Electroencephalogram-ultrasound composite ECoG electrode

Abstract

The application provides an electroencephalogram-ultrasound composite ECoG electrode, which comprises a patch type ultrasonic transducer layer and an ECoG electrode layer from top to bottom in sequence, wherein the ECoG electrode layer is provided with a hole, and the hole is filled with an ultrasonic coupling agent. The electroencephalogram-ultrasound composite ECoG electrode can realize the effects of ECoG signal acquisition and ultrasonic focusing stimulation simultaneously, and the ECoG electrode which is closer to the brain in space position can not shield the patch type ultrasonic transducer by setting the hole, so that the function expansion of the integrated device is realized.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of medical devices, and particularly relates to an electroencephalogram-ultrasound composite ECoG electrode. BACKGROUND

[0002] Electroencephalogram (EEG) is a basic feature of brain neural activity, reflecting the physiological state and information coding of neurons. Electrode is an electronic device for recording the electrophysiological activity of neurons, and is an important tool for studying EEG. Electrodes are divided into three types according to the degree of invasion: non-invasive scalp EEG, semi-invasive cortical EEG (ECoG) and invasive deep brain electrode (DPS). Among them, the ECoG electrode is directly placed on the surface of the cerebral cortex, and the recorded signal is less shielded by the skull, so it has higher resolution than EEG; at the same time, the electrode does not directly insert into the brain tissue, so it causes less damage than invasive electrodes, and can often maintain a relatively longer stable recording time, and is widely used in medical diagnosis and brain-computer interface research. A flexible patch type EcoG electrode array supporting EIT and EEG signal synchronous acquisition is disclosed in Chinese Patent No. CN219109442U, which comprises a circuit board, a skull nail, an interface and a wire. The skull nail and the interface are located on the circuit board, and the skull nail is connected to the interface through the circuit board and is in communication.

[0003] Although the ECoG electrode has advantages in recording and studying brain electrical activity, it is difficult to stimulate deep structures during treatment due to the limitation of its location on the surface of the brain. Moreover, the functions that a single ECoG electrode can achieve are relatively limited, and there is still room for research on how to add modules with other diagnostic and therapeutic functions in the limited patch structure to expand the functions of integrated devices.

[0004] Focused ultrasound therapy can precisely focus on specific areas in the brain and produce local thermal effects by controlling the intensity and focal point of ultrasound waves, which has shown obvious advantages in the treatment of diseases such as tumors, epilepsy and movement disorders. This treatment can be achieved through a patch-type ultrasonic transducer with a smaller thickness. A implantable ultrasonic device for accelerating bone fracture healing is disclosed in Chinese Patent No. CN117503405A, which comprises an external ultrasonic transducer and an implantable ultrasonic patch. The implantable ultrasonic patch comprises a piezoelectric transducer, a polyimide substrate, a flexible control circuit, a serpentine wire, an interdigital electrode and a flexible packaging layer. The external ultrasonic transducer is a lead zirconate titanate piezoelectric ceramic, which is responsible for providing ultrasonic waves to the implantable ultrasonic patch.

[0005] Commonly, a focusing ultrasound device is arranged outside the skull, most of the energy will be reflected and absorbed when passing through the skull, resulting in only about 10% of the ultrasonic energy passing through the skull, large power consumption, serious heating and inaccurate focusing. Therefore, how to reduce the loss of the patch type ultrasonic transducer is also a technical problem to be solved at present. SUMMARY

[0006] The purpose of the present application is to provide an electroencephalogram-ultrasound composite ECoG electrode, which can realize the effects of ECoG signal acquisition and ultrasonic focusing stimulation at the same time, and solve the problem that the ECoG electrode device is difficult to realize stimulation with a certain depth.

[0007] The present application provides the following technical solutions:

[0008] An electroencephalogram-ultrasound composite ECoG electrode comprises a patch type ultrasonic transducer layer and an ECoG electrode layer from top to bottom, the ECoG electrode layer is provided with a hole, and the hole is filled with an ultrasonic coupling agent.

[0009] The ECoG electrode layer is used for detecting ECoG electroencephalogram signals, the patch type ultrasonic transducer layer is used for realizing the function of focused ultrasonic stimulation, the coupling agent is used for enhancing the propagation efficiency of ultrasonic waves between human tissues and the ultrasonic transducer, and the use of the coupling agent in cooperation with the patch type ultrasonic transducer layer can also reduce the loss.

[0010] The hole position of the ECoG electrode layer is below the effective part of the patch type ultrasonic transducer.

[0011] The thickness of the ECoG electrode is 1-1000 mu m.

[0012] The patch type ultrasonic transducer comprises a substrate on which a top electrode and a bottom electrode are arranged, a piezoelectric sheet connected with the top electrode and the bottom electrode is mounted on the substrate, and the position of the piezoelectric sheet corresponds to the hole on the ECoG electrode layer.

[0013] The thickness of the patch type ultrasonic transducer is 1-2000 mu m.

[0014] The assembling method of the electroencephalogram-ultrasound composite ECoG electrode comprises the following steps: assembling the ECoG electrode layer provided with a hole and the patch type ultrasonic transducer layer, and then adding an ultrasonic coupling agent.

[0015] The ECoG electrode layer and the patch type ultrasonic transducer are bonded by double-sided adhesive, and the thickness of the double-sided adhesive is 1-1000 mu m.

[0016] In use, the electroencephalogram-ultrasound composite ECoG electrode is located between the skull and the cerebral cortex, and the ECoG electrode layer is closely attached to the cerebral cortex.

[0017] The composite ECoG electrode provided by the application can be placed under the skull, and has lower loss compared with the patch type ultrasonic transducer layer placed outside the skull.

[0018] The beneficial effects of the application are as follows:

[0019] The application retains the advantages of the cortical ECoG electrode, such as not directly damaging the brain tissue and being capable of low-invasive ECoG signal acquisition, and through the composite design of the patch type ultrasonic transducer layer and the ECoG electrode layer, the effects of ECoG signal acquisition and ultrasonic focusing stimulation can be realized at the same time, and the patch type ultrasonic transducer layer has good compatibility with the ECoG electrode structure attached to the surface of the cerebral cortex, so that the functional expansion of the integrated device is realized; and the holes arranged in the ECoG electrode layer ensure that the ECoG electrode closer to the brain is not blocked by the patch type ultrasonic transducer layer. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawing description in the following description is only an example, and other embodiments can be obtained by the drawings provided by the person skilled in the art without creative labor.

[0021] The structures, proportions, sizes and the like shown in the specification are only used to cooperate with the content disclosed in the specification, so as to be understood and read by the person skilled in the art, and do not define the limiting conditions for the implementation of the application, and therefore do not have technical significance. Any modification of structure, change of proportion relationship or adjustment of size, which does not affect the effects and purposes that can be achieved by the application, should still fall within the scope of the disclosed technical content.

[0022] Figure 1 The structure schematic diagram of the electroencephalogram-ultrasound composite ECoG electrode provided for the embodiment.

[0023] Figure 2 The cross-sectional side view of the electroencephalogram-ultrasound composite ECoG electrode provided for the embodiment.

[0024] Figure 3 The preparation flowchart of the patch type ultrasonic transducer layer contained in the electroencephalogram-ultrasound composite ECoG electrode provided for the embodiment.

[0025] Figure 4 The real photo of the electroencephalogram-ultrasound composite ECoG electrode provided for the embodiment.

[0026] In the figure: 1-ECoG electrode layer, 2-patch type ultrasonic transducer layer, 3-ultrasonic coupling agent, 4-effective site. DETAILED DESCRIPTION

[0027] The application will be further described below in conjunction with the accompanying drawings and examples. Herein, the examples of the application and their descriptions are used to explain the application, but not as a limitation of the application. Based on the examples in the application, all other examples obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the application.

[0028] Embodiment

[0029] The ECoG electrode provided by the embodiment comprises, from top to bottom, a patch ultrasonic transducer layer 2 and an ECoG electrode layer 1. The ECoG electrode layer 1 is provided with a hole, and the hole is filled with an ultrasonic coupling agent 3. The structure and use are shown in Figure 1 The cross-sectional side view in use is shown in Figure 2 The ECoG electrode layer 1 is in direct contact with the cerebral cortex through the ultrasonic coupling agent 3; the patch ultrasonic transducer layer 2 is arranged outside the ECoG electrode layer 1 and the ultrasonic coupling agent 3, the hole of the ECoG electrode layer 1 is opposite to the effective part 4 of the patch ultrasonic transducer layer 2, and the contact 5 of the ECoG electrode layer 1 is closely combined with the cortex.

[0030] As shown in Figure 3 The patch ultrasonic transducer layer 2 provided by the embodiment is a 1-3 type piezoelectric transducer and electrode welded by PZT-5H ceramic and epoxy resin, and the manufacturing method comprises steps S1-S5.

[0031] S1, a slotting machine is used to horizontally slot the PZT-5H ceramic after polarization in two mutually perpendicular directions to obtain a ceramic column array with a certain area.

[0032] S2, unhardened epoxy resin is poured between the ceramic column array and hardened.

[0033] S3, the unslotted part and other excess parts are ground flat to obtain a 1-3 type piezoelectric sheet.

[0034] S4, the ultrasonic top and bottom electrodes are designed and welded according to the size and shape of the required vibration element. The top electrode contains multiple channels and is welded by low-temperature soldering paste, mainly used for applying different electrical excitation to different vibration elements; the bottom electrode serves as a common ground and is connected with the solder pad by silver epoxy resin, and can also serve as a backing layer.

[0035] S5, the patch ultrasonic transducer layer 2 can be obtained after glue pouring and packaging.

[0036] In the embodiment, the thickness of the ECoG electrode 1 is 1-1000 μm, the thickness of the patch ultrasonic transducer 2 is 1-2000 μm, and the ECoG electrode layer 1 and the patch ultrasonic transducer layer 2 can be bonded by double-sided adhesive, and the thickness of the double-sided adhesive can be 1-1000 μm.

[0037] Figure 4 The physical photos of the embodiment are shown in the following.

[0038] The above only describes the preferred embodiments of the present application and is not used to limit the present application. The structure, proportion, size, etc. of the present application can be variously changed and altered for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A brainwave-ultrasound composite ECoG electrode, characterized in that, The EEG-ultrasound composite ECoG electrode comprises, from top to bottom, a patch-type ultrasound transducer layer and an ECoG electrode layer. The ECoG electrode layer has holes filled with ultrasound coupling agent. The holes in the ECoG electrode layer are located below the effective portion of the patch-type ultrasonic transducer layer; In use, the EEG-ultrasound composite ECoG electrode is located between the skull and the cerebral cortex, wherein the ECoG electrode layer is in close contact with the cerebral cortex.

2. The EEG-ultrasound composite ECoG electrode according to claim 1, characterized in that, The thickness of the ECoG electrode layer is 1~1000 µm.

3. The EEG-ultrasound composite ECoG electrode according to claim 1, characterized in that, The thickness of the patch-type ultrasonic transducer layer is 1~2000 µm.

4. The EEG-ultrasound composite ECoG electrode according to claim 3, characterized in that, The patch-type ultrasonic transducer layer includes a substrate on which a top electrode and a bottom electrode are arranged. A piezoelectric sheet connected to the top electrode and the bottom electrode is mounted on the substrate. The position of the piezoelectric sheet corresponds to the hole on the ECoG electrode layer.

5. The EEG-ultrasound composite ECoG electrode according to claim 1, characterized in that, The assembly method of the EEG-ultrasound composite ECoG electrode includes: assembling an ECoG electrode layer with holes and a patch-type ultrasound transducer layer, and then adding an ultrasound coupling agent.

6. The EEG-ultrasound composite ECoG electrode according to claim 1, characterized in that, The ECoG electrode layer and the patch-type ultrasonic transducer layer are bonded together with double-sided adhesive, the thickness of which is 1~1000 µm.

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