Immersed Server

Abstract

The present invention relates to the technical field of liquid cooling servers, and discloses an immersion server, comprising a cabinet, a mounting frame, a mainboard, a power circulation mechanism and a convection switching device; the mounting frame is arranged in the cabinet; the mounting frame and the side wall of the cabinet are spaced to form a first flow space, and the mounting frame is provided with a receiving cavity; the top of the receiving cavity is communicated with the first flow space; the mainboard is fixed in the receiving cavity; a temperature sensor is provided on the mainboard; the power circulation mechanism is arranged in the first flow space; the convection switching device is fixed between the cabinet and the mounting frame; and is spaced to form a second flow space with a bottom plate of the cabinet, and the second flow space is communicated with the bottom end of the receiving cavity; the convection switching device has a connecting position connecting the first flow space and the second flow space, and a separating position separating the first flow space and the second flow space. The present invention realizes the reasonable flow of cooling medium in the server, avoids the phenomenon of uneven hot and cold of the upper and lower parts of the cooling medium, and improves the cooling efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling servers, and in particular to an immersion server. Background Art

[0002] With the rapid development of Internet technology, the amount of data is growing exponentially, which has greatly promoted the rise of edge computing technology. The core strategy of edge computing is to deploy computing and storage resources near the data source, so as to effectively reduce the delay time of data transmission, thereby significantly improving the system's response speed and service quality. However, the deployment environment of edge computing equipment is often very harsh. For example, edge servers often face complex outdoor conditions such as high temperature, low temperature, high humidity and dust, which puts extremely strict requirements on the heat dissipation performance of the equipment. Traditional air cooling technology is limited by its relatively low thermal conductivity and high energy consumption level, and it has become increasingly difficult to meet the growing heat dissipation needs of high-density computing equipment. In this context, the immersion cooling system is gradually becoming the preferred solution to solve the heat dissipation problem of data centers with its high-efficiency thermal conductivity and excellent environmental adaptability.

[0003] The immersion cooling system directly immerses the server in the coolant, so that the coolant is in direct contact with the heat generating components, and relies on the convection circulation of the coolant to achieve heat dissipation of the server unit. However, since the key heat generating components such as the processor and power supply module in the server unit are often arranged in the middle or upper part of the motherboard; this layout causes heat to accumulate and form convection in the middle or upper area of ​​the coolant under the action of thermal convection, while the lower part of the coolant may form a relatively static area, resulting in uneven distribution of heat and cold in the upper and lower parts of the coolant, which in turn affects the heat dissipation effect and reduces the heat dissipation efficiency of the server. Summary of the invention

[0004] In view of this, the present invention provides an immersion server to solve the problem of uneven heat distribution in the upper and lower parts of the coolant, which affects the heat dissipation effect.

[0005] The present invention provides an immersion server, comprising a cabinet, a mounting frame, a mainboard, a power circulation mechanism and a convection switching device; the cabinet is filled with a cooling medium; the mounting frame is arranged in the cabinet and is located below the liquid surface of the cooling medium; the mounting frame and the side wall of the cabinet are spaced to form a first flow space, and a receiving cavity is arranged on the mounting frame; the top of the receiving cavity is connected to the first flow space; the mainboard is fixed in the receiving cavity; and a temperature sensor is arranged on the mainboard; the power circulation mechanism is arranged in the first flow space; the convection switching device is fixed between the cabinet and the mounting frame; the convection switching The device is spaced apart from the bottom plate of the cabinet and forms a second flow space, and the second flow space is connected to the bottom end of the accommodating cavity; the convection switching device has a connecting position connecting the first flow space and the second flow space, and a separating position separating the first flow space and the second flow space; wherein, when the temperature of the temperature sensor is lower than the preset temperature, the convection switching device is in the connecting position, and the power circulation mechanism is in the closed state; when the temperature of the temperature sensor is higher than the preset temperature, the convection switching device is in the separating position, and the power circulation mechanism is in the open state.

[0006] Since a receiving cavity is provided in the mounting frame, the mainboard is fixed in the receiving cavity, and a first flow space is provided between the mounting frame and the cabinet, during the operation of the mainboard, the cooling medium in the receiving cavity will be heated up due to the heat generated by the mainboard, and the hot cooling medium rises to the top of the cabinet to exchange heat with the outside air, thereby achieving cooling and heat dissipation. The cooling medium after heat dissipation then flows downward through the first flow space, enters the second flow space, and finally flows back to the receiving cavity to continue to provide cooling for the mainboard, thereby achieving natural convection circulation of the cooling medium in the cabinet, achieving reasonable flow of the cooling medium inside the cabinet, preventing heat accumulation in the middle or upper area of ​​the cooling medium, avoiding the phenomenon of uneven hot and cold in the upper and lower parts of the cooling medium, and improving the cooling efficiency; when the mainboard load increases, causing the temperature detected by the temperature sensor to exceed the preset value, the power circulation mechanism will be started; at this time, the convection switching device will also switch to the separation state to ensure that the cooling medium is driven by the power circulation mechanism to forcibly circulate in the receiving cavity, which not only prevents heat accumulation in the middle or upper area of ​​the cooling medium, but also significantly accelerates the circulation speed of the cooling medium and improves the heat dissipation efficiency.

[0007] In an optional embodiment, a diversion component is also provided in the accommodating cavity, and the diversion component is spaced apart from the side wall of the accommodating cavity to form a third flow space; and a fourth flow space is formed in the diversion component; on the side close to the top of the cabinet, the third flow space, the fourth flow space and the first flow space are interconnected; on the side close to the bottom of the cabinet, the third flow space, the fourth flow space and the second flow space are interconnected; a high-heat generating component and a low-heat generating component are provided on the main board, the low-heat generating component is arranged in the third flow space, and the high-heat generating component is arranged in the fourth flow space.

[0008] By setting up the diversion component, the third flow space and the fourth flow space are divided. The setting of the third flow space and the fourth flow space can separate the high-heat generating components and the low-heat generating components from each other. The heat generated by the high-heat generating components during operation is confined to the third flow space and cannot cause adverse effects on the low-heat generating components located in the fourth flow space, thereby ensuring that the low-heat generating components can work stably in a relatively low-temperature environment, thereby improving the efficiency and reliability of the entire system.

[0009] In an optional embodiment, the diverter assembly includes two diverter plates, which are spaced apart from each other and form the fourth flow space; and the two diverter plates are spaced apart from two opposite side walls of the accommodating cavity and respectively form two third flow spaces; the low-heat generating assembly is provided with two groups, and the two groups of low-heat generating assembly are respectively arranged in the two third flow spaces.

[0010] By setting up two diversion plates, two independent third flow spaces can be formed, which enhances the circulation fluidity of the cooling medium; and the two low-heat generating components are respectively located in the two third flow spaces, which not only ensures that each low-heat generating component can be fully cooled, but also effectively improves the overall heat dissipation performance by enhancing the circulation of the cooling medium, thereby optimizing the spatial layout and improving the heat dissipation effect.

[0011] In an optional embodiment, the diverter plate includes a first connecting plate, a second connecting plate and a third connecting plate, and the first connecting plate, the second connecting plate and the third connecting plate are arranged in sequence along the vertical direction; the top end of the second connecting plate is connected to the first connecting plate, and the bottom end is connected to the third connecting plate; the distance between the two first connecting plates is smaller than the distance between the two third connecting plates.

[0012] Since the distance between the two first connecting plates is smaller than the distance between the two third connecting plates, it is ensured that sufficient cooling medium can be distributed between the two third connecting plates, and sufficient cooling medium can be distributed between the first connecting plate and the side wall of the accommodating cavity; sufficient distribution of the cooling medium between the two third connecting plates and between the first connecting plate and the side wall of the accommodating cavity is achieved, and the overall fluidity of the cooling medium in the accommodating cavity is enhanced.

[0013] In an optional embodiment, the high heat generation component is arranged between the two third connecting plates, and the low heat generation component is arranged between the first connecting plate and the side wall of the accommodating cavity.

[0014] The top end of the second connecting plate is connected to the first connecting plate, and the bottom end is connected to the third connecting plate. The three connecting plates are arranged in sequence in the vertical direction to form an orderly structure. Therefore, the third connecting plate is located below the first connecting plate; since the high-heat generating component is arranged between the two third connecting plates, that is, on the side close to the bottom plate of the cabinet, when the high-heat generating component generates heat, the heat will flow upward and be further cooled by the cooling medium above the cabinet on the way, which not only accelerates the heat dissipation efficiency but also ensures the full utilization of the cooling medium; the low-heat generating component is arranged in the space between the first connecting plate and the side wall of the accommodating cavity, and forms a layout arranged in sequence in the vertical direction with the high-heat generating component, so that the heat generated by the low-heat generating component can quickly rise to the liquid surface of the cooling medium for heat dissipation, and the heat generated by the high-heat generating component will not interfere with it, thereby ensuring the stability and efficiency of the entire heat dissipation system.

[0015] In an optional embodiment, the convection switching device includes a first partition plate, a switching plate and a power telescopic mechanism; the first partition plate is arranged between the mounting frame and the side wall of the cabinet; in the first direction, a first gap is arranged between the mounting frame and the side wall of the cabinet; the first partition plate is provided with a plurality of convection holes, the plurality of convection holes are arranged at intervals from each other, and the convection holes are located in the first gap; the switching plate is provided with a plurality of switching holes, and the plurality of switching holes correspond one-to-one to the plurality of convection holes; and the switching plate is abutted against the first partition plate, and is slidably arranged in the cabinet along the second direction; the first direction is perpendicular to the second direction; the power output end of the power telescopic mechanism is connected to the switching plate.

[0016] The switching plate is controlled to slide by a power telescopic mechanism. When the power telescopic mechanism controls the switching plate to slide to a position corresponding to the switching hole and the convection hole, the first flow space and the second flow space can be connected. When the power telescopic mechanism drives the switching plate to slide to a position where the switching hole and the convection hole are staggered, the first flow space and the second flow space are effectively separated by physical barriers. The coordinated work of the power telescopic mechanism and the switching plate enables the connection and separation of the first flow space and the second flow space.

[0017] In an optional embodiment, it also includes a second partition plate, which is arranged in the cabinet body and divides the interior of the cabinet body into a first accommodating space and a second accommodating space, and the first accommodating space and the second accommodating space are arranged in sequence along the second direction; the cooling medium is arranged in the first accommodating space, and the mounting frame is located in the first accommodating space; the power telescopic mechanism is located in the second accommodating space, and the power output end of the power telescopic mechanism is connected to the switching plate through the second partition plate.

[0018] By setting the second partition plate, the cabinet can be divided into two independent areas, the first accommodating space and the second accommodating space. By setting the power telescopic mechanism in the second accommodating space, the working stability of the power telescopic mechanism is ensured and the interference caused by the cooling medium is avoided.

[0019] In an optional embodiment, it also includes a first heat dissipation mechanism, and a second gap is provided between the mounting frame and the second partition plate; the first heat dissipation mechanism includes a first heat sink and a second heat sink; the first heat sink is arranged in the second gap, and is respectively abutted against the mounting frame and the second partition plate on both sides along the second direction; the second heat sink is arranged in the second accommodating space and is connected to the first heat sink.

[0020] By setting up the first heat sink and the second heat sink, an efficient heat transfer path is constructed, which can effectively and quickly conduct the heat generated in the first storage space to the second storage space, thereby achieving rapid heat dissipation and cooling, ensuring the high efficiency of heat transfer and the significance of heat dissipation effect.

[0021] In an optional embodiment, the first heat dissipation mechanism also includes a heat dissipation fan, which is arranged in the second storage space, and an air inlet and an air outlet are provided on the side wall of the cabinet, the air inlet and the air outlet are both connected to the second storage space, and the air inlet and the air outlet are arranged at intervals.

[0022] By setting the heat dissipation fan, air inlet and air outlet, the flow of air in the second storage space can be accelerated, which not only enhances the heat dissipation effect but also ensures the effective circulation of air, thereby accelerating the dissipation of heat and making the heat dissipation process more efficient and reliable.

[0023] In an optional embodiment, it also includes a third partition plate, which is arranged in the second accommodating space and divides the second accommodating space into a first installation space and a second installation space; the second installation space is located below the first installation space; the second heat sink is located in the second installation space; the heat dissipation fan is fixed on the third partition plate, and the air inlet end of the heat dissipation fan is located in the first installation space, and the air outlet end is located in the second installation space; the air inlet is connected to the first installation space, and the air outlet is connected to the second installation space.

[0024] Since the second heat sink is located in the second installation space and the air outlet is connected to the second installation component, the path for heat to be dissipated from the second heat sink to the outside is shortened, thereby accelerating the heat dissipation process; and since the air inlet is connected to the first installation space, the air inlet end of the heat dissipation fan is located in the first installation space, and the air outlet end is located in the second installation space, which not only ensures that a steady stream of cold air can be sucked in from the first installation space and sent into the second installation space through the heat dissipation fan, but also further optimizes the overall heat dissipation effect, so that heat can be discharged more quickly and effectively.

[0025] In an optional embodiment, the mounting frame includes one or more fixing components and a fixing plate; the multiple fixing components are arranged in sequence along the second direction; the fixing component includes a mounting plate and two side plates; the two side plates are respectively arranged on both sides of the mounting plate along the first direction, and are combined with the mounting plate to form a receiving groove; the receiving groove and the adjacent fixing components are combined to form the receiving cavity; the fixing plate is located on the side of the fixing component away from the second partition plate, and the fixing plate and the receiving groove of the adjacent fixing component are combined to form the receiving cavity.

[0026] By setting up multiple fixing parts, multiple mainboards can be fixedly installed; and a receiving cavity can be enclosed between two adjacent fixing components; by setting up a fixing plate, a receiving cavity can be enclosed with the fixing components located at the end, thereby making full use of space resources and providing each mainboard with a relatively independent and protected working environment.

[0027] In an optional embodiment, the shunt assembly is connected to the fixed plate, and the shunt assembly is spaced apart from the mounting plate; the main board is located between the shunt assembly and the mounting plate, and the main board is fixedly connected to the mounting plate and abuts against the shunt assembly.

[0028] By connecting the diverter assembly to the fixed plate, the diverter assembly in the accommodating cavity away from the second separation plate is fixedly installed, which not only ensures that the diverter assembly can be firmly installed in the predetermined position, but also greatly facilitates the subsequent assembly process of the mounting frame.

[0029] In an optional embodiment, the shunt assembly is connected to the side of the mounting plate facing away from the side plate, and the shunt assembly is spaced apart from the adjacent mounting plate; the main board is located between the shunt assembly and the adjacent mounting plate, and the main board is fixedly connected to the adjacent mounting plate and abuts against the shunt assembly.

[0030] By connecting the flow diverter assembly to the side of the mounting plate away from the side plate, the fixed installation of the flow diverter assembly in the accommodating cavity formed by two adjacent fixing assemblies is facilitated, and the assembly of the mounting frame is facilitated.

[0031] In an optional embodiment, it further includes a second heat dissipation mechanism, which includes a third heat sink; the high-heat generating component includes a processor, and the third heat sink is attached to the processor.

[0032] By providing a third heat sink, the heat dissipation surface area of ​​the processor is increased, which not only directly improves the heat conduction efficiency, allowing the heat generated by the processor to be transferred to the cooling medium more quickly, but also the heat is more effectively carried away by the flow of the cooling medium, thereby enhancing the ability of convection heat dissipation. The heat dissipation path is optimized, the flow efficiency of the cooling medium is enhanced, the accumulation of heat around the processor is reduced, and the rapid dissipation of heat is promoted.

[0033] In an optional embodiment, the high-heat generating component further includes a power supply module, and the power supply module and the processor are arranged in sequence along the vertical direction; the second heat dissipation mechanism further includes a fourth heat sink, and the fourth heat sink is in contact with the power supply module.

[0034] By setting the fourth heat sink, the heat dissipation surface area of ​​the power supply module is increased, which not only directly improves the heat conduction efficiency, so that the heat generated by the power supply module can be transferred to the cooling medium more quickly, but also the heat is more effectively carried away by the flow of the cooling medium, thereby enhancing the ability of convection heat dissipation. It also optimizes the heat dissipation path, enhances the flow efficiency of the cooling medium, reduces the accumulation of heat around the power supply module, and promotes the rapid dissipation of heat. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the related technologies, the drawings required for use in the specific embodiments or the related technical descriptions will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 A front view of an immersion server according to an embodiment of the present invention;

[0037] Figure 2 It is a schematic diagram of the exploded structure of the immersion server according to an embodiment of the present invention;

[0038] Figure 3 A schematic structural diagram of an immersion server from another perspective of an embodiment of the present invention;

[0039] Figure 4 A side view of an immersion server according to an embodiment of the present invention;

[0040] Figure 5 for Figure 4 AA section view;

[0041] Figure 6 for Figure 4 BB cross-section diagram;

[0042] Figure 7 A front view of an immersion server according to an embodiment of the present invention;

[0043] Figure 8 for Figure 7 CC profile of ;

[0044] Fig. 9 This is a structural schematic diagram of the connection between the first partition plate and the cabinet according to an embodiment of the present invention;

[0045] Fig.10 It is a structural schematic diagram of the connection between the fixed plate and the diversion component according to an embodiment of the present invention.

[0046] Description of reference numerals:

[0047] 1. Cabinet; 11. First flow space; 12. Second flow space; 13. Third flow space; 14. Fourth flow space; 15. Second partition plate; 16. Third partition plate; 17. Air inlet; 18. Air outlet; 2. Mounting frame; 21. Diverter assembly; 211. Diverter plate; 2111. First connecting plate; 2112. Second connecting plate; 2113. Third connecting plate; 22. Fixing assembly; 221. Mounting plate; 222. Side plate; 23. Fixing plate; 3. Main board; 31. High-frequency Thermal component; 311, processor; 312, power supply module; 32, low-heat component; 321, server memory; 322, server hard disk; 4, power circulation mechanism; 5, convection switching device; 51, first partition plate; 511, convection hole; 52, switching plate; 521, switching hole; 53, power telescopic mechanism; 6, first heat dissipation mechanism; 61, first heat sink; 62, second heat sink; 63, heat dissipation fan; 7, second heat dissipation mechanism; 71, third heat sink; 72, fourth heat sink. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0049] Combine the following Figures 1 to 10 , describing an embodiment of the present invention.

[0050] According to an embodiment of the present invention, on the one hand, an immersion server is provided, including a cabinet 1, a mounting frame 2, a mainboard 3, a power circulation mechanism 4 and a convection switching device 5; the cabinet 1 is filled with a cooling medium; the mounting frame 2 is arranged in the cabinet 1, below the liquid level of the cooling medium; the mounting frame 2 and the side wall of the cabinet 1 are spaced to form a first flow space 11, and a receiving cavity is provided on the mounting frame 2; the top of the receiving cavity is connected to the first flow space 11; the mainboard 3 is fixed in the receiving cavity; and a temperature sensor is provided on the mainboard 3; the power circulation mechanism 4 is arranged in the first flow space 11; the convection switching device 5 is fixed between the cabinet 1 and the mounting frame 2 The convection switching device 5 is spaced from the bottom plate of the cabinet 1 to form a second flow space 12, and the second flow space 12 is connected to the bottom end of the accommodating cavity; the convection switching device 5 has a connecting position connecting the first flow space 11 and the second flow space 12, and a separating position separating the first flow space 11 and the second flow space 12; wherein, when the temperature of the temperature sensor is lower than the preset temperature, the convection switching device 5 is in the connecting position, and the power circulation mechanism 4 is in the closed state; when the temperature of the temperature sensor is higher than the preset temperature, the convection switching device 5 is in the separating position, and the power circulation mechanism 4 is in the open state.

[0051] Since the mounting frame 2 is provided with a receiving cavity, the mainboard 3 is fixed in the receiving cavity, and a first flow space 11 is provided between the mounting frame 2 and the cabinet 1, during the operation of the mainboard 3, the cooling medium in the receiving cavity will be heated up due to the heat generated by the mainboard 3, and the hot cooling medium rises to the top of the cabinet 1 and exchanges heat with the outside air, thereby achieving cooling and heat dissipation. The cooling medium after heat dissipation then flows downward through the first flow space 11, enters the second flow space 12, and finally flows back to the receiving cavity, continues to provide cooling for the mainboard 3, realizes the natural convection circulation of the cooling medium in the cabinet 1, and realizes the cooling medium in the cabinet Reasonable flow inside the body 1 prevents heat accumulation in the middle or upper area of ​​the cooling medium, avoids the phenomenon of uneven hot and cold in the upper and lower parts of the cooling medium, and improves the cooling efficiency; when the load of the main board 3 increases, causing the temperature detected by the temperature sensor to exceed the preset value, the power circulation mechanism 4 will start; at this time, the convection switching device 5 will also switch to the separation state to ensure that the cooling medium is driven by the power circulation mechanism 4 to force circulation in the accommodating cavity, which not only prevents heat accumulation in the middle or upper area of ​​the cooling medium, but also significantly speeds up the circulation speed of the cooling medium and improves the heat dissipation efficiency.

[0052] In a specific implementation, when the server is under a small load, the temperature of the mainboard 3 is low, and the temperature monitored by the temperature sensor is lower than a preset value. At this time, the natural convection cycle can meet the heat dissipation needs of the server, and the power circulation mechanism 4 is in a closed state, saving energy consumption; when the server is under a large load, the temperature of the mainboard 3 is high, and the temperature monitored by the temperature sensor is higher than a preset value. At this time, the power circulation mechanism 4 is in an open state, switching from the natural convection mode to the forced convection mode to ensure the heat dissipation efficiency; through the setting of the temperature sensor and the convection switching device 5, the cooling mode can be dynamically adjusted according to the actual workload to ensure that a good heat dissipation effect can be maintained under different working conditions.

[0053] In a specific embodiment, since the temperature monitored by the temperature sensor is higher than the preset value, when the power circulation mechanism 4 is in the open state, the first flow space 11 and the second flow space 12 are in a separated state, and the cooling medium circulates only in the accommodating cavity and the second flow space 12, thereby reducing the load of the power circulation mechanism 4 and reducing energy consumption.

[0054] In a specific implementation, in the traditional cooling system design, since only a single cooling chamber is provided, the cooling medium will rise and flow to the top of the cabinet 1 after being heated around the mainboard 3, and exchange heat with the air to achieve heat dissipation. However, when the cooled cooling medium flows downward, it can often only reach the heating part of the mainboard 3 and be heated again, and then continue to flow upward, but cannot effectively flow to the bottom of the heating part. This causes the cooling medium below to be in a static state and cannot fully exert its cooling effect. Compared with the traditional structure, the cooled cooling medium in the present application can flow to the bottom of the heating part of the mainboard 3 through the first flow space 11, and through the setting of the second flow space 12, it is achieved that the cooling medium flowing to the bottom of the heating part can flow to the heating part of the mainboard 3 again to cool the heating part, ensuring that the cooling medium can circulate under natural convection, avoiding the accumulation of heat in the middle or upper area of ​​the cooling medium, and improving the cooling efficiency.

[0055] In a specific embodiment, the power circulation mechanism 4 is a circulation pump.

[0056] In a specific embodiment, the cooling medium is a cooling liquid.

[0057] In one embodiment, a diverter component 21 is further provided in the accommodating cavity, and the diverter component 21 is spaced apart from the side wall of the accommodating cavity to form a third flow space 13; and a fourth flow space 14 is formed in the diverter component 21; on the side close to the top of the cabinet 1, the third flow space 13, the fourth flow space 14 and the first flow space 11 are interconnected; on the side close to the bottom of the cabinet 1, the third flow space 13, the fourth flow space 14 and the second flow space 12 are interconnected; a high heat generation component 31 and a low heat generation component 32 are provided on the main board 3, the low heat generation component 32 is arranged in the third flow space 13, and the high heat generation component 31 is arranged in the fourth flow space 14.

[0058] By setting the diversion component 21, a third flow space 13 and a fourth flow space 14 are divided. The setting of the third flow space 13 and the fourth flow space 14 can separate the high heat generation component 31 and the low heat generation component 32 from each other. The heat generated by the high heat generation component 31 during operation is confined to the third flow space 13 and cannot cause adverse effects on the low heat generation component 32 located in the fourth flow space 14, thereby ensuring that the low heat generation component 32 can work stably in a relatively low temperature environment, thereby improving the efficiency and reliability of the entire system.

[0059] In one embodiment, the diverter assembly 21 includes two diverter plates 211, and the two diverter plates 211 are spaced apart and form the fourth flow space 14; and the two diverter plates 211 are spaced apart from the two opposite side walls of the accommodating cavity, and respectively form two third flow spaces 13; the low heat generation assembly 32 is provided with two groups, and the two groups of the low heat generation assembly 32 are respectively arranged in the two third flow spaces 13.

[0060] By setting up two diverter plates 211, two independent third flow spaces 13 can be formed, thereby enhancing the circulation fluidity of the cooling medium; and the two low-heat generating components 32 are respectively located in the two third flow spaces 13, which not only ensures that each low-heat generating component 32 can be sufficiently cooled, but also effectively improves the overall heat dissipation performance by enhancing the circulation of the cooling medium, thereby achieving optimization of the spatial layout and improvement of the heat dissipation effect.

[0061] In a specific embodiment, the diverter plate 211 is made of insulating material, which helps to prevent the risk of electrical short circuit and increases the safety and reliability of the system.

[0062] In one embodiment, the diverter plate 211 includes a first connecting plate 2111, a second connecting plate 2112 and a third connecting plate 2113, and the first connecting plate 2111, the second connecting plate 2112 and the third connecting plate 2113 are arranged in sequence along the vertical direction; the top end of the second connecting plate 2112 is connected to the first connecting plate 2111, and the bottom end is connected to the third connecting plate 2113; the distance between the two first connecting plates 2111 is smaller than the distance between the two third connecting plates 2113.

[0063] Since the distance between the two first connecting plates 2111 is smaller than the distance between the two third connecting plates 2113, it is ensured that sufficient cooling medium can be distributed between the two third connecting plates 2113, and sufficient cooling medium can be distributed between the first connecting plate 2111 and the side wall of the accommodating cavity; sufficient distribution of the cooling medium between the two third connecting plates 2113 and between the first connecting plate 2111 and the side wall of the accommodating cavity is achieved, and the overall fluidity of the cooling medium in the accommodating cavity is enhanced.

[0064] In one embodiment, the high heat generating component 31 is disposed between the two third connecting plates 2113 , and the low heat generating component 32 is disposed between the first connecting plate 2111 and the side wall of the accommodating cavity.

[0065] The top end of the second connecting plate 2112 is connected to the first connecting plate 2111, and the bottom end is connected to the third connecting plate 2113. The three connecting plates are arranged in sequence in the vertical direction to form an orderly structure. Therefore, the third connecting plate 2113 is located below the first connecting plate 2111; since the high-heat generating component 31 is arranged between the two third connecting plates 2113, that is, on the side close to the bottom plate of the cabinet 1, when the high-heat generating component 31 generates heat, the heat will flow upward and be further cooled by the cooling medium above the cabinet 1 on the way, which not only accelerates the heat dissipation efficiency but also ensures the full utilization of the cooling medium; the low-heat generating component 32 is arranged in the space between the first connecting plate 2111 and the side wall of the accommodating cavity, and forms a layout arranged in sequence in the vertical direction with the high-heat generating component 31, so that the heat generated by the low-heat generating component 32 can quickly rise to the liquid surface of the cooling medium for heat dissipation, while the heat generated by the high-heat generating component 31 will not interfere with it, thereby ensuring the stability and efficiency of the entire heat dissipation system.

[0066] Preferably, fan blades can be arranged between the two first connecting plates 2111. The heat generated by the high-heat generating component 31 can heat the cooling medium, causing the cooling medium to be heated and rise. During this rising process, the heated cooling medium can naturally drive the fan blades to rotate. The rotation of the fan blades not only accelerates the rising speed of the heated medium, but also further promotes the convection circulation of the cooling medium, thereby improving the overall heat dissipation capacity.

[0067] In one embodiment, the convection switching device 5 includes a first partition plate 51, a switching plate 52 and a power telescopic mechanism 53; the first partition plate 51 is arranged between the mounting frame 2 and the side wall of the cabinet 1; in the first direction, a first gap is arranged between the mounting frame 2 and the side wall of the cabinet 1; a plurality of convection holes 511 are arranged on the first partition plate 51, and the plurality of convection holes 511 are arranged at intervals from each other, and the convection holes 511 are located in the first gap; the switching plate 52 is provided with a plurality of switching holes 521, and the plurality of switching holes 521 correspond one-to-one to the plurality of convection holes 511; and the switching plate 52 is abutted against the first partition plate 51, and is slidably arranged in the cabinet 1 along the second direction; the first direction is perpendicular to the second direction; the power output end of the power telescopic mechanism 53 is connected to the switching plate 52.

[0068] The switching plate 52 is controlled to slide by the power telescopic mechanism 53. When the power telescopic mechanism 53 controls the switching plate 52 to slide to the position corresponding to the switching hole 521 and the convection hole 511, the connection between the first flow space 11 and the second flow space 12 can be achieved; when the power telescopic mechanism 53 drives the switching plate 52 to slide to the position where the switching hole 521 and the convection hole 511 are staggered, the first flow space 11 is effectively separated from the second flow space 12 through physical barriers; the coordinated work of the power telescopic mechanism 53 and the switching plate 52 realizes the connection and separation between the first flow space 11 and the second flow space 12.

[0069] In a specific embodiment, the switching plate 52 is disposed below the first partition plate 51 .

[0070] In a specific embodiment, the power telescopic mechanism 53 is a telescopic cylinder.

[0071] In one embodiment, it also includes a second partition plate 15, which is arranged in the cabinet body 1 and divides the interior of the cabinet body 1 into a first accommodating space and a second accommodating space, and the first accommodating space and the second accommodating space are arranged in sequence along the second direction; the cooling medium is arranged in the first accommodating space, and the mounting frame 2 is located in the first accommodating space; the power telescopic mechanism 53 is located in the second accommodating space, and the power output end of the power telescopic mechanism 53 is connected to the switching plate 52 through the second partition plate 15.

[0072] By setting the second partition plate 15, the cabinet 1 can be divided into two independent areas, a first accommodating space and a second accommodating space. By setting the power telescopic mechanism 53 in the second accommodating space, the working stability of the power telescopic mechanism 53 is ensured and the interference caused by the cooling medium is avoided.

[0073] In one embodiment, it also includes a first heat dissipation mechanism 6, and a second gap is provided between the mounting frame 2 and the second partition plate 15; the first heat dissipation mechanism 6 includes a first heat sink 61 and a second heat sink 62; the first heat sink 61 is arranged in the second gap, and is respectively abutted against the mounting frame 2 and the second partition plate 15 on both sides along the second direction; the second heat sink 62 is arranged in the second accommodating space and is connected to the first heat sink 61.

[0074] By setting the first heat sink 61 and the second heat sink 62, an efficient heat transfer path is constructed, which can effectively and quickly conduct the heat generated in the first storage space to the second storage space, thereby achieving rapid heat dissipation and cooling, ensuring the high efficiency of heat transfer and the significance of heat dissipation effect.

[0075] In a specific implementation, the first heat sink 61 is located below the power circulation mechanism 4 .

[0076] In a specific implementation, the first heat sink 61 and the second heat sink 62 are both heat sink fins.

[0077] In one embodiment, the first heat dissipation mechanism 6 also includes a heat dissipation fan 63, which is arranged in the second accommodation space, and an air inlet 17 and an air outlet 18 are provided on the side wall of the cabinet 1, and the air inlet 17 and the air outlet 18 are both connected to the second accommodation space, and the air inlet 17 and the air outlet 18 are arranged at intervals.

[0078] By setting the heat dissipation fan 63, the air inlet 17 and the air outlet 18, the flow of air in the second storage space can be accelerated, which not only enhances the heat dissipation effect but also ensures the effective circulation of air, thereby accelerating the dissipation of heat and making the heat dissipation process more efficient and reliable.

[0079] In one embodiment, it also includes a third partition plate 16, which is arranged in the second accommodating space and divides the second accommodating space into a first installation space and a second installation space; the second installation space is located below the first installation space; the second heat sink 62 is located in the second installation space; the heat dissipation fan 63 is fixed on the third partition plate 16, and the air inlet end of the heat dissipation fan 63 is located in the first installation space, and the air outlet end is located in the second installation space; the air inlet 17 is connected to the first installation space, and the air outlet 18 is connected to the second installation space.

[0080] Since the second heat sink 62 is located in the second installation space and the air outlet 18 is arranged to be connected to the second installation component, the path for heat to be dissipated from the second heat sink 62 to the outside is shortened, thereby accelerating the heat dissipation process; and since the air inlet 17 is connected to the first installation space, the air inlet end of the heat dissipation fan 63 is located in the first installation space, and the air outlet end is located in the second installation space, which not only ensures that a steady stream of cold air can be sucked in from the first installation space and sent into the second installation space through the heat dissipation fan 63, but also further optimizes the overall heat dissipation effect, so that heat can be discharged more quickly and effectively.

[0081] In one embodiment, the mounting frame 2 includes one or more fixing components 22 and a fixing plate 23; the multiple fixing components 22 are arranged in sequence along the second direction; the fixing component 22 includes a mounting plate 221 and two side plates 222; the two side plates 222 are respectively arranged on both sides of the mounting plate 221 along the first direction, and are combined with the mounting plate 221 to form a receiving groove; the receiving groove and the adjacent fixing components 22 are combined to form the receiving cavity; the fixing plate 23 is located on the side of the fixing component 22 away from the second partition plate 15, and the fixing plate 23 and the receiving groove of the adjacent fixing component 22 are combined to form the receiving cavity.

[0082] By setting up multiple fixing parts, multiple main boards 3 can be fixedly installed; and a receiving cavity can be enclosed between two adjacent fixing components 22; by setting up the fixing plate 23, a receiving cavity can be enclosed with the fixing component 22 located at the end, thereby making full use of space resources and providing each main board 3 with a relatively independent and protected working environment.

[0083] In a specific embodiment, the fixing component 22 is a door-shaped structure, which is convenient for installation and disassembly of the internal structure of the server and for daily maintenance and upgrading of the server.

[0084] In a specific embodiment, the fixing plate 23 is made of insulating material, which helps to prevent the risk of electrical short circuit and increases the safety and reliability of the system.

[0085] In one embodiment, the shunt component 21 is connected to the fixed plate 23, and the shunt component 21 is spaced apart from the mounting plate 221; the main board 3 is located between the shunt component 21 and the mounting plate 221, and the main board 3 is fixedly connected to the mounting plate 221 and abuts against the shunt component 21.

[0086] By connecting the diverter assembly 21 to the fixing plate 23, the diverter assembly 21 in the accommodating cavity facing away from the second separation plate is fixedly installed, which not only ensures that the diverter assembly 21 can be firmly installed in the predetermined position, but also greatly facilitates the subsequent assembly process of the mounting frame 2.

[0087] In one embodiment, the side of the mounting plate 221 facing away from the side plate 222 is connected to the diverter assembly 21, and the diverter assembly 21 is spaced apart from the adjacent mounting plate 221; the main board 3 is located between the diverter assembly 21 and the adjacent mounting plate 221, and the main board 3 is fixedly connected to the adjacent mounting plate 221 and abuts against the diverter assembly 21.

[0088] By connecting the flow divider assembly 21 on the side of the mounting plate 221 away from the side plate 222 , the flow divider assembly 21 can be fixedly installed in the accommodating cavity formed by two adjacent fixing assemblies 22 , and the assembly of the mounting frame 2 can be facilitated.

[0089] In one embodiment, a second heat dissipation mechanism 7 is further included, and the second heat dissipation mechanism 7 includes a third heat sink 71 ; the high-heat generating component 31 includes a processor 311 , and the third heat sink 71 is attached to the processor 311 .

[0090] By providing the third heat sink 71, the heat dissipation surface area of ​​the processor 311 is increased, which not only directly improves the heat conduction efficiency, so that the heat generated by the processor 311 can be transferred to the cooling medium more quickly, but also the heat is more effectively carried away by the flow of the cooling medium, thereby enhancing the ability of convection heat dissipation. The heat dissipation path is optimized, the flow efficiency of the cooling medium is enhanced, the accumulation of heat around the processor 311 is reduced, and the rapid dissipation of heat is promoted.

[0091] In a specific implementation, the temperature processor 311 can be fixed on the board of the mainboard 3 to monitor the temperature of the mainboard 3; it can also be fixed on the processor 311 of the mainboard 3 to monitor the temperature of the processor 311.

[0092] In a specific implementation, the third heat sink 71 is a heat sink fin.

[0093] In one embodiment, the high-heat generating component 31 further includes a power supply module 312 , and the power supply module 312 and the processor 311 are arranged in sequence along the vertical direction; the second heat dissipation mechanism 7 further includes a fourth heat sink 72 , and the fourth heat sink 72 is in contact with the power supply module 312 .

[0094] By setting the fourth heat sink 72, the heat dissipation surface area of ​​the power supply module 312 is increased, which not only directly improves the heat conduction efficiency, so that the heat generated by the power supply module 312 can be transferred to the cooling medium more quickly, but also the heat is more effectively carried away by the flow of the cooling medium, thereby enhancing the ability of convection heat dissipation. It also optimizes the heat dissipation path, enhances the flow efficiency of the cooling medium, reduces the accumulation of heat around the power supply module 312, and promotes the rapid dissipation of heat.

[0095] In a specific implementation, the power supply module 312 includes a first module and a second module, the first module is used to supply power to the processor 311, and the second module is used to supply power to the mainboard 3. Specifically, the first module and the second module are sequentially arranged at intervals along the first direction.

[0096] In a specific implementation, the low heat generation component 32 includes a plurality of server memories 321 arranged in sequence and a plurality of server hard disks 322 arranged in sequence, and the server hard disks 322 are located above the server motherboard 3 .

[0097] In a specific implementation, the fourth heat sink 72 is a heat sink fin.

[0098] In a specific implementation, when the server is under a small load, the temperature monitored by the temperature sensor is lower than a preset value. At this time, the power circulation mechanism 4 is in a closed state, and the convection switching device 5 is in a connected position. When the high-heat generating components 31 such as the processor 311 and the power supply module 312 generate heat, the heat heats the surrounding cooling medium, and the heated cooling medium moves upward in the fourth flow space 14, and carries the heat of the third heat sink 71 and the fourth heat sink 72 upward; at the same time, the cooling medium in the third flow space 13 exchanges heat with the server memory 321 and the server hard disk 322, and the heat exchanged cooling medium The cooling medium moves upward; then the third flow space 13 and the fourth flow space 14 flow to the heated cooling medium above, and cools down and dissipates heat in contact with the outside air and the outer wall of the cabinet 1, and then the cooling medium after heat dissipation moves downward from the first flow space 11, passes through the convection holes 511 and the switching holes 521 of the convection switching device 5 and enters the second flow space 12, and then the cooling medium entering the second flow space 12 continues to enter the third flow space 13 and the fourth flow space 14 to cool down the low-heat generating components 32 and the high-heat generating components 31, and the above process is repeated to realize natural convection circulation heat dissipation.

[0099] In a specific embodiment, when the server is under heavy load, the temperature monitored by the temperature sensor is higher than the preset value. At this time, the power retractable mechanism 53 is actuated to drive the switching plate 52 to move, so that the switching hole 521 and the convection hole 511 are staggered, and the convection switching device 5 is in a separated position; then the heat dissipation fan 63 and the power circulation mechanism 4 are controlled to be in an on state, and the power circulation mechanism 4 drives the cooling medium located above to be forced to move downward. The cooling medium moving downward enters the accommodating cavity from the second flow space 12, and takes away the heat generated by the low-heat generating components and the high-heat generating components. At the same time, the first heat sink 61 and the second heat sink 62 transfer the heat of the heated cooling medium below the power circulation mechanism 4 to the second accommodating space, and the heat dissipation fan 63 draws in the cold air from the outside through the air inlet 17, and then discharges the hot air after heat exchange with the second heat sink 62 through the air outlet 18.

[0100] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. An immersion server, characterized in that: include: A cabinet (1) filled with a cooling medium; A mounting frame (2) is arranged in the cabinet (1) and is located below the liquid surface of the cooling medium; the mounting frame (2) and the side wall of the cabinet (1) are spaced apart to form a first flow space (11), and a receiving cavity is provided on the mounting frame (2); the top end of the receiving cavity is in communication with the first flow space (11); A main board (3) is fixed in the accommodating cavity; and a temperature sensor is provided on the main board (3); A power circulation mechanism (4) is arranged in the first flow space (11); a convection switching device (5) fixed between the cabinet (1) and the mounting frame (2); the convection switching device (5) is spaced apart from the bottom plate of the cabinet (1) to form a second flow space (12), and the second flow space (12) is connected to the bottom end of the accommodating cavity; The convection switching device (5) has a connecting position connecting the first flow space (11) and the second flow space (12), and a separating position separating the first flow space (11) and the second flow space (12); Wherein, when the temperature of the temperature sensor is lower than a preset temperature, the convection switching device (5) is in the connecting position, and the power circulation mechanism (4) is in the closed state; when the temperature of the temperature sensor is higher than the preset temperature, the convection switching device (5) is in the separating position, and the power circulation mechanism (4) is in the open state; The convection switching device (5) comprises: A first partition plate (51) is arranged between the mounting frame (2) and the side wall of the cabinet (1); in a first direction, a first gap is provided between the mounting frame (2) and the side wall of the cabinet (1); a plurality of convection holes (511) are provided on the first partition plate (51), the plurality of convection holes (511) are arranged at intervals from each other, and the convection holes (511) are located in the first gap; The switching plate (52) is provided with a plurality of switching holes (521), and the plurality of switching holes (521) correspond one-to-one to the plurality of convection holes (511); the switching plate (52) abuts against the first partition plate (51) and is slidably arranged in the cabinet (1) along a second direction; the first direction is perpendicular to the second direction; When the switching plate (52) slides to a position corresponding to the switching hole (521) and the convection hole (511), the first flow space (11) and the second flow space (12) are connected; when the switching plate (52) slides to a position where the switching hole (521) and the convection hole (511) are offset, the first flow space (11) and the second flow space (12) are separated.

2. The immersion server according to claim 1, characterized in that: A flow dividing component (21) is further provided in the accommodating cavity, and the flow dividing component (21) is spaced apart from the side wall of the accommodating cavity to form a third flow space (13); and a fourth flow space (14) is formed in the flow dividing component (21); on a side close to the top of the cabinet (1), the third flow space (13), the fourth flow space (14) and the first flow space (11) are interconnected; and on a side close to the bottom of the cabinet (1), the third flow space (13), the fourth flow space (14) and the second flow space (12) are interconnected; The mainboard (3) is provided with a high-heat generating component (31) and a low-heat generating component (32); the low-heat generating component (32) is arranged in the third flow space (13), and the high-heat generating component (31) is arranged in the fourth flow space (14); the high-heat generating component (31) comprises a processor (311); the high-heat generating component (31) further comprises a power supply module (312); the low-heat generating component (32) comprises a plurality of server memories (321) arranged in sequence and a plurality of server hard disks (322) arranged in sequence.

3. The immersion server according to claim 2, characterized in that: The flow distribution component (21) comprises two flow distribution plates (211), the two flow distribution plates (211) are spaced apart and form the fourth flow space (14); and the two flow distribution plates (211) are spaced apart from two opposite side walls of the accommodating cavity and respectively form two third flow spaces (13); the low heat generation component (32) is provided with two groups, and the two groups of low heat generation components (32) are respectively arranged in the two third flow spaces (13).

4. The immersion server according to claim 3, characterized in that: The diverter plate (211) comprises a first connecting plate (2111), a second connecting plate (2112) and a third connecting plate (2113); the first connecting plate (2111), the second connecting plate (2112) and the third connecting plate (2113) are arranged in sequence along the vertical direction; the top end of the second connecting plate (2112) is connected to the first connecting plate (2111), and the bottom end is connected to the third connecting plate (2113); the distance between the two first connecting plates (2111) is smaller than the distance between the two third connecting plates (2113).

5. The immersion server according to claim 4, characterized in that: The high heat generation component (31) is arranged between the two third connecting plates (2113), and the low heat generation component (32) is arranged between the first connecting plate (2111) and the side wall of the accommodating cavity.

6. The immersion server according to any one of claims 2 to 5, characterized in that: The convection switching device (5) comprises: A power retractable mechanism (53) has a power output end connected to the switching plate (52).

7. The immersion server according to claim 6, characterized in that: It also comprises a second partition plate (15), the second partition plate (15) being arranged in the cabinet (1) and dividing the interior of the cabinet (1) into a first accommodating space and a second accommodating space, the first accommodating space and the second accommodating space being arranged in sequence along the second direction; the cooling medium is arranged in the first accommodating space, and the mounting frame (2) is located in the first accommodating space; The power telescopic mechanism (53) is located in the second accommodating space, and a power output end of the power telescopic mechanism (53) passes through the second partition plate (15) and is connected to the switching plate (52).

8. The immersion server according to claim 7, characterized in that: It also includes a first heat dissipation mechanism (6), a second gap is provided between the mounting frame (2) and the second partition plate (15); the first heat dissipation mechanism (6) includes: A first heat sink (61) is arranged in the second gap, and is in contact with the mounting frame (2) and the second partition plate (15) at two sides along the second direction respectively; The second heat sink (62) is arranged in the second accommodation space and connected to the first heat sink (61).

9. The immersion server according to claim 8, characterized in that: The first heat dissipation mechanism (6) further comprises a heat dissipation fan (63), the heat dissipation fan (63) being arranged in the second accommodation space, and an air inlet (17) and an air outlet (18) being arranged on the side wall of the cabinet (1), the air inlet (17) and the air outlet (18) both being in communication with the second accommodation space, and the air inlet (17) and the air outlet (18) being arranged at intervals.

10. The immersion server according to claim 9, characterized in that: It also includes a third partition plate (16), which is arranged in the second accommodating space and divides the second accommodating space into a first installation space and a second installation space; the second installation space is located below the first installation space; the second heat sink (62) is located in the second installation space; the heat dissipation fan (63) is fixed on the third partition plate (16), and the air inlet end of the heat dissipation fan (63) is located in the first installation space, and the air outlet end is located in the second installation space; the air inlet (17) is connected to the first installation space, and the air outlet (18) is connected to the second installation space.

11. The immersion server according to any one of claims 7 to 10, characterized in that: The mounting frame (2) comprises: One or more fixing components (22), wherein the fixing components (22) are arranged in sequence along the second direction; the fixing components (22) comprise a mounting plate (221) and two side plates (222); the two side plates (222) are arranged on both sides of the mounting plate (221) along the first direction, respectively, and are combined with the mounting plate (221) to form a receiving groove; the receiving groove and the adjacent fixing components (22) are combined to form the receiving cavity; The fixing plate (23) is located on a side of the fixing component (22) away from the second partition plate (15), and the fixing plate (23) and the receiving groove of the adjacent fixing component (22) enclose each other to form the receiving cavity.

12. The immersion server according to claim 11, characterized in that: The fixed plate (23) is connected to the flow diversion component (21), and the flow diversion component (21) and the mounting plate (221) are arranged at a distance; the main board (3) is located between the flow diversion component (21) and the mounting plate (221), and the main board (3) is fixedly connected to the mounting plate (221) and abuts against the flow diversion component (21).

13. The immersion server according to claim 11, characterized in that: The side of the mounting plate (221) facing away from the side plate (222) is connected to the flow diversion component (21), and the flow diversion component (21) and the adjacent mounting plate (221) are arranged at a distance; the main board (3) is located between the flow diversion component (21) and the adjacent mounting plate (221), and the main board (3) is fixedly connected to the adjacent mounting plate (221) and abuts against the flow diversion component (21).

14. The immersion server according to any one of claims 2 to 5 or 7 to 10 or 12 or 13, characterized in that: It also comprises a second heat dissipation mechanism (7), the second heat dissipation mechanism (7) comprising a third heat sink (71); the high-heat generating component (31) comprises a processor (311), and the third heat sink (71) is bonded to the processor (311).

15. The immersion server according to claim 14, characterized in that: The high-heat generating component (31) further comprises a power supply module (312), wherein the power supply module (312) and the processor (311) are arranged in sequence along a vertical direction; and the second heat dissipation mechanism (7) further comprises a fourth heat sink (72), wherein the fourth heat sink (72) is in contact with the power supply module (312).

Images