Solar cell, solar cell module and preparation method thereof

Abstract

The invention provides a solar cell, a solar cell module and a preparation method thereof, and the solar cell comprises a solder strip film which comprises a substrate, a plurality of solder strips and insulating layers, the plurality of solder strips extend along a first direction and are arranged on the substrate at intervals along a second direction, and the insulating layers are arranged on each solder strip at intervals along the first direction and the second direction; the first grid line and the second grid line which have opposite polarities are located on one side of the first surface of the solar cell, the welding strip film is attached to the first surface, and when the welding strip is electrically connected with the first grid line, the insulating layer is arranged at the position where the welding strip and the second grid line coincide and located between the welding strip and the second grid line; when the welding strip is electrically connected with the second grid line, the insulating layer is arranged at the position where the welding strip coincides with the first grid line and located between the welding strip and the first grid line. According to the invention, efficient connection between solar cells can be realized, and the assembly production efficiency and the assembly stability are improved.

Description

Technical Field

[0001] The present application mainly relates to the field of battery technology, and in particular to a solar cell, a solar cell module and a preparation method thereof. Background Art

[0002] With the development of new energy technologies in recent years, photovoltaic power generation has played an extremely important role in reducing dependence on traditional fancy energy sources. At present, various high-efficiency solar cell technologies are flourishing. The mainstream solar cells on the market include PERC, passivated contact cells TOPCON, heterojunction solar cells HJT, back contact solar cells XBC and other technologies. Among them, back contact solar cells have the advantages of no grid lines on the front, less shading, high conversion efficiency, low attenuation, high reliability, and beautiful appearance. They have been extensively studied by major manufacturers and research institutions for a long time. They can be combined with existing technologies to form IBC, TBC, HBC, HPBC and other batteries.

[0003] However, because the P / N and grid lines of back-contact solar cells are on the same side, higher requirements are placed on the welding connection of the components. How to efficiently and simply achieve the connection of back-contact batteries is an important part of whether back-contact batteries can achieve large-scale mass production and replacement. Conventional back-contact batteries prevent short circuits between PN areas by staggering PN areas through regional settings or by dispensing, printing, and isolating with printed insulating glue. However, this method requires steps such as dispensing, which seriously affects production efficiency and has high requirements for precision. There are risks in stability during long-term production. The independent welding of P / N areas through graphical methods is a more complicated process and cannot maximize the conversion efficiency of the back contact. Summary of the invention

[0004] The technical problem to be solved by the present application is to provide a solar cell, a solar cell module and a preparation method thereof, which can realize efficient connection between solar cells and improve module production efficiency and module stability.

[0005] To solve the above technical problems, the present application provides a solar cell, comprising: a solder ribbon film, the solder ribbon film comprising a substrate, a plurality of solder ribbons and an insulating layer, wherein the plurality of solder ribbons extend along a first direction and are arranged on the substrate at intervals along a second direction, and the insulating layer is arranged on the plurality of solder ribbons at intervals along the first direction and the second direction; a first grid line and a second grid line with opposite polarities are located on one side of a first surface of the solar cell, and the solder ribbon film is adhered to the first surface, wherein, when the solder ribbon is electrically connected to the first grid line, the insulating layer is arranged at a position where the solder ribbon overlaps with the second grid line and is located between the solder ribbon and the second grid line; when the solder ribbon is electrically connected to the second grid line, the insulating layer is arranged at a position where the solder ribbon overlaps with the first grid line and is located between the solder ribbon and the first grid line.

[0006] Optionally, the solar cell further comprises a plurality of first doping layers and second doping layers with opposite doping types, which are located on one side of the first surface, wherein the first doping layers are electrically connected to the first grid lines, and the second doping layers are electrically connected to the second grid lines.

[0007] Optionally, when the insulating layer is arranged at a position where the welding strip overlaps with the first gate line and is located between the welding strip and the first gate line, the width of the insulating layer is greater than or equal to the width of the first doped layer; when the insulating layer is arranged at a position where the welding strip overlaps with the second gate line and is located between the welding strip and the second gate line, the width of the insulating layer is greater than or equal to the width of the second doped layer.

[0008] Optionally, the solar cell further includes a semiconductor substrate, a plurality of the first doped layers and a plurality of the second doped layers are alternately arranged on a first surface of the semiconductor substrate, and the first surface of the substrate is located on the same side as the first surface.

[0009] Optionally, the doping type of the semiconductor substrate is N-type or P-type.

[0010] Optionally, the substrate includes a hot-melt film, EVA and / or POE.

[0011] Optionally, the solar cell includes a heterojunction back contact cell HBC, a TOPCon back contact cell TBC or a composite passivation back contact cell HPBC.

[0012] To solve the above technical problems, the present application provides a solar cell assembly, comprising: a plurality of solar cells as described above connected in series and / or in parallel; and glass located at least on one side of the first surface of the solar cell.

[0013] To solve the above technical problems, the present application provides a method for preparing a solar cell module, comprising the following steps: forming a plurality of welding strips extending along a first direction on a substrate at intervals along a second direction; printing an insulating layer on each of the welding strips at intervals along the first direction to form a welding strip film; a first grid line and a second grid line with opposite polarities are located on one side of a first surface of the solar cell, and the welding strip film is adhered to the first surface, wherein, when the welding strip is electrically connected to the first grid line, the insulating layer is arranged at a position where the welding strip overlaps with the second grid line and is located between the welding strip and the second grid line; when the welding strip is electrically connected to the second grid line, the insulating layer is arranged at a position where the welding strip overlaps with the first grid line and is located between the welding strip and the first grid line.

[0014] Optionally, the insulating layer is printed by inkjet printing, screen printing and / or laser stripping.

[0015] Optionally, the preparation method further comprises placing glass on the first surface of the solar cell after laminating the solder tape film to the back of the solar cell, and performing heat-pressing packaging.

[0016] Compared with the prior art, the present application arranges a solder ribbon film on the solar module, and the solder ribbon film is an integral structure of the substrate, the solder ribbon and the insulating layer. During the preparation of the solar cell, the solder ribbon film is placed on the back of the solar cell to connect multiple solar cells. The arrangement of the solder ribbon film can achieve efficient connection between the multiple solar cells. Furthermore, by directly arranging the insulating layer on the solder ribbon instead of arranging the insulating layer on the back of the solar cell, since the insulating layer has both an insulating effect and can further fix the solder ribbon and the solar cell, there is no need to fix the solder ribbon and the solar cell by dispensing glue, which saves process steps, further improves the module production efficiency and module stability, and improves the mass producibility of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are included to provide a further understanding of the present application. They are included and constitute a part of the present application. The accompanying drawings illustrate embodiments of the present application and together with the present specification serve to explain the principles of the present application. In the accompanying drawings:

[0018] Figure 1-2 is a schematic diagram of a partial structure of a solar cell assembly in one embodiment of the present application;

[0019] Figure 3 This is a front view of the structure of a solar cell assembly in one embodiment of the present application;

[0020] Figure 4 is a structural side view of a solar cell assembly in one embodiment of the present application;

[0021] Figure 5 It is a schematic flow chart of a method for preparing a solar cell assembly in one embodiment of the present application. DETAILED DESCRIPTION

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0023] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0024] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so that once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0025] In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0026] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0027] In addition, it should be noted that the use of words such as "first" and "second" to define components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above words have no special meaning and cannot be understood as limiting the scope of protection of this application. In addition, although the terms used in this application are selected from well-known and commonly used terms, some terms mentioned in the specification of this application may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this article. In addition, it is required to understand this application not only by the actual terms used, but also by the meaning implied by each term.

[0028] Figure 1 to Figure 4 The structure of a solar cell assembly 100 and a solar cell 101 proposed in the present application are shown, wherein the solar cell 101 can be applied to the solar cell assembly 100, and the solar cell assembly 100 includes a plurality of solar cells 101 connected in series and / or in parallel. Specifically, Figure 3-4 1 and 2 show a front view and a side view of a solar cell device 100. Figure 1 The structure schematic diagram of the solder ribbon film 102 of the solar cell 101 applied to the solar cell module 100 is shown. Figure 2 FIG. 1 is a schematic diagram showing the structure of a first doping layer 1011 and a second doping layer 1012 on one of the solar cells 101 in the solar cell module 100. In order to more clearly illustrate the structure of the solar cell module 100, the following is first referred to Figure 1-2 The specific structures of the solder ribbon film 102 and the first doping layer 1011 and the second doping layer 1012 in the solar cell 101 are described.

[0029] First refer to Figure 1 , Figure 1The solder tape film 102 is shown, and the solder tape film 102 includes a substrate 11, a plurality of solder tapes 12, and an insulating layer 13, wherein the plurality of solder tapes 12 extend along a first direction x and are arranged on the substrate 11 at intervals along a second direction y, and the insulating layer 13 is arranged on the plurality of solder tapes 12 at intervals along the first direction x and the second direction y. Exemplarily, the substrate 11 includes a hot melt film, EVA, and / or POE.

[0030] Further, see Figure 2 The solar cell 101 includes a plurality of first doping layers 1011 and second doping layers 1012 with opposite doping types, a first grid line 14 and a second grid line 15 with opposite polarities, the first doping layer 1011, the second doping layer 1012, the first grid line 14 and the second grid line 15 are all located on one side of the first surface S of the solar cell 101, wherein the first doping layer 1011 is electrically connected to the first grid line 14, and the second doping layer 1012 is electrically connected to the second grid line 15. The solder tape film 102 is attached to the first surface S of the solar cell 101. The number of the first doping layer 1011 and the second doping layer 1012 on the solar cell 101 can be set according to actual needs, and the present application is not limited to this. Exemplarily, the solar cell 101 can be a heterojunction back contact cell HBC, a TOPCon back contact cell TBC or a composite passivation back contact cell HPBC, and the present application is not limited to this.

[0031] Reference Figure 3 , Figure 3 FIG. 1 shows a front view of the structure of the solar cell assembly 100 after the solder tape film 102 is attached to the first surface S, wherein a plurality of solar cells 101 in the solar cell assembly 100 are connected in series. Figure 3 As shown, when the soldering ribbon 12 is electrically connected to the first gate line 14, the insulating layer 13 is arranged at the position where the soldering ribbon 12 overlaps with the second gate line 15 and is located between the soldering ribbon 12 and the second gate line 15, thereby insulating the two; when the soldering ribbon 12 is electrically connected to the second gate line 15, the insulating layer 13 is arranged at the position where the soldering ribbon 12 overlaps with the first gate line 14 and is located between the soldering ribbon 12 and the first gate line 14, thereby insulating the two.

[0032] Preferably, in this embodiment, the insulating layer 13 may specifically include an insulating layer 131 and an insulating layer 132, depending on the different arrangement positions. When the insulating layer 13 is arranged at a position where the soldering strip 12 overlaps with the first gate line 14 and is located between the soldering strip 12 and the first gate line 14, that is, for the insulating layer 131, the width w10 of the insulating layer 131 is equal to the width w1 of the first doped layer 1011; when the insulating layer 13 is arranged at a position where the soldering strip 12 overlaps with the second gate line 15 and is located between the soldering strip 12 and the second gate line 15, that is, for the insulating layer 132, the width w20 of the insulating layer 132 is equal to the width w2 of the second doped layer 1012. It should be noted that Figure 3 The insulating layers numbered 131 and 132 are only used to more clearly illustrate the width relationship between the insulating layer 13 at different positions and the first doped layer 1011 and the second doped layer 1012. In fact, the insulating layer 131 and the insulating layer 132 may be the same except for the different positions. The design of the width of the insulating layer 13 can ensure that the welding strip 12 does not contact the second doped layer 1012 and the second grid line 15 when it is electrically connected to the first grid line 14 on the first doped layer 1011, and at the same time, the welding strip 12 does not contact the first doped layer 1011 and the first grid line 14 when it is electrically connected to the second grid line 15 on the second doped layer 1012, thereby preventing short circuits from occurring inside the solar cell 101 and the solar cell module 100, and further ensuring the performance of the solar cell module 100.

[0033] In other embodiments of the present application, when the insulating layer 13 is arranged at a position where the soldering strip 12 overlaps with the first gate line 14 and is located between the soldering strip 12 and the first gate line 14, the width w10 of the insulating layer 13 can also be greater than the width w1 of the first doping layer 1011; when the insulating layer 13 is arranged at a position where the soldering strip 12 overlaps with the second gate line 15 and is located between the soldering strip 12 and the second gate line 15, the width w20 of the insulating layer 13 can also be greater than the width w2 of the second doping layer 1012. The present application imposes restrictions on this.

[0034] Continue to refer to Figure 3 In this embodiment, preferably, in the solar cell assembly 100, a welding strip 12 connects two adjacent solar cells 101. In order to more clearly illustrate the connection relationship between the solar cells 101, the specific reference is made to Figure 3 The following describes one of the solder strips 12 and two solar cells 200 and 201 connected by the solder strip 12. It is worth noting that the solar cell 200 and the solar cell 201 are the same solar cell 101, and different reference numerals are used only to more clearly illustrate the connection method between two adjacent solar cells 101, and have no other purpose, so it is hereby explained.

[0035] In this embodiment, the doping type of the first doping layer 1011 is P type, and the doping type of the second doping layer 1012 is N type, so the first grid line 14 electrically connected to the first doping layer 1011 is considered to have P polarity, and the second grid line 15 electrically connected to the second doping layer 1012 is considered to have polarity. A portion of the welding strip 12 is electrically connected to the first grid lines 14 on all the first doping layers 1011 of the solar cell 200, that is, the welding strip 12 is connected to the P pole of the solar cell 200. At this time, when the other portion of the welding strip 12 is connected to the solar cell 201 adjacent to the solar cell 200, it is electrically connected to the second grid lines 15 on all the second doping layers 1012 on the solar cell 201, that is, the welding strip 12 is connected to the N pole of the solar cell 201. Therefore, a portion of the welding strip 12 is connected to the P pole of the solar cell 200, and a portion is connected to the N pole of the solar cell 201, thereby realizing the series connection between two adjacent solar cells 101.

[0036] In other embodiments of the present application, the doping type of the first doping layer 1011 may be N-type, and the doping type of the second doping layer 1012 may be P-type. The present application is not limited thereto. Furthermore, the present application can also realize parallel connection of solar cells 101 by connecting multiple welding strips 12 using bus bars (not shown), which is not the focus of the present application and will not be elaborated here.

[0037] Further references Figure 4 , Figure 4 The structure of the solar cell assembly 100 is shown in a side view. Figure 4 It can be seen that each solar cell 101 in the solar cell assembly 100 further includes a semiconductor substrate 103, and the doping type of the semiconductor substrate 103 is N-type or P-type. Figure 4 As shown, a plurality of first doped layers 1011 and a plurality of second doped layers 1012 are alternately disposed on a first substrate surface S1 of a semiconductor substrate 103 , and the first substrate surface S1 is located on the same side as a first surface S of the solar cell 101 .

[0038] In this embodiment, the solar cell module 100 further includes glass (not shown), which is located on one side of the first surface S of the solar cell 101 and is suitable for packaging with multiple solar cells 101. In this embodiment, preferably, when the substrate of the solder tape film 102 uses a hot melt film, the solar cell module 100 further includes an EVA adhesive film. At this time, the glass and the EVA adhesive film are sequentially located on one side of the first surface S of the solar cell 101 and located on the substrate 11 and are suitable for packaging with multiple solar cells 101. Exemplarily, the solar cell module 100 can be heat-pressed and packaged by a heat press.

[0039] On the other hand, the present application also refers to Figure 5A method 20 for preparing a solar cell assembly is shown, comprising steps S1 to S3:

[0040] S1: forming a plurality of welding strips extending along a first direction on a substrate at intervals along a second direction;

[0041] S2: printing an insulating layer on each welding strip at intervals along a first direction to form a welding strip film;

[0042] S3: A first grid line and a second grid line with opposite polarities are located on one side of a first surface of the solar cell, and a soldering ribbon film is attached to the first surface, wherein when the soldering ribbon is electrically connected to the first grid line, the insulating layer is arranged at a position where the soldering ribbon overlaps with the second grid line and is located between the soldering ribbon and the second grid line; when the soldering ribbon is electrically connected to the second grid line, the insulating layer is arranged at a position where the soldering ribbon overlaps with the first grid line and is located between the soldering ribbon and the first grid line.

[0043] Preferably, in this embodiment, an insulating layer is printed on each welding strip at intervals along a first direction and dried and solidified to form a welding strip film. The method of printing the insulating layer includes inkjet printing, that is, the insulating layer is intermittently coated on the surface of the welding strip after drying and solidification. After the welding strip film is bonded to the back of the solar cell, glass is placed on one side of the first surface of the solar cell, and the solar cell is subjected to steps such as position correction, welding, and lamination for the next step of production.

[0044] Exemplarily, the method of printing the insulating layer also includes screen printing and / or laser stripping, wherein, after the surface of the solder strip is cleaned, the insulating layer can be coated on the entire surface of the solder strip, and then the insulating layer can be removed by laser stripping in places where the insulating layer is not needed, thereby realizing the production of the spacer insulating layer.

[0045] The above Figure 5 The preparation method 20 shown can be used to prepare Figure 3 and Figure 4 The solar cell assembly 100 shown in FIG. 1 is a solar cell assembly 100, and therefore other details of the preparation method 20 can also be referred to in the previous Figure 3-4 The description will not be repeated here. In the present application, a solder ribbon film is arranged on the solar module, and the solder ribbon film is an integral structure of a substrate, a solder ribbon and an insulating layer. In the process of preparing solar cells, the solder ribbon film is placed on the back of the solar cell to connect multiple solar cells. The arrangement of the solder ribbon film can achieve efficient connection between multiple solar cells; further, by directly arranging an insulating layer on the solder ribbon instead of arranging an insulating layer on the back of the solar cell, since the insulating layer has both an insulating effect and can further fix the solder ribbon and the solar cell, there is no need to fix the solder ribbon and the solar cell by dispensing glue, which saves working procedures, further improves the production efficiency and stability of the module, and improves the mass manufacturability of the module.

[0046] The basic concepts have been described above. Obviously, for those skilled in the art, the above application disclosure is only an example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements and amendments to the present application. Such modifications, improvements and amendments are suggested in the present application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present application.

[0047] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0048] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more application embodiments, in the above description of the embodiments of this application, multiple features are sometimes merged into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0049] In some embodiments, numbers describing the number of components and attributes are used. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise specified, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

[0050] Although the present application has been described with reference to the current specific embodiments, ordinary technicians in this technical field should recognize that the above embodiments are only used to illustrate the present application, and various equivalent changes or substitutions may be made without departing from the spirit of the present application. Therefore, as long as the changes and modifications to the above embodiments are within the essential spirit of the present application, they will fall within the scope of the claims of the present application.

Claims

1. A solar cell, characterized in that: include: A solder strip film, the solder strip film comprising a substrate, a plurality of solder strips and an insulating layer, wherein the plurality of solder strips extend along a first direction and are arranged on the substrate at intervals along a second direction, and the insulating layer is arranged on the plurality of solder strips at intervals along the first direction and the second direction; A first grid line and a second grid line with opposite polarities are located on one side of a first surface of the solar cell, and the solder tape film is attached to the first surface, wherein: When the welding strip is electrically connected to the first gate line, the insulating layer is arranged at a position where the welding strip overlaps with the second gate line and is located between the welding strip and the second gate line; When the welding strip is electrically connected to the second gate line, the insulating layer is arranged at a position where the welding strip overlaps with the first gate line and is located between the welding strip and the first gate line.

2. The solar cell according to claim 1, wherein: It also includes a plurality of first doping layers and second doping layers with opposite doping types, which are located on one side of the first surface, wherein the first doping layers are electrically connected to the first gate lines, and the second doping layers are electrically connected to the second gate lines.

3. The solar cell according to claim 2, characterized in that When the insulating layer is arranged at a position where the welding strip overlaps with the first gate line and is located between the welding strip and the first gate line, the width of the insulating layer is greater than or equal to the width of the first doping layer; When the insulating layer is arranged at a position where the soldering strip overlaps with the second gate line and is located between the soldering strip and the second gate line, the width of the insulating layer is greater than or equal to the width of the second doping layer.

4. The solar cell according to claim 2, wherein: It also includes a semiconductor substrate, a plurality of the first doping layers and a plurality of the second doping layers are alternately arranged on a first surface of the semiconductor substrate, and the first surface of the substrate is located on the same side as the first surface.

5. The solar cell according to claim 4, characterized in that The doping type of the semiconductor substrate is N-type or P-type.

6. The solar cell according to claim 1, wherein: The substrate includes hot melt film, EVA and / or POE.

7. The solar cell according to claim 1, wherein: The solar cell comprises a heterojunction back contact cell HBC, a TOPCon back contact cell TBC or a composite passivation back contact cell HPBC.

8. A solar cell module, characterized in that: include: A plurality of solar cells according to any one of claims 1 to 7 connected in series and / or in parallel; The glass is located at least on one side of the first surface of the solar cell.

9. A method for preparing a solar cell module, characterized in that: The steps include: Forming a plurality of welding strips extending along a first direction on a substrate at intervals along a second direction; Printing an insulating layer on each of the welding strips at intervals along a first direction to form a welding strip film; The first grid line and the second grid line with opposite polarities are located on one side of the first surface of the solar cell, and the solder tape film is attached to the first surface, wherein: When the welding strip is electrically connected to the first gate line, the insulating layer is arranged at a position where the welding strip overlaps with the second gate line and is located between the welding strip and the second gate line; When the welding strip is electrically connected to the second gate line, the insulating layer is arranged at a position where the welding strip overlaps with the first gate line and is located between the welding strip and the first gate line.

10. The preparation method according to claim 9, characterized in that: The method of printing the insulating layer includes inkjet printing, screen printing and / or laser stripping.

11. The preparation method according to claim 9 or 10, characterized in that: The method further includes placing glass on the first surface of the solar cell after laminating the solder tape film to the back of the solar cell, and performing heat-pressing packaging.

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