Mini LED backlight display device, high-color-gamut LED lamp panel and manufacturing method of high-color-gamut LED lamp panel
By arranging LED chip arrays and forming target color conversion films on a PCB substrate, followed by a transparent silicone layer, the method addresses the high cost and supply issues of large-sized quantum films, achieving cost-effective and uniform color gamut displays.
Patent Information
- Application Number
- CN202411344394.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2024-12-27
AI Technical Summary
The existing quantum film color conversion method for large-size high color gamut displays is expensive and difficult to supply due to the need for customized large-sized quantum films, leading to high costs and production challenges.
A manufacturing method involving arranging LED chip arrays on a PCB substrate, forming target color conversion films larger than the LED chips, transferring these films to form an array-type fluorescent film, and covering them with a transparent silicone layer to create a high color gamut LED light panel, ensuring color uniformity and reducing the need for large-sized quantum films.
This method ensures color uniformity, reduces costs, and simplifies the process, enabling the production of ultra-large-sized high color gamut displays by using smaller, more manageable color conversion films instead of large-sized quantum films.
Smart Images
Figure CN119208467A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of display technology, and more specifically, to a Mini LED backlight display device, a high color gamut LED light panel, and a manufacturing method thereof. Background Art
[0002] As Mini LED chips and driving technologies mature, the proportion of Mini LED backlight displays increases year by year. Mini LED backlight displays are mid-to-high-end products, so they are generally used in conjunction with high color gamut displays. Currently, high color gamut displays are mainly implemented by combining blue light chips with quantum films. The color conversion method of the blue light chip and quantum film combination is photoluminescence. The quantum film color conversion method for large-size high color gamut displays is expensive, and the quantum film size of 100 inches or more is very large. The raw materials for ultra-wide widths need to be customized, which is not only expensive but also difficult to supply.
[0003] Therefore, the prior art still needs to be improved and developed. Summary of the invention
[0004] The purpose of this application is to provide a Mini LED backlight display device, a high color gamut LED light panel and a manufacturing method thereof, so as to solve the problem that the existing quantum film color conversion method for large-size high color gamut display is high in cost and the large-size production leads to supply difficulties.
[0005] To achieve the above objectives, the technical solution adopted in the first aspect of the embodiment of the present application is:
[0006] A method for manufacturing a high color gamut LED light panel, comprising:
[0007] Arrange a plurality of LED chip arrays on a PCB substrate, wherein the LED chips are blue light LED chips or blue light combined with green light LED chips;
[0008] Making an initial color conversion film on a first carrier film, and processing the made initial color conversion film into a plurality of target color conversion films, wherein the size of the target color conversion film is larger than the size of the LED chip;
[0009] According to the array position of the LED chip, a plurality of the target color conversion films are transferred to the second carrier film to form an array type fluorescent film corresponding to the array position of the LED chip;
[0010] After the array fluorescent film is arranged on the array position of the LED chip, the second carrier film is removed, and all the target color conversion films are covered and arranged on the outer surface of the corresponding LED chip to obtain a white light LED dot matrix light source;
[0011] The outer surface of the white light LED dot matrix light source is covered with a transparent silicone layer to obtain a high color gamut LED light panel.
[0012] According to the above-mentioned method for manufacturing a high color gamut LED light panel, the step of manufacturing an initial color conversion film on the first carrier film and processing the manufactured initial color conversion film into a plurality of target color conversion films specifically includes:
[0013] An initial color conversion film is produced on a first carrier film, and the produced initial color conversion film is cut into a plurality of target color conversion films by laser cutting.
[0014] According to the above-mentioned method for manufacturing a high color gamut LED light panel, the step of transferring a plurality of the target color conversion films to a second carrier film according to the array position of the LED chip to form an array-type fluorescent film corresponding to the array position of the LED chip specifically includes:
[0015] According to the array position of the LED chip, a plurality of target color conversion films are pushed onto the second carrier film by flat-head ejector pins to form an array type fluorescent film corresponding to the array position of the LED chip.
[0016] According to the above-mentioned method for manufacturing a high color gamut LED light board, the steps of setting the array fluorescent film on the array position of the LED chip, removing the second carrier film, and covering all the target color conversion films on the outer surface of the corresponding LED chip to obtain a white light LED dot matrix light source specifically include:
[0017] After the array fluorescent film is arranged on the array position of the LED chip, the second carrier film is removed, and all the target color conversion films are pasted on the outer surface of the corresponding LED chip;
[0018] The target color conversion films attached to the outer surface of the LED chip are heated so that all the target color conversion films are closely attached to the outer surface of the LED chip corresponding thereto, thereby obtaining a white light LED dot matrix light source.
[0019] According to the above-mentioned method for manufacturing a high color gamut LED light board, the step of covering the outer surface of the white light LED dot matrix light source with a layer of transparent silicone layer to obtain a high color gamut LED light board specifically includes:
[0020] A layer of transparent silicone is coated on the outer surface of the white light LED dot matrix light source by means of micro-lens dispensing to obtain a high color gamut LED light panel.
[0021] According to the above-mentioned method for manufacturing a high color gamut LED light board, the step of covering the outer surface of the white light LED dot matrix light source with a layer of transparent silicone layer to obtain a high color gamut LED light board specifically includes:
[0022] A layer of transparent silicone is coated on the outer surface of the white light LED dot matrix light source by dispensing glue on the dam to obtain a high color gamut LED light panel.
[0023] The technical solution adopted in the second aspect of the embodiment of the present application is:
[0024] A high color gamut LED light board is prepared based on the manufacturing method of the high color gamut LED light board as described above, the high color gamut LED light board includes a PCB substrate, multiple LED chips, a target color conversion film and a transparent silicone layer, multiple LED chip arrays are arranged on the PCB substrate, the target color conversion film corresponds to the LED chips one by one and is covered on the outer surface of the LED chips, and the transparent silicone layer corresponds to the target color conversion film one by one and is covered on the outer surface of the target color conversion film.
[0025] According to the high color gamut LED light board described above, the Mini LED chip is a blue light LED chip, and the color conversion film is a green light and red light color conversion film.
[0026] According to the high color gamut LED light board described above, the Mini LED chip is a blue light composite green light LED chip, and the color conversion film is a red light color conversion film.
[0027] The technical solution adopted in the third aspect of the embodiment of the present application is:
[0028] A Mini LED backlight display device comprises a panel, an optical film, a diffusion plate and the high color gamut LED light board as described above, which are connected in sequence.
[0029] The beneficial effects of a Mini LED backlight display device, a high color gamut LED light panel and a manufacturing method thereof provided by the present application are at least that: the present application manufactures the color conversion material in the form of a film (initial color conversion film), which well ensures the color uniformity and solves the problem of uneven color of fluorescent dispensing on the COB surface. At the same time, the target color conversion film is manufactured in the form of a small (grid) array, replacing a large-sized quantum film. Large-scale display devices reduce large-width quantum dot film materials while improving the color gamut and display quality, thereby reducing costs and simplifying the process, thereby enabling the promotion of ultra-large-sized high color gamut display devices. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0031] Figure 1 A flowchart of a method for manufacturing a high color gamut LED light panel provided in an embodiment of the present application.
[0032] Figure 2 A schematic diagram of the structure of disposing multiple Mini LED chip arrays on a PCB substrate in a method for manufacturing a high color gamut LED light board provided in an embodiment of the present application.
[0033] Figure 3 A structural schematic diagram of a method for manufacturing a high color gamut LED light panel provided in an embodiment of the present application includes manufacturing a large color conversion film on a first carrier film, and processing the manufactured large color conversion film into multiple small color conversion films.
[0034] Figure 4 A schematic structural diagram of transferring a plurality of small color conversion films to corresponding positions of a second carrier film in a method for manufacturing a high color gamut LED light panel provided in an embodiment of the present application.
[0035] Figure 5 In a method for manufacturing a high color gamut LED light board provided in an embodiment of the present application, all small color conversion films are covered on the outer surface of the Mini LED chip corresponding thereto to obtain a structural schematic diagram of a white light LED dot matrix light source.
[0036] Figure 6 In a method for manufacturing a high color gamut LED light board provided in an embodiment of the present application, a layer of transparent silicone is coated on the outer surface of the white light LED dot matrix light source by microlens dispensing to obtain a structural schematic diagram of the high color gamut LED light board.
[0037] Figure 7 In a method for manufacturing a high color gamut LED light board provided in an embodiment of the present application, a layer of transparent silicone is coated on the outer surface of the white light LED dot matrix light source by dispensing glue on a dam to obtain a structural schematic diagram of the high color gamut LED light board.
[0038] Among them, the reference numerals in the figure are:
[0039] 1. PCB substrate; 2. LED chip; 3. First carrier film; 4. Target color conversion film; 5. Second carrier film; 6. Transparent silicone layer. DETAILED DESCRIPTION
[0040] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0041] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be directly or indirectly located on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the directions or positions shown in the accompanying drawings and are only for the convenience of description and cannot be understood as limitations on the present technical solution. The terms "first" and "second" are only used for the convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.
[0042] As Mini LED chips and driving technologies mature, the proportion of Mini LED backlight displays increases year by year. Mini LED backlight displays are mid-to-high-end products, so they are generally used in conjunction with high color gamut displays. Currently, high color gamut displays are mainly implemented by combining blue light chips with quantum films. The color conversion method of the blue light chip and quantum film combination is photoluminescence. The quantum film color conversion method for large-size high color gamut displays is expensive, and the quantum film size of 100 inches or more is very large. The raw materials for ultra-wide widths need to be customized, which is not only expensive but also difficult to supply.
[0043] To this end, the present application provides a Mini LED backlight display device, a high color gamut LED light board and a manufacturing method thereof, wherein the present application arranges a plurality of LED chip arrays on a PCB substrate, wherein the LED chip is a blue light LED chip or a blue light composite green light LED chip; an initial color conversion film is manufactured on a first carrier film, and the manufactured initial color conversion film is processed into a plurality of target color conversion films, wherein the size of the target color conversion film is larger than the size of the LED chip; according to the array position of the LED chip, the plurality of the target color conversion films are transferred to a second carrier film to form an array fluorescent film corresponding to the array position of the LED chip; after the array fluorescent film is arranged at the array position of the LED chip, the second carrier film is removed, and all the target color conversion films are The conversion film is covered on the outer surface of the LED chip corresponding to it to obtain a white light LED dot matrix light source; the outer surface of the white light LED dot matrix light source is covered with a layer of transparent silicone to obtain a high color gamut LED light board; through the above-mentioned production method, the color conversion material in this embodiment is produced in the form of a film (initial color conversion film), which well ensures the color uniformity and solves the problem of uneven color of fluorescent glue on the COB surface. At the same time, the target color conversion film is produced in the form of a small (grid) array, replacing a large-sized quantum film. The large-scale display device reduces the large-width quantum dot film material while improving the color gamut and display quality, thereby reducing the cost and simplifying the process, thereby realizing the promotion of ultra-large-sized high color gamut display devices.
[0044] The following, such as Figure 1 As shown, the manufacturing method of the high color gamut LED light board provided in the first aspect of the embodiment of the present application is introduced in detail.
[0045] For example, Figure 1 A flowchart of a method for manufacturing a high color gamut LED light panel is provided for this embodiment, such as Figure 1 As shown, the production method includes:
[0046] S10, disposing a plurality of LED chip arrays on a PCB substrate.
[0047] Specifically, the LED chip 2 may be a blue LED chip or a blue-green LED chip. A plurality of LED chips 2 are arranged on the PCB substrate 1 in an array. Figure 2 shown.
[0048] S20, making an initial color conversion film on the first carrier film, and processing the made initial color conversion film into a plurality of target color conversion films, wherein the size of the target color conversion film is larger than the size of the LED chip.
[0049] Specifically, the first carrier film 3 may be a release film, and the prepared initial color conversion film is cut into single-point small modules by laser cutting, that is, cut into a plurality of target color conversion films 4, while the first carrier film 3 is not cut. Figure 3 As shown, this is conducive to separating the cut target color conversion films 4 from the first carrier film 3. The size of the target color conversion film 4 after cutting will be larger than the size of the LED chip 2. The target color conversion film 4 can be a green light and / or red light color conversion film.
[0050] It is worth noting that when the LED chip 2 is a blue light LED chip, the target color conversion film 4 is a green light and red light color conversion film; when the LED chip 2 is a blue light composite green light LED chip, the target color conversion film 4 is a red light color conversion film, wherein the material of the green light and red light color conversion film is a mixed material of a quantum dot material emitting red light and a quantum dot material emitting green light, and the material of the red light color conversion film is a quantum dot material emitting red light.
[0051] S30, transferring the plurality of target color conversion films onto a second carrier film according to the array positions of the LED chips, to form an array type fluorescent film corresponding to the array positions of the LED chips.
[0052] Specifically, the second carrier film 5 can also be a release film, and the array position of the LED chip 2 is the position where the plurality of LED chips 2 are arrayed on the PCB substrate 1. It can be understood that the array-type fluorescent film is a film formed by arraying the plurality of target color conversion films on the second carrier film with reference to the array position of the LED chip. The viscosity of the second carrier film 5 is different from that of the first carrier film 3. In order to facilitate the transfer of the cut target color conversion film 4 to the second carrier film 5 to form the array-type fluorescent film, the viscosity of the second carrier film 5 is greater than that of the first carrier film 3. In this embodiment, the target color conversion film can be pushed onto the second carrier film 5 by means of a flat-head ejector pin, wherein the plurality of target color conversion films 4 are pushed onto the second carrier film 5 as shown in FIG. Figure 4 shown.
[0053] S40, after the array fluorescent film is disposed on the array position of the LED chip, the second carrier film is removed, and all the target color conversion films are covered and disposed on the outer surface of the corresponding LED chip to obtain a white light LED dot matrix light source.
[0054] Specifically, after the array fluorescent film is arranged on the array position of the LED chip 2, the second carrier film 5 is torn off, and all the target color conversion films 4 are pasted on the outer surface of the corresponding LED chip 2, such as Figure 5As shown, the target color conversion film 4 attached to the outer surface of the LED chip 2 is heated so that all the target color conversion films 4 are closely attached to the top surface and four side surfaces of the corresponding LED chip 2 to obtain a white light LED dot matrix light source.
[0055] S50, covering the outer surface of the white light LED dot matrix light source with a layer of transparent silicone layer to obtain a high color gamut LED light panel.
[0056] Specifically, there are two ways to cover the outer surface of the white light LED dot matrix light source with a layer of transparent silicone layer 6. One is to coat the outer surface of the white light LED dot matrix light source with a layer of transparent silicone layer 6 by dispensing microlenses, such as Figure 6 As shown, the transparent silicone layer 6 obtained in this way can protect the target color conversion film 4 from water and oxygen, so that a high color gamut LED light board with stable light type can be obtained; another method is to coat a layer of transparent silicone layer 6 on the outer surface of the white light LED dot matrix light source by dispensing glue around the dam, such as Figure 7 As shown, the frame formed by the dam prevents the light from each point light source from being strung together, so that the light type of each backlight partition presents a matrix light type corresponding to the pixel partition, which has a good partitioning effect and dynamic contrast. At the same time, the transparent silicone layer 6 in the dam covers the target color conversion film 4 to protect it from water and oxygen.
[0057] A high color gamut LED light board provided in the second aspect of an embodiment of the present application is prepared based on the manufacturing method of the high color gamut LED light board as described above. The high color gamut LED light board manufactured by the above manufacturing method can reduce the use of quantum dot materials and ensure color uniformity. The light board product of the present application can be distinguished from the appearance. Because the target color conversion film directly covers the LED chip, it can be seen before dispensing that the product manufactured by the present application (high color gamut LED light board) is smaller in size than the conventionally packaged LED chip, and the surface of the LED chip of the present application is yellower than the conventional COB product.
[0058] Among them, the high color gamut LED light board includes a PCB substrate, multiple LED chips, a target color conversion film and a transparent silicone layer. Multiple LED chip arrays are arranged on the PCB substrate. The target color conversion film corresponds one-to-one to the LED chips and is covered on the outer surface of the LED chips. The transparent silicone layer corresponds one-to-one to the target color conversion film and is covered on the outer surface of the target color conversion film.
[0059] Optionally, in one embodiment, the Mini LED chip is a blue light LED chip, and the color conversion film is a green light and red light color conversion film.
[0060] Optionally, in one embodiment, the Mini LED chip is a blue light composite green light LED chip, and the color conversion film is a red light color conversion film.
[0061] A Mini LED backlight display device provided in the third aspect of an embodiment of the present application includes a panel, an optical film, a diffusion plate and the high color gamut LED light board as described above, which are connected in sequence, wherein the LED backlight display device can be any one of an ultra-high-definition television, an LED display screen, a monitor, a laptop computer, a mobile phone, a tablet computer, etc.
[0062] In summary, the present application provides a Mini LED backlight display device, a high color gamut LED light board and a manufacturing method thereof, the manufacturing method comprising: arranging a plurality of LED chip arrays on a PCB substrate, wherein the LED chip is a blue light LED chip or a blue light composite green light LED chip; making an initial color conversion film on a first carrier film, and processing the prepared initial color conversion film into a plurality of target color conversion films, wherein the size of the target color conversion film is larger than the size of the LED chip; transferring the plurality of the target color conversion films to a second carrier film according to the array position of the LED chip to form an array-type fluorescent film corresponding to the array position of the LED chip; after the array-type fluorescent film is arranged at the array position of the LED chip, the second carrier film is removed, and all the target color conversion films are placed on the second carrier film. A target color conversion film is covered on the outer surface of the corresponding LED chip to obtain a white light LED dot matrix light source; a transparent silicone layer is covered on the outer surface of the white light LED dot matrix light source to obtain a high color gamut LED light board; through the above-mentioned production method, the present application produces the color conversion material in the form of a film (initial color conversion film), which well ensures the color uniformity and solves the problem of uneven color of fluorescent glue on the COB surface. At the same time, the target color conversion film is produced in the form of a small (grid) array, replacing a large-sized quantum film. The large-scale display device reduces the large-width quantum dot film material while improving the color gamut and display quality, thereby reducing the cost and simplifying the process, thereby realizing the promotion of ultra-large-sized high color gamut display devices.
[0063] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. A method for manufacturing a high color gamut LED light panel, characterized in that: include: Arrange a plurality of LED chip arrays on a PCB substrate, wherein the LED chips are blue light LED chips or blue light combined with green light LED chips; Making an initial color conversion film on a first carrier film, and processing the made initial color conversion film into a plurality of target color conversion films, wherein the size of the target color conversion film is larger than the size of the LED chip; According to the array position of the LED chip, a plurality of the target color conversion films are transferred to the second carrier film to form an array type fluorescent film corresponding to the array position of the LED chip; After the array fluorescent film is arranged on the array position of the LED chip, the second carrier film is removed, and all the target color conversion films are covered and arranged on the outer surface of the corresponding LED chip to obtain a white light LED dot matrix light source; The outer surface of the white light LED dot matrix light source is covered with a transparent silicone layer to obtain a high color gamut LED light panel.
2. The method for manufacturing a high color gamut LED light board according to claim 1, characterized in that: The step of manufacturing an initial color conversion film on the first carrier film and processing the manufactured initial color conversion film into a plurality of target color conversion films specifically includes: An initial color conversion film is produced on a first carrier film, and the produced initial color conversion film is cut into a plurality of target color conversion films by laser cutting.
3. The method for manufacturing a high color gamut LED light board according to claim 1, characterized in that: The step of transferring the plurality of target color conversion films to the second carrier film according to the array position of the LED chip to form an array type fluorescent film corresponding to the array position of the LED chip specifically includes: According to the array position of the LED chip, a plurality of target color conversion films are pushed onto the second carrier film by flat-head ejector pins to form an array type fluorescent film corresponding to the array position of the LED chip.
4. The method for manufacturing a high color gamut LED light board according to claim 1, characterized in that: The steps of setting the array fluorescent film on the array position of the LED chip, removing the second carrier film, and covering and setting all the target color conversion films on the outer surface of the corresponding LED chip to obtain the white light LED dot matrix light source specifically include: After the array fluorescent film is arranged on the array position of the LED chip, the second carrier film is removed, and all the target color conversion films are pasted on the outer surface of the corresponding LED chip; The target color conversion films attached to the outer surface of the LED chip are heated so that all the target color conversion films are closely attached to the outer surface of the LED chip corresponding thereto, thereby obtaining a white light LED dot matrix light source.
5. The method for manufacturing a high color gamut LED light board according to claim 1, characterized in that: The step of covering the outer surface of the white light LED dot matrix light source with a layer of transparent silicone layer to obtain a high color gamut LED light board specifically includes: A layer of transparent silicone is coated on the outer surface of the white light LED dot matrix light source by means of micro-lens dispensing to obtain a high color gamut LED light panel.
6. The method for manufacturing a high color gamut LED light board according to claim 1, characterized in that: The step of covering the outer surface of the white light LED dot matrix light source with a layer of transparent silicone layer to obtain a high color gamut LED light board specifically includes: A layer of transparent silicone is coated on the outer surface of the white light LED dot matrix light source by dispensing glue on the dam to obtain a high color gamut LED light panel.
7. A high color gamut LED light panel, characterized in that: The high color gamut LED light board is prepared based on the manufacturing method of any one of claims 1 to 6, wherein the high color gamut LED light board comprises a PCB substrate, a plurality of LED chips, a target color conversion film and a transparent silicone layer, wherein an array of a plurality of LED chips is arranged on the PCB substrate, the target color conversion film corresponds one-to-one to the LED chips and is covered on the outer surface of the LED chips, and the transparent silicone layer corresponds one-to-one to the target color conversion film and is covered on the outer surface of the target color conversion film.
8. The high color gamut LED light board according to claim 7, characterized in that: The LED chip is a blue light LED chip, and the color conversion film is a green light and red light color conversion film.
9. The high color gamut LED light board according to claim 7, characterized in that: The LED chip is a blue light composite green light LED chip, and the color conversion film is a red light color conversion film.
10. A Mini LED backlight display device, characterized in that: It comprises a panel, an optical film, a diffusion plate and the high color gamut LED light panel as claimed in claim 7 which are connected in sequence.