A photovoltaic panel silicon wafer preparation device

Abstract

The application relates to the technical field of photovoltaic panel production, and discloses a photovoltaic panel silicon wafer preparation equipment, which comprises a base, a top frame is fixedly assembled at the top of the base, a placing seat is rotationally connected to the top of the base, an auxiliary frame is fixedly assembled at the bottom of the inner wall of the placing seat, a cylinder is fixedly assembled at the top of the auxiliary frame, and a round rod is slidably sleeved on the inner wall of the cylinder. The side surface of the butt joint pipe drives the side surface of the electromagnetic ring and the side surface of the permanent magnet ring to be in abutment and be adsorbed, then the bottom plate is slid in the inner wall of the placing seat by the overheating of external sintering, and then the sintering frame and the bottom plate assist in preparing the silicon block, the placing seat drives the silicon block to move, the electric telescopic support drives the pressing plate to move, the bottom of the pressing plate limits the silicon block, then the electric telescopic rod one and the electric telescopic rod two drive the cutting blade to move, the cutting blade cuts the silicon block, the silicon wafer is stably prepared, and the silicon wafer is efficiently generated.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic panel manufacturing technology, specifically to a photovoltaic panel silicon wafer preparation equipment. Background Technology

[0002] The production process of photovoltaic panels can be divided into six main steps: silicon raw material preparation, silicon wafer preparation, cell manufacturing, module manufacturing, assembly and testing, and packaging and transportation. In order to assist in the stable production of photovoltaic panels, a photovoltaic panel silicon wafer preparation equipment is needed.

[0003] Traditional photovoltaic (PV) panel silicon wafer fabrication equipment involves a complex process: silicon powder is sintered at high temperatures to form silicon blocks, which are then drawn into silicon rods. These rods are then diced into wafers. A thin layer of silicon oxide is deposited onto the wafers using chemical vapor deposition (CVD). Next, photolithography is used to form the positive and negative electrodes. A PN junction is then formed on the wafer surface using diffusion. Finally, aluminum and silver electrodes are connected to the PN junction using metallization to form the solar cell. However, this traditional process is cumbersome, with the silicon block to rod and then wafer dicing being time-consuming and labor-intensive, impacting equipment efficiency. Furthermore, traditional equipment requires manual intervention to stabilize the wafer fabrication process. Summary of the Invention

[0004] This invention provides a photovoltaic panel silicon wafer manufacturing device to solve the problems mentioned in the background art.

[0005] This invention provides the following technical solution: a photovoltaic silicon wafer manufacturing equipment, comprising a base, a top frame fixedly mounted on the top of the base, a placement seat rotatably connected to the top of the base, an auxiliary frame fixedly mounted on the bottom of the inner wall of the placement seat, a cylinder fixedly mounted on the top of the auxiliary frame, a round rod slidably sleeved on the inner wall of the cylinder, a base plate fixedly mounted on the top of the round rod, and the side of the base plate slidably connected to the inner wall of the base, a support rod fixedly mounted on the top of the base, a pusher rotatably connected to the inner wall of the support rod, a cylinder slidably connected to the inner wall of the pusher, a motor fixedly mounted on the top of the support rod, and the output shaft of the motor fixedly sleeved to the top of the pusher, a push plate fixedly mounted on the side of the cylinder, an air inlet pipe fixedly mounted on the inner wall of the top frame, a solenoid valve pipe fixedly sleeved on the inner wall of the air inlet pipe, a feed pipe fixedly sleeved on the outer edge of the air inlet pipe, and a sintering frame fixedly mounted on the bottom of the feed pipe, a fixed magnet ring fixedly mounted on the inner wall of the placement seat, and the side of the fixed magnet ring adsorbs... The device includes an electromagnet ring, with a connecting pipe fixedly mounted on its side. The side of the connecting pipe is fixedly mounted to the bottom of a solenoid valve tube. A connecting frame is fixedly mounted on the inner wall of the top frame. An electric telescopic rod is fixedly mounted on the side of the connecting frame. A fixing frame is fixedly mounted on the side of the electric telescopic rod. An electric telescopic rod is fixedly mounted on the side of the fixing frame. A fixed magnet is fixedly mounted on the side of the electric telescopic rod. The side of the fixed magnet is slidably connected to the side of the fixing frame. There are two electric telescopic rods. A fixed magnet is fixedly mounted on the bottom of the electric telescopic rod furthest from the fixed magnet, and the side of the fixed magnet is attracted to the side of the fixed magnet. A cutting blade is fixedly mounted on the side of the fixed magnet. An auxiliary frame is fixedly mounted on the inner wall of the top frame. A coating photolithography box is fixedly mounted on the bottom of the auxiliary frame. A side rod is fixedly mounted on the bottom of the auxiliary frame. A connecting rod is fixedly mounted on the side of the side rod, and the side of the connecting rod is fixedly mounted to the side of the sliding frame.

[0006] As a preferred embodiment of the present invention, a limiting frame is fixedly mounted on the top of the inner wall of the auxiliary frame, a tension spring is fixedly connected to the top of the limiting frame, the top of the tension spring is fixedly connected to the bottom of the round rod, a fixed magnet frame one is fixedly sleeved on the inner wall of the base plate, and an electromagnet frame two is fixedly mounted on the inner wall of the placement seat, and the inner wall of the electromagnet frame two is attracted to the side of the fixed magnet frame one.

[0007] As a preferred embodiment of the present invention, an electric telescopic rod three is fixedly mounted on the bottom of the push frame, an electromagnetic valve tube two is fixedly mounted on the bottom of the electric telescopic rod three, a suction cup is fixedly mounted on the bottom of the electromagnetic valve tube two, an electric telescopic rod four is fixedly mounted on the top of the inner wall of the push frame, and the bottom of the electric telescopic rod four is fixedly mounted to the top of the cylinder.

[0008] As a preferred embodiment of the present invention, a sliding frame is fixedly mounted on the top of the placement seat, an electromagnet assembly is fixedly mounted on the side of the inner wall of the sliding frame, a fixed magnet plate is slidably connected to the inner wall of the placement seat, and a side plate is fixedly mounted on the top of the fixed magnet plate, and the side of the fixed magnet plate is attracted to the inner wall of the electromagnet assembly.

[0009] As a preferred embodiment of the present invention, an electric telescopic frame is fixedly mounted on the top of the support rod, and a pressure plate is fixedly mounted on the bottom of the electric telescopic frame.

[0010] As a preferred embodiment of the present invention, a U-shaped frame is fixedly mounted on the top of the base, a motor is fixedly mounted on the top of the inner wall of the U-shaped frame, a drive gear is fixedly sleeved on the output shaft of the motor, a gear ring is fixedly mounted on the outer edge of the placement seat near the bottom, and the protruding teeth on the outer edge of the gear ring mesh with the protruding teeth on the outer edge of the drive gear, an electric push rod is fixedly mounted on the top of the U-shaped frame, and a ramp frame is fixedly mounted on the side of the electric push rod, and a transmission mechanism is provided on the side of the ramp frame.

[0011] The present invention has the following beneficial effects:

[0012] 1. This photovoltaic silicon wafer fabrication equipment utilizes the cooperation of a solenoid valve tube and a connecting tube. The side of the connecting tube drives the side of the electromagnet ring and the side of the fixed magnet ring to come into contact and adhere. Then, the external sintering process generates heat, which helps push the base plate to slide within the inner wall of the placement seat. The sintering frame and the base plate then assist in the fabrication of the silicon block. The placement seat moves the silicon block, and the electric telescopic frame moves the pressure plate, thus limiting the silicon block at the bottom. Then, the electric telescopic rods one and two move the cutting blade, which cuts the silicon block to facilitate stable silicon wafer fabrication and efficient silicon wafer generation.

[0013] 2. This photovoltaic silicon wafer fabrication equipment uses a connecting rod and a sliding frame in cooperation. The connecting rod drives the sliding frame to move, and then an electromagnet assembly assists in moving a fixed magnet plate within the inner wall of the sliding frame. The fixed magnet plate then drives the side plate to adjust its height, thereby using the side plate to assist in positioning the silicon wafer. A coating and photolithography box is used to coat the silicon wafer with silicon oxide and perform photolithography. A pusher and a suction cup are used to assist in adjusting the position of the silicon wafer. Finally, a cylinder uses a pusher plate to stably transport the photovoltaic cell through the inclined frame to the top of the transmission mechanism. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0015] Figure 2 This is a schematic diagram of the placement base structure of the present invention;

[0016] Figure 3 This is a schematic diagram of the front section structure of the present invention;

[0017] Figure 4 For the present invention Figure 3 Enlarged structural diagram at point A in the middle;

[0018] Figure 5 This is a schematic diagram of the inclined frame structure of the present invention;

[0019] Figure 6 For the present invention Figure 5 Enlarged structural diagram at point B;

[0020] Figure 7 This is a schematic diagram of the front section structure of the side rod of the present invention;

[0021] Figure 8 For the present invention Figure 7 Enlarged structural diagram at point C;

[0022] Figure 9 This is a schematic diagram of the structure of the present invention from another angle.

[0023] In the diagram: 1. Base; 2. Top frame; 3. Placement seat; 4. Auxiliary frame; 5. Limiting frame; 6. Tension spring; 7. Cylinder; 8. Round rod; 9. Base plate; 10. Fixed magnet frame one; 11. Electromagnet frame two; 12. Fixed magnet ring; 13. Electromagnet ring; 14. Connecting pipe; 15. Sintering frame; 16. Solenoid valve pipe one; 17. Feed pipe; 18. Air inlet pipe; 19. Connecting frame; 20. Electric telescopic rod one; 21. Electric telescopic rod two; 22. Fixed magnet plate one; 23. Cutting blade; 24. Fixed magnet plate two; 25. Fixing frame; 26. 27. Support rod; 28. Electric telescopic frame; 29. ​​Pressure plate; 30. Push frame; 31. Electric telescopic rod four; 32. Cylinder; 33. Push plate; 34. Electric telescopic rod three; 35. Solenoid valve tube two; 36. Suction cup; 37. Motor; 38. Slide frame; 39. Electromagnet assembly; 40. Fixed magnet plate; 41. Side plate; 42. Auxiliary frame; 43. Coating lithography box; 44. Side rod; 45. Connecting rod; 46. Gear ring; 47. Drive gear; 48. Motor; 49. Electric push rod; 50. Inclined frame; 51. Transmission mechanism; 52. U-shaped frame. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] Please see Figures 1-9A photovoltaic silicon wafer manufacturing device includes a base 1, a top frame 2 fixedly mounted on the top of the base 1, a placement seat 3 rotatably connected to the top of the base 1, an auxiliary frame 4 fixedly mounted on the bottom of the inner wall of the placement seat 3, a cylinder 7 fixedly mounted on the top of the auxiliary frame 4, a round rod 8 slidably sleeved on the inner wall of the cylinder 7, a base plate 9 fixedly mounted on the top of the round rod 8, and the side of the base plate 9 slidably connected to the inner wall of the base 1. A support rod 26 fixedly mounted on the top of the base 1, a pusher 29 rotatably connected to the inner wall of the support rod 26, a cylinder 31 slidably connected to the inner wall of the pusher 29, and a motor 36 fixedly mounted on the top of the support rod 26. The output shaft of the motor 36 is fixedly connected to the top of the pusher 29. The side of the cylinder 31 is fixedly fitted with a pusher plate 32. The inner wall of the top frame 2 is fixedly fitted with an air inlet pipe 18. The inner wall of the air inlet pipe 18 is fixedly fitted with a solenoid valve pipe 16. The outer edge of the air inlet pipe 18 is fixedly fitted with a feed pipe 17. The bottom of the feed pipe 17 is fixedly fitted with a sintering frame 15. Through the cooperation of the motor 36 and the pusher 29, the motor 36 drives the pusher 29 to adjust the position of the inner wall of the support rod 26. Then, the cylinder 31 drives the pusher plate 32 to adjust the position, thereby using the pusher plate 32 to push the photovoltaic cell to move.

[0026] In a preferred embodiment, a limiting frame 5 is fixedly mounted on the top of the inner wall of the auxiliary frame 4. A tension spring 6 is fixedly connected to the top of the limiting frame 5. The top of the tension spring 6 is fixedly connected to the bottom of the round rod 8. A fixed magnet frame 10 is fixedly sleeved on the inner wall of the base plate 9. An electromagnet frame 21 is fixedly mounted on the inner wall of the placement seat 3. The inner wall of the electromagnet frame 21 is attracted to the side of the fixed magnet frame 10. Through the cooperation of the limiting frame 5 and the tension spring 6, the tension spring 6 assists in limiting the round rod 8, thereby using the round rod 8 to provide auxiliary support for the base plate 9. The inner wall of the electromagnet frame 21 is attracted to the side of the fixed magnet frame 10, thereby helping the base plate 9 to be stably limited in the inner wall of the placement seat 3.

[0027] In a preferred embodiment, a fixed magnet ring 12 is fixedly mounted on the inner wall of the placement seat 3. An electromagnet ring 13 is attracted to the side of the fixed magnet ring 12, and a connecting pipe 14 is fixedly mounted on the side of the electromagnet ring 13. The side of the connecting pipe 14 is fixedly mounted to the bottom of the solenoid valve pipe 16. Through the cooperation of the fixed magnet ring 12 and the electromagnet ring 13, the fixed magnet ring 12 and the electromagnet ring 13 are attracted to each other, thereby helping to stably supply the gas inside the connecting pipe 14 to the inner cavity of the placement seat 3.

[0028] In a preferred embodiment, a connecting frame 19 is fixedly mounted on the inner wall of the top frame 2, an electric telescopic rod 20 is fixedly mounted on the side of the connecting frame 19, a fixing frame 25 is fixedly mounted on the side of the electric telescopic rod 20, an electric telescopic rod 21 is fixedly mounted on the side of the fixing frame 25, and a fixed magnet 22 is fixedly mounted on the side of the electric telescopic rod 21. The side of the fixed magnet 22 is slidably connected to the side of the fixing frame 25. Through the cooperation of the electric telescopic rod 20 and the electric telescopic rod 21, the fixed magnet 22 is assisted in adjusting its position on the inner wall of the fixing frame 25.

[0029] In a preferred embodiment, there are two electric telescopic rods 21, and the bottom of the electric telescopic rod 21 away from the fixed magnet plate 22 is fixedly equipped with a fixed magnet plate 24, and the side of the fixed magnet plate 24 is attracted to the side of the fixed magnet plate 22. A cutting blade 23 is fixedly equipped on the side of the fixed magnet plate 24. By adding the cutting blade 23, the silicon block is cut by the cutting blade 23, thereby assisting in the stable generation of silicon wafers.

[0030] In a preferred embodiment, an electric telescopic rod 33 is fixedly mounted on the bottom of the pusher 29, a solenoid valve tube 34 is fixedly mounted on the bottom of the electric telescopic rod 33, a suction cup 35 is fixedly mounted on the bottom of the solenoid valve tube 34, and an electric telescopic rod 40 is fixedly mounted on the top of the inner wall of the pusher 29. The bottom of the electric telescopic rod 40 is fixedly mounted on the top of the cylinder 31. Through the cooperation of the electric telescopic rod 33 and the solenoid valve tube 34, the electric telescopic rod 33 drives the solenoid valve tube 34 to adjust its position. The solenoid valve tube 34 then assists in venting the suction cup 35, thereby helping the bottom of the suction cup 35 to separate from the top of the silicon wafer. With the addition of the cylinder 31, the pusher 29 is moved stably by the cylinder 31.

[0031] In a preferred embodiment, a sliding frame 37 is fixedly mounted on the top of the placement base 3, an electromagnet assembly 38 is fixedly mounted on the side of the inner wall of the sliding frame 37, a fixed magnet plate 39 is slidably connected to the inner wall of the placement base 3, and a side plate 40 is fixedly mounted on the top of the fixed magnet plate 39. The side of the fixed magnet plate 39 is attracted to the inner wall of the electromagnet assembly 38. Through the cooperation of the electromagnet assembly 38 and the fixed magnet plate 39, the inner wall of the electromagnet assembly 38 attracts the fixed magnet plate 39, thereby assisting the side of the side plate 40 in adjusting its position on the inner wall of the sliding frame 37.

[0032] In a preferred embodiment, an electric telescopic frame 27 is fixedly mounted on the top of the support rod 26, and a pressure plate 28 is fixedly mounted on the bottom of the electric telescopic frame 27. Through the cooperation of the electric telescopic frame 27 and the pressure plate 28, the electric telescopic frame 27 drives the pressure plate 28 to adjust its position, and then the bottom of the pressure plate 28 clamps and limits the top of the silicon block, thereby ensuring that the silicon block is stably cut.

[0033] In a preferred embodiment, an auxiliary frame 41 is fixedly mounted on the inner wall of the top frame 2, a coating lithography box 42 is fixedly mounted on the bottom of the auxiliary frame 41, a side rod 43 is fixedly mounted on the bottom of the auxiliary frame 41, a connecting rod 44 is fixedly mounted on the side of the side rod 43, and the side of the connecting rod 44 is fixedly mounted to the side of the sliding frame 37. By adding the coating lithography box 42, a chemical vapor deposition device and a lithography device are added to the inner wall of the coating lithography box 42, thereby using the coating lithography box 42 to perform silicon oxide coating and lithography on the silicon wafer.

[0034] In a preferred embodiment, a U-shaped frame 51 is fixedly mounted on the top of the base 1, and a motor 47 is fixedly mounted on the top of the inner wall of the U-shaped frame 51. The output shaft of the motor 47 is fixedly sleeved with a drive gear 46. A gear ring 45 is fixedly mounted on the outer edge of the placement seat 3 near the bottom, and the protruding teeth on the outer edge of the gear ring 45 mesh with the protruding teeth on the outer edge of the drive gear 46. An electric push rod 48 is fixedly mounted on the top of the U-shaped frame 51, and a ramp frame 49 is fixedly mounted on the side of the electric push rod 48. A transmission mechanism 50 is provided on the side of the ramp frame 49. Through the cooperation of the motor 47 and the drive gear 46, the motor 47 drives the drive gear 46 to rotate, thereby driving the gear ring 45 to rotate, and the gear ring 45 drives the placement seat 3 to rotate, thereby assisting the silicon wafer to be stably processed until the silicon wafer moves to the top of the transmission mechanism 50 after passing through the ramp frame 49.

[0035] Working principle: When the device is in use, the side of the connecting pipe 14 drives the side of the electromagnet ring 13 and the side of the fixed magnet ring 12 to come into contact and attract each other. Then, the overheating during external sintering helps push the base plate 9 to slide in the inner wall of the placement seat 3. The sintering frame 15 and the base plate 9 then assist in the preparation of the silicon block. The placement seat 3 then moves the silicon block, and the electric telescopic frame 27 moves the pressure plate 28, thereby limiting the silicon block with the bottom of the pressure plate 28. Then, the electric telescopic rod 1 20 and electric telescopic rod 21 move the cutting blade 23, thereby cutting the silicon block with the cutting blade 23. The silicon wafer is stably prepared, which in turn assists in the efficient generation of silicon wafers. The connecting rod 44 drives the sliding frame 37 to move. Then, the electromagnet group 38 assists in driving the fixed magnet plate 39 to move in the inner wall of the sliding frame 37. The fixed magnet plate 39 then drives the side plate 40 to adjust its height, thereby using the side plate 40 to assist in limiting the silicon wafer. The coating photolithography box 42 is used to coat the silicon wafer with silicon oxide and perform photolithography. The pusher 29 uses the suction cup 35 to assist in adjusting the position of the silicon wafer. Then, the cylinder 31 drives the photovoltaic cell through the pusher plate 32 to stably pass through the inclined frame 49 to the top of the transmission mechanism 50 for transmission.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A photovoltaic panel silicon wafer fabrication device, comprising a base (1), characterized in that: A top frame (2) is fixedly mounted on the top of the base (1). A placement seat (3) is rotatably connected to the top of the base (1). An auxiliary frame (4) is fixedly mounted on the bottom of the inner wall of the placement seat (3). A cylinder (7) is fixedly mounted on the top of the auxiliary frame (4). A round rod (8) is slidably sleeved on the inner wall of the cylinder (7). A base plate (9) is fixedly mounted on the top of the round rod (8), and the side of the base plate (9) is slidably connected to the inner wall of the base (1). A support rod (26) is fixedly mounted on the top of the base (1). A pusher (29) is rotatably connected to the inner wall of the support rod (26). A cylinder (31) is slidably connected to the inner wall of the pusher (29). A motor (36) is fixedly mounted on the top of the support rod (26), and the output shaft of the motor (36) is fixedly sleeved with the top of the push frame (29). A push plate (32) is fixedly mounted on the side of the cylinder (31). An air inlet pipe (18) is fixedly mounted on the inner wall of the top frame (2). A solenoid valve pipe (16) is fixedly sleeved on the inner wall of the air inlet pipe (18). A feed pipe (17) is fixedly sleeved on the outer edge of the air inlet pipe (18), and a sintering frame (15) is fixedly mounted on the bottom of the feed pipe (17). A fixed magnet ring (12) is fixedly mounted on the inner wall of the placement seat (3). An electromagnet ring (13) is attracted to the side of the fixed magnet ring (12), and the electromagnet ring (13) is... The top frame (2) is fixedly fitted with a connecting pipe (14) on its side. The side of the connecting pipe (14) is fixedly fitted with the bottom of the solenoid valve pipe (16). The inner wall of the top frame (2) is fixedly fitted with a connecting frame (19). The side of the connecting frame (19) is fixedly fitted with an electric telescopic rod (20). The side of the electric telescopic rod (20) is fixedly fitted with a fixing frame (25). The side of the fixing frame (25) is fixedly fitted with an electric telescopic rod (21). The side of the electric telescopic rod (21) is fixedly fitted with a fixed magnet plate (22). The side of the fixed magnet plate (22) is slidably connected to the side of the fixing frame (25). The electric telescopic rod (21) has several... Two electric telescopic rods (21) are provided, and a fixed magnet (24) is fixedly mounted at the bottom of the electric telescopic rod (21) which is far away from the fixed magnet (22). The side of the fixed magnet (24) is attracted to the side of the fixed magnet (22). A cutting blade (23) is fixedly mounted on the side of the fixed magnet (24). An auxiliary frame (41) is fixedly mounted on the inner wall of the top frame (2). A coating photolithography box (42) is fixedly mounted at the bottom of the auxiliary frame (41). A side rod (43) is fixedly mounted at the bottom of the auxiliary frame (41). A connecting rod (44) is fixedly mounted on the side of the side rod (43). The side of the connecting rod (44) is fixedly mounted to the side of the sliding frame (37).

2. The photovoltaic panel silicon wafer preparation equipment according to claim 1, characterized in that: A limiting frame (5) is fixedly mounted on the top of the inner wall of the auxiliary frame (4). A tension spring (6) is fixedly connected to the top of the limiting frame (5). The top of the tension spring (6) is fixedly connected to the bottom of the round rod (8). A fixed magnet frame (10) is fixedly sleeved on the inner wall of the base plate (9). An electromagnet frame (11) is fixedly mounted on the inner wall of the placement seat (3). The inner wall of the electromagnet frame (11) is attracted to the side of the fixed magnet frame (10).

3. The photovoltaic panel silicon wafer preparation equipment according to claim 1, characterized in that: The bottom of the pusher (29) is fixedly equipped with an electric telescopic rod three (33), the bottom of the electric telescopic rod three (33) is fixedly equipped with a solenoid valve tube two (34), the bottom of the solenoid valve tube two (34) is fixedly equipped with a suction cup (35), the top of the inner wall of the pusher (29) is fixedly equipped with an electric telescopic rod four (30), and the bottom of the electric telescopic rod four (30) is fixedly equipped with the top of the cylinder (31).

4. The photovoltaic panel silicon wafer preparation equipment according to claim 1, characterized in that: The top of the placement seat (3) is fixedly fitted with a sliding frame (37), and the side of the inner wall of the sliding frame (37) is fixedly fitted with an electromagnet assembly (38). The inner wall of the placement seat (3) is slidably connected with a fixed magnet plate (39), and the top of the fixed magnet plate (39) is fixedly fitted with a side plate (40), and the side of the fixed magnet plate (39) is attracted to the inner wall of the electromagnet assembly (38).

5. The photovoltaic panel silicon wafer preparation equipment according to claim 1, characterized in that: The top of the support rod (26) is fixedly fitted with an electric telescopic frame (27), and the bottom of the electric telescopic frame (27) is fixedly fitted with a pressure plate (28).

6. The photovoltaic panel silicon wafer preparation equipment according to claim 1, characterized in that: A U-shaped frame (51) is fixedly mounted on the top of the base (1). A motor (47) is fixedly mounted on the top of the inner wall of the U-shaped frame (51). A drive gear (46) is fixedly sleeved on the output shaft of the motor (47). A gear ring (45) is fixedly mounted on the outer edge of the placement seat (3) near the bottom. The protruding teeth on the outer edge of the gear ring (45) mesh with the protruding teeth on the outer edge of the drive gear (46). The top of the U-shaped frame (51) An electric push rod (48) is fixedly mounted, and a ramp frame (49) is fixedly mounted on the side of the electric push rod (48). The ramp frame (49) is provided with a transmission mechanism (50) on its side.

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