Light-emitting panel, wiring board, and display device

By designing a light-emitting board and circuit board structure with backup electrical contact pairs and optimized electrode routing, the problem of improving contrast and brightness of Mini LED in backlights and LCD panels was solved, achieving efficient Mini LED display effects and large-size applications.

CN119230537BActive Publication Date: 2026-04-21BOE TECHNOLOGY GROUP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BOE TECHNOLOGY GROUP CO LTD
Filing Date
2020-01-21
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

In existing technologies, Mini LEDs have limited effectiveness in improving contrast and brightness when used in backlights and LCD panels, and their market prospects are limited in large-size display products.

Method used

Design a light-emitting board and circuit board structure, employing multiple light-emitting units and connecting circuit units, and setting up spare electrical contact point pairs to achieve flexible connection and repair of light-emitting diode chips, and reduce power consumption by optimizing electrode routing layout.

Benefits of technology

It improves the contrast and brightness of display devices, reduces the power consumption of electrode traces, enhances the reliability and display uniformity of LED chips, and expands the market application of Mini LED in large-size display products.

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Abstract

A light-emitting panel, a circuit board and a display device. The light-emitting panel comprises a substrate, a light-emitting unit on the substrate and a plurality of first electrode traces. The light-emitting unit comprises a light-emitting subunit, and the light-emitting subunit comprises a connecting circuit unit and one light-emitting diode chip connected with the connecting circuit unit. The connecting circuit unit comprises at least two pairs of electrical contact points, each pair of electrical contact points comprising a first electrode contact point and a second electrode contact point, and only one pair of electrical contact points in each connecting circuit unit is connected with the light-emitting diode chip; at least two of the first electrode contact points electrically connected with each other are arranged adjacent to each other, and at least two first electrode contact points are arranged between at least two of the second electrode contact points electrically connected with each other. The light-emitting panel can not only improve the binding yield of the product by providing a backup pair of electrical contact points, but also reduce the power consumption of the negative electrode traces.
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Description

[0001] This application is a divisional application of Chinese Patent Application No. 202080000063.0 entitled "Light Emitting Panel, Circuit Board and Display Device", which entered the Chinese national phase on January 22, 2020. Chinese Patent Application No. 202080000063.0 is a patent application that entered the Chinese national phase on January 21, 2020, under PCT application No. PCT / CN2020 / 073558. Technical Field

[0002] At least one embodiment of this disclosure relates to a light-emitting board, a circuit board, and a display device. Background Technology

[0003] Currently, with the continuous advancement of display technology, users' demands for product performance, such as brightness and contrast, are constantly increasing. On one hand, Mini LEDs can be used as backlights. When Mini LEDs are combined with traditional LCD panels as backlights, by controlling the switching of Mini LEDs within the designated zones, the LCD device can achieve a contrast ratio comparable to that of OLED displays. On the other hand, Mini LEDs can also be directly manufactured into large-size display products, showing great market potential. Summary of the Invention

[0004] This disclosure provides a light-emitting board, a circuit board, and a display device.

[0005] At least one embodiment of this disclosure provides a light-emitting plate, comprising: a substrate; a plurality of light-emitting units arranged in an array on the substrate along a first direction and a second direction, each light-emitting unit including at least one light-emitting sub-unit, the light-emitting sub-unit including a connection line unit and a light-emitting diode chip connected to the connection line unit, the light-emitting diode chip being located on the side of the connection line unit away from the substrate; and a plurality of first electrode traces extending along the first direction. Each of the connection line units includes at least two electrical contact point pairs, each electrical contact point pair including a first electrode contact point and a second electrode contact point. In at least one of the connection line units, each first electrode contact point is electrically connected to each other, and each second electrode contact point is electrically connected to each other. The plurality of first electrode traces includes a plurality of first-type first electrode traces and a plurality of second-type first electrode traces. At least one of the light-emitting sub-units includes a plurality of first light-emitting sub-units and a plurality of second light-emitting sub-units. The first light-emitting sub-units are connected to the first-type first electrode traces through the first electrode contact points, and the second light-emitting sub-units are connected to the second-type first electrode traces through the first electrode contact points. At least two first electrode contacts of the electrically connected first electrode contacts are arranged adjacent to each other, and at least two first electrode contacts are arranged between at least two second electrode contacts of the electrically connected second electrode contacts.

[0006] For example, the first type of first electrode trace and the second type of first electrode trace connected to a row of light-emitting sub-units arranged along the first direction are located on both sides of the row of light-emitting sub-units, respectively.

[0007] For example, each of the first type of first electrode traces includes a first sub-electrode trace and a second sub-electrode trace that extend along the same straight line and are mutually insulated and spaced apart. The portion of the plurality of first light-emitting sub-units near the first sub-electrode trace is connected to the first sub-electrode trace, and the portion of the plurality of first light-emitting sub-units near the second sub-electrode trace is connected to the second sub-electrode trace. Each of the second type of first electrode traces includes a third sub-electrode trace and a fourth sub-electrode trace that extend along the same straight line and are mutually insulated and spaced apart. The portion of the plurality of second light-emitting sub-units near the third sub-electrode trace is connected to the third sub-electrode trace, and the portion of the plurality of second light-emitting sub-units near the fourth sub-electrode trace is connected to the fourth sub-electrode trace.

[0008] For example, the light-emitting panel further includes: a plurality of second electrode traces extending along the second direction, wherein the second electrode traces are located between the first electrode traces and the substrate. Each of the connection line units further includes a second electrode connection portion, wherein the second electrode connection portion is disposed on the same layer as the first electrode trace, and the second electrode contact point in each of the connection line units is connected to the second electrode trace through the second electrode connection portion.

[0009] For example, the second electrode contact point and the second electrode connection part are an integral structure.

[0010] For example, in the first direction, the orthographic projection of each second electrode trace on the substrate overlaps with the orthographic projection of one of the electrical contact points and a portion of the second electrode connection portion on the substrate.

[0011] For example, each light-emitting unit includes three light-emitting sub-units of different colors arranged along the second direction, the second electrode trace includes a first type of second electrode trace and a second type of second electrode trace, and one of the light-emitting sub-units in the light-emitting unit is connected to the first type of second electrode trace, and the other two light-emitting sub-units in the light-emitting unit are connected to the second type of second electrode trace.

[0012] For example, each of the connection line units includes two electrical contact point pairs, and each of the connection line units also includes two first electrode connection portions connected to each of the first electrode contact points. The first electrode connection portions are located on the side of the first electrode contact point away from the second electrode contact point. The first electrode contact point is connected to the first electrode trace through the first electrode connection portion, and at least a portion of the orthographic projection of the first electrode connection portion on the substrate does not overlap with the orthographic projection of the second electrode trace on the substrate.

[0013] This disclosure provides a circuit board, comprising: a substrate; a plurality of connection line units arranged in an array on the substrate along a first direction and a second direction; and a plurality of first electrode traces extending along the first direction. Each connection line unit includes at least two electrical contact pairs, each electrical contact pair including a first electrode contact and a second electrode contact. In at least one connection line unit, each first electrode contact is electrically connected to each other, and each second electrode contact is electrically connected to each other. The plurality of first electrode traces includes a plurality of first-type first electrode traces and a plurality of second-type first electrode traces. At least one connection line unit includes a plurality of first connection line units and a plurality of second connection line units. The first electrode contact of the first connection line unit is connected to the first-type first electrode trace, and the first electrode contact of the second connection line unit is connected to the second-type first electrode trace. At least two first electrode contacts of the electrically connected first electrode contacts are arranged adjacent to each other, and at least two first electrode contacts are arranged between at least two second electrode contacts of the electrically connected second electrode contacts.

[0014] For example, the first type of first electrode trace and the second type of first electrode trace, which are connected to a row of connection line units arranged along the first direction, are located on both sides of the row of connection line units.

[0015] For example, each of the first type of first electrode traces includes a first sub-electrode trace and a second sub-electrode trace that extend along the same straight line and are mutually insulated and spaced apart. The portion of the plurality of first connection line units near the first sub-electrode trace is connected to the first sub-electrode trace, and the portion of the plurality of first connection line units near the second sub-electrode trace is connected to the second sub-electrode trace. Each of the second type of first electrode traces includes a third sub-electrode trace and a fourth sub-electrode trace that extend along the same straight line and are mutually insulated and spaced apart. The portion of the plurality of second connection line units near the third sub-electrode trace is connected to the third sub-electrode trace, and the portion of the plurality of second connection line units near the fourth sub-electrode trace is connected to the fourth sub-electrode trace.

[0016] For example, the circuit board further includes: multiple second electrode traces extending along the second direction, the second electrode traces being located on the side of the first electrode traces facing the substrate. Each connection line unit further includes a second electrode connection portion, the second electrode connection portion being disposed on the same layer as the first electrode traces, and the second electrode contact point in each connection line unit being connected to the second electrode traces through the second electrode connection portion.

[0017] For example, in the first direction, the orthographic projection of each second electrode trace on the substrate overlaps with the orthographic projection of one of the electrical contact points and a portion of the second electrode connection portion on the substrate.

[0018] For example, three adjacent connection line units arranged along the second direction form a connection line unit group, the second electrode trace includes a first type of second electrode trace and a second type of second electrode trace, one of the connection line units in the connection line unit group is connected to the first type of second electrode trace, and the other two connection line units in the connection line unit group are connected to the second type of second electrode trace.

[0019] For example, each of the connection line units includes two electrical contact point pairs, and each of the connection line units also includes two first electrode connection portions connected to each of the first electrode contact points. The first electrode connection portions are located on the side of the first electrode contact point away from the second electrode contact point. The first electrode contact point is connected to the first electrode trace through the first electrode connection portion, and at least a portion of the orthographic projection of the first electrode connection portion on the substrate does not overlap with the orthographic projection of the second electrode trace on the substrate.

[0020] One embodiment of this disclosure provides a display device including the aforementioned light-emitting panel. The light-emitting panel is a display panel. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings of the embodiments will be briefly described below. Obviously, the drawings described below only relate to some embodiments of this disclosure, and are not intended to limit this disclosure.

[0022] Figure 1A This is a partial planar structural schematic diagram of a light-emitting panel according to an embodiment of the present disclosure;

[0023] Figure 1B For along Figure 1A A schematic diagram of the cross-sectional structure cut by line AA;

[0024] Figure 2 for Figure 1A The circuit diagram shown is of the two light-emitting units included in the light-emitting panel.

[0025] Figure 3 A partial planar structural schematic diagram of a light-emitting plate provided in another embodiment of this disclosure;

[0026] Figure 4 A partial planar structural schematic diagram of a circuit board provided in an embodiment of this disclosure; and

[0027] Figure 5This is a partial planar structural schematic diagram of a circuit board provided in another embodiment of the present disclosure. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Based on the described embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0029] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects.

[0030] This disclosure provides a light-emitting board, a circuit board, and a display device. The light-emitting board includes a substrate and a plurality of light-emitting units located on the substrate. The plurality of light-emitting units are arranged in an array on the substrate along a first direction and a second direction. Each light-emitting unit includes at least one light-emitting sub-unit, which includes a connection line unit and a light-emitting diode chip connected to the connection line unit. The light-emitting diode chip is located on the side of the connection line unit away from the substrate. Each connection line unit includes at least two electrical contact pairs, each electrical contact pair including a first electrode contact and a second electrode contact. In each connection line unit, the first electrode contacts are electrically connected to each other, the second electrode contacts are electrically connected to each other, and only one of the at least two electrical contact pairs is connected to the light-emitting diode chip. In this disclosure, all the first electrode contacts in the at least two electrical contact pairs in each connection line unit are electrically connected to each other, and all the second electrode contacts are electrically connected to each other. When the light-emitting diode chip connected to one electrical contact pair in the connection line unit malfunctions, a spare light-emitting diode chip can be connected to other spare electrical contact pairs, thereby repairing the light-emitting sub-unit.

[0031] The light-emitting board, circuit board, and display device provided in the embodiments of this disclosure are described below with reference to the accompanying drawings.

[0032] Figure 1A This is a partial planar structural schematic diagram of a light-emitting plate according to an embodiment of the present disclosure. Figure 1B For along Figure 1A The diagram shows the cross-sectional structure cut by line AA. Figure 2 for Figure 1A The circuit diagram shown illustrates the two light-emitting units included in the light-emitting panel. Figure 1A As shown, the light-emitting plate in this embodiment includes a substrate 100 and a plurality of light-emitting units 200 located on the substrate 100. The plurality of light-emitting units 200 are arranged in an array on the substrate 100 along a first direction and a second direction. Figure 1A Taking the X direction as the first direction and the Y direction as the second direction as an example, the first and second directions intersect, for example, the first and second directions are perpendicular, and the embodiments of this disclosure include, but are not limited to, this. Taking the first direction as the column direction and the second direction as the row direction as an example, the column direction and row direction are relative. For example, the first and second directions can also be interchanged, that is, the first direction can also refer to the row direction, and the second direction can also refer to the column direction.

[0033] like Figure 1A and Figure 1B As shown, each light-emitting unit 200 includes at least one light-emitting sub-unit 201. The light-emitting sub-unit 201 includes a connection line unit 210 and a light-emitting diode chip 220 connected to the connection line unit 210. The light-emitting diode chip 220 is located on the side of the connection line unit 210 away from the substrate 100. Each connection line unit 210 includes at least two electrical contact pairs 211. Each electrical contact pair 211 includes a positive contact 2111 and a negative contact 2112. In each connection line unit 210, the positive contacts 2111 are electrically connected to each other, and the negative contacts 2112 are electrically connected to each other. Only one of the at least two electrical contact pairs 211 is connected to the light-emitting diode chip 220. That is, all positive contacts and all negative contacts are electrically connected in each connection line unit. The positive contact 2111 is connected to the positive electrode of the light-emitting diode chip 220, and the negative contact 2112 is connected to the negative electrode of the light-emitting diode chip 220. In this embodiment, each connection line unit includes at least two electrical contact pairs. One of these electrical contact pairs is used to connect to a light-emitting diode (LED) chip, while the other electrical contact pairs serve as backup electrical contact pairs. When the LED chip connected to one of the electrical contact pairs malfunctions, or when the electrical contact pair is broken, causing the LED chip to fail to emit light, the light-emitting subunit can be repaired by binding an LED chip to any of the other backup electrical contact pairs. This disclosure uses the second electrode contact point as the positive contact point and the first electrode contact point as the negative contact point as an example, but it is not limited to this, and the two can be interchanged.

[0034] For example, such as Figure 1AAs shown in the illustration, this embodiment of the present disclosure describes each connection line unit 210 as having two electrical contact pairs 211, one of which is connected to a light-emitting diode chip, and the other serves as a spare electrical contact pair. However, this embodiment of the present disclosure is not limited to this.

[0035] For example, the light-emitting diode chip in this embodiment can be a Mini LED. For example, the maximum size of a mini LED in the direction parallel to the substrate 100 is no greater than 500 micrometers. For example, the size of a mini LED can be 0.1mm × 0.17mm. This embodiment is not limited to this; the light-emitting diode chip can also be a microLED. Because the light-emitting diode chip used in this embodiment is small in size—for example, the size of each light-emitting diode chip occupies a very low proportion (e.g., about 2%) of the pixel area / light-emitting area where the light-emitting unit is located—it has ample space for setting up spare electrical contact pairs compared to other types of display panels.

[0036] For example, the connection line unit may also include three or more electrical contact pairs. When the connection line unit includes three or more electrical contact pairs, one of the electrical contact pairs is connected to the LED chip, and the other electrical contact pairs serve as backup electrical contact pairs. For example, a malfunction of the LED chip may include a short circuit or open circuit between the positive and negative terminals of the LED chip. In this case, the connection between the negative terminal and the negative terminal trace of the malfunctioning LED chip can be severed, and then a backup LED chip can be connected to the backup electrical contact pair to repair the LED subunit. It should be noted that the backup LED chip connected to the backup electrical contact pair should be a chip that emits the same color of light as the malfunctioning LED chip.

[0037] For example, such as Figure 1A As shown, the light-emitting panel also includes multiple negative electrode traces 300 extending along a first direction (X direction). Each negative electrode trace 300 includes a first negative electrode trace 310 and a second negative electrode trace 320. A row of light-emitting sub-units 201 arranged along the first direction includes a first light-emitting sub-unit 2011 and a second light-emitting sub-unit 2012. The first light-emitting sub-unit 2011 is connected to the first negative electrode trace 310 through a corresponding negative electrode contact point 2112, and the second light-emitting sub-unit 2012 is connected to the second negative electrode trace 320 through a corresponding negative electrode contact point 2112. Thus, a row of light-emitting sub-units is connected to two corresponding negative electrode traces.

[0038] Compared to the general case of connecting a row of light-emitting sub-units (e.g., a row of sub-pixels) to a negative electrode line, in this embodiment of the present disclosure, a portion of the multiple light-emitting sub-units arranged along the first direction are connected to the first negative electrode line, and another portion are connected to the second negative electrode line. This can reduce the number of light-emitting sub-units connected to each negative electrode line, that is, reduce the number of light-emitting diode chips connected to each negative electrode line, thereby effectively reducing the current on each negative electrode line and reducing the power consumption of the negative electrode line.

[0039] For example, in one embodiment of this disclosure, the light-emitting panel may employ bilateral driving. The light-emitting panel may further include two drivers connected to negative electrode traces, each located on one of the two sides of the light-emitting panel along a first direction. A first negative electrode trace may be connected to one driver, and a second negative electrode trace may be connected to the other driver. The first and second negative electrode traces connected to a column of light-emitting sub-units may be located on the same side of the column of light-emitting sub-units, or on opposite sides of the column of light-emitting sub-units.

[0040] For example, with Figure 1A Taking the positive direction of the X direction (indicated by the arrow) as an example, multiple light-emitting sub-units located in the same column can be divided into upper and lower parts. The number of light-emitting sub-units in the two parts can be the same or different. Using the interval between the two parts of light-emitting sub-units as a dividing line, the first negative electrode trace and the second negative electrode trace can be located on both sides of the dividing line, thereby connecting to the light-emitting sub-units located on both sides of the dividing line. This embodiment is not limited to this; the first negative electrode trace and the second negative electrode trace can both pass through the dividing line, as long as the first negative electrode trace and the second negative electrode trace are connected to the light-emitting sub-units located on both sides of the dividing line.

[0041] For example, when the first negative electrode trace and the second negative electrode trace are located on opposite sides of the separator line, the first negative electrode trace and the second negative electrode trace connected to a column of light-emitting sub-units can be located on the same side of the column of light-emitting sub-units or on opposite sides of the column of light-emitting sub-units, as long as the orthogonal projections of the first negative electrode trace and the second negative electrode trace on a straight line extending along the first direction do not overlap. In this case, each negative electrode trace can be configured to have a wider linewidth to reduce power consumption.

[0042] For example, in another embodiment of this disclosure, the light-emitting panel may employ single-sided driving. The light-emitting panel may further include a driver connected to each negative electrode trace, located on either side edge of the light-emitting panel along a first direction. Both the first and second negative electrode traces are connected to the driver. The first and second negative electrode traces connected to a column of light-emitting sub-units may be located on opposite sides of that column of light-emitting sub-units.

[0043] Figure 1AIn the illustrated embodiment, both the first negative electrode trace and the second negative electrode trace are continuous traces. Figure 1A The example shown illustrates that each negative trace has a signal input terminal, but it is not limited to this.

[0044] For example, such as Figure 1A As shown, the first negative electrode trace 310 and the second negative electrode trace 320, which are connected to a row of light-emitting sub-units 201 arranged along the first direction, are located on both sides of the row of light-emitting sub-units 201, respectively. This ensures that when the negative electrode contact point in this row of light-emitting sub-units is connected to the corresponding negative electrode trace, there will be no intersection with other negative electrode traces, facilitating trace design. Two negative electrode traces 300 are provided between two adjacent rows of light-emitting sub-units 201 arranged along the second direction. The spacing between the two negative electrode traces 300 is a safe distance to prevent short circuits; for example, the spacing between the two negative electrode traces 300 can be no less than 15 micrometers. For example, while ensuring that the spacing between the two negative electrode traces 300 located between two adjacent rows of light-emitting sub-units 201 meets the safe distance requirement, the line width of each negative electrode trace 300 can be set as wide as possible, which can ensure the flatness of the negative electrode trace and reduce its resistance.

[0045] For example, such as Figure 1A As shown, along the first direction, the first light-emitting sub-unit 2011 and the second light-emitting sub-unit 2012 can be arranged alternately to ensure the uniformity of light emission from the light-emitting sub-units. This embodiment does not limit the arrangement or number of the first and second light-emitting sub-units, as long as the first light-emitting sub-unit is connected to the first negative electrode trace and the second light-emitting sub-unit is connected to the second negative electrode trace, thereby reducing the number of light-emitting sub-units connected to each negative electrode trace.

[0046] For example, the number of the first light-emitting sub-unit 2011 and the second light-emitting sub-unit 2012 is the same, so as to ensure that the current flowing through each negative electrode trace is approximately equal and to prevent the situation where individual negative electrode traces have high power consumption.

[0047] For example, such as Figure 1A As shown, the light-emitting plate also includes multiple positive electrode traces 400 extending along a second direction (i.e., the Y direction), with the positive electrode traces 400 located between the negative electrode traces 300 and the substrate 100. Each connection line unit 210 also includes a positive electrode connection portion 212, which is disposed on the same layer as the negative electrode traces 300, and the positive electrode contact point 2111 in each connection line unit 210 is connected to the positive electrode trace 400 through the positive electrode connection portion 212. This disclosure describes the example of the first electrode trace being a negative electrode trace and the second electrode trace being a positive electrode trace. However, it is not limited to this; the two can be interchanged, that is, the first electrode trace can be a positive electrode trace, and the second electrode trace can be a negative electrode trace.

[0048] For example, such as Figure 1A As shown, the positive electrode contact 2111 and the negative electrode contact 2112 can be disposed on the same layer as the negative electrode trace 300 and made of the same material. For example, the positive electrode contact 2111, the negative electrode contact 2112, and the negative electrode trace 300 can be formed using the same material and the same patterning process. For example, the material of the negative electrode trace 300 may include copper.

[0049] For example, such as Figure 1A As shown, the positive electrode connection 212 and the negative electrode trace 300 can also be formed by using the same material and the same patterning process.

[0050] For example, while maintaining a safe distance between the positive terminal connection 212 and the negative terminal traces 300 located on both sides thereon, the line width of the positive terminal connection 212 can be as wide as possible to reduce the resistance of the positive terminal connection 212 and thus reduce power consumption.

[0051] For example, such as Figure 1A As shown, the positive electrode contact point 2111 can be integrated with the positive electrode connection part 212 to facilitate manufacturing.

[0052] For example, such as Figure 1A As shown, when the connection line unit 210 includes two electrical contact point pairs 211, along the first direction, the two positive contact points 2111 are located on the two side edges of the positive connection portion 212, and the two negative contact points 2112 are located on the side of the corresponding positive contact point 2111 away from the positive connection portion 212, and are separated from the positive contact point 2111.

[0053] For example, such as Figure 1A As shown, an insulating layer (not shown) is provided between the positive electrode connection portion 212 and the positive electrode trace 400. The positive electrode connection portion 212 can be electrically connected to the positive electrode trace 400 through a via 500 penetrating the insulating layer. For example, each positive electrode connection portion 212 can be electrically connected to the positive electrode trace 400 through multiple vias 500 to ensure the effectiveness of the electrical connection.

[0054] For example, such as Figure 1A As shown, in each circuit unit 210, the distance between the two positive electrical contact points 2111 is greater than 20 micrometers, so that a positive connection portion 212 and a via 500 are provided between the two positive contact points 2111.

[0055] For example, such as Figure 1A As shown, in the first direction, the orthographic projection of each positive electrode trace 400 on the substrate 100 overlaps with the orthographic projection of an electrical contact pair 211 and a portion of the positive electrode connection portion 212 on the substrate 100. In this embodiment, setting the linewidth of the positive electrode trace to be wider can reduce the power consumption of the trace.

[0056] For example, such as Figure 1A As shown, each connection line unit 210 also includes two negative electrode connection portions 213 connected to each negative electrode contact point 2112. The negative electrode connection portions 213 are located on the side of the negative electrode contact point 2112 away from the positive electrode contact point 2111. The negative electrode contact point 2112 is connected to the negative electrode trace 300 through the negative electrode connection portions 213, and at least a portion of the orthogonal projection of the negative electrode connection portion 213 on the substrate 100 does not overlap with the orthogonal projection of the positive electrode trace 400 on the substrate 100. In this embodiment of the present disclosure, by providing negative electrode connection portions that do not overlap with both the positive and negative electrode traces at least partially, when the light-emitting diode chip malfunctions, the negative electrode connection portions can be cut using methods such as laser cutting to disconnect the connection between the negative electrode contact point and the negative electrode trace, thereby achieving the repair of the light-emitting subunit. By providing negative electrode connection portions, the cutting process can be avoided from affecting the positive and negative electrode traces.

[0057] For example, such as Figure 1A As shown, the negative electrode connection portion 213 can be integrally formed with the negative electrode contact point 2112. For example, the negative electrode connection portion 213 may include a first portion extending along a first direction and a second portion extending along a second direction. The first portion is used to connect with the negative electrode trace 300, and the second portion is used to connect with the negative electrode contact point. This disclosure describes the example of the first electrode connection portion being the negative electrode connection portion and the second electrode connection portion being the positive electrode connection portion. However, it is not limited to this; the first electrode connection portion may also be a positive electrode connection portion, and the second electrode connection portion may also be a negative electrode connection portion.

[0058] For example, such as Figure 1A As shown, each light-emitting unit 200 may include three light-emitting sub-units 201 of different colors arranged along a second direction. The positive electrode line 400 includes a first positive electrode line 410 and a second positive electrode line 420. One light-emitting sub-unit 201 of the light-emitting unit 200 is connected to the first positive electrode line 410, and the other two light-emitting sub-units 201 of the light-emitting unit 200 are connected to the second positive electrode line 420. In this embodiment of the present disclosure, connecting each light-emitting unit to two positive electrode lines allows the light-emitting sub-units of one color to be controlled independently.

[0059] For example, the light-emitting unit may include a red light-emitting subunit, a green light-emitting subunit, and a blue light-emitting subunit. This is because the green and blue light-emitting units have a turn-on voltage (meaning the device brightness reaches 1 cd / m²). 2The operating voltages of the two light-emitting sub-units are similar, but the starting voltage of the red light-emitting sub-unit differs significantly from that of the other two. By connecting the red light-emitting sub-unit to the first positive electrode line and connecting the green and blue light-emitting sub-units to the second positive electrode line, it can be ensured that each light-emitting sub-unit is subjected to the corresponding starting voltage. This can save energy and prevent overload voltage from being applied to a certain color light-emitting sub-unit.

[0060] For example, such as Figure 1A As stated above, both the first positive electrode trace 410 and the second positive electrode trace 420 have a minimum width along the first direction. Taking the first positive electrode trace as an example, assuming M light-emitting units are arranged along the second direction, the voltage drop value IRdrop of the first positive electrode trace is I... t *R,I t Let R be the total current of the M light-emitting units arranged along the second direction, and R be the resistance of the first positive electrode trace within the light-emitting unit, satisfying R = Rs * P / Wr. Rs is the sheet resistance of the first positive electrode trace, Wr is the width of the first positive electrode trace, and P is the period of the light-emitting unit along the second direction. Combining these two formulas, we can obtain: Wr = (I t *Rs*P) / (IRdrop). To ensure uniform display brightness, the voltage drop (IR drop) of the first positive electrode trace must be less than a certain value K. When IRdrop = K, Wr has a minimum width Wrm. Similarly, the second positive electrode trace 420 also has a minimum width.

[0061] For example, along the first direction, the width of the first positive electrode trace 410 can be smaller than the width of the second positive electrode trace 420. However, it is not limited to this; the relationship between the widths of the two positive electrode traces needs to be determined based on the relationship between the magnitudes of the currents flowing through them.

[0062] For example, such as Figure 1B As shown, the substrate 100 can be a glass substrate. In this embodiment, a glass substrate with circuit connection units is used instead of a commonly used substrate, such as a printed circuit board (PCB) for electrically connecting light-emitting diode chips in a backlight or display panel, which can overcome the problem of poor heat dissipation performance of general PCB substrates.

[0063] For example, such as Figure 1A and Figure 1B As shown, the materials for the first negative electrode trace 310, the second negative electrode trace 320, and the positive electrode trace 400 can be conductive materials such as copper. Taking copper as an example, the two copper layers can be deposited on the substrate by sputtering or by electroplating. For example, the greater the thickness of the first negative electrode trace, the second negative electrode trace, and the positive electrode trace, the lower the power consumption, and the better the display effect when the light-emitting panel is used as a display panel.

[0064] For example, such as Figure 1A and Figure 1B As shown, a first buffer layer 103 is disposed between the positive electrode trace 400 and the substrate 100. The material of the first buffer layer 103 may include silicon nitride. A second buffer layer 104, a planarization layer 105, and a passivation layer 106 are sequentially disposed between the positive electrode trace 400 and the first negative electrode trace 310. The material of the planarization layer 105 may be resin. The greater the thickness of the planarization layer 105, the smaller the coupling capacitance between the trace layers on both sides. The materials of the second buffer layer 104 and the passivation layer 106 may both be silicon nitride, which is used to avoid the planarization layer 105 from directly contacting the metal layers on both sides and causing poor adhesion.

[0065] For example, such as Figure 1A and Figure 1B As shown, through holes 500 are provided in the second buffer layer 104, the planarization layer 105 and the passivation layer 106 so that the positive electrode connection portion 212 can be electrically connected to the positive electrode trace 400.

[0066] For example, such as Figure 1B As shown, an insulating layer 107 is provided on the side of the circuit connection unit 210 away from the substrate 100. The insulating layer 107 includes two vias to expose the positive electrode contact point 2111 and the negative electrode contact point 2112, respectively. The light-emitting diode chip 220 is located on the side of the insulating layer 107 away from the circuit connection unit 210, and the positive and negative electrodes of the light-emitting diode chip 220 are electrically connected to the positive electrode contact point 2111 and the negative electrode contact point 2112 through the vias in the insulating layer 107, respectively.

[0067] For example, such as Figure 1B As shown, the positive contact point 2111 and the positive connection part 212 are an integral structure, and the positive connection part 212 is connected to the positive trace 400 through multiple vias 500 so that the positive trace 400 is electrically connected to the positive electrode of the light-emitting diode chip 220.

[0068] For example, such as Figure 1B As shown, the positive electrode contact point 2111 and the negative electrode contact point 2112 are arranged in the same layer and are spaced apart from each other.

[0069] For example, the surfaces of the positive electrode contact 2111 and the negative electrode contact 2112 away from the substrate 100 can be located on the same plane as the surface of the positive electrode connection portion 212 away from the substrate 100, but this is not the only embodiment disclosed herein. For example, the positive electrode contact 2111 and the negative electrode contact 2112 include two protrusions that extend into two vias of the insulating layer 107, respectively. The positive and negative electrodes of the light-emitting diode chip 220 are electrically connected to the protrusions of the electrical contact pair through the aforementioned vias. The aforementioned protrusions can be fabricated using the same film deposition process as the film layer containing the positive electrode connection portion 212, and can be formed in a sequential patterning process using a halftone mask process.

[0070] For example, such as Figure 1A and Figure 2 As shown, each light-emitting unit 200 may include two bonding regions (light-emitting diode chip connection regions), namely a first bonding region 2201 and a second bonding region 2202. Each connection line unit 210 includes two electrical contact pairs 211 located in the first bonding region 2201 and the second bonding region 2202, respectively. The positive electrode connection portion 212 may be located between the two bonding regions to achieve electrical connection with the positive electrode trace 400.

[0071] For example, such as Figure 1A and Figure 2 As shown, multiple light-emitting sub-units 201 in the light-emitting unit 200 can all be bound to the first binding area 2201 to achieve a concentrated setting of the light-emitting positions of the three light-emitting sub-units, resulting in uniform display. When the light-emitting diode chip in any of the light-emitting sub-units bound to the first binding area 2201 malfunctions, a light-emitting diode chip of the same color can be bound to a spare electrical contact pair in the second binding area 2202. This spare electrical contact pair and the electrical contact pair connected to the malfunctioning light-emitting diode chip can be located on a straight line. Of course, the embodiments of this disclosure are not limited to this; multiple light-emitting sub-units in the light-emitting unit can also all be bound to the second binding area, while the electrical contact pairs in the first binding area are all used as spare electrical contact pairs.

[0072] For example, the light-emitting unit 200 includes three light-emitting sub-units 201 arranged along the second direction. The light-emitting sub-units 201 located on both sides can be bound to the same binding area, and the light-emitting sub-unit 201 located in the middle can be bound to another binding area. The line connecting the binding positions of the three light-emitting sub-units 201 forms a triangle, which is more conducive to achieving uniform light emission.

[0073] Figure 1AThe light-emitting panel shown can be a display panel, such as a passive matrix (PM) display panel, where the light-emitting unit is a pixel unit, and the light-emitting sub-units included in the light-emitting unit are sub-pixels. The display panel provided in this disclosure can improve the bonding yield of the product by providing backup electrical contact points, and can also reduce the power consumption of the negative electrode trace.

[0074] Of course, the light-emitting panel provided in this embodiment can also be used as a backlight to be combined with a liquid crystal display panel, and this embodiment does not limit this.

[0075] Figure 3 This is a partial planar structural schematic diagram of a light-emitting plate provided in another embodiment of this disclosure. (See attached diagram.) Figure 3 As shown, with Figure 1A Compared to the embodiments shown, Figure 3 The difference in the illustrated embodiment is that the first negative electrode trace 310 is not a continuous trace, but is interrupted in the middle to form a first sub-negative electrode trace 311 and a second sub-negative electrode trace 312. The two ends of the first sub-negative electrode trace 311 and the second sub-negative electrode trace 312 that are far apart from each other are two signal input terminals 301 and 302. The second negative electrode trace 320 is not a continuous trace, but is interrupted in the middle to form a third sub-negative electrode trace 321 and a fourth sub-negative electrode trace 322. The two ends of the third sub-negative electrode trace 321 and the fourth sub-negative electrode trace 322 that are far apart from each other are configured as two signal input terminals 303 and 304. This disclosure describes the first sub-negative electrode trace as the first sub-negative electrode trace, the second sub-negative electrode trace as the second sub-negative electrode trace, the third sub-negative electrode trace as the third sub-negative electrode trace, and the fourth sub-negative electrode trace as the fourth sub-negative electrode trace as examples.

[0076] For example, each first negative electrode trace 310 includes a first sub-negative electrode trace 311 and a second sub-negative electrode trace 312 that extend along the same straight line and are mutually insulated and spaced apart. The distance between the first sub-negative electrode trace 311 and the second sub-negative electrode trace 312 is no greater than the distance between two adjacent light-emitting sub-units. Each second negative electrode trace 320 includes a third sub-negative electrode trace 321 and a fourth sub-negative electrode trace 322 that extend along the same straight line and are mutually insulated and spaced apart. The distance between the third sub-negative electrode trace 321 and the fourth sub-negative electrode trace 322 is no greater than the distance between two adjacent light-emitting sub-units.

[0077] like Figure 3 As shown, the light-emitting panel provided in this embodiment can be driven by both sides. The first negative electrode trace 310 includes a first sub-negative electrode trace 311 and a second sub-negative electrode trace 312, which are respectively connected to two drivers. The second negative electrode trace 320 includes a third sub-negative electrode trace 321 and a fourth sub-negative electrode trace 322, which are respectively connected to the two drivers. These two drivers can be located on both sides of the light-emitting panel along the first direction.

[0078] For example, such as Figure 3 As shown, the signal input terminal 301 of the first sub-negative line 311 and the signal input terminal 303 of the third sub-negative line 321 can be connected to the same driver, and the signal input terminal 302 of the second sub-negative line 312 and the signal input terminal 304 of the fourth sub-negative line 322 can be connected to the same driver.

[0079] For example, such as Figure 3 As shown, the first sub-negative electrode trace 311 and the second sub-negative electrode trace 312 can be located on the same straight line, and the third sub-negative electrode trace 321 and the fourth sub-negative electrode trace 322 can be located on the same straight line.

[0080] For example, such as Figure 3 As shown, the portions of the plurality of first light-emitting sub-units 2011 near the first sub-negative electrode trace 311 are connected to the first sub-negative electrode trace 311, and the portions of the plurality of first light-emitting sub-units 2011 near the second sub-negative electrode trace 312 are connected to the second sub-negative electrode trace 312. The portions of the plurality of second light-emitting sub-units 2012 near the third sub-negative electrode trace 321 are connected to the third sub-negative electrode trace 321, and the portions of the plurality of second light-emitting sub-units 2012 near the fourth sub-negative electrode trace 322 are connected to the fourth sub-negative electrode trace 322.

[0081] For example, multiple light-emitting sub-units located in the same column can be divided into two parts along a first direction. The number of light-emitting sub-units in the two parts can be the same or different. Using the interval between the two parts of light-emitting sub-units as a dividing line, the first sub-negative electrode trace and the second sub-negative electrode trace are located on both sides of the dividing line and connected by the light-emitting sub-units located on both sides of the dividing line. The third sub-negative electrode trace and the fourth sub-negative electrode trace are located on both sides of the dividing line and connected by the light-emitting sub-units located on both sides of the dividing line.

[0082] Compared to the general case of connecting a column of light-emitting sub-units (e.g., a column of sub-pixels) to a single negative electrode trace, in this embodiment of the present disclosure, a column of light-emitting sub-units arranged along a first direction includes four parts of light-emitting sub-units. The first part of the light-emitting sub-units is connected to a first sub-negative electrode trace, the second part of the light-emitting sub-units is connected to a second sub-negative electrode trace, the third part of the light-emitting sub-units is connected to a third sub-negative electrode trace, and the fourth part of the light-emitting sub-units is connected to a fourth sub-negative electrode trace. That is, a column of light-emitting sub-units is connected to four negative electrode traces, which can further reduce the number of light-emitting sub-units connected to each negative electrode trace, i.e., reduce the number of light-emitting diode chips connected to each negative electrode trace, thereby effectively reducing the current on each negative electrode trace and reducing the power consumption of the negative electrode trace.

[0083] The features of the positive electrode wiring, the number and arrangement of the light-emitting sub-units included in the light-emitting unit, and the features of the light-emitting sub-units including the connecting line units in the embodiments of this disclosure are all the same as those of the previous embodiments. Figure 1A and Figure 2 The embodiments shown are the same and will not be described again here.

[0084] Figure 3 The light-emitting panel shown can be a display panel, the light-emitting unit is a pixel unit, and the light-emitting sub-units included in the light-emitting unit are sub-pixels. The display panel provided in this embodiment can improve the bonding yield of the product by providing spare electrical contact points, and can also reduce the power consumption of the negative electrode trace.

[0085] Of course, the light-emitting panel provided in this embodiment can also be used as a backlight and combined with a liquid crystal display panel, and this embodiment does not limit this.

[0086] Another embodiment of this disclosure provides a display device including any of the above-described display panels. The display device provided by this disclosure can improve product bonding yield by providing backup electrical contacts, and can also reduce power consumption of the negative electrode trace.

[0087] Figure 4 This is a partial planar structural diagram of a circuit board provided in an embodiment of this disclosure. For example... Figure 4 As shown, the circuit board includes a substrate 100 and a plurality of connection line units 210 located on the substrate 100. The plurality of connection line units 210 are arranged in an array on the substrate 100 along a first direction and a second direction. Figure 4 The description will be based on the example of X direction as the first direction and Y direction as the second direction.

[0088] like Figure 4 As shown, each connection line unit 210 includes at least two electrical contact pairs 211. Each electrical contact pair 211 includes a positive contact 2111 and a negative contact 2112. In each connection line unit 210, the positive contacts 2111 are electrically connected to each other, and the negative contacts 2112 are electrically connected to each other. Only one of the at least two electrical contact pairs 211 has its positive contact 2111 and negative contact 2112 configured to be connected to the positive and negative terminals of a light-emitting diode (LED) chip, respectively. In this embodiment, each connection line unit includes at least two electrical contact pairs, one of which is used to connect to the LED chip, while the other pairs serve as backup pairs. When the LED chip connected to one of the electrical contact pairs malfunctions, the LED chip can be repaired by binding it to any of the other backup electrical contact pairs.

[0089] For example, such as Figure 4As shown in the illustration, this embodiment of the present disclosure describes each connection line unit 210 as including two electrical contact pairs 211. One of the two electrical contact pairs 211 is configured to connect to the light-emitting diode chip, and the other serves as a spare electrical contact pair. However, this embodiment of the present disclosure is not limited to this. The connection line unit may also include three or more electrical contact pairs. When the connection line unit includes three or more electrical contact pairs, one of the electrical contact pairs is configured to connect to the light-emitting diode chip, and the other electrical contact pairs serve as spare electrical contact pairs.

[0090] For example, such as Figure 4 As shown, the circuit board also includes multiple negative traces 300 extending along a first direction (X direction). Each negative trace 300 includes a first negative trace 310 and a second negative trace 320. A row of connection line units 210 arranged along the first direction includes multiple first connection line units 2101 and multiple second connection line units 2102. The negative contact point 2112 of the first connection line unit 2101 is connected to the first negative trace 310, and the negative contact point 2112 of the second connection line unit 2102 is connected to the second negative trace 320. For example, taking a row of connection line units arranged along the first direction as an example, the row of connection line units is connected to two corresponding negative traces.

[0091] Compared to the typical case where a column of connection line units (e.g., a column of connection line units configured to connect to a column of sub-pixels) is connected to a single negative electrode trace, in this embodiment of the disclosure, the connection line units arranged along the first direction are connected to two negative electrode traces. This reduces the number of connection line units connected to each negative electrode trace, i.e., reduces the number of LED chips connected to each negative electrode trace, thereby effectively reducing the current on each negative electrode trace and thus reducing the power consumption of the negative electrode trace.

[0092] For example, such as Figure 4As shown, the first negative electrode trace 310 and the second negative electrode trace 320, which are connected to a column of connecting line units 210 arranged along the first direction, are located on both sides of the column of connecting line units 210, respectively. This ensures that when the negative electrode contact point in this row of light-emitting sub-units is connected to the corresponding negative electrode trace, there will be no intersection with other negative electrode traces, facilitating trace design. Taking a column of light-emitting sub-units arranged along the first direction as an example, two negative electrode traces 300 are provided between two adjacent columns of connecting line units 210 arranged along the second direction. The spacing between the two negative electrode traces 300 is a safe distance to ensure that they do not short-circuit. For example, the spacing between the two negative electrode traces 300 can be no less than 15 micrometers. For example, while ensuring that the spacing between the two negative electrode traces 300 located between two adjacent columns of connecting line units 210 meets the safe distance requirement, the line width of each negative electrode trace 300 can be set as wide as possible (for example, 30 micrometers), which can also reduce the resistance of the negative electrode traces.

[0093] For example, such as Figure 4 As shown, along the first direction, the first connecting line unit 2101 and the second connecting line unit 2102 can be arranged alternately. This embodiment is not limited to this; as long as the first connecting line unit is connected to the first negative terminal trace and the second connecting line unit is connected to the second negative terminal trace, the number of connecting line units connected to each negative terminal trace can be reduced.

[0094] For example, the number of first connection line units 2101 and second connection line units 2102 is the same.

[0095] For example, such as Figure 4 As shown, the circuit board also includes multiple positive electrode traces 400 extending along a second direction (i.e., the Y direction), with the positive electrode traces 400 located between the negative electrode traces 300 and the substrate 100. Each connection line unit 210 also includes a positive electrode connection portion 212, which is disposed on the same layer as the negative electrode traces 300, and the positive electrode contact point 2111 in each connection line unit 210 is connected to the positive electrode trace 400 through the positive electrode connection portion 212.

[0096] For example, such as Figure 4 As shown, the positive electrode contact point 2111 can be integrated with the positive electrode connection part 212 to facilitate manufacturing.

[0097] For example, such as Figure 4 As shown, when the connection line unit 210 includes two electrical contact point pairs 211, along the first direction, the two positive contact points 2111 are located on the two side edges of the positive connection portion 212, and the two negative contact points 2112 are located on the side of the corresponding positive contact point 2111 away from the positive connection portion 212, and are separated from the positive contact point 2111.

[0098] For example, such as Figure 4 As shown, an insulating layer (not shown) is provided between the positive electrode connection part 212 and the positive electrode trace 400. The positive electrode connection part 212 can be electrically connected to the positive electrode trace 400 through a plurality of through holes 500 penetrating the insulating layer.

[0099] For example, such as Figure 4 As shown, in the first direction, the orthographic projection of each positive electrode trace 400 on the substrate 100 overlaps with the orthographic projection of an electrical contact pair 211 and a portion of the positive electrode connection portion 212 on the substrate 100. In this embodiment, setting the linewidth of the positive electrode trace to be wider can reduce the power consumption of the trace.

[0100] For example, such as Figure 4 As shown, each connection line unit 210 also includes two negative electrode connection portions 213 connected to each negative electrode contact point 2112. The negative electrode connection portions 213 are located on the side of the negative electrode contact point 2112 away from the positive electrode contact point 2111. The negative electrode contact point 2112 is connected to the negative electrode trace 300 through the negative electrode connection portions 213, and at least a portion of the orthogonal projection of the negative electrode connection portion 213 on the substrate 100 does not overlap with the orthogonal projection of the positive electrode trace 400 on the substrate 100. In this embodiment of the present disclosure, by providing negative electrode connection portions that do not overlap with both the positive and negative electrode traces at least partially, when the light-emitting diode chip malfunctions, the negative electrode connection portions can be cut using methods such as laser cutting to disconnect the connection between the negative electrode contact point and the negative electrode trace, thereby achieving the repair of the light-emitting subunit. By providing negative electrode connection portions, the cutting process can be avoided from affecting the positive and negative electrode traces.

[0101] For example, such as Figure 4 As shown, three adjacent connection line units 210 arranged along the second direction form a connection line unit group 2100. The positive electrode trace 400 includes a first positive electrode trace 410 and a second positive electrode trace 420. One connection line unit 210 in the connection line unit group 2100 is connected to the first positive electrode trace 410, and the other two connection line units 210 in the connection line unit group 2100 are connected to the second positive electrode trace 420. Along the first direction, the width of the first positive electrode trace 410 is smaller than the width of the second positive electrode trace 420. In this embodiment, connecting each connection line unit group to two positive electrode traces allows one connection line unit to be independently controlled.

[0102] For example, the three connection line units are respectively connected to the red, green, and blue LED chips. For example, the connection line unit connected to the red LED chip can be connected to the first positive terminal trace, and the connection line units connected to the green and blue LED chips can be connected to the second positive terminal trace, so as to ensure that each light-emitting sub-unit is subjected to the corresponding lighting voltage, which can save power and prevent overload voltage from being applied to a certain color light-emitting sub-unit.

[0103] Figure 4 The circuit board shown is Figure 1A The structure of the light-emitting board shown, excluding the light-emitting diode chip, and the specific characteristics of the circuit board are also the same. Figure 1A The circuit boards shown are identical. Therefore, in Figure 4 The features of the circuit board in the embodiments can be referred to Figure 1A Corresponding embodiments. This circuit board can be applied to display panels or backlights. The circuit board provided in this disclosure can improve the bonding yield of products by providing spare electrical contacts, and can also reduce the power consumption of negative electrode traces.

[0104] Figure 5 This is a partial planar structural diagram of a circuit board provided in another embodiment of the present disclosure. (See diagram below.) Figure 5 As shown, with Figure 4 Compared to the embodiments shown, Figure 5 The difference in the illustrated embodiment is that the first negative electrode trace 310 is not a continuous trace, but is interrupted in the middle to form the first sub-negative electrode trace 311 and the second sub-negative electrode trace 312; the second negative electrode trace 320 is not a continuous trace, but is interrupted in the middle to form the third sub-negative electrode trace 321 and the fourth sub-negative electrode trace 322.

[0105] like Figure 5 As shown, the circuit board provided in this embodiment can be used for dual-sided driving. The first negative electrode trace 310 includes a first sub-negative electrode trace 311 and a second sub-negative electrode trace 312, which are respectively connected to two drivers. The second negative electrode trace 320 includes a third sub-negative electrode trace 321 and a fourth sub-negative electrode trace 322, which are respectively connected to the two drivers. These two drivers can be located on both sides of the circuit board along the first direction.

[0106] For example, such as Figure 5 As shown, the first sub-negative electrode trace 311 and the second sub-negative electrode trace 312 can be located on the same straight line, and the third sub-negative electrode trace 321 and the fourth sub-negative electrode trace 322 can be located on the same straight line.

[0107] For example, such as Figure 5As shown, in the plurality of first connection line units 2101, the portion near the first sub-negative terminal trace 311 is connected to the first sub-negative terminal trace 311, and the portion near the second sub-negative terminal trace 312 is connected to the second sub-negative terminal trace 312. In the plurality of second connection line units 2102, the portion near the third sub-negative terminal trace 321 is connected to the third sub-negative terminal trace 321, and the portion near the fourth sub-negative terminal trace 322 is connected to the fourth sub-negative terminal trace 322.

[0108] For example, multiple connection line units located in the same column can be divided into two parts along a first direction. The number of connection line units in the two parts can be the same or different. Using the interval between the two parts of connection line units as a dividing line, the first sub-negative line and the second sub-negative line are located on both sides of the dividing line, respectively, to connect with the connection line units located on both sides of the dividing line. The third sub-negative line and the fourth sub-negative line are located on both sides of the dividing line, respectively, to connect with the connection line units located on both sides of the dividing line.

[0109] Compared to the typical case where a column of connection line units (e.g., a column of connection line units configured to connect to a column of sub-pixels) is connected to a single negative electrode trace, in this embodiment of the disclosure, a column of connection line units is connected to four negative electrode traces. This reduces the number of connection line units connected to each negative electrode trace, i.e., reduces the number of LED chips connected to each negative electrode trace, thereby effectively reducing the current on each negative electrode trace and thus reducing the power consumption of the negative electrode trace.

[0110] The features of the positive electrode wiring, the number of connecting line units, and the arrangement of the units in the embodiments disclosed herein are all similar to those of the present disclosure. Figure 4 The embodiments shown are the same and will not be described again here.

[0111] Figure 5 The circuit board shown is Figure 3 The structure of the light-emitting board shown, excluding the light-emitting diode chip, and the specific characteristics of the circuit board are also the same. Figure 3 The circuit boards shown are identical. Therefore, in Figure 5 The features of the circuit board in the embodiments can be referred to Figure 3 Corresponding embodiments. This circuit board can be applied to display panels or backlights. The circuit board provided in this disclosure can improve the bonding yield of products by providing spare electrical contacts, and can also reduce the power consumption of negative electrode traces.

[0112] The following points need to be explained:

[0113] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure, and other structures can be referred to the general design.

[0114] (2) Where there is no conflict, features of the same embodiment and different embodiments of this disclosure may be combined with each other.

[0115] The above description is merely an exemplary embodiment of this disclosure and is not intended to limit the scope of protection of this disclosure, which is determined by the appended claims.

Claims

1. A light emitting panel, comprising: a substrate substrate; a plurality of light emitting units arranged in an array along a first direction and a second direction on the substrate substrate, each of the light emitting units comprising at least one light emitting sub-unit, the light emitting sub-unit comprising a connecting line unit and one light emitting diode chip connected with the connecting line unit, the light emitting diode chip being located on a side of the connecting line unit away from the substrate substrate; a plurality of first electrode traces extending along the first direction, wherein each of the connecting line units comprises at least two pairs of electrical contact points, each of the pairs of electrical contact points comprising a first electrode contact point and a second electrode contact point, in at least one of the connecting line units, the first electrode contact points are electrically connected with each other, and the second electrode contact points are electrically connected with each other; the plurality of first electrode traces comprises a plurality of first type first electrode traces and a plurality of second type first electrode traces, at least one of the light emitting sub-units comprises a plurality of first light emitting sub-units and a plurality of second light emitting sub-units, the first light emitting sub-units are connected with the first type first electrode traces through the first electrode contact points, and the second light emitting sub-units are connected with the second type first electrode traces through the first electrode contact points; at least two of the second electrode contact points that are electrically connected with each other are arranged adjacent to each other, and at least two of the second electrode contact points are arranged between at least two of the first electrode contact points that are electrically connected with each other, the at least two of the second electrode contact points arranged between the at least two of the first electrode contact points are arranged in the first direction along with the at least two of the first electrode contact points.

2. The light panel of claim 1, wherein, the first type first electrode traces and the second type first electrode traces connected with a column of the light emitting sub-units arranged in the first direction are respectively located on two sides of the column of the light emitting sub-units.

3. The light panel of claim 1, wherein, each of the first type first electrode traces comprises a first sub-electrode trace and a second sub-electrode trace extending along the same line and insulated from each other, a part of the first light emitting sub-units close to the first sub-electrode trace are connected with the first sub-electrode trace, and a part of the first light emitting sub-units close to the second sub-electrode trace are connected with the second sub-electrode trace; each of the second type first electrode traces comprises a third sub-electrode trace and a fourth sub-electrode trace extending along the same line and insulated from each other, a part of the second light emitting sub-units close to the third sub-electrode trace are connected with the third sub-electrode trace, and a part of the second light emitting sub-units close to the fourth sub-electrode trace are connected with the fourth sub-electrode trace. 4.The light emitting panel according to claim 1, further comprising: a plurality of second electrode traces extending along the second direction, the second electrode traces being located between the first electrode traces and the substrate substrate, wherein each of the connecting line units further comprises a second electrode connecting part, the second electrode connecting part being arranged in the same layer as the first electrode traces, and the second electrode contact points in each of the connecting line units are connected with the second electrode traces through the second electrode connecting part.

5. The light panel of claim 4, wherein, The second electrode contact point and the second electrode connecting part are in an integrated structure.

6. The light panel of claim 4, wherein, In the first direction, the orthogonal projection of each second electrode trace on the substrate substrate overlaps with the orthogonal projection of one pair of electrical contact points and part of the second electrode connecting part on the substrate substrate.

7. The light panel of claim 4, wherein, Each of the light emitting units includes three light emitting sub-units of different colors arranged along the second direction, the second electrode traces include first type second electrode traces and second type second electrode traces, and one of the light emitting sub-units in the light emitting unit is connected to the first type second electrode traces, and the other two of the light emitting sub-units in the light emitting unit are connected to the second type second electrode traces.

8. The light panel of claim 4, wherein, Each of the connecting line units includes two pairs of electrical contact points, and each of the connecting line units further includes two first electrode connecting parts connected to the first electrode contact points, the first electrode connecting parts are located on the side of the first electrode contact points away from the second electrode contact points, the first electrode contact points are connected to the first electrode traces through the first electrode connecting parts, and at least part of the first electrode connecting parts has no overlap with the orthogonal projection of the second electrode traces on the substrate substrate.

9. A circuit board, comprising: a substrate substrate; a plurality of connecting line units arranged in a first direction and a second direction on the substrate substrate, a plurality of first electrode traces extending in the first direction, wherein each of the connecting line units includes at least two pairs of electrical contact points, each of the pairs of electrical contact points includes a first electrode contact point and a second electrode contact point, and in at least one of the connecting line units, the first electrode contact points are electrically connected to each other, and the second electrode contact points are electrically connected to each other; the plurality of first electrode traces includes a plurality of first type first electrode traces and a plurality of second type first electrode traces, at least one connecting line unit includes a plurality of first connecting line units and a plurality of second connecting line units, the first electrode contact points of the first connecting line units are connected to the first type first electrode traces, and the first electrode contact points of the second connecting line units are connected to the second type first electrode traces; at least two of the second electrode contact points electrically connected to each other are arranged adjacent to each other, and at least two second electrode contact points are arranged between at least two first electrode contact points electrically connected to each other, and the at least two second electrode contact points arranged between the at least two first electrode contact points are arranged along the first direction.

10. The circuit board of claim 9, wherein, The first type first electrode traces and the second type first electrode traces connected to a row of the connecting line units arranged along the first direction are respectively located on both sides of the row of the connecting line units.

11. The circuit board of claim 10, wherein, Each of the first electrode traces of the first type comprises a first sub-electrode trace and a second sub-electrode trace extending along the same line and insulated from each other, a portion of the plurality of first connection line units close to the first sub-electrode trace is connected to the first sub-electrode trace, and a portion of the plurality of first connection line units close to the second sub-electrode trace is connected to the second sub-electrode trace. Each of the first electrode traces of the second type comprises a third sub-electrode trace and a fourth sub-electrode trace extending along the same line and insulated from each other, a portion of the plurality of second connection line units close to the third sub-electrode trace is connected to the third sub-electrode trace, and a portion of the plurality of second connection line units close to the fourth sub-electrode trace is connected to the fourth sub-electrode trace.

12. The circuit board of claim 9, further comprising: a plurality of second electrode traces extending along the second direction, the second electrode traces being located on a side of the first electrode traces facing the substrate, wherein each of the connection line units further comprises a second electrode connection portion, the second electrode connection portion being disposed in the same layer as the first electrode traces, and the second electrode contact points in each of the connection line units are connected to the second electrode traces through the second electrode connection portion.

13. The circuit board of claim 12, wherein, In the first direction, a projection of each of the second electrode traces on the substrate overlaps with a projection of a pair of the electrical contact points and a portion of the second electrode connection portion on the substrate.

14. The circuit board of claim 12, wherein, Three adjacent connection line units arranged along the second direction form a connection line unit group, the second electrode traces comprise first type second electrode traces and second type second electrode traces, one of the connection line units in the connection line unit group is connected to the first type second electrode traces, and the other two of the connection line units in the connection line unit group are connected to the second type second electrode traces.

15. The circuit board of claim 12, wherein, Each of the connection line units comprises two pairs of electrical contact points, each of the connection line units further comprises two first electrode connection portions connected to the first electrode contact points, the first electrode connection portions are located on a side of the first electrode contact points away from the second electrode contact points, the first electrode contact points are connected to the first electrode traces through the first electrode connection portions, and at least a portion of the first electrode connection portions has no overlap with a projection of the second electrode traces on the substrate.

16. A display device comprising the light emitting panel of any one of claims 1-8, wherein, The light-emitting panel is a display panel.

Citation Information

Patent Citations

  • Drive backplate, little light emitting diode display panel and display

    CN208014703U