Fan

By using a combination of refrigeration parts and cooling media in the fan, the problems of poor fan cooling effect and increased air humidity are solved, and better cooling effect and a more compact design are achieved.

CN119222652APending Publication Date: 2024-12-31QINGDAO HAIER SMART TECH R & D CO LTD
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Patent Information

Application Number
CN202310793531.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-06-29
Publication Date
2024-12-31

AI Technical Summary

Technical Problem

Existing fans have poor cooling during cooling and significantly increase air humidity, which may lead to health problems for users.

Method used

Refrigeration parts are used for refrigeration, and the heat generated when the refrigeration parts are absorbed through the cooling medium to ensure that the refrigeration parts continue to work. At the same time, the refrigeration parts are arranged on the inner wall of the shell to extend in a certain direction to fully contact the air, increase the heat exchange area, and reduce air resistance or Improve the refrigeration effect.

Benefits of technology

Achieve better cooling effects and lower air resistance, avoiding the problem of increased air humidity, providing more efficient cooling and a more compact fan design.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the field of household appliances, in particular to a fan, and aims to solve the technical problems that the refrigeration effect is poor and the air humidity is greatly increased when the fan works to at least a certain extent. To this end, the fan of the present invention comprises: a housing having an air inlet and an air outlet; the air guide piece is arranged on the shell and located between the air inlet and the air outlet; the refrigerating part is arranged on the inner wall of the shell and extends in at least one direction in the inner space of the shell; and the storage part is used for storing a cooling medium capable of absorbing heat generated when the refrigerating part works.
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Description

Technical Field

[0001] The invention relates to the technical field of household appliances, and in particular provides a fan. Background Art

[0002] Fans are commonly used household refrigeration equipment. Compared with air conditioners that cool large spaces, fans can cool local spaces and achieve significant energy savings.

[0003] The fan in the prior art usually adopts a water curtain structure to achieve cooling. A water tank is provided in this fan, and water in the water tank is pumped to the water curtain structure by a water pump to form a water film. Under the action of the airflow inhaled by the fan, the water on the water film evaporates from liquid to gas and is blown out, thereby achieving the cooling function.

[0004] However, this type of fan has a poor cooling effect and will significantly increase the humidity of the air when used, which may cause health problems for users. Summary of the invention

[0005] In order to at least partially overcome the above-mentioned defects, the present invention is proposed. Specifically, the present invention provides a fan that can at least partially solve the technical problem that the cooling effect of the fan is poor and the air humidity is greatly increased when the fan is working.

[0006] The present invention provides a fan, which includes: a shell having an air inlet and an air outlet; an air guide member, which is arranged in the shell and located between the air inlet and the air outlet; a refrigeration member, which is configured on the inner wall of the shell and extends in at least one direction in the internal space of the shell; and a storage member, which is used to store a cooling medium that can absorb heat generated when the refrigeration member is working.

[0007] It is understandable that the fan provided by the present invention uses a refrigeration element for cooling, and uses a cooling medium to absorb the heat generated by the refrigeration element when it is working to ensure that the refrigeration element can continue to work. Compared with the water curtain structure in the prior art, it does not cause an increase in air humidity during cooling. On the other hand, the refrigeration element is arranged on the inner wall of the shell and extends in at least one direction in the internal space of the shell, so that it can be in more sufficient contact with the air and obtain a better cooling effect.

[0008] In a technical solution of the above-mentioned fan, an extension direction of the refrigeration element is parallel to or forms an angle with an air flow direction in the shell.

[0009] It is understandable that when the extension direction of the refrigeration component is parallel to the air flow direction in the shell, the refrigeration component will not cause resistance to the air flow, thereby reducing the wind resistance of the fan and obtaining a larger air volume. When the extension direction of the refrigeration component forms an angle with the air flow direction in the shell, the heat exchange area between the refrigeration component and the air will increase, thereby obtaining a better cooling effect, but the wind resistance will also increase slightly.

[0010] In a technical solution of the above fan, the refrigeration element extends from a wall of the shell corresponding to the air inlet to a wall of the shell corresponding to the air outlet.

[0011] Through such a structure, the heat exchange area between the refrigeration element and the air in the shell is further increased, thereby achieving a better refrigeration effect.

[0012] In a technical solution of the above fan, at least a part of the structure of the refrigeration component is a plate-shaped structure.

[0013] With such a structure, the contact area between the refrigeration component and the air in the shell is increased from another perspective, thereby obtaining a better refrigeration effect.

[0014] In a technical solution of the above-mentioned fan, the plate-like structure and a part of the structure of the shell together constitute a refrigeration cavity, and the air inlet, the air outlet and the air guide are located in the refrigeration cavity.

[0015] With such a structure, the air is concentrated and distributed in the refrigeration cavity, and comes into more complete contact with the refrigeration components, thereby obtaining a better refrigeration effect.

[0016] In a technical solution of the above fan, the storage element is arranged in the shell and is located on a side of the plate-like structure away from the refrigeration cavity.

[0017] With such a configuration, the structure of the entire fan is made more compact, which helps to reduce the volume of the fan. At the same time, the distance between the refrigeration component and the storage component is closer, which helps to improve the heat dissipation effect and thus obtain a better cooling effect.

[0018] In a technical solution of the above-mentioned fan, the refrigeration component includes one or more. In the case where the refrigeration component includes more than one, the extension directions of the multiple refrigeration components are different or not completely the same.

[0019] With such a structure, the total contact area between the refrigeration component and the air is further increased, thereby obtaining a better refrigeration effect.

[0020] In a technical solution of the above-mentioned fan, in the case where the refrigeration component includes a plurality of refrigeration components, the refrigeration functions of the plurality of refrigeration components are configured to be independently turned on or off.

[0021] Through such a structure, in actual use, the refrigeration function of the refrigeration component can be selectively turned on according to actual refrigeration needs, thereby meeting the diverse usage needs of users.

[0022] In one technical solution of the above-mentioned fan, the refrigeration element includes: a semiconductor refrigeration part, whose cooling side faces the air guide member; and at least one heat conduction part, which is connected to the heat generating side of the semiconductor refrigeration part and extends toward the storage element.

[0023] Compared with other functional implementation methods, refrigeration components using semiconductor refrigeration have higher refrigeration efficiency and better refrigeration effect.

[0024] In a technical solution of the above fan, the refrigeration element has a cavity for accommodating a refrigeration medium.

[0025] Compared with the method of using a semiconductor refrigeration unit, no additional energy is consumed when using a refrigerant medium for refrigeration.

[0026] In one technical solution of the above-mentioned fan, the refrigeration component includes a main body and at least one extension portion, the extension portion extends from the main body into the storage component, the main body and the extension portion both have the cavity, and the cavities of the main body and the extension portion are connected.

[0027] Through such a structure, the heat exchange area between the refrigerant medium and the cooling medium is increased, so that the refrigerant medium can always maintain a good refrigeration effect.

[0028] In one technical solution of the above-mentioned fan, the storage element is arranged on a side of the main body away from the direction of gravity, and the refrigerant medium is arranged to absorb heat and convert from liquid to gas when exchanging heat with air, and to release heat and convert from gas to liquid when exchanging heat with the cooling medium.

[0029] With such a structure, the gaseous refrigerant medium will automatically diffuse into the cavity of the extension part and exchange heat with the cooling medium, while the liquid refrigerant medium will automatically flow into the main body and exchange heat with the air, thereby realizing the natural circulation of the refrigerant medium.

[0030] In a technical solution of the above fan, the refrigerant medium includes superconducting liquid.

[0031] Compared with conventional liquids, such as water, superconducting liquids have higher heat exchange efficiency, thus achieving better cooling effects.

[0032] In a technical solution of the above fan, the storage element has an opening facing the main body, and the main body covers the opening.

[0033] With such a structure, the cooling medium in the storage element will be gathered at the opening under the action of gravity and come into contact with the main body, which will further increase the heat exchange area between the refrigerant medium and the cooling medium, thereby obtaining a better cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The disclosure of the present invention will become more easily understood with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In addition, similar numbers in the figures are used to represent similar components, among which:

[0035] Figure 1 is a side view of a fan according to an embodiment of the present invention;

[0036] Figure 2 yes Figure 1 A cross-sectional view of a fan in FIG.

[0037] Figure 3 yes Figure 1 An exploded view of the fan in the

[0038] Figure 4 yes Figure 1 A schematic diagram of the structure of the cooling component of the middle fan;

[0039] Figure 5 is a cross-sectional view of a fan according to another embodiment of the present invention;

[0040] Figure 6 yes Figure 5 Schematic diagram of the structure of the cooling part and storage part of the central fan.

[0041] Reference numerals list :

[0042] 1: Shell; 11: Air inlet; 12: Air outlet; 13: Refrigeration chamber; 2: Air guide; 3: Refrigeration element; 31: Semiconductor refrigeration part; 32: Heat conduction part; 33: Main body; 34: Extension part; 4: Storage element. DETAILED DESCRIPTION

[0043] Some embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0044] An embodiment of the present invention provides a fan. Figure 1 is a side view of a fan according to an embodiment of the present invention, Figure 2 yes Figure 1 A cross-sectional view of the fan in FIG. Figure 3 yes Figure 1 Exploded view of the fan in the . Figure 1-Figure 3 The fan of this embodiment includes a shell 1, an air guide member 2, a refrigeration member 3 and a storage member 4.

[0045] The shell 1 has an air inlet 11 and an air outlet 12. In this example, the shell 1 is roughly in the shape of a cube. The air inlet 11 and the air outlet 12 are respectively arranged on two opposite side walls of the shell 1. However, it can be understood that the shell 1 can have any suitable shape, and the air inlet 11 and the air outlet 12 can include one or more. The air inlet 11 and the air outlet 12 can be arranged at any suitable position of the shell 1. In the case where the air inlet 11 includes multiple air inlets, the multiple air inlets 11 can be arranged on the same side of the shell 1, or on different sides of the shell 1. The same is true for the air outlet 12. In a possible embodiment, an air filtering structure such as a filter can be provided at the air inlet 11, and a backflow structure such as a wind deflector can be provided at the air outlet 12. Those skilled in the art can make settings according to actual needs, and there is no limitation on this.

[0046] The air guide 2 is arranged on the housing 1 and is located between the air inlet 11 and the air outlet 12. In actual use, it can guide the airflow from the air inlet 11 into the housing 1 and blow it out from the air outlet 12. The air guide 2 can be a fan commonly used in the field, such as a cross-flow fan and an axial flow fan. Those skilled in the art can select a suitable type of fan according to the positions of the air inlet 11 and the air outlet 12, and can determine the power parameters of the fan according to actual use requirements. Preferably, the air inlet 11 and the air outlet 12 can be arranged on the opposite side walls of the housing 1, and a cross-flow fan is used as the air guide 2 to reduce the wind resistance of the air during the flow.

[0047] The refrigeration element 3 is arranged on the inner wall of the shell 1 and extends in at least one direction in the internal space of the shell 1, so as to cool the air in the shell 1. The refrigeration element 3 can be connected to any suitable inner wall of the shell 1. The refrigeration element 3 can be directly connected to the inner wall of the shell 1 or connected to other structures connected to the shell 1. The refrigeration element 3 can be connected to only one inner wall of the shell 1 or to multiple inner walls at the same time. One or more refrigeration elements 3 can be provided. When multiple refrigeration elements 3 are provided, multiple refrigeration elements 3 can be connected to different positions of the inner wall of the shell 1 respectively. Multiple refrigeration elements 3 can be connected to the same inner wall of the shell 1 or to different inner walls of the shell 1. The refrigeration element 3 can extend in one direction or in multiple directions. It can be understood that the extension method of the refrigeration element 3 determines the way in which the air contacts it. Those skilled in the art can determine the extension method of the refrigeration element 3 according to the actual refrigeration needs.

[0048] The refrigeration component 3 can be any suitable refrigeration equipment. For example, the refrigeration component 3 can be a semiconductor refrigeration device. The semiconductor refrigeration device is a type of device that uses the thermoelectric effect of semiconductors to produce cold. After the power is turned on, electron-hole pairs are generated near the contact on one end, the internal energy is reduced, the temperature is lowered, and heat is absorbed from the outside, which is called the cold end. The other end increases the internal energy and the temperature rises due to the recombination of electron-hole pairs, and releases heat to the environment, which is called the hot end. For another example, the refrigeration component 3 can be a device with a refrigerant medium inside, and these refrigerants can achieve a refrigeration effect by exchanging heat with the air. The refrigeration component 3 can also be other suitable devices with refrigeration functions, and those skilled in the art can choose according to actual needs.

[0049] The refrigeration element 3 generates heat during operation. For example, the hot end of the semiconductor refrigeration device releases heat during refrigeration, and the refrigerant absorbs heat from the air during heat exchange. In order to ensure that the refrigeration element 3 can continuously and effectively refrigerate, the heat generated during operation needs to be absorbed in time. Therefore, the refrigeration element 3 can be connected to the storage element 4 so that the heat generated during operation of the refrigeration element can be absorbed by the cooling medium stored in the storage element 4.

[0050] The storage element 4 may be any suitable container, and the storage element 4 may be disposed inside the housing 1 or outside the housing 1. In the case where the storage element 4 is disposed inside the housing 1, the storage element 4 may be slidably connected to the housing 1, so that the storage element 4 can be at least partially removed from the housing 1, so as to facilitate the user to add cooling medium to the storage element 4 or replace the cooling medium in the storage element 4. Alternatively, in the case where the storage element 4 is disposed inside the housing 1, one or more walls of the housing 1 may be configured as one or more walls of the storage element 4, and these walls may be provided with openings, through which the user can add cooling medium to the storage element 4 or replace the cooling medium in the storage element 4.

[0051] The storage element 4 may include one or more storage elements. When the refrigeration element 3 includes more than one storage element, the more than one refrigeration element 3 may be connected to the same storage element 4, or may be connected to more than one storage element 4. Those skilled in the art may set the storage element 4 according to the specific setting mode of the refrigeration element 3, and there is no limitation on this. The cooling medium stored in the storage element 4 may include any suitable medium, such as water, ice, ice crystals, dry ice, etc., and the user may select and add it to the storage element 4.

[0052] The refrigeration element 3 can be connected to the storage element 4 in any suitable manner, as long as the heat generated by the refrigeration element 3 during operation can be absorbed by the cooling medium. For example, part of the structure of the refrigeration element 3 can extend into the storage element 4 and contact the cooling medium of the storage element 4, or the refrigeration element 3 can have an opening, and the refrigeration element 3 can cover the opening so that the cooling medium inside the storage element 4 can directly contact the refrigeration element 3. Alternatively, the storage element 4 can be provided with a pump and a cooling medium circulation pipeline, and the cooling medium circulation pipeline can be arranged in close contact with the refrigeration element 3, and the cooling medium can enter the cooling medium pipeline under the drive of the pump and absorb the heat generated by the refrigeration element 3. Those skilled in the art can reasonably select the connection method between the refrigeration element 3 and the storage element 4 according to the specific structure of the refrigeration element 3 actually selected, which will not be repeated here.

[0053] It is understandable that the fan provided by the present invention uses the refrigeration element 3 for refrigeration, and uses a cooling medium to absorb the heat generated by the refrigeration element 3 when it is working to ensure that the refrigeration element 3 can continue to work. Compared with the water curtain structure in the prior art, it does not cause an increase in air humidity. On the other hand, the refrigeration element 3 is connected to the inner wall of the shell 1 and extends inside the shell 1, so that it can be fully in contact with the air. Compared with the water curtain structure in the prior art, the refrigeration effect is better.

[0054] Several possible configurations of the refrigeration element 3 will be described below.

[0055] In a possible implementation, the extension direction of the refrigeration element 3 may be parallel to or form an angle with the air flow direction in the housing 1. Figure 2 For example, the arrow direction in the figure is the air flow direction in the shell 1 in this example, and the extension direction of the refrigeration component 3 is set to be parallel to the air flow direction. As described above, the refrigeration component 3 can have multiple extension directions, and the multiple extension directions can all be parallel to the air flow direction in the shell 1, or some extension directions can be parallel to the air flow direction in the shell 1, and another part of the extension direction can form an angle with the air flow direction in the shell 1.

[0056] In the case where there are multiple refrigeration components 3, the extension directions of the multiple refrigeration components 3 may be the same, different, or not completely the same. For example, the extension directions of the multiple refrigeration components 3 may all be parallel to the air flow direction in the shell 1, or all form an angle with the air flow direction in the shell 1, or a part of the extension directions of the multiple refrigeration components 3 may be parallel to the air flow direction in the shell 1, and another part may form an angle with the air flow direction in the shell 1.

[0057] It is understandable that, when the extension direction of the refrigeration component 3 is parallel to the air flow direction in the shell 1, the refrigeration component 3 will not cause resistance to the flow of air, thereby reducing the wind resistance of the fan and obtaining a larger air volume. When the extension direction of the refrigeration component 3 forms an angle with the air flow direction in the shell 1, the heat exchange area between the refrigeration component 3 and the air will increase, thereby obtaining a better cooling effect, but the wind resistance will also increase slightly. Those skilled in the art can reasonably select the extension direction of the refrigeration component 3 according to actual needs, which will not be repeated here.

[0058] In a possible implementation, the refrigeration component 3 can be extended from the wall of the housing 1 corresponding to the air inlet 11 to the wall of the housing 1 corresponding to the air outlet 12. Through such a configuration, the heat exchange area between the refrigeration component 3 and the air in the housing 1 is further increased, thereby obtaining a better refrigeration effect. Obviously, the refrigeration component 3 can also be extended in other ways, such as extending from one wall of the housing 1 in the gravity direction to another wall, etc. Those skilled in the art can make arrangements according to the air flow conditions and spatial layout conditions in the housing 1, which will not be described in detail here.

[0059] In a possible implementation, at least a portion of the structure of the refrigeration component 3 may be a plate-like structure. With such a structure, the contact area between the refrigeration component 3 and the air in the shell 1 is increased from another perspective, thereby obtaining a better refrigeration effect. Obviously, in addition to the plate-like structure, part or all of the structure of the refrigeration component 3 may also be any other suitable structural form, such as a tubular structure, a strip structure, etc. In the case where the refrigeration component 3 includes multiple refrigeration components, the structural forms of the multiple refrigeration components 3 may be the same or different. Those skilled in the art may set it according to the refrigeration method of the refrigeration component 3 actually selected and the spatial layout inside the shell 1.

[0060] In a possible embodiment, the plate-like structure of the refrigeration element 3 can form a refrigeration cavity 13 together with a part of the structure of the shell 1, and the air inlet 11, the air outlet 13 and the air guide 2 can all be located in the refrigeration cavity 13. Figure 2 The plate-like structure of the refrigeration element 3 and the top wall and side wall of the shell 1 together form a refrigeration cavity 13. Figure 2 In addition to the manner shown, the refrigeration element 3 can also form a refrigeration cavity 13 together with other structures of the shell 1. For example, the refrigeration element 3 can include multiple refrigeration elements 3, and the plate-like structures of multiple refrigeration elements 3 form the bottom wall and part of the side wall of the refrigeration cavity 13, and the shell 1 forms the top wall and other side walls of the refrigeration cavity 13. Those skilled in the art can set it according to actual needs. Through such a structure, the distribution of air in the shell 1 is more concentrated and the contact area with the refrigeration element 3 is larger, thereby obtaining a better refrigeration effect.

[0061] In a possible implementation, reference may still be made to Figure 2 The storage element 4 can be arranged in the housing 1 and is located on the side of the plate-like structure of the refrigeration element 3 away from the refrigeration cavity 13. With such a configuration, the structure of the entire fan is more compact, which helps to reduce the volume of the fan. At the same time, the distance between the refrigeration element 3 and the storage element 4 is relatively close, which helps to improve the heat dissipation effect, thereby obtaining a better refrigeration effect.

[0062] In a possible implementation, as described above, the refrigeration element 3 may include one or more refrigeration elements. When the refrigeration element 3 includes multiple refrigeration elements, the extension directions of the multiple refrigeration elements 3 may be different or not completely the same. With such a configuration, the multiple refrigeration elements 3 will contact the air of the housing 1 in different directions, so that the total heat exchange area of ​​the refrigeration elements 3 is increased, thereby obtaining a better refrigeration effect.

[0063] Further, in a possible implementation, when there are multiple refrigeration components 3, the refrigeration functions of the multiple refrigeration components 3 can be turned on or off independently. Therefore, during use, the refrigeration function of the refrigeration component 3 can be selectively turned on according to actual refrigeration needs, thereby meeting the diverse usage needs of users. In other possible implementations, the multiple refrigeration components 3 can also be divided into multiple refrigeration groups, and the refrigeration functions of the multiple refrigeration groups are configured to be turned on or off independently.

[0064] The following will further supplement and expand the possible configuration of the refrigeration component 3 in combination with two specific examples.

[0065] Embodiment 1:

[0066] Reference Figure 1-Figure 4 In this example, the refrigeration element 3 may include a semiconductor refrigeration part 31 and at least one heat conduction part 32. The refrigeration side of the semiconductor refrigeration part 31 may face the air guide part 2, so that it can cool the air. The heat conduction part 32 may be connected to the heat generated by the semiconductor refrigeration part 31 and extend toward the storage part 4, so that it can conduct the heat generated by the semiconductor refrigeration part 31 when it is working to the cooling medium for heat dissipation. Compared with other functional implementation methods, the refrigeration element 3 using semiconductor refrigeration has higher refrigeration efficiency and better refrigeration effect.

[0067] The heat conducting part 32 may be any suitable heat conducting structure, which can achieve heat dissipation by contacting the cooling medium in the storage element 4. The heat conducting part 32 may be made of a material with high heat conductivity to improve the heat dissipation efficiency of the semiconductor refrigeration part 31, so that the semiconductor refrigeration part 31 obtains a better cooling effect.

[0068] Further, refer to Figure 2The semiconductor refrigeration unit 31 may be a plate-like structure as described above, which may extend from the wall where the air inlet 11 is located to the wall where the air outlet 12 is located along a direction parallel to the air flow direction inside the housing 1, and together with part of the structure of the housing 1, form a refrigeration cavity 13. Obviously, the arrangement of the semiconductor refrigeration unit 31 is not limited to this, and the structural form, extension method, etc. of the semiconductor refrigeration unit 31 may also be any other suitable form described above, which will not be repeated here.

[0069] Further, refer to Figure 4 In this example, the heat conducting part 32 can be configured as a columnar structure, and a plurality of heat conducting parts 32 can be distributed in a grid shape on the heat generating side of the semiconductor refrigeration part 31. Obviously, the configuration of the heat conducting part 32 is not limited thereto, and those skilled in the art can configure the heat conducting part 32 to any suitable structure according to the specific structure of the semiconductor refrigeration part 31 and the positional relationship between the semiconductor refrigeration part 31 and the storage element 4, without limitation thereto.

[0070] Further, the storage element 4 may be configured as a container with an opening, the opening may be disposed toward the heat generating side of the semiconductor refrigeration part 31, and the heat conducting part 32 may extend to the interior of the storage element 4 through the opening, so that it can come into contact with the cooling medium inside the storage element 4. Obviously, the configuration of the storage element 4 is not limited thereto, and those skilled in the art may select any other suitable configuration described above to configure the storage element 4, which will not be described in detail herein.

[0071] Embodiment 2:

[0072] Reference Figure 5 and Figure 6 The refrigeration element 3 may have a cavity for accommodating a refrigeration medium. When air flows, the refrigeration medium in the cavity may exchange heat with the air through the wall of the refrigeration element 3 facing the air, thereby cooling the air. At the same time, the refrigeration medium may also extend through the refrigeration element 3 to the wall of the storage element 4 to exchange heat with the cooling medium stored in the storage element 4, thereby dissipating the heat absorbed by the refrigeration medium to achieve continuous cooling.

[0073] The reason why both the refrigeration medium and the cooling medium are set up is that the medium that exchanges heat with the air needs to have a sufficiently high heat exchange efficiency to obtain the desired refrigeration effect, and it must always be kept at a low temperature to achieve continuous refrigeration. The medium whose heat exchange efficiency meets this requirement is usually expensive and may include substances that are not suitable for direct contact with users (such as some chemical raw materials, etc.). It is difficult for users to continuously supply the low-temperature medium during use.

[0074] In the case where both the refrigeration medium and the cooling medium are provided at the same time, the refrigeration medium only needs to have a sufficiently high heat exchange efficiency. The user can absorb the heat of the refrigeration medium by continuously providing a low-temperature cooling medium to ensure its continuous cooling capacity. There is no requirement for the heat exchange efficiency of the cooling medium. Common media in daily life such as water, ice, and ice crystals can be used as cooling media. It is easy for users to continuously provide a low-temperature cooling medium.

[0075] In this example, those skilled in the art can select a medium with heat exchange efficiency that meets the requirements as the refrigeration medium according to the actual refrigeration requirements, without limitation. Compared with the semiconductor refrigeration method used in the first embodiment, the refrigeration method using the refrigeration medium in this example is more energy-efficient.

[0076] Further, the refrigeration element 3 may include a main body 33 and an extension 34 extending from the main body 33 to the storage element 4. The main body 33 and the extension 34 may both have cavities, and the cavities of the main body 33 and the extension 34 may be connected. The advantage of providing the extension 34 is that the heat exchange area between the refrigeration medium and the cooling medium can be increased, so that the refrigeration medium can maintain a better refrigeration effect.

[0077] Further, the main body 33 may be a plate-like structure as described above, which may extend from the wall where the air inlet 11 is located to the wall where the air outlet 12 is located in a direction parallel to the air flow inside the housing 1, and divide the interior of the housing 1 into a refrigeration cavity 13. The extension portion 34 may be configured as a columnar structure, and a plurality of extension portions 33 may be distributed in a grid shape on one surface of the main body 33. This configuration of the extension portion 33 can significantly increase the heat exchange area between the refrigeration element 3 and the cooling medium, thereby ensuring the refrigeration effect.

[0078] In other possible embodiments, the refrigeration component 3 may further include at least one second extension portion, which is also provided with a cavity connected to the main body portion, and may extend from the main body portion 33 to a position close to the air guide member 2. The specific arrangement of the second extension portion may refer to the extension portion 34, and the benefit of providing the second extension portion is that the heat exchange area between the refrigerant medium and the air can be increased, thereby obtaining a better refrigeration effect.

[0079] Further, refer to Figure 5 and Figure 6 The storage element 4 can be arranged on the side of the main body 33 away from the gravity direction, and the refrigerant can be arranged to absorb heat and convert from liquid to gas when exchanging heat with air, and to release heat and convert from gas to liquid when exchanging heat with the cooling medium. Those skilled in the art can select a medium with a suitable boiling point and heat exchange efficiency that meets the requirements as the refrigerant according to the temperature range of air and the cooling medium during actual use to achieve the above effect.

[0080] It can be understood that, in this example, the storage element 4 is arranged on the side of the main body 33 that is away from the direction of gravity, that is, the extension portion 34 will eventually extend to the side of the main body 33 that is away from the direction of gravity. Therefore, the gaseous refrigerant medium in the main body 33 will automatically diffuse into the cavity of the extension portion 34 and exchange heat with the cooling medium, and the liquid refrigerant medium in the extension portion 34 will automatically flow into the main body 33 and exchange heat with the air, thereby realizing the natural circulation of the refrigerant medium and ensuring that the refrigerant medium can continue to cool.

[0081] In other possible implementations, the refrigerant medium may not undergo phase change during the heat exchange process. In these implementations, a driving device such as a pump may be used to force the refrigerant medium to circulate to ensure that the refrigerant medium can continue to cool.

[0082] Furthermore, the refrigeration medium may include a superconducting liquid, which is a liquid prepared from chemical raw materials. Compared with conventional liquid media, the superconducting liquid has a higher heat exchange efficiency, thereby being able to obtain a better refrigeration effect. The physical properties of the superconducting liquid, such as the boiling point, can be regulated by adjusting the type of raw materials and the principle ratio. Those skilled in the art can select appropriate raw materials to set the superconducting liquid according to actual refrigeration needs, and there is no limitation on this.

[0083] In a possible implementation, the material of the main body portion 33 and the extension portion 34 may also be a material with high heat exchange efficiency, or even a super thermal conductive material, so as to further obtain a better cooling effect.

[0084] In a possible implementation, when the storage element 4 is arranged on the side of the main body away from the direction of gravity, the storage element 4 may have an opening facing the main body 33, and the main body 33 may cover the opening. It is understandable that in this example, the cooling medium in the storage element 4 will be collected at the opening under the action of gravity and contact the main body 33, which will further increase the heat exchange area between the refrigeration medium and the cooling medium, thereby obtaining a better cooling effect. Furthermore, the main body 33 may be sealed and connected to the storage element 4 by welding, or other suitable sealing connection methods may be used to prevent the cooling medium from flowing into the interior of the housing 1 from the opening.

[0085] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. A fan, characterized in that: The fan comprises: A housing having an air inlet and an air outlet; An air guide member, which is arranged on the housing and located between the air inlet and the air outlet; a refrigeration element, which is disposed on the inner wall of the shell and extends in at least one direction in the inner space of the shell; and The storage element is used to store a cooling medium capable of absorbing the heat generated when the refrigeration element is working.

2. The fan according to claim 1, characterized in that The extending direction of the refrigeration component is parallel to or forms an angle with the air flow direction in the shell.

3. The fan according to claim 2, characterized in that: The refrigeration component extends from a wall of the shell corresponding to the air inlet to a wall of the shell corresponding to the air outlet.

4. The fan according to claim 1, characterized in that: At least a part of the refrigeration component is a plate-shaped structure.

5. The fan according to claim 4, characterized in that: The plate-like structure and a part of the structure of the shell together form a refrigeration cavity, and the air inlet, the air outlet and the air guide are located in the refrigeration cavity.

6. The fan according to claim 1, characterized in that: The refrigeration element includes one or more, Wherein, in the case where the refrigeration components include a plurality of refrigeration components, the extension directions of the plurality of refrigeration components are different or not completely the same.

7. The fan according to any one of claims 1 to 6, characterized in that: The refrigeration element comprises: a semiconductor refrigeration unit, wherein a refrigeration side of the semiconductor refrigeration unit is disposed toward the air guide member; and At least one heat-conducting portion is connected to the heat-generating side of the semiconductor refrigeration portion and extends toward the storage element.

8. The fan according to any one of claims 1 to 7, characterized in that: The refrigeration element has a cavity for accommodating a refrigeration medium.

9. The fan according to claim 8, characterized in that The refrigeration element includes a main body portion and at least one extension portion, wherein the extension portion extends from the main body portion into the storage element; The main body and the extension part both have the cavity, and the cavities of the main body and the extension part are communicated.

10. The fan according to claim 9, characterized in that The storage element is arranged on a side of the main body away from the direction of gravity, and the refrigerant medium includes a superconducting liquid, which is arranged to absorb heat and convert from liquid to gas when exchanging heat with air, and to release heat and convert from gas to liquid when exchanging heat with the cooling medium.

Citation Information

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