075] When specifically adjusting the position of the clamping frame 513 in the height direction of the adapter plate 514, it is necessary to first loosen the second threaded connector 960 to facilitate adjusting the position of the clamping frame 513 in the height direction of the adapter plate 514. The embodiment of the present application can adapt to adjusting the height of the initial clamping wafer 610 of the clamping frame 513 by adjusting the position of the clamping frame 513 in the height direction of the adapter plate 514. Of course, the clamping device may also not include the third adjusting member 830. In addition, according to the above content, it can be seen that the third adjusting member 830 and the second adjusting member 820 can adjust the position of the clamping frame 513 in two perpendicular directions, which allows the clamping frame 513 to clamp the wafer 610 more accurately.

[0076] Optionally, the third adjusting member 830 may specifically be a second threaded adjusting member. Since one end of the third adjusting member 830 is in contact with the clamping frame 513, the position of the clamping frame 513 in the height direction of the adapter plate 514 can be adjusted by adjusting the length of the second threaded adjusting member extending out of the adapter plate 514. Optionally, there may be at least two third adjusting members 830, each of which is arranged at intervals on the same side of the adapter plate 514. By adjusting the length of each second threaded adjusting member extending out of the adapter plate 514, the horizontality of the clamping frame 513 can be ensured. Optionally, please refer to Figure 2 and Figure 3 The sliding seat 300 also has a first plane 340 and a second plane 350. The first plane 340, the first inclined surface 310, the second inclined surface 320 and the second plane 350 are connected in sequence, and in the height direction of the sliding seat 300, the height of the first plane 340 is greater than the height of the second plane 350. During the movement of the sliding seat 300, one end of the transmission assembly 400 can contact the first plane 340, the first inclined surface 310, the second inclined surface 320 and the second plane 350 in sequence, or can contact the second plane 350, the second inclined surface 320, the first inclined surface 310 and the first plane 340 in sequence.

[0077] Optionally, the clamping device may further include a first buffer 840 and a second buffer 850 disposed at intervals on the substrate 100, the first buffer 840 and the second buffer 850 are disposed sequentially in the moving direction of the sliding seat 300, and the first buffer 840 and the second buffer 850 are located on opposite sides of the sliding seat 300, and during the movement of the sliding seat 300, the sliding seat 300 may cooperate with the first buffer 840 or the second buffer 850 to limit the position, that is, the first buffer 840 and the second buffer 850 may protect the sliding seat 300 by buffering the movement of the sliding seat 300, and at the same time, the first buffer 840 and the second buffer 850 also have a limiting function for the sliding seat 300. Of course, the clamping device may also not include the first buffer 840 and the second buffer 850.

[0078] Optionally, the height of the first buffer 840 and the height of the second buffer 850 are both adjustable, and the height is the dimension of the first buffer 840 and the second buffer 850 in the height direction of the sliding seat 300, and by adjusting the height of the first buffer 840 and the height of the second buffer 850, the contact area between the sliding seat 300 and the first buffer 840 and the second buffer 850 can be changed, thereby further improving the buffering effect and limiting effect on the sliding seat 300.

[0079] Optionally, the clamping device may also include a first sensor 860 and a second sensor 870 which are arranged at intervals on the substrate 100, and the first sensor 860 and the second sensor 870 are arranged in sequence in the moving direction of the sliding seat 300, and the first sensor 860 and the second sensor 870 are located on opposite sides of the sliding seat 300. During the movement of the sliding seat 300, the sliding seat 300 may contact the first sensor 860 or the second sensor 870.

[0080] When the sliding seat 300 contacts the first sensor 860, the first sensor 860 is triggered, which means that the clamping assembly 500 clamps the wafer 610 in place. When the next operation is performed, the driving mechanism 200 drives the sliding seat 300 to move in the reverse direction. When the sliding seat 300 contacts the second sensor 870, the second sensor 870 is triggered, which means that the clamping assembly 500 places the wafer 610 in place, that is, the first sensor 860 and the second sensor 870 can be used to determine whether the clamping assembly 500 clamps or places the wafer 610 in place. Of course, the clamping device may also not include the first sensor 860 and the second sensor 870.

[0081] Optionally, the clamping device may further include a fourth adjusting member, and the first sensor 860 and the second sensor 870 are both arranged on the substrate 100 through the fourth adjusting member, and the first sensor 860 and the second sensor 870 are both movably arranged on the fourth adjusting member, so that the positions of the first sensor 860 and the second sensor 870 on the substrate 100 are both adjustable, and by adjusting the positions of the first sensor 860 and the second sensor 870, the opening and closing angles of the clamping assembly 500 can be calibrated, so as to accurately determine whether the clamping assembly 500 clamps or places the wafer 610 in place. At the same time, the first sensor 860 and the second sensor 870 in the embodiment of the present application are both used for linear motion detection of the sliding seat 300, so when adjusting the positions of the first sensor 860 and the second sensor 870, the adjustment is easier. Of course, the positions of the first sensor 860 and the second sensor 870 on the substrate 100 may also be non-adjustable.

[0082] Optionally, a protrusion may be protruded from the base plate 100, and a rotation hole is opened on the protrusion, and the rotation rod 520 is rotatably disposed in the rotation hole.

[0083] In another embodiment, the clamping device may further include a bearing seat 910 and a bearing 920. The bearing seat 910 is disposed on the substrate 100. A through hole is opened on the bearing seat 910. The bearing 920 is disposed in the through hole. The bearing 920 is sleeved on the outside of the rotating rod 520, that is, the rotating rod 520 is rotatably disposed in the bearing 920, so that the rotating rod 520 is easier to rotate, and then the clamping member 510 can clamp or place the wafer 610 more smoothly.

[0084] Optionally, the clamping device may further include a bearing stopper 930, which is disposed on the bearing seat 910, and in the extension direction of the rotating rod 520, the bearing stopper 930 and the bearing 920 are limitedly matched to prevent the rotating rod 520 from rotating for a long time, causing the bearing 920 to be separated from the bearing seat 910, thereby affecting the rotation stability of the rotating rod 520. Of course, the clamping device may also not include the bearing stopper 930.

[0085] In a further embodiment, the clamping device may further include a bearing lock nut 940, and the bearing lock nut 940 and the bearing stopper 930 are disposed on opposite sides of the bearing seat 910, so that the bearing lock nut 940 and the bearing stopper 930 limit the bearing 920 in two opposite directions, so as to further prevent the bearing 920 from being separated from the bearing seat 910, and further prevent the rotation stability of the rotating rod 520 from being affected. Of course, the clamping device may also not include the bearing lock nut 940.

[0086] Optionally, the present application also discloses a cleaning device, including a cleaning tank, a carrying device 620, a transmission device and the clamping device described above, please refer to Figure 4The carrying device 620 is used to carry the wafer 610, and the transmission device can be movably disposed in the cleaning tank, and the transmission device is connected to the carrying device 620 to drive the carrying device 620 to move into or out of the cleaning tank.

[0087] The clamping device is used to clamp the wafer 610 on the carrier 620, or the clamping device is used to place the wafer 610 on the carrier 620. Specifically, the clamping device can stably place the wafer 610 to be cleaned on the carrier 620. At this time, the transmission device can transfer the carrier 620 and the wafer 610 to the cleaning tank, so that the cleaning liquid in the cleaning tank can clean the wafer 610 on the carrier 620. After cleaning the wafer 610 on the carrier 620, the transmission device can transfer the carrier 620 and the cleaned wafer 610 to the outside of the cleaning tank. At this time, the clamping device can clamp the cleaned wafer 610 on the carrier 620 and transfer it to the next production process. At the same time, since the clamping device can stably place the wafer 610 to be cleaned on the carrier 620, this can ensure the stability of the cleaning process. Furthermore, when the clamping device clamps the cleaned wafer 610 on the carrier device 620, that is, when the clamping device interacts with the carrier device 620, the clamping angle of the clamping assembly 500 of the clamping device can be adjusted so that the clamping assembly 500 can stably clamp the cleaned wafer 610 on the carrier device 620, that is, the clamping device has the advantage of convenient adjustment, and therefore, the interaction between the clamping device and the carrier device 620 is less difficult.

[0088] At the same time, when the clamping device places the wafer 610, the clamping groove on the clamping frame 513 of the clamping assembly 500 does not need to be completely separated from the wafer 610 to open the clamping frame 513. When the clamping device clamps the wafer 610, the clamping frame 513 can directly clamp the wafer 610, that is, the clamping device does not need to be raised to a certain height in advance, and then approach the carrier 610 and clamp the wafer 610. It can be seen that the present application can shorten the height of the cleaning equipment and shorten the exposure time of the wafer 610 in the air during the process while greatly reducing the interaction stroke between the clamping device and the carrier 610.

[0089] The above embodiments of the present application focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0090] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A clamping device, characterized in that: The invention comprises a base plate (100), a driving mechanism (200), a sliding seat (300), a transmission assembly (400) and a clamping assembly (500). The driving mechanism (200) is disposed on the substrate (100), and the driving mechanism (200) is connected to the sliding seat (300) to drive the sliding seat (300) to move relative to the substrate (100); The first end of the clamping assembly (500) is rotatably disposed on the substrate (100), and the second end of the clamping assembly (500) is used to clamp the wafer (610); The sliding seat (300) has a first inclined surface (310) and a second inclined surface (320) connected to each other, the inclination of the first inclined surface (310) is smaller than the inclination of the second inclined surface (320), one end of the transmission component (400) can contact the first inclined surface (310) and the second inclined surface (320), and the other end of the transmission component (400) is connected to the first end of the clamping component (500); During the movement of the sliding seat (300), one end of the transmission component (400) may first contact one of the first inclined surface (310) and the second inclined surface (320), and then contact the other of the first inclined surface (310) and the second inclined surface (320), so that the transmission component (400) drives the second end of the clamping component (500) away from or close to the wafer (610).

2. The clamping device according to claim 1, characterized in that: The sliding seat (300) is provided with a sliding channel (330), and the bottom wall (331) of the sliding channel (330) has the first inclined surface (310) and the second inclined surface (320). At least a part of the transmission assembly (400) is located in the sliding channel (330). During the movement of the sliding seat (300), the transmission assembly (400) can be limitedly matched with the side wall (332) of the sliding channel (330).

3. The clamping device according to claim 2, characterized in that: The clamping device further comprises a pressing assembly, which is movably arranged on the top wall (333) of the sliding channel (330), and the pressing assembly can press the transmission assembly (400).

4. The clamping device according to claim 3, characterized in that: The clamping assembly includes a clamping plate (710), an elastic member (720) and a guide pin shaft (730), one end of the guide pin shaft (730) is connected to the clamping plate (710), and the other end of the guide pin shaft (730) is slidably matched with the sliding seat (300), the elastic member (720) is sleeved outside the guide pin shaft (730), and one end of the elastic member (720) is abutted against the top wall (333) of the sliding channel (330), and the other end of the elastic member (720) is abutted against the clamping plate (710), and the clamping plate (710) can squeeze the transmission assembly (400).

5. The clamping device according to claim 1, characterized in that: The transmission assembly (400) comprises a rolling element (410) and a connecting element (420), wherein the rolling element (410) comprises a first rotating part (411) and a second rotating part (412) which are rotatably connected, wherein the first rotating part (411) can roll relative to the first inclined surface (310) and the second inclined surface (320), wherein the first rotating part (411) has a spherical rolling surface, and a rotation axis of the first rotating part (411) relative to the second rotating part (412) is parallel to a rolling axis of the first rotating part (411) relative to the first inclined surface (310) and the second inclined surface (320); The clamping assembly (500) comprises a clamping member (510) and a rotating rod (520), one end of the rotating rod (520) is rotatably disposed on the substrate (100), and the other end of the rotating rod (520) is connected to the clamping member (510), the clamping member (510) is used to clamp the wafer (610), and the connecting member (420) connects the second rotating part (412) and the rotating rod (520).

6. The clamping device according to claim 5, characterized in that: The clamping member (510) comprises a first clamping member (511) and a second clamping member (512) which are arranged at intervals, and the rotating rod (520) comprises a first rotating rod (521) and a second rotating rod (522) which are arranged at intervals, one end of the first rotating rod (521) and one end of the second rotating rod (522) are both rotatably arranged on the substrate (100), the other end of the first rotating rod (521) is connected to the first clamping member (511), and the other end of the second rotating rod (522) is connected to the second clamping member (512), and the first clamping member (511) and the second clamping member (512) are used to clamp the wafer (610); The number of the connecting members (420) is at least two, including a first connecting member (421) and a second connecting member (422); the number of the rolling members (410) is at least two, including a first rolling member (413) and a second rolling member (414) arranged at intervals; the first connecting member (421) and the second connecting member (422) are symmetrically arranged on opposite sides of the rolling member (410); one end of the first connecting member (421) is connected to the second rotating portion (412) of the first rolling member (413); one end of the second connecting member (422) is connected to the second rotating portion (412) of the second rolling member (414); the other end of the first connecting member (421) is connected to the first rotating rod (521); and the other end of the second connecting member (422) is connected to the second rotating rod (522).

7. The clamping device according to claim 5, characterized in that: The clamping device further comprises a first adjusting member (810), and the connecting member (420) is connected to the rotating rod (520) via the first adjusting member (810), so that the position of the connecting member (420) in the circumferential direction of the rotating rod (520) is adjustable.

8. The clamping device according to claim 5, characterized in that: The clamping member (510) comprises a clamping frame (513) and an adapter plate (514), one end of the clamping frame (513) is used to clamp the wafer (610), and the other end of the clamping frame (513) is connected to the rotating rod (520) through the adapter plate (514). The clamping device further comprises a second adjusting member (820), the second adjusting member (820) being movably disposed on the adapter plate (514), and one end of the second adjusting member (820) being in contact with the clamping frame (513), and during the movement of the second adjusting member (820), the position of the clamping frame (513) in the extension direction of the rotating rod (520) is adjustable; and / or, The clamping device also includes a third adjusting member (830), which is movably disposed on the adapter plate (514), and one end of the third adjusting member (830) is in contact with the clamping frame (513). During the movement of the third adjusting member (830), the position of the clamping frame (513) in the height direction of the adapter plate (514) is adjustable.

9. The clamping device according to claim 2, characterized in that: The sliding seat (300) further comprises a first plane (340) and a second plane (350); the first plane (340), the first inclined plane (310), the second inclined plane (320) and the second plane (350) are connected in sequence, and in the height direction of the sliding seat (300), the height of the first plane (340) is greater than the height of the second plane (350); during the movement of the sliding seat (300), one end of the transmission assembly (400) may contact the first plane (340), the first inclined plane (310), the second inclined plane (320) and the second plane (350) in sequence, or may contact the second plane (350), the second inclined plane (320), the first inclined plane (310) and the first plane (340) in sequence.

10. The clamping device according to claim 1, characterized in that: The clamping device also includes a first buffer (840) and a second buffer (850) which are arranged at intervals on the substrate (100); the first buffer (840) and the second buffer (850) are arranged in sequence in the moving direction of the sliding seat (300); and the first buffer (840) and the second buffer (850) are located on opposite sides of the sliding seat (300); during the movement of the sliding seat (300), the sliding seat (300) can be limitedly matched with the first buffer (840) or the second buffer (850).

11. The clamping device according to claim 1, characterized in that: The clamping device also includes a first sensor (860) and a second sensor (870) which are arranged at intervals on the substrate (100); the first sensor (860) and the second sensor (870) are arranged in sequence in the moving direction of the sliding seat (300); and the first sensor (860) and the second sensor (870) are located on opposite sides of the sliding seat (300); during the movement of the sliding seat (300), the sliding seat (300) may contact the first sensor (860) or the second sensor (870).

12. The clamping device according to claim 11, characterized in that: The clamping device also includes a fourth adjusting member, and the first sensor (860) and the second sensor (870) are both arranged on the substrate (100) through the fourth adjusting member, and the first sensor (860) and the second sensor (870) are both movably arranged on the fourth adjusting member, so that the positions of the first sensor (860) and the second sensor (870) on the substrate (100) are both adjustable.

13. A cleaning device, characterized in that: It comprises a cleaning tank, a carrying device (620), a transmission device and a clamping device as described in any one of claims 1 to 12, wherein the carrying device (620) is used to carry the wafer (610), the transmission device can be movably arranged in the cleaning tank, the transmission device is connected to the carrying device (620) to drive the carrying device (620) to move into or out of the cleaning tank, the clamping device is used to clamp the wafer (610) on the carrying device (620), or the clamping device is used to place the wafer (610) on the carrying device (620).

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