Electronic device

Abstract

The embodiment of the invention provides electronic equipment. Relates to the technical field of display. The electronic equipment comprises a display module and a circuit board, the display module comprises a display screen, the display screen comprises a display area, an edge bending area located on the edge of the display area and a lower frame area connected with the edge bending area, and the lower frame area is located on the side, away from a display surface, of the display area; the circuit board is connected with the side, away from the display area, of the lower frame area. One surface of the circuit board connected with the lower frame area is provided with a diversion trench, and / or one surface of the lower frame area connected with the circuit board is provided with a diversion trench. The liquid can be drained out through the flow guide grooves, and the corrosion degree of the liquid to circuits on the display module is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a foldable electronic device. Background Art

[0002] With the development of human-computer interaction technology, display has become an important element of human-computer interaction. Therefore, foldable screen electronic devices have come into being, such as foldable mobile phones.

[0003] How to prevent external liquids from entering electronic devices and improve user experience is one of the main problems currently faced. In some existing technologies, waterproofing can be achieved by filling with glue, but the process is complicated and some points prone to failure cannot be filled with glue, resulting in poor waterproof performance of the entire electronic device. Summary of the invention

[0004] The present application provides an electronic device, such as a foldable electronic device, for the purpose of preventing external liquid from entering the device and reducing the degree of corrosion of the liquid on electronic components in the electronic device.

[0005] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, the present application provides an electronic device, which may be a foldable electronic device.

[0007] The electronic device includes a display module and a circuit board. The display module includes a display screen. The display screen includes a display area, an edge bending area located at the edge of the display area, and a lower frame area connected to the edge bending area. The lower frame area is located on a side of the display area away from the display surface; the circuit board is arranged on a side of the lower frame area away from the display area; the circuit board is connected to a side of the lower frame area away from the display area; a guide groove is provided on a side of the circuit board connected to the lower frame area, and / or a guide groove is provided on a side of the lower frame area connected to the circuit board.

[0008] In the electronic device involved in the present application, since a guide groove is provided on the surface of the circuit board connected to the lower frame area, and / or a guide groove is provided on the surface of the lower frame area connected to the circuit board, when external liquid enters the device along the display module, it will flow along the guide groove and be drained to the outside of the display module, thereby reducing the degree of corrosion of the liquid on the circuit on the display module.

[0009] In one achievable manner, the circuit board has a first edge and a second edge relative to each other, and a third edge and a fourth edge relative to each other, and the first edge is arranged at the end of the lower frame area away from the edge bending area through an electrical connection structure; a guide groove is provided on one side of the circuit board connected to the lower frame area, and the guide groove extends to the second edge, the third edge and the fourth edge.

[0010] By extending the guide groove to the second edge, the third edge and the fourth edge, the liquid can be discharged from multiple directions, thereby improving the flow efficiency of the liquid and avoiding the accumulation of too much liquid and corrosion of the circuit.

[0011] In one practicable manner, an adhesive layer is provided between the circuit board and the bonding surface of the lower frame area, and the adhesive layer is provided at the edge of the electrical connection structure.

[0012] The adhesive layer can play an adsorption role, and the cooperation between the adhesive layer and the guide groove can further inhibit the corrosion of the circuit by the liquid.

[0013] In one achievable manner, the electronic device further includes a shell and a filling layer, the shell includes a frame arranged at the edge of the display module, the filling layer is arranged at a position where the frame is in contact with the display surface of the display module, and a texture structure is arranged at a position of the display module opposite to the filling layer.

[0014] Since the texture structure is provided at the position where the display module is attached to the filling layer, the texture structure is used to destroy the capillary effect of the gap between the filling layer and the display module to prevent liquid from entering. When liquid flows from the outside to the texture structure, the texture structure can effectively destroy the driving force of the liquid to continue to move forward, thereby preventing the liquid from entering the device and corroding the components in the device. The combination of the texture structure and the guide groove can further improve the waterproof performance.

[0015] In one achievable manner, the display module further includes a cover plate, which is disposed on one side of the display surface of the display screen. The texture structure includes a texture groove, and the texture groove is disposed at a position of the cover plate opposite to the filling layer.

[0016] In one achievable manner, the depth of the texture groove is 0.1 μm to 10 μm.

[0017] In one achievable manner, a texture boss protrudes from a position of the cover plate opposite to the filling layer, and the texture boss forms a texture structure.

[0018] The texture structure can be obtained not only by etching but also by dispensing coating.

[0019] In one achievable manner, the cover plate includes a first non-bending area, a second non-bending area, a third non-bending area, a first bending area and a second bending area, the first bending area connects the first non-bending area and the second non-bending area, the second bending area connects the second non-bending area and the third non-bending area, and both the first bending area and the second bending area can be bent along a bending line to switch between an expanded state and a closed state; the thickness of the first non-bending area is not equal to the thickness of the second non-bending area.

[0020] Since the thickness of the first non-bending area is not equal to the thickness of the second non-bending area in the cover plate, that is, the cover plate is designed as a non-uniform thickness structure. For example, in some scenarios, in order to improve the rigidity of the first non-bending area exposed in the folded state (to present a picture to the user), when the thickness of the first non-bending area is increased, the non-uniform thickness design of the cover plate basically does not affect the bendability of the first bending area due to the increase in the thickness of the first non-bending area.

[0021] In one achievable manner, the cover plate includes a substrate and a first buffer layer, the first buffer layer is closer to the display screen than the substrate; the thickness of the substrate located in the first non-bending area is greater than the thickness of the substrate located in the second non-bending area, and / or; the thickness of the first buffer layer located in the first non-bending area is greater than the thickness of the first buffer layer located in the second non-bending area.

[0022] In some implementation structures, at least one of the substrate or the buffer layer in the cover plate can be designed as a structure of unequal thickness. In one achievable manner, the thickness of the first buffer layer located in the first bending area gradually decreases from the first non-bending area to the second non-bending area.

[0023] In one achievable manner, the cover plate includes a second buffer layer, the second buffer layer includes a first part and a second part; the first part of the second buffer layer is located in the first non-bending area, the second part of the second buffer layer is located in the first bending area, and the elastic modulus of the first part of the second buffer layer is greater than the elastic modulus of the second part of the second buffer layer.

[0024] In order to further improve the bendability of the bending area, the second buffer layer may be designed to have a structure with unequal elastic moduli.

[0025] In a second aspect, the present application provides an electronic device, which includes a display module and a circuit board, the display module includes a display screen, the display screen includes a display area, an edge bending area located at the edge of the display area, and a lower frame area connected to the edge bending area, the lower frame area is located on the side of the display area away from the display surface; the circuit board is connected to the side of the lower frame area away from the display area; the circuit board is provided with at least one opening, and along the thickness direction of the circuit board, at least one opening passes through the circuit board; an adhesive layer is provided in at least one opening, and an adhesive layer is provided between the bonding surface of the circuit board and the lower frame area.

[0026] In the electronic device provided in the present application, at least one opening is provided on the circuit board and passes through it. In a feasible process, a glue layer can be filled between the circuit board and the lower frame area through the opening. The glue layer can prevent external liquids from corroding the circuit structure on the display module or other electronic devices.

[0027] In one achievable manner, the circuit board is disposed at an end of the lower frame region away from the edge bending region through an electrical connection structure; and at least one opening is disposed close to the electrical connection structure.

[0028] Since the opening is arranged close to the electrical connection structure, the filled adhesive layer can well protect the circuit at the electrical connection structure, or the exposed circuit structure at the edge of the electrical connection structure.

[0029] In one possible implementation, there are a plurality of openings, and the plurality of openings are arranged at intervals along a direction parallel to the bending line of the edge bending region.

[0030] A plurality of openings are provided to fully fill the gap between the circuit board and the display screen.

[0031] In one achievable manner, the electronic device further includes a shell, the shell includes a frame arranged at the edge of the display module, a filling layer is arranged at a position where the frame and the display surface of the display module are in contact, and a texture structure is arranged at a position of the display module opposite to the filling layer.

[0032] Since the texture structure is provided at the position of the display module opposite to the filling layer, the texture structure is used to destroy the capillary effect of the gap between the filling layer and the display module to prevent liquid from entering. When liquid flows from the outside to the texture structure, the texture structure can effectively destroy the driving force of the liquid to continue to move forward, thereby preventing the liquid from entering the device and corroding the components in the device. The combination of the texture structure and the guide groove can further improve the waterproof performance.

[0033] In one achievable manner, the display module further includes a cover plate, which is disposed on one side of the display surface of the display screen, and the texture structure includes a texture groove, and the texture groove is disposed at a position of the cover plate opposite to the filling layer.

[0034] In one achievable manner, the depth of the texture groove is 0.1 μm to 10 μm.

[0035] In one achievable manner, a texture boss protrudes from a position of the cover plate opposite to the filling layer, and the texture boss forms a texture structure.

[0036] The texture structure can be obtained not only by etching but also by dispensing coating.

[0037] In one achievable manner, the cover plate includes a first non-bending area, a second non-bending area, a third non-bending area, a first bending area and a second bending area, the first bending area connects the first non-bending area and the second non-bending area, the second bending area connects the second non-bending area and the third non-bending area, and both the first bending area and the second bending area can be bent along a bending line to switch between an expanded state and a closed state; the thickness of the first non-bending area is not equal to the thickness of the second non-bending area.

[0038] In the cover plate, the thickness of the first non-bending area is not equal to the thickness of the second non-bending area, that is, the cover plate is designed as an unequal thickness structure. For example, in some scenarios, in order to improve the stiffness of the first non-bending area exposed in the folded state (to present a picture to the user), when the thickness of the first non-bending area is increased, the unequal thickness design of the cover plate basically does not affect the bendability of the first bending area due to the increase in the thickness of the first non-bending area.

[0039] In one achievable manner, the cover plate includes a substrate and a first buffer layer, the first buffer layer is closer to the display screen than the substrate; the thickness of the substrate located in the first non-bending area is greater than the thickness of the substrate located in the second non-bending area, and / or; the thickness of the first buffer layer located in the first non-bending area is greater than the thickness of the first buffer layer located in the second non-bending area.

[0040] In some implementation structures, at least one of the substrate or the buffer layer in the cover plate may be designed to have unequal thickness.

[0041] In one achievable manner, the thickness of the first buffer layer located in the first bending region gradually decreases from the first non-bending region to the second non-bending region.

[0042] In one achievable manner, the cover plate includes a second buffer layer, the second buffer layer includes a first part and a second part; the first part of the second buffer layer is located in the first non-bending area, the second part of the second buffer layer is located in the first bending area, and the elastic modulus of the first part of the second buffer layer is greater than the elastic modulus of the second part of the second buffer layer.

[0043] In order to further improve the bendability of the bending area, the second buffer layer may be designed to have a structure with unequal elastic moduli.

[0044] In a third aspect, the present application provides an electronic device, which includes a display module and a shell, the shell including a frame arranged at the edge of the display module, a filling layer is arranged at a position where the frame is in contact with the display surface of the display module; a texture structure is arranged at a position of the display module opposite to the filling layer.

[0045] In the electronic device provided in the present application, since a textured structure is provided at a position of the display module opposite to the filling layer, the textured structure is utilized to destroy the capillary action of the gap between the filling layer and the display module to prevent liquid from entering. When liquid flows from the outside to the textured structure, the textured structure can effectively destroy the driving force for the liquid to continue to move forward, thereby preventing the liquid from entering the device and corroding the components in the device.

[0046] In one achievable manner, the display module includes a display screen and a cover plate, wherein the cover plate is disposed on one side of a display surface of the display screen, and a texture structure is disposed at a position of the cover plate opposite to the filling layer.

[0047] That is, the texture structure is arranged on the surface of the cover plate.

[0048] In one achievable manner, the cover plate includes a first non-bending area, a second non-bending area, a third non-bending area, a first bending area and a second bending area, the first bending area connects the first non-bending area and the second non-bending area, the second bending area connects the second non-bending area and the third non-bending area, and both the first bending area and the second bending area can be bent along a bending line to switch between an expanded state and a closed state; the thickness of the first non-bending area is not equal to the thickness of the second non-bending area.

[0049] In the cover plate, the thickness of the first non-bending area is not equal to the thickness of the second non-bending area, that is, the cover plate is designed as an unequal thickness structure. For example, in some scenarios, in order to improve the stiffness of the first non-bending area exposed in the folded state (to present a picture to the user), when the thickness of the first non-bending area is increased, the unequal thickness design of the cover plate basically does not affect the bendability of the first bending area due to the increase in the thickness of the first non-bending area.

[0050] In one achievable manner, the cover plate includes a substrate and a first buffer layer, the first buffer layer is closer to the display screen than the substrate; the thickness of the substrate located in the first non-bending area is greater than the thickness of the substrate located in the second non-bending area, and / or; the thickness of the first buffer layer located in the first non-bending area is greater than the thickness of the first buffer layer located in the second non-bending area.

[0051] In some implementation structures, at least one of the substrate or the buffer layer in the cover plate may be designed to have unequal thickness.

[0052] In one achievable manner, the thickness of the first buffer layer located in the first bending region gradually decreases from the first non-bending region to the second non-bending region.

[0053] In one achievable manner, the cover plate includes a second buffer layer, the second buffer layer includes a first part and a second part; the first part of the second buffer layer is located in the first non-bending area, the second part of the second buffer layer is located in the first bending area, and the elastic modulus of the first part of the second buffer layer is greater than the elastic modulus of the second part of the second buffer layer.

[0054] In order to further improve the bendability of the bending area, the second buffer layer may be designed to have a structure with unequal elastic moduli.

[0055] In one practicable manner, the display screen includes a display area, an edge bending area located at an outer edge of the display area, and a lower frame area connected to the edge bending area, and the lower frame area is located on the back of the display area.

[0056] In one achievable manner, a texture groove is provided at a position of the display module opposite to the filling, and the texture groove forms a texture structure; or a texture boss is protruded at a position of the display module opposite to the filling, and the texture boss forms a texture structure.

[0057] The texture structure can be made not only by etching but also by dispensing. For example, the depth of the texture groove or the texture boss is 0.1 μm to 10 μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] Figure 1 A structural diagram of a foldable electronic device;

[0059] Figure 2 A structural diagram of a display screen in a display module when it is bent;

[0060] Figure 3 A schematic diagram showing the connection relationship between a display module and a housing;

[0061] Figure 4 A schematic diagram of the connection relationship between a display module and a circuit board;

[0062] Figure 5 A schematic diagram of the connection relationship between a display module, a circuit board and a housing;

[0063] Figure 6 A schematic diagram of the connection relationship between a display module and a circuit board;

[0064] Figure 7 A schematic diagram of the connection relationship between a display module, a circuit board and a housing;

[0065] Figure 8 A schematic diagram of the connection relationship between a display module and a circuit board provided in an embodiment of the present application;

[0066] Fig. 9 A schematic diagram of the connection relationship of a circuit board provided in an embodiment of the present application;

[0067] Fig.10 A structural diagram of a display screen of a display module provided in an embodiment of the present application;

[0068] Fig.11 A structural diagram of a circuit board provided in an embodiment of the present application;

[0069] Fig.12 A schematic diagram of the connection relationship between a display screen and a circuit board provided in an embodiment of the present application;

[0070] Fig.13 A structural diagram of a circuit board provided in an embodiment of the present application;

[0071] Fig.14 A schematic diagram of the connection relationship between a display screen and a circuit board provided in an embodiment of the present application;

[0072] Fig.15 A structural diagram of a circuit board provided in an embodiment of the present application;

[0073] Fig.16 for Fig.15 AA section view;

[0074] Fig.17 A schematic diagram of the connection relationship between a display screen and a circuit board provided in an embodiment of the present application;

[0075] Fig.18 A schematic diagram of the connection relationship between a display module and a housing provided in an embodiment of the present application;

[0076] Fig.19 A structural diagram of a cover plate of a display module provided in an embodiment of the present application;

[0077] Fig. 20 A structural diagram of a cover plate of a display module provided in an embodiment of the present application;

[0078] Fig.21 A structural diagram of a cover plate of a display module provided in an embodiment of the present application;

[0079] Fig. 22 A structural diagram of a cover plate of a display module provided in an embodiment of the present application;

[0080] Fig.23 A structural diagram of a cover plate of a display module provided in an embodiment of the present application;

[0081] Fig.24 A structural diagram of a cover plate of a display module provided in an embodiment of the present application;

[0082] Fig.25 A schematic diagram of the connection relationship between a frame and a rotating shaft mechanism provided in an embodiment of the present application;

[0083] Fig.26 for Fig.25 Exploded diagram of

[0084] Fig. 27 A partial structural diagram of a main shaft provided in an embodiment of the present application;

[0085] Fig.28 A schematic diagram of the connection relationship between a frame and a rotating shaft mechanism provided in an embodiment of the present application;

[0086] Fig.29 A schematic diagram of the connection relationship between a frame, a rotating shaft mechanism and a shielding strip provided in an embodiment of the present application;

[0087] Fig.30 A structural diagram of a multi-fold display module in a flattened state provided in an embodiment of the present application;

[0088] Fig.31 A structural diagram of a multi-fold display module in a flattened state provided in an embodiment of the present application;

[0089] Fig.32 A structural diagram of a multi-fold display module in a flattened state provided in an embodiment of the present application;

[0090] Fig.33 A structural diagram of a multi-folding display module in a folded state provided in an embodiment of the present application;

[0091] Fig.34 A structural diagram of a multi-fold display module in a flattened state provided in an embodiment of the present application;

[0092] Fig.35 A structural diagram of a multi-fold display module in a flattened state provided in an embodiment of the present application;

[0093] Fig.36 A structural diagram of a multi-fold display module in a flattened state provided in an embodiment of the present application;

[0094] Fig.37 A structural diagram of a multi-fold display module provided in an embodiment of the present application;

[0095] Fig.38 A structural diagram of a multi-fold display module provided in an embodiment of the present application, in which a cover plate is in a flattened state;

[0096] Fig.39 A structural diagram of a multi-fold display module provided in an embodiment of the present application, in which a cover plate is in a flattened state;

[0097] Fig.40 A structural diagram of a multi-fold display module provided in an embodiment of the present application, in which a cover plate is in a flattened state;

[0098] Fig.41 A structural diagram of a multi-fold display module provided in an embodiment of the present application, in which a cover plate is in a flattened state;

[0099] Fig.42 A structural diagram of a multi-fold display module provided in an embodiment of the present application, in which a cover plate is in a flattened state;

[0100] Fig.43 A structural diagram of a multi-fold display module provided in an embodiment of the present application, in which a cover plate is in a flattened state;

[0101] Fig.44 A structural diagram of a multi-fold display module in a flattened state provided in an embodiment of the present application;

[0102] Fig.45 A structural diagram of a multi-fold display module provided in an embodiment of the present application, in which a cover plate is in a flattened state;

[0103] Fig.46 A structural diagram of a multi-fold display module provided in an embodiment of the present application, in which a cover plate is in a flattened state;

[0104] Fig.47 A structural diagram of a multi-fold display module provided in an embodiment of the present application, in which a cover plate is in a flattened state;

[0105] Fig.48 A structural diagram of a multi-fold display module in a flattened state provided in an embodiment of the present application;

[0106] Fig.49 A structural diagram of a multi-fold display module in a flattened state provided in an embodiment of the present application;

[0107] Fig.50 A structural diagram of a multi-fold display module in a flattened state provided in an embodiment of the present application;

[0108] Fig.51 A structural diagram of a multi-fold display module in a flattened state provided in an embodiment of the present application;

[0109] Fig.52 A structural diagram of a multi-fold display module in a flattened state provided in an embodiment of the present application. DETAILED DESCRIPTION

[0110] The specific embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0111] An embodiment of the present application provides an electronic device, which may be a foldable electronic device.

[0112] The electronic device may include a mobile phone, a tablet computer (pad), a smart wearable product (e.g., a smart watch, a smart bracelet), a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, and other electronic products with display functions. The embodiments of the present application do not impose any special restrictions on the specific form of the above-mentioned electronic devices with display functions.

[0113] For the convenience of explanation, the structure of the electronic device is described below by taking a mobile phone as an example.

[0114] Figure 1 A structural diagram of a folding screen mobile phone is shown, and the folding screen mobile phone of the example is a three-screen folding mobile phone. The three-folding screen mobile phone may include a first shell 100a, a second shell 100b and a third shell 100c, and a display module 11. The display module 11 may be continuously covered on the first shell 100a, the second shell 100b and the third shell 100c. The folding screen mobile phone may also include a first rotating shaft mechanism and a second rotating shaft mechanism.

[0115] The first shell 100a and the second shell 100b are arranged on both sides of the first hinge mechanism and are respectively connected to the first hinge mechanism. The first hinge mechanism can move so that the first shell 100a and the second shell 100b are relatively folded or relatively unfolded, thereby realizing the flattening and closing of the display module 11 arranged on the first shell 100a and the second shell 100b.

[0116] The second shell 100b and the third shell 100c are arranged on both sides of the second hinge mechanism and are respectively connected to the second hinge mechanism. The second hinge mechanism can move so that the second shell 100b and the third shell 100c are relatively folded or relatively unfolded, thereby realizing the flattening and closing of the display module 11 arranged on the second shell 100b and the third shell 100c.

[0117] A foldable electronic device can be unfolded to a flat state, or folded to a closed state, or in an intermediate state between the flat state and the closed state. A foldable electronic device has at least two states, namely, a flat state and a closed state. In some cases, a third state may be further included, which is an intermediate state between the flat state and the closed state. The intermediate state does not have only one state, and may be any one or more states between the flat state and the closed state of the electronic device.

[0118] In some examples, the display module 11 may include a display panel. The display panel may be a flexible display panel.

[0119] In the display module, the display driver integrated circuit (DDIC) and the touch panel integrated circuit (TPIC) are very important components of the display touch imaging system. They integrate resistors, regulators, power transistors and other components, and are responsible for driving the display panel and controlling the driving current and other functions.

[0120] Figure 2 One of the packaging structures of a display driver chip DDIC is shown, and this packaging structure may be referred to as a chip on panel (COP) packaging.

[0121] like Figure 2 The edge portion of the display screen 112 is bent so that the display screen 112 includes a display area AA and a lower frame area CC, and an edge bending area BB connecting the display area AA and the lower frame area CC.

[0122] Figure 2 The display area AA in the above includes: Figure 1 The bending part and the non-bending part connected to the bending part are both used as display parts to display images to users. Figure 2 The edge bending area BB and the lower frame area CC are both used as non-display parts.

[0123] The display driver chip 13 is arranged on the lower frame area CC, and other electronic devices 14, such as a touch chip (TPIC), capacitors, resistors, etc., are integrated on a circuit board 12 electrically connected to the main circuit board, such as a flexible printed circuit (FPC). The circuit board 12 is connected to the lower frame area CC to realize signal interconnection between the electronic devices 14 on the circuit board 12 and the display driver chip 13.

[0124] like Figure 3 As shown, the housing 100 of the foldable electronic device includes a middle frame 101 and a frame 102 (also referred to as a small A shell) disposed at the edge of the middle frame 101. The frame 102 is provided with a foam adhesive 20 in contact with the display surface of the display module 11. In order to prevent the display module 11 from shifting when being bent, there is a gap between the foam adhesive 20 and the display module 11. The existence of this gap becomes a path for liquid to enter, so that the foldable electronic device cannot completely isolate the liquid inlet path.

[0125] Figure 4 The diagram shows a connection relationship between the display screen 112 in the display module 11 and the circuit board 12 when the edge of the display screen 112 is not bent. Figure 5 The structure diagram shown is that the edge of the display screen 112 is bent and installed in the housing 100 .

[0126] In order to realize the electrical connection between the display driver chip 13 and the display screen 112, and to realize the electrical connection between the circuit board 12 and the display screen 112, the display driver chip 13 and the circuit board 12 are electrically connected to the display screen 112 through an electrical connection structure. In the process that can be realized, it is necessary to expose the connection lines arranged in the display screen 112, and then electrically connect them to the display driver chip 13 or the circuit board 12 through the electrical connection structure. In some processes, after the electrical connection structure is set, some connection lines will be exposed. The circuit board 12 is electrically connected to the display screen through the electrical connection structure.

[0127] In order to avoid Figure 3 The liquid entering the gap shown erodes the connection line, such as Figure 4 As shown, a glue dispensing process can be added to the connection part ① between the display driver chip 13 and the display screen 112, the connection parts ② and ③ between the display screen 112 and the circuit board 12, and the connection part ④ between the electronic device 14 and the circuit board 12 to prevent these parts from being corroded and failing.

[0128] Figure 6 Shown is a schematic diagram of another connection relationship between the display screen 112 and the circuit board 12 when the edge of the display screen 112 is not bent. Figure 7 The structure diagram shown is that the edge of the display screen 112 is bent and installed in the housing 100 .

[0129] like Figure 6 and Figure 7 , and the above Figure 4 and Figure 5 Similarly, the display driver chip 13 and the circuit board 12 are both arranged on the lower frame area CC. Figure 4 and Figure 5 The difference is that the binding position of the circuit board 12 is different. Figure 4 In the embodiment, part of the circuit board 12 is bound to the display screen 112, and the rest of the circuit board 12 is suspended on one side of the display screen 112. Figure 6 In the embodiment, part of the circuit board 12 is bound to the display screen 112 , and the rest of the circuit board 12 is not suspended in the air but is arranged on one side of the display screen 112 .

[0130] In order to avoid Figure 3 The liquid entering the gap shown in the figure may corrode the connection line or the electrical connection structure, such as Figure 6As shown, a glue dispensing process can be added at the connection part ① between the display driver chip 13 and the display screen 112, the connection part ⑥ between the display screen 112 and the circuit board 12, and the connection part ④ between the electronic device 14 and the circuit board 12 to prevent these parts from being corroded and failing.

[0131] However, in Figure 6 In the embodiment, the glue dispensing process cannot be performed at the connection portion ⑤ between the display screen 112 and the circuit board 12, and the connection portion ⑤ will become a corrosion failure point, affecting the electrical connection between the display screen 112 and the circuit board 12.

[0132] When the above-mentioned glue dispensing process is used for protection, glue is required to be dispensed at multiple points. Not only is the process complicated, but some points prone to failure cannot be dispensed, resulting in poor waterproof performance of the entire folding electronic device.

[0133] The embodiments of the present application provide some waterproof structures, which are not only simple in structure but also easy to implement in terms of process. See the following embodiments for details.

[0134] like Figure 8 , Figure 8 1 is a structural diagram of the connection relationship between a circuit board 12 and a display screen 112 provided in an embodiment of the present application. The display screen 112 includes a display area AA and a lower frame area CC, and an edge bending area BB connecting the display area AA and the lower frame area CC. The circuit board 12 is arranged on a side of the lower frame area CC away from the display surface of the display area AA.

[0135] The display screen 112 can be used to display information and provide an interactive interface for the user. In various embodiments of the present application, the display screen 112 can be, but is not limited to, an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MIL-E) display screen, a micro organic light-emitting diode (MIL-E) display screen, a micro organic light-emitting diode (MIL-E) display screen, a quantum dot light-emitting diode (QLED) display screen, etc.

[0136] like Figure 8, a side of the circuit board 12 connected to the lower frame area CC is provided with a guide groove, and / or, a side of the lower frame area CC connected to the circuit board 12 is provided with a guide groove. The side of the circuit board 12 connected to the lower frame area CC can be understood as follows Figure 8 The first side shown, the side of the lower frame area CC connected to the circuit board 12 can be understood as Figure 8 The second side.

[0137] In some achievable process structures, a bonding structure (or bonding structure) may be used to electrically connect the display screen and the circuit board, and the area where the binding structure is located may be considered as a bonding area.

[0138] Fig. 9 The structure diagram of the first surface of the circuit board 12 is shown. The first surface of the circuit board 12 has a binding area and a facing area opposite to the display screen 112. In the binding area, the circuit board 12 is arranged in the lower frame area CC through an electrical connection structure. In the facing area, a guide groove 401 is formed, and the guide groove 401 is connected to the edge of the first surface of the circuit board 12.

[0139] When liquid enters Figure 8 After the liquid is in the gap between the circuit board 12 and the display screen 112 as shown, the guide groove 401 can guide the liquid to the edge of the circuit board 12 and out of the gap, thereby preventing the liquid from entering the binding area and causing corrosion of the connecting lines or electrical connection structures in the binding area.

[0140] In some examples, such as Figure 8 The circuit board 12 is arranged on the binding area of ​​the display screen 112 through an electrical connection structure, and the electrical connection structure is close to the edge of the lower frame area CC of the display screen 112, in order to improve the flow guide speed. Fig. 9 The circuit board 12 has a first edge and a second edge opposite to each other, and a third edge and a fourth edge opposite to each other. The first edge is arranged at the end of the lower frame area CC away from the edge bending area BB through an electrical connection structure; the guide groove 401 on the circuit board 12 extends to the second edge, the third edge and the fourth edge. The liquid can be guided out of the gap from multiple directions to improve the guide speed.

[0141] Fig.10 1 is a structural diagram of the display screen 112 in a flattened state according to an embodiment of the present application. In order to prevent liquid from entering the binding area between the circuit board 12 and the display screen 112 and corroding the connecting line or the electrical connection structure, Fig.10 A guide groove 402 is provided on the surface (which may be referred to as the second surface) of the display screen 112 opposite to the circuit board 12 . The end of the guide groove 402 is connected to the edge of the display screen 112 .

[0142] Combination Fig. 9When liquid enters Figure 8 After the liquid is in the gap between the circuit board 12 and the display screen 112 as shown, the guide groove 402 can also guide the liquid to the edge of the display screen 112 and out of the gap to prevent the liquid from entering the binding area and causing corrosion of the connecting lines or electrical connection structures in the binding area.

[0143] In some examples, the guide groove 401 can be provided on the surface of the circuit board 12 opposite to the display screen 112, or Figure 8 A guide groove 402 is provided on the second surface of the display screen 112 opposite to the circuit board 12. In order to achieve a better guide effect, the guide groove 401 and the guide groove 402 can be staggered.

[0144] In some feasible structures, the depth of the guide groove may be between 0.02 mm and 0.2 mm.

[0145] In some other achievable structures, the radial dimension of the guide groove can be less than or equal to 1 mm. The formed guide groove is a capillary structure, which can effectively drain the liquid. In some examples, the radial dimension of the guide groove can be understood as the dimension in a direction perpendicular to the extension direction of the guide groove.

[0146] In the feasible process, such as Fig. 9 , the guide groove 401 can be formed by etching on the surface of the circuit board 12 that is in contact with the display screen 112. The process is simple and easy to implement.

[0147] In order to further improve the waterproof effect, Fig.11 , a glue layer 50 may be provided at a position near the binding area of ​​the circuit board 12, for example, the glue layer 50 may be made by a pasting process, such as Fig.12 , the circuit board 12 with the adhesive layer 50 attached thereto is bound to the display screen 112 .

[0148] Fig.12 The exemplary adhesive layer 50 can play an adsorption role, for example, when Fig.12 When liquid remains in the gap, the adhesive layer 50 can absorb the liquid to prevent excessive liquid from entering the binding area to corrode the connection line or the electrical connection structure.

[0149] Fig.13 and Fig.14 The embodiment of the present application provides another waterproof structure. A glue layer 50 is provided on the surface of the circuit board 12 opposite to the display screen 112, for example, the glue layer 50 is made by a pasting process. Fig.14 , the circuit board 12 with the adhesive layer 50 attached thereto is bound to the binding area on the display screen 112 .

[0150] The adhesive layer 50 is used to fill the gap between the circuit board 12 and the display screen 112 to prevent liquid from entering the binding area.

[0151] Fig.15 Another waterproof structure provided in the embodiment of the present application is provided. An opening 60 is provided at a position close to the binding area of ​​the circuit board 12. The opening 60 is provided along the thickness direction of the circuit board 12. Fig.16 The through circuit board 12 shown, Fig.16 It is along Fig.15 The structure diagram after the AA section is shown. Along the thickness direction of the circuit board 12, the circuit board 12 has an A1 surface and an A2 surface opposite to each other, and the opening 60 passes through the A1 surface and the A2 surface.

[0152] In a feasible process, when opening 60 on circuit board 12 , it is necessary to avoid connecting lines in circuit board 12 .

[0153] Will Fig.15 and Fig.16 After the circuit board 12 is bound to the display screen 112, the lower frame area has a surface that fits the circuit board 12, and there is a gap between this surface and the circuit board 12, such as Fig.17 , a glue injection process can be used to inject adhesive into the opening 60, and the adhesive flows from the opening 60 into the gap between the circuit board 12 and the display screen 112 to fill the gap, thereby forming Fig.17 Waterproof structure shown.

[0154] In this embodiment, the circuit board 12 is provided with an opening 60, which is filled with a glue layer 70, and a glue layer 70 is provided in the gap between the circuit board 12 and the display screen 112. The glue layer 70 prevents liquid from flowing into the binding area to corrode the connection line or the electrical connection structure.

[0155] In some possible structures, such as Fig.15 There are a plurality of openings 60, and these plurality of openings 60 can be arranged at intervals. For example, they can be arranged at intervals along a direction parallel to the bending line of the edge bending area BB.

[0156] The embodiment of the present application does not limit the number of the openings 60 . For example, there may be at least two or even more openings.

[0157] In some examples, such as Fig.18 The display module 11 may further include a support plate (bracket) 111 and a cover plate 110 .

[0158] The support plate 111 and the cover plate 110 are arranged on opposite sides of the display screen 112. The support plate 111 is located on the back side of the display screen 112 and serves as a supporting structure for supporting the display screen 112. The cover plate 110 is located on the display surface side of the display screen 112 and is used to protect the display screen 112 and reduce the probability of the display screen 112 being damaged.

[0159] In other examples, such as Fig.18 The display module 11 may further include a polarizing plate 120 , and the polarizing plate 120 is disposed between the cover plate 110 and the display screen 112 .

[0160] In order to prevent liquid from entering the device from the gap between the filling layer 21 (such as foam glue) and the cover plate 110, Fig.18 A new type of cover plate 110 structure is provided. Fig.18 and Fig.19 The edge of the cover plate 110 (at a position opposite to the filling layer 21 ) has a texture structure 30 .

[0161] The embodiment of the present application uses a texture structure 30 to destroy the capillary effect of the gap between the filling layer 21 and the cover plate 110 to prevent liquid from entering. When liquid flows from the outside to the texture structure 30, the texture structure 30 can effectively destroy the driving force for the liquid to continue to enter the device, making it difficult for the liquid to enter the device, thereby preventing corrosion of the components in the device.

[0162] In some examples, the depth of the texture structure 30 is 0.1 μm to 10 μm, for example, 0.5 μm, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc.

[0163] The texture structure 30 has various shapes. Fig.19 The diamond-shaped texture structure 30 is shown. Fig. 20 A rectangular texture structure 30 is shown. Fig.21 The oval-shaped texture structure 30 is shown. Fig. 22 The circular texture structure 30 is shown. Fig.23 A triangular texture structure 30 is shown, and Fig.24 A hexagonal texture structure 30 is shown. Figures 19 to 24 Only some examples are shown, and the texture structure 30 may also be in other shapes.

[0164] In some structures, the cover plate 110 has a groove at a position opposite to the filling layer 21, and the groove forms a texture structure 30. In other structures, the cover plate 110 has a protruding plate at a position opposite to the filling layer 21, and the protruding plate forms a texture structure 30.

[0165] In a feasible process, the texture structure 30 can be manufactured by laser etching, chemical etching or printing and coating.

[0166] For example, the cover plate 110 may include a display cover plate and a protective layer. The display cover plate is disposed on one side of the display surface of the display screen 112, and the protective layer is disposed on the side of the display cover plate away from the display screen 112. The display cover plate and the protective layer are both light-transmissive. The light transmitted from the display surface of the display screen 112 can pass through the display cover plate and the protective layer and be received by the user.

[0167] In some usage scenarios, when the protective layer is damaged or peeled off, the display cover can still be used to protect the display screen 112.

[0168] In some structures, the edge of the display cover plate is opposite to the filling layer 21 , and the texture structure can be arranged at a position of the display cover plate opposite to the filling layer 21 .

[0169] The texture structure 30 provided on the edge of the cover plate 110 can be combined with the guide groove provided on the circuit board 12 or the guide groove provided on the display screen 112. In the display module, not only the texture structure 30 but also the guide groove can further optimize the waterproof performance.

[0170] The texture structure 30 disposed on the edge of the cover plate 110 can be combined with the opening structure penetrating the circuit board 12. In the display module, there are not only the texture structure 30 but also the opening, which can further optimize the waterproof performance.

[0171] In a foldable electronic device, in order to effectively protect the reliability of the display module in the bending area, in some examples, a T-block can be set at the end of the hinge mechanism. The T-block can effectively protect the reliability of the display module and reduce the probability of edge failure.

[0172] The T-block will increase the number of steps during assembly and can easily hit the side wall of the display module, bringing about a certain risk of assembly failure. In some structures, the T-block will protrude from the housing, and the protruding part will give users a bad experience of resting their hands during use.

[0173] The present application exemplifies some electronic devices, which can simplify the assembly process and reduce the risk of damage to the display module during the assembly process.

[0174] like Fig.25 and Fig.26 , Fig.25 is an assembly structure diagram of the rotating shaft mechanism, shielding strip, shielding block and frame given in the embodiment of the present application, Fig.26 yes Fig.25 Exploded diagram.

[0175] In some examples, the foldable electronic device includes a first shell and a second shell, each shell includes a middle frame and a frame arranged outside the middle frame, for example, Fig.25 FIG. 1 shows a first frame 102A of the first shell and a second frame 102B of the second shell. Fig.25 and Fig.26 In the figure, the first middle frame of the first shell and the second middle frame of the second shell are not shown.

[0176] In some examples, a concave cavity is provided at a position near the rotating shaft mechanism in the first middle frame of the first shell and at a position near the rotating shaft mechanism in the second middle frame of the second shell. The two grooves form an accommodating cavity, and the rotating shaft mechanism is arranged in the accommodating cavity.

[0177] In other examples, a decorative cover is provided at the bottom of the main shaft (the side away from the display module); when the display module is in a flattened state, the hinge mechanism and the decorative cover are arranged in the accommodating cavity; when the display module is in a closed state, the decorative cover is exposed to decorate or protect the hinge mechanism.

[0178] The hinge mechanism includes a main shaft 204, a first door panel 202, and a second door panel 203; one side of the first door panel 202 and the second door panel 203 is used to set the display module, and the other side is provided with the main shaft 204. The first door panel 202 and the second door panel 203 can move toward or away from the main shaft 201 to achieve flattening and closing of the display module. In some examples, the main shaft 204 can be set in the accommodating cavity surrounded by the first middle frame and the second middle frame described above.

[0179] In other examples, such as Fig.25 The hinge mechanism further includes a middle door panel 201, a first door panel 202 and a second door panel 203 are arranged on opposite sides of the middle door panel 201, and the first door panel 202, the middle door panel 201 and the second door panel 203 support the display module.

[0180] The end of the spindle 204 needs to be assembled with the first shell and the second shell. A receiving groove is provided at a position of the first middle frame of the first shell near the end of the spindle, and a position of the second middle frame of the second shell near the end of the spindle, respectively. The end of the spindle is provided in the receiving groove. In some examples, the receiving groove and the above-mentioned receiving cavity can be a connected cavity structure.

[0181] like Fig. 27 , Fig. 27 2 is a partial structural diagram of the main shaft provided in the embodiment of the present application, showing the end structure of the main shaft. A shielding block 204A bent toward the display module is provided at the end of the main shaft 204 .

[0182] In some examples, Fig. 27The shielding block 204A and the main shaft 204 are an integrally formed structure.

[0183] When the display module is in a flattened state, the shielding block 204A is arranged in the receiving groove; when the display module is in a closed state, the shielding block 204 is exposed from the first shell and the second shell, and the shielding block 204A has a retaining wall function to protect the hinge mechanism or serve as a decoration.

[0184] See also Fig.28 A first gap is formed between the surface of the first door panel 202 that is in contact with the display module and the first frame 102A, and a second gap is formed between the surface of the second door panel 203 that is in contact with the display module and the second frame 102B.

[0185] like Fig.26 The electronic device further includes a shielding bar 205, which is disposed above the shielding block 204A and covers the shielding block 204A. In an example, the shielding bar 205 is in contact with the shielding block 204A.

[0186] In some examples, such as Fig. 27 The top surface M of the shielding block 204A is a smooth surface, and the shielding strip 205 can be attached to the top surface M of the shielding block 204A.

[0187] One end of the shielding strip 205 is arranged in the first gap between the first frame 102A and the first door panel 202, and the other end is arranged in the second gap between the second frame 102B and the second door panel 203. The part between the two ends is arranged above the shielding block 204A, for example, it can be attached to the shielding block 204A.

[0188] In the electronic device provided in the present application, a shielding block 204A which is integral with the main shaft 201 is provided at the end of the main shaft 201, and the shielding strip 205 is attached to the shielding block 204A. When the display module is in a closed state, the shielding block 204A is exposed to protect the hinge mechanism.

[0189] When assembling the electronic device of the example of the present application, the rotating shaft mechanism including the main shaft 204, the first door panel 202, the second door panel 203 and the middle door panel 201 is installed between the first middle frame of the first housing and the second middle frame of the second housing, and the end of the main shaft 204 is set in the receiving groove; and then the shielding strip 205 is installed. Since the shielding block 204A with the function of a retaining wall is an integral structure with the main shaft 204, the assembly process is simplified and the risk of damage to the display module during the assembly process is reduced.

[0190] In some embodiments, the shielding strip 205 and the first frame 102A are integrally formed, or the shielding strip 205 and the second frame 102B are integrally formed. For example, the shielding strip and the frame can be manufactured by an insert molding process, such as a two-color injection molding process.

[0191] When the shielding strip 205 and the first frame 102A are an integrally formed structure, the assembly process can be further simplified. For example, the shielding strip 205 can be assembled when the frame is installed.

[0192] In some examples given in this application, the top surface of the shielding strip 205 away from the shielding block 204A is substantially flush with the top surface of the first frame 102A and the top surface of the second frame 102B, so as to avoid the user having a bad experience of resting his hands during use.

[0193] In some other examples, when the shaft mechanism includes the middle door panel 201, as Fig.29 The end of the middle door panel 201 is provided with a protruding block 201A protruding toward the display module, and the shielding strip 205 can be attached to the protruding block 201A, or, in some embodiments, the shielding strip 205 is attached to the shielding block 204A and the protruding block 201A.

[0194] In order to further improve product performance in the foldable electronic device described above, it is also necessary to improve the impact resistance and external force damage resistance of the non-bending area of ​​the display module and improve the bendability of the bending area.

[0195] The present application provides some display module embodiments, which can not only improve the rigidity of the exposed non-bending area, but also will not weaken the bendability of the bending area.

[0196] Fig.30 This is a structural diagram of a display module provided in an embodiment of the present application. The display screen 112 in the display module 11 includes: a first non-bending portion, a second non-bending portion, a third non-bending portion, a first bending portion, and a second bending portion; the first bending portion connects the first non-bending portion and the second non-bending portion, and the second bending portion connects the second non-bending portion and the third non-bending portion.

[0197] The cover plate 110 in the display module 11 includes a first non-bending area, a second non-bending area and a third non-bending area, a first bending area connecting the first non-bending area and the second non-bending area, and a second bending area connecting the second non-bending area and the third non-bending area.

[0198] The first non-bending portion of the display screen 112 corresponds to the first non-bending area of ​​the cover plate 110, the first bending portion of the display screen 112 corresponds to the first bending area of ​​the cover plate 110, the second non-bending portion of the display screen 112 corresponds to the second non-bending area of ​​the cover plate 110, the second bending portion of the display screen 112 corresponds to the second bending area of ​​the cover plate 110, and the third non-bending portion of the display screen 112 corresponds to the third non-bending area of ​​the cover plate 110.

[0199] The first bending region, the first bending portion, the second bending region and the second bending portion can all be bent along a bending line to switch between a flattened state and a closed state.

[0200] Fig.30 Take the three-screen folding as an example. In other examples, you can Fig.30 Based on the structure shown, more bending areas and non-bending areas are added to form electronic devices such as four-screen folding and five-screen folding.

[0201] like Fig.30 The thickness of the first non-bending area of ​​the cover plate 110 is d1, and the thickness of the second non-bending area is d2. The thickness d1 is not equal to the thickness d2. For example, the thickness d1 may be greater than the thickness d2.

[0202] Fig.31 is a structural diagram of another display module provided in an embodiment of the present application. Fig.30 Similarly, the thickness of the first non-bending area of ​​the cover plate 110 is d1, and the thickness of the second non-bending area is d2. The thickness d1 is not equal to the thickness d2, and the thickness d1 is greater than the thickness d2.

[0203] Fig.32 is a structural diagram of another display module provided in an embodiment of the present application. Fig.30 and Fig.31 Similarly, in the cover plate 110 , the thickness d1 of the first non-bending area is not equal to the thickness d2 of the second non-bending area, and the thickness d1 is greater than the thickness d2 .

[0204] The thickness dimension involved in the embodiment of the present application refers to: Fig.30 The dimension along the stacking direction (P direction) of multiple film layers.

[0205] Fig.30 , Fig.31 and Fig.32 In the three different examples of the display module 11 shown, the thickness d4 of the first bending area of ​​the cover plate 110 is not constant, but decreases along the direction away from the first non-bending area. It can also be understood that the thickness d4 gradually decreases from the first non-bending area to the second non-bending area, so that the thickness d2 is smaller than the thickness d1.

[0206] like Figure 30 to Figure 32 In the cover plate 110, the first non-bending area is a thick area, the second non-bending area is a thin area, and the first bending area connected between the first non-bending area and the second non-bending area is a thin-to-thick transition area.

[0207] Fig.30 , Fig.31 and Fig.32 The three different examples of the display module 11 shown have the following differences:

[0208] Fig.30 In the cover plate 110, the thickness of the second bending area is d5, the thickness of the third non-bending area is d3, and the thickness d2, the thickness d5 and the thickness d3 are equal. The first non-bending area is a thick area, the first bending area is a thick-thin transition area, and the second non-bending area, the second bending area and the third non-bending area are thin areas with equal thickness.

[0209] and the above Fig.30 compared to, Fig.31 In the example shown, not only the thickness d4 of the first bending area is not a constant value, but also the thickness d2 of the second non-bending area is not a constant value. In some examples, the thickness of the first bending area and the second non-bending area of ​​the cover plate 110 gradually decreases in the direction away from the first non-bending area, which can cover up the visual effect of the uneven thickness of the entire display module.

[0210] exist Fig.31 In the embodiment, the thickness of the second bending area and the third non-bending area of ​​the cover plate 110 are equal, that is, the thickness d5 is equal to the thickness d3.

[0211] exist Fig.31 In the embodiment, the first non-bending region is a thick region, the first bending region and the second non-bending region are thick-thin transition regions, and the second bending region and the third non-bending region are thin regions with equal thickness.

[0212] and the above Fig.30 and Fig.31 In comparison, Fig.32 In the embodiment, not only the thickness of the first bending area and the second non-bending area of ​​the cover plate 110 is not constant, but also the thickness of the second bending area and the third non-bending area of ​​the cover plate 110 is not constant. Along the direction away from the first non-bending area, the thickness of the first bending area, the second non-bending area, the second bending area and the third non-bending area of ​​the cover plate 110 gradually decreases. This can further cover up the visual effect of the uneven thickness of the entire display module.

[0213] Fig.33 Yes Fig.30The structural diagram of the display module 11 after bending given in the embodiment of the present application. The thickness of the first non-bending area that is exposed (visible to the user when folded) is greater than the thickness of the second non-bending area that is not exposed (invisible to the user when folded). The first bending area connected to the exposed first non-bending area is designed to be an unequal thickness structure. Even if the thickness of the first non-bending area is increased in order to improve the rigidity and strength of the first non-bending area, the bendability of the bending area will not be affected. The thickness of other areas will not be increased, and when the whole machine is in a folded state, the thickness of the folded state will not be significantly increased.

[0214] In some examples, the above Figure 30 to Figure 32 The bending area of ​​the example may form an inner bending area, or may form an outer bending area. Fig.33 In the folded state shown, the first bending area forms an outer bending area, and the second bending area forms an inner bending area. The first non-bending area is exposed and visible to the user, and the second non-bending area and the third non-bending area are opposite and invisible to the user.

[0215] like Fig.34 , Fig.34 This is a structural diagram of a display module provided in an embodiment of the present application. The thickness of the display cover plate 113 located in the first non-bending area is greater than the thickness located in the second non-bending area, and the thickness of the display cover plate 113 located in the first bending area gradually decreases in the direction away from the first non-bending area.

[0216] exist Fig.34 In the embodiment, the thickness of the protection layer 114 in each bending region and each non-bending region is equal.

[0217] Fig.35 This is another structural diagram of a display module provided in an embodiment of the present application. In this structure, the thickness of the protective layer 114 located in the first non-bending area is greater than the thickness located in the second non-bending area, and the thickness of the protective layer 114 located in the first bending area gradually decreases in the direction away from the first non-bending area.

[0218] exist Fig.35 In the figure, the thickness of the cover plate 113 in each bending area and each non-bending area is equal.

[0219] Fig.36 is a structural diagram of another display module provided in an embodiment of the present application. Fig.35 In comparison, in this structure, along the direction away from the first non-bending area, the thickness of the first bending area and the thickness of the second non-bending area in the protective layer 114 gradually decrease, thereby widening the width of the thin-to-thick transition zone of the protective layer 114.

[0220] Fig.37is a structural diagram of another display module provided in an embodiment of the present application. Fig.35 and Fig.36 In contrast, in this example, in the protective layer 114, the thickness of the first bending region, the thickness of the second non-bending region, the thickness of the second bending region, and the thickness of the third non-bending region gradually decrease in the direction away from the first non-bending region, further widening the width of the thin-thick transition zone of the protective layer 114.

[0221] Above Figure 35 to Figure 37 In the embodiment, the protective layer 114 is designed as a structure with uneven thickness. In other examples, the uneven thickness transition zone can be set in other film layer structures, for example, in the display cover plate 113, Figure 35 to Figure 37 The structure shown.

[0222] In some examples provided in this application, Fig.38 , the display cover 113 or the protective layer 114 may include: a substrate 11D and a buffer layer 11B.

[0223] The substrate 11D and the buffer layer 11B may be connected via an adhesive layer 11C, and the adhesive layer 11A connects the stacked film layer structures to other layer structures. Fig.33 When the protective layer 114 is shown, the structure including the substrate 11D, the adhesive layer 11C and the buffer layer 11B can be connected to the display cover 113 by using the adhesive layer 11A.

[0224] Among some selectable materials, the substrate 11D may be selected from at least one of polyethylene terephthalate (PET), polyimide (PI), and transparent polyimide (CPI).

[0225] In some examples, the buffer layer 11B is an elastomeric film material, and the elastic modulus of the buffer layer 11B is smaller than the elastic modulus of the substrate 11D. The buffer layer 11B can be made of at least one of elastomeric film materials such as thermoplastic polyurethane elastomer TPU and thermoplastic polyamide elastomer TPAE.

[0226] The adhesive layer 11A and the adhesive layer 11C may be made of at least one of an optically clear adhesive (OCA), an optically clear resin (OCR), an acrylic resin, an epoxy resin, and the like.

[0227] See also Fig.38In this embodiment, the buffer layer 11B located in the first bending region is designed as a structure of unequal thickness. Along the direction away from the first non-bending region, the thickness of the buffer layer 11B located in the first bending region gradually decreases, so that the protective layer 114 or the display cover plate 113 located in the first bending region is a thick-thin transition zone.

[0228] exist Fig.38 In the embodiment, the thickness of the substrate 11D may be 25 μm to 75 μm, and the thickness of the adhesive layer 11A and the adhesive layer 11C may be 25 μm to 50 μm.

[0229] The thickness of the buffer layer 11B located in the first non-bending region is 75 μm to 150 μm, and the thickness of the buffer layer 11B located in the second non-bending region, the second bending region and the third non-bending region is 25 μm to 75 μm.

[0230] Fig.39 This is another structural diagram of a display cover plate 113 or a protective layer 114 provided in an embodiment of the present application. In this example, the substrate 11D located in the first bending region is designed to have a structure of unequal thickness. Along the direction away from the first non-bending region, the thickness of the substrate 11D located in the first bending region gradually decreases, so that the protective layer 114 or the display cover plate 113 located in the first bending region is a thick-thin transition zone.

[0231] Fig.40 1 is another structural diagram of a display cover plate 113 or a protective layer 114 provided in an embodiment of the present application. Fig.39 In comparison, not only the buffer layer 11B located in the first bending area is designed as a structure with unequal thickness, but also the buffer layer 11B located in the second non-bending area is designed as a structure with unequal thickness, so as to weaken the visual effect of uneven thickness of the entire display module.

[0232] Fig.41 1 is a structural diagram of another display cover plate 113 or protective layer 114 provided in an embodiment of the present application. In some examples, the thickness of the buffer layer 11B is relatively large, for example, the thickness reaches 100 μm. Due to the thick buffer layer, the strain generated on the upper and lower surfaces of the film material when the display module is bent is easy to enter the plastic deformation stage.

[0233] When the display module is bent, in order to weaken the strain generated on the upper and lower surfaces of the display module, the plastic deformation stage is entered to improve the bendability. In some examples, such as Fig.41The buffer layer 11B includes a first buffer layer 11B1 and a second buffer layer 11B2. The first buffer layer 11B is of equal thickness, and the second buffer layer 11B2 located in the first bending region is designed to be of unequal thickness. The second buffer layer 11B2 of uneven thickness is farther away from the display screen than the first buffer layer 11B1 of uniform thickness, that is, closer to the interface visible to the user; in other examples, the first buffer layer 11B1 of uniform thickness can also be closer to the interface visible to the user than the second buffer layer 11B2 of uneven thickness.

[0234] See also Fig.41 The first buffer layer 11B1 is connected to the second buffer layer 11B2 via an adhesive layer 11E, and the second buffer layer 11B2 is connected to the substrate 11D via an adhesive layer 11C.

[0235] Fig.42 This is another structural diagram of a display cover plate 113 or a protective layer 114 provided in an embodiment of the present application. In some optional processes, a coating process can be used to bond the buffer layer 11B to the substrate 11D. The adhesive layer used to connect the buffer layer 11B and the substrate 11D can be removed to reduce the thickness of the entire display module without weakening the rigidity of the non-bending area and the bendability of the bending area.

[0236] Fig.42 The material of the buffer layer 11B in the example can be selected from at least one of thermoplastic polyurethane elastomer, silicone gel, and shear thickening material.

[0237] See also Fig.42 In this example, the buffer layer 11B located in the first bending region is designed to have an unequal thickness structure, and the thickness of each region of the substrate 11D is equal.

[0238] Fig.43 This is another structural diagram of a display cover plate 113 or a protective layer 114 provided in an embodiment of the present application. In some optional processes, a coating process can also be used to bond the buffer layer 11B to the substrate 11D. The buffer layer 11B in this example can be made of a sticky material, such as an optically transparent adhesive OCA. The buffer layer 11B is not only an elastic film material, but also has a connecting function, so the adhesive layer 11A may not be required. The thickness of the display module can be further compressed.

[0239] See also Fig.43 In this example, the buffer layer 11B located in the first bending region is designed to have an unequal thickness structure, and the thickness of each region of the substrate 11D is equal.

[0240] In order to improve the rigidity of the exposed non-bending area without weakening the bendability of the bending area, the present application also provides some structures that can be implemented, as follows:

[0241] Fig.44 1 is a structural diagram of a display module provided in an embodiment of the present application. In the cover plate 110 of the display module 11, the elastic modulus in the first non-bending area is greater than the elastic modulus in the first bending area. The cover plate 110 includes a hard area with a larger elastic modulus and a soft area with a smaller elastic modulus.

[0242] In some examples, when the cover plate 110 includes a display cover plate or a protective layer, the hard area and the soft area can be set in at least one of the display cover plate and the protective layer. Fig.45 1 is a structural diagram of a display cover plate 113 or a protective layer 114 provided in an embodiment of the present application, including a substrate 11D and a buffer layer 11B, wherein the substrate 11D and the buffer layer 11B are connected via an adhesive layer 11C.

[0243] like Fig.40 The buffer layer 11B includes a hard region 11B01 (also called the first part) and a soft region 11B02 (also called the second part), and the elastic modulus of the hard region 11B01 is greater than the elastic modulus of the soft region 11B02. The hard region 11B01 is located in the first non-bending region, and the soft region 11B02 can be located in at least one of the first bending region and the second bending region.

[0244] exist Fig.45 In the embodiment, the hard region 11B01 and the soft region 11B02 are connected together as an integral structure. In some optional process steps, the buffer layer material can be first coated on the substrate, and then cured by UV (ultraviolet light) in different regions to obtain buffer materials with different hardness; in other optional process steps, the buffer layer material can be heated in different regions to obtain parts with different elastic moduli to obtain hard regions and soft regions.

[0245] The buffer layer 11B is divided into a hard area 11B01 and a soft area 11B02 with different elastic moduli. The hard area 11B01 is located in the first non-bending area to improve the stiffness of the first non-bending area. The soft area 11B02 with a smaller elastic modulus is located in the bending area to ensure that the bending area has better bendability.

[0246] exist Fig.45 In the embodiment, the elastic modulus of the buffer layer 11B (which may be called the third part) located in the second non-bending area and the third non-bending area may be smaller than the elastic modulus of the hard area 11B01 and larger than the elastic modulus of the soft area 11B02.

[0247] In some examples, in order to improve the stiffness of the second non-bending region and the third non-bending region, the elastic modulus of the buffer layer 11B located in the second non-bending region and the third non-bending region may be equal to the elastic modulus of the hard region 11B01.

[0248] When the elastic modulus of the buffer layer 11B located in the second non-bending area and the third non-bending area is smaller than the elastic modulus of the hard area 11B01 and larger than the elastic modulus of the soft area 11B02, the buffer material can be first coated, at which time its modulus is lower, and then cross-linked by local UV curing or heating, and a lower modulus part and a higher modulus part can be obtained by controlling the UV energy or heating temperature.

[0249] Fig.46 It is a structural diagram of another display cover plate 113 or protective layer 114 provided in an embodiment of the present application, including a substrate 11D and a buffer layer 11B, wherein the substrate 11D and the buffer layer 11B are connected via an adhesive layer 11C.

[0250] In this example, the buffer layer 11B includes a hard part 11B11 with a larger elastic modulus and a soft part 11B12 with a smaller elastic modulus, which are spliced ​​together. The hard part 11B11 is located in the first non-bending area, and the soft part 11B12 is located in at least one of the first bending area and the second bending area.

[0251] In some examples, such as Fig.46 , the hard part 11B11 and the soft part 11B12 can be spliced ​​together by using the adhesive layer 11B13. For example, when the adhesive layer 11C located on one side of the buffer layer 11B is coated, the colloid can overflow into the gap between the hard part and the soft part, thereby bonding the hard part and the soft part together.

[0252] See also Fig.46 In order to improve the rigidity of the second non-bending region and the third non-bending region, the elastic modulus of the buffer layer 11B located in the second non-bending region and the third non-bending region may be equal to the elastic modulus of the hard part.

[0253] In some other examples, the elastic modulus of the buffer layer 11B located in the second non-bending region and the third non-bending region may be smaller than the elastic modulus of the hard portion and larger than the elastic modulus of the soft portion.

[0254] exist Fig.46In the example, the material that can be selected for the hard part 11B11 includes at least one of polyethylene terephthalate (PET), transparent polyimide (CPI), etc. The material that can be selected for the soft part 11B12 includes at least one of thermoplastic polyurethane elastomer TPU, thermoplastic polyamide elastomer TPAE, etc.

[0255] Fig.47 This is another structural diagram of a display cover plate 113 or a protective layer 114 provided in an embodiment of the present application. The buffer layer 11B includes a first buffer layer 11B1 and a second buffer layer 11B2. The first buffer layer 11B1 includes a hard region 11B01 with a larger elastic modulus and a soft region 11B02 with a smaller elastic modulus. In the second buffer layer 11B2, the thickness of the portion located in the first bending region is designed to be an unequal thickness structure. This embodiment combines the unequal thickness design of the buffer layer with the unequal elastic modulus design.

[0256] When the display module is in a folded state and the first non-bending area is exposed, the first bending area connecting the first non-bending area and the second non-bending area needs to have sufficient resistance to external impact. For example, when the folded electronic device falls, the first bending area may be damaged by the impact of the hinge mechanism on one side and the ground.

[0257] The embodiments of the present application provide some novel display modules 11, such as Fig.48 A buffer pad 127 is provided on a side of the support plate 111 away from the display screen 112 , and the buffer pad 127 is provided at a position of the support plate 111 opposite to the first bending area.

[0258] In some examples, in order to improve the bendability of the support plate 111, a hollow structure 111a (which may be called a bamboo book) is provided in a portion opposite to the first bending area, and a buffer pad 127 is provided at a position opposite to the hollow structure 111a.

[0259] The buffer pad 127 may be a one-layer film structure, or a multi-layer film structure.

[0260] For example, the buffer pad 127 can be made of at least one of stainless steel SUS, thermoplastic polyurethane elastomer TPU elastomer, porous foam Foam material, PET film material and the like.

[0261] Fig.49 1 is a structural diagram of another display module provided in an embodiment of the present application. In this embodiment, the buffer pad 127 is disposed in the support plate 111. For example, a groove may be provided in the support plate 111, and the buffer pad 127 may be disposed in the groove, and the groove is located at a position opposite to the first bending area.

[0262] Fig.50 1 is a structural diagram of another display module provided in an embodiment of the present application. In this embodiment, the buffer pad 127 is arranged on the rotating shaft mechanism 200 located on one side of the display module.

[0263] like Figures 48 to 50 Since the buffer pad 127 is included, when the first bending area is impacted by external force, the buffering effect of the buffer pad 127 can reduce the degree of damage to the display module.

[0264] Fig.51 1 is a structural diagram of another display module provided in an embodiment of the present application. In this structure, not only is the display cover plate 113 located in the first bending area designed to be a structure of unequal thickness, but a buffer pad 127 is also provided on the side of the support plate 111 away from the display screen 112. This can not only improve the rigidity of the exposed non-bending part, but also will not weaken the bendability of the bending part, and can also reduce the degree of damage to the bending part of the display module, thereby improving the performance of the display module.

[0265] In some other examples, various regions of the protection layer 114 may be designed to have structures of unequal thickness.

[0266] like Fig.52 As shown, the cover plate (e.g., display cover plate, protective layer) located on the display surface side of the display screen 112 is designed as a structure with unequal elastic modulus. Also, the buffer pad 127 is arranged at a position of the support plate 111 opposite to the first bending area. This not only optimizes the bendability of the display module bending portion, but also improves the impact resistance and extrusion resistance of the bending portion.

[0267] The embodiment of the present application shows that the cover plate 110 is designed as a structure of unequal thickness or unequal modulus, which can be applied to the whole machine thinning solution involved in any of the above embodiments.

[0268] In some examples, any of the above waterproof structures can be used in a foldable electronic device, and the cover plate in the display module of the electronic device can adopt the above unequal thickness structure or unequal modulus structure. The foldable electronic device not only has good waterproof performance, but also can improve the rigidity of the non-bending area and the bending performance of the bending area, further optimize the performance of the electronic device, and improve the user experience.

[0269] In some other examples, any of the above structures without the T-block may be used in a foldable electronic device. The cover plate in the display module of the electronic device may adopt the above unequal thickness structure or unequal modulus structure.

[0270] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0271] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: A display module, wherein the display module comprises a display screen, wherein the display screen comprises a display area, an edge bending area located at an edge of the display area, and a lower frame area connected to the edge bending area, wherein the lower frame area is located at a side of the display area away from a display surface; A circuit board, the circuit board being connected to a side of the lower frame area away from the display area; A guide groove is provided on one side of the circuit board connected to the lower frame area, and / or a guide groove is provided on one side of the lower frame area connected to the circuit board.

2. The electronic device according to claim 1, characterized in that: The circuit board has a first edge and a second edge opposite to each other, and a third edge and a fourth edge opposite to each other, wherein the first edge is connected to an end of the lower frame region away from the edge bending region through an electrical connection structure; The guide groove is provided on one side of the circuit board connected to the lower frame area, and the guide groove extends to the second edge, the third edge and the fourth edge.

3. The electronic device according to claim 2, characterized in that: An adhesive layer is arranged between the circuit board and the bonding surface of the lower frame area, and the adhesive layer is arranged at the edge of the electrical connection structure.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The electronic device further comprises: A housing, wherein the housing comprises a frame arranged at the edge of the display module, and a filling layer is arranged at a position where the frame is in contact with a display surface of the display module; A texture structure is arranged at a position of the display module opposite to the filling layer.

5. The electronic device according to claim 4, characterized in that: The display module also includes: A cover plate, the cover plate being arranged on one side of the display surface of the display screen; The texture structure includes a texture groove, and the texture groove is arranged at a position of the cover plate opposite to the filling layer.

6. The electronic device according to claim 5, characterized in that: The cover plate includes a first non-bending area, a second non-bending area, a third non-bending area, a first bending area, and a second bending area, wherein the first bending area connects the first non-bending area and the second non-bending area, and the second bending area connects the second non-bending area and the third non-bending area, and both the first bending area and the second bending area can be bent along a bending line to switch between an expanded state and a closed state; The thickness of the first non-bending region is not equal to the thickness of the second non-bending region.

7. The electronic device according to claim 6, characterized in that: The cover plate comprises: A substrate and a first buffer layer, wherein the first buffer layer is closer to the display screen than the substrate; The thickness of the substrate in the first non-bending area is greater than the thickness of the substrate in the second non-bending area, and / or; The thickness of the first buffer layer located in the first non-bending area is greater than the thickness of the first buffer layer located in the second non-bending area.

8. The electronic device according to claim 7, characterized in that: From the first non-bending area to the second non-bending area, the thickness of the first buffer layer located in the first bending area gradually decreases.

9. The electronic device according to claim 7 or 8, characterized in that: The cover plate comprises: a second buffer layer, the second buffer layer comprising a first portion and a second portion; The first portion of the second buffer layer is located in the first non-bending region, the second portion of the second buffer layer is located in the first bending region, and the elastic modulus of the first portion of the second buffer layer is greater than the elastic modulus of the second portion of the second buffer layer.

10. An electronic device, characterized in that: include: A display module, wherein the display module comprises a display screen, wherein the display screen comprises a display area, an edge bending area located at an edge of the display area, and a lower frame area connected to the edge bending area, wherein the lower frame area is located at a side of the display area away from a display surface; A circuit board, the circuit board being connected to a side of the lower frame area away from the display area; The circuit board is provided with at least one opening, and along the thickness direction of the circuit board, the at least one opening passes through the circuit board; An adhesive layer is arranged in the at least one opening, and an adhesive layer is arranged between the circuit board and the bonding surface of the lower frame area.

11. The electronic device according to claim 10, characterized in that: The circuit board is arranged at an end of the lower frame region away from the edge bending region through an electrical connection structure; The at least one opening is disposed adjacent to the electrical connection structure.

12. The electronic device according to claim 10 or 11, characterized in that: There are a plurality of openings, and the plurality of openings are arranged at intervals along a direction parallel to the bending line of the edge bending area.

13. The electronic device according to any one of claims 10 to 12, characterized in that: The electronic device further comprises: A housing, wherein the housing comprises a frame arranged at the edge of the display module, and a filling layer is arranged at a position where the frame is in contact with a display surface of the display module; A texture structure is arranged at a position of the display module opposite to the filling layer.

14. The electronic device according to claim 13, characterized in that: The display module also includes: A cover plate, the cover plate being arranged on a display surface side of the display screen; The texture structure includes a texture groove, and the texture groove is arranged at a position of the cover plate opposite to the filling layer.

15. The electronic device according to claim 14, characterized in that: The cover plate includes a first non-bending area, a second non-bending area, a third non-bending area, a first bending area, and a second bending area, wherein the first bending area connects the first non-bending area and the second non-bending area, and the second bending area connects the second non-bending area and the third non-bending area, and both the first bending area and the second bending area can be bent along a bending line to switch between an expanded state and a closed state; The thickness of the first non-bending region is not equal to the thickness of the second non-bending region.

16. The electronic device according to claim 15, characterized in that: The cover plate comprises: A substrate and a first buffer layer, wherein the first buffer layer is closer to the display screen than the substrate; The thickness of the substrate in the first non-bending area is greater than the thickness of the substrate in the second non-bending area, and / or; The thickness of the first buffer layer located in the first non-bending area is greater than the thickness of the first buffer layer located in the second non-bending area.

17. The electronic device according to claim 16, characterized in that: From the first non-bending area to the second non-bending area, the thickness of the first buffer layer located in the first bending area gradually decreases.

18. The electronic device according to claim 16 or 17, characterized in that: The cover plate comprises: a second buffer layer, the second buffer layer comprising a first portion and a second portion; The first portion of the second buffer layer is located in the first non-bending region, the second portion of the second buffer layer is located in the first bending region, and the elastic modulus of the first portion of the second buffer layer is greater than the elastic modulus of the second portion of the second buffer layer.

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