Electronic assembly and method for producing an electronic assembly
By using welding and injection molding encapsulation technology of cylindrical housing and sickle-shaped or banana-shaped plug pins in the electronic switching device, the problem of insufficient sealing in the prior art is solved, and the effect of simplifying manufacturing and reducing costs is achieved.
Patent Information
- Application Number
- CN202410835546.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-06-30
- Filing Date
- 2024-06-26
- Publication Date
- 2024-12-31
AI Technical Summary
The existing electronic switching devices have problems with insufficient sealing properties during the manufacturing process, especially the adverse sealing effect caused by the use of epoxy resin, and the manufacturing process is complicated and costly.
Using cylindrical shells and sickle-shaped or banana-shaped plug pins, assembled structural units are formed by welding and injection molding encapsulation techniques, and injection molded outer covers are manufactured using low-pressure injection molding methods to achieve sealing and connection, simplifying the manufacturing process.
It realizes simple manufacturing of electronic components and part replacement, ensures sealing and stability, reduces manufacturing costs, and supports subsequent repair and recycling.
Smart Images
Figure CN119231228A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to an electronic component and a method for manufacturing such an electronic component.An example of such an electronic component may be a proximity switch or any other electronic switching device. Background Art
[0002] Figure 5 , an electronic switching device in the prior art is shown, as disclosed in DE 10 2017 201 320 B3. The electronic switching device has a housing with a cylindrical section 5. A circuit carrier 2 and a sensor unit 1 are placed in the cylindrical section 5. The sensor unit 1 is implemented in the form of a wound front coil in this application example in the prior art. The sensor unit defines the front side of the electronic switching device, wherein the plug 3 defines the back side of the electronic switching device.
[0003] In order to achieve sealing of electronic components in the interior of the housing, DE 10 2017 201 320 B3 describes a situation in which a plug 3 is pushed into the housing from the rear side and a threaded tube 6 having a perforated plate 7 and a cylindrical section 5 is crimped. A soft PU foam 4 made of a soft foam is arranged in the interior of the electronic switching device to achieve sealing. DE 10 2017 201 320 B3 differs from the prior art in that the soft foam is used instead of epoxy resin, which is said to result in an unfavorable sealing effect.
[0004] Other relevant prior art is described in DE 10 2017 129 687 B4 and EP 1 695 037 B1. EP 1 695 037 B1 describes a structural example of a switch device having a shielding sleeve for shielding electromagnetic radiation. Summary of the invention
[0005] Starting from the above-mentioned prior art, the object of the present invention is to specify a simplified method, in particular for the automated production of an electronic component, and an electronic component which can be produced cost-effectively.
[0006] In order to solve this problem, an electronic component and a method for producing an electronic component are proposed according to the appended independent claims.
[0007] The electronic assembly has a housing, a plug, an electronic circuit board, a sensor circuit board and a front cover. The housing can have a cylindrical and in particular tubular configuration. Any other housing shape is also possible. The housing usually has an axial extension along the extension direction from the front side to the back side. The housing sequentially receives the plug, the electronic circuit board, the sensor circuit board and the front cover from the back side toward the front side.
[0008] The plug can be produced as a separate component and have, for example, a plug housing in which one or more pins are arranged, which ensure the plug function.
[0009] For example, the plug contacts a first end of the electronic circuit board. The electronic circuit board can be, for example, a planar element with an electronic module mounted thereon. At a second end of the electronic circuit board, the sensor circuit board can then correspondingly contact the electronic circuit board.
[0010] The plug, the electronic circuit board and the sensor circuit board form in particular an assembled unit. The assembled unit is a unit in which the electronic circuit board and the sensor circuit board are connected to one another, for example by welding and / or by additional overmolding, for example by means of a hot melt method, and thus form an assembled unit. The unit can then be pushed into the housing as a whole from the front.
[0011] After the assembled unit has been pushed in, for example, an axial end face of the plug interacts with a collar which is arranged on the rear side of the housing so that the plug cannot be pulled out from the rear side of the housing.
[0012] The front side of the housing is closed and / or sealed, for example, by crimping around a front cover, so that the assembly is fixed in the housing and pressed against the collar.
[0013] The electronic assembly can thus be produced in a simple manner and replacement of individual parts is also ensured.
[0014] According to a further development of the invention, the plug has a plug housing and a plug pin. The plug pin is held in the plug housing. The back end of the pin is preferably designed to be sickle-shaped, with which the contact with the first end of the electronic circuit board is made. Even if a plurality of "pins" are described in the present case, only a single pin may be provided, which forms the plug function.
[0015] A sickle-shaped or banana-shaped configuration is particularly advantageous in combination with a contact pad on the circuit board, at which the pin establishes contact with the electronic circuit board, in order to enable simple contacting and fixing.
[0016] The pins are in particular arranged in the plug housing in such a way that the sickle-shaped elements lie opposite one another so that they position the electronic circuit board in the manner of a clip on the corresponding contact pads between themselves and pre-fix the contact pads before they are then connected to the contact pads by means of soldering, in particular in a selective soldering process, as will be described later.
[0017] The pins can be pulled out of the solid material. This allows for a more stable design and a connection that is less mechanically susceptible.
[0018] The pins are made of brass, for example, in particular, but any other electrically conductive material, in particular a metallic material, may also be used.
[0019] According to a further development of the present invention, a grounding element can be provided, which is arranged between the electronic circuit board and the housing at the end of the plug housing on the electronic circuit board side. The grounding element is made of metal in particular. However, any other conductive material can also be used. The housing is preferably also made of a conductive material, such as metal.
[0020] The grounding element can be formed by a sheet metal ring having at least one soldering projection for contacting a grounding contact pad of an electronic circuit board, which contact pad is connected to a capacitor on the electronic circuit board. The sheet metal ring can also have at least one press-in projection extending therefrom, which produces an electrically conductive contact with the housing. In particular, exactly two soldering projections are provided, which receive the electronic circuit board between themselves. Advantageously, four press-in projections are also provided on the sheet metal ring. The press-in projection is, for example, a local radial widening of the ring.
[0021] According to an advantageous development of the invention, the assembled structural unit is at least partially surrounded by an injection-molded housing. For example, the electronic circuit board and the sensor circuit board can be surrounded by an injection-molded housing, and the injection molding can extend to the plug, so that an additional connection is established between the circuit board and the plug. The injection-molded housing can be produced by means of a low-pressure injection molding method, and the structural unit thus forms a non-lost and integrated unit, and the structural unit together with its injection-molded housing is inserted into the housing.
[0022] In order to ensure the function of sensitive electronic components such as circuit boards, sensors or other electronic components, it is crucial to protect them from adverse environmental influences. Here, for example, a low-pressure injection molding method is used, which can achieve effective sealing of the electronic components.
[0023] By using different materials, individual requirements in terms of flexibility, impact resistance, shock absorption, moisture resistance, sealing, UV protection, chemical resistance and color can be taken into account. This ensures an optimal match to the specific requirements of the respective component.
[0024] The component is placed in the mold using the low-pressure injection molding method and directly encapsulated with the molten adhesive material. Injection pressures of 1.5 to 40 bar and an operating temperature range of -50°C to +200°C are used. This casting technology can not only protect the component from corrosion and environmental influences, but also integrate holes and threads to ensure further improved functionality.
[0025] The contour of the injection-molded cover, which also has a tubular shape, can correspond to the inner contour of the housing (as long as this is a housing with a tubular cross section). However, the contour of the injection-molded cover takes into account, for example, the thermal expansion coefficient of the thermoplastic and leaves a defined buffer area for thermal expansion to the housing. The structural unit with the injection-molded cover is thus held at the front only by the side faces of the flange of the housing and the flange is held on the back, and the electronic assembly can therefore also be disassembled again relatively easily. The use of thermoplastics also enables subsequent mechanical removal of the plastic due to their low adhesion compared to typical casting materials, in particular based on thermosetting or elastomeric plastic materials (for example epoxy resins or thermosetting plastic materials or silicone resin materials or elastomeric plastic materials), thus enabling repair work on the circuit board or also recycling of individual components.
[0026] The injection-molded outer shell can have a sealing lip integrally thereon, for example if the injection-molded outer shell is designed to be tubular, the sealing lip can surround the tube in order to ensure a watertight seal with respect to the inner wall of the housing.
[0027] The electronic assembly described above very generally may for example consist of a proximity switch or any other electronic switch or include such a switch. Other sensor types are as follows: inductive sensors, capacitive sensors, pressure sensors, gas sensors, temperature sensors, humidity sensors, ultrasonic sensors, vibration recognition sensors, UV sensors.
[0028] Furthermore, a method for producing an electronic component is specified. The component may be the component described above.
[0029] The method features given below for the method can also be provided in the form of a device in an electronic component.
[0030] In the method, the back ends of the pins of the plug are first brought into contact with the first end of the electronic circuit board. Furthermore, the contacts of the sensor circuit board are brought into contact with the corresponding contacts of the electronic circuit board at the second end of the electronic circuit board. The plug of the electronic circuit board thus forms the sensor circuit board as an assembled structural unit. The two contacting steps described above can also be carried out without problems in the reverse order.
[0031] The assembled structural unit can then advantageously have an injection-molded outer casing in an integral manner, which is produced in particular by means of a low-pressure injection molding method.
[0032] The structural unit is then inserted into the housing from the front side to the back side until the axial end face of the plug is supported on the flange on the back side of the housing. In addition, the housing is closed on the front side with a cover and the back side of the housing is crimped around the front cover, so that the structural unit is fixed in the housing and pressed against the flange.
[0033] Before the cover is inserted into the housing, the cover can also already be arranged or mounted on the front side of the structural unit and therefore does not have to be installed only after the structural unit has been inserted.
[0034] According to an advantageous improvement of the invention, the method can also include a step of encapsulating at least parts of the structural unit by injection molding, so that the structural unit is at least partially surrounded by an injection molded outer cover. For example, the injection molding can extend to the plug so that other elements of the building unit are better connected to the plug.
[0035] The injection-molded cover is advantageously made of thermoplastics. The contour of the injection-molded cover takes into account, for example, the thermal expansion coefficient of the thermoplastic and releases a defined buffer region for thermal expansion to the housing. The injection-molded cover can be manufactured by means of the low-pressure injection molding method described above.
[0036] The contacting of the rear ends of the pins of the plug with the first end of the circuit board and alternatively or additionally the contacting of the contacts of the sensor circuit board with corresponding contacts of the electronic circuit board and the second end of the electronic circuit board can be performed by means of a selective soldering process.
[0037] In short, selective soldering replaces manual soldering in component manufacturing. Selective soldering is an automated 3D soldering method controlled by software. Here, X, Y and Z coordinates are determined on the circuit board. The coordinates indicate at which locations on the circuit board the hot solder is deposited in order to solder very specific components. For example, a conical nozzle is moved toward the circuit board from below and the soldering points are placed in a punctiform manner. The process of selective soldering can also be recorded as a video, for example.
[0038] Selective soldering can also be performed with mini-waves. In particular, selective soldering with mini-waves is possible with a large number of soldering points. Mini-waves can already be used around the soldering area with a free space of 2 mm. With quickly replaceable nozzle groups, this method can be used flexibly for different soldering points.
[0039] The selective soldering method is derived from wave soldering, where the soldering area is limited by reducing the solder wave or lowering the solder bath to a small soldering nozzle.
[0040] In this method, the workpiece is immersed in a "stationary" mini-wave. In order to remove the oxide scale that has formed on the surface, the solder wave flows inside the nozzle, that is to say inside. In order to reduce the oxide formation at the nozzle outlet and improve the welding, the nozzle is flushed with nitrogen, for example.
[0041] Thus, with a single wave, for example, contact can be established at the first end and / or the second end of the electronic circuit board. Thus, all contacts between the sensor circuit board and the electronic circuit board or between the pin and the electronic circuit board can be established in one method process or in two selective soldering method steps (one for the sensor-side end and one for the plug-side end), when, for example, the wave moves over the contact area in one process.
[0042] The above-described method can be carried out automatically and the individual steps in particular must not be carried out manually. BRIEF DESCRIPTION OF THE DRAWINGS
[0043] Further advantageous embodiments are discussed with reference to the embodiments described below in conjunction with the drawings.
[0044] In the attached picture:
[0045] Figure 1a A design scheme of the electronic assembly according to the present invention in its joining direction is shown, in which the parts are joined;
[0046] Figure 1b A side view of the structural unit consisting of a plug, an electronic circuit board and a sensor circuit board is shown, wherein a front cover is already provided on the front side;
[0047] Figure 1c Show Figure 1b A cross-sectional view of a structural unit inserted into a housing;
[0048] Figure 2a A side view showing the plug housing and the electronic circuit board connected thereto,
[0049] Figure 2b Show Figure 2a The corresponding side view of the plug housing without the electronic circuit board (see Figure 2c along the direction of arrow B),
[0050] Figure 2c An oblique view of the plug housing is shown,
[0051] Figure 3a The plug housing is shown with Figure 2b The view in the figure is offset by 90 degrees from the other side view (see Figure 2c along the direction of arrow D),
[0052] Figure 3b A view showing the side of the plug housing pointing toward the electronic circuit board,
[0053] Figure 3c A schematic diagram showing how the plug housing with the electronic circuit board mounted thereon is held in the housing 100,
[0054] Figure 4a The arrangement consisting of a plug housing and an electronic circuit board connected thereto is shown. Figure 2c Top view in the direction of arrow D,
[0055] Figure 4b A section of an electronic circuit board and its end, which is connected to a sensor circuit board, are shown.
[0056] Figure 4c An oblique view showing the connection area between the electronic circuit board and the sensor circuit board,
[0057] Figure 4d Show Figure 4b A side view of the arrangement in
[0058] Figure 4e a simplified diagram showing the connections between the contacts of the sensor circuit board and the corresponding contacts of the electronic circuit board, and
[0059] Figure 5 A structural unit is shown as it is described in DE 10 2017 201 320 B3. DETAILED DESCRIPTION
[0060] Figure 1a The housing is indicated by reference numeral 100 .
[0061] In the present case, the housing is designed to be cylindrical, ie tubular. The housing 100 therefore has an axial direction.
[0062] The housing 100 has a front opening 101 at its front side.
[0063] On the back side of the housing 100 (such as Figure 1c A flange 102 is provided (as can be seen in FIG. 1 ), which is formed by the inwardly bent end of the housing 100 .
[0064] The housing 100 also has a rear opening 103 on the rear side in any case, the cross section of which is smaller than the front opening 101 .
[0065] If Figure 1c As can be seen from the cross-sectional view in FIG. 1 , the housing has a cylindrical inner circumference 104 on the inside.
[0066] The structural unit 105 described below engages in the front opening 101 in the housing.
[0067] The housing is then crimped on its front side and thus placed at least partially around the edge of one of the front covers 106, so that the structural unit 105 is fixedly held in the housing and the axial end face of the plug 107 interacts with the flange 102, which Figure 1c In this case, in particular the axial end face of the plug 107 is supported on the flange 102 in the axial direction.
[0068] exist Figure 1a Other parts of the electronic assembly can be seen in the figure.
[0069] These parts are the plug 107 , the electronic circuit board 108 and the sensor circuit board 109 .
[0070] In this example, the front cover 106 is not considered as part of the structural unit 105 but as a separate element.
[0071] The plug 107 , the electronic printed circuit board 108 and the sensor printed circuit board 109 are connected to one another by subsequent soldering, for example by selective soldering in the present case.
[0072] The components provided in this example, namely the plug 107, the electronic circuit board 108 and the sensor circuit board 109, form a structural unit 105. Figure 1b Shown in side view.
[0073] The structural element 105 is surrounded by an injection molded housing 110. Figure 1a The injection-molded housing 110 can be produced by means of a low-pressure injection molding method.
[0074] In the present exemplary embodiment, the injection-molded casing 110 has a thickening on a second side located at the front side of the housing 100 and on a first side located at the rear side of the housing 100. For example, a so-called sealing lip is produced in each case there.
[0075] The sealing lip is supported, in particular, on an inner wall of the housing 100 in order to seal the housing.
[0076] In the region of the electronic circuit board, where diodes (not shown in detail in the figures) may be arranged, the injection-molded housing 110 may be thinner and / or have openings.
[0077] By overmolding, in particular by means of a low-pressure injection molding method, a non-lost component can be produced which can then be inserted into the interior of the housing 100 with a precise fit.
[0078] The plug has a plug housing 112 and pins 113 received therein.
[0079] The pins 113 each have a sickle-shaped configuration on the side that contacts the electronic circuit board 108 and are produced in the present example by being pulled out of a solid material. Figure 2c and 3b It can be seen that in the present case four such pins 113 are provided.
[0080] In addition to the 4-pin plug shown in the present exemplary embodiment, a 3-pin plug or a plug having more than four pins is of course also conceivable in a similar manner.
[0081] The pin 113 is designed to be substantially circular or oval in cross section, at least on the side where the electronic circuit board 108 is located. In the present case, the pin is designed to be circular in its cross section over its entire length.
[0082] When viewed from the front end, the pins 113 are bent in the rearward section. Figure 2a and 3c 4) receives the electronic circuit board between itself and contacts the plug-side contact pads 116 arranged on the electronic circuit board 108 in FIG4. The bend of the pin is banana-shaped, wherein the end of the pin 113 on the electronic circuit board side points slightly away from the electronic circuit board 108 in the radial direction. The two opposite protrusions of the banana-shaped bend of the pin 113 form the shortest intermediate space between the two opposite pins and receive the electronic circuit board 108 between themselves there, for example, especially with prestressing.
[0083] In addition to the pins 113, the plug also has a sheet metal ring 117 with two welding lugs 118 (see Figure 2c , Figure 3b and Figure 3c ). The sheet metal ring 117 also has a press-in projection 119 extending from it in the radial direction. The sheet metal ring 117 is mounted on the plug housing 112 at the end of the plug housing 112 on the electronic circuit board side in the axial direction of the structural unit 105. Thus, the plug housing 112 with the pins 113 and the sheet metal ring can itself form a unit, which can then be used in a prefabricated manner, for example, during the automatic production of the structural unit 105 or the entire electronic assembly.
[0084] The welding lugs 118 and the press-in lugs 119 are integrally arranged on a sheet metal ring 117, which can be manufactured as a stamped part. Even if two welding lugs 118 and four press-in lugs 119 are provided in the present case, the electronic circuit board 108 needs to be grounded via the housing 100 and not via a special configuration and / or number of the welding lugs 118 and the press-in lugs 119. The sheet metal ring 117 is an example of a grounding element which is arranged on the end of the plug housing 112 on the electronic circuit board side between the electronic circuit board 108 and the housing 100.
[0085] Here, the soldering protrusion 118 is designed as a plate-shaped connecting piece, the plate surface of which is perpendicular to the electronic circuit board 108. In addition to the contact pads 116 on the plug side, further ground contact pads 120 are provided on the electronic circuit board 108, which establish contact with capacitors 121 mounted on the electronic circuit board (see Figure 4a , Figure 3c ). In the present case, the electronic circuit board 108 has on each of the lower and upper sides a single ground contact pad 120 and two plug-side contact pads 116 corresponding to the number and position of the pins 113 and the soldering lugs 118. The side edges of the two soldering lugs 118 receive the electronic circuit board 108 between themselves and stabilize the arrangement.
[0086] The shielding sleeve described in the aforementioned EP 1 695 037 B1 is, for example, in the present case connected capacitively to the plug via a metal sheet (sheet metal ring 117) which establishes an electrically conductive connection to the housing and is soldered to the electronic circuit board, whereby AC interferences can be conducted away via the housing via a capacitor placed at the circuit ground (GND). This has the advantage that no additional shielding sleeve and no additional contacting process (soldering process) for the shielding sleeve is required.
[0087] For example, the soldering projection 118 is soldered together with the pin 113 simultaneously by a selective soldering method. Here, the sickle-shaped or banana-shaped shaping of the plug pin is also advantageous for the selective soldering method, which enables simultaneous and reproducible wetting of the pin with the soldering finger and thus very short soldering times, in particular soldering times of less than 5 seconds.
[0088] In the electronic circuit board 108, Figure 1a The individual contact pads on the right side (contact pads 116 on the plug side) are shown in FIG. Contact is made to the pins 113 via these contact pads.
[0089] In the case of electronic circuit board 108, Figure 1a Three contact pads (contact pads 122 on the sensor side) are shown on the left side in FIG. 1 , which are in contact with pins (not shown) of the sensor circuit board 109 , for example.
[0090] The contacting is performed by soldering, in particular selective soldering.
[0091] For example, the contacting of the pins of the plug with the contact pads of the electronic circuit board 108 and the contacting of the pins of the sensor circuit board 109 with the contact pads of the electronic circuit board 108 can be carried out in a single soldering step, for example by a mini wave, which moves over or through the area to be soldered, so that the individual pins are selectively soldered at the same time. During this selective soldering step of soldering the pins 113, the soldering protrusions 118 can also be soldered to the ground contact pads 120 at the same time.
[0092] The selective soldering method is characterized in that individual pins are selectively soldered instead of soldering the connection portions on the entire circuit board at the same time.
[0093] The connection of the contacts of the sensor printed circuit board 109 to the sensor-side contact pads 122 can also be carried out in a single selective soldering step, which is carried out in addition to the selective soldering step for the contact plugs.
[0094] Figures 4b to 4e Details of the connection between the sensor circuit board 109 and the electronic circuit board 108 are shown. Figures 4b to 4d Only one section of the electronic circuit board 108 is shown in FIG. Figure 3c and 4a The connection to the plug shown in is not visible. Figure 4e The contact pads on the sensor circuit board 109 are schematically shown and are denoted there by reference numeral 122. A total of six such contact pads 123 are provided. These contact pads are arranged such that, when the sensor circuit board 109 is arranged perpendicular to the electronic circuit board 108, they lie directly opposite the corresponding sensor-side contact pads 122 on the electronic circuit board 108.
[0095] Therefore, the soldering points, which are denoted in the drawing by reference numeral 124, can then also be produced in the manner of fillet soldering points. All six fillet soldering points, which connect the sensor circuit board 109 to the electronic circuit board, are advantageously produced in a single selective soldering step.
[0096] In particular, it can be provided that three soldering locations are arranged on each side, that is to say on the upper side and the lower side of the electronic circuit board. These three soldering locations can advantageously be produced in a single selective soldering step, for example by wetting the three soldering pads simultaneously with the soldering fingers. Then, in a second step, after turning the circuit board over, the other side with the three soldering pads can be soldered. In particular, the soldering pads can only be approached from "below" by the soldering fingers in order to wet them.
[0097] Of course, another embodiment can be proposed in which two welding fingers are used simultaneously to simultaneously weld one side of the circuit board together with the three welding locations of the sensor circuit board 109 and the electronic circuit board 108, and the contact portions of the plug pins 113 and the welding protrusions 118 with the electronic circuit board 108.
[0098] After the elements have been joined and connected by welding and subsequently encapsulated with injection-molded casing 110 , front cover 109 is then plugged onto sensor circuit board 108 and the entire assembly 105 and cover 109 are introduced into housing 100 from the front.
[0099] Thereafter, the housing is flanged at the back at the tapered end, which is Figure 1c A reference numeral 114 is provided in the middle to achieve anti-lost fixation.
[0100] Insofar as individual features are shown in particular exemplary embodiments, these features should also be protected separately and constitute the invention per se.
[0101] In particular, the arrangement of the contacts and / or pins 113 forming a sickle-shaped or banana-shaped electronic circuit board 108 can itself constitute the invention.
[0102] In particular, selective soldering and / or soldering by means of mini-waves can also constitute the invention itself, in particular in one step.
[0103] The present assembly is produced, for example, fully automatically, in that the structural unit 105 consisting of the electronic circuit board 108, the sensor circuit board 109 and the plug is first prefabricated from the corresponding individual parts. For example, only two optional individual steps are required each, since both sides of the electronic circuit board 108 each have three solder pads for contacting the sensor circuit board 109 (front area) and three solder pads for contacting the plug and the soldering lugs (rear area of the circuit board). This automatic method itself can also constitute the present invention.
[0104] List of Reference Numerals
[0105] 1 Sensor unit
[0106] 2 Circuit carrier
[0107] 3 Plug
[0108] 4Soft PU foam
[0109] 5 Column segments
[0110] 6 Threaded pipe
[0111] 7-well plate
[0112] 100 Shell
[0113] 101 Front opening
[0114] 102 Flange
[0115] 103 Back opening
[0116] 104 Inner Surface
[0117] 105 structural units
[0118] 106 front cover
[0119] 107 Plug
[0120] 108 Electronic Circuit Board
[0121] 109 Sensor circuit board
[0122] 110 Injection molded cover
[0123] 112 Plug housing
[0124] 113 pins
[0125] 114 tapered end
[0126] 116 Contact pads on the plug side
[0127] 117 Plate Ring
[0128] 118 Welding protrusion
[0129] 119 Press into the protrusion
[0130] 120 Ground contact pad
[0131] 121 Capacitor
[0132] 122 Contact pads on sensor side
[0133] 123 Contact pads of the sensor circuit board
[0134] 124 welding parts
Claims
1. An electronic component, comprising a housing (100), a plug (107), an electronic circuit board (108), a sensor circuit board (109) and a front cover (106); wherein The housing (100) sequentially receives the plug (107), the electronic circuit board (108), the sensor circuit board (109) and the front cover (106) from the back side to the front side; wherein A flange (102) is provided on the back side of the housing (100), and the axial end face of the plug (107) is supported on the flange, so that the plug (107) cannot be pulled out from the back side of the housing (100); The plug (107), the electronic circuit board (108) and the sensor circuit board (109) form an assembled structural unit; and wherein The front part of the housing (100) fixes the structural unit in the housing (100) by crimping around the front cover (106) and presses against the flange (102).
2. The electronic component according to claim 1, characterized in that The plug (107) comprises a plug housing (112) and a plug pin (113) held in the plug housing (112), and the back end of the pin (113) is designed to be sickle-shaped, by means of which contact is achieved with the first end of the electronic circuit board (108), wherein in particular the plug pins (113) are respectively arranged in the plug housing (112) such that the sickle-shaped ends are opposite to each other and the raised parts of the sickle-shaped ends place the electronic circuit board on corresponding contact pads therebetween and pre-fix the electronic circuit board.
3. The electronic component according to claim 2, characterized in that A grounding element is provided, which is arranged between the electronic circuit board (108) and the housing (100) at an end of the plug housing (112) on the electronic circuit board side.
4. The electronic component according to claim 3, characterized in that: The grounding element is formed by a sheet metal ring (117) having at least one soldering protrusion (118) for contacting a grounding contact pad (120) of the electronic circuit board (108), the contact pad being connected to a capacitor (121) on the electronic circuit board (108), and wherein the sheet metal ring (117) has at least one press-in protrusion (119) extending therefrom, which produces an electrically conductive contact with the housing (100).
5. The electronic component according to any one of claims 1 to 4, characterized in that: The structural unit is completely or at least partially surrounded by an injection-molded outer cover (110) made of thermoplastic plastic, the contour of which releases a radial buffer area for thermal expansion to the housing, wherein in particular the injection-molded outer cover (110) is produced by means of a low-pressure injection molding method, wherein the structural unit and the injection-molded outer cover (110) form a unit such that the unit is held only by a flanged front side of the housing (100) and a flange (102) on the back side of the housing (100).
6. The electronic component according to any one of claims 1 to 4, characterized in that: The electronic component is one of the following sensor types: proximity switch, inductive sensor, capacitive sensor, pressure sensor, gas sensor, temperature sensor, humidity sensor, ultrasonic sensor, vibration recognition sensor, UV sensor.
7. A method for manufacturing an electronic component, the electronic component having a housing (100), a plug (107), an electronic circuit board (108), a sensor circuit board (109) and a front cover (106), wherein the method comprises the following steps: Making the back end of the pin (113) of the plug (107) contact the first end of the electronic circuit board (108); bringing the contacts of the sensor circuit board (109) into contact with corresponding contacts of the electronic circuit board (108) at the second end of the electronic circuit board (108); The plug (107), the electronic circuit board (108) and the sensor circuit board (109) form an assembled structural unit; Inserting the structural unit into the housing (100) from the front side to the back side of the housing until the axial end face of the plug (107) is supported on the flange (102) on the back side of the housing (100); Closing the front side of the housing (100) using the front cover (106); and The rear side of the housing (100) is crimped around the front cover (106), thereby fixing the structural unit in the housing (100) and pressing it against the flange (102).
8. The method according to claim 7, characterized in that The method further comprises the step of overmolding at least parts of the structural unit, so that the structural unit is completely or at least partially surrounded by an injection-molded outer shell (110).
9. The method according to claim 7, characterized in that: Bringing the back end of the pin (113) of the plug (107) into contact with the first end of the electronic circuit board (108); and / or The contacts of the sensor circuit board (109) are brought into contact with corresponding contacts of the electronic circuit board (108) at the second end of the electronic circuit board (108) by means of a selective soldering process and / or a wave soldering process, wherein in particular all contacts between the plug (108) and the electronic circuit board (108) are implemented in a single uninterrupted soldering step and / or all contacts between the sensor circuit board (109) and the electronic circuit board (108) are implemented in a single further uninterrupted soldering step; In particular, two welding fingers are used simultaneously to simultaneously weld one side of the circuit board together with the welding position of the sensor circuit board (109) and the electronic circuit board (108), and the contact part of the pin (113) and the welding protrusion (118) with the electronic circuit board (108).
10. The method according to any one of claims 7 to 9, characterized in that The method is carried out automatically and the individual steps are in particular not carried out manually.