Circuit board assembly and electronic equipment

Abstract

The invention provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a circuit board, an electronic device and a shielding structure, the electronic device is arranged on the circuit board, and the shielding structure covers the electronic device and is connected with the circuit board; the shielding structure comprises a shielding cover and a shielding layer, a containing cavity is formed in the shielding cover, and an opening communicating with the interior and exterior of the containing cavity is formed in the inner wall, opposite to the circuit board, in the containing cavity; the shielding layer is located on the outer surface of the shielding cover, the shielding layer is connected with the outer surface of the shielding cover and covers the opening, and part of the electronic device is located in the containing cavity and located in the opening; the thickness of the shielding layer is smaller than the wall thickness of the shielding case. According to the circuit board assembly provided by the embodiment of the invention, the space occupied by the circuit board assembly in the electronic equipment can be reduced, and further thinning of the electronic equipment is realized.

Description

Technical Field

[0001] The present invention relates to the field of chip technology and more particularly to a circuit board assembly and an electronic device. Background Art

[0002] With the continuous development of communication technology, the performance requirements for electronic equipment are getting higher and higher. The good working performance of electronic devices in electronic equipment is one of the important factors to ensure the high performance of electronic equipment. However, electronic devices will generate mutual electromagnetic interference when working, which will affect the working performance of electronic devices and electronic equipment.

[0003] In the related art, in order to provide shielding for electronic devices, a shielding cover is often set on a circuit board with electronic devices, and a shielding space is formed between the shielding cover and the circuit board. Electronic devices that are more sensitive to electromagnetic interference are placed in the shielding space, thereby improving the anti-interference ability of the electronic devices in the shielding space.

[0004] However, since the shielding cover is arranged on the electronic device, if the height of the electronic device is relatively large, the thickness of the shielding cover is relatively large, and a relatively large space is occupied in the electronic device, thereby restricting further thinning of the electronic device. Summary of the invention

[0005] The embodiments of the present application provide a circuit board assembly and an electronic device, which can solve the technical problem that when the height of the electronic device is large, the thickness of the shielding cover is large, which occupies a large space in the electronic device, thereby restricting the further thinning of the electronic device.

[0006] In order to achieve the above objectives, the embodiments of the present application provide the following technical solutions:

[0007] A first aspect of an embodiment of the present application provides a circuit board assembly, which includes a circuit board, an electronic device and a shielding structure; the electronic device is arranged on the circuit board, and the shielding structure cover is arranged on the electronic device and connected to the circuit board; the shielding structure includes a shielding cover and a shielding layer, the shielding cover has a accommodating cavity, and the inner wall of the accommodating cavity opposite to the circuit board is provided with an opening connected to the inside and outside of the accommodating cavity; the shielding layer is located on the outer surface of the shielding cover, and the shielding layer is connected to the outer surface of the shielding cover and covers the opening, part of the electronic device is located in the accommodating cavity, and part of the electronic device is located in the opening; the thickness of the shielding layer is less than the wall thickness of the shielding cover.

[0008] The embodiment of the present application provides a circuit board assembly and an electronic device, wherein the circuit board assembly includes a circuit board, an electronic device and a shielding structure. By setting the shielding structure cover on the electronic device and the shielding structure on the circuit board, the electronic device set in the shielding structure can be protected, the influence of electromagnetic interference on the electronic device in the shielding structure is reduced, the working performance of the electronic device in the shielding structure is improved, and the working performance of the circuit board assembly is improved.

[0009] The shielding structure arranges the electronic device in the accommodating cavity of the shielding cover, and the shielding layer is arranged on the outer surface of the shielding cover and covers the opening, so that part of the electronic device is located in the accommodating cavity, and part of the electronic device is located in the opening. Therefore, when the height of the electronic device increases, there is no need to increase the height of the shielding cover, thereby reducing the height of the shielding structure. Furthermore, if the shielding cover in the prior art and the shielding structure of the embodiment of the present application are used to perform electromagnetic shielding on electronic devices of the same height, since the minimum height of the shielding cover in the prior art is equal to the wall thickness of the shielding cover plus the height of the electronic device, and the minimum height of the shielding structure in the present application is equal to the height of the electronic device plus the height of the shielding layer, and the thickness of the shielding layer in the embodiment of the present application is less than the wall thickness of the shielding cover, when electromagnetic shielding is performed on electronic devices of the same height, the height of the shielding structure in the embodiment of the present application is less than the height of the shielding cover in the prior art, thereby achieving that the shielding structure of the embodiment of the present application can reduce the space occupied by the circuit board assembly in the electronic device.

[0010] In a possible implementation, the shielding structure further includes a welding layer, which is disposed between the shielding layer and the outer surface of the shielding cover, and the shielding layer is connected to the shielding cover via the welding layer.

[0011] By arranging a welding layer between the shielding cover and the shielding layer so that the shielding layer is connected to the outer surface of the shielding cover by welding through the welding layer, the outer surface of the shielding cover and the shielding layer can be connected by metal, thereby improving the anti-electromagnetic interference ability of the connection between the shielding layer and the shielding cover, thereby improving the shielding effect of the shielding structure on the electronic device, reducing the influence of electromagnetic interference on the operation of the electronic device in the accommodating cavity, and then improving the shielding effect of the circuit board assembly and the working performance of the circuit board assembly.

[0012] In a possible implementation, the shielding layer is a flexible circuit board. By setting the shielding layer as a flexible circuit board, since the flexible circuit board has the characteristics of light weight, thin thickness, and free bending, compared with the use of an integrated shielding structure in the prior art, since the opening is covered by a thin and light flexible circuit board, it is possible to reduce the weight of the shielding structure while ensuring a good shielding effect, thereby reducing the overall weight of the circuit board assembly and improving the anti-bending performance of the shielding layer.

[0013] In a possible implementation, the shielding layer is a metal layer, and the metal layer is welded to the outer surface of the shielding cover through a welding layer, and the shielding layer and the shielding cover form a shielding structure of metal material through the welding layer, so as to shield the influence of electromagnetic interference on the electronic devices in the accommodating cavity.

[0014] In a possible implementation manner, the shielding layer further includes a first protective layer, and the first protective layer is disposed on a surface of the metal layer facing the opening.

[0015] By arranging the first protective layer on the surface of the metal layer facing the opening, the metal layer can be protected. The metal layer and the electronic device are separated by the first protective layer to avoid damage to the metal layer due to collision with the electronic device in the accommodating cavity, thereby improving the protective performance of the metal layer and increasing the service life of the shielding structure.

[0016] In a possible implementation, the shielding layer further includes a second protective layer, and the second protective layer is disposed on a surface of the metal layer facing away from the opening.

[0017] By arranging the second protective layer on the surface of the metal layer facing away from the opening, other electronic devices arranged on the circuit board assembly outside the shielding structure can be separated from the metal layer by the second protective layer to protect the metal layer and avoid damage to the metal layer during the assembly of the circuit board assembly, thereby improving the protective performance of the metal layer and increasing the service life of the shielding structure.

[0018] In a possible implementation, the first protective layer is a first insulating layer or a first insulating thermally conductive layer; and the second protective layer is a second insulating layer or a second insulating thermally conductive layer.

[0019] By setting the first protective layer as the first insulating layer, the electronic device in the accommodating cavity can be electrically insulated and separated from the metal layer by the first insulating layer, so as to avoid electrical contact between the electronic device arranged in the accommodating cavity and the metal layer, thereby improving the working performance of the electronic device and the circuit board assembly. By setting the first protective layer as the first insulating heat-conducting layer, the first insulating heat-conducting layer can transfer the heat generated by the electronic device in the accommodating cavity when it is working to the metal layer, and further transfer it to the outside of the shielding structure through the metal layer, thereby accelerating the transfer of the heat generated by the electronic device when it is working to the outside of the shielding structure, improving the heat dissipation effect of the shielding structure, and further improving the heat dissipation capacity of the circuit board assembly.

[0020] By setting the second protective layer as the second insulating layer and setting the second insulating layer on the surface of the metal layer facing away from the opening, other electronic devices arranged on the circuit board assembly outside the shielding structure can be insulated and separated from the metal layer by the second insulating layer, so as to avoid electrical contact between other electronic devices outside the shielding structure and the metal layer, thereby improving the working performance of the electronic devices and the circuit board assembly.

[0021] In a possible implementation, the end of the shielding cover facing the opening has a first flange, and the inner edge of the first flange surrounds the opening; the shielding layer and the surface of the first flange facing the shielding layer are connected to the shielding cover.

[0022] By arranging a first flange at the end of the shielding cover facing the opening so that the inner edge of the first flange surrounds the opening, the area of ​​the connection surface between the outer surface of the shielding cover and the shielding layer can be increased, thereby improving the connection stability between the shielding layer and the outer surface of the shielding cover.

[0023] In a possible implementation, the end of the shielding cover facing the circuit board has a second flange, the second flange is arranged around the outer circumference of the shielding cover, and the second flange extends along the side facing away from the shielding cover; the shielding cover is connected to the circuit board via the second flange.

[0024] By providing a second flange extending away from the side of the shielding cover on the outer periphery of the end of the shielding cover facing the circuit board, and connecting the shielding cover to the circuit board through the second flange, the area of ​​the connection surface between the shielding cover and the circuit board can be increased, thereby improving the connection stability between the shielding cover and the circuit board.

[0025] In one possible implementation, the thickness of the shielding layer is greater than or equal to 0.01 mm and less than or equal to 0.1 mm. By setting the thickness of the shielding layer to be greater than or equal to 0.01 mm and less than or equal to 0.1 mm, the thickness of the shielding layer can be reduced to reduce the overall height of the shielding structure, reduce the volume of the shielding structure, reduce the space occupied by the shielding structure in the circuit board assembly, and improve the overall space utilization of the circuit board assembly. Furthermore, by setting the thickness of the shielding layer to be greater than or equal to 0.01 mm and less than or equal to 0.1 mm, it is possible to avoid the shielding layer being too thin and easily damaged due to being less than 0.01 mm, and the shielding structure being too high due to being greater than 0.1 mm, resulting in a large space occupied by the shielding structure.

[0026] In a possible implementation manner, the material of the metal layer is metal copper, metal aluminum, or a metal alloy.

[0027] In a possible implementation manner, the materials of the first protective layer and the second protective layer are polyimide, polyethylene terephthalate and polyethylene.

[0028] In a possible implementation, the welding temperature when the shielding layer is welded to the shielding cover through the welding layer is lower than the welding temperature when the electronic device is welded to the circuit board.

[0029] Compared with the electronic components in the circuit board assembly being welded to the circuit board through welding materials with higher melting points, the shielding layer and the outer surface of the shielding cover are connected by a welding layer with a lower melting temperature. This can avoid the problem of welding failure caused by the welding materials between the electronic components and the circuit board melting due to excessive temperature when the welding layer is melted.

[0030] A second aspect of an embodiment of the present application provides an electronic device, which includes the circuit board assembly as described above.

[0031] The embodiments of the present application provide a circuit board assembly and an electronic device. By using the above-mentioned circuit board assembly, the electronic device can reduce the space occupied by the circuit board assembly in the electronic device because the circuit board assembly uses the above-mentioned shielding structure, thereby achieving further thinning of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 A schematic diagram of the structure of a circuit board assembly provided in an embodiment of the present application;

[0034] Figure 2 A cross-sectional view of a circuit board assembly provided in an embodiment of the present application;

[0035] Figure 3 A cross-sectional view of another circuit board assembly provided in an embodiment of the present application;

[0036] Figure 4 A cross-sectional view of another circuit board assembly provided in an embodiment of the present application.

[0037] Description of reference numerals:

[0038] 100-circuit board;

[0039] 200-Electronic devices;

[0040] 300-shielded structure;

[0041] 310-shielding cover; 320-shielding layer; 330-welding layer;

[0042] 311 - accommodating cavity; 312 - opening; 313 - first flange; 314 - second flange; 321 - first protective layer;

[0043] 322-Second protective layer. DETAILED DESCRIPTION

[0044] As described in the background technology, in the above-mentioned prior art, since the shielding cover is arranged on the electronic device, if the height of the electronic device is large, the thickness of the shielding cover is large, and the space occupied in the electronic device is large, thereby restricting the further thinning of the electronic device. The reason for this problem is that the shielding structure in the prior art can be an integrated structure. When the shielding structure cover of the integrated structure is buckled on the circuit board, the space in the accommodating cavity is formed by the inner wall of the accommodating cavity, and the wall thickness of the shielding structure is not fully utilized. The electronic device cannot extend into the wall thickness of the inner wall, resulting in a low space utilization rate in the shielding structure. When it is necessary to electromagnetically shield a taller electronic device (the height of the electronic device refers to the maximum vertical distance from the electronic device to the circuit board), it is necessary to increase the height of the accommodating cavity by increasing the overall height of the shielding structure (the overall height of the shielding cover refers to the maximum vertical distance from the shielding cover to the circuit board) to accommodate the taller electronic device. However, the increase in the height of the shielding cover will increase the space occupied by the circuit board assembly in the electronic device, thereby restricting the further thinning of the electronic device.

[0045] In view of the above technical problems, the embodiments of the present application provide a circuit board assembly and an electronic device, wherein the circuit board assembly includes a circuit board, an electronic device and a shielding structure. By setting the shielding structure cover on the electronic device and the shielding structure on the circuit board, the electronic device set in the shielding structure can be protected, the influence of electromagnetic interference on the electronic device in the shielding structure is reduced, the working performance of the electronic device in the shielding structure is improved, and the working performance of the circuit board assembly is improved.

[0046] The shielding structure arranges the electronic device in the accommodating cavity of the shielding cover, and the shielding layer is arranged on the outer surface of the shielding cover and covers the opening, so that part of the electronic device is located in the accommodating cavity, and part of the electronic device is located in the opening. Therefore, when the height of the electronic device increases, there is no need to increase the height of the shielding cover, thereby reducing the height of the shielding structure. Furthermore, if the shielding cover in the prior art and the shielding structure of the embodiment of the present application are used to perform electromagnetic shielding on electronic devices of the same height, since the minimum height of the shielding cover in the prior art is equal to the wall thickness of the shielding cover plus the height of the electronic device, and the minimum height of the shielding structure in the present application is equal to the height of the electronic device plus the height of the shielding layer, and the thickness of the shielding layer in the embodiment of the present application is less than the wall thickness of the shielding cover, when electromagnetic shielding is performed on electronic devices of the same height, the height of the shielding structure in the embodiment of the present application is less than the height of the shielding cover in the prior art, thereby achieving that the shielding structure of the embodiment of the present application can reduce the space occupied by the circuit board assembly in the electronic device.

[0047] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work belong to the scope of protection of this application.

[0048] refer to Figure 1 According to a first aspect of an embodiment of the present application, a circuit board assembly is provided. The circuit board assembly may include a circuit board 100, an electronic device 200, and a shielding structure 300. The electronic device 200 is disposed on the circuit board 100, and the shielding structure 300 is covered on the electronic device 200 and connected to the circuit board 100. The circuit board assembly may include a plurality of electronic devices 200, some of which are more sensitive to the influence of electromagnetic interference and may affect the working performance of the electronic device 200. For example, the electronic device 200 may be a storage device or a central processing unit. By providing a shielding structure 300 on such electronic devices 200, the influence of electromagnetic interference on such electronic devices 200 can be effectively shielded to ensure the working performance of such electronic devices 200.

[0049] In some embodiments, the shielding structure 300 can be made of a conductive material, such as conductive ceramic or metal. In a specific implementation, the shielding structure 300 can be made of a metal material, and the shielding structure 300 and the circuit board 100 can be connected by welding or conductive adhesive bonding. Compared with the conductive adhesive bonding method, connecting the shielding structure 300 to the circuit board 100 by welding can improve the connection stability between the shielding structure 300 and the circuit board 100, and can improve the electromagnetic shielding capability of the connection between the circuit board 100 and the shielding structure 300, so as to prevent electromagnetic interference from affecting the electronic device 200 covered by the shielding structure 300 through the connection between the circuit board 100 and the shielding structure 300.

[0050] refer to Figure 1 The shielding structure 300 may include a shielding cover 310 and a shielding layer 320. The shielding cover 310 has a receiving cavity 311. The electronic device 200 is disposed in the receiving cavity 311, and the electronic device 200 is connected to the circuit board 100. The inner wall of the receiving cavity 311 opposite to the circuit board 100 is provided with an opening 312 communicating with the inside and outside of the receiving cavity 311. Figure 1 In the circuit board assembly shown in FIG. 3 , an opening 312 is opened at the top of the shielding case 310 . The shielding layer 320 is located on the outer surface of the shielding case 310 , and the shielding layer 320 is connected to the outer surface of the shielding case 310 and covers the opening 312 .

[0051] refer to Figure 2 In some examples, part of the electronic device 200 is located in the accommodating cavity 311, and part of the electronic device 200 is located in the opening 312. The size of the opening 312 can at least allow the electronic device 200 disposed in the accommodating cavity 311 to pass through, so that the part of the electronic device 200 facing the opening 312 can extend into the opening 312, so that the space in the opening 312 can be used as a part of the accommodating cavity 311, so as to increase the height of the accommodating cavity while keeping the height H1 of the shielding structure unchanged, thereby improving the space utilization of the accommodating cavity 311 and improving the compatibility with electronic devices 200 of different heights.

[0052] refer to Figure 2, the shielding layer 320 covers the outer surface of the shielding cover 310 and can completely cover the opening 312. By using the shielding layer 320 to completely cover the opening 312, the electromagnetic interference at the opening 312 can be shielded by the shielding layer 320, so as to realize the function of the shielding structure 300 to shield the electromagnetic interference. The shielding layer 320 and the outer surface of the shielding cover 310 can be connected by an adhesive layer, and the adhesive layer can be a non-conductive adhesive layer or a conductive adhesive layer. Compared with the non-conductive adhesive layer, the shielding layer 320 and the shielding cover 310 are connected by the conductive adhesive layer, which can increase the conductivity of the connection between the shielding layer 320 and the shielding cover 310, thereby improving the electromagnetic shielding effect of the connection between the shielding layer 320 and the shielding cover 310, and further improving the overall electromagnetic shielding effect of the shielding structure 300. If the shielding layer 320 and the shielding cover 310 are both made of metal materials, the shielding layer 320 and the shielding cover 310 can also be metal-connected by welding to further improve the connection stability between the shielding cover 310 and the shielding layer 320.

[0053] In a specific implementation, the larger the connection area between the shielding layer 320 and the outer surface of the shielding cover 310 near the opening 312, the stronger the connection stability between the shielding cover 310 and the shielding layer 320. Compared with the method of connecting the shielding layer 320 and the outer surface of the shielding cover 310 near the opening 312 through a smaller connection area, the larger the connection area between the shielding layer 320 and the outer surface of the shielding cover 310 near the opening 312, the more the propagation path of electromagnetic interference at the connection can be increased, and the more the electromagnetic shielding performance at the connection between the shielding layer 320 and the outer surface of the shielding cover 310 can be improved.

[0054] In a specific implementation, there is a gap between the shielding layer 320 and the end of the electronic device 200 in the accommodating cavity 311 away from the circuit board 100, thereby avoiding direct contact between the shielding layer 320 and the electronic device 200 and preventing the electronic device 200 from damaging the shielding layer 320.

[0055] refer to Figure 2 The thickness H3 of the shielding layer 320 of the shielding structure 300 of the embodiment of the present application is less than the wall thickness H4 of the shielding cover 310. Compared with the height of the shielding cover in the prior art (the height of the shielding cover is the height of the electronic device 200 plus the wall thickness of the shielding cover), the minimum height H1 of the shielding structure 300 is equal to the sum of the height H2 of the electronic device 200 in the accommodating cavity 311 and the thickness H3 of the shielding layer 320. Therefore, when electromagnetic shielding is performed on electronic devices 200 of the same height, the height H1 of the shielding structure 300 is smaller than the height of the shielding cover in the prior art, which can reduce the space occupied by the circuit board assembly in the electronic device.

[0056] The embodiment of the present application provides a circuit board assembly and an electronic device, wherein the circuit board assembly includes a circuit board 100, an electronic device 200 and a shielding structure 300. By setting the shielding structure 300 on the electronic device 200 and the shielding structure 300 on the circuit board 100, the electronic device 200 set in the shielding structure 300 can be protected, the influence of electromagnetic interference on the electronic device 200 in the shielding structure 300 is reduced, and the shielding structure 300 is improved. By setting the electronic device 200 in the accommodating cavity 311 of the shielding cover 310, the shielding layer 320 is set on the outer surface of the shielding cover 310 and covers the opening 312, so that part of the electronic device 200 is located in the accommodating cavity 311, and part of the electronic device 200 is located in the opening 312, so that when the electronic device 200 is increased in height, the height of the shielding cover 310 does not need to be increased, thereby reducing the height of the shielding structure 300. Furthermore, if the shielding cover in the prior art and the shielding structure 300 of the embodiment of the present application are used to perform electromagnetic shielding on electronic devices of the same height, since the minimum height of the shielding cover in the prior art is equal to the wall thickness of the shielding cover plus the height of the electronic device 200, and the minimum height of the shielding structure 300 in the present application is equal to the height of the electronic device 200 plus the height of the shielding layer 320, and the thickness of the shielding layer 320 of the embodiment of the present application is less than the wall thickness of the shielding cover 310, when electromagnetic shielding is performed on electronic devices 200 of the same height, the height of the shielding structure 300 in the embodiment of the present application is smaller than the height of the shielding cover 310 in the prior art, thereby achieving that the shielding structure 300 of the embodiment of the present application can reduce the space occupied by the circuit board assembly in the electronic device.

[0057] In some examples, the thickness of the shielding layer 320 is greater than or equal to 0.01 mm and less than or equal to 0.1 mm. For example, the thickness of the shielding layer 320 can be 0.01 mm, 0.03 mm, 0.04 mm, 0.06 mm or 0.09 mm. Compared with the integrated shielding structure 300 in the prior art, by setting the thickness of the shielding layer 320 to be greater than or equal to 0.01 mm and less than or equal to 0.1 mm, the thickness of the shielding layer 320 can be reduced to reduce the overall height of the shielding structure 300, reduce the volume of the shielding structure 300, reduce the space occupied by the shielding structure 300 in the circuit board assembly, and improve the overall space utilization of the circuit board assembly. If the thickness of the shielding layer 320 is too thin, for example, the thickness of the shielding layer 320 is set to be less than 0.01 mm, the shielding layer 320 will be easily damaged due to being too thin. If the thickness of the shielding layer 320 is too large, for example, the thickness of the shielding layer 320 is greater than 0.1 mm, the overall height of the shielding structure 300 will be too high due to the excessive thickness of the shielding layer 320 , thereby causing the shielding structure 300 to occupy a larger space.

[0058] refer to Figure 2In a possible implementation, the shielding structure 300 may further include a welding layer 330, which is disposed between the shielding layer 320 and the outer surface of the shielding cover 310, and the shielding layer 320 is connected to the shielding cover 310 through the welding layer 330. By disposing the welding layer 330 between the shielding cover 310 and the shielding layer 320, the shielding layer 320 is connected to the outer surface of the shielding cover 310 by welding through the welding layer 330. It should be noted that the sum of the thickness H3 of the shielding layer 320 and the thickness H5 of the welding layer 330 needs to be less than the wall thickness H4 of the shielding cover 310.

[0059] When the shielding cover 310 and the shielding layer 320 are connected by gluing, there is a problem of poor electromagnetic shielding stability of the shielding structure 300. This is because the shielding layer 320 and the shielding cover 310 are separated due to the failure of the gluing between the shielding cover 310 and the shielding layer 320, which in turn causes the electromagnetic shielding effect of the shielding structure 300 to fail. However, the shielding cover 310 and the shielding layer 320 are connected by means of a welding layer 330, which can make the outer surface of the shielding cover 310 and the shielding layer 320 connected by metal, so that the impedance stability is higher and the electromagnetic shielding performance is more stable, and the anti-electromagnetic interference ability of the connection between the shielding layer 320 and the shielding cover 310 is further improved, thereby improving the shielding effect of the shielding structure 300 on the electronic device 200, reducing the influence of electromagnetic interference on the operation of the electronic device 200 in the accommodating cavity 311, and thus improving the shielding effect of the circuit board assembly and the working performance of the circuit board assembly. Furthermore, the welding connection method is less likely to separate than the gluing method, so that the connection stability between the shielding cover 310 and the shielding layer 320 is further improved, and the electromagnetic shielding performance of the shielding structure 300 is also further improved.

[0060] In a specific implementation, the welding layer 330 can be formed after the solder paste used for welding is melted and solidified. During the installation of the shielding structure 300, the shielding cover 310 can be first buckled on the electronic device 200 that needs electromagnetic shielding, and the shielding cover 310 can be welded to the circuit board 100. Then, solder paste is applied to the outer surface near the opening 312 of the shielding cover 310, and the shielding layer 320 is covered on the opening 312. The solder paste is melted by a reflow soldering process to connect the shielding layer 320 to the outer surface of the shielding cover 310 through the solder paste and form a welding layer 330. At this time, the shielding layer 320 covers the opening 312.

[0061] In a possible implementation, the shielding layer 320 may be a metal layer. The shielding layer 320 may be a single-layer metal layer, and the metal layer may be connected to the outer surface of the shielding cover 310 by means of adhesive such as conductive glue, and the metal layer may also be welded to the shielding cover 310 by welding. In some embodiments, a welding layer 330 may be provided between the outer surface of the shielding cover 310 and the shielding layer 320, and the welding layer 330 may be provided on the outer surface of the shielding cover 310, the metal layer covers the opening 312, and the metal layer is covered on the welding layer 330, so that the metal layer is connected to the outer surface of the shielding cover 310 through the welding layer 330, and the connection between the metal layer and the outer surface of the shielding cover 310 can be completely filled by the welding layer 330.

[0062] By setting the shielding layer 320 as a metal layer, the metal layer is welded to the outer surface of the shielding cover 310 through the welding layer 330, and the shielding layer 320 forms a shielding structure 300 of metal material with the shielding cover 310 through the welding layer 330, thereby shielding the influence of electromagnetic interference on the electronic device 200 in the accommodating cavity 311.

[0063] It is understandable that the material of the metal layer is metal copper, metal aluminum or metal alloy. For example, the metal layer can be a copper layer, an aluminum layer or an alloy layer. The metal alloy can be a copper alloy, an aluminum alloy, an iron alloy, etc. In a possible implementation, the metal layer can be a copper foil, and the thickness of the copper foil is greater than or equal to 0.01 mm and less than or equal to 0.1 mm. For example, the thickness of the copper foil is 0.01 mm, 0.04 mm or 0.06 mm. If the metal layer is a copper foil, copper has better electrical conductivity than the aluminum layer, so the electromagnetic shielding effect of the copper foil is also stronger, which helps to improve the electromagnetic shielding effect of the shielding structure 300. The thickness of the copper foil is 0.01 mm, which can reduce the height of the shielding structure 300 relative to the surface of the circuit board 100 as much as possible while ensuring that the shielding structure 300 has a larger accommodating cavity 311.

[0064] refer to Figure 3In a possible implementation, the shielding layer 320 may also include a first protective layer 321, and the first protective layer 321 is disposed on the surface of the metal layer facing the opening 312. If the shielding layer 320 includes a metal layer and a first protective layer 321, the first protective layer 321 is disposed on the surface of the metal layer facing the opening 312, and the surface of the metal layer facing the opening 312 needs to be directly connected to the connection area connected to the outer surface of the shielding cover 310 through the welding layer 330, and the surface of the connection area on the metal layer is not exposed to the outside, so the connection area does not need to be covered with the first protective layer 321, that is, the first protective layer 321 can only cover the area corresponding to the opening 312 on the metal layer. By arranging the first protective layer 321 on the surface of the metal layer facing the opening 312, the metal layer can be protected, and the metal layer and the electronic device 200 are separated by the first protective layer 321, so as to avoid the damage of the metal layer due to the collision with the electronic device 200 in the accommodating cavity 311, thereby improving the protection performance of the metal layer and improving the service life of the shielding structure 300.

[0065] In some embodiments, the first protective layer 321 may be a protective layer with insulating properties, so as to avoid electrical contact between the electronic device 200 and the metal layer. The first protective layer 321 may also be a material layer with tear resistance and high flexibility, which can improve the flexibility of the metal layer and avoid bending damage to the metal layer. In other embodiments, the second protective layer 322 may also be a protective layer with thermal conductivity, which can improve the heat dissipation efficiency of the electronic device 200. It is understood that the first protective layer 321 can be adhered to the surface of the metal layer facing the opening 312 by gluing.

[0066] refer to Figure 4 , the shielding layer 320 further includes a second protective layer 322, which is disposed on the surface of the metal layer facing away from the opening 312. The second protective layer 322 can cover the entire area of ​​the surface of the metal layer facing away from the opening 312, so as to provide overall protection for the entire surface of the metal layer facing away from the opening 312. By disposing the second protective layer 322 on the surface of the metal layer facing away from the opening 312, other electronic devices 200 disposed on the circuit board assembly outside the shielding structure 300 can be separated from the metal layer by the second protective layer 322, so as to protect the metal layer and avoid damage to the metal layer during the process of assembling the circuit board assembly, thereby improving the protective performance of the metal layer and increasing the service life of the shielding structure 300.

[0067] In some embodiments, the second protective layer 322 may be a protective layer with insulating properties, so as to avoid electrical contact between the electronic device 200 and the metal layer. The second protective layer 322 may also be a material layer that is tear-resistant and has high flexibility, which can improve the flexibility of the metal layer and avoid bending damage to the metal layer. In other embodiments, the second protective layer 322 may also be a protective layer with thermal conductivity, which can improve the heat dissipation efficiency of the electronic device 200. It is understood that the second protective layer 322 may be adhered to the surface of the metal layer facing the opening 312 by gluing.

[0068] refer to Figure 4 In a possible implementation, the shielding layer 320 may have a first protective layer 321, a second protective layer 322 and a metal layer at the same time. By setting the first protective layer 321 on the surface of the metal layer facing the opening 312 and setting the second protective layer 322 on the surface of the metal layer facing away from the opening 312, the two opposite surfaces of the metal layer can be protected at the same time, which can reduce the damage of the electronic device 200 in the shielding cover 310 to the surface of the metal layer facing the opening 312, and reduce the damage of other components outside the shielding structure 300 to the surface of the metal layer facing away from the opening 312, thereby further improving the protection of the metal layer and improving the damage resistance of the shielding layer 320.

[0069] It should be noted that the second protective layer 322 and the first protective layer 321 may be protective layers with the same function, and the material of the first protective layer 321 and the material of the second protective layer 322 may also be the same.

[0070] In a possible implementation, the shielding layer 320 may include two metal layers, a first protective layer 321, a second protective layer 322, and a third protective layer, wherein the first protective layer 321 is disposed on a surface of one of the metal layers facing the opening 312, the second protective layer 322 is disposed on a surface of the metal layer facing away from the opening 312, another metal layer is disposed on a surface of the first protective layer 321 facing the opening 312, and the third protective layer is disposed on a surface of the other metal layer facing the opening 312. By providing two metal layers and three protective layers, the strength of the shielding layer 320 can be further improved and the probability of damage to the shielding layer 320 can be reduced.

[0071] In a possible implementation, the material of the first protective layer 321 and the second protective layer 322 may be one of polyimide (PI), polyethylene terephthalate (PET) and polyethylene (PE). In a specific implementation, the first protective layer 321 and the second protective layer 322 may be polyimide, which has high temperature resistance of more than 400°C and a long-term use temperature range of greater than or equal to -200°C and less than or equal to 300°C. Polyimide has high insulation performance, and its dielectric constant is 4.0 at 103 Hz. By setting the first protective layer 321 and the second protective layer 322 to polyimide, it is possible to improve the thermal conductivity of the shielding layer 320 while ensuring physical protection of the metal layer, so as to accelerate the heat dissipation of the electronic device 200 in the accommodating cavity 311.

[0072] In some embodiments, the first protective layer 321 may be a first insulating layer or a first insulating thermally conductive layer. If the first protective layer 321 is a first insulating layer, by setting the first protective layer 321 as a first insulating layer, the electronic device 200 in the accommodating cavity 311 and the metal layer can be electrically insulated and separated by the first insulating layer, so as to avoid electrical contact between the electronic device 200 disposed in the accommodating cavity 311 and the metal layer, thereby improving the working performance of the electronic device 200 and the circuit board assembly.

[0073] In a specific implementation, if the first protective layer 321 is a first insulating thermally conductive layer, then by setting the first protective layer 321 as the first insulating thermally conductive layer, the metal layer and the electronic device 200 in the accommodating cavity 311 can be insulated and separated to avoid electrical contact between the metal layer and the electronic device 200. At the same time, the first insulating thermally conductive layer can accelerate the transfer of heat generated by the electronic device 200 during operation to the metal layer, and further transfer it to the outside of the shielding structure 300 through the metal layer, thereby accelerating the transfer of heat generated by the electronic device 200 during operation to the outside of the shielding structure 300, thereby improving the heat dissipation effect of the shielding structure 300, and thereby improving the heat dissipation capacity of the circuit board assembly.

[0074] In an exemplary embodiment, the second protective layer 322 is a second insulating layer or a second insulating thermal conductive layer. If the second protective layer 322 is a second insulating layer, by setting the second protective layer 322 as the second insulating layer and setting the second insulating layer on the surface of the metal layer facing away from the opening 312, other electronic devices 200 arranged on the circuit board assembly outside the shielding structure 300 can be insulated and separated from the metal layer by the second insulating layer, so as to avoid electrical contact between other electronic devices 200 outside the shielding structure 300 and the metal layer, thereby improving the working performance of the electronic devices 200 and the circuit board assembly.

[0075] If the second protective layer 322 is a second insulating thermally conductive layer, then by setting the second protective layer 322 as the second insulating thermally conductive layer, it is possible to avoid electrical contact between other electronic devices 200 outside the shielding structure 300 and the metal layer. At the same time, the second insulating thermally conductive layer will accelerate the transfer of heat transferred from the electronic device 200 to the metal layer to the outside of the shielding structure 300, thereby accelerating the transfer of heat generated by the electronic device 200 during operation to the outside of the shielding structure 300, thereby improving the heat dissipation effect of the shielding structure 300, and thereby improving the heat dissipation capacity of the circuit board assembly.

[0076] In some examples, the shielding layer 320 may include a metal layer, a first insulating layer, and a second insulating layer, so that the metal layer is electrically insulated and isolated from the electronic device 200 by the first insulating layer and the second insulating layer. The shielding layer 320 may also include a metal layer, a first insulating thermal conductive layer, and a second insulating thermal conductive layer. By providing the first insulating thermal conductive layer and the second insulating thermal conductive layer, it is possible to accelerate the heat dissipation of the electronic device 200 in the accommodating cavity 311 while performing electrical insulation isolation.

[0077] refer to Figure 4 In a possible implementation, the shielding layer 320 is a flexible circuit board. The shielding layer 320 may be at least one layer of flexible circuit board, for example, the shielding layer 320 may be a single-layer flexible circuit board, a two-layer flexible circuit board superposition structure, or a three-layer flexible circuit board superposition structure. A flexible printed circuit (FPC) is a printed circuit board made of polyimide or polyester film as a substrate with high reliability and high flexibility. In a specific implementation, the shielding layer 320 may be a single-layer flexible circuit board, and the single-layer flexible circuit board may include a copper foil and a first insulating layer and a second insulating layer, and the first insulating layer and the second insulating layer are respectively arranged on two opposite sides of the copper foil.

[0078] By setting the shielding layer 320 as a flexible circuit board, since the flexible circuit board has the characteristics of light weight, thin thickness, and free bending, compared with the integrated shielding structure 300 used in the prior art, since the opening 312 is covered by a flexible circuit board with thin thickness and light weight, it is possible to significantly reduce the weight of the shielding structure 300 while ensuring a good shielding effect, thereby reducing the overall weight of the circuit board assembly and improving the bending resistance of the shielding layer 320.

[0079] refer to Figure 4The end of the shielding cover 310 facing the opening 312 has a first flange 313, the inner edge of the first flange 313 surrounds the opening 312, and the shielding layer 320 is connected to the surface of the first flange 313 facing the shielding layer 320. By providing the first flange 313 at the end of the shielding cover 310 facing the opening 312 so that the inner edge of the first flange 313 surrounds the opening 312, the area of ​​the connection surface between the outer surface of the shielding cover 310 and the shielding layer 320 can be increased, and the connection stability between the shielding layer 320 and the outer surface of the shielding cover 310 is improved.

[0080] refer to Figure 4 If the shielding structure 300 has a welding layer 330, the welding layer 330 can be arranged on the surface of the first flange 313 facing the shielding layer 320, and the surface of the first flange 313 facing the shielding layer 320 can be the surface facing the outside of the shielding structure 300. The welding layer 330 is arranged on the first flange 313, the shielding layer 320 is covered on the opening 312, and the shielding layer 320 is connected to the shielding cover 310 through the welding layer 330 on the first flange 313. By providing the first flange 313, the coating area of ​​the welding layer 330 on the outer surface of the shielding cover 310 can be increased, and the coating of the welding layer 330 can also be facilitated, so that the connection stability between the shielding layer 320 and the shielding cover 310 can be increased or decreased.

[0081] In some embodiments, the plane where the first flange 313 is located can be parallel to the surface where the circuit board 100 is located, thereby ensuring the flatness of the surface of the first flange 313 so that the shielding layer 320 is connected to the surface of the first flange 313 through the welding layer 330.

[0082] refer to Figure 4 In a possible implementation, the end of the shielding cover 310 facing the circuit board 100 has a second flange 314, the second flange 314 is arranged around the outer periphery of the shielding cover 310, the second flange 314 extends along the side facing away from the shielding cover 310, and the shielding cover 310 is connected to the circuit board 100 through the second flange 314. By arranging the second flange 314 extending away from the side of the shielding cover 310 on the outer periphery of the end of the shielding cover 310 facing the circuit board 100, and connecting the shielding cover 310 to the circuit board 100 through the second flange 314, the area of ​​the connection surface between the shielding cover 310 and the circuit board 100 can be increased, thereby improving the connection stability between the shielding cover 310 and the circuit board 100.

[0083] In some embodiments, the shielding cover 310 and the circuit board 100 may be connected by welding or gluing. If the shielding cover 310 and the circuit board 100 are connected by welding, the welding material may be applied to the area corresponding to the second flange 314 on the circuit board 100, and the second flange 314 of the shielding cover 310 is aligned and placed on the welding material applied on the circuit board 100, and the second flange 314 is welded to the circuit board 100 through the welding material by reflow welding.

[0084] It can be understood that the plane where the second flange 314 is located can be nearly parallel to the surface on the circuit board 100 used for welding with the shielding cover 310, so as to improve the connection stability between the first flange 313 and the surface of the circuit board 100, thereby improving the connection stability between the shielding cover 310 and the circuit board 100.

[0085] In a specific implementation, the shielding cover 310 may have both a first flange 313 at the end facing the opening 312 and a second flange 314 at the end facing the circuit board 100. By simultaneously arranging the first flange 313 and the second flange 314 on the shielding cover 310, it is possible to improve the connection stability between the shielding layer 320 and the shielding cover 310, and also improve the connection stability between the shielding cover 310 and the circuit board 100, thereby improving the structural stability of the shielding structure 300 and the connection stability between the shielding structure 300 and the circuit board 100.

[0086] In a possible implementation, the welding temperature when the shielding layer 320 is welded to the shielding cover 310 through the welding layer 330 is lower than the welding temperature when the electronic device 200 is welded to the circuit board 100. By setting the welding temperature when the shielding layer 320 is welded to the shielding cover 310 through the welding layer 330 to be lower than the welding temperature when the electronic device 200 is welded to the circuit board 100, it is possible to avoid the problem that when the shielding layer 320 is welded to the shielding cover 310, the welding material between the electronic device 200 and the circuit board 100 melts due to excessively high welding temperature, thereby causing the electronic device 200 to move or separate relative to the circuit board 100, thereby reducing the difficulty of assembling the circuit board assembly and improving the assembly efficiency of the circuit board assembly.

[0087] In some examples, the electronic device 200 and the circuit board 100 are soldered by high-temperature reflow soldering using a solder material with a higher melting temperature, and the melting temperature of the solder material used in the high-temperature reflow soldering may be 217° C. The shielding layer 320 and the shielding cover 310 may be soldered by a soldering process using a low-temperature reflow soldering, and the melting temperature of the solder layer 330 may be 138° C.

[0088] A second aspect of an embodiment of the present application provides an electronic device, which may include the circuit board assembly as described above.

[0089] An embodiment of the present application provides a circuit board assembly, namely an electronic device. By using the above-mentioned circuit board assembly, the electronic device can reduce the space occupied by the circuit board assembly in the electronic device because the circuit board assembly uses the above-mentioned shielding structure, thereby further thinning the electronic device.

[0090] It is understandable that the electronic device may be a mobile phone (such as a straight-screen mobile phone or a foldable mobile phone), a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a wearable device (such as a smart watch, a smart wristband, a pedometer, a virtual reality device, or other mobile or fixed terminal with a circuit board assembly.

[0091] In a specific implementation, if the electronic device is a mobile phone, the mobile phone includes a display screen, a middle frame and a rear shell. The middle frame has a first surface and a second surface that are arranged opposite to each other, the display screen is arranged on the first surface, and the side of the display screen facing outward is the display surface, the circuit board assembly is arranged on the second surface, the circuit board assembly is electrically connected to the display screen, and the circuit board assembly is used to transmit signals with the screen, and the rear shell is connected to the second surface of the middle frame so that the circuit board assembly is arranged between the rear shell and the middle frame.

[0092] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0093] In general, terms should be understood, at least in part, by the context in which they are used. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending, at least in part, on the context. Similarly, terms such as "a," "an," or "the" may also be understood to convey singular usage or to convey plural usage, depending, at least in part, on the context.

[0094] It should be easily understood that “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).

[0095] In addition, spatially relative terms, such as "below," "below," "beneath," "above," "above," etc., may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board assembly, characterized in that: It comprises a circuit board (100), an electronic device (200) and a shielding structure (300); The electronic device (200) is arranged on the circuit board (100), and the shielding structure (300) is arranged to cover the electronic device (200) and is connected to the circuit board (100); The shielding structure (300) comprises a shielding cover (310) and a shielding layer (320); the shielding cover (310) has a housing cavity (311) therein; an inner wall of the housing cavity (311) opposite to the circuit board (100) is provided with an opening (312) communicating with the inside and outside of the housing cavity (311); The shielding layer (320) is located on the outer surface of the shielding cover (310), and the shielding layer (320) is connected to the outer surface of the shielding cover (310) and covers the opening (312); a portion of the electronic device (200) is located in the accommodating cavity (311), and a portion of the electronic device (200) is located in the opening (312); The thickness of the shielding layer (320) is smaller than the wall thickness of the shielding cover (310).

2. The circuit board assembly according to claim 1, characterized in that: The shielding structure (300) further comprises a welding layer (330), wherein the welding layer (330) is arranged between the shielding layer (320) and the outer surface of the shielding cover (310), and the shielding layer (320) is connected to the shielding cover (310) via the welding layer (330).

3. The circuit board assembly according to claim 1, characterized in that: The shielding layer (320) is a flexible circuit board.

4. The circuit board assembly according to claim 1, characterized in that: The shielding layer (320) is a metal layer.

5. The circuit board assembly according to claim 4, characterized in that: The shielding layer (320) further comprises a first protective layer (321), wherein the first protective layer (321) is arranged on a surface of the metal layer facing the opening (312).

6. The circuit board assembly according to claim 5, characterized in that: The shielding layer (320) further comprises a second protective layer (322), wherein the second protective layer (322) is arranged on a surface of the metal layer facing away from the opening (312).

7. The circuit board assembly according to claim 6, characterized in that: The first protective layer (321) is a first insulating layer or a first insulating heat-conducting layer; The second protective layer (322) is a second insulating layer or a second insulating heat-conducting layer.

8. The circuit board assembly according to any one of claims 1 to 7, characterized in that: The end of the shielding cover (310) facing the opening (312) has a first flange (313), and the inner edge of the first flange (313) surrounds the opening (312); The shielding layer (320) is connected to a surface of the first flange (313) facing the shielding layer (320).

9. The circuit board assembly according to any one of claims 1 to 8, characterized in that: The end of the shielding cover (310) facing the circuit board (100) has a second flange (314), the second flange (314) is arranged around the outer periphery of the shielding cover (310), and the second flange (314) extends along the side facing away from the shielding cover (310); The shielding cover (310) is connected to the circuit board (100) via the second flange (314).

10. The circuit board assembly according to any one of claims 1 to 9, characterized in that: The thickness of the shielding layer (320) is greater than or equal to 0.01 mm and less than or equal to 0.1 mm.

11. The circuit board assembly according to claim 4, characterized in that: The material of the metal layer is metal copper, metal aluminum or metal alloy.

12. The circuit board assembly according to claim 6, characterized in that: The material of the first protective layer (321) and the second protective layer (322) is one of polyimide, polyethylene terephthalate and polyethylene.

13. The circuit board assembly according to claim 2, characterized in that: The welding temperature when the shielding layer (320) is welded to the shielding cover (310) through the welding layer (330) is lower than the welding temperature when the electronic device (200) is welded to the circuit board (100).

14. An electronic device, characterized in that: A circuit board assembly comprising the circuit board assembly as claimed in any one of claims 1 to 13.

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