A packaging structure for a semiconductor discrete device

Abstract

The present invention discloses a packaging structure for a semiconductor discrete device, which relates to the field of semiconductor packaging technology, comprising an outer packaging shell, exhaust holes are provided on both sides of the outer packaging shell, and an exhaust fan is rotatably provided in the exhaust holes; positioning cavities are provided on both sides of the outer packaging shell, and an inner packaging body is provided inside the positioning cavity; ratchet structures are provided on both sides of the inner packaging body, and the motor of the ratchet structure is connected to a transmission ratchet, and the output ends of the motors on both sides are fixedly connected to the exhaust fans; by providing the ratchet structure, the motors on both sides of the ratchet structure can rotate separately, and when the motor on one side drives the ratchet to transmit to the transmission structure, the closed motor on the other side can idly slip through the transmission ratchet, so that the transmission structure can move smoothly; the cooling structure is indirectly controlled to absorb heat and cool down; by providing the exhaust fan, the rotation of the motor can drive the exhaust fan to rotate, thereby driving the flow of cold air from the cooling blocks on the upper and lower sides of the inner packaging body, thereby achieving comprehensive cooling.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a packaging structure of a discrete semiconductor device. Background Art

[0002] Semiconductor components are divided into "discrete" and "integrated" according to their packaging form. Discrete devices refer to electronic devices that have separate functions and cannot be separated. Depending on the chip structure and function, they can be divided into semiconductor diodes, transistors, bridge rectifiers, optoelectronic devices, etc., as well as devices formed by connecting them in a certain way.

[0003] In order to improve stability and practicality, a packaging structure is constructed outside the semiconductor discrete device. The existing packaging structure can cool and dissipate heat for the semiconductor discrete device during the packaging process. For example, the packaging structure of a semiconductor discrete device with publication number CN117116879B includes an outer packaging shell, an inner packaging body and connecting pins. The inner packaging body is provided on the lower inner wall of the outer packaging shell, and the connecting pins are provided on the lower outer wall of the outer packaging shell. The connecting pins pass through the bottom wall of the outer packaging shell and are connected to the inner packaging body. The interior of the outer packaging shell is provided with an alternating magnetic cooling mechanism, and the alternating magnetic cooling mechanism includes an alternating cooling transmission component, an automatic steering transmission component and a fixed partition.

[0004] This packaging structure uses the forward and reverse rotation of a motor on one side to drive the temperature conduction plate to flip. The motor is positioned on one side, and one end of the temperature conduction plate is too far from the motor. This results in high torque on the temperature conduction plate, requiring the motor to generate high power to flip the plate. Furthermore, the motor needs to rotate forward and reverse, placing significant restrictions on the motor's requirements. Furthermore, this packaging structure primarily cools the upper and lower surfaces of the inner package by directly contacting cold air with the package. However, this air can escape directly through side slots and heat dissipation holes, making cooling the sides of the inner package inefficient. This can lead to uneven packaging due to surface temperature differences during the packaging process. Summary of the Invention

[0005] The purpose of the present invention is to solve the problem that the transmission motor on one side of the above-mentioned background technology needs to have high power and be able to rotate forward and reverse at the same time, which brings many requirements and restrictions, and the low cooling efficiency of the side of the inner package body leads to large surface temperature difference and uneven packaging, and proposes a packaging structure for semiconductor discrete devices.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A semiconductor discrete device packaging structure, characterized by comprising an outer packaging shell, exhaust holes provided on both sides of the outer packaging shell, an exhaust fan rotatably provided in the exhaust holes; positioning cavities provided on both sides of the outer packaging shell, an inner packaging body detachably provided inside the positioning cavity; ratchet structures provided on both sides of the inner packaging body near the exhaust holes, the ratchet structures comprising:

[0008] The motors are arranged on both sides of the inner package body near the exhaust hole, the output end surfaces of the two motors are coaxially fixedly connected to the transmission ratchet, and one end of the output end of the two motors is coaxially fixedly connected to the corresponding exhaust fan;

[0009] A transmission gear ring is sleeved on the outer surface of each transmission ratchet, and a plurality of clamping blocks are provided inside the transmission gear ring, and the plurality of clamping blocks are in close contact with the surface of the transmission ratchet;

[0010] The surface of the transmission gear ring is provided with a transmission structure, and a transmission frame of the transmission structure is sleeved on the surface of each transmission gear ring, and connecting vertical plates are provided on both sides of the transmission frame; a rotating shaft is rotatably provided between the corresponding connecting vertical plates on both sides of the inner packaging body, and the rotating shaft is transmission-connected to the transmission frame;

[0011] A cooling structure is provided on the surface of the rotating shaft, and a rotating plate of the cooling structure is provided on the surface of each rotating shaft. A plurality of cold transfer blocks are provided on one side of the rotating plate. Two fixed partitions are provided on the side of each rotating plate away from the inner packaging body, and a spacing is provided between the two fixed partitions, and the spacing is adapted to the corresponding rotating plate. A cooling fin is provided on one side of the two fixed partitions.

[0012] As a further solution of the present invention: handles and connecting pins are respectively provided on both sides of the outer packaging shell where the exhaust hole is provided, and the exhaust hole is located below the handles and the connecting pins.

[0013] As a further solution of the present invention: the exhaust holes on both sides are located at the center of the two sides of the outer packaging shell, and the exhaust holes on both sides are located on the same horizontal line.

[0014] As a further solution of the present invention: a plurality of clamping blocks are arranged in a circular array at equal distances inside the transmission gear ring, and a compression spring is provided between each clamping block and the inner ring of the transmission gear ring.

[0015] As a further solution of the present invention: a transmission rack is provided on one side of the transmission frame, and the transmission rack is meshedly connected with the surface of the transmission gear ring.

[0016] As a further solution of the present invention: the two ends of the rotating shaft extend from the connecting vertical plates on both sides, and transmission gears are fixedly provided on the surfaces of the two extended ends of the rotating shaft; a fixed rack is provided inside the positioning cavity, and the fixed rack is meshed and connected with the two transmission gears in the vertical direction.

[0017] As a further solution of the present invention, the fixed rack is engaged with only one corresponding transmission gear at the same time.

[0018] As a further solution of the present invention: a plurality of heat dissipation holes are provided on both sides of the outer packaging shell.

[0019] As a further solution of the present invention: connecting horizontal plates are provided on both sides of each transmission frame, and a connecting vertical plate is provided at one end of the connecting horizontal plate away from the transmission frame.

[0020] Beneficial effects of the present invention:

[0021] (1) A semiconductor discrete device packaging structure of the present invention is provided with a ratchet structure, and the motors on both sides of the ratchet structure can rotate separately, so that when the motor on one side drives the ratchet to transmit to the transmission structure, the motor on the other side can be turned off and slip through the transmission ratchet, so that the transmission structure can move smoothly; and the transmission mechanism controls the cooling structure to absorb heat and reduce temperature;

[0022] (2) The packaging structure of a semiconductor discrete device of the present invention is provided with an exhaust fan. The output ends of the motors on both sides are coaxially fixedly connected with the exhaust fans. The motors can drive the exhaust fans to rotate during rotation, thereby driving the flow of cold air from the cold transfer blocks on the upper and lower sides of the inner packaging body, guiding the cold air to be discharged from the exhaust ports on both sides, thereby improving the cooling and heat dissipation efficiency of the cold air on the sides of the inner packaging body; preventing the cold air from directly overflowing from the heat dissipation holes and the positioning cavity, thereby improving the cooling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below with reference to the accompanying drawings.

[0024] Figure 1 It is a structural schematic diagram of a packaging structure of a semiconductor discrete device of the present invention;

[0025] Figure 2 It is a front view of the internal structure of a packaging structure of a semiconductor discrete device of the present invention;

[0026] Figure 3 It is a schematic diagram of the internal structure of a packaging structure of a semiconductor discrete device of the present invention;

[0027] Figure 4 It is a structural schematic diagram of the ratchet structure of the present invention;

[0028] Figure 5 It is a front schematic diagram of a packaging structure of a semiconductor discrete device of the present invention;

[0029] Figure 6 It is a schematic back view of a packaging structure of a semiconductor discrete device of the present invention.

[0030] In the figure: 1. Outer packaging shell; 11. Positioning cavity; 12. Handle; 13. Connecting pin; 14. Exhaust hole; 15. Exhaust fan; 16. Heat dissipation hole; 2. Inner packaging body; 3. Ratchet structure; 31. Motor; 32. Transmission ratchet; 33. Block; 34. Extrusion spring; 35. Transmission gear ring; 4. Transmission structure; 41. Transmission frame; 42. Transmission rack; 43. Connecting horizontal plate; 44. Connecting vertical plate; 45. Rotating shaft; 46. Transmission gear; 47. Reset spring; 48. Fixed rack; 5. Cooling structure; 51. Rotating plate; 52. Cold transfer block; 53. Fixed partition; 54. Refrigeration plate. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0032] See also Figure 1-6 As shown, the present invention is a packaging structure for a discrete semiconductor device, comprising an outer packaging shell 1, with positioning cavities 11 provided on both sides of the outer packaging shell 1, and a plurality of heat dissipation holes 16 provided on the upper and lower surfaces of the outer packaging shell 1. A handle 12 is provided on one side of the outer packaging shell 1, and connecting pins 13 are provided on the side of the outer packaging shell 1 away from the handle 12. Exhaust holes 14 are provided on both sides of the outer packaging shell 1 where the handle 12 and connecting pins 13 are provided. The exhaust holes 14 are respectively located below the handle 12 and the connecting pins 13. The exhaust holes 14 on both sides are located in the center of the outer packaging shell 1 and are located on the same horizontal line. An exhaust fan 15 is rotatably provided in each exhaust hole 14.

[0033] An inner packaging body 2 is detachably provided inside the positioning cavity 11, and the positioning cavity 11 is detachably connected to the inner packaging body 2. The inner packaging body 2 is located in the central horizontal plane of the positioning cavity 11. A ratchet structure 3 is provided near both sides of the inner packaging body 2 near the exhaust hole 14, and two motors 31 of the ratchet structure 3 are provided on both sides of the inner packaging body 2 near the exhaust hole 14. The output end of the motor 31 is coaxially fixedly connected to the exhaust fan 15. A transmission ratchet 32 ​​is fixedly provided on the circumferential surface of the output end of the motor 31, and a transmission gear ring 35 is sleeved on the surface of each transmission ratchet 32. The inner ring of the transmission gear ring 35 is rotatably provided with a plurality of clamping blocks 33. The plurality of clamping blocks 33 are arranged in an equidistant circumferential array inside the inner ring of the transmission gear ring 35, and each clamping block 33 and the inner ring of the transmission gear ring 35 are provided with an extrusion spring 34.

[0034] The transmission rings 35 on either side are each provided with a transmission structure 4, with a transmission frame 41 mounted on the surface of the transmission rings 35. A transmission rack 42 is mounted on one side of each transmission frame 41, meshing with the teeth on the surface of the transmission rings 35. Each transmission frame 41 is provided with a connecting horizontal plate 43 on either side, with a connecting vertical plate 44 located at the end of the connecting horizontal plate 43 facing away from the transmission frame 41. A rotating shaft 45 is disposed between the corresponding connecting plates on either side of the inner package 2, with the ends of the rotating shaft 45 rotatably connected to different connecting vertical plates 44. The ends of the rotating shaft 45 extend from the connecting plates, and transmission gears 46 are coaxially fixed to the ends of the rotating shaft 45. Two fixed racks 48 are disposed on either side of the positioning cavity 11. Each fixed rack 48 meshes with two transmission gears 46 in the same vertical direction, and each fixed rack 48 can only mesh with the teeth of one transmission gear 46 at a time.

[0035] A cooling structure 5 is provided inside the positioning cavity 11, and the rotating plates 51 of the cooling structure 5 are all provided on the circumferential surface of the rotating shaft 45. Return springs 47 are provided on both sides of each rotating plate 51, and the other end of the return spring 47 is connected to the nearby connecting vertical plate 44, and the return spring 47 is sleeved on the rotating shaft 45. A cold transfer block 52 is provided on one side of each rotating plate 51, and the cold transfer block 52 is made of a material with a large specific heat capacity and good heat absorption and heat release effects. Eight fixed partitions 53 are provided inside the positioning cavity 11, and two fixed partitions 53 are fixedly provided above each rotating plate 51, and a gap is provided between the two fixed partitions 53, and the gap is adapted to the corresponding rotating plate 51. A plurality of cooling fins 54 are provided on the side of each fixed partition 53 away from the inner packaging body 2.

[0036] When using this semiconductor discrete device packaging structure, the inner package body 2 is installed within the positioning groove for positioning. The handle 12 is used to drive the connecting pins 13 of the outer package housing 1 into the semiconductor circuit board. The discrete device encapsulated in the plastic of the inner package body 2 is then connected to other devices for operation, dissipating heat from the discrete device. When the temperature of the outer package housing 1 exceeds a specified temperature, the internal temperature sensor detects the temperature and transmits an electrical signal to the motors 31 on both sides of the inner package body 2. The motor 31 on one side is activated, and the output end of the motor 31 drives the transmission ratchet 32 ​​to rotate. The rotation direction of the output end of the activated motor 31 can cause the ratchet to engage with the block 33 on the surface, thereby causing the ratchet to rotate the transmission gear ring 35. As the transmission gear ring 35 rotates, the transmission frame 41 is driven vertically by the transmission rack 42 on the surface. At this time, the transmission gear ring 35 on the other side rotates synchronously, and the ratchet on the output end of the unactivated motor 31 on the other side slips with the transmission gear ring 35, allowing the transmission frame 41 on the other side to move synchronously. As the transmission frame 41 moves, it indirectly drives the transmission gears 46 on the top of each side upward. This movement continues until the teeth of the transmission gears 46 contact and mesh with the fixed racks 48. As the transmission gears 46 continue to move upward, they are forced to rotate by the fixed racks 48, thereby rotating the rotating shaft 45 between the transmission gears 46. The rotating plate 51 on the surface of the rotating shaft 45 flips and moves upward to the gap between the two fixed partitions 53. Simultaneously, the cooling blocks 52 on the rotating plate 51 flip over and move between the cooling fins 54 on either side to absorb heat. After a period of time, the motor 31 on the other side is activated. The output terminal of the motor 31 on the other side rotates, driving the moving frame in the opposite direction. After absorbing heat, the rotating plate 51, which then drives the cooling blocks 52 under the force of the return spring 47, flips again and approaches the inner package 2 below, cooling the top surface of the inner package 2. At this point, the rotating plate 51 and cooling blocks 52 below absorb heat. The motors 31 on both sides rotate sequentially under the control of the temperature sensors, driving the ratchet mechanism 3 and the drive mechanism to control the cooling and heat dissipation of the cold transfer block 52. During the rotation of the output ends of the motors 31 on both sides, they also drive the coaxially fixed exhaust fan 15 to rotate, thereby guiding the cold air from the cold transfer block 52 to flow from the upper and lower surfaces of the inner package 2 to the sides, thereby allowing the cold air to effectively cool the sides of the inner package 2, preventing the cold air from directly flowing out of the heat dissipation holes 16 or the sides of the positioning grooves, which would reduce the cooling efficiency of the inner package 2.

[0037] Working principle of the present invention: A packaging structure of a semiconductor discrete device of the present invention is provided with a ratchet structure 3, and the motors 31 on both sides of the ratchet structure 3 can rotate separately, so that when the motor 31 on one side drives the transmission ratchet 32 ​​to transmit with the transmission structure 4, the motor 31 closed on the other side can idle and slip through the transmission ratchet 32, so that the transmission structure 4 can move smoothly; drive the transmission mechanism to control the cooling structure to absorb heat and cool down; by providing an exhaust fan 15, the output ends of the motors 31 on both sides are coaxially fixedly connected to the exhaust fan 15, and the motor 31 can drive the exhaust fan 15 to rotate during the rotation process, thereby driving the flow of cold air from the cooling blocks 52 on the upper and lower sides of the inner packaging body 2, guiding the cold air to be discharged from the exhaust ports on both sides, thereby improving the cooling and heat dissipation efficiency of the cold air on the side of the inner packaging body 2; preventing the cold air from directly overflowing from the heat dissipation holes 16 and the positioning cavity 11, thereby improving the cooling efficiency.

[0038] The above is a detailed description of an embodiment of the present invention. However, the content described is only a preferred embodiment of the present invention and should not be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A packaging structure for a semiconductor discrete device, characterized in that: The invention comprises an outer packaging shell (1), exhaust holes (14) are provided on both sides of the outer packaging shell (1), and an exhaust fan (15) is rotatably provided in the exhaust hole (14); positioning cavities (11) are provided on both sides of the outer packaging shell (1), and an inner packaging body (2) is detachably provided inside the positioning cavity (11); ratchet structures (3) are provided on both sides of the inner packaging body (2) near the exhaust hole (14), and the ratchet structure (3) comprises: The motors (31) are arranged on both sides of the inner package body (2) near the exhaust hole (14), the output end surfaces of the motors (31) on both sides are coaxially fixedly connected to the transmission ratchet (32), and one end of the output end of the motors (31) on both sides is coaxially fixedly connected to the corresponding exhaust fan (15); A transmission gear ring (35) is sleeved on the outer surface of each transmission ratchet (32), and a plurality of clamping blocks (33) are provided inside the transmission gear ring (35), and the plurality of clamping blocks (33) are in close contact with the surface of the transmission ratchet (32); A transmission structure (4) is provided on the surface of the transmission gear ring (35); a transmission frame (41) of the transmission structure (4) is sleeved on the surface of each transmission gear ring (35); connecting vertical plates (44) are provided on both sides of the transmission frame (41); a rotating shaft (45) is rotatably provided between the corresponding connecting vertical plates (44) on both sides of the inner packaging body (2); and the rotating shaft (45) is transmission-connected to the transmission frame (41); The surface of the rotating shaft (45) is provided with a cooling structure (5), and a rotating plate (51) of the cooling structure (5) is provided on the surface of each rotating shaft (45), and a plurality of cold transfer blocks (52) are provided on one side of the rotating plate (51); each rotating plate (51) is provided with two fixed partitions (53) on the side away from the inner packaging body (2), and a spacing is provided between the two fixed partitions (53), and the spacing is adapted to the corresponding rotating plate (51), and a cooling plate (54) is provided on one side of the two fixed partitions (53).

2. The packaging structure of a semiconductor discrete device according to claim 1, characterized in that: The two sides of the outer packaging shell (1) where the exhaust hole (14) is provided are respectively provided with a handle (12) and a connecting pin (13), and the exhaust hole (14) is located below the handle (12) and the connecting pin (13).

3. The packaging structure of a semiconductor discrete device according to claim 1, characterized in that: The exhaust holes (14) on both sides are located at the center positions of the two sides of the outer packaging shell (1), and the exhaust holes (14) on both sides are located on the same horizontal line.

4. The packaging structure of a semiconductor discrete device according to claim 1, characterized in that: A plurality of clamping blocks (33) are arranged in an equidistant circumferential array in a transmission gear ring (35), and a compression spring (34) is arranged between each clamping block (33) and the inner ring of the transmission gear ring (35).

5. The packaging structure of a semiconductor discrete device according to claim 1, characterized in that: A transmission rack (42) is provided on one side of the transmission frame (41), and the transmission rack (42) is meshedly connected with the surface of the transmission gear ring (35).

6. The packaging structure of a discrete semiconductor device according to claim 1, characterized in that: The two ends of the rotating shaft (45) extend from the connecting vertical plates (44) on both sides, and transmission gears (46) are fixedly provided on the surfaces of the two extended ends of the rotating shaft (45); a fixed rack (48) is provided inside the positioning cavity (11), and the fixed rack (48) is meshed and connected with the two transmission gears (46) in the vertical direction.

7. The packaging structure of a discrete semiconductor device according to claim 6, characterized in that: The fixed rack (48) is meshed with only one corresponding transmission gear (46) at a time.

8. The packaging structure of a semiconductor discrete device according to claim 1, characterized in that: A plurality of heat dissipation holes (16) are provided on both sides of the outer packaging shell (1).

9. The packaging structure of a discrete semiconductor device according to claim 1, characterized in that: Both sides of each transmission frame (41) are provided with connecting transverse plates (43), and one end of the connecting transverse plate (43) away from the transmission frame (41) is provided with a connecting vertical plate (44).

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