Thermoelectric module

Abstract

The thermoelectric device includes a support substrate, a thermoelectric element, and a wiring conductor. The support substrate has a first substrate and a second substrate disposed facing each other. The wiring conductors are respectively arranged on the first substrate and the second substrate. The thermoelectric elements are disposed so as to be in contact with each of the opposing wiring conductors. The first substrate has a first region where the thermoelectric element is located. The first substrate has a second region disposed continuously with the first region. The wiring conductor has an extending protrusion throughout the entire second region. A connector is also provided, and a surface of the connector facing the support substrate is in surface connection with the extension protrusion.

Description

Technical Field

[0001] The present disclosure relates to a thermoelectric module for temperature regulation, for example for seat cooling in a motor vehicle or for temperature regulation of a fuel cell, a lithium-ion battery or the like. Background Art

[0002] As a thermoelectric module, for example, there is known a thermoelectric power generation module described in Patent Document 1. The thermoelectric power generation module described in Patent Document 1 includes: a pair of substrates arranged to face each other; electrodes respectively located on the facing surfaces of the pair of substrates; a plurality of thermoelectric elements arranged to be electrically connected between the facing surfaces of the pair of substrates via the electrodes; and leads for conducting with a thermistor, the electrodes and the leads being connected via a conductive bonding material.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-113636 Summary of the invention

[0006] The sample holding device disclosed in the present invention comprises a supporting substrate, a thermoelectric element and a wiring conductor. The supporting substrate comprises a first substrate and a second substrate arranged opposite to each other. The wiring conductors are respectively located on the first substrate and the second substrate. The thermoelectric element is arranged to contact the opposite wiring conductors respectively. The first substrate comprises a first area where the thermoelectric element is located. The first substrate comprises a second area arranged continuously with the first area. The wiring conductor comprises an extended protrusion extending throughout the entire second area. A connector is also provided, wherein the surface of the connector opposite to the supporting substrate is surface-connected to the extended protrusion. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a perspective view showing an example of a thermoelectric module.

[0008] Figure 2 yes Figure 1 A side view of a thermoelectric module is shown.

[0009] Figure 3 It is a side view showing another example of the thermoelectric module.

[0010] Figure 4 It is a side view showing another example of the thermoelectric module.

[0011] Figure 5 yes Figure 4 An enlarged top view of a thermoelectric module is shown.

[0012] Figure 6 1 and 2 are a bottom view and a cross-sectional view showing another example of a thermoelectric module.

[0013] Figure 7 It is a perspective view showing another example of the thermoelectric module.

[0014] Figure 8 This is another example of a thermoelectric module, and is a side view when viewed from a lead member.

[0015] Fig. 9 It is a plan view showing another example of the thermoelectric module.

[0016] Fig.10 It is a perspective view showing another example of the thermoelectric module.

[0017] Fig.11 It is a side view showing another example of the thermoelectric module.

[0018] Fig.12 It is a side view showing another example of the thermoelectric module. DETAILED DESCRIPTION

[0019] The thermoelectric module 100 will be described in detail.

[0020] Figure 1 is a perspective view showing an example of a thermoelectric module 100. Figure 2 yes Figure 1 FIG. 1 is a side view of the thermoelectric module 100 shown in FIG. Figure 1 As shown, the thermoelectric module 100 includes a support substrate 1, a thermoelectric element 2, a wiring conductor 3, a connector 4, and a lead member 5. Specifically, the support substrate 1 has a first substrate 11 and a second substrate 12 facing each other, and the wiring conductor 3 is respectively located on the facing surfaces of the first substrate 11 and the second substrate 12. In addition, the thermoelectric element 2 is configured to be conductively connected to each wiring conductor 33.

[0021] like Figure 2 As shown, the first substrate 11 and the second substrate 12 have a first region 111 where the thermoelectric element 2 is located, and the first substrate 11 has a second region 112 arranged continuously with the first region 111. Furthermore, the wiring conductor 3 has an extended protrusion 31 extending throughout the second region 112. A connector 4 is also provided, and the surface of the connector 4 facing the support substrate 1 is connected to the extended protrusion 31 surface.

[0022] Next, the functions and features of the components constituting the thermoelectric module 100 are described. Figure 1 as well as Figure 2 As shown, the direction from the first region 111 toward the second region 112 is set as a first direction (X), and the direction orthogonal to the first direction is set as a second direction (Y).

[0023] The support substrate 1 is a member for cooling or heating an external device or the like through conduction of the thermoelectric element 2 and the wiring conductor 3. Figure 1 as well as Figure 2 In the figure, the substrate located at the bottom is the first substrate 11, and the substrate located at the top is the second substrate 12. In addition, in all the figures, for easy understanding, a virtual line (two-dot chain line) is provided at the boundary A between the first region 111 and the second region 112.

[0024] The shapes of the first substrate 11 and the second substrate 12 are, for example, rectangular. In addition, as the material of the first substrate 11 and the second substrate 12, for example, a structure in which a metal plate such as copper is attached to the main surface outside the insulating substrate body including an epoxy resin material to which an alumina filler is added, alumina, aluminum nitride or other ceramic material. In addition, a structure in which an insulating material is provided on the main surface inside the substrate body including a conductive material such as silver or copper.

[0025] The support substrate 1 can absorb heat (cool) in the first substrate 11 and generate heat (heat) in the second substrate 12 , or generate heat (heat) in the first substrate 11 and absorb heat (cool) in the second substrate 12 , by the Peltier effect.

[0026] The thermoelectric element 2 is arranged in plurality so as to be electrically connected by the wiring conductor 3. The plurality of thermoelectric elements 2 are p-type thermoelectric elements and n-type thermoelectric elements. The thermoelectric elements 2 are arranged in a plurality of rows and columns at intervals of, for example, 0.1 to 2 times the diameter of the thermoelectric element 2, and are joined to the wiring conductor 3 by solder. In the thermoelectric element 2, the p-type thermoelectric element and the n-type thermoelectric element are alternately arranged adjacent to each other. The shape of the thermoelectric element 2 is, for example, cylindrical. As another shape, there is a prism.

[0027] The wiring conductor 3 is in contact with the opposing portions of the first substrate 11 and the second substrate 12. The shape of the wiring conductor 3 can be adjusted appropriately according to the arrangement of the thermoelectric element 2. The material of the wiring conductor 3 is not limited to copper, and may be silver, silver-palladium, or the like.

[0028] The connector 4 can maintain the conduction with the wiring conductor 3 while maintaining the warping of the support substrate 1. The shape of the connector 4 is, for example, a rectangular shape. Figure 2 As shown, the surface of the connector 4 facing the support substrate 1 is connected to the extended protrusion 31 of the wiring conductor 3. The connector 4 is made of a resin material including PBT (polybutylene terephthalate), PC (polycarbonate), PPS (polyphenylene sulfide), LCP (liquid crystal polymer), nylon, PEEK (polyetheretherketone), and PA (polyamide).

[0029] The lead member 5 is connected to an external power source via the connector 4. The lead member 5 is made of a material including a metal member such as copper, iron, or aluminum. Figure 1The lead member 5 is a round rod-shaped shape, but other than this, various shapes such as a plate shape can be adopted from the viewpoint of design. In addition, the lead member 5 is joined by solder.

[0030] As another example, in order to improve insulation, there is also a structure in which the conductive wire is covered with a resin member to form a belt shape.

[0031] like Figure 1 as well as Figure 2 As shown, the thermoelectric module 100 in this embodiment includes a connector 4 .

[0032] When current flows through the thermoelectric module 100, stress is applied to the connection portion between the wiring conductor 3 and the connector 4. However, the thermoelectric module 100 of the present disclosure is provided with the connector 4 connected to the surface, so the applied stress is small. Therefore, cracks are rarely generated in the connection portion. As a result, the thermoelectric module 100 of the present disclosure has excellent durability.

[0033] In addition, if Figure 3 As shown, the connector 4 may also be fixed to the support substrate 1 via a fixing member 6. Thus, the parallelism of the connector 4 can be maintained compared to the case where the connector 4 is fixed without the fixing member 6. In addition, by using the fixing member 6, the possibility of the connector 4 being peeled off during repeated use can be reduced. As a result, the thermoelectric module 100 of the present disclosure has excellent durability.

[0034] The fixing member 6 is located between the wiring conductor 3 and the connector 4. The fixing member 6 is made of a material containing epoxy resin. Figure 3 In the embodiment, the shape is a frame shape to match the second region 112, but in addition, various shapes such as a plate shape can be adopted from a design point of view.

[0035] In addition, if Figure 3 As shown, the conductive bonding material 7 can also be used in the conduction between the wiring conductor 3 and the connector 4. As a result, the height difference between the connector 4 and the wiring conductor 3 can be adjusted when connecting to the connector 4. As a result, the thermoelectric module 100 of the present disclosure has excellent durability. Figure 3 As shown, the connection between the wiring conductor 3 and the connector 4 by the conductive bonding material 7 with fixed surfaces also means "surface connection".

[0036] In addition, if Figure 3 or Figure 4As shown, the fixing member 6 may also have a surrounding portion 61 surrounding the conductive bonding material 7, and the connector 4 is placed on the surrounding portion 61. Specifically, when viewed from above, the fixing member 6 may also be configured to surround at least the outer edge of the connector 4. Thus, by having the surrounding portion 61, the connector 4 can be placed more stably. In addition, a fixed area for ejecting the conductive bonding material 7 can be formed by the surrounding portion 61. Thus, the amount of the conductive bonding material 7 can be fixed, and the bonding strength of the thermoelectric module 100 is less likely to vary from product to product. As a result, the thermoelectric module 100 disclosed in the present invention has excellent reliability.

[0037] In addition, if Figure 5 As shown, the width of the extended protrusion 31 (line C) may be smaller than the width of the wiring conductor 3 located in the first region 111 (line B). When the thermoelectric module 100 is turned on, heat is sometimes carried in the wiring conductor 3. Therefore, when connected to the wiring conductor 3, thermal stress may be generated and cracks may occur. Therefore, in the case where the width of the extended protrusion 31 (line C) is smaller than the width of the wiring conductor 3 located in the first region 111 (line B), even if thermal stress is generated, it is small, so there are few cases of cracks in the connection portion. As a result, the thermoelectric module 100 of the present disclosure has excellent durability. In addition, by reducing the width, the degree of freedom of the position of the wiring conductor 3 in the second region 112 can be increased. As a result, the thermoelectric module 100 of the present disclosure can be adjusted according to the size of the connector 4 and the supporting substrate 1, so it has excellent reliability. As Figure 5 In the case shown, the width of the wiring conductor 3 located in the first region 111 and the width of the extended protrusion 31 are considered to be 1 to 45 mm and 0.6 to 15 mm, respectively. Figure 5 In FIG. 1 , the connector 4 and the lead member 5 are indicated by dotted lines.

[0038] In addition, if Figure 4 as well as Figure 5 As shown, the portion of the extended protrusion 31 close to the first region 111 other than the portion overlapping the connector 4 in a top view is covered with the resin 8, and the resin 8 may also cover the portion between the first substrate 11 and the second substrate 12 and opposite to the connector 4. By being covered with the resin 8, the thermoelectric element 22 is difficult to contact with the outside air, and the possibility of cracks due to oxidation can be reduced. As a result, the thermoelectric module 100 of the present disclosure has excellent durability.

[0039] In addition, if Figure 6 As shown, the first substrate 11 may have grid-like slits 9 at positions opposite to the second region 112. By having the slits 9, the second region 112 is easily deformed, and the stress applied to the boundary A is further reduced. As a result, the thermoelectric module 100 of the present disclosure has excellent durability.

[0040] The slit mentioned here is Figure 6 A thin incision as shown.

[0041] An example of the pattern of the slit 9 is described below. Figure 6 As shown, two slits 9 extending in the Y direction and slits 9 extending in a grid pattern between the two slits 9 are provided on the opposite side of the second region 112. At this time, if the slits 9 are provided at 45 degrees relative to the X and Y directions, the stress applied to the boundary A is likely to be reduced.

[0042] Furthermore, the ends of the lattice-shaped slits 9 are located at two slits 9 extending in the Y direction, and the slits 9 are connected to each other, thereby most relaxing the stress generated at the boundary A. If the intervals of the lattice are equal, the stress applied to the boundary A is likely to be further reduced.

[0043] In addition, if Figure 6 As shown, the slit 9 may also be located inside the second region 112. Figure 6 In order to facilitate understanding, cross-sectional views of two parts, namely, a part (DD') of the first substrate 11 not having the slit 9 and a part (EE') having the slit 9 are described.

[0044] In addition, if Figure 7 As shown, the second region 112 may also include a fitting portion 1121 of the connector 4, and the fitting portion 1121 may also include a side wall 10, which is arranged along the direction in which the extension portion extends, clamping a fitting region 1122 for the connector 4 to fit. Thus, the connector 4 is clamped by the side wall 10, thereby reducing movement in a direction parallel to the second direction (Y) during use. As a result, the thermoelectric module 100 of the present disclosure has excellent durability. Figure 7 In FIG. 1 , the engaging portion 1121 is indicated by a dotted line.

[0045] The side wall 10 is made of a resin material such as epoxy resin, acrylic acid, silicone, etc. Figure 7 As shown, the side walls 10 are opposed to each other in the second direction (Y), and are in contact with the first substrate 11 and the second substrate 12 , respectively, and at least a portion of each of them is configured from the first region 111 to the second region 112 .

[0046] In addition, as another example, Figure 8 1 is a side view of the thermoelectric module 100 as viewed from the lead member 5. Figure 8As shown in the part F described in the figure, the side wall 10 can also be arranged in contact with the upper surface of the first substrate 11. As a result, compared with the case where the side wall 10 is arranged in contact with the side surface of the first substrate 11, a gap can be provided between the side wall 10 of the first substrate 11 and the outer periphery of the first substrate 11. When a plurality of thermoelectric modules 100 are arranged and mounted through the gap, the possibility of the thermoelectric modules 100 arranged adjacent to each other causing heat propagation and causing an impact can be reduced. As a result, the reliability of the thermoelectric module 100 disclosed in the present invention is excellent.

[0047] In addition, if Figure 8 As shown in the G portion recorded in the figure, the side wall 10 can also be arranged in contact with the side of the second substrate 12. As a result, in addition to the upper surface of the second substrate 12, it is also possible to heat and absorb heat from the side. Therefore, it is possible to heat and absorb heat from more parts of the external components. As a result, the reliability of the thermoelectric module 100 disclosed in the present invention is excellent.

[0048] In addition, if Figure 8 As shown in the portion G described in the figure, the end of the side wall 10 that is connected to the side surface of the second substrate 12 may also have a rounded corner. Thus, compared with the case where the corner has no rounded corner, the stress can be dispersed and the generation of cracks at the end can be reduced. As a result, the thermoelectric module 100 of the present disclosure maintains high durability.

[0049] In addition, if Fig. 9 As shown, the side wall 10 may also be located at a position closer to the inside than the respective ends of the first substrate 11 in the second direction (Y). The "inside" mentioned here means that when looking down at the thermoelectric module 100, there is a portion of the first substrate 11 exposed between the edge of the first substrate 11 and the side wall 10. As a result, the gap described above can be further increased. Therefore, the possibility of the thermoelectric modules 100 arranged adjacent to each other causing heat propagation and affecting the possibility can be reduced.

[0050] In addition, if Fig.10 As shown, the side wall 10 can also block the first direction and the second direction (Y) of the opposing first region 111. Thus, the thermoelectric element 2 can be surrounded, so that the thermoelectric element 2 is not easily exposed to the outside air, and the possibility of cracks due to oxidation can be reduced. As a result, the thermoelectric module 100 has excellent durability.

[0051] In addition, if Fig.11As shown, the height of the side wall 10 may also decrease from the boundary A between the first region 111 and the second region 112 toward the direction away from the first region 111. Thus, compared with the case where the height remains unchanged, the side wall 10 has no corners from the boundary A between the first region 111 and the second region 112 toward the direction away from the first region 111, thereby preventing cracks from being generated. As a result, the thermoelectric module 100 of the present disclosure has excellent durability. In addition, Fig.11 In order to facilitate understanding of the lowering of the height of the side wall 10 , two imaginary lines (dashed lines) extending in parallel are added to the first substrate 11 .

[0052] In addition, if Fig.12 As shown, the side wall 10 may also be wavy in side view in the second region 112. The “wavy” mentioned here means that when the thermoelectric module 100 is viewed from the side, Fig.11 In this way, the profile of the side wall 10 is wavy. As a result, the profile of the side wall 10 can be changed from the boundary A toward the direction away from the first region 111, and the surface area can be increased compared to the case where the height is fixed, so that the heat dissipation is high. Therefore, the degradation of the side wall 10 caused by repeated heating and cooling temperature changes for a long time is less. As a result, the thermoelectric module 100 of the present disclosure has excellent durability. In addition, in Fig.12 In order to make it easier to understand that the contour is wavy, two imaginary lines (dashed lines) extending in parallel are added to the first substrate 11.

[0053] In addition, if Fig.12 As shown, the side wall 10 may also be arranged on the side of the second region 112 of the first substrate 11. Thus, compared with the case where the first substrate 11 is only located at the portion facing the second substrate 12, the portion having the side wall 10 can be increased on the first substrate 11, so even if stress is generated on the support substrate 1 in a wider range, it is easy to alleviate. As a result, the thermoelectric module 100 of the present disclosure has excellent durability.

[0054] In addition, the side wall 10 may be arranged on the side of the first substrate 11. Thus, compared with the case where the first substrate 11 is only located at the portion facing the second substrate 12, the portion having the side wall 10 can be increased on the first substrate 11, so even if stress is generated on the support substrate 1 in a wider range, it is easy to alleviate. As a result, the thermoelectric module 100 of the present disclosure has excellent durability.

[0055] Next, the dimensions of the members constituting the thermoelectric module 100 will be described.

[0056] The first region 111 of the first substrate 11 and the second substrate 12 has a longitudinal length of 4 to 200 mm extending in the first direction (X) and a lateral length of 4 to 200 mm extending in the second direction (Y).

[0057] In addition, the first substrate 11 has a second region 112 behind the first region 111. The second region 112 has a longitudinal length of 1 to 30 mm extending in the first direction (X) and a transverse length of 4 to 200 mm extending in the second direction (Y). The thickness of the first substrate 11 and the second substrate 12 is 0.1 to 5 mm.

[0058] When the plurality of thermoelectric elements 2 are formed into a cylindrical shape, the dimensions of the thermoelectric element 2 are set to, for example, a diameter of 0.2 mm to 5 mm and a height of 0.1 mm to 10 mm.

[0059] Since the wiring conductor 3 is located on the first substrate 1111 and the second substrate 12, it is arranged within the range of 4 to 200 mm of the total length of the support substrate 1 and has a thickness of 0.01 to 0.5 mm.

[0060] The dimensions of the connector 4 are as follows: the vertical length extending along the first direction (X) is 0.9 to 24 mm, and the horizontal length extending along the second direction (Y) is 1 to 48 mm. The thickness of the connector 4 is 0.2 to 5 mm.

[0061] The dimensions of the lead member 5 are such that the lead member 5 has a diameter of 0.1 to 3 mm and a length of 20 to 500 mm as long as the lead member 5 is in the shape of a round rod.

[0062] In the case of a strip shape, the longitudinal length extending along the first direction (X) is 6 mm to 300 mm, the lateral length extending along the second direction (Y) is 2 mm to 50 mm, and the thickness is 0.2 to 5 mm.

[0063] The dimensions of the fixing member 6 are 1 to 30 mm in the longitudinal direction extending in the first direction (X) and 1 to 34 mm in the transverse direction extending in the second direction (Y). In addition, the thickness of the connector 4 is 0.2 to 5 mm. Figure 5 The length of the inner circumference of the inner side of the surrounding portion 61 shown is 0.8 to 36 mm.

[0064] Regarding the size of the resin 8, the length in the longitudinal direction extending along the first direction (X) is 0.3 to 8 mm, and the length in the transverse direction extending along the second direction (Y) is 4 to 200 mm. Figure 4 The height of the resin 8 shown is 0.1 to 7 mm.

[0065] Regarding the dimensions of the fitting portion 1121 , the length in the longitudinal direction extending along the first direction (X) is 1 to 35 mm, and the length in the lateral direction extending along the second direction (Y) is 8 to 200 mm.

[0066] The dimensions of the fitting region 1122 are 1 to 30 mm in the longitudinal direction extending in the first direction (X), and 1 to 35 mm in the lateral direction extending in the second direction (Y).

[0067] Regarding the size of the side wall 10, the length of the longitudinal direction extending in the first direction (X) is 4 to 200 mm, and the length of the transverse direction extending in the second direction (Y) is 0.3 to 8 mm. Figure 7 The height of the side wall 10 shown is 0.1 to 7 mm.

[0068] Next, a method for fixing and a method for manufacturing the connector 4 of an example of the thermoelectric module 100 according to the present embodiment will be described.

[0069] The rod-shaped p-type thermoelectric material and n-type thermoelectric material are cut into predetermined heights by a wire saw to produce p-type thermoelectric elements and n-type thermoelectric elements. A nickel layer is formed on the cut surfaces of the p-type thermoelectric elements and n-type thermoelectric elements by electroplating.

[0070] Next, metal plates that will become the wiring conductors 3 are attached to the mutually opposing surfaces of the first substrate 11 and the second substrate 12 , and after masking, portions other than portions that will become the wiring conductors 3 are removed by etching, thereby forming the wiring conductors 3 .

[0071] Furthermore, solder paste is printed on the wiring conductor 3. Then, the thermoelectric elements are arranged thereon using a chip mounter in such a manner that the p-type thermoelectric element and the n-type thermoelectric element are electrically connected in series. The p-type thermoelectric element and the n-type thermoelectric element arranged as described above are sandwiched between a pair of support substrates 1, and the wiring conductor 3 and the thermoelectric element 2 are joined by solder while applying pressure to the upper and lower surfaces and heating them in a reflow furnace.

[0072] The connector 4 for passing current through the obtained thermoelectric module 100 is joined with a conductive joining material 7 containing solder.

[0073] The thermoelectric module 100 of the present embodiment is manufactured by the above method.

[0074] Next, a method of arranging the thermoelectric element 2 will be described.

[0075] The plurality of thermoelectric elements 2 are composed of a thermoelectric material containing A2B3 type crystals (A is Bi and / or Sb, B is Te and / or Se), preferably a thermoelectric material of Bi (bismuth) and Te (tellurium) system, and the main body thereof. Specifically, the p-type thermoelectric element is composed of a thermoelectric material containing a solid solution of Bi2Te3 (bismuth telluride) and Sb2Te3 (antimony telluride). In addition, the n-type thermoelectric element is composed of a thermoelectric material containing a solid solution of Bi2Te3 (bismuth telluride) and Bi2Se3 (bismuth selenide), for example.

[0076] The thermoelectric material used as the p-type thermoelectric element is a thermoelectric material made of Bi, Sb and Te as main materials, which is melted and solidified once by the Bridgman method, and then solidified in one direction to form a rod-shaped body with a circular cross section. In addition, the thermoelectric material used as the n-type thermoelectric element is the same as the p-type thermoelectric element, and is a thermoelectric material made of Bi, Te and Se as main materials, which is melted and solidified once by the Bridgman method, and then solidified in one direction to form a rod-shaped body with a circular cross section.

[0077] The method for forming the slit 9 is described. It may be any method such as cutting with a diamond grindstone, chemical etching, or dry etching such as sputtering. For example, the slit 9 can be provided by etching a copper-clad substrate, but in this case, it is preferred that the slit 9 is also formed in the substrate portion that becomes the mother material of the copper-clad substrate.

[0078] -Description of Reference Numerals-

[0079] 1: Support base plate

[0080] 11: First substrate

[0081] 111: First Area

[0082] 112: Second Area

[0083] 1121: Chimera Department

[0084] 1122: Chimeric region

[0085] 12: Second substrate

[0086] 2: Thermoelectric element

[0087] 3: Wiring conductor

[0088] 31: Extended protrusion

[0089] 4: Connector

[0090] 5: Lead components

[0091] 6: Fixing components

[0092] 61: Surrounding

[0093] 7: Conductive bonding materials

[0094] 8: Resin

[0095] 9: Slit

[0096] 10: Sidewall

[0097] 100: Thermoelectric module.

Claims

1. A thermoelectric module comprising: support base plate; wiring conductors; and Thermoelectric elements, The support substrate includes a first substrate and a second substrate arranged opposite to each other. The wiring conductors are respectively located on the first substrate and the second substrate, The thermoelectric element and the opposing wiring conductor are respectively arranged in contact with each other. The first substrate has a first region where the thermoelectric element is located and a second region arranged continuously with the first region. The wiring conductor has an extended protrusion extending throughout the second region, The thermoelectric module further comprises a connector. The surface of the connector facing the support substrate is connected to the extending protrusion surface.

2. The thermoelectric module according to claim 1, wherein: The connector is fixed to the support substrate via a fixing member.

3. The thermoelectric module according to claim 2, wherein: The connector is connected to the wiring conductor via a conductive bonding material. The fixing member has a surrounding portion surrounding the conductive bonding material, The connector is placed on the surrounding portion.

4. The thermoelectric module according to claim 1, wherein: The extension protrusion has a width smaller than a width of the wiring conductor located in the first region.

5. The thermoelectric module according to claim 1, wherein: The portion of the extended protrusion close to the first region except for the portion overlapping with the connector in a plan view is covered with resin. The resin covers a portion between the first substrate and the second substrate and facing the connector.

6. The thermoelectric module according to claim 1, wherein: The first substrate has lattice-shaped slits at a position opposite to the second region.

7. The thermoelectric module according to claim 1, wherein: The second region includes a fitting portion of the connector. The fitting portion has side walls disposed along a direction in which the extending protrusion extends, sandwiching a fitting region in which the connector is to be fitted.

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