High-speed substrate classifier

Abstract

A substrate classifier, an inspection and classification system having the substrate classifier, and a method for the inspection and classification system are disclosed herein. The substrate classifier includes: an annular gripper including a rotator and a plurality of vacuum applicators disposed concircularly about an axis; a carrier operable to move the substrate toward the rotator and into a loading area below the rotator; and an actuator coupled with the annular gripper and operable to rotate the rotator about the axis relative to the plurality of vacuum applicators while one or more of the plurality of vacuum applicators hold the substrate against the rotator.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to a high-speed semiconductor sorting apparatus and a semiconductor inspection system including such a sorting apparatus. More specifically, embodiments disclosed herein relate to a substrate sorter for sorting substrates traveling on a high-speed carrier and methods thereof. Background Art

[0002] Semiconductor substrates are routinely inspected by metrology systems before processing to obtain the characteristics and defects of the substrates to ensure strict adherence to predetermined quality control standards. The metrology system can provide comprehensive data about the substrates, such as physical dimensions, optical properties, electrical properties, crystal structure, etc. After the inspection is completed, the substrates are sorted and transferred to designated containers assigned according to their specific characteristics.

[0003] Since substrates can be inspected by metrology stations in parallel, the sorting and transfer of inspected substrates can be a limiting factor in the throughput of the metrology system. For example, a rotary sorter used to sort and transfer inspected substrates employs an indexing motion that rotates in a stop-and-go manner. In such a sorter, a pick arm rotates into a pick area and then stops the motion to allow a substrate to be picked up by the pick arm. Once a substrate has been picked up by the pick arm, the motion of the pick arm is restarted to rotate the pick arm out of the pick area. However, starting and stopping the indexing motion limits the throughput through the system and presents a significant challenge to increasing the speed at which inspected substrates can be handled.

[0004] Furthermore, starting and stopping the indexing motion requires frequent acceleration and deceleration of the pick arm, thus requiring very powerful motors and brakes. As a result, such indexing motion inevitably causes vibrations. Furthermore, as the speed of the indexing motion increases, the frequency of repairs and preventive maintenance also undesirably increases.

[0005] Therefore, there is a need for improved sorting and transfer systems. Summary of the invention

[0006] A substrate sorter, an inspection and sorting system including the substrate sorter, and a method for the inspection and sorting system are disclosed herein. The substrate sorter includes: an annular clamp including a rotator and a plurality of vacuum applicators cocircularly arranged around an axis; a carrier operable to move a substrate toward the rotator and into a loading area below the rotator; and an actuator coupled to the annular clamp and operable to rotate the rotator relative to the plurality of vacuum applicators about the axis while one or more of the plurality of vacuum applicators hold the substrate against the rotator.

[0007] In another example, a system for inspecting and sorting a plurality of substrates is disclosed herein, comprising: a loading unit operable to load substrates; a metrology unit coupled to the loading unit; and a sorting unit as described in the present application and coupled to the metrology unit.

[0008] In yet another example, a method for inspecting and sorting a plurality of substrates is disclosed herein. The method includes the following operations: performing a metrology process on the substrate in a metrology unit, assigning the substrate to a collection bin based on substrate information obtained through the metrology process; transferring the substrate on a carrier from the metrology unit and passing through a loading area where the carrier and a sorter intersect, the sorter including a rotator and a plurality of vacuum applicators; keeping the plurality of vacuum applicators stationary relative to an axis; rotating the rotator relative to the plurality of vacuum applicators around an axis while one or more of the plurality of vacuum applicators hold the substrate against the rotator; picking up the substrate from the carrier by the rotator while the rotator continuously rotates; rotating the rotator and the substrate to the collection bin; and releasing the substrate from the rotator to the collection bin. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Therefore, in order to be able to understand in detail the manner in which the above-mentioned features of the present disclosure are used, a more specific description of the present disclosure briefly summarized above may be made with reference to various embodiments, some of which are shown in the accompanying drawings. However, it should be noted that the accompanying drawings only illustrate exemplary embodiments of the present disclosure and are not therefore to be considered as limiting the scope of the present disclosure, as the present disclosure may allow other equally effective embodiments.

[0010] Figure 1 A top plan view of an inspection system is shown according to one embodiment.

[0011] Figure 2A According to an embodiment Figure 1 Top plan view of the inspection system's high-speed substrate sorter.

[0012] Figure 2B According to an embodiment Figure 1 Cross-sectional view of the loading area in Figure 2.

[0013] Figure 2C According to an embodiment Figure 1 Cross-sectional view of the loading area in Figure 2.

[0014] Figure 2D A perspective partial view of a high speed substrate sorter is shown according to one embodiment.

[0015] Figure 3 A perspective view of at least one Bernoulli picker of a high speed substrate sorter is shown according to one embodiment.

[0016] Figure 4A A perspective view of a substrate collection bin is shown according to one embodiment.

[0017] Figure 4B A cross-sectional view of a substrate collection location is shown according to one embodiment.

[0018] Figure 5 A flow chart of a method for sorting substrates according to one embodiment is shown.

[0019] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0020] Embodiments of the present disclosure generally relate to a substrate classifier, an inspection and classification system including the substrate classifier, and a method for the inspection and classification system. The substrate classifier utilizes non-indexed (i.e., continuous) motion to drive the classifier to run rapidly and uninterruptedly during the process of picking up a substrate and transferring it to a specified position. The vacuum of the classification device used to pick up the substrate is no longer discrete and indexed. Even during the process of picking up the substrate, the vacuum applicator rotates continuously. In other words, two processes: picking up the substrate and rotating the vacuum applicator occur in parallel. This classification device reduces the need for high-power motors, avoids the generation of vibrations caused by frequent acceleration and deceleration of indexing motion, and increases the throughput of the classification device and the substrate inspection system.

[0021] Figure 1 A top plan view of an inspection system 100 according to one embodiment is shown. The inspection system 100 includes a loading unit 102, a metering unit 104, and a sorting unit 106. The loading unit 102 receives one or more boxes 112 containing substrates 110 in a stacked configuration. The loading unit 102 includes a computer (not shown) having a graphical user interface that is suitable for presenting information related to operations occurring in the loading unit 102, including process metrics, batch numbers, etc. The modular unit 104 can be, for example, a metering unit. The sorting unit 106 can be, for example, a sorting module. The loading unit 102, the modular unit 104, and the sorting unit 106 can be arranged linearly relative to one another by way of example only.

[0022] The loading unit 102 includes a transfer robot 108 having a support element 108E, such as a suction element, an end effector, and a gripper fixture for gripping and transferring a substrate 110. The transfer robot 108 is adapted to transfer the substrate 110 from one or more boxes 112 positioned in the loading unit 102 to a conveying system 114. The conveying system 114 may be a motor-driven conveying system, and may include one or more carriers 111, such as a conveyor, a conveyor belt, a pallet transporter, or a track driven by an actuator through rollers and / or a drive gear. The conveying system 114 may be arranged in a linear arrangement to transfer the substrate received from the transfer robot 108 through the modular unit 104. Therefore, the conveying system 114 is arranged in the modular unit 104 and facilitates the transfer of the substrate 110 through the modular unit 104. Additional modular units may be positioned between the loading unit 102 and the modular unit 104, and / or between the modular unit 104 and the sorting unit 106, and / or after the sorting unit 106 to facilitate the expansion of the inspection system 100.

[0023] The modular unit 104 may include one or more metering stations. Figure 1 In the embodiment of the present invention, the modular unit 104 includes five metrology stations 116A-116E. It is contemplated that the inspection system 100 may also be modified by adding or removing metrology stations from the modular unit 104 as space permits, rather than adding a second modular unit, thereby increasing the throughput and / or the number of metrology processes performed.

[0024] By way of example only, the metrology station may include any of the following: a microcrack inspection unit, a thickness measurement unit, a resistivity measurement unit, a photoluminescence unit, a geometry inspection unit, a saw mark detection unit, a stain detection unit, a chip detection unit, and / or a crystal fraction detection unit. By way of example only, the microcrack inspection unit may be configured to inspect a substrate for cracks, and optionally determine a crystal fraction of the substrate. By way of example only, the geometry inspection unit may be configured to analyze surface properties of a substrate. By way of example only, the saw mark detection unit may be configured to identify saw marks including grooves, steps, and double step marks on a substrate. The metrology station may also include other examples than those listed above.

[0025] Since multiple substrates 110 can be inspected in parallel by multiple modular units 116, the substrate carrier 111 travels at a high speed to transfer the substrates within the metrology unit 104 and transfer the inspected substrates 110 to the sorting unit 106. According to one embodiment, the throughput of the inspection system 100 may be as high as 15,000 substrates per hour. In one example, the substrate carrier 111 is a belt conveyor. In another example, the substrate carrier 111 is a palletized conveyor. Other types of substrate carriers 111 may be utilized.

[0026] The sorting unit 106 contains a sorter 120 and a housing 121. According to one embodiment, the sorter 120 includes an annular holder 123 configured to continuously rotate around an axis R during operation. The annular holder 123 includes a gas-permeable spinner (later identified by element number 252 shown in FIG. 2 b ) that rotates below a plurality of vacuum applicators 130. A plurality of vacuum applicators 130 are cocircularly arranged just above the spinner around the axis R. According to one embodiment, each vacuum applicator 130 is configured to independently pull a vacuum through a portion of the spinner located below the vacuum applicator 130. For example, the spinner has a plurality of perforations for conveying a vacuum from the vacuum applicator 130 so that the substrate 110 is held to the portion of the spinner just below the vacuum applicator 130, thereby providing a vacuum. The spinner may have any configuration or be made of any material as long as it is capable of holding the substrate 110, even after the plurality of perforations are created. According to one embodiment, the spinner is made of plastic, such as polyacetal or polyoxymethylene, to avoid scratching the substrate 110. The plurality of vacuum applicators 130 are independently controllable and are capable of holding the substrate 110 in place by vacuum while the annular gripper 123 continuously rotates about the axis R. The vacuum applicators 130 may be assisted by a separate device to raise the substrate 110 from the carrier 111 into contact with the spinner, such as an air nozzle disposed below the substrate 110 or a Bernoulli gripper disposed above the substrate 110.

[0027] The vacuum applicators 130 are configured to hold the substrate 110 in position against the rotator. As the rotator rotates, the substrate 110 is first held against the rotator by one vacuum applicator 130, then by the next adjacent vacuum applicator 130, and so on, as the substrate 110 attached to the rotator rotates sequentially under the ring of adjacent vacuum applicators 130. Once the substrate 110 reaches a designated collection bin 140 at a collection location 250 selected based on the metering results of the substrate 100, the vacuum applied by the vacuum applicator 130 disposed above the designated collection location 250 is reduced or turned off, so that the substrate 110 is released from the rotator and falls into the designated collection location 250. The collection bin 140 may be disposed in each collection location 250 so that the released substrate 110 is collected in the designated collection bin 140. The release may be achieved by increasing the pressure of the vacuum applicator 130 above a threshold amount, i.e., reducing the vacuum power. The release may be achieved by turning off the vacuum or filling the vacuum plenum of the vacuum applicator 130 with a gas. According to one embodiment, a plurality of air nozzles may be provided in the collection location 250 configured to provide an air flow toward the spinner in a direction opposite to the motion of the spinner. Such air flow is selected to slow down the momentum of the substrate 110 when the ring gripper 123 releases the substrate 110 without stopping the rotation of the spinner.

[0028] Figure 1 Only 24 vacuum applicators 130 are illustrated as being included in the ring clamp 123. It is contemplated that a greater or lesser number of vacuum applicators 130 may be utilized. According to one embodiment, the ring clamp 123 includes 12 vacuum applicators 130. According to another embodiment, the ring clamp 123 includes 36 vacuum applicators 130.

[0029] like Figure 1 As shown, the carrier 111 traverses the sorter 120 so that the ring gripper 123 can reach the inspected substrate 110. For example, the carrier 111 and the ring gripper 123 intersect each other at least at two loading areas 133 and 135. In the first loading area 133, the vacuum applicator 130 applies vacuum through the spinner to pick up the substrate 110 for transfer to one of the collection locations 250. Defective or other unsorted substrates 110 that are not sorted are transferred under the ring gripper 123 to the second loading area 135, where the defective substrates 110 are discarded.

[0030] In addition, the carrier 111 can continue through the sorting unit 106 towards the connector 150. Therefore, if the sorting unit 106 does not sort the substrate 110, the inspected substrate 110 can bypass the sorter 120 of the sorting unit 106. In addition, if the inspected substrate 110 is not picked up by the sorter 120, the substrate can continue along the carrier 111 towards the connector 150. In some embodiments, the substrate not picked up by the sorter 120 can continue along the carrier 111, which may lead to an unsorted substrate bin. In some embodiments, the sorting unit 106 can be further connected to additional units via the connector 150, such as, for example only, additional inspection systems, additional sorting units, additional metrology units, etc. The connector 150 can further allow the conveying system 114 to be aligned with the conveying systems of additional units, such as, for example only, additional inspection systems, additional sorting units, additional metrology units, etc.

[0031] The inspection system 100 may also include a controller 190. The controller facilitates control and automation of the inspection system 100. The controller 190 may be coupled to or in communication with one or more of the conveyor system 114, the loading unit 102, the modular unit 104, the sorting unit 106, the transfer robot 108, and / or the metrology stations 116A-116E. The inspection system 100 may provide information to the controller 190 regarding the substrate movement, substrate transfer, substrate sorting, and / or metrology performed.

[0032] The controller 190 may include a central processing unit (CPU) (not shown), a memory (not shown), and support circuits (or I / O) (not shown). The CPU may be one of any form of computer processor used in industrial settings to control various processes and hardware (e.g., pattern generators, motors, and other hardware) and monitor processes (e.g., processing time, substrate positioning or position). The memory (not shown) is connected to the CPU and may be one or more of readily available memories, such as random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, or any other form of digital storage (local or remote). Software instructions and data may be encoded and stored in the memory for instructing the CPU. Support circuits (not shown) are also connected to the CPU for supporting the processor in a conventional manner. The support circuits may include conventional caches, power supplies, clock circuits, input / output circuit systems, subsystems, and the like. A program (or computer instructions) readable by the controller 190 determines which tasks may be performed on the substrate. The program may be software readable by the controller 190 and may include code for monitoring and controlling, for example, processing time and substrate positioning or position within the inspection system 100.

[0033] Figure 2A Shows Figure 1 1. A top plan view of a classifier 120 of the embodiment of the present invention. The rotator of the ring gripper 123 is supported by a support frame including an inner frame 125, an outer frame 127, a plurality of radially arranged tubular members 129, and a support platform 122. The support platform 122 is coupled to a rotary actuator, such as a motor, which rotates the support frame on an axis R. According to one embodiment, the ring gripper 123 is configured to continuously rotate about the axis R while the vacuum applicator 130 applies vacuum through the rotator to secure the substrate 110 from the carrier 111. In one example, the vacuum applicator 130 rotates about the axis R with the rotator into the first loading area 133. In another example, the vacuum applicator 130 remains stationary while the rotator rotates about the axis R. The rotation of the rotator continues without stopping while the vacuum applicator 130 located above the first loading area 133 picks up the substrate 110. While the rotator rotates into the first loading area 133, the substrate 110 attached to the ring clamp 123 also rotates around the axis R. By performing the picking motion and the rotating motion in parallel or simultaneously, the classifier 120 can classify the substrate 110 at a very high speed. The support platform 122 can be a rotating disk, a circular support, or any other shape. A plurality of tubular members 129 couple the inner frame 125 and the outer frame 127 to the support platform 122 via appropriate coupling mechanisms (such as, for example, welding connection, pin connection, fastening connection, etc.). The rotator is fixed between the inner frame 125 and the outer frame 127 so that the rotator rotates in unison with the support frame.

[0034] Each vacuum applicator 130 may include left and right walls 124, 126 that separate the vacuum applicator 130 from adjacent vacuum applicators 130, thereby allowing the application of vacuum or pressure applied by the portion of the spinner immediately preceding each vacuum applicator 130 to be independently controllable relative to the other vacuum applicators 130. Each vacuum applicator 130 generally includes a plenum box having one side open to the spinner, wherein plenum chambers in the plenum box are independently coupled to a vacuum source, and optionally also to a pressure source, such that the pressure and / or vacuum within each plenum chamber can be independently controlled.

[0035] In each collection position 250, one or more substrate collection bins 140 are arranged around the peripheral area of ​​the annular holder 123 to receive and store the sorted substrates 110. In one embodiment, the substrate collection bins 140 are arranged in a circular arrangement and share a common axis R as the center of the circular arrangement. In response to one or more substrate characteristics determined during one or more inspection processes performed in the metrology stations 116A-116E, the substrates 110 may be sorted into the substrate collection bins 140. Once the sorter 120 transfers the substrates 110 to the collection position 250 for the substrate collection bins 140, the pressure of the vacuum applicator 130 above the substrates 110 is increased to above a threshold amount, and the substrates 110 are released from the rotator into the appropriate substrate collection bins 140.

[0036] The substrate collection bins 140 may each be independently removable from the sorting unit 106. Although not shown, it is contemplated that additional substrate collection bins 140 may be positioned within the sorting unit 106 to receive substrates 110 that may have been inadvertently omitted from sorting, thereby preventing damage to such substrates. Additionally, a rejection bin may be positioned within the sorting unit 106 to capture substrates 110 that have been rejected by one or more of the metrology stations 116A-116E of the modular unit 104. Thus, the sorter 120 may deliver damaged substrates to the rejection bin.

[0037] As discussed above, the support platform 122 can be coupled to a rotary actuator (not shown), such as a pneumatic, hydraulic, or electric motor. The rotary actuator continuously rotates the support platform 122 in a non-indexed manner. With the assistance of sensors that detect the positioning of the substrate 110, the substrate 110 can be picked up from the carrier 111 and fixed to the rotator by applying vacuum to the vacuum applicator 130 around the loading area 133, and then released into the substrate collection bin 140, which is arranged in a collection position 250 arranged below the rotator. When the rotator passes through all substrate collection bins 140, the sorter 120 can sort the substrate 110 into a desired one of the substrate collection bins 140 by turning off or substantially reducing the vacuum applied to the vacuum applicator 130, which is associated with the portion of the rotator arranged above the desired collection position. In some embodiments, the sorter 120 can advantageously sort at least 15,000 substrates per hour, which is a significant improvement over other sorting systems.

[0038] Figure 2B According to one embodiment, Figure 2A 13. A cross-sectional view of a first area 133 of the present invention is shown in FIG. 13. The cross-sectional view illustrates the vacuum applicator 130, the substrate 110, the carrier 111, and the lifter 242 below the carrier 111. The carrier 111 carries the substrate 110 and travels toward the axis R in a linear motion 256 while the rotator 252 rotates about the axis R. The direction of travel of the rotator 252 at the first area 133 is approximately perpendicular to the linear motion 256 of the carrier 111 and can be considered as a lateral motion relative to the carrier 111. As previously disclosed in this application, the rotator 252 rotates into the loading area 133 and continues its rotational movement without stopping. While the rotator 252 continues to rotate, the vacuum applicator 130, which is stationary relative to the rotator 252, applies a vacuum through the rotator 252, which picks up the substrate 110 from the carrier 111, such as by vacuum power.

[0039] According to one embodiment, the annular rotator 252 is air-permeable and / or includes a plurality of perforations for conveying the vacuum provided by the vacuum applicator 130 to the substrate 110. The annular rotator 252 may be attached to the inner frame 125 and the outer frame 127, which are coupled to an actuator (such as a motor) via a tubular member 129 and a support platform 122. The annular rotator 252 may be formed by an annular block having a plurality of channels. The annular block may be made of plastic, aluminum, or any other suitable material. According to one embodiment, the vacuum applicator 130 may be a vacuum plenum adjacent to the upper surface of the annular rotator 252. The vacuum plenum includes a plurality of vacuum portions, and each portion of the vacuum plenum is designed to control a portion of the annular rotator 252. According to one embodiment, the vacuum plenum is stationary while the annular rotator 252 rotates around the axis R. According to another embodiment, the vacuum applicator 130 is attached to the annular rotator 252 and rotates with the annular rotator 252.

[0040] In order to pick up the substrate 110, the vacuum applicator 130 provides vacuum to the ring rotator 252 after the ring rotator 252 has sufficient overlap above the substrate 110. According to one embodiment, a predetermined level of vacuum is generated and maintained at all times by the vacuum applicator 130, and a valve is used to control the supply of vacuum to the ring rotator 252 and the substrate 110. The perforations of the ring rotator 252 are configured to immediately deliver vacuum power to the substrate 110 on the carrier 111. Again, while the substrate 110 is picked up, the ring rotator 252 of the ring gripper 123 continues to rotate. Compared to those systems that use a serial process for picking up and rotating (such as an indexing method), this parallelization of the picking process and the rotation of the ring rotator 252 can provide a very high throughput for the sorting system.

[0041] According to one embodiment, the loading area 133 further includes a lifter 242 disposed below the carrier 111 and configured to lift the substrate 110 using an air flow. The lifter 242 may include a plurality of air nozzles that release air jets at appropriate times and have a strength to lift the substrate 110 toward the circular rotator 252. The carrier 111 further includes a plurality of perforations 246 that allow the air flow released by the lifter 242 to reach the substrate 110. The lifter 242 can assist the vacuum applicator 130 in picking up the substrate 110.

[0042] According to another embodiment, the first area 133 may further include an auxiliary vacuum applicator 248 positioned adjacent to the ring-shaped rotator 252. In some cases, the vacuum generated by the vacuum applicator 130 may not be sufficient to pick up the substrate 110. Therefore, the auxiliary vacuum applicator 248 may be used together with the vacuum applicator 130 to pick up the substrate 110. Once the substrate 110 is picked up, the vacuum applicator 130 generates enough suction to hold the substrate 110 to the rotator 252 without additional assistance, and the assistance of the lifter 242 and the auxiliary vacuum applicator 248 can be turned off. The auxiliary vacuum applicator 248 may include a plurality of Bernoulli grippers 254 or any other suitable grippers. According to one embodiment, the auxiliary vacuum applicator 248 represents a stationary vacuum applicator disposed within the loading area 133 and does not rotate with the ring gripper 123. According to another embodiment, the auxiliary vacuum applicator 248 is attached to the ring-shaped rotator 252 and moves with the ring-shaped rotator 252.

[0043] Figure 2C According to another embodiment, Figure 2A A cross-sectional view of the cross-sectional line SS at the first area 133 in FIG. Figure 2C It is shown that the auxiliary vacuum applicator 248 may be centrally disposed between two concentric annular rotators 252A, B. The concentric annular rotators 252A, B are both coupled to a support frame, wherein each rotator portion 252A or 252B interfaces with at least one vacuum applicator 130 . Figure 2C The centrally located vacuum applicator 248 is shown with Figure 2B The auxiliary vacuum applicator 248 is shown as being disposed peripherally in contrast. According to one embodiment, each vacuum applicator 130 may be separated into a plurality of vacuum portions 130A and 130B, and the auxiliary vacuum applicator 248 is disposed between those vacuum portions 130A and 130B. According to one embodiment, the vacuum portions 130A and 130B are disposed concentrically around the axis R.

[0044] Figure 2D A perspective partial view of a high speed substrate classifier according to one embodiment is shown. Figure 2D As shown, the rotator 252 of the ring clamp 123 includes two concentric parts 252A and 252B that hold a plurality of substrates 110. The high-speed substrate sorter includes a roller module 270 that is configured to engage with the rotator 252 and rotate it. According to one embodiment, the roller module 270 includes a leg 272 coupled to a cantilever beam 276. The leg 272 is attached to the ground or other parts of the high-speed substrate sorter. The cantilever beam 276 is disposed above the rotator 252 and is coupled to a plurality of rollers 274 that engage with the concentric parts 252A and 252B. Figure 2DAs shown, each section 252A or 252B has two rollers 274 engaged with its sidewalls. The rollers 274 are driven by a suitable actuation mechanism (such as a motor). When the rollers 274 rotate, the rollers cause the rotator 252 to rotate due to the contraction force between the rollers 274 and the sections 252A and 252B. According to one embodiment, the high-speed substrate sorter may include a plurality of roller modules 270 coupled by concentric members 278. These concentric members 278 are substantially consistent with the shape of the concentric sections 252A and 252B.

[0045] like Figure 2D As shown, the vacuum applicator 130 includes two concentric parts 130A and 130B, whose shapes also conform to the shapes of the concentric parts 252A and 252B. The concentric parts 130A and 130B are connected to each other by a connecting member 282. An opening 280 is provided on the connecting member 232 to allow vacuum to enter the vacuum applicator 130. According to one embodiment, an auxiliary vacuum applicator 248 (such as a Bernoulli picker) is provided between the concentric parts 252A and 252B at the loading area 133.

[0046] Figure 3 A perspective bottom view of at least one auxiliary vacuum applicator 248 of the sorter 120 is shown. Figure 3 In the embodiment of the present invention, four grippers 254 are illustrated; however, it is contemplated that any number of grippers 254, including one gripper 254, may be utilized. In one embodiment, each gripper 254 may be a Bernoulli picker 210. Each Bernoulli picker 210 may extend downwardly to lift the substrate 110, or simply generate sufficient vacuum force to pull the substrate 110 toward the rotator 252. The location of each Bernoulli picker 210 depends on the number of Bernoulli pickers utilized. In one embodiment, only one Bernoulli picker 210 may be utilized, and therefore, it is contemplated that the Bernoulli picker 210 may be centrally located between two vacuum applicators 130, or alternatively located on either side of a single vacuum applicator 130.

[0047] Each Bernoulli picker 210 is operable to provide a soft contact transfer of the substrate 110 by applying an air flow between the non-contact surface 214A of the Bernoulli picker 210 and the substrate 110. The air flow from the non-contact surface 214A can generate a vacuum and a lifting force on the surface of the substrate 110. The stopper 214B can be located between the non-contact surface 214A of the Bernoulli picker and the substrate 110. When sorting the substrate, the stopper 214B can prevent the substrate 110 from sliding or moving from the Bernoulli picker 210. The stopper 214B can be a thin material, such as a material that does not damage the substrate 110. The stopper 214B can prevent the substrate 110 from contacting the non-contact surface 214A of the Bernoulli picker 210. In one embodiment, the substrate 110 does not directly contact the Bernoulli picker 210, but can contact the bottom surface of the vacuum applicator 130.

[0048] Figure 4A A perspective view of a collection location 250 and a substrate collection bin 140 is shown according to one embodiment. Based on the inspection data obtained in one or more metrology stations 116A-116E, each substrate 110 is sorted into a substrate collection bin 140 placed in the collection location 250. According to one embodiment, the substrate collection bin 140 and the vacuum applicator 130 are both fixed and paired for ease of control. When the substrate is positioned above the appropriate bin, the sorter 120 continues to rotate without stopping. The substrate 110 positioned above the appropriate bin 140 can be released from the corresponding rotator 252 so that the substrate falls into the substrate collection bin 140. The release can be achieved by turning off the vacuum of the paired vacuum applicators 130 and letting the substrate 110 fall under gravity. According to one embodiment, air flow is released by the paired portions of the vacuum plenum to push the substrate 110 away from the annular rotator 252. The air flow can be generated by reversing the operation of the vacuum applicator 130.

[0049] The determination of the position of releasing the substrate 110 takes into account the tangential and radial momentum of the substrate 110, so that the released substrate 110 can accurately reach the designated substrate collection bin. When the substrate 110 reaches the designated substrate collection bin, the substrate 110 encounters an air pillow 192, or resistance, which slows down the fall and other movements of the substrate 110. The air pillow 192 can provide resistance to the falling substrate 110, so that the substrate 110 gently falls into the substrate collection bin 140.

[0050] like Figure 4AAs further shown, in certain embodiments, the collection location 250 optionally includes a frame 164 that holds a plurality of first gas nozzles 162 and a plurality of second gas nozzles 160. The frame 164 is disposed in a position such that the filled bin 140 can be removed from the collection location 250 without any interference from the frame 164. The plurality of first gas nozzles 162 are oriented opposite to the tangential movement 402 of the released substrate 110, while the plurality of second gas nozzles 160 are oriented opposite to the radial movement 404 of the released substrate 110. The optional gas nozzles 160 and 162 may release pressurized gas, such as air, oxygen, or any other suitable pressurized or non-pressurized gas, to slow down or dampen the radial and tangential momentum of the released substrate 110, respectively. The amount of air released by the gas nozzles 160 and 162 may be controlled by the controller 190.

[0051] It is contemplated that the frame 164 with the gas nozzles 160 and 162 may be disposed at a location other than the interior of the substrate collection bin 140. For example, the frame 164 and the gas nozzles 160 and 162 may be disposed at a region slightly below the annular holder 123 and above the substrate collection bin 140. Other locations may also be selected as long as the gas jets released by the nozzles 160 and 162 can slow down the tangential and radial motions of the released substrate 110.

[0052] Figure 4B According to one embodiment, Figure 4A 2 is a cross-sectional view of the cross-sectional line BB at the substrate collection bin 140 of FIG. The substrate 110 is released by the vacuum applicator 130. The air flow 262 can be generated by the vacuum applicator 130 or a separate nozzle 264 to push the substrate 110 away from the annular spinner 252. When the substrate 110 is released by the vacuum applicator 130, the substrate has a tendency to maintain the momentum generated by the rotation rate of the substrate 110 attached to the rotating spinner 252. Figure 4B As shown, the substrate 110 continues to travel in a radial direction 404 (in addition to a tangential direction). This is different from a sorting system using an indexing motion in which the gripper stops any rotational movement before releasing the substrate into the substrate collection bin. In a sorting system with an indexing motion, the substrate falls into the substrate collection bin substantially without tangential or radial movement. In order to slow down the radial and tangential movement of the substrate 110, the collection position 250 where the bin 140 resides includes one or more gas nozzles 160 and 162, which are fixed by a frame 164 and arranged in a direction opposite to the radial and tangential movement of the substrate 110. The tangential movement of the released substrate can be hindered similarly to the radial movement by the gas nozzle 162.

[0053] Figure 5A flowchart 500 of a method for inspecting and sorting a plurality of substrates is shown according to one embodiment. The flowchart 500 begins at operation 502, where a box holding a plurality of substrates for inspection is positioned at a loading station of an inspection system. The loading unit loads a plurality of substrates 110 into the inspection system 100. The conveyor system 114 of the inspection system moves the substrates through various modular units such as metrology stations 116A-116E. Once the metrology unit receives the substrate 110, a metrology process is performed on the substrate in the modular unit 104. The substrate can be inspected by a first metrology station such as metrology station 116A. By way of example only, the metrology station 116A can be a microcrack inspection unit, a thickness measurement unit, a resistivity measurement unit, a photoluminescence unit, a geometry inspection unit, or a saw mark detection unit. Any number of metrology units can be included within the modular unit 104 along the conveyor system 114.

[0054] At operation 504, the substrate 110 may be assigned to the substrate collection bin 140 based on the substrate information obtained by the various metrology units. The substrate information includes metrology data and inspection results. The substrate information obtained by the various metrology units may be sent to a yield analysis server, which may analyze the data and inspection results and assign the substrate to the substrate collection bin 140. For illustration, by way of example only, the metrology station 116A may be a microcrack inspection unit. If the metrology station 116A inspects the substrate and determines that the substrate contains one or more microcracks, such data may be sent to the yield analysis server. The yield analysis server may then determine that a particular substrate is assigned to, for example, the substrate collection bin D due to the microcracks.

[0055] At operation 506, the substrate 110 is placed on a carrier 111, which transfers the substrate 110 out of the metrology unit. According to one embodiment, the carrier 111 transfers the substrate 110 in a linear motion toward an axis R of the sorter unit.

[0056] In operation 508 , the carrier 111 transfers the substrate 110 to the loading area 133 where the ring gripper 123 and the carrier 111 intersect each other.

[0057] At operation 510, the ring gripper 123 includes a ring rotator 252 that continuously rotates in a non-indexed manner about an axis R. The rotator 252 rotates into the loading area 133 and intersects the carrier 111 carrying the substrate 110. The ring gripper 123 further includes a plurality of vacuum applicators 130. According to one embodiment, the plurality of vacuum applicators 130 remain stationary relative to the axis.

[0058] In operation 512, while the spinner 252 of the ring gripper 123 continues to rotate, the vacuum applicator 130 of the ring gripper 123 picks up the substrate 110 by using the vacuum power applied by the spinner 252. The air flow may be released under the substrate 110 through the lifter 242 to lift the substrate toward the spinner 252. In addition, operation 510 may also use an auxiliary vacuum applicator 248, such as a Bernoulli gripper, to assist the vacuum applicator 130 in lifting the substrate into contact with the spinner 252.

[0059] At operation 514, the fixed vacuum applicator 130 holds the substrate 110 in position against the spinner 252 by using a vacuum. The substrate 110 held against the spinner 252 continues to rotate toward the substrate collection bin 140 disposed in the collection position 250. The vacuum applicator 130, which is in abutment with the upper surface of the gas permeable spinner 252 of the ring holder 123, maintains the vacuum above a predetermined level sufficient to hold the substrate 110 against the rotating spinner 252. The vacuum level is maintained within the vacuum plenum or applicator 130 until the substrate 110 is adjacent to the substrate collection bin 140.

[0060] At operation 516, when the rotating spinner 252 moves the substrate 110 to the substrate collection position, the pressure of the vacuum applicator 130 is increased above a threshold amount, so that the vacuum power is reduced to a level that cannot hold the substrate 110 against the rotating spinner 252, thereby allowing the substrate 110 to fall off the ring clamp 123. Then, the substrate 110 is released while the spinner 252 continues to rotate. The pressure of the vacuum applicator 130 can be increased by simply turning off the vacuum or by injecting gas into the plenum of the vacuum applicator 130. The substrate collection chamber 140 is provided at the substrate collection position to receive the substrate 110. The substrate collection position and the chamber may include a plurality of gas nozzles 162 and 160, which are directed in a direction opposite to the radial and tangential movement of the released substrate 110. The gas nozzles 162 and 160 release gas jets to hinder the radial and tangential movement of the released substrate 110.

[0061] Those skilled in the art will appreciate that the foregoing examples are illustrative and not limiting. All permutations, additions, equivalents, and improvements thereof that would be apparent to those skilled in the art after reading the specification and studying the drawings are intended to be included within the true spirit and scope of the present disclosure. Thus, the following appended claims are intended to include all such modifications, permutations, and equivalents that fall within the true spirit and scope of these teachings.

Claims

1. A substrate classifier, comprising: an annular holder comprising a rotator and a plurality of vacuum applicators co-circularly disposed about an axis; a carrier operable to move a substrate toward the spinner into a loading area below the spinner; as well as An actuator is coupled to the annular clamp and is operable to rotate the rotator about the axis relative to the plurality of vacuum applicators while one or more of the plurality of vacuum applicators holds the substrate against the rotator. 2 . The substrate sorter of claim 1 , wherein the plurality of vacuum applicators remain fixed relative to the axis. 3 . The substrate sorter of claim 2 , wherein the plurality of vacuum applicators includes a first vacuum applicator disposed above the loading area and operable to pick up the substrate while the rotator rotates about the axis.

4. The substrate classifier according to claim 3, further comprising: An auxiliary vacuum applicator is disposed above the loading area of ​​the carrier, the auxiliary vacuum applicator being operable to assist in transferring the substrate disposed on the carrier to the spinner.

5. The substrate classifier of claim 2, wherein the spinner is air permeable and comprises two concentric parts.

6. The substrate classifier according to claim 5, further comprising: An auxiliary vacuum applicator is operable to assist in transferring the substrate disposed on the carrier to the spinner and is disposed between the two concentric portions. 7 . The substrate sorter of claim 5 , wherein the actuator comprises a plurality of rollers configured to engage with and rotate the two concentric portions. 8 . The substrate sorter of claim 7 , wherein the actuator comprises a beam disposed above the rotator and configured to support the plurality of rollers.

9. The substrate sorter of claim 1 , wherein the plurality of vacuum applicators include a second vacuum applicator corresponding to a substrate collection position, such that when a pressure of the second vacuum applicator rises above a threshold amount, the substrate held by the rotator is released to the substrate collection position.

10. The substrate classifier according to claim 9, further comprising: A removable bin is disposed at the substrate collection location.

11. The substrate classifier according to claim 9, further comprising: A first nozzle is disposed adjacent the substrate collection location and is oriented to direct a first jet of gas in a first direction opposite to a tangential direction of the spinner.

12. The substrate classifier according to claim 9, further comprising: A second nozzle is disposed adjacent the substrate collection location and is oriented to direct a second jet of gas in a second direction opposite to the radial direction of the spinner.

13. The substrate classifier according to claim 9, further comprising: A third nozzle is disposed above the second vacuum applicator and is oriented to direct a third jet of gas in a third direction toward the substrate collection location.

14. The substrate classifier according to claim 1, further comprising: A lifter is disposed below the carrier at the loading area, the lifter being operable to assist in transferring the substrate disposed on the carrier to the first vacuum applicator.

15. A system for inspecting and sorting substrates, comprising: a loading unit operable to load a substrate; a metering unit coupled to the loading unit; and A classification unit coupled to the metering unit, wherein the classification unit comprises: an annular holder comprising a rotator and a plurality of vacuum applicators co-circularly disposed about an axis; a carrier operable to transfer the substrate toward the spinner into a loading area below the spinner; as well as An actuator is coupled to the annular clamp and is operable to rotate the rotator about the axis relative to the plurality of vacuum applicators while one or more of the plurality of vacuum applicators holds the substrate against the rotator.

16. The system of claim 15, wherein the plurality of vacuum applicators remain stationary relative to the axis and include a first vacuum applicator disposed above the loading area and operable to pick up the substrate while the spinner rotates about the axis.

17. The system of claim 16, wherein the rotator comprises two concentric sections; and the actuator comprises a plurality of rollers configured to engage with and rotate the two concentric sections.

18. The system of claim 17, further comprising: An auxiliary vacuum applicator is operable to assist in transferring the substrate disposed on the carrier to the spinner and is disposed between the two concentric portions.

19. The system of claim 15, wherein the plurality of vacuum applicators includes a second vacuum applicator corresponding to a substrate collection position such that when a pressure of the second vacuum applicator rises above a threshold amount, the substrate held by the rotator is released to the substrate collection position.

20. A method for inspecting and sorting a plurality of substrates, the method comprising: performing a metrology process on the substrate in a metrology unit; allocating the substrate to a collection bin based on substrate information obtained through the metrology process; transferring the substrate on a carrier from the metrology unit to a loading area where the carrier intersects a sorter, the sorter comprising an annular gripper comprising a rotator and a plurality of vacuum applicators co-circularly disposed about an axis; maintaining the plurality of vacuum applicators stationary relative to the shaft; rotating the rotator relative to the plurality of vacuum applicators about the axis while one or more of the plurality of vacuum applicators holds the substrate against the rotator; picking up the substrate from the carrier by the rotator while the rotator continues to rotate; rotating the rotator and the base plate of the classifier toward the collection bin; as well as The substrate is released from the spinner to the collection bin.

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